WO2021238443A1 - 显示模组和显示装置 - Google Patents

显示模组和显示装置 Download PDF

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Publication number
WO2021238443A1
WO2021238443A1 PCT/CN2021/086177 CN2021086177W WO2021238443A1 WO 2021238443 A1 WO2021238443 A1 WO 2021238443A1 CN 2021086177 W CN2021086177 W CN 2021086177W WO 2021238443 A1 WO2021238443 A1 WO 2021238443A1
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WO
WIPO (PCT)
Prior art keywords
reinforcing plate
pad
display module
display
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/086177
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
白枭
杨盛际
黄冠达
卢鹏程
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to JP2022524217A priority Critical patent/JP7750829B2/ja
Priority to US17/598,232 priority patent/US12219697B2/en
Priority to EP21813156.3A priority patent/EP4036981B1/en
Publication of WO2021238443A1 publication Critical patent/WO2021238443A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display module and a display device.
  • the present disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a display module and a display device.
  • a display module including:
  • a display panel the display panel includes a display area and a binding area, the binding area is located on at least one side of the display area, the display panel includes: a substrate, a driving circuit and a first pad, the driving The circuit and the first pad are both disposed on the substrate, and the first pad is located in the bonding area; the driving circuit is electrically connected to the first pad, and the driving circuit at least includes A transistor located in the display area, the semiconductor layer of the transistor is embedded on the substrate;
  • a flexible circuit board comprising: a flexible substrate, a first wiring layer and a first reinforcement board, the first wiring layer is disposed on the flexible substrate, and the first wiring layer includes a main wiring portion And a second pad, the first reinforcing plate is arranged on a side of the first wiring layer away from the flexible substrate;
  • the orthographic projection of the main wiring portion on the flexible substrate is located within the orthographic projection of the first reinforcing plate on the flexible substrate; the second pad is connected to the main wiring portion , And at least a part of the second pad is electrically connected to the first pad through conductive glue, and the conductive glue includes conductive particles;
  • the first reinforcing plate is located outside the display panel, the first reinforcing plate has a first edge facing the display panel, and the first edge includes: facing the display The curved convex part of the panel and the concave part bent away from the display panel, the concave part and the convex part are alternately arranged in the second direction, forming a wave shape; the first direction is the second welding The direction of the disc away from the display panel, the second direction intersects the first direction.
  • the protruding portion and the recessed portion are both arc-shaped.
  • the radius of the convex portion and the radius of the concave portion are both between 1.0 mm and 1.5 mm.
  • the arc length of a single protruding part and the arc length of a single recessed part are both between 1.0 mm and 1.6 mm.
  • the length of the single protrusion in the second direction and the length of the single recess in the second direction are equal.
  • the distance between any position of the first edge and the display panel is between 200 ⁇ m and 1500 ⁇ m.
  • the flexible circuit board further includes a second reinforcing plate located on a side of the flexible base away from the first wiring layer, and the second reinforcing plate is at least It includes a first reinforcing part, and the orthographic projection of the second pad on the flexible substrate is located within the orthographic projection of the first reinforcing part on the flexible substrate.
  • the second reinforcing plate further includes a second reinforcing part, the second reinforcing part and the first reinforcing part are arranged in sequence in the first direction, and the The orthographic projection of the second reinforcing part on the flexible substrate is located within the orthographic projection of the first reinforcing plate on the flexible substrate.
  • the first reinforcement part and the second reinforcement part of the second reinforcement plate are an integral structure.
  • the size of the second reinforcing part in the first direction is not less than 500 ⁇ m.
  • the flexible circuit board further includes a second wiring layer and a third reinforcing plate, and the second wiring layer is located on a side of the flexible substrate away from the first wiring layer and passes through a via hole. Electrically connected to the main wiring part; the third reinforcing plate is arranged on a side of the second wiring layer away from the flexible substrate;
  • the orthographic projection of the second wiring layer on the flexible substrate is located in the orthographic projection of the first reinforcing plate on the flexible substrate, and the third reinforcing plate is positioned on the flexible substrate. In the orthographic projection.
  • a part of the third reinforcing plate is located on a side of the second wiring layer facing the second reinforcing portion.
  • the conductive adhesive is anisotropic conductive adhesive.
  • the display panel further includes:
  • the light-emitting element located in the display area the light-emitting element is arranged on the side of the driving circuit away from the substrate, and the light-emitting element is electrically connected to the transistor.
  • the embodiment of the present disclosure also provides a display device including the above-mentioned display module.
  • FIG. 1 is a schematic diagram of a display module provided in some embodiments of the present disclosure.
  • FIG. 2 is a schematic diagram of a display panel provided in some embodiments of the present disclosure.
  • FIG. 3 is a bottom view of a flexible circuit board provided in some embodiments of the disclosure.
  • Fig. 4 is an enlarged view of area I in Fig. 3.
  • Fig. 5 is a cross-sectional view taken along line AA' in Fig. 4;
  • FIG. 6 is a schematic diagram of the connection between the flexible circuit board and the display panel provided in some embodiments of the present disclosure.
  • Fig. 7 is a bottom view of a partial area of a flexible circuit board provided in a pair of scales.
  • FIG. 8 is a schematic diagram of the connection between the flexible circuit board and the display panel in a pair of scales.
  • FIG. 1 is a schematic diagram of a display module provided in some embodiments of the present disclosure.
  • the display module includes a display panel and a flexible circuit board.
  • 2 is a schematic diagram of a display panel provided in some embodiments of the present disclosure.
  • the display panel 10 includes a display area 10a and a binding area 10b located on at least one side of the display area 10a.
  • the display panel 10 includes a substrate 102, a driving circuit, and a first pad 101, and the driving circuit and the first pad 101 are both disposed on the substrate 102.
  • the first pad 101 is located in the bonding area 10b, the first pad 101 may be a single-layer or multi-layer structure, and the first pad 101 may be made of materials such as metal or alloy, for example: A metal single-layer or multi-layer structure formed of copper, molybdenum, aluminum, titanium, etc., but not limited to this, the first pad 101 can also be made of other conductive materials.
  • the first pad 101 is usually used for bonding with an external element (for example, the flexible circuit board 20) after the device in the display area 10a is completed, so as to provide a signal for the display panel 10.
  • the number of first pads is multiple, each first pad may be elongated, the length direction of the first pad may be along the first direction (the X direction in FIG. 1 and FIG. 2), and there are multiple
  • the first pads are arranged along a second direction (the Y direction in FIGS. 1 and 2) that crosses the first direction, for example, the second direction is perpendicular to the first direction.
  • the substrate 102 is a silicon-based substrate, and the silicon substrate is, for example, single crystal silicon or high-purity silicon.
  • the driving circuit may be formed on the substrate 102 so that it is integrally formed as the driving substrate 105. It should be understood that the driving circuit may include a circuit structure located in the display area 10a, and may also include a circuit structure located in the binding area 10b. The driving circuit may be electrically connected to the first bonding pad 101 of the bonding area 10 b, and the first bonding pad 101 is bonded to the second bonding pad 202 a of the flexible circuit board 20 to provide a signal for the display panel 10.
  • the driving circuit may include at least a pixel circuit located in the display area 10a, the pixel circuit includes a plurality of transistors 103, and the pixel circuit may be formed on a silicon substrate by a semiconductor process, for example: a doping process on the silicon substrate.
  • the semiconductor layer 1031 (that is, the active layer), the source electrode 1032 and the drain electrode 1033 of the transistor 103 are formed thereon, and the insulating layer 1034 is formed by a silicon oxidation process, and the gate electrode 1035 and a plurality of conductive materials are formed by a sputtering process or other processes. Layers 106, 107, etc.
  • the semiconductor layer 1031 of the transistor 103 is embedded on the substrate 102; that is, when the substrate 102 is a silicon substrate, the semiconductor layer 1031 may belong to a part of the silicon substrate.
  • the driving circuit may further include a gate driving circuit and a data driving circuit, and the data driving circuit and the gate driving circuit are connected to the pixel circuit in the display area 10a to provide electrical signals for the pixel circuit.
  • the data driving circuit is used to provide data signals
  • the gate driving circuit is used to provide scan signals, and can also be further used to provide various control signals, power signals, and the like.
  • the gate driving circuit and the data driving circuit can also be integrated in the silicon substrate through the above-mentioned semiconductor process.
  • a silicon substrate is used as the substrate 102 in the display panel 10, and the pixel circuit, the gate driving circuit, and the data driving circuit can all be integrated on the silicon substrate.
  • the gate drive circuit and the data drive circuit can also be arranged in the area corresponding to the display area 10a of the display panel 10, and not necessarily located in the non-display area. District 10b.
  • the display panel may further include a plurality of light-emitting elements, such as organic light-emitting diodes (OLED) or micro-light-emitting diodes (Micro/Mini OLED).
  • OLED organic light-emitting diodes
  • Micro/Mini OLED micro-light-emitting diodes
  • the light-emitting element 104 is arranged on the side of the driving circuit away from the substrate 102 and located in the display area 10a, and the light-emitting element 104 can be electrically connected to the transistor 103 in the pixel circuit.
  • the light-emitting element 104 may include an anode 1041, a light-emitting layer 1042, and a cathode 1043 sequentially formed on the driving substrate 105.
  • the anode 1041 may pass through a contact hole 108 filled with a conductive material (such as metal tungsten, etc.) and a plurality of conductive layers 106 , 107 and the drain electrode 1033 in the transistor 103 are electrically connected.
  • the anodes 1041 of the multiple light-emitting elements 104 are spaced apart from each other, and the cathodes 1043 of the multiple light-emitting elements 104 can be formed as a whole layer of film.
  • a pixel defining part (PDL) may be provided between adjacent anodes 1041, or a pixel defining part (PDL) may not be provided, depending on the specific situation.
  • the first pad 101 on the substrate 102 can be arranged in the same layer as the conductive structure in the display area 10a to save process.
  • the first pad 101 may be provided in the same layer as the conductive layer 107 of the topmost layer (farthest away from the substrate 102) below the light-emitting element 104 in the display area 10a.
  • the conductive layer 107 is reflective, for example, a laminated structure of titanium/titanium nitride/aluminum.
  • the conductive layer 107 includes a plurality of sub-layers arranged at intervals, which are respectively arranged in a one-to-one correspondence with the anode 1041 of each light-emitting element 104.
  • the conductive layer 107 can be set as a reflective layer for reflecting the light emitted by the light-emitting element 104 and improving the light extraction efficiency.
  • the orthographic projection of the anode 1041 of each light-emitting element 104 on the substrate 102 falls within the orthographic projection of the portion of the corresponding conductive layer on the substrate 102.
  • the anode 1041 may use a transparent conductive oxide material with a high work function, such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and the like.
  • the display panel 10 further includes an encapsulation layer 109, a color film layer 110, a cover 111, etc. on the side of the light-emitting element 104 away from the substrate 102.
  • the first encapsulation layer 109 is configured to seal the light-emitting element 104 to prevent external moisture and oxygen from penetrating the light-emitting element 104 and the pixel circuit and causing damage to the device.
  • the first encapsulation layer 109 includes an inorganic thin film or a structure in which organic thin films and inorganic thin films are alternately stacked.
  • the color film layer 110 may include color blocks such as R (red), G (green), and B (blue).
  • the cover 111 is, for example, a glass cover. Wherein, an encapsulation layer 109 can also be provided between the color filter layer 110 and the cover plate 111 to encapsulate the color filter layer 110.
  • FIG. 3 is a bottom view of a flexible circuit board provided in some embodiments of the present disclosure
  • FIG. 4 is an enlarged view of area I in FIG. 3
  • FIG. 5 is a cross-sectional view along line AA' in FIG. 4
  • FIG. 6 is a view of the present disclosure
  • the schematic diagram of the connection between the flexible circuit board and the display panel provided in some embodiments is shown in conjunction with FIG. 3 to FIG.
  • the first wiring layer is disposed on the flexible substrate 201, the first wiring layer may include a main wiring portion 202b and a second pad 202a, and the first reinforcing plate 203 is disposed on a side of the first wiring layer away from the flexible substrate 201.
  • the orthographic projection of the main wiring portion 202b on the flexible substrate 201 is located within the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201, and the first reinforcing plate 203 can be opposed to the main wiring portion 202b on the flexible circuit board 20. It has a protective effect, and in addition, it can also ensure the structural stability of the flexible circuit board 20, which facilitates the overall assembly of the product.
  • the number of the second pads 202a is multiple, and they are connected to the first pads 101 in a one-to-one correspondence (for example, connected by pressure bonding), and the length direction of each second pad 202a is the same as that of the first pad.
  • the length direction of the pad 101 may be the same, for example, extending along the X direction in FIGS. 1 and 3.
  • the second pad 202a is connected to the main wiring portion 202b, and at least a part of the second pad 202a is electrically connected to the first pad 101 through conductive glue, where the conductive glue includes conductive particles 30.
  • the conductive particles 30 are doped in colloid.
  • the second pad 202a includes a first connection portion 202a1 and a second connection portion 202a2 arranged along its length.
  • the first connection portion 202a1 is connected to the main wiring portion 202b, and the second connection portion 202a2 It is electrically connected to the first pad 101. It should be noted that FIG.
  • the first reinforcing plate 203 can be made to cover the part of the first connecting portion 202a1 close to the main wiring portion 202b, so as to avoid the main wiring portion 202b and the second The contact portion of the pad 202a is exposed.
  • the flexible substrate 201 and the first reinforcing plate 203 of the flexible circuit board 20 may have a single-layer structure or a multilayer structure; and the flexible substrate 201 and the first reinforcing plate 203 may adopt PI (poly (Imide) and other materials.
  • the first wiring layer can be made of materials such as Al (aluminum) or Cu (copper).
  • the thickness of the first reinforcing plate 203 may be greater than the thickness of the second pad 202a.
  • an anti-oxidation film layer with good conductivity such as a gold (Au) material film
  • Au gold
  • the conductive adhesive may be an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the anisotropic conductive film uses conductive particles 30 to connect the second pad 202a of the flexible circuit board 20 to the display
  • the first pad 101 of the panel 10 is bound to electrically conduct the flexible circuit board 20 and the display panel 10.
  • the anisotropic conductive glue is only conducted in the thickness direction of the flexible substrate 201, Therefore, it is possible to avoid short circuits between adjacent pads in the horizontal direction, so as to ensure the stability of the electrical connection between the flexible circuit board 20 and the display panel 10.
  • the anisotropic conductive adhesive is only conductive in the thickness direction of the flexible substrate 201, in the process of realizing the binding of multiple pairs of the first pad 101 and the second pad 202a, the anisotropy can be set on the entire surface. Conductive glue to reduce the difficulty of binding.
  • the first reinforcing plate 203 is located outside the display panel 10 in the first direction.
  • the first reinforcing plate 203 has a first edge facing the display panel 10.
  • the first direction is the length direction of the first pad 101, that is, the direction in which the second pad 202a is away from the display panel 10.
  • the first edge facing the display panel 10 means that the first edge E1 is an edge close to the display panel 10, and the overall direction of the first edge E1 is along the second direction.
  • FIG. 7 is a top view of a partial area of a flexible circuit board provided in a pair of scales
  • FIG. 8 is a schematic diagram of a connection between the flexible circuit board and a display panel in a pair of scales.
  • FIG. 7 shows an area of the same size as in FIG. 4, as shown in FIG. 7, in the comparative example, the first reinforcing plate 203 An edge E1 is straight. At this time, as shown in FIG.
  • the first edge E1 may be set to be wavy.
  • the first edge E1 includes: The curved protrusions E11 of the display panel 10 and the recesses E12 curved away from the display panel 10, the protrusions E11 and the recesses E12 are alternately arranged in the second direction, forming a wave shape.
  • the first edge E1 is set to be wavy, which can increase the length of the first edge E1. Therefore, when the conductive particles 30 in the conductive adhesive are discharged outward under the pressing force, It can be dispersed along the first edge E1, thereby reducing or preventing the accumulation of conductive particles, and improving the reliability of the flexible circuit board.
  • the protrusions E11 and the recesses E12 are both smooth patterns to prevent the conductive particles 30 from accumulating at a certain position of the protrusions E11 and the recesses E12, for example, the protrusions E11 and the recesses E12.
  • E12 are all arc-shaped, so that the conductive particles in the conductive adhesive can be evenly dispersed along the protrusion E11 and the recess E12.
  • the radius of the convex portion E11 and the radius of the concave portion E12 are both between 1.0 mm and 1.5 mm, for example, the radius of the convex portion E11 and the radius of the concave portion E12 are both 1.3 mm.
  • the radius of the protrusion E11 (or recess) refers to the radius of the circle where the arc protrusion E12 (or recess) is located.
  • the length of the single protrusion E11 in the second direction and the length of the single recess E12 in the second direction are equal. It is understandable that when the length of the convex portion E11 in the second direction and the length of the concave portion E12 in the second direction are equal, and the radius of the convex portion E11 and the radius of the concave portion E12 are also equal, a single convex The arc length of the portion E11 is equal to the arc length of the single recessed portion E12, which is more favorable for the conductive particles 30 to be uniformly dispersed along the first edge E1.
  • the connecting lines of the plurality of second pads 202a close to one end of the first reinforcing plate 203 may have substantially the same shape as the first edge E1.
  • one end of the plurality of second pads 202a close to the main wiring portion 202b is aligned with the first reinforcing plate 203, or a portion of each second pad 202a close to the main wiring portion 202b is covered by the first reinforcing plate 203
  • the length of each second pad 202a covered by the first reinforcing plate 203 is equal.
  • any position of the first edge E1 of the first reinforcing plate 203 and the display panel 10 that is, any position of the first edge E1 of the first reinforcing plate 203 will not be with
  • the display panel 10 is in contact, so as to ensure that part of the conductive particles 30 can be smoothly discharged to the space between the first edge E1 and the first reinforcing plate 203 when pressed together, and are dispersed along the wavy edge to further ensure the flexible circuit The reliability of the board 20.
  • the interval H1 between any position of the first edge E1 and the display panel 10 is between 200 ⁇ m and 1500 ⁇ m.
  • glue is applied to the space between the first edge E1 of the first reinforcing plate 203 and the display panel 10, so that the first The wiring layer is covered by the exposed part of the first reinforcing plate 203.
  • the interval between the first edge E1 and the display panel 203 can be set according to the width of the glue head.
  • the width of the glue applicator head of the glue applicator is 1000 ⁇ m
  • the closest distance between the protrusion E11 of the first edge E1 and the display panel 10 is at least 200 ⁇ m to prevent the conductive particles 30 in the conductive glue from accumulating
  • the farthest distance between the recessed portion E12 of one edge E1 and the display panel does not exceed 1000 ⁇ m, so as to ensure that when the glue applicator applies glue to the gap area between the first edge E1 and the display panel 10, the glue can remove the first wiring layer by the first wiring layer.
  • a reinforcing plate 203 covers the exposed part.
  • the flexible circuit board 20 further includes a second reinforcing plate 204, and the second reinforcing plate 204 can be made of materials such as PI (polyimide).
  • the second reinforcing plate 204 is located on the side of the flexible substrate 201 away from the first wiring layer.
  • the second reinforcing plate 204 includes at least a first reinforcing portion 204a.
  • the orthographic projection of the second pad 202a on the flexible substrate 201 is located on the first A reinforcing portion 204a is in the orthographic projection on the flexible substrate 201, and this design can increase the structural strength of the area where the second pad 202a is provided in the flexible circuit board 20.
  • the second reinforcing plate 204 further includes a second reinforcing portion 204b.
  • the second reinforcing portion 204b and the first reinforcing portion 204a are arranged in sequence in the first direction, and the second reinforcing portion 204b is flexible
  • the orthographic projection on the substrate 201 is located within the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201.
  • a part of the second reinforcing plate 204 can also extend to the area where the main wiring portion 202b is provided in the flexible circuit board 20, and the part of the second reinforcing plate 204 that extends to the area where the main wiring portion 202b is located is the first Two reinforcement part 204.
  • the dimension H2 of the second reinforcing portion 204b in the first direction is not less than 500 ⁇ m, so as to further prevent the problem that the connection between the second pad 202a and the second pad 202a and the main wiring portion 202b is prone to breakage , To ensure the structural stability of the flexible circuit board 20 during the binding process.
  • the edge of the second reinforcing portion 204b away from the first reinforcing portion 203 may be linear, and since the first edge E1 of the first reinforcing plate 203 is not linear, the second reinforcing portion The width at different positions of 204b is different.
  • the above-mentioned “H2 is not less than 500 ⁇ m” means that the minimum width of the overlapping portion of the second reinforcing plate 204 and the first reinforcing plate 203 in the thickness direction of the flexible substrate 201 is not less than 500 ⁇ m.
  • the flexible circuit board 20 further includes a second wiring layer 205 and a third reinforcing plate 206, the second wiring layer 205 is located on the side of the flexible substrate 201 away from the first wiring layer, and The via 207 is electrically connected to the main wiring portion 202b, and the second wiring layer 205 can be made of materials such as Al (aluminum) or Cu (copper).
  • the third reinforcing plate 206 is arranged on the side of the second wiring layer 205 away from the flexible substrate 201.
  • the third reinforcing plate 206 can be made of materials such as PI (polyimide); among them, the second wiring layer 205 is The orthographic projection on the flexible substrate 201 is located in the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201 and in the orthographic projection of the third reinforcing plate 206 on the flexible substrate 201.
  • the flexible circuit board 20 is provided with two wiring layers to facilitate wiring, and the third reinforcing plate 206 can protect the second wiring layer 205, and in addition, the flexible circuit can be strengthened. The structural strength of the board 20.
  • the flexible circuit board 20 can not only be provided with two wiring layers, but also can be provided with more layers according to actual needs, such as three layers, four layers, etc., which are not specifically limited here.
  • multiple via holes 207 for connecting the first wiring layer and the second wiring layer 205 may be provided to ensure the stability of the connection between the first wiring layer and the second wiring layer 205.
  • the width of the interval 208 may be determined according to actual needs, and the embodiment of the present disclosure does not specifically limit it here.
  • a part of the third reinforcing plate 206 is located on the side of the second wiring layer 205 facing the second reinforcing portion 204b, so as to cover the end of the second wiring layer 205 close to the second reinforcing portion 204b to avoid
  • the second wiring layer 205 is oxidized, so as to ensure that the second wiring layer 205 has good conductivity; at the same time, it can also prevent the second wiring layer 205 from accidentally touching other conductive components at the interval 208.
  • the second reinforcing portion 204b and the first reinforcing portion 204a of the second reinforcing plate 204 may be an integral structure, which is beneficial to simplify the manufacturing process.
  • a full-surface film layer can be made on the side of the flexible substrate 201 away from the first circuit layer, and then cut at the position of the entire surface film layer corresponding to the interval 208 Or etch to form the second reinforcing plate 204 and the third reinforcing plate 206 that are disconnected from each other.
  • the manufacturing process of the second reinforcing plate 204 and the third reinforcing plate 206 is not limited to this, and the two can also be formed independently, depending on the specific situation.
  • An embodiment of the present disclosure also provides a display device, which includes the display module described in any of the foregoing embodiments.
  • the specific type of the display device is not particularly limited.
  • the types of display devices commonly used in this field can be used, such as display screens, mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc., according to those skilled in the art
  • the specific purpose of the display device is selected accordingly, which will not be repeated here.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
PCT/CN2021/086177 2020-05-25 2021-04-09 显示模组和显示装置 Ceased WO2021238443A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022524217A JP7750829B2 (ja) 2020-05-25 2021-04-09 表示モジュール及び表示装置
US17/598,232 US12219697B2 (en) 2020-05-25 2021-04-09 Display assembly and display device each including flexible circuit board with reinforcement plate having wave shaped edge
EP21813156.3A EP4036981B1 (en) 2020-05-25 2021-04-09 Display module and display apparatus

Applications Claiming Priority (2)

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CN202010452026.5A CN113725379B (zh) 2020-05-25 2020-05-25 显示模组和显示装置
CN202010452026.5 2020-05-25

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CN114423182B (zh) * 2022-02-25 2024-10-01 京东方科技集团股份有限公司 柔性电路板及其制造方法
CN115201783A (zh) * 2022-07-21 2022-10-18 嘉兴敏惠汽车零部件有限公司 一种激光雷达罩电路连接改进结构及其制作方法
CN117523988A (zh) * 2022-07-27 2024-02-06 成都辰显光电有限公司 显示模组及其制造方法、驱动模组、显示屏及拼接屏
CN115472654B (zh) * 2022-08-31 2025-04-29 武汉华星光电半导体显示技术有限公司 显示装置及其制作方法
CN115938231A (zh) * 2022-11-30 2023-04-07 京东方科技集团股份有限公司 显示模组及显示装置
CN115915855A (zh) * 2023-01-12 2023-04-04 京东方科技集团股份有限公司 显示模组及显示装置
CN117746741A (zh) * 2023-12-25 2024-03-22 厦门天马微电子有限公司 一种显示模组及显示装置
CN119340582A (zh) * 2024-09-19 2025-01-21 东莞新能德科技有限公司 电池及用电设备
CN120076158B (zh) * 2025-02-26 2026-04-03 昆山国显光电有限公司 显示面板、显示面板的制备方法及显示模组

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EP4036981A1 (en) 2022-08-03
EP4036981A4 (en) 2023-05-10
CN113725379A (zh) 2021-11-30
EP4036981B1 (en) 2026-01-28
JP2023527600A (ja) 2023-06-30
US20220322524A1 (en) 2022-10-06
JP7750829B2 (ja) 2025-10-07
CN113725379B (zh) 2022-12-09
US12219697B2 (en) 2025-02-04

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