WO2022059681A1 - 銅粉及び、銅粉の製造方法 - Google Patents
銅粉及び、銅粉の製造方法 Download PDFInfo
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- WO2022059681A1 WO2022059681A1 PCT/JP2021/033803 JP2021033803W WO2022059681A1 WO 2022059681 A1 WO2022059681 A1 WO 2022059681A1 JP 2021033803 W JP2021033803 W JP 2021033803W WO 2022059681 A1 WO2022059681 A1 WO 2022059681A1
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- Prior art keywords
- particles
- copper
- copper powder
- solution
- particle size
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 238000000034 method Methods 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000002245 particle Substances 0.000 claims abstract description 150
- 239000010949 copper Substances 0.000 claims abstract description 53
- 229910052802 copper Inorganic materials 0.000 claims abstract description 51
- 239000007788 liquid Substances 0.000 claims abstract description 15
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 11
- 239000002002 slurry Substances 0.000 claims description 26
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 24
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 24
- 229940112669 cuprous oxide Drugs 0.000 claims description 24
- 239000002994 raw material Substances 0.000 claims description 16
- 238000001914 filtration Methods 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 7
- 239000000243 solution Substances 0.000 description 42
- 239000007864 aqueous solution Substances 0.000 description 34
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 18
- 239000003638 chemical reducing agent Substances 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 239000000126 substance Substances 0.000 description 14
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 10
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 10
- 239000000460 chlorine Substances 0.000 description 10
- 229910052801 chlorine Inorganic materials 0.000 description 10
- 238000007323 disproportionation reaction Methods 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 150000001879 copper Chemical class 0.000 description 8
- 238000006722 reduction reaction Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010908 decantation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000011362 coarse particle Substances 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004816 latex Substances 0.000 description 3
- 229920000126 latex Polymers 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 102000008186 Collagen Human genes 0.000 description 1
- 108010035532 Collagen Proteins 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001436 collagen Polymers 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- -1 turpineol Chemical compound 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/044—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by jet milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2304/00—Physical aspects of the powder
- B22F2304/05—Submicron size particles
- B22F2304/058—Particle size above 300 nm up to 1 micrometer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Definitions
- This specification discloses copper powder and technology relating to a method for producing copper powder.
- Submicron size copper powder is generally a powder of fine copper particles having a particle size of 1 ⁇ m or less. It is expected to be used for applications such as conductive paste used for bonding with a substrate.
- This kind of copper powder can be produced from a raw material solution containing copper ions such as a copper sulfate solution by using a chemical reduction method or a disproportionation method (see, for example, Patent Document 1).
- the conductive paste in the use of a conductive paste, it is required that the conductive paste can be smoothly applied on the surface of a semiconductor element or a base material. If the smoothness of the conductive paste is not guaranteed, disconnection may occur there during use.
- This specification discloses copper powder in which foreign substances other than copper particles are effectively reduced, and a method for producing the copper powder.
- the copper powder disclosed in this specification is a copper powder containing copper particles, and is obtained by dissolving the copper particles of the copper powder with nitric acid in a solution having a copper ion concentration of 10 g / L, and a particle counter in the liquid.
- the number of particles having a particle size of 1.5 ⁇ m or more measured using the above is 10,000 or less per 10 mL.
- the method for producing copper powder disclosed in this specification is a method for producing copper powder containing copper particles, wherein at least one of the raw material solutions used in the method has a particle diameter of 10 ⁇ m prior to the use. It includes a step of filtering with a filter having a collection efficiency of 95% or more of the particles.
- the above-mentioned copper powder is one in which foreign substances other than copper particles are effectively reduced. Further, according to the above-mentioned method for producing copper powder, foreign substances other than copper particles can be effectively reduced.
- the copper powder of one embodiment contains copper particles and has reduced foreign substances that are not copper particles. More specifically, in this copper powder, the copper powder is added to a 9% by mass nitrate aqueous solution to dissolve the copper particles in the copper powder, and the resulting copper ion concentration is 10 g / L in the solution. When the number of particles is measured with an in-liquid particle counter, the number of particles having a particle size of 1.5 ⁇ m or more is 10,000 or less per 10 mL. The copper ion concentration is calculated on the assumption that the copper powder is entirely composed of metallic copper.
- the concentration of nitric acid that dissolves the copper powder is 2% by mass or less, it may not be possible to completely dissolve the copper powder, which is not preferable. If it is 30% by mass or more, the dissolution reaction of the copper powder becomes violent and violent. It is not preferable for safety because it foams. Based on these, a 9% by mass nitric acid aqueous solution is preferable because it completely dissolves the copper powder and there is no concern about violent foaming.
- the number of particles having a particle size of 1.5 ⁇ m or more is 10,000 or less per 10 mL.
- the above-mentioned foreign matter corresponds to the particles referred to here, remains as a solid in the above solution without being dissolved by nitric acid, and is typically made of a material that does not contain a simple substance of copper.
- the foreign matter is often, for example, an organic substance, dust, silica, sand, a piece of stainless steel, etc., but is not limited to these as long as it does not dissolve in nitric acid and remains in the solution.
- the number of the above particles is preferably 7,000 or less per 10 mL.
- this number of particles can be measured as follows. First, 1.000 ⁇ 0.005 g of copper powder is put into a container having a capacity of 100 mL (Sampler Tech Co., Ltd., Sampler (R) PP Bottle Wide Mouth, Part No. 2043), and 10 mL of filtered pure water is added thereto. Further, 90 mL of a filtered 10% by mass nitric acid aqueous solution is added thereto to dissolve the copper particles in the copper powder. As a result, a solution having a copper ion concentration of 10 g / L is obtained. A 40 mm size stirrer is put therein and the mixture is stirred at 300 rpm.
- the 10 mass% nitric acid aqueous solution can be prepared by mixing 833 g of pure water and 167 g of 60 mass% nitric acid.
- nitric acid and pure water used for dissolving copper particles of copper powder are also filtered with a 0.1 ⁇ m membrane filter.
- the filtered nitric acid aqueous solution and pure water it is confirmed in advance by the above-mentioned submerged particle counter that the number of particles having a particle size of 1.5 ⁇ m or more is 150 or less per 10 mL.
- a filter having a particle diameter of 10 ⁇ m and a collection efficiency of 95% or more is used.
- the submerged particle counter can be calibrated in advance with spherical polystyrene latex (PSL) particles priced with a transmission electron microscope (TEM).
- PSD spherical polystyrene latex
- TEM transmission electron microscope
- a counting millican particle absolute measurement method or a method using an optical microscope may be used.
- the particle size of the copper powder is preferably 0.1 ⁇ m to 1.0 ⁇ m, particularly preferably 0.2 ⁇ m to 0.5 ⁇ m. If the particle size of the copper powder is too large, there is a concern that it cannot be used satisfactorily for a predetermined purpose such as a material for internal and external electrodes, inkjet wiring, and a conductive paste. On the other hand, if the particle size of the copper powder is too small, the copper powder tends to aggregate in the paste, which is not preferable.
- the particle size of copper powder can be measured as follows.
- the copper powder is observed with a scanning electron microscope (SEM) at a magnification of 20,000 times, and the SEM image obtained by the observation is taken into image analysis software (Image Fiji). Fifteen particle sizes are randomly measured with this image analysis software, and the average value of 13 particles excluding the maximum and minimum values of those particle sizes is defined as the particle size of the copper powder.
- the copper powder mainly contains copper particles, and in some cases, a predetermined surface treatment agent such as a coupling agent may be further contained.
- Copper powder may contain chlorine, but chlorine can be an impurity, so it is desirable that the content is low.
- the chlorine content of the copper powder is preferably less than 10 mass ppm.
- Such a low chlorine content of copper powder can be realized, for example, by producing using cuprous oxide having a low chlorine content.
- the chlorine content of copper powder can be measured by combustion-ion chromatography. In this measuring method, a copper powder sample is thermally decomposed in a carrier gas of argon, then burned in an oxygen gas, and the desorbed chlorine is collected in an absorbing solution and introduced into an ion chromatograph for analysis. At this time, AQF2100H manufactured by Mitsubishi Chemical Analytech Co., Ltd. and Integration RFIC manufactured by Thermo Fisher Scientific Co., Ltd. can be used.
- the above-mentioned copper powder is particularly suitable for a conductive paste or the like that can be mixed with a resin material, a dispersion medium or the like to form a paste and used for bonding a semiconductor element and a substrate.
- a resin material such as polymethyl methacrylate
- a dispersion medium or the like such as polymethyl methacrylate
- it can be suitably used as a material for internal and external electrodes of electronic parts such as multilayer ceramic capacitors and inductors, and for inkjet wiring.
- the copper powder as described above can be produced by applying a chemical reduction method or a disproportionation method to a raw material solution containing copper ions.
- a step of preparing a copper salt aqueous solution (a raw material solution containing copper ions), an alkaline aqueous solution, a reducing agent aqueous solution, or the like as a raw material solution, and the raw material solutions thereof are mixed to contain copper particles.
- a step of obtaining a slurry, a step of washing copper particles by decantation or the like, a step of performing solution separation, and a step of drying can be included in this order.
- copper sulfate is added, and a sodium hydroxide aqueous solution and a hydrazine aqueous solution are added while stirring. After the addition, the temperature is raised to react copper oxide. After completion of the reaction, the obtained slurry is filtered through Nutche, then washed with pure water and methanol, and further dried. As a result, copper powder is obtained.
- An embodiment of the production method by the disproportioning method is, for example, a step of preparing a copper salt aqueous solution (a raw material solution containing copper ions), an alkaline aqueous solution, a reducing agent aqueous solution, or the like as a raw material solution, and mixing the raw material solutions thereof.
- a step of cleaning copper particles, a step of performing solution separation, and a step of drying may be included in this order.
- the process of contacting the slurry containing the copper oxide particles with sulfuric acid may be started. Specifically, cuprous oxide particles are added to an aqueous solvent containing an additive of a dispersant (for example, gum arabic, gelatin, collagen peptide) to prepare a slurry containing the cuprous oxide particles, and the slurry is prepared. Dilute sulfuric acid is added at once within 5 seconds to carry out the disproportionation reaction.
- the disproportionation reaction is expressed by the formula: Cu 2 O + H 2 SO 4 ⁇ Cu ⁇ + Cu SO 4 + H 2 O.
- an aqueous solution of copper sulfate or copper nitrate can be used as the copper salt aqueous solution.
- the alkaline aqueous solution may be an aqueous solution of NaOH, KOH, NH 4 OH or the like.
- the reducing agent of the aqueous reducing agent solution include hydrazine and the like.
- the production method of this embodiment captures particles having a particle size of 10 ⁇ m in advance before using the raw material solution used in the production method. Further including a step of filtering with a filter having a collection efficiency of 95% or more.
- the raw material solution is at least one selected from the group consisting of a copper salt aqueous solution, an alkaline aqueous solution and a reducing agent aqueous solution. That is, in this step, the copper salt aqueous solution, the alkaline aqueous solution and / or the reducing agent aqueous solution are filtered by the above filter.
- the filter After mixing two or more of the copper salt aqueous solution, the alkaline aqueous solution and the reducing agent aqueous solution, the filter may be used for filtration. Further, an aqueous solution containing two or more kinds selected from the group consisting of a copper salt, an alkali and a reducing agent also corresponds to the raw material solution referred to here. More preferably, all the raw material solutions (for example, all of the copper salt aqueous solution, the alkaline aqueous solution and the reducing agent aqueous solution) are filtered by the above filter.
- the filter used here is assumed to have a collection efficiency of 95% or more for particles having a particle diameter of 10 ⁇ m. Information on such collection efficiency is retained or disclosed by various filter manufacturers as specifications or specifications of their own filters. Based on this, it is possible to obtain a filter having a collection efficiency of 95% or more for particles having a particle diameter of 10 ⁇ m. In many cases, a cartridge filter is preferably used as the above filter.
- the collection efficiency of particles having a particle diameter of 10 ⁇ m is improved in advance by using a cleaning solution such as pure water used in the above-mentioned step of cleaning cuprous oxide particles or copper particles. It is preferable to filter with a filter of 95% or more. That is, it is preferable that the above embodiment includes a step of cleaning the cuprous oxide particles or the copper particles using the cleaning liquid filtered through the filter.
- cuprous oxide In the step of cleaning the cuprous oxide particles after the step of obtaining the slurry containing the particles and / or the step of cleaning the copper particles after the step of obtaining the slurry containing the copper particles, the cleaning liquid after filtration by the above filter is used. be able to. When there are both a step of cleaning the cuprous oxide particles and a step of cleaning the copper particles as in the disproportionation method, it is more preferable to use the cleaning liquid filtered through the above filter in both steps. be.
- the sulfuric acid to be brought into contact with the slurry containing the cuprous oxide particles by the disproportionation method is also filtered in advance with a filter having a collection efficiency of particles having a particle size of 10 ⁇ m of 95% or more. This makes it possible to remove foreign substances that may be contained in sulfuric acid.
- Example 1 Copper powder was produced by the disproportionation method.
- a solution A obtained by filtering an aqueous solution of copper sulfate with a cartridge filter (manufactured by JNC Filter Co., Ltd., model number: CP-01, nominal pore size: 1 ⁇ m) and an aqueous solution obtained by mixing sodium hydroxide and hydrazine hydrate are filtered with a similar cartridge filter.
- the solution B was mixed with the above solution B to obtain a cuprous oxide slurry.
- This cuprous oxide slurry was cleaned by decantation using pure water as a cleaning solution filtered through a similar cartridge filter. Then, it was dried by vacuum heating to obtain powdered cuprous oxide.
- the resulting cuprous oxide had a chlorine content of less than 10 mass ppm and an average particle size D50 of 2.42 ⁇ m.
- the average particle size D50 is a particle size distribution graph obtained by measuring with a laser diffraction / scattering type particle size distribution measuring device, and means a particle size in which the cumulative frequency of volume-based frequencies is 50%.
- This cuprous oxide (10 kg) is mixed with pure water (46 kg) as a cleaning liquid filtered through the same cartridge filter as above, and arabic rubber (480 g) is dissolved in pure water (30 L) in the same manner.
- An aqueous solution of Arabic rubber (4 kg) filtered through a cartridge filter was added to prepare a cuprous oxide slurry A.
- sulfuric acid (22.2 kg) filtered through the same cartridge filter was brought into contact with the cuprous oxide slurry A to obtain a copper slurry A.
- the copper slurry A was washed three times by decantation using pure water as a washing liquid filtered by the same cartridge filter, and the above Arabic rubber aqueous solution (3.3 kg) was added at the third washing, and the filter press was performed.
- Example 1 The mixture was separated into solid and liquid, and dried by vacuum heating. After that, it was crushed with a jet mill to obtain copper powder.
- the above-mentioned cartridge filter manufactured by JNC Filter Co., Ltd., model number: CP-01, nominal pore diameter: 1 ⁇ m
- the above-mentioned cartridge filter used in Example 1 has a collection efficiency of particles having a particle diameter of 10 ⁇ m of 95%.
- Example 2 Copper powder was produced by the chemical reduction method. More specifically, copper sulfate pentahydrate (2400 g) and citric acid (30 g) are dissolved in pure water (8700 g), and this is used as a cartridge filter (manufactured by Advantech, model number: TCSE-E010S, nominal pore size: 0. 1 ⁇ m) was filtered to obtain solution C. Further, a solution obtained by mixing 10% by mass sodium hydroxide (5400 g) and 10% by mass hydrazine (1440 g) was filtered through a similar cartridge filter to obtain a solution D. Solution C and solution D were mixed to obtain a cuprous oxide slurry B.
- a cartridge filter manufactured by Advantech, model number: TCSE-E010S, nominal pore size: 0. 1 ⁇ m
- a solution prepared by mixing 10% by mass sodium hydroxide (2616 g) and 10% by mass hydrazine (1440 g) was filtered through a similar cartridge filter to obtain Solution E.
- the cuprous oxide slurry B and the solution E were mixed to obtain a copper slurry B.
- the copper slurry B was washed by decantation using pure water as a washing liquid filtered through the same cartridge filter, solid-liquid separated by a centrifuge, and dried by vacuum heating. After that, it was crushed with a jet mill to obtain copper powder.
- the cartridge filter (manufactured by Advantech, model number: TCSE-E010S, nominal pore size: 0.1 ⁇ m) used in Example 2 has a collection efficiency of particles having a particle size of 10 ⁇ m of 95% or more. The collection efficiency was measured using polystyrene latex ball-dispersed water as a test solution.
- Example 3 and 8 copper powder was produced in substantially the same manner as in Example 1 except that the characteristics such as the particle size of the cuprous oxide used for producing the copper powder were slightly different from those in Example 1. did.
- Example 4 to 7 copper powder was produced in the same manner as in Example 1 except that the cuprous oxide slurry A was brought into contact with 22.5 kg of sulfuric acid. Although the conditions of Examples 4 to 7 were almost the same, the obtained copper powders were slightly different as shown in Table 3.
- the following grind gauge evaluation was performed for each copper powder. Copper powder, turpineol, ethyl cellulose and oleic acid were mixed and kneaded so as to have a weight ratio of 80: 16.1: 2.6: 1.3. Then, it was passed through a 3-roll mill set to a gap width of 5 ⁇ m to obtain a copper paste. A grind gauge table with a groove that gradually becomes shallower from 25 ⁇ m to 0 ⁇ m. Pour a sufficient amount of copper paste into the deep end of the groove and press the squeegee onto the table while pressing the deep end of the groove. It was moved from the part to the shallow end.
- the average value of the streak positions was calculated by taking the number obtained by subtracting the number of the evaluation results from the total number (6) as the number n without considering the evaluation result in the calculation. It can be said that the smaller the number of streaks, the smaller the number of coarse particles (foreign matter or aggregates) in the copper paste, and the smoother the copper paste. Further, the size of the coarse particles corresponding to the position where the first streak enters corresponds to the largest coarse particles contained in the copper paste, and it can be said that the smaller the size, the smoother the copper paste. The results are also shown in Table 3.
- Example 3 From the results shown in Table 3, the number of particles of 1.5 ⁇ m or more was relatively large in Comparative Example 1, whereas in Examples 1 to 8, the number of particles of 1.5 ⁇ m or more was increased by filtering with a predetermined filter. It can be seen that the number of particles has decreased. In particular, in Example 2, since the collection performance of the filter was higher than that used in Examples 1 and 3 to 8, the number of particles was further reduced. Further, in Examples 1 to 8, the number of streaks in the grind gauge evaluation was smaller than that in Comparative Example 1. In addition, the positions of the first streaks in Examples 1 to 6 and 8 were smaller than those in Comparative Example 1. In Example 7, the streak-filled position is slightly large, but since the number of streaks is small, it is presumed that a large foreign substance was accidentally caught and the streak-filled position was slightly larger.
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Abstract
Description
このことに対し、銅粉に混入することがある銅粒子以外の異物が、導電性ペーストの平滑性に影響を及ぼすことが新たな知見として得られた。
一の実施形態の銅粉は、銅粒子を含み、銅粒子ではない異物が低減されたものである。より詳細には、この銅粉は、当該銅粉を9質量%の硝酸水溶液に添加して銅粉中の銅粒子を溶解させ、それにより得られる銅イオン濃度が10g/Lである溶液中のパーティクル数を液中パーティクルカウンターで測定したとき、粒径が1.5μm以上のパーティクル数が、10mL当たり10000個以下であるというものである。なお、上記銅イオン濃度は、銅粉が全て金属銅から構成されていると仮定して算出している。銅粉を溶解する硝酸濃度が、2質量%以下であると、銅粉を完全に溶解できない可能性があるため好ましくなく、30質量%以上であると、銅粉の溶解反応が激しくなり、激しく発泡するため、安全上好ましくない。これらを踏まえた上で、9質量%の硝酸水溶液であれば、銅粉を完全に溶解しつつ、激しい発泡の懸念もないので好ましい。
銅粉の銅粒子を溶解させた溶液の銅イオン濃度が10g/Lになるように、銅粒子を硝酸により溶解させた場合、この実施形態では、その溶液中の溶けずに残ったパーティクルのうち、粒径が1.5μm以上であるパーティクル数が、10mL当たり10000個以下になる。
液中パーティクルカウンターは予め、透過型電子顕微鏡(TEM)で値付けされた真球状ポリスチレンラテックス(PSL)粒子を用いて校正しておくことができる。真球状ポリスチレンラテックス(PSL)粒子の値付けをするには、上述した透過型電子顕微鏡(TEM)による方法の他、計数ミリカン粒子絶対測定法又は、光学顕微鏡による方法を用いてもよい。
銅粉の粒径は、0.1μm~1.0μm、特に0.2μm~0.5μmであることが好ましい。銅粉の粒径が大きすぎる場合は、内外電極用材料やインクジェット配線、導電性ペースト等の所定の用途に良好に使用することができない懸念がある。一方、銅粉の粒径が小さすぎると、銅粉がペースト中で凝集しやすくなるため好ましくない。
銅粉は主として銅粒子を含むものであり、場合によってはさらにカップリング剤等の所定の表面処理剤が含まれ得る。
上述した銅粉は、たとえば、樹脂材料及び分散媒等と混合してペースト状にし、半導体素子と基板との接合に使用され得る導電性ペースト等に特に適している。あるいは、積層セラミックコンデンサないしインダクタ等の電子部品の内外電極用材料や、インクジェット配線の用途にも好適に用いることができる。
以上に述べたような銅粉は、銅イオンを含む原料溶液に対し、化学還元法または不均化法を適用すること等により製造することができる。
より具体的な一例では、純水にアラビアゴムを添加した後、硫酸銅を添加し、撹拌しながら、水酸化ナトリウム水溶液、ヒドラジン水溶液を添加する。その添加後に昇温し、酸化銅を反応させる。反応終了後、得られたスラリーをヌッチェで濾過し、次いで純水及びメタノールで洗浄し、更に乾燥させる。これにより、銅粉が得られる。
具体例を述べると、分散剤(たとえばアラビアゴム、ゼラチン、コラーゲンペプチド)の添加剤を含む水性溶媒中に亜酸化銅粒子を添加して、亜酸化銅粒子を含むスラリーを作製し、このスラリーに希硫酸を5秒以内に一度に添加して不均化反応を行う。不均化反応は、式:Cu2O+H2SO4→Cu↓+CuSO4+H2Oで表される。ここでは、希硫酸の添加により、pHを1.5以下にすることが好適である。
多くの場合、上記のフィルターとして、カートリッジフィルターが好適に用いられる。
不均化法により銅粉を製造した。ここでは、硫酸銅水溶液をカートリッジフィルター(JNCフィルター社製、型番:CP-01、公称孔径:1μm)で濾過した溶液Aと、水酸化ナトリウム及び加水ヒドラジンを混合した水溶液を同様のカートリッジフィルターで濾過した溶液Bとを混合し、亜酸化銅スラリーを得た。この亜酸化銅スラリーについて、同様のカートリッジフィルターで濾過した洗浄液としての純水を用いてデカンテーションによる洗浄を行った。その後、真空加熱により乾燥させ、粉末状の亜酸化銅を得た。それにより得られた亜酸化銅は塩素含有量が10質量ppm未満、平均粒径D50が2.42μmであった。なお、この平均粒径D50は、レーザ回折/散乱式粒径分布測定装置で測定して得られる粒径分布グラフで、体積基準の頻度の累積が50%になる粒径を意味する。
実施例1で用いた上記のカートリッジフィルター(JNCフィルター社製、型番:CP-01、公称孔径:1μm)は、粒子径が10μmの粒子の捕集効率が95%である。
化学還元法により銅粉を製造した。より詳細には、硫酸銅5水和物(2400g)、クエン酸(30g)を純水(8700g)に溶解させ、これをカートリッジフィルター(アドバンテック社製、型番:TCSE-E010S、公称孔径:0.1μm)で濾過し、溶液Cを得た。また、10質量%水酸化ナトリウム(5400g)と10質量%ヒドラジン(1440g)とを混合した溶液を、同様のカートリッジフィルターで濾過し、溶液Dを得た。溶液Cと溶液Dを混合し、亜酸化銅スラリーBを得た。10質量%水酸化ナトリウム(2616g)と10質量%ヒドラジン(1440g)とを混合した溶液を、同様のカートリッジフィルターで濾過し、溶液Eを得た。亜酸化銅スラリーBと溶液Eを混合し、銅スラリーBを得た。その後、同様のカートリッジフィルターで濾過した洗浄液としての純水を用いて銅スラリーBをデカンテーションにより洗浄し、遠心分離機で固液分離し、真空加熱で乾燥させた。さらにその後、ジェットミルで解砕し、銅粉を得た。
実施例2で用いた上記のカートリッジフィルター(アドバンテック社製、型番:TCSE-E010S、公称孔径:0.1μm)は、粒子径が10μmの粒子の捕集効率が95%以上である。当該捕集効率は、試験液としてポリスチレンラテックス球分散水を用いて測定されたものである。
実施例3及び8では、銅粉の製造に用いた亜酸化銅の粒径等の特性がそれぞれ実施例1と若干異なっていたことを除いて、実施例1とほぼ同様にして銅粉を製造した。
実施例4~7では、亜酸化銅スラリーAを22.5kgの硫酸と接触させたことを除いて、実施例1と同様にして銅粉を製造した。実施例4~7はほぼ同様の条件としたが、得られた各銅粉は、表3に示すように若干異なっていた。
いずれの溶液、洗浄液及び硫酸についてもカートリッジフィルターによる濾過を行わなかったことを除いて、実施例1と同様にして銅粉を製造した。
実施例1~8並びに比較例1の各銅粉について、先述した方法に従い、パーティクル数、塩素含有量及び粒径(SEM径)をそれぞれ測定した。なお、用いた液中パーティクルカウンター(KS-42C、リオン社製)は、標準粒子を用いて校正されたものである。校正に用いた標準粒子は以下のとおりである。
(液中パーティクルカウンターKS-42Cの校正に用いた標準粒子)
品名:JSR SIZE STANDARD PARTICLES SC-052-S、平均粒径:0.498±0.003μm
品名:JSR SIZE STANDARD PARTICLES SC-103-S、平均粒径:1.005±0.021μm
品名:JSR SIZE STANDARD PARTICLES SC-201-S、平均粒径:2.052±0.071μm
品名:DYNOSPHERES SS-033-P、平均粒径:3.344±0.191μm
品名:DYNOSPHERES SS-053-P、平均粒径:5.124±0.115μm
品名:DYNOSPHERES SS-104-P、平均粒径:10.14±0.186μm
品名:DYNOSPHERES SS-204-P、平均粒径:19.83±0.201μm
上述の標準粒子を用いて検出された、装置に内蔵された校正チャンネルは表1の通りであり、その結果から設定された粒子区分ごとの設定チャンネルは表2の通りであった。
パーティクル数、塩素含有量及び粒径(SEM径)の測定結果を表3に示す。
また、実施例1~8では、比較例1に比して、グラインドゲージ評価のスジ本数が少なくなった。また、1本目のスジ入り位置については、実施例1~6、8は比較例1よりも小さくなった。実施例7ではスジ入り位置がやや大きいが、スジ本数が少ないことから、これは偶然大きな異物が引っ掛かってスジ入り位置が若干大きくなったと推測される。
Claims (4)
- 銅粒子を含む銅粉であって、
硝酸により当該銅粉の前記銅粒子を溶解させて得られる銅イオン濃度が10g/Lの溶液中、液中パーティクルカウンターを用いて測定した粒径が1.5μm以上であるパーティクル数が、10mL当たり10000個以下である銅粉。 - 前記パーティクル数が、10mL当たり7000個以下である請求項1に記載の銅粉。
- 銅粒子を含む銅粉を製造する方法であって、
当該方法に使用する原料溶液の少なくとも一種を、該使用に先立ち、粒子径が10μmの粒子の捕集効率が95%以上であるフィルターで濾過する工程を含む、銅粉の製造方法。 - 前記原料溶液から、銅粒子を含むスラリー又は亜酸化銅粒子を含むスラリーを得る工程と、
前記スラリーを、粒子径が10μmの粒子の捕集効率が95%以上であるフィルターで濾過した洗浄液で洗浄する工程と
を含む、請求項3に記載の銅粉の製造方法。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007169770A (ja) | 2005-12-26 | 2007-07-05 | Mitsui Mining & Smelting Co Ltd | 銅粒子並びに銅粉及びその銅粒子の製造方法 |
JP2007197755A (ja) * | 2006-01-25 | 2007-08-09 | Nippon Shokubai Co Ltd | 金属ナノ粒子の製造方法、金属ナノ粒子、導電性組成物および電子デバイス |
JP2016191085A (ja) * | 2015-03-30 | 2016-11-10 | Jx金属株式会社 | 銅微粒子ペースト及びその製造方法 |
WO2019123856A1 (ja) * | 2017-12-18 | 2019-06-27 | Dic株式会社 | 銅微粒子焼結体 |
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JP5571435B2 (ja) * | 2010-03-31 | 2014-08-13 | Jx日鉱日石金属株式会社 | 銀メッキ銅微粉の製造方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007169770A (ja) | 2005-12-26 | 2007-07-05 | Mitsui Mining & Smelting Co Ltd | 銅粒子並びに銅粉及びその銅粒子の製造方法 |
JP2007197755A (ja) * | 2006-01-25 | 2007-08-09 | Nippon Shokubai Co Ltd | 金属ナノ粒子の製造方法、金属ナノ粒子、導電性組成物および電子デバイス |
JP2016191085A (ja) * | 2015-03-30 | 2016-11-10 | Jx金属株式会社 | 銅微粒子ペースト及びその製造方法 |
WO2019123856A1 (ja) * | 2017-12-18 | 2019-06-27 | Dic株式会社 | 銅微粒子焼結体 |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2024009522A1 (ja) * | 2022-07-08 | 2024-01-11 | Jx金属株式会社 | 銅粉 |
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JP7161630B2 (ja) | 2022-10-26 |
US20230311207A1 (en) | 2023-10-05 |
KR20220158280A (ko) | 2022-11-30 |
CN115666819A (zh) | 2023-01-31 |
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EP4215300A4 (en) | 2024-02-28 |
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EP4215300A1 (en) | 2023-07-26 |
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