WO2022044111A1 - Dispositif et procédé d'estimation de cause d'erreur - Google Patents

Dispositif et procédé d'estimation de cause d'erreur Download PDF

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Publication number
WO2022044111A1
WO2022044111A1 PCT/JP2020/031971 JP2020031971W WO2022044111A1 WO 2022044111 A1 WO2022044111 A1 WO 2022044111A1 JP 2020031971 W JP2020031971 W JP 2020031971W WO 2022044111 A1 WO2022044111 A1 WO 2022044111A1
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WO
WIPO (PCT)
Prior art keywords
evaluation
error
target
evaluation target
work
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PCT/JP2020/031971
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English (en)
Japanese (ja)
Inventor
郁夫 鈴木
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株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to JP2022544925A priority Critical patent/JP7326631B2/ja
Priority to PCT/JP2020/031971 priority patent/WO2022044111A1/fr
Priority to DE112020007552.4T priority patent/DE112020007552T5/de
Priority to CN202080104674.XA priority patent/CN116114390A/zh
Publication of WO2022044111A1 publication Critical patent/WO2022044111A1/fr
Priority to JP2023125906A priority patent/JP7466746B2/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops

Definitions

  • This specification discloses a technique relating to an error cause estimation device and an error cause estimation method.
  • the arithmetic unit described in Patent Document 1 includes a storage unit and a control unit.
  • the storage unit stores device operation information and abnormality history information.
  • the device operation information specifies the number of operations of the first component and the second component used when mounting the component on the board for each combination of the first component and the second component.
  • the abnormality history information specifies the number of abnormalities in which an abnormality occurs in the first component and the second component when the component is mounted on the substrate for each combination of the first component and the second component.
  • the control unit compares the dispersion value of the first component with a high abnormality occurrence rate with the dispersion value of the second component with a high abnormality occurrence rate, and determines the type to which the component with the smaller value belongs as the cause of the abnormality. It is judged that there is a high possibility that it has become.
  • the abnormality history information described in Patent Document 1 is information indicating the number of abnormalities that have occurred with respect to the combination of the first component and the second component. Therefore, the abnormality history information contains a mixture of abnormality histories caused by various causes. Therefore, the control unit may not always be able to properly extract the component causing the abnormality.
  • the present specification discloses an error cause estimation device and an error cause estimation method capable of extracting a specific target that has caused a work error from the evaluation targets.
  • an error cause estimation device including a storage unit, an aggregation unit, and an extraction unit.
  • the storage unit is an evaluation target, which is at least one of the equipment used for the anti-board work and the usage data used for the anti-board work of the anti-board work machine that performs a predetermined anti-board work on the substrate.
  • an error code indicating a work error of the work on the board using the evaluation target is associated and stored in the storage device.
  • the aggregation unit aggregates the evaluation values of the error occurrence status for the plurality of types of the evaluation targets stored in the storage device for each error code.
  • the extraction unit is the evaluation target that caused the work error based on the significant difference in the evaluation value of the error occurrence status among the plurality of types of the evaluation targets aggregated for each error code. Extract a specific target.
  • an error cause estimation method including a storage process, an aggregation process, and an extraction process.
  • the storage step is an evaluation target, which is at least one of the equipment used for the anti-board work and the usage data used for the anti-board work of the anti-board work machine that performs a predetermined anti-board work on the substrate.
  • an error code indicating a work error of the work on the board using the evaluation target is associated and stored in the storage device.
  • the evaluation values of the error occurrence status for the plurality of types of the evaluation targets stored in the storage device are aggregated for each error code.
  • the extraction step is the evaluation target that caused the work error based on the significant difference in the evaluation value of the error occurrence status among the plurality of types of the evaluation targets aggregated for each error code. Extract a specific target.
  • the error cause estimation device it is equipped with an extraction unit.
  • the extraction unit extracts a specific target that is the evaluation target that caused the work error, based on the significant difference in the evaluation value of the error occurrence status among the plurality of types of evaluation targets aggregated for each error code. Therefore, the error cause estimation device can appropriately extract the specific target that caused the work error from the evaluation targets, as compared with the case where the evaluation values are not aggregated for each error code.
  • the above-mentioned matters regarding the error cause estimation device can be applied to the error cause estimation method as well.
  • Embodiment 1-1 Configuration example of the substrate work line WL0
  • a predetermined anti-board work is performed on the substrate 90.
  • the type and number of the anti-board work machines WM0 constituting the anti-board work line WL0 are not limited.
  • the substrate-to-board work line WL0 of the present embodiment is a plurality (five) anti-board work of a printing machine WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and an appearance inspection machine WM5.
  • the machine WM0 is provided, and the substrate 90 is conveyed in this order by the substrate transfer device.
  • the printing machine WM1 prints solder at the mounting positions of a plurality of parts 91 on the substrate 90.
  • the printing inspection machine WM2 inspects the printing state of the solder printed by the printing machine WM1.
  • the component mounting machine WM3 mounts a plurality of components 91 on a substrate 90 on which solder is printed by the printing machine WM1.
  • the component mounting machine WM3 may be one or a plurality. When a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share and mount the plurality of components 91.
  • the reflow furnace WM4 heats the substrate 90 on which a plurality of parts 91 are mounted by the parts mounting machine WM3, melts the solder, and performs soldering.
  • the visual inspection machine WM5 inspects the mounting state of a plurality of parts 91 mounted by the component mounting machine WM3.
  • the board-to-board work line WL0 uses a plurality of (five) board-to-board work machines WM0 to sequentially convey the boards 90 and execute a production process including an inspection process to produce the board product 900. Can be done.
  • the board work line WL0 includes, for example, a board work machine WM0 such as a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device. You can also prepare.
  • a board work machine WM0 such as a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device. You can also prepare.
  • the plurality of (five) anti-board work machines WM0 and the line management device LC0 constituting the anti-board work line WL0 are communicably connected by a communication unit. Further, the line management device LC0 and the management device HC0 are communicably connected by a communication unit.
  • the communication unit can connect these in a communicable manner by wire or wirelessly, and the communication method may be various methods.
  • a premises information communication network (LAN: Local Area Network) is configured by a plurality of (five) anti-board work machines WM0, a line management device LC0, and a management device HC0. Therefore, the plurality (five) anti-board working machines WM0 can communicate with each other via the communication unit. Further, the plurality (five) anti-board working machines WM0 can communicate with the line management device LC0 via the communication unit. Further, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.
  • LAN Local Area Network
  • the line management device LC0 controls a plurality of (five) anti-board work machines WM0 constituting the anti-board work line WL0, and monitors the operating status of the anti-board work line WL0.
  • the line management device LC0 stores various control data for controlling a plurality of (five) anti-board working machines WM0.
  • the line management device LC0 transmits control data to each of the plurality (five) anti-board working machines WM0. Further, each of the plurality (five) anti-board working machines WM0 transmits the operation status and the production status to the line management device LC0.
  • the management device HC0 manages at least one line management device LC0. For example, the operating status and the production status of the anti-board working machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as needed.
  • the management device HC0 is provided with a storage device DS0.
  • the storage device DS0 can store various acquired data acquired by the board working machine WM0. For example, various image data captured by the anti-board working machine WM0 are included in the acquired data.
  • the recording (log data) of the operating status acquired by the anti-board working machine WM0 is included in the acquired data. Further, the storage device DS0 can store various production information regarding the production of the substrate product 900.
  • the component mounting machine WM3 mounts a plurality of components 91 on the substrate 90. As shown in FIG. 2, the component mounting machine WM3 includes a board transfer device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16.
  • the substrate transfer device 11 is configured by, for example, a belt conveyor or the like, and conveys the substrate 90 in the transfer direction (X-axis direction).
  • the board 90 is a circuit board, and an electronic circuit, an electric circuit, a magnetic circuit, and the like are formed.
  • the board transfer device 11 carries the board 90 into the machine of the component mounting machine WM3, and positions the board 90 at a predetermined position in the machine.
  • the board transfer device 11 carries out the board 90 to the outside of the component mounting machine WM3 after the mounting process of the plurality of components 91 by the component mounting machine WM3 is completed.
  • the component supply device 12 supplies a plurality of components 91 mounted on the substrate 90.
  • the component supply device 12 includes a plurality of feeders 121 provided along the transport direction (X-axis direction) of the substrate 90. As shown in FIG. 3, each of the plurality of feeders 121 is equipped with a reel RL0. A carrier tape CT0 containing a plurality of parts 91 is wound around the reel RL0. The feeder 121 feeds the carrier tape CT0 at a pitch so that the component 91 can be collected at the supply position PU0 located on the tip end side of the feeder 121. Further, the component supply device 12 can also supply an electronic component (for example, a lead component) having a relatively large size as compared with a chip component or the like in a state of being arranged on a tray.
  • an electronic component for example, a lead component
  • the parts transfer device 13 includes a head drive device 131 and a moving table 132.
  • the head drive device 131 is configured to be able to move the moving table 132 in the X-axis direction and the Y-axis direction by a linear motion mechanism.
  • the moving table 132 is provided with a mounting head 20 detachably (replaceable) by a clamp member.
  • the mounting head 20 uses at least one holding member 30 to collect and hold the component 91 supplied by the component supply device 12, and mounts the component 91 on the substrate 90 positioned by the substrate transfer device 11.
  • the holding member 30 for example, a suction nozzle, a chuck, or the like can be used.
  • a known imaging device can be used for the component camera 14 and the board camera 15.
  • the component camera 14 is fixed to the base of the component mounting machine WM3 so that the optical axis faces upward in the vertical direction (Z-axis direction).
  • the component camera 14 can take an image of the component 91 held by the holding member 30 from below.
  • the board camera 15 is provided on the moving table 132 of the component transfer device 13 so that the optical axis faces downward in the vertical direction (Z-axis direction).
  • the board camera 15 can take an image of the board 90 from above.
  • the component camera 14 and the board camera 15 perform imaging based on a control signal transmitted from the control device 16.
  • the image data of the captured image captured by the component camera 14 and the substrate camera 15 is transmitted to the control device 16.
  • the control device 16 includes a known arithmetic unit and a storage device, and constitutes a control circuit. Information, image data, and the like output from various sensors provided in the component mounting machine WM3 are input to the control device 16. The control device 16 sends a control signal to each device based on a control program, predetermined mounting conditions, and the like.
  • control device 16 causes the board camera 15 to image the board 90 positioned by the board transfer device 11.
  • the control device 16 processes the image captured by the substrate camera 15 and recognizes the positioning state of the substrate 90.
  • the control device 16 causes the holding member 30 to collect and hold the parts 91 supplied by the parts supply device 12, and causes the parts camera 14 to image the parts 91 held by the holding member 30.
  • the control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the component 91.
  • the control device 16 moves the holding member 30 toward the upper side of the planned mounting position preset by a control program or the like. Further, the control device 16 corrects the planned mounting position based on the positioning state of the board 90, the holding posture of the component 91, and the like, and sets the mounting position where the component 91 is actually mounted.
  • the planned mounting position and the mounting position include the rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).
  • the control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 according to the mounting position.
  • the control device 16 lowers the holding member 30 at the corrected rotation angle at the corrected target position, and mounts the component 91 on the substrate 90.
  • the control device 16 executes a mounting process for mounting a plurality of components 91 on the substrate 90.
  • the component 91 is supplied from the feeder 121 of the component supply device 12, the component 91 supplied from the feeder 121 is collected by the holding member 30, and the substrate 90 is collected.
  • Various devices and data are used by the time the component 91 is mounted on the. When an error occurs in these operations due to a malfunction of a specific device, it becomes more difficult to identify the device that caused the work error as the number of intervening devices increases. The same is true for data and for other board-to-board operations.
  • the error cause estimation device 70 is provided on the board-to-board work line WL0 of the present embodiment.
  • the error cause estimation device 70 extracts the specific target ST0 that caused the work error from the evaluation target ET0.
  • the error cause estimation device 70 can be provided in various arithmetic units.
  • the error cause estimation device 70 can be provided in the analysis device, the line management device LC0, the management device HC0, the control device 16 of the component mounting machine WM3, and the like.
  • the error cause estimation device 70 can also be formed on the cloud. As shown in FIG. 4, the error cause estimation device 70 of the present embodiment is provided in the management device HC0.
  • the error cause estimation device 70 includes a storage unit 71, a tabulation unit 72, and an extraction unit 73 when regarded as a control block.
  • the error cause estimation device 70 may also include a first determination unit 74 and a second determination unit 75.
  • the error cause estimation device 70 may also include a guide unit 76.
  • the error cause estimation device 70 of the present embodiment includes a storage unit 71, an aggregation unit 72, an extraction unit 73, a first determination unit 74, a second determination unit 75, and a guide unit 76. And have.
  • the error cause estimation device 70 of the present embodiment executes control according to the flowchart shown in FIG.
  • the storage unit 71 performs the process shown in step S11.
  • the tabulation unit 72 performs the process shown in step S12.
  • the extraction unit 73, the first determination unit 74, and the second determination unit 75 perform the process shown in step S13.
  • the guide unit 76 performs the process shown in step S14.
  • the storage unit 71 stores the evaluation target ET0 and the error code EC0 in the storage device DS0 in association with each other (step S11 shown in FIG. 5).
  • the evaluation target ET0 refers to at least one of the equipment used UM0 and the data used UD0.
  • the device used UM0 refers to the device used for the board-to-board work of the board-to-board work machine WM0.
  • the usage data UD0 refers to the data used for the board-to-board work of the board-to-board work machine WM0.
  • the error code EC0 indicates a work error of the work on the board using the evaluation target ET0.
  • the board-to-board working machine WM0 includes a component mounting machine WM3 that mounts the component 91 on the board 90.
  • the board-to-board work includes a supply work of supplying the parts 91 from the parts supply device 12, a collection work of collecting the parts 91 supplied from the parts supply device 12, and a board of the parts 91. At least one of the mounting operations to be mounted on the 90 is included.
  • the equipment used UM0 includes a reel RL0, a feeder 121, a mounting head 20, a holding member 30, a component camera 14, and the like.
  • the reel RL0 and the feeder 121 are involved in the supply work of the component 91.
  • the mounting head 20, the holding member 30, and the component camera 14 are involved in the sampling work and the mounting work of the component 91.
  • the usage data UD0 includes parts data including shape data, array data, coordinate data, and the like.
  • the component data defines the properties and handling conditions of the component 91. Specifically, the component data defines the electrical characteristic values of the component 91, its error, properties such as operating environment conditions, as well as the packaging form and storage conditions. Further, the component data defines handling conditions such as the specifications of the reel RL0, the feeder 121 used, the type of the holding member 30, the moving speed of the mounting head 20, and the ascending / descending speed of the holding member 30. Further, the component data includes shape data.
  • the shape data defines the outer shape of the part 91.
  • the shape data defines, for example, the size (vertical dimension, horizontal dimension, and height dimension) of the component 91, size tolerance, lead position, appearance color, and the like.
  • the shape data may specify imaging conditions, lighting conditions, and the like when the component 91 held by the holding member 30 is imaged by the component camera 14.
  • the component mounting machine WM3 processes the image data of the component 91 imaged by the component camera 14 and compares it with the outer shape defined in the shape data, so that the presence or absence of the component 91 held by the holding member 30 is present. , Judge the type of error, etc. Similarly, the component mounting machine WM3 acquires a holding posture such as a position and a rotation angle of the component 91 with respect to the holding member 30.
  • the arrangement data defines the slot positions of the pallet members in which a plurality of feeders 121 are arranged.
  • the coordinate data defines the position of the board 90 on which the component 91 is mounted.
  • These usage data UD0 are stored in the storage device DS0 shown in FIGS. 1 and 4.
  • the control device 16 of the component mounting machine WM3 can acquire and use these data together with, for example, a control program.
  • the component data and the array data are involved in the supply operation of the component 91.
  • the component data and the coordinate data are involved in the sampling operation and the mounting operation of the component 91.
  • the work error of the supply work and the collection work of the part 91 is determined based on the image of the part 91 captured by the part camera 14.
  • the work error of the mounting work of the component 91 is determined based on the image of the board 90 captured by the board camera 15.
  • the component mounting machine WM3 can determine the quality of the work on the substrate depending on whether or not the measured value of the object extracted from the image is included in the allowable range. Further, the quality of the work with the board can be judged by another work machine with the board WM0.
  • the visual inspection machine WM5 can determine the quality of the work on the board by the component mounting machine WM3.
  • the error code EC0 is assigned to each type of work error.
  • the error code EC0 may take various forms as long as it can identify the work error of the work with the board. As shown in FIG. 6, the error code EC0 of this embodiment is represented by, for example, a character string (alphanumerical characters).
  • the storage unit 71 stores the evaluation target ET0 and the error code EC0 in the storage device DS0 in association with each other. Specifically, the storage unit 71 stores the identification code for identifying the evaluation target ET0 and the error code EC0 in the storage device DS0 in association with each other.
  • the storage unit 71 sequentially stores the evaluation target ET0 and the error code EC0 in the storage device DS0. Further, the storage unit 71 can store the evaluation target ET0 and the error code EC0 for a predetermined number of times in the storage device DS0 when a predetermined number of work errors occur. If the board-to-board work machine WM0 performs the board-to-board work, but no work error occurs, the storage unit 71 stores only the evaluation target ET0 in the storage device DS0.
  • FIG. 6 shows an example of a state in which the error code EC0, the device used UM0, and the data used UD0 are associated and stored in the storage device DS0.
  • the work error of the work on the board using the used equipment UM1, the used equipment UM2, and the used data UD1 is indicated by the error code EC0001.
  • the aggregation unit 72 aggregates the evaluation value EV0 of the error occurrence status for the plurality of types of evaluation target ET0 stored in the storage device DS0 for each error code EC0 (step S12 shown in FIG. 5).
  • the evaluation value EV0 is not limited as long as it can evaluate the error occurrence status.
  • the evaluation value EV0 of the error occurrence status can be expressed by a combination of the number of times the evaluation target ET0 is used for the work on the board and the number of times the work error occurs.
  • the totaling unit 72 totals the number of times of use for the board work and the number of times of occurrence of work errors for each of the used equipment UM1, the used equipment UM2, and the used data UD1. ..
  • the aggregation unit 72 aggregates the evaluation value EV0 in the same manner.
  • the tabulation unit 72 can also generate a ranking of the error code EC0 stored in the storage device DS0.
  • the extraction unit 73 can extract the specific target ST0 from the error code EC0 having a higher ranking.
  • the error code EC0170 shown in FIG. 6 and the error code EC0174 differ only in the lowest digit.
  • the error code EC0 is often assigned to related work errors in order, and grouping similar error codes EC0 (for example, when only the lowest digit is different) makes it easier to aggregate the evaluation values EV0. .. Therefore, the aggregation unit 72 may group similar error codes EC0 and aggregate the evaluation value EV0 of the error occurrence status.
  • the aggregation unit 72 aggregates the evaluation value EV0 of the error occurrence status by combining the evaluation target ET0 associated with the error code EC0170 and the evaluation target ET0 associated with the error code EC0174.
  • the totaling unit 72 can also group the error codes EC0 having the same or similar measures for improving the work error, and totalize the evaluation value EV0 of the error occurrence status.
  • the tabulation unit 72 may group error code EC0s having similar error codes EC0 and having the same or similar measures for improving work errors, and tabulate the evaluation value EV0 of the error occurrence status.
  • Extraction unit 73 is a specific target that is the evaluation target ET0 that caused the work error, based on the significant difference in the evaluation value EV0 of the error occurrence status among the plurality of types of evaluation target ET0 aggregated for each error code EC0. Extract ST0 (step S13 shown in FIG. 5).
  • one type of evaluation target ET0 selected from a plurality of types of evaluation target ET0 stored in association with one error code EC0 is set as the first-class evaluation target ET1, and is referred to as the first-class evaluation target ET1.
  • the first determination unit 74 evaluates the error occurrence status of a plurality of evaluation target ET0s included in the second type evaluation target ET2 based on one evaluation target ET0 included in the first type evaluation target ET1. The presence or absence of a significant difference in EV0 is determined for each of the plurality of evaluation target ET0s included in the first-class evaluation target ET1.
  • the second determination unit 75 is significant in the evaluation value EV0 of the error occurrence status for a plurality of evaluation target ET0s included in the first type evaluation target ET1 based on one evaluation target ET0 included in the second type evaluation target ET2. The presence or absence of the difference is determined for each of the plurality of evaluation target ET0s included in the type 2 evaluation target ET2.
  • the extraction unit 73 is based on the first determination result, which is the determination result determined by the first determination unit 74, and the second determination result, which is the determination result determined by the second determination unit 75.
  • the specific target ST0 can be extracted.
  • FIG. 7 shows an example of the evaluation value EV0 of the error occurrence status of the feeder 121 which is the first type evaluation target ET1 and the holding member 30 (suction nozzle) which is the second type evaluation target ET2.
  • the figure schematically shows the evaluation value EV0 of the error occurrence status for one error code EC0001, and the description is omitted for other types of error codes EC0.
  • the feeder 121 is assumed to be the feeder FD1, the feeder FD2, and the feeder FD3.
  • the holding member 30 suction nozzle
  • three suction nozzles NZ1, suction nozzle NZ2, and suction nozzle NZ3 are assumed for convenience of explanation.
  • the fractional notation in the figure shows an example of the evaluation value EV0 of the error occurrence status.
  • the denominator indicates the number of times of use for the substrate work (for example, collection work).
  • the numerator indicates the number of times a work error (eg, collection error) has occurred.
  • the combination of the feeder FD1 and the suction nozzle NZ1 shows that the number of times the work error occurred was 4 times out of the number of times of use 100 times.
  • the first determination unit 74 uses the feeder FD1 as a reference as one evaluation target ET0 included in the first-class evaluation target ET1.
  • the first determination unit 74 has a significance of the evaluation value EV0 of the error occurrence status for the three evaluation target ET0s of the suction nozzle NZ1, the suction nozzle NZ2 and the suction nozzle NZ3 included in the second type evaluation target ET2 with the feeder FD1 as a reference. Determine if there is a difference.
  • the evaluation value EV0 of the error occurrence status for the suction nozzle NZ1 based on the feeder FD1 is expressed as a situation in which the number of work error occurrences is 4 out of 100 times of use.
  • the evaluation value EV0 of the error occurrence status for the suction nozzle NZ2 with respect to the feeder FD1 is represented as a situation in which the number of work errors occurrence is 1 out of 100 times of use.
  • the evaluation value EV0 of the error occurrence status for the suction nozzle NZ3 with respect to the feeder FD1 is represented as a situation in which the number of work error occurrences is 0 out of 100 times of use.
  • the first determination unit 74 uses, for example, a statistical test method, specifically, a method called "test of difference in population ratio" in determining the presence or absence of a significant difference in the evaluation value EV0 of the error occurrence status. Can be done. In this verification method, statistical processing is performed using the number of times the work is used for the board work and the number of times work errors occur, and whether or not there is a significant difference between multiple events (evaluation value EV0 of the error occurrence status). Is tested. A 5% probability of occurrence is exemplified as a criterion for determining a significant difference.
  • the test accuracy increases as the number of times of use increases.
  • the first determination unit 74 may select the evaluation target ET0 that has been used for the substrate work more than a predetermined number of times as the first-class evaluation target ET1.
  • the second determination unit 75 may select the evaluation target ET0 that has been used for the substrate work more than a predetermined number of times as the second type evaluation target ET2.
  • the error occurrence rate is calculated by dividing the number of work error occurrences by the number of times the evaluation target ET0 is used for the board work.
  • the first determination unit 74 may provide a minimum number of uses and select the evaluation target ET0 having the minimum number of uses or more as the first-class evaluation target ET1.
  • the second determination unit 75 sets the minimum number of uses and selects the evaluation target ET0 equal to or more than the minimum number of uses as the second type evaluation target ET2. good.
  • the evaluation target ET0 as the reference is not the specific target ST0, and the evaluation target ET0 whose error occurrence status evaluation value EV0 included in the type 2 evaluation target ET2 is defective is the specific target. It is determined that there is a possibility of ST0. For convenience of explanation, this determination is referred to as determination A.
  • the first determination unit 74 determines that the reference evaluation target ET0 is not the specific target ST0 and that the second type evaluation target ET2 does not include the specific target ST0. For convenience of explanation, this determination is referred to as determination B.
  • the first determination unit 74 determines that the evaluation target ET0 as the reference may be the specific target ST0. For convenience of explanation, this determination is referred to as determination C.
  • the second determination unit 75 makes a determination by exchanging the first type evaluation target ET1 and the second type evaluation target ET2 as compared with the first determination unit 74. That is, when a significant difference in the evaluation value EV0 of the error occurrence status is recognized for a plurality of evaluation target ET0s included in the first-class evaluation target ET1 based on one evaluation target ET0 included in the second-class evaluation target ET2.
  • the evaluation target ET0 as the reference is not the specific target ST0
  • the evaluation target ET0 whose error occurrence status evaluation value EV0 included in the first-class evaluation target ET1 is defective is the specific target. It is determined that there is a possibility of ST0. For convenience of explanation, this determination is referred to as determination D.
  • the second determination unit 75 determines that the evaluation target ET0 as the reference is not the specific target ST0 and that the first-class evaluation target ET1 does not include the specific target ST0. For convenience of explanation, this determination is referred to as determination E.
  • the second determination unit 75 determines that the evaluation target ET0 as the reference may be the specific target ST0. For convenience of explanation, this determination is referred to as determination F.
  • the extraction unit 73 may be able to extract the specific target ST0.
  • the extraction unit 73 may be able to extract the specific target ST0.
  • the feeder FD1 as the reference is specified in the first determination unit 74. It is determined that it is not the target ST0 (determination A). Further, the first determination unit 74 determines (determination A) that the suction nozzle NZ1 having a defective error occurrence status evaluation value EV0 may be the specific target ST0, and uses it as the first first determination result. ..
  • the first determination unit 74 uses the feeder FD2 as a reference. It is determined that it is not the specific target ST0 (determination A). Further, the first determination unit 74 determines (determination A) that the suction nozzle NZ1 having a defective error occurrence status evaluation value EV0 may be the specific target ST0, and obtains the second first determination result. ..
  • the feeder FD3 as the reference is specified in the first determination unit 74. It is determined that it is not the target ST0 (determination A). Further, the first determination unit 74 determines (determination A) that the suction nozzle NZ1 having a defective error occurrence status evaluation value EV0 may be the specific target ST0, and uses it as the third first determination result. ..
  • the second determination unit 75 determines (determination F) that the suction nozzle NZ1 as the reference may be the specific target ST0, and obtains the first second determination result.
  • the second determination unit 75 determines that the reference suction nozzle NZ2 is not the specific target ST0, and the first-class evaluation target ET1 (feeder FD1, feeder FD2, and feeder FD3) does not include the specific target ST0. (Judgment E) is performed to obtain the second second judgment result.
  • the second determination unit 75 determines that the reference suction nozzle NZ3 is not the specific target ST0, and the first-class evaluation target ET1 (feeder FD1, feeder FD2, and feeder FD3) does not include the specific target ST0. (Judgment E) is performed to obtain the third second judgment result.
  • the extraction unit 73 determines the specific target ST0 based on the first determination result, which is the determination result determined by the first determination unit 74, and the second determination result, which is the determination result determined by the second determination unit 75. Extract.
  • the extraction unit 73 is the first determination result to the third first determination result determined by the first determination unit 74, and the first determination result determined by the second determination unit 75.
  • the specific target ST0 is extracted based on the second judgment result to the third second judgment result of.
  • the extraction unit 73 extracts the evaluation target ET0 that satisfies the first determination result and the second determination result as the specific target ST0 when the first determination result and the second determination result do not contradict each other.
  • the extraction unit 73 can extract the evaluation target ET0 that satisfies the first determination result and the second determination result as the specific target ST0.
  • the extraction unit 73 extracts the suction nozzle NZ1 as the specific target ST0.
  • the extraction unit 73 estimates that the feeder FD1, the feeder FD2, and the feeder FD3 are not the specific target ST0.
  • the extraction unit 73 estimates that the suction nozzle NZ2 and the suction nozzle NZ3 are not the specific target ST0.
  • the guide unit 76 guides the specific target ST0 extracted by the extraction unit 73 (step S14 shown in FIG. 5).
  • the guide unit 76 can display the specific target ST0 on the display device 80 to guide the specific target ST0.
  • the display device 80 a known display device can be used.
  • the display device 80 can be provided in an analysis device, a management device HC0, a line management device LC0, a component mounting machine WM3, and the like. As shown in FIGS. 1 and 4, the display device 80 of this embodiment is provided in the management device HC0.
  • FIG. 8 shows an example of guidance by the guide unit 76.
  • the guide unit 76 guides that the specific target ST0 that caused the work error is the suction nozzle NZ1. As a result, the worker can know the specific target ST0. However, when only the specific target ST0 is guided, the worker needs to confirm the work error separately. Therefore, the guide unit 76 may guide the error code EC0 associated with the specific target ST0 together with the specific target ST0.
  • the guide unit 76 guides the error code EC0 (in this example, the error code EC0001) associated with the suction nozzle NZ1 which is the specific target ST0. Further, the guide unit 76 may also indicate that the error code EC0001 indicates, for example, a component standing abnormality (an abnormal state in which the suction nozzle NZ1 sucks a corner portion of the component 91 and the component 91 stands up). can. Further, the guide unit 76 can also indicate that the type of work for the substrate is collection work.
  • the experienced worker can take measures to improve the work error of the work on the board using the specific target ST0 based on the accumulated knowledge.
  • the guide unit 76 may guide the specific target ST0 together with the countermeasure information EI0 for improving the work error of the work on the board using the specific target ST0.
  • EI0 countermeasure information
  • the guide unit 76 guides the skip of the suction nozzle NZ1 which is the specific target ST0 as the countermeasure information EI0 for improving the work error.
  • the skip of the suction nozzle NZ1 indicates that when the mounting head 20 includes a plurality of suction nozzles, the suction nozzle NZ1 is not used and another suction nozzle is used. Further, the guide unit 76 guides the replacement of the suction nozzle NZ1 which is the specific target ST0 as the countermeasure information EI0 for improving the work error.
  • the guide unit 76 refers to the comparison table stored in the storage device DS0, acquires a countermeasure candidate (countermeasure information EI0) for the combination of the error code EC0 and the specific target ST0, and obtains the countermeasure information EI0. I can guide you.
  • the guidance unit 76 can guide various countermeasure information EI0 according to the types of the specific target ST0 and the error code EC0. For example, when the specific target ST0 is the mounting head 20 and the error code EC0 indicates an abnormality regarding the internal structure of the mounting head 20, the guide unit 76 can guide the maintenance of the mounting head 20 as countermeasure information EI0. Further, when the specific target ST0 is the holding member 30 (suction nozzle) and the error code EC0 is a front / back determination abnormality, a mounting load abnormality, a suction load abnormality, etc. of the component 91, the guide unit 76 uses the shape data as countermeasure information EI0. It is possible to guide the correction of.
  • the board-to-board work is not limited to the supply work, collection work, and mounting work of the component 91.
  • the board-to-board work may be a transfer work in which the board 90 is carried into the machine, positioned at a predetermined position, and the board 90 is carried out from the machine after the predetermined board-to-board work.
  • the specific target ST0 is the substrate transfer device 11
  • the error code EC0 indicates a reading error of the positioning reference unit provided on the substrate 90, a detection error of a plurality of positioning reference units, and the like.
  • the guide unit 76 can guide the correction of data related to the positioning reference unit specified in the production program as the countermeasure information EI0.
  • the specific target ST0 is the board transfer device 11, and the error code EC0 indicates an error related to the loading / unloading of the board 90 in the specific anti-board working machine WM0.
  • the guide unit 76 can guide the cleaning, calibration, and the like of the board transfer device 11 as the countermeasure information EI0.
  • the board working machine WM0 is not limited to the component mounting machine WM3, and may be, for example, a printing machine WM1, a printing inspection machine WM2, an appearance inspection machine WM5, or the like.
  • the error cause estimation method includes a storage process, an aggregation process, and an extraction process.
  • the storage process corresponds to the control performed by the storage unit 71.
  • the aggregation process corresponds to the control performed by the aggregation unit 72.
  • the extraction step corresponds to the control performed by the extraction unit 73.
  • the error cause estimation method can include a first determination step and a second determination step.
  • the first determination step corresponds to the control performed by the first determination unit 74.
  • the second determination step corresponds to the control performed by the second determination unit 75.
  • the error cause estimation method can include a guidance process.
  • the guidance process corresponds to the control performed by the guidance unit 76.
  • the extraction unit 73 is provided.
  • the extraction unit 73 is a specific target that is the evaluation target ET0 that caused the work error, based on the significant difference in the evaluation value EV0 of the error occurrence status among the plurality of types of evaluation target ET0 aggregated for each error code EC0. Extract ST0. Therefore, the error cause estimation device 70 can appropriately extract the specific target ST0 that caused the work error from the evaluation target ET0 as compared with the case where the evaluation value EV0 is not aggregated for each error code EC0. can.
  • the above-mentioned matters regarding the error cause estimation device 70 can be applied to the error cause estimation method as well.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Debugging And Monitoring (AREA)
  • General Factory Administration (AREA)
  • Testing And Monitoring For Control Systems (AREA)

Abstract

L'invention concerne un dispositif d'estimation de cause d'erreur pourvu d'une unité de stockage, d'une unité de comptage et d'une unité d'extraction. L'unité de stockage amène un objet d'évaluation et un code d'erreur indiquant une erreur de travail d'un travail de substrat à l'aide de l'objet d'évaluation à être associés l'un à l'autre et stockés dans un dispositif de stockage, l'objet d'évaluation étant au moins l'un d'un appareil employé pour le travail de substrat d'une machine de travail de substrat pour effectuer un travail de substrat prédéterminé sur un substrat, ainsi que des données utilisées pour le travail de substrat. L'unité de comptage permet, pour chaque code d'erreur, une valeur d'évaluation d'une circonstance d'occurrence d'erreur par rapport à une pluralité de types d'objets d'évaluation stockés dans le dispositif de stockage. L'unité d'extraction, sur la base d'une différence significative dans les valeurs d'évaluation des circonstances d'occurrence d'erreur entre une pluralité de types d'objets d'évaluation comptés pour chaque code d'erreur, extrait un objet spécifique qui est un objet d'évaluation provoquant l'erreur de travail.
PCT/JP2020/031971 2020-08-25 2020-08-25 Dispositif et procédé d'estimation de cause d'erreur WO2022044111A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022544925A JP7326631B2 (ja) 2020-08-25 2020-08-25 エラー原因推定装置およびエラー原因推定方法
PCT/JP2020/031971 WO2022044111A1 (fr) 2020-08-25 2020-08-25 Dispositif et procédé d'estimation de cause d'erreur
DE112020007552.4T DE112020007552T5 (de) 2020-08-25 2020-08-25 Fehlerursachenschätzvorrichtung und Fehlerursachenschätzverfahren
CN202080104674.XA CN116114390A (zh) 2020-08-25 2020-08-25 错误原因推定装置以及错误原因推定方法
JP2023125906A JP7466746B2 (ja) 2020-08-25 2023-08-02 対策情報案内装置および対策情報案内方法

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PCT/JP2020/031971 WO2022044111A1 (fr) 2020-08-25 2020-08-25 Dispositif et procédé d'estimation de cause d'erreur

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WO2022044111A1 true WO2022044111A1 (fr) 2022-03-03

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CN (1) CN116114390A (fr)
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Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2006261338A (ja) * 2005-03-16 2006-09-28 Yamaha Motor Co Ltd 電子部品実装機
JP2010177293A (ja) * 2009-01-27 2010-08-12 Omron Corp 部品実装基板の品質管理用の情報表示システムおよび情報表示方法
WO2019013225A1 (fr) * 2017-07-14 2019-01-17 パナソニックＩｐマネジメント株式会社 Dispositif d'affichage, système de fabrication, et procédé d'affichage

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Publication number Priority date Publication date Assignee Title
JP2010118561A (ja) 2008-11-14 2010-05-27 Hitachi High-Tech Instruments Co Ltd 部品装着装置、プログラム及び異常原因究明方法
JP5172763B2 (ja) 2009-03-30 2013-03-27 株式会社日立ハイテクインスツルメンツ 演算装置、部品実装装置、プログラム及び演算方法
JP5427054B2 (ja) 2010-01-29 2014-02-26 株式会社日立ハイテクインスツルメンツ 異常検出装置を備えた部品実装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261338A (ja) * 2005-03-16 2006-09-28 Yamaha Motor Co Ltd 電子部品実装機
JP2010177293A (ja) * 2009-01-27 2010-08-12 Omron Corp 部品実装基板の品質管理用の情報表示システムおよび情報表示方法
WO2019013225A1 (fr) * 2017-07-14 2019-01-17 パナソニックＩｐマネジメント株式会社 Dispositif d'affichage, système de fabrication, et procédé d'affichage

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JP2023133485A (ja) 2023-09-22
JP7326631B2 (ja) 2023-08-15
CN116114390A (zh) 2023-05-12
JP7466746B2 (ja) 2024-04-12
JPWO2022044111A1 (fr) 2022-03-03

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