WO2021249125A1 - Procédé de fabrication de capteur - Google Patents

Procédé de fabrication de capteur Download PDF

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Publication number
WO2021249125A1
WO2021249125A1 PCT/CN2021/094169 CN2021094169W WO2021249125A1 WO 2021249125 A1 WO2021249125 A1 WO 2021249125A1 CN 2021094169 W CN2021094169 W CN 2021094169W WO 2021249125 A1 WO2021249125 A1 WO 2021249125A1
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WO
WIPO (PCT)
Prior art keywords
board
pcb board
unit
sensor
assembly
Prior art date
Application number
PCT/CN2021/094169
Other languages
English (en)
Chinese (zh)
Inventor
党茂强
解士翔
Original Assignee
潍坊歌尔微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2021249125A1 publication Critical patent/WO2021249125A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers

Definitions

  • This application relates to the technical field of sensor production, and in particular to a method for manufacturing a sensor.
  • MEMS Micro Electro Mechanical System
  • sensor is a device that converts external signals (such as vibration, light, or pressure) into electrical signals through a sensor chip. In this device, it is necessary to protect fragile chips and reduce external interference. Set up the package shell.
  • a three-layer PCB board is used to form a packaging shell, that is, the packaging shell includes a surrounding plate, and a bottom plate and a top plate respectively arranged at both ends of the surrounding plate.
  • the bottom plate and the top plate respectively seal the openings at both ends of the surrounding plate.
  • the board, bottom board and top board are all PCB boards.
  • the above-mentioned package shell is not easy to achieve mass production. Therefore, in order to realize the mass production of MEMS sensors, another package structure has been designed in this field, which includes a metal shell with an opening at one end and an opening for sealing the metal shell. In this way, the metal shell can be mass produced by stamping and forming, so as to realize the mass production of MEMS sensors.
  • the use of a metal shell as the encapsulation shell of the sensor is not conducive to improving the performance of the MEMS sensor. For example, the sensor chip and the sound hole can only be arranged on the bottom plate.
  • the main purpose of this application is to propose a method for manufacturing a sensor, aiming to realize the mass production of a MEMS sensor using a three-layer PCB board as a package shell.
  • the present application proposes a method for manufacturing a sensor.
  • the sensor includes an enclosure, the enclosure includes an enclosure, and a top plate and a bottom plate respectively provided at both ends of the enclosure.
  • the ends are respectively provided with a first connection structure and a second connection structure; one of the first connection structure and the second connection structure connects one end of the enclosure plate with the top plate, and the other connects the enclosure plate The other end and the bottom plate; and the widths of the first connection structure and the second connection structure are both greater than or equal to 0.1 mm and less than or equal to 0.3 mm;
  • the manufacturing method of the sensor includes:
  • first PCB board including a plurality of first board units, a second PCB board including a plurality of enclosure units, and a third PCB board including a plurality of second board units.
  • One of the second board units is a top board unit and the other is a bottom board unit;
  • the second PCB board is provided with a first connection structure and a second connection structure, and each of the enclosure units is in the second Both sides of the PCB board are respectively provided with the first connection structure and the second connection structure;
  • the second PCB board is an enclosure assembly
  • one of the first PCB board and the third PCB board is a top board assembly
  • the other is a bottom board assembly.
  • the solution of the present application is: first install the enclosure plate assembly on the top plate assembly to separate the intermediate transition body; then install the intermediate transition body on the bottom plate assembly to separate the sensor. Or, first install the enclosure plate assembly on the bottom plate assembly to separate the intermediate transition body; then install the intermediate transition body on the top plate assembly to separate the sensor. In this way, the mass production of the MEMS sensor using a three-layer PCB board as the package can be realized.
  • FIG. 1 is a schematic block diagram of the flow of an embodiment of a method for manufacturing a sensor according to the present application
  • FIG. 2 is a schematic diagram of the assembly process of the first embodiment of the manufacturing method of the sensor according to the present application
  • FIG. 3 is a schematic diagram of the assembly process of the third embodiment of the manufacturing method of the sensor according to the present application.
  • FIG. 4 is a schematic diagram of the front structure of the second PCB board in FIG. 1;
  • FIG. 5 is a schematic diagram of the reverse structure of the second PCB board in FIG. 4;
  • FIG. 6 is a schematic diagram of the structure of the sensor in FIG. 1;
  • Figure 7 is a schematic diagram of the front structure of the enclosure in Figure 6;
  • Fig. 8 is a schematic diagram of the reverse structure of the enclosure panel in Fig. 7;
  • Fig. 9 is a schematic cross-sectional structure diagram of the enclosure plate in Fig. 6.
  • This application proposes a method for manufacturing a sensor.
  • the sensor 100 includes a packaging shell and a MEMS sensor chip and an ASIC chip arranged in the packaging shell.
  • the packaging shell includes a surrounding plate 20 and two surrounding plates 20 respectively.
  • the top board 10, the surrounding board 20 and the bottom board 30 are all PCB boards.
  • the senor is a MEMS sensor, which may specifically be a MEMS microphone, or a MEMS pressure sensor, etc.; correspondingly, the MEMS sensor chip may specifically be a MEMS microphone chip, or a MEMS pressure sensor chip, or the like.
  • the sensor is a MEMS microphone as an example for description.
  • both ends of the enclosure panel 20 are respectively provided with a first connection structure and a second connection structure, and one of the first connection structure and the second connection structure connects one end of the enclosure panel 20 to the top panel 10, The other is connected to the other end of the enclosure board 20 and the bottom plate 30.
  • the connecting structure (the first connecting structure, the second connecting structure) can facilitate the connection of the enclosure panel 20 and the top panel 10 or the enclosure panel 20 and the bottom panel 30.
  • the first connection structure can be configured as a welding ring, so that the enclosure board 20 and the corresponding board body can be welded by solder paste.
  • the first connection structure may also be a plurality of soldering pieces/part structures distributed on one end of the enclosure plate in a ring shape. In this way, the enclosure plate 20 and the corresponding board body can also be welded by solder paste.
  • the first connection structure can also be configured as a ring-shaped electrical connector, so that the enclosure board 20 and the corresponding board body can be connected by conductive glue.
  • the structural form of the second connecting structure is the same as the structural form of the first connecting structure, and there is no need to repeat them here.
  • the following will explain the application by taking the first connection structure and the second connection structure as welding rings as an example, but it is not used to limit the application.
  • the widths of the first connection structure and the second connection structure are both greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
  • the width of the first connection structure refers to the length of the first connection structure in the thickness direction of the wall of the enclosure.
  • the width of the first connecting structure refers to the width of the welding ring;
  • the first connecting structure is a structure of a plurality of welding pieces/sections distributed in a ring shape at one end of the enclosure, the first connecting structure
  • the width of a connecting structure refers to the width of the annular structure formed by the plurality of welding pieces/parts; when the first connecting structure is an annular electrical connector, the width of the first connecting structure refers to the width of the annular electrical connector Width; etc.
  • the width of the second connection structure also refers to the length of the first connection structure in the thickness direction of the wall of the enclosure.
  • first connection structure and the second connection structure are too narrow, the processing of the first connection structure and the second connection structure will be difficult, and the firmness after the connection will be poor. If the widths of the first connection structure and the second connection structure are too wide, the size of the sensor 100 will be affected; and for the soldering ring, the amount of solder paste will be large when scribing the solder paste, which will affect the flatness of the product .
  • the widths of the first connection structure and the second connection structure are both greater than or equal to 0.12 mm and less than or equal to 0.28 mm, such as 0.15, 0.18, 0.2, 0.22, 0.22, 0.25, 0.27 mm, etc.
  • the manufacturing method of the sensor 100 includes:
  • Step S100 providing a first PCB board 200, a second PCB board 300, and a third PCB board 400, the first PCB board includes a plurality of first board units, and the second PCB board 300 includes a plurality of enclosure units 20a ,
  • the third PCB board 400 includes a plurality of second board units, wherein one of the first board unit and the second board unit is a top board unit 10a, and the other is a bottom board unit 30a; each top board unit A sound hole 11 is provided on 10a (if the sensor is a MEMS pressure sensor, the sound hole 11 is correspondingly a pressure transmission hole).
  • the second PCB board is provided with a first connection structure and a second connection structure
  • each of the enclosure units 20a is provided with a first connection structure on both sides of the second PCB board 300 respectively And a said second connection structure.
  • each top plate unit 10a is used to form a top plate 10 of a sensor
  • each surrounding plate unit 20a is used to form a surrounding plate 20 of a sensor
  • each bottom plate unit 30a is used to form a sensor.
  • each top plate unit 10a is a top plate 10 of a sensor 100
  • each enclosure plate unit 20a is a enclosure plate 20 of a sensor 100
  • each base plate unit 30a is a sensor 100
  • the bottom plate 30 is used to connect with an external circuit board.
  • the multiple first board units are arranged in an array
  • the multiple enclosure units 20a are also arranged in an array
  • the multiple second board units are also arranged in an array; and the array arrangements of the three are the same.
  • a plurality of the first board units are arranged in a rectangle or a square, correspondingly, a plurality of the enclosure units 20a are also arranged in a rectangle or a square, and a plurality of the second board units are also arranged. Distributed into a rectangle or square.
  • the first plate unit may be round or square (square or rectangular), etc., which is not limited herein, and the shapes of the enclosure plate unit 20a and the second plate unit are adapted to those of the first plate unit.
  • step S200 the second PCB board 300 is mounted on the first PCB board 200 to form a first assembly 600; and each of the enclosure units 20a is connected to each other through the first connection structure. Plate unit to form a plurality of intermediate transition body units on the first assembly 600.
  • each intermediate transition body unit includes an enclosure unit 20a and a first board unit connected to the enclosure unit 20a.
  • Step S300 Separate intermediate transition body units from the first assembly 600 to obtain a plurality of intermediate transition bodies 40.
  • each intermediate transition body 40 includes an enclosure plate 20 and a first plate connected to one end of the enclosure plate unit 20a.
  • the intermediate transition body unit can be separated from the first assembly 600 by cutting.
  • Step S400 Mount the intermediate transition body 40 on the third PCB board 400 to form a second assembly 700; and each of the second board units is correspondingly installed with one intermediate transition body 40, and The second connection structure connects the second plate unit and the intermediate transition body 40 to form a plurality of sensor units on the second assembly 700.
  • the first board is positioned on the side of the enclosure board 20 away from the third PCB board 400, so that the enclosure board 20 is connected to the second board unit, So that each enclosure unit 20a is correspondingly connected with a first board unit and a second board unit, so as to respectively seal the openings at both ends of the enclosure unit 20a, so that the second assembly 700 A plurality of sensor units are formed on the upper surface.
  • each sensor unit is a sensor 100, which includes an enclosure unit 20a, and a top board unit 10a and a bottom board unit 30a respectively provided at both ends of the enclosure unit 20a.
  • step S500 the sensor unit is separated from the second assembly 700 to obtain a plurality of sensors 100.
  • the sensor unit can be separated from the second assembly 700 by cutting to obtain a plurality of sensors 100.
  • the second PCB board 300 is an enclosure assembly
  • one of the first PCB board 200 and the third PCB board 400 is a top board assembly
  • the other is a bottom board assembly.
  • the solution of the present application is: first install the enclosure plate assembly on the top plate assembly to separate the intermediate transition body 40; then install the intermediate transition body 40 on the bottom plate assembly to separate the sensor 100. Or, first install the enclosure plate assembly on the bottom plate assembly to separate the intermediate transition body 40; then install the intermediate transition body 40 on the top plate assembly to separate the sensor 100.
  • connection structures first connection structure, second connection structure
  • first connection structure and the second connection structure are usually solder rings
  • the second PCB board 300 is usually mounted on the first PCB board 200 by solder paste
  • the intermediate transition body 40 is made by solder paste. It is mounted on the third PCB board 400, and the specific mounting steps will be described in detail below in conjunction with the structure of the sensor 100.
  • the first connection structure is a first welding ring 25.
  • the width of the first welding ring 25 is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
  • first welding ring 25 is too narrow, it will be difficult to process the first welding ring 25, and the firmness after the connection will be poor. If the first solder ring 25 is too wide, the size of the sensor 100 will be affected; and when the solder paste is scratched, the amount of solder paste will be large, which will affect the flatness of the product.
  • the width of the first welding ring 25 is greater than or equal to 0.12 mm and less than or equal to 0.28 mm, such as 0.15, 0.18, 0.2, 0.22, 0.25, 0.27 mm, etc.
  • the first welding ring 25 includes a copper layer provided on the side surface of the second PCB board 300, a nickel layer provided on the surface of the copper layer, and a gold layer provided on the surface of the nickel layer. Set between the copper layer and the gold layer. In this way, the weldability of the first welding ring 25 can be improved.
  • the copper layer is formed by a surface copper coating process.
  • the nickel layer is an electroplated layer
  • the gold layer is an electroplated layer
  • the thickness of the copper layer is greater than or equal to 20 microns. It can be understood that if the thickness of the copper layer is thin, the processing of the copper layer will be more difficult, and the firmness after welding will also be poor.
  • the thickness of the nickel layer is greater than or equal to 2 micrometers and less than or equal to 10 micrometers. It can be understood that if the thickness of the nickel layer is thin, it is not conducive to improving the weldability of the first welding ring 25; if the thickness of the nickel layer is thick, the cost will be increased.
  • the thickness of the nickel layer is greater than or equal to 3 micrometers and less than or equal to 8 micrometers.
  • the thickness of the nickel layer may be 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, etc.
  • the thickness of the gold layer is greater than or equal to 0.05 micrometers and less than or equal to 15 micrometers. It can be understood that if the thickness of the gold layer is thin, it is not conducive to improving the weldability of the first welding ring 25; if the thickness of the gold layer is thick, the cost will be increased.
  • the thickness of the gold layer is greater than or equal to 0.08 micrometers and less than or equal to 12 micrometers.
  • the thickness of the gold layer may be 0.09 micrometers, 1 micrometer, 2 micrometers, 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, etc.
  • the second connection structure is a second welding ring 27.
  • the structure of the second welding ring 27 is (basically) the same as the structure of the first welding ring 25, which also includes a copper layer provided on the side of the second PCB board 300 and a nickel layer provided on the surface of the copper layer.
  • the specific structure of the layer and the gold layer provided on the surface of the nickel layer are limited here and it is not necessary to repeat them one by one.
  • an electrical connector 24 is further provided on the second PCB board 300, and an electrical connector 24 is embedded in each enclosure unit 20a.
  • the electrical connection member 24 has a circular columnar structure.
  • step S200 mounting the second PCB board 300 on the first PCB board 200 to form the first assembly 600 includes:
  • Step S220 applying tin paste to each of the first board units on the first PCB board 200.
  • each of the first board units on the first PCB board 200 is provided with a first annular coating area, and in step S220, tin paste is applied to the first annular coating area.
  • the solder paste is coated all over the first annular coating area to ensure the connection strength.
  • a first pad is provided in the first annular coating area.
  • step S230 mount the second PCB board 300 on the first PCB board 200, and (make) the solder paste on each of the first board units to connect the first board unit to the first board unit
  • the first welding ring 25 of the enclosure unit 20a is used to mount the second PCB board 300 on the first PCB board 200 to form a first assembly 600.
  • step S220 the solder paste is drawn on each of the first board units.
  • step S230 specifically, the solder paste solders the first solder ring 25 and the first pad together at the soldering temperature.
  • the first soldering ring 25 and the first pad are soldered by solder paste to connect the first board unit and the corresponding enclosure unit 20a, which can not only realize the fixed connection between the first board unit and the enclosure unit 20a, but also The electrical connection between the first board unit and the enclosure unit 20a is realized.
  • the first PCB board 200 is arranged flat, and the second PCB board 300 is mounted on the upper surface of the first PCB board 200 from above the first PCB board 200. In this way, the solder paste can be prevented from flowing around on the first PCB board 200.
  • the first PCB board 200 is provided with a first positioning hole
  • the second PCB board 300 is provided with a second positioning hole; the position of the first positioning hole on the first PCB board 200 and the second positioning The positions of the holes on the second PCB board 300 correspond to each other.
  • step S200 mounting the second PCB board 300 on the first PCB board 200 to form the first assembly 600 further includes:
  • Step S210 Fix the first PCB board 200 on the mounting table, and the positioning pins on the mounting table are inserted into the first positioning holes.
  • the first PCB board 200 is placed above the mounting table, and the first positioning hole is aligned with the positioning pin of the mounting table, and then the first PCB board 200 is moved downward, so that the positioning pin is inserted into the first positioning Inside the hole, to guide the first PCB board 200 to move to the mounting table, so that the first PCB board 200 is fixed on the mounting table.
  • step S230 is: placing the second PCB board 300 above the first PCB board 200, and aligning the second positioning holes with the positioning pins of the mounting table, and then making the second PCB board 300
  • the second PCB board 300 moves downwards, so that the positioning pins are inserted into the second positioning holes to guide the second PCB board 300 to move to the first PCB board 200, so that the second PCB board 300 is mounted on the first PCB board.
  • One PCB board 200 is: placing the second PCB board 300 above the first PCB board 200, and aligning the second positioning holes with the positioning pins of the mounting table, and then making the second PCB board 300
  • the second PCB board 300 moves downwards, so that the positioning pins are inserted into the second positioning holes to guide the second PCB board 300 to move to the first PCB board 200, so that the second PCB board 300 is mounted on the first PCB board.
  • One PCB board 200 is: placing the second PCB board 300 above the first PCB board 200, and aligning the second positioning holes with the positioning pins
  • first positioning hole and the second positioning hole can be arranged correspondingly, so that each first board unit can be connected to a surrounding board unit 20a correspondingly, and accurate positioning can be achieved.
  • a first ring-shaped barrier wall is provided on the periphery of each first board unit, and the first ring-shaped barrier wall is located on the inner side of the inner wall surface of the surrounding board unit.
  • the first annular baffle wall can be used to form a first annular coating zone. It can be understood that the first annular blocking wall may form a first coating groove between adjacent first plate units.
  • the solder paste can be coated in the first coating tank. In this way, by adjusting the width of the first coating tank, it is not only beneficial to ensure the connection strength and prevent the dispersion of the solder paste, but also can reduce as much as possible.
  • the amount of solder paste can also take into account the separation of the sensor unit.
  • the first annular blocking wall can also block solder (such as solder) during soldering to prevent the solder from splashing into the package shell and contaminating the internal chip.
  • the first annular blocking wall can be integrally formed with the first plate unit, or can be separately connected and formed on the surface of the first plate unit.
  • a metal shielding layer 21 is further provided on the inner wall surface of each enclosure unit 20a, and the metal shielding layer 21 is grounded.
  • the metal shielding layer 21 is a copper foil layer.
  • the thickness of the metal shielding layer 21 is greater than or equal to 10 microns. In this way, to ensure/improve the shielding effect.
  • an insulating layer 22 is provided on the inner wall surface of each enclosure unit 20a to block solder during soldering.
  • the metal shielding layer 21 is provided between the insulating layer 22 and the inner wall surface of the enclosure unit 20 a, that is, the insulating layer 22 is provided on the inner side of the metal shielding layer 21.
  • the insulating layer 22 may be an electrophoretic layer.
  • the thickness of the insulating layer 22 is greater than or equal to 6 micrometers and less than or equal to 20 micrometers, such as 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers. Micron, 16 microns, 17 microns, 18 microns, 19 microns, etc.
  • the manufacturing process of the second PCB board 300 roughly includes:
  • each enclosure unit 20a is provided with an inner cavity through hole and a metalized through hole opened on the side wall of the enclosure unit 20a.
  • a metal shielding layer 21 is formed on the inner wall surface of each enclosure unit 20a (that is, the inner wall surface of the inner cavity through hole).
  • the electrical connector 24 is formed in the metalized through hole.
  • the electrical connector 24 is in the shape of a circular column, and a resin isolation layer 26 can be filled in the metalized through hole, that is, a resin plug hole structure is formed, so that no air bubbles remain in the metalized through hole.
  • the thickness of the sidewall of the electrical connector 24 is greater than or equal to 12 microns.
  • An insulating layer 22 is formed in the metal shielding layer 21.
  • the first welding ring 25 and the second welding ring 27 are respectively formed on both sides of the PCB board.
  • a solder mask isolation layer 23 is formed on the surface of the plate, such as a green oil layer.
  • the second PCB board 300 can be mounted on the first PCB board 200 in other ways to form the first assembly 600.
  • the step S200 of mounting the second PCB board 300 on the first PCB board 200 to form the first assembly 600 includes:
  • Step S201 applying tin paste to each of the first board units on the first PCB board 200;
  • Step S202 applying tin paste to the first soldering ring 25 of each of the enclosure unit 20a on the second PCB board 300;
  • Step S203 Mount the second PCB board 300 on the first PCB board 200, and (make) the solder paste on the first board unit and the surrounding board unit 20a provided in each pair to be connected
  • the first welding ring 25 of the first board unit and the surrounding board unit 20a enables the second PCB board 300 to be mounted on the first PCB board 200.
  • solder paste can be distributed more uniformly, and the connection strength can be improved.
  • the intermediate transition body unit may be separated from the first assembly 600 by cutting to obtain a plurality of intermediate transition bodies 40.
  • the first assembly 600 may be cut by a dicing machine to separate the intermediate transition body unit.
  • step S300 separating the intermediate transition body unit from the first assembly 600 to obtain a plurality of intermediate transition bodies 40, includes:
  • Step S310 Use positioning pins to fix the first assembly 600 and the steel ring, and the first assembly 600 is located inside the steel ring, and then lay a UV film on one side of the first assembly 600 and the steel ring, so that the UV film The first assembly 600 is fixed on the steel ring.
  • Step S320 dicing and cutting the first assembly 600 on the steel ring to separate the intermediate transition body unit from the first assembly 600 to obtain a plurality of intermediate transition bodies 40.
  • the intermediate transition body 40 is provided with a knife alignment mark to improve cutting accuracy.
  • a first pair of knife marks and a second pair of knife marks 310 are respectively provided to install the second PCB board 300 on the first
  • a knife mark is formed.
  • the second tool setting mark 310 is taken as an example for description below.
  • a plurality of the enclosure units 20a are arranged in a rectangle or a square, wherein there are a plurality of second pair of knife marks 310, and some of them are located in the plurality of enclosure units.
  • the four corners of the rectangle or square arranged by 20a are partially located on the sides of the rectangle or square arranged by the plurality of enclosure units 20a.
  • the second knife mark 310 may be a cross mark.
  • step S310 if the first board unit is the top board unit 10a, the UV film is usually laid on the surface of the first PCB board 200 so that the UV film can also protect the sound hole 11.
  • step S400 mounting the intermediate transition body 40 on the third PCB board 400 to form the second assembly 700 includes: mounting the intermediate transition body 40 on the third PCB board 400 through solder paste, To form a second assembly 700.
  • the step S400 includes:
  • Step S420 applying solder paste to each second board unit on the third PCB board 400.
  • each second board unit on the third PCB board 400 is provided with a second annular coating area, and in step S420, tin paste is applied to the second annular coating area.
  • the solder paste is coated all over the second annular coating area to ensure the connection strength.
  • a second pad is provided in the second annular coating area.
  • step S430 mount the intermediate transition body 40 on the third PCB board 400, and (make) the solder paste on each of the second board units are connected to the second board unit and the second board unit The second welding ring 27 of the corresponding enclosure unit 20a.
  • step S420 the solder paste is drawn on each of the second board units.
  • step S430 specifically, the solder paste solders the second solder ring 27 and the second pad together at the soldering temperature.
  • the intermediate transition body 40 can be mounted on the third PCB board 400 by surface mounting, and the first board is located on the upper side of the enclosure board 20 during mounting, and each enclosure unit 20a corresponds to a first board.
  • a second ring-shaped barrier wall is provided on the periphery of each second board unit, and the second ring-shaped barrier wall is located on the inner side of the inner wall surface of the surrounding board unit.
  • the second annular baffle wall can be used to form a second annular coating zone. It can be understood that the second annular blocking wall may form a second coating groove between adjacent second plate units.
  • the solder paste can be coated in the second coating tank.
  • the second annular blocking wall can also block solder (such as solder, etc.) during soldering, so as to prevent the solder from splashing into the package shell and contaminating the internal chip.
  • the second annular blocking wall can be integrally formed with the second plate unit, or can be separately connected and formed on the surface of the second plate unit.
  • step S400 the third PCB board 400 is laid flat, and the intermediate transition body 40 is mounted on the upper surface of the third PCB board 400 from above the third PCB board 400.
  • the third PCB board 400 is provided with a third positioning hole.
  • step S400 mounting the intermediate transition body 40 on the third PCB board 400 to form the second assembly 700 further includes:
  • Step S410 Fix the third PCB board 400 on the mounting table, and the positioning pins on the mounting table are inserted into the third positioning holes.
  • the third PCB board 400 is placed above the mounting table, and the third positioning hole is aligned with the positioning pin of the mounting table, and then the third PCB board 400 is moved downward, so that the positioning pin is inserted into the third positioning In the hole, the third PCB board 400 is guided to move to the mounting table, so that the third PCB board 400 is fixed on the mounting table.
  • step S500 includes: separating the sensor unit from the second assembly 700 by cutting to obtain a plurality of sensors 100.
  • the second assembly 700 can be cut by a dicing machine to separate the sensor unit.
  • step S500 specifically includes:
  • Step S510 Use positioning pins to fix the second assembly 700 and the steel ring, and the second assembly 700 is located inside the steel ring, and then lay a UV film on one side of the second assembly 700 and the steel ring to pass the UV film.
  • the second assembly 700 is fixed on the steel ring.
  • Step S520 dicing and cutting the second assembly 700 on the steel ring to separate the sensor units from the second assembly 700 to obtain a plurality of sensors 100.
  • Step S530 Tear off the UV film on the sensor 100.
  • the third PCB board 400 is provided with a third pair of knife marks to improve cutting accuracy.
  • a plurality of the second plate units are arranged in a rectangle or a square, wherein there are a plurality of third knife marks, and some of them are located at the four corners of the rectangle or square where the plurality of second plate units are arranged.
  • the locations and parts are located on the rectangular or square sides of the arrangement of the plurality of second board units.
  • the third knife mark can be selected as a cross mark.
  • the MEMS sensor chip is usually arranged on the top plate 10 to form a pseudo TOP structure, thereby improving the performance of the MEMS sensor chip.
  • the first board unit as the top board unit 10a as an example, the manufacturing process of the sensor 100 of the pseudo TOP structure will be described.
  • the first connection structure connects one end of the enclosure board 20 and the top board 10
  • the second connection structure connects the other end of the enclosure board 20 and the bottom board 30.
  • step S200 before mounting the second PCB board 300 on the first PCB board 200 to form the first assembly 600, the manufacturing method of the sensor 100 further includes:
  • step S50a the MEMS sensor chip is mounted on the first PCB board 200, and each of the first board units is mounted with a MEMS sensor chip.
  • the MEMS sensor chip is mounted on the first PCB board 200, and the MEMS sensor chip can be mounted on the first PCB board 200 using surface mount technology. On a PCB board 200, this can reduce the difficulty of the mounting process of the MEMS sensor chip and reduce the cost.
  • the MEMS sensor chip can be mounted on the first PCB board 200, that is, in step S200, the second PCB board 300 is mounted on
  • the intermediate transition body unit is separated from the first assembly 600 to obtain a plurality of intermediate transition bodies 40
  • the manufacturing method of the sensor 100 further includes:
  • step S60a the MEMS sensor chip is mounted on the first PCB board 200, and each of the first board units is mounted with a MEMS sensor chip.
  • the solder such as solder, etc.
  • the ASIC chip is also provided on the top plate 10.
  • the manufacturing method of the sensor 100 further includes the following steps, namely Before step S200, the second PCB board 300 is mounted on the first PCB board 200 to form the first assembly 600, the manufacturing method of the sensor 100 further includes:
  • step S50b the ASIC chip is mounted on the first PCB board 200, and each first board unit is mounted with an ASIC chip.
  • step S50a can be made first, or step S50b can be made first.
  • the ASIC chip can be mounted on the first PCB board 200, that is, in step S200, the second PCB board 300 is mounted on the first PCB board 200.
  • the first PCB board 200 is formed to form the first assembly 600, and in step S300, the intermediate transition body unit is separated from the first assembly 600 to obtain a plurality of intermediate transition bodies 40, the sensor
  • the manufacturing method of 100 also includes:
  • step S60b the ASIC chip is mounted on the first PCB board 200, and each of the first board units is mounted with an ASIC chip.
  • the solder such as solder, etc.
  • the solder splashes and pollutes the ASIC chip.
  • step S60a can be made first, or step S60b can be made first.
  • step S50a and step S50b the optional steps for mounting the MEMS sensor chip and the ASIC chip are: step S50a and step S50b, step S50a and step S60b, step S50b and step S60a, and step S60a And step S60b.
  • the ASIC chip is disposed on the bottom plate 30.
  • the method for manufacturing the sensor 100 further includes the following steps.
  • step S400 the intermediate transition body 40 is installed.
  • the manufacturing method of the sensor 100 further includes:
  • step S700 the ASIC chip is mounted on the third PCB board 400, and each second board unit is mounted with an ASIC chip.
  • step S50a and step S700 are: step S50a and step S700 (in no particular order), step S60a and step S700 (In no particular order).
  • the first board unit can also be the bottom board unit 30a.
  • the mounting process of the MEMS sensor chip and the ASIC chip is different, as follows: Give a brief description.
  • the first plate unit is a bottom plate unit 30a
  • the first connection structure connects one end of the enclosure plate and the bottom plate
  • the second connection structure connects the enclosure plate. The other end of the board and the top board.
  • the manufacturing method of the sensor 100 further includes:
  • step S80a the ASIC chip is mounted on the first PCB board 200, and each first board unit is mounted with an ASIC chip.
  • step S200 after the second PCB board 300 is mounted on the first PCB board 200 to form the first assembly 600, and in step S300, the intermediate transition body is separated from the first assembly 600 before the unit to obtain a plurality of intermediate transition bodies 40, the manufacturing method of the sensor 100 further includes:
  • step S80b the ASIC chip is mounted on the first PCB board 200, and each first board unit is mounted with an ASIC chip.
  • the manufacturing method of the sensor 100 further includes:
  • step S80c the ASIC chip is mounted on the third PCB board 400, and each second board unit is mounted with an ASIC chip.
  • the second board unit is the top board unit 10a.
  • the manufacturing method of the sensor 100 further includes:
  • step S900 the MEMS sensor chip is mounted on the third PCB board 400, and each second board unit is mounted with a MEMS sensor chip.
  • step S900 and step S80a, or S80b, or S80c are in no particular order.
  • the distance between two adjacent sensor units is greater than or equal to 0.2 mm. It can be understood that if the distance between two adjacent sensor units is too small, it is not conducive to cutting.
  • the distance between two adjacent sensor units is less than or equal to 0.6 mm. It can be understood that if the distance between two adjacent sensor units is too large, the sensor units will be arranged too sparsely, which is not conducive to improving production efficiency and causing waste.
  • the distance between two adjacent sensor units is greater than or equal to 0.28 mm and less than or equal to 0.5 mm.
  • the distance between two adjacent sensor units is greater than or equal to 0.32 mm and less than or equal to 0.4 mm.
  • the distance between two adjacent sensor units may be 0.34 mm, 0.35 mm, 0.36 mm, 0.38 mm, 0.4 mm, etc.
  • the width of the sensor assembly 500 is greater than or equal to 50 mm and less than or equal to 200 mm.
  • the length of the sensor assembly 500 is greater than or equal to 50 mm and less than or equal to 200 mm.
  • the width of the second PCB board 300 is greater than or equal to 50 mm and less than or equal to 200 mm.
  • the length of the second PCB board 300 is greater than or equal to 50 mm and less than or equal to 200 mm.
  • the number of the sensor units is greater than or equal to 150 and less than or equal to 2,400. That is, the number of first board units on the first PCB board 200 is greater than or equal to 150 and less than or equal to 2400, and the number of enclosure units 20a on the second PCB board 300 is greater than or equal to 150 and less than or equal to 2400, and The number of second board units on the three PCB board 400 is greater than or equal to 150 and less than or equal to 2,400.
  • the number of the sensor units is greater than or equal to 300 and less than or equal to 2,000.
  • the number of the sensor units may be 400, 500, 600, 700, 800, 900, 1000, 1200, 1400, 1500, 1600, 1800, etc.
  • the amount of solder paste is greater than or equal to 0.06 grams and less than or equal to 2 grams. It can be understood that if the amount of solder paste is too large, it will not only cause waste, but also easily splash during soldering; if the amount of solder paste is too small, the soldering strength cannot be guaranteed. It can be understood that the amount of solder paste is also affected by the size of the sensor assembly 500 and the arrangement density of the sensor units.
  • the amount of solder paste is greater than or equal to 0.1 g and less than or equal to 1.2 g, such as 0.2 g, 0.3 g, 0.4 g, 0.5 g, 0.6 g, 0.7 g, 0.8 g, 0.9 g, 1 g, 1.1 grams and so on.
  • the overall thickness of the second assembly 700 is less than or equal to 1.5 mm. It can be understood that if the overall thickness of the second assembly 700 is too thick, it is not conducive to the miniaturization of the sensor design.
  • the overall thickness of the second assembly 700 is less than or equal to 1.2 mm.
  • the thickness of the second PCB board is 0.65 ⁇ 0.03mm.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

Procédé de fabrication d'un capteur (100), comprenant : la fourniture d'une première PCB (200) comprenant de multiples premières unités de carte, d'une deuxième PCB (300) comprenant de multiples unités d'environnement de carte, et d'une troisième PCB (400) comprenant de multiples secondes unités de carte, l'une de la première unité de carte et de la seconde unité de carte étant une unité de carte supérieure (10a), et l'autre étant une unité de carte inférieure (30a) ; le montage de la deuxième PCB (300) sur la première PCB (200) de manière à former un premier corps combiné (600) ; la connexion de chaque unité d'environnement de carte (20a) à une première unité de carte, de manière à former de multiples unités de corps de transition intermédiaires sur le premier corps combiné (600) ; la séparation des corps de transition intermédiaires (40) du premier corps combiné (600) ; le montage des corps de transition intermédiaires (40) sur la troisième PCB (400) de manière à former un second corps combiné (700) ; le montage de manière correspondante d'un corps de transition intermédiaire (40) sur chaque seconde unité de carte, de manière à former de multiples unités de capteur sur le second corps combiné (700) ; et la séparation des unités de capteur du second corps combiné (700) de manière à acquérir de multiples capteurs (100).
PCT/CN2021/094169 2020-06-11 2021-05-17 Procédé de fabrication de capteur WO2021249125A1 (fr)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111422825B (zh) * 2020-06-11 2020-09-22 潍坊歌尔微电子有限公司 传感器的制造方法
CN212727420U (zh) * 2020-08-28 2021-03-16 潍坊歌尔微电子有限公司 Mems麦克风和电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007124500A (ja) * 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 音響センサおよび音響センサの製造方法
CN101301993A (zh) * 2007-05-11 2008-11-12 北京大学 一种mems器件真空封装方法
CN101360352A (zh) * 2008-08-27 2009-02-04 歌尔声学股份有限公司 具有屏蔽结构的微型麦克风及其线路板框架的制造方法
KR20140143588A (ko) * 2013-06-07 2014-12-17 (주)파트론 음향 센서 패키지 및 그 제조 방법
CN107108203A (zh) * 2014-11-10 2017-08-29 奥特斯奥地利科技与系统技术有限公司 Mems封装件
CN208581350U (zh) * 2018-07-19 2019-03-05 广西三诺数字科技有限公司 一种麦克风阵列封装
CN208924521U (zh) * 2018-12-18 2019-05-31 歌尔科技有限公司 封装用电路板及mems麦克风
CN111422825A (zh) * 2020-06-11 2020-07-17 潍坊歌尔微电子有限公司 传感器的制造方法
CN111422826A (zh) * 2020-06-11 2020-07-17 潍坊歌尔微电子有限公司 传感器的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102291660A (zh) * 2010-10-12 2011-12-21 歌尔声学股份有限公司 一种微型电容式麦克风
US8735260B2 (en) * 2010-12-13 2014-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method to prevent metal pad damage in wafer level package
KR20130004829A (ko) * 2011-07-04 2013-01-14 삼성디스플레이 주식회사 유기 발광 조명 장치
TW201342497A (zh) * 2012-04-10 2013-10-16 Touch Micro System Tech 封裝結構及封裝方法
WO2015147854A1 (fr) * 2014-03-28 2015-10-01 Intel Corporation Procede et traitement pour interconnexions de puces par pont d'interconnexion incorpore (emib)
KR102434435B1 (ko) * 2015-10-26 2022-08-19 삼성전자주식회사 인쇄회로기판 및 이를 가지는 반도체 패키지
CN118117024A (zh) * 2017-03-21 2024-05-31 Lg 伊诺特有限公司 半导体元件封装和自动聚焦装置
US10276424B2 (en) * 2017-06-30 2019-04-30 Applied Materials, Inc. Method and apparatus for wafer level packaging
CN108598246A (zh) * 2018-07-13 2018-09-28 广东格斯泰气密元件有限公司 一种真空气密封装的smd-uv-led
KR20200051215A (ko) * 2018-11-05 2020-05-13 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 패키지 구조물
KR102679995B1 (ko) * 2018-11-13 2024-07-02 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 패키지 구조물

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007124500A (ja) * 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 音響センサおよび音響センサの製造方法
CN101301993A (zh) * 2007-05-11 2008-11-12 北京大学 一种mems器件真空封装方法
CN101360352A (zh) * 2008-08-27 2009-02-04 歌尔声学股份有限公司 具有屏蔽结构的微型麦克风及其线路板框架的制造方法
KR20140143588A (ko) * 2013-06-07 2014-12-17 (주)파트론 음향 센서 패키지 및 그 제조 방법
CN107108203A (zh) * 2014-11-10 2017-08-29 奥特斯奥地利科技与系统技术有限公司 Mems封装件
CN208581350U (zh) * 2018-07-19 2019-03-05 广西三诺数字科技有限公司 一种麦克风阵列封装
CN208924521U (zh) * 2018-12-18 2019-05-31 歌尔科技有限公司 封装用电路板及mems麦克风
CN111422825A (zh) * 2020-06-11 2020-07-17 潍坊歌尔微电子有限公司 传感器的制造方法
CN111422826A (zh) * 2020-06-11 2020-07-17 潍坊歌尔微电子有限公司 传感器的制造方法

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