WO2022057139A1 - 一种焊带载体膜及其制备方法和应用 - Google Patents

一种焊带载体膜及其制备方法和应用 Download PDF

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Publication number
WO2022057139A1
WO2022057139A1 PCT/CN2020/139566 CN2020139566W WO2022057139A1 WO 2022057139 A1 WO2022057139 A1 WO 2022057139A1 CN 2020139566 W CN2020139566 W CN 2020139566W WO 2022057139 A1 WO2022057139 A1 WO 2022057139A1
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Prior art keywords
carrier film
ribbon
resin
welding tape
battery sheet
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PCT/CN2020/139566
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English (en)
French (fr)
Inventor
韩晓航
王磊
郑亚
陈洪野
吴小平
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苏州赛伍应用技术股份有限公司
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Priority to US18/044,855 priority Critical patent/US20230374347A1/en
Publication of WO2022057139A1 publication Critical patent/WO2022057139A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F289/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds not provided for in groups C08F251/00 - C08F287/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/04—Homopolymers or copolymers of ethene
    • C08J2423/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2457/00—Characterised by the use of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C08J2457/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C08K5/1345—Carboxylic esters of phenolcarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/10—Joining materials by welding overlapping edges with an insertion of plastic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention specifically relates to a welding tape carrier film and a preparation method and application thereof.
  • the wire is carried by an adhesive film and fixed on the battery sheet during lamination, such as the preparation method of the busbarless welding tape for solar cells CN201510933299.0 of Yellow River Hydropower Photovoltaic Industry Technology Co., Ltd.
  • the adhesive film in the prior art usually has a structure of two or more layers, one is a support layer and the other is an adhesive layer; the adhesive layer provides the adhesive force required for the bonding of the adhesive film and the welding tape and The adhesive force required for the bonding of the adhesive film to the battery sheet.
  • the adhesive film with two or more layers is used in the encapsulation of photovoltaic modules, the connection between the support layer and the encapsulation material is prone to delamination at high temperature; in addition, the multi-layer structure will inevitably make the adhesive film used in the packaging. There are many components, which in turn has a great influence on the light transmittance, refractive index and haze of the adhesive film, and the processing cost is high, and the equipment cost is also high.
  • the purpose of the present invention is to provide a welding tape carrier film, which can well bond the welding tape on the battery sheet and has a simple structure, as well as a preparation method and application thereof.
  • the technical scheme adopted in the present invention is:
  • the raw material formula includes 50-99% of matrix resin, 0-50% of tackifying resin, and 0-5% of auxiliary agent;
  • the matrix The resin is polyolefin resin and its elastomer, polyester resin and its elastomer, polyvinyl butyral (PVB), ethylene-vinyl acetate copolymer (EVA), ethylene-acrylic acid copolymer (EAA), ionic One or more of polymers, polyamides, fluororesins, and modifications of the above substances;
  • the tackifying resins are rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, terpene resin one or more of.
  • modified products of various types of matrix resins in the present invention can be based on the matrix resin, using other monomers (including but not limited to ethylene) or modifiers (including but not limited to silane) to copolymerize and graft the matrix resin. etc. modification.
  • the polyolefin resin includes, but is not limited to, one of polyethylene (PE), high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE) or variety.
  • PE polyethylene
  • HDPE high density polyethylene
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • polyolefin elastomers include, but are not limited to, one or more of OBC, POE, POP.
  • polyester resins include, but are not limited to, polyethylene terephthalate, polybutylene terephthalate, polydiallyl terephthalate, polyparaben one or more of.
  • polyester elastomers include, but are not limited to, one or more of polyurethane elastomers, copolyester elastomers containing polyether soft segments.
  • ionic polymers include, but are not limited to, ionized polymers of sodium ions, potassium ions, etc., of polymer resins.
  • polyamides include, but are not limited to, one or more of polyamide 6 (PA6), polyamide-66 (PA66), polyamide 1212 (PA1212).
  • the fluororesin includes, but is not limited to, one or more of polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), and polytetrafluoroethylene (PTFE).
  • PVF polyvinyl fluoride
  • PVDF polyvinylidene fluoride
  • PTFE polytetrafluoroethylene
  • the content of the tackifying resin is >0.
  • the raw material formulation of the ribbon carrier film includes 50-95% of matrix resin, 0.1-50% of tackifying resin, and 0-5% of auxiliary agent.
  • the raw material formulation of the ribbon carrier film includes 60-90% of matrix resin, 5-39% of tackifying resin, and 0.1-5% of auxiliary agent.
  • the raw material formulation of the ribbon carrier film includes 75-90% of matrix resin, 5-20% of tackifier resin, and 0.1-5% of auxiliary agent.
  • the content of the tackifying resin is 0, and in this case, at least one of the matrix resins is a polar resin.
  • the raw material formulation of the ribbon carrier film includes 95-99.9% of the matrix resin and 0.1-5% of the auxiliary agent.
  • the raw material formulation of the ribbon carrier film includes 95-99% of the matrix resin and 1-5% of the auxiliary agent.
  • the auxiliary agents include initiators, cross-linking agents, silane coupling agents, light stabilizers, antioxidants, ultraviolet absorbers, blocking agents, nucleating agents, anti-reflection agents, and anti-PID auxiliary agents. one or more.
  • the thickness of the ribbon carrier film is 20 ⁇ m ⁇ 500 ⁇ m.
  • the light transmittance of the ribbon carrier film in the wavelength range of 380-1100 is ⁇ 80%, preferably ⁇ 90%.
  • a release film is further provided on one side of the ribbon carrier film, and/or a single side of the ribbon carrier film is embossed.
  • the embossing is not limited to embossing into a pattern, and any form may be used as long as the surface of the ribbon carrier film can be roughened.
  • the release film or embossing is formed on a layer away from the welding tape, and the side in contact with the welding tape should be as smooth as possible.
  • the release film is a conventional release film, such as PE, PP, PET, etc., and the release film may be colored or colorless.
  • the ribbon carrier film is a cross-linked type or a non-cross-linked type; when the ribbon carrier film is a cross-linked type, the pre-crosslinking degree of the ribbon carrier film is ⁇ 60% , preferably, the pre-crosslinking degrees of the two sides of the ribbon carrier film are different.
  • the melting point or Tg temperature of the matrix resin is ⁇ 150°C
  • the melting point or Tg temperature of the matrix resin is greater than or equal to 100°C.
  • the requirement of the melting point or Tg temperature of the matrix resin used in the cross-linked type and the non-cross-linked type means that at least part of the resin in the matrix resin needs to meet this requirement.
  • the auxiliary agent when the ribbon carrier film is a cross-linked type, includes an initiator, a cross-linking agent, a silane coupling agent, as well as a light stabilizer, an antioxidant, an ultraviolet absorber, an opening One or more of the agent, nucleating agent, anti-penetration agent, anti-PID auxiliary agent; when the ribbon carrier film is non-crosslinked type, the auxiliary agent includes initiator, silane coupling agent , one or more of light stabilizers, antioxidants, ultraviolet absorbers, blocking agents, nucleating agents, anti-reflection agents, and anti-PID additives.
  • the auxiliary agent is a light stabilizer, an antioxidant, an anti-PID auxiliary agent with a mass ratio of 2-3:0.5-1.5:1
  • the auxiliary agent is an initiator, coupling agent, light stabilizer, antioxidant, anti-PID auxiliary agent whose mass ratio is 0.5 ⁇ 1.5:2 ⁇ 8:2 ⁇ 3:0.5 ⁇ 1.5:1 .
  • the auxiliary agent is in a mass ratio of 1:1-3:0.8-1.5:0.5-1:0.1-0.5:0.1-0.5 Initiators, cross-linking agents, coupling agents, light stabilizers, antioxidants, anti-PID additives.
  • the initiators include but are not limited to trimethylolpropane triacrylate, bis-trimethylolpropane tetraacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated triacrylate Methylol propane triacrylate, ethyl 4-dimethylaminobenzoate, dicumyl peroxide (DCP), 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane One or more of the alkanes.
  • DCP dicumyl peroxide
  • the cross-linking agent includes, but is not limited to, tert-butyl peroxide 2-ethylhexyl carbonate, tert-butyl peroxy-isopropyl carbonate, dibenzoyl peroxide, Dicumyl oxide, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, cyclohexanone peroxide, tert-butyl hydroperoxide, tert-butyl peroxybenzoate , tert-butyl peroxyacetate, di-(4-tert-butylcyclohexyl) peroxydicarbonate, tert-butyl peroxy-3,5,5-trimethylhexanoate, triallyl isocyanate (TAIC) one or more of them.
  • TAIC triallyl isocyanate
  • the coupling agent includes but is not limited to 3-methacryloyloxypropylmethyldimethoxysilane, 3-glycidylpropyltrimethoxysilane, vinyltrimethylsilane One or more of oxysilane, 3-aminopropyltriethoxysilane, isopropyl triisostearoyl titanate, and isopropyl tris(dioctyl pyrophosphate acyloxy) titanate .
  • the light stabilizers include but are not limited to bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate (light stabilizer 770), poly Succinate (4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol) ester, poly- ⁇ [6-[(1,1,3,3-tetramethylbutyl) -Imino]-1,3,5-triazine-2,4-diyl][2-(2,2,6,6-tetramethylpiperidinyl)-amino]-hexylene-[4 One or more of -(2,2,6,6-tetramethylpiperidinyl)-imino].
  • the antioxidants include, but are not limited to, one or more of phenol-based antioxidants, phosphite-based antioxidants and hindered amine-based antioxidants.
  • the anti-PID adjuvant is a metal ion scavenger.
  • the second aspect of the present invention is to provide a method for preparing the carrier film for welding tape, which is formed into a film by mixing materials and then casting, calendering or blowing, and selectively adopts electronic, Atomic, ionic, neutron, thermal or electromagnetic radiation to control the degree of pre-crosslinking of the carrier film; electron or electromagnetic radiation is preferred.
  • a third aspect of the present invention is to provide a welding tape composite body, including the welding tape carrier film, and a welding tape adhered on the welding tape carrier film; preferably, for the cross-linked carrier film,
  • the pre-crosslinking degree of the side of the carrier film in contact with the welding tape is smaller than the pre-crosslinking degree of the side away from the welding tape.
  • the volume of the soldering tape is exposed to the carrier film of the soldering tape, so that the soldering tape can be in good contact with the battery sheet and the bonding performance between the soldering tape and the carrier film is ensured.
  • 30%-70% of the volume of the soldering tape is exposed to the soldering tape carrier film, more preferably 40%-60% of the volume of the soldering tape is exposed to the soldering tape carrier film .
  • a fourth aspect of the present invention is to provide a battery sheet composite, comprising a battery sheet, a welding tape in contact with the battery sheet, and a carrier film for fixing the welding tape on the battery sheet,
  • the carrier film is the ribbon carrier film; preferably, the ribbon and the carrier film are respectively provided on both sides of the battery sheet.
  • the cell is one of a crystalline silicon cell, an amorphous silicon cell, a chemical solar cell, a multicomponent compound thin film solar cell, and the like.
  • a fifth aspect of the present invention is to provide a method for preparing a battery sheet composite, comprising the following steps:
  • the release film is removed before step (1) or after step (3).
  • the sixth aspect of the present invention is to provide an application of the ribbon carrier film, or the ribbon composite, or the cell composite in a photovoltaic module.
  • the present invention has the following advantages compared with the prior art:
  • the present invention can make the carrier film into a single-layer structure, which can play a supporting role while ensuring the bonding performance with the welding tape and the battery sheet, and the carrier film will not be damaged during lamination. Ribbon punch-through while only having a single layer construction also increases compatibility with encapsulation films.
  • the carrier film of the invention has a simple structure, low production cost and low equipment cost. At the same time, through the improved process, the carrier film and the welding tape can be fixed quickly and stably, which facilitates the lamination of the entire assembly in the next step.
  • FIG. 1 is a schematic structural diagram of a ribbon composite formed by a carrier film
  • FIG. 2 is a schematic structural diagram of a battery sheet composite
  • the present invention will be further described below in conjunction with specific embodiments, but the present invention is not limited to the following embodiments.
  • the implementation conditions adopted in the examples can be further adjusted according to different requirements of specific use, and the unremarked implementation conditions are the conventional conditions in the industry.
  • the parts of raw materials in the following examples and comparative examples are all parts by mass.
  • the raw material formula of carrier film 1 is: 50 parts of matrix resin linear low density polyethylene (LLDPE), 30 parts of POE, 20 parts of hydrogenated petroleum resin, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-oxidant PID auxiliary agent; after being uniformly mixed by a high-mixer, it is cast into an 80 ⁇ m film, without release film, and can be embossed on one side or not embossed according to needs.
  • LLDPE matrix resin linear low density polyethylene
  • POE polyethylene
  • hydrogenated petroleum resin 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-oxidant PID auxiliary agent
  • This embodiment is a non-crosslinked carrier film, and the amount of LLDPE is relatively large to improve the overall temperature resistance and prevent the film from being pressed through by the welding tape when it is bonded to the welding tape.
  • carrier film 1 matrix resin linear low density polyethylene (LLDPE) 50 parts, POE 40 parts, hydrogenated petroleum resin 10 parts, initiator 2,5-dimethyl-2,5-bis(tertiary) 0.2 part of butyl peroxy) hexane, 1 part of silane coupling agent vinyltrimethoxysilane, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID additive; mixed by high mixer uniform, and then grafted in a twin-screw extruder at a grafting temperature of 180-250 °C, and finally cast into a 80 ⁇ m film.
  • LLDPE matrix resin linear low density polyethylene
  • This example is a non-crosslinked carrier film.
  • Initiator and silane coupling agent are added to increase the adhesion between the film and the battery sheet and the temperature resistance of the film itself.
  • the matrix resin LLDPE is grafted and modified. Grafting is carried out in an extruder, and the grafting temperature is 180-250 ° C, which can reduce the crystallinity of LLDPE, improve the transmittance of the film itself, and reduce the haze.
  • the raw material formula of carrier film 1 is: 80 parts of matrix resin POE, 20 parts of hydrogenated petroleum resin, 0.6 part of initiator 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, 1 part of cross-linking agent TAIC, 0.6 part of silane coupling agent vinyltrimethoxysilane, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID auxiliary agent; mixed evenly by high mixer and placed for 4 -8h to ensure that the additives can be completely absorbed by the resin, and then cast into a 80 ⁇ m film, and finally the film is irradiated with electron beams to make the pre-crosslinking degree of the product reach 20%, and further crosslinking can be performed during the lamination process.
  • This example is a cross-linked carrier film, with a pre-cross-linking degree of 20%, a post-lamination cross-linking degree of 73%, and the melting point of the matrix resin at about 70°C. It will be pressed through, and the pre-crosslinking degree should not be too high to ensure the initial adhesion of the film, the ribbon and the battery.
  • the raw material formula of carrier film 1 is: 60 parts of matrix resin POE, 40 parts of EAA, 0.6 part of initiator 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, cross-linking 1 part of TAIC, 0.6 part of silane coupling agent vinyltrimethoxysilane, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID additive; mixed evenly by high mixer and placed for 4-8h To ensure that the additives can be completely absorbed by the resin, then cast into a 80 ⁇ m film, and finally irradiate the film with electron beams to make the pre-crosslinking degree of the product reach 20%, and further crosslinking can be performed during the lamination process.
  • This example is a cross-linked carrier film with a pre-cross-linking degree of 20% and a post-lamination cross-linking degree of 75%.
  • the polar material EAA is used to replace the tackifier resin with a smaller molecular weight to ensure the initial adhesion with the welding tape and the battery sheet. At the same time, it is matched with a pre-crosslinking degree of 20% to ensure that the film will not be pressed through when it is bonded to the welding tape.
  • carrier film 1 100 parts of matrix resin linear low density polyethylene (LLDPE), 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID additive; mixed evenly by high mixer Then cast into 80 ⁇ m thin films.
  • LLDPE matrix resin linear low density polyethylene
  • This embodiment is a non-cross-linked carrier film, pure LLDPE film, non-polar low-melting resin or tackifying resin, which cannot be bonded to the welding tape and the battery sheet.
  • the raw material formula of carrier film 1 is: 100 parts of matrix resin POE, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID auxiliary agent; mixed uniformly by high mixer and cast into 80 ⁇ m film.
  • This example is a non-crosslinked carrier film, pure POE film with a melting point of 70°C, and the sample is pressed through by the welding tape when it is bonded to the welding tape.
  • the raw material formula of carrier film 1 is: 80 parts of matrix resin POE, 20 parts of hydrogenated petroleum resin, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID auxiliary; Cast into 80 ⁇ m films.
  • This example is a non-crosslinked carrier film, the base resin POE melting point is 70°C, and 20 parts of hydrogenated petroleum resin is added at the same time, and the sample is pressed through by the welding tape when it is bonded to the welding tape.
  • the raw material formula of carrier film 1 is: 80 parts of matrix resin POE, 20 parts of hydrogenated petroleum resin, 0.6 part of initiator 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, 1 part of cross-linking agent TAIC, 0.6 part of silane coupling agent vinyltrimethoxysilane, 0.5 part of light stabilizer 770, 0.2 part of antioxidant 1010, 0.2 part of anti-PID auxiliary agent; mixed evenly by high mixer and placed for 4 -8h to ensure that the additives can be completely absorbed by the resin, and then cast into a 80 ⁇ m film, and finally the film is irradiated by electron beam to make the pre-crosslinking degree of the product reach 65%, and at the same time, it can be further cross-linked during the lamination process. Degree 80%.
  • This embodiment is a cross-linked carrier film, with a pre-cross-linking degree of 65%, and the pre-cross-linking is too high to achieve bonding with the welding tape and the battery sheet.
  • Pre-crosslinking degree/crosslinking degree solvent method (Xylene reflux 145°C, 5h)

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Abstract

本发明涉及一种焊带载体膜，按质量百分比计，其原料配方包括50～99％的基体树脂、0～50％的增粘树脂、0～5％的助剂；所述的基体树脂为聚烯烃树脂及其弹性体、聚酯树脂及其弹性体、聚乙烯醇缩丁醛酯、乙烯-醋酸乙烯酯共聚物、乙烯-丙烯酸共聚物、离子聚合物、聚酰胺、氟树脂、及上述物质的改性物中的一种或多种；所述的增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、萜烯树脂中的一种或多种。本发明通过对载体膜配方的优化，使得载体膜可以制作成单层结构，在保证与焊带和电池片的粘结性能的同时，可以起到支撑作用，载体膜在层压时不会被焊带压穿，本发明的载体膜结构简单，生产成本以及设备成本低。

Description

一种焊带载体膜及其制备方法和应用 技术领域
本发明具体涉及一种焊带载体膜及其制备方法和应用。
背景技术
目前光伏行业组件的发展趋势是从3主栅变成4主栅、5主栅，近而发展成现在的多主栅。近几年有提出无主栅组件，可以节约银的用量以及减少栅线对电池片遮挡，提高发电效率，如泰州隆基乐叶CN201720080886.4 IBC电池的电极互联结构，CN201710054876.8一种N型双面电池互联工艺；深圳市拉普拉斯能源技术有限公司CN201720292907.9无主栅太阳能电池组件。
目前无主栅组件的电池片的导线有两种方式固定于电池片上：
1是通过电镀工艺，如苏州太阳井新能源有限公司，CN201820959124.6一种无主栅双面电镀金属化太阳能电池片；
2.通过一个粘接膜将导线载住，在层压时固定在电池片上，如黄河水电光伏产业技术有限公司CN201510933299.0一种用于太阳能电池的无主栅焊带的制备方法。
另外，现有技术中的粘结膜通常为两层及以上的结构，一层为支撑层，一层为粘结层；粘结层提供粘结膜与焊带复合所需的粘结力以及粘结膜与电池片复合所需的粘结力。但是，采用两层及以上结构的粘结膜在光伏组件封装时，在高温下，支撑层与封装材料的连接容易出现分层的现象；另外，层结构多，必然会使得粘结膜中使用的成分多，进而对粘结膜的透光率、折射率和雾度的影响大，加工成本高，设备成本也高。
发明内容
本发明的目的是提供一种能够很好的将焊带粘结在电池片上且结构简单的焊带载体膜及其制备方法和应用。
为达到上述目的，本发明采用的技术方案是：
本发明一方面提供一种焊带载体膜，按质量百分比计，其原料配方包括50～99％的基体树脂、0～50％的增粘树脂、0～5％的助剂；所述的基体树脂为聚烯烃树脂及其弹性体、聚酯树脂及其弹性体、聚乙烯醇缩丁醛酯(PVB)、乙烯-醋酸乙烯酯共聚物(EVA)、乙烯-丙烯酸共聚物 (EAA)、离子聚合物、聚酰胺、氟树脂、及上述物质的改性物中的一种或多种；所述的增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、萜烯树脂中的一种或多种。
本发明中各类基体树脂的改性物可以是在基体树脂的基础上，利用其它单体(包括但不限于乙烯)或改性物(包括但不限于硅烷)对基体树脂进行共聚、接枝等改性。
根据一些具体且优选实施方式，聚烯烃树脂包括但不限于聚乙烯(PE)、高密度聚乙烯(HDPE)、低密度聚乙烯(LDPE)、线性低密度聚乙烯(LLDPE)中的一种或多种。
根据一些具体且优选实施方式，聚烯烃弹性体包括但不限于OBC、POE、POP中的一种或多种。
根据一些具体且优选实施方式，聚酯树脂包括但不限于聚对苯二甲酸乙二酯、聚对苯二甲酸丁二酯、聚对苯二甲酸二烯丙酯、聚对羟基苯甲酸酯中的一种或多种。
根据一些具体且优选实施方式，聚酯弹性体包括但不限于聚氨酯弹性体、含有聚醚软段的共聚酯弹性体中的一种或多种。
根据一些具体且优选实施方式，离子聚合物包括但不限于聚合物树脂的钠离子、钾离子等的离子化聚合物。
根据一些具体且优选实施方式，聚酰胺包括但不限于聚酰胺6(PA6)、聚酰胺-66(PA66)、聚酰胺1212(PA1212)中的一种或多种。
本发明中，氟树脂包括但不限于聚氟乙烯(PVF)、聚偏氟乙烯(PVDF)、聚四氟乙烯(PTFE)中的一种或多种。
根据一种实施方式，所述增粘树脂的含量＞0。
根据该实施方式的优选方式，所述焊带载体膜的原料配方包括50～95％的基体树脂、0.1～50％的增粘树脂、0～5％的助剂。
进一步优选地，所述焊带载体膜的原料配方包括60～90％的基体树脂、5～39％的增粘树脂、0.1～5％的助剂。
更优选地，所述焊带载体膜的原料配方包括75～90％的基体树脂、5～20％的增粘树脂、0.1～5％的助剂。
根据另一种实施方式，所述增粘树脂的含量为0，此时，所述的基体树脂中至少一种为极性树脂。
根据该实施方式的优选方式，所述焊带载体膜的原料配方包括95～99.9％的基体树脂、0.1～5％的助剂。
进一步优选地，所述焊带载体膜的原料配方包括95～99％的基体树脂、1～5％的助剂。
优选地，所述的助剂包括引发剂、交联剂、硅烷偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
优选地，所述的焊带载体膜的厚度为20μm～500μm。
优选地，所述的焊带载体膜在波段为380～1100下的透光率≥80％，优选≥90％。
优选地，所述的焊带载体膜的单侧还设置有离型膜，和/或，所述的焊带载体膜的单侧压花。
本发明中，压花并非限定为压制成花纹，只要是能够使得焊带载体膜的表面粗糙的方式均可。
本发明中，离型膜或压花均形成在远离焊带的一层，而与焊带接触的一侧应尽量光滑。
进一步优选地，所述离型膜为常规离型膜，例如PE、PP、PET等，所述离型膜有色或者无色均可。
优选地，所述的焊带载体膜为交联型或非交联型；当所述的焊带载体膜为交联型时，所述的焊带载体膜的预交联度为≤60％，优选所述的焊带载体膜的两面的预交联度不同。
进一步优选地，当所述的焊带载体膜为交联型时，所述的基体树脂的熔点或者Tg温度≤150℃，当所述的焊带载体膜为非交联型时，所述的基体树脂的熔点或者Tg温度≥100℃。
本发明中，交联型和非交联型使用的基体树脂的熔点或者Tg温度的要求，是指基体树脂中至少部分树脂需要满足该要求。
进一步优选地，当所述的焊带载体膜为交联型时，所述的助剂包括引发剂、交联剂、硅烷偶联剂，以及光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种；当所述的焊带载体膜为非交联型时，所述的助剂包括引发剂、硅烷偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
更为优选地，当所述的焊带载体膜为非交联型时，所述的助剂为质量比为2～3:0.5～1.5:1的光稳定剂、抗氧剂、抗PID助剂；或者，所述的助剂为质量比为0.5～1.5:2～8：2～3:0.5～1.5:1的引发剂、偶联剂、光稳定剂、抗氧剂、抗PID助剂。
更为优选地，当所述的焊带载体膜为交联型时，所述的助剂为质量比为1:1～3:0.8～1.5:0.5～1:0.1～0.5:0.1～0.5的引发剂、交联剂、偶联剂、光稳定剂、抗氧剂、抗PID助剂。
根据一些具体且优选实施方式，所述的引发剂包括但不限于三羟甲基丙烷三丙烯酸酯、双 三羟甲基丙烷四丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、4-二甲氨基苯甲酸乙酯、过氧化二异丙苯(DCP)、2,5-二甲基-2,5-二(叔丁基过氧基)己烷中的一种或几种。
根据一些具体且优选实施方式，所述的交联剂包括但不限于过氧化2-乙基己基碳酸叔丁酯、叔丁基过氧化-异丙基碳酸酯、过氧化二苯甲酰、过氧化二异丙苯、2,5-二甲基-2,5-双(叔丁基过氧基)己烷、过氧化环己酮、叔丁基过氧化氢、过氧化苯甲酸叔丁酯、过氧乙酸叔丁酯、二-(4-叔丁基环己基)过氧重碳酸酯、叔丁基过氧化-3,5,5-三甲基己酸酯、三烯丙基异氰酸酯(TAIC)中的一种或几种。
根据一些具体且优选实施方式，所述的偶联剂包括但不限于3-甲基丙烯酰氧基丙基甲基二甲氧基硅烷、3-缩水甘油丙基三甲氧基硅烷、乙烯基三甲氧基硅烷、3-氨丙基三乙氧基硅烷、三异硬脂酰基钛酸异丙酯、异丙基三(二辛基焦磷酸酰氧基)钛酸酯中的一种或几种。
根据一些具体且优选实施方式，所述的光稳定剂包括但不限于双(2,2,6,6-四甲基-4-哌啶基)癸二酸酯(光稳定剂770)、聚丁二酸(4-羟基-2,2,6，6-四甲基-1-哌啶乙醇)酯、聚-{[6-[(1,1,3,3-四甲基丁基)-亚氨基]-1,3,5-三嗪-2，4-二基][2-(2,2,6,6-四甲基哌啶基)-氨基]-亚已基-[4-(2,2,6,6-四甲基哌啶基)-亚氨基]中的一种或几种。
根据一些具体且优选实施方式，所述的抗氧剂包括但不限于酚系抗氧剂、亚磷酸酯系抗氧剂和受阻胺类抗氧剂中的一种或几种。
根据一些具体且优选实施方式，抗PID助剂为金属离子捕捉剂。
本发明的第二方面是提供一种所述的焊带载体膜的制备方法，其通过混料，然后流延、压延或吹塑成膜，对于交联型的载体膜选择性地采用电子、原子、离子、中子、热或电磁辐照以控制所述的载体膜的预交联度；优选电子或电磁辐照。
本发明的第三方面是提供一种焊带复合体，包括所述的焊带载体膜，以及粘附在所述的焊带载体膜上的焊带；优选地，对于交联型载体膜，所述的载体膜与所述的焊带接触的一侧的预交联度小于远离所述的焊带一侧的预交联度。
优选地，所述的焊带的至少30％及以上的体积露出所述的焊带载体膜以使焊带能够很好的与电池片接触的同时保证焊带与载体膜的粘结性能。进一步优选地，所述的焊带的30％～70％的体积露出所述的焊带载体膜，更优选为所述的焊带的40％～60％的体积露出所述的焊带载体膜。
本发明的第四方面是提供一种电池片复合体，包括电池片、与所述的电池片接触的焊带、 以及用于将所述的焊带固定在所述的电池片上的载体膜，所述的载体膜为所述的焊带载体膜；优选地，所述的电池片的两面分别设置有所述的焊带以及所述的载体膜。
优选地，所述的电池片为晶硅电池、非晶硅电池、化学太阳能电池、多元化合物薄膜太阳能电池等中的一种。
本发明的第五方面是提供一种电池片复合体的制备方法，包括如下步骤：
(1)控制温度在50～200℃下，通过压合将所述的焊带粘附在所述的载体膜上，控制压合时间为0.1～1s，且相邻两个所述的载体膜分别位于所述的焊带的两侧且间隔分布；
(2)对粘附有所述的载体膜的焊带进行裁切以形成焊带复合体单元，所述的焊带复合体单元由所述的焊带以及两个所述的载体膜组成；
(3)控制温度在50～300℃下，将所述的焊带复合体单元压合在电池片的表面，控制压合时间为0.2～3s；优选地，所述的电池片的两面分别压合有所述的焊带复合体单元。
优选地，当所述的载体膜上设置有离型膜时，所述的离型膜在步骤(1)之前或者步骤(3)之后去除。
本发明的第六方面是提供一种所述的焊带载体膜，或所述的焊带复合体、或所述的电池片复合体在光伏组件中的应用。
由于上述技术方案运用，本发明与现有技术相比具有下列优点：
本发明通过对载体膜配方的优化，使得载体膜可以制作成单层结构，在保证与焊带和电池片的粘结性能的同时，可以起到支撑作用，载体膜在层压时不会被焊带压穿，同时只有单层结构也增加了与封装胶膜的相容性。本发明的载体膜结构简单，生产成本以及设备成本低。同时通过改进的工艺，能够快速稳定的将载体膜与焊带相固定，方便下一步整个组件的层压。
附图说明
图1为载体膜形成的焊带复合体的结构示意图；
图2为电池片复合体的结构示意图；
其中，1、载体膜；4、焊带；5、电池片。
具体实施方式
下面结合具体实施例对本发明作进一步描述，但本发明并不限于以下实施例。实施例中采用的实施条件可以根据具体使用的不同要求做进一步调整，未注明的实施条件为本行业中的常规条件。下述实施例和对比例中的原料的份数均为质量份。
实施例1
1、载体膜1的原料配方为：基体树脂线性低密度聚乙烯(LLDPE)50份，POE 30份，氢化石油树脂20份，0.5份光稳定剂770，0.2份抗氧剂1010，0.2份抗PID助剂；经高混机混合均匀后流延成80μm薄膜，无需离型膜，可根据需要单面压花或不压花。
2、电池片复合体的制备
(1)将步骤1制得的载体膜裁1切成所需尺寸；
(2)控制温度在110℃以下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控制压合时间为0.5s，且相邻两个载体膜1分别粘附在焊带4的上下两侧且错开分布从而便于焊带4与电池片5的粘结；
(3)对粘附有载体膜1的焊带4按照两个载体膜1为一个单元进行裁切形成一个焊带复合体单元；
(4)控制温度在150℃以下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜1将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜1压合在一个电池片5的上表面，另一个载体膜1压合在与该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜1的一面与另一个焊带复合体单元的载体膜1压合，从而使得每个电池片5的两面均压合有焊带复合体单元，结构如图2所示。
本实施例为非交联型载体膜，LLDPE量较大以提升整体耐温性，防止膜在与焊带粘合时被焊带压穿。
实施例2
1、载体膜1的原料配方为：基体树脂线性低密度聚乙烯(LLDPE)50份，POE 40份，氢化石油树脂10份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.2份，硅烷偶联剂乙烯基三甲氧基硅烷1份，0.5份光稳定剂770,0.2份抗氧剂1010,0.2份抗PID助剂；经高混机混合均匀，然后在双螺杆挤出机中进行接枝，接枝温度180-250℃，最后流延成80μm薄膜。
2、电池片复合体的制备
(1)将步骤1制得的载体膜1裁切成所需尺寸；
(2)控制温度在110℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控制压合时间为0.5s，且相邻两个载体膜1分别粘附在焊带4的上下两侧且错开分布从而便于焊 带4与电池片5的粘结；
(3)对粘附有载体膜1的焊带4按照两个载体膜1为一个单元进行裁切形成一个焊带复合体单元；
(4)控制温度在150℃下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜1将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜1压合在一个电池片5的上表面，另一个载体膜1压合在与该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜1的一面与另一个焊带复合体单元的载体膜1压合，从而使得每个电池片5的两面均压合有焊带复合体单元。
本实施例为非交联型载体膜，添加引发剂和硅烷偶联剂以增加膜与电池片的粘结能力及膜本身耐温性，同时对基体树脂LLDPE进行接枝改性，在双螺杆挤出机中进行接枝，接枝温度180-250℃，可降低LLDPE结晶性，提升膜本身的透过率同时降低雾度。
实施例3
1、载体膜1的原料配方为：基体树脂POE 80份，氢化石油树脂20份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.6份，交联剂TAIC 1份，硅烷偶联剂乙烯基三甲氧基硅烷0.6份，0.5份光稳定剂770,0.2份抗氧剂1010,0.2份抗PID助剂；经高混机混合均匀后放置4-8h保证助剂能够被树脂吸收完全，然后流延成80μm薄膜，最后对薄膜进行电子束辐照使产品的预交联度达到20％，同时在层压过程中可进一步交联。
2、电池片复合体的制备
(1)将步骤1制得的载体膜1裁切成所需尺寸；
(2)控制温度在110℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控制压合时间为0.5s，且相邻两个载体膜1分别粘附在焊带4的上下两侧且错开分布从而便于焊带4与电池片5的粘结；
(3)对粘附有载体膜1的焊带4按照两个载体膜1为一个单元进行裁切形成一个焊带复合体单元；
(4)控制温度在150℃下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜1将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜1压合在一个电池片5的上表面，另一个载体膜1压合在 与该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜1的一面与另一个焊带复合体单元的载体膜1压合，从而使得每个电池片5的两面均压合有焊带复合体单元。
本实施例为交联型载体膜，预交联度20％，层压后交联度73％，基体树脂熔点70℃左右，20％的预交联度保证膜在与焊带粘合时不会被压穿，同时预交联度不能过高以保证膜与焊带及电池片的初粘性。
实施例4
1、载体膜1的原料配方为：基体树脂POE 60份，EAA 40份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.6份，交联剂TAIC 1份，硅烷偶联剂乙烯基三甲氧基硅烷0.6份，0.5份光稳定剂770,0.2份抗氧剂1010,0.2份抗PID助剂；经高混机混合均匀后放置4-8h保证助剂能够被树脂吸收完全，然后流延成80μm薄膜，最后对薄膜进行电子束辐照使产品的预交联度达到20％，同时在层压过程中可进一步交联。
2、电池片复合体的制备
(1)将步骤1制得的载体膜1裁切成所需尺寸；
(2)控制温度在110℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控制压合时间为0.5s，且相邻两个载体膜1分别粘附在焊带4的上下两侧且错开分布从而便于焊带4与电池片5的粘结；
(3)对粘附有载体膜1的焊带4按照两个载体膜1为一个单元进行裁切形成一个焊带复合体单元；
(4)控制温度在150℃下，将裁切后的焊带复合体单元压合在电池片5的表面，控制压合时间为1.5s；并使焊带4与电池片5接触，通过载体膜1将焊带4固定在电池片5的表面。一个焊带复合体单元上的一个载体膜1压合在一个电池片5的上表面，另一个载体膜1压合在与该电池片5相邻的一个电池片5的下表面，并且每个电池片5的未贴合有载体膜1的一面与另一个焊带复合体单元的载体膜1压合，从而使得每个电池片5的两面均压合有焊带复合体单元。
本实施例为交联型载体膜，预交联度20％，层压后交联度75％，以极性材料EAA替代分子量较小的增粘树脂，保证与焊带及电池片的初粘性同时配合20％的预交联度，保证膜在与焊带粘合时不会被压穿。
对比例1
1、载体膜1的原料配方为：基体树脂线性低密度聚乙烯(LLDPE)100份，0.5份光稳定剂770，0.2份抗氧剂1010，0.2份抗PID助剂；经高混机混合均匀后流延成80μm薄膜。
2、电池片复合体的制备
(1)将步骤1制得的载体膜1裁切成所需尺寸；
(2)控制温度在110℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控制压合时间为0.5s，且相邻两个载体膜1分别粘附在焊带4的上下两侧且错开分布；但载体膜1与焊带4无法粘结；
(3)控制温度在150℃下，利用载体膜1将焊带4粘结在电池片5上，控制压合时间为1.5s；但载体膜1无法与电池片5粘结。
本实施例为非交联型载体膜，纯LLDPE薄膜，无极性低熔点树脂或增粘树脂，无法实现与焊带及电池片的粘结。
对比例2
1、载体膜1的原料配方为：基体树脂POE 100份，0.5份光稳定剂770,0.2份抗氧剂1010,0.2份抗PID助剂；经高混机混合均匀后流延成80μm薄膜。
2、电池片复合体的制备
(1)将步骤1制得的载体膜1裁切成所需尺寸；
(2)控制温度在110℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控制压合时间为0.5s，载体膜1被压穿。
本实施例为非交联型载体膜，纯POE薄膜，熔点70℃，在与焊带粘合时样品被焊带压穿。
对比例3
1、载体膜1的原料配方为：基体树脂POE 80份，氢化石油树脂20份，0.5份光稳定剂770,0.2份抗氧剂1010,0.2份抗PID助剂；经高混机混合均匀后流延成80μm薄膜。
2、电池片复合体的制备
(1)将步骤1制得的载体膜1裁切成所需尺寸；
(2)控制温度在110℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控 制压合时间为0.5s，载体膜1被压穿。
本实施例为非交联型载体膜，基体树脂POE熔点70℃，同时添加20份氢化石油树脂，在与焊带粘合时样品被焊带压穿。
对比例4
1、载体膜1的原料配方为：基体树脂POE 80份，氢化石油树脂20份，引发剂2,5-二甲基-2,5-二(叔丁基过氧基)己烷0.6份，交联剂TAIC 1份，硅烷偶联剂乙烯基三甲氧基硅烷0.6份，0.5份光稳定剂770,0.2份抗氧剂1010,0.2份抗PID助剂；经高混机混合均匀后放置4-8h保证助剂能够被树脂吸收完全，然后流延成80μm薄膜，最后对薄膜进行电子束辐照使产品的预交联度达到65％，同时在层压过程中可进一步交联，交联度80％。
2、电池片复合体的制备
(1)将步骤1制得的载体膜1裁切成所需尺寸；
(2)控制温度在110℃下，通过压合将多根焊带4平行粘附在裁切后的载体膜1上，控制压合时间为0.5s，且相邻两个载体膜1分别粘附在焊带4的上下两侧且错开分布；但载体膜1与焊带4无法粘结；
(3)控制温度在150℃下，利用载体膜1将焊带4粘结在电池片5上，控制压合时间为1.5s；但载体膜1无法与电池片5粘结。
本实施例为交联型载体膜，预交联度65％，预交联度过高，无法实现与焊带及电池片粘结。
上述实施例和对比例制得的载体膜按照如下方法进行检测，检测结果见表1。
各性能的检测和评定方法如下：
收缩率：GB/T 13541-92；
透过率：IEC60664-1；
雾度：ISO 14782；
预交联度/交联度：溶剂法(二甲苯回流145℃,5h)
与焊带及电池片粘合情况：目测
表1
Figure PCTCN2020139566-appb-000001
Figure PCTCN2020139566-appb-000002
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (16)

  1. 一种焊带载体膜，其特征在于：按质量百分比计，其原料配方包括50～99％的基体树脂、0～50％的增粘树脂、0～5％的助剂；所述的基体树脂为聚烯烃树脂及其弹性体、聚酯树脂及其弹性体、聚乙烯醇缩丁醛酯、乙烯-醋酸乙烯酯共聚物、乙烯-丙烯酸共聚物、离子聚合物、聚酰胺、氟树脂、及上述物质的改性物中的一种或多种；所述的增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、萜烯树脂中的一种或多种。
  2. 根据权利要求1所述的焊带载体膜，其特征在于：所述的助剂包括引发剂、交联剂、偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
  3. 根据权利要求1所述的焊带载体膜，其特征在于：所述的焊带载体膜的厚度为20μm～500μm；所述的焊带载体膜在波段为380～1100下的透光率≥80％，优选≥90％。
  4. 根据权利要求1所述的焊带载体膜，其特征在于：所述的焊带载体膜的单侧还设置有离型膜，和/或，所述的焊带载体膜的单侧压花。
  5. 根据权利要求1所述的焊带载体膜，其特征在于：所述的焊带载体膜为交联型或非交联型；当所述的焊带载体膜为交联型时，所述的焊带载体膜的预交联度为≤60％，优选所述的焊带载体膜的两面的预交联度不同。
  6. 根据权利要求5所述的焊带载体膜，其特征在于：当所述的焊带载体膜为交联型时，所述的基体树脂的熔点或者Tg温度≤150℃，当所述的焊带载体膜为非交联型时，所述的基体树脂的熔点或者Tg温度≥100℃。
  7. 根据权利要求5所述的焊带载体膜，其特征在于：当所述的焊带载体膜为交联型时，所述的助剂包括引发剂、交联剂、偶联剂，以及光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种；当所述的焊带载体膜为非交联型时，所述的助剂包括引发剂、硅烷偶联剂、光稳定剂、抗氧剂、紫外线吸收剂、开口剂、成核剂、增透剂、抗PID助剂中的一种或多种。
  8. 根据权利要求1所述的焊带载体膜，其特征在于：当所述增粘树脂的含量为0，所述的基体树脂中至少一种为极性树脂。
  9. 一种如权利要求1至8中任一项所述的焊带载体膜的制备方法，其特征在于：其通过混料，然后流延、压延或吹塑成膜，对于交联型的载体膜选择性地采用电子、原子、离子、中子、热或电磁辐照以控制所述的载体膜的预交联度；优选电子或电磁辐照。
  10. 一种焊带复合体，其特征在于：包括权利要求1至8中任一项所述的焊带载体膜，以及粘附在所述的焊带载体膜上的焊带；优选地，对于交联型载体膜，所述的载体膜与所述的焊带接触的一侧的预交联度小于远离所述的焊带一侧的预交联度。
  11. 根据权利要求10所述的焊带复合体，其特征在于：所述的焊带的至少30％及以上的体积露出所述的焊带载体膜。
  12. 一种电池片复合体，其特征在于：包括电池片、与所述的电池片接触的焊带、以及用于将所述的焊带固定在所述的电池片上的载体膜，所述的载体膜为权利要求1至8中任一项所述的焊带载体膜；优选地，所述的电池片的两面分别设置有所述的焊带以及所述的载体膜。
  13. 根据权利要求12所述的电池片复合体，其特征在于：所述的电池片为晶硅电池、非晶硅电池、化学太阳能电池、多元化合物薄膜太阳能电池等中的一种。
  14. 一种电池片复合体的制备方法，其特征在于：包括如下步骤：
    (1)控制温度在50～200℃下，通过压合将所述的焊带粘附在如权利要求1至8中任一项所述的载体膜上，控制压合时间为0.1～1s，且相邻两个所述的载体膜分别位于所述的焊带的两侧且间隔分布；
    (2)对粘附有所述的载体膜的焊带进行裁切以形成焊带复合体单元，所述的焊带复合体单元由所述的焊带以及两个所述的载体膜组成；
    (3)控制温度在50～300℃下，将所述的焊带复合体单元压合在电池片的表面，控制压合时间为0.2～3s；优选地，所述的电池片的两面分别压合有所述的焊带复合体单元。
  15. 根据权利要求14所述的电池片复合体的制备方法，其特征在于：当所述的载体膜上设置有离型膜时，所述的离型膜在步骤(1)之前或者步骤(3)之后去除。
  16. 一种如权利要求1至8中任一项所述的焊带载体膜，或权利要求10或11所述的焊带复合体、或权利要求12或13所述的电池片复合体在光伏组件中的应用。
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