WO2021235196A1 - チップ部品の実装構造 - Google Patents

チップ部品の実装構造 Download PDF

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Publication number
WO2021235196A1
WO2021235196A1 PCT/JP2021/016755 JP2021016755W WO2021235196A1 WO 2021235196 A1 WO2021235196 A1 WO 2021235196A1 JP 2021016755 W JP2021016755 W JP 2021016755W WO 2021235196 A1 WO2021235196 A1 WO 2021235196A1
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WO
WIPO (PCT)
Prior art keywords
mounting structure
chip component
land
lands
component
Prior art date
Application number
PCT/JP2021/016755
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
幸男 小谷
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN202180035046.5A priority Critical patent/CN115553074A/zh
Priority to JP2022524354A priority patent/JPWO2021235196A1/ja
Publication of WO2021235196A1 publication Critical patent/WO2021235196A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • This disclosure relates to the mounting structure of chip components.
  • the flow soldering method and the reflow soldering method are well known as methods for mounting electronic components on a printed wiring board.
  • Patent Document 1 discloses a flow soldering method.
  • the printed wiring board used in this flow soldering method corresponds to a board in which various circuit elements are surfaced and a hole is formed in which a lead terminal of a lead component is inserted, and a board is opened. It is composed of a peelable sheet member having an opening formed at a position where the solder is formed. Then, an adhesive layer having adhesiveness is formed at a predetermined position other than the substrate electrode formed on the substrate, and the surface on which the adhesive layer is formed is covered with the sheet member.
  • Patent Document 2 discloses a reflow soldering method.
  • the mounting structure of this reflow soldering method is a mounting structure of a chip component formed by soldering terminal electrodes at both ends of the chip component to two lands on a printed wiring board.
  • the two lands formed on the printed wiring board are a conductor film in which a part of the circular opposite side is cut off and the two cut-out sides face each other in parallel. It is a thing.
  • the present disclosure provides a chip component mounting structure that enables stable bond printing on a printed wiring board and mounting arrangement of small chip components.
  • the mounting structure of the chip component in the present disclosure is a mounting structure of the chip component in which both terminal electrodes of the chip component are soldered to two lands on the printed wiring board in the flow soldering process.
  • the chip component is a small SMD component of 0.6 mm ⁇ 0.3 mm, and the dimension between the two lands is 0.23 mm or more and 0.25 mm or less.
  • the mounting structure of the chip component in the present disclosure is a printed wiring on which a small SMD (Surface Mounted Device) component (for example, 0.6 mm ⁇ 0.3 mm (0603 size)), which is a chip component, is mounted, which was not possible in the past. Stable bond printing can be performed on the board. This makes it possible to mount and arrange small SMD components. By defining the dimensions between the two lands, it is possible to eliminate bond printing defects and eliminate the dropout of small SMD parts during flow soldering work.
  • SMD Surface Mounted Device
  • FIG. 1 is a plan view showing a mounting structure of a chip component according to an embodiment.
  • FIG. 2 is a plan view showing a mounting structure of other chip components in the embodiment.
  • the size of SMD components mounted on printed wiring boards has also been miniaturized.
  • the surface area of the SMD component is about 1/2 size, from 1.0 mm ⁇ 0.5 mm (1005 size) to 0.6 mm ⁇ 0.3 mm (0603 size).
  • the size limit of SMD parts that can be flow soldered is 1.0 mm x 0.5 mm, and the number of small SMD parts that cannot be mounted by the flow soldering method is increasing.
  • a major problem in mounting a small SMD component with an SMD component size of 0.6 mm ⁇ 0.3 mm by the flow soldering method is that it is extremely difficult to perform stable bond printing on the printed wiring board. .. This is because the component size is small, so it is not possible to secure the land size and the distance between lands where bond printing can be performed on the lower part of the SMD component.
  • the present disclosure provides a chip component mounting structure that enables stable bond printing on a printed wiring board and mounting and placement of small chip components.
  • FIG. 1 is a plan view showing a mounting structure of a chip component according to an embodiment.
  • FIG. 1 shows a mounting structure of a small SMD component 2 which is a chip component having a size of 0.6 mm ⁇ 0.3 mm.
  • the mounting structure shown in FIG. 1 is an example in which the small SMD component 2 is mounted in a shape that conforms to the land shape, and the solder resist has an NSMD (Non Solder Mask Defined) structure that partially conforms to the land shape. An example is shown.
  • NSMD Non Solder Mask Defined
  • Two lands 3 on which the small SMD component 2 is mounted are formed on the printed wiring board 1.
  • the dimension t1 between the insides of the two lands 3 is set to 0.23 mm or more and 0.25 mm or less.
  • the dimension t2 of the portion of the land 3 on which the small SMD component 2 is mounted is set to 0.2 mm, and the width dimension t3 is set to 0.3 mm.
  • the longitudinal dimension t4 of each of the two lands 3 is set to 0.65 mm or more and 1.2 mm or less.
  • the direction of the width dimension t3 referred to here coincides with the lateral direction of the small SMD component 2. Further, the direction of the longitudinal dimension t4 coincides with the longitudinal direction of the small SMD component 2.
  • the dimension t1 is set to 0.23 mm or more and 0.25 mm or less, but if the dimension t1 is smaller than 0.23 mm, printing such that a bond is applied on the land 3 due to a deviation in bond printing or the like is printed. There is a problem that mistakes occur. Further, if the dimension t1 is smaller than 0.23 mm, there is a problem that a solder bridge is generated between the terminal electrodes at both ends of the small SMD component 2 during soldering.
  • the dimension t1 is larger than 0.25 mm, there is a problem that the terminal electrode of the small SMD component 2 and the land 3 are not soldered due to the misalignment when the component is mounted, and there is a high possibility that a soldering error occurs.
  • the above problem can be solved by setting the dimension t1 to 0.23 mm or more and 0.25 mm or less.
  • the longitudinal dimension t4 of each of the two lands 3 is set to 0.65 mm or more and 1.2 mm or less, but in the case of a small SMD component 2 having a size of 0.6 mm ⁇ 0.3 mm, soldering is performed. Since the land 3 is very small, if the longitudinal dimension t4 is smaller than 0.65 mm, moisture gas may be generated between the substrate and the solder when performing the flow soldering work, which may hinder soldering. There's a problem. The above problem can be solved by setting the longitudinal dimension t4 to 0.65 mm or more and 1.2 mm or less. Further, by setting the longitudinal dimension t4 to 1.2 mm or less, the small SMD component 2 can be mounted on the printed wiring board 1 at a high density.
  • a convex portion 4a for drawing in a circuit pattern 4 connected to a GND pattern, a power supply pattern circuit, or the like is provided.
  • the convex portion 4a includes a copper foil. That is, the land 3 has the convex portion 4a.
  • the circuit pattern 4 connected to the land 3 is connected via the convex portion 4a along the shape of the convex portion 4a.
  • three convex portions 4a are provided, but at least one may be provided. In other words, the convex portion 4a may be provided at the position where the circuit pattern 4 of the land 3 is connected (the lead-in portion of the circuit pattern 4).
  • a solder resist 5 is formed around the land 3 and the circuit pattern 4.
  • the solder resist 5 is an insulating printing (resist ink) portion, and when the pattern is pulled in, the soldered portion of the land 3 is prevented from becoming abnormally large.
  • Bond printing is performed between the insides of the two lands 3, and the small SMD component 2 is placed on the bond printing to temporarily fix the small SMD component 2.
  • the bond printing may be performed using a metal mask or a dispenser device.
  • FIG. 2 is a plan view showing a mounting structure of other chip components in the embodiment.
  • FIG. 2 shows a mounting structure of a small SMD component 2 having an SMD component size of 0.6 mm ⁇ 0.3 mm.
  • the pattern drawn into each of the two lands 3 indicates the wiring of the solid pattern 6.
  • a thermal pattern (cross-shaped pattern) is formed by connecting the solid pattern 6 to the lead-in pattern of the circuit pattern 4. That is, in the mounting structure shown in FIG. 2, the land 3 has at least two convex portions 4a.
  • a solid pattern 6 connected only to at least two convex portions 4a is provided on the printed wiring board 1.
  • the solid pattern 6 is connected along the shape of each of the convex portions 4a of at least two convex portions 4a.
  • the mounting structure of the chip component is the mounting of the chip component in which both terminal electrodes of the small SMD component 2 are soldered to the two lands 3 on the printed wiring board 1 in the flow soldering process. It is a structure.
  • the small SMD component has a size of 0.6 mm ⁇ 0.3 mm, and the dimension between the two lands 3 is 023 mm or more and 0.25 mm or less.
  • the dimension between the two lands 3 is 0.23 mm to 0.25 mm, it is possible to eliminate bond printing defects and eliminate the dropout of small SMD parts during flow soldering work.
  • the lengthwise dimension of the land 3 is 0.65 mm or more and 1.2 mm or less.
  • the mounting structure of the chip component is a shape that can draw the pattern to the land or a solid pattern in the mounting structure of the chip component in which the terminal electrodes at both ends of the chip component are soldered to the two lands on the printed wiring board 1.
  • the shape will be a thermal land.
  • the stress on the small SMD component 2 mounted due to the expansion and contraction of the printed wiring board 1 is relaxed by performing pattern wiring along the pattern pulling shape to the convex portion for pulling into the two lands 3. It becomes possible to eliminate the destruction of parts. Further, when the solid pattern 6 is pulled in, the pattern wiring along the shape of the convex portion 4a becomes a thermal land, and it is possible to stabilize the amount of solder during the flow soldering work. The quality of soldering can be improved.
  • the land 3 has a convex portion 4a. Then, the circuit pattern 4 connected to the land 3 is connected via the convex portion 4a along the shape of the convex portion 4a.
  • the land 3 has at least two convex portions 4a.
  • a solid pattern connected only to at least two convex portions 4a is provided on the printed wiring board 1.
  • the solid pattern 6 is connected along the shape of each of the convex portions 4a of at least two convex portions 4a.
  • the shape of the chip component may be any shape.
  • the land, the pattern, and the resist shape may be, for example, a shape with an R or a pattern arrangement only at a place where the pattern is actually drawn.
  • the feature is that it is possible to solder to two lands with the same amount of solder during flow soldering, and it is possible to make the stress on the terminals at both ends of the chip component the same due to the expansion and contraction of the printed wiring board. ing.
  • the mounting structure of the chip parts in the present disclosure makes it possible to improve productivity and realize low-cost production costs, which are the characteristics of the flow soldering method, and is applicable to various electric appliances.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2021/016755 2020-05-21 2021-04-27 チップ部品の実装構造 WO2021235196A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180035046.5A CN115553074A (zh) 2020-05-21 2021-04-27 芯片部件的安装构造
JP2022524354A JPWO2021235196A1 (zh) 2020-05-21 2021-04-27

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020088512 2020-05-21
JP2020-088512 2020-05-21

Publications (1)

Publication Number Publication Date
WO2021235196A1 true WO2021235196A1 (ja) 2021-11-25

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Application Number Title Priority Date Filing Date
PCT/JP2021/016755 WO2021235196A1 (ja) 2020-05-21 2021-04-27 チップ部品の実装構造

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JP (1) JPWO2021235196A1 (zh)
CN (1) CN115553074A (zh)
TW (1) TW202145849A (zh)
WO (1) WO2021235196A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163759U (zh) * 1981-04-09 1982-10-15
JP2002271009A (ja) * 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005167287A (ja) * 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57163759U (zh) * 1981-04-09 1982-10-15
JP2002271009A (ja) * 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005167287A (ja) * 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

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Publication number Publication date
CN115553074A (zh) 2022-12-30
JPWO2021235196A1 (zh) 2021-11-25
TW202145849A (zh) 2021-12-01

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