WO2022070946A1 - 感光性樹脂組成物、硬化物、及び表示装置、並びに、硬化物の製造方法 - Google Patents

感光性樹脂組成物、硬化物、及び表示装置、並びに、硬化物の製造方法 Download PDF

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Publication number
WO2022070946A1
WO2022070946A1 PCT/JP2021/034096 JP2021034096W WO2022070946A1 WO 2022070946 A1 WO2022070946 A1 WO 2022070946A1 JP 2021034096 W JP2021034096 W JP 2021034096W WO 2022070946 A1 WO2022070946 A1 WO 2022070946A1
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group
resin
carbon atoms
structural unit
compound
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English (en)
French (fr)
Japanese (ja)
Inventor
谷垣勇剛
日比野千香
西山雅仁
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Toray Industries Inc
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Toray Industries Inc
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Priority to KR1020237002851A priority Critical patent/KR20230078994A/ko
Priority to CN202180065410.2A priority patent/CN116261688A/zh
Priority to JP2021559351A priority patent/JP7819496B2/ja
Publication of WO2022070946A1 publication Critical patent/WO2022070946A1/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]

Definitions

  • the present invention relates to a photosensitive resin composition, a cured product, a display device, and a method for producing the cured product.
  • EL organic electroluminescence
  • a pixel dividing layer In order to improve the light emission characteristics and reliability of the organic EL display, a pixel dividing layer, a thin transistor (hereinafter, "TFT") flattening layer, a TFT protective layer, or a layer in the formation of a TFT array of the organic EL display.
  • TFT thin transistor
  • a highly heat-resistant photosensitive composition is used for the insulating layer or the gate insulating layer.
  • the organic EL display As an improvement in the light emission characteristics of the organic EL display, if the organic EL display is driven at a low voltage, a high current flows at a desired voltage, so that high brightness and power saving can be realized. Further, if the light emitting element is made highly reliable, the durability of the organic EL display can be improved. Therefore, in order to obtain a desired current density, it is required to achieve both excellent light emission characteristics capable of low voltage drive and excellent reliability of the light emitting element.
  • the pixel division layer After forming the pixel division layer, it is common to form a film of a light emitting material by vapor deposition through a vapor deposition mask, and then to form a film of a second electrode by vapor deposition. Therefore, the pixel division layer is also required to have a low taper pattern shape. It is also common to form a thick region (hereinafter, "thick film portion") in a part of the pixel dividing layer as a support base of the vapor deposition mask when the light emitting material is formed into a film by vapor deposition. Such a thick region in a part of the pixel dividing layer can be formed by a two-layer film forming process in which the photosensitive composition is formed again on the pixel dividing layer and then patterned. be.
  • the photosensitive composition examples include a negative photosensitive composition containing an epoxy acrylate resin and a novolak resin (see Patent Documents 1 and 2), a first resin such as polyimide, and a second resin such as a cardo-based resin. Examples thereof include a negative photosensitive composition containing a resin (see Patent Document 3).
  • the development residue on the surface of the anode, which is the opening is predominantly generated in the process of forming the coating film of the photosensitive composition because the alkali solubility of the components in the coating film is lowered by the thermal reaction at the time of prebaking.
  • the development residue on the surface of the anode, which is the opening not only raises the drive voltage required to obtain the desired current density, but also generates dark spots starting from the development residue, and is generated from the development residue. Outgas causes a factor that reduces the reliability of the light emitting element.
  • the pixel dividing layer and the thick film portion are collectively exposed by pattern exposure via a halftone photomask.
  • the characteristics to be formed (hereinafter referred to as "halftone characteristics") may be insufficient. Even if a halftone photomask is used, the film thickness difference between the pixel division layer and the thick film portion may not be formed, or the region of the pixel division layer may disappear during development. This is considered to be dominated by the sensitivity of the photosensitive composition to light with a relatively small exposure through the halftone portion of the halftone photomask.
  • a positive photosensitive composition if the sensitivity to light through the halftone portion is excessive, the region of the pixel dividing layer tends to disappear during development.
  • a negative photosensitive composition if the sensitivity to light through the halftone portion is excessive, it tends to be difficult to form a film thickness difference between the pixel dividing layer and the thick film portion.
  • inadequate photocuring tends to occur in a region where the exposure amount is relatively small, and the region of the pixel division layer often disappears during development, making stable pattern processing difficult. Is.
  • the opening size error from the pattern size of the photomask (hereinafter, “mask bias property”) is large, the design error of the light emitting pixel region on the anode Therefore, it adversely affects the light emission characteristics of the organic EL display.
  • mask bias property In order to suppress the mask bias property, there is a method of adjusting the pattern size of the photomask according to the characteristics of the photosensitive composition, but there is another problem that the design such as the pattern arrangement and resolution of the photomask is limited. Occur. Further, if the mask bias property is excessively large, it becomes difficult to improve the photomask by adjusting the pattern dimensions.
  • the mask bias property includes a characteristic that the opening size is narrower than the pattern size of the photomask (hereinafter, “narrow mask bias”) and a characteristic that the opening size is wider than the pattern size of the photomask (hereinafter, “narrow mask bias”).
  • narrow mask bias a characteristic that the opening size is narrower than the pattern size of the photomask
  • narrow mask bias a characteristic that the opening size is wider than the pattern size of the photomask
  • the mask bias property differs depending on how much the improvement in alkali solubility of the exposed part is affected by the diffracted light.
  • the mask bias property differs depending on how much the decrease in alkali solubility due to photocuring of the exposed portion is affected by the diffracted light.
  • the photosensitive composition is required to have a material having excellent residue suppression after development, narrow mask bias suppression of aperture pattern size after development, low taper of pattern shape after thermosetting, and excellent halftone characteristics. To.
  • all of the photosensitive compositions described in the above documents are insufficient in any of the above properties.
  • the photosensitive resin composition according to the first aspect of the present invention contains (A) an alkali-soluble resin and (C) a photosensitive agent, and the (C) photosensitive agent is (C).
  • the photosensitive resin composition according to the second aspect of the present invention contains (A) an alkali-soluble resin and (C) a photosensitizer, and the (C) photosensitizer contains (C1) a photopolymerization initiator.
  • the (A) alkali-soluble resin contains a resin having (A3) a phenolic hydroxyl group, and the resin having the (A3) phenolic hydroxyl group has a (A3x) phenolic hydroxyl group.
  • a resin having at least two structural units a resin having a (A3y) phenolic hydroxyl group, and a structural unit containing an aromatic group, a structural unit containing a (A3z) phenolic hydroxyl group, and a second aromatic group.
  • a photosensitive resin composition containing at least one selected from the group consisting of resins having structural units.
  • the display device has at least a substrate, a first electrode, a second electrode, and a pixel dividing layer, and further comprises an organic EL layer including a light emitting layer and / or a light extraction including a light emitting layer.
  • the pixel dividing layer is formed so as to overlap a part on the first electrode, and the organic EL layer including the light emitting layer and / or the light extraction layer including the light emitting layer is A resin having a structural unit formed on the first electrode and between the first electrode and the second electrode, and the pixel dividing layer containing at least two (X-DL) phenolic hydroxyl groups. , A display device.
  • the display device has at least a substrate, a first electrode, a second electrode, and a pixel dividing layer, and further comprises an organic EL layer including a light emitting layer and / or a light extraction including a light emitting layer.
  • the pixel dividing layer is formed so as to overlap a part on the first electrode, and the organic EL layer including the light emitting layer and / or the light extraction layer including the light emitting layer is A resin having a structural unit formed on the first electrode and between the first electrode and the second electrode, wherein the pixel dividing layer contains at least two (X-DL) phenolic hydroxyl groups.
  • a resin having a structural unit containing a phenolic hydroxyl group and an aromatic group and a resin having a structural unit containing (Z-DL) a phenolic hydroxyl group and a structural unit containing a second aromatic group. It is a display device having one or more kinds selected from the group.
  • the photosensitive resin composition of the present invention has excellent photosensitivity, which suppresses residue after development, suppresses narrow mask bias of opening pattern size after development, reduces taper of pattern shape after heat curing, and has excellent halftone characteristics. It is possible to provide a sex resin composition. In addition, according to the photosensitive resin composition of the present invention, it is possible to provide a cured film suitable for an organic EL display having excellent light emitting characteristics capable of driving at a low voltage and having excellent reliability of a light emitting element. Is.
  • the display device of the present invention it is possible to provide a display device having excellent light emitting characteristics capable of low voltage drive and having excellent reliability of the light emitting element in obtaining a desired current density.
  • FIG. 1 is a cross-sectional view showing an example of a cross section of a curing pattern having a stepped shape.
  • FIG. 2 is a process diagram illustrating the manufacturing process of steps 1 to 7 in an organic EL display using a cured product of the photosensitive resin composition of the present invention in a schematic cross section.
  • FIG. 3 is a schematic diagram illustrating the arrangement and dimensions of the translucent portion, the light-shielding portion, and the semi-translucent portion in the halftone photomask used for the halftone characteristic evaluation.
  • FIG. 4 is a schematic view illustrating the manufacturing process of steps 1 to 4 in the substrate of the organic EL display used for the evaluation of light emission characteristics in a plan view.
  • FIG. 5 is a schematic view illustrating a schematic cross section of a flexible organic EL display having no polarizing layer.
  • a sixth aspect, and a ninth aspect of the display device will be described.
  • it when described as a photosensitive resin composition of the present invention, it relates to the photosensitive resin composition of the first aspect, the second aspect, the fifth aspect, the seventh aspect, and the eighth aspect of this invention. It is a description.
  • the photosensitive resin composition of a specific aspect it is described as the photosensitive resin composition of the first aspect and the like.
  • the display device of the present invention the display device including the cured product of the photosensitive resin composition of the present invention, and the third, fourth, sixth, and sixth aspects of the present invention. It is a description about the display device of the 9th aspect. On the other hand, when the display device of a specific aspect is described, it is described as the display device of the third aspect and the like.
  • the photosensitive resin composition according to the first aspect of the present invention contains (A) an alkali-soluble resin and (C) a photosensitive agent, and the (C) photosensitive agent contains (C1) a photopolymerization initiator.
  • (A) an alkali-soluble resin contains (A3) a resin having a phenolic hydroxyl group, and the (A3) the resin having a phenolic hydroxyl group contains at least (A3x) a phenolic hydroxyl group.
  • the photosensitive resin composition according to the second aspect of the present invention contains (A) an alkali-soluble resin and (C) a photosensitizer, and the (C) photosensitizer contains (C1) a photopolymerization initiator.
  • (A) an alkali-soluble resin contains (A3) a resin having a phenolic hydroxyl group, and the (A3) the resin having a phenolic hydroxyl group contains at least (A3x) a phenolic hydroxyl group.
  • a photosensitive resin composition Containing a resin having two structural units, a (A3y) phenolic hydroxyl group, and a resin having a structural unit containing an aromatic group, a structural unit containing (A3z) a phenolic hydroxyl group, and a second aromatic group.
  • a photosensitive resin composition containing at least one type selected from the group consisting of resins having structural units.
  • the photosensitive resin composition according to the fifth aspect of the present invention contains (A) an alkali-soluble resin and (C) a photosensitizer, and the (C) photosensitizer contains (C1) a photopolymerization initiator.
  • the alkali-soluble resin contains (A3) a resin having a phenolic hydroxyl group
  • the (A3) the resin having a phenolic hydroxyl group is (A3-1) a phenol resin,
  • Phenolic resin (1) A resin having a structural unit containing at least two groups having a phenolic hydroxyl group. (2) A resin having a structural unit containing at least three groups having a phenolic hydroxyl group connected by one atom. (3) It has a structural unit containing both a structure containing at least three groups having a phenolic hydroxyl group connected by one atom and a structure having 3 to 12 carbon atoms connecting the groups having a phenolic hydroxyl group. resin, (4) A resin having a structural unit including a structure in which at least two aromatic ring skeletons are directly connected, and a resin.
  • (5) Contains one or more selected from the group consisting of a resin having a structural unit containing a group having at least two phenolic hydroxyl groups.
  • A3-3) The phenol group-modified epoxy resin contains a resin having a phenolic hydroxyl group, (A3-4)
  • the phenolic modified acrylic resin is a photosensitive resin composition containing a resin having a phenolic hydroxyl group.
  • the photosensitive resin composition according to the seventh aspect of the present invention is a photosensitive resin composition containing (A) an alkali-soluble resin and (C) a photosensitive agent, and (A) an alkali-soluble resin is (A3). ) Contains a resin having a phenolic hydroxyl group and further contains an acidic group containing (F0) phosphorus atom and / or a compound having a salt of an acidic group containing a phosphorus atom and / or (FB) phosphorus atom.
  • the (F0) compound contains a compound having a betaine structure, and the (I-f0) compound has a 1 to divalent aliphatic group having 4 to 30 carbon atoms, an alkylaryl group having 10 to 30 carbon atoms, and 6 to 6 carbon atoms.
  • a photosensitive resin composition having one or more groups selected from the group consisting of an oxyalkylene group to which 15 aryl groups are bonded.
  • the photosensitive resin composition according to the eighth aspect of the present invention is a photosensitive resin composition containing (A) an alkali-soluble resin and (C) a photosensitive agent, and (A) an alkali-soluble resin is (A3). ) One or more selected from the group consisting of a resin having a phenolic hydroxyl group, a (F1) phosphoric acid compound, a phosphonic acid compound, a phosphinic acid compound, and salts thereof, and / or (FB1) phosphorus.
  • a monovalent aliphatic group having (I-f1) 4 to 30 carbon atoms which comprises one or more selected from the group consisting of an acid betaine compound, a phosphonate betaine compound, and a phosphinic acid betaine compound.
  • An oxyalkylene group to which a monovalent aliphatic group is bonded an oxyalkylene group to which an alkylaryl group having 10 to 30 carbon atoms is bonded, and an oxyalkylene group having 4 to 15 carbon atoms to which an aryl group having 6 to 15 carbon atoms are bonded. It has one or more groups selected from the group consisting of, and the (FB1) compound has a (I-fb1) ammonium cation structure and has a 1 to 6 valent aliphatic group having 1 to 6 carbon atoms and is photosensitive. It is a resin composition.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin.
  • the composition is imparted with positive or negative photosensitive by the (C) photosensitive agent described later, and a positive or negative pattern is formed by developing with an alkaline developer.
  • a resin having possible solubility is preferred.
  • the photosensitive resin composition of the present invention is a group in which (A) an alkali-soluble resin does not further have (A1) an ethylenically unsaturated double bond group and consists of an imide structure, an amide structure, an oxazole structure, and a siloxane structure.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the resin does not have an ethylenically unsaturated double bond group at the main chain of the resin, the side chain of the resin, and the terminal of the resin, and has an imide structure, an amide structure, an oxazole structure, and an oxazole structure in the structural unit of the resin.
  • the (A1) resin has a phenolic hydroxyl group, it is included in the (A1) resin.
  • the polyimide, the polyimide precursor, the polybenzoxazole, the polybenzoxazole precursor, the polyamide-imide, and the polysiloxane have a phenolic hydroxyl group, they are included in the (A1) resin.
  • the polyimide, the polyimide precursor, the polybenzoxazole, the polybenzoxazole precursor, the polyamide-imide, and the polysiloxane have a radically polymerizable group, they are included in the resin (A2) described later.
  • the resin (A2) described later has a phenolic hydroxyl group, it is included in the resin (A3) described later.
  • a resin having a structural unit containing at least one selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure, having a radically polymerizable group, and further having a phenolic hydroxyl group will be described later.
  • the resin (A1) is (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, (A1-5) polyamideimide, And (A1-6), it is preferable to contain at least one selected from the group consisting of polysiloxane.
  • the (A1) resin is a (A1-1) polyimide, (A1-2) polyimide precursor.
  • the resin may be either a single resin or a copolymer thereof.
  • the (A2) resin is a resin having an ethylenically unsaturated double bond group at at least one of the main chain of the resin, the side chain of the resin, and the terminal of the resin, and is the resin (A1) and described later (A3). ) A resin different from the resin. (A2) By containing the resin, the effects of suppressing the residue after development and improving the halftone characteristics become remarkable. In addition, the effects of lowering the voltage drive of the light emitting characteristics and improving the reliability of the light emitting element become remarkable.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group, and is selected from the group consisting of a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. It is preferable that there is at least one type.
  • a photoreactive group a styryl group, a cinnamoyl group, a maleimide group, or a (meth) acryloyl group is preferable, and a (meth) acryloyl group is more preferable.
  • examples of the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms include a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group and a 2-methyl-2-butenyl group, 3 -Methyl-2-butenyl group, 2,3-dimethyl-2-butenyl group, ethynyl group, or 2-propargyl group is preferable, and vinyl group or allyl group is more preferable.
  • the resin (A2) includes (A2-a) unsaturated group-containing polyimide, (A2-b) unsaturated group-containing polyimide precursor, (A2-c) unsaturated group-containing polybenzoxazole, and (A2-d) unsaturated group.
  • the (A2) resin is composed of (A2-a) an unsaturated group-containing polyimide, (A2-b) an unsaturated group-containing polyimide precursor, and (A2-c). ) Unsaturated group-containing polybenzoxazole, (A2-d) unsaturated group-containing polybenzoxazole precursor, (A2-e) unsaturated group-containing polyamideimide, and (A2-f) unsaturated group-containing polysiloxane.
  • the (A2) resin is a group consisting of (A2-1) polycyclic side chain-containing resin, (A2-2) acid-modified epoxy resin, and (A2-3) acrylic resin. It is more preferable to contain one or more kinds selected from the above, and it is further preferable to contain (A2-1) polycyclic side chain-containing resin and / or (A2-2) acid-modified epoxy resin. Further, from the viewpoint of suppressing the residue after development, improving the halftone characteristics, and improving the reliability of the light emitting element, the (A2) resin contains (A2-a) an unsaturated group-containing polyimide and (A2-b) an unsaturated group-containing polyimide.
  • Polyimide precursor (A2-c) unsaturated group-containing polybenzoxazole, (A2-d) unsaturated group-containing polybenzoxazole precursor, (A2-e) unsaturated group-containing polyamideimide, and (A2-f). It contains one or more types selected from the group consisting of unsaturated group-containing polysiloxanes, and further contains (A2-1) polycyclic side chain-containing resin, (A2-2) acid-modified epoxy resin, and (A2-3) acrylic resin. It is also preferable to contain one or more kinds selected from the group consisting of. (A2) The resin may be either a single resin or a copolymer thereof.
  • the (A1) resin and the (A2) resin have an acidic group as an alkali-soluble group at the main chain of the resin, the side chain of the resin, or the terminal.
  • the resin (A1) and the resin (A2) preferably have a structural unit having an acidic group or a terminal structure having an acidic group.
  • the acidic group include a carboxy group, a carboxylic acid anhydride group, a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis (trifluoromethyl) methylol group, a sulfonic acid group, or a mercapto group.
  • a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, or 1,1-bis (trifluoro) is preferable.
  • Methyl) methylol groups are preferred, and phenolic hydroxyl groups or silanol groups are more preferred.
  • a carboxy group or a carboxylic acid anhydride group is preferable from the viewpoint of suppressing the residue after development.
  • the (A) alkali-soluble resin preferably contains (A1) resin and (A2) resin.
  • the resin (A1) and the resin (A2) By containing the resin (A1) and the resin (A2), the effects of suppressing the residue after development, suppressing the narrow mask bias after development, reducing the taper of the pattern shape, and improving the halftone characteristics become remarkable. In addition, the effects of lowering the voltage drive of the light emitting characteristics and improving the reliability of the light emitting element become remarkable.
  • the acid equivalent of the (A1) resin is preferably 200 g / mol or more, more preferably 250 g / mol or more, and even more preferably 300 g / mol or more.
  • the acid equivalent is preferably 600 g / mol or less, more preferably 500 g / mol or less, still more preferably 450 g / mol or less.
  • the acid equivalent of the resin (A2) is preferably 300 g / mol or more, more preferably 350 g / mol or more, still more preferably 400 g / mol or more.
  • the acid equivalent is preferably 700 g / mol or less, more preferably 600 g / mol or less, and even more preferably 550 g / mol or less.
  • Examples of the (A1-2) polyimide precursor which is the resin (A1) include a resin obtained by reacting a tetracarboxylic acid or a corresponding tetracarboxylic dianhydride with a diamine or a diisocyanate compound. Will be.
  • Examples of the (A1-2) polyimide precursor include polyamic acid, polyamic acid ester, polyamic acid amide, and polyisoimide.
  • Examples of the (A1-1) polyimide which is the (A1) resin include a resin obtained by dehydrating and ring-closing the above-mentioned (A1-2) polyimide precursor by heating or a reaction using a catalyst.
  • the polyimide is a structural unit represented by the general formula (1) from the viewpoints of suppressing residue after development, suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving halftone characteristics. Is preferably contained.
  • the content ratio of the structural unit represented by the general formula (1) in the total structural unit in the polyimide is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and 70 to 100 mol%. More preferred.
  • the polyimide precursor preferably has a structural unit represented by the general formula (3) from the viewpoint of suppressing residue after development, suppressing narrow mask bias after development, and improving halftone characteristics. .. (A1-2)
  • the content ratio of the structural unit represented by the general formula (3) in the total structural units in the polyimide precursor is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and 70 to 100 mol. % Is more preferable.
  • R 1 and R 9 each independently represent a 4- to 10-valent organic group.
  • R 2 and R 10 each independently represent a 2- to 10-valent organic group.
  • R 3 , R 4 and R 13 each independently represent a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the general formula (6) or the general formula (7).
  • R 11 represents a substituent represented by the general formula (6) or the general formula (7).
  • R 12 represents a phenolic hydroxyl group, a sulfonic acid group, or a mercapto group.
  • p represents an integer from 0 to 6.
  • q represents an integer from 0 to 8.
  • t represents an integer of 2 to 8
  • u represents an integer of 0 to 6
  • v represents an integer from 0 to 8.
  • R 3 or R 4 represents a phenolic hydroxyl group
  • R 1 or R 2 bonded to the phenolic hydroxyl group represents an aromatic structure
  • R 12 or R 13 represents a phenolic hydroxyl group
  • R 9 or R 10 bonded to the phenolic hydroxyl group represents an aromatic structure.
  • R 1 and R 9 independently have an aliphatic structure having 2 to 20 carbon atoms, an alicyclic structure having 4 to 20 carbon atoms, or 6 to 30 carbon atoms.
  • a 4- to 10-valent organic group having the aromatic structure of is preferable.
  • R 2 and R 10 are 2 to 10 valent having an aliphatic structure having 2 to 20 carbon atoms, an alicyclic structure having 4 to 20 carbon atoms, or an aromatic structure having 6 to 30 carbon atoms, respectively.
  • Organic groups are preferred.
  • q is preferably an integer of 1 to 8.
  • v is preferably an integer of 1 to 8.
  • R 1 and R 9 independently represent a tetracarboxylic acid residue or a tetracarboxylic acid derivative residue, respectively.
  • R 2 and R 10 independently represent a diamine residue or a diamine derivative residue, respectively.
  • the tetracarboxylic acid derivative include tetracarboxylic acid dianhydride, tetracarboxylic acid dichloride, and tetracarboxylic acid active diester.
  • the diamine derivative include a diisocyanate compound and a trimethylsilylated diamine.
  • the above-mentioned aliphatic structure, alicyclic structure, and aromatic structure may have a heteroatom and may be an unsubstituted or substituted product.
  • R 25 to R 27 are independently hydrogen atoms, alkyl groups having 1 to 10 carbon atoms, acyl groups having 2 to 6 carbon atoms, or 6 to 15 carbon atoms, respectively. Represents an aryl group of.
  • R 25 to R 27 are independently hydrogen atoms, alkyl groups having 1 to 6 carbon atoms, acyl groups having 2 to 4 carbon atoms, or 6 to 10 carbon atoms, respectively.
  • Aryl groups are preferred.
  • the above-mentioned alkyl group, acyl group, and aryl group may have a heteroatom and may be an unsubstituted or substituted product.
  • R 11 in the structural unit represented by the general formula (3) is a substituent represented by the general formula (6)
  • R 25 is a hydrogen atom.
  • the structural unit is called an amic acid structural unit.
  • R 11 in the structural unit represented by the general formula (3) is a substituent represented by the general formula (6)
  • R 25 is an alkyl group having 1 to 10 carbon atoms and 2 to 6 carbon atoms.
  • a structural unit that is an acyl group or an aryl group having 6 to 15 carbon atoms is called an amic acid ester structural unit.
  • the structural unit is referred to as an amic acid amide structural unit.
  • the amide acid structural unit, the amide acid ester structural unit, and the imide ring-closed structural unit in which a part of the amide acid amide structural unit is imide-closed may be included.
  • the total content ratio of the amide acid ester structural unit and the amide acid amide structural unit in the total content ratio of the amide acid structural unit, the amide acid ester structural unit, the amide acid amide structural unit, and the imide ring-closed structural unit is after development. From the viewpoint of suppressing the narrow mask bias and improving the halftone characteristics, 10 mol% or more is preferable, 30 mol% or more is more preferable, and 50 mol% or more is further preferable.
  • the total content ratio of the amic acid ester structural unit and the amid acid amide structural unit is preferably 100 mol% or less, more preferably 90 mol% or more, still more preferably 80 mol% or more, from the viewpoint of suppressing the residue after development.
  • (A1-4) polybenzoxazole precursor which is a resin (A1), for example, a resin obtained by reacting a dicarboxylic acid or a corresponding dicarboxylic acid active diester with a bisaminophenol compound or the like as a diamine can be used. Can be mentioned.
  • the (A1-4) polybenzoxazole precursor include polyhydroxyamides.
  • the (A1-3) polybenzoxazole which is the (A1) resin for example, a resin obtained by dehydrating and ring-closing the above-mentioned (A1-4) polybenzoxazole precursor by heating or a reaction using a catalyst can be obtained. Can be mentioned.
  • Polybenzoxazole may have a structural unit represented by the general formula (2) from the viewpoint of suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving halftone characteristics. preferable.
  • the content ratio of the structural unit represented by the general formula (2) in the total structural units in polybenzoxazole is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and 70 to 100 mol. % Is more preferable.
  • the polybenzoxazole precursor contains a structural unit represented by the general formula (4) from the viewpoint of suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving the halftone characteristics. It is preferable to do so.
  • the content ratio of the structural unit represented by the general formula (4) in the total structural units in the polybenzoxazole precursor is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and 70. It is more preferably ⁇ 100 mol%.
  • R 5 and R 14 each independently represent a divalent to 10-valent organic group.
  • R 6 and R 15 each independently represent a 4- to 10-valent organic group having an aromatic structure.
  • R 7 , R 8 and R 16 independently represent a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above-mentioned general formula (6) or general formula (7).
  • R 17 represents a phenolic hydroxyl group.
  • R 18 represents a sulfonic acid group, a mercapto group, or a substituent represented by the above-mentioned general formula (6) or general formula (7).
  • r represents an integer from 0 to 8.
  • s represents an integer from 0 to 6.
  • w represents an integer from 0 to 8.
  • x represents an integer of 2 to 8
  • y represents an integer of 0 to 6, and 2 ⁇ x + y ⁇ 8.
  • R 7 represents a phenolic hydroxyl group
  • R 5 bonded to the phenolic hydroxyl group
  • R 16 represents an aromatic structure.
  • R 5 and R 14 independently have an aliphatic structure having 2 to 20 carbon atoms, an alicyclic structure having 4 to 20 carbon atoms, or 6 to 30 carbon atoms.
  • a 2- to 10-valent organic group having the aromatic structure of is preferable.
  • R 6 and R 15 are preferably 4- to 10-valent organic groups having an aromatic structure having 6 to 30 carbon atoms independently.
  • s is preferably an integer of 1 to 6.
  • R 5 and R 14 independently represent a dicarboxylic acid residue or a dicarboxylic acid derivative residue, respectively.
  • R 6 and R 15 independently represent bis-aminophenol compound residues or bis-aminophenol compound derivative residues, respectively.
  • dicarboxylic acid derivative examples include dicarboxylic acid anhydride, dicarboxylic acid acidate, dicarboxylic acid active ester, and diformyl compound.
  • dicarboxylic acid anhydride examples include dicarboxylic acid anhydride, dicarboxylic acid acidate, dicarboxylic acid active ester, and diformyl compound.
  • the above-mentioned aliphatic structure, alicyclic structure, and aromatic structure may have a heteroatom and may be an unsubstituted or substituted product.
  • Examples of the (A1-5) polyamide-imide of the resin (A1) include a resin obtained by reacting a tricarboxylic acid or a corresponding tricarboxylic acid anhydride with a diamine or a diisocyanate compound. Examples thereof include a resin obtained by dehydrating and ring-closing the obtained resin by further heating or a reaction using a catalyst.
  • the polyamide-imide has a structure represented by the general formula (5) from the viewpoints of suppressing residue after development, suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving halftone characteristics. It is preferable to have a unit.
  • the content ratio of the structural unit represented by the general formula (5) in the total structural unit in the polyamide-imide is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and 70 to 100 mol%. Is even more preferable.
  • R 19 represents a 3 to 10 valent organic group.
  • R 20 represents a 2- to 10-valent organic group.
  • R 21 and R 22 independently represent a phenolic hydroxyl group, a sulfonic acid group, a mercapto group, or a substituent represented by the above-mentioned general formula (6) or general formula (7).
  • m represents an integer from 0 to 7.
  • n represents an integer from 0 to 8.
  • R 21 or R 22 represents a phenolic hydroxyl group
  • R 19 or R 20 bonded to the phenolic hydroxyl group represents an aromatic structure.
  • R 19 is a 3- to 10-valent organic having an aliphatic structure having 2 to 20 carbon atoms, an alicyclic structure having 4 to 20 carbon atoms, or an aromatic structure having 6 to 30 carbon atoms. Groups are preferred.
  • R 20 is preferably a 2- to 10-valent organic group having an aliphatic structure having 2 to 20 carbon atoms, an alicyclic structure having 4 to 20 carbon atoms, or an aromatic structure having 6 to 30 carbon atoms.
  • n is preferably an integer of 1 to 8.
  • R 19 represents a tricarboxylic acid residue or a tricarboxylic acid derivative residue.
  • R20 represents a diamine residue or a diamine derivative residue.
  • Examples of the tricarboxylic acid derivative include tricarboxylic acid anhydride, tricarboxylic acid anhydride, and tricarboxylic acid active ester.
  • Examples of the diamine derivative include a diisocyanate compound and a trimethylsilylated diamine.
  • the above-mentioned aliphatic structure, alicyclic structure, and aromatic structure may have a heteroatom and may be an unsubstituted or substituted product.
  • (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamideimide are sensitive to exposure. From the viewpoint of improvement, suppression of narrow mask bias after development, and improvement of halftone characteristics, it is preferable to have a structural unit having a fluorine atom.
  • the exposure referred to here is irradiation with active chemical rays (radiation), and examples thereof include irradiation with visible light, ultraviolet rays, electron beams, or X-rays.
  • exposure refers to irradiation with active chemical rays (radiation).
  • the respective resins of all structural units the structural unit derived from a carboxylic acid or the structural unit derived from a carboxylic acid derivative has a fluorine atom, and the structural unit derived from an amine or the structural unit derived from an amine derivative has a fluorine atom.
  • the total content ratio of the structural units having a fluorine atom in the total structural units of each resin is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, still more preferably 50 to 100 mol%.
  • the structural unit derived from the carboxylic acid or the structural unit derived from the carboxylic acid derivative has a fluorine atom among all the structural units of each resin
  • the structural unit derived from the total carboxylic acid and the structural unit derived from the carboxylic acid derivative are used.
  • the total content ratio of the structural units having a fluorine atom to the total of the derived structural units is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, still more preferably 50 to 100 mol%.
  • the structural unit derived from an amine or the structural unit derived from an amine derivative has a fluorine atom among all the structural units of each resin
  • the structural unit derived from all amines and the structural unit derived from all amine derivatives The total content ratio of the structural unit having a fluorine atom to the total of the above is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, still more preferably 50 to 100 mol%.
  • (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamideimide are the main chains of the resin.
  • These resins preferably contain a structural unit having an acidic group, such as a structural unit derived from a carboxylic acid having an acidic group or a structural unit derived from a diamine having an acidic group, or a terminal structure having an acidic group.
  • a resin obtained by reacting a part of the hydroxy groups of each resin with a polyfunctional carboxylic acid dianhydride is also preferable, and a catalyst is attached to the main chain, side chain or terminal of each resin.
  • a resin in which an acidic group is introduced by the reaction used is also preferable.
  • A2 Resin (A2-a) unsaturated group-containing polyimide, (A2-b) unsaturated group-containing polyimide precursor, (A2-c) unsaturated group-containing polybenzoxazole, (A2-d) unsaturated
  • the group-containing polybenzoxazole precursor and the (A2-e) unsaturated group-containing polyamideimide (hereinafter, "polyimide-based (A2) resin") have an ethylenically unsaturated double-bonding group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • Examples of these (A2) resins include (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, or (A1-5).
  • polyamide-imide a resin obtained by reacting a part of the acidic groups of each resin with a compound having an ethylenically unsaturated double bond group is preferable. Further, a resin in which an ethylenically unsaturated double bond group is introduced into a side chain or a terminal of each resin by a reaction using a catalyst is also preferable.
  • an electrophilic compound having an ethylenically unsaturated double bond group is preferable.
  • an isocyanate compound, an epoxy compound, an alcohol compound, an aldehyde compound, a ketone compound, or a carboxylic acid anhydride is preferable, and an isocyanate compound or an epoxy compound is more preferable, from the viewpoint of reactivity and availability of the compound. ..
  • the double bond equivalent of the polyimide-based (A2) resin described above is preferably 500 g / mol or more, more preferably 700 g / mol or more, still more preferably 1,000 g / mol or more.
  • the double bond equivalent is preferably 3,000 g / mol or less, more preferably 2,000 g / mol or less, and even more preferably 1,500 g / mol or less.
  • the structural units of (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamideimide are From the viewpoint of improving the reliability of the light emitting element, a structural unit having an aromatic group such as a structural unit derived from an aromatic carboxylic acid or a structural unit derived from an aromatic diamine is also preferable.
  • a structural unit having a silyl group or a siloxane bond such as a structural unit derived from silicone diamine, or a structural unit having an oxyalkylene skeleton such as a structural unit derived from oxyalkylene diamine is also available.
  • a structural unit having a silyl group or a siloxane bond such as a structural unit derived from silicone diamine, or a structural unit having an oxyalkylene skeleton such as a structural unit derived from oxyalkylene diamine is also available.
  • the end of the resin has a structure sealed with a terminal sealant such as monoamine or dicarboxylic acid anhydride.
  • the weight average molecular weight (hereinafter, “Mw”) of each resin is 1,000 in terms of polystyrene measured by gel permeation chromatography (hereinafter, “GPC”) from the viewpoint of improving the reliability of the light emitting device.
  • Mw is 1,000 in terms of polystyrene measured by gel permeation chromatography (hereinafter, “GPC”) from the viewpoint of improving the reliability of the light emitting device.
  • GPC gel permeation chromatography
  • Mw is preferably 100,000 or less, more preferably 50,000 or less, further preferably 30,000 or less, and particularly preferably 20,000 or less, from the viewpoint of reducing the taper of the pattern shape.
  • Each resin can be synthesized by a known method.
  • Tetracarboxylic acids, tricarboxylic acids, dicarboxylic acids and their derivatives, as well as diamines, bisaminophenol compounds and their derivatives, used in the synthesis of the respective resins include, for example, International Publication No. 2017/052781 or International. Examples include the compounds described in Publication No. 2017/159876.
  • (A1-6) Polysiloxane which is the resin (A1), for example, one or more kinds selected from the group consisting of trifunctional organosilane, tetrafunctional organosilane, bifunctional organosilane, and monofunctional organosilane are hydrolyzed. Then, the resin obtained by dehydration condensation is mentioned.
  • the polysiloxane (A1-6) is a trifunctional organosilane unit represented by the general formula (8) and / or the general formula (9) from the viewpoint of reducing the taper of the pattern shape and improving the halftone characteristics. It is preferable to have a tetrafunctional organosilane unit represented by.
  • R 29 represents a hydrogen atom or an organic group. * 1 to * 3 independently represent the bonding points in the resin.
  • R 29 has a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, and 1 to 1 carbon atoms.
  • a halogenated alkyl group of 10, a halogenated cycloalkyl group having 4 to 10 carbon atoms, or an aryl halide group having 6 to 15 carbon atoms is preferable.
  • alkyl group, cycloalkyl group, aryl group, alkyl halide group, cycloalkyl halide group, and aryl halide group may have a hetero atom and may be an unsubstituted or substituted product. It doesn't matter.
  • the content ratio of the trifunctional organosilane unit represented by the general formula (8) in the (A1-6) polysiloxane is preferably 50 to 100 mol% in terms of the Si atom mol ratio from the viewpoint of improving the reliability of the light emitting device. , 60 to 100 mol% is more preferable, and 70 to 100 mol% is further preferable.
  • the trifunctional organosilane unit an organosilane unit having an epoxy group is preferable from the viewpoint of suppressing residue after development.
  • the content ratio of the tetrafunctional organosilane unit represented by the general formula (9) in the polysiloxane is the Si atom mol ratio from the viewpoint of improving the sensitivity during exposure and suppressing the residue after development. 1 mol% or more is preferable, 5 mol% or more is more preferable, and 10 mol% or more is further preferable.
  • the content ratio of the tetrafunctional organosilane unit represented by the general formula (9) is preferably 40 mol% or less, more preferably 30 mol% or less, and 20 mol in terms of Si atom mol ratio from the viewpoint of reducing the taper of the pattern shape. % Or less is more preferable.
  • (A1-6) Polysiloxane has an acidic group as an alkali-soluble group in the main chain of the resin, the side chain of the resin, or the terminal.
  • the (A1-6) polysiloxane is preferably a resin containing an organosilane unit having an acidic group.
  • a resin obtained by reacting a part of the hydroxy groups of the resin with a polyfunctional carboxylic acid dianhydride is also preferable, and a reaction using a catalyst on the main chain, the side chain or the end of the resin is preferable.
  • a resin having an acidic group introduced is also preferable.
  • the (A2-f) unsaturated group-containing polysiloxane which is a resin (A2), has an ethylenically unsaturated double bond group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the (A2-f) unsaturated group-containing polysiloxane is preferably a resin containing an organosilane unit having an ethylenically unsaturated double bond group.
  • a resin obtained by reacting a part of the acidic group of the resin with a compound having an ethylenically unsaturated double bond group is also preferable, and the side chain or the terminal of the resin is ethylenically obtained by a reaction using a catalyst.
  • a resin having an unsaturated double bond introduced is also preferable.
  • the double bond equivalent of the (A2-f) unsaturated group-containing polysiloxane is preferably 500 g / mol or more, more preferably 700 g / mol or more, still more preferably 1,000 g / mol or more.
  • the double bond equivalent is preferably 3,000 g / mol or less, more preferably 2,000 g / mol or less, and even more preferably 1,500 g / mol or less.
  • each organosilane unit may be either a regular sequence or an irregular sequence. Regular sequences include, for example, alternating copolymerization, periodic copolymerization, block copolymerization, graft copolymerization, and the like. Examples of the irregular arrangement include random copolymerization.
  • each organosilane unit may be either a two-dimensional array or a three-dimensional array.
  • the two-dimensional array include a linear array.
  • the three-dimensional arrangement include a ladder shape, a basket shape, a mesh shape, and the like.
  • the Mw of the (A1-6) polysiloxane is preferably 500 or more, more preferably 1,000 or more in terms of polystyrene measured by GPC, from the viewpoint of improving the reliability of the light emitting device. On the other hand, the Mw is preferably 50,000 or less, more preferably 10,000 or less, from the viewpoint of suppressing the residue after development and reducing the taper of the pattern shape.
  • (A2-1) Polysiloxane can be synthesized by a known method. Examples of the organosilane include the compounds described in International Publication No. 2017/052781 or International Publication No. 2017/159876.
  • Examples of the (A2-1) polycyclic side chain-containing resin which is the (A2) resin include the resins obtained in the following (1-a2-1) to (6-a2-1). If necessary, the polyfunctional alcohol compound may be further reacted at any of the reaction steps.
  • (2-a2-1) A resin obtained by reacting a compound obtained by reacting a polyfunctional phenol compound with an epoxy compound with a polyfunctional carboxylic acid dianhydride.
  • (3-a2-1) A resin obtained by reacting an epoxy compound with a compound obtained by reacting a cyclic skeleton-containing polyfunctional alcohol compound with a polyfunctional carboxylic acid dianhydride.
  • (4-a2-1) A resin obtained by reacting a compound obtained by reacting a cyclic skeleton-containing polyfunctional alcohol compound with an epoxy compound with a polyfunctional carboxylic acid dianhydride.
  • (5-a2-1) A resin obtained by reacting a compound obtained by reacting a polyfunctional epoxy compound with a polyfunctional carboxylic acid compound with an epoxy compound.
  • (6-a2-1) A resin obtained by reacting a compound obtained by reacting a polyfunctional epoxy compound with a carboxylic acid compound with a polyfunctional carboxylic acid dianhydride.
  • the polycyclic side chain-containing resin has a structure in which a main chain and a bulky side chain having a cyclic skeleton are connected by one atom. Further, from the viewpoint of suppressing the residue after development, it is preferable to contain a resin having a structural unit represented by the general formula (41).
  • X 41 and X 42 each independently represent a direct bond, a substituent represented by the general formula (42) or the general formula (43).
  • Y 41 represents a 3- to tetravalent organic group which is a carboxylic acid residue or a carboxylic acid derivative residue.
  • W 1 represents an organic group having at least two aromatic groups.
  • R 101 and R 102 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
  • R 103 and R 104 independently represent a hydrogen atom and an alkyl group having 1 to 10 carbon atoms, respectively.
  • it represents an organic group having an ethylenically unsaturated double bond group.
  • a and b each independently represent an integer of 0 to 10.
  • R 105 and R 106 independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an organic group having an ethylenically unsaturated double bond group, respectively. .. * 1 and * 2 independently represent the bond point with W1 or the bond point with a carbon atom in the general formula (41). * 3 and * 4 independently represent the bond point with the oxygen atom in the general formula (41).
  • Y 41 is a 3- to 4-valent organic having an aliphatic structure having 2 to 20 carbon atoms, an alicyclic structure having 4 to 20 carbon atoms, or an aromatic structure having 6 to 30 carbon atoms. Groups are preferred.
  • W1 is preferably a substituent represented by any of the general formulas (44) to (49).
  • R 103 and R 104 are preferably organic groups each independently having a hydrogen atom or an ethylenically unsaturated double bond group.
  • the organic group having an ethylenically unsaturated double bond group in R 103 to R 106 is preferably a (meth) acryloyl group or a substituent represented by the general formula (50). ..
  • the above-mentioned alkyl group, aliphatic structure, alicyclic structure, and aromatic structure may have a heteroatom and may be an unsubstituted or substituted product.
  • X 43 to X 52 each independently represent a monocyclic or condensed polycyclic hydrocarbon ring.
  • Y 43 and Y 53 independently represent a direct bond, a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom.
  • R 107 to R 117 each independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R 118 to R 124 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • a, b, c, and d each independently represent an integer of 0 to 4.
  • e and f each independently represent an integer of 0 to 5.
  • g, h, and i each independently represent an integer of 0 to 4.
  • j and k each independently represent an integer of 0 to 3.
  • * 1 to * 6 each independently represent a bond point with X 41 or a bond point with an oxygen atom in the above-mentioned general formula (47).
  • * 7 to * 12 each independently represent a bond point with X 42 or a bond point with an oxygen atom in the above-mentioned general formula (47).
  • X 43 to X 52 are preferably monocyclic or condensed polycyclic hydrocarbon rings having 6 to 15 carbon atoms independently.
  • Y 43 and Y 53 are each independently preferably directly bonded or oxygen atom.
  • the above-mentioned alkyl group, cycloalkyl group, aryl group, and monocyclic or condensed polycyclic aromatic hydrocarbon ring may have a heteroatom and may be an unsubstituted or substituted product. I do not care.
  • X 54 represents a direct bond, an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms.
  • R 125 represents a vinyl group, an allyl group, a crotonyl group, a styryl group, a cinnamoyle group, a maleimide group, or a (meth) acryloyl group.
  • R 126 represents a carboxylic acid derivative residue having a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a carboxy group.
  • the above-mentioned alkylene group, cycloalkylene group, and arylene group may have a heteroatom and may be an unsubstituted or substituted form.
  • the polycyclic side chain-containing resin contains a structural unit having a condensed polycyclic structure or a condensed polycyclic heterocyclic structure from the viewpoint of suppressing residue after development and improving the reliability of the light emitting element. It is preferable to do so.
  • a fluorene skeleton, a xanthene skeleton, or an isoindolinone skeleton is preferable.
  • W 1 when W 1 is the general formula (44) or (49) and Y 43 is a direct bond or an oxygen atom, it contains a structural unit having a fluorene skeleton and / or a xanthene skeleton. .. Further, in the above-mentioned general formula (41), when W 1 is the general formula (48), it contains a structural unit having an isoindolinone skeleton.
  • the polycyclic side chain-containing resin has an acidic group as an alkali-soluble group at the main chain of the resin, the side chain of the resin, or the terminal.
  • the (A2-1) polycyclic side chain-containing resin preferably contains a structural unit derived from a polyfunctional carboxylic acid compound, a structural unit derived from a polyfunctional carboxylic acid dianhydride, or a terminal structure having an acidic group. ..
  • a resin obtained by reacting a part of the hydroxy groups of the resin with a polyfunctional carboxylic acid dianhydride is also preferable, and a reaction using a catalyst on the main chain, the side chain or the end of the resin is preferable.
  • a resin having an acidic group introduced is also preferable.
  • the (A2-1) polycyclic side chain-containing resin which is the (A2) resin, has an ethylenically unsaturated double bond group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the polycyclic side chain-containing resin is a structural unit derived from an epoxy compound having an ethylenically unsaturated double bond group or a structural unit derived from a carboxylic acid compound having an ethylenically unsaturated double bond group. Alternatively, it preferably contains a terminal structure having an ethylenically unsaturated double bond group.
  • a resin obtained by reacting a part of the acidic group of the resin with a compound having an ethylenically unsaturated double bond group is also preferable, and the side chain or the terminal of the resin is ethylenically obtained by a reaction using a catalyst.
  • a resin having an unsaturated double bond introduced is also preferable.
  • the double bond equivalent of the (A2-1) polycyclic side chain-containing resin is preferably 300 g / mol or more, more preferably 400 g / mol or more, still more preferably 500 g / mol or more.
  • the double bond equivalent is preferably 1,500 g / mol or less, more preferably 1,000 g / mol or less, and even more preferably 700 g / mol or less.
  • the structural unit of the (A2-1) polycyclic side chain-containing resin is a structural unit derived from an aromatic polyfunctional carboxylic acid compound or an aromatic polyfunctional carboxylic acid dianhydride from the viewpoint of improving the reliability of the light emitting element.
  • Structural units having an aromatic group, such as structural units derived from, are also preferred.
  • the end of the resin has a structure sealed with a terminal encapsulant such as monocarboxylic acid, dicarboxylic acid anhydride, or tricarboxylic acid anhydride.
  • the Mw of the (A2-1) polycyclic side chain-containing resin is preferably 500 or more, more preferably 1,000 or more in terms of polystyrene measured by GPC, from the viewpoint of improving the reliability of the light emitting device. On the other hand, the Mw is preferably 50,000 or less, more preferably 10,000 or less, from the viewpoint of suppressing the residue after development and reducing the taper of the pattern shape.
  • the polycyclic side chain-containing resin can be synthesized by a known method. Examples of the phenol compound, alcohol compound, epoxy compound, carboxylic acid anhydride, and carboxylic acid compound include the compounds described in International Publication No. 2017/052781 or International Publication No. 2017/159876.
  • polycyclic side chain-containing resin examples include "ADEKA ARKLS” (registered trademark) WR-101 or WR-301 (all manufactured by ADEKA), or OGSOL (registered trademark) CR-. 1030 (manufactured by Osaka Gas Chemical Co., Ltd.) can be mentioned.
  • Examples of the (A2-2) acid-modified epoxy resin which is the (A2) resin include the resins obtained in the following (1-a2-2) to (2-a2-2). If necessary, the polyfunctional alcohol compound may be further reacted at any of the reaction steps.
  • the acid-modified epoxy resin has a cyclic skeleton in the main chain. Further, from the viewpoint of suppressing residue after development, it is preferable to contain at least one selected from the group consisting of resins having structural units represented by any of the general formulas (61) to (63).
  • X 61 and X 62 each independently represent an aliphatic structure having 1 to 6 carbon atoms.
  • X 63 represents an alkylene group having 1 to 6 carbon atoms.
  • W 2 represents an organic group having at least one aromatic group.
  • R 141 and R 142 independently represent a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R143 represents a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R 144 to R 146 are independently represented by a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or the general formula (69). Represents the represented substituent.
  • R147 represents a hydrogen atom or a substituent represented by the general formula (70).
  • R 148 and R 149 each independently represent an organic group having an ethylenically unsaturated double bond group.
  • a and b each independently represent an integer of 0 to 10.
  • c represents an integer from 0 to 14.
  • d represents an integer of 0 to 3.
  • e and f each independently represent an integer of 0 to 4.
  • the substituent represented by any of the general formulas (64) to (68) is preferable for W 2 from the viewpoint of suppressing the residue after development and improving the reliability of the light emitting device.
  • the organic group having an ethylenically unsaturated double bond group in R 148 and R 149 is a (meth) acryloyl group, or the general formula (72) or the general formula (73).
  • the represented substituent is preferred.
  • the above-mentioned aliphatic structure, alkylene group, alkyl group, cycloalkyl group, and aryl group may have a heteroatom and may be an unsubstituted or substituted product.
  • X64 represents an aliphatic structure having 1 to 6 carbon atoms.
  • X 65 and X 66 each independently represent a monocyclic or condensed polycyclic hydrocarbon ring.
  • Y 65 represents a direct bond, a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom.
  • R 150 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R 151 to R 159 are independently represented by a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or the general formula (69). Represents the represented substituent.
  • R 160 to R 162 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R 163 to R 169 each independently represent an organic group having an ethylenically unsaturated double bond group. a represents an integer from 0 to 10.
  • b represents an integer of 0 to 3.
  • c represents an integer from 0 to 5.
  • d represents an integer of 0 to 3.
  • e, f, g, and h each independently represent an integer of 0 to 4.
  • i and j each independently represent an integer of 0 to 3. If Y 65 is a direct bond, an oxygen atom, or a sulfur atom, k is 0. When Y 65 is a nitrogen atom, k is 1. When Y 65 is a carbon atom, k is 2.
  • * 1 to * 5 each independently represent a connection point with X 61 in the above-mentioned general formula (61).
  • * 6 to * 10 independently represent the coupling points in the above-mentioned general formula (61).
  • X 65 and X 66 are preferably monocyclic or condensed polycyclic hydrocarbon rings having 6 to 15 carbon atoms independently.
  • Y 65 is preferably a direct bond or an oxygen atom.
  • the organic group having an ethylenically unsaturated double bond group in R 163 to R 169 is preferably a (meth) acryloyl group or a substituent represented by the general formula (72) or the general formula (73).
  • the above-mentioned aliphatic structure, alkyl group, cycloalkyl group, aryl group, and monocyclic or condensed polycyclic aromatic hydrocarbon ring may have a heteroatom, and may have a heteroatom, either an unsubstituted or a substituted compound. It doesn't matter.
  • R 170 and R 172 independently represent the substituents represented by the general formula (72) or the general formula (73), respectively.
  • R 171 is represented by a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a general formula (69) or a general formula (71). Represents a substituent.
  • a represents an integer from 0 to 4.
  • R 173 and R 174 each independently represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms.
  • R 175 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (69).
  • b represents an integer from 0 to 5.
  • X 67 and X 68 are independently bonded, directly bonded, an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or 6 to 6 carbon atoms, respectively. Represents 15 allylene groups.
  • R 176 and R 177 independently represent a vinyl group, an allyl group, a crotonyl group, a styryl group, a cinnamoyl group, a maleimide group, or a (meth) acryloyl group.
  • R 178 and R 179 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (74).
  • X69 has an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, a cycloalkenylene group having 4 to 10 carbon atoms, or a cycloalkenylene group having 4 to 10 carbon atoms. Represents an arylene group having 6 to 15 carbon atoms.
  • X 69 is preferably a carboxylic acid anhydride residue.
  • alkyl group, cycloalkyl group, aryl group, alkylene group, alkenylene group, cycloalkylene group, cycloalkenylene group, and arylene group may have a hetero atom and may be an unsubstituted or substituted product. It doesn't matter.
  • the (A2-2) acid-modified epoxy resin includes a fused polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic ring skeleton, and an alicyclic structure from the viewpoint of suppressing residues after development and improving the reliability of the light emitting element. It preferably contains a structural unit having a structure in which the skeletons are directly linked, or a structure in which at least two aromatic ring skeletons are directly linked.
  • a fused polycyclic structure or the condensed polycyclic heterocyclic structure a naphthalene skeleton, a fluorene skeleton, or a xanthene skeleton is preferable.
  • a tricyclo [5.2.1.0 2,6 ] decane skeleton is preferable.
  • the biphenyl skeleton is preferred as the structure in which at least two aromatic ring skeletons are directly linked.
  • W 2 is the general formula (65), (66), or (67) and Y 65 is a direct bond or an oxygen atom, a naphthalene skeleton, a biphenyl skeleton, and a fluorene skeleton
  • it contains a structural unit having a xanthene skeleton.
  • the above-mentioned general formula (62) contains a structural unit having a structure in which an aromatic ring and a tricyclo [5.2.1.0 2,6 ] decane skeleton are directly linked.
  • the acid-modified epoxy resin has an acidic group as an alkali-soluble group at the main chain, side chain or terminal of the resin.
  • the (A2-2) acid-modified epoxy resin preferably contains a structural unit derived from a polyfunctional carboxylic acid compound, a structural unit derived from a polyfunctional carboxylic acid dianhydride, or a terminal structure having an acidic group.
  • a resin obtained by reacting a part of the hydroxy groups of the resin with a polyfunctional carboxylic acid dianhydride is also preferable, and a reaction using a catalyst on the main chain, the side chain or the end of the resin is preferable.
  • a resin having an acidic group introduced is also preferable.
  • the (A2-2) acid-modified epoxy resin which is the (A2) resin, has an ethylenically unsaturated double bond group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the acid-modified epoxy resin is a structural unit derived from an epoxy compound having an ethylenically unsaturated double bond group, a structural unit derived from a carboxylic acid compound having an ethylenically unsaturated double bond group, or ethylene. It preferably contains a terminal structure having a sex-unsaturated double bond group.
  • a resin obtained by reacting a part of the acidic group of the resin with a compound having an ethylenically unsaturated double bond group is also preferable, and the side chain or the terminal of the resin is ethylenically obtained by a reaction using a catalyst.
  • a resin having an unsaturated double bond introduced is also preferable.
  • the double bond equivalent of the (A2-2) acid-modified epoxy resin is preferably 300 g / mol or more, more preferably 400 g / mol or more, still more preferably 500 g / mol or more.
  • the double bond equivalent is preferably 1,500 g / mol or less, more preferably 1,000 g / mol or less, and even more preferably 700 g / mol or less.
  • the structural unit of the acid-modified epoxy resin is derived from a structural unit derived from an aromatic polyfunctional carboxylic acid compound or an aromatic polyfunctional carboxylic acid dianhydride from the viewpoint of improving the reliability of the light emitting element. Structural units having aromatic groups such as structural units to be used are also preferable. It is also preferable that the end of the resin has a structure sealed with a terminal encapsulant such as monocarboxylic acid, dicarboxylic acid anhydride, or tricarboxylic acid anhydride.
  • the Mw of the (A2-2) acid-modified epoxy resin is preferably 500 or more, more preferably 1,000 or more in terms of polystyrene measured by GPC, from the viewpoint of improving the reliability of the light emitting device. On the other hand, the Mw is preferably 50,000 or less, more preferably 20,000 or less, from the viewpoint of suppressing the residue after development and reducing the taper of the pattern shape.
  • the acid-modified epoxy resin can be synthesized by a known method. Examples of the epoxy compound, the carboxylic acid anhydride, and the carboxylic acid compound include the compounds described in International Publication No. 2017/052781 or International Publication No. 2017/159876.
  • Examples of the (A2-2) acid-modified epoxy resin include "KAYARAD” (registered trademark) PCR-1222H, CCR-1171H, TCR-1348H, ZAR-1494H, ZFR-1401H, and ZCR-1798H. Examples thereof include the same ZXR-1807H, the same ZCR-6002H, and the same ZCR-8001H (all of which are manufactured by Nippon Kayaku Co., Ltd.).
  • (A2-3) Acrylic resin which is the (A2) resin, for example, one kind selected from the group consisting of a (meth) acrylic acid derivative, a (meth) acrylic acid ester derivative, a styrene derivative, and other copolymerization components. Examples thereof include a resin obtained by radically copolymerizing the above.
  • (A2-3) As the acrylic resin from the viewpoint of suppressing residue after development, a resin having a structural unit represented by the general formula (81) and / or a resin having a structural unit represented by the general formula (82). Is preferably contained.
  • X 81 represents a direct bond or an alkylene group having 1 to 10 carbon atoms.
  • X 82 represents a direct bond, an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms.
  • R 201 to R 206 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
  • R 207 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkyl halide group having 1 to 10 carbon atoms, and 4 to 10 carbon atoms. It represents 10 cycloalkyl halide groups or aryl halide groups having 6 to 15 carbon atoms.
  • R 208 represents a vinyl group, an allyl group, a crotonyl group, a styryl group, a cinnamoyle group, a maleimide group, or a (meth) acryloyl group.
  • R209 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (83).
  • X83 is an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, a cycloalkenylene group having 4 to 10 carbon atoms, or a cycloalkenylene group having 4 to 10 carbon atoms.
  • X 83 is preferably a carboxylic acid anhydride residue.
  • X 81 is a direct bond and R 207 is a hydrogen atom.
  • R 207 is a hydrogen atom.
  • the above-mentioned alkyl group, cycloalkyl group, aryl group, alkyl halide group, cycloalkyl halide group, aryl halide group, alkylene group, alkenylene group, cycloalkylene group, cycloalkenylene group, and arylene group contain heteroatoms. It may have, and may be either a non-substituted product or a substituted product.
  • Acrylic resin has an acidic group as an alkali-soluble group in the main chain of the resin, the side chain of the resin, or the terminal.
  • the (A2-3) acrylic resin preferably contains a structural unit derived from a (meth) acrylic acid derivative or a terminal structure having an acidic group.
  • a resin obtained by reacting a part of the hydroxy groups of the resin with a polyfunctional carboxylic acid dianhydride is also preferable, and a reaction using a catalyst on the main chain, the side chain or the end of the resin is preferable.
  • a resin having an acidic group introduced is also preferable.
  • the (A2) resin (A2-3) acrylic resin has an ethylenically unsaturated double bond group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the (A2-3) acrylic resin is preferably a resin obtained by reacting a part of the acidic group of the resin with an epoxy compound having an ethylenically unsaturated double bond group or the like. Further, a resin obtained by reacting an epoxy group or the like of a resin with a carboxylic acid compound having an ethylenically unsaturated double bond group is also preferable.
  • the double bond equivalent of the (A2-3) acrylic resin is preferably 500 g / mol or more, more preferably 700 g / mol or more, still more preferably 1,000 g / mol or more.
  • the double bond equivalent is preferably 4,000 g / mol or less, more preferably 3,000 g / mol or less, further preferably 2,000 g / mol or less, and particularly preferably 1,500 g / mol or less.
  • an aromatic such as a structural unit derived from an aromatic (meth) acrylic acid ester derivative or a structural unit derived from a styrene derivative.
  • Structural units with groups are also preferred.
  • a structural unit having an alicyclic group such as a structural unit derived from an alicyclic (meth) acrylic acid ester derivative is also preferable.
  • the Mw of the acrylic resin from the viewpoint of improving the reliability of the light emitting element, 1,000 or more is preferable, and 3,000 or more is more preferable in terms of polystyrene measured by GPC.
  • the Mw is preferably 50,000 or less, more preferably 20,000 or less, from the viewpoint of suppressing the residue after development and reducing the taper of the pattern shape.
  • (A2-3) Acrylic resin can be synthesized by a known method. Examples of the (meth) acrylic acid derivative, the (meth) acrylic acid ester derivative, the styrene derivative, and other copolymerization components include the compounds described in International Publication No. 2017/052781 or International Publication No. 2017/159876. Be done.
  • the (A) alkali-soluble resin has (A3) a phenolic hydroxyl group.
  • the (A3) resin is a resin having a phenolic hydroxyl group at least one of the main chain of the resin, the side chain of the resin, and the end of the resin, and is different from the resin (A1) and the resin (A2). say.
  • the (A) alkali-soluble resin is (A3-1) phenol resin, (A3-2) polyhydroxystyrene, (A3-3) phenol-based modified epoxy resin, and (A3-). 4) It is preferable to contain one or more kinds (hereinafter, "(A3p) resin") selected from the group consisting of phenol group-modified acrylic resins.
  • the (A3p) resin may be either a single resin or a copolymer thereof.
  • the (A3) resin contains the (A3p) resin in the photosensitive resin composition of the present invention.
  • the effects of suppressing the residue after development, suppressing the narrow mask bias after development, reducing the taper of the pattern shape, and improving the halftone characteristics become remarkable.
  • the photosensitive resin composition according to the first aspect of the present invention has a structure in which (A) an alkali-soluble resin contains (A3) a resin, and the (A3) resin contains at least two (A3x) phenolic hydroxyl groups. It contains a resin having a unit (hereinafter, "(A3x) resin").
  • the photosensitive resin composition according to the second aspect of the present invention has a structure in which (A) an alkali-soluble resin contains (A3) a resin, and the (A3) resin contains at least two (A3x) phenolic hydroxyl groups.
  • a resin having a unit hereinafter, "(A3x) resin"
  • a resin having a structural unit containing a (A3y) phenolic hydroxyl group, and an aromatic group hereinafter, "(A3y) resin”
  • (A3z) resin contains one or more selected from the group consisting of a structural unit containing a sex hydroxyl group and a resin having a structural unit containing a second aromatic group (hereinafter, “(A3z) resin”).
  • an alkali-soluble resin contains (A3) resin, the (A3) resin contains (A3x) resin, and further (A3y). It is also preferable to contain a resin and / or a (A3z) resin.
  • an alkali-soluble resin contains (A3) resin, the (A3) resin contains (A3x) resin, and further (A3y). It preferably contains a resin and / or a (A3z) resin.
  • (A) an alkali-soluble resin contains (A3) resin, and the (A3) resin is (A3). It is preferable to contain at least one selected from the group consisting of A3x) resin, (A3y) resin, and (A3z) resin.
  • an alkali-soluble resin contains (A3) resin, and the (A3) resin is (A3). It is also preferable to contain an A3x) resin and further contain a (A3y) resin and / or a (A3z) resin.
  • the (A3x) resin, the (A3y) resin, and the (A3z) resin are (A3p) resins.
  • the photosensitive resin composition according to the fifth aspect of the present invention contains (A) an alkali-soluble resin and (C) a photosensitive agent, and the (C) photosensitive agent contains (C1) a photopolymerization initiator.
  • an alkali-soluble resin contains (A3) resin
  • the (A3) resin is (A3-1) phenol resin, (A3-2) polyhydroxystyrene, (A3-). 3) Containing one or more kinds selected from the group consisting of a phenol-based modified epoxy resin and (A3-4) a phenol-based modified acrylic resin.
  • A3-1) Phenolic resin (1) A resin having a structural unit containing at least two groups having a phenolic hydroxyl group.
  • a resin having a structural unit containing at least three groups having a phenolic hydroxyl group connected by one atom has a structural unit containing both a structure containing at least three groups having a phenolic hydroxyl group connected by one atom and a structure having 3 to 12 carbon atoms connecting the groups having a phenolic hydroxyl group.
  • resin (4) A resin having a structural unit including a structure in which at least two aromatic ring skeletons are directly connected, and a resin.
  • One or more kinds selected from the group consisting of a resin having a structural unit containing a group having at least two phenolic hydroxyl groups hereinafter, "specific (A3-1) phenols of (1) to (5)".
  • a resin having a structural unit having an alkoxyalkyl group and / or (7) A resin having a structural unit having a hydroxyalkyl group (hereinafter, "specific (A3-2) polyhydroxystyrene of (6) to (7)") is contained.
  • A3-3) The phenol group-modified epoxy resin contains a resin having a phenolic hydroxyl group
  • A3-4) The phenolic modified acrylic resin is a photosensitive resin composition containing a resin having a phenolic hydroxyl group.
  • an alkali-soluble resin is a (A3-1) phenol resin, (A3-). 2) Containing at least one selected from the group consisting of polyhydroxystyrene, (A3-3) phenol-based modified epoxy resin, and (A3-4) phenol-based modified acrylic resin, the (A3-1) phenol resin contains. It contains the specific (A3-1) phenolic resin of (1)-(5), and the (A3-2) polyhydroxystyrene contains the specific (A3-2) polyhydroxystyrene of (6)-(7). It is preferable that the (A3-3) phenolic modified epoxy resin contains a resin having a phenolic hydroxyl group, and the (A3-4) phenolic modified acrylic resin contains a resin having a phenolic hydroxyl group.
  • a narrow mask bias is likely to occur when the alkali solubility of the exposed portion is not sufficiently improved.
  • the exposed portion is narrowed by suppressing the residue by the alkali dissolution promoting action of the phenolic hydroxyl group and improving the alkali solubility even with the diffracted light during pattern exposure. It is considered that the mask bias is suppressed.
  • the unexposed area also has moderate solubility, so that the pattern shape is reduced during development, and the mild acidity of the phenolic hydroxyl group causes the halftone exposed area to gradually reduce the developing film, resulting in halftone processing.
  • the pattern shape can be reduced in taper at the time of heat curing by controlling the excessive photocuring in the exposed portion by the phenolic hydroxyl group, and the gradient of the degree of photocuring with respect to the exposure amount can be made gentle.
  • the mild acidity of the phenolic hydroxyl group causes the halftone exposed portion to gradually reduce the developing film, thereby improving the halftone processability.
  • the photosensitive resin composition of the first aspect of the present invention (A) an alkali-soluble resin contains (A3) resin, and the (A3) resin contains (A3x) resin.
  • the photosensitive resin composition comprises (A3x) resin, (A3y) resin, and (A3z). It is preferable to contain one or more kinds selected from the group consisting of resins, more preferably to contain (A3x) resin and / or (A3y) resin, and further preferably to contain (A3x) resin.
  • the density of the phenolic hydroxyl group in the structural unit of the resin is improved by the structural unit containing at least two phenolic hydroxyl groups of the (A3x) resin. That is, the action of the phenolic hydroxyl group in the film is remarkably promoted by the high-density phenolic hydroxyl group, and the action of the phenolic hydroxyl group becomes dominant, so that the action on the dissolution promotion or photocuring during pattern exposure, and / Alternatively, it is presumed that the solubility at the time of development can be appropriately controlled, and various characteristics can be combined at a high level.
  • the structural unit containing an aromatic group or the structural unit containing a second aromatic group of the (A3y) resin and the (A3z) resin has a function of promoting or assisting the action of the phenolic hydroxyl group in the film. Therefore, it is presumed that the action on the promotion of dissolution or photocuring during pattern exposure and / or the solubility during development can be appropriately controlled, and various characteristics can be combined at a high level.
  • excessive photocuring in the exposed area is controlled by steric damage and molecular motion inhibition of the aromatic group, which is a rigid skeleton, and alkali dissolution inhibition of the hydrophobic aromatic group causes alkaline development in the exposed area.
  • the (A3x) resin, the (A3y) resin, and the (A3z) resin may be either a single resin or a copolymer thereof.
  • the (A3x) resin is a resin containing at least two phenolic hydroxyl groups in one structural unit of the resin.
  • the (A3y) resin is a resin containing a phenolic hydroxyl group and an aromatic group in one structural unit of the resin.
  • the aromatic group is an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded.
  • the (A3z) resin is a resin containing a phenolic hydroxyl group in one structural unit of the resin and further containing a second aromatic group in another structural unit of the resin.
  • the second aromatic group is an aromatic group excluding the aromatic ring to which the phenolic hydroxyl group is bonded.
  • the second aromatic group is a name for distinguishing an aromatic group (meaning an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded) in the (A3y) resin.
  • the structural unit having at least two phenolic hydroxyl groups (hereinafter, “(3x) structural unit”) and containing the phenolic hydroxyl group and the aromatic group (hereinafter, “(3y) structural unit”). "), And / or a resin having a structural unit containing a phenolic hydroxyl group and a structural unit containing a second aromatic group (hereinafter,” (3z) structural unit ”) is included in the (A3x) resin. Further, the resin having the (3y) structural unit and the (3z) structural unit is included in the (A3y) resin.
  • the at least two phenolic hydroxyl groups in the (3x) structural unit are preferably at least two phenolic hydroxyl groups bonded to the same aromatic ring, or at least two phenolic hydroxyl groups bonded to different aromatic rings, preferably bonded to different aromatic rings. At least two phenolic hydroxyl groups are more preferred.
  • the aromatic group in the (3y) structural unit and the second aromatic group in the (3z) structural unit are a benzene skeleton, an isocyanuric acid skeleton, a triazine skeleton, a skeleton derived from bisphenol A, a skeleton derived from bisphenol F, or bisphenol.
  • a skeleton derived from F is preferred.
  • the aromatic group in the (3y) structural unit and the second aromatic group in the (3z) structural unit are directly composed of a fused polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic ring skeleton and an alicyclic skeleton. It is preferable to have a linked structure or a structure in which at least two aromatic ring skeletons are directly linked, and more preferably to have a fused polycyclic structure or a condensed polycyclic heterocyclic structure.
  • Condensed polycyclic structures include naphthalene skeleton, anthracene skeleton, indan skeleton, inden skeleton, fluorene skeleton, benzoindan skeleton, benzoinden skeleton, benzofluorene skeleton, dibenzofluorene skeleton, dihydronaphthalene skeleton, tetrahydronaphthalene skeleton, dihydroanthracene skeleton, Alternatively, a dihydrophenanthrene skeleton is preferable, and a naphthalene skeleton, anthracene skeleton, fluorene skeleton, benzofluorene skeleton, and dihydroanthracene skeleton are more preferable.
  • Fused polycyclic heterocyclic structures include carbazole skeleton, dibenzofuran skeleton, dibenzothiophene skeleton, benzocarbazole skeleton, naphthobenzofuran skeleton, naphthobenzothiophene skeleton, indole skeleton, benzofuran skeleton, benzothiophene skeleton, indolin skeleton, indolinone skeleton, isoind.
  • a linone skeleton, an acridin skeleton, a xanthene skeleton, or a thioxanthene skeleton is preferable, and a carbazole skeleton, a dibenzofuran skeleton, a benzocarbazole skeleton, an indolinone skeleton, an isoindolinone skeleton, an acridin skeleton, or a xanthene skeleton is more preferable.
  • the aromatic ring skeleton in the structure in which the aromatic ring skeleton and the alicyclic skeleton are directly connected the above-mentioned aromatic group or condensed polycyclic structure is preferable.
  • the alicyclic skeletons in the structure in which the aromatic ring skeleton and the alicyclic skeleton are directly connected are cyclopentane skeleton, cyclohexane skeleton, cycloheptane skeleton, bicyclo [4.3.0] nonan skeleton, and bicyclo [5.4.0].
  • Undecane skeleton, bicyclo [2.2.2] octane skeleton, tricyclo [5.2.1.0 2,6 ] decane skeleton, pentacyclopentadecane skeleton, or adamantan skeleton is preferable.
  • the structure in which at least two aromatic ring skeletons are directly linked is preferably a biphenyl skeleton, a terphenyl skeleton, or a structure in which the above aromatic group or condensed polycyclic structure is directly linked.
  • the (A3x) resin, the (A3y) resin, or the (A3z) resin is further added with a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl having 2 to 5 carbon atoms. It is also preferable to have a structural unit having a group or a heat-reactive group (hereinafter, “(3w) structural unit”).
  • ((3w) structural unit) a structural unit having a group or a heat-reactive group
  • the photoreactive group is preferably a radically polymerizable group, more preferably a styryl group, a cinnamoyl group, a maleimide group, or a (meth) acryloyl group, and even more preferably a (meth) acryloyl group.
  • the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a radically polymerizable group, and is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, or 2-methyl-.
  • a 2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group is more preferable, and a vinyl group or an allyl group is further preferable.
  • the thermally reactive group is preferably an alkoxymethyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, or a blocked isocyanate group.
  • the (A3) resin contains a (A3) resin having a specific structural unit described later (hereinafter, "specific (A3) resin”).
  • specific (A3) resin a (A3) resin having a specific structural unit described later
  • the specific structural unit or the specific structure of the specific (A3) resin has a function of promoting or assisting the action of the phenolic hydroxyl group in the film, so that the action on the dissolution promotion or photocuring during pattern exposure, And / or, it is presumed that the solubility at the time of development can be appropriately controlled, and various characteristics can be combined at a high level.
  • the specific (A3) resin may be either a single resin or a copolymer thereof.
  • the (A3) resin preferably contains (A3-1) phenol resin and / or (A3-3) phenol group-modified epoxy resin, and more preferably contains (A3-1) phenol resin.
  • the resin has a phenolic hydroxyl group as an alkali-soluble group in the main chain of the resin, the side chain of the resin, or the terminal.
  • the resin (A3) preferably has a structural unit having a phenolic hydroxyl group, a side chain structure having a phenolic hydroxyl group, or a terminal structure having a phenolic hydroxyl group. Further, it may have other acidic groups.
  • a carboxy group, a carboxylic acid anhydride group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis (trifluoromethyl) methylol group, a sulfonic acid group, or a mercapto group is preferable, and after development, it is preferable.
  • a hydroxyimide group, a hydroxyamide group, a silanol group, or a 1,1-bis (trifluoromethyl) methylol group is preferable.
  • a carboxy group or a carboxylic acid anhydride group is preferable from the viewpoint of suppressing the residue after development.
  • the (A) alkali-soluble resin has (A3b) a phenolic hydroxyl group and an ethylenically unsaturated double bond group (hereinafter, "" (A3b) Resin ”), and the (A3b) resin preferably has an ethylenically unsaturated double bond group as a radically polymerizable group.
  • the (A) alkali-soluble resin contains the (A3b) resin
  • the (A3b) resin is also preferable that the (A3b) resin is the (A3p) resin.
  • the (A) alkali-soluble resin is (A3-1) a phenol resin containing (A3b-1) an unsaturated group-containing phenol resin, (A3-2) a polyhydroxystyrene as (A3b-2) an unsaturated group-containing polyhydroxystyrene, and the like.
  • A3-3) phenol group-modified epoxy resin (A3b-3) unsaturated group-containing phenol group-modified epoxy resin, and (A3-4) phenol group-modified acrylic resin (A3b-4) unsaturated group-containing phenol group modification It is preferable to contain one or more kinds (hereinafter, "resin having an unsaturated group (A3b)") selected from the group consisting of acrylic resins.
  • the unsaturated group is preferably an ethylenically unsaturated double bond group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group, and is selected from the group consisting of a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. It is more preferable that there is one or more types.
  • a photoreactive group a styryl group, a cinnamoyl group, a maleimide group, or a (meth) acryloyl group is preferable, and a (meth) acryloyl group is more preferable.
  • examples of the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms include a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group and a 2-methyl-2-butenyl group, 3 -Methyl-2-butenyl group, 2,3-dimethyl-2-butenyl group, ethynyl group, or 2-propargyl group is preferable, and vinyl group or allyl group is more preferable.
  • the double bond equivalent of the resin having an unsaturated group (A3b) is preferably 500 g / mol or more, more preferably 700 g / mol or more, still more preferably 1,000 g / mol or more.
  • the double bond equivalent is preferably 3,000 g / mol or less, more preferably 2,000 g / mol or less, and even more preferably 1,500 g / mol or less.
  • the alkali-soluble resin has (A3a) a phenolic hydroxyl group and an ethylenically unsaturated double bond group. It is preferable to include a resin that does not have (hereinafter, “(A3a) resin”).
  • the resin (A3a) preferably does not have an ethylenically unsaturated double bond group, which is a radically polymerizable group.
  • the (A) alkali-soluble resin contains the (A3a) resin, it is also preferable that the (A3a) resin is the (A3p) resin.
  • the alkali-soluble resin does not have (A3a-1) a phenolic resin as (A3-1) a phenolic resin and (A3a-2) an unsaturated group as (A3-2) polyhydroxystyrene.
  • the unsaturated group is preferably an ethylenically unsaturated double bond group. That is, the (A3a) resin preferably does not have an ethylenically unsaturated double bond group which is a radically polymerizable group.
  • the (A) alkali-soluble resin contains the (A3b) resin
  • the (A) alkali-soluble resin further contains the (A3a) resin.
  • the alkali-soluble resin contains the above-mentioned resin having an unsaturated group (A3b)
  • the acid equivalent of the (A3) resin is preferably 70 g / mol or more, more preferably 80 g / mol or more, and even more preferably 90 g / mol or more.
  • the acid equivalent is preferably 450 g / mol or less, more preferably 350 g / mol or less, still more preferably 300 g / mol or less.
  • the (A3-1) phenol resin which is the resin (A3), is obtained by reacting, for example, a phenol compound with one or more selected from the group consisting of an aldehyde compound, a ketone compound, an alkoxymethyl compound, and a methylol compound.
  • the resin to be used is mentioned.
  • the (A3-1) phenol resin preferably contains a novolak resin and / or a resol resin.
  • the novolak resin refers to a resin obtained by reacting under an acid catalyst.
  • the resol resin refers to a resin obtained by reacting under a base catalyst.
  • the structural unit in the (A3-1) phenol resin is a repetition including (I) a structure derived from a phenol compound and (II) a structure derived from an aldehyde compound, a ketone compound, an alkoxymethyl compound, or a methylol compound.
  • the structural unit in the (A3-1) phenol resin may further have a structure derived from (III) another compound.
  • the above-mentioned (3w) structural unit in the (A3-1) phenol resin means that these (I) structure, (II) structure, (III) structure, or the structure after the reaction of the group having them is photoreactive.
  • the phenolic resin (A3-1) As the phenolic resin (A3-1), the general formulas (31) to (35) and from the viewpoints of suppressing the residue after development, suppressing the narrow mask bias after development, reducing the taper of the pattern shape, and improving the halftone characteristics. It is preferable to contain at least one selected from the group consisting of resins having the structural unit represented by any of (38) to (40).
  • X 31 to X 37 each independently represent an aliphatic structure having 1 to 2 carbon atoms.
  • Y 33 represents an alkylene group having 1 to 10 carbon atoms.
  • Y 35 is a direct bond, an alkylene group having 1 to 6 carbon atoms, an alkylidene group having 1 to 6 carbon atoms, a halogenated alkylene group having 1 to 6 carbon atoms, a halogenated alkylidene group having 1 to 6 carbon atoms, and an aromatic group.
  • R 71 to R 82 are independent halogen atoms, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkoxy group having 1 to 10 carbon atoms.
  • R 83 to R 88 each independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a hydroxy group.
  • a represents an integer of 1 to 4.
  • b represents an integer of 1 to 5.
  • m represents an integer of 0 to 3.
  • n represents an integer from 0 to 4.
  • c represents an integer of 1 to 4.
  • o and p each independently represent an integer of 0 to 3.
  • q represents an integer from 0 to 4.
  • d represents an integer of 1 to 4.
  • r and s each independently represent an integer of 0 to 3.
  • t represents an integer from 0 to 4.
  • e represents an integer of 1 to 4.
  • f, g, v, and w each independently represent an integer of 0 to 4.
  • u represents an integer from 0 to 3.
  • h represents an integer of 1 to 3.
  • x represents an integer of 0 to 2.
  • y and z independently represent 0 or 1, respectively.
  • ⁇ , ⁇ , ⁇ , ⁇ , ⁇ , and ⁇ each independently represent an integer of 0 to 4.
  • * 1 and * 2 independently represent the bonding points in the resin.
  • Y35 is an aromatic group, a fused polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly linked, or at least.
  • a structure in which two aromatic ring skeletons are directly linked is preferable, and a fused polycyclic structure or a condensed polycyclic heterocyclic structure is more preferable.
  • a structure in which the skeleton and the alicyclic skeleton are directly connected, or a structure in which at least two aromatic ring skeletons are directly connected is preferable.
  • the fused polycyclic heterocyclic structure, the aromatic ring skeleton, and the alicyclic skeleton may have a hetero atom and may be an unsubstituted or substituted product.
  • the fused polycyclic hydrocarbon ring formed by the group forming the ring may be a naphthalene ring, an anthracene ring, pyrene ring, indane ring, indene ring, tetrahydronaphthalene ring, fluorene ring, xanthene ring, or isoindolinone ring. preferable.
  • Z 31 to Z 34 independently represent an aliphatic structure having 1 to 2 carbon atoms.
  • W 32 has an aromatic group, a fused polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly linked, or a structure in which at least two aromatic ring skeletons are directly linked. Represents.
  • W 34 is a direct bond, an alkylene group having 1 to 6 carbon atoms, an alkylidene group having 1 to 6 carbon atoms, a halogenated alkylene group having 1 to 6 carbon atoms, a halogenated alkylidene group having 1 to 6 carbon atoms, and an aromatic group.
  • R 91 to R 96 are independent halogen atoms, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkoxy group having 1 to 10 carbon atoms.
  • the rings linked by the groups forming the rings represent monocyclic or condensed polycyclic hydrocarbon rings.
  • R 97 to R 99 independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a hydroxy group.
  • a represents an integer of 1 to 4.
  • m represents an integer of 0 to 3.
  • n represents an integer from 0 to 5.
  • b represents an integer of 1 to 4.
  • o represents an integer from 0 to 3.
  • p represents an integer from 0 to 10.
  • X is the valence of W 32 , 0 ⁇ p ⁇ (X-2).
  • c and d each independently represent an integer of 1 to 4.
  • q and r each independently represent an integer of 0 to 3.
  • Y35 is an aromatic group, a fused polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly linked, or at least.
  • a structure in which two aromatic ring skeletons are directly linked is preferable, and a fused polycyclic structure or a condensed polycyclic heterocyclic structure is more preferable.
  • an aromatic group a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, and an aromatic ring illustrating preferred structures.
  • the fused polycyclic heterocyclic structure, the aromatic ring skeleton, and the alicyclic skeleton may have a hetero atom and may be an unsubstituted or substituted product.
  • the fused polycyclic hydrocarbon ring formed by the group forming the ring may be a naphthalene ring, an anthracene ring, pyrene ring, indane ring, indene ring, tetrahydronaphthalene ring, fluorene ring, xanthene ring, or isoindolinone ring. preferable.
  • the (A3x) resin is a (A3-1) resin from the viewpoints of suppressing residue after development, suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving halftone characteristics.
  • the (A3x) resin contains the (A3-1) phenol resin, in the general formula (34), f and g each independently represent an integer of 1 to 4.
  • the (A3-1) phenol resin may contain a resin having a structural unit represented by the general formula (36).
  • X 38 represents an aliphatic structure having 1 to 6 carbon atoms.
  • R 89 is a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and an alkenyl having 2 to 10 carbon atoms.
  • the rings linked by the groups forming the rings represent monocyclic or condensed polycyclic hydrocarbon rings.
  • R 90 represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • a represents an integer of 1 to 4.
  • b represents an integer of 0 to 3.
  • ⁇ represents an integer from 0 to 4.
  • the above-mentioned aliphatic structure, alkyl group, aryl group, alkenyl group, alkoxy group, acyl group, ring-forming group, and alkylene group may have a hetero atom and may be an unsubstituted or substituted product. It doesn't matter.
  • the fused polycyclic hydrocarbon ring formed by the group forming the ring may be a naphthalene ring, an anthracene ring, pyrene ring, indane ring, indene ring, tetrahydronaphthalene ring, fluorene ring, xanthene ring, or isoindolinone ring. preferable.
  • the (A3y) resin is a (A3-1) resin from the viewpoints of suppressing residue after development, suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving halftone characteristics.
  • the (A3y) resin contains the (A3-1) phenol resin, f and g are 0 in the general formula (34).
  • the (A3x) resin contains (A3-1) phenol resin, in the structural unit of (A3-1) phenol resin, (I) the resin whose structure derived from the phenol compound has at least two phenolic hydroxyl groups, and /
  • the (A3x) resin contains (II) a resin having a phenolic hydroxyl group having a structure derived from an aldehyde compound, a ketone compound, an alkoxymethyl compound, or a methylol compound.
  • the resin whose structure derived from the phenol compound has at least two phenolic hydroxyl groups is preferably a resin containing a skeleton derived from an aromatic compound having at least two phenolic hydroxyl groups.
  • the resin having a structure derived from an aldehyde compound, a ketone compound, an alkoxymethyl compound, or a methylol compound having a phenolic hydroxyl group is preferably a resin containing a skeleton derived from an electrophilic aromatic compound having a phenolic hydroxyl group.
  • a resin containing a skeleton derived from an aromatic aldehyde having a phenolic hydroxyl group, an aromatic ketone having a phenolic hydroxyl group, an aromatic alkoxymethyl compound having a phenolic hydroxyl group, or an aromatic methylol compound having a phenolic hydroxyl group is more preferable.
  • the (A3y) resin contains (A3-1) phenol resin, in the structural unit of (A3-1) phenol resin, (I) the resin whose structure derived from the phenol compound has a phenolic hydroxyl group and an aromatic group, And / or (II) a resin having an aromatic group having a structure derived from an aldehyde compound, a ketone compound, an alkoxymethyl compound, or a methylol compound is included in the (A3y) resin.
  • the resin having a structure derived from a phenol compound having a phenolic hydroxyl group and an aromatic group is preferably a resin containing a phenolic hydroxyl group and a skeleton derived from an aromatic compound having an aromatic group.
  • the aromatic group is an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded. Further, it has a phenolic hydroxyl group and has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly linked, or a structure in which at least two aromatic ring skeletons are directly linked.
  • a resin containing a skeleton derived from an aromatic compound having the above-mentioned structure is more preferable.
  • the resin having an aromatic group structure derived from an aldehyde compound, a ketone compound, an alkoxymethyl compound, or a methylol compound is preferably a resin containing a skeleton derived from an electrophilic aromatic compound, and is preferably an aromatic aldehyde or aromatic. Resins containing a skeleton derived from a group ketone, an aromatic alkoxymethyl compound, or an aromatic methylol compound are more preferable.
  • an electrophilic fragrance having a fused polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly linked, or a structure in which at least two aromatic ring skeletons are directly linked.
  • Resins containing a skeleton derived from a group compound are more preferred.
  • the structural unit in (A3-1) phenol resin is (I) a structure derived from a phenol compound, (II) an aldehyde compound, a ketone compound, and an alkoxymethyl compound. , Or a resin having a structure derived from a methylol compound and (III) a structure derived from another compound, and (III) a structure derived from another compound having an aromatic group is contained in the (A3z) resin. Is done.
  • the (A3-1) phenol resin has at least one type selected from the group consisting of structural units represented by any of the general formulas (31) to (33), (35), and (40) (A3-1).
  • the A3) resin is contained in the (A3x) resin.
  • the resins (A3) having the structural unit represented by the general formula (34) the resin in the case where f and g independently represent an integer of 1 to 4 in the general formula (34) is , (A3x) is contained in the resin.
  • the resin in the case where f and g are 0 in the general formula (34) is included in the (A3y) resin.
  • the (A3) resin having the structural unit represented by the general formula (38) and / or the structural unit represented by the general formula (39) is included in the (A3y) resin.
  • the photosensitive resin composition of the present invention contains a specific (A3-1) phenol resin in which the (A) alkali-soluble resin is a specific (A3) resin
  • the (A3-1) phenol resin can be used.
  • It has a structural unit containing both a structure containing at least three groups having a phenolic hydroxyl group connected by one atom and a structure having 3 to 12 carbon atoms connecting the groups having a phenolic hydroxyl group.
  • the photosensitive resin composition of the present invention contains a specific (A3-1) phenol resin in which the (A) alkali-soluble resin is a specific (A3) resin
  • the (A3-1) phenol resin can be used.
  • (I-a3-1) A resin having a structural unit containing at least two aromatic groups having a phenolic hydroxyl group.
  • (II-a3-1) A resin having a structural unit containing at least three aromatic groups having a phenolic hydroxyl group connected by one atom.
  • III-a3-1) A structure containing at least three aromatic groups having a phenolic hydroxyl group connected by one atom, and an aliphatic group having 3 to 12 carbon atoms connecting the aromatic groups having a phenolic hydroxyl group.
  • a resin having a structural unit including both structures, (IV-a3-1) Aromatic group, fused polycyclic structure, condensed polycyclic heterocyclic structure, structure in which aromatic ring skeleton and alicyclic skeleton are directly linked, or structure in which at least two aromatic ring skeletons are directly linked.
  • a structure in which is directly linked, or a structure in which at least two aromatic ring skeletons are directly linked is a structure in which a fused polycyclic structure, a condensed polycyclic heterocyclic structure, an aromatic ring skeleton and an alicyclic skeleton are directly linked.
  • at least two aromatic ring skeletons are preferably directly linked, and more preferably a fused polycyclic structure or a condensed polycyclic heterocyclic structure.
  • an aromatic group a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, and an aromatic ring illustrating preferred structures.
  • the resin having the structural unit of (3) described above is excluded from the resin having the structural unit of (1) described above and the resin having the structural unit of (2) described above.
  • the resin having the structural unit of (III-a3-1) described above includes the resin having the structural unit of (I-a3-1) described above and the structural unit of (II-a3-1) described above. Excludes from the resin it has.
  • (A3-1) The phenol resin has a plurality of structures among the above-mentioned structural units (1) to (5) or the above-mentioned (I-a3-1) to (V-a3-1) structural units. When a resin having a unit is contained, the (A3-1) phenol resin is treated as containing a resin having all the structural units.
  • the (A3) resin having at least one type selected from the group consisting of the structural units (1) to (3) and (5) described above is included in the (A3x) resin. Further, among the (A3) resins having the structural unit of (4) described above, the resin having at least two phenolic hydroxyl groups in the structural unit of (4) is included in the (A3x) resin. Further, among the (A3) resins having the structural unit of (4) described above, the resin having one phenolic hydroxyl group in the structural unit of (4) is included in the (A3y) resin.
  • the resin (A3) having at least one kind selected from the group consisting of the structural units of (1) to (5) described above is the resin having the structural unit of (I-a3-1) described above, (II-.
  • the number is one or more selected from the group consisting of resins having a unit.
  • the photosensitive resin composition of the present invention is The structural unit of (1) is the structural unit of (I-a3-1).
  • the structural unit of (2) is the structural unit of (II-a3-1).
  • the structural unit of (3) is the structural unit of (III-a3-1).
  • the structural unit of (4) is the structural unit of (IV-a3-1).
  • the structural unit of (5) is the structural unit of (V-a3-1).
  • the content ratio of the structural unit of a3-1) is preferably 50 mol% or more, more preferably 60 mol% or more, still more preferably 70 mol% or more.
  • the content ratio of the structural unit represented by the above-mentioned general formula (31), the content ratio of the structural unit of the above-mentioned (1), or the content ratio of the structural unit of the above-mentioned (I-a3-1) is.
  • A3-1 The content ratio of the structural unit represented by the general formula (32) described above, the content ratio of the structural unit of the above-mentioned (2), or the above-mentioned (II-) in all the structural units of the phenol resin.
  • the content ratio of the structural unit of a3-1) is preferably 50 to 100 mol%, more preferably 60 to 100 mol% or more, still more preferably 70 to 100 mol%.
  • A3-1) The content ratio of the structural unit represented by the general formula (33) described above, the content ratio of the structural unit of the above-mentioned (3), or the above-mentioned (III-) in all the structural units of the phenol resin.
  • the content ratio of the structural unit of a3-1) is preferably 5 mol% or more, more preferably 10 mol% or more, further preferably 15 mol% or more, and particularly preferably 20 mol% or more.
  • the content ratio of the structural unit represented by the general formula (33) described above, the content ratio of the structural unit of the above-mentioned (3), or the content ratio of the structural unit of the above-mentioned (III-a3-1) is 60 mol% or less is preferable, and 45 mol% or less is more preferable.
  • the content ratio of the structural unit of a3-1) is preferably 50 mol% or more, more preferably 60 mol% or more, still more preferably 70 mol% or more.
  • the content ratio of the structural unit represented by the above-mentioned general formula (34), the content ratio of the structural unit of the above-mentioned (4), or the content ratio of the above-mentioned structural unit of (IV-a3-1) is.
  • the content ratio of the structural unit of a3-1) is preferably 50 to 100 mol%, more preferably 60 to 100 mol% or more, still more preferably 70 to 100 mol%.
  • the content ratio of the structural unit represented by the above-mentioned general formula (38) in the total structural units of the phenol resin is preferably 50 mol% or more, more preferably 60 mol% or more, and further preferably 70 mol% or more. preferable.
  • the content ratio of the structural unit represented by the above-mentioned general formula (38) is preferably 100 mol% or less, more preferably 90 mol% or less.
  • the content ratio of the structural unit represented by the above-mentioned general formula (39) in the total structural units of the phenol resin is preferably 5 mol% or more, more preferably 10 mol% or more, and further preferably 15 mol% or more.
  • the content ratio of the structural unit represented by the above-mentioned general formula (39) is preferably 70 mol% or less, more preferably 60 mol% or less, still more preferably 50 mol% or less.
  • the content ratio of the structural unit represented by the above-mentioned general formula (40) in the total structural units of the phenol resin is preferably 5 mol% or more, more preferably 10 mol% or more, and further preferably 15 mol% or more. It is preferable, and 20 mol% or more is particularly preferable.
  • the content ratio of the structural unit represented by the above-mentioned general formula (40) is preferably 70 mol% or less, more preferably 60 mol% or less, still more preferably 50 mol% or less.
  • the above-mentioned structural units (1) to (3) or the above-mentioned (I-a3-1) to (III-a3-1) are derived from an electrophilic aromatic compound having a phenolic hydroxyl group.
  • the compound preferably contains an aromatic aldehyde having a phenolic hydroxyl group, an aromatic ketone having a phenolic hydroxyl group, an aromatic alkoxymethyl compound having a phenolic hydroxyl group, or an aromatic compound having a phenolic hydroxyl group.
  • Methylol compounds are preferred.
  • electrophilic aromatic compound having a phenolic hydroxyl group examples include salicylaldehyde, 3-hydroxybenzaldehyde, 4-hydroxybenzaldehyde, 2,4-dihydroxybenzaldehyde, 2,6-dihydroxybenzaldehyde, 3,5-dihydroxybenzaldehyde, and 2-. Hydroxy-1-naphthaldehyde, 6-hydroxy-2-naphthaldehyde, 2-hydroxyphenylmethylketone, 2- (methoxymethyl) phenol, or 2- (hydroxymethyl) phenol is preferred.
  • the structural unit of (3) described above or the structural unit of (III-a3-1) described above preferably contains a skeleton derived from an electrophilic aliphatic compound having at least two electrophilic groups.
  • the compound include an aliphatic dialdehyde having at least two formyl groups, an aliphatic diketone having at least two carbonyl groups, an aliphatic dialkoxymethyl compound having at least two alkoxymethyl groups, or at least two methylol groups.
  • the aliphatic dimethylol compound having is preferable.
  • electrophilic aliphatic compound having at least two electrophilic groups examples include malondialdehyde, succindialdehyde, glutardylaldehyde, adipindialdehyde, sebacindialdehyde, decandylaldehyde, 2,6-heptandione, and 2 , 6-Bis (methoxymethyl) heptane, or 2,6-bis (hydroxymethyl) heptane is preferred.
  • the structural unit of (4) described above or the structural unit of (IV-a3-1) described above preferably contains a skeleton derived from a compound having a biphenyl skeleton, and the compound is 4,4'-.
  • Biphenyldicarboxyaldehyde, 3,4'-biphenyldicarboxyaldehyde, 3,3'-biphenyldicarboxyaldehyde, 4,4'-bis (methoxymethyl) biphenyl, 4,4-dihydroxybiphenyl, or 2,2-dihydroxy Biphenyl is preferred.
  • the structural unit of (5) described above or the structural unit of (V-a3-1) described above preferably contains a skeleton derived from an aromatic compound having at least two phenolic hydroxyl groups, and the compound is preferably used as the compound.
  • Catechol, resorcinol, 1,4-hydroquinone, pyrogallol, 1,2,4-benzenetriol, or phloroglucinol is preferred.
  • the (A3-1) phenol resin preferably has a structural unit containing a skeleton derived from an electrophilic aromatic compound.
  • an electrophilic aromatic compound an aromatic aldehyde, an aromatic ketone, an aromatic alkoxymethyl compound, or an aromatic methylol compound is preferable.
  • an electrophilic aromatic compound benzaldehyde, naphthaldehyde, crotonaldehyde, cinnamaldehyde, phenylmethylketone, 2- (methoxymethyl) phenol, or 2- (hydroxymethyl) phenol is preferable.
  • the (A) alkali-soluble resin contains (A3-1) a phenol resin from the viewpoints of suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving the halftone characteristics.
  • (A3-1) Phenolic resin has (1) a resin having a structural unit having at least two phenolic hydroxyl groups and / or (2) at least 3 groups having a phenolic hydroxyl group linked by one atom.
  • the (A) alkali-soluble resin contains (A3-1) a phenol resin from the viewpoints of suppressing narrow mask bias after development, reducing the taper of the pattern shape, and improving the halftone characteristics.
  • (A3-1) Phenolic resin has a structural unit containing at least two aromatic groups having (I-a3-1) phenolic hydroxyl groups, and / or (II-a3-1) one atom.
  • the (A) alkali-soluble resin contains (A3-1) phenol resin, and the (A3-1) phenol resin has a resin having a structural unit represented by the general formula (31) and / or the general formula (32). It is preferable that the phenol resin (A3-1) further contains a resin having a structural unit represented by the general formula (33), and contains a resin having a structural unit represented by.
  • the phenol resin has a phenolic hydroxyl group as an alkali-soluble group in the main chain of the resin, the side chain of the resin, or the terminal.
  • the (A3-1) phenol resin is preferably a resin obtained by reacting a phenol compound with one or more selected from the group consisting of an aldehyde compound, a ketone compound, an alkoxymethyl compound, and a methylol compound. Further, a resin in which a phenolic hydroxyl group is introduced into the main chain of the resin, the side chain of the resin, or the terminal thereof by a reaction using a catalyst is also preferable.
  • It may have a carboxy group and / or a carboxylic acid anhydride group.
  • a resin obtained by reacting a phenolic hydroxyl group of a resin with a carboxylic acid anhydride or a resin obtained by reacting a phenol compound having a carboxy group and / or a carboxylic acid anhydride group as a phenol compound can be mentioned. ..
  • the (A3-1) phenol resin which is the (A3) resin, preferably contains a (A3b-1) unsaturated group-containing phenol resin having at least one ethylenically unsaturated double bond group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the (A3b-1) unsaturated group-containing phenol resin is preferably a resin obtained by reacting a part of the acidic groups of the resin with an epoxy compound having an ethylenically unsaturated double bond group or the like. Further, a resin in which an ethylenically unsaturated double bond group is introduced into a side chain or a terminal of the resin by a reaction using a catalyst is also preferable.
  • A3-1 As the structural unit of the phenol resin, from the viewpoint of improving the reliability of the light emitting element, a structural unit derived from an alicyclic aldehyde compound, a structural unit derived from an alicyclic ketone compound, or an alicyclic alkoxy. Structural units having an alicyclic group such as a structural unit derived from a methyl compound or a structural unit derived from an alicyclic methylol compound are also preferable.
  • the Mw of the (A3-1) phenol resin is preferably 500 or more, more preferably 1,000 or more in terms of polystyrene measured by GPC, from the viewpoint of improving the reliability of the light emitting device.
  • the Mw is preferably 50,000 or less, more preferably 10,000 or less, further preferably 5,000 or less, and 3,000 or less, from the viewpoint of suppressing residue after development and reducing the taper of the pattern shape. Is particularly preferable.
  • the phenol resin can be synthesized by a known method. Examples of the phenol compound, aldehyde compound, ketone compound, alkoxymethyl compound, and methylol compound include the compounds described in International Publication No. 2017/159876.
  • Examples of the (A3-2) polyhydroxystyrene resin (A3) include a resin obtained by radically copolymerizing a hydroxystyrene derivative with a styrene derivative and / or other copolymerization component. Examples of other copolymerization components include (meth) acrylic acid derivatives and (meth) acrylic acid ester derivatives. Further, the structural unit in (A3-2) polyhydroxystyrene means a repeating unit including (I) a structure derived from a hydroxystyrene derivative.
  • the structural unit in (A3-2) polyhydroxystyrene may further have a structure derived from (II) a styrene derivative and / or a structure derived from (III) other copolymerization components.
  • the above-mentioned (3w) structural unit in polyhydroxystyrene is a photoreaction of these (I) structure, (II) structure, (III) structure, or the post-reaction structure of the group having them.
  • the polyhydroxystyrene has a resin having a structural unit represented by the general formula (91) and / or a structural unit represented by the general formula (92) from the viewpoint of suppressing residues after development. It preferably contains a resin.
  • X 121 represents an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms.
  • X 122 and X 123 each independently represent an alkylene group having 1 to 6 carbon atoms.
  • R 221 to R 226 independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
  • R227 and R228 are independently halogen atoms, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkoxy group having 1 to 10 carbon atoms.
  • the rings linked by the groups forming the rings represent monocyclic or condensed polycyclic hydrocarbon rings.
  • R 229 and R 230 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
  • a and b each independently represent an integer of 1 to 5.
  • c, d, e, and f each independently represent an integer of 0 to 4.
  • alkyl group, aryl group, alkenyl group, alkoxy group, acyl group, ring-forming group, alkylene group, cycloalkylene group, and arylene group may have a hetero atom, and may have a hetero atom, and is an unsubstituted or substituted product. It does not matter which one.
  • the fused polycyclic hydrocarbon ring formed by the group forming the ring may be a naphthalene ring, an anthracene ring, pyrene ring, indane ring, indene ring, tetrahydronaphthalene ring, fluorene ring, xanthene ring, or isoindolinone ring. preferable.
  • the (A3x) resin contains (A3-2) polyhydroxystyrene, in the structural unit of (A3-2) polyhydroxystyrene, in the structure derived from (I) hydroxystyrene derivative or (III) other copolymerization component.
  • the (A3x) resin contains a resin whose derived structure has at least two phenolic hydroxyl groups.
  • the resin having a structure derived from the hydroxystyrene derivative having at least two phenolic hydroxyl groups is preferably a resin containing a skeleton derived from the hydroxystyrene derivative having at least two phenolic hydroxyl groups.
  • the resin having a structure derived from other copolymerization components having at least two phenolic hydroxyl groups has a structure in which a phenol compound having an addition reactive group and at least two phenolic hydroxyl groups has reacted. Is preferable.
  • the resin in which the structure derived from the (I) hydroxystyrene derivative has an aromatic group or (III) A resin having a structure derived from other copolymerization components having one phenolic hydroxyl group and having an aromatic group is included in the (A3y) resin.
  • the resin whose structure derived from the hydroxystyrene derivative has an aromatic group is preferably a resin containing a skeleton derived from the hydroxystyrene derivative having an aromatic group.
  • the aromatic group is an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded.
  • a hydroxystyrene derivative having a fused polycyclic structure a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly linked, or a structure in which at least two aromatic ring skeletons are directly linked.
  • Resins containing the derived skeleton are more preferred.
  • the structural unit in (A3-2) polyhydroxystyrene is derived from the structure derived from (I) hydroxystyrene derivative and (II) styrene derivative.
  • a resin having a structure is included in the (A3z) resin.
  • the photosensitive resin composition of the present invention contains (A3-2) polyhydroxystyrene.
  • (A3-2) polyhydroxystyrene is the structural unit and / or the structural unit of (6). It has the structural unit of (7).
  • the photosensitive resin composition of the present invention contains (A3-2) polyhydroxystyrene.
  • (I-a3-2) A resin having a structural unit containing a skeleton having at least one alkoxyalkyl group, and / or (II-a3-2) It is preferable to contain a resin having a structural unit containing a skeleton having at least one hydroxyalkyl group.
  • (A3-2) polyhydroxystyrene has the structure of (I-a3-2).
  • (A3-2) Polyhydroxystyrene is a plurality of the structural units of (6) to (7) described above or the structural units of (I-a3-2) to (II-a3-2) described above. When a resin having a structural unit is contained, the (A3-2) polyhydroxystyrene is treated as containing a resin having all the structural units.
  • the resin (A3) having the structural unit of (6) and / or the structural unit of (7) described above is the resin having the structural unit of (I-a3-2) described above, and / or (II-). It is also preferable that the resin has the structural unit of a3-2). That is, in the photosensitive resin composition of the present invention, the structural unit of (6) is the structural unit of (I-a3-2), and the structural unit of (7) is the structural unit of (II-a3-2). Is also preferable.
  • the total content ratio of the structural unit and the structural unit of (II-a3-2) described above is preferably 10 mol% or more, more preferably 20 mol% or more.
  • the total content ratio of the structural units is preferably 60 mol% or less, more preferably 45 mol% or less.
  • the structural units of (6) to (7) described above, or the structural units of (I-a3-2) to (II-a3-2) described above, are alkoxyalkyl groups and / or fats derived from aliphatic aldehydes. It is preferable to have a hydroxyalkyl group derived from a group aldehyde. Further, a resin obtained by reacting an aromatic group having a phenolic hydroxyl group of the resin with an aliphatic aldehyde is preferable. As the aliphatic aldehyde, formaldehyde, paraformaldehyde, acetaldehyde, paraaldehyde, or propionaldehyde is preferable.
  • (A3-2) Polyhydroxystyrene has a phenolic hydroxyl group as an alkali-soluble group in the main chain of the resin, the side chain of the resin, or the terminal.
  • the (A3-2) polyhydroxystyrene is preferably a resin obtained by radically copolymerizing a copolymerization component containing at least a hydroxystyrene derivative. Further, in a resin obtained by radically copolymerizing a copolymerization component containing a (meth) acrylic acid ester having a reactive group such as an epoxy group, an epoxy group or the like of the resin and a phenol compound having a carboxy group are used.
  • a resin obtained by reacting with the above is also preferable, and a resin in which a phenolic hydroxyl group is introduced into the main chain, the side chain or the terminal of the resin by a reaction using a catalyst is also preferable.
  • the phenol compound having a carboxy group include 2-hydroxybenzoic acid, 3-hydroxybenzoic acid, 4-hydroxybenzoic acid, 3-hydroxyphthalic acid, 4-hydroxyphthalic acid, 5-hydroxyphthalic acid and 2,3-dihydroxyl.
  • a resin having a phenolic hydroxyl group as an alkali-soluble group at the main chain of the resin, the side chain of the resin, or the terminal thereof, and having a carboxy group and / or a carboxylic acid anhydride group is also preferable.
  • it is obtained by reacting a resin obtained by reacting a phenolic hydroxyl group of a resin with a carboxylic acid anhydride, or a copolymerizing component having a carboxy group and / or a carboxylic acid anhydride group as another copolymerizing component. Resin is mentioned.
  • the (A3) resin (A3-2) polyhydroxystyrene preferably contains (A3b-2) unsaturated group-containing polyhydroxystyrene having at least one ethylenically unsaturated double bond group.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the (A3b-2) unsaturated group-containing polyhydroxystyrene is preferably a resin obtained by reacting a part of the acidic groups of the resin with an epoxy compound having an ethylenically unsaturated double bond group or the like.
  • a resin obtained by reacting an epoxy group or the like of a resin with a carboxylic acid compound having an ethylenically unsaturated double bond group is also preferable.
  • the carboxylic acid compound having an ethylenically unsaturated double bond group include 2-vinylacetic acid, 4-vinylbenzoic acid, crotonic acid, cinnamic acid, 2-maleimideacetic acid, 3-maleimidepropionic acid, and 4-maleimidebutanoic acid. , 6-Maleimidehexanoic acid, or (meth) acrylic acid is preferred.
  • a structural unit having an aromatic group such as a structural unit derived from an aromatic (meth) acrylic acid ester derivative is also preferable from the viewpoint of improving the reliability of the light emitting device. .. Further, from the viewpoint of improving the reliability of the light emitting device, a structural unit having an alicyclic group such as a structural unit derived from an alicyclic (meth) acrylic acid ester derivative is also preferable.
  • the Mw of (A3-2) polyhydroxystyrene is preferably 500 or more, more preferably 1,000 or more in terms of polystyrene measured by GPC, from the viewpoint of improving the reliability of the light emitting device. On the other hand, the Mw is preferably 50,000 or less, more preferably 20,000 or less, from the viewpoint of suppressing the residue after development and reducing the taper of the pattern shape.
  • (A3-2) Polyhydroxystyrene can be synthesized by a known method. Examples of the hydroxystyrene derivative, the styrene derivative, and other copolymerization components include the compounds described in International Publication No. 2017/159876.
  • Examples of the (A3-3) phenol group-modified epoxy resin which is the (A3) resin include the resins obtained in the following (1-a3-3) to (2-a3-3). If necessary, the polyfunctional alcohol compound may be further reacted at any of the reaction steps.
  • (1-a3-3) A resin obtained by reacting a polyfunctional epoxy compound with a phenol compound having an epoxy-reactive group.
  • (2-a3-3) A resin obtained by further reacting the above-mentioned resin (1-a3-3) with a polyfunctional carboxylic acid dianhydride or a polyfunctional carboxylic acid compound.
  • the structural unit in the (A3-3) phenol group-modified epoxy resin is a structure derived from (I) a polyfunctional epoxy compound reacted with a phenol compound having an epoxy-reactive group (hereinafter, "(A3-3)). It refers to a repeating unit including (I) structure of resin ").
  • the structural unit in the (A3-3) phenol group-modified epoxy resin is a structure derived from a polyfunctional epoxy compound excluding the (I) structure of the (II) (A3-3) resin (hereinafter, "(A3-3)".
  • the above-mentioned (3w) structural unit in the phenol group-modified epoxy resin is the structure (I), the structure (II), the structure (III), or the structure of the group after the reaction.
  • the phenol group-modified epoxy resin has a cyclic skeleton in the main chain. Further, from the viewpoint of suppressing residue after development and improving halftone characteristics, it contains one or more selected from the group consisting of resins having structural units represented by any of the general formulas (101) to (103). Is preferable.
  • X 141 and X 142 independently represent an aliphatic structure having 1 to 6 carbon atoms.
  • X 143 represents an alkylene group having 1 to 6 carbon atoms.
  • W 3 represents an organic group having at least one aromatic group.
  • R 241 and R 242 independently represent a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R243 represents a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R244 to R246 are independently represented by a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or the general formula (109).
  • R247 represents a hydrogen atom or a substituent represented by the general formula (110).
  • R248 and R249 each independently represent an organic group having an ethylenically unsaturated double bond group.
  • a and b each independently represent an integer of 0 to 10.
  • c represents an integer from 0 to 14.
  • d represents an integer of 0 to 3.
  • e and f each independently represent an integer of 0 to 4.
  • W3 is preferably a substituent represented by any of the general formulas (104) to (108).
  • the organic group having an ethylenically unsaturated double bond group in R 248 and R 249 is a (meth) acryloyl group, or the general formula (112) or the general formula (113).
  • the represented substituent is preferred.
  • the above-mentioned aliphatic structure, alkylene group, alkyl group, cycloalkyl group, and aryl group may have a heteroatom and may be an unsubstituted or substituted product.
  • X 144 represents an aliphatic structure having 1 to 6 carbon atoms.
  • X 145 and X 146 each independently represent a monocyclic or condensed polycyclic hydrocarbon ring.
  • Y 145 represents a direct bond, a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom.
  • R 250 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R 251 to R 259 are independently represented by a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or the general formula (109). Represents the represented substituent.
  • R 260 to R 262 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R263 to R269 each independently represent an organic group having an ethylenically unsaturated double bond group. a represents an integer from 0 to 10.
  • b represents an integer of 0 to 3.
  • c represents an integer from 0 to 5.
  • d represents an integer of 0 to 3.
  • e, f, g, and h each independently represent an integer of 0 to 4.
  • i and j each independently represent an integer of 0 to 3. If Y 145 is a direct bond, an oxygen atom, or a sulfur atom, k is 0. When Y 145 is a nitrogen atom, k is 1. If Y 145 is a carbon atom, k is 2.
  • * 1 to * 5 each independently represent a connection point with X 141 in the above-mentioned general formula (101).
  • * 6 to * 10 independently represent the coupling points in the above-mentioned general formula (101).
  • X 145 and X 146 are preferably monocyclic or condensed polycyclic hydrocarbon rings having 6 to 15 carbon atoms independently.
  • Y 145 is preferably a direct bond or an oxygen atom.
  • the organic group having an ethylenically unsaturated double bond group in R 263 to R 269 is preferably a (meth) acryloyl group or a substituent represented by the general formula (112) or the general formula (113).
  • the above-mentioned aliphatic structure, alkyl group, cycloalkyl group, aryl group, and monocyclic or condensed polycyclic aromatic hydrocarbon ring may have a heteroatom, and may have a heteroatom, either an unsubstituted or a substituted compound. It doesn't matter.
  • R 270 and R 272 independently represent a substituent represented by the general formula (112) or the general formula (113), respectively.
  • R 271 is represented by a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, or a general formula (109) or a general formula (111).
  • a represents an integer from 0 to 4.
  • R 273 and R 274 each independently represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms.
  • R275 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (109).
  • b represents an integer from 0 to 5.
  • X 147 and X 148 independently have a direct bond, a carbonyl group, a urethane bond, a carbamoyl group, an alkylene group having 1 to 10 carbon atoms, and 4 to 10 carbon atoms.
  • Y 147 and Y 148 independently represent an oxygen atom, a nitrogen atom, or a sulfur atom.
  • R276 and R277 are independent halogen atoms, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkoxy group having 1 to 10 carbon atoms.
  • R 278 and R 279 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (114).
  • R280 and R281 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.
  • c and d each independently represent an integer of 1 to 5.
  • e and f each independently represent an integer of 0 to 4.
  • X 149 is an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, a cycloalkenylene group having 4 to 10 carbon atoms, or a cycloalkenylene group having 4 to 10 carbon atoms. Represents an arylene group having 6 to 15 carbon atoms.
  • alkyl group, aryl group, alkenyl group, alkoxy group, acyl group, ring-forming group, alkylene group, alkenylene group, cycloalkylene group, cycloalkenylene group, and arylene group may have a hetero atom. , Unsubstituted or substituted.
  • the fused polycyclic hydrocarbon ring formed by the group forming the ring may be a naphthalene ring, an anthracene ring, pyrene ring, indane ring, indene ring, tetrahydronaphthalene ring, fluorene ring, xanthene ring, or isoindolinone ring. preferable.
  • Phenolic group-modified epoxy resin has a phenolic hydroxyl group as an alkali-soluble group in the main chain, side chain or terminal of the resin.
  • the (A3-3) phenol group-modified epoxy resin is preferably a resin obtained by reacting a polyfunctional epoxy compound with a phenol compound having a carboxy group.
  • a resin in which a phenolic hydroxyl group is introduced into the main chain of the resin, the side chain of the resin, or the terminal thereof by a reaction using a catalyst is also preferable. It may have a carboxy group and / or a carboxylic acid anhydride group.
  • a resin obtained by reacting a hydroxy group of a resin with a carboxylic acid anhydride can be mentioned.
  • the (I) structure of the (A3-3) resin has a phenolic hydroxyl group in the structural unit of the (A3-3) phenol group-modified epoxy resin.
  • the (A3x) resin contains at least two resins.
  • the resin in which the structure (I) of the resin has at least two phenolic hydroxyl groups is a resin having a structure in which a phenol compound having an epoxy-reactive group and at least two phenolic hydroxyl groups has reacted. preferable.
  • the (I) structure of the (A3-3) resin has an aromatic group in the structural unit of the (A3-3) phenol group-modified epoxy resin.
  • the resin to have is included in the (A3y) resin.
  • the resin in which the structure (I) of the resin has an aromatic group is preferably a resin containing a skeleton derived from a polyfunctional epoxy compound having an aromatic group.
  • a resin containing a skeleton derived from the above is more preferable.
  • the structural units in the (A3-3) phenol-based modified epoxy resin are the (I) structure of the (A3-3) resin and (A3-3).
  • the (A3z) resin contains a resin having the (II) structure of the resin and the (II) structure of the (A3-3) resin having an aromatic group.
  • the photosensitive resin composition of the present invention contains (A3-3) phenol-based modified epoxy.
  • the resin preferably contains a resin having a phenolic hydroxyl group.
  • the photosensitive resin composition of the present invention contains (A3-3) phenol-based modified epoxy.
  • the resin is (I-a3-3) A resin having a structure represented by the general formula (21) and / or (II-3-3) It is preferable to contain a resin having a structure represented by the general formula (22).
  • X 21 and X 22 independently have a direct bond, a carbonyl group, a urethane bond, a carbamoyl group, an alkylene group having 1 to 10 carbon atoms, and 4 to 10 carbon atoms. It represents a cycloalkylene group, an arylene group having 6 to 15 carbon atoms, an alkylene carbonyl group having 1 to 10 carbon atoms, a cycloalkylene carbonyl group having 4 to 10 carbon atoms, or an arylene carbonyl group having 6 to 15 carbon atoms.
  • Y 21 and Y 22 independently represent an oxygen atom, a nitrogen atom, or a sulfur atom.
  • Each of R 61 and R 62 independently has a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an alkoxy group having 1 to 10 carbon atoms.
  • the rings linked by the groups forming the rings represent monocyclic or condensed polycyclic hydrocarbon rings.
  • R 63 and R 64 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (23).
  • R 65 and R 66 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.
  • a and b each independently represent an integer of 1 to 5.
  • c and d each independently represent an integer of 0 to 4.
  • X 23 is an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, a cycloalkenylene group having 4 to 10 carbon atoms, or a cycloalkenylene group having 4 to 10 carbon atoms.
  • the fused polycyclic hydrocarbon ring formed by the group forming the ring may be a naphthalene ring, an anthracene ring, pyrene ring, indane ring, indene ring, tetrahydronaphthalene ring, fluorene ring, xanthene ring, or isoindolinone ring. preferable.
  • the resin (A3) having the above-mentioned structural unit (8) is a resin having the above-mentioned structure (I-a3-3) and / or a resin having the above-mentioned structure (II-a3-3). It is also preferable to have. That is, in the photosensitive resin composition of the present invention, it is also preferable that the structure of (8) is the structure of (I-a3-3) and / or the structure of (II-a3-3).
  • the total content ratio of the structural units including the structure represented by the above-mentioned general formula (22) is preferably 30 to 100 mol%, more preferably 50 to 100 mol%.
  • the structural unit including the structure of the above-mentioned (8), or the structural unit including the structure represented by the above-mentioned general formula (21) and the structural unit including the structure represented by the general formula (22) is one phenol. It preferably contains a skeleton derived from a phenolic compound having a sex hydroxyl group and a carboxy group, and examples of the compound include 2-hydroxybenzoic acid, 3-hydroxybenzoic acid, 4-hydroxybenzoic acid, 3-hydroxyphthalic acid and 4-. Hydroxyphthalic acid or 5-hydroxyphthalic acid is preferred.
  • the phenol group-modified epoxy resin may be a structural unit containing the structure of (8) described above, or a structural unit including the structure represented by the general formula (21) described above and the general formula (22).
  • the structural unit including the structure represented may include a skeleton derived from a phenolic compound having one phenolic hydroxyl group and a carboxy group, and a skeleton derived from a phenolic compound having at least two phenolic hydroxyl groups and a carboxy group. preferable.
  • phenolic compound having at least two phenolic hydroxyl groups and a carboxy group examples include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, 2,5-dihydroxybenzoic acid, 2,6-dihydroxybenzoic acid, 3, 5-Dihydroxybenzoic acid, 2,3,4-trihydroxybenzoic acid, or phenolic acid is preferred.
  • the (A3-3) phenol group-modified epoxy resin which is the (A3) resin may contain a (A3b-3) unsaturated group-containing phenol group-modified epoxy resin having at least one ethylenically unsaturated double bond group. preferable.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the (A3b-3) unsaturated group-containing phenol group-modified epoxy resin is preferably a resin obtained by reacting a part of the acidic groups of the resin with an epoxy compound having an ethylenically unsaturated double bond group or the like.
  • a resin obtained by reacting an epoxy group or the like having a resin with a carboxylic acid compound having an ethylenically unsaturated double bond group is also preferable.
  • the carboxylic acid compound having an ethylenically unsaturated double bond group include 2-vinylacetic acid, 4-vinylbenzoic acid, crotonic acid, cinnamic acid, 2-maleimideacetic acid, 3-maleimidepropionic acid, and 4-maleimidebutanoic acid. , 6-Maleimidehexanoic acid, or (meth) acrylic acid is preferred.
  • the structural unit of the phenol group-modified epoxy resin is a structural unit derived from an aromatic polyfunctional carboxylic acid compound or an aromatic polyfunctional carboxylic acid dianhydride from the viewpoint of improving the reliability of the light emitting element.
  • Structural units having an aromatic group, such as the derived structural unit, are also preferred.
  • the Mw of the (A3-3) phenol group-modified epoxy resin is preferably 500 or more, more preferably 1,000 or more in terms of polystyrene measured by GPC, from the viewpoint of improving the reliability of the light emitting device. On the other hand, the Mw is preferably 50,000 or less, more preferably 20,000 or less, from the viewpoint of suppressing the residue after development and reducing the taper of the pattern shape.
  • the phenol group-modified epoxy resin can be synthesized by a known method.
  • Examples of the (A3-4) phenol group-modified acrylic resin which is the (A3) resin include the resins obtained in the following (1-a3-4) to (2-a3-4).
  • a resin obtained by reacting a phenol compound having an addition-reactive group are examples of the (A3-4) phenol group-modified acrylic resin which is the (A3) resin.
  • (2-a3-4) A resin obtained by further reacting the above-mentioned resin (1-a3-4) with a polyfunctional carboxylic acid dianhydride or a polyfunctional carboxylic acid compound.
  • (3-a3-4) Copolymerizing component having a phenolic hydroxyl group, and A resin obtained by radical copolymerizing one or more kinds selected from the group consisting of (meth) acrylic acid derivatives, (meth) acrylic acid ester derivatives, styrene derivatives, and other copolymerization components.
  • the copolymerization component having a phenolic hydroxyl group is a copolymerization component different from the hydroxystyrene derivative.
  • (4-a3-4) A resin obtained by further reacting the above-mentioned (3-a3-4) resin with a phenol compound having an addition-reactive group.
  • (5-a3-4) A resin obtained by further reacting the above-mentioned resin (4-a3-4) with a polyfunctional carboxylic acid dianhydride or a polyfunctional carboxylic acid compound.
  • the structural unit in the (A3-4) phenol group-modified acrylic resin is (I-1) a (meth) acrylic acid derivative, a (meth) acrylic acid ester derivative, in which a phenol compound having an addition-reactive group is reacted.
  • (A3-4) resin (I-1) structure”) or (I-2)
  • the structural units in the (A3-4) styrene-modified acrylic resin further exclude the (I-1) structure of the (II) (A3-4) resin and the (I-2) structure of the (A3-4) resin.
  • (A3-4) resin (II) structure Structures derived from (meth) acrylic acid derivatives, (meth) acrylic acid ester derivatives, styrene derivatives, or other copolymerization components (hereinafter, "(A3-4) resin (II) structure"), and / or. (III) It may have a structure derived from other compounds.
  • (A3-4) The above-mentioned (3w) structural unit in the phenol group-modified epoxy resin is these (I-1) structure, (I-2) structure, (II) structure, (III) structure, or them.
  • the post-reaction structure of the group has a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, an alkynyl group having 2 to 5 carbon atoms, or a thermally reactive group.
  • the phenol group-modified acrylic resin may be any of the general formulas (121), (122), (125), and (126) from the viewpoint of suppressing the residue after development and improving the halftone characteristics. It is preferable to contain at least one selected from the group consisting of resins having the represented structural units. Further, as the (A3-4) phenol group-modified acrylic resin, a structural unit represented by any one of the general formulas (121), (122), (125), and (126), and the general formula (123). It is also preferable to contain a resin having a structural unit represented by.
  • X181, X182, X185, and X186 are independently directly bonded, a carbonyl group, a urethane bond, a carbamoyl group, and an alkylene group having 1 to 10 carbon atoms.
  • X 183 represents a direct bond or an alkylene group having 1 to 10 carbon atoms.
  • Y 181 and Y 182 independently represent an oxygen atom, a nitrogen atom, or a sulfur atom.
  • R 284 to R 292 and R 331 to R 335 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
  • R 293 , R 294 , R 336 , and R 337 independently have an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkoxy group having 2 to 10 carbon atoms, and 1 to 10 carbon atoms.
  • R295 and R296 independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a substituent represented by the general formula (124).
  • R297 and R298 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R299 has a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkyl halide group having 1 to 10 carbon atoms, and 4 to 10 carbon atoms. It represents 10 cycloalkyl halide groups or aryl halide groups having 6 to 15 carbon atoms.
  • a, b, c, and d each independently represent an integer of 1 to 5.
  • e, f, g, and h each independently represent an integer of 0 to 4. If Y 181 is an oxygen atom or a sulfur atom, i is 0. If Y 181 is a nitrogen atom, i is 1.
  • X184 is an alkylene group having 1 to 6 carbon atoms, an alkenylene group having 2 to 6 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, a cycloalkenylene group having 4 to 10 carbon atoms, or a cycloalkenylene group having 4 to 10 carbon atoms. Represents an arylene group having 6 to 15 carbon atoms.
  • alkyl group, aryl group, alkenyl group, alkoxy group, acyl group, ring-forming group, alkylene group, alkenylene group, cycloalkylene group, cycloalkenylene group, and arylene group may have a hetero atom. , Unsubstituted or substituted.
  • the fused polycyclic hydrocarbon ring formed by the group forming the ring may be a naphthalene ring, an anthracene ring, pyrene ring, indane ring, indene ring, tetrahydronaphthalene ring, fluorene ring, xanthene ring, or isoindolinone ring. preferable.
  • Phenolic group-modified acrylic resin has a phenolic hydroxyl group as an alkali-soluble group in the main chain, side chain or terminal of the resin.
  • the (A3-4) phenol group-modified acrylic resin is a resin obtained by radically copolymerizing a copolymerization component containing a (meth) acrylic acid ester having a reactive group such as an epoxy group, such as an epoxy group contained in the resin. And a resin obtained by reacting with a phenol compound having a carboxy group is preferable.
  • a resin in which a phenolic hydroxyl group is introduced into the main chain of the resin, the side chain of the resin, or the terminal thereof by a reaction using a catalyst is also preferable. It may have a carboxy group and / or a carboxylic acid anhydride group.
  • a resin obtained by reacting a hydroxy group of a resin with a carboxylic acid anhydride can be mentioned.
  • the (A3x) resin contains the (A3-4) phenol group-modified acrylic resin, the (A3-4) structure of the (A3-4) resin or the (A3) structure in the structural unit of the (A3-4) phenol group-modified acrylic resin.
  • the (A3x) resin contains a resin in which the (I-2) structure of the resin has at least two phenolic hydroxyl groups.
  • the resin in which the structure (I-1) of the resin has at least two phenolic hydroxyl groups includes a structure in which a phenol compound having an addition-reactive group and having at least two phenolic hydroxyl groups has reacted. Resin is preferred.
  • the resin in which the structure (I-2) of the resin (A3-4) has at least two phenolic hydroxyl groups is preferably a resin containing a structure derived from a copolymer component having at least two phenolic hydroxyl groups.
  • the (A3y) resin contains a (A3-4) phenol group-modified acrylic resin
  • the (I-1) structure of the (A3-4) resin is aromatic in the structural unit of the (A3-4) phenol group-modified acrylic resin.
  • the (A3y) resin contains a resin having a group or a resin in which the (II) structure of the (A3-4) resin has one phenolic hydroxyl group and has an aromatic group.
  • the structural unit in the (A3-4) phenol group-modified acrylic resin is the (I-1) structure of the (A3-4) resin and (I-1).
  • the (A3z) resin contains a resin having the (II) structure of the A3-4) resin and the (II) structure of the (A3-4) resin having an aromatic group.
  • the resin in which the structure (II) of the resin has an aromatic group is preferably a resin containing a skeleton derived from a (meth) acrylic acid ester derivative having an aromatic group or a styrene derivative.
  • the photosensitive resin composition of the present invention contains (A3-4) phenol-based modified acrylic.
  • the resin preferably contains a resin having a phenolic hydroxyl group.
  • (A3-4) Phenolic-modified acrylic resin (9) It is more preferable to contain a resin having a structure in which a group having a phenolic hydroxyl group and a group having a hydroxy group, an alkoxy group, or a carboxy group are connected by one atom. By having this structure, the effects of suppressing the residue after development and improving the halftone characteristics become remarkable.
  • the photosensitive resin composition of the present invention contains (A3-4) phenol-based modified acrylic.
  • the resin is A resin having a structure represented by the above-mentioned (I-a3-4) general formula (21) and / or It is preferable to contain the resin having the structure represented by the above-mentioned (II-3-4) general formula (22).
  • the resin (A3) having the above-mentioned structural unit (9) is a resin having the above-mentioned structure (I-a3-4) and / or a resin having the above-mentioned structure (II-a3-4). It is also preferable to have. That is, in the photosensitive resin composition of the present invention, it is also preferable that the structure of (9) is the structure of (I-a3-4) and / or the structure of (II-a3-4).
  • the total content ratio of the structural units including the structure represented by the above-mentioned general formula (22) is preferably 10 mol% or more, more preferably 20 mol% or more.
  • the content ratio of the structural unit including the structure of the above-mentioned (9), or the structural unit including the structure represented by the above-mentioned general formula (21) and the structure represented by the above-mentioned general formula (22) are included.
  • the total content ratio of the structural units is preferably 60 mol% or less, more preferably 45 mol% or less.
  • the structural unit including the structure of the above-mentioned (9), or the structural unit including the structure represented by the above-mentioned general formula (21) and the structural unit including the structure represented by the general formula (22) is one phenol. It preferably contains a skeleton derived from a phenolic compound having a sex hydroxyl group and a carboxy group, and examples of the compound include 2-hydroxybenzoic acid, 3-hydroxybenzoic acid, 4-hydroxybenzoic acid, 3-hydroxyphthalic acid and 4-. Hydroxyphthalic acid or 5-hydroxyphthalic acid is preferred.
  • the phenol group-modified acrylic resin may be a structural unit containing the structure of (9) described above, or a structural unit including the structure represented by the general formula (21) described above and the general formula (22).
  • the structural unit including the structure represented may include a skeleton derived from a phenolic compound having one phenolic hydroxyl group and a carboxy group, and a skeleton derived from a phenolic compound having at least two phenolic hydroxyl groups and a carboxy group. preferable.
  • phenolic compound having at least two phenolic hydroxyl groups and a carboxy group examples include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, 2,5-dihydroxybenzoic acid, 2,6-dihydroxybenzoic acid, 3, 5-Dihydroxybenzoic acid, 2,3,4-trihydroxybenzoic acid, or phenolic acid is preferred.
  • the structural unit including the structure (9) described above contains a skeleton derived from a copolymerization component having a phenolic hydroxyl group.
  • the copolymerization component having a phenolic hydroxyl group include (meth) acrylic acid (2-hydroxy) phenyl, (meth) acrylic acid (3-hydroxy) phenyl, (meth) acrylic acid (4-hydroxy) phenyl, and (meth).
  • Acrylic acid (2,4-dihydroxy) phenyl (meth) acrylic acid (6-hydroxy) naphthalene-1-yl, (meth) acrylic acid (6-hydroxy) naphthalene-2-yl, (meth) acrylic acid (4) -Hydroxy) Phenol-1-yl, (meth) Acrylic Acid (4-Hydroxy) Phenol-2-yl, N- (2-Hydroxyphenyl) Maleimide, N- (3-Hydroxyphenyl) Maleimide, N- (4-) Hydroxyphenyl) Maleimide, 2-vinylphenol, 3-vinylphenol, 4-vinylphenol, 2-allylphenol, 3-allylphenol, or 4-allylphenol is preferable.
  • the (A3-4) phenol group-modified acrylic resin which is the (A3) resin may contain a (A3b-4) unsaturated group-containing phenol group-modified acrylic resin having at least one ethylenically unsaturated double bond group. preferable.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the (A3b-4) unsaturated group-containing phenol group-modified acrylic resin is preferably a resin obtained by reacting a part of the acidic groups of the resin with an epoxy compound having an ethylenically unsaturated double bond group or the like.
  • a resin obtained by reacting an epoxy group or the like having a resin with a carboxylic acid compound having an ethylenically unsaturated double bond group is also preferable.
  • the carboxylic acid compound having an ethylenically unsaturated double bond group include 2-vinylacetic acid, 4-vinylbenzoic acid, crotonic acid, cinnamic acid, 2-maleimideacetic acid, 3-maleimidepropionic acid, and 4-maleimidebutanoic acid. , 6-Maleimidehexanoic acid, or (meth) acrylic acid is preferred.
  • the structural unit of the phenol group-modified acrylic resin includes a structural unit derived from an aromatic (meth) acrylic acid ester derivative or a structural unit derived from a styrene derivative from the viewpoint of improving the reliability of the light emitting element. Structural units having the aromatic group of are also preferred. Further, from the viewpoint of improving the reliability of the light emitting device, a structural unit having an alicyclic group such as a structural unit derived from an alicyclic (meth) acrylic acid ester derivative is also preferable.
  • the Mw of the (A3-4) phenol group-modified acrylic resin is preferably 1,000 or more, more preferably 3,000 or more, in terms of polystyrene measured by GPC, from the viewpoint of improving the reliability of the light emitting device. On the other hand, the Mw is preferably 50,000 or less, more preferably 20,000 or less, from the viewpoint of suppressing the residue after development and reducing the taper of the pattern shape.
  • the phenol group-modified acrylic resin can be synthesized by a known method.
  • the total content ratio of (A3) resin in the total 100% by mass of (A) alkali-soluble resin suppresses narrow mask bias after development and reduces the taper of the pattern shape.
  • 3% by mass or more is preferable, 5% by mass or more is more preferable, 10% by mass or more is further preferable, 15% by mass or more is further preferable, and 20% by mass or more is particularly preferable.
  • the total content ratio of the (A3) resin is preferably 85% by mass or less, more preferably 75% by mass or less, still more preferably 65% by mass or less, from the viewpoint of suppressing the residue after development and improving the halftone characteristics. , 60% by mass or less is even more preferable, and 55% by mass or less is particularly preferable.
  • the total content ratio of the (A3x) resin, the (A3y) resin, and the (A3z) resin to the total 100% by mass of the (A) alkali-soluble resin is narrow after development. From the viewpoint of suppressing mask bias and reducing the taper of the pattern shape, 3% by mass or more is preferable, 5% by mass or more is more preferable, 10% by mass or more is further preferable, 15% by mass or more is even more preferable, and 20% by mass is 20% by mass. The above is particularly preferable.
  • the total content ratio of the (A3x) resin, the (A3y) resin, and the (A3z) resin is preferably 65% by mass or less, preferably 60% by mass or less, from the viewpoint of suppressing the residue after development and improving the halftone characteristics. Is more preferable, 55% by mass or less is further preferable, 50% by mass or less is even more preferable, and 45% by mass or less is particularly preferable.
  • the total content ratio of the (A3x) resin in the total 100% by mass of the (A) alkali-soluble resin suppresses the narrow mask bias after development and reduces the taper of the pattern shape.
  • 3% by mass or more is preferable, 5% by mass or more is more preferable, 10% by mass or more is further preferable, 15% by mass or more is further preferable, and 20% by mass or more is particularly preferable.
  • the total content ratio of the (A3x) resin is preferably 65% by mass or less, more preferably 60% by mass or less, still more preferably 55% by mass or less, from the viewpoint of suppressing the residue after development and improving the halftone characteristics. , 50% by mass or less is even more preferable, and 45% by mass or less is particularly preferable.
  • the total content ratio of the (A3y) resin to the total 100% by mass of the (A) alkali-soluble resin is the suppression of narrow mask bias after development and the reduction of the taper of the pattern shape. From the above viewpoint, 3% by mass or more is preferable, 5% by mass or more is more preferable, 10% by mass or more is further preferable, 15% by mass or more is further preferable, and 20% by mass or more is particularly preferable.
  • the total content ratio of the (A3y) resin is preferably 65% by mass or less, more preferably 60% by mass or less, still more preferably 55% by mass or less, from the viewpoint of suppressing the residue after development and improving the halftone characteristics. , 50% by mass or less is even more preferable, and 45% by mass or less is particularly preferable.
  • the total content ratio of the (A1) resin to the total 100% by mass of the (A) alkali-soluble resin is preferably 5% by mass or more, more preferably 10% by mass or more. 20% by mass or more is more preferable.
  • the total content ratio of the (A1) resin is preferably 65% by mass or less, more preferably 55% by mass or less, still more preferably 45% by mass or less.
  • the total content ratio of the (A2) resin to the total 100% by mass of the (A) alkali-soluble resin is preferably 5% by mass or more, more preferably 10% by mass or more. 20% by mass or more is more preferable.
  • the total content ratio of the (A2) resin is preferably 65% by mass or less, more preferably 55% by mass or less, still more preferably 45% by mass or less.
  • the content ratio of the (A) alkali-soluble resin in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is 10% by mass or more from the viewpoint of improving the halftone characteristics and the reliability of the light emitting element. Is preferable, 20% by mass or more is more preferable, and 25% by mass or more is further preferable.
  • the content ratio of the alkali-soluble resin (A) is preferably 75% by mass or less, more preferably 65% by mass or less, and further preferably 55% by mass or less, from the viewpoint of improving the sensitivity during exposure and suppressing the residue after development. preferable.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a radically polymerizable compound
  • the content of the (A) alkali-soluble resin in the photosensitive resin composition of the present invention is preferably 25 parts by mass or more from the viewpoint of improving halftone characteristics and reliability of the light emitting element when the total of (A) alkali-soluble resin and (B) radically polymerizable compound is 100 parts by mass. 35 parts by mass or more is more preferable, and 45 parts by mass or more is further preferable.
  • the content of the alkali-soluble resin (A) is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and further preferably 75 parts by mass or less from the viewpoint of improving sensitivity during exposure and suppressing residue after development. preferable.
  • the photosensitive resin composition of the present invention preferably further contains (B) a radically polymerizable compound.
  • the radically polymerizable compound means a compound having at least two ethylenically unsaturated double bond groups.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • radical polymerization of (B) the radically polymerizable compound proceeds by radicals generated from the (C1) photopolymerization initiator described later, and the exposed portion of the film of the composition becomes insoluble in the alkaline developing solution. A negative pattern can be formed.
  • UV curing during exposure is promoted, and the effect of improving sensitivity during exposure becomes remarkable.
  • the ethylenically unsaturated double bond group preferably has a (meth) acryloyl group from the viewpoint that radical polymerization can easily proceed.
  • the double bond equivalent of the radically polymerizable compound is preferably 80 g / mol or more, more preferably 90 g / mol or more, from the viewpoint of reducing the taper of the pattern shape.
  • the double bond equivalent is preferably 800 g / mol or less, more preferably 600 g / mol or less, from the viewpoint of improving sensitivity during exposure.
  • the content of the (B) radically polymerizable compound in the photosensitive resin composition of the present invention is
  • the total of (A) alkali-soluble resin and (B) radically polymerizable compound is 100 parts by mass, 15 parts by mass or more is preferable from the viewpoint of improving sensitivity during exposure and suppressing residue after development. More than parts by mass is more preferable, and more than 25 parts by mass is even more preferable.
  • the content of the radically polymerizable compound (B) is preferably 75 parts by mass or less, more preferably 65 parts by mass or less, and further preferably 55 parts by mass or less from the viewpoint of improving the halftone characteristics and the reliability of the light emitting element. preferable.
  • the photosensitive resin composition of the present invention further contains (B1) a hydrophobic skeleton-containing radically polymerizable compound (hereinafter, “(B1) compound”), and the (B1) compound has a (I-b1) fluorene structure.
  • (B1) compound a hydrophobic skeleton-containing radically polymerizable compound
  • (B1) compound has a (I-b1) fluorene structure.
  • Indan structure condensed polycyclic alicyclic structure, indolinone structure, and structure containing at least one selected from the group consisting of isoindolinone structure (hereinafter, "specific hydrophobicity of (I-b1) (B1) compound”.
  • (II-b1) structure It has a structure including a skeleton ”) and an organic group having (II-b1) an ethylenically unsaturated double bond group (hereinafter,“ (II-b1) structure ”), and has a (II-b1) structure. It is preferable to have at least two.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the ethylenically unsaturated double bond group preferably has a (meth) acryloyl group.
  • the compound (B1) has a structure containing a specific hydrophobic skeleton of the above-mentioned compounds (I-b1) and (B1) having the general formulas (141) to (141). It is preferable that the structure is represented by any one of (147).
  • X 201 to X 208 independently represent a monocyclic or condensed polycyclic hydrocarbon ring.
  • Each of X 210 to X 214 independently represents an aliphatic structure having 1 to 6 carbon atoms.
  • Y 201 and Y 209 independently represent a direct bond, a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom.
  • R 301 to R 309 each independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R 310 to R 316 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R 317 and R 318 each independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • a, b, c, d, e, f, and g each independently represent an integer of 0 to 4.
  • h and i each independently represent an integer of 0 to 3. If Y 201 is a direct bond, an oxygen atom, or a sulfur atom, j is 0. When Y 201 is a nitrogen atom, j is 1.
  • Y 201 is a carbon atom
  • j is 2.
  • Y 209 is a direct bond, an oxygen atom, or a sulfur atom
  • k is 0.
  • k is 1.
  • k is 2.
  • l and m each independently represent an integer of 0 to 14.
  • n represents an integer of 0 to 2.
  • * 1 to * 15 each independently represent a connection point with the above-mentioned (II-b1) structure.
  • X 201 to X 208 are preferably monocyclic or condensed polycyclic hydrocarbon rings having 6 to 15 carbon atoms independently.
  • Y 201 and Y 209 are each independently preferably directly bonded or oxygen atom.
  • the above-mentioned aliphatic structure, alkyl group, cycloalkyl group, aryl group, and monocyclic or condensed polycyclic aromatic hydrocarbon ring may have a heteroatom, and may have a heteroatom, either an unsubstituted or a substituted compound. It doesn't matter.
  • the compound (B1) includes a structure containing a specific hydrophobic skeleton of the compounds (I-b1) and (B1) from the viewpoints of suppressing residue after development, reducing the taper of the pattern shape, and improving the halftone characteristics, (II).
  • -B1) Has a structure, and further (III-b1) One or more selected from the group consisting of an alkylene carbonyl group, an oxyalkylene carbonyl group, and an aminoalkylene carbonyl group (hereinafter, "specific flexible skeleton A of (III-b1) (B1) compound").
  • (IV-b1) An alkylene group containing a hydroxy group and / or an oxyalkylene group containing a hydroxy group (hereinafter, "specific flexible skeleton B of (IV-b1) (B1) compound"). It is more preferable to have.
  • (B1) As the total number of specific flexible skeletons A and specific flexible skeletons B contained in the compound, two or more are preferable, three or more are more preferable, and four or more are further preferable. On the other hand, the total number of the specific flexible skeletons A and the specific flexible skeletons B is preferably 10 or less, more preferably 8 or less, still more preferably 6 or less.
  • the specific flexible skeleton A a structure derived from a lactone compound or a structure derived from a lactam compound is preferable.
  • the compound (B1) has a specific flexible skeleton A of the (III-b1) (B1) compound or a specific flexible skeleton B of the (IV-b1) (B1) compound, the above-mentioned general formulas (141) to (147) are described above. ),
  • Each of * 1 to * 15 independently has a binding point with the above-mentioned (II-b1) structure, and a binding point with the specific flexible skeleton A of the above-mentioned (III-b1) (B1) compound.
  • the above-mentioned (IV-b1) (B1) compound represents the binding point of the above-mentioned (IV-b1) (B1) compound with a specific flexible skeleton B.
  • the compound (B1) has a structure represented by the general formula (157) described later, it has a specific flexible skeleton A of the above-mentioned (III-b1) and (B1) compounds.
  • X 231 represents an alkylene group having 1 to 10 carbon atoms including a hydroxy group
  • the above-mentioned (IV-b1) ( B1) It has a specific flexible skeleton B of the compound.
  • * 1 and * 2 each independently represent a binding point of the above-mentioned (I-b1) (B1) compound with a structure containing a specific hydrophobic skeleton.
  • * 3 and * 4 each independently represent a connection point with the above-mentioned (II-b1) structure.
  • * 1 and * 2 are preferably the bond points with the oxygen atoms in the above-mentioned general formulas (141) to (147) independently of each other.
  • the double bond equivalent of the compound (B1) is preferably 150 g / mol or more, more preferably 190 g / mol or more, from the viewpoint of reducing the taper of the pattern shape and improving the halftone characteristics.
  • the double bond equivalent is preferably 600 g / mol or less, more preferably 400 g / mol or less, from the viewpoint of suppressing the residue after development.
  • the content of the (B1) compound in the photosensitive resin composition of the present invention is (A).
  • the total of the alkali-soluble resin and the (B) radically polymerizable compound is 100 parts by mass, 5 parts by mass or more is preferable and 10 parts by mass or more is preferable from the viewpoint of reducing the taper of the pattern shape and improving the halftone characteristics. Is more preferable.
  • the content of the compound (B1) is preferably 25 parts by mass or less, more preferably 20 parts by mass or less, from the viewpoint of suppressing the residue after development.
  • the photosensitive resin composition of the present invention further contains (B2) a flexible skeleton-containing radically polymerizable compound (hereinafter, “(B2) compound”), and the (B2) compound is (I-b2) at least two.
  • (B2) compound a flexible skeleton-containing radically polymerizable compound
  • the structure derived from the compound having at least two hydroxy groups is a structure derived from the (I-b2x) aliphatic polyfunctional alcohol from the viewpoint of suppressing the residue after development and improving the halftone characteristics.
  • a structure containing one or more selected from the group consisting of an alicyclic structure and a heteroaliphatic structure (hereinafter, "a structure containing a specific aliphatic skeleton (I-b2x)") is more preferable.
  • the ethylenically unsaturated double bond group is preferably a radically polymerizable group.
  • the ethylenically unsaturated double bond group preferably has a (meth) acryloyl group.
  • the compound (B2) has a structure containing the above-mentioned (I-b2x) specific aliphatic skeleton according to any one of the general formulas (151) to (154). It is preferable that the structure is represented by.
  • X 221 to X 228 independently represent an aliphatic structure having 1 to 6 carbon atoms.
  • R 321 to R 325 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group having 4 to 10 carbon atoms.
  • a and b each independently represent an integer of 0 to 5.
  • * 1 to * 16 each independently represent a binding point with the above-mentioned (II-b2) structure or a binding point with the above-mentioned flexible skeleton of the (III-b2) (B2) compound.
  • the above-mentioned aliphatic structure, alkyl group, and cycloalkyl group may have a heteroatom and may be an unsubstituted or substituted product.
  • the compound (B2) contains the compound having a structure containing the above-mentioned (I-b2x) specific aliphatic skeleton
  • the compound (B2) is further described above (B2) from the viewpoint of reducing the taper of the pattern shape.
  • I-b2) As a structure derived from a compound having at least two hydroxy groups, it is preferable to contain a compound having a structure represented by the general formula (155).
  • X 229 and X 230 each independently represent an aliphatic structure having 1 to 6 carbon atoms.
  • Y 229 represents a direct bond, a nitrogen atom, or an oxygen atom.
  • R326 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group having 4 to 10 carbon atoms. If Y 229 is a direct bond or an oxygen atom, a is 0. When Y 229 is a nitrogen atom, a is 1.
  • * 1 and * 2 each independently represent the binding point of the above-mentioned (III-b2) (B2) compound with a specific flexible skeleton.
  • the above-mentioned aliphatic structure may have a heteroatom and may be an unsubstituted or substituted product.
  • the compound (B2) is composed of a (III-b2x) alkylene carbonyl group, an oxyalkylene carbonyl group, and an aminoalkylene carbonyl group from the viewpoint of suppressing residue after development, reducing the taper of the pattern shape, and improving the halftone characteristics. It is more preferable to have one or more kinds selected from the group (hereinafter, "specific flexible skeleton of (III-b2x) (B2) compound").
  • the number of flexible skeletons such as the flexible skeleton of the (III-b2) (B2) compound or the specific flexible skeleton of the (III-b2x) (B2) compound of the (B2) compound is preferably 2 or more, preferably 3 or more.
  • the number of flexible skeletons is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less.
  • the alkylene group and the oxyalkylene group preferably have a structure derived from an epoxy compound or a structure derived from an alkylene glycol.
  • the specific flexible skeleton of the (III-b2x) (B2) compound a structure derived from a lactone compound or a structure derived from a lactam compound is preferable.
  • the compound (B2) is selected from the group consisting of the above-mentioned alkylene group, oxyalkylene group, alkylenecarbonyl group, oxyalkylenecarbonyl group, and aminoalkylenecarbonyl group from the viewpoint of suppressing residue after development and improving halftone characteristics. It is preferable that one or more of the above types are one or more selected from the group consisting of the structures represented by the general formulas (156) and (157).
  • X 231 and X 232 each independently represent an alkylene group having 1 to 10 carbon atoms or an alkylene group having 1 to 10 carbon atoms including a hydroxy group.
  • Y 231 and Y 232 independently represent a direct bond, a nitrogen atom, or an oxygen atom.
  • R327 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group having 4 to 10 carbon atoms.
  • a and b each independently represent an integer of 1 to 4. If Y 232 is a direct bond or an oxygen atom, c is 0. When Y 232 is a nitrogen atom, c is 1.
  • * 1 and * 2 each independently represent a bonding point with a structure derived from the compound having at least two hydroxy groups (I-b2) described above.
  • * 3 and * 4 each independently represent a connection point with the above-mentioned (II-b2) structure.
  • * 1 and * 2 are the bond points with the oxygen atoms in the general formulas (151) to (154) independently of each other.
  • the above-mentioned alkylene group, alkyl group, and cycloalkyl group may have a heteroatom and may be an unsubstituted or substituted product.
  • the compound (B2) has a structure represented by the general formula (157), it has a specific flexible skeleton of the above-mentioned (III-b2x) (B2) compound.
  • the number of ethylenically unsaturated double bond groups (B2) contained in the compound is preferably 2 or more, more preferably 3 or more, and further 4 or more, from the viewpoint of suppressing residue after development and improving halftone characteristics. preferable.
  • the number of ethylenically unsaturated double bond groups is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less, from the viewpoint of reducing the taper of the pattern shape.
  • the double bond equivalent is preferably 100 g / mol or more, more preferably 120 g / mol or more, from the viewpoint of reducing the taper of the pattern shape.
  • the double bond equivalent is preferably 600 g / mol or less, more preferably 400 g / mol or less, from the viewpoint of suppressing the residue after development and improving the halftone characteristics.
  • the compound (B2) includes a compound having at least three (II-b2) structures and two (II-b2) compounds from the viewpoints of suppressing residue after development, reducing the taper of the pattern shape, and improving halftone characteristics. It is more preferable to contain a compound having a structure.
  • the content of the (B2) compound in the photosensitive resin composition of the present invention is (A).
  • the total of the alkali-soluble resin and the radically polymerizable compound is 100 parts by mass, 10 parts by mass or more is preferable, and 20 parts by mass or more is preferable from the viewpoint of suppressing the residue after development and improving the halftone characteristics. More preferred.
  • the content of the compound (B2) is preferably 40 parts by mass or less, more preferably 35 parts by mass or less, from the viewpoint of reducing the taper of the pattern shape.
  • the photosensitive resin composition according to the first aspect, the second aspect, the fifth aspect, the seventh aspect, and the eighth aspect of the present invention contains (C) a photosensitive agent.
  • the photosensitive agent is a compound that imparts positive or negative photosensitive to the composition by causing bond cleavage, reaction, or structural change to generate another compound by exposure.
  • the (C) photosensitive agent preferably contains one or more selected from the group consisting of (C1) photopolymerization initiator, (C2) photoacid generator, and (C3) naphthoquinone diazide compound.
  • (C1) photopolymerization initiator or (C1) a photopolymerization initiator and (C2) a photoacid generator.
  • When imparting positive photosensitivity it is preferable to contain (C3) a naphthoquinone diazide compound, or (C3) a naphthoquinone diazide compound and (C2) a photoacid generator.
  • the content ratio of the (C) photosensitive agent in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is preferably 0.3% by mass or more, preferably 1.0, from the viewpoint of improving the sensitivity during exposure.
  • the mass% or more is more preferable, and 2.0% by mass or more is further preferable.
  • the content ratio of the (C) photosensitive agent is preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less, from the viewpoint of suppressing the residue after development.
  • (C) the photosensitive agent contains (C1) a photopolymerization initiator.
  • the (C) photosensitive agent contains (C1) a photopolymerization initiator.
  • the photopolymerization initiator is a compound that undergoes bond cleavage and / or reaction to generate radicals upon exposure.
  • (C1) It is suitable for forming a negative type pattern to contain a photopolymerization initiator. Even if the amount of radicals generated from the (C1) photopolymerization initiator at the time of exposure is small, the radical polymerization of the above-mentioned (B) radically polymerizable compound and the like proceeds in a chain reaction, so that the light with a low exposure amount is used. It is suitable for forming a negative pattern of the above, and the effect of improving the sensitivity at the time of exposure becomes remarkable.
  • Examples of the photopolymerization initiator include a benzyl ketal-based photopolymerization initiator, an ⁇ -hydroxyketone-based photopolymerization initiator, an ⁇ -aminoketone-based photopolymerization initiator, an acylphosphine oxide-based photopolymerization initiator, and a biimidazole-based photoinitiator.
  • Polymerization initiators oxime ester-based photopolymerization initiators, aclysine-based photopolymerization initiators, titanosen-based photopolymerization initiators, benzophenone-based photopolymerization initiators, acetophenone-based photopolymerization initiators, aromatic ketoester-based photopolymerization initiators, or A benzoic acid ester-based photopolymerization initiator is preferable, and from the viewpoint of improving sensitivity during exposure, an ⁇ -hydroxyketone-based photopolymerization initiator, an ⁇ -aminoketone-based photopolymerization initiator, an acylphosphine oxide-based photopolymerization initiator, and biimidazole.
  • a system photopolymerization initiator or an oxime ester-based photopolymerization initiator is more preferable, and an oxime ester-based photopolymerization initiator is further preferable from the viewpoint of improving sensitivity during exposure and suppressing residue after development.
  • the content ratio of the (C1) photopolymerization initiator in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is preferably 0.3% by mass or more from the viewpoint of improving the sensitivity during exposure. It is more preferably 0.0% by mass or more, and further preferably 2.0% by mass or more.
  • the content ratio of the (C1) photopolymerization initiator is preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less, from the viewpoint of suppressing the residue after development.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a radically polymerizable compound
  • the photosensitive resin composition of the present invention contains (C1) a photopolymerization initiator.
  • the amount of the (A) alkali-soluble resin and (B) radically polymerizable compound is 100 parts by mass, the amount is preferably 1 part by mass or more, more preferably 3 parts by mass or more, from the viewpoint of improving sensitivity during exposure. It is preferable, and more preferably 5 parts by mass or more.
  • the content of the (C1) photopolymerization initiator is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, still more preferably 20 parts by mass or less, from the viewpoint of suppressing the residue after development.
  • the (C1) photopolymerization initiator contains (C1-1) an oxime ester-based photopolymerization initiator (hereinafter, "(C1-1) compound").
  • the (C1-1) compound refers to a compound having an oxime ester structure as a skeleton that generates radicals by bond cleavage and / or reaction by exposure. By containing the compound (C1-1), the effects of improving the sensitivity during exposure and suppressing the residue after development become remarkable.
  • the (C1) photopolymerization initiator contains the (C1-1) compound from the viewpoint of improving the sensitivity at the time of exposure and suppressing the residue after development, and further described above (C1).
  • the (C1-1) compound preferably has a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or a diphenylsulfide structure from the viewpoint of improving sensitivity during exposure and suppressing residues after development. Further, it may have a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or a diphenyl sulfide structure to which at least one oxime ester structure is bonded, or a structure in which at least one oxime ester carbonyl structure is bonded. It is preferable to have a structure in which at least one oxime ester structure is bonded.
  • a fluorene structure, a benzofluorene structure, a dibenzofluorene structure, an indene structure, an indane structure, a benzoinden structure, or a benzoindan structure is preferable, and a fluorene structure, a benzofluorene structure, or a dibenzofluorene structure is more preferable. ..
  • a carbazole structure, a dibenzofuran structure, a dibenzothiophene structure, a benzocarbazole structure, an indole structure, an indole structure, a benzoindole structure, or a benzoindole structure is preferable, and a carbazole structure, a benzocarbazole structure, and an indole structure are preferable. , Or a benzoindol structure is more preferred.
  • the compound (C1-1) includes a nitro group, a naphthylcarbonyl structure, a trimethylbenzoyl structure, a thiophenylcarbonyl structure, a frillcarbonyl structure, and at least two oximes from the viewpoint of improving sensitivity during exposure and suppressing residues after development. It is preferable to have one or more selected from the group consisting of ester structures. Above all, it is preferable to have a structure in which these structures are bonded to a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, or a diphenyl sulfide structure.
  • the (C) photosensitive agent contains (C1) a photopolymerization initiator, the (C1) photopolymerization initiator contains a (C1-1) compound, and (C1-1).
  • the compound preferably has at least one selected from the group consisting of a nitro group, a naphthylcarbonyl structure, a trimethylbenzoyl structure, a thiophenylcarbonyl structure, a frillcarbonyl structure, and at least two oxime ester structures.
  • the (C1-1) compound preferably has at least one selected from the group consisting of a fluorene structure, a benzofluorene structure, and a dibenzofluorene structure. Since the (C1-1) compound has these structures, the (C1-1) compound has photobleaching properties, so that the effects of improving the sensitivity during exposure, suppressing the residue after development, and improving the halftone characteristics can be obtained. It becomes remarkable. Photobleaching property means that the absorbance at a wavelength in the ultraviolet region (for example, 400 nm or less) and / or the absorbance at a wavelength of visible light (380 to 780 nm) decreases due to bond cleavage and / or reaction by exposure. say.
  • the compound (C1-1) preferably has a diphenyl sulfide structure, an indole structure, or a benzoindol structure, and has a condensed polycyclic structure or a condensed polycyclic heterocycle. It is also preferable to have a structure in which an oxime ester carbonyl structure is bonded (that is, a structure in which an oxime ester structure is bonded via a carbonyl structure; a ⁇ -oxime structure).
  • the compound (C1-1) preferably has a group substituted with a halogen atom, and more preferably has a group substituted with a fluorine atom, from the viewpoint of improving sensitivity during exposure and suppressing residue after development. preferable.
  • the above-mentioned (A) alkali-soluble resin contains a structural unit having a halogen atom, the sensitivity at the time of exposure is improved, the narrow mask bias is suppressed after development, and the halftone is improved by improving the compatibility between the resin and the photopolymerization initiator. The effect of improving the characteristics becomes remarkable.
  • the above-mentioned (A1-1) polyimide, (A1-2) polyimide precursor, (A1-3) polybenzoxazole, (A1-4) polybenzoxazole precursor, and (A1-5) polyamideimide are It is preferable to contain the structural unit having the above-mentioned fluorine atom.
  • Groups substituted with halogen atoms include trifluoromethyl group, trifluoropropyl group, trichloropropyl group, tetrafluoropropyl group, fluorocyclopentyl group, fluorophenyl group, pentafluorophenyl group, trifluoropropoxy group and tetrafluoropropoxy. Groups or pentafluorophenoxy groups are preferred.
  • (C1-1) compound a compound having the following structure is preferable.
  • the content ratio of the compound (C1-1) in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is preferably 0.3% by mass or more from the viewpoint of improving the sensitivity during exposure. 0% by mass or more is more preferable, and 2.0% by mass or more is further preferable. On the other hand, the content ratio of the (C1-1) compound is preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less, from the viewpoint of suppressing the residue after development.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a radically polymerizable compound, the content of the (C1-1) compound in the photosensitive resin composition of the present invention is contained.
  • the total of (A) alkali-soluble resin and (B) radically polymerizable compound is 100 parts by mass, 1 part by mass or more is preferable and 3 parts by mass or more is more preferable from the viewpoint of improving sensitivity at the time of exposure. More than 5, parts by mass is more preferable.
  • the content of the (C1-1) compound is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, still more preferably 20 parts by mass or less, from the viewpoint of suppressing the residue after development.
  • the (C) photosensitive agent may contain (C2) a photoacid generator.
  • the photoacid generator refers to a compound that generates an acid by binding cleavage and / or reacting with exposure. Even if the amount of acid generated from the (C2) photoacid generator at the time of exposure is small, the cationic polymerization of a cationically polymerizable compound such as the (G) cross-linking agent described later and / or the (G) cross-linking described later.
  • the (C) photosensitive agent contains the above-mentioned (C1) photopolymerization initiator and (C2) photoacid generator.
  • the (C) photosensitive agent contains the (C3) naphthoquinone diazide compound and (C2) photoacid generator described later, the acid is removed from the (C2) photoacid generator during exposure after alkaline development and before heat curing. Can occur.
  • the generated acid can promote the cross-linking between the resin and the heat-reactive compound such as (C) cross-linking agent described later at the time of the subsequent heat curing, the heat resistance of the cured film and the chemical resistance of the cured film are improved. The effect becomes remarkable.
  • Examples of the (C2) photoacid generator include ionic compounds and non-ionic compounds.
  • the ionic compound a triorganosulfonium salt-based compound is preferable.
  • the nonionic compound a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonic acid ester compound, a carboxylic acid ester compound, a sulfonimide compound, a phosphoric acid ester compound, or a sulfone benzotriazole compound is preferable.
  • the (C) photosensitive agent may contain (C3) a naphthoquinone diazide compound.
  • the naphthoquinone diazide compound refers to a compound that undergoes a structural change upon exposure to generate indene carboxylic acid and / or sulfoinden carboxylic acid.
  • a positive pattern can be formed by solubilizing the exposed portion of the film of the composition with an alkaline developer due to the acidic compound in which the (C3) naphthoquinone diazide compound has undergone a structural change during exposure.
  • the solubility of the exposed portion in the alkaline developer is selectively improved, and the effect of improving the resolution after development becomes remarkable.
  • the (C3) naphthoquinone diazide compound a compound in which a compound having a phenolic hydroxyl group and a naphthoquinone diazido sulfonic acid are ester-bonded is preferable.
  • a compound obtained by subjecting a compound having a phenolic hydroxyl group to an esterification reaction of naphthoquinonediazide sulfonic acid chloride is also preferable.
  • the naphthoquinone diazide sulfonic acid chloride 5-naphthoquinone diazido sulfonic acid chloride or 4-naphthoquinone diazido sulfonic acid chloride is preferable.
  • the photosensitive resin composition of the present invention preferably further contains (D) a colorant.
  • the colorant refers to a compound that colors by absorbing light having a wavelength of visible light (380 to 780 nm).
  • the light transmitted through the film of the composition or the light reflected from the film of the composition can be colored in a desired color.
  • light-shielding properties can be imparted to the film of the composition.
  • (D) colorant (D1) pigment, (D2) dye and the like are preferable.
  • the blackening agent refers to a compound that blackens by absorbing light having a wavelength of visible light.
  • the film of the composition containing (Da) blackening agent is suitable for applications requiring high contrast by suppressing external light reflection, prevention of light leakage from adjacent pixels, prevention of malfunction of TFT, and the like, and is suitable for organic EL.
  • a pixel dividing layer a TFT flattening layer, a TFT protective layer, an interlayer insulating layer, or a gate insulating layer of a display. It is also preferable as a black matrix or a black column spacer.
  • a blackening agent may be contained, and
  • a coloring agent other than black may be further contained.
  • Db By containing a colorant other than black, the film of the composition can be toned to a desired color coordinate.
  • the (D2) dye refers to a compound that chemically adsorbs the surface structure of an object to color it, and is generally soluble in a solvent or the like.
  • Examples of the (D2) dye include anthraquinone dyes, azo dyes, azine dyes, phthalocyanine dyes, methine dyes, oxazine dyes, quinoline dyes, indigo dyes, indigoid dyes, carbonium dyes, and slene.
  • Examples thereof include dyes, perinone dyes, perylene dyes, triarylmethane dyes, and xanthene dyes.
  • the black color in the colorant means that "BLACK” is contained in Color Index Generic Name (hereinafter, "CI number").
  • the black color in the case of a cured film means that (D) the transmittance per 1.0 ⁇ m film thickness at a wavelength of 550 nm in the transmission spectrum of the cured film of the composition containing the colorant is based on the Lambert-Vale equation.
  • the transmittance at a wavelength of 550 nm is 10%
  • the transmittance at a wavelength of 450 to 650 nm in the converted transmission spectrum is 25% or less.
  • the transmission spectrum of the cured film can be obtained based on the method described in International Publication No. 2019/087958.
  • the content ratio of the (D) colorant in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is preferably 5% by mass or more from the viewpoint of improving the light-shielding property and the reliability of the light emitting element. , 20% by mass or more is more preferable, and 30% by mass or more is further preferable.
  • the content ratio of the (D) colorant is preferably 70% by mass or less, more preferably 50% by mass or less, from the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the light emitting element.
  • the preferable content ratio of the (Da) blackening agent is the same as the preferable content ratio of the (D) colorant described above.
  • the (Da) black agent contains (D1a) a black pigment.
  • the black pigment refers to a pigment that blackens by absorbing light having a wavelength of visible light.
  • the pigment refers to a compound that colors the surface of an object by physical adsorption or interaction, and is generally insoluble in a solvent or the like.
  • D1a By containing the black pigment, the effects of improving the light-shielding property of the film of the composition and improving the reliability of the light emitting element become remarkable.
  • the (D1a) black pigment is a (D1a-1) black organic pigment and / or (D1a-2) black inorganic pigment described later
  • a pigment other than (D1b) black may be further contained.
  • the pigment other than black is preferably one or more selected from the group consisting of a blue pigment, a red pigment, a yellow pigment, a purple pigment, an orange pigment, and a green pigment, which will be described later.
  • the preferable content ratio of the (D1a) black pigment is the same as the preferable content ratio of the (D) colorant described above.
  • the (D1a) black pigment comprises (D1a-1) a black organic pigment, (D1a-2) a black inorganic pigment, and (D1a-3) a mixture of two or more colored pigments. It is preferably one or more selected from the group, and from the viewpoint of low voltage drive of light emitting characteristics and improvement of reliability of light emitting element, (D1a-1) black organic pigment and / or (D1a-3) two colors.
  • the above colored pigment mixture is more preferable, and (D1a-1) black organic pigment is further preferable.
  • Examples of the (D1a-1) black organic pigment include benzofuranone-based black pigment, perylene-based black pigment, azo-based black pigment, anthraquinone-based black pigment, aniline-based black pigment, azomethine-based black pigment, and carbon black.
  • Examples of the black inorganic pigment include fine particles and oxides in a graphite or silver-tin alloy, or a metal such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, or silver. , Composite oxides, sulfides, sulfates, nitrates, carbonates, nitrides, carbides, or oxynitrides.
  • the color pigment mixture of two or more colors means a pigment mixture that makes a pseudo black color by combining two or more colors of pigments. Since two or more pigments are mixed, the film of the composition can be toned to the desired color coordinates.
  • the photosensitive composition of the present invention further contains (D1a-1) a black organic pigment and / or (D1a-3) a mixture of two or more colored pigments.
  • the (D1a-1) black organic pigment is one or more selected from the group consisting of (D1a-1a) benzofuranone-based black pigment, (D1a-1b) perylene-based black pigment, and (D1a-1c) azo-based black pigment.
  • Including, (D1a-3) It is preferable that the mixture of two or more colored pigments contains two or more colors selected from the group consisting of red, orange, yellow, green, blue and purple pigments.
  • the photosensitive resin composition of the present invention contains the above-mentioned (A3) resin as the (D1a) black pigment having high light-shielding properties, the effect of suppressing the residue after development is remarkable. Become. In addition, the effects of improving the reliability of the light emitting element in the organic EL display and driving the light emitting element to a low voltage become remarkable. It is considered that this is because the above-mentioned interaction between the (A3) resin and the (Da) blackening agent improved the solubility of the (Da) blackening agent in the alkaline developer on the substrate surface.
  • the mixture of two or more colored pigments preferably contains two or more colors selected from the group consisting of red, orange, yellow, green, blue, and purple pigments.
  • the (D1a-3) color pigment mixture having two or more colors (Id1) a color pigment mixture containing a blue pigment, a red pigment, and a yellow pigment, from the viewpoint of improving the light-shielding property and improving the sensitivity at the time of exposure, (D1a-3).
  • II-d1) Colored pigment mixture containing blue pigment, red pigment, and orange pigment
  • III-d1 Colored pigment mixture containing blue pigment, purple pigment, and orange pigment
  • the blue pigment is C.I. I. Pigment Blue 15: 4, C.I. I. Pigment Blue 15: 6, or C.I. I. Pigment Blue 60 is preferable, and C.I. I. Pigment Red 123, C.I. I. Pigment Red 149, C.I. I. Pigment Red 177, C.I. I. Pigment Red 179, or C.I. I. Pigment Red 190 is preferable, and C.I. I. Pigment Yellow 120, C.I. I. Pigment Yellow 151, C.I. I. Pigment Yellow 175, C.I. I. Pigment Yellow 180, C.I. I. Pigment Yellow 181 and C.I. I.
  • Pigment Yellow 192 or C.I. I. Pigment Yellow 194 is preferable, and C.I. I. Pigment Violet 19, C.I. I. Pigment Violet 29, or C.I. I. Pigment Violet 37 is preferable, and C.I. I. Pigment Orange 43, C.I. I. Pigment Orange 64, or C.I. I. Pigment Orange 72 is preferred (all numbers are CI numbers).
  • the total content ratio of (D1a-1) black organic pigment, (D1a-2) black inorganic pigment, and (D1a-3) two or more colored pigment mixtures is described above.
  • D The content ratio of the colorant is as shown.
  • the photosensitive resin composition of the present invention is a (D1a-1) black organic pigment from the viewpoints of suppressing narrow mask bias after development, improving halftone characteristics, driving light emission characteristics to a low voltage, and improving reliability of light emitting elements.
  • a (D1a-1) black organic pigment from the viewpoints of suppressing narrow mask bias after development, improving halftone characteristics, driving light emission characteristics to a low voltage, and improving reliability of light emitting elements.
  • the specific (D1a) black pigment is superior in light-shielding property per unit content ratio of the pigment in the composition as compared with a general organic pigment, and has a high transmittance at a wavelength in the ultraviolet region (for example, 400 nm or less). Therefore, the effects of improving the light-shielding property and improving the sensitivity at the time of exposure become remarkable. In addition, the effect of driving the light emitting element to a low voltage in the organic EL display becomes remarkable. Further, since it is excellent in insulating property and low dielectric property as compared with general organic pigments and inorganic pigments, the effect of improving the reliability of the light emitting element becomes remarkable.
  • the specific (D1a) black pigment suitable for combination with the above-mentioned (A3) resin has a high light-shielding property at the wavelength of visible light of the pigment and a wavelength in the ultraviolet region of the pigment.
  • (D1a-1a) benzofuranone-based black pigment is particularly preferable.
  • the benzofuran-based black pigment has a benzofuran-2 (3H) -on structure or a benzofuran-3 (2H) -on structure, and is a compound represented by the general formula (161) or (162). Those geometric isomers, their salts, or salts of those geometric isomers are preferred.
  • R 341 to R 344 independently represent a hydrogen atom, a halogen atom, and an alkyl group having 1 to 10 carbon atoms.
  • R 345 to R 348 are independently halogen atoms, R 353 , COOH, COOR 353 , COO- , CONH 2 , CONHR 353 , CONR 353 R 354 , CN, OH, OR 353 , OCOR 353 , OCON2 , respectively.
  • the plurality of R 345 to R 348 may be directly bonded to each other, or may form a ring by an oxygen atom bridge, a sulfur atom bridge, an NH bridge, or an NR 353 bridge.
  • R 349 to R 352 independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • a, b, c, and d each independently represent an integer of 0 to 4.
  • the above-mentioned alkyl group, cycloalkyl group, alkenyl group, cycloalkenyl group, alkynyl group, and aryl group may have a heteroatom and may be an unsubstituted or substituted form.
  • the (D1a-1b) perylene-based black pigment has a perylene structure, and a compound represented by any of the general formulas (164) to (166) or a salt thereof is preferable.
  • X 241 and X 242 independently represent a direct bond or an alkylene group having 1 to 10 carbon atoms.
  • Y 241 and Y 242 each independently represent a direct bond or an arylene group having 6 to 15 carbon atoms.
  • R 461 and R 462 independently represent a hydrogen atom, a hydroxy group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an acyl group having 2 to 6 carbon atoms.
  • R 463 to R 469 are independently hydroxy groups, alkyl groups having 1 to 10 carbon atoms, alkoxy groups having 1 to 6 carbon atoms, acyl groups having 2 to 6 carbon atoms, halogen atoms, R 470 , COOH, and the like.
  • R 467 to R 469 may be directly bonded to each other, or may form a ring by an oxygen atom bridge, a sulfur atom bridge, an NH bridge, or an NR 470 bridge.
  • a and b each independently represent an integer of 0 to 5.
  • c, d, e, and f each independently represent an integer of 0 to 4.
  • g, h, and i each independently represent an integer of 0 to 8.
  • R 461 and R 462 are preferably independent hydrogen atoms or alkyl groups having 1 to 10 carbon atoms, respectively. And b are 1.
  • R 461 and R 462 are preferably hydroxy groups, and a and b are 1.
  • R 461 and R 462 are independently hydroxy groups, respectively.
  • alkoxy group having 1 to 6 carbon atoms or an acyl group having 2 to 6 carbon atoms is preferable, and a and b each independently represent an integer of 0 to 5.
  • the above-mentioned alkylene group, arylene group, alkyl group, alkoxy group, and acyl group may have a heteroatom and may be an unsubstituted or substituted form.
  • the (D1a-1c) azo-based black pigment has an azo group in the molecule, and a compound represented by the general formula (168) or a salt thereof is preferable.
  • X 251 represents an arylene group having 6 to 15 carbon atoms.
  • Y 251 represents an arylene group having 6 to 15 carbon atoms.
  • R 481 to R 483 are independently halogen atoms, R 490 , COOH, COOR 490 , COO- , CONH 2 , CONHR 490 , CONR 490 R 491 , CN, OH, OR 490 , OCOR 490 , OCON2 , respectively.
  • R 481 to R 483 may be directly bonded to each other, or may form a ring by an oxygen atom bridge, a sulfur atom bridge, an NH bridge, or an NR 490 bridge.
  • R 484 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or a nitro group.
  • R 485 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an acylamino group having 2 to 10 carbon atoms, or a nitro group.
  • R 486 to R 489 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.
  • a represents an integer from 0 to 4.
  • b represents an integer of 0 to 2.
  • c represents an integer from 0 to 4.
  • d and e each independently represent an integer of 0 to 8.
  • n represents an integer of 1 to 4.
  • the above-mentioned arylene group, alkyl group, alkoxy group, and acylamino group may have a heteroatom and may be an unsubstituted or substituted form.
  • benzofuranone-based black pigment examples include "IRGAPHOR” (registered trademark) BLACK S0100CF (manufactured by BASF), the black pigment described in International Publication No. 2010/081624, or the black pigment described in International Publication No. 2010/081756. Black pigments can be mentioned.
  • the (D1a-1b) perylene-based black pigment for example, C.I. I. Pigment Black 31 or C.I. I. Pigment Black 32 (all numerical values are CI numbers).
  • PALIOGEN registered trademark
  • BLACK S0084, K0084, L0086, K0086, K0087, K878, EH0788, FK4280, or FK4281 are mentioned. Will be.
  • Examples of the (D1a-1c) azo-based black pigment include "CHROMOFINE” (registered trademark) BLACK A1103 (manufactured by Dainichiseika Kogyo Co., Ltd.), the black pigment described in JP-A No. 01-17601, or a special black pigment. Examples thereof include black pigments described in Kaihei 02-034664.
  • the total content ratio of the specific (D1a) black pigment is the same as the above-mentioned preferable content ratio of the (D) colorant.
  • the (D1a-1) black organic pigment further contains a (DC) coating layer.
  • the (DC) coating layer is a layer that coats the pigment surface formed by, for example, a surface treatment with a silane coupling agent, a surface treatment with a silicate, a surface treatment with a metal alkoxide, or a coating treatment with a resin. say.
  • the acid resistance, alkali resistance, solvent resistance, dispersion stability, or heat resistance of the (D1a-1) black organic pigment can be improved, and residue suppression after development and halftone can be improved. The effects of improving the characteristics and improving the reliability of the light emitting element become remarkable.
  • the inclusion of the (DC) coating layer suppresses the residue after development due to the pigment and emits light.
  • the effects of lowering the voltage drive of the characteristics and improving the reliability of the light emitting element become remarkable.
  • the average coverage of the (D1a-1) black organic pigment by the (DC) coating layer is preferably 50% or more, more preferably 70% or more, still more preferably 90% or more from the viewpoint of suppressing residue after development. ..
  • the average coverage of the (D1a-1) black organic pigment by the (DC) coating layer can be determined based on the method described in International Publication No. 2019/0879585.
  • the (DC) coating layer includes the (DC-1) silica coating layer, the (DC-2) metal oxide coating layer, and the (DC-3) metal hydroxide coating layer from the viewpoint of suppressing the residue after development. It is preferable to contain one kind selected from the above group, and the (DC-1) silica coating layer is more preferable from the viewpoint of improving the reliability of the light emitting element.
  • silica include silicon dioxide or a hydrate thereof.
  • the metal oxide include a metal oxide or a hydrate thereof.
  • the metal oxide include alumina (Al 2 O 3 ) or alumina hydrate (Al 2 O 3 ⁇ nH 2 O).
  • the metal hydroxide include aluminum hydroxide (Al (OH) 3 ).
  • the content of the (DC-1) silica coating layer is 1 from the viewpoint of suppressing the residue after development when the (D1a-1) black organic pigment is 100 parts by mass. More than parts by mass is preferable, and more than 5 parts by mass is more preferable.
  • the content of the (DC-1) silica coating layer is preferably 20 parts by mass or less, more preferably 10 parts by mass or less, from the viewpoint of suppressing the residue after development.
  • the total content of the (DC-2) metal oxide coating layer and the (DC-3) metal hydroxide coating layer is the (D1a-1) black organic pigment.
  • the amount is 100 parts by mass, 0.1 part by mass or more is preferable, and 0.5 part by mass or more is more preferable, from the viewpoint of suppressing the residue after development.
  • the total content of the (DC-2) metal oxide coating layer and the (DC-3) metal hydroxide coating layer is preferably 20 parts by mass or less, preferably 10 parts by mass, from the viewpoint of suppressing the residue after development. The following are more preferable.
  • the photosensitive resin composition of the present invention preferably further contains (E) a dispersant.
  • the (E) dispersant refers to a compound having a surface affinity group that interacts with the surface such as the above-mentioned (D1) pigment and a dispersion stabilizing structure that improves the dispersion stability.
  • the dispersion stabilizing structure include an ionic substituent or a polar substituent that is dispersed and stabilized by electrostatic repulsion, a polymer chain that is dispersed and stabilized by steric hindrance, and the like.
  • the dispersant (E) includes a dispersant having only a basic group, a dispersant having a basic group and an acidic group, and a dispersion having a structure in which the basic group is salt-formed with an acid from the viewpoint of suppressing the residue after development.
  • An agent or a dispersant having a structure in which an acidic group is salt-formed with a base is preferable, and a dispersant having only a basic group or a dispersant having a basic group and an acidic group is more preferable.
  • a dispersant having only an acidic group or a dispersant having neither a basic group nor an acidic group may be contained.
  • a tertiary amino group or a nitrogen-containing ring skeleton such as a pyrrolidine skeleton, a pyrrole skeleton, an imidazole skeleton, or a piperidine skeleton is preferable.
  • an acidic group of the dispersant (E) a carboxy group, a sulfonic acid group, a phosphoric acid group, or a phenolic hydroxyl group is preferable.
  • a quaternary ammonium salt structure or a structure in which the above-mentioned nitrogen-containing ring skeleton is salt-formed is preferable.
  • Examples of the (E) dispersant having a polymer chain include an acrylic resin-based dispersant, a polyoxyalkylene ether-based dispersant, a polyester-based dispersant, a polyurethane-based dispersant, a polyol-based dispersant, a polyalkylene amine-based dispersant, and polyethyleneimine.
  • a system dispersant or a polyallylamine system dispersant is preferable.
  • the (E) dispersant preferably contains (E1) a pigment dispersant having a basic group, and the (E1) pigment dispersant having a basic group is any of the general formulas (26) to (29). It is more preferable to have one or more kinds of structures selected from the group consisting of the structures represented by the above, and polyoxyalkylene structures.
  • the pigment dispersant having a basic group is represented by the general formula (26) from the viewpoints of suppressing the increase in viscosity during storage of the pigment dispersion, improving the flatness of the cured film, and suppressing the residue after development. It is more preferable to have a structure and a polyoxyalkylene structure.
  • the pigment dispersant having a basic group (E1) has a structure represented by the general formula (29) and a structure represented by the general formula (29) from the viewpoint of improving the dispersibility of the pigment and suppressing the pigment agglomerates during the frozen storage of the pigment dispersion liquid. It is also more preferred to have a polyoxyalkylene structure.
  • the photosensitive composition of the present invention further contains (E1) a pigment dispersant having a basic group.
  • the pigment dispersant having a basic group has one or more structures selected from the group consisting of the structures represented by any of the general formulas (26) to (29), and a polyoxyalkylene structure. Is preferable.
  • a pigment dispersant having a (E1) basic group having one or more structures selected from the group consisting of the structures represented by any of the general formulas (26) to (29) and a polyoxyalkylene structure.
  • “Pigment dispersant having a specific (E1) basic group” may be referred to.
  • R 56 to R 59 each independently represent an alkyl group having 1 to 6 carbon atoms.
  • n represents an integer from 1 to 9.
  • * 1 to * 6 each independently represent a bonding point with the polyoxyalkylene structure.
  • X 56 and X 57 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
  • Y 56 to Y 59 each independently represent an alkylene group having 1 to 6 carbon atoms.
  • a and b each independently represent an integer of 1 to 100.
  • c and d each independently represent an integer from 0 to 100.
  • * 7 represents a bond point with a carbon atom or a nitrogen atom.
  • an integer of 5 to 60 is preferable, and an integer of 10 to 40 is more preferable, respectively.
  • an integer of 0 to 20 is preferable, and an integer of 0 to 10 is more preferable, respectively.
  • the (A) alkali-soluble resin contains a resin having (A3) a phenolic hydroxyl group, and the (A3) resin having a phenolic hydroxyl group is (A3x).
  • the effect of the present invention becomes remarkable by containing the resin and further containing the pigment dispersant having the above-mentioned specific (E1) basic group.
  • the (A) alkali-soluble resin contains a resin having (A3) a phenolic hydroxyl group, and the resin having the (A3) phenolic hydroxyl group is (A3x).
  • the (A) alkali-soluble resin contains a resin having (A3) a phenolic hydroxyl group, and the (A3) resin having a phenolic hydroxyl group is a resin.
  • (A3-3) Phenolic-modified epoxy resin, a resin having a phenolic hydroxyl group, and (A3-4) Containing one or more kinds selected from the group consisting of a phenol-based modified acrylic resin, a resin having a phenolic hydroxyl group. Furthermore, the effect of the present invention becomes remarkable by containing the pigment dispersant having the above-mentioned specific (E1) basic group.
  • the (A) alkali-soluble resin contains (A3) resin and contains (F0) compound and / or (FB) compound, and further, the above-mentioned By containing a pigment dispersant having a specific (E1) basic group, the effect of the present invention becomes remarkable.
  • the (A) alkali-soluble resin contains (A3) resin and contains (F1) compound and / or (FB1) compound, and further, the above-mentioned
  • a pigment dispersant having a specific (E1) basic group contains a pigment dispersant having a specific (E1) basic group.
  • the effects of suppressing the residue after development and improving the halftone characteristics become remarkable.
  • the effects of lowering the voltage drive of the light emitting characteristics and improving the reliability of the light emitting element become remarkable. It is presumed that this is due to the interaction between the pigment dispersant having the specific (E1) basic group described above and each resin such as the (A3x) resin.
  • the photosensitive composition of the present invention preferably contains a specific (D1a) black pigment, and more preferably contains (D1a-1a) a benzofuranone-based black pigment.
  • a specific (D1a) black pigment preferably contains (D1a-1a) a benzofuranone-based black pigment.
  • each resin such as the above-mentioned (A3x) resin and each compound such as (F0) compound and (FB) compound. ..
  • the amine value of the dispersant (E) is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, from the viewpoint of suppressing the residue after development.
  • the amine value is preferably 100 mgKOH / g or less, more preferably 70 mgKOH / g or less, from the viewpoint of suppressing the residue after development.
  • the amine value here means the mass of potassium hydroxide equivalent to the acid that reacts with 1 g of the (E) dispersant, and the unit is mgKOH / g.
  • the acid value of the dispersant (E) is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, from the viewpoint of suppressing the residue after development.
  • the acid value is preferably 100 mgKOH / g or less, more preferably 70 mgKOH / g or less, from the viewpoint of suppressing the residue after development.
  • the acid value here means the mass of potassium hydroxide that reacts with 1 g of the (E) dispersant, and the unit is mgKOH / g.
  • the content of (E) dispersant in the photosensitive resin composition of the present invention is 100 parts by mass of (D1) pigment. From the viewpoint of suppressing the residue after development, 5 parts by mass or more is preferable, and 15 parts by mass or more is more preferable. On the other hand, the content of the dispersant (E) is preferably 50 parts by mass or less, more preferably 40 parts by mass or less, from the viewpoint of suppressing the residue after development.
  • the photosensitive resin composition of the first aspect, the second aspect, and the fifth aspect of the present invention further comprises (F0) a salt of an acidic group containing a phosphorus atom and / or an acidic group containing a phosphorus atom.
  • (F0) compound a compound having a betaine structure containing a phosphorus atom
  • (FB) compound a compound having a betaine structure containing a phosphorus atom
  • the photosensitive resin composition according to the seventh aspect of the present invention contains the (F0) compound and / or the (FB) compound.
  • the (F0) compound is an oxyalkylene bonded to (1-f0) a 1 to divalent aliphatic group having 4 to 30 carbon atoms, an alkylaryl group having 10 to 30 carbon atoms, and an aryl group having 6 to 15 carbon atoms. It has one or more groups selected from the group consisting of groups.
  • the (F0) compound, the (FB) compound, and the (FC1) compound described later may be collectively referred to as "(F) compound” below.
  • the (F0) compound is an oxyalkylene bonded to (I-f0) a 1 to divalent aliphatic group having 4 to 30 carbon atoms, an alkylaryl group having 10 to 30 carbon atoms, and an aryl group having 6 to 15 carbon atoms. It is preferable to have one or more groups selected from the group consisting of groups (hereinafter, "(F0) structure of (F0) compound").
  • the (FB) compound has a 1- to divalent aliphatic group having 1 to 6 carbon atoms having a (I-fb) ammonium cation structure (hereinafter, “the (I-fb) structure of the (FB) compound”). Is preferable.
  • the (F0) compound and / or the (FB) compound preferably contains two or more kinds of compounds, and preferably contains two or more kinds of (F0) compounds and two or more kinds of (FB) compounds. It is particularly preferable to contain the (F0) compound and the (FB) compound from the viewpoints of suppressing the residue after development, improving the halftone characteristics, driving the light emitting characteristics to a low voltage, and improving the reliability of the light emitting element.
  • the photosensitive resin composition of the first aspect, the second aspect, the fifth aspect, and the seventh aspect of the present invention further comprises (F1) a phosphoric acid compound, a phosphonic acid compound, a phosphinic acid compound, and the like.
  • F1 a phosphoric acid compound
  • a phosphonic acid compound a phosphinic acid compound
  • a phosphinic acid compound a phosphinic acid compound
  • the photosensitive resin composition of the first aspect, the second aspect, the fifth aspect, and the seventh aspect of the present invention contains the (F0) compound and / or the (FB) compound.
  • the (F0) compound comprises the (F1) compound.
  • the (FB) compound preferably contains the (FB1) compound. It is particularly preferred to contain compounds and (FB) compounds.
  • the photosensitive resin composition according to the eighth aspect of the present invention contains the (F1) compound and / or the (FB1) compound.
  • the (F1) compound is a group consisting of (I-f1) a monovalent aliphatic group having 4 to 30 carbon atoms, a divalent aliphatic group having 6 to 30 carbon atoms, and an alkylaryl group having 10 to 30 carbon atoms. More than one type of group selected from And / or (II-f1) An oxyalkylene group to which a monovalent aliphatic group having 4 to 30 carbon atoms is bonded, an oxyalkylene group to which an alkylaryl group having 10 to 30 carbon atoms is bonded, and an aryl group having 6 to 15 carbon atoms are present.
  • the (FB1) compound has one or more groups selected from the group consisting of bonded oxyalkylene groups having 4 to 15 carbon atoms.
  • the (FB1) compound has a 1- to divalent aliphatic group having 1 to 6 carbon atoms and having a (I-fb1) ammonium cationic structure.
  • the (F1) compound, the (FB1) compound, and the (FC1) compound described later may be collectively referred to as "(F) compound” below.
  • the (F1) compound is a group consisting of (I-f1) a monovalent aliphatic group having 4 to 30 carbon atoms, a divalent aliphatic group having 6 to 30 carbon atoms, and an alkylaryl group having 10 to 30 carbon atoms.
  • (F1) structure possessed by (F1) compound) One or more groups selected from the above (hereinafter, "(F1) structure possessed by (F1) compound"), And / or (II-f1)
  • the (FB1) compound has a 1- to divalent aliphatic group having a (I-fb1) ammonium cation structure and 1 to 6 carbon atoms (hereinafter, “the (I-fb1) structure of the (FB1) compound”). Is preferable.
  • the (F1) compound and / or the (FB1) compound preferably contains two or more kinds of compounds, and preferably contains two or more kinds of (F1) compounds and two or more kinds of (FB1) compounds. It is particularly preferable to contain the (F1) compound and the (FB1) compound from the viewpoints of suppressing the residue after development, improving the halftone characteristics, driving the light emitting characteristics to a low voltage, and improving the reliability of the light emitting element.
  • the photosensitive resin composition of the first aspect, the second aspect, and the fifth aspect of the present invention contains the (F0) compound and / or the (FB) compound.
  • the (F0) compound preferably contains the (F1) compound. It is also preferable that the (FB) compound contains the (FB1) compound.
  • the photosensitive resin composition according to the seventh aspect of the present invention preferably contains the (F1) compound as the (F0) compound and / or the (FB1) compound as the (FB) compound.
  • the (F1) compound and the (FB1) compound will be described.
  • the (F1) compound has a substituent that binds to a phosphorus atom and / or a substituent that binds to an oxygen atom on a PO bond. It is preferable that the substituent has the (I-f1) structure of the (F1) compound and / or the (II-f1) structure of the (F1) compound.
  • the (I-f1) structure of the (F1) compound is (I-f1x) a monovalent aliphatic group having 6 to 12 carbon atoms, a divalent aliphatic group having 6 to 12 carbon atoms, and 14 to 14 carbon atoms. One or more groups selected from the group consisting of 26 alkylaryl groups are preferred.
  • the monovalent aliphatic group is preferably an alkyl group, an alkenyl group, or an alkynyl group.
  • the divalent aliphatic group is preferably an alkylene group, an alkenylene group, or an alkynylene group.
  • the (I-f1) structure of the (F1) compound has a linear structure and / or a branched structure.
  • the (II-f1) structure of the (F1) compound is such that (II-f1x) an oxyalkylene group to which a monovalent aliphatic group having 6 to 12 carbon atoms is bonded and an alkylaryl group having 14 to 26 carbon atoms are bonded.
  • One or more groups selected from the group consisting of an oxyalkylene group and an oxyalkylene group having 6 to 12 carbon atoms bonded to an aryl group having 6 to 10 carbon atoms are preferable.
  • the monovalent aliphatic group is preferably an alkyl group, an alkenyl group, or an alkynyl group.
  • the (II-f1) structure of the (F1) compound has a linear structure and / or a branched structure.
  • Examples of the salt of the acidic group containing a phosphorus atom in the (F0) compound include a salt of an acidic group containing a phosphorus atom and a compound having a cationic structure.
  • the salt of the phosphoric acid compound, the salt of the phosphonic acid compound, or the salt of the phosphinic acid compound in the (F1) compound is a salt of the phosphoric acid compound, the phosphonic acid compound, and the phosphinic acid compound and the compound having a cationic structure. Can be mentioned.
  • Examples of the compound having a cation structure include a compound having at least one selected from the group consisting of a cation of a metal atom, an ammonium cation, a phosphonium cation, and a sulfonium cation, and a compound having an ammonium cation is preferable.
  • the ammonium cation is preferably a primary ammonium cation, a secondary ammonium cation, a tertiary ammonium cation, or a quaternary ammonium cation, and more preferably a quaternary ammonium cation.
  • the ammonium cation preferably has at least one aliphatic group having 1 to 30 carbon atoms, more preferably having an aliphatic group having 1 to 15 carbon atoms, and having an aliphatic group having 1 to 10 carbon atoms. Is more preferable, and it is particularly preferable to have an aliphatic group having 1 to 6 carbon atoms.
  • a 1- to divalent linear structure and / or a branched aliphatic group is preferable, and a group selected from the group consisting of an alkyl group, an alkenyl group and an alkynyl group having a linear structure is preferable, and a direct group is preferable.
  • Alkyl groups having a chain structure are more preferable.
  • the (F1) compound it is preferable to contain at least one selected from the group consisting of the compounds represented by any of the general formulas (11) to (13) and salts thereof. It is also preferable to contain two or more kinds of compounds selected from the group consisting of the compounds represented by any of the general formulas (11) to (13) and salts thereof.
  • the compound (F1) at least the compound represented by the general formula (12) and / / Or it is particularly preferable to contain a salt thereof.
  • Z 11 to Z 13 are independently bonded, divalent aliphatic groups having 6 to 30 carbon atoms, or groups represented by the general formula (14).
  • Z 14 to Z 16 each independently represent a direct bond, a divalent aliphatic group having 6 to 30 carbon atoms, or a group represented by the general formula (15).
  • the corresponding R 31 represents a monovalent aliphatic group having 4 to 30 carbon atoms or an alkylaryl group having 10 to 30 carbon atoms.
  • Z 12 and the corresponding R 32 in the general formulas (12) and (13), and Z 11 and the corresponding R 31 in the general formula (11) is the same for Z 13 and the corresponding R 33 .
  • the corresponding R 34 is a hydrogen atom, a monovalent aliphatic group having 4 to 30 carbon atoms, an alkylaryl group having 10 to 30 carbon atoms, and a photoreactive group.
  • Z 15 and the corresponding R 35 in the general formulas (12) and (13), and Z 14 and the corresponding R 34 in the general formula (11) is the same for Z 16 and the corresponding R 36 .
  • the corresponding R 31 and / or R 34 are independently hydrogen atoms.
  • Z 12 and Z 15 and the corresponding R 32 and R 35 in the general formulas (12) and (13), and Z 11 in the general formula (11) also in the Z 13 and Z 16 and the corresponding R 33 and R 36 .
  • Z 14 and the corresponding R 31 and R 34 are a group represented by the general formula (14).
  • the corresponding R 31 is a monovalent aliphatic group having 4 to 30 carbon atoms and an alkylaryl having 10 to 30 carbon atoms. Represents a group or an aryl group having 6 to 15 carbon atoms.
  • the relationship between Z 12 and the corresponding R 32 in the general formulas (12) and (13), and Z 11 and the corresponding R 31 in the general formula (11) is the same for Z 13 and the corresponding R 33 .
  • the corresponding R 34 is a hydrogen atom, a monovalent aliphatic group having 4 to 30 carbon atoms, and 10 to 30 carbon atoms.
  • the relationship between Z 15 and the corresponding R 35 in the general formulas (12) and (13), and Z 14 and the corresponding R 34 in the general formula (11) is the same for Z 16 and the corresponding R 36 .
  • the photoreactive group, the alkenyl group having 2 to 5 carbon atoms, and the alkynyl group having 2 to 5 carbon atoms are preferably radically polymerizable groups.
  • Y 11 and Y 12 each independently represent an alkylene group having 1 to 15 carbon atoms.
  • R 37 and R 38 each independently represent an alkyl group having 1 to 6 carbon atoms.
  • m and n each independently represent an integer of 1 to 15.
  • p and q each independently represent an integer of 0 to 4.
  • * 1 represents a bond point with an oxygen atom in the general formula (11), a bond point with a phosphorus atom in the general formula (12), or a bond point with a phosphorus atom in the general formula (13).
  • * 2 represents a connection point with R 31 in the general formula (11), a connection point with R 32 in the general formula (12), or a connection point with R 33 in the general formula (13).
  • * 3 represents a bond point with an oxygen atom in the general formula (11), a bond point with an oxygen atom in the general formula (12), or a bond point with a phosphorus atom in the general formula (13).
  • * 4 represents a connection point with R 34 in the general formula (11), a connection point with R 35 in the general formula (12), or a connection point with R 36 in the general formula (13).
  • the photosensitive resin composition of the present invention contains propylene glycol monoalkyl ether acetate as a solvent having an acetate bond, which will be described later, and the compound (F1) is Z in the above-mentioned general formulas (11) to (13).
  • the monovalent aliphatic group having 4 to 30 carbon atoms in R 31 to R 33 independently has 6 to 12 carbon atoms.
  • R 34 to R 36 are preferably hydrogen atoms.
  • Such (F1) compound is hereinafter referred to as "specific (F1) compound”.
  • the (F1) compound has a monovalent aliphatic group having 6 to 12 carbon atoms as the (I-f1) structure of the above-mentioned (F1) compound, and / or the above-mentioned (F1) compound has (II).
  • -F1 When the structure has an oxyalkylene group to which a monovalent aliphatic group having 6 to 12 carbon atoms is bonded, such a compound is also hereinafter referred to as "specific (F1) compound".
  • the (F1) compound contains a specific (F1) compound, the solubility of the (F1) compound in propylene glycol monoalkyl ether acetate can be significantly improved.
  • propylene glycol monoalkyl ether acetate propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate are preferable, and propylene glycol monomethyl ether acetate is more preferable.
  • the (F1) compound is further selected from the group consisting of (III-f1) a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms from the viewpoint of improving halftone characteristics. It is also preferable to have one or more kinds (hereinafter, "(III-f1) structure possessed by the (F1) compound").
  • the (F1) compound has a substituent that binds to a phosphorus atom and / or two or more types of substituents that bind to an oxygen atom on a PO bond, and the substituent is possessed by the (F1) compound (F1).
  • the structure is I-f1) and / or the structure (II-f1) possessed by the compound (F1) and the structure (III-f1) possessed by the compound (F1).
  • the photoreactive group is preferably a radically polymerizable group, more preferably a styryl group, a cinnamoyle group, a maleimide group, or a (meth) acryloyl group, and more preferably a (meth) acryloyl group. Groups are even more preferred.
  • the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a radically polymerizable group, and is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, or 2-methyl-.
  • a 2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group is more preferable, and a vinyl group or an allyl group is further preferable.
  • the photosensitive resin composition of the present invention contains the above-mentioned (F1) compound and / or (FB1) compound, and is different from the (F1) compound, and has the above-mentioned photoreactive group and 2 to 5 carbon atoms.
  • the (FB1) compound has a substituent that binds to a phosphorus atom and / or a substituent that binds to an oxygen atom on a PO bond, and the substituent has a (I-fb1) structure of the (FB1) compound.
  • the divalent aliphatic group having 1 to 4 carbon atoms is preferable as the 1 to 2 valent aliphatic group having 1 to 6 carbon atoms.
  • the monovalent aliphatic group an alkyl group, an alkenyl group, or an alkynyl group is preferable.
  • the divalent aliphatic group an alkylene group, an alkenylene group, or an alkynylene group is preferable.
  • the 1 to 2 valent aliphatic group having 1 to 6 carbon atoms preferably has a linear structure and / or a branched structure.
  • the 1 to 2 valent aliphatic group having 1 to 6 carbon atoms may have an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a carboxy group, or a hydroxy group as a substituent. not.
  • the ammonium cation structure is preferably an ammonium cation, a monoalkylammonium cation, a dialkylammonium cation, or a trialkylquaternary ammonium cation, and a trialkylquaternary ammonium cation is more preferable.
  • the (I-fb1) structure of the (FB1) compound includes a structure derived from a nitrogen-containing fatty alcohol compound having at least one hydroxy group and at least one ammonium group or amino group and having 1 to 6 carbon atoms. More preferred.
  • Such compounds are preferably ethanolamine, propanolamine, butanolamine, pentanolamine, serine, threonine, thiosine, or choline, with ethanolamine, serine, or choline being more preferred.
  • the photosensitive resin composition of the present invention contains at least propylene glycol monoalkyl ether acetate as a solvent having an acetate bond described later, and diethylene glycol dialkyl ether as a solvent having at least three ether bonds described later, and / or described later.
  • propylene glycol monoalkyl ether, alkyl lactate, hydroxyacetic acetate, and hydroxyalkyl acetate are contained as the solvent having an alcoholic hydroxyl group (hereinafter, "when containing a specific solvent").
  • the (FB1) compound preferably has a trialkyl quaternary ammonium cation structure in the (I-fb1) structure of the above-mentioned (FB1) compound.
  • the trialkyl quaternary ammonium cation structure preferably has three alkyl groups having 1 to 6 carbon atoms, and more preferably has three alkyl groups having 1 to 4 carbon atoms.
  • Such a (FB1) compound is hereinafter referred to as a "specific (FB1) compound”.
  • the (FB1) compound contains a specific (FB1) compound, the solubility of the (FB1) compound in the solvent can be significantly improved.
  • propylene glycol monoalkyl ether acetate propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate are preferable, and propylene glycol monomethyl ether acetate is more preferable.
  • diethylene glycol dialkyl ether diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol ethyl methyl ether are preferable, and diethylene glycol ethyl methyl ether is more preferable.
  • propylene glycol monoalkyl ether, lactate alkyl, hydroxyacetate alkyl, or hydroxyacetic acetate examples include propylene glycol monomethyl ether, propylene glycol monoethyl ether, methyl lactate, ethyl lactate, methyl hydroxyacetate, ethyl hydroxyacetate, and 2-acetic acid. Hydroxymethyl and 2-hydroxyethyl acetate are preferred, with propylene glycol monomethyl ether, ethyl lactate, ethyl hydroxyacetate, or 2-hydroxyethyl acetate being more preferred.
  • the (FB1) compound is a fatty acid having 6 to 30 carbon atoms (II-fb1) from the viewpoints of suppressing residue after development, improving halftone characteristics, driving a low voltage of light emitting characteristics, and improving reliability of a light emitting element. It may have a fatty acid ester structure derived from a compound and / or an aliphatic ether structure derived from an aliphatic alcohol having 6 to 30 carbon atoms (hereinafter, “the (II-fb1) structure possessed by the (FB1) compound”). preferable.
  • the (FB1) compound has a substituent that binds to a phosphorus atom and / or two or more types of substituents that bind to an oxygen atom on a PO bond, and the substituent is possessed by the (FB1) compound (I).
  • -Fb1) structure and (II-fb1) structure possessed by the (FB1) compound are preferable.
  • the (II-fb1) structure of the (FB1) compound preferably has a 1 to 2 valent aliphatic group having 6 to 30 carbon atoms, and a 1 to 2 valent aliphatic group having 10 to 20 carbon atoms. It is more preferable to have.
  • the monovalent aliphatic group an alkyl group, an alkenyl group, or an alkynyl group is preferable.
  • the divalent aliphatic group an alkylene group, an alkenylene group, or an alkynylene group is preferable.
  • the 1 to 2 valent aliphatic group having 6 to 30 carbon atoms preferably has a linear structure and / or a branched structure.
  • the (FB1) compound has the (II-fb1) structure of the above-mentioned (FB1) compound, so that the solubility of the (FB1) compound in the solvent is further specific. It can be significantly improved.
  • the (FB1) compound has the (I-fb1) structure of the (FB1) compound from the viewpoints of suppressing residue after development, improving halftone characteristics, driving the light emitting characteristics to a low voltage, and improving the reliability of the light emitting element. Further, an ester structure derived from an aliphatic polyfunctional alcohol compound having 2 to 6 carbon atoms and having (IV-fb1) at least three hydroxy groups (hereinafter, “the (IV-fb1) structure possessed by the (FB1) compound”.
  • (V-fb1) an ester structure derived from a nitrogen-containing aliphatic alcohol compound having at least two hydroxy groups and at least one amino group or alkylamide group and having 15 to 20 carbon atoms (hereinafter,” “.” It is preferable to contain a compound having a (V-fb1) structure of the (FB1) compound (hereinafter, "betaine-type phospholipid (FB1) compound").
  • the (FB1) compound contains the (FB1) compound of the betaine-type phospholipid in the case of containing a specific solvent, the solubility of the (FB1) compound in the solvent can be remarkably improved more specifically. ..
  • the (FB1) compound is a betaine-type phospholipid (FB1) compound, which is a glycerophospholipid, from the viewpoints of suppressing residue after development, improving halftone characteristics, driving a low voltage of light emitting characteristics, and improving reliability of a light emitting element. And / or sphingolipids are particularly preferred.
  • Examples of the (FB1) compound of betaine-type phospholipids include phosphatidylcholine, phosphatidylethanolamine, phosphatidylserine, sphingomyelin, hydrogenated phosphatidylcholine, hydrogenated phosphatidylethanolamine, hydrogenated phosphatidylserine, hydrogenated sphingomyelin, lysophosphatidylcholine, and lysophosphatidylethanol.
  • amine selected from the group consisting of amine, lysophosphatidylserine, lysosphingomyelin, lecithin, hydrogenated lecithin, lysolecithin, cephalin, hydrogenated cephalin, lysocephalin, plasmalogen, platelet activator, and (trimethylammonio) ethylphosphonate ceramide. It is particularly preferable to contain one or more types.
  • the (FB1) compound is further selected from the group consisting of (III-fb1) a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms from the viewpoint of improving halftone characteristics. It is also preferable to have one or more kinds (hereinafter, "(III-fb1) structure possessed by the (FB1) compound").
  • the (FB1) compound has a substituent that binds to a phosphorus atom and / or two or more types of substituents that bind to an oxygen atom on a PO bond, and the substituent is possessed by the (FB1) compound (I).
  • -Fb1) structure and (III-fb1) structure possessed by the (FB1) compound are preferable.
  • the (FB1) compound contains two or more kinds of (FB1) compounds, and the above-mentioned (FB1) compound has the (II-fb1) structure, the above-mentioned (FB1) compound has the (IV-fb1) structure, and the above-mentioned (FB1) compound. It is also preferable to include a compound having at least one selected from the group consisting of the (V-fb1) structure of the (FB1) compound described above, and further to include a compound having the (III-fb1) structure of the (FB1) compound. ..
  • the photoreactive group is preferably a radically polymerizable group, more preferably a styryl group, a cinnamoyl group, a maleimide group, or a (meth) acryloyl group, and more preferably a (meth) acryloyl group.
  • the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a radically polymerizable group, and is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, or 2-methyl-.
  • a 2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group is more preferable, and a vinyl group or an allyl group is further preferable.
  • the total content ratio of the (F1) compound and the (FB1) compound in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is for suppressing the residue after development and driving the light emission characteristics to a low voltage.
  • 0.02% by mass or more is preferable, 0.05% by mass or more is more preferable, 0.15% by mass or more is further preferable, and 0.25% by mass or more is particularly preferable.
  • the total content ratio of the (F1) compound and the (FB1) compound is preferably 1.8% by mass or less, preferably 1.5% by mass or less, from the viewpoint of suppressing the residue after development and improving the reliability of the light emitting element.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a radically polymerizable compound, the (F1) compound and the (FB1) compound occupy the photosensitive resin composition of the present invention.
  • the total content of (A) is 100 parts by mass of the total of the alkali-soluble resin and (B) the radically polymerizable compound, from the viewpoint of suppressing the residue after development and reducing the emission characteristics to a low voltage.
  • the total content of the (F1) compound and the (FB1) compound is preferably 3.0 parts by mass or less, preferably 2.5 parts by mass or less, from the viewpoint of suppressing the residue after development and improving the reliability of the light emitting element. Is more preferable, 2.0 parts by mass or less is further preferable, and 1.5 parts by mass or less is particularly preferable.
  • the photosensitive resin composition of the present invention preferably further contains (FC1) non-betaine phospholipid (hereinafter, “(FC1) compound”).
  • (FC1) compound By containing the (FC1) compound, the effects of suppressing the residue after development and improving the halftone characteristics become remarkable. In addition, the effects of lowering the voltage drive of the light emitting characteristics and improving the reliability of the light emitting element become remarkable.
  • the (FC1) compound preferably contains two or more kinds of compounds, and particularly preferably contains a (F1) compound and / or a (FB1) compound, and further contains a (FC1) compound.
  • the (FC1) compound is one or more selected from the group consisting of at least an acidic group containing a (I-fc1) phosphorus atom, an anion structure containing a phosphorus atom, and a salt of an acidic group containing a phosphorus atom (hereinafter, "(FC1)”. ) (I-fc1) structure possessed by the compound "), and (II-fc1) fatty acid ester structure derived from a fatty acid compound having 6 to 30 carbon atoms, and / or derived from an aliphatic alcohol having 6 to 30 carbon atoms. It has an aliphatic ether structure (hereinafter, "(II-fc1) structure possessed by the (FC1) compound”).
  • the (FC1) compound When the (I-fc1) structure of the (FC1) compound is an acidic group containing a phosphorus atom and / or an anion structure containing a phosphorus atom, the (FC1) compound preferably does not have an ammonium cation structure.
  • the anion structure containing a phosphorus atom described above an anion structure derived from an acidic group containing a phosphorus atom is preferable.
  • the (FC1) compound has a substituent that binds to a phosphorus atom and / or two or more types of substituents that bind to an oxygen atom on a PO bond, and the substituent is possessed by the (FC1) compound (I).
  • the structure is ⁇ fc1) and the structure (II-fc1) possessed by the compound (FB1).
  • the (I-fc1) structure of the (FC1) compound is preferably a phosphate group, a phosphonic acid group, or a phosphinic acid group, and / or a phosphate anion, a phosphonate anion, or a phosphinic acid anion.
  • As the (II-fc1) structure of the (FC1) compound it is preferable to have a 1 to 2 valent aliphatic group having 6 to 30 carbon atoms, and a 1 to 2 valent aliphatic group having 10 to 20 carbon atoms. It is more preferable to have.
  • an alkyl group, an alkenyl group, or an alkynyl group is preferable.
  • divalent aliphatic group an alkylene group, an alkenylene group, or an alkynylene group is preferable.
  • the 1 to 2 valent aliphatic group having 6 to 30 carbon atoms preferably has a linear structure and / or a branched structure.
  • phosphatidic acid, phosphatidylglycerol, lysophosphatidic acid, and lysophosphatidylglycerol are used from the viewpoints of suppressing residue after development, improving halftone characteristics, driving light emission characteristics to a low voltage, and improving reliability of light emitting elements.
  • Phosphatidylinositol, lysophatidylinositol, diphosphatidylglycerol, cardiolipin, sphingosine-1-phosphate, and phosphatidyl-citidine monophosphate are particularly preferably contained.
  • the total content ratio of the (F1) compound, the (FB1) compound, and the (FC1) compound is the same as the above-mentioned preferable content ratio of the (F1) compound and the (FB1) compound.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a radically polymerizable compound, the content of the (F1) compound, the (FB1) compound, and the (FC1) compound is The total is as per the preferred contents of the (F1) and (FB1) compounds described above.
  • the photosensitive resin composition according to the first aspect of the present invention may further contain an ester compound of an acidic group containing a phosphorus atom having a (FT) reactive group (hereinafter, “(FT) compound”). preferable.
  • (FT) compound By containing the (FT) compound, the effects of improving the halftone characteristics and suppressing the pattern peeling after development become remarkable.
  • the (FT) compound preferably contains two or more kinds of compounds, and particularly preferably contains (F1) compound and / or (FB1) compound, and further contains (FT) compound.
  • the (FT) compound preferably has a radically polymerizable group, and has at least one selected from the group consisting of a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. Is more preferable.
  • (FT) compound It is selected from the group consisting of a 1 to 2 valent aliphatic group, a 1 to 2 valent alicyclic group, a 1 to 2 valent aromatic group, and an oxyalkylene group to which a substituent is bonded, which is possessed by the (FT) compound.
  • (X) and (Y) satisfy the general formulas (FT- ⁇ ) to (FT- ⁇ ).
  • X + Y 3 (FT- ⁇ ) 1 ⁇ X ⁇ 3 (FT- ⁇ ) 0 ⁇ Y ⁇ 2 (FT- ⁇ ).
  • X is preferably an integer of 1 to 3, more preferably 2 or 3, and even more preferably 3.
  • Y is preferably an integer of 0 to 2, more preferably 0 or 1.
  • the (FT) compound has a substituent that binds to a phosphorus atom and / or a substituent that binds to an oxygen atom on a PO bond, and the substituent preferably has a radical polymerizable group, and is a photoreaction. It is more preferable to have one or more selected from the group consisting of a sex group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. Further, the substituent is selected from the group consisting of a 1 to 2 valent aliphatic group, a 1 to 2 valent alicyclic group, a 1 to 2 valent aromatic group, and an oxyalkylene group to which a substituent is bonded. It is also preferable to have one or more types.
  • the photosensitive resin composition according to the first aspect of the present invention further comprises the following (FT1) compound, the compound having the above-mentioned (III-fb1) structure as the (F1) compound, and the above-mentioned (FB1) compound.
  • FT1 compound An acidic group containing a phosphorus atom having at least three selected from the group consisting of a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. Ester compound.
  • the photoreactive group is preferably a radically polymerizable group, more preferably a styryl group, a cinnamoyl group, a maleimide group, or a (meth) acryloyl group, and even more preferably a (meth) acryloyl group.
  • the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a radically polymerizable group, and is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, or 2-methyl-.
  • a 2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group is more preferable, and a vinyl group or an allyl group is further preferable.
  • the (FT) compound is a phosphate triester compound having one or more selected from the group consisting of the above-mentioned photoreactive group, alkenyl group having 2 to 5 carbon atoms, and alkynyl group having 2 to 5 carbon atoms. It is preferable to contain at least one selected from the group consisting of a phosphoric acid triester compound, a phosphonic acid diester compound, a hypophobic acid diester compound, and a phosphinic acid monoester compound.
  • the total content ratio of the (F1) compound, the (FB1) compound, and the (FT) compound is the same as the above-mentioned preferable content ratio of the (F1) compound and the (FB1) compound. be.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin and (B) a compound, the total content of the (F1) compound, the (FB1) compound, and the (FT) compound is This is the preferred content of the (F1) compound and the (FB1) compound described above.
  • the photosensitive resin composition of the present invention preferably further contains (G) a cross-linking agent.
  • the cross-linking agent means a compound having a cross-linking group capable of binding to a resin or the like or a compound having a cationically polymerizable group.
  • the cross-linking reaction with a resin or the like by a cross-linking group and the cationic polymerization by a cationically polymerizable group can be promoted by an acid and / or heat, and are suitable for improving the heat resistance of the cured film and the chemical resistance of the cured film. Is.
  • (G) cross-linking agent a compound having at least two groups of one or more selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, a vinyl group, and an allyl group is preferable (however, however).
  • the above-mentioned (B) radically polymerizable compound is excluded).
  • the photosensitive resin composition of the present invention preferably further contains (G1) a hydrophobic skeleton-containing epoxy cross-linking agent (hereinafter, “(G1) compound”).
  • (G1) compound a hydrophobic skeleton-containing epoxy cross-linking agent
  • (G1) compound) A group consisting of a condensed polycyclic structure, a condensed polycyclic heterocyclic structure, a structure in which an aromatic ring skeleton and an alicyclic skeleton are directly linked, and a structure in which at least two aromatic ring skeletons are directly linked.
  • a structure containing one or more selected from the above (hereinafter, "a structure containing a specific hydrophobic skeleton of the (I-g1) (G1) compound”), and (II-g1) It has an organic group having an epoxy group (hereinafter, “(II-g1) structure”), and has (II-g1) A compound having at least two structures.
  • (G1) compound By containing the (G1) compound, the effects of reducing the taper of the pattern shape and improving the halftone characteristics become remarkable.
  • the compound (G1) has a structure containing a specific hydrophobic skeleton of the above-mentioned (I-g1) (G1) compounds from the general formula (171) to. It is preferable that the structure is represented by any one of (177).
  • X 271 to X 278 and X 280 independently represent a monocyclic or condensed polycyclic hydrocarbon ring, respectively.
  • X 279 represents an aliphatic structure having 1 to 6 carbon atoms.
  • X 281 represents a direct bond or an alkylene group having 1 to 6 carbon atoms.
  • Y 271 and Y 279 each independently represent a direct bond, a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom.
  • R 371 to R 382 independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R 383 to R 389 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R 390 represents a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R 391 to R 399 and R 401 to R 403 independently represent an alkyl group having 1 to 6 carbon atoms having an epoxy group or an alkoxyalkyl group having 2 to 10 carbon atoms having an epoxy group.
  • R 400 represents an organic group having an epoxy group.
  • a, b, c, d, e, f, and g each independently represent an integer of 0 to 4.
  • h, i, and j each independently represent an integer of 0 to 3.
  • k and l each independently represent an integer of 0 to 6.
  • X 271 to X 278 and X 278 are preferably monocyclic or condensed polycyclic hydrocarbon rings having 6 to 15 carbon atoms independently.
  • Y 271 and Y 279 are each independently preferably directly bonded or oxygen atom.
  • the above-mentioned aliphatic structure, alkylene group, alkyl group, cycloalkyl group, aryl group, alkoxyalkyl group, and monocyclic or condensed polycyclic aromatic hydrocarbon ring may have a heteroatom or no heteroatom. It may be either a substituted product or a substituted product.
  • the epoxy group equivalent of the (G1) compound is preferably 150 g / mol or more, more preferably 170 g / mol or more, still more preferably 190 g / mol or more, from the viewpoint of suppressing the residue after development.
  • the epoxy group equivalent is preferably 800 g / mol or less, more preferably 600 g / mol or less, still more preferably 500 g / mol or less, from the viewpoint of reducing the taper of the pattern shape.
  • the content ratio of the (G1) compound in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is 0.3% by mass or more from the viewpoint of reducing the taper of the pattern shape and improving the halftone characteristics. Is preferable, 1.0% by mass or more is more preferable, and 2.0% by mass or more is further preferable.
  • the content ratio of the (G1) compound is preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less, from the viewpoint of suppressing the residue after development.
  • the content of the (G1) compound in the photosensitive resin composition of the present invention is
  • the total of the alkali-soluble resin (A) and the radically polymerizable compound is 100 parts by mass, 1 part by mass or more is preferable and 3 parts by mass is preferable from the viewpoint of reducing the taper of the pattern shape and improving the halftone characteristics. More than 5 parts by mass is more preferable, and 5 parts by mass or more is further preferable.
  • the content of the (G1) compound is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, still more preferably 20 parts by mass or less, from the viewpoint of suppressing the residue after development.
  • the photosensitive resin composition of the present invention further contains (G2) a cross-linking agent having at least two phenolic hydroxyl groups and at least two cross-linking groups (hereinafter, “(G2) compound”).
  • the crosslinkable group contains at least one selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, a vinyl group, and an allyl group.
  • the (G2) compound preferably contains at least two structures in which a phenolic hydroxyl group and a crosslinkable group are bonded to one aromatic group.
  • the (G2) compound preferably has a hydrophobic skeleton such as an aromatic group.
  • a hydrophobic skeleton from the viewpoint of suppressing narrow mask bias after development and improving halftone characteristics, a fluorene structure, an indan structure, a condensed polycyclic alicyclic structure, and at least two aromatic ring skeletons are linked by an aliphatic group.
  • a structure containing at least one selected from the group consisting of a structure consisting of a structure in which at least two aromatic ring skeletons are directly linked is more preferable.
  • a compound represented by any of the general formulas (181) to (184) is preferable from the viewpoint of suppressing narrow mask bias after development and improving halftone characteristics.
  • Y 311 represents a direct bond, a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom.
  • R 411 to R 423 independently represent a halogen atom or an alkyl group having 1 to 10 carbon atoms.
  • R 424 to R 430 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, or an aryl group having 6 to 15 carbon atoms.
  • R 431 to R 440 independently have an alkoxyalkyl group having 2 to 10 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, an alkyl group having 1 to 6 carbon atoms having an epoxy group, and carbon having an epoxy group. It represents an alkoxyalkyl group having a number of 2 to 10, an alkyl group having 1 to 8 carbon atoms having an oxetanyl group, an alkoxyalkyl group having 2 to 12 carbon atoms having an oxetanyl group, a vinyl group, or an allyl group.
  • a and b each independently represent an integer of 0 to 4.
  • c and d each independently represent an integer of 0 to 2.
  • e, f, g, h, i, j, k, and l each independently represent an integer of 0 to 3.
  • m represents an integer from 0 to 4.
  • Y 311 is a direct bond, oxygen atom, or sulfur atom
  • n is 0.
  • Y 311 is a nitrogen atom
  • n is 1.
  • Y 311 is a carbon atom
  • n is 2.
  • o, p, ⁇ , and ⁇ each independently represent an integer of 1 to 3, 2 ⁇ o + ⁇ ⁇ 4, and 2 ⁇ p + ⁇ ⁇ 4.
  • q, r, ⁇ , and ⁇ each independently represent an integer of 1 to 4, 2 ⁇ q + ⁇ ⁇ 5, and 2 ⁇ r + ⁇ ⁇ 5.
  • s, t, u, ⁇ , ⁇ , and ⁇ each independently represent an integer of 1 to 4, 2 ⁇ s + ⁇ ⁇ 5, 2 ⁇ t + ⁇ ⁇ 5, and 2 ⁇ u + ⁇ ⁇ 5.
  • .. v, w, x, ⁇ , ⁇ , and ⁇ independently represent integers of 1 to 4, 2 ⁇ v + ⁇ ⁇ 5, 2 ⁇ w + ⁇ ⁇ 5, and 2 ⁇ x + ⁇ ⁇ 5.
  • .. Y 311 is preferably a direct bond or an oxygen atom.
  • the above-mentioned alkyl group, cycloalkyl group, aryl group, alkoxyalkyl group, and hydroxyalkyl group may have a hetero atom and may be an unsubstituted or substituted product.
  • the content ratio of the (G2) compound in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is from the viewpoint of suppressing the residue after development, suppressing the narrow mask bias after developing, and improving the halftone characteristics. , 0.3% by mass or more is preferable, 1.0% by mass or more is more preferable, and 2.0% by mass or more is further preferable.
  • the content ratio of the (G2) compound is preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less, from the viewpoint of suppressing the residue after development and improving the sensitivity during exposure.
  • the content of the (G2) compound in the photosensitive resin composition of the present invention is
  • the total of (A) alkali-soluble resin and (B) radically polymerizable compound is 100 parts by mass, 1 mass from the viewpoint of suppressing residue after development, suppressing narrow mask bias after development, and improving halftone characteristics. 3 parts or more is preferable, 3 parts by mass or more is more preferable, and 5 parts by mass or more is further preferable.
  • the content of the (G2) compound is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, still more preferably 20 parts by mass or less, from the viewpoint of suppressing the residue after development and improving the sensitivity at the time of exposure.
  • the photosensitive resin composition according to the first aspect of the present invention further contains the following (G3) compound, and the crosslinkable group is an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, a vinyl group, and a crosslinkable group. It is preferable to contain at least one selected from the group consisting of allyl groups.
  • (G3) Compound A compound having a cyclic structure having at least two nitrogen atoms and a compound having at least two crosslinkable groups.
  • the number of crosslinkable groups of the (G3) compound is preferably two or more, more preferably three or more, and even more preferably four or more.
  • the number of crosslinkable groups is preferably 8 or less, more preferably 7 or less, and even more preferably 6 or less.
  • the (G3) compound preferably has the following (I-g3) structure. Further, it is more preferable that the (G3) compound has the following (I-g3x) structure.
  • (I-g3) Structure A structure in which a crosslinkable group is bonded to a cyclic skeleton having at least two nitrogen atoms.
  • (I-g3x) structure A structure in which at least two crosslinkable groups are bonded to a cyclic skeleton having at least two nitrogen atoms.
  • the number of crosslinkable groups in the (I-g3x) structure of the (G3) compound is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more.
  • the number of crosslinkable groups is preferably 8 or less, more preferably 7 or less, and even more preferably 6 or less.
  • the (G3) compound has an isocyanuric acid structure in the cyclic skeleton having at least two nitrogen atoms of the (G3) compound.
  • One or more selected from the group consisting of triazine structure, glycoluril structure, imidazolidone structure, pyrazole structure, imidazole structure, triazole structure, tetrazole structure, and purine structure is preferable, and it is composed of isocyanuric acid structure, triazine structure, and glycoluril structure.
  • One or more selected from the group is more preferable, and an isocyanuric acid structure and / or a triazine structure is further preferable.
  • the (G3) compound preferably contains at least one selected from the group consisting of compounds represented by any of the general formulas (171) to (173).
  • the content ratio of the (G3) compound in the total solid content of the photosensitive resin composition of the present invention excluding the solvent is from the viewpoint of suppressing the residue after development, suppressing the narrow mask bias after developing, and improving the halftone characteristics. , 0.3% by mass or more is preferable, 1.0% by mass or more is more preferable, and 2.0% by mass or more is further preferable.
  • the content ratio of the (G3) compound is preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 15% by mass or less, from the viewpoint of suppressing the residue after development and improving the sensitivity at the time of exposure.
  • the content of the (G3) compound in the photosensitive resin composition of the present invention is (A).
  • the total of the alkali-soluble resin and the compound (B) is 100 parts by mass, 1 part by mass or more is preferable from the viewpoint of suppressing the residue after development, suppressing the narrow mask bias after development, and improving the halftone characteristics. More than parts by mass is more preferable, and more than 5 parts by mass is even more preferable.
  • the content of the (G3) compound is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, still more preferably 20 parts by mass or less, from the viewpoint of suppressing the residue after development and improving the sensitivity during exposure.
  • the photosensitive resin composition of the present invention is further selected from the group consisting of halogen element, sulfur element, and phosphorus element from the viewpoint of improving the reliability of the light emitting element in the organic EL display and driving the light emitting element to a low voltage. It is preferable to contain one or more kinds, more preferably to contain a halogen element and / or a sulfur element, and further preferably to contain a sulfur element. Further, the photosensitive resin composition of the present invention preferably contains two or more kinds selected from the group consisting of a halogen element, a sulfur element, and a phosphorus element, and more preferably contains a halogen element and a sulfur element. It is more preferable to contain a halogen element, a sulfur element, and a phosphorus element.
  • halogen elements include chlorine element, bromine element, iodine element, and fluorine element.
  • the halogen element preferably contains one or more kinds selected from the group consisting of chlorine element, bromine element, and iodine element, more preferably contains chlorine element and / or bromine element, and further preferably contains chlorine element. ..
  • the content of the halogen element in the photosensitive resin composition is preferably 0.1 ppm or more, more preferably 0.3 ppm or more, further preferably 0.5 ppm or more, further preferably 0.7 ppm or more, and even more preferably 1 ppm or more. Especially preferable.
  • the content of the halogen element is preferably 700 ppm or less, more preferably 500 ppm or less, still more preferably 300 ppm or less. Further, from the viewpoint of improving light emission characteristics, 100 ppm or less is preferable, 70 ppm or less is more preferable, 50 ppm or less is further preferable, 30 ppm or less is further preferable, and 10 ppm or less is particularly preferable.
  • the content of the sulfur element in the photosensitive resin composition is preferably 0.1 ppm or more, more preferably 0.3 ppm or more, further preferably 0.5 ppm or more, further preferably 0.7 ppm or more, and even more preferably 1 ppm or more. Especially preferable.
  • the content of the sulfur element is preferably 700 ppm or less, more preferably 500 ppm or less, still more preferably 300 ppm or less. Further, from the viewpoint of improving light emission characteristics, 100 ppm or less is preferable, 70 ppm or less is more preferable, 50 ppm or less is further preferable, 30 ppm or less is further preferable, and 10 ppm or less is particularly preferable.
  • the content of the phosphorus element in the photosensitive resin composition is preferably 0.1 ppm or more, more preferably 0.3 ppm or more, further preferably 0.5 ppm or more, further preferably 0.7 ppm or more, and even more preferably 1 ppm or more. Especially preferable.
  • the content of the phosphorus element is preferably 700 ppm or less, more preferably 500 ppm or less, still more preferably 300 ppm or less. Further, from the viewpoint of improving light emission characteristics, 100 ppm or less is preferable, 70 ppm or less is more preferable, 50 ppm or less is further preferable, 30 ppm or less is further preferable, and 10 ppm or less is particularly preferable.
  • the photosensitive resin composition of the present invention contains at least one selected from the group consisting of halogen elements, sulfur elements, and phosphorus elements, and preferably satisfies one or more of the following conditions (1) to (3). .. (1)
  • the content of the halogen element in the photosensitive resin composition is 0.1 to 100 ppm.
  • the content of sulfur element in the photosensitive resin composition is 0.1 to 100 ppm.
  • the content of the phosphorus element in the photosensitive resin composition is 0.1 to 100 ppm.
  • the photosensitive resin composition of the present invention more preferably satisfies the condition (1) and / or the condition (2), and further preferably the condition (2). Further, the photosensitive resin composition of the present invention preferably satisfies two or more conditions selected from the group consisting of the conditions (1) to (3), and the conditions (1) and (2) are satisfied. It is more preferable to satisfy all the conditions (1) to (3).
  • the photosensitive resin composition of the present invention contains at least one selected from the group consisting of halogen elements, sulfur elements, and phosphorus elements.
  • the content of the halogen element in the photosensitive resin composition is 0.1 to 100 ppm.
  • the photosensitive resin composition contains a sulfur element, the content of the sulfur element in the photosensitive resin composition is 0.1 to 100 ppm.
  • the photosensitive resin composition contains a phosphorus element, the content of the phosphorus element in the photosensitive resin composition is more preferably 0.1 to 100 ppm.
  • the photosensitive resin composition contains one or more kinds selected from the group consisting of halogen element, sulfur element, and phosphorus element, and one or more kinds selected from the group consisting of halogen element, sulfur element, and phosphorus element.
  • the surface of the first electrode is surface-modified by these elements by the transition of these elements contained in the pixel division layer after the pixel division layer is formed. Therefore, it is presumed that the effect of lower voltage drive of the light emitting element in the organic EL display becomes remarkable by adjusting the work function difference of the first electrode. Further, it is considered that the polarization structure and charge balance in the pixel division layer in, for example, an organic EL display are controlled by intentionally containing a small amount of these elements. As a result, it is presumed that the effect of improving the reliability of the light emitting element in the organic EL display becomes remarkable by suppressing ion migration and electromigration caused by metal impurities and ion impurities that adversely affect the light emission characteristics.
  • the halogen element, sulfur element, and phosphorus element contained in the photosensitive resin composition are preferably simple substances, ions, compounds, or compound ions. That is, the photosensitive resin composition comprises a simple substance of a halogen element, an ion of a halogen element, a compound containing a halogen element, a compound ion containing a halogen element, a simple substance of a sulfur element, an ion of a sulfur element, a compound containing a sulfur element, and a sulfur element.
  • a compound ion containing a phosphorus element a simple substance of a phosphorus element, an ion of a phosphorus element, a compound containing a phosphorus element, or a compound ion containing a phosphorus element.
  • the content of the halogen element in the photosensitive resin composition is the total amount of the halogen element which is a simple substance, an ion, a compound, or a compound ion.
  • the content of the sulfur element in the photosensitive resin composition is the total amount of the sulfur element which is a simple substance, an ion, a compound, or a compound ion.
  • the content of the phosphorus element in the photosensitive resin composition is the total amount of the phosphorus element which is a simple substance, an ion, a compound, or a compound ion.
  • the photosensitive resin composition contains a halogen element ion, a compound ion containing a halogen element, a sulfur element ion, a compound ion containing a sulfur element, a phosphorus element ion, or a compound ion containing a phosphorus element
  • a counter cation is used.
  • it may contain a counter anion.
  • the counter cation include metal element ion, ammonium ion, primary ammonium ion, secondary ammonium ion, tertiary ammonium ion, or quaternary ammonium ion, and quaternary ammonium ion is preferable.
  • the metal element ion examples include an alkali metal ion, an alkaline earth metal ion, a main group element metal ion, and a transition metal ion.
  • the metal element is preferably Li, Be, Na, Mg, Al, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, or Zn.
  • the primary ammonium ion, the secondary ammonium ion, the tertiary ammonium ion, and the quaternary ammonium ion each have 1 to 4 aliphatic groups, alicyclic groups, or aromatic groups.
  • the counter anion examples include hydroxide ion, carboxylic acid ion, hyponitrite ion, nitrite ion, nitrate ion, or phenoxy ion.
  • the photosensitive resin composition of the present invention further contains an ink-repellent agent.
  • the ink-repellent agent refers to a compound having a water-repellent structure and / or an oil-repellent structure. Since the liquid repellency of the film can be improved by containing the ink-repellent agent, the contact angle of the film with pure water and / or the contact angle of the film with an organic solvent can be increased.
  • the ink repellent is from a group consisting of at least two photoreactive groups, at least two alkenyl groups having 2 to 5 carbon atoms, at least two alkynyl groups having 2 to 5 carbon atoms, and at least two thermally reactive groups. It is preferable to have one or more selected types.
  • the photoreactive group is preferably a radically polymerizable group, more preferably a styryl group, a cinnamoyl group, a maleimide group, or a (meth) acryloyl group, and even more preferably a (meth) acryloyl group.
  • the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a radically polymerizable group, and is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, or 2-methyl-.
  • a 2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group is more preferable, and a vinyl group or an allyl group is further preferable.
  • the thermally reactive group an alkoxymethyl group, a methylol group, an epoxy group, an oxetanyl group, or a blocked isocyanate group is preferable.
  • the ink-repellent agent preferably has a polymer chain, and the side chain of the repeating unit of the polymer chain has a water-repellent structure, an oil-repellent structure, at least two photoreactive groups, and at least two carbon atoms of 2 to 5. It is also preferable to have at least one selected from the group consisting of an alkenyl group, at least two alkynyl groups having 2 to 5 carbon atoms, and at least two thermoreactive groups.
  • ink-repellent agent having a polymer chain examples include acrylic resin-based ink-repellent agent, polyoxyalkylene ether-based ink-repellent agent, polyester-based ink-repellent agent, polyurethane-based ink-repellent agent, polyol-based ink-repellent agent, and polyethyleneimine-based ink-repellent agent. , Or a polyallylamine-based ink repellent.
  • the photosensitive resin composition of the present invention further contains one or more selected from the group consisting of a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, and a surfactant.
  • a sensitizer By containing a sensitizer, the effect of improving the sensitivity during exposure becomes remarkable.
  • the sensitizer a compound having a fluorene skeleton, a benzofluorene skeleton, a fluorenone skeleton, or a thioxanthone skeleton is preferable.
  • the chain transfer agent By containing the chain transfer agent, the effect of improving the sensitivity at the time of exposure becomes remarkable.
  • a compound having at least two mercapto groups is preferable.
  • a polymerization inhibitor By containing a polymerization inhibitor, the effect of improving the resolution after development becomes remarkable.
  • a polymerization inhibitor a hindered phenol compound, a hindered amine compound, or a benzimidazole compound is preferable.
  • a silane coupling agent By containing a silane coupling agent, the effect of improving the adhesion between the cured film and the underlying substrate becomes remarkable.
  • a trifunctional organosilane, a tetrafunctional organosilane, or a silicate compound is preferable.
  • a surfactant By containing a surfactant, the effect of improving the film thickness uniformity of the coating film becomes remarkable.
  • a fluororesin-based surfactant a silicone-based surfactant, a polyoxyalkylene ether-based surfactant, or an acrylic resin-based surfactant is preferable.
  • the content ratio of the surfactant in the photosensitive resin composition of the present invention is preferably 0.001% by mass or more, more preferably 0.005% by mass or more of the entire photosensitive resin composition.
  • the content ratio of the surfactant is preferably 1% by mass or less, more preferably 0.5% by mass or less.
  • the photosensitive resin composition of the present invention further contains a solvent.
  • a solvent By containing a solvent, a film of the composition can be formed on the substrate with a desired film thickness, and the effect of improving the film thickness uniformity of the coating film becomes remarkable.
  • the solvent from the viewpoint of solubility of various resins and various additives, a compound having an alcoholic hydroxyl group, a compound having a carbonyl group, a compound having an ester bond, or a compound having at least three ether bonds is preferable.
  • a compound having a boiling point of 110 ° C. or higher under atmospheric pressure is preferable from the viewpoint of improving the film thickness uniformity of the coating film.
  • a compound having a boiling point of 250 ° C. or lower under atmospheric pressure is preferable.
  • the content ratio of the solvent in the photosensitive resin composition of the present invention can be appropriately adjusted according to the coating method and the like. For example, when a coating film is formed by spin coating, it is generally 50 to 95% by mass of the entire photosensitive resin composition.
  • the photosensitive resin composition of the present invention contains (D1) a pigment as a (D) colorant
  • the (D1) pigment can be obtained by containing a solvent having a carbonyl group or a solvent having an ester bond as the solvent.
  • a solvent having a carbonyl group or a solvent having an ester bond As the carbonyl group, an alkylcarbonyl group, a dialkylcarbonyl group, a formyl group, a carboxy group, an amide group, an imide group, a urea bond, or a urethane bond is preferable.
  • the ester bond a carboxylic acid ester bond, a carbonate ester bond, or a formic acid ester bond is preferable, and a carboxylic acid ester bond is more preferable.
  • carboxylic acid ester bonds an acetate bond, a propionate bond, or a butyrate bond is more preferable, and an acetate bond is further preferable.
  • the total content ratio of the solvent having a carbonyl group or the solvent having an ester bond in the solvent is 30 to 100 from the viewpoint of suppressing the residue after development and improving the resolution after development.
  • the mass% is preferable, 50 to 100% by mass is more preferable, and 70 to 100% by mass is further preferable.
  • the content ratio of propylene glycol monoalkyl ether acetate in the solvent is also 30 to 100% by mass. Is preferable, 50 to 100% by mass is more preferable, and 70 to 100% by mass is further preferable.
  • the content ratio of propylene glycol monoalkyl ether acetate in the solvent is preferably 30% by mass or more. 40% by mass or more is more preferable, and 50% by mass or more is further preferable. On the other hand, the content ratio of propylene glycol monoalkyl ether acetate is preferably 90% by mass or less, more preferably 80% by mass or less, still more preferably 70% by mass or less.
  • the (FB1) compound contains the above-mentioned specific (FB1) compound, the diethylene glycol dialkyl ether and / or the propylene glycol monoalkyl ether and lactate alkyl in the solvent.
  • the total content ratio of one or more selected from the group consisting of hydroxyalkyl acetate, hydroxyalkyl acetate, and hydroxyalkyl acetate is preferably 10% by mass or more, more preferably 20% by mass or more, still more preferably 30% by mass or more.
  • the total content ratio of these solvents is preferably 50% by mass or less, more preferably 40% by mass or less.
  • ⁇ Method for Producing Photosensitive Resin Composition of the Present Invention> A typical method for producing the photosensitive resin composition of the present invention will be described.
  • the colorant contains (Da) a blackening agent and (Da) the blackening agent contains (D1a) a black pigment
  • (A) a dispersant is added to the solution of the alkali-soluble resin as needed.
  • (D1a) The black pigment is dispersed in the mixed solution using a disperser to prepare a pigment dispersion.
  • (A) an alkali-soluble resin, (C) a photosensitive agent, and if necessary, (F) a compound, other additives, and an arbitrary solvent are added to this pigment dispersion, and the mixture is added for 20 minutes to 3 hours. Stir to a uniform solution. After stirring, the obtained solution is filtered to obtain the photosensitive resin composition of the present invention.
  • a bead mill is preferable from the viewpoint of suppressing residue after development. Examples of the beads include titania beads, zirconia beads, and zircon beads.
  • the bead diameter is preferably 0.01 to 6 mm, more preferably 0.015 to 5 mm, still more preferably 0.03 to 3 mm.
  • the cured product of the present invention is the photosensitive resin composition of the first aspect of the present invention, the photosensitive resin composition of the second aspect, the photosensitive resin composition of the fifth aspect, and the photosensitive resin of the seventh aspect. It is a cured composition or the photosensitive resin composition of the eighth aspect.
  • Curing refers to a state in which a crosslinked structure is formed by heating and the fluidity of the film is lost. Curing conditions include heating at 150 to 500 ° C. for 5 to 300 minutes. Examples of the heating method include a method of heating using an oven, a hot plate, infrared rays, a flash annealing device, or a laser annealing device.
  • the treatment atmosphere for heating is air, oxygen, nitrogen, helium, neon, argon, krypton or xenon atmosphere, a gas atmosphere containing 1 to 10,000 ppm (0.0001 to 1% by mass) of oxygen, or a vacuum.
  • the following can be mentioned.
  • the optical density at the wavelength of visible light (380 to 780 nm) per 1 ⁇ m of the film thickness is from the viewpoint of suppressing external light reflection and preventing light leakage from adjacent pixels. , 1.0 to 5.0 is preferable.
  • the optical density per 1 ⁇ m of the film thickness can be adjusted by the composition and content ratio of the above-mentioned (D) colorant.
  • the taper angle of the inclined side in the cross section of the cured pattern contained in the cured film obtained by curing the photosensitive resin composition of the present invention is preferably 20 ° to 45 ° from the viewpoint of preventing electrode disconnection and improving the reliability of the light emitting element. ..
  • FIG. 1 shows an example of a cross section of a cured pattern having a stepped shape, which is contained in a cured film obtained by curing the photosensitive composition of the present invention.
  • the thick film portion 34 in the stepped shape corresponds to the cured portion at the time of exposure and has the maximum film thickness of the cured pattern.
  • the thin film portions 35a, 35b, and 35c in the stepped shape correspond to the halftone exposed portion at the time of exposure and have a film thickness smaller than the thickness of the thick film portion 34.
  • the taper angles ⁇ a , ⁇ b , ⁇ c , ⁇ d , and ⁇ e of the inclined sides 36a, 36b, 36c, 36d, and 36e in the cross section of the hardening pattern having a stepped shape are all low taper. .. As shown in FIG.
  • the taper angles ⁇ a , ⁇ b , ⁇ c , ⁇ d , and ⁇ e are the horizontal sides 37 of the substrate on which the curing pattern is formed, or the thin film portions 35a, 35b,
  • the forward taper means that the taper angle is larger than 0 ° and is within the range of less than 90 °
  • the reverse taper means that the taper angle is larger than 90 ° and is within the range of less than 180 °. ..
  • the rectangle means that the taper angle is 90 °
  • the low taper means that the taper angle is larger than 0 ° and is within the range of 60 °.
  • the taper angle of the inclined side in the cross section of the cured pattern having the stepped shape included in the cured film obtained by curing the photosensitive composition of the present invention is the same as the preferable taper angle of the cured pattern having the low taper shape described above.
  • the thickness between the plane of the lower surface (horizontal side 37 side of the underlying substrate) surface and the plane of the upper surface of the cured pattern having a stepped shape contained in the cured film obtained by curing the photosensitive composition of the present invention is the largest.
  • the region having a thickness is referred to as a thick film portion 34, and the region having a thickness smaller than the thickness of the thick film portion 34 is referred to as a thin film portion 35a, 35b, 35c.
  • the film thickness of the thick film portion 34 is ( TFT) ⁇ m and the film thickness of the thin film portions 35a, 35b, 35c arranged on the thick film portion 34 via at least one step shape is (THT ) ⁇ m.
  • the film thickness difference ( ⁇ T FT-HT ) ⁇ m between (T FT ) and (T HT ) is preferably 0.5 ⁇ m or more, more preferably 1.0 ⁇ m or more, still more preferably 1.5 ⁇ m or more, respectively.
  • 2.0 ⁇ m or more is even more preferable, 2.5 ⁇ m or more is particularly preferable, and 3.0 ⁇ m or more is most preferable.
  • all of them are preferably 0.5 ⁇ m or more, more preferably 1.0 ⁇ m or more, further preferably 1.5 ⁇ m or more, further preferably 2.0 ⁇ m or more, particularly preferably 2.5 ⁇ m or more, and particularly preferably 3.0 ⁇ m or more.
  • the film thickness difference ( ⁇ T FT-HT ) ⁇ m is preferably 10.0 ⁇ m or less, more preferably 9.5 ⁇ m or less, further preferably 9.0 ⁇ m or less, further preferably 8.5 ⁇ m or less, and even more preferably 8.0 ⁇ m or less. Is particularly preferable.
  • the film thickness difference is 10.0 ⁇ m or less, the exposure amount at the time of forming a curing pattern having a stepped shape can be reduced, so that the effects of reducing the process time and improving the productivity become remarkable.
  • the cured product obtained by curing the photosensitive resin composition of the present invention has a cured pattern having a stepped shape, and the film thickness of the thick film portion 34 in the stepped shape of the cured pattern is ( TFT ) ⁇ m and the thin film portion.
  • the film thickness of 35a, 35b, 35c is ( THT ) ⁇ m
  • the film thickness (TFT) ⁇ m of the thick film portion 34 and the film thickness ( THT ) ⁇ m of the thin film portions 35a , 35b, 35c are general formulas. It is preferable to satisfy the relationship represented by ( ⁇ ) to ( ⁇ ).
  • T FT 2.0 ⁇ (T FT ) ⁇ 10.0 ( ⁇ ) 0.20 ⁇ ( THT ) ⁇ 7.5 ( ⁇ ) 0.10 ⁇ (T FT ) ⁇ (T HT ) ⁇ 0.75 ⁇ (T FT ) ( ⁇ ).
  • the film thickness (TFT) ⁇ m of the thick film portion 34 and the film thickness ( THT ) ⁇ m of the thin film portions 35a , 35b, 35c further satisfy the relationships represented by the general formulas ( ⁇ ) to ( ⁇ ). .. 2.0 ⁇ (T FT ) ⁇ 10.0 ( ⁇ ) 0.30 ⁇ ( THT ) ⁇ 7.0 ( ⁇ ) 0.15 ⁇ (T FT ) ⁇ (T HT ) ⁇ 0.70 ⁇ (T FT ) ( ⁇ ).
  • the film thickness (TFT) ⁇ m of the thick film portion 34 and the film thickness ( THT ) ⁇ m of the thin film portions 35a , 35b, 35c are within the above-mentioned ranges, the decrease in the yield of the panel is suppressed and the light emitting element in the organic EL display.
  • the ° is preferably 20 ° or higher, more preferably 40 ° or higher, from the viewpoint of suppressing color mixing between inks when forming an organic EL layer by inkjet coating.
  • the contact angle difference ( ⁇ CAw FT-HT ) ° with respect to pure water is preferably 90 ° or less, more preferably 70 ° or less.
  • the cured film obtained by curing the photosensitive resin composition of the present invention is a pixel dividing layer of an organic EL display
  • the cured film containing the pattern having the stepped shape described above has a thick film portion of propylene glycol monomethyl ether acetate.
  • the contact angle is (CAp FT ) °
  • the contact angle of the thin film portion with respect to propylene glycol monomethyl ether acetate is (CAp HT ) °
  • the contact angle difference between the (CAp FT ) ° and the (CAp HT ) ° is
  • the contact angle difference ( ⁇ CAp FT-HT ) ° with respect to propylene glycol monomethyl ether acetate is preferably 70 ° or less, more preferably 50 ° or less.
  • Display device provided with the cured product of the present invention
  • Examples of the display device of the present invention include an organic EL display, a quantum dot display, a micro LED display, an LED display, a liquid crystal display, a plasma display, or a field emission display.
  • the display device of the present invention preferably has an organic EL display, a quantum dot display, or a micro LED display, and more preferably an organic EL display.
  • the photosensitive resin composition of the present invention has features of suppressing the residue of the opening after development, suppressing the narrow mask bias of the opening pattern size after development, reducing the taper of the pattern shape after heat curing, and excellent halftone characteristics. It is possible. In addition, it is possible to achieve both low voltage drive of light emitting characteristics and improvement of reliability of light emitting elements. Therefore, the cured film obtained by curing the photosensitive resin composition of the present invention under the above-mentioned curing conditions is particularly used as a pixel dividing layer, a TFT flattening layer, a TFT protective layer, an interlayer insulating layer, or a gate insulating layer of an organic EL display. preferable. It is also preferable as a black matrix or a black column spacer.
  • the cured film can be particularly suitably provided for an organic EL display.
  • high brightness and power saving can be realized by high current flowing in low voltage drive, and durability of the organic EL display can be improved by high reliability of the light emitting element.
  • the photosensitive resin composition of the present invention is particularly suitable for use in forming a pixel dividing layer in an organic EL display. Further, since it has excellent halftone characteristics, it is particularly suitable for applications for collectively forming a stepped shape of a pixel dividing layer in an organic EL display.
  • the photosensitive resin composition of the present invention is preferably for the pixel dividing layer of an organic EL display.
  • the photosensitive resin composition of the present invention is used for collectively forming the stepped shape of the pixel dividing layer in the organic EL display.
  • the organic EL display provided with the cured film obtained by curing the photosensitive resin composition of the present invention has a polarizing film such as a linear polarizing plate, a 1/4 wave plate, or a circular polarizing plate on the light extraction side of the light emitting element. It is possible to suppress external light reflection without doing so. Therefore, it can be particularly preferably provided for a flexible organic EL display having a structure in which a cured film is laminated on a flexible substrate and having no polarizing film.
  • the flexible substrate a polyimide substrate, a polyethylene terephthalate substrate, a cycloolefin polymer substrate, a polycarbonate substrate, or a cellulose triacetate substrate is preferable.
  • the flexible organic EL display preferably has a curved display unit, a display unit that can be folded outward, or a display unit that can be folded inward.
  • the display device of the present invention is preferably a display device including the cured product of the present invention as one or more selected from the group consisting of a pixel dividing layer, a TFT flattening layer, and a TFT protective layer.
  • a display device provided with a cured product of the photosensitive resin composition according to the first aspect of the present invention or a cured product of the photosensitive resin composition according to the second aspect of the present invention comprises a cured product of the present invention as a pixel dividing layer.
  • the display device provided with the cured product of the present invention is preferably an organic EL display.
  • the display device provided with the cured product obtained by curing the photosensitive resin composition of the present invention has at least a substrate, a first electrode, a second electrode, and a pixel dividing layer. Further, a display device having an organic EL layer including a light emitting layer and / or a light extraction layer including a light emitting layer. The pixel dividing layer is formed so as to overlap a part on the first electrode. The organic EL layer including the light emitting layer and / or the light extraction layer including the light emitting layer has a laminated structure formed on the first electrode and between the first electrode and the second electrode.
  • the display device has at least a substrate, a first electrode, a second electrode, and a pixel dividing layer. Further, a display device having an organic EL layer including a light emitting layer and / or a light extraction layer including a light emitting layer. The pixel dividing layer is formed so as to overlap a part on the first electrode. The organic EL layer including the light emitting layer and / or the light extraction layer including the light emitting layer is formed on the first electrode and between the first electrode and the second electrode.
  • a display device in which the pixel dividing layer has a resin having a structural unit containing at least two (X-DL) phenolic hydroxyl groups.
  • the display device has at least a substrate, a first electrode, a second electrode, and a pixel dividing layer. Further, a display device having an organic EL layer including a light emitting layer and / or a light extraction layer including a light emitting layer. The pixel dividing layer is formed so as to overlap a part on the first electrode. The organic EL layer including the light emitting layer and / or the light extraction layer including the light emitting layer is formed on the first electrode and between the first electrode and the second electrode.
  • the pixel division layer is (X-DL) A resin having a structural unit containing at least two phenolic hydroxyl groups, (Y-DL) Resin having a structural unit containing a phenolic hydroxyl group and an aromatic group, and (Z-DL) A display device having at least one selected from the group consisting of a structural unit containing a phenolic hydroxyl group and a resin having a structural unit containing a second aromatic group.
  • the display device has at least a substrate, a first electrode, a second electrode, and a pixel dividing layer. Further, a display device having an organic EL layer including a light emitting layer and / or a light extraction layer including a light emitting layer. The pixel dividing layer is formed so as to overlap a part on the first electrode. The organic EL layer including the light emitting layer and / or the light extraction layer including the light emitting layer is formed on the first electrode and between the first electrode and the second electrode.
  • the pixel dividing layer has at least one selected from the group consisting of (III-DL) phenol resin, polyhydroxystyrene, phenol group-modified epoxy resin, and phenol group-modified acrylic resin.
  • the phenolic resin has one or more kinds selected from the group consisting of the structural units represented by any of the above-mentioned general formulas (31) to (35) and (38) to (40).
  • the polyhydroxystyrene has a structural unit represented by the above-mentioned general formula (91) and / or a structural unit represented by the above-mentioned general formula (92).
  • the phenol group-modified epoxy resin has a structure represented by the above-mentioned general formula (21) and / or a structure represented by the above-mentioned general formula (22).
  • a display device in which the phenol group-modified acrylic resin has a structure represented by the above-mentioned general formula (21) and / or a structure represented by the above-mentioned general formula (22).
  • the display device includes at least a substrate, a first electrode, a second electrode, and a pixel dividing layer. Further, a display device having an organic EL layer including a light emitting layer and / or a light extraction layer including a light emitting layer. The pixel dividing layer is formed so as to overlap a part on the first electrode. The organic EL layer including the light emitting layer and / or the light extraction layer including the light emitting layer is formed on the first electrode and between the first electrode and the second electrode.
  • the pixel dividing layer has at least one selected from the group consisting of (III-DL) phenol resin, polyhydroxystyrene, phenol group-modified epoxy resin, and phenol group-modified acrylic resin.
  • the pixel dividing layer further includes (IV-DL) phosphate ester structure, phosphonic acid structure, phosphonic acid ester structure, phosphite ester structure, phosphinic acid structure, phosphinic acid ester structure, hypophobic acid ester structure, and phosphate betaine.
  • the display device of the present invention has a substrate.
  • a glass substrate is preferable from the viewpoint of improving impact resistance.
  • the substrate is an oxide or metal (molybdenum, silver, copper, aluminum, chromium, titanium, etc.) having one or more selected from indium, tin, zinc, aluminum, and gallium as electrodes or wiring on glass. , Or a substrate on which CNT (Carbon Nano Tube) is formed.
  • a flexible substrate such as a polyimide substrate is preferable from the viewpoint of improving bendability.
  • the display device of the present invention has a first electrode and a second electrode.
  • a transparent electrode and a non-transparent electrode as the first electrode and the second electrode, light emission in the light emitting layer described later can be taken out to one side.
  • the transparent electrode and the non-transparent electrode have excellent electrical characteristics, can efficiently inject holes when used as an anode, and can efficiently inject electrons when used as a cathode. Complex characteristics are required.
  • the display device of the present invention has a transparent conductive oxide film layer containing at least one selected from the group consisting of indium, tin, zinc, aluminum, and gallium on the outermost layer on the light emitting layer side of the first electrode described above. It is more preferable to have a transparent conductive oxide film layer containing at least indium, and it is further preferable to have an amorphous transparent conductive oxide film layer containing at least indium. As the transparent conductive oxide film layer containing at least indium, ITO or IZO is preferable, and ITO is more preferable, from the viewpoint of reducing the voltage driving of the light emitting characteristics by adjusting the work function difference.
  • the first electrode has a single-layer structure or a multi-layer structure.
  • the first electrode is a transparent electrode, and a transparent conductive oxide film layer containing indium is preferable.
  • the first electrode has a multilayer structure, the first electrode is a transparent electrode or a non-transparent electrode, and it is preferable that the outermost layer on the light emitting layer side of the first electrode has a transparent conductive oxide film layer containing at least indium.
  • the second electrode is a single-layer structure transparent electrode, a multi-layer structure transparent electrode, a single-layer structure non-transparent electrode, or a multi-layer structure non-transparent electrode.
  • the first electrode described above is a transparent electrode
  • the second electrode is a non-transparent electrode.
  • the second electrode is a transparent electrode.
  • the above-mentioned first electrode has a multilayer structure including at least a transparent conductive oxide film layer and a non-transparent conductive metal layer, and at least indium is formed on the outermost layer on the light emitting layer side of the first electrode.
  • the non-transparent conductive metal layer has an alloy layer containing at least silver and has a top-emission type structure, and has an amorphous conductive oxide film layer containing.
  • the display device of the present invention has a pixel dividing layer, and the pixel dividing layer is formed so as to overlap a part on the first electrode described above.
  • the pixel dividing layer a cured film obtained by curing the above-mentioned photosensitive resin composition is preferable.
  • the pixel dividing layer so as to overlap a part on the first electrode, it is possible to insulate the first electrode of an arbitrary pixel from the second electrode described later of the pixel, and the first electrode and the first electrode. It is possible to suppress pixel non-lighting due to a short circuit with the second electrode. Further, the first electrode of an arbitrary pixel and the first electrode of a pixel adjacent to the pixel can be insulated, and the non-lighting of the pixel due to a short circuit between the first electrodes can be suppressed.
  • the display device of the third aspect of the present invention has a resin having a structural unit containing at least two (X-DL) phenolic hydroxyl groups.
  • the above-mentioned pixel dividing layer is a resin having a structural unit containing at least two (X-DL) phenolic hydroxyl groups. It is preferable to have.
  • the pixel dividing layer described above has the above-mentioned pixel division layer.
  • (X-DL) A resin having a structural unit containing at least two phenolic hydroxyl groups (hereinafter, “(X-DL) resin in a pixel dividing layer”), A resin having a structural unit containing a (Y-DL) phenolic hydroxyl group and an aromatic group (hereinafter, “(Y-DL) resin in a pixel dividing layer”), and (Z-DL) Selected from the group consisting of a structural unit containing a phenolic hydroxyl group and a resin having a structural unit containing a second aromatic group (hereinafter, "(Z-DL) resin in a pixel-divided layer”).
  • the pixel division layer described above is the (X-DL) resin in the pixel division layer and the (Y-DL) resin in the pixel division layer. , And one or more selected from the group consisting of (Z-DL) resin in the pixel dividing layer.
  • the pixel division layer described above has the (X-DL) resin in the pixel division layer, and the (Y-DL) resin and / or the pixel division layer in the pixel division layer. It is preferable to have the (Z-DL) resin in the pixel dividing layer.
  • the aromatic group is an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded.
  • the second aromatic group is an aromatic group excluding the aromatic ring to which the phenolic hydroxyl group is bonded.
  • the second aromatic group is a name for distinguishing an aromatic group (meaning an aromatic group different from the aromatic ring to which the phenolic hydroxyl group is bonded) in the (Y-DL) resin.
  • the above-mentioned pixel dividing layer is selected from the group consisting of at least (III-DL) phenol resin, polyhydroxystyrene, phenol group-modified epoxy resin, and phenol group-modified acrylic resin. It has one or more types (hereinafter, "(III-DL) resin in the pixel dividing layer"). These resins contain a phenolic hydroxyl group as the main acidic group in the resin. In addition, these resins contain an aromatic ring skeleton in the main chain of the resin and / or the side chain of the resin.
  • the phenol resin in the (III-DL) resin in the pixel division layer, is any of the general formulas (31) to (35) and (38) to (40).
  • the polyhydroxystyrene has a structural unit represented by the general formula (91) and / or a structural unit represented by the general formula (92).
  • the phenol group-modified epoxy resin has a structure represented by the general formula (21) and / or a structure represented by the general formula (22).
  • the phenol group-modified acrylic resin has a structure represented by the general formula (21) and / or a structure represented by the general formula (22) (hereinafter, “specific (III-DL) resin in the pixel dividing layer””. ).
  • the pixel division layer described above has the (III-DL) resin in the pixel division layer, and the pixel division layer is contained. It is more preferable to have a specific (III-DL) resin in the layer.
  • e and f are independently integers of 1 to 4, respectively.
  • the specific (III-DL) resin in the pixel division layer is preferably a resin having a structure derived from the above-mentioned specific (A3) resin.
  • the (X-DL) resin in the pixel division layer is preferably a resin having a structure derived from the above-mentioned (A3x) resin.
  • the (Y-DL) resin in the pixel division layer is preferably a resin having a structure derived from the above-mentioned (A3y) resin.
  • the (Z-DL) resin in the pixel division layer is preferably a resin having a structure derived from the above-mentioned (A3z) resin.
  • the (X-DL) resin in the pixel division layer is selected from the group consisting of the structural units represented by any of the above-mentioned general formulas (31) to (33), (35), and (40). It is preferable to have more than one kind.
  • the (Y-DL) resin in the pixel dividing layer preferably has a structural unit represented by the general formula (38) and / or a structural unit represented by the general formula (39). It is also preferable that the structural unit is represented by the general formula (34) and f and g are 0 in the general formula (34).
  • the (III-DL) resin in the pixel division layer is preferably a resin having a structure derived from the above-mentioned (A3) resin.
  • the (III-DL) resin in the pixel dividing layer includes the above-mentioned general formulas (31) to (36) and (38) to (40), general formulas (91) to (92), and general formulas (101) to. It is also preferable to have one or more selected from the group consisting of the structural units represented by (103) and the general formulas (121) to (122), and the general formulas (31) to (36) and (38). )-(40), and it is more preferable to have one or more selected from the group consisting of structural units represented by any of the general formulas (101)-(103).
  • the (III-DL) resin in the pixel division layer, the (X-DL) resin in the pixel division layer, the (Y-DL) resin in the pixel division layer, and the (Z-DL) resin in the pixel division layer It is also preferable that a part of the phenolic hydroxyl group contained in the resin reacts with other resins or compounds to form a crosslinked structure for the specific (III-DL) in the pixel dividing layer. It is also preferable that a part of the alkoxyalkyl group and / or the hydroxyalkyl group contained in the resin reacts with another resin or compound to form a crosslinked structure.
  • the above-mentioned pixel division layer is a resin having at least one selected from the group consisting of an (I-DL) imide structure, an amide structure, an oxazole structure, and a siloxane structure (hereinafter, "pixel division”.
  • R 67 to R 69 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. a is 0 or 1. * 1 represents the bonding point in the resin.
  • the (I-DL) resin in the pixel division layer and / or the (II-DL) resin in the pixel division layer By having the (I-DL) resin in the pixel division layer and / or the (II-DL) resin in the pixel division layer, the effect of lowering the voltage driving of the light emitting characteristics and improving the reliability of the light emitting element can be obtained. It becomes remarkable.
  • the (I-DL) resin in the pixel division layer a resin having at least one selected from the group consisting of an imide structure, an amide structure, and an oxazole structure is preferable.
  • the (I-DL) resin in the pixel division layer is preferably a resin having a structure derived from the above-mentioned (A1) resin.
  • the (II-DL) resin in the pixel division layer is preferably a resin having a structure derived from the above-mentioned (A2) resin.
  • the (I-DL) resin in the pixel division layer is selected from the group consisting of the structural units represented by any of the above-mentioned general formulas (1) to (5) and general formulas (8) to (9). It is preferable to have one or more of them, and it is more preferable to have a structural unit represented by the general formula (1) and / or a structural unit represented by the general formula (5).
  • Examples of the (II-DL) resin in the pixel dividing layer include the above-mentioned (1) to (5), general formulas (8) to (9), general formula (41), and general formulas (61) to (63).
  • the pixel dividing layer described above further comprises an (IV-DL) phosphoric acid ester structure, a phosphonic acid structure, and a phosphonic acid ester structure.
  • Subphosphate ester structure, phosphinic acid structure, phosphinic acid ester structure, hypophobic acid ester structure, phosphoric acid betaine ester structure, phosphonic acid betaine structure, phosphonic acid betaine ester structure, phosphite betaine ester structure, phosphinic acid betaine structure One or more selected from the group consisting of compounds having a phosphinic acid betaine ester structure or a hypophobic acid betaine ester structure (hereinafter, "a compound having a (IV-DL) phosphate-based structure") may be contained. preferable.
  • the pixel dividing layer described above contains a compound having a (IV-DL) phosphoric acid-based structure.
  • the effects of lowering the voltage driving of the light emitting characteristics and improving the reliability of the light emitting element become remarkable. It is presumed that when the pixel dividing layer contains a compound having these structures, the effect of improving the conductivity on the surface of the conductive oxide film layer corresponding to the opening of the pixel dividing layer becomes remarkable. Further, when the opening of the pixel dividing layer is formed, the component derived from the compound having these structures surface-modifies the surface of the conductive oxide film layer, so that the work function on the surface of the conductive oxide film layer is increased. It is considered that the effect of improving the light emission characteristics and the reliability will be remarkable after the adjustment.
  • the compound having a (IV-DL) phosphate-based structure it is more preferable to contain at least one selected from the group consisting of compounds having a phosphonic acid structure, a phosphonic acid ester structure, or a phosphonic acid ester structure. It is more preferable to contain a compound having a phosphonic acid structure and / or a compound having a phosphonic acid ester structure.
  • the compound having a (IV-DL) phosphate-based structure is preferably a compound having a structure derived from the above-mentioned (F0) compound and / or a compound having a structure derived from the (FB) compound, and is described above. It is more preferable that the compound has a structure derived from the (F1) compound and / or the compound has a structure derived from the (FB1) compound.
  • the pixel dividing layer described above further contains (D1a) a black pigment.
  • the (D1a) black pigment contains the above-mentioned specific (D1a) black pigment, and it is further preferable that the (D1a-1a) benzofuranone-based black pigment is contained.
  • the above-mentioned pixel division layer is a compound having a structure represented by either the general formula (161) or the general formula (162), their geometric isomers, their salts, their salts, and the general formula; One or more selected from the group consisting of compounds having a structure represented by any of (164) to (166), salts thereof; compounds having a structure represented by the general formula (168), and salts thereof. It is also preferable to contain. It is more preferable that the pixel dividing layer described above contains a compound having a structure represented by either the general formula (161) or the general formula (162).
  • the display device of the present invention has a structure in which the pixel dividing layer described above is further represented by any of the general formulas (141) to (147) from the viewpoint of improving the reliability of the light emitting element and improving the contrast of the display device. It is preferable to contain at least one selected from the group consisting of the compounds having the same.
  • the compound having the structure in the pixel division layer is preferably a compound having a structure derived from the compound (B1).
  • the above-mentioned pixel dividing layer further has a fluorene structure, a benzofluorene structure, a dibenzofluorene structure, an indene structure, an indan structure, and a benzoin.
  • benzoindan structure Den structure, benzoindan structure, carbazole structure, dibenzofuran structure, dibenzothiophene structure, benzocarbazole structure, indole structure, indoline structure, benzoindole structure, benzoindoline structure, or diphenylsulfide structure with imino group bonded, and / Alternatively, it preferably contains a compound having a structure in which a carbonyl group is bonded.
  • the compound having the structure in the pixel division layer is preferably a compound having a structure derived from the (C1-1) oxime ester compound.
  • the display device of the present invention has a structure in which the pixel dividing layer described above is further represented by any of the general formulas (171) to (177) from the viewpoint of improving the reliability of the light emitting element and improving the contrast of the display device. It is preferable to contain at least one selected from the group consisting of the compounds having the same.
  • the compound having the structure in the pixel division layer is preferably a compound having a structure derived from the (G1) compound.
  • the display device of the present invention has an organic EL layer including a light emitting layer, and the organic EL layer including the light emitting layer is placed on the above-mentioned first electrode and between the above-mentioned first electrode and the above-mentioned second electrode. It is formed.
  • the organic EL layer including the light emitting layer is formed on the first electrode and between the first electrode and the second electrode, a region corresponding to the light emitting pixel portion can be formed.
  • the organic EL layer preferably further has a hole transport layer and / or an electron transport layer, and it is preferable to form the organic EL layer so as to have a laminated structure with the light emitting layer.
  • Examples of the structure of the organic EL layer include (1) a hole transport layer / a light emitting layer, (2) a hole transport layer / a light emitting layer / an electron transport layer, or (3) a light emitting layer / an electron transport layer. Be done.
  • Various studies have been made on the structure of the organic EL layer in order to comprehensively improve the injection and transport of holes and electrons, the luminous efficiency in the light emitting layer, and the like, and the preferable structure is described in JP-A-8-109373. Examples thereof include organic EL elements.
  • step 1 a thin film transistor (hereinafter, "TFT") 2 is formed on a glass substrate 1, a photosensitive material for a TFT flattening film is formed, a pattern is processed by photolithography, and then the film is thermally cured.
  • TFT thin film transistor
  • step 2 a silver-palladium-copper alloy (hereinafter, “APC”) is formed by sputtering, and a pattern is processed by etching using a photoresist to form an APC layer, and further, an upper layer of the APC layer is formed.
  • Indium tin oxide hereinafter referred to as “ITO” is formed into a film by sputtering and patterned by etching using a photoresist to form a reflective electrode 4 as a first electrode.
  • step 3 the photosensitive resin composition of the present invention is applied and prebaked to form a prebaked film 5a.
  • step 4 the active chemical line 7 is irradiated through the mask 6 having a desired pattern.
  • step 5 development and pattern processing, bleaching exposure and middle baking are performed as necessary. Further, by heat-curing, a cured pattern 5b having a desired pattern is formed as a pixel dividing layer having a light-shielding property.
  • step 6) the EL light emitting material is formed into a film by thin film deposition through a mask to form an organic EL layer 8, and a magnesium-silver alloy (hereinafter, “MgAg”) is formed into a film by thin film deposition to form a photoresist.
  • MgAg magnesium-silver alloy
  • the transparent electrode 9 is formed as the second electrode by pattern processing by etching.
  • step 7 a photosensitive material for a flattening film is formed, a pattern is processed by photolithography, and then heat-cured to form a cured film 10 for flattening, and then a cover glass 11 is bonded.
  • the method for producing a cured product of the present invention preferably has the following steps (1) to (4).
  • a step of forming a coating film of the photosensitive resin composition of the present invention on a substrate (2) A step of irradiating a coating film of a photosensitive resin composition with an active chemical ray via a photomask.
  • a step of developing with an alkaline solution to form a pattern of the photosensitive resin composition and (4) A step of heating the pattern to obtain a cured pattern of the photosensitive resin composition.
  • the photomask includes a light-transmitting portion and a light-shielding portion, the transmittance between the light-transmitting portion and the light-shielding portion is lower than the value of the light-transmitting portion, and the transmittance is light-shielding. It is preferable to use a halftone photomask having a translucent portion, which is higher than the value of the portion.
  • the production method described in International Publication No. 2019/087955 may be applied.
  • the method for producing a cured product using the photosensitive resin composition of the present invention includes (1) a step of forming a coating film of the photosensitive resin composition on a substrate.
  • the method for forming the photosensitive resin composition include a method of applying the photosensitive resin composition on the substrate and a method of applying the photosensitive resin composition on the substrate in a pattern. ..
  • the substrate may be, for example, an oxide, metal (molybdenum, silver, copper, aluminum, chromium, or titanium) containing one or more selected from indium, tin, zinc, aluminum, and gallium as electrodes or wiring on glass. Etc.), or a substrate on which CNT (Carbon Nano Tube) is formed is used.
  • the oxide containing one or more selected from indium, tin, zinc, aluminum, and gallium include indium tin oxide (ITO).
  • ⁇ Method of applying the photosensitive resin composition on the substrate examples include spin coating, curtain flow coating, spray coating, and slit coating.
  • the coating film thickness varies depending on the coating method, the solid content concentration and the viscosity of the photosensitive resin composition, etc., but usually, the film thickness after coating and prebaking is 0.1 to 30 ⁇ m. It is preferable to apply the photosensitive resin composition on the substrate and then prebake to form a film.
  • the prebake can use an oven, a hot plate, infrared rays, a flash annealing device, a laser annealing device, or the like.
  • the prebake temperature is preferably 50 to 150 ° C.
  • the prebake time is preferably 30 seconds to 10 minutes. Further, prebaking may be performed in two or more stages, such as prebaking at 80 ° C. for 2 minutes and then prebaking at 120 ° C. for 2 minutes.
  • Examples of the method for patterning the coating film of the photosensitive resin composition formed on the substrate include a method of directly patterning by photolithography and a method of patterning by etching. From the viewpoint of reducing the number of processes and shortening the process time, a method of directly pattern processing by photolithography is preferable.
  • the method for producing a cured product using the photosensitive resin composition of the present invention includes (2) a step of irradiating the coating film of the above-mentioned photosensitive resin composition with an active chemical ray via a photomask.
  • Examples of the method of irradiating the active chemical beam through the photomask include a method of patterning exposure using an exposure machine such as a stepper, a scanner, a mirror projection mask aligner (MPA), or a parallel light mask aligner (PLA). Be done.
  • the photomask is a photomask having a pattern including a translucent portion and a light-shielding portion, and has a transmittance lower than the value of the translucent portion and a transmittance between the translucent portion and the light-shielding portion. It is preferable to use a halftone photomask having a semi-transmissive portion, which is higher than the value of the light-shielding portion. By exposing with a halftone photomask, it is possible to form a pattern having a stepped shape after development.
  • a portion formed from an exposed portion irradiated with active chemical rays through the translucent portion corresponds to a thick film portion, and the semitranslucent portion corresponds to the thick film portion.
  • the portion formed from the halftone portion irradiated with the active chemical beam through the portion corresponds to the thin film portion.
  • the exposure wavelength of the active chemical beam is preferably 150 nm or more, more preferably 300 nm or more. On the other hand, the exposure wavelength is preferably 450 nm or less, more preferably 420 nm or less.
  • the active chemical line is a mercury lamp j-line (wavelength 313 nm), i-line (wavelength 365 nm), h-line (wavelength 405 nm), g-line (wavelength 436 nm), or a mixed line of i-line, h-line and g-line. Is particularly preferable.
  • a XeF (wavelength 351 nm) laser, an XeCl (wavelength 308 nm) laser, a KrF (wavelength 248 nm) laser, an ArF (wavelength 193 nm) laser, or the like may be used.
  • the exposure amount of the active chemical line is preferably 100 J / m 2 (10 mJ / cm 2 ) to 30,000 J / m 2 (3,000 mJ / cm 2 ) or less in terms of i-line illuminance value.
  • post-exposure baking may be performed. By baking after exposure, it is possible to improve the resolution after development or expand the allowable range of development conditions.
  • the method for producing a cured product using the photosensitive resin composition of the present invention includes (3) a step of developing with an alkaline solution to form the pattern of the photosensitive resin composition described above.
  • Examples of the method of developing with an alkaline solution after irradiating the active chemical beam through a photomask include a method of developing with an automatic developing machine.
  • Examples of the developing method include paddle development, spray development, and dip development. When it has a negative type photosensitive, the unexposed part can form a pattern removed by the developer, and when it has a positive type photosensitive, the exposed part can form a pattern removed by the developer.
  • an alkaline solution is preferable, and an organic alkaline solution or an aqueous solution of a compound showing alkalinity is preferable.
  • the alkaline solution include diethanolamine, trimethylamine, triethylamine, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, tetramethylammonium hydroxide, and tetraethylammonium hydroxide.
  • An organic solvent may be used as the developer.
  • a mixed solution containing both an organic solvent and a poor solvent for the photosensitive resin composition may be used.
  • the alkaline concentration of the alkaline solution is preferably 0.01 to 5% by mass.
  • the development time is preferably 30 seconds to 10 minutes.
  • a rinsing solution When an alkaline aqueous solution is used as the developing solution, water is preferable as the rinsing solution.
  • a rinsing solution an aqueous solution of alcohols, an aqueous solution of esters, an aqueous solution of an acidic compound, or an organic solvent may be used.
  • post-development exposure may be performed. By exposure after development, it is possible to improve the resolution after thermosetting, control the pattern shape after thermosetting, and form a pattern having a stepped shape after thermosetting. Further, after development, middle baking may be performed. By middle baking, it is possible to improve the resolution after thermosetting and control the pattern shape after thermosetting.
  • the method for producing a cured film using the photosensitive resin composition of the present invention is as follows: (4) The pattern of the above-mentioned photosensitive resin composition is heated and cured to obtain the above-mentioned curing pattern of the photosensitive resin composition. Has a process. Examples of the method for heating the pattern of the photosensitive resin composition include a method of heating using an oven, a hot plate, infrared rays, a flash annealing device, or a laser annealing device. By heating and thermally curing the pattern of the photosensitive resin composition, the heat resistance of the cured film can be improved and a pattern having a low taper shape can be formed.
  • the temperature for thermosetting is preferably 150 to 500 ° C.
  • the time for heat curing is preferably 5 to 300 minutes. Further, it may be heat-cured in two or more stages, such as heat-curing at 150 ° C. for 30 minutes and then heat-curing at 250 ° C. for 30 minutes.
  • the heat-curing treatment atmosphere includes, for example, an atmosphere of air, oxygen, nitrogen, helium, neon, argon, krypton or xenon, and a gas atmosphere containing 1 to 10,000 ppm (0.0001 to 1% by mass) of oxygen. Alternatively, it may be under vacuum.
  • Bk-S0084 A compound represented by the general formula (164); "PALIOGEN” (registered trademark) BLACK S0084 (manufactured by BASF; a perylene-based black pigment having a primary particle diameter of 50 to 100 nm).
  • Bk-S0100CF A mixture of a compound represented by the general formula (161) and a compound represented by the general formula (162); "IRGAPHOR” (registered trademark) BLACK S0100CF (manufactured by BASF; with a primary particle diameter of 40 to 80 nm).
  • BHPP 1,1-bis [3-hydroxymethyl-4-hydroxyphenyl] propane
  • BIP 1,1-bis (4-hydroxyphenyl) propane BMMB :, 4,4'-bis (methoxymethyl) biphenyl
  • BPFL 9 , 9'-bis (4-hydroxyphenyl) fluorene
  • BPI N 3,3'-bis (4-hydroxyphenyl) -1-isodolinone
  • BPL biphenol cyEpoTMS: 2- (3,4-epoxycyclohexyl) ethyltrimethoxy Silane
  • DHBA 3,5-Dihydroxybenzoic acid
  • EDM Diethylene glycol ethylmethyl ether
  • GAD Glutalaldehyde
  • GMA Glycidyl methacrylate
  • HA Hydroxy group-containing diamine compound represented by the following formula HAD: Formaldehyde HPMA: Methacrylate (4-hydroxy) Phenyl HPMI: N- (4-Hyd
  • Synthesis Examples 1, 2, 4, 5, 9, 10, and 38-45 are the methods according to International Publication No. 2017/052781.
  • Synthesis Examples 3, 11-13, 17-19, 21-27, 29, 31, and 32 are the methods according to International Publication No. 2017/159876.
  • Synthesis Example 6 is the method described in International Publication No. 2017/051743.
  • Synthesis Examples 7 and 8 are the methods described in International Publication No. 2018/159384.
  • Synthesis Example 14 is the method described in International Publication No. 2012/141165.
  • Synthesis Example 15 is the method described in International Publication No. 2016/103850.
  • Synthesis Examples 16 and 20 are the methods described in International Publication No. 2014/046062.
  • Synthesis Examples 28 and 30 are the methods described in International Publication No. 2016/171179.
  • Synthesis Examples 33 to 37 are the methods described in JP-A-2020-042150.
  • synthesis examples 3, 8, 12, 19, 29, 30, 32, 34, 35, 37, 39, 41, 43, 44, and 45 are based on the method described in International Publication No. 2017/159876.
  • An ethylenically unsaturated double bond was introduced.
  • an unsaturated carboxylic acid was reacted with NC-3500 having an epoxy group, and all of the epoxy groups derived from NC-3500 were ring-opened and added.
  • Synthesis Examples 12, 19, 29, 30, 44, and 45 GMA having an epoxy group was reacted, and all the epoxy groups of GMA were ring-opened and added.
  • Synthesis Examples 31, 32, and 38 to 43 a compound having an unsaturated double bond group or a carboxy group-containing phenol compound is reacted with a structural unit derived from GMA having an epoxy group, and an epoxy derived from GMA is reacted. All rings were added to the group.
  • the carboxy group-containing phenol compound is reacted with the structural unit derived from NC-3000-H having an epoxy group, and all the rings are opened with respect to the epoxy group derived from NC-3000-H. It was added.
  • HA hydroxy group-containing diamine compound having the following structure used in Synthesis Example 4 was synthesized by a known method based on the method described in International Publication No. 2016/056451.
  • Synthesis Examples 14 and 15 a phenol compound having the following structure was synthesized as a condensation reaction product of XLN and SAD, and the obtained phenol compound was used for the condensation reaction with the aldehyde compound.
  • Preparation example of each pigment dispersion liquid The compositions of the dispersions obtained in Preparation Examples 1 to 7 as the pigment dispersions are collectively shown in Table 2-1.
  • Preparation Examples 1 to 7 were prepared based on the method described in International Publication No. 2019/087958, and each pigment dispersion was prepared by a known method.
  • the surface-coated benzofuranone-based black pigment (Bk-CBF1) used in Preparation Example 6 and the surface-coated perylene-based black pigment (Bk-CBF2) used in Preparation Example 7 are described in International Publication No. 2019/087955. Was synthesized by a known method.
  • the polyalkylene amine-polyoxyalkylene ether-based dispersant (ADP) used in Preparation Examples 1 to 7 has a structure represented by the general formula (26), a structure represented by the general formula (29), and a structure represented by the general formula (29). It is a pigment dispersant having a (E1) basic group having a polyoxyalkylene structure.
  • the ADP used in Preparation Examples 1 to 7 was synthesized by a known method based on the method described in JP-A-2020-070352.
  • methylol equivalent a sample in which a methylol group was acetylated was prepared, and the methylol equivalent (unit: g / mol) was calculated from the methylol value measured by the potentiometric titration method in the same manner.
  • a 100 g / L potassium iodide aqueous solution as a capture aqueous solution for unreacted iodine
  • a 0.1 mol / L sodium thiosulfate aqueous solution as a titration reagent
  • the iodine value of the resin was measured by the Wies method based on the method described in "Section 6 Iodine value” of "Test method for value, saponification value, ester value, iodine value, hydroxyl value, and unsaponifiable matter". ..
  • the double bond equivalent (unit: g / mol) was calculated from the measured iodine value (unit: gI / 100 g).
  • the pigment dispersion is 1.0 ⁇ 10-5 .
  • Dilute to a concentration of ⁇ 40% by volume set the refractive index of the diluting solvent to the refractive index of PGMEA, set the refractive index to be measured to 1.6, and irradiate with laser light having a wavelength of 633 nm in the pigment dispersion.
  • the number average particle size of the pigment was measured.
  • ITO was sputtered to form a 10 nm glass substrate (manufactured by Geomatec; hereinafter, “ITO / Ag substrate”) using a desktop optical surface treatment device (PL16-110; manufactured by Sen Special Light Source Co., Ltd.) for 100 seconds. It was used after being washed with UV-O3.
  • the Tempax glass substrate (manufactured by AGC Techno Glass Co., Ltd.) was used without pretreatment.
  • a post-development film of the composition was prepared by the method described in Example 1 below. Using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation), the resolution pattern of the prepared post-development film was observed. As an index of the development residue, the presence or absence of the residue of the pattern corresponding to the opening was observed in the line and space pattern of 20 ⁇ m. Judging as follows, A +, A, B +, B, C + and C in which the abundance area of the residue is 20% or less are accepted, and the abundance area of the residue is 10% or less, A +, A, B + and B was good, and A + and A, in which the abundance area of the residue was 3% or less, were excellent.
  • Mask Bias A film after development of the composition was prepared by the method described in Example 1 below. Using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation), observe the resolution pattern of the produced post-development film, and in a line-and-space pattern with a mask size of 20 ⁇ m, a pattern corresponding to the opening. The opening dimension (CD DEV ) ⁇ m was measured. As for the exposure amount, when the aperture size (CD DEV ) ⁇ m is less than 20 ⁇ m and the prebaked film thickness is ( TPB ) ⁇ m and the developed film thickness (T DEV ) ⁇ m, the developed residual film ratio (((TPV)) ⁇ m.
  • the minimum exposure amount was set so that T DEV ) / ( TPB ) ⁇ 100) was 70% or more.
  • the aperture size difference ((CD DEV ) -20) ⁇ m from the mask size of 20 ⁇ m was calculated. Judging as follows, A +, A, B +, B, C + and C, which have an opening dimension difference of 3.0 ⁇ m or less from the mask dimension, are accepted, and the opening dimension difference from the mask dimension is 2.0 ⁇ m or less. A +, A, B + and B were good, and A + and A were excellent, with an opening size difference of 1.0 ⁇ m or less from the mask size.
  • Opening dimension difference from mask dimension is 0.5 ⁇ m or less
  • C Opening dimension difference from mask dimension exceeds 2.5 ⁇ m and 3.0 ⁇ m or less
  • Pattern cross-sectional shape A cured film of the composition was prepared by the method described in Example 1 below. Using a field emission scanning electron microscope (S-4800; manufactured by Hitachi High-Technologies Corporation), observe the cross section of the line-and-space pattern with a space dimension width of 20 ⁇ m among the resolution patterns of the thermocured film produced. The taper angle of the cross section was measured. Judging as follows, A +, A, B +, B, C + and C having a cross-sectional taper angle of 60 ° or less are accepted, and the cross-sectional taper angle is 45 ° or less, A +, A, B + and B was good, and A + and A, in which the taper angle of the cross section was 30 ° or less, were excellent.
  • S-4800 field emission scanning electron microscope
  • the taper angle of the cross section is 25 ° or less
  • a prebake film of the composition is formed on an ITO / Ag substrate with a film thickness of 5 ⁇ m by the method described in Example 1 below, and a double-sided alignment single-sided exposure apparatus (mask aligner PEM-6M; union) is formed.
  • a halftone photomask for evaluating halftone characteristics manufactured by Kogaku Co., Ltd.
  • the i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength) of an ultra-high pressure mercury lamp are changed by changing the exposure amount.
  • the transmittance (% THT )% of the translucent portion is 20%, 25%, 30%, 35%, 40%, or 50% of the transmittance (% TFT ) of the translucent portion, respectively. Has a place.
  • FIG. 3 shows an example of the arrangement and dimensions of the translucent portion 41, the light-shielding portion 42, and the semi-translucent portion 43.
  • the film thickness ( TFT ) ⁇ m after development of the thick film portion was measured for the resolution pattern having the stepped shape of the produced post-development film.
  • the film thickness ( THT ) ⁇ m after development is measured at locations having different transmittances, and the minimum film thickness ( THT / min ) ⁇ m of the thin film portion remaining after development is obtained. rice field.
  • the maximum step film thickness ((TFT)-( THT / min )) ⁇ m was calculated as an index of the halftone characteristic.
  • a +, A, B +, B, C + and C having a maximum step film thickness of 0.5 ⁇ m or more are accepted, and the maximum step film thickness is 1.0 ⁇ m or more, A +, A, B + and B were good, and A + and A, which had a maximum step film thickness of 2.0 ⁇ m or more, were excellent.
  • the maximum step film thickness in the step shape is 2.5 ⁇ m or more
  • the maximum step film thickness of the pattern in the step shape is 2.0 ⁇ m or more and less than 2.5 ⁇ m B +: The maximum step film thickness in the step shape is 1.5 ⁇ m or more And less than 2.0 ⁇ m
  • B: Maximum step film thickness in step shape is 1.0 ⁇ m or more and less than 1.5 ⁇ m
  • C +: Maximum step film thickness in step shape is 0.7 ⁇ m or more and less than 1.0 ⁇ m
  • Step shape The maximum step film thickness in the step shape is 0.4 ⁇ m or more and less than 0.7 ⁇ m
  • D The maximum step film thickness in the step shape is 0.1 ⁇ m or more and less than 0.4 ⁇ m
  • the maximum step film thickness in the step shape is less than 0.1 ⁇ m Or, it is impossible to measure because there is no residual film after development.
  • thermosetting film of the composition was prepared on a Tempax glass substrate by the method described in Example 1 below.
  • a transmission densitometer (X-Rite 361T (V); manufactured by X-Rite)
  • I 0 incident light intensity
  • I transmitted light intensity
  • FIG. 4 shows a schematic view of the used substrate.
  • the pattern was processed by etching to form an APC layer.
  • an amorphous ITO as a transparent conductive oxide film layer was formed on the upper layer of the APC layer by sputtering at 10 nm, and a reflective electrode was formed as the first electrode 48 by etching.
  • an auxiliary electrode 49 was also formed at the same time in order to take out the second electrode (FIG. 4 (step 1)).
  • the obtained substrate was ultrasonically cleaned with "Semicoclean” (registered trademark) 56 (manufactured by Furuuchi Chemical Co., Ltd.) for 10 minutes, and then washed with ultrapure water.
  • the composition is applied and prebaked on this substrate by the method described in Example 1, patterned exposure, development and rinsing via a photomask having a predetermined pattern, and then heated and thermoset. rice field.
  • openings having a width of 70 ⁇ m and a length of 260 ⁇ m are arranged at a pitch of 155 ⁇ m in the width direction and a pitch of 465 ⁇ m in the length direction, and the pixel dividing layer 50 having a shape in which each opening exposes the first electrode is provided.
  • the effective area of the substrate was 16 mm square, and the thickness of the pixel dividing layer 50 was about 1.0 ⁇ m.
  • an organic EL display was manufactured using a substrate on which the first electrode 48, the auxiliary electrode 49, and the pixel dividing layer 50 were formed.
  • an organic EL layer 51 including a light emitting layer was formed by a vacuum vapor deposition method (FIG. 4 (step 3)).
  • the degree of vacuum during vapor deposition was 1 ⁇ 10 -3 Pa or less, and the substrate was rotated with respect to the vapor deposition source during vapor deposition.
  • the compound (HT-1) was deposited at 10 nm as the hole injection layer, and the compound (HT-2) was deposited at 50 nm as the hole transport layer.
  • a compound (GH-1) as a host material and a compound (GD-1) as a dopant material were deposited on the light emitting layer to a thickness of 40 nm so that the doping concentration was 10%.
  • compound (ET-1) and compound (LiQ) were laminated to a thickness of 40 nm at a volume ratio of 1: 1.
  • the compounds used in the organic EL layer (compound (HT-1), compound (HT-2), compound (GH-1), compound (GD-1), compound (ET-1), and compound (LiQ)). ) Used the same compounds as those described in International Publication No. 2017/052781.
  • a cap-shaped glass plate was bonded using an epoxy resin adhesive to seal the mixture, and four 5 mm square bottom-emission organic EL displays were produced on one substrate. ..
  • the film thickness referred to here is a crystal oscillation type film thickness monitor display value.
  • the organic EL display produced by the above method was made to emit light by direct current drive until the current density reached 30 mA / cm 2 by sequentially changing the voltage value from the low voltage side.
  • the voltage value and the current density when the voltage value was sequentially changed from the low voltage side were plotted, and the voltage value at which the current density was 10 mA / cm 2 was obtained as an index of the current density-voltage characteristic. Judging as follows, A +, A, B +, B, C + and C having a voltage value of 4.5V or less are accepted, and A +, A, B + and B having a voltage value of 4.0V or less are accepted.
  • Voltage value with a predetermined current density exceeds 3.7V and 4.0V or less
  • the organic EL display produced by the above method was made to emit light at 10 mA / cm 2 by direct current drive, and it was observed whether there was a light emission defect such as a non-light emitting region or uneven brightness. Moreover, as a durability test, it was held at 80 ° C. for 500 hours. After the durability test, the organic EL display is made to emit light at 10 mA / cm 2 by direct current drive, and it is observed whether there is any change in the light emission characteristics. The area of the light emitting region of was measured.
  • a +, A, B +, B, C + and C having a light emitting area area of 80% or more are accepted, and A +, A, B + and B having a light emitting area area of 90% or more are accepted.
  • each resin has the following structural units.
  • Polyimides (PI-1) to (PI-3) are structural units represented by the general formula (1). Note that (PI-3) also has an ethylenically unsaturated double bond group.
  • the polyimide precursor (PIP-1) is a structural unit represented by the general formula (3).
  • the content ratio of the amide acid ester structural unit in (PIP-1) to the total content ratio of the amide acid structural unit, the amide acid ester structural unit, the amide acid amide structural unit, and the imide ring-closed structural unit is 65 mol%.
  • Polybenzoxazole (PB-1) is a structural unit represented by the general formula (2).
  • the polybenzoxazole precursor (PBP-1) is a structural unit represented by the general formula (4).
  • Polyamideimide (PAI-1) and (PAI-2) are structural units represented by the general formula (5). Note that (PAI-2) also has an ethylenically unsaturated double bond group.
  • Polysiloxane (PS-1) is a structural unit represented by the general formula (8) and a structural unit represented by the general formula (9).
  • the polycyclic side chain-containing resin (CR-1) is a structural unit represented by the general formula (41) including the structure represented by the general formula (44). Note that (CR-1) also has an ethylenically unsaturated double bond group.
  • the acid-modified epoxy resin (AE-1) and (AE-2) are structural units represented by the general formula (61) including the structure represented by the general formula (66). Note that (AE-1) and (AE-2) also have an ethylenically unsaturated double bond group.
  • the acrylic resin (AC-1) is a structural unit represented by the general formula (81) and a structural unit represented by the general formula (82). Note that (AC-1) also has an ethylenically unsaturated double bond group.
  • Phenolic resins (PR-1) and (PR-7) are structural units represented by the general formula (31). Note that (PR-7) also has an ethylenically unsaturated double bond group.
  • Phenol resin (PR-2) is a structural unit represented by the general formula (32).
  • Phenol resin (PR-3) is a structural unit represented by the general formula (33).
  • Phenolic resins (PR-4) and (PR-8) are structural units represented by the general formula (34).
  • Phenol resin (PR-5) and (PR-11) are structural units represented by the general formula (35).
  • Phenol resin (PR-6) is a structural unit represented by the general formula (36).
  • Phenol resin (PR-9) is a structural unit represented by the general formula (38).
  • Phenol resin (PR-10), (PR-12), (PR-13), and (PR-14) are structural units represented by the general formula (40).
  • Polyhydroxystyrene (PHS-1) to (PHS-6) are structural units represented by the general formula (91). Note that (PHS-3), (PHS-4), and (PHS-6) also have an ethylenically unsaturated double bond group.
  • (PHS-2) and (PHS-4) also have a methylol group.
  • the phenol group-modified epoxy resins (PE-1) to (PE-5) are structural units represented by the general formula (101) including the structure represented by the general formula (106). Note that (PE-2), (PE-3), and (PE-5) also have an ethylenically unsaturated double bond group.
  • Phenolic-modified acrylic resins (PAC-1) and (PAC-2) are structural units represented by the general formula (121) and structural units represented by the general formula (122).
  • the phenol group-modified acrylic resin (PAC-3) is a structural unit represented by the general formula (121), a structural unit represented by the general formula (122), and a structural unit represented by the general formula (125).
  • the phenol group-modified acrylic resin (PAC-5) is a structural unit represented by the general formula (121), a structural unit represented by the general formula (122), and a structural unit represented by the general formula (126).
  • Phenolic group-modified acrylic resin (PAC-4), (PAC-7), and (PAC-8) are structural units represented by the general formula (125).
  • the phenol group-modified acrylic resin (PAC-6) is a structural unit represented by the general formula (126). It should be noted that (PAC-2), (PAC-4), (PAC-6), (PAC-7), and (PAC-8) also have an ethylenically unsaturated double bond group.
  • phenol resin (PR-1), (PR-2), (PR-3), (PR-5), (PR-7), (PR-8), (PR-10), (PR-11) ), (PR-12), (PR-13), and (PR-14) are contained in the (A3x) resin.
  • the phenolic resin (PR-4) and (PR-9) are contained in the (A3y) resin.
  • the phenolic resin (PR-6) is not contained in any of the (A3x) resin, the (A3y) resin, and the (A3z) resin.
  • Polyhydroxystyrene (PHS-5) is contained in the (A3x) resin.
  • Polyhydroxystyrene (PHS-1), (PHS-2), (PHS-3), (PHS-4), and (PHS-6) are contained in the (A3z) resin.
  • Phenolic-modified epoxy resins (PE-1), (PE-2), (PE-3), (PE-4), and (PE-5) are included in the (A3x) resin.
  • Phenolic-modified acrylic resins (PAC-1), (PAC-2), (PAC-3), and (PAC-5) are included in the (A3x) resin.
  • Phenolic-modified acrylic resins (PAC-4), (PAC-6), (PAC-7), and (PAC-8) are included in the (A3z) resin.
  • composition 1 was prepared according to the compositions shown in Table 3-1 and Table 3-2.
  • the prepared prebake film is spray-developed with a 2.38 mass% TMAH aqueous solution using a small photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.), and the time required for the prebake film (unexposed portion) to completely dissolve. (Breaking Point; hereinafter, "BP") was measured.
  • a prebake film is prepared in the same manner as described above, and the prepared prebake film is subjected to a grayscale mask (MDRM MODEL 4000-5) for sensitivity measurement using a double-sided alignment single-sided exposure device (mask aligner PEM-6M; manufactured by Union Optical Co., Ltd.).
  • -FS Patterned exposure was performed with i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultrahigh-pressure mercury lamp via Optito-Line International.
  • the exposure amount was an exposure amount (value of an i-line illuminance meter) capable of forming a space pattern corresponding to an opening with a dimension width of 18 ⁇ m in a line-and-space pattern of 20 ⁇ m. After the exposure, it was developed with a 2.38 mass% TMAH aqueous solution using a small photolithography developing device (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.) and rinsed with water for 30 seconds. The development time was BP + 20 seconds. After development, it was thermally cured at 250 ° C.
  • thermosetting was performed at 250 ° C. for 60 minutes in a nitrogen atmosphere.
  • the cured film was analyzed by methods such as nuclear magnetic resonance spectroscopy, infrared spectroscopy, and time-of-flight secondary ion mass spectrometry, and the structural units of the resin and the structure of the compound contained in the cured film were analyzed. It was confirmed that the cured film obtained by curing the composition 1 by the above method contained the following resins and compounds. That is, the cured film obtained by curing the composition 1 contains a compound having a structure derived from each constituent component contained in the composition 1.
  • (I-DL) resin in the pixel division layer a resin having a structural unit represented by the general formula (1)
  • (II-DL) resin in the pixel division layer a structural unit represented by the general formula (24).
  • (III-DL) resin in the resin pixel division layer having: Resin having a structural unit represented by the general formula (31)
  • D1a Black pigment: (D1a-1a) Benzofuranone-based black pigment
  • Examples 2 to 121 were prepared with the compositions shown in Tables 3-1 to 10.
  • a composition was formed on a substrate in the same manner as in Example 1, and the photosensitive characteristics, the cured film characteristics, and the light emitting characteristics were evaluated.
  • the evaluation results are collectively shown in Tables 3-1 to 10.
  • Table 3-2, Table 4-1 and Table 4-2, Table 5-1 and Table 5-2, Table 5-3, Table 6-1 and Table 6-2, Table 7 , And Table 8 shows the composition and evaluation results of Example 1, and Table 6-3 shows the compositions and evaluation results of Examples 1, 13, and 21, respectively.
  • Table 9 shows Examples 1 and Examples. Composition and evaluation of Example 113, Example 13 and Comparative Example 5, Example 21 and Comparative Example 6, Example 100 and Comparative Example 7, Example 101 and Comparative Example 8, and Example 102 and Comparative Example 9, respectively. The results are described in comparison.
  • Comparative Example 1 is a composition containing no (A3) resin.
  • Comparative Examples 2 to 4 contain a resin that is not contained in any of the (A3x) resin, the (A3y) resin, and the (A3z) resin as the (A3) resin.
  • Comparative Example 2 is a composition containing no compound (F).
  • Comparative Example 3 and Comparative Example 4 are compositions containing no (F1) compound and (FB1) compound.
  • Reference Example 3 contains a resin that is not contained in any of the (A3x) resin, the (A3y) resin, and the (A3z) resin as the (A3) resin, and contains a compound having a structure that is not suitable as the (F1) compound.
  • Various characteristics were evaluated in the composition to be used.
  • Comparative Example 5 and Comparative Example 6 are compositions which do not contain (A3) resin but contain (A1) resin or (A2) resin.
  • Comparative Examples 7 and 8 are negative photosensitive compositions that do not contain (A3) resin, contain (A1) resin or (A2) resin, and do not contain (D) colorant.
  • Comparative Example 9 is a positive photosensitive composition that does not contain (A3) resin, contains only (A1) resin, and does not contain (D) colorant.
  • Table 10 various characteristics were evaluated with a composition in which an additive containing an element of chlorine, an element of bromine, an element of sulfur, or an element of phosphorus was changed.
  • Table 10 describes the contents of chlorine element, bromine element, sulfur element, or phosphorus element, and summarizes the evaluation results of reliability and current density-voltage characteristic emission characteristics regarding emission characteristics.
  • Example 1 The content of elemental chlorine, elemental bromine, elemental sulfur, or elemental phosphorus was measured by gas chromatography. The elemental contents of each Example, Reference Example, and Comparative Example are described below. If there is no description of the element content, it means that the element was not detected. Examples 1 to 22, 39 to 77, 79 to 87, 94 to 96, 98 to 99, and 103 to 113, Reference Examples 1 to 2, and Comparative Examples 1 and 5 to 8 have a phosphorus element content of 34 ppm.
  • the phosphorus element content of Example 23 was 53 ppm, the phosphorus element content of Example 24 was 44 ppm, the phosphorus element content of Example 25 was 39 ppm, and the phosphorus element content of Examples 26 and 28 was 31 ppm, Example 27, The phosphorus element content of 87 to 93 is 33 ppm, the phosphorus element content of Example 29 is 24 ppm, the phosphorus element content of Example 30 is 58 ppm, the phosphorus element content of Example 31 is 46 ppm, and the phosphorus element of Example 32.
  • the content was 40 ppm, the phosphorus element content of Example 33 was 41 ppm, the phosphorus element content of Example 34 was 35 ppm, the phosphorus element content of Example 35 was 37 ppm, and the phosphorus element content of Example 36 was 141 ppm.
  • the phosphorus element content of Example 37 is 61 ppm, the phosphorus element content of Example 38 is 47 ppm, the phosphorus element content of Example 97 is 27 ppm, the phosphorus element content of Examples 100 to 101 is 52 ppm, and the phosphorus element of Reference Example 3 is used.
  • the element content was 86 ppm, and the phosphorus element content of Comparative Example 4 was 51 ppm.
  • the phosphorus element content of Example 78 was 34 ppm, and the sulfur element content was 580 ppm.
  • the phosphorus element content of Example 102 was 47 ppm, and the sulfur element content was 692 ppm.
  • the phosphorus element content of Comparative Example 9 was 47 ppm, and the sulfur element content was 692 ppm.
  • ⁇ Example 122> ⁇ Manufacturing method of flexible organic EL display without polarizing layer> The outline of the organic EL display to be manufactured is shown in FIG.
  • a polyimide film substrate (“Kapton” (registered trademark) -150-EN-C (manufactured by Toray DuPont) 67) is temporarily fixed on a 38 ⁇ 46 mm non-alkali glass substrate with an adhesive layer, and a buzzer hot plate is provided. It was prebaked at 130 ° C. for 120 seconds using (HPD-3000BZN; manufactured by AS ONE Corporation).
  • the SiO 2 film 73 was formed as a gas barrier layer on the polyimide film substrate 67 by the CVD method.
  • a laminated film of chromium and gold was formed on the gas barrier layer by an electron beam vapor deposition method, and a source electrode 74 and a drain electrode 75 were formed by etching.
  • an amorphous ITO as a transparent conductive oxide film layer was formed on the upper layer of the APC layer by sputtering at 10 nm, and a reflective electrode 76 was formed as a first electrode by etching.
  • an amorphous IGZO was formed by a sputtering method, and an oxide semiconductor layer 77 was formed between the source and drain electrodes by etching.
  • a positive photosensitive polysiloxane-based material SP-P2301 (manufactured by Toray Industries, Inc.) was formed by a spin coating method, and a via hole 78 and a pixel region 79 were opened by photolithography and then thermoset.
  • the gate insulating layer 80 was formed.
  • gold was formed into a film by an electron beam vapor deposition method, and a gate electrode 81 was formed by etching to obtain an oxide TFT array.
  • the composition 1 is coated and prebaked on an oxide TFT array to form a film by the method described in Example 1 described above, and is patterned, exposed, developed and rinsed through a photomask having a predetermined pattern to obtain a pixel region.
  • openings having a width of 70 ⁇ m and a length of 260 ⁇ m are arranged at a pitch of 155 ⁇ m in the width direction and a pitch of 465 ⁇ m in the length direction, and a pixel dividing layer having a shape in which each opening exposes a reflective electrode is formed on a substrate. It was formed only in the effective area. It should be noted that this opening finally becomes a light emitting pixel of the organic EL display.
  • the effective area of the substrate was 16 mm square, and the thickness of the pixel dividing layer was about 1.0 ⁇ m.
  • the compound (HT-1) is used as the hole injection layer
  • the compound (HT-2) is used as the hole transport layer
  • the compound (GH-1) is used as the host material
  • the compound (GD-1) is used as the dopant material.
  • the organic EL layer 83 was formed by using the compound (ET-1) and the compound (LiQ) as the electron transport material.
  • an organic EL sealing material (“Structbond” (registered trademark) XMF-T (manufactured by Mitsui Chemicals, Inc.)) was used to form a sealing film 85 under a low humidity nitrogen atmosphere. Further, a polyethylene terephthalate film substrate (“Lumirror” (registered trademark) U34 (manufactured by Toray Industries, Inc.)) 87 having a SiO 2 film 86 formed as a gas barrier layer is bonded onto the sealing film, and then the polyimide film substrate 67 is not used. The alkali glass substrate was peeled off, and four 5 mm square, top-emission type flexible organic EL displays having no polarizing layer were produced on one substrate.
  • the film thickness referred to here is a crystal oscillation type film thickness monitor display value.

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JPWO2022124296A1 (https=) * 2020-12-10 2022-06-16
WO2023190317A1 (ja) * 2022-03-31 2023-10-05 東レ株式会社 表示装置
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JP7370425B1 (ja) 2022-06-23 2023-10-27 東洋インキＳｃホールディングス株式会社 有機ｅｌ表示装置用感光性組成物および有機ｅｌ表示装置
JP2023547134A (ja) * 2020-11-09 2023-11-09 エルジー・ケム・リミテッド 感光性樹脂組成物、これを含む感光材、これを含むブラックマトリクス、およびこれを含む電子素子
JP2023169106A (ja) * 2022-05-16 2023-11-29 Dic株式会社 ネガ型感光性樹脂組成物
JP2024039899A (ja) * 2022-09-12 2024-03-25 Dic株式会社 ネガ型感光性樹脂組成物及びドライフィルムレジスト
JP2024090819A (ja) * 2022-12-23 2024-07-04 Jsr株式会社 感放射線性組成物、硬化物、レンズの製造方法、表示装置、固体撮像素子、撮像装置、及び、重合体
KR20250006712A (ko) 2023-07-04 2025-01-13 디아이씨 가부시끼가이샤 네가티브형 감광성 수지 조성물
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WO2025249231A1 (ja) * 2024-05-31 2025-12-04 富士フイルム株式会社 樹脂組成物、硬化物、硬化物の製造方法、積層体の製造方法、及び半導体デバイスの製造方法

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JP7626349B2 (ja) 2020-11-09 2025-02-04 エルジー・ケム・リミテッド 感光性樹脂組成物、これを含む感光材、これを含むブラックマトリクス、およびこれを含む電子素子
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JPWO2022124296A1 (https=) * 2020-12-10 2022-06-16
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WO2023190317A1 (ja) * 2022-03-31 2023-10-05 東レ株式会社 表示装置
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JP7556419B2 (ja) 2022-05-16 2024-09-26 Dic株式会社 ネガ型感光性樹脂組成物
JP2024002203A (ja) * 2022-06-23 2024-01-11 東洋インキＳｃホールディングス株式会社 有機ｅｌ表示装置用感光性組成物および有機ｅｌ表示装置
WO2023249045A1 (ja) * 2022-06-23 2023-12-28 東洋インキＳｃホールディングス株式会社 有機ｅｌ表示装置用感光性組成物および有機ｅｌ表示装置
JP7370425B1 (ja) 2022-06-23 2023-10-27 東洋インキＳｃホールディングス株式会社 有機ｅｌ表示装置用感光性組成物および有機ｅｌ表示装置
JP2024039899A (ja) * 2022-09-12 2024-03-25 Dic株式会社 ネガ型感光性樹脂組成物及びドライフィルムレジスト
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