JP7750829B2 - 表示モジュール及び表示装置 - Google Patents

表示モジュール及び表示装置

Info

Publication number
JP7750829B2
JP7750829B2 JP2022524217A JP2022524217A JP7750829B2 JP 7750829 B2 JP7750829 B2 JP 7750829B2 JP 2022524217 A JP2022524217 A JP 2022524217A JP 2022524217 A JP2022524217 A JP 2022524217A JP 7750829 B2 JP7750829 B2 JP 7750829B2
Authority
JP
Japan
Prior art keywords
reinforcing plate
reinforcing
display panel
flexible substrate
display module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022524217A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023527600A (ja
JP2023527600A5 (https=
JPWO2021238443A5 (https=
Inventor
▲梟▼ 白
盛▲際▼ ▲楊▼
冠▲達▼ 黄
▲鵬▼程 ▲盧▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of JP2023527600A publication Critical patent/JP2023527600A/ja
Publication of JP2023527600A5 publication Critical patent/JP2023527600A5/ja
Publication of JPWO2021238443A5 publication Critical patent/JPWO2021238443A5/ja
Application granted granted Critical
Publication of JP7750829B2 publication Critical patent/JP7750829B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
JP2022524217A 2020-05-25 2021-04-09 表示モジュール及び表示装置 Active JP7750829B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202010452026.5A CN113725379B (zh) 2020-05-25 2020-05-25 显示模组和显示装置
CN202010452026.5 2020-05-25
PCT/CN2021/086177 WO2021238443A1 (zh) 2020-05-25 2021-04-09 显示模组和显示装置

Publications (4)

Publication Number Publication Date
JP2023527600A JP2023527600A (ja) 2023-06-30
JP2023527600A5 JP2023527600A5 (https=) 2024-04-12
JPWO2021238443A5 JPWO2021238443A5 (https=) 2024-04-12
JP7750829B2 true JP7750829B2 (ja) 2025-10-07

Family

ID=78671249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524217A Active JP7750829B2 (ja) 2020-05-25 2021-04-09 表示モジュール及び表示装置

Country Status (5)

Country Link
US (1) US12219697B2 (https=)
EP (1) EP4036981B1 (https=)
JP (1) JP7750829B2 (https=)
CN (1) CN113725379B (https=)
WO (1) WO2021238443A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021189493A1 (zh) * 2020-03-27 2021-09-30 京东方科技集团股份有限公司 显示模组及显示装置
CN114423182B (zh) * 2022-02-25 2024-10-01 京东方科技集团股份有限公司 柔性电路板及其制造方法
CN115201783A (zh) * 2022-07-21 2022-10-18 嘉兴敏惠汽车零部件有限公司 一种激光雷达罩电路连接改进结构及其制作方法
CN117523988A (zh) * 2022-07-27 2024-02-06 成都辰显光电有限公司 显示模组及其制造方法、驱动模组、显示屏及拼接屏
CN115472654B (zh) * 2022-08-31 2025-04-29 武汉华星光电半导体显示技术有限公司 显示装置及其制作方法
CN115938231A (zh) * 2022-11-30 2023-04-07 京东方科技集团股份有限公司 显示模组及显示装置
CN115915855A (zh) * 2023-01-12 2023-04-04 京东方科技集团股份有限公司 显示模组及显示装置
CN117746741A (zh) * 2023-12-25 2024-03-22 厦门天马微电子有限公司 一种显示模组及显示装置
CN119340582A (zh) * 2024-09-19 2025-01-21 东莞新能德科技有限公司 电池及用电设备
CN120076158B (zh) * 2025-02-26 2026-04-03 昆山国显光电有限公司 显示面板、显示面板的制备方法及显示模组

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133677A (ja) 2001-10-29 2003-05-09 Advanced Display Inc フレキシブル回路基板の圧着構造
JP2005311106A (ja) 2004-04-22 2005-11-04 Nitto Denko Corp 配線回路基板
JP2014132299A (ja) 2013-01-07 2014-07-17 Japan Display Inc 表示装置
JP2014160762A (ja) 2013-02-20 2014-09-04 Seiko Epson Corp 半導体装置及び電子機器
CN105242802A (zh) 2014-07-09 2016-01-13 宸鸿科技(厦门)有限公司 触控模块及其可挠性电路板
US20170135217A1 (en) 2015-11-11 2017-05-11 Kabushiki Kaisha Toshiba Flexibile printed circuit and electronic device
CN206212421U (zh) 2016-11-30 2017-05-31 无锡村田电子有限公司 柔性电路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4156476B2 (ja) 2003-09-04 2008-09-24 株式会社 日立ディスプレイズ 液晶表示装置
CN101056512B (zh) * 2007-06-06 2010-09-22 友达光电股份有限公司 具有电路板的装置
JP2014194517A (ja) * 2013-02-27 2014-10-09 Sony Corp 表示装置、表示装置の製造方法、表示装置の駆動方法および電子機器
JP6171778B2 (ja) * 2013-09-19 2017-08-02 三菱電機株式会社 表示装置
KR101893503B1 (ko) * 2016-05-27 2018-08-30 (주) 화인켐 미세배선용 연성 회로 기판 및 이의 제조방법
CN110825268B (zh) 2019-11-12 2022-12-02 业成科技（成都）有限公司 触控模组、触控显示装置及电子设备
CN212660364U (zh) 2020-06-22 2021-03-05 欧菲微电子技术有限公司 柔性电路板、显示模组及电子设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133677A (ja) 2001-10-29 2003-05-09 Advanced Display Inc フレキシブル回路基板の圧着構造
JP2005311106A (ja) 2004-04-22 2005-11-04 Nitto Denko Corp 配線回路基板
JP2014132299A (ja) 2013-01-07 2014-07-17 Japan Display Inc 表示装置
JP2014160762A (ja) 2013-02-20 2014-09-04 Seiko Epson Corp 半導体装置及び電子機器
CN105242802A (zh) 2014-07-09 2016-01-13 宸鸿科技(厦门)有限公司 触控模块及其可挠性电路板
US20170135217A1 (en) 2015-11-11 2017-05-11 Kabushiki Kaisha Toshiba Flexibile printed circuit and electronic device
CN206212421U (zh) 2016-11-30 2017-05-31 无锡村田电子有限公司 柔性电路板

Also Published As

Publication number Publication date
EP4036981A1 (en) 2022-08-03
EP4036981A4 (en) 2023-05-10
CN113725379A (zh) 2021-11-30
EP4036981B1 (en) 2026-01-28
JP2023527600A (ja) 2023-06-30
WO2021238443A1 (zh) 2021-12-02
US20220322524A1 (en) 2022-10-06
CN113725379B (zh) 2022-12-09
US12219697B2 (en) 2025-02-04

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