WO2022001954A1 - Puce et cartouche d'encre - Google Patents

Puce et cartouche d'encre Download PDF

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Publication number
WO2022001954A1
WO2022001954A1 PCT/CN2021/102748 CN2021102748W WO2022001954A1 WO 2022001954 A1 WO2022001954 A1 WO 2022001954A1 CN 2021102748 W CN2021102748 W CN 2021102748W WO 2022001954 A1 WO2022001954 A1 WO 2022001954A1
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WO
WIPO (PCT)
Prior art keywords
terminal
substrate
chip
terminals
ink cartridge
Prior art date
Application number
PCT/CN2021/102748
Other languages
English (en)
Chinese (zh)
Inventor
马浩铭
梁仕超
陈伟健
朱一静
夏敬章
贾志铮
Original Assignee
珠海纳思达企业管理有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 珠海纳思达企业管理有限公司 filed Critical 珠海纳思达企业管理有限公司
Priority to JP2021558017A priority Critical patent/JP7290746B2/ja
Priority to EP21832988.6A priority patent/EP4177062A1/fr
Publication of WO2022001954A1 publication Critical patent/WO2022001954A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17553—Outer structure

Definitions

  • the present application relates to the technical field of the inkjet printing industry, in particular to a chip and an ink cartridge having the chip.
  • Inkjet printers are more and more widely used in modern life.
  • the ink cartridge is a consumable in the inkjet printer. When the ink cartridge in the inkjet printer is used up, it needs to be replaced with a new ink cartridge and installed on the installation part.
  • the ink cartridge is generally provided with a chip, and the contact pin part on the printer mounting part contacts the terminal on the ink cartridge chip to form an electrical connection to complete the electrical signal transmission and storage between the ink cartridge and the printer.
  • FIG. 1 is a schematic diagram of contact between a chip and a contact pin group of a contact pin portion in the prior art.
  • the chip includes a first substrate 1' and a second substrate 2'.
  • the first substrate 1' and the second substrate 2' are arranged in a staggered manner, and terminals are respectively provided on the two substrates.
  • the first substrate 1' includes four first terminals 11' to 14'.
  • the second substrate 2' includes five second terminals 21'-25'.
  • the nine terminals on the chip are in contact with the contact pins 55' of the contact pin part to form an electrical connection, so as to complete the work of electrical signal transmission and storage between the ink cartridge and the printer.
  • the number of contact pins 55 ′ is consistent with the number of terminals, and there are also nine contact pins, which correspond to the nine terminals one by one. In FIG. 1 , only three contact pins are shown in order to better show the contact mode.
  • terminals 12', 13', 22', 23', 24' are connected to the wafer of the chip, and are wafer terminals, which are given a lower voltage (such as 3.6V) by the printer. ) to maintain the normal operation of the wafer.
  • Some of the terminals 21' and 25' in the second terminals are high-voltage terminals, which are given a higher voltage (for example, 42V) by the printer to complete the installation and detection work.
  • Some of the terminals 11 ′ and 14 ′ in the first terminals are short-circuit detection terminals, which detect the short-circuit situation between the terminals and prevent the damage of the wafer caused by the application of a higher voltage to the wafer terminals.
  • the terminal 22' is provided as a power supply terminal, because the high-voltage terminals are connected to the die on the second substrate 2'.
  • the distance between the element terminals 22' to 24' is too close, so that the short circuit detection terminals 11' and 14' cannot effectively detect the short circuit between the terminals, which is easy to cause the element terminals 22' to 24' located on the second substrate 2'.
  • a short circuit occurs between the power terminal 22' and the high voltage terminals 21', 25', but the short circuit detection terminals 11', 14' do not detect the short circuit, which may cause the risk of damage to the chip or the printer.
  • the main purpose of the present application is to provide a chip that can reduce the risk of damage to the chip or the printing device.
  • the application provides a chip, the chip includes:
  • the first substrate is provided with a first terminal, and the first terminal includes at least one wafer terminal and at least one short-circuit detection terminal;
  • the second substrate is stacked on one side of the first substrate, and the second substrate is provided with a second terminal, the second terminal includes a high-voltage terminal;
  • the second substrate is provided with a concave portion, and the high-voltage terminal is located at both ends of the concave portion, and the high-voltage terminal protrudes from the first terminal along the mounting direction of the chip mounted on the printing device.
  • the first substrate includes a first surface and a third surface, and the first terminal is disposed on the first surface and the third surface;
  • the second substrate includes a first surface and a third surface, The concave portion is opened on the third surface, and the high-voltage terminal is disposed on the third surface.
  • the first terminal located on the third surface extends to the first surface, and/or the high voltage terminal located on the third surface extends to the first surface.
  • the third surface is provided with a first groove, and the first groove is located between two adjacent first terminals and on both sides of the third surface.
  • the first substrate further includes a second surface opposite to the first surface
  • the second substrate further includes a second surface opposite to the first surface
  • the first groove penetrates through the first surface the first surface and the second surface
  • the recess penetrates the first surface and the second surface.
  • the high-voltage terminal is provided on the front end side of the first terminal, and at least a part of the recessed portion is located on the front end side of the first terminal.
  • the first substrate includes a first surface
  • the first terminal is disposed on the first surface
  • the second substrate includes a first surface and a third surface
  • the second terminal further includes at least one crystal
  • the concave portion is opened on the third surface
  • the second terminal is arranged on the first surface.
  • the second substrate is further provided with a second groove, and the second groove is located adjacent to the second substrate. between two of the die terminals.
  • the high voltage terminal is provided on the front end side of the die terminal in a mounting direction of the chip to the printing apparatus.
  • the chipset further includes a flexible connector, and the first substrate is connected to the second substrate via the flexible connector.
  • the first substrate is provided with a first connection terminal
  • the second substrate is provided with a second connection terminal at a position corresponding to the first connection terminal
  • the second substrate is stacked on the When the first substrate is installed, the first connection terminal is in contact with the second connection terminal.
  • the present application also provides an ink cartridge, the ink cartridge includes a main body and a terminal mounting portion, the terminal mounting portion is disposed on the main body, and the terminal mounting portion includes the above-mentioned chip.
  • the terminal mounting portion is provided with an accommodating cavity, the chip is mounted in the accommodating cavity, and the chip is parallel to the XY plane, wherein the XY plane is perpendicular to the vertical direction.
  • the chip of the present application includes a first substrate and a second substrate, the first substrate is provided with a first terminal, the first terminal includes at least one die terminal and at least one short-circuit detection terminal, and the second substrate is stacked on the One side of the first substrate, and the second substrate is provided with a second terminal, and the second terminal includes a high-voltage terminal; wherein, the second substrate is provided with a recess, and the high-voltage terminal is located at both ends of the recess, along the mounting direction of the chip to the printing equipment.
  • the high-voltage terminal protrudes from the first terminal; the design of this structure makes the high-voltage terminal far away from the wafer terminal, so that the short-circuit detection terminal can effectively detect the short circuit between the terminals, avoiding the wafer terminal especially Short circuit between power terminals and high voltage terminals, thereby reducing the risk of chip or printing equipment being damaged.
  • FIG. 1 is a schematic diagram of the contact between a chip and a contact pin in the prior art.
  • FIG. 2 is a perspective view of a chip provided by an embodiment of the present application.
  • FIG. 3 is a perspective view of a first substrate in a chip provided by an embodiment of the present application.
  • FIG. 4 is a perspective view of a second substrate in a chip provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of connection between the first substrate and the second substrate according to an embodiment of the present application.
  • FIG. 6 is a perspective view of a chip provided by another embodiment of the present application.
  • FIG. 7 is a perspective view of a chip provided by another embodiment of the present application.
  • FIG. 8 is a perspective view of a chip holder provided by an embodiment of the present application.
  • FIG. 9 is a perspective view of an embodiment of the present application when a chip is mounted on a chip holder.
  • FIG. 10 is a perspective view of a stylus portion provided in the prior art.
  • FIG. 11 is a schematic structural diagram of a contact needle provided in the prior art.
  • FIG. 12 is a schematic diagram of the contact between the chip and the contact pins according to the implementation of the present application.
  • FIG. 13 is a perspective view of the ink cartridge provided by the embodiment of the application.
  • FIG. 14 is a perspective view of a terminal mounting portion in an ink cartridge provided by an embodiment of the application.
  • FIG. 15 is another perspective view of the terminal in the ink cartridge provided by the embodiment of the present application.
  • FIG. 16 is a perspective view of an ink cartridge provided by another embodiment of the application.
  • FIG. 17 is a perspective view of a terminal mounting portion in an ink cartridge provided by another embodiment of the application.
  • connection can be a fixed connection, a detachable connection, or an integral Connection, or electrical connection; either directly or indirectly through an intermediary.
  • the X axis, the Y axis and the Z axis in the figure are perpendicular to each other, forming a three-dimensional rectangular coordinate system.
  • the direction of the second surface 102 pointing to the first surface 101 is the +Z axis direction
  • the third surface 103 is pointing to the +Z axis direction.
  • the direction of the fourth surface 104 is the +Y axis direction
  • the direction of the fifth surface 105 to the sixth surface 106 is the +X axis direction
  • the -Z axis direction is the vertical direction.
  • the ink cartridge is a consumable in the inkjet printer. When the ink cartridge in the inkjet printer is used up, it needs to be replaced with a new ink cartridge and installed on the installation part of the printing device.
  • the ink cartridge is generally provided with a chip, and the contact pin part on the printer mounting part contacts the terminal on the ink cartridge chip to form an electrical connection to complete the electrical signal transmission and storage between the ink cartridge and the printer.
  • an embodiment of the present application discloses a chip 100 .
  • the chip 100 includes a first substrate 1 and a second substrate 2 .
  • the first substrate 1 is provided with a first terminal 11
  • the second substrate 2 is provided with a first terminal 11 .
  • the second terminal 21, the first terminal 11 and the second terminal 21 each have a contact area that is in contact with a contact pin in the printing apparatus.
  • the first terminal 11 includes at least one die terminal connected to the chip die, and the second terminal 21 includes at least one high-voltage terminal that receives a higher voltage than the die terminal.
  • the first terminal 11 further includes at least one short circuit detection terminal for detecting whether a short circuit occurs between the terminals of the chip.
  • the second substrate 2 is provided with a concave portion 22 .
  • the second terminal 21 includes a first high voltage terminal 211 and a second high voltage terminal 212 , and the first high voltage terminal 211 and the second high voltage terminal 212 are located at both ends of the recess 22 .
  • the first substrate 1 is stacked on the upper surface of the second substrate 2, and the first high-voltage terminal 211 and the second high-voltage terminal 212 protrude along the mounting direction (-Y direction in FIG. 2) of the chip 100 being mounted on the printing device. out of the first terminal 11 .
  • the first substrate 1 is substantially in the shape of a cuboid, which includes a first surface 101 , a second surface 102 , a third surface 103 , a fourth surface 104 , a fifth surface 105 and a sixth surface 106 .
  • the first surface 101 and the second surface 102 are arranged in parallel
  • the third surface 103 and the fourth surface 104 are arranged in parallel
  • the fifth surface 105 and the sixth surface 106 are arranged in parallel.
  • the third surface 103 and the fourth surface 104 intersect at the first surface 101 and the second surface 102
  • the fifth surface 105 and the sixth surface 106 intersect at the first surface 101, the second surface 102, the third surface 103 and the fourth surface 104.
  • the third surface 103 and the fourth surface 104 are perpendicular to the first surface 101 and the second surface 102; the fifth surface 105 and the sixth surface 106 are perpendicular to the first surface 101, the second surface 102, the third surface 103, Fourth face 104 .
  • the first terminal 11 includes a reset terminal 111 , a clock terminal 112 , a power supply terminal 113 , a ground terminal 114 , a data terminal 115 , a short detection terminal 116 , an additional terminal 117 , a first extension terminal 118 and a second extension terminal 119 .
  • the reset terminal 111 , the clock terminal 112 , the short-circuit detection terminal 116 , the additional terminal 117 , the first extension terminal 118 and the second extension terminal 119 are all arranged on the first surface 101 , and the power terminal 113 , the ground terminal 114 and the data terminal 115 are arranged on the first surface 101 .
  • the third surface 103 extends to the first surface 101 , and two short-circuit detection terminals 116 are provided, and the two short-circuit detection terminals 116 are respectively located on both sides of the first surface 101 .
  • the first substrate 1 is provided with a first groove 12 , a first hole 13 , a second hole 14 and a third hole 15 .
  • the first groove 12 is disposed on the third surface 103 and located between two adjacent terminals among the three terminals of the power terminal 113 , the ground terminal 114 and the data terminal 115 and on both sides of the third surface 103 .
  • the first hole 13, the second hole 14 and the third hole 15 penetrate through the first surface 101 and the second surface 102, respectively, for fixing the substrate to the chip holder or the ink cartridge.
  • the second surface 102 of the first substrate 1 is also provided with wafers or electrical components, and the wafers are used to store electronic information, such as ink cartridge model, ink volume, ink type, and the like.
  • the chip contacts the contact pin part of the printing device to form an electrical connection, and the information stored in the wafer will interact, authenticate and maintain with the information in the printing device. For example, when the ink in the ink cartridge is continuously consumed, the ink amount information in the chip will change with the change of the printing amount.
  • the second substrate 2 is substantially in the shape of a cuboid, which includes a first surface 201 , a second surface 202 , a third surface 203 , a fourth surface 204 , a fifth surface 205 and a sixth surface 206 .
  • the first surface 201 and the second surface 202 are arranged in parallel
  • the third surface 203 and the fourth surface 204 are arranged in parallel
  • the fifth surface 205 and the sixth surface 206 are arranged in parallel.
  • the third surface 203 and the fourth surface 204 intersect the first surface 201, the second surface 202; the fifth surface 205, the sixth surface 206 intersect the first surface 201, the second surface 202, the third surface 203, the fourth surface 204.
  • the third surface 203 and the fourth surface 204 are perpendicular to the first surface 201 and the second surface 202; the fifth surface 205 and the sixth surface 206 are perpendicular to the first surface 201, the second surface 202, the third surface 203, Fourth surface 204 .
  • the recess 22 is opened on the third surface 203 and penetrates through the first surface 201 and the second surface 202.
  • the first high-voltage terminal 211 and the second high-voltage terminal 212 are respectively disposed on the third surface 203 and extend to the first surface 201.
  • the first high-voltage terminal 211 and the second high voltage terminal 212 are located at both ends of the recess 22 .
  • the first high voltage terminal 211 is on the -X axis side of the recess 22
  • the second high voltage terminal 212 is on the +X axis side of the recess 22
  • the first high voltage terminal 211 and the second high voltage terminal 212 are provided on the front end side of the first terminal 11 along the mounting direction of the chip 100 on the printing apparatus, and at least a part of the recess 22 is on the front end side of the first terminal 11 .
  • the second substrate 2 is further provided with a fourth hole 23 , a fifth hole 24 and a sixth hole 25 .
  • the fourth hole 23 and the fifth hole 24 penetrate through the first surface 201 and the second surface 202 for fixing the substrate to the chip holder or the ink cartridge.
  • the sixth hole 25 is an avoidance hole, in order to avoid wafers or electrical components disposed on the first substrate 1 .
  • wafers or electrical components may also be provided on the second substrate 2 .
  • the reset terminal 111 , the clock terminal 112 , the power terminal 113 , the ground terminal 114 and the data terminal 115 may also be called wafer terminals, which are used to connect with the wafer of the chip.
  • the first high voltage terminal 211 and the second high voltage terminal 212 receives a higher voltage (eg, 42V) than the wafer terminal, and the short-circuit detection terminal 116 is used to detect whether a short circuit occurs between the terminals of the chip.
  • Reset terminal 111 used to reset the internal data of the wafer.
  • Clock terminal 112 used to receive the clock signal
  • Power supply terminal 113 used to receive a power supply potential (such as 3.6V) different from the ground potential, and provide power for the work of the wafer through this terminal.
  • a power supply potential such as 3.6V
  • Ground terminal 114 for receiving ground potential.
  • Data terminal 115 used to transmit or receive data signals.
  • the first high-voltage terminal 211 and the second high-voltage terminal 212 are used to receive an installation detection voltage (for example, 42V) to complete the installation detection function of the ink cartridge being installed on the installation part.
  • an installation detection voltage for example, 42V
  • a high resistance is connected between the first high voltage terminal 211 and the second high voltage terminal 212, and it is determined whether the ink cartridge has been installed in the installation part by detecting the change of current or voltage.
  • Short circuit detection terminal 116 used to detect whether a short circuit occurs between the terminals, specifically, to detect whether a short circuit occurs between the first high voltage terminal 211, the second high voltage terminal 212 and the short circuit detection terminal 116.
  • the printer can detect that the voltage on the short-circuit detection terminal 116 is increased, and then the printer prompts a short-circuit information to avoid the chip or the printer. Risk of damage due to short circuit.
  • the additional terminal 117 is not in contact with the contact pin and does not generate electrical connection, and may be used for other functions, such as enhancing the short-circuit detection function. Detects whether ink has adhered to the substrate.
  • the first extension terminal 118 is an extension part of the reset terminal 111
  • the second extension terminal 119 is an extension part of the clock terminal 112 .
  • the chip 100 may further include a flexible connector 3 , and the first substrate 1 is connected to the second substrate 2 via the flexible connector 3 to form a whole chip.
  • the present application also discloses another specific implementation manner.
  • the first terminal 11 includes a reset The terminal 111 , the clock terminal 112 and the short-circuit detection terminal 116 , the reset terminal 111 , the clock terminal 112 and the short-circuit detection terminal 116 are respectively provided on the first surface 101 of the first substrate 1 .
  • the second terminal 21 includes a power terminal 113, a ground terminal 114, a data terminal 115, a first high voltage terminal 211 and a second high voltage terminal 212.
  • the power terminal 113, the ground terminal 114, the data terminal 115, the first high voltage terminal 211 and the second high voltage terminal 212 The terminals 212 are respectively disposed on the first surface 201 of the second substrate 2 , and the first high-voltage terminal 211 and the second high-voltage terminal 212 are located at both ends of the concave portion 22 .
  • the power terminal 113 , the ground terminal 114 , and the data terminal 115 belong to the die terminals provided on the second substrate 2 .
  • the first high voltage terminal 211 and the second high voltage terminal 212 are provided on the front end side of the die terminal (especially the power terminal 113 ) on the second substrate 2 along the mounting direction (-Y axis direction) in which the chip 100 is mounted on the printing apparatus (-Y axis side).
  • the third surface 203 of the second substrate 2 defines a second groove 26 , and the second groove 26 is located between the power terminal 113 and the ground terminal 114 and between the ground terminal 114 and the data terminal 115 . At least a part of the concave portion 22 is located on the front end side of the die terminal in the mounting direction of the chip.
  • the present application also discloses another specific implementation manner.
  • the difference between this embodiment and the above-mentioned embodiment is that in this embodiment, the third hole 15 and the first The shape of the four holes 23 is different from the shapes of the third hole 15 and the fourth hole 23 in the above-mentioned embodiment.
  • the fourth hole 23 is a round hole. It can be understood that in other embodiments, the shapes of the first hole 13 , the second hole 14 , the third hole 15 , the fourth hole 23 and the fifth hole 24 may be different from the shapes of the corresponding holes in the above-mentioned embodiments, as long as they can Fix the chip to the chip holder through these holes.
  • a first connection terminal (not shown in the figure) is further arranged on the second surface 102 of the first substrate 1 , and a second connection terminal 27 is also arranged on the first surface 201 of the second substrate 2 , The second connection terminal 27 is provided corresponding to the position of the first connection terminal.
  • the first connection terminals are in contact with the second connection terminals 27 to achieve electrical connection.
  • the electrical connection between the first substrate 1 and the second substrate 2 can be ensured, so that the first substrate 1 and the second substrate 2 can share wafers and electrical components .
  • first substrate 1 and the second substrate 2 may also be independent of each other, and there is no electrical connection between them.
  • the present application further discloses a chip set including the chip 100 and the chip frame 4 of the above-mentioned embodiment.
  • the chip frame 4 is used to fix the first substrate 1 and the second substrate 2.
  • the chip frame 4 includes a frame body 41, a first column 42, a second column 43, a third column 44, a fourth column 45, a fifth column 46 and a card Buckle 47.
  • the frame body 41 has a notch 411 , a first mounting plane 412 , a second mounting plane 413 and a through hole 414 .
  • the first column 42 , the second column 43 , the third column 44 , the fourth column 45 , the fifth column 46 and the buckle 47 are respectively connected to the frame body 41 .
  • the first column 42 , the second column 43 and the third column 44 are respectively arranged corresponding to the first hole 13 , the second hole 14 and the third hole 15 , and the fourth column 45 and the fifth column 46 are respectively arranged with the fourth hole 23 and the fifth hole 24 is correspondingly arranged.
  • the notch 411 is used to accommodate a portion of the stylus.
  • the through hole 414 is a hollow blind hole used for accommodating the wafers and electrical components of the chip.
  • the first mounting plane 412 is matched with the second surface 202 of the second substrate 2
  • the second mounting plane 413 is matched with the first substrate.
  • the second side 102 of 1 matches.
  • the buckle 47 is used to install and fix the combination of the substrate and the chip holder 4 to the ink cartridge, so as to prevent the combination of the substrate and the chip holder from being separated from the ink cartridge.
  • the first way is that the second surface 102 of the first substrate 1 is attached to the first surface 201 of the second substrate 2 .
  • the specific installation process place the second substrate 2 on the first installation plane 412, at this time the second surface 202 of the second substrate 2 is in contact with the first installation plane 412, and the fourth column 45 and the fifth column 46 are respectively The fourth hole 23 and the fifth hole 24 are matched.
  • the first substrate 1 is then placed on the second mounting plane 413.
  • the second surface 102 of the first substrate 1 is attached to the second mounting plane 413, and the second surface 102 of the first substrate 1 and the second substrate
  • the first surface 201 of 2 is in contact with each other, and the first column 42 , the second column 43 , and the third column 44 are respectively matched with the first hole 13 , the second hole 14 , and the third hole 15 .
  • the parts of the first pillar 42 , the second pillar 43 and the third pillar 44 beyond the first surface 101 of the first substrate 1 are thermally fused onto the first surface 101 by means of thermal fusion, and the thermally fused part is larger than the first surface 101 .
  • the width of the hole 13 , the second hole 14 , and the third hole 15 is such that the second substrate 2 can be stably locked to the chip holder, so that the first substrate 1 and the second substrate 2 are fixed in place.
  • the second way is that the second surface 102 of the first substrate 1 and the first surface 201 of the second substrate 2 do not adhere to each other.
  • the specific installation process place the second substrate 2 on the first installation plane 412, at this time the second surface 202 of the second substrate 2 is in contact with the first installation plane 412, and the fourth column 45 and the fifth column 46 are respectively The fourth hole 23 and the fifth hole 24 are matched. Then, the parts of the fourth pillar 45 and the fifth pillar 46 beyond the first surface 201 of the second substrate 2 are thermally fused onto the first surface 201 by means of thermal fusion.
  • the heat-fused portion is larger than the width of the fourth hole 23 and the fifth hole 24 , so that the second substrate 2 can be stably locked to the chip holder 4 .
  • the first substrate 1 is then placed on the second mounting plane 413 .
  • the second surface 102 of the first substrate 1 is attached to the second mounting plane 413 , and the first column 42 , the second column 43 and the third column 44 They are respectively matched with the first hole 13 , the second hole 14 and the third hole 15 .
  • the parts of the first column 42, the second column 43, and the third column 44 beyond the first surface 101 of the first substrate 1 are thermally fused to the first surface 101 by means of thermal fusion.
  • the thermally fused portion is larger than the first hole 13 , the second hole 14 , and the third hole 15 , so that the second substrate 2 can be stably locked to the chip holder 4 , so that the first substrate 1 and the second substrate 2 are fixed in place.
  • the first substrate 1 and the second substrate can be fixed to the chip frame 4, and the positions of the first substrate 1 and the second substrate 2 in the Y-axis and X-axis directions are the same. it's the same.
  • the difference is that in the first manner, the second surface 102 of the first substrate 1 is in contact with at least a part of the first surface 201 of the second substrate 2 .
  • the first substrate 1 and the second substrate 2 may be independent of each other and not connected to each other.
  • the first substrate 1 and the second substrate 2 may be electrically connected through the first connection terminal or the second connection terminal 27 .
  • the fourth column 45 or/and the fifth column 46 of the chip frame 4 are conductive components, and in this way, the first substrate 1 and the second substrate 2 can pass through the third column 45 or/ and the fourth column 46 are connected to each other, for example, the copper-clad portion of the second connection terminal 27 extends to the inner wall of the fourth hole 23, and the first substrate 1 is provided with a first connection terminal at a position opposite to the fourth column 45;
  • the second substrate 2 is electrically connected to the first substrate 1 through the conductivity of the second connection terminals 27 and the fourth pillars 45 .
  • the first substrate 1 is located on the +Z-axis direction side of the second substrate 2, and the first high-voltage terminal 211 and the second high-voltage terminal 212 are located on the side of the +Z-axis direction. Both sides of the recessed portion 22 .
  • the third surface 103 of the first substrate 1 is located on the +Y-axis direction side of the third surface 203 of the second substrate 2 .
  • At least a part of the recessed portion 22 is located on the -Y axis side of the first terminal 11 .
  • the second terminal 21 is provided on the front end side (-Y axis side) of the first terminal 11 in the mounting direction (-Y axis direction) in which the chip 100 is mounted on the printing apparatus.
  • the ink cartridge When the ink cartridge is mounted on the mounting portion in the -Y axis direction, at least a part of the recessed portion 22 is located on the front end side of the first terminal 11 in the mounting direction, and the first high voltage terminal 211 and the second high voltage terminal 212 are located on the side of the die terminal. -Y axis direction.
  • the power supply terminal 113 is located on the -Y axis side of the reset terminal 111 and the clock terminal 112 .
  • the high voltage terminals 211 and 212 are provided on the front end side (-Y axis side) of the first terminal 11 (particularly, the power supply terminal 113 ) in the mounting direction (-Y axis direction) of the chip 100 on the printing apparatus.
  • the contact pin portion 5 includes a hook portion 51 , a first protrusion 52 , a second protrusion 53 , an opposite surface 54 , a base 56 and multiple outer contact pins 55 , and a plurality of contact pins 55 are arranged to form Two rows.
  • the stylus portion 5 can be mounted on the mounting portion of the printing apparatus through the hook portion 51 .
  • the first protrusions 52 and the second protrusions 53 are respectively disposed on a pair of opposite surfaces 54 .
  • the first protrusion 52 has a first side portion 521 on the -X axis side
  • the second protrusion 53 has a second side portion on the +X axis side (not shown in the figure).
  • the base 56 is disposed in a pair of opposing surfaces 54 , and the base 56 is provided with contact pins 55 and slits for installing the respective contact pins 55 .
  • the contact pin is a thin metal sheet, which can conduct electricity and is not easy to wear.
  • the base 56 has a plurality of slits. The plurality of slits are in one-to-one correspondence with the plurality of contact pins, and the plurality of slits are all U-shaped with a slit opening through which each contact pin is installed into each slit, and the structure of each contact pin 55 is consistent. .
  • each contact pin 55 is connected to the main circuit of the inkjet printing apparatus through the circuit inside the mounting portion, and the other end is used to connect to the terminal of the chip of the ink cartridge.
  • the contact pin 55 includes a first end portion 551 , a second end portion 552 and a connecting portion 553 . Two ends of the connecting portion 553 are respectively connected to the first end portion 551 and the second end portion 552 .
  • the first end portion 551 and the connecting portion 553 are used for contacting with the chip of the ink cartridge, and the second end portion 552 is used for connecting with the internal circuit of the inkjet printer. For example, it may be connected to the main circuit in the inkjet printing apparatus through the holder chip.
  • the first end portion 551 includes a slope portion 551a, a pointed top portion 551b and a bottom portion 551c.
  • the widest position of the first end portion 551 is the pointed top portion 551b
  • the upper portion of the pointed top portion 551b is the inclined portion 551a
  • the lower part of the pointed top part 551b is the bottom part 551c.
  • the contact pin 55 is fixed in the slit through the connecting portion 553 or a part of the connecting portion 553 (for example, the horizontal portion of the connecting portion 553), so that the first end portion 551 and the second end portion 552 can be elastically deformed and easily deformed. Return to the original state.
  • the first end 551 of the contact pin 55 is arranged in the +Y axis direction, and the second end 552 is arranged in the -Y axis direction.
  • the first end 551 and the second end 552 protrude from the base 54 and are connected
  • the portion 553 does not protrude from the base 54 .
  • the connecting portion 553 is divided into a first vertical portion 553a and a second vertical portion 553b perpendicular to the X-axis direction, and a horizontal portion 553c parallel to the X-axis direction; the horizontal portion 553c connects the first vertical portion 553a and the two vertical portions 553b.
  • the first vertical portion 553a and the second vertical portion 553b extend along the Z-axis direction.
  • the end of the first vertical portion 553a is connected to the first end portion 551
  • the end of the second vertical portion 553b is connected to the second end portion 552 .
  • the structure of the contact pin 55 can make the first end 551 and the second end 552 of the contact pin 55 have elasticity , to avoid chip wear due to hard contact with the internal circuit of the inkjet printer and the chip of the ink cartridge.
  • the short-circuit detection terminal 116 , the reset terminal 111 , and the clock terminal 112 are in contact with the tips of the corresponding contact pins, and the power supply terminal 113 , the ground terminal 114 , and the data terminal 115 correspond to the corresponding contact pins.
  • the slope part of the contact pin part contacts.
  • the first high voltage terminal 211 and the second high voltage terminal 212 are in contact with the slopes of the corresponding contact pins.
  • the recess 22 can accommodate the first end 551 of the contact pin 55 .
  • the unloading opening on the chip holder 4 can also accommodate the first end portion 551 of the contact pin, which prevents the first end portion 551 of the contact pin from interfering with the chip or the chip holder.
  • an embodiment of the present application also discloses an ink cartridge 6 , the ink cartridge 6 includes a main body 60 , a front rib 61 , a rear rib 62 , an ink amount detection portion 63 and a terminal mounting portion 64 .
  • the main body 60 has an upper surface 601, a lower surface 602, a front surface 603, a rear surface 604, an ink outlet 605 and a process hole 606.
  • the upper surface 601 and the lower surface 602 are arranged in parallel, and the front surface 603 and the rear surface 604 are arranged in parallel.
  • the ink amount detection part 63 is provided on the front surface 603 of the main body 60, and the ink outlet 605 and the process hole 606 are respectively opened on the front surface 603 of the main body 60.
  • the front rib 61 and the rear rib 62 are respectively disposed on the upper surface 601 of the main body 60 , and there is a recess 620 between the front rib 61 and the rear rib 62 .
  • the terminal mounting portion 64 is provided at the junction of the front surface 603 and the upper surface 601 .
  • the process holes 606 are located on both sides of the terminal mounting portion 64 , and are used to facilitate demolding and the like during the injection molding process of the ink cartridge housing.
  • the front rib 61 and the rear rib 62 can play a guiding role, and the engaging part on the installation part of the printing device will be engaged in the recess 620 to prevent the ink cartridge from being removed from the installation part.
  • the lower surface of the main body 60 also has a front rib, a rear rib, and a recess, the functions of which are the same as the front rib, rear rib, and recess provided on the upper surface.
  • the terminal mounting portion 64 includes the chip 100 of the above-mentioned embodiment, and the terminal mounting portion 64 has a receiving cavity 641 , a bottom surface 642 , a first side surface 643 , a second side surface 644 , a third side surface 645 , and a first side surface 645 .
  • the bottom surface 642 , the first side surface 643 , the second side surface 644 and the third side surface 645 form the accommodating cavity 641 , the first side wall 646 is connected to the first side surface 643 , the second side wall 647 is connected to the second side surface 644 , and the third side wall 647 is connected to the second side surface 644 .
  • the side wall 648 is connected to the third side 645 .
  • the chip 100 is mounted on the bottom surface 642 of the accommodating cavity 641 , and the accommodating cavity 641 can be used for accommodating a part of the contact pin portion 5 .
  • the first substrate 1 and the second substrate 2 are mounted on the chip frame 4 and combined with the chip frame 4 as a whole. on the bottom surface of the cavity 641 .
  • the chip frame may not be provided, and the first substrate 1 and the second substrate 2 are directly mounted on the bottom surface of the accommodating cavity 641 .
  • the first guide portion 649 is a surface that gradually shifts in the +X axis direction along the +Y axis direction, and finally the first guide portion 649 is connected with the first side surface 643 .
  • the second guide portion 650 is gradually shifted to the ⁇ X axis direction along the +Y direction, and finally the second guide portion 650 is connected with the second side surface 644 .
  • the terminal mounting portion 64 is viewed from the +Z axis direction, and the accommodating cavity 641 is U-shaped.
  • the first guide portion 649 and the second guide portion 650 form a bell mouth, which gradually shrinks into the accommodating cavity 641 .
  • the terminal mounting portion 64 When installing the ink cartridge, the terminal mounting portion 64 gradually approaches the contact pin portion 5, and one of the first guide portion 649 and the second guide portion 650 contacts the first side portion 521 and the second guide portion 521 on the X axis side of the first protrusion 52.
  • One of the protrusions 53 + the second side portion on the X-axis side is gradually guided into the accommodating cavity 641 as the ink cartridge is installed.
  • the first side 643 is in contact with the first side 521 of the first protrusion 52
  • the second side 644 is in contact with the second side of the second protrusion 53 to complete the positioning in the X-axis direction, and the chip is in preliminary contact with a plurality of contact pins .
  • the installation is continued until the engaging part on the installation part is engaged with the corresponding position of the ink cartridge, the chip and the contact pin are electrically connected, and then the chip authentication, installation detection and other tasks are completed. Parts such as the ink outlet are in contact with the corresponding parts of the mounting part.
  • the ink cartridge completes the installation action.
  • the chip is inclined to the XY plane and is parallel to the base 56 of the stylus portion 5, and the first side wall and the second side wall are respectively provided with grooves.
  • the needle is inserted into the groove. A slight misalignment between the stylus portion and the grooves on the first and second side walls will cause the stylus portion 5 to make hard contact with the grooves on the first and second side walls. If the user’s If the installation force is too strong, the ink cartridge may be damaged by hard contact, especially the chip on the front end face is more likely to be damaged.
  • the chip is arranged parallel to the XY plane, perpendicular to the Z axis, and perpendicular to the vertical direction, and the stylus of the stylus portion is inclined.
  • the first side portion 521 of the first protrusion 52 and the second side portion of the second protrusion 53 are matched with the first side surface 643 and the second side surface 644 to complete the positioning.
  • the first side surface 643 and the second side surface 644 are one plane.
  • the embodiment of the present application further discloses another ink cartridge
  • the ink cartridge 6 includes a main body 60 , a terminal mounting portion 64 , a first side edge 65 , a second side edge 66 and a fixing portion 67 .
  • the main body 60 has an upper surface 601, a lower surface 602, a front surface 603 and a rear surface 604, the upper surface 601 is arranged opposite to the lower surface 602, and the front surface 603 and the rear surface 604 are arranged opposite.
  • the front surface 603 is provided with an ink outlet 605
  • the first side edge 65 and the second side edge 66 are respectively disposed on the upper surface 601
  • the fixing portion 67 is located on the lower surface 602 .
  • the terminal mounting portion 64 is located at the junction of the front surface 603 and the upper surface 601 .
  • the first side rib 65 and the second side rib 66 may play a guiding role when the ink cartridge is installed in the mounting portion.
  • the engaging portion on the mounting portion will be snapped into the fixing portion 67 to prevent the ink cartridge from detaching from the mounting portion.
  • the lower surface also has a first side edge and a second side edge, the functions of which are the same as those of the first side edge and the second side edge on the upper surface.
  • the terminal mounting portion includes the chip 100 of the above-mentioned embodiment, and the terminal mounting portion 64 has a receiving cavity 641 , a bottom surface 642 , a first side surface 643 , a second side surface 644 , a third side surface 645 , and a first side wall 646 , a second side wall 647 , a third side wall 648 , a first through hole 651 and a second through hole 652 .
  • the bottom surface 642 , the first side surface 643 , the second side surface 644 and the third side surface 645 constitute the accommodating cavity 641 .
  • the first side wall 646 is connected to the first side 643
  • the second side wall 647 is connected to the second side 644
  • the third side wall 648 is connected to the third side 645 .
  • the chip 100 is mounted on the bottom surface 642 of the accommodating cavity 641 , and the accommodating cavity 641 can be used for accommodating one end of the contact portion 5 .
  • the first substrate 1 and the second substrate 2 are mounted on the chip frame 4 and combined with the chip frame 4 as a whole. on the bottom surface of the cavity 641 .
  • the chip holder may not be provided, and the first substrate and the second substrate are directly mounted on the bottom surface of the accommodating cavity.
  • the first through hole 651 is located on the first side wall 646, and the first through hole 651 has a first upper surface and a first lower surface in the Z-axis direction; the second through hole 652 is located on the second side wall 647, and the second The through hole 652 has a second upper surface and a second lower surface in the Z-axis direction.
  • the terminal mounting portion is viewed from the +Z axis direction, and the accommodating cavity 641 is U-shaped.
  • first side surface 643 , the second side surface 644 and the third side surface 645 do not match the first side portion 521 of the first protrusion 52 and the second side portion of the second protrusion 53 .
  • the terminal mounting portion 64 gradually approaches the contact pin portion 5 .
  • the first protrusion 52 will enter into the first through hole 651
  • the second protrusion 53 will enter into the second through hole 652 to complete the positioning in the Z-axis direction.
  • the chip makes initial contact with a plurality of contact pins. The installation is continued until the engaging part on the installation part is engaged with the corresponding position of the ink cartridge, the chip and the contact pin are electrically connected, and then the chip authentication, installation detection and other tasks are completed. Parts such as the ink outlet are in contact with the corresponding parts of the mounting part. The ink cartridge completes the installation action.
  • the chip is inclined to the XY plane and parallel to the base, and grooves are formed on the first side wall and the second side wall, and the contact pin part is inserted into the groove when the ink cartridge is installed on the installation part. .
  • a slight misalignment between the stylus portion and the grooves on the first and second side walls may cause the stylus portion to make hard contact with the grooves on the first and second side walls. If it is too large, it may cause the ink cartridge to be damaged by hard contact, especially if the chip is located on the front end surface, it is more likely to be damaged.
  • the chip is arranged parallel to the XY plane and perpendicular to the Z axis, and the stylus of the stylus portion is inclined.
  • the first side portion 521 of the first protrusion 52 and the second side portion of the second protrusion 53 are not in contact with the ink cartridge, that is, in the X-axis direction, the ink cartridge will not touch the first protrusion 52 and the second protrusion. 53 is limited in the X-axis direction.
  • the first through hole 651 and the second through hole 652 are through holes in the X-axis direction.

Abstract

La présente invention concerne une puce et une cartouche d'encre comprenant la puce. La puce (100) comprend un premier substrat (1) et un second substrat (2). Le premier substrat (1) comporte une première borne (11), et la première borne (11) comprend au moins une borne de tranche (111-115) et au moins une borne de détection de court-circuit (116). Le second substrat (2) est empilé sur un côté du premier substrat (1), le second substrat (2) comporte une seconde borne (21), la seconde borne (21) comprend des bornes haute tension (211-212). Un renfoncement (22) est ménagé dans le second substrat (2), et les bornes haute tension (211-212) sont situées aux deux extrémités du renfoncement (22). Les bornes haute tension (211-212) font saillie à partir de la première borne (11) le long de la direction dans laquelle la puce (100) est montée sur un dispositif d'impression. La puce, au moyen d'une telle structure, permet aux bornes haute tension d'être éloignées de la borne de tranche, permettant ainsi à la borne de détection de court-circuit de détecter efficacement des courts-circuits entre les bornes, évitant les courts-circuits entre la borne de tranche, en particulier une borne d'alimentation, et la borne haute tension, et réduisant ainsi le risque d'endommagement de la puce ou du dispositif d'impression.
PCT/CN2021/102748 2020-07-03 2021-06-28 Puce et cartouche d'encre WO2022001954A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021558017A JP7290746B2 (ja) 2020-07-03 2021-06-28 チップ及びインクカートリッジ
EP21832988.6A EP4177062A1 (fr) 2020-07-03 2021-06-28 Puce et cartouche d'encre

Applications Claiming Priority (2)

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CN202021285743.5U CN212796256U (zh) 2020-07-03 2020-07-03 芯片及墨盒
CN202021285743.5 2020-07-03

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WO2022001954A1 true WO2022001954A1 (fr) 2022-01-06

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JP (1) JP7290746B2 (fr)
CN (2) CN212796256U (fr)
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CN212796256U (zh) * 2020-07-03 2021-03-26 珠海纳思达企业管理有限公司 芯片及墨盒

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JP6345818B2 (ja) * 2017-01-20 2018-06-20 エステー産業株式会社 インクカートリッジ及びチップ
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CN212796256U (zh) 2021-03-26
CN215243807U (zh) 2021-12-21
JP2022541970A (ja) 2022-09-29
JP7290746B2 (ja) 2023-06-13
EP4177062A1 (fr) 2023-05-10

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