JPWO2021235196A1 - - Google Patents

Info

Publication number
JPWO2021235196A1
JPWO2021235196A1 JP2022524354A JP2022524354A JPWO2021235196A1 JP WO2021235196 A1 JPWO2021235196 A1 JP WO2021235196A1 JP 2022524354 A JP2022524354 A JP 2022524354A JP 2022524354 A JP2022524354 A JP 2022524354A JP WO2021235196 A1 JPWO2021235196 A1 JP WO2021235196A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022524354A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021235196A1 publication Critical patent/JPWO2021235196A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2022524354A 2020-05-21 2021-04-27 Pending JPWO2021235196A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020088512 2020-05-21
PCT/JP2021/016755 WO2021235196A1 (ja) 2020-05-21 2021-04-27 チップ部品の実装構造

Publications (1)

Publication Number Publication Date
JPWO2021235196A1 true JPWO2021235196A1 (zh) 2021-11-25

Family

ID=78708343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524354A Pending JPWO2021235196A1 (zh) 2020-05-21 2021-04-27

Country Status (4)

Country Link
JP (1) JPWO2021235196A1 (zh)
CN (1) CN115553074A (zh)
TW (1) TW202145849A (zh)
WO (1) WO2021235196A1 (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629755Y2 (zh) * 1981-04-09 1987-03-06
JP2002271009A (ja) * 2001-03-08 2002-09-20 Toyo Commun Equip Co Ltd 高密度実装用プリント配線基板及びプリント配線基板母材
JP2002329954A (ja) * 2001-04-27 2002-11-15 Nikon Corp プリント配線基板のフットプリント構造
JP2005167287A (ja) * 2005-03-11 2005-06-23 Horiba Ltd プリント基板
JP2007096208A (ja) * 2005-09-30 2007-04-12 Matsushita Electric Ind Co Ltd 回路部品搭載装置
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2020047799A (ja) * 2018-09-20 2020-03-26 株式会社明電舎 プリント基板の構造

Also Published As

Publication number Publication date
WO2021235196A1 (ja) 2021-11-25
CN115553074A (zh) 2022-12-30
TW202145849A (zh) 2021-12-01

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