WO2021235201A1 - 品質変化検知方法、品質変化検知システム、及びプログラム - Google Patents

品質変化検知方法、品質変化検知システム、及びプログラム Download PDF

Info

Publication number
WO2021235201A1
WO2021235201A1 PCT/JP2021/016814 JP2021016814W WO2021235201A1 WO 2021235201 A1 WO2021235201 A1 WO 2021235201A1 JP 2021016814 W JP2021016814 W JP 2021016814W WO 2021235201 A1 WO2021235201 A1 WO 2021235201A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
quality
change detection
determination
mounting position
Prior art date
Application number
PCT/JP2021/016814
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
アレックス ヴァルディヴィエルソ
謙太 中村
昌弘 谷口
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2022524357A priority Critical patent/JPWO2021235201A1/ja
Publication of WO2021235201A1 publication Critical patent/WO2021235201A1/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • This disclosure generally relates to quality change detection methods, quality change detection systems, and programs.
  • Patent Document 1 describes a mounted component inspection device for inspecting a mounted state of a component on a printed circuit board.
  • the mounted component inspection device described in Patent Document 1 detects a component mounting defect based on an image of a component mounting position on a printed circuit board.
  • An object of the present disclosure is to provide a quality change detection method, a quality change detection system, and a program that can prevent the occurrence of mounting defects of the second object with respect to the first object.
  • the quality change detection method includes an acquisition step and a first determination step.
  • the acquisition step is a step of acquiring the amount of mounting position deviation, which is the difference between the actual mounting position of the second object and the target mounting position with respect to the first object.
  • the first determination step is a step of determining that the quality of mounting has changed when the mounting position deviation amount acquired in the acquisition step exceeds the first determination range and falls within the second determination range. Is.
  • the first determination range is included in the second determination range in which the quality of the implementation is determined to be normal.
  • the quality change detection system includes an acquisition unit and a determination unit.
  • the acquisition unit acquires the amount of mounting position deviation, which is the difference between the actual mounting position of the second object and the target mounting position with respect to the first object.
  • the determination unit determines that the quality of the mounting has changed when the mounting position deviation amount acquired by the acquisition unit exceeds the first determination range and falls within the second determination range.
  • the first determination range is included in the second determination range in which the quality of the implementation is determined to be normal.
  • the program according to one aspect of the present disclosure is a program for causing one or more processors to execute the quality change detection method.
  • FIG. 1 is a schematic configuration diagram of a substrate manufacturing line to which the quality change detection system according to the embodiment is applied.
  • FIG. 2 is a schematic plan view of the mounting system that is the detection target of the same quality change detection system.
  • FIG. 3 is a sectional view taken along the line AA of FIG.
  • FIG. 4 is a block diagram of the same quality change detection system.
  • FIG. 5 is a block diagram of the mounting system that is the detection target of the same quality change detection system.
  • FIG. 6A is a diagram showing the distribution of mounting positions of the second object with respect to the first object generated by the same quality change detection system.
  • FIG. 6B is a diagram showing the distribution of the mounting position of the second object with respect to the first object for each mounting angle of the second object with respect to the first object, which was generated by the same quality change detection system.
  • FIG. 7 is a graph showing the amount of mounting position deviation of the second object with respect to the first object, which is generated by the same quality change detection system, and is a second graph which is not normally mounted on the first object. It is a graph when the object is included.
  • FIG. 8 is an explanatory diagram for explaining the first detection process of the same quality change detection system.
  • 9A to 9C are graphs for explaining the second detection process of the same quality change detection system.
  • FIG. 10 is a flowchart showing a quality change detection method executed by the same quality change detection system.
  • each of the figures described in the following embodiments and the like is a schematic view, and the ratio of the size and the thickness of each component in each figure does not necessarily reflect the actual dimensional ratio. Not always.
  • the mounted component inspection device (quality change detection system) described in Patent Document 1 can detect the occurrence of a mounting defect of a component (second object) on a printed circuit board (first object), but the mounting defect is not present. The outbreak could not be prevented.
  • the quality change detection method is a method for detecting that the quality of processing for the first object T1 has changed.
  • the quality change detection system 1 according to the present embodiment is a system used in the above-mentioned quality change detection method.
  • the second object T2 is mounted (processed) on the first object T1 in the mounting system 22.
  • the mounting system 22 is used for the production of various products such as electronic devices, automobiles, clothing, groceries, pharmaceuticals and crafts in facilities such as factories, laboratories, offices and educational facilities. It is a mounting device (mounting machine) to be mounted.
  • a general electronic device has various circuit boards such as a power supply circuit and a control circuit, for example.
  • a soldering step, a mounting step, and a reflow step are performed in this order.
  • creamy solder is applied (or printed) to the substrate (including the printed wiring board).
  • components including electronic components
  • the substrate in which the parts are mounted is heated in a reflow furnace to melt the creamy solder and perform soldering.
  • first to third inspection steps are performed between the solder coating process and the mounting process, between the mounting process and the reflow process, and after the reflow process.
  • first inspection step the state of application of the cream-like solder to the substrate (position, size, film thickness, etc. of the cream-like solder with respect to the substrate) is inspected.
  • second inspection step the mounting state of the second object T2 on the first object T1 (mounting position, mounting angle, etc. of the second object T2 on the first object T1) before the reflow step is performed is inspected.
  • the mounting state of the second object T2 on the first object T1 after the reflow step is performed (the mounting position, mounting angle, etc. of the second object T2 on the first object T1) is inspected. Will be done.
  • the board manufacturing line 2 includes a printing system 21, a mounting system 22, a reflow system 23, a post-printing inspection system 24, a post-mounting inspection system 25, and a post-reflow inspection system 26.
  • the printing system 21 prints solder on the substrate 100 as the first object T1 in the solder coating process.
  • the mounting system 22 performs work of mounting the component 200 as the second object T2 on the substrate 100 as the first object T1.
  • the reflow system 23 heats the substrate 100 on which the component 200 is mounted via solder, melts the solder, and solders the component 200 to the substrate 100.
  • the post-print inspection system 24 (see FIG. 1) inspects the printed state of the solder printed on the substrate 100, which is the first object T1, in the first inspection step.
  • the post-mounting inspection system 25 (see FIG. 1) inspects the mounting state of the second object T2 with respect to the first object T1 in the second inspection step.
  • the post-reflow inspection system 26 (see FIG. 1) inspects the mounting state of the second object T2 with respect to the first object T1 after reflow in the third inspection step.
  • Each facility constituting the board manufacturing line 2 is connected to the quality change detection system 1 via a wired or wireless communication network, and data is transmitted / received between each facility and the quality change detection system 1.
  • each of the printing system 21, the mounting system 22, the reflow system 23, the post-printing inspection system 24, the post-mounting inspection system 25, and the post-reflow inspection system 26, in principle, refer to a single device. It also includes a configuration in which a control unit and a storage unit of the device are arranged outside the device, or a configuration in which the functions of the device are realized by combining a plurality of modules. It also includes a configuration in which a plurality of devices of the same type are grouped together.
  • the quality change detection system 1 detects that the quality of the first object T1 manufactured on the substrate manufacturing line 2 (see FIG. 1) has changed based on the first information D1.
  • the first information D1 is information acquired in the second inspection step, and is input from the post-mounting inspection system 25 described later.
  • the quality change detection method is for detecting that the quality of mounting when the second object T2 is mounted on the first object T1 performed in the mounting process has changed.
  • the mounting quality control method includes an acquisition step and a first determination step (steps ST1 to ST3 in FIG. 10).
  • the acquisition step is based on the amount of mounting position deviation, which is the difference between the actual mounting position of the second object T2 and the target mounting position with respect to the first object T1, included in the first information D1 from the post-mounting inspection system 25.
  • This is a step of acquiring data related to the component 200 to be detected.
  • the acquired data is grouped by the type of parts or the mounting angle as an example.
  • the first determination step is mounted when the amount of mounting position deviation acquired in the acquisition step exceeds the first determination range R1 (see FIG. 7) and falls within the second determination range R2 (see FIG. 7). This is the step of determining that the quality of the product has changed.
  • the second determination range R2 is a range in which the quality of mounting is determined to be normal.
  • the quality change detection system 1 is a system used in the above-mentioned quality change detection method.
  • the quality change detection system 1 includes an acquisition unit 11 and a determination unit 12.
  • the acquisition unit 11 is a mounting which is the difference between the actual mounting position of the second object T2 and the target mounting position on the first object T1 which has undergone the mounting step of mounting the second object T2 on the first object T1. Acquire the amount of misalignment.
  • the determination unit 12 is mounted when the amount of mounting position deviation acquired by the acquisition unit 11 exceeds the first determination range R1 (see FIG. 7) and falls within the second determination range R2 (see FIG. 7). It is judged that the quality of is changed.
  • the second determination range R2 is a range in which the quality of mounting is determined to be normal.
  • normal mounting quality means that at least the range determined to be normal in the post-mounting inspection system 25 that outputs information to the quality change detection system 1 is satisfied.
  • the mounting position deviation amount falls within the second judgment range R2 in which the mounting quality is judged to be normal, it exceeds the first judgment range R1. If so, it is determined that the quality of the implementation has changed. Therefore, before the mounting position deviation amount exceeds the second determination range R2, it can be grasped that the mounting quality has changed in the direction of becoming abnormal (defective). As a result, it is possible to prevent the occurrence of mounting defects of the second object T2 with respect to the first object T1.
  • the mounting system 22 is used for mounting a component (second object T2) by surface mount technology (SMT)
  • SMT surface mount technology
  • the component 200 as the second object T2 is a surface mount device (SMD) and is arranged on the surface (mounting surface 101) of the substrate 100 as the first object T1. It will be implemented with that.
  • the present invention is not limited to this example, and the mounting system 22 may be used for mounting a component (second object T2) by an insertion mounting technology (IMT: Insertion Mount Technology).
  • the component 200 as the second object T2 is a component for insertion mounting having a lead terminal, and by inserting the lead terminal into the hole of the substrate 100 as the first object T1, the substrate 100 It is mounted on the surface (mounting surface 101) of.
  • the component 200 as the second object T2 is arranged on the mounting surface 101 of the substrate 100 as the first object T1, or the component 200 is arranged on the mounting surface 101 of the substrate 100. Includes mounting and inserting the lead terminal of the component 200 into the hole of the substrate 100. Further, the “mounting” referred to in the present disclosure includes joining the component 200 to the substrate 100 and adhering the component 200 to the substrate 100.
  • the "mounting quality” referred to in the present disclosure refers to the quality when the component 200 as the second object T2 is mounted on the substrate 100 as the first object T1, and the component 200 with respect to the substrate 100. Includes mounting position and mounting angle. More specifically, “mounting quality” refers to the mounting position of the board 100 in the first direction (X-axis direction), the mounting position of the board 100 in the second direction (Y-axis direction), and the inside of the mounting surface 101 of the board 100. Including the mounting angle at.
  • the quality of the implementation changes in the present disclosure means that the quality of the implementation changes in a direction away from the range judged to be normal (that is, a direction judged to be abnormal).
  • it means that the mounting position (or mounting angle) of the second object T2 with respect to the first object T1 changes.
  • determining that the quality of mounting has changed means that the amount of deviation of the mounting position (or mounting angle) of the second object T2 with respect to the first object T1 is that the quality of mounting is normal. It is determined whether or not the first determination range R1 (see FIG. 5) included in the second determination range R2 (see FIG. 5) to be determined is exceeded, or the second determination range R1 is contained. This means that the distribution of the amount of deviation of the mounting position (or mounting angle) of the object T2 changes.
  • the "target mounting position" referred to in the present disclosure means a position (coordinates) on which the component 200 as the second object T2 should be mounted on the substrate 100 as the first object T1.
  • the target mounting position is the coordinates in the X-axis direction (X-coordinates) and the Y-axis direction. It is represented by the coordinates (Y coordinates) of.
  • X-axis three axes of X-axis, Y-axis, and Z-axis that are orthogonal to each other are set, and the axes parallel to the surface (mounting surface 101) of the substrate 100, which is the first object T1, are defined as "X-axis” and "X-axis".
  • the "Y-axis” is used, and the axis parallel to the thickness direction of the substrate 100 is the "Z" axis.
  • the capture portion 2211 side as seen from the substrate 100, which is the first object T1 is defined as the positive direction (also referred to as “upward”) of the Z axis.
  • the state seen from the positive direction (upper side) of the Z axis is also referred to as "planar view” below.
  • the X-axis, Y-axis, and Z-axis are all virtual axes, and the arrows indicating "X", "Y", and “Z” in the drawings are shown for illustration purposes only. , Neither is accompanied by substance. Further, these directions are not intended to limit the directions when the mounting system 22 is used.
  • a pipe for circulating cooling water, a cable for supplying electric power, a pipe for supplying pneumatic pressure (including positive pressure and vacuum), and the like are connected to the mounting system 22, but in the present embodiment, these are connected.
  • the illustration is omitted as appropriate.
  • the quality change detection system 1 mainly includes a computer system having one or more processors and one or more memories. That is, the function of the quality change detection system 1 is realized by executing the program recorded in one or more memories of the computer system by one or more processors.
  • the program may be pre-recorded in a memory, may be provided through a telecommunication line such as the Internet, or may be recorded and provided on a non-temporary recording medium such as a memory card.
  • the quality change detection system 1 includes an acquisition unit 11 and a determination unit 12. Further, in the present embodiment, the quality change detection system 1 further includes a prediction unit 13, a factor estimation unit 14, a creation unit 15, and a notification unit 16 in addition to the acquisition unit 11 and the determination unit 12.
  • the quality change detection system 1 mainly includes a computer system having one or more processors and one or more memories. Therefore, each configuration of the quality change detection system 1 (acquisition unit 11, determination unit 12, prediction unit 13, factor estimation unit 14, creation unit 15, and notification unit 16) is realized by executing a program by one or more processors. Be made.
  • the acquisition unit 11 acquires the amount of mounting position deviation, which is the difference between the actual mounting position of the second object T2 and the target mounting position with respect to the first object T1. do. That is, the step (process) in which the acquisition unit 11 acquires the mounting position deviation amount is the acquisition step of the quality change detection method according to the present embodiment. Specifically, the acquisition unit 11 acquires the first information D1 from the post-mounting inspection system 25 (see FIG. 1) described later. Further, the acquisition unit 11 may acquire the second information D2 from the mounting system 22 described later. Further, in the present embodiment, the acquisition unit 11 acquires the first information D1 at the timing when the inspection of one substrate 100 as the first object T1 is completed in the post-mounting inspection system 25.
  • the acquisition unit 11 may acquire the first information D1 at the timing when the inspection of the required number of substrates 100 is completed for the distribution change detection F2 (see FIG. 10) described later. Further, in the present embodiment, the acquisition unit 11 acquires the first information D1 for all the second objects T2 mounted on the mounting surface 101 of one substrate 100. The acquisition unit 11 outputs the acquired first information D1 to the determination unit 12 for each type of the component 200.
  • the "part type” here includes the type of element (resistor, capacitor, lead part, etc.) and the size of the part (0402, 0603, 1005, etc., not limited to actual dimensions, but also standard and data dimensions. ) And, including.
  • "for each type of component” includes at least the meaning of each element type, each component size, and each element type and component size.
  • the first information D1 of the 0603 size resistor and the first information D1 of the 1005 size resistor are separately output to the determination unit 12. That is, even if the types of elements are the same, if the sizes of the parts are different, they are separately output to the determination unit 12. Further, the first information D1 may be output to the determination unit 12 for each type of component and for each mounting angle.
  • the acquisition unit 11 acquires the first information D1 from the management computer 3 (see FIG. 4) that manages the information of the devices constituting the board manufacturing line 2.
  • the first information D1 includes a mounting position deviation amount which is a difference between the actual mounting position of the second object T2 with respect to the first object T1 and the target mounting position of the second object T2 with respect to the first object T1. .. Further, in the first information D1, there is a mounting angle deviation which is a difference between the actual mounting angle of the second object T2 with respect to the first object T1 and the target mounting angle of the second target T2 with respect to the first object T1. The amount may be further included. In the present embodiment, it will be described that only the mounting position shift amount is included in the first information D1.
  • the mounting position deviation amount includes a first mounting position deviation amount which is a deviation amount in the X-axis direction and a second mounting position deviation amount which is a deviation amount in the Y-axis direction.
  • the first information D1 includes a mounting position shift amount before the reflow step is performed.
  • the second information D2 is information acquired from at least one of the plurality of facilities constituting the substrate manufacturing line 2.
  • the second information D2 is information acquired from the mounting system 22 which is one of the plurality of facilities 4 (see FIG. 4).
  • the second information D2 includes lot information, trace information, event information and production information (production data).
  • the lot information is information on the type of the substrate 100 on which the component 200 corresponding to the above-mentioned first information D1 is mounted, and includes, for example, information on a production lot for each substrate 100 and information on a production date and time of the substrate 100.
  • the trace information is the address of the nozzle 2211 or feeder described later used when mounting the component 200 corresponding to the first information D1 described above (that is, at which position the nozzle 2211 mounted on the nozzle holder was mounted, which position.
  • Information about whether it was supplied from a feeder mounted at a position information acquired by a sensor provided in the mounting system 22 (eg, component recognition camera 222), and a correction amount based on the information acquired by the sensor (eg,). , Recognition correction amount), and.
  • the event information is information about an event performed in the mounting process by the mounting system 22, and includes, for example, a feeder exchange.
  • the production information includes, for example, a target mounting position of the component 200 on the substrate 100, a target mounting angle, a circuit number, a component code for individually identifying the component 200, and the like.
  • the part code includes information such as the size of the part, the type of element (that is, a resistor or a capacitor), the vendor of the part, and the like.
  • the determination unit 12 determines that the quality of the implementation has changed based on the first information D1 from the acquisition unit 11. More specifically, the determination unit 12 determines that the amount of mounting position deviation from the acquisition unit 11 exceeds the first determination range R1 (see FIG. 7), and the quality of mounting is determined to be normal. If it falls within the range R2 (see FIG. 7), it is determined that the quality of the mounting has changed. Further, the determination unit 12 determines that the quality of mounting has changed based on the statistical information regarding the amount of mounting position deviation included in the first determination range R1. That is, the step (process) in which the determination unit 12 determines that the quality of the implementation has changed is the determination step (first determination step and second determination step) of the quality change detection method according to the present embodiment.
  • the quality change detection method has a first determination step and a second determination step as determination steps.
  • the first determination step is a step of determining that the quality of mounting has changed when the amount of mounting position deviation exceeds the first determination range R1 and falls within the second determination range R2.
  • the second determination step is a step of determining that the quality of the implementation has changed based on the statistical information regarding the amount of the mounting position deviation of the second object T2 included in the first determination range R1.
  • the first determination range R1 is set based on the standard deviation of the normal state distribution (see FIG. 9A) created by the creation unit 15 described later.
  • the normal state distribution (see FIG. 9A) is a distribution showing how the mounting position shift amount of the second object T2 fluctuates if the state of the substrate manufacturing line 2 is normal.
  • FIG. 6A is a diagram showing the distribution of the mounting positions of the second object T2 with respect to the first object T1 for each type of part and for each production lot.
  • each type of component means each size of component and each type of element.
  • FIG. 6A shows the distribution of the mounting positions of the second object T2 in the X-axis direction.
  • the graphs arranged in the horizontal axis direction show graphs in which production lots are different
  • the graphs arranged in the vertical axis direction are graphs in which the types of parts are different. Is shown.
  • the vertical axis in each graph indicates the amount of mounting position deviation
  • the horizontal axis in each graph indicates the number of times of mounting in each mounting position deviation amount, that is, the number of appearances.
  • the normal state distribution is set according to the type of the component 200 which is the second object T2.
  • the first determination range R1 is set according to the type of the second object T2.
  • the second determination range R2 is also preferably set according to the type of the second object T2.
  • the distribution of the mounting position shift amount of the second object T2 in the Y-axis direction also changes more greatly depending on the type of parts than in the production lot (the shape of the distribution cannot be regarded as the same). Therefore, here, only the distribution of the mounting position in the X-axis direction will be described, and the description of the distribution of the mounting position deviation amount in the Y-axis direction will be omitted.
  • FIG. 6B is a diagram showing the distribution of the mounting position of the second object T2 with respect to the first object T1 for each mounting angle of the second object T2 with respect to the first object T1.
  • FIG. 6B shows the distribution of the mounting positions of the second object T2 in the X-axis direction, as in FIG. 6A.
  • the vertical axis in each graph shows the amount of mounting position deviation, and the horizontal axis in each graph shows the number of occurrences.
  • the graph on the left side in FIG. 6B shows the case where the mounting angle of the second object T2 with respect to the first object T1 is 90 degrees
  • the graph on the right side in FIG. 6B shows the case where the mounting angle is 0 degrees. Is shown. Comparing the graph when the mounting angle is 90 degrees and the graph when the mounting angle is 0 degrees, it can be seen that the distribution of the mounting position deviation amount of the second object T2 is different. In short, the distribution of the mounting position shift amount of the second object T2 changes greatly depending on the mounting angle of the second object T2 with respect to the first object T1 (the shapes of the distributions cannot be regarded as equivalent).
  • the normal state distribution is set according to the mounting angle of the component 200 which is the second object T2 with respect to the first object T1.
  • the first determination range R1 (see FIG. 8) is preferably set according to the mounting angle of the component 200 which is the second object T2 with respect to the first object T1.
  • the second determination range R2 is also set according to the mounting angle of the component 200 which is the second object T2 with respect to the first object T1.
  • the first determination range R1 is a range defined by the first threshold value TH11 and the second threshold value TH12.
  • the absolute values of the first threshold value TH11 and the second threshold value TH12 are different, but the absolute values of the first threshold value TH11 and the second threshold value TH12 may be the same.
  • the horizontal axis indicates the elapsed time t, and the vertical axis indicates the mounting position deviation amount GapX of the second object T2.
  • the second determination range R2 is a range in which the quality of mounting is determined to be normal, as described above.
  • the second determination range R2 is a range defined by the first threshold value TH21 and the second threshold value TH22.
  • the absolute values of the first threshold value TH21 and the second threshold value TH22 are different, but the absolute values of the first threshold value TH21 and the second threshold value TH22 may be the same.
  • a “circle” exceeding the first threshold value TH11 indicates an outlier of the mounting position deviation amount GapX of the second object T2.
  • the “outlier” here means a value that is within the second determination range R2 but exceeds the first determination range R1 (see “Ou1" and “Ou2” in FIG. 8).
  • “DI1” in FIG. 8 indicates the distribution of the mounting position shift amount GapX of the second object T2 (hereinafter referred to as “distribution DI1").
  • the determination unit 12 determines that the mounting position deviation amount GapX (outliers Ou1 and Ou2 in FIG. 8) exceeds the first determination range R1 and falls within the second determination range R2. , Judge that the quality of implementation has changed. That is, in the present embodiment, as shown in FIGS. 7 and 8, the first determination range R1 is included in the second determination range R2.
  • the first determination range R1 is set according to the type of the second object T2. Then, when the type of the second object T2 is different, the determination unit 12 determines that the second object T2 is based on the first determination range R1 set according to the type of the second object T2. Determine that the quality of the implementation has changed. Further, as described above, the first determination range R1 is set according to the mounting angle of the second object T2 with respect to the first object T1. Then, when the mounting angle of the second object T2 with respect to the first object T1 is different, the determination unit 12 determines the mounting quality based on the first determination range R1 set according to the mounting angle. Judge that it has changed.
  • the determination unit 12 changes the quality of mounting based on the first determination range R1 set according to the feeder (serial or address of the feeder) used for mounting the second object T2. It may be determined that it has been done. That is, the determination unit 12 determines that the quality of the implementation has changed based on the determination criteria generated for each different category (type of the second object T2, mounting angle, feeder used for supply, etc.). become. As a result, the variation from the judgment criteria is clarified for a specific category, and the change in the quality of implementation becomes apparent.
  • the determination unit 12 includes the mounting position deviation amount in the first determination range R1 among the plurality of second objects T2 mounted on the mounting surface 101 of the substrate 100 as the first object T1.
  • the distribution change detection F2 (see FIG. 10) described later is executed. That is, the determination unit 12 determines that the quality of the implementation has changed based on the statistical information regarding the amount of the mounting position deviation of the second object T2 included in the first determination range R1.
  • the statistical information includes the average calculated based on the distribution of the mounting misalignment amount of the second object T2 and the variance (or standard deviation) calculated based on the distribution of the mounting misalignment amount of the second object T2. , Including at least one of.
  • the statistical information is the average calculated from the distribution of the mounting misalignment amount of the second object T2 and the variance (or standard deviation) calculated from the distribution of the mounting misalignment amount of the second object T2. And, including both.
  • the determination unit 12 has a large difference between the average calculated from the distribution DI1 of the mounting position deviation amount of the second object T2 and the average calculated from the normal state distribution (FIG. 10).
  • step ST7 it is determined that the quality of the implementation has changed. Further, in the determination unit 12, for example, as shown in FIG. 9C, the ratio of the variance calculated from the distribution DI1 of the mounting position deviation amount of the second object T2 to the variance calculated from the normal state distribution is large (that is,). If the distribution DI1 is wider than the normal state distribution), it is determined that the quality of the implementation has changed.
  • FIG. 9A is a diagram showing a normal state distribution obtained from the past first information D1.
  • the distribution DI1 of the mounting position deviation amount of the second object T2 is distributed with the vicinity of zero of the mounting position deviation amount as an average.
  • the scale on the left side (value of the number of appearances) in FIGS. 9A to 9C is a scale with respect to the normal state distribution
  • the distribution DI1 of the mounting position deviation amount of the second object T2 in FIGS. 9B and 9C is normal. It is normalized according to the state distribution.
  • the prediction unit 13 predicts an abnormality (defectiveness) in the quality of mounting based on the determination result of the determination unit 12.
  • the abnormality in the mounting quality is caused by the specific second object T2 in which the mounting position deviation amount exceeds the first determination range R1 among the plurality of second objects T2 mounted on the first object T1. It occurs when the amount of mounting position deviation of the above exceeds the second determination range R2.
  • the quality of the implementation changes before the anomaly of the quality of the implementation. Therefore, the prediction unit 13 predicts an abnormality in the quality of the mounting based on the first information D1 from the post-mounting inspection system 25.
  • the step (processing) in which the prediction unit 13 predicts an abnormality in the quality of the implementation is a prediction step. For example, when the determination unit 12 determines that the mounting position deviation amount of the second object T2 changes in a direction exceeding the second determination range R2, the prediction unit 13 results in an abnormality (defectiveness) in the mounting quality. Predict that.
  • the prediction unit 13 predicts at least the time until an abnormality occurs in the substrate manufacturing line 2 in the prediction step.
  • the prediction unit 13 has, for example, an outlier Ou1 (or Ou2) in which the mounting position deviation amount of the second object T2 exceeds the first determination range R1 from the initial position within the first determination range R1. (In FIG. 7, the time until the first determination range R1 is exceeded) is stored, and the time until the outliers Au1 and Ou2 exceed the second determination range R2 is predicted based on this time.
  • Ou1 or Ou2
  • the time until the outliers Au1 and Ou2 exceed the second determination range R2 is predicted based on this time.
  • the prediction unit 13 may predict the probability of occurrence of an abnormality in the mounting quality, the number of times of occurrence of an abnormality, and the like after a lapse of a predetermined time. Alternatively, the prediction unit 13 may predict the number of production sheets, the probability of abnormality occurrence per production lot, the number of abnormality occurrences, and the like.
  • the factor estimation unit 14 estimates the malfunctioning part in the substrate manufacturing line 2 that causes the change in the mounting quality based on the information regarding the amount of mounting misalignment.
  • the step (processing) in which the factor estimation unit 14 estimates the malfunctioning portion in the substrate manufacturing line 2 that causes the change in the mounting quality is the estimation step. For example, when the determination unit 12 determines that the mounting position deviation amount of the second object T2 changes in a direction exceeding the first determination range R1, the component recognition described later is performed from the second information D2 from the mounting system 22. Information on the fluctuation of the correction amount (recognition correction amount) of the mounting position of the specific second object T2 calculated based on the image pickup result by the camera 222 is called.
  • the factor estimation unit 14 mounts the second object T2 on the first object T1 which is information corresponding to the amount of mounting position deviation, in addition to the first information D1 from the post-mounting inspection system 25.
  • the faulty part is estimated using the second information D2 from the mounting system 22 which is the equipment 4 used at the time.
  • the malfunction location estimated by the factor estimation unit 14 is not limited to the unit constituting the equipment 4 such as the feeder, the head, and the nozzle, but also the processes such as the suction process and the printing process, and the equipment 4 constituting the substrate manufacturing line 2. Also includes.
  • the factor estimation unit 14 may estimate the stop time (time operation loss) due to the failure of the feeder, head, or nozzle which is the estimated malfunction location, the appropriate maintenance time for the malfunction location, and the like.
  • the creation unit 15 distributes the normal state from the amount of mounting position deviation for which the quality of mounting was determined to be normal (that is, within the second determination range R2) through the mounting process in the past. To create.
  • the normal state distribution is created for each type of the second object T2 to be detected and a combination of mounting angles. For example, when a 0603 size resistor and a 1005 size resistor are to be detected, a normal state distribution is created from the mounting misalignment amount corresponding to the 0603 size resistor and the mounting misalignment amount corresponding to the 1005 size resistor. Will be done.
  • the first determination range R1 is calculated from the standard deviation of the normal state distribution.
  • the number of data for the amount of mounting misalignment is preferably large in order to ensure the accuracy of the normal state distribution. Therefore, the mounting misalignment amount data is collected over a plurality of production lots. As an example, the number of data of the amount of mounting position deviation is 8000 points on average.
  • the normal state distribution may be updated at the timing when the data of the mounting position shift amount is sufficiently collected. For example, it may be updated at a predetermined interval in which a certain number or more of data of the amount of mounting position deviation is accumulated for each type of component, for example, every day, and the timing of updating may be appropriately set.
  • the notification unit 16 notifies, for example, a factory manager (worker) of at least one of the determination result of the determination unit 12 and the prediction result of the prediction unit 13.
  • the notification unit 16 notifies the operator of the determination result in the first determination step of the determination unit 12, the determination result in the second determination step of the determination unit 12, and the prediction result of the prediction unit 13.
  • the notification unit 16 notifies the operator that the quality of the mounting has changed.
  • the determination unit 12 determines that it cannot be regarded as equivalent to the normal state distribution based on the statistical information (average or variance) calculated from the distribution of the mounting position shift amount included in the first determination range R1, a notification is given.
  • the unit 16 notifies the operator that the quality of the implementation has changed. Further, when the prediction unit 13 predicts that the mounting quality will be abnormal (defective), the notification unit 16 notifies the operator that the mounting quality abnormality (defective) will occur.
  • the mode of notification performed by the notification unit 16 includes, for example, display and lighting on the display unit (liquid crystal display and light emitting unit) of the equipment 4, and terminals (personal computer, tablet, smartphone, etc.) used by the operator.
  • the notification unit 16 may notify any one of the determination result in the first determination step of the determination unit 12, the determination result in the second determination step, and the prediction result of the prediction unit 13.
  • the mounting system 22 includes a mounting head 221, a component recognition camera 222, a control device 223, a drive device 224, a component supply device 225, and a component supply device 225. It is equipped with a transfer device 226.
  • the mounting head 221 has at least one catching unit 2211.
  • the mounting head 221 has a plurality of capturing portions 2211.
  • the mounting head 221 moves the capture unit 2211 so as to approach the first object T1 (board 100) in a state where the capture unit 2211 captures the second object T2 (component 200), and the second object T2 Is mounted on the mounting surface 101 of the first object T1.
  • the mounting head 221 moves the capture unit 2211 between the first position closer to the first object T1 and the second position farther from the first object T1 than the first position. Hold as possible. That is, the mounting head 221 movably holds the capturing unit 2211 toward the first object T1.
  • the mounting head 221 has an actuator 2212 (see FIG. 5) for moving the capture unit 2211 in addition to the capture unit 2211, and a head body 2213 (see FIG. 3) that holds the capture unit 2211 and the actuator 2212. ) And further.
  • a plurality of capture units 2211 and actuators 2212 are held in one head body 2213.
  • the mounting head 221 can capture a plurality of second objects T2 (components 200).
  • the capture unit 2211 is, for example, a suction nozzle.
  • the capture unit 2211 is controlled by the control device 223 and can switch between a capture state in which the second object T2 is captured (held) and a release state in which the second object T2 is released (capture is released). ..
  • the capturing unit 2211 is not limited to a suction nozzle that sucks the second object T2 by a vacuum force, for example, a chuck mechanism having a structure that physically sandwiches (picks) the second object T2, a robot hand, or other magnetic force. It may be configured to capture (hold) the second object T2 by suction (suction) or the like by static electricity.
  • the mounting head 221 operates by receiving the supply of pneumatic pressure (vacuum) as power. That is, the mounting head 221 switches between the capture state and the release state of the capture unit 2211 by opening and closing the valve on the pneumatic (vacuum) supply path connected to the capture unit 2211.
  • the actuator 2212 moves the capture unit 2211 straight in the Z-axis direction. Further, the actuator 2212 rotates and moves the capture unit 2211 in the rotation direction (hereinafter, referred to as “ ⁇ direction”) about the axis along the Z-axis direction. As an example in the present embodiment, the actuator 2212 is driven by the driving force generated by the linear motor with respect to the movement of the capturing unit 2211 in the Z-axis direction. Regarding the movement of the capture unit 2211 in the ⁇ direction, the actuator 2212 is driven by the driving force generated by the rotary motor. On the other hand, as will be described later, the mounting head 221 moves linearly in the X-axis direction and the Y-axis direction by the drive device 224. As a result, the capture unit 2211 included in the mounting head 221 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the ⁇ direction by the drive device 224 and the actuator 2212.
  • the head body 2213 is made of metal and is formed in a rectangular parallelepiped shape.
  • the head body 2213 holds the capture unit 2211 and the actuator 2212.
  • the capture unit 2211 is indirectly held by the head body 2213 via the actuator 2212 in a state where it can move in the Z-axis direction and the ⁇ direction.
  • the mounting head 221 moves in the XY plane by moving the head body 2213 in the XY plane by the drive device 224.
  • the mounting head 221 moves so as to bring the capture unit 2211 closer to the first object T1 (board 100) in a state where the capture unit 2211 captures the second object T2 (component 200).
  • the second object T2 can be mounted on the mounting surface 101 of the first object T1. That is, the mounting head 221 has the capture unit 2211 at least between the first position closer to the first object T1 and the second position farther from the first object T1 than the first position. Move it.
  • the mounting head 221 moves the capturing unit 2211 in a state where the second object T2 is captured from the second position to the first position, whereby the second object T2 is moved to the mounting surface 101 of the first object T1.
  • the mounting head 221 further includes a head camera 2214 in addition to the capturing unit 2211, the actuator 2212, and the head body 2213.
  • the head camera 2214 is fixed to the mounting head 221 by being fixed to the side surface of the head body 2213.
  • the mounting system 22 includes one head camera 2214.
  • the head camera 2214 is, for example, an area camera.
  • the head camera 2214 is arranged with the imaging field of view facing downward, and images a positioning substrate mark attached to the first object T1.
  • the head camera 2214 may take an image of a specific region including a joining member (for example, solder) in the mounting surface 101 of the first object T1 (board 100).
  • the parts recognition camera 222 is arranged on the base 220 of the mounting system 22 with the imaging field of view facing upward.
  • the component recognition camera 222 captures an image of the lower surface of the component 200 held by the capture unit 2211 of the mounting head 221 from below.
  • the control device 223 calculates the amount of misalignment of the component 200 with respect to the capture unit 2211 of the mounting head 221, and based on the calculated amount of misalignment, the mounting head 221 attaches the mounting head 221 to the substrate 100. Correct the mounting position of the component 200.
  • the component recognition camera 222 is arranged on the base 220 of the mounting system 22, but the present invention is not limited to this, and for example, the component recognition camera 222 may be integrally provided on the mounting head 221.
  • the control device 223 controls each part of the mounting system 22.
  • the control device 223 mainly comprises a computer system having one or more processors and one or more memories. That is, the function of the control device 223 is realized by executing the program recorded in one or more memories of the computer system by one or more processors.
  • the program may be pre-recorded in a memory, may be provided through a telecommunication line such as the Internet, or may be recorded and provided on a non-temporary recording medium such as a memory card.
  • the control device 223 is electrically connected to, for example, each of the mounting head 221, the head camera 2214, the component recognition camera 222, the drive device 224, the component supply device 225, and the transfer device 226.
  • the control device 223 outputs a control signal to the mounting head 221 and the driving device 224, and mounts the second object T2 captured by at least the capturing unit 2211 on the mounting surface 101 of the first object T1. It controls 221 and the drive device 224. Further, the control device 223 outputs a control signal to the head camera 2214 and the component recognition camera 222 to control the head camera 2214 and the component recognition camera 222, or obtains an image captured by the head camera 2214 and the component recognition camera 222. Obtained from the head camera 2214 and the component recognition camera 222.
  • the drive device 224 is a device for moving the mounting head 221.
  • the drive device 224 moves the mounting head 221 in the XY plane.
  • the "XY plane” here is a plane including the X-axis and the Y-axis, and is a plane orthogonal to the Z-axis.
  • the drive device 224 moves the mounting head 221 in the X-axis direction and the Y-axis direction.
  • the drive device 224 since the head camera 2214 is fixed to the mounting head 221, the drive device 224 also moves the head camera 2214 together with the mounting head 221. In other words, the drive device 224 moves the mounting head 221 and the head camera 2214 in the XY plane.
  • the drive device 224 has an X-axis drive unit 2241 and a Y-axis drive unit 2242, as shown in FIGS. 2 and 3.
  • the X-axis drive unit 2241 moves the mounting head 221 straight in the X-axis direction.
  • the Y-axis drive unit 2242 moves the mounting head 221 linearly in the Y-axis direction.
  • the Y-axis drive unit 2242 moves the mounting head 221 together with the X-axis drive unit 2241 along the Y-axis, thereby moving the mounting head 221 linearly in the Y-axis direction.
  • each of the X-axis drive unit 2241 and the Y-axis drive unit 2242 includes a linear motor, and the mounting head 221 is moved by a driving force generated by the linear motor when it receives electric power.
  • the parts supply device 225 supplies the parts 200 as the second object T2 captured by the capture unit 2211 of the mounting head 221.
  • the component supply device 225 has a plurality of tape feeders 2251 that supply components 200 housed in the carrier tape 6.
  • the component supply device 225 may have a tray on which a plurality of components 200 are placed.
  • the mounting head 221 captures the second object T2 (component 200) from such a component supply device 225 by the capture unit 2211.
  • the transport device 226 is a device that transports the substrate 100 as the first object T1.
  • the transfer device 226 is realized by, for example, a belt conveyor or the like.
  • the transport device 226 transports the first object T1 (board 100) along, for example, the X axis.
  • the transport device 226 transports the first object T1 at least below the mounting head 221, that is, in the mounting space facing the capture unit 2211 in the Z-axis direction. Then, the transfer device 226 stops the first object T1 in the mounting space until the mounting of the second object T2 (component 200) on the first object T1 (board 100) by the mounting head 221 is completed. ..
  • the mounting system 22 also includes, for example, a communication unit and the like.
  • the communication unit is configured to communicate with the host system directly or indirectly via a network or a repeater or the like. As a result, the mounting system 22 can exchange data with and from the host system.
  • the post-mounting inspection system 25 is a system for inspecting the mounting state of the second object T2 with respect to the first object T1 in the second inspection step between the mounting process and the reflow process. As shown in FIG. 4, the post-mounting inspection system 25 is connected to the quality change detection system 1 via the management computer 3, and outputs the first information D1 to the quality change detection system 1. As described above, the first information D1 includes the amount of mounting position deviation of the second object T2 with respect to the first object T1 before the reflow step.
  • the post-mounting inspection system 25 calculates the amount of mounting position deviation of all the second objects T2 mounted on the first object T1. Specifically, the post-mounting inspection system 25 determines the difference between the actual mounting position of the second object T2 with respect to the first object T1 and the target mounting position of the second object T2 with respect to the first object T1. Calculated as the amount of mounting position deviation.
  • the acquisition unit 11 receives the first information D1 from the post-mounting inspection system 25 and the second information D2 from the mounting system 22 at the timing when the production of the preset number of boards 100 (first object T1) is completed. To get. Then, the acquisition unit 11 groups the first information D1 acquired from the post-mounting inspection system 25 for each type of the second object T2 and for each mounting angle of the second object T2 with respect to the first object T1. (Assembly) and output to the determination unit 12.
  • the "timing at which production is completed” may be the timing at which all the processes of production of the substrate 100 in the substrate manufacturing line 2 are completed, or the timing at which the inspection by the post-mounting inspection system 25 is completed.
  • the determination unit 12 executes the outlier detection F1 (steps ST1 to ST3).
  • the determination unit 12 compares the absolute value of the mounting position deviation amount GapX of each second object T2 mounted on the first object T1 with the comparison value 3 ⁇ (step ST1).
  • " ⁇ " in the comparison value 3 ⁇ is the standard deviation of the above-mentioned normal state distribution
  • the comparison value 3 ⁇ is a value that defines the first determination range R1. That is, the first determination range R1 is a range defined by the comparison value + 3 ⁇ and the comparison value -3 ⁇ .
  • the comparison value is set for each category, and in the present embodiment, the determination unit 12 makes a determination based on the comparison value set for each type of the component 200 and for each mounting angle.
  • the determination unit 12 temporarily stores the data of the mounting position deviation amount GapX in the buffer memory (step ST2).
  • the determination unit 12 records the determination result that the mounting position deviation amount GapX is an outlier (step ST3).
  • the determination unit 12 executes outlier detection F1 for all the second objects T2 mounted on the first object T1 (steps ST1 to ST3).
  • the determination unit 12 compares the number of data of the mounting position shift amount GapX stored in the buffer memory with a preset threshold value (minimum number of data for determination) (step ST4). When the number of data is equal to or greater than the threshold value (step ST4: Yes), the determination unit 12 executes the distribution change detection F2 (steps ST5 to ST9). Specifically, the determination unit 12 has the distribution of the mounting position shift amount GapX stored in the buffer memory based on the variance calculated from the distribution in the distribution change detection F2, and the normal state created in advance by the creation unit 15. It is determined whether or not the distribution is homoscedastic (step ST5).
  • homoscedasticity includes not only the case where the two variances are completely equal, but also the case where the ratio of the two variances is included in a certain range. As described above, the normal state distribution is obtained from the past first information D1.
  • the determination unit 12 is in the case where the distribution of the mounting position deviation amount GapX and the normal state distribution are not evenly dispersed (step ST5: No), that is, in the direction in which the distribution of the mounting position deviation amount GapX is larger than that of the normal state distribution. If it has changed, the determination result that the mounting position deviation amount GapX of the second object T2 has changed in the direction exceeding the first determination range R1 is recorded (step ST6). Further, the determination unit 12 determines whether or not the average value of the distribution of the mounting position deviation amount GapX and the average value of the normal state distribution are equal (step ST7).
  • the term "equal average” as used herein includes not only the case where the average values of the two are completely equal to each other, but also the case where the ratio of the average values of the two is included in a certain range.
  • step ST7: No the determination unit 12 determines that the mounting position deviation amount GapX of the second object T2 changes in the direction exceeding the first determination range R1. Is recorded (step ST8).
  • step ST7: Yes the determination unit 12 has a range in which the mounting position deviation GapX of each second object T2 does not exceed a normal range (that is, a range in which the second determination range R2 is not exceeded). ), And the data of the mounting position shift amount GapX stored in the buffer memory is reset (erased) (step ST9).
  • step ST4: No determines the outlier detection F1 and the distribution change when the data to be determined remains (step ST10: Yes). Execute detection F2. On the other hand, if the data to be determined does not remain (step ST10: No), the determination unit 12 ends a series of processes.
  • the step in which the acquisition unit 11 acquires the first information D1 is the acquisition step, and the above-mentioned steps ST1 to ST9 are the determination steps.
  • the mounting position deviation amount GapX of the second object T2 is determined to be normal in the mounting quality. Even if it is within the determination range R2, if it exceeds the first determination range R1 or if it changes in the direction exceeding the first determination range R1, it is determined that the quality of the mounting has changed. Therefore, before the mounting position deviation amount GapX exceeds the second determination range R2, it can be grasped that the mounting quality has changed in the direction of becoming abnormal. As a result, it is possible to prevent the occurrence of mounting defects of the second object T2 with respect to the first object T1.
  • the above embodiment is only one of the various embodiments of the present disclosure.
  • the above-described embodiment can be variously modified depending on the design and the like as long as the object of the present disclosure can be achieved.
  • the same function as the quality change detection method according to the above-described embodiment may be embodied in a quality change detection system 1, a (computer) program, a non-temporary recording medium on which the program is recorded, or the like.
  • the program according to one aspect is a program for causing one or more processors to execute the quality change detection method according to the above-described embodiment.
  • the quality change detection system 1 in the present disclosure includes a computer system.
  • the computer system mainly consists of a processor and a memory as hardware.
  • the processor executes the program recorded in the memory of the computer system, the function as the quality change detection system 1 in the present disclosure is realized.
  • the program may be pre-recorded in the memory of the computer system, may be provided through a telecommunications line, and may be recorded on a non-temporary recording medium such as a memory card, optical disk, hard disk drive, etc. that can be read by the computer system. May be provided.
  • the processor of a computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI).
  • IC semiconductor integrated circuit
  • LSI large scale integrated circuit
  • the integrated circuit such as IC or LSI referred to here has a different name depending on the degree of integration, and includes an integrated circuit called a system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration).
  • an FPGA Field-Programmable Gate Array
  • a plurality of electronic circuits may be integrated on one chip, or may be distributed on a plurality of chips.
  • a plurality of chips may be integrated in one device, or may be distributed in a plurality of devices.
  • the computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microprocessor is also composed of one or a plurality of electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.
  • the quality change detection system 1 it is not an essential configuration for the quality change detection system 1 that a plurality of functions in the quality change detection system 1 are integrated in one housing.
  • the components of the quality change detection system 1 may be distributed in a plurality of housings. Further, at least a part of the functions of the quality change detection system 1 may be realized by a cloud (cloud computing) or the like.
  • one mounting system 22 may be used for the work of mounting the second target object T2 on the first target object T1, or a plurality of (two in FIG. 1) mounting systems 22 (22A, 22B) may be used.
  • the mounting quality is the quality when the second object T2 is mounted on the first object T1 and includes the mounting position (or mounting angle).
  • the quality may be the case of capturing the second object T2 from 225. That is, the quality of mounting may include the position of the suction nozzle 2211 with respect to the second object T2.
  • the quality change detection method and the quality change detection system 1 are used for the mounting deviation in the mounting process.
  • the quality change detection method and the quality change detection system 1 are used for the coating deviation in the solder coating process. You may use it.
  • the acquisition unit 11 acquires the amount of misalignment between the position of the solder applied (printed) on the first object T1 and the position of the land from the post-print inspection system 24.
  • the equipment 4 is the mounting system 22, but the equipment 4 is not limited to the mounting system 22, and may be, for example, a printing system 21.
  • the first determination range R1 may be set depending on the type of creamy solder.
  • the notification unit 16 notifies the operator of both the determination result of the determination unit 12 and the prediction result of the prediction unit 13, but the notification unit 16 determines, for example, the determination unit 12. Only the result may be notified to the worker, or only the prediction result of the prediction unit 13 may be notified to the worker. Further, the notification unit 16 may notify not only the operator but also the robot that performs the maintenance work of the substrate manufacturing line 2 including the equipment 4 on behalf of the operator.
  • the comparison value of the mounting position deviation amount GapX of the second object T2 is 3 ⁇ , but for example, the comparison value may be 2 ⁇ or 1 ⁇ . May be.
  • the determination unit 12 detects the distribution change F2 when the number of second objects T2 that are not outliers detected in the outlier detection F1 is equal to or more than a certain number. Running.
  • the determination unit 12 may execute the distribution change detection F2 in either the case where the outlier is not detected in the outlier detection F1 or the case where the outlier is detected.
  • the determination unit 12 is based on the statistical information regarding the mounting position deviation amount GapX of the second object T2 even when the mounting position deviation amount GapX of all the second objects T2 is included in the first determination range R1. It may be determined that the quality of the implementation has changed. Even in this case, the determination unit 12 determines that the mounting position deviation amount GapX of the second object T2 changes in the direction exceeding the first determination range R1 because the dispersion is not equal or equal. be able to.
  • the first determination range R1 (range based on the standard deviation of the normal state distribution) for each type of the second object T2 and for each mounting angle of the second object T2 with respect to the first object T1. Is set, but it is not limited to this. For example, when the first determination range R1 is set for each type of the second object T2, the same first determination range R1 is used even if the mounting angle of the second object T2 with respect to the first object T1 is different. May be applied. Further, when the first determination range R1 is set for each mounting angle of the second object T2 with respect to the first object T1, the same first determination range R1 is set even if the type of the second object T2 is different. May be applied. Further, the first determination range R1 may be applied to each unit (feeder or nozzle) used for mounting the second object T2.
  • the center of the first determination range R1 and the center of the second determination range R2 coincide with each other, and the first determination range R1 and the second determination range R2 are concentric. be.
  • the first determination range R1 may be included in the second determination range R2, and the center of the first determination range R1 and the center of the second determination range R2 may be deviated from each other.
  • the shapes of the first determination range R1 and the second determination range R2 are circular, but the shapes of the first determination range R1 and the second determination range R2 are, for example, elliptical. It may be a polygon (for example, a quadrangle). Further, the shapes of the first determination range R1 and the second determination range R2 may be the same or different.
  • the average of the first determination range R1 does not necessarily mean that the mounting position deviation amount is zero.
  • the first information D1 is information acquired in the second inspection step, but is not limited to this.
  • the first information may be information acquired in the third inspection step, or may include both information acquired in the second inspection step and information acquired in the third inspection step.
  • the quality change detection method includes an acquisition step and a first determination step.
  • the acquisition step is a step of acquiring the amount of mounting position deviation, which is the difference between the actual mounting position of the second object (T2) and the target mounting position with respect to the first object (T1).
  • the first determination step when the amount of mounting position deviation acquired in the acquisition step exceeds the first determination range (R1) and falls within the second determination range (R2), the mounting quality has changed. This is the step to judge.
  • the first determination range (R1) is included in the second determination range (R2) in which the quality of the implementation is determined to be normal.
  • the quality change detection method further includes a second determination step in the first aspect.
  • the second determination step is a step of determining that the quality of the implementation has changed based on the statistical information regarding the amount of mounting misalignment included in the first determination range (R1).
  • the statistical information is at least the average calculated from the distribution of the mounting misalignment amount and the variance calculated from the distribution of the mounting misalignment amount. Including one.
  • the number of second objects (T2) whose mounting position deviation amount is included in the first determination range (R1) is a fixed number.
  • the first determination range (R1) is set according to the type of the second object (T2). ..
  • the first determination range (R1) can be set according to the type of the second object (T2).
  • the first determination range (R1) is the second object (T2) with respect to the first object (T1). It is set according to the mounting angle of.
  • the first determination range (R1) can be set according to the mounting angle of the second object (T2) with respect to the first object (T1).
  • the mounting quality control method further has a prediction step in any one of the first to sixth aspects.
  • the prediction step is a step of predicting an abnormality in the quality of the implementation based on the first information (D1).
  • the first information (D1) is information regarding the amount of mounting position deviation.
  • the quality change detection method in the seventh aspect, at least the time until the quality abnormality of the above-mentioned implementation occurs is predicted in the prediction step.
  • the quality change detection method further includes a notification step in the seventh or eighth aspect.
  • the notification step is a step of notifying at least one of a plurality of results including the determination result of the first determination step and the prediction result of the prediction step.
  • At least one of a plurality of results can be notified.
  • the quality change detection method further includes an estimation step in any one of the first to ninth aspects.
  • the estimation step is a step of estimating a malfunctioning part in the mounting system (22), which causes a change in the quality of mounting, based on the first information (D1) regarding the amount of mounting misalignment.
  • the second information (D2) is used in addition to the first information (D1) in the estimation step.
  • the second information (D2) is information corresponding to the amount of mounting misalignment, and is information on the equipment (4) used when mounting the second object (T2) on the first object (T1). Is.
  • the first object (T1) is a part (200) and the second object (T2) is.
  • the quality change detection system (1) includes an acquisition unit (11) and a determination unit (12).
  • the acquisition unit (11) acquires the amount of mounting position deviation, which is the difference between the actual mounting position of the second object (T2) and the target mounting position with respect to the first object (T1).
  • the determination unit (12) determines the quality of mounting when the amount of mounting position deviation acquired by the acquisition unit (11) exceeds the first determination range (R1) and falls within the second determination range (R2). Is determined to have changed.
  • the first determination range (R1) is included in the second determination range (R2) in which the quality of the implementation is determined to be normal.
  • the program according to the fourteenth aspect is a program for causing one or more processors to execute one or more quality change detection methods according to any one of the first to twelfth aspects.
  • the configuration according to the second to twelfth aspects is not an essential configuration for the quality change detection method, and can be omitted as appropriate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2021/016814 2020-05-19 2021-04-27 品質変化検知方法、品質変化検知システム、及びプログラム WO2021235201A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022524357A JPWO2021235201A1 (de) 2020-05-19 2021-04-27

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020087726 2020-05-19
JP2020-087726 2020-05-19

Publications (1)

Publication Number Publication Date
WO2021235201A1 true WO2021235201A1 (ja) 2021-11-25

Family

ID=78708531

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/016814 WO2021235201A1 (ja) 2020-05-19 2021-04-27 品質変化検知方法、品質変化検知システム、及びプログラム

Country Status (2)

Country Link
JP (1) JPWO2021235201A1 (de)
WO (1) WO2021235201A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024105931A1 (ja) * 2022-11-17 2024-05-23 パナソニックＩｐマネジメント株式会社 生産支援システム、生産支援方法及びプログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081080A (ja) * 2005-09-14 2007-03-29 Omron Corp 基板検査システム
JP2007149817A (ja) * 2005-11-25 2007-06-14 I-Pulse Co Ltd 実装ライン、実装ラインの管理方法および検査機
JP2015153914A (ja) * 2014-02-14 2015-08-24 オムロン株式会社 品質管理装置、品質管理方法、およびプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081080A (ja) * 2005-09-14 2007-03-29 Omron Corp 基板検査システム
JP2007149817A (ja) * 2005-11-25 2007-06-14 I-Pulse Co Ltd 実装ライン、実装ラインの管理方法および検査機
JP2015153914A (ja) * 2014-02-14 2015-08-24 オムロン株式会社 品質管理装置、品質管理方法、およびプログラム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024105931A1 (ja) * 2022-11-17 2024-05-23 パナソニックＩｐマネジメント株式会社 生産支援システム、生産支援方法及びプログラム

Also Published As

Publication number Publication date
JPWO2021235201A1 (de) 2021-11-25

Similar Documents

Publication Publication Date Title
US6904672B2 (en) Method for mounting an electronic component
JP5246064B2 (ja) 電子部品実装方法
EP3076776B1 (de) Datenaktualisierungsverfahren für schaltsubstratarbeitssystem und schaltsubstratarbeitssystem
JP4793187B2 (ja) 電子部品実装システムおよび電子部品実装方法
KR20010075434A (ko) 피크-앤-플레이스 로봇 내에서 소자를 검사하는 방법
JP2009004754A (ja) 部品実装方法、部品実装機、実装条件決定方法、実装条件決定装置およびプログラム
KR100915128B1 (ko) 부품장착 관리방법, 장착검사장치 및 장착시스템
WO2018142532A1 (ja) 生産管理装置
WO2021235201A1 (ja) 品質変化検知方法、品質変化検知システム、及びプログラム
CN104380853A (zh) 电子部件安装系统和电子部件安装方法
WO2015029209A1 (ja) 部品実装装置、その制御方法および部品実装装置用プログラム
JP6830538B2 (ja) 対基板作業管理システム
JP2009081170A (ja) 基板処理装置、管理コンピュータ装置、複数ステージ型表面実装機
US20070276867A1 (en) Embedded inspection image archival for electronics assembly machines
EP2897449B1 (de) Arbeitssystem für ein substrat und programm zur bestimmung einer werkbankmenge
JP7126122B2 (ja) 実装システム、および生産管理装置
WO2021125102A1 (ja) 実装システム及び実装方法
CN114041332B (zh) 安装装置、安装系统以及检查安装方法
JP2012038692A (ja) コネクタ不具合検査装置
TWI400020B (zh) 整合電路板資訊之置件方法
WO2023153341A1 (ja) 実装システム、及び実装方法
JP2017050496A (ja) 部品実装装置および部品実装システム
JP7398724B2 (ja) 部品装着装置、および部品装着方法
KR20230063492A (ko) 표면 실장 기술의 관리 시스템
Field et al. SMD placement using machine vision

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21808070

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022524357

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21808070

Country of ref document: EP

Kind code of ref document: A1