WO2022057138A1 - 一种焊带载体膜、焊带复合体及电池片复合体 - Google Patents

一种焊带载体膜、焊带复合体及电池片复合体 Download PDF

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WO2022057138A1
WO2022057138A1 PCT/CN2020/139549 CN2020139549W WO2022057138A1 WO 2022057138 A1 WO2022057138 A1 WO 2022057138A1 CN 2020139549 W CN2020139549 W CN 2020139549W WO 2022057138 A1 WO2022057138 A1 WO 2022057138A1
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carrier film
ribbon
adhesive layer
resin
agent
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PCT/CN2020/139549
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English (en)
French (fr)
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韩晓航
王磊
郑亚
陈洪野
吴小平
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苏州赛伍应用技术股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • C08L87/005—Block or graft polymers not provided for in groups C08L1/00 - C08L85/04
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention specifically relates to a welding tape carrier film, a welding tape composite body and a battery sheet composite body.
  • the wire is carried by an adhesive film and fixed on the battery sheet during lamination, such as the preparation method of the busbarless welding tape for solar cells CN201510933299.0 of Yellow River Hydropower Photovoltaic Industry Technology Co., Ltd.
  • the inventor found that the adhesive film could not fix the wire on the battery sheet well, or the welding tape would press through the adhesive film during the pressing process.
  • the purpose of the present invention is to provide a ribbon carrier film, a ribbon composite body and a battery chip composite body that can well bond the ribbon on the battery sheet.
  • the technical scheme adopted in the present invention is:
  • the raw material formula of the adhesive layer includes 50-95% of matrix resin. , 0-50% tackifying resin, 0-5% auxiliary agent; based on the total mass of the support layer as 100%, the raw material formula of the support layer includes 95-100% matrix resin, 0-5% % of auxiliary agent;
  • the matrix resin is polyolefin resin and its elastomer, polyester resin and its elastomer, polyvinyl butyral ester (PVB), ethylene-vinyl acetate copolymer (EVA), ethylene -One or more of acrylic copolymers (EAA), ionic polymers, polyamides, fluororesins, and modifications of the above substances;
  • the tackifying resins are rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum One or more of resins, phenolic resins, and terpene resins.
  • modified products of various types of matrix resins in the present invention can be based on the matrix resin, using other monomers (including but not limited to ethylene) or modifiers (including but not limited to silane) to copolymerize and graft the matrix resin. etc. modification.
  • the polyolefin resin includes, but is not limited to, one of polyethylene (PE), high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE) or variety.
  • PE polyethylene
  • HDPE high density polyethylene
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • polyolefin elastomers include, but are not limited to, one or more of OBC, POE, POP.
  • polyester resins include, but are not limited to, polyethylene terephthalate, polybutylene terephthalate, polydiallyl terephthalate, polyparaben one or more of.
  • polyester elastomers include, but are not limited to, polyurethane elastomers, copolyester elastomers containing polyether soft segments.
  • ionic polymers include, but are not limited to, one or more of ionized polymers of sodium ions, potassium ions, etc. of the polymer resin.
  • polyamides include, but are not limited to, one or more of polyamide 6 (PA6), polyamide-66 (PA66), polyamide 1212 (PA1212).
  • the fluororesin includes, but is not limited to, one or more of polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), and polytetrafluoroethylene (PTFE).
  • PVF polyvinyl fluoride
  • PVDF polyvinylidene fluoride
  • PTFE polytetrafluoroethylene
  • the content of tackifying resin in the adhesive layer is more than 0, more preferably 5-45%, still more preferably 5-40%, still further 10-30%, still more 15-25%.
  • the content of the adjuvant in the adhesive layer is >0, more preferably 0.01-5%, still more preferably 0.05-5%, still further 0.1-5%, still more preferably 0.5-3%.
  • the raw material formula of the adhesive layer includes 60-90% of the matrix resin, 5-40% of the tackifying resin, and 0-5% of the auxiliary agent .
  • the raw material formula of the adhesive layer includes 70-90% of the matrix resin, 9-29% of the tackifying resin, 0.1-5% of the auxiliary resin. agent.
  • the raw material formulation of the adhesive layer includes 75-85% of the matrix resin, 14-24% of the tackifying resin, 0.1-5% of the auxiliary resin. agent.
  • the matrix resin in the adhesive layer includes at least a polyolefin elastomer.
  • the content of the auxiliary agent in the support layer is greater than 0, more preferably 0.01-5%, still more preferably 0.05-5%, still further 0.1-5%, still more preferably 0.5-3%.
  • the raw material formula of the support layer includes 95-99.9% of the matrix resin and 0.1-5% of the auxiliary agent.
  • the matrix resin in the support layer is one or more of polyamide or its modification, polyolefin resin or its modification.
  • the support layer when the matrix resin in the support layer is a polyolefin elastomer, the support layer contains an initiator, and the pre-crosslinking degree of the support layer is ⁇ 30%.
  • the auxiliary agents include initiators, cross-linking agents, coupling agents, light stabilizers, antioxidants, ultraviolet absorbers, blocking agents, nucleating agents, anti-reflection agents, anti-PID One or more of the adjuvants.
  • the thickness of the adhesive layer is 10-400 ⁇ m.
  • the thickness of the support layer is 10-400 ⁇ m.
  • the thickness of the ribbon carrier film is 20 ⁇ m ⁇ 500 ⁇ m.
  • the light transmittance of the ribbon carrier film in the wavelength range of 380-1100 is ⁇ 80%, preferably ⁇ 90%.
  • the ribbon carrier film may further include one or more intermediate layers disposed between the adhesive layer and the support layer.
  • the raw material formulation of the intermediate layer may be similar to that of the support layer, or may be formed by curing glue.
  • the raw material formulation of the intermediate layer includes 95-100% of the matrix resin and 0-5% of the auxiliary agent.
  • the raw material formulation of the intermediate layer includes 95-99.9% of the matrix resin and 0.1-5% of the auxiliary agent.
  • the ribbon carrier film may further comprise a release film disposed on the outer side of the support layer, and/or the outer side of the support layer is embossed.
  • embossing is not limited to embossing into a pattern, and any form may be used as long as the surface of the ribbon carrier film can be roughened.
  • the release film is a conventional release film, such as PE, PP, PET, etc., and the release film may be colored or colorless.
  • the adhesive layer and the support layer are independently cross-linked or non-cross-linked; that is, in the ribbon carrier film, when the adhesive layer is cross-linked
  • the support layer can be of the cross-linked type or the non-cross-linked type.
  • the pre-crosslinking degree of the adhesive layer is ⁇ 60%.
  • the two sides of the ribbon carrier film have different pre-crosslinking degrees.
  • the pre-crosslinking degree of the support layer is greater than the pre-crosslinking degree of the adhesive layer.
  • the melting point or Tg temperature of the matrix resin is ⁇ 150°C
  • the melting point or Tg temperature of the matrix resin is ⁇ 100°C
  • the requirement on the melting point or Tg temperature of the matrix resin used in the cross-linked and non-cross-linked types means that at least part of the resin in the matrix resin needs to meet the requirement.
  • the auxiliary agent when the adhesive layer is a cross-linked type, includes an initiator, a cross-linking agent, a coupling agent, a light stabilizer, an antioxidant, an ultraviolet absorber, an opening agent, a One or more of nucleating agent, anti-penetration agent and anti-PID auxiliary agent to ensure the adhesion between the adhesive layer and the welding tape and the battery sheet;
  • the auxiliary Agents include one or more of initiators, cross-linking agents, light stabilizers, antioxidants, ultraviolet absorbers, blocking agents, nucleating agents, anti-penetration agents, and anti-PID additives;
  • the auxiliary agents when the adhesive When the layer and the supporting layer are non-crosslinked, include initiators, coupling agents, light stabilizers, antioxidants, ultraviolet absorbers, blocking agents, nucleating agents, anti-reflection agents, One or more of the anti-PID adjuvants.
  • the auxiliary agent is a light stabilizer, an antioxidant with a mass ratio of 2-3:0.5-1.5:1 agent, anti-PID additives.
  • the auxiliary agent is an initiator whose mass ratio is 1:1-3:0.8-1.5:1-2:0.4-1:0.4-1 agents, cross-linking agents, coupling agents, light stabilizers, antioxidants, anti-PID additives.
  • the auxiliary agent is an initiator and a cross-linking agent with a mass ratio of 1:1.5 ⁇ 2:0.5 ⁇ 1:0.1 ⁇ 0.5:0.1 ⁇ 0.5 , Light stabilizers, antioxidants, anti-PID additives.
  • the initiator is selected from trimethylolpropane triacrylate, bis-trimethylolpropane tetraacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trihydroxyl Methylpropane Triacrylate, Ethyl 4-Dimethylaminobenzoate, Dicumyl Peroxide (DCP), 2,5-Dimethyl-2,5-di(tert-butylperoxy)hexane one or more of them.
  • DCP Dicumyl Peroxide
  • the crosslinking agent is selected from the group consisting of tert-butyl peroxide 2-ethylhexyl carbonate, tert-butyl peroxy-isopropyl carbonate, dibenzoyl peroxide, peroxide Dicumylbenzene, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, cyclohexanone peroxide, tert-butyl hydroperoxide, tert-butyl peroxybenzoate, Tert-butyl peroxyacetate, bis-(4-tert-butylcyclohexyl) peroxydicarbonate, tert-butyl peroxy-3,5,5-trimethylhexanoate, triallyl isocyanate (TAIC) one or more of them.
  • TAIC triallyl isocyanate
  • the coupling agent is selected from 3-methacryloyloxypropylmethyldimethoxysilane, 3-glycidylpropyltrimethoxysilane, vinyltrimethoxysilane One or more of silane, 3-aminopropyltriethoxysilane, isopropyl triisostearoyl titanate, isopropyl tris(dioctyl pyrophosphate acyloxy) titanate, etc.
  • the light stabilizer is selected from bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate (light stabilizer 770), polybutylene Diacid (4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol) ester, poly- ⁇ [6-[(1,1,3,3-tetramethylbutyl)- Imino]-1,3,5-triazine-2,4-diyl][2-(2,2,6,6-tetramethylpiperidinyl)-amino]-hexylene-[4- One or more of (2,2,6,6-tetramethylpiperidinyl)-imino] ⁇ .
  • the antioxidant is one or more of phenol-based antioxidants, phosphite-based antioxidants and hindered amine-based antioxidants.
  • the anti-PID adjuvant is a metal ion scavenger.
  • the second aspect of the present invention is to provide a method for preparing the carrier film for welding tape, which is formed into a film by mixing materials and then casting, calendering or blowing, and selectively adopts electronic, Atomic, ionic, neutron, thermal or electromagnetic radiation to control the degree of pre-crosslinking of the carrier film; preferably electron or electromagnetic radiation is used.
  • a third aspect of the present invention is to provide a welding tape composite body, including the welding tape carrier film, and a welding tape adhered on the welding tape carrier film; preferably, for the cross-linked carrier film,
  • the pre-crosslinking degree of the side of the carrier film in contact with the welding tape is smaller than the pre-crosslinking degree of the side away from the welding tape.
  • the volume of the soldering tape is exposed to the carrier film of the soldering tape, so that the soldering tape can be in good contact with the battery sheet and the bonding performance between the soldering tape and the carrier film is ensured.
  • 30%-70% of the volume of the soldering tape is exposed to the soldering tape carrier film, more preferably 40%-60% of the volume of the soldering tape is exposed to the soldering tape carrier film .
  • a fourth aspect of the present invention is to provide a battery sheet composite, comprising a battery sheet, a welding tape in contact with the battery sheet, and a carrier film for fixing the welding tape on the battery sheet,
  • the carrier film is the ribbon carrier film; preferably, the ribbon and the carrier film are respectively provided on both sides of the battery sheet.
  • the cell is one of a crystalline silicon cell, an amorphous silicon cell, a chemical solar cell, and a multicomponent compound thin film solar cell.
  • a fifth aspect of the present invention is to provide a method for preparing a battery sheet composite, comprising the following steps:
  • the release film is removed before step (1).
  • the sixth aspect of the present invention is to provide an application of the ribbon carrier film, or the ribbon composite, or the cell composite in a photovoltaic module.
  • the present invention has the following advantages compared with the prior art:
  • the invention optimizes the formulation of the adhesive layer and the support layer, so that the carrier film can be well bonded with the welding tape and the battery sheet, and the carrier film is not easy to be pressed through.
  • FIG. 1 is a schematic structural diagram of a ribbon composite formed by a carrier film with a two-layer structure
  • FIG. 2 is a schematic structural diagram of a ribbon composite formed by a carrier film with a three-layer structure
  • FIG. 3 is a schematic structural diagram of a battery sheet composite
  • Adhesive layer 2. Support layer; 3. Intermediate layer; 4. Welding tape; 5. Battery sheet.
  • the present invention will be further described below in conjunction with specific embodiments, but the present invention is not limited to the following embodiments.
  • the implementation conditions adopted in the examples can be further adjusted according to different requirements of specific use, and the unremarked implementation conditions are the conventional conditions in the industry.
  • the raw materials in the present invention are all commercially available.
  • the parts of raw materials in the following examples and comparative examples are all parts by mass.
  • the double-layer structure carrier film includes an adhesive layer 1 and a support layer 2, wherein,
  • the raw material formula of the support layer 2 is: the matrix resin is 80 parts of polyethylene grafted polyamide modified polymer, 20 parts of PE, 770 parts of light stabilizer, 0.2 part of antioxidant, 0.2 part of anti-PID additive; The high-mixer mixes evenly and then extrudes and granulates.
  • the raw material formula of adhesive layer 1 is: base resin POE 50 parts, PE 30 parts, tackifying resin hydrogenated petroleum resin 20 parts, light stabilizer 770 0.5 parts, antioxidant 1010 0.2 parts, anti-PID additives 0.2 parts; The high-mixer mixes evenly and then extrudes and granulates.
  • a film with a thickness of 80 ⁇ m in a double-layer structure is obtained by double-layer co-extrusion and casting technology.
  • the thickness of the adhesive layer 1 is 40 ⁇ m
  • the thickness of the support layer 2 is 40 ⁇ m.
  • This example is a double-layer non-crosslinked carrier film
  • the main resin of the support layer 2 is polyethylene grafted polyamide modified polymer, containing high melting point components, Tm>200 ° C, to ensure the temperature resistance of the sample.
  • the double-layer structure carrier film includes an adhesive layer 1 and a support layer 2, wherein,
  • the raw material formula of the support layer 2 is: 100 parts of the matrix resin POE of the support layer 2, 0.6 part of the initiator dicumyl peroxide, 1 part of the crosslinking agent TAIC, 770 parts of the light stabilizer, 0.2 part of the antioxidant, 0.2 part of the anti-oxidant 0.2 part of PID auxiliary agent; extruded and granulated after being uniformly mixed by a high-mixer.
  • the raw material formula of adhesive layer 1 is: base resin POE 50 parts, PE 30 parts, tackifying resin hydrogenated petroleum resin 20 parts, light stabilizer 770 0.5 parts, antioxidant 1010 0.2 parts, anti-PID additives 0.2 parts; The high-mixer mixes evenly and then extrudes and granulates.
  • a double-layered film with a thickness of 80 ⁇ m was obtained by double-layer co-extrusion and casting technology.
  • the thickness of the adhesive layer 1 was 40 ⁇ m, and the thickness of the supporting layer 2 was 40 ⁇ m;
  • This embodiment is a double-layer partially cross-linked carrier film.
  • the support layer 2 has a certain degree of pre-crosslinking (about 40%) through electron beam irradiation to ensure that the carrier film will not be pressed during the lamination process with the welding tape 4. At the same time, it can be further cross-linked in the lamination process, and finally the cross-linking degree of the support layer 2 can reach more than 75%; the adhesive layer is a non-cross-linked structure.
  • the double-layer structure carrier film includes an adhesive layer 1 and a support layer 2, wherein,
  • support layer 2 matrix resin polyethylene 75 parts, POE 25 parts, initiator 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane 0.6 parts, 1 part of cross-linking agent TAIC, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID additive; mixed uniformly by high mixer and then extruded and granulated.
  • the raw material formula of the adhesive layer 1 is: 80 parts of matrix resin POE, 20 parts of hydrogenated petroleum resin, 0.3 part of initiator 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, cross-linked Coupling agent TAIC 0.6 part, coupling agent vinyltrimethoxysilane 0.3 part, light stabilizer 770 0.5 part, antioxidant 1010 0.2 part, anti-PID auxiliary agent 0.2 part; mixed evenly by high mixer and then extruded and granulated .
  • a double-layered film with a thickness of 80 ⁇ m was obtained by double-layer co-extrusion and casting technology.
  • the thickness of the adhesive layer 1 was 40 ⁇ m, and the thickness of the supporting layer 2 was 40 ⁇ m. Then, the supporting layer 2 and the adhesive layer were irradiated by electron beams. 1 has a certain degree of pre-crosslinking, wherein the pre-crosslinking degree of the support layer 2 is about 40%, and the pre-crosslinking degree of the adhesive layer is about 15%.
  • This example is a cross-linked double-layer carrier film.
  • both the sample support layer 2 and the adhesive layer have a certain degree of pre-crosslinking, wherein the pre-crosslinking degree of the support layer 2 is about 40%.
  • the pre-crosslinking degree of the adhesive layer is about 15%, and at the same time, it can be further crosslinked during the lamination process, and the final crosslinking degree can reach more than 75%.
  • the three-layer structure carrier film includes an adhesive layer 1, a support layer 2 and an intermediate layer 3 between the adhesive layer 1 and the support layer 2, and its structure is shown in Figure 2, wherein,
  • the raw material formula of the support layer 2 is: 100 parts of matrix resin polyamide, 770 parts of light stabilizer, 0.2 part of antioxidant, 0.2 part of antioxidant, 0.2 part of anti-PID auxiliary; after mixing uniformly by high mixer, extrusion granulation.
  • the raw material formula of the middle layer 3 is: 40 parts of matrix resin polyethylene grafted polyamide modified polymer, 60 parts of polyethylene, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, and 0.2 part of anti-PID additive; The high-mixer mixes evenly and then extrudes and granulates.
  • the raw material formula of adhesive layer 1 is: base resin POE 50 parts, PE 30 parts, tackifying resin hydrogenated petroleum resin 20 parts, light stabilizer 770 0.5 parts, antioxidant 1010 0.2 parts, anti-PID additives 0.2 parts; The high-mixer mixes evenly and then extrudes and granulates.
  • a 100- ⁇ m-thick film with a three-layer structure was obtained by three-layer co-extrusion and casting technology.
  • This embodiment is a non-crosslinked three-layer carrier film
  • the support layer 2 is a high melting point transparent polyamide, the melting point is > 200 ° C, to ensure the temperature resistance of the sample
  • the intermediate layer 3 is a transition layer to ensure that the support layer 2 and the adhesive layer 1 are It can be co-extruded smoothly, and at the same time plays a buffering role to increase the overall elasticity of the sample;
  • the double-layer structure carrier film includes an adhesive layer 1 and a support layer 2, wherein,
  • the raw material formula of the support layer 2 is: 100 parts of the matrix resin POE of the support layer 2, 770 parts of the light stabilizer, 0.2 part of the antioxidant, 0.2 part of the antioxidant, and 0.2 part of the anti-PID auxiliary agent; after being uniformly mixed by a high-mixer, it is extruded and granulated.
  • the raw material formula of adhesive layer 1 is: base resin POE 50 parts, PE 30 parts, tackifying resin hydrogenated petroleum resin 20 parts, light stabilizer 770 0.5 parts, antioxidant 1010 0.2 parts, anti-PID additives 0.2 parts; The high-mixer mixes evenly and then extrudes and granulates.
  • a film with a thickness of 80 ⁇ m with a double-layer structure was obtained by double-layer co-extrusion and casting technology.
  • the thickness of the adhesive layer 1 was 40 ⁇ m
  • the thickness of the support layer 2 was 40 ⁇ m.
  • This embodiment is a double-layer non-crosslinked carrier film, the main resin of the support layer 2 is POE, and the melting point is low ( ⁇ 80°C).
  • the double-layer structure carrier film includes an adhesive layer 1 and a support layer 2, wherein,
  • support layer 2 matrix resin polyethylene grafted polyamide modified polymer 80 parts, polyethylene 20 parts, light stabilizer 770 0.5 parts, antioxidant 1010 0.2 parts, anti-PID additives 0.2 parts parts; mixed evenly by a high-mixer and then extruded and granulated.
  • the raw material formula of the adhesive layer 1 is: base resin PE 100 parts, light stabilizer 770 0.5 parts, antioxidant 1010 0.2 parts, anti-PID auxiliary agent 0.2 parts; mixed evenly by a high-mixer and then extruded and granulated.
  • a film with a thickness of 80 ⁇ m with a double-layer structure was obtained by double-layer co-extrusion and casting technology.
  • the thickness of the adhesive layer 1 was 40 ⁇ m
  • the thickness of the support layer 2 was 40 ⁇ m.
  • This embodiment is a double-layer non-crosslinked carrier film, and the adhesive layer 1 is made of non-polar pure polyethylene material without adding tackifier resin and silane coupling agent, so it is difficult to bond with the welding tape 4 and the battery sheet 5 .
  • the double-layer structure carrier film includes an adhesive layer 1 and a support layer 2, wherein,
  • support layer 2 matrix resin polyethylene 75 parts, POE 25 parts, initiator 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane 0.6 parts, 1 part of cross-linking agent TAIC, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID additive; mixed evenly by high mixer and then extruded and granulated.
  • the raw material formula of the adhesive layer 1 is: 80 parts of matrix resin POE, 20 parts of hydrogenated petroleum resin, 0.8 part of initiator 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, cross-linked Coupling agent TAIC 2 parts, coupling agent vinyltrimethoxysilane 0.3 parts, light stabilizer 770 0.5 parts, antioxidant 1010 0.2 parts, anti-PID auxiliary agent 0.2 parts; mixed uniformly by high mixer and then extruded and granulated .
  • a double-layered film with a thickness of 80 ⁇ m was obtained by double-layer co-extrusion and casting technology.
  • the thickness of the adhesive layer 1 was 40 ⁇ m, and the thickness of the supporting layer 2 was 40 ⁇ m. Then, the supporting layer 2 and the adhesive layer were irradiated by electron beams. 1 has a certain degree of pre-crosslinking, wherein the pre-crosslinking degree of the support layer 2 is about 40%, and the pre-crosslinking degree of the adhesive layer is about 70%.
  • This example is a cross-linked double-layer carrier film.
  • both the sample support layer 2 and the adhesive layer 1 have a certain degree of pre-crosslinking, and the pre-crosslinking degree of the support layer 2 is about 40%. , the pre-crosslinking degree of the adhesive layer 1 is about 70%.
  • Pre-crosslinking degree/crosslinking degree solvent method (Xylene reflux 145°C, 5h)

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Abstract

本发明涉及一种焊带载体膜，包括胶黏层和支撑层，胶黏层的原料配方包括50～95％的基体树脂、0～50％的增粘树脂、0～5％的助剂；支撑层的原料配方包括95～100％的基体树脂、0～5％的助剂；基体树脂为聚烯烃树脂及其弹性体、聚酯树脂及其弹性体、聚乙烯醇缩丁醛酯、乙烯-醋酸乙烯酯共聚物、乙烯-丙烯酸共聚物、离子聚合物、聚酰胺、氟树脂、及上述物质的改性物中的一种或多种；增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、萜烯树脂中的一种或多种。本发明通过对胶黏层和支撑层配方的优化，使得载体膜能够与焊带和电池片很好的粘结，且载体膜不易被压穿。

Description

一种焊带载体膜、焊带复合体及电池片复合体 技术领域
本发明具体涉及一种焊带载体膜、焊带复合体及电池片复合体。
背景技术
目前光伏行业组件的发展趋势是从3主栅变成4主栅、5主栅，近而发展成现在的多主栅。近几年有提出无主栅组件，可以节约银的用量以及减少栅线对电池片遮挡，提高发电效率，如泰州隆基乐叶CN201720080886.4 IBC电池的电极互联结构，CN201710054876.8一种N型双面电池互联工艺；深圳市拉普拉斯能源技术有限公司CN201720292907.9无主栅太阳能电池组件。
目前无主栅组件的电池片的导线有两种方式固定于电池片上：
1是通过电镀工艺，如苏州太阳井新能源有限公司，CN201820959124.6一种无主栅双面电镀金属化太阳能电池片；
2.通过一个粘接膜将导线载住，在层压时固定在电池片上，如黄河水电光伏产业技术有限公司CN201510933299.0一种用于太阳能电池的无主栅焊带的制备方法。
但发明人在研究过程中发现粘接膜要么无法很好的将导线固定在电池片上，要么在压合过程中，焊带会将粘结膜压穿。
发明内容
本发明的目的是提供一种能够很好的将焊带粘结在电池片上的焊带载体膜、焊带复合体及电池片复合体。
为达到上述目的，本发明采用的技术方案是：
本发明一方面提供一种焊带载体膜，包括胶黏层和支撑层，按所述胶黏层的总质量为百分之百计，所述的胶黏层的原料配方包括50～95％的基体树脂、0～50％的增粘树脂、0～5％的助剂；按所述支撑层的总质量为百分之百计，所述的支撑层的原料配方包括95～100％的基体树脂、0～5％的助剂；所述的基体树脂为聚烯烃树脂及其弹性体、聚酯树脂及其弹性体、聚乙烯醇缩丁醛酯(PVB)、乙烯-醋酸乙烯酯共聚物(EVA)、乙烯-丙烯酸共聚物(EAA)、离子聚合物、聚酰胺、氟树脂、及上述物质的改性物中的一种或多种；所述的增粘树脂为松香、氢化松香、 石油树脂、氢化石油树脂、酚醛树脂、萜烯树脂中的一种或多种。
本发明中各类基体树脂的改性物可以是在基体树脂的基础上，利用其它单体(包括但不限于乙烯)或改性物(包括但不限于硅烷)对基体树脂进行共聚、接枝等改性。
根据一些具体且优选实施方式，聚烯烃树脂包括但不限于聚乙烯(PE)、高密度聚乙烯(HDPE)、低密度聚乙烯(LDPE)、线性低密度聚乙烯(LLDPE)中的一种或多种。
根据一些具体且优选实施方式，聚烯烃弹性体包括但不限于OBC、POE、POP中的一种或多种。
根据一些具体且优选实施方式，聚酯树脂包括但不限于聚对苯二甲酸乙二酯、聚对苯二甲酸丁二酯、聚对苯二甲酸二烯丙酯、聚对羟基苯甲酸酯中的一种或多种。
根据一些具体且优选实施方式，聚酯弹性体包括但不限于聚氨酯弹性体、含有聚醚软段的共聚酯弹性体。
根据一些具体且优选实施方式，离子聚合物包括但不限于聚合物树脂的钠离子、钾离子等的离子化聚合物中的一种或多种。
根据一些具体且优选实施方式，聚酰胺包括但不限于聚酰胺6(PA6)、聚酰胺-66(PA66)、聚酰胺1212(PA1212)中的一种或多种。
根据一些具体且优选实施方式，氟树脂包括但不限于聚氟乙烯(PVF)、聚偏氟乙烯(PVDF)、聚四氟乙烯(PTFE)中的一种或多种。
优选地，所述的胶黏层中增粘树脂的含量＞0，进一步优选为5～45％，再优选为5～40％，再进一步为10～30％，更进一步为15～25％。
优选地，所述的胶黏层中助剂的含量＞0，进一步优选为0.01～5％，再优选为0.05～5％，再进一步为0.1～5％，更进一步为0.5～3％。
优选地，按所述胶黏层的总质量为百分之百计，所述的胶黏层的原料配方包括60～90％的基体树脂、5～40％的增粘树脂、0～5％的助剂。
进一步优选地，按所述胶黏层的总质量为百分之百计，所述的胶黏层的原料配方包括70～90％的基体树脂、9～29％的增粘树脂、0.1～5％的助剂。
再优选地，按所述胶黏层的总质量为百分之百计，所述的胶黏层的原料配方包括75～85％的基体树脂、14～24％的增粘树脂、0.1～5％的助剂。
优选地，所述胶黏层中的基体树脂中至少包括聚烯烃弹性体。
优选地，所述的支撑层中助剂的含量含量＞0，进一步优选为0.01～5％，再优选为0.05～5％， 再进一步为0.1～5％，更进一步为0.5～3％。
优选地，按所述支撑层的总质量为百分之百计，所述的支撑层的原料配方包括95～99.9％的基体树脂、0.1～5％的助剂。
根据一些具体且优选实施方式，所述支撑层中的基体树脂为聚酰胺或其改性物、聚烯烃树脂或其改性物中的一种或多种。
根据另一些具体且优选实施方式，当所述支撑层中的基体树脂为聚烯烃弹性体时，所述支撑层中含有引发剂，且所述支撑层的预交联度为≥30％。
根据一些具体且优选实施方式，所述的助剂包括引发剂、交联剂、偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
根据一些具体且优选实施方式，所述的胶黏层的厚度为10～400μm。
根据一些具体且优选实施方式，所述的支撑层的厚度为10～400μm。
根据一些具体且优选实施方式，所述的焊带载体膜的厚度为20μm～500μm。
根据一些具体且优选实施方式，所述的焊带载体膜在波段为380～1100下的透光率≥80％，优选≥90％。
根据一些具体且优选实施方式，所述的焊带载体膜还可以包括设置在所述的胶黏层和所述的支撑层之间的一层或多层中间层。
进一步优选地，所述中间层的原料配方可以与支撑层类似，也可以是胶水固化形成。
进一步优选地，按所述中间层的总质量为百分之百计，所述的中间层的原料配方包括95～100％的基体树脂、0～5％的助剂。
更优选地，按所述中间层的总质量为百分之百计，所述的中间层原料配方包括95～99.9％的基体树脂、0.1～5％的助剂。
根据一些具体且优选实施方式，所述的焊带载体膜还可以包括设置在所述的支撑层外侧的离型膜，和/或，所述的支撑层的外侧面上有压花。
本公开中，压花并非限定为压制成花纹，只要是能够使得焊带载体膜的表面粗糙的方式均可。
进一步优选地，所述离型膜为常规离型膜，例如PE、PP、PET等，所述离型膜有色或者无色均可。
根据一些具体且优选实施方式，所述的胶黏层和所述的支撑层独立地为交联型或非交联型；即，在所述的焊带载体膜中，当胶黏层为交联型时，支撑层可以是交联型或非交联型；当胶黏 层为非交联型时，支撑层可以是交联型或非交联型。
进一步优选地，当所述的胶黏层为交联型时，所述的胶黏层的预交联度为≤60％。
更优选地，所述的焊带载体膜的两面的预交联度不同。
更优选地，所述的支撑层的预交联度大于所述的胶黏层的预交联度。
进一步优选地，当所述的胶黏层或所述的支撑层为交联型时，所述的基体树脂的熔点或者Tg温度≤150℃，当所述的胶黏层或所述的支撑层为非交联型时，所述的基体树脂的熔点或者Tg温度≥100℃。
本公开中，交联型和非交联型使用的基体树脂的熔点或者Tg温度的要求，是指基体树脂中至少部分树脂需要满足该要求。
进一步优选地，当所述的胶黏层为交联型时，所述的助剂包括引发剂、交联剂、偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种以保证胶黏层与焊带以及电池片的粘结力；当所述的支撑层为交联型时，所述的助剂包括引发剂、交联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种；当所述的胶黏层和所述的支撑层为非交联型时，所述的助剂包括引发剂、偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
更为优选地，当所述的胶黏层和所述的支撑层为非交联型时，所述的助剂为质量比为2～3:0.5～1.5:1的光稳定剂、抗氧剂、抗PID助剂。
更为优选地，当所述的胶黏层为交联型时，所述的助剂为质量比为1:1～3:0.8～1.5:1～2:0.4～1:0.4～1的引发剂、交联剂、偶联剂、光稳定剂、抗氧剂、抗PID助剂。
更为优选地，当所述的支撑层为交联型时，所述的助剂为质量比为1:1.5～2:0.5～1:0.1～0.5:0.1～0.5的引发剂、交联剂、光稳定剂、抗氧剂、抗PID助剂。
根据一些具体且优选实施方式，所述的引发剂为选自三羟甲基丙烷三丙烯酸酯、双三羟甲基丙烷四丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、4-二甲氨基苯甲酸乙酯、过氧化二异丙苯(DCP)、2,5-二甲基-2,5-二(叔丁基过氧基)己烷中的一种或几种。
根据一些具体且优选实施方式，所述的交联剂为选自过氧化2-乙基己基碳酸叔丁酯、叔丁基过氧化-异丙基碳酸酯、过氧化二苯甲酰、过氧化二异丙苯、2,5-二甲基-2,5-双(叔丁基过氧基)己烷、过氧化环己酮、叔丁基过氧化氢、过氧化苯甲酸叔丁酯、过氧乙酸叔丁酯、二-(4- 叔丁基环己基)过氧重碳酸酯、叔丁基过氧化-3,5,5-三甲基己酸酯、三烯丙基异氰酸酯(TAIC)中的一种或几种。
根据一些具体且优选实施方式，所述的偶联剂为选自3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、3-缩水甘油丙基三甲氧基硅烷、乙烯基三甲氧基硅烷、3-氨丙基三乙氧基硅烷、三异硬脂酰基钛酸异丙酯、异丙基三(二辛基焦磷酸酰氧基)钛酸酯等的一种或几种。
根据一些具体且优选实施方式，所述的光稳定剂为选自双(2,2,6,6-四甲基-4-哌啶基)癸二酸酯(光稳定剂770)、聚丁二酸(4-羟基-2,2,6，6-四甲基-1-哌啶乙醇)酯、聚-{[6-[(1,1,3,3-四甲基丁基)-亚氨基]-1,3,5-三嗪-2，4-二基][2-(2,2,6,6-四甲基哌啶基)-氨基]-亚已基-[4-(2,2,6,6-四甲基哌啶基)-亚氨基]}中的一种或几种。
根据一些具体且优选实施方式，所述的抗氧剂为酚系抗氧剂、亚磷酸酯系抗氧剂和受阻胺类抗氧剂中的一种或几种。
根据一些具体且优选实施方式，抗PID助剂为金属离子捕捉剂。
本发明的第二方面是提供一种所述的焊带载体膜的制备方法，其通过混料，然后流延、压延或吹塑成膜，对于交联型的载体膜选择性地采用电子、原子、离子、中子、热或电磁辐照以控制所述的载体膜的预交联度；优选采用电子或电磁辐照。
本发明的第三方面是提供一种焊带复合体，包括所述的焊带载体膜，以及粘附在所述的焊带载体膜上的焊带；优选地，对于交联型载体膜，所述的载体膜与所述的焊带接触的一侧的预交联度小于远离所述的焊带一侧的预交联度。
优选地，所述的焊带的至少30％及以上的体积露出所述的焊带载体膜以使焊带能够很好的与电池片接触的同时保证焊带与载体膜的粘结性能。进一步优选地，所述的焊带的30％～70％的体积露出所述的焊带载体膜，更优选为所述的焊带的40％～60％的体积露出所述的焊带载体膜。
本发明的第四方面是提供一种电池片复合体，包括电池片、与所述的电池片接触的焊带、以及用于将所述的焊带固定在所述的电池片上的载体膜，所述的载体膜为所述的焊带载体膜；优选地，所述的电池片的两面分别设置有所述的焊带以及所述的载体膜。
优选地，所述的电池片为晶硅电池、非晶硅电池、化学太阳能电池、多元化合物薄膜太阳能电池中的一种。
本发明的第五方面是提供一种电池片复合体的制备方法，包括如下步骤：
(1)控制温度在80～170℃下，通过压合将所述的焊带粘附在所述的载体膜上，控制压合 时间为0.1～1s，且相邻两个所述的载体膜分别位于所述的焊带的两侧且间隔分布；
(2)对粘附有所述的载体膜的焊带进行裁切以形成焊带复合体单元，所述的焊带复合体单元由所述的焊带以及两个所述的载体膜组成；
(3)控制温度在100～300℃下，将所述的焊带复合体单元压合在电池片的表面，控制压合时间为0.2～3s；优选地，所述的电池片的两面分别压合有所述的焊带复合体单元。
优选地，当所述的载体膜上设置有离型膜时，所述的离型膜在步骤(1)之前去除。
本发明的第六方面是提供一种所述的焊带载体膜，或所述的焊带复合体、或所述的电池片复合体在光伏组件中的应用。
由于上述技术方案运用，本发明与现有技术相比具有下列优点：
本发明通过对胶黏层和支撑层配方的优化，使得载体膜能够与焊带和电池片很好的粘结，且载体膜不易被压穿。
附图说明
图1为两层结构的载体膜形成的焊带复合体的结构示意图；
图2为三层结构的载体膜形成的焊带复合体的结构示意图；
图3为电池片复合体的结构示意图；
其中，1、胶黏层；2、支撑层；3、中间层；4、焊带；5、电池片。
具体实施方式
下面结合具体实施例对本发明作进一步描述，但本发明并不限于以下实施例。实施例中采用的实施条件可以根据具体使用的不同要求做进一步调整，未注明的实施条件为本行业中的常规条件。本发明中的原料均可市购获得。下述实施例和对比例中的原料的份数均为质量份。
实施例1
1、双层结构载体膜包括胶黏层1和支撑层2，其中，
支撑层2的原料配方为：基体树脂为聚乙烯接枝聚酰胺改性聚合物80份，PE 20份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
胶黏层1的原料配方为：基体树脂POE 50份，PE 30份，增粘树脂氢化石油树脂20份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
通过双层共挤、流延技术得到双层结构的80μm厚的膜，胶黏层1的厚度为40μm，支 撑层2的厚度为40μm。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁切成所需尺寸；
(2)控制温度在115℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜的胶黏层1上，控制压合时间为0.5s，且相邻两个载体膜分别粘附在焊带4的上下两侧且错开分布从而便于焊带4与电池片5的粘结；
(3)对粘附有载体膜的焊带4按照两个载体膜为一个单元进行裁切形成一个焊带复合体单元；
(4)控制温度在150℃下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜压合在一个电池片5的上表面，另一个载体膜压合在于该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜的一面与另一个焊带复合体单元的载体膜压合，从而使得每个电池片5的两面均压合有焊带复合体单元，结构如图3所示。
本实施例为双层非交联型载体膜，支撑层2主树脂为聚乙烯接枝聚酰胺改性聚合物，含有高熔点组分，Tm＞200℃，保证样品耐温性。
实施例2
1、双层结构载体膜包括胶黏层1和支撑层2，其中，
支撑层2的原料配方为：支撑层2基体树脂POE 100份，引发剂过氧化二异丙苯0.6份，交联剂TAIC 1份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
胶黏层1的原料配方为：基体树脂POE 50份，PE 30份，增粘树脂氢化石油树脂20份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
通过双层共挤、流延技术得到双层结构的80μm厚的膜，胶黏层1的厚度为40μm，支撑层2的厚度为40μm；然后通过电子束辐照使支撑层2具有一定的预交联度，约40％。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁切成所需尺寸；
(2)控制温度在115℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜的胶黏层1 上，控制压合时间为0.5s，且相邻两个载体膜分别粘附在焊带4的上下两侧且错开分布从而便于焊带4与电池片5的粘结；
(3)对粘附有载体膜的焊带4按照两个载体膜为一个单元进行裁切形成一个焊带复合体单元；
(4)控制温度在150℃下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜压合在一个电池片5的上表面，另一个载体膜压合在于该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜的一面与另一个焊带复合体单元的载体膜压合，从而使得每个电池片5的两面均压合有焊带复合体单元。
本实施例为双层部分交联型载体膜，通过电子束辐照使支撑层2具有一定的预交联度(约40％)以保证与焊带4压合过程中载体膜不会被压穿，同时在层压过程中可进一步交联，最终支撑层2交联度可达到75％以上；粘结层为非交联型结构。
实施例3
1、双层结构载体膜包括胶黏层1和支撑层2，其中，
支撑层2的原料配方为：支撑层2基体树脂聚乙烯75份，POE 25份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.6份，交联剂TAIC 1份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
胶黏层1的原料配方为：基体树脂POE 80份，氢化石油树脂20份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.3份，交联剂TAIC 0.6份，偶联剂乙烯基三甲氧基硅烷0.3份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
通过双层共挤、流延技术得到双层结构的80μm厚的膜，胶黏层1的厚度为40μm，支撑层2的厚度为40μm；然后通过电子束辐照使支撑层2和胶黏层1具有一定的预交联度，其中支撑层2预交联度约40％，粘结层预交联度约15％。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁切成所需尺寸；
(2)控制温度在115℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜的胶黏层1上，控制压合时间为0.5s，且相邻两个载体膜分别粘附在焊带4的上下两侧且错开分布从而便 于焊带4与电池片5的粘结；
(3)对粘附有载体膜的焊带4按照两个载体膜为一个单元进行裁切形成一个焊带复合体单元；
(4)控制温度在150℃下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜压合在一个电池片5的上表面，另一个载体膜压合在于该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜的一面与另一个焊带复合体单元的载体膜压合，从而使得每个电池片5的两面均压合有焊带复合体单元。
本实施例为交联型双层载体膜，通过电子束辐照及配方调整使样品支撑层2及粘结层均具有一定的预交联度，其中支撑层2预交联度约40％，粘结层预交联度约15％，同时在层压过程中可进一步交联，最终交联度可达到75％以上。
实施例4
1、三层结构载体膜包括胶黏层1、支撑层2以及位于胶黏层1和支撑层2之间的中间层3，其结构如图2所示，其中，
支撑层2的原料配方为：基体树脂聚酰胺100份，光稳定剂770 0.5份，抗氧剂1010 0.2份,抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
中间层3的原料配方为：基体树脂聚乙烯接枝聚酰胺改性聚合物40份，聚乙烯60份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
胶黏层1的原料配方为：基体树脂POE 50份，PE 30份，增粘树脂氢化石油树脂20份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
通过三层共挤、流延技术得到三层结构的100μm厚的膜，胶黏层1的厚度为40μm，中间层3的厚度为30μm，支撑层2的厚度为30μm。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁切成所需尺寸；
(2)控制温度在115℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜的胶黏层1上，控制压合时间为0.5s，且相邻两个载体膜分别粘附在焊带4的上下两侧且错开分布从而便于焊带4与电池片5的粘结；
(3)对粘附有载体膜的焊带4按照两个载体膜为一个单元进行裁切形成一个焊带复合体 单元；
(4)控制温度在150℃下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜压合在一个电池片5的上表面，另一个载体膜压合在于该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜的一面与另一个焊带复合体单元的载体膜压合，从而使得每个电池片5的两面均压合有焊带复合体单元。
本实施例为非交联型三层载体膜，支撑层2为高熔点透明聚酰胺，熔点＞200℃，保证样品耐温性；中间层3为过渡层，确保支撑层2与胶黏层1能够顺利共挤成型，同时起到缓冲作用，增加样品整体的弹性；胶黏层1保证与焊带及电池片5的粘结性能。
对比例1
1、双层结构载体膜包括胶黏层1和支撑层2，其中，
支撑层2的原料配方为：支撑层2基体树脂POE 100份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
胶黏层1的原料配方为：基体树脂POE 50份，PE 30份，增粘树脂氢化石油树脂20份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
通过双层共挤、流延技术得到双层结构的80μm厚的膜，胶黏层1的厚度为40μm，支撑层2的厚度为40μm。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁切成所需尺寸；
(2)控制温度在115℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜的胶黏层1上，控制压合时间为0.5s，载体膜被压穿。
本实施例为双层非交联型载体膜，支撑层2的主树脂为POE，熔点较低(＜80℃)，在与焊带4粘合过程中载体膜被焊带4压穿。
对比例2
1、双层结构载体膜包括胶黏层1和支撑层2，其中，
支撑层2的原料配方为：支撑层2基体树脂聚乙烯接枝聚酰胺改性聚合物80份，聚乙烯20份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤 出造粒。
胶黏层1的原料配方为：基体树脂PE 100份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
通过双层共挤、流延技术得到双层结构的80μm厚的膜，胶黏层1的厚度为40μm，支撑层2的厚度为40μm。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁切成所需尺寸；
(2)控制温度在115℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜的胶黏层1上，控制压合时间为0.5s，且相邻两个载体膜分别粘附在焊带4的上下两侧且错开分布；但载体膜与焊带4无法粘结；
(3)控制温度在150℃下，利用载体膜将焊带4粘结在电池片5上，控制压合时间为1.5s；但载体膜无法与电池片5粘结。
本实施例为双层非交联型载体膜，胶黏层1为非极性纯聚乙烯材料，未添加增粘树脂及硅烷偶联剂，与焊带4及电池片5难以粘结。
对比例3
1、双层结构载体膜包括胶黏层1和支撑层2，其中，
支撑层2的原料配方为：支撑层2基体树脂聚乙烯75份，POE 25份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.6份，交联剂TAIC 1份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
胶黏层1的原料配方为：基体树脂POE 80份，氢化石油树脂20份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.8份，交联剂TAIC 2份，偶联剂乙烯基三甲氧基硅烷0.3份，光稳定剂770 0.5份，抗氧剂1010 0.2份，抗PID助剂0.2份；经高混机混合均匀后挤出造粒。
通过双层共挤、流延技术得到双层结构的80μm厚的膜，胶黏层1的厚度为40μm，支撑层2的厚度为40μm；然后通过电子束辐照使支撑层2和胶黏层1具有一定的预交联度，其中支撑层2预交联度约40％，粘结层预交联度约70％。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁切成所需尺寸；
(2)控制温度在115℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜的胶黏层1 上，控制压合时间为0.5s，且相邻两个载体膜分别粘附在焊带4的上下两侧且错开分布；但载体膜与焊带4无法粘结；
(3)控制温度在150℃下，利用载体膜将焊带4粘结在电池片5上，控制压合时间为1.5s；但载体膜无法与电池片5粘结。
本实施例为交联型双层载体膜，通过电子束辐照及配方调整使样品支撑层2及胶黏层1均具有一定的预交联度，其中支撑层2预交联度约40％，胶黏层1预交联度约70％，胶黏层1预交联度过高，与焊带4及电池片5难以粘结。
上述实施例和对比例制得的载体膜按照如下方法进行检测，检测结果见表1。
各性能的检测和评定方法如下：
收缩率：GB/T 13541-92；
透过率：IEC60664-1；
预交联度/交联度：溶剂法(二甲苯回流145℃,5h)
与焊带4及电池片5粘合情况：目测。
表1
Figure PCTCN2020139549-appb-000001
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (17)

  1. 一种焊带载体膜，其特征在于：包括胶黏层和支撑层，按所述胶黏层的总质量为百分之百计，所述的胶黏层的原料配方包括50～95％的基体树脂、0～50％的增粘树脂、0～5％的助剂；按所述支撑层的总质量为百分之百计，所述的支撑层的原料配方包括95～100％的基体树脂、0～5％的助剂；所述的基体树脂为聚烯烃树脂及其弹性体、聚酯树脂及其弹性体、聚乙烯醇缩丁醛酯、乙烯-醋酸乙烯酯共聚物、乙烯-丙烯酸共聚物、离子聚合物、聚酰胺、氟树脂、及上述物质的改性物中的一种或多种；所述的增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、萜烯树脂中的一种或多种。
  2. 根据权利要求1所述的焊带载体膜，其特征在于：所述的助剂包括引发剂、交联剂、偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
  3. 根据权利要求1所述的焊带载体膜，其特征在于：所述的焊带载体膜的厚度为20μm～500μm；和/或，所述的胶黏层的厚度为10～400μm；和/或，所述的支撑层的厚度为10～400μm；和/或，所述的焊带载体膜在波段为380～1100下的透光率≥80％，优选≥90％。
  4. 根据权利要求1所述的焊带载体膜，其特征在于：所述的焊带载体膜还可以包括设置在所述的胶黏层和所述的支撑层之间的一层或多层中间层。
  5. 根据权利要求1或4所述的焊带载体膜，其特征在于：所述的焊带载体膜还可以包括设置在所述的支撑层外侧的离型膜，和/或，所述的支撑层的外侧面上有压花。
  6. 根据权利要求1所述的焊带载体膜，其特征在于：所述的胶黏层和所述的支撑层独立地为交联型或非交联型；当所述的胶黏层为交联型时，所述的胶黏层的预交联度≤60％，优选所述的焊带载体膜的两面的预交联度不同。
  7. 根据权利要求6所述的焊带载体膜，其特征在于：当所述的胶黏层或所述的支撑层为交联型时，所述的基体树脂的熔点或者Tg温度≤150℃，当所述的胶黏层或所述的支撑层为非交联型时，所述的基体树脂的熔点或者Tg温度≥100℃。
  8. 根据权利要求6所述的焊带载体膜，其特征在于：当所述的胶黏层为交联型时，所述的助剂包括引发剂、交联剂、偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种；当所述的支撑层为交联型时，所述的助剂包括引发剂、交联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种；当所述的胶黏层和所述的支撑层为非交联型时，所述的助剂包括引发剂、偶联剂、 光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
  9. 一种如权利要求1至8中任一项所述的焊带载体膜的制备方法，其特征在于：其通过混料，然后流延、压延或吹塑成膜，对于交联型的载体膜选择性地采用电子、原子、离子、中子、热或电磁辐照以控制所述的载体膜的预交联度；优选采用电子或电磁辐照。
  10. 一种焊带复合体，其特征在于：包括权利要求1至8中任一项所述的焊带载体膜，以及粘附在所述的焊带载体膜上的焊带；优选地，对于交联型载体膜，所述的载体膜与所述的焊带接触的一侧的预交联度小于远离所述的焊带一侧的预交联度。
  11. 根据权利要求10所述的焊带复合体，其特征在于：所述的焊带的至少30％及以上的体积露出所述的焊带载体膜。
  12. 一种电池片复合体，其特征在于：包括电池片、与所述的电池片接触的焊带、以及用于将所述的焊带固定在所述的电池片上的载体膜，所述的载体膜为权利要求1至8中任一项所述的焊带载体膜；优选地，所述的电池片的两面分别设置有所述的焊带以及所述的载体膜。
  13. 根据权利要求12所述的电池片复合体，其特征在于：所述的电池片为晶硅电池、非晶硅电池、化学太阳能电池、多元化合物薄膜太阳能电池中的一种。
  14. 一种电池片复合体的制备方法，其特征在于：包括如下步骤：
    (1)控制温度在80～170℃下，通过压合将所述的焊带粘附在如权利要求1至8中任一项所述的载体膜上，控制压合时间为0.1～1s，且相邻两个所述的载体膜分别位于所述的焊带的两侧且间隔分布；
    (2)对粘附有所述的载体膜的焊带进行裁切以形成焊带复合体单元，所述的焊带复合体单元由所述的焊带以及两个所述的载体膜组成；
  15. 控制温度在100～300℃下，将所述的焊带复合体单元压合在电池片的表面，控制压合时间为0.2～3s；优选地，所述的电池片的两面分别压合有所述的焊带复合体单元。
  16. 根据权利要求14所述的电池片复合体的制备方法，其特征在于：当所述的载体膜上设置有离型膜时，所述的离型膜在步骤(1)之前去除。
  17. 一种如权利要求1至8中任一项所述的焊带载体膜，或权利要求10或11所述的焊带复合体、或权利要求12或13所述的电池片复合体在光伏组件中的应用。
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