CN103173145B - 双玻太阳能组件封装专用eva胶膜及其制备方法 - Google Patents
双玻太阳能组件封装专用eva胶膜及其制备方法 Download PDFInfo
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- CN103173145B CN103173145B CN201310089491.7A CN201310089491A CN103173145B CN 103173145 B CN103173145 B CN 103173145B CN 201310089491 A CN201310089491 A CN 201310089491A CN 103173145 B CN103173145 B CN 103173145B
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- adhesive film
- glass solar
- eva adhesive
- ethylene
- solar components
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- 239000005038 ethylene vinyl acetate Substances 0.000 title claims abstract description 82
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- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 title abstract 5
- -1 polyethylene Polymers 0.000 claims abstract description 28
- 229920001577 copolymer Polymers 0.000 claims abstract description 18
- 239000004698 Polyethylene Substances 0.000 claims abstract description 13
- 229920000573 polyethylene Polymers 0.000 claims abstract description 13
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- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 14
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 12
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- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 8
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 8
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- 239000012964 benzotriazole Substances 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 claims description 6
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- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
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- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 4
- FEXBEKLLSUWSIM-UHFFFAOYSA-N 2-Butyl-4-methylphenol Chemical class CCCCC1=CC(C)=CC=C1O FEXBEKLLSUWSIM-UHFFFAOYSA-N 0.000 claims description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 3
- UQAMDAUJTXFNAD-UHFFFAOYSA-N 4-(4,6-dichloro-1,3,5-triazin-2-yl)morpholine Chemical class ClC1=NC(Cl)=NC(N2CCOCC2)=N1 UQAMDAUJTXFNAD-UHFFFAOYSA-N 0.000 claims description 3
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 238000005660 chlorination reaction Methods 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- TWHJJBBWHBQERD-UHFFFAOYSA-N C(OC(C)(C)OOCCCC)(O)=O.C(C)(C)(C)OO Chemical compound C(OC(C)(C)OOCCCC)(O)=O.C(C)(C)(C)OO TWHJJBBWHBQERD-UHFFFAOYSA-N 0.000 claims description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- HGRNRWNRNVPVMM-UHFFFAOYSA-N benzene-1,3-diol;benzoic acid Chemical compound OC1=CC=CC(O)=C1.OC(=O)C1=CC=CC=C1 HGRNRWNRNVPVMM-UHFFFAOYSA-N 0.000 claims description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 229950002083 octabenzone Drugs 0.000 claims description 2
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
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- 238000010345 tape casting Methods 0.000 abstract 1
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- 239000002131 composite material Substances 0.000 description 4
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- 238000010030 laminating Methods 0.000 description 3
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- 230000035939 shock Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 2
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- 238000000465 moulding Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- ODNRTOSCFYDTKF-UHFFFAOYSA-N 1,3,5-Trimethyl-cyclohexan Natural products CC1CC(C)CC(C)C1 ODNRTOSCFYDTKF-UHFFFAOYSA-N 0.000 description 1
- LQWSBXWILISUST-UHFFFAOYSA-N 1,3,5-trimethylcyclohexane Chemical compound CC1[CH]C(C)CC(C)C1 LQWSBXWILISUST-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
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- 238000002203 pretreatment Methods 0.000 description 1
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- 239000005341 toughened glass Substances 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
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CN201310089491.7A CN103173145B (zh) | 2013-03-19 | 2013-03-19 | 双玻太阳能组件封装专用eva胶膜及其制备方法 |
Applications Claiming Priority (1)
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CN201310089491.7A CN103173145B (zh) | 2013-03-19 | 2013-03-19 | 双玻太阳能组件封装专用eva胶膜及其制备方法 |
Publications (2)
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CN103173145A CN103173145A (zh) | 2013-06-26 |
CN103173145B true CN103173145B (zh) | 2015-01-14 |
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CN201310089491.7A Active CN103173145B (zh) | 2013-03-19 | 2013-03-19 | 双玻太阳能组件封装专用eva胶膜及其制备方法 |
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Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103346184B (zh) * | 2013-07-15 | 2016-03-02 | 明冠新材料股份有限公司 | 一种eva膜及其制备方法 |
CN104745109A (zh) * | 2015-04-16 | 2015-07-01 | 中天光伏材料有限公司 | 一种光伏组件封装用白色eva胶膜 |
CN105176428A (zh) * | 2015-09-30 | 2015-12-23 | 昆山天洋热熔胶有限公司 | 一种高清晰度eva夹层玻璃中间膜及其制备方法 |
CN105218937B (zh) * | 2015-10-29 | 2017-11-14 | 严梅霞 | Eva胶膜用的eva母粒 |
CN105802548B (zh) * | 2016-05-27 | 2017-10-31 | 苏州度辰新材料有限公司 | 一种用于双玻光伏组件的白色封装胶膜及其制备方法 |
CN106634650A (zh) * | 2016-12-01 | 2017-05-10 | 天津三瑞塑胶制品有限公司 | 一种双玻太阳能电池封装胶片的生产工艺 |
CN108034372B (zh) * | 2017-12-27 | 2020-06-23 | 杭州福斯特应用材料股份有限公司 | 一种抗电势诱导衰减的光伏封装材料eva胶膜 |
CN108219692A (zh) * | 2017-12-29 | 2018-06-29 | 江苏鹿山光电科技有限公司 | 一种交联eva导热封装胶膜及其制备方法 |
ES2943469T3 (es) * | 2018-03-08 | 2023-06-13 | Dow Global Technologies Llc | Módulo fotovoltaico y composición encapsulante que tienen resistencia mejorada a la degradación inducida por potencial |
CN109679534B (zh) * | 2018-12-29 | 2020-11-17 | 苏州度辰新材料有限公司 | 一种用于太阳能电池组件的白色封装胶膜 |
CN110054867A (zh) * | 2019-04-23 | 2019-07-26 | 苏州太湖电工新材料股份有限公司 | 一种环氧树脂绝缘筒用预固化组合物及其制备方法和应用 |
CN110010715B (zh) * | 2019-05-08 | 2024-01-05 | 苏州赛伍应用技术股份有限公司 | 一种多层封装胶膜 |
CN110294888A (zh) * | 2019-06-24 | 2019-10-01 | 黄少珍 | 一种太阳能锂电池封装用环保材料及其制备方法 |
CN113956801B (zh) * | 2020-07-21 | 2023-05-05 | 杭州玻美文化艺术有限公司 | 彩色胶膜及其制备方法和彩色太阳能光伏组件 |
CN112225981B (zh) * | 2020-09-18 | 2022-04-12 | 苏州赛伍应用技术股份有限公司 | 一种焊带载体膜及其制备方法和应用 |
CN112226169B (zh) * | 2020-09-25 | 2022-11-18 | 苏州赛伍应用技术股份有限公司 | 一种焊带载体膜、其制备方法及焊带复合体、电池片复合体 |
CN114736617B (zh) * | 2021-11-17 | 2024-03-22 | 浙江中聚材料有限公司 | 一种高强度高稳定性光伏胶膜及其制备方法和应用 |
CN114958216A (zh) * | 2022-06-27 | 2022-08-30 | 苏州赛伍应用技术股份有限公司 | 一种异质结电池用封装胶膜及其制备方法和应用 |
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CN101942145A (zh) * | 2010-09-13 | 2011-01-12 | 苏州福斯特光伏材料有限公司 | 一种封装胶膜组合物及其应用 |
WO2012138689A2 (en) * | 2011-04-08 | 2012-10-11 | Henkel Corporation | Hot melt adhesives for multilayer structure enclosures |
CN102775924A (zh) * | 2012-07-09 | 2012-11-14 | 苏州爱康光伏新材料有限公司 | 一种耐水解太阳能封装用eva胶膜、其制备方法及使用方法 |
-
2013
- 2013-03-19 CN CN201310089491.7A patent/CN103173145B/zh active Active
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WO2012138689A2 (en) * | 2011-04-08 | 2012-10-11 | Henkel Corporation | Hot melt adhesives for multilayer structure enclosures |
CN102775924A (zh) * | 2012-07-09 | 2012-11-14 | 苏州爱康光伏新材料有限公司 | 一种耐水解太阳能封装用eva胶膜、其制备方法及使用方法 |
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夏晓明等.《功能助剂 塑料 涂料 胶黏剂》.《功能助剂 塑料 涂料 胶黏剂》.化学工业出版社,2004,(第1版),306-307. * |
李子东等.《胶黏剂助剂》.《胶黏剂助剂》.化学工业出版社,2005,(第1版),488-489. * |
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CN103173145A (zh) | 2013-06-26 |
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