WO2022077576A1 - 柔性显示面板及电子设备 - Google Patents

柔性显示面板及电子设备 Download PDF

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Publication number
WO2022077576A1
WO2022077576A1 PCT/CN2020/124600 CN2020124600W WO2022077576A1 WO 2022077576 A1 WO2022077576 A1 WO 2022077576A1 CN 2020124600 W CN2020124600 W CN 2020124600W WO 2022077576 A1 WO2022077576 A1 WO 2022077576A1
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WO
WIPO (PCT)
Prior art keywords
display panel
flexible display
holes
layer
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/124600
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English (en)
French (fr)
Inventor
陈建锋
张淑媛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US17/297,585 priority Critical patent/US11925061B2/en
Publication of WO2022077576A1 publication Critical patent/WO2022077576A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the present invention relates to the field of display technology, in particular to a flexible display panel and an electronic device.
  • the current flexible display panel includes a plurality of pixels, however, because the existing flexible display panel is subjected to relatively large stress during the rolling process, the pixels are easily damaged, and the display effect is reduced.
  • the present invention provides a flexible display panel and an electronic device, which can avoid pixel damage and improve display effect.
  • the present invention provides a flexible display panel, which includes:
  • a display area including a pixel array, the pixel array including a plurality of pixel groups, the pixel groups including a plurality of pixels arranged along a first direction;
  • the flexible display panel further includes:
  • a semiconductor layer disposed on part of the substrate
  • a gate disposed on the semiconductor layer
  • the position of the metal part corresponds to the position of the gate
  • a first insulating layer is arranged on the metal part; at least one first groove is arranged on the first insulating layer; the position of the first groove and the gap between the two adjacent pixel groups are corresponding to the location.
  • the present invention also provides an electronic device including the above-mentioned flexible display panel.
  • the flexible display panel and electronic device of the present invention include a display area, which includes a pixel array, the pixel array includes a plurality of pixel groups, and the pixel group includes a plurality of pixels arranged along the first direction; the flexible display panel further It includes: a substrate; a semiconductor layer, arranged on a part of the substrate; a gate, arranged on the semiconductor layer; a metal part, arranged on the gate; the position of the metal part and the position of the gate Correspondingly; a first insulating layer is arranged on the metal part; at least one first groove is arranged on the first insulating layer; the position of the first groove and the gap between two adjacent pixel groups position corresponding to the position; since the first groove is arranged at the gap between two adjacent pixel groups, the stress on the flexible display panel during the rolling process can be reduced, thereby avoiding pixel damage and improving the display effect and product yield.
  • FIG. 1 is a top view of a conventional flexible display panel.
  • FIG. 2 is a schematic cross-sectional view of the flexible display panel shown in FIG. 1 along a longitudinal direction.
  • FIG. 3 is a layout diagram of pixels in a conventional flexible display panel.
  • FIG. 4 is a layout diagram of pixels in a flexible display panel according to an embodiment of the present invention.
  • FIG. 5 is an equivalent top view of the display panel shown in FIG. 4 .
  • FIG. 6 is a schematic cross-sectional view of a flexible display panel along a longitudinal direction according to an embodiment of the present invention.
  • FIG. 7 is a layout diagram of pixels in a flexible display panel according to another embodiment of the present invention.
  • FIG. 8 is an equivalent top view of the display panel shown in FIG. 7 .
  • FIG. 9 is an enlarged layout diagram of pixels in a flexible display panel according to an embodiment of the present invention.
  • FIG. 10 is a circuit diagram of a pixel according to an embodiment of the present invention.
  • FIG. 11 is a layout diagram of a single pixel according to an embodiment of the present invention.
  • FIG. 12 is a layout diagram of a single pixel according to another embodiment of the present invention.
  • FIG. 13 is a schematic structural diagram of a data line or a second power line according to an embodiment of the present invention.
  • FIG. 14 is a schematic structural diagram of a data line or a second power line according to another embodiment of the present invention.
  • FIG. 15 is a layout diagram of a single pixel according to yet another embodiment of the present invention.
  • FIG. 16 is a layout diagram of a single pixel according to still another embodiment of the present invention.
  • 17 is a schematic cross-sectional view of a flexible display panel according to another embodiment of the present invention.
  • FIG. 18 is a schematic cross-sectional view of a flexible display panel according to another embodiment of the present invention.
  • FIG. 19 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
  • the existing flexible display panel 100 includes a display area 101 and a pad bending area 102.
  • the display area 101 is used for displaying a picture.
  • the display area 101 includes a plurality of pixels, wherein the pixels include Red pixels, green pixels, and blue pixels.
  • the display area 101 may further include data lines and scan lines.
  • a first wiring area 103 is arranged between the pad bending area 102 and the display area 101, and a second wiring area 104 is arranged below the pad bending area 102, wherein the first wiring area 103 and the second wiring area
  • the regions 104 are all provided with external wirings, and the external wirings in the two wiring regions are located on the same layer.
  • the pad bend area 102 may facilitate the above-mentioned wire area crimping and prevent external wire breakage.
  • the traces in the first trace area 103 are connected to the data lines in the display area 101 .
  • the cross-sectional structure of the flexible display panel 100 includes a first flexible substrate 10, a first barrier layer 11, a second flexible substrate 11', a first barrier layer 12, a buffer layer 12', a semiconductor layer 13, The second insulating layer 14, the first metal layer 15, the third insulating layer 16, the second metal layer 17, the first insulating layer 18, the organic layer 19, the first metal layer 15 includes the gate electrode 151, and the second metal layer 17 includes The metal part 171, the first via hole 201 and the second via hole 202 are provided on the first insulating layer 18, wherein the first via hole 201 is located in the display area 101, and the second via hole 202 is located in the pad bending area 102; in addition, the flexible The display panel 100 further includes a third metal layer 20 , a flat layer 21 , an anode 22 , a pixel definition layer 23 and a spacer 24 , which are sequential
  • the existing first via hole 201 is obtained by digging a hole in a spare position in each pixel.
  • the pixel includes the first transistor T1 to the seventh transistor T7, the first power line 25, the first scan line 26, The second scan line 27 , the third power line 28 ′, the third scan line 29 ′, the data line 211 , and the second power line 222 . It can be seen that the area of the first via hole 201 is small and relatively scattered, so during the curling process, the metal layer in the pixel is easily broken. layer extension, causing cracks in the inorganic layer.
  • FIG. 4 is a schematic cross-sectional view of a flexible display panel according to an embodiment of the present invention.
  • the flexible display panel 100 of the present invention includes a display area, and the display area includes a pixel array (not shown in the drawings), the pixel array includes a plurality of pixel groups a1 , and the pixel group a1 includes A plurality of pixels 71 are arranged along the first direction.
  • the flexible display panel 100 includes: a substrate 301 , a semiconductor layer 13 , a first metal layer 15 , a second metal layer 17 and a first insulating layer 28 .
  • the substrate 301 may include a first flexible substrate 10, a first barrier layer 11, a second flexible substrate 11', and a second barrier layer 12; the material of the first flexible substrate 10 may be polyimide (PI) and other flexible materials.
  • the first barrier layer 11 can be used to prevent the intrusion of water and oxygen from the first flexible substrate 10 .
  • the material of the first blocking layer 11 may be silicon nitride or silicon oxide.
  • the material of the buffer layer 12 ′ can be silicon oxide, silicon nitride, etc., and the material of the semiconductor layer 13 can be polysilicon or amorphous silicon.
  • the semiconductor layer 13 is disposed on part of the substrate 301 ; in addition, in one embodiment, the flexible display panel 100 further includes a buffer layer 12 ′ and a second insulating layer 14 ; specifically, the semiconductor layer 13 is disposed on the buffer layer 12 ′ located in the pixel 71 on; the second insulating layer 14 is located on the semiconductor layer 13 .
  • the material of the second insulating layer 14 may be SiOx or SiNx.
  • the first metal layer 15 includes a gate electrode 151 , and the gate electrode 151 is disposed on the second insulating layer 14 .
  • the second metal layer 17 includes a metal part 171 , the metal part 171 is disposed on the gate electrode 151 , and the position of the metal part 171 corresponds to the position of the gate electrode 151 .
  • Materials of the gate electrode 151 and the metal portion 171 may be copper, aluminum, or other materials.
  • the first insulating layer 28 is disposed on the metal portion 171 ; at least one first groove 203 is disposed on the first insulating layer 28 ; the position of the first groove 203 is the same as that of two adjacent pixel groups The position of 72 at the gap between a1 corresponds.
  • the first insulating layer 28 is provided with a first groove 203 , and the first groove 203 covers the space between two adjacent pixel groups a1 72 at the gap. That is, the length of the first groove 203 is greater than or equal to the length of the gap 72 between two adjacent pixel groups a1.
  • the direction in which the length is located is the same as the first direction. For example, in an embodiment, when the pixel group a1 is arranged in the lateral direction, the length is the size of the lateral direction. When the display panel is rolled, the first direction is parallel to the direction of the roll.
  • the first insulating layer 28 is provided with a plurality of first grooves 203 , the first grooves 203 correspond to the pixels 71 , and the first grooves 203 correspond to the pixels 71 .
  • the length of a groove 203 is greater than or equal to the length of the corresponding pixel 71 .
  • two adjacent first grooves 203 are arranged at intervals.
  • the first groove 203 penetrates the first insulating layer 28 and the buffer layer 12 ′.
  • the shape of the first groove 203 is not limited to this.
  • the first groove 203 in order to further reduce the bending stress, is filled with an organic material 73 .
  • the organic material 73 may be one of silicon-based organic compounds, high molecular polymers such as polymethyl methacrylate, and organic resins.
  • the first groove 203 may not be filled with organic material.
  • the flexible display panel 100 includes: a third insulating layer 16 and a third metal layer 20 .
  • the third insulating layer 16 is disposed between the first metal layer 15 and the second metal layer 17 .
  • the third metal layer 20 is disposed on the first insulating layer 28 , the third metal layer 20 includes a source electrode 61 and a drain electrode 62 , and the source electrode 61 and the drain electrode 62 are located in the pixel 71
  • the flexible display panel 100 includes a first power line 31 , a first scan line 32 , a second scan line 33 , a third power line 34 , a third scan line 35 , a data line 36 and a second power line 37 , wherein the first power line 31 can be arranged through the semiconductor layer 17, the first scan line 32, the second scan line 33 and the third scan line 35 can be arranged through the gate 151, and the third power line 34 can be arranged with the metal
  • the portion 171 is disposed in the same layer, and the data line 36 and the second power line 37 can be disposed in the same layer as the source electrode 61 and the drain electrode 62 , that is, the data line 36 and the second power line 37 are located in the third metal layer 20 .
  • the pixel 71 includes an organic light emitting diode D1, a first transistor T1 to a seventh transistor T7, wherein the gate of the second transistor T2 is connected to the second scan line 33, and the second scan line 33 is input with the second scan signal Scan2 , the source of the second transistor T2 is connected to the data line 36, the data line 36 is input with the data voltage Vdata, the drain of the second transistor T2 is connected to the source of the first transistor T1; the gate of the fourth transistor T4 is connected to the first The scan line 32 is connected, the first scan signal Scan1 is input to the first scan line 32, the source of the fourth transistor T4 is connected to the first power line 31, the first power line 31 is input with the first power voltage Vi, and the fourth transistor T4 The drain is connected to the source of the third transistor T3 and the gate of the first transistor T1.
  • the gate of the third transistor T3 is connected to the second scan line 33 .
  • the drain of the third transistor T3 is connected to the drain of the first transistor T1; the gate of the fifth transistor T5 is connected to the third power line 34, the third power line 34 is used for inputting the light-emitting enable signal S1, and the fifth transistor T5
  • the source is connected to the second power supply line 37, and the second power supply line 37 is used to input the second power supply voltage Vdd.
  • the drain of the fifth transistor T5 is connected to the source of the first transistor T1.
  • One end of the capacitor C1 is connected to the source of the fifth transistor T5, and the other end of the capacitor C1 is connected to the gate of the first transistor T1.
  • the gate of the sixth transistor T6 is connected to the third power supply line 34, the source of the sixth transistor T6 is connected to the drain of the third transistor T3, and the drain of the sixth transistor T6 is connected to the anode of the light-emitting element D1.
  • the gate of the seventh transistor T7 is connected to the third scan line 35, the third scan line 35 is input with the third scan signal Scan3, the source of the seventh transistor T7 is connected to the first power line 31, and the drain of the seventh transistor T7
  • the anode of the light-emitting element D1 is connected, and the cathode of the light-emitting element D1 is connected to the low-level power supply voltage Vss.
  • the flexible display panel 100 of the present invention includes: a display area 101, the display area 101 includes a pixel 71 and a gap between two adjacent pixel groups a1 (hereinafter referred to as a gap area) 72, and the area of the gap area 72 is larger than
  • the preset area that is, the area of the gap area is increased.
  • the preset area is an area to avoid pixel damage during the curling process, and can be specifically set according to an empirical value. Referring to FIG. 4 , the area of the pixel 71 is compressed or reduced, thereby increasing the area of the gap region 72 .
  • the spacing between metal lines in the pixel 71 or the width of the metal lines can be reduced.
  • the area of the pixel 71 can be reduced by the method, and the specific method is not limited.
  • the flexible display panel 100 further includes a pad bending region 102 and metal traces.
  • a second via hole 202 is further provided on the first insulating layer 28 in the pad bending region 102 ; the second via hole 202 is filled with organic materials.
  • the metal trace 63 is disposed on the organic material in the second via hole 202 .
  • the metal trace 63 may also be provided with a plurality of through holes 81 .
  • the metal traces 63 may not be provided with through holes.
  • the depth of the second via hole 202 may be greater than the depth of the first groove 203 .
  • the metal traces 63 are located on the third metal layer 20 .
  • the data lines 36 and/or the second power lines 37 are provided with a plurality of through holes 81 .
  • the outer surfaces of the data lines 36 and/or the second power lines 37 are provided with concave-convex structures, so that the breakage of the signal lines can be further prevented.
  • the position of the protrusion may correspond to the position of the through hole 81
  • the position of the depression corresponds to the position of the gap between two adjacent through holes 81 , and the specific manner is not limited.
  • the outer surfaces of the data lines 36 and/or the second power lines 37 may not be provided with concave-convex structures.
  • the density is greater than that of the through holes 81 away from the set side.
  • the set side is, for example, the side close to the starting end of the crimping.
  • the density of the through holes 81 on the upper side of the data line 36 is greater than the density of the through holes 81 on the lower side of the data line 36, because it is close to the curling starting end. Therefore, more through holes are arranged on this side to further relieve and reduce the stress.
  • two adjacent through holes 81 abut each other.
  • two adjacent through holes 81 may be spaced apart or partially overlapped, and the specific arrangement is not limited to this.
  • the plurality of through holes 81 form a first hole row b1 and a second hole row b2 , the first hole row b1 and the second hole row
  • Each of b2 includes a plurality of through holes 81, and the through holes 81 in the first hole row b1 and the through holes 81 in the second hole row b2 are staggered.
  • the through holes 81 in the first hole row b1 are located at a gap between two adjacent through holes 81 in the second hole row b2.
  • the through holes 81 in the first hole row b1 partially overlap with two adjacent through holes 81 in the second hole row b2.
  • the arrangement of the through holes is not limited to this. 36 or the second power line 37 can also be provided with more hole columns.
  • the shape of the through hole 81 may be at least one of a circle, an ellipse, an approximate ellipse, and a rectangle. Of course, it can be understood that the shape of the through hole 81 may also include a semi-circular shape. A circle, a plate ellipse or a trapezoid is not specifically limited.
  • the structure of the through hole on the metal trace can be the same as the structure of the through hole on the data line or the second power line.
  • the flexible display panel 100 may further include: an organic layer 29 disposed on the first insulating layer 28 , in the first groove 203 and the second via hole 202 Inside.
  • the organic layer 29 is provided on a part of the first insulating layer 28 . Since the organic layer covers part of the first insulating layer, the contact area with the flat layer can be reduced , thereby preventing the peeling phenomenon of the flat layer and improving the yield and service life of the product.
  • the flexible display panel may also not include: the organic layer 29 .
  • the organic material 73 is filled in the first groove 203 and the second via hole 202 at this time.
  • the organic material can be one of silicon-based organic compounds, high molecular polymers such as polymethyl methacrylate, and organic resins. kind.
  • the first groove is arranged at the gap between two adjacent pixel groups, the stress on the flexible display panel during the rolling process can be reduced, thereby avoiding pixel damage, and improving the display effect and product yield.
  • FIG. 19 is a schematic structural diagram of an electronic device provided by the present invention.
  • the electronic device 200 may include any one of the above-mentioned flexible display panels 100 , a control circuit 80 and a casing 90 . It should be noted that the electronic device 200 shown in FIG. 19 is not limited to the above contents, and may also include other components, such as a camera, an antenna structure, a fingerprint unlocking module, and the like.
  • the flexible display panel 100 is disposed on the casing 90 .
  • the flexible display panel 100 may be fixed to the casing 90, and the flexible display panel 100 and the casing 90 form a closed space to accommodate devices such as the control circuit 80.
  • the casing 90 may be made of a flexible material, such as a plastic casing or a silicone casing.
  • control circuit 80 is installed in the casing 90, the control circuit 80 can be the main board of the electronic device 200, and the control circuit 80 can be integrated with a battery, an antenna structure, a microphone, a speaker, a headphone interface, a universal serial bus interface, One, two or more of functional components such as camera, distance sensor, ambient light sensor, receiver, and processor.
  • the flexible display panel 100 is installed in the housing 90 , and at the same time, the flexible display panel 100 is electrically connected to the control circuit 80 to form a display surface of the electronic device 200 .
  • the flexible display panel 100 may include a display area and a non-display area.
  • the display area may be used to display the screen of the electronic device 200 or for the user to perform touch manipulation or the like. This non-display area can be used to set various functional components.
  • the electronic devices include but are not limited to mobile phones, tablet computers, computer monitors, game consoles, televisions, display screens, wearable devices, and other household appliances or household appliances with display functions.
  • the flexible display panel and electronic device of the present invention include a display area, which includes a pixel array, the pixel array includes a plurality of pixel groups, and the pixel group includes a plurality of pixels arranged along the first direction; the flexible display panel further It includes: a substrate; a semiconductor layer, arranged on a part of the substrate; a gate, arranged on the semiconductor layer; a metal part, arranged on the gate; the position of the metal part and the position of the gate Correspondingly; a first insulating layer is arranged on the metal part; at least one first groove is arranged on the first insulating layer; the position of the first groove and the gap between two adjacent pixel groups position corresponding to the position; since the first groove is arranged at the gap between two adjacent pixel groups, the stress on the flexible display panel during the rolling process can be reduced, thereby avoiding pixel damage and improving the display effect and product yield.

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Abstract

本发明公开了一种柔性显示面板及电子设备，该柔性显示面板包括多个像素组，所述像素组包括多个沿第一方向排列的像素；所述柔性显示面板还包括：基底；半导体层、栅极、金属部；第一绝缘层，设于所述金属部上；所述第一绝缘层上设置有至少一第一凹槽；所述第一凹槽的位置与相邻两个像素组之间的间隙处的位置对应。

Description

柔性显示面板及电子设备 技术领域
本发明涉及显示技术领域，具体涉及一种柔性显示面板及电子设备。
 背景技术
随着柔性显示面板的不断发展，可折叠和卷曲面板成为柔性显示面板的主流方向。
 技术问题
目前的柔性显示面板包括多个像素，然而由于现有的柔性显示面板在卷曲过程中所受的应力较大，因此容易使像素受损，降低了显示效果。
 技术解决方案
本发明提供一种柔性显示面板及电子设备，可以避免像素受损，提高了显示效果。
本发明提供一种柔性显示面板，其包括：
显示区域，其包括像素阵列，所述像素阵列包括多个像素组，所述像素组包括多个沿第一方向排列的像素；
所述柔性显示面板还包括：
基底；
半导体层，设于部分所述基底上；
栅极，设于所述半导体层上；
金属部，设于所述栅极上；所述金属部的位置与所述栅极的位置对应；
第一绝缘层，设于所述金属部上；所述第一绝缘层上设置有至少一第一凹槽；所述第一凹槽的位置与相邻两个像素组之间的间隙处的位置对应。
本发明还提供一种电子设备，其包括上述柔性显示面板。
 有益效果
本发明的柔性显示面板及电子设备，包括显示区域，其包括像素阵列，所述像素阵列包括多个像素组，所述像素组包括多个沿第一方向排列的像素；所述柔性显示面板还包括：基底；半导体层，设于部分所述基底上；栅极，设于所述半导体层上；金属部，设于所述栅极上；所述金属部的位置与所述栅极的位置对应；第一绝缘层，设于所述金属部上；所述第一绝缘层上设置有至少一第一凹槽；所述第一凹槽的位置与相邻两个像素组之间的间隙处的位置对应；由于在相邻两个像素组之间的间隙处设置第一凹槽，因此可以减小在卷曲过程中柔性显示面板所受的应力，从而避免像素受损，提高了显示效果和产品良率。
 附图说明
图1为现有柔性显示面板的俯视图。
图2为图1中所示的柔性显示面板沿纵向方向的剖面示意图。
图3为现有柔性显示面板内像素的布局图。
图4为本发明一实施例提供的柔性显示面板内像素的布局图。
图5为图4所示的显示面板的等效俯视图。
图6为本发明一实施例提供的柔性显示面板沿纵向方向的剖面示意图。
图7为本发明另一实施例提供的柔性显示面板内像素的布局图。
图8为图7所示的显示面板的等效俯视图。
图9为本发明一实施例提供的柔性显示面板内像素的放大布局图。
图10为本发明一实施例提供的像素的电路图。
图11为本发明一实施例提供的单个像素的布局图。
图12为本发明另一实施例提供的单个像素的布局图。
图13为本发明一实施例提供的数据线或者第二电源线的结构示意图。
图14为本发明另一实施例提供的数据线或者第二电源线的结构示意图。
图15为本发明又一实施例提供的单个像素的布局图。
图16为本发明再一实施例提供的单个像素的布局图。
图17为本发明另一实施例提供的柔性显示面板的剖面示意图。
图18为本发明又一实施例提供的柔性显示面板的剖面示意图。
图19为本发明一实施例提供的电子设备的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别不同对象，而不是用于描述特定顺序。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。
如图1所示，现有的柔性显示面板100包括显示区域101和垫弯区域102，显示区域101用于显示画面，在一实施方式中，所述显示区域101包括多个像素，其中像素包括红色像素、绿色像素以及蓝色像素。所述显示区域101还可包括数据线和扫描线。
所述垫弯区域102和所述显示区域101之间设置有第一走线区域103，垫弯区域102的下方设置有第二走线区域104，其中第一走线区域103和第二走线区域104均设置有外部走线，且两个走线区域中的外部走线位于同一层。垫弯区域102可便于上述走线区域卷曲以及防止外部走线断裂。第一走线区域103中的走线与显示区域101中的数据线连接。
柔性连接器30与外部走线的另一端连接，所述主柔性电路板40与所述柔性连接器30连接。如图2所示，柔性显示面板100的截面结构包括第一柔性衬底10、第一阻隔层11、第二柔性衬底11'、第一阻隔层12、缓冲层12'、半导体层13、第二绝缘层14、第一金属层15、第三绝缘层16、第二金属层17以及第一绝缘层18、有机层19，第一金属层15包括栅极151，第二金属层17包括金属部171，第一绝缘层18上设置有第一过孔201和第二过孔202，其中第一过孔201位于显示区域101内，第二过孔202位于垫弯区域102内；此外柔性显示面板100还包括依次设于有机层19上的第三金属层20、平坦层21、阳极22、像素定义层23以及间隙子24。
结合图3，现有的第一过孔201是在各像素内空余的位置进行挖孔得到的，像素包括第一晶体管T1至第七晶体管T7，第一电源线25、第一扫描线26、第二扫描线27以及第三电源线28’、第三扫描线29’以及数据线211、第二电源线222。可见第一过孔201的面积较小，且比较分散，因此在卷曲过程中，容易使得像素内的金属层出现断裂，当金属层出现断裂时，在持续的弯折应力下，裂纹进一步向无机层延伸，从而引发无机层出现裂纹。
请参阅图4，图4为本发明一实施例提供的柔性显示面板的剖面示意图。
如图4和图5所示，本发明的柔性显示面板100包括显示区域，显示区域包括像素阵列（图中未标出），所述像素阵列包括多个像素组a1，所述像素组a1包括多个沿第一方向排列的像素71。
结合图6，所述柔性显示面板100包括：基底301、半导体层13、第一金属层15、第二金属层17以及第一绝缘层28。
基底301可包括第一柔性衬底10、第一阻隔层11、第二柔性衬底11'、第二阻隔层12；第一柔性衬底10的材料可以为聚酰亚胺(Polyimide，PI)等柔性材料。该第一阻隔层11可以用于防止水氧从第一柔性衬底10侵入。第一阻隔层11的材料可为氮化硅或氧化硅。缓冲层12'的材料可为氧化硅、氮化硅等，半导体层13的材料可为多晶硅或者非晶硅。
半导体层13设于部分基底301上；此外在一实施方式中，柔性显示面板100还包括缓冲层12'和第二绝缘层14；具体地半导体层13设于位于像素71内的缓冲层12'上；第二绝缘层14位于半导体层13上。第二绝缘层14的材料可为SiOx或者SiNx。
第一金属层15包括栅极151，栅极151设于第二绝缘层14上。
第二金属层17包括金属部171，金属部171设于所述栅极151上，金属部171的位置与栅极151的位置对应。栅极151和金属部171的材料可为铜、铝等材料。
结合图5，第一绝缘层28设于所述金属部171上；所述第一绝缘层28上设置有至少一第一凹槽203；第一凹槽203的位置与相邻两个像素组a1之间的间隙处72的位置对应。
在一些实施例中，如图4和图5所示，所述第一绝缘层28上设置有一个第一凹槽203，所述第一凹槽203覆盖相邻两个像素组a1之间的间隙处72。也即，所述第一凹槽203的长度大于或等于相邻两个像素组a1之间的间隙处72的长度。所述长度所在的方向与第一方向相同，比如在一实施方式中，当像素组a1沿横向方向排布时，长度为横向方向的尺寸。当显示面板卷曲时，第一方向与卷轴的方向平行。
在一些实施例中，如图7和图8所示，所述第一绝缘层28上设置有多个第一凹槽203，所述第一凹槽203与所述像素71对应，所述第一凹槽203的长度大于或等于对应的像素71的长度。在一优选实施方式中，相邻两个所述第一凹槽203之间间隔设置。在一实施方式中，所述第一凹槽203贯穿所述第一绝缘层28和所述缓冲层12'。
当然第一凹槽203的形状不限于此。在一实施方式中，为了进一步减小弯折应力，所述第一凹槽203内填充有有机材料73。有机材料73可以为硅基有机物、聚甲基丙烯酸甲酯等高分子聚合物和有机树脂等中的一种。在另一实施方式中，所述第一凹槽203内也可不填充有有机材料。在一实施方式中，结合图6，柔性显示面板100包括：第三绝缘层16以及第三金属层20。
第三绝缘层16设于第一金属层15和第二金属层17之间。
第三金属层20设于所述第一绝缘层28上，所述第三金属层20包括源极61和漏极62，所述源极61和漏极62位于所述像素71内
如图9所示，柔性显示面板100包括第一电源线31、第一扫描线32、第二扫描线33、第三电源线34、第三扫描线35、数据线36以及第二电源线37，其中第一电源线31可与半导体层17通层设置，第一扫描线32、第二扫描线33以及第三扫描线35可与栅极151通层设置，第三电源线34可与金属部171同层设置，数据线36和第二电源线37均可与源极61和漏极62同层设置，也即数据线36和第二电源线37位于第三金属层20。
结合图10，像素71包括有机发光二极管D1，第一晶体管T1至第七晶体管T7，其中第二晶体管T2的栅极与第二扫描线33连接，第二扫描线33输入有第二扫描信号Scan2,第二晶体管T2的源极与数据线36连接，数据线36输入有数据电压Vdata，第二晶体管T2的漏极与第一晶体管T1的源极连接；第四晶体管T4的栅极与第一扫描线32连接，第一扫描线32输入有第一扫描信号Scan1，第四晶体管T4的源极与第一电源线31连接，第一电源线31输入有第一电源电压Vi，第四晶体管T4的漏极与第三晶体管T3的源极以及第一晶体管T1的栅极连接。第三晶体管T3的栅极与第二扫描线33连接。第三晶体管T3的漏极以及第一晶体管T1的漏极连接；第五晶体管T5的栅极与第三电源线34连接，第三电源线34用于输入发光使能信号S1，第五晶体管T5的源极与第二电源线37连接，第二电源线37用于输入第二电源电压Vdd。第五晶体管T5的漏极与第一晶体管T1的源极连接。电容C1的一端与第五晶体管T5的源极连接，电容C1的另一端与第一晶体管T1的栅极连接。
第六晶体管T6的栅极与第三电源线34连接，第六晶体管T6的源极与第三晶体管T3的漏极连接，第六晶体管T6的漏极与发光元件D1的阳极连接。第七晶体管T7的栅极与第三扫描线35连接，第三扫描线35输入有第三扫描信号Scan3，第七晶体管T7的源极与第一电源线31连接，第七晶体管T7的漏极与发光元件D1的阳极连接，发光元件D1的阴极接入低电平电源电压Vss。
结合图6，本发明的柔性显示面板100包括：显示区域101，显示区域101包括像素71和相邻两个像素组a1之间的间隙处（以下简称间隙区）72，间隙区72的面积大于预设面积，也即增大了间隙区的面积。该预设面积为避免卷曲过程中像素受损的面积，具体可以根据经验值设定。结合图4，也即将像素71的面积进行压缩或者减小，从而增大间隙区72的面积，在具体实施方式中，可以减小像素71内金属线之间的间距，或者金属线的宽度等方式来减小像素71的面积，具体方式不限。
在另一实施例中，返回图6，所述柔性显示面板100还包括垫弯区域102和金属走线。
位于所述垫弯区域102内的第一绝缘层28上还设置有第二过孔202；所述第二过孔202内填充有有机材料。
金属走线63设于所述第二过孔202内的有机材料上，在一实施方式中，所述金属走线63上也可设置有多个通孔81。在另一实施方式中，所述金属走线63上可未设置有通孔。在一优选实施方式中，所述第二过孔202的深度可大于所述第一凹槽203的深度。为了简化制程工艺，所述金属走线63位于所述第三金属层20。
如图11和图12所示，所述数据线36和/或第二电源线37上设置有多个通孔81。在一些实施例中，如图11所示，数据线36和/或第二电源线37的外表面上设置有凹凸结构，因此可以进一步防止信号线发生断裂。在一实施方式中，凸起的位置可与通孔81的位置对应，凹陷的位置与相邻两个通孔81的间隙处的位置对应，具体方式不限。在另一些实施例中，如图12所示，数据线36和/或第二电源线37的外表面也可不设置有凹凸结构。在一些实施方式中，以数据线36和/或第二电源线37的外表面未设置有凹凸结构为例，在一实施方式中，如图13所示，靠近设定侧的通孔81的密度大于远离设定侧的通孔81的密度。该设定侧比如为靠近卷曲起始端的一侧。比如数据线或者第二电源线的上侧靠近卷曲起始端，则数据线36的上侧的通孔81的密度大于数据线36的下侧的通孔81的密度，由于靠近卷曲起始端一侧的应力较大，因此通过在该侧设置较多的通孔，从而进一步缓解和减小应力。
在一些实施方式中，如图14所示，相邻两个通孔81彼此抵接，在其他实施方式中，相邻两个通孔81之间可间隔设置或者部分重叠，具体排列方式不限于此。
在另一实施方式中，如图15或图16所示，所述多个通孔81组成第一孔列b1和第二孔列b2，所述第一孔列b1和所述第二孔列b2均包括多个通孔81,所述第一孔列b1内的通孔81和所述第二孔列b2内的通孔81之间交错设置。在一实施方式中，所述第一孔列b1内的通孔81位于所述第二孔列b2内的相邻两个通孔81之间的间隙处。在其他实施方式中，所述第一孔列b1内的通孔81与所述第二孔列b2内的相邻两个通孔81部分重叠，当然通孔的排列方式不限于此，数据线36或者第二电源线37上还可设置更多的孔列。如图11至图16所示，所述通孔81的形状可为圆形、椭圆形近似椭圆形以及长方形中的至少一种，当然可以理解的，所述通孔81的形状还可包括半圆形、板椭圆形或者梯形，具体不作限定。在一优选实施方式中，其中金属走线上通孔的结构可与数据线或者第二电源线上通孔的结构相同。
在一实施例中，返回图6，所述柔性显示面板100还可包括：有机层29设于所述第一绝缘层28上、所述第一凹槽203内以及所述第二过孔202内。在另一实施例中，如图17所示，有机层29设于部分所述第一绝缘层28上，由于有机层覆盖部分第一绝缘层，因此可以减小与平坦层之间的接触面积，从而防止平坦层发生剥离现象，提高了产品的良率和使用寿命。在另一实施例中，如图18所示，为了更好地防止平坦层发生剥离，所述柔性显示面板也可不包括：有机层29。也即此时在第一凹槽203和第二过孔202内填充有有机材料73，该有机材料可以为硅基有机物、聚甲基丙烯酸甲酯等高分子聚合物和有机树脂等中的一种。
由于在相邻两个像素组之间的间隙处设置第一凹槽，因此可以减小在卷曲过程中柔性显示面板所受的应力，从而避免像素受损，提高了显示效果和产品良率。
请参阅图19，图19为本发明提供的电子设备的结构示意图。
该电子设备200可以包括上述任意一种柔性显示面板100、控制电路80以及壳体90。需要说明的是，图19所示的电子设备200并不限于以上内容，其还可以包括其他器件，比如还可以包括摄像头、天线结构、指纹解锁模块等。
其中，柔性显示面板100设置于壳体90上。
在一些实施例中，柔性显示面板100可以固定到壳体90上，柔性显示面板100和壳体90形成密闭空间，以容纳控制电路80等器件。
在一些实施例中，壳体90可以为由柔性材料制成，比如为塑胶壳体或者硅胶壳体等。
其中，该控制电路80安装在壳体90中，该控制电路80可以为电子设备200的主板，控制电路80上可以集成有电池、天线结构、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。
其中，该柔性显示面板100安装在壳体90中，同时，该柔性显示面板100电连接至控制电路80上，以形成电子设备200的显示面。该柔性显示面板100可以包括显示区域和非显示区域。该显示区域可以用来显示电子设备200的画面或者供用户进行触摸操控等。该非显示区域可用于设置各种功能组件。
所述电子设备包括但不限定于手机、平板电脑、计算机显示器、游戏机、电视机、显示屏幕、可穿戴设备及其他具有显示功能的生活电器或家用电器等。
本发明的柔性显示面板及电子设备，包括显示区域，其包括像素阵列，所述像素阵列包括多个像素组，所述像素组包括多个沿第一方向排列的像素；所述柔性显示面板还包括：基底；半导体层，设于部分所述基底上；栅极，设于所述半导体层上；金属部，设于所述栅极上；所述金属部的位置与所述栅极的位置对应；第一绝缘层，设于所述金属部上；所述第一绝缘层上设置有至少一第一凹槽；所述第一凹槽的位置与相邻两个像素组之间的间隙处的位置对应；由于在相邻两个像素组之间的间隙处设置第一凹槽，因此可以减小在卷曲过程中柔性显示面板所受的应力，从而避免像素受损，提高了显示效果和产品良率。
以上对本发明提供的柔性显示面板及电子设备进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明。同时，对于本领域的技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种柔性显示面板，其包括：显示区域，其包括像素阵列，所述像素阵列包括多个像素组，所述像素组包括多个沿第一方向排列的像素；
    所述柔性显示面板还包括：
    基底；
    半导体层，设于部分所述基底上；
    栅极，设于所述半导体层上；
    金属部，设于所述栅极上；所述金属部的位置与所述栅极的位置对应；
    第一绝缘层，设于所述金属部上；所述第一绝缘层上设置有至少一第一凹槽；所述第一凹槽的位置与相邻两个像素组之间的间隙处的位置对应。
  2. 根据权利要求1所述的柔性显示面板，其中所述第一绝缘层上设置有多个第一凹槽，所述第一凹槽与所述像素对应，所述第一凹槽的长度大于或等于对应的像素的长度，所述长度所在的方向与所述第一方向相同。
  3. 根据权利要求2所述的柔性显示面板，其中相邻两个所述第一凹槽之间间隔设置。
  4. 根据权利要求1所述的柔性显示面板，其中所述第一绝缘层上设置有一个第一凹槽，所述第一凹槽覆盖相邻两个像素组之间的间隙处。
  5. 根据权利要求1所述的柔性显示面板，其中
    所述第一凹槽内填充有有机材料。
  6. 根据权利要求1所述的柔性显示面板，其中
    所述柔性显示面板还包括数据线和第二电源线；
    所述数据线设置有多个通孔和/或所述第二电源线上设置有多个通孔。
  7. 根据权利要求6所述的柔性显示面板，其中所述数据线的外表面和/或所述第二电源线的外表面设置有凹凸结构。
  8. 根据权利要求6所述的柔性显示面板，其中
    靠近设定侧的通孔的密度大于远离设定侧的通孔的密度。
  9. 根据权利要求6所述的柔性显示面板，其中
    所述多个通孔包括第一孔列和第二孔列，所述第一孔列和所述第二孔列均包括多个通孔，所述第一孔列内的通孔和所述第二孔列内的通孔之间交错设置。
  10. 根据权利要求9所述的柔性显示面板，其中
    所述第一孔列内的通孔位于所述第二孔列内的相邻两个通孔之间的间隙处。
  11. 根据权利要求6所述的柔性显示面板，其中相邻两个通孔之间彼此抵接。
  12. 根据权利要求6所述的柔性显示面板，其中所述柔性显示面板还包括：
    第三金属层，设于所述第一绝缘层上，所述第三金属层包括源极和漏极；
    所述数据线和所述第二电源线均位于所述第三金属层。
  13. 根据权利要求1所述的柔性显示面板，其中
    所述第一凹槽的俯视形状包括圆形、长方形以及梯形中的至少一种。
  14. 根据权利要求1所述的柔性显示面板，其中所述柔性显示面板还包括：
    缓冲层，设于所述基底和所述半导体层之间；
    所述第一凹槽贯穿所述第一绝缘层和所述缓冲层。
  15. 根据权利要求1所述的柔性显示面板，其中所述柔性显示面板还包括垫弯区域；
    位于所述垫弯区域内的第一绝缘层上还设置有第二过孔；所述第二过孔内填充有有机材料；所述第二过孔的深度大于所述第一凹槽的深度。
  16. 根据权利要求15所述的柔性显示面板，其中所述柔性显示面板还包括：
    金属走线，设于所述第二过孔内的有机材料上。
  17. 根据权利要求16所述的柔性显示面板，其中所述金属走线上设置有通孔。
  18. 根据权利要求16所述的柔性显示面板，其中所述柔性显示面板还包括：第三金属层，所述金属走线位于所述第三金属层。
  19. 根据权利要求1所述的柔性显示面板，其中当所述柔性显示面板卷曲时，所述第一方向与所述柔性显示面板的卷轴的方向平行。
  20. 一种电子设备，其包括如权利要求1所述的柔性显示面板。
PCT/CN2020/124600 2020-10-15 2020-10-29 柔性显示面板及电子设备 Ceased WO2022077576A1 (zh)

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