WO2022085741A1 - 回路接続用接着剤フィルム、接続構造体、及び接続構造体の製造方法 - Google Patents

回路接続用接着剤フィルム、接続構造体、及び接続構造体の製造方法 Download PDF

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Publication number
WO2022085741A1
WO2022085741A1 PCT/JP2021/038830 JP2021038830W WO2022085741A1 WO 2022085741 A1 WO2022085741 A1 WO 2022085741A1 JP 2021038830 W JP2021038830 W JP 2021038830W WO 2022085741 A1 WO2022085741 A1 WO 2022085741A1
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Prior art keywords
circuit
adhesive film
connection
mass
electrode
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Ceased
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PCT/JP2021/038830
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English (en)
French (fr)
Japanese (ja)
Inventor
敏光 森谷
剛幸 市村
亮太 小林
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Resonac Corp
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Showa Denko Materials Co Ltd
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Priority to CN202180086230.2A priority Critical patent/CN116635956A/zh
Priority to JP2022557591A priority patent/JP7740254B2/ja
Priority to KR1020237015653A priority patent/KR20230092943A/ko
Publication of WO2022085741A1 publication Critical patent/WO2022085741A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Definitions

  • the present disclosure relates to an adhesive film for circuit connection, a connection structure, and a method for manufacturing the connection structure.
  • a circuit connection adhesive film in which conductive particles are dispersed in a circuit connection material such as an epoxy adhesive or an acrylic adhesive that heats and pressurizes the opposing circuits and electrically connects the electrodes in the pressurizing direction (different).
  • the conductive film) is mainly a TCP (Tape Carrier Package) or COF (Chip On Flex) and an LCD panel on which a semiconductor for driving a liquid crystal display (LCD) is mounted, or electricity between a TCP or COF and a printed wiring board. Widely used for target connection.
  • connection resistance value Even when the circuit connection structure is exposed to a high temperature and high humidity environment (for example, 85 ° C., 85% RH) for a long period of time (for example, 250 hours) after the circuit member is connected to the circuit connection adhesive film. It is required to suppress peeling to the electrode portion and to show an excellent resistance value (connection resistance value).
  • the circuit connection structure is placed in a high temperature and high humidity environment (for example, 85) after the circuit members are connected to each other, while having excellent adhesiveness to the circuit members even when stored in contact with air.
  • a high temperature and high humidity environment for example, 85
  • An adhesive film for circuit connection that can ensure connection reliability between opposing electrodes even when exposed to °C, 85% RH for a long period of time, and a connection structure using the adhesive film for circuit connection. And to provide a method of manufacturing a connection structure.
  • One aspect of the present disclosure relates to a circuit connection adhesive film containing an amide having a lactam ring, a cationically polymerizable compound, a thermal polymerization initiator, and conductive particles.
  • the circuit connection adhesive film which is one aspect of the present disclosure, by having the above configuration, in the connection between circuit members, when the circuit connection adhesive film is attached to the circuit members, the circuit connection is made. While the adhesive film for use and the circuit member are sufficiently brought into close contact with each other, the connection resistance between the opposing electrodes can be sufficiently reduced. In particular, since the circuit connection adhesive film contains an amide having a lactam ring, the circuit connection adhesive film has excellent adhesiveness to circuit members even when stored in contact with air.
  • the circuit connection structure is exposed to a high temperature and high humidity environment (for example, 85 ° C., 85% RH) for a long period of time after the circuit members are connected to each other, the connection reliability between the opposing electrodes can be ensured.
  • a high temperature and high humidity environment for example, 85 ° C., 85% RH
  • the connection reliability between the opposing electrodes can be ensured.
  • the reason why the above effect can be obtained by containing the amide having a lactam ring in the adhesive film for circuit connection is that the deterioration of the film surface is suppressed by containing the amide having a lactam ring, and the resin on the film surface is obtained. It is presumed that this is because the state of can be maintained in the same state as the resin inside the film.
  • the number of carbon atoms constituting the lactam ring of the amide may be 3 to 12.
  • the amide may contain ⁇ -caprolactam.
  • the cationically polymerizable compound may contain at least one selected from the group consisting of an oxetane compound and an alicyclic epoxy compound.
  • a W / B W is 0.001 when the mass-based content of the amide is A W and the mass-based content of the thermal polymerization initiator is B W. It may be ⁇ 0.2.
  • the circuit connection adhesive film includes a first adhesive layer and a second adhesive layer laminated on the first adhesive layer, and the first adhesive layer is the above.
  • the amide, the cationically polymerizable compound, the thermal polymerization initiator, and the conductive particles may be contained.
  • a connection structure comprising a connection portion for electrically connecting the first electrode and the second electrode to each other, wherein the connection portion contains a cured product of the adhesive film for circuit connection.
  • the circuit connection adhesive film is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and the above is described.
  • the present invention relates to a method for manufacturing a connection structure, comprising a step of thermocompression bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other.
  • the circuit connection structure in the connection between circuit members, has a high temperature after the circuit members are connected to each other, while having excellent adhesiveness to the circuit members even when stored in contact with air.
  • a circuit connection adhesive film that can ensure connection reliability between facing electrodes even when exposed to a high humidity environment (for example, 85 ° C., 85% RH) for a long period of time, and the circuit connection adhesive. It is possible to provide a connection structure using a film and a method for manufacturing the connection structure.
  • One embodiment of the present disclosure comprises (a) an amide having a lactam ring, (b) a cationically polymerizable compound, (c) a thermal polymerization initiator, and (d) conductive particles for circuit connection. It is an adhesive film. That is, one embodiment of the present disclosure is an adhesive film for circuit connection, which contains an adhesive component containing the components (a) to (c) and conductive particles dispersed in the adhesive component.
  • a high temperature and high humidity environment for example, 85 ° C, 85% RH
  • the amide having a lactam ring may have 3 to 12 carbon atoms constituting the lactam ring.
  • the number of carbon atoms constituting the lactam ring is a viewpoint that it is easier to secure the connection reliability between the opposing electrodes even when the circuit connection structure is exposed to a high temperature and high humidity environment (for example, 85 ° C., 85% RH) for a long period of time. Therefore, it may be 3 to 10, 3 to 8, 3 to 7, or 3 to 6.
  • the amide having a lactam ring may have a functional group attached to the lactam ring.
  • Such functional groups include a carboxy group, a carboxylic acid base, a hydroxy group, an alkoxy group, an alkyl group, an ester group, a sulfo group, a sulfonic acid base, a carbonyl group, an amino group, an amide group, a carboxamide group, a nitro group and a cyano group.
  • Groups, halogen atoms and the like can be mentioned.
  • the amide having a lactam ring has a viewpoint that it is easy to obtain excellent stickability to the circuit member even if it is stored in contact with air in the connection between the circuit members, and a circuit connection structure after the circuit members are connected to each other.
  • 2-azetidineone, 2-pyrrolidinone (2-pyrrolidone) from the viewpoint of ensuring connection reliability between facing electrodes even when exposed to a high temperature and high humidity environment (for example, 85 ° C., 85% RH) for a long period of time.
  • 2-Piperidinone, ⁇ -caprolactam, caprolactam, laurolactam ( ⁇ -laurin lactam) may contain at least one selected from the group, and may contain ⁇ -caprolactam.
  • the content of ⁇ -caprolactam may be 80% by mass or more, 90% by mass or more, 95% by mass or more, or 100% by mass, based on the total mass of the amide having a lactam ring.
  • the content of the amide having a lactam ring is from the viewpoint that it is easy to obtain excellent adhesiveness to the circuit member even if it is stored in contact with air in the connection between the circuit members, and the circuit after the circuit members are connected to each other.
  • the total mass of the adhesive film for circuit connection from the viewpoint of easily ensuring the connection reliability between the opposing electrodes even when the connection structure is exposed to a high temperature and high humidity environment (for example, 85 ° C., 85% RH) for a long period of time. It may be 0.001% by mass or more, 0.003% by mass or more, or 0.005% by mass or more based on the above.
  • the content of the amide having a lactam ring is 2.0% by mass or less, 1.0% by mass or less, or 0.8% by mass or less based on the total mass of the adhesive film for circuit connection. It may be there. From these viewpoints, the content of the amide having a lactam ring is 0.001 to 2.0% by mass, 0.003 to 1.0% by mass, 0. It may be 005 to 0.8% by mass.
  • the content of the amide having a lactam ring is from the viewpoint that it is easy to obtain excellent stickability to the circuit member even if it is stored in contact with air in the connection between the circuit members, and the circuit after the circuit members are connected to each other.
  • Circuit connection adhesive excluding conductive particles from the viewpoint of easily ensuring connection reliability between facing electrodes even when the connection structure is exposed to a high temperature and high humidity environment (for example, 85 ° C, 85% RH) for a long period of time. It may be 0.003% by mass or more, 0.006% by mass or more, or 0.009% by mass or more based on the total mass of the film.
  • the content of the amide having a lactam ring is 3.0% by mass or less, 2.0% by mass or less, or 1.0 based on the total mass of the adhesive film for circuit connection excluding conductive particles. It may be mass% or less. From these viewpoints, the content of the amide having a lactam ring is 0.003 to 3.0% by mass and 0.006 to 2.0% by mass based on the total mass of the adhesive film for circuit connection excluding the conductive particles. %, 0.009 to 1.0% by mass.
  • the content of the amide having a lactam ring is from the viewpoint that when the circuit members are connected to each other, it is easy to obtain excellent adhesiveness to the circuit members even if they are stored in contact with air, and the circuit after the circuit members are connected to each other.
  • Circuit connection excluding conductive particles and filler from the viewpoint of easily ensuring connection reliability between facing electrodes even when the connection structure is exposed to a high temperature and high humidity environment (for example, 85 ° C., 85% RH) for a long period of time. Based on the total mass of the adhesive film for use, it may be 0.005% by mass or more, 0.008% by mass or more, or 0.01% by mass or more.
  • the content of the amide having a lactam ring is 4.0% by mass or less, 3.0% by mass or less, or 3.0% by mass or less, based on the total mass of the adhesive film for circuit connection excluding conductive particles and filler. It may be 2.0% by mass or less. From these viewpoints, the content of the amide having a lactam ring is 0.005 to 4.0% by mass and 0.008 to 3 based on the total mass of the adhesive film for circuit connection excluding the conductive particles and the filler. It may be 0.0% by mass and 0.01 to 2.0% by mass.
  • the cationically polymerizable compound is, for example, a compound that crosslinks by reacting with a thermal polymerization initiator by heat.
  • the cationically polymerizable compound may contain at least one selected from the group consisting of an oxetane compound and an alicyclic epoxy compound from the viewpoint of low temperature rapid curing (low temperature short time curing), and the oxetane compound and the alicyclic epoxy compound may be contained. May include.
  • the cationically polymerizable compound may be used alone or in combination of two or more.
  • oxetane compound examples include 2-ethylhexyl oxetane, 3-hydroxymethyl-3-methyloxetane, 3-hydroxymethyl-3-ethyloxetane, 3-hydroxymethyl-3-propyloxetane, and 3-hydroxymethyl-3-normalbutyl.
  • the alicyclic epoxy compound as a cationically polymerizable compound is, for example, 3', 4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (bi-7-oxabicyclo [4,1,0] heptane), and the like. It may be 3,4-epoxycyclohexylmethyl (meth) acrylate, (3,3', 4,4'-diepoxy) bicyclohexyl, hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin.
  • the content of the cationically polymerizable compound is 10% by mass or more, 15% by mass or more, or 20% by mass based on the total mass of the circuit connection adhesive film from the viewpoint of ensuring the curability of the circuit connection adhesive film. It may be% or more.
  • the content of the cationically polymerizable compound is 50% by mass or less, 40% by mass or less, or 30% by mass based on the total mass of the circuit connection adhesive film from the viewpoint of ensuring the formability of the circuit connection adhesive film. It may be less than or equal to%. From these viewpoints, the content of the cationically polymerizable compound may be 10 to 50% by mass, 15 to 40% by mass, or 20 to 30% by mass based on the total mass of the adhesive film for circuit connection.
  • the ratio of the mass-based content of the oxetane compound to the mass-based content of the alicyclic epoxy compound (based on the mass of the oxetane compound).
  • the content / content based on the mass of the alicyclic epoxy compound) is 0.2 to 5.0, 0.5 to 4.0, 1.0 to 3. from the viewpoint of improving the reactivity of the oxetane compound. It may be 0 or 1.5 to 2.5.
  • the thermal polymerization initiator is a compound that initiates polymerization by generating an acid or the like by heating, and may be a compound composed of a cation and an anion.
  • the thermal polymerization initiators are, for example, SbF 6- , PF 6- , PF X (CF 3 ) 6-X- (where X is an integer of 1 to 5), BF 4- , B (C 6 F 5 ) 4 - , RSO 3- ( where R is an alkyl group with 1 to 3 carbon atoms, substituted or unsubstituted aryl group), C (SO 2 CF 3 ) 3- , sulfonium salt, phosphonium salt, ammonium having anions such as Examples thereof include onium salts such as salts, diazonium salts, iodonium salts and arylinium salts. These may be used alone or in combination of two or more.
  • the onium salt as the thermal polymerization initiator may contain an anilinium salt from the viewpoint of low temperature curability and storage stability, and may contain an N-alkylanilinium salt, an N-benzylanilinium salt, or an N, N-dialkylanily. It may contain at least one selected from the group consisting of nium salts and N, N, N-trialkylanilinium salts.
  • anilinium salts the hydrocarbon group bonded to the nitrogen atom may have a substituent.
  • anilinium salt examples include N-benzyl-N, N-dimethylanilinium tetrakispentafluorophenylborate, N- (4-nitrobenzyl) -N, N-dimethylanilinium tetrakispentafluorophenylborate, N- (4-methoxy).
  • the anilinium salt as the thermal polymerization initiator may have an N-benzylanilinium derivative structure represented by the following formula (1) from the viewpoint that the polymerization initiation temperature can be set with a high degree of freedom by selecting the thermal polymerization initiator. good.
  • R 1 , R 2 , R 3 , R 8 , R 9 and R 10 are independently hydrogen atom, halogen atom, alkyl group having 1 to 3 carbon atoms, and 1 to 3 carbon atoms, respectively.
  • R 4 and R 5 are independently hydrogen atoms and alkyl having 1 to 3 carbon atoms, respectively.
  • a group or a halogen atom is indicated, R 6 and R 7 each independently indicate a halogen atom and an alkyl group having 1 to 3 carbon atoms, and
  • X ⁇ is SbF 6 ⁇ , PF 6 ⁇ , PF X (CF).
  • anilinium salts satisfying the above formula (1) include K-PURE CXC-1612, K-PURE CXC-1733, K-PURE CXC-1738, K-PURE TAG-2678, and K-PURE CXC-. 1614, K-PURE TAG-2689, K-PURE TAG-2690, K-PURE TAG-2700, K-PURE CXC-1802-60, K-PURE CXC-1821 (manufactured by King Industries) and the like.
  • the content of the thermal polymerization initiator is 0.5% by mass or more, 1.0% by mass or more, or 3.0 based on the total mass of the adhesive film for circuit connection from the viewpoint of sufficiently promoting the curing reaction. It may be mass% or more.
  • the content of the thermal polymerization initiator is 20% by mass or less, 15% by mass or less, or 10% by mass or less based on the total mass of the adhesive film for circuit connection from the viewpoint of improving the physical properties of the cured product. good. From these viewpoints, the content of the thermal polymerization initiator is 0.5 to 20% by mass, 1.0 to 15% by mass, or 3.0 to 10% by mass based on the total mass of the adhesive film for circuit connection. May be%.
  • the ratio of A W to B W may be 0.001 or more, 0.01 or more, or 0.05 or more from the viewpoint of easily obtaining better stickability to the circuit member.
  • the ratio of A W to B W may be 0.2 or less, 0.15 or less, or 0.1 or less from the viewpoint of suppressing an increase in the mounting temperature. From these viewpoints, the ratio of A W to B W (A W / B W ) may be 0.001 to 0.2, 0.01 to 0.15, or 0.05 to 0.1. ..
  • the conductive particles are not particularly limited as long as they are conductive particles, and are composed of metal particles made of metals such as gold, silver, palladium, nickel, copper, and solder, and conductive carbon. It may be conductive carbon particles or the like.
  • the conductive particles may be coated conductive particles including a nucleus containing non-conductive glass, ceramic, plastic (polystyrene, etc.) and the like, and a coating layer containing the metal or conductive carbon and covering the nucleus.
  • the conductive particles may include at least one selected from the group consisting of metal particles formed of a heat-meltable metal and coated conductive particles, and may include coated conductive particles.
  • the coated conductive particles can be easily deformed by heating and / or pressurizing, when the electrodes are electrically connected to each other, the contact area between the electrodes and the conductive particles is increased, and the conductivity between the electrodes is increased. Can be further improved.
  • the average particle size of the conductive particles may be 1.0 ⁇ m or more, 2.0 ⁇ m or more, or 2.5 ⁇ m or more from the viewpoint of excellent dispersibility and conductivity.
  • the average particle diameter of the conductive particles may be 6.0 ⁇ m or less, 5.5 ⁇ m or less, or 5.0 ⁇ m or less from the viewpoint of ensuring the insulating property between the adjacent electrodes. From these viewpoints, the average particle size of the conductive particles may be 1.0 to 6.0 ⁇ m, 2.0 to 5.5 ⁇ m, or 2.5 to 5.0 ⁇ m.
  • the average particle size of the conductive particles was determined by measuring the particle size of 300 conductive particles contained in the adhesive film for circuit connection by observing with a scanning electron microscope (SEM). Use the average value.
  • the particle diameter of the conductive particles is the diameter of a circle circumscribing the conductive particles in the observation image by SEM.
  • the conductive particles may be uniformly dispersed.
  • the particle density of the conductive particles in the adhesive film for circuit connection may be 100 pieces / mm 2 or more, 1000 pieces / mm 2 or more, or 3000 pieces / mm 2 or more from the viewpoint of obtaining stable connection resistance.
  • the particle density of the conductive particles in the adhesive film for circuit connection is 100,000 pieces / mm 2 or less, 50,000 pieces / mm 2 or less, or 30,000 pieces / mm 2 or less from the viewpoint of ensuring the insulating property between adjacent electrodes. It's okay. From these viewpoints, the particle density of the conductive particles in the adhesive film for circuit connection may be 100 to 100,000 particles / mm 2 , 1000 to 50,000 particles / mm 2 , or 3000 to 30,000 particles / mm 2 .
  • the content of the conductive particles may be 10% by mass or more, 20% by mass or more, or 30% by mass or more based on the total mass of the adhesive film for circuit connection.
  • the content of the conductive particles may be 60% by mass or less, 50% by mass or less, or 40% by mass or less based on the total mass of the adhesive film for circuit connection.
  • the circuit connection adhesive film may further contain other components in addition to the above components (a) to (d).
  • other components include (e) a thermoplastic resin, (f) a coupling agent, and (g) a filler.
  • the adhesive film for circuit connection contains a thermoplastic resin, so that it can be easily formed into a film.
  • the thermoplastic resin include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, acrylic rubber, and epoxy resin (solid at 25 ° C.). These may be used alone or in combination of two or more.
  • the weight average molecular weight (Mw) of the thermoplastic resin may be, for example, 5000 to 200,000, 10000 to 100,000, 20000 to 80000, or 40,000 to 60000.
  • the weight average molecular weight of the thermoplastic resin means a value measured by gel permeation chromatography (GPC) and converted using a calibration curve made of standard polystyrene.
  • the content of the thermoplastic resin may be 1.0% by mass or more, 5.0% by mass or more, 10% by mass or more, or 15% by mass or more based on the total mass of the adhesive film for circuit connection.
  • the content of the thermoplastic resin may be 50% by mass or less, 40% by mass or less, 30% by mass or less, or 20% by mass or less based on the total mass of the adhesive film for circuit connection.
  • the content of the thermoplastic resin is 1.0 to 50% by mass, 5.0 to 40% by mass, 10 to 30% by mass, or 15 to 20% by mass based on the total mass of the adhesive film for circuit connection. It may be there.
  • the adhesive film for circuit connection can further improve the adhesiveness by containing the coupling agent.
  • the coupling agent may be, for example, a silane coupling agent.
  • Examples of the coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3- (meth) acryloxypropylmethyldimethoxysilane.
  • the content of the coupling agent is 0.1% by mass or more, 0.5% by mass or more, 1.0% by mass or more, or 1.5% by mass or more based on the total mass of the adhesive film for circuit connection. It may be there.
  • the content of the coupling agent is 10% by mass or less, 8.0% by mass or less, 5.0% by mass or less, or 3.0% by mass or less based on the total mass of the adhesive film for circuit connection. good.
  • the content of the coupling agent is 0.1 to 10% by mass, 0.5 to 8.0% by mass, 1.0 to 5.0% by mass, or 100% by mass, based on the total mass of the adhesive film for circuit connection. It may be 1.5 to 3.0% by mass.
  • the adhesive film for circuit connection contains a filling material, so that the connection reliability can be further improved.
  • the filler include non-conductive fillers (for example, non-conductive particles).
  • the filler may be either an inorganic filler or an organic filler.
  • the inorganic filler examples include metal oxide particles such as silica particles, alumina particles, silica-alumina particles, titania particles, and zirconia particles; and metal nitride particles. These may be used alone or in combination of two or more.
  • organic filler examples include silicone particles, methacrylate / butadiene / styrene particles, acrylic / silicone particles, polyamide particles, polyimide particles and the like. These may be used alone or in combination of two or more.
  • the filler may contain an inorganic filler and may contain silica particles from the viewpoint of improving the film formability and the reliability of the connecting structure.
  • the silica particles may be crystalline silica particles or amorphous silica particles, and these silica particles may be synthetic products.
  • the method for synthesizing silica may be a dry method or a wet method.
  • the silica particles may contain at least one selected from the group consisting of fumed silica particles and sol-gel silica particles.
  • the silica particles may be surface-treated silica particles from the viewpoint of excellent dispersibility in the adhesive component.
  • the surface-treated silica particles may be, for example, silica particles surface-treated with a silane compound such as an alkoxysilane compound, a disilazan compound, or a siloxane compound, or may be silica particles surface-treated with a silane coupling agent. ..
  • the surface-treated silica particles are, for example, obtained by hydrophobizing the hydroxyl groups on the surface of the silica particles with a silane compound or a silane coupling agent.
  • alkoxysilane compound examples include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, dimethoxydiphenylsilane, tetraethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, and n-propyltrimethoxysilane.
  • n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, 1,6-bis (trimethoxysilyl) hexane, 3,3,3-trifluoropropyltrimethoxy Examples include silane.
  • disilazane compound examples include 1,1,1,3,3,3-hexamethyldisilazane, 1,3-diphenyltetramethyldisilazane, and 1,3-bis (3,3,3-trifluoropropyl)-. Examples thereof include 1,1,3,3,-tetramethyldisilazane and 1,3-divinyl-1,1,3,3-tetramethyldisilazane.
  • siloxane compound examples include tetradecamethylcycloheptasiloxane, decamethylcyclopentasiloxane, hexaphenylcyclosiloxane, octadecamethylcyclononasiloxane, hexadecamethylcyclooctasiloxane, dodecamethylcyclohexasiloxane, octaphenylcyclotetrasiloxane, and hexa.
  • silane coupling agent examples include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropyltrimethoxy.
  • Silane 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3- Methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) ) -3-Aminopropyltrimethoxysilane, 3-Aminopropyltrimethoxysilane, 3-Aminopropyltrimethoxysilane, 3-Aminopropyltriethoxysilane, 3-Triethoxysilyl-N- (1,3-dimethyl-but
  • Silane particles surface-treated with a silane compound or a silane coupling agent have 3-methacryloxypropyltrimethoxysilane, vinyltrimethoxysilane, and trimethoxyphenyl in order to further hydrophobize the water-acidic group residues on the surface of the silica particles.
  • the surface may be treated with a silane compound such as silane to further make it hydrophobic.
  • the surface-treated silica particles are made of silica and tri.
  • Reaction product with methoxyoctylsilane hydrolysis product
  • reaction product between silica and dimethylsiloxane reaction product between silicon dioxide or silica and dichloro (dimethyl) silane
  • reaction between silica and bis (trimethylsilyl) amine It may contain at least one selected from the group consisting of a product (hydrolysis product) and a reaction product of silica and hexamethyldisilazane, a reaction product of silica and trimethoxyoctylsilane, and silica and bis (). It may contain at least one selected from the group consisting of reaction products of trimethylsilyl) amine.
  • the content of the filler may be 0.1% by mass or more, 1.0% by mass or more, 5.0% by mass or more, or 10% by mass or more based on the total mass of the adhesive film for circuit connection. ..
  • the content of the filler may be 50% by mass or less, 40% by mass or less, 30% by mass or less, or 20% by mass or less based on the total mass of the adhesive film for circuit connection.
  • the content of the filler is 0.1 to 50% by mass, 1.0 to 40% by mass, 5.0 to 30% by mass, or 10 to 20% by mass based on the total mass of the adhesive film for circuit connection. May be.
  • the circuit connection adhesive film is an adhesive containing at least the above-mentioned components (a) to (c) and (d) conductive particles dispersed in the adhesive component.
  • a layer made of the composition (first adhesive layer) is provided.
  • the circuit connection adhesive film may have a single-layer structure composed of a first adhesive layer, or may have a multi-layer structure having a first adhesive layer and a layer other than the first adhesive layer.
  • the content of the above-mentioned components (a) to (g) may be within the above-mentioned range based on the total mass of each layer.
  • the circuit connection adhesive film may be provided on a base material (for example, PET film) or the like.
  • the circuit connection adhesive film with a substrate is based on, for example, an adhesive composition containing at least the above-mentioned (a) to (d) using a knife coater, a roll coater, an applicator, a comma coater, a die coater, or the like. It can be manufactured by applying it on a material.
  • FIG. 1 is a schematic cross-sectional view showing an adhesive film for circuit connection according to an embodiment.
  • the circuit connection adhesive film 1 is composed of a single layer composed of an adhesive component 2 and conductive particles 3 dispersed in the adhesive component 2.
  • the adhesive component 2 contains at least the above-mentioned components (a) to (c), and the conductive particles 3 may be the above-mentioned component (d).
  • the circuit connection adhesive film 1 may be in an uncured state or may be in a partially cured state.
  • the thickness of the circuit connection adhesive film 1 may be, for example, 5 ⁇ m or more or 10 ⁇ m or more, and may be 30 ⁇ m or less or 20 ⁇ m or less.
  • the thickness of the circuit connection adhesive film 1 may be 5 to 30 ⁇ m or 10 to 20 ⁇ m.
  • the circuit-connecting adhesive film may have a multilayer structure having two or more layers.
  • the circuit-connecting adhesive film 1 is a layer containing conductive particles 3A (as shown in FIG. 2).
  • a first adhesive layer composed of an adhesive component 2A and conductive particles 3A dispersed in the adhesive component 2A) 1A, and a layer not containing conductive particles (a second adhesive layer composed of an adhesive component 2B).
  • the first adhesive layer 1A is an adhesive composition containing at least the above-mentioned components (a) to (c) and the above-mentioned (d) conductive particles (first adhesion).
  • the second adhesive layer 1B may be a layer composed of the agent composition), and the second adhesive layer 1B is an adhesive composition (second adhesive) containing the above-mentioned components (a) to (c) and (e) to (g). It may be a layer composed of an agent composition).
  • the type, content, and the like of each component contained in the second adhesive layer 1B may be the same as or different from that of the first adhesive layer 1A.
  • the first adhesive layer 1A and the second adhesive layer 1B of the circuit connection adhesive film 1 may be in an uncured state, or may be in a partially cured state.
  • the thickness of the first adhesive layer 1A may be, for example, 3 ⁇ m or more or 5 ⁇ m or more, and may be 15 ⁇ m or less or 10 ⁇ m or less.
  • the thickness of the first adhesive layer 1A may be 3 to 15 ⁇ m or 5 to 10 ⁇ m.
  • the thickness of the second adhesive layer 1B may be, for example, 5 ⁇ m or more or 10 ⁇ m or more, and may be 20 ⁇ m or less or 15 ⁇ m or less.
  • the thickness of the second adhesive layer 1B may be 5 to 20 ⁇ m or 10 to 15 ⁇ m.
  • the ratio of the thickness of the first adhesive layer 1A to the thickness of the second adhesive layer 1B is 0.1.
  • the ratio of the thickness of the first adhesive layer 1A to the thickness of the second adhesive layer 1B is 0.1. It may be ⁇ 1.0 or 0.3 ⁇ 0.5.
  • the circuit connection adhesive film according to the embodiment may have anisotropic conductivity. That is, the adhesive film for circuit connection may be an anisotropic conductive film.
  • the adhesive film for circuit connection may be a conductive adhesive film having no anisotropic conductivity.
  • connection structure Another embodiment of the present disclosure is between a first circuit member having a first electrode, a second circuit member having a second electrode, and the first circuit member and the second circuit member.
  • a connection structure comprising a connection portion for electrically connecting the first electrode and the second electrode to each other, wherein the connection portion contains a cured product of the adhesive film for circuit connection. Is.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of the connection structure.
  • the structure 10 is the first between the first circuit member 4 and the second circuit member 5 facing each other and the first circuit member 4 and the second circuit member 5. It includes a connecting portion 6 for connecting the circuit member 4 and the second circuit member 5.
  • the first circuit board 4 includes a first circuit board 41 and a first electrode 42 formed on the main surface 41a of the first circuit board 41.
  • the second circuit board 5 includes a second circuit board 51 and a second electrode 52 formed on the main surface 51a of the second circuit board 51.
  • the first circuit member 4 and the second circuit member 5 are not particularly limited as long as they are members on which electrodes requiring electrical connection are formed.
  • the members (circuit members, etc.) on which the electrodes are formed include inorganic substrates such as semiconductors, glass, and ceramics; polyimide substrates typified by TCP, FPC, COF, etc .; electrodes on films such as polycarbonate, polyester, and polyether sulfone. A printed wiring board or the like is used, and a plurality of these may be used in combination.
  • the connection portion 6 contains a cured product of the circuit connection adhesive film 1, and contains an insulating substance 7 which is a cured product of the adhesive component 2 and conductive particles 3.
  • the conductive particles 3 are not only between the facing first electrode 42 and the second electrode 52, but also between the main surface 41a of the first circuit board 41 and the main surface 51a of the second circuit board 51. It may be arranged. In the structure 30, the first electrode 42 and the second electrode 52 are electrically connected via the conductive particles 3. That is, the conductive particles 3 are in contact with both the first electrode 42 and the second electrode 52.
  • the facing first electrode 42 and the second electrode 52 are electrically connected via the conductive particles 3. Therefore, the connection resistance between the first electrode 42 and the second electrode 52 is sufficiently reduced. Therefore, it is possible to smooth the flow of current between the first electrode 42 and the second electrode 52, and to fully exert the functions of the first circuit member 4 and the second circuit member 5. Can be done.
  • connection adhesive film is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and the above is described.
  • a method for manufacturing a connection structure comprising a step of thermocompression bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other.
  • FIG. 4 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a connection structure.
  • the first circuit member 4 and the circuit connection adhesive film 1 are prepared.
  • the circuit connection adhesive film 1 is arranged on the main surface 41a of the first circuit member 4.
  • the circuit connection adhesive film 1 is laminated on the base material (not shown)
  • the circuit connection adhesive film 1 side of the base material is directed toward the first circuit member 4.
  • the laminate is placed on the first circuit member 4.
  • the circuit connection adhesive film 1 has the first adhesive layer 1A and the second adhesive layer 1B as shown in FIG. 2, the viewpoint of improving the number of conductive particles captured between the facing electrodes.
  • the first adhesive layer side may be arranged so as to be in contact with the main surface 41a of the first circuit member 4.
  • circuit connection adhesive film 1 is pressurized in the directions of arrows A and B in FIG. 4A, and the circuit connection adhesive film 1 is temporarily connected to the first circuit member 4 (FIG. 4B). reference). At this time, heating may be performed together with pressurization.
  • the second electrode 52 side is directed toward the first circuit member 4 on the circuit connection adhesive film 1 arranged on the first circuit member 4. (That is, the first electrode 42 and the second electrode 52 are arranged to face each other, and the circuit connection adhesive is placed between the first circuit member 4 and the second circuit member 5.
  • the second circuit member 5 is further arranged (with the film 1 interposed therebetween).
  • circuit connection adhesive film 1 is thermocompression bonded in the directions of arrows A and B in FIG. 4 (c). As a result, the circuit connection adhesive film 1 is cured, and the main connection for electrically connecting the first electrode 42 and the second electrode 52 to each other is performed. As a result, the structure 10 as shown in FIG. 3 is obtained.
  • the conductive particles 3 can be brought into contact with both the first electrode 42 and the second electrode 52 facing each other, and the first electrode 42 and the second electrode 52 can be brought into contact with each other.
  • the connection resistance between the electrodes 52 can be sufficiently reduced.
  • the adhesive component 2 is cured to become the insulating substance 7 with the distance between the first electrode 42 and the second electrode 52 sufficiently reduced.
  • the first circuit member 4 and the second circuit member 5 are firmly connected via the connecting portion 6. Further, in the structure 10, a state in which the adhesive strength is sufficiently high is maintained for a long period of time. Therefore, in the structure 10, the change in the distance between the first electrode 42 and the second electrode 52 with time is sufficiently suppressed, and the long-term reliability of the electrical characteristics between the first electrode 42 and the second electrode 52 is reliable. Is excellent.
  • a layer made of nickel was formed on the surface of the crosslinked polystyrene particles so that the thickness of the layer was 0.15 ⁇ m. In this way, conductive particles having an average particle diameter of 3.3 ⁇ m, a maximum particle diameter of 3.5 ⁇ m, and a specific gravity of 2.7 were obtained.
  • Adhesive composition was prepared. The details of each component in Tables 1 and 2 are as follows, and the blending amount of each component in the table represents the blending amount of the non-volatile component.
  • Cationic polymerizable compound B1 be-7-oxabicyclo [4,1,0] heptane (trade name: seroxide 8010, manufactured by Daicel Chemical Co., Ltd.)
  • B2 4,4'-bis [(3-ethyl-3-oxetanyl) methyl] biphenyl (trade name: OXBP, manufactured by Ube Kosan Co., Ltd.)
  • Thermal polymerization initiator C1 quaternary ammonium salt (trade name: K-PURE CXC-1821, manufactured by King Industries)
  • E1 P-1 (fluorene type phenoxy resin)
  • E2 Bisphenol A type solid epoxy resin (trade name: jER1010, manufactured by Mitsubishi Chemical Corporation)
  • F1 ⁇ -glycidoxypropyltrimethoxysilane (trade name: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.)
  • the second adhesive composition was applied on the base material (PET film) to form the second adhesive layer on the base material. Further, the first adhesive composition is applied on the second adhesive layer to form the first adhesive layer, and the first adhesive layer, the second adhesive layer, and the base material are formed. Made an adhesive film for circuit connection laminated in this order. The thickness of the first adhesive layer of the adhesive films for circuit connection of Examples 1 to 13 and Comparative Examples 1 to 2 was 7 ⁇ m, and the thickness of the second adhesive layer was 11 ⁇ m.
  • thermocompression bonding device manufactured by Ohashi Seisakusho Co., Ltd., a thermocompression bonding device equipped with a stage consisting of a ceramic heater and a tool (8 mm x 50 mm)
  • conditions of 70 ° C. and 0.98 MPa (10 kgf / cm 2 ) The adhesive film for circuit connection was attached to the evaluation member by heating and pressurizing for 2 seconds.
  • FPD / LSI inspection microscope ECLIPSE L300ND manufactured by Nikon Instec Co., Ltd.
  • the interface between the evaluation member and the circuit connection adhesive film was observed, and the adhesiveness of the circuit connection adhesive film was confirmed.
  • the circuit connection adhesive film attached to the evaluation member is the one immediately after the circuit connection adhesive film was made, and the one immediately after the circuit connection adhesive film was made.
  • % RH the first adhesive layer was stored for 96 hours in an environment under fluorescent light so that it was in contact with air. Those in which no floating was observed at the interface between the evaluation member and the circuit connection adhesive film were marked with " ⁇ ", and those in which floating was observed were marked with "x”. The results are shown in Tables 1 and 2.
  • connection structure As the first circuit member, AlNd (100 nm) / Mo (50 nm) / on the surface of a non-alkali glass substrate (OA-11, manufactured by Nippon Electric Glass Co., Ltd., outer shape: 38 mm ⁇ 28 mm, thickness: 0.3 mm). An ITO (100 nm) wiring pattern (pattern width: 19 ⁇ m, space between electrodes: 5 ⁇ m) was prepared.
  • an IC chip in which bump electrodes are arranged in two rows in a staggered pattern (outer shape: 0.9 mm ⁇ 20.3 mm, thickness: 0.3 mm, bump electrode size: 70 ⁇ m ⁇ 12 ⁇ m, bump electrode Spacing space: 12 ⁇ m, bump electrode thickness: 8 ⁇ m) was prepared.
  • a connection structure was produced using the adhesive films for circuit connection of Examples 1 to 13 and Comparative Examples 1 and 2.
  • a first adhesive layer of the circuit connection adhesive film was placed on the first circuit member.
  • a thermocompression bonding device (LD-06, manufactured by Ohashi Seisakusho Co., Ltd.) consisting of a stage consisting of a ceramic heater and a tool (8 mm x 50 mm), under the conditions of 50 ° C. and 0.98 MPa (10 kgf / cm 2 ).
  • the circuit connection adhesive film was attached to the first circuit member by heating and pressurizing for 2 seconds.
  • the release film on the side opposite to the first circuit member of the circuit connection adhesive film was peeled off, and the bump electrode of the first circuit member and the circuit electrode of the second circuit member were aligned.
  • connection resistance at 14 points was measured by the four-terminal measurement method, and the maximum value (maximum resistance value) of the connection resistance value was evaluated.
  • the high temperature and high humidity test was performed by storing the connected structure in a high temperature and high humidity tank having a temperature of 85 ° C. and a humidity of 85% RH for 250 hours.
  • a multimeter (MLR21, manufactured by ETAC) was used to measure the connection resistance.
  • an FPD / LSI inspection microscope (ECLIPSE L300ND manufactured by Nikon Instec Co., Ltd.) was installed from the opposite side of the adhesive surface of the first circuit member to the circuit connection adhesive film. Using, the interface between the first circuit member and the circuit connection adhesive film was observed, and the adhesiveness was evaluated. Those in which peeling did not occur at the interface between the first circuit member and the circuit connection adhesive film were marked with " ⁇ ", and those in which peeling occurred were marked with "x”. The evaluation results are shown in Tables 1 and 2.
  • Adhesive film for circuit connection 1A ... First adhesive layer, 1B ... Second adhesive layer, 2,2A, 2B ... Adhesive component, 3,3A ... Conductive particles, 4 ... First circuit Member, 5 ... Second circuit member, 6 ... Connection, 7 ... Insulating material, 10 ... Structure, 41 ... First circuit board, 42 ... First electrode, 51 ... Second circuit board, 52 ... Second electrode.

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  • Adhesive Tapes (AREA)
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JP2011082025A (ja) * 2009-10-07 2011-04-21 Bando Chemical Industries Ltd 導電性ペースト
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