WO2021205675A1 - Composition adhésive à base de bismaléimide, produit durci, feuille adhésive et carte de circuit imprimé souple - Google Patents

Composition adhésive à base de bismaléimide, produit durci, feuille adhésive et carte de circuit imprimé souple Download PDF

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Publication number
WO2021205675A1
WO2021205675A1 PCT/JP2020/027886 JP2020027886W WO2021205675A1 WO 2021205675 A1 WO2021205675 A1 WO 2021205675A1 JP 2020027886 W JP2020027886 W JP 2020027886W WO 2021205675 A1 WO2021205675 A1 WO 2021205675A1
Authority
WO
WIPO (PCT)
Prior art keywords
bismaleimide
adhesive composition
based adhesive
composition according
mass
Prior art date
Application number
PCT/JP2020/027886
Other languages
English (en)
Japanese (ja)
Inventor
来 佐藤
淳一 亀井
聡一郎 小宮
Original Assignee
昭和電工マテリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電工マテリアルズ株式会社 filed Critical 昭和電工マテリアルズ株式会社
Priority to KR1020227036317A priority Critical patent/KR20220160027A/ko
Priority to JP2022514304A priority patent/JPWO2021205675A1/ja
Publication of WO2021205675A1 publication Critical patent/WO2021205675A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention has low dielectric constant and dielectric loss tangent (hereinafter, both may be collectively referred to as "dielectric properties"), and has good adhesion to copper and polyimide films, particularly copper having a smooth surface.
  • the main task is to provide a novel bismaleimide-based adhesive.
  • Examples of the phosphonium salt compound include compounds having a tetraphenylphosphonium salt, an alkyltriphenylphosphonium salt, a tetraalkylphosphonium and the like, and specific examples thereof include tetraphenylphosphonium-thiocyanate and tetraphenylphosphonium-tetra-p-methylphenylborate.
  • the flame retardant is added to impart flame retardancy, and all known flame retardants can be used and are not particularly limited.
  • the flame retardant include phosphazene compounds, silicon compounds, zinc molybdate-supported talc, zinc molybdate-supported zinc oxide, aluminum hydroxide, magnesium hydroxide, molybdate and the like. These can be used alone or in combination of two or more.
  • the ion trap agent is added to capture ionic impurities contained in the liquid resin composition and prevent thermal deterioration and hygroscopic deterioration.
  • Any known ion trapping agent can be used and is not particularly limited.
  • Examples of the ion trap agent include hydrotalcites, bismuth hydroxide compounds, rare earth oxides and the like. These can be used alone or in combination of two or more.
  • Example 2 As the component (A), the component (B), the component (C), and the component (D), the types shown in Table 2 were used in the amounts shown in the same table, respectively, in the same manner as in Example 1, respectively. An adhesive composition was obtained.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une composition adhésive à base de bismaléimide contenant : une charge inorganique (B) ; et une résine de bismaléimide (A) formée par réaction d'un acide tétracarboxylique aromatique (a1), d'une diamine dimère (a2) et d'un anhydride maléique (a3), la teneur de la charge inorganique (B) étant de 5 à 55 % en masse par rapport à la teneur totale en matières solides de la composition adhésive.
PCT/JP2020/027886 2020-04-06 2020-07-17 Composition adhésive à base de bismaléimide, produit durci, feuille adhésive et carte de circuit imprimé souple WO2021205675A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020227036317A KR20220160027A (ko) 2020-04-06 2020-07-17 비스말레이미드계 접착제 조성물, 경화물, 접착 시트 및 플렉시블 프린트 배선판
JP2022514304A JPWO2021205675A1 (fr) 2020-04-06 2020-07-17

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-068399 2020-04-06
JP2020068399 2020-04-06

Publications (1)

Publication Number Publication Date
WO2021205675A1 true WO2021205675A1 (fr) 2021-10-14

Family

ID=78023091

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/027886 WO2021205675A1 (fr) 2020-04-06 2020-07-17 Composition adhésive à base de bismaléimide, produit durci, feuille adhésive et carte de circuit imprimé souple

Country Status (3)

Country Link
JP (1) JPWO2021205675A1 (fr)
KR (1) KR20220160027A (fr)
WO (1) WO2021205675A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024075744A1 (fr) * 2022-10-05 2024-04-11 株式会社レゾナック Composition de résine ainsi que procédé de fabrication de celle-ci, et objet durci associé

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015032639A (ja) * 2013-07-31 2015-02-16 日立化成株式会社 先塗布型熱硬化性アンダーフィル組成物、電子部品装置及び電子部品装置の製造方法
US20160237311A1 (en) * 2013-09-26 2016-08-18 Farhad G. Mizori Low dielectric constant, low dielectric dissipation factor coatings, films and adhesives
WO2018016489A1 (fr) * 2016-07-19 2018-01-25 日立化成株式会社 Composition de résine, plaque stratifiée, et carte de circuit imprimé multicouche
JP2018538377A (ja) * 2015-10-07 2018-12-27 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ３ｄ ｔｓｖパッケージのための配合物およびその使用
JP2019082598A (ja) * 2017-10-31 2019-05-30 日本化薬株式会社 ディスプレイ用封止剤
WO2019188189A1 (fr) * 2018-03-28 2019-10-03 パナソニックＩｐマネジメント株式会社 Composition de résine, et préimprégné, film revêtu de résine, feuille métallique revêtue de résine, stratifié à revêtement métallique, et carte de câblage obtenus chacun à l'aide de ladite composition de résine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5338469B2 (ja) 2008-05-14 2013-11-13 三菱瓦斯化学株式会社 ポリイミドおよびポリアミック酸
JP2014045076A (ja) 2012-08-27 2014-03-13 Nippon Kayaku Co Ltd 高周波回路用基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015032639A (ja) * 2013-07-31 2015-02-16 日立化成株式会社 先塗布型熱硬化性アンダーフィル組成物、電子部品装置及び電子部品装置の製造方法
US20160237311A1 (en) * 2013-09-26 2016-08-18 Farhad G. Mizori Low dielectric constant, low dielectric dissipation factor coatings, films and adhesives
JP2018538377A (ja) * 2015-10-07 2018-12-27 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ３ｄ ｔｓｖパッケージのための配合物およびその使用
WO2018016489A1 (fr) * 2016-07-19 2018-01-25 日立化成株式会社 Composition de résine, plaque stratifiée, et carte de circuit imprimé multicouche
JP2019082598A (ja) * 2017-10-31 2019-05-30 日本化薬株式会社 ディスプレイ用封止剤
WO2019188189A1 (fr) * 2018-03-28 2019-10-03 パナソニックＩｐマネジメント株式会社 Composition de résine, et préimprégné, film revêtu de résine, feuille métallique revêtue de résine, stratifié à revêtement métallique, et carte de câblage obtenus chacun à l'aide de ladite composition de résine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024075744A1 (fr) * 2022-10-05 2024-04-11 株式会社レゾナック Composition de résine ainsi que procédé de fabrication de celle-ci, et objet durci associé
WO2024075746A1 (fr) * 2022-10-05 2024-04-11 株式会社レゾナック Composition de résine ainsi que procédé de fabrication de celle-ci, et objet durci associé

Also Published As

Publication number Publication date
KR20220160027A (ko) 2022-12-05
JPWO2021205675A1 (fr) 2021-10-14

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