WO2021261504A1 - Résistance - Google Patents

Résistance Download PDF

Info

Publication number
WO2021261504A1
WO2021261504A1 PCT/JP2021/023717 JP2021023717W WO2021261504A1 WO 2021261504 A1 WO2021261504 A1 WO 2021261504A1 JP 2021023717 W JP2021023717 W JP 2021023717W WO 2021261504 A1 WO2021261504 A1 WO 2021261504A1
Authority
WO
WIPO (PCT)
Prior art keywords
resistor
substrate
electrode
protective film
face
Prior art date
Application number
PCT/JP2021/023717
Other languages
English (en)
Japanese (ja)
Inventor
賢一 松島
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2022532507A priority Critical patent/JPWO2021261504A1/ja
Priority to CN202180043665.9A priority patent/CN115803830A/zh
Publication of WO2021261504A1 publication Critical patent/WO2021261504A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Definitions

  • the present disclosure relates to resistors in general, and more particularly to resistors provided with a protective film.
  • Patent Document 1 describes a chip resistor using a metal thin film resistor.
  • the chip resistor described in Patent Document 1 includes a substrate, a resistor formed on the substrate, a pair of electrodes connected to the resistor, a protective film covering the resistor between at least a pair of electrodes, and a substrate. It is provided with an end face electrode formed on the end face (side surface) of the above.
  • An object of the present disclosure is to provide a resistor capable of suppressing a decrease in reliability.
  • the resistor includes a substrate, a resistor, an electrode, and a protective film.
  • the resistor is formed on one surface of the substrate.
  • the electrode is formed on the one surface of the substrate.
  • the protective film covers at least a part of the resistor and the electrode.
  • the protective film has an end face along the thickness direction of the substrate.
  • the resistor further comprises an end face electrode extending from the side surface of the substrate to the end face of the protective film.
  • FIG. 1 is a cross-sectional view of the resistor according to the first embodiment.
  • FIG. 2 is a flowchart showing a method of manufacturing the same resistor.
  • FIG. 3A is a cross-sectional view of the resistor according to the comparative example.
  • FIG. 3B is a partially enlarged view of FIG. 3A.
  • FIG. 4 is a cross-sectional view of the resistor according to the second embodiment.
  • FIG. 5 is a cross-sectional view of the resistor according to the third embodiment.
  • FIG. 6 is a cross-sectional view of the resistor according to the fourth embodiment.
  • the directions of “up”, “down”, “left”, and “right” are defined in the directions shown in FIGS. 1, 3A, 3B, and 4 to 6. That is, in the resistors 1 according to the first to fourth embodiments, the thickness direction D1 of the substrate 11 is the vertical direction, and the direction in which the pair of upper surface electrodes 13 formed on the upper surface 111 of the substrate 11 are arranged is the horizontal direction. be. However, these directions are not intended to specify the direction in which the resistor 1 is used. In addition, the arrows indicating each direction in the drawing are shown only for the sake of explanation, and are not accompanied by an entity.
  • FIGS. 1, 3A, 3B, and 4 to 6 are schematic views, and the ratio of the size and the thickness of each component in each figure is not necessarily the actual dimensional ratio. Does not always reflect.
  • the resistor 1 is, for example, a chip resistor for surface mounting (SMT: Surface Mount Technology) mounted on the surface (mounting surface) of a printed circuit board using a surface mounter (mounter). ..
  • the resistor 1 is a thick film chip resistor.
  • the resistor 1 includes a substrate 11, a resistor 12, a pair of top electrodes (electrodes) 13, and a resin protective film (protective film) 15.
  • the resistor 12 is formed on the upper surface (one surface) 111 of the substrate 11.
  • the pair of upper surface electrodes 13 are formed on the upper surface 111 of the substrate 11.
  • the resin protective film 15 covers at least a part of the resistor 12 and the pair of top electrodes 13.
  • the resin protective film 15 has an end face 151 along the thickness direction D1 of the substrate 11.
  • the resistor 1 according to the present embodiment further includes an end face electrode 17.
  • the end face electrode 17 extends from the side surface 113 of the substrate 11 to the end face 151 of the resin protective film 15.
  • the creepage distance d1 with the top electrode 13 can be lengthened, and the creepage distance d1 can be lengthened.
  • the resin protective film 15 and the first plating layer 18 are in close contact with each other via the end face electrode 17.
  • the resistor 1 according to the present embodiment includes a substrate 11, a resistor 12, a pair of top electrodes 13, a resin protective film 15, and a pair of end face electrodes 17. Further, the resistor 1 according to the present embodiment further includes a glass protective film 14, a pair of lower surface electrodes (back surface electrodes) 16, a pair of first plating layers 18, and a pair of second plating layers 19. ..
  • the substrate (insulated substrate) 11 is, for example, an alumina substrate containing Al 2 O 3 (alumina).
  • the substrate 11 has a rectangular shape in which the shape seen from the thickness direction D1 (vertical direction) of the substrate 11 is long in the left-right direction.
  • the substrate 11 has an upper surface (one surface) 111, a lower surface 112, and a side surface 113.
  • the upper surface 111 and the lower surface 112 face each other in the thickness direction D1 (vertical direction) of the substrate 11.
  • the side surface 113 intersects (orthogonally) the upper surface 111 and the lower surface 112. That is, the side surface 113 is along the thickness direction D1 of the substrate 11.
  • the resistor 12 is made of RuO 2 , AgPd, CuNi, etc., and is formed at the center of the upper surface 111 of the substrate 11. That is, the resistor 12 is formed on the upper surface 111 of the substrate 11.
  • the resistor 12 is formed on the upper surface 111 of the substrate 11 by, for example, screen printing.
  • the resistor 12 has a rectangular shape when viewed from the vertical direction, but can have an arbitrary shape according to the resistance value.
  • the resistance value of the resistor 12 can be adjusted to a desired resistance value by, for example, laser trimming.
  • the pair of top electrodes 13 are made of, for example, an Ag-based material or a Cu-based material, and are formed at both ends in the left-right direction on the top surface 111 of the substrate 11. That is, the pair of upper surface electrodes 13 are formed on the upper surface 111 of the substrate 11.
  • the pair of top electrodes 13 are formed on the top 111 of the substrate 11 by, for example, screen printing.
  • each of the pair of top electrodes 13 has a rectangular shape when viewed from the vertical direction, but may have a circular shape, a triangular shape, or the like, for example.
  • the glass protective film 14 is a film for protecting the resistor 12.
  • the glass protective film 14 is made of, for example, lead oxide glass.
  • the glass protective film 14 is formed (film-formed) so as to cover the entire area of the resistor 12 by, for example, screen printing.
  • the glass protective film 14 has a rectangular shape when viewed from the vertical direction, but can have an arbitrary shape according to the shape of the resistor 12.
  • the glass protective film 14 is not limited to lead oxide glass, and may be, for example, silica oxide glass.
  • the resin protective film 15 is made of, for example, an epoxy resin, and is formed so as to cover the glass protective film 14. That is, the resin protective film 15 covers at least a part of the resistor 12 and the pair of top electrodes 13. In the present embodiment, the resin protective film 15 covers the entire area of the resistor 12 and the pair of top electrodes 13. Further, in the present embodiment, the resin protective film 15 covers the entire area (entire surface) of the upper surface 111 of the substrate 11.
  • the resin protective film 15 is formed, for example, by applying an epoxy resin paste by screen printing and then curing the epoxy resin by heating it, or by irradiating it with ultraviolet rays to cure the epoxy resin. In the present embodiment, the resin protective film 15 has a rectangular shape that is long in the horizontal direction when viewed from the vertical direction, but can have any shape according to the shapes of the resistor 12 and the pair of top electrodes 13.
  • the resin protective film 15 has an end face 151.
  • the end face 151 is in the vertical direction, that is, along the thickness direction D1 of the substrate 11.
  • the end face 151 is orthogonal to the upper surface 111 of the substrate 11.
  • orthogonal as used herein means not only a state in which the angle between the two is exactly 90 degrees, but also a range in which the angle between the two is substantially effective (for example, ⁇ 5 degrees). It is meant to include states that are approximately orthogonal to each other.
  • the pair of bottom electrodes (backside electrodes) 16 are made of, for example, an Ag-based material or a Cu-based material.
  • the pair of bottom electrode 16s are formed at both ends of the bottom surface 112 of the substrate 11 in the left-right direction.
  • the pair of bottom electrodes 16 are formed, for example, by screen printing.
  • the pair of bottom electrodes 16 have a one-to-one correspondence with the pair of top electrodes 13.
  • the pair of end face electrodes 17 are made of CuNi, Cr, or the like, and are formed on both side surfaces 113 in the left-right direction of the substrate 11.
  • Each of the pair of end face electrodes 17 is, for example, a sputter film.
  • the term "sputtered film” as used herein means a film formed by sputtering. That is, the pair of end face electrodes 17 are formed (deposited) on both side surfaces 113 in the left-right direction of the substrate 11 by sputtering.
  • Each of the pair of end face electrodes 17 electrically connects the corresponding upper surface electrode 13 of the pair of upper surface electrodes 13 and the corresponding lower surface electrode 16 of the pair of lower surface electrodes 16.
  • the material of the end face electrode 17 is not limited to CuNi and Cr, and may be any other compound as long as it is a Cu-based alloy or a Cr-based alloy.
  • each of the pair of end face electrodes 17 covers not only the side surface 113 of the substrate 11 but also the end face 151 of the resin protective film 15. That is, each of the pair of end face electrodes 17 extends from the side surface 113 of the substrate 11 to the end face 151 of the resin protective film 15. In the present embodiment, each of the pair of end face electrodes 17 covers the entire end face 151 of the resin protective film 15. Further, in the present embodiment, each of the pair of end face electrodes 17 also covers the corresponding bottom electrode 16 of the pair of bottom electrodes 16.
  • the pair of first plating layers 18 are made of, for example, nickel (Ni) plating.
  • the pair of first plating layers 18 covers the pair of end face electrodes 17 at both ends in the left-right direction of the substrate 11. That is, in the present embodiment, the resistor 1 further includes a first plating layer 18 formed on the end face electrode 17.
  • each of the pair of end face electrodes 17 is a sputter film. Therefore, it is possible to improve the adhesion between the resin protective film 15 and the first plating layer 18.
  • the pair of second plating layers 19 are made of, for example, tin (Sn) plating.
  • the pair of second plating layers 19 covers the pair of first plating layers 18 at both ends in the left-right direction of the substrate 11.
  • the method for manufacturing the resistor 1 includes a first step P1, a second step P2, and a third step P3.
  • the first step P1 is a step of executing the processes of S1 to S7 on the sheet-shaped first substrate.
  • the second step P2 is a step of executing the processes of S8 and S9 on the strip-shaped second substrate divided from the sheet-shaped first substrate.
  • the third step P3 is a step of executing the processes of S10 and S11 on the individual third substrate divided from the strip-shaped second substrate.
  • the third substrate is the substrate 11 described above.
  • a bottom surface electrode (back surface electrode) 16 is formed on the bottom surface (back surface) of the first substrate (S1).
  • the first substrate is a substrate having a size in which a plurality of third substrates (boards 11) are arranged in a matrix.
  • the first substrate is an alumina substrate like the substrate 11.
  • the lower surface electrode 16 is formed on the lower surface of the first substrate by applying the paste of the Ag-based material to the lower surface of the first substrate by screen printing and then firing the paste.
  • the upper surface electrode 13 is formed on the upper surface of the first substrate (S2).
  • the paste of the Ag-based material is applied to the upper surface of the first substrate by screen printing and then fired to form the upper surface electrode 13 on the upper surface of the first substrate.
  • the resistor 12 is formed on the upper surface of the first substrate (S3).
  • the RuO 2 paste is applied to the upper surface of the first substrate and then fired to form the resistor 12 on the upper surface of the first substrate.
  • the firing of the bottom electrode 16, the firing of the top electrode 13, and the firing of the resistor 12 may be performed individually as described above, or for example, the bottom electrode 16 and the top electrode 13 may be fired at the same time.
  • the upper surface electrode 13 and the resistor 12 may be fired at the same time, or the lower surface electrode 16, the upper surface electrode 13 and the resistor 12 may be fired at the same time.
  • the glass protective film 14 is formed on the resistor 12 (S4).
  • a glass protective film 14 is formed on the resistor 12 by applying a lead oxide glass paste by screen printing so as to cover the resistor 12 and then firing the paste.
  • a trimming groove is formed in a part of the resistor 12 by laser trimming. By changing the size of the trimming groove, it is possible to adjust the resistance value of the resistor 12.
  • the resin protective film 15 is formed on the glass protective film 14 (S6).
  • the treatment S6 after applying the epoxy resin by screen printing so as to cover the glass protective film 14, for example, the epoxy resin is cured by heating or is irradiated with ultraviolet rays to cure the epoxy resin.
  • the resin protective film 15 is formed on the glass protective film 14.
  • the first substrate is divided into a plurality of second substrates (S7).
  • the second substrate is a substrate having a size in which a plurality of third substrates (boards 11) are arranged in one direction.
  • the first substrate may be divided into a plurality of second substrates by dicing, or a slit may be provided in the first substrate and divided into a plurality of second substrates along the slit.
  • the end face electrode 17 is formed on the end face of the second substrate (S8).
  • the end face electrode 17 is formed on the end face of the second substrate by performing sputtering on the end face of the second substrate.
  • the second substrate is divided into a plurality of third substrates (boards 11) (S9).
  • the third substrate is the substrate 11 described above.
  • the second substrate may be divided into a plurality of third substrates by dicing, or a slit may be provided in the second substrate and divided into a plurality of third substrates along the slit.
  • the first plating layer 18 is formed on the end face electrode 17 formed on the end face (side surface 113) of the third substrate (board 11) (S10).
  • the first plating layer 18 includes nickel plating as described above.
  • the first plating layer 18 is formed on the end face electrode 17 by applying nickel plating to the end face electrode 17 formed on the end face of the third substrate.
  • the second plating layer 19 is formed on the first plating layer 18 (S11).
  • the second plating layer 19 includes tin plating as described above.
  • the second plating layer 19 is formed on the first plating layer 18 by applying tin plating to the first plating layer 18.
  • FIG. 3A is a cross-sectional view of the resistor 100 according to the comparative example.
  • FIG. 3B is a partially enlarged view of FIG. 3A.
  • the resistor 100 according to the comparative example includes a substrate 101, a resistor 102, a pair of top electrodes 103, a resin protective film 105, and a pair of end face electrodes 107. .. Further, the resistor 100 according to the comparative example further includes a glass protective film 104, a pair of lower surface electrodes (back surface electrodes) 106, a pair of first plating layers 108, and a pair of second plating layers 109.
  • the entire area of the pair of top electrodes 13 is covered with the resin protective film 15, whereas in the resistor 100 according to the comparative example, the pair of top electrodes A part of 103 is exposed from the resin protective film 105.
  • the portion of the pair of top electrodes 103 exposed from the resin protective film 105 is covered with the first plating layer 108 and the second plating layer 109.
  • the resistor 100 according to the comparative example as shown in FIG. 3B, a part of the resin protective film 105 and a part of the first plating layer 108 and the second plating layer 109 overlap each other in the vertical direction. ..
  • the first plating layer 108 and the second plating layer 109 are in direct contact with the resin protective film 105. That is, in the resistor 100 according to the comparative example, the resin protective film 105 is only in contact with the first plating layer 108 and the second plating layer 109, and the adhesion is weak.
  • the sulfur component contained in the atmosphere may infiltrate from the interface between the resin protective film 105 and the first plating layer 108 and the second plating layer 109, and the resistance The reliability of the resistor 100 may decrease due to aging of the value, disconnection, or the like.
  • the creepage distance d2 (see FIG. 3B) from the second plating layer 109 to the top electrode 103 is, for example, 15 to 30 ⁇ m.
  • the resin protective film 15 is formed over the entire upper surface 111 of the substrate 11, and the end face 151 of the resin protective film 15 and the first plating layer 18 are end face electrodes. They are in close contact with each other through 17.
  • the creepage distance d1 (see FIG. 1) from the resin protective film 15 to the upper surface electrode 13 is, for example, 30 to 55 ⁇ m.
  • the creepage distance d2 is 15 ⁇ m, but in the resistor 1 according to the present embodiment, the creepage distance d1 can be set to 30 ⁇ m with the same size.
  • the creepage distance d1 can be made longer than that of the resistor 100 according to the comparative example, and the resin protective film 15 and the first plating layer 18 are in close contact with each other. is doing. Therefore, it is possible to suppress the infiltration of sulfur components contained in the atmosphere from the interface between the resin protective film 15 and the first plating layer 18, and the creepage distance from the outside to the top electrode 13 becomes long. As a result, it is possible to suppress a decrease in the reliability of the resistor 1.
  • Modification Example 1 is only one of various embodiments of the present disclosure.
  • the first embodiment can be changed in various ways depending on the design and the like as long as the object of the present disclosure can be achieved.
  • modified examples of the first embodiment are listed. The modifications described below can be applied in combination as appropriate.
  • the resistor 1 is a thick film chip resistor, but the present invention is not limited to this.
  • the resistor 1 may be, for example, a thin film chip resistor.
  • the resistor 1 is a resistor for surface mounting, but is not limited to this.
  • the resistor 1 may be, for example, a resistor for through-hole mounting (THT: Through-hole Technology).
  • the end face electrode 17 is a sputtering film formed by sputtering, but the present invention is not limited to this.
  • the end face electrode 17 may be formed by, for example, roller transfer or screen printing.
  • the resin protective film 15 covers the entire surface of the upper surface 111 of the substrate 11, but the present invention is not limited to this.
  • the resin protective film 15 may be formed, for example, so that a part of the pair of top electrodes 13 is exposed.
  • the end face electrode 17 may be formed over the side surface 113 of the substrate 11, the upper surface of the top surface electrode 13, and the end face 151 of the resin protective film 15.
  • the resin protective film 15 covers the entire area of the resistor 12 and the pair of top electrodes 13, but it is sufficient that the resin protective film 15 covers at least a part of the resistor 12 and the pair of top electrodes 13.
  • the end face electrode 17 covers the entire end face 151 of the resin protective film 15, but it is sufficient that the end face electrode 17 covers at least a part of the end face 151 of the resin protective film 15.
  • the resistor 1 includes a pair of top surface electrodes (electrodes) 13, but the resistor 1 may include, for example, one top surface electrode 13 or three or more top surface electrodes. 13 may be provided.
  • the resistor 1 includes the first plating layer 18 and the second plating layer 19, but the resistor 1 may include, for example, only the first plating layer 18 or the second plating layer 18. Only the plating layer 19 may be provided. Further, the resistor 1 may further include one or more plating layers in addition to the first plating layer 18 and the second plating layer 19.
  • the end face electrode 17 is formed not only on the end face 151 of the resin protective film 15 but also on the upper surface 152 of the resin protective film 15, in that the resistor 1 is different from the resistor 1 according to the first embodiment. It's different.
  • the resistor 1a according to the second embodiment includes a substrate 11, a resistor 12, a pair of top electrodes 13, a resin protective film 15, and a pair of end face electrodes 17. Further, the resistor 1a according to the second embodiment further includes a glass protective film 14, a pair of lower surface electrodes 16, a pair of first plating layers 18, and a pair of second plating layers 19.
  • each of the pair of end face electrodes 17 covers not only the end face 151 but also the upper surface 152 in the resin protective film 15. That is, each of the pair of end face electrodes 17 is formed from the side surface 113 of the substrate 11 to the upper surface 152 which is the surface of the resin protective film 15 opposite to the substrate 11. As a result, the end face electrode 17 is less likely to be peeled off and the creepage distance from the outside to the top electrode 13 becomes longer than in the case where the end face electrode 17 is formed only up to the end face 151 of the resin protective film 15.
  • the resistor 1a according to the second embodiment it is possible to suppress the sulfur component contained in the atmosphere from infiltrating from the interface between the resin protective film 15 and the end face electrode 17, and as a result, it is possible to suppress sulfurization resistance. It is possible to improve the sex. That is, according to the resistor 1a according to the second embodiment, it is possible to suppress a decrease in the reliability of the resistor 1a.
  • the configuration described in the second embodiment can be appropriately combined with the configuration (including a modification) described in the first embodiment.
  • the resistor 1b according to the third embodiment is different from the resistor 1a according to the second embodiment in that it is face-down mounted on the mounting surface 21 of the mounting board 2 to which the resistor 1b is mounted. Further, since the resistor 1b according to the third embodiment is face-down mounted on the mounting substrate 2, the lower surface electrode (back surface electrode) 16 is omitted, which is different from the resistor 1a according to the second embodiment. do.
  • the resistor 1b according to the third embodiment includes a substrate 11, a resistor 12, a pair of top electrodes 13, a resin protective film 15, and a pair of end face electrodes 17. Further, the resistor 1b according to the third embodiment further includes a glass protective film 14, a pair of first plating layers 18, and a pair of second plating layers 19.
  • Each of the pair of end face electrodes 17 covers not only the end face 151 but also the upper surface 152 in the resin protective film 15. That is, each of the pair of end face electrodes 17 is integrally formed over the side surface 113 of the substrate 11, the end face 151 of the resin protective film 15, and the upper surface 152 of the resin protective film 15.
  • the upper surface 111 of the substrate 11 on which the resistor 12 and the pair of upper surface electrodes 13 are formed face the mounting surface 21 of the mounting substrate 2. It is mounted on the mounting surface 21 of the mounting board 2. That is, the resistor 1b according to the third embodiment is face-down mounted on the mounting surface 21 of the mounting board 2 to which the resistor 1b is mounted.
  • the configuration described in the third embodiment can be appropriately combined with the configurations (including modified examples) described in the first and second embodiments.
  • the resistor 1c according to the fourth embodiment is different from the resistor 1b according to the third embodiment in that the resin electrode 20 is provided.
  • the resistor 1c according to the fourth embodiment includes a substrate 11, a resistor 12, a pair of top electrodes 13, a resin protective film 15, and a pair of end face electrodes 17. Further, the resistor 1c according to the fourth embodiment further includes a glass protective film 14, a pair of first plating layers 18, a pair of second plating layers 19, and a pair of resin electrodes 20.
  • the pair of resin electrodes 20 are formed on the upper surface 152 of the resin protective film 15.
  • the pair of resin electrodes 20 are formed at both ends in the left-right direction on the upper surface 152 of the resin protective film 15.
  • Each of the pair of resin electrodes 20 is made of, for example, an epoxy resin containing silver (Ag) as a conductor.
  • Each of the pair of resin electrodes 20 is formed by, for example, applying an epoxy resin to the upper surface 152 of the resin protective film 15 by screen printing and then irradiating with ultraviolet rays to cure the epoxy resin.
  • the pair of resin electrodes 20 have a one-to-one correspondence with the pair of top electrodes 13.
  • each of the pair of end face electrodes 17 covers the upper surface 201 of the corresponding resin electrode 20 and both side surfaces 202 in the left-right direction of the pair of resin electrodes 20. ing. That is, each of the pair of end face electrodes 17 is formed over the side surface 113 of the substrate 11, the end face 151 of the resin protective film 15, the upper surface 201 of the resin electrode 20, and both side surfaces 202 of the resin electrode 20.
  • the resin electrode 20 as the second electrode is formed on the upper surface 111 of the substrate 11 between the upper surface electrode 13 as the first electrode and the end surface electrode 17. .. Then, as shown in FIG.
  • the resin electrode 20 is thicker than the end face electrode 17. Further, in the resistor 1c according to the fourth embodiment, the end face electrode 17 is formed so as to cover at least a part of the upper surface electrode 13 as the first electrode in the thickness direction D1 of the substrate 11.
  • the resistor 1c according to the fourth embodiment is face-down mounted on the mounting surface of the mounting board in the same manner as the resistor 1b described in the third embodiment described above.
  • the resin electrode 20 since the resin electrode 20 is provided between the resin protective film 15 and the end face electrode 17, the influence of the shrinkage of the substrate 11 at the time of mounting the resistor 1c is affected by the resin.
  • the electrode 20 makes it possible to relax. That is, according to the resistor 1c according to the fourth embodiment, it is possible to improve the thermal impact resistance.
  • the configuration described in the fourth embodiment can be appropriately combined with the configurations (including modified examples) described in the first to third embodiments.
  • the resistor (1; 1a; 1b; 1c) includes a substrate (11), a resistor (12), an electrode (13), and a protective film (15). , Equipped with.
  • the resistor (12) is formed on one surface (111) of the substrate (11).
  • the electrode (13) is formed on one surface (111) of the substrate (11).
  • the protective film (15) covers at least a part of the resistor (12) and the electrode (13).
  • the protective film (15) has an end face (151) along the thickness direction (D1) of the substrate (11).
  • the resistor (1; 1a; 1b; 1c) further comprises an end face electrode (17) extending from the side surface (113) of the substrate (11) to the end face (151) of the protective film (15).
  • the resistor (1; 1a; 1b; 1c) according to the second aspect further includes a plating layer (18, 19) in the first aspect.
  • the plating layer (18, 19) is formed on the end face electrode (17).
  • the protective film (15) covers the entire surface (111) of the substrate (11). ..
  • the end face electrode (17) is a sputtered film.
  • the end face electrode (17) is the end face (151) of the protective film (15). It covers the whole area of.
  • the end face (151) of the protective film (15) is the substrate (11). It is orthogonal to one surface (111).
  • the end face electrode (17) is a protective film from the side surface (113) of the substrate (11). It is formed over the surface (152) opposite to the substrate (11) in (15).
  • the end face electrode (17) is less likely to come off.
  • the resistor (1b) according to the eighth aspect is face-down mounted on the mounting surface (21) of the mounting board (2) to be mounted in any one of the first to seventh aspects.
  • the end face electrode (17) serves as the electrode in the thickness direction (D1) of the substrate (11). It is formed so as to cover at least a part of the first electrode (13).
  • the resistor (1c) further comprises a second electrode (20).
  • the second electrode (20) is formed between the first electrode (13) and the end face electrode (17) on one surface (111) of the substrate (11).
  • the second electrode (20) is thicker than the end face electrode (17).
  • the configuration according to the second to ninth aspects is not an essential configuration for the resistor (1; 1a; 1b; 1c) and can be omitted as appropriate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)

Abstract

La présente invention permet de remédier à une diminution de la fiabilité. Cette résistance (1) comprend un substrat (11), un corps résistif (12), une électrode de surface supérieure (13) et un film protecteur en résine (15). Le corps résistif (12) est formé sur une surface (111) du substrat (11). L'électrode de surface supérieure (13) est formée sur une surface (111) du substrat (11). Le film protecteur en résine (15) recouvre au moins une partie du corps résistif (12) et l'électrode de surface supérieure (13). Le film protecteur en résine (15) a une surface d'extrémité (151) dans la direction d'épaisseur (D1) du substrat (11). La résistance (1) comprend en outre une électrode de surface d'extrémité (17) s'étendant entre une surface latérale (113) du substrat (11) et la surface d'extrémité (151) du film protecteur en résine (15).
PCT/JP2021/023717 2020-06-26 2021-06-23 Résistance WO2021261504A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022532507A JPWO2021261504A1 (fr) 2020-06-26 2021-06-23
CN202180043665.9A CN115803830A (zh) 2020-06-26 2021-06-23 电阻器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-110949 2020-06-26
JP2020110949 2020-06-26

Publications (1)

Publication Number Publication Date
WO2021261504A1 true WO2021261504A1 (fr) 2021-12-30

Family

ID=79281253

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/023717 WO2021261504A1 (fr) 2020-06-26 2021-06-23 Résistance

Country Status (3)

Country Link
JP (1) JPWO2021261504A1 (fr)
CN (1) CN115803830A (fr)
WO (1) WO2021261504A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275702A (ja) * 1997-03-31 1998-10-13 Taiyo Yuden Co Ltd チップ抵抗器
JP2009088344A (ja) * 2007-10-01 2009-04-23 Koa Corp チップ抵抗器
JP2017123453A (ja) * 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． チップ抵抗素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275702A (ja) * 1997-03-31 1998-10-13 Taiyo Yuden Co Ltd チップ抵抗器
JP2009088344A (ja) * 2007-10-01 2009-04-23 Koa Corp チップ抵抗器
JP2017123453A (ja) * 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． チップ抵抗素子

Also Published As

Publication number Publication date
JPWO2021261504A1 (fr) 2021-12-30
CN115803830A (zh) 2023-03-14

Similar Documents

Publication Publication Date Title
US20210012932A1 (en) Chip resistor and method for manufacturing the same
JP7382451B2 (ja) チップ抵抗器
JP7385358B2 (ja) チップ抵抗器
JP2024010234A (ja) チップ抵抗器
WO2006030705A1 (fr) Partie electronique en forme de puce
US10192659B2 (en) Chip resistor
JP5115968B2 (ja) チップ抵抗器の製造方法およびチップ抵抗器
WO2014109224A1 (fr) Résistance de puce
JP5706186B2 (ja) チップ抵抗器およびその製造方法
WO2021261504A1 (fr) Résistance
JP2022012055A (ja) 抵抗器
WO2020189217A1 (fr) Pavé résistif
WO2017033793A1 (fr) Résistance pavé et procédé de fabrication de résistance pavé
JPH08316002A (ja) 電子部品及び複合電子部品
JP2004079811A (ja) チップ電子部品及びその製造方法
JP4707890B2 (ja) チップ抵抗器およびその製造方法
JP2002231502A (ja) フィレットレス形チップ抵抗器及びその製造方法
JP3652568B2 (ja) チップ部品及びチップ部品の製造方法
JP3953325B2 (ja) チップ抵抗器およびその製造方法
JP2003068505A (ja) チップ抵抗器およびその製造方法
JPH05283273A (ja) 積層セラミックコンデンサ
JP3981273B2 (ja) チップ抵抗器
JP3159963B2 (ja) チップ抵抗器
JP2023157576A (ja) チップ抵抗器およびチップ抵抗器の製造方法
JP2002305126A (ja) チップ抵抗器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21829354

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022532507

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21829354

Country of ref document: EP

Kind code of ref document: A1