WO2021203367A1 - 等离子清洗装置及其使用方法 - Google Patents

等离子清洗装置及其使用方法 Download PDF

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Publication number
WO2021203367A1
WO2021203367A1 PCT/CN2020/083995 CN2020083995W WO2021203367A1 WO 2021203367 A1 WO2021203367 A1 WO 2021203367A1 CN 2020083995 W CN2020083995 W CN 2020083995W WO 2021203367 A1 WO2021203367 A1 WO 2021203367A1
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WO
WIPO (PCT)
Prior art keywords
product
lifting
reclaiming
moving
cleaning device
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Application number
PCT/CN2020/083995
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English (en)
French (fr)
Inventor
李志�
任宁
陶权
朱俊如
史军辉
肖亚军
高云峰
Original Assignee
大族激光科技产业集团股份有限公司
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Application filed by 大族激光科技产业集团股份有限公司 filed Critical 大族激光科技产业集团股份有限公司
Priority to PCT/CN2020/083995 priority Critical patent/WO2021203367A1/zh
Publication of WO2021203367A1 publication Critical patent/WO2021203367A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • This application relates to the technical field of plasma cleaning, and in particular to a plasma cleaning device and a method of use thereof.
  • Plasma cleaning technology is a technology that uses active substances (ions, electrons, and active groups, etc.) in the plasma to treat the surface of the sample to achieve cleaning, modification, and photoresist ashing. It is now widely used Rubber and plastics, automotive, medical and electronic industries. Especially in the electronics industry, plasma cleaning has a wide range of applications in de-glueing, wafer photoresist, wafer modification, and increasing adhesion after wafer de-glueing.
  • a plasma cleaning device and a method of use thereof are provided.
  • a plasma cleaning device includes a working platform, a material box, a lifting module, a plasma generator and a material moving module.
  • the work platform has a preparation position and a reclaiming position.
  • the material box is movably arranged on the work platform, the material box is used for accommodating products, and the material retrieving position is located below the products in the material box.
  • the lifting module is used to drive the material box to move along the vertical direction.
  • the plasma generator is arranged on the work platform and is adjacent to the material box, and the preparation position is located on the side of the plasma generator away from the material box.
  • the material-moving module is arranged on the work platform, and the material-moving module includes a material-moving driving mechanism and a material-removing mechanism for carrying the product.
  • the material-moving driving mechanism drives the material-removing mechanism in the The preparation position and the reclaiming position move back and forth, so that the product in the reclaiming mechanism passes through the plasma generator.
  • the lifting module drives the magazine to move in a vertical direction, so that the product falls into the reclaiming mechanism from the magazine, Or make the product fall into the magazine from the reclaiming mechanism.
  • the material box containing the product is placed on the work platform, and the material box is movably arranged on the work platform.
  • the plasma generator is started, and the material-moving drive mechanism drives the reclaiming mechanism from the ready position to the reclaiming position.
  • the reclaiming mechanism is located below the product in the material box, and then the lift drive mechanism drives the material box to move downward.
  • the reclaiming mechanism is made to obtain the product located above the reclaiming mechanism, and the moving drive mechanism drives the reclaiming mechanism carrying the product to move from the reclaiming position through the plasma generator to the preparation position, and the product undergoes plasma cleaning when passing through the plasma generator.
  • the entire cleaning process of the plasma cleaning device has high cleaning efficiency and simple operation.
  • the material box is used for accommodating a plurality of the products, and the material box includes two oppositely arranged side walls, and each side wall is provided with a plurality of cards arranged at intervals in the vertical direction. Slots, both ends of each product are slidably received in a card slot, the thickness of the card slot is greater than the thickness of the product, and the material taking mechanism can be inserted between two adjacent products.
  • the material-moving module further includes a material-moving slide rail and a material-moving slider that are arranged on the work platform, and the material-moving slide rail extends from the preparation position to the reclaimer Position, the reclaiming mechanism is fixed on the material moving slider, and the material moving drive mechanism drives the material moving slider to move along the material moving slide.
  • the lifting module includes a lifting driving mechanism and a lifting platform
  • the material box is placed on the lifting platform
  • the work platform is provided with lifting holes
  • the lifting driving mechanism drives the lifting The table passes through the lifting hole and moves along the vertical direction.
  • the lift module further includes a lift slide rail and a lift slide, the lift slide extends in a vertical direction, the lift platform is fixed on the lift slide, and the lift drive The mechanism drives the lifting slide to move along the lifting slide.
  • the reclaiming mechanism is U-shaped in shape and includes two legs extending in the direction of the magazine, and the surfaces of the two legs in contact with the product are provided with non-slip structures.
  • the anti-slip structure is a plurality of anti-slip ribs arranged at intervals.
  • the plasma cleaning device further includes a gas source device that passes argon gas into the plasma generator, and the plasma generator excites the argon gas to generate plasma.
  • a method of using the plasma cleaning device described above comprising: the material-moving drive mechanism drives the material-removing mechanism to move from the preparation position to the material-removing position, so that the material-removing mechanism is located below the first product .
  • the lifting driving mechanism drives the magazine to move downward for a first distance, so that the first product falls on the reclaiming mechanism.
  • the material-moving driving mechanism drives the material-removing mechanism carrying the first product to move from the material-removing position to the preparation position via the plasma generator.
  • the plasma cleaning method uses the cooperation of the material-moving drive mechanism and the lifting drive mechanism to make the reclaiming mechanism take out the first product in the magazine and carry the first product from the reclaiming position to the preparation position via the plasma generator, thereby Complete the plasma cleaning of the first product.
  • the plasma cleaning device has high cleaning efficiency, can ensure product uniformity, has low manufacturing cost and simple operation.
  • the method further includes:
  • the material-moving driving mechanism drives the material-removing mechanism carrying the first product to move from the preparation position to the material-removing position;
  • the lifting drive mechanism drives the magazine to move upward for a first distance, so that the first product carried on the material reclaiming mechanism is placed back in the magazine.
  • the method further includes:
  • the material-moving drive mechanism drives the material-removing mechanism to move from the material-removing position to the preparation position
  • the lifting driving mechanism drives the material box to move down a second distance
  • the material-moving drive mechanism drives the material-removing mechanism from the preparation position to the material-removing position, so that the material-removing mechanism is located between the first product and the second product;
  • the lifting driving mechanism drives the material box to move downward by the first distance, so that the second product falls on the reclaiming mechanism;
  • the material-moving driving mechanism drives the material-removing mechanism carrying the second product to move from the material-removing position to the preparation position via the plasma generator.
  • Fig. 1 is a perspective view of a plasma cleaning device according to an embodiment
  • Fig. 2 is a perspective view of the plasma cleaning device shown in Fig. 1 with the protective cover and cabinet removed;
  • Fig. 3 is a perspective view of the plasma cleaning device shown in Fig. 2 from another perspective;
  • Figure 4 is an enlarged perspective view of the material box, plasma generator and material moving module in Figure 2;
  • Figure 5 is an exploded view of the work platform, material box, plasma generator, material moving module and lifting module in Figure 2;
  • Figure 6 is an enlarged perspective view of the cartridge in Figure 5;
  • Figure 7 is a cross-sectional view taken along line A-A in Figure 6;
  • Fig. 8 is an enlarged perspective view of B in Fig. 7;
  • FIG. 9 is an enlarged perspective view of the lifting module in FIG. 5;
  • Figure 10 is an exploded view of the lifting module in Figure 9;
  • FIGS 11-17 are schematic diagrams of the use process of the plasma cleaning device shown in Figure 1 respectively;
  • FIG. 18 is a flowchart of a method of using a plasma cleaning device according to an embodiment.
  • an embodiment provides a plasma cleaning device 10 mainly used for cleaning products 20.
  • the plasma cleaning device 10 includes a work platform 100, a material box 200, a plasma generator 300, a material moving module 400 and a lifting module 500.
  • the work platform 100 is roughly a square plate extending in a horizontal direction, and the material box 200, the plasma generator 300, and the material moving module 400 are arranged on the work platform 100 respectively.
  • the plasma generator 300 is fixedly arranged in the middle of the work platform 100, and the material box 200 and the material moving module 400 are respectively located on both sides of the plasma generator 300.
  • the work platform 100 has a preparation position 110 and a reclaiming position 120.
  • the initial position of the material moving module 400 is at the ready position 110.
  • the position of the material box 200 is the material reclaiming position 120.
  • the material-moving module 400 includes a material-moving driving mechanism 410 and a material-removing mechanism 420 for carrying the product 20.
  • the material-moving driving mechanism 410 can drive the material-removing mechanism 420 to move back and forth between the preparation position 110 and the material-removing position 120.
  • the material box 200 is movably arranged on the work platform 100 and is used for accommodating one or more products 20.
  • the cartridge 200 is substantially a hollow box body, which includes a top wall 250, a bottom wall 260, and two opposite side walls 230.
  • the top wall 250 is connected to the top of the two side walls 230
  • the bottom wall 260 is connected to the bottom of the two side walls 230.
  • Each side wall 230 is provided with a plurality of slots 210 arranged at intervals along the vertical direction. Both ends of each product 20 are slidably received in a slot 210 respectively.
  • the thickness T1 of the card slot 210 in the vertical direction is greater than the thickness T2 of the product 20, so that both ends of the product 20 can move up and down a certain distance in the card slot 210 in the vertical direction.
  • the thickness T1 of the card slot 210 is greater than the thickness of the material removal mechanism 420 of the material moving module 400, so that the material removal mechanism 420 can be inserted between two adjacent products 20.
  • the inner sides of the two side walls 230 of the cartridge 200 are each provided with a plurality of protruding strips 220 spaced apart along the vertical direction, and a card slot 210 is formed between two adjacent protruding strips 220.
  • the card slot 210 may also be a plurality of strip-shaped holes arranged on the two side walls 230 at intervals along the vertical direction.
  • the plasma generator 300 is fixedly arranged on the work platform 100, and a channel allowing the material reclaiming mechanism 420 to pass through is arranged below it.
  • the reclaiming mechanism 420 carries the product 20 and passes under the plasma generator 300, the plasma generator 300 can perform plasma cleaning on the product 20.
  • the plasma cleaning device 10 further includes a gas source device (not shown in the drawings).
  • the gas source device is used to pass argon gas into the plasma generator 300, and the plasma generator 300 is used to excite the argon gas to generate plasma.
  • the plasma generator 300 is passed through argon gas, and the argon gas is excited by the plasma exciter to generate plasma, so that plasma cleaning can be performed under normal pressure, eliminating the need for vacuum equipment in the traditional vacuum plasma cleaning device 10
  • argon plasma is used to clean the product 20.
  • the cleaning effect of the product 20 is more uniform, and it is not easy to have the problem that the cleaning effect around the product 20 is worse than the intermediate cleaning effect.
  • the material moving module 400 is movably installed on the work platform 100.
  • the material-moving module 400 includes a material-moving driving mechanism 410, a material-removing mechanism 420, a material-moving slide 430, and a material-moving slider 440.
  • the material-moving driving mechanism 410 can drive the material-removing mechanism 420 to reciprocate between the preparation position 110 and the material-removing position 120, so that the product 20 carried in the material-removing mechanism 420 passes under the plasma generator 300.
  • the material-moving driving mechanism 410 is a motor.
  • the material-moving driving mechanism 410 may also be an air cylinder or an oil cylinder or the like.
  • the reclaiming mechanism 420 can extend into the magazine 200 from between the two side walls 230 to take out the product 20 from the magazine 200 or put the product 20 back into the magazine 200.
  • the reclaiming mechanism 420 is substantially a U-shaped thin plate, and includes two legs 421 extending in the direction of the magazine 200 and connected to each other. The product 20 can be placed on the two feet 421 steadily.
  • the U-shaped reclaiming mechanism 420 is beneficial to reduce the material of the reclaiming mechanism 420 and save costs on the one hand, and on the other hand, it is beneficial to reduce the weight of the reclaiming mechanism 420 and prevent the reclaiming mechanism 420 from being damaged.
  • the product 20 and its own weight cause deformation and cannot be inserted between two adjacent products 20 in the material box 200. At the same time, it can also reduce the contact area between the reclaiming mechanism 420 and the product 20, and prevent the reclaiming mechanism 420 from colliding with each other. Product 20 caused damage.
  • the product 20 is a wafer embedded in a ring frame.
  • the picking mechanism 420 picks up material
  • the two legs 421 of the picking mechanism 420 are respectively supported under the ring frame and have almost no contact with the wafer, so as to well protect the wafer from the picking mechanism 420.
  • the reclaiming mechanism 420 may also be ring-shaped, V-shaped or other shapes.
  • the reclaiming mechanism 420 may also be an electromagnet, and the ring frame of the product 20 may also be made of a ferromagnetic material.
  • the magnetism of the reclaiming mechanism 420 can be controlled to control the adsorption and desorption of the product 20 by the reclaiming mechanism 420.
  • the surfaces of the two supporting feet 421 that are in contact with the product 20 are both provided with non-slip structures (not shown).
  • the anti-skid structure helps prevent the product 20 from falling from the reclaiming mechanism 420 during the movement of the reclaiming mechanism 420.
  • the anti-slip structure is a plurality of anti-slip ribs arranged at intervals.
  • the non-slip ribs can not only increase the friction between the product 20 and the reclaiming mechanism 420, but also prevent the product 20 from falling from the reclaiming mechanism 420 during the movement of the reclaiming mechanism 420, and at the same time, it can further reduce the relationship between the reclaiming mechanism 420 and the product 20.
  • the contact area of the product 20 prevents damage to the product 20 caused by the reclaiming mechanism 420.
  • the material-moving slide 430 is generally elongated and extends from the preparation position 110 to the material-removing position 120.
  • the work platform 100 is further provided with a slide rail hole 140, and the material moving slide rail 430 is embedded in the slide rail hole 140.
  • the material-moving slider 440 is movably disposed on the material-moving slide rail 430, and the material-moving driving mechanism 410 can drive the material-moving slider 440 to move along the material-moving slide 430.
  • the material reclaiming mechanism 420 is fixed on the material moving slider 440. In this embodiment, the joint of the two legs 421 of the material reclaiming mechanism 420 is fixed to the material moving slider 440 by a plurality of screws.
  • the lifting module 500 is used to drive the magazine 200 to move along the vertical direction.
  • the lifting module 500 includes a lifting driving mechanism 510 and a lifting platform 520.
  • the magazine 200 is placed on the lifting platform 520.
  • the lifting driving mechanism 510 is a motor.
  • the lifting driving mechanism 510 may also be an air cylinder or an oil cylinder. As shown in FIG.
  • the work platform 100 is provided with a lifting hole 130 corresponding to the shape of the lifting platform 520, and the lifting driving mechanism 510 can drive the lifting platform 520 to pass through the lifting hole 130 and move along the vertical direction, so as to realize the material box 200 Lifting, so as to cooperate with the reclaiming mechanism 420 to take out the product 20 in the magazine 200 for cleaning, and place the cleaned product 20 back into the magazine 200.
  • the lifting module 500 further includes a lifting slide 530 and a lifting slider 540.
  • the lifting slide 530 is arranged below the work platform 100 and extends in a vertical direction.
  • the lifting slider 540 can move along the lifting slide 530 under the driving of the lifting driving mechanism 510.
  • the lifting platform 520 is fixed on the lifting slider 540 and moves along with the lifting slider 540.
  • the lifting module 500 further includes a fixed bracket 580, a lifting bracket 570, two lifting rails 550, and four auxiliary sliding blocks 560.
  • the fixing bracket 580 is arranged opposite to the lifting slide 530, and two lifting rails 550 are fixedly arranged on the fixing bracket 580 in parallel.
  • the lifting platform 520 is fixed on the top of the lifting bracket 570.
  • Four auxiliary sliding blocks 560 are fixed in pairs on one side of the lifting bracket 570, and each group of auxiliary sliding blocks 560 can slide in a vertical direction on a lifting rail 550.
  • the lifting slider 540 is fixed on the other side of the lifting bracket 570.
  • the lifting bracket 570 and the lifting platform 520 can move up and down in the vertical direction between the fixed bracket 580 and the lifting slide 530.
  • the plasma cleaning device 10 further includes a power source (not shown in the drawings), which is used to power the plasma generator 300, the material moving drive mechanism 410, the lifting drive mechanism 510 and other components.
  • the plasma cleaning device 10 further includes a matcher 710.
  • the matcher 710 facilitates the effective transmission of the power of the power source to the plasma generator 300, thereby generating the desired plasma power.
  • the plasma cleaning device 10 further includes a protective cover 610.
  • the protective cover 610 is arranged on the work platform 100.
  • the material box 200, the plasma generator 300, the material moving module 400 and the matching device 710 are all arranged in the protective cover 610.
  • the protective cover 610 can provide safety protection for the operator effect.
  • the protective cover 610 is provided with a hatch 612 to facilitate loading and unloading and viewing of the internal condition of the protective cover 610.
  • the plasma cleaning device 10 further includes a cabinet 620, and the cabinet 620 is located under the work platform 100.
  • the lifting module 500 is at least partially located in the cabinet 620.
  • the plasma cleaning device 10 also includes an electrical installation board 720 and a chiller 730 for cooling the plasma generator 300. In this embodiment, the power supply, the electrical installation board 720, and the chiller 730 are all located in the cabinet 620.
  • the plasma cleaning device 10 further includes a touch screen 740 and an indicator light 750 which are arranged outside the protective cover 610.
  • the touch screen 740 is convenient for the operator to input parameters such as the total number of products 20 and the argon gas filling amount, and it is also convenient for monitoring various parameters of the plasma cleaning process.
  • the indicator light 750 is used to indicate the progress and end of the cleaning process.
  • the plasma cleaning device 10 also includes a controller (not shown).
  • the material moving drive mechanism 410, the lifting drive mechanism 510, the touch screen 740 and the indicator light 750 are all electrically connected to the controller, and the controller is used to obtain whether the product 20 is After the cleaning is completed, the controller is used to control the operation of the material-moving driving mechanism 410 and the lifting driving mechanism 510.
  • the controller can control the operation of the material-moving driving mechanism 410 and the lifting driving mechanism 510 according to whether the product 20 has been cleaned, so as to improve the automation of the entire plasma cleaning device 10.
  • the controller refers to a device that can obtain information about whether the product 20 has been cleaned, and realize the control of the material moving drive mechanism 410 and the lifting drive mechanism 510, such as a computer, PLC (editable controller), DDC At least one of (digital controller) and PCB (printed circuit board) board.
  • the information about whether the product 20 has been cleaned may include information such as the total number of products 20, the number of products 20 that have been cleaned, and the comparison result of the two.
  • the total number of products 20 can be obtained by manual input on the touch screen 740.
  • the number of cleaned products 20 can be obtained by a position sensor arranged on the work platform 100.
  • a position sensor (not shown in the figure) electrically connected to the controller is arranged at the reclaiming position 120.
  • the material mechanism passes by, that is, it transmits an arrival signal to the controller, and the number of cleaned products 20 increases by one every time the controller receives the arrival signal twice.
  • an embodiment of the present application also proposes a method for using the plasma cleaning device 10, which includes the following steps:
  • the material-moving driving mechanism 410 drives the material-removing mechanism 420 to move from the preparation position 110 to the material-removing position 120, so that the material-removing mechanism 420 is located below the first product 20.
  • the reclaiming mechanism 420 is located at the preparation position 110.
  • a plurality of products 20 including a first product, a second product, etc. are housed in the magazine 200 stacked on top of each other.
  • the controller controls the material-moving driving mechanism 410 to drive the material-removing mechanism 420 to move from the preparation position 110 to the material-removing position 120.
  • the picking mechanism 420 is located at the picking position 120, since the vertical distance between two adjacent products 20 is greater than the thickness of the picking mechanism 420, the picking mechanism 420 can be inserted between two adjacent products 20. It can be understood that if there is only one product 20 in the magazine 200, the reclaiming mechanism 420 is located below the first product 20.
  • the lifting driving mechanism 510 drives the magazine 200 to move downward for a first distance, so that the first product 20 falls on the material unloading mechanism 420.
  • the distance between the reclaiming mechanism 420 and the first product 20 located above the reclaiming mechanism 420 is a first distance D1.
  • the lifting drive mechanism 510 drives the magazine 200 to move downward for a first distance
  • the middle of the first product 20 will contact the reclaiming mechanism 420, and the two ends of the first product 20 will no longer contact the slot 210 of the magazine 200 , Even if the first product 20 falls on the material taking mechanism 420, it is convenient for the material taking mechanism 420 to remove the first product 20 from the magazine 200 in the subsequent steps.
  • the first distance is greater than the first distance D1, but less than the vertical distance D2 between two adjacent products 20.
  • the material-moving driving mechanism 410 drives the material-removing mechanism 420 carrying the first product 20 to move from the material-removing position 120 to the preparation position 110 via the plasma generator 300.
  • the first product 20 will pass under the plasma generator 300 for the first time.
  • the controller issues a working instruction to the plasma generator 300 to make it perform the first plasma cleaning on the first product 20.
  • the duration of the first plasma cleaning that is, the time for the first product 20 to pass under the plasma generator 300, can be precisely controlled by the material-moving driving mechanism 410 according to requirements.
  • the material-moving driving mechanism 410 drives the material-removing mechanism 420 carrying the first product 20 to move from the preparation position 110 to the material-removing position 120.
  • the reclaiming mechanism 420 returns from the preparation position 110 to the reclaiming position 120.
  • the first product 20 will pass under the plasma generator 300 for the second time.
  • the controller issues a working instruction to the plasma generator 300 to make it perform a second plasma cleaning on the first product 20.
  • the steps of the first plasma cleaning can also be omitted, so that the speed of the reclaiming mechanism 420 from the preparation position 110 to the reclaiming position 120 can be accelerated, and work efficiency can be improved.
  • the first product 20 carried on the reclaiming mechanism 420 will be located inside the magazine 200.
  • the lifting driving mechanism 510 drives the magazine 200 to move upward by a first distance, so that the first product 20 on the reclaiming mechanism 420 is placed in the magazine 200.
  • the two ends of the first product 20 will contact the slot 210 of the magazine 200, and the middle of the first product 20 will no longer contact the reclaiming mechanism 420.
  • the contact means that the first product 20 is placed back into the box 200. At this time, the distance between the reclaiming mechanism 420 and the first product 20 is restored to the first distance D1.
  • the material-moving driving mechanism 410 drives the material-removing mechanism 420 to move from the material-removing position 120 to the preparation position 110.
  • the reclaiming mechanism 420 returns to the preparation position 110 to prepare for the next cleaning.
  • the above is the entire process of cleaning the first product 20.
  • the above method further includes the following steps:
  • step S700 Determine whether the products 20 in the magazine 200 are all cleaned, if yes, end the cleaning process, and if not, execute step S800.
  • step S700 the specific steps for judging whether the product 20 in the cartridge 200 is cleaned are: obtaining the total number of products 20 in the cartridge 200; obtaining the number of cleaned products 20; comparing the total number of products 20 in the cartridge 200 with The number of products 20 that have been cleaned. If the total number of products 20 in the magazine 200 is greater than the number of products 20 that have been cleaned, the products 20 in the magazine 200 are all cleaned. If the total number of products 20 in the magazine 200 is not greater than the total number of products 20 If the number of cleaned products is 20, the product 20 in the magazine 200 has not been cleaned.
  • the lifting drive mechanism 510 drives the magazine 200 to move a second distance, and repeats steps S100 to S600.
  • step S800 if the reclaiming mechanism 420 sequentially takes out the products 20 from top to bottom for cleaning, the lifting drive mechanism 510 drives the magazine 200 to move upward by a second distance D2; if the reclaiming mechanism 420 sequentially takes out the products 20 from bottom to top For cleaning, the lifting driving mechanism 510 drives the magazine 200 to move downward by a second distance D2.
  • the second distance D2 is the vertical distance between two adjacent products 20.
  • the entire cleaning process of the above plasma cleaning device has high cleaning efficiency and simple operation.
  • multiple products 20 can always be located in the plasma cleaning device 10.
  • the product 20 is uneven or even damaged.
  • the automatic cleaning of multiple products 20 can be realized through the mutual cooperation of the material moving module 400 and the lifting module 500, which saves equipment cost compared with the use of manipulators to unload materials, reduces the size of the device, and is easier to integrate into a variety of products. In the industrial assembly line, the ease of operation is also greatly improved.

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Abstract

一种等离子清洗装置及其使用方法，该等离子清洗装置(10)包括作业平台(100)、料盒(200)、等离子发生器(300)、移料模组(400)和升降模组(500)。作业平台(100)具有准备位置(110)和取料位置(120)，料盒(200)用于容纳产品(20)，取料位置(120)位于料盒(200)中的产品的下方。升降模组(500)用于驱动料盒(200)沿着竖直方向移动。等离子发生器(300)设置于作业平台(100)上并与料盒(200)相邻，准备位置(110)位于等离子发生器(300)远离料盒(200)的一侧。移料模组(400)包括移料驱动机构(410)和用于承载产品(20)的取料机构(420)，移料驱动机构(410)驱动取料机构(420)在准备位置(110)和取料位置(120)之间往复移动，以使得取料机构(420)中的产品(20)经过等离子发生器(300)。其中当取料机构(420)位于取料位置(120)时，升降模组(500)驱动料盒(200)沿着竖直方向移动，以使产品(20)从料盒(200)落入取料机构(420)，或使产品(20)从取料机构(420)落入料盒(200)。

Description

等离子清洗装置及其使用方法 技术领域
本申请涉及等离子清洗技术领域，特别是涉及一种等离子清洗装置及其使用方法。
背景技术
等离子清洗技术是一种利用等离子体中的活性物质(离子、电子及活性基团等)来处理样品表面，从而实现清洁、改性、光刻胶灰化等目的的技术，现已广泛运用于橡塑、汽车、医疗及电子行业。尤其在电子行业，等离子清洗在除胶、晶圆光刻胶、晶圆改性、晶圆除胶后增加附着力等方面均具有广泛的应用。
现有的等离子清洗装置多采用人工上下料，这影响清洗效率又容易影响产品的均匀性，特别是上下料过程中的震动或意外的磕碰都可能损伤产品的品质。另外的一些等离子清洗装置采用机械手替代人工上下料，但这不仅增加成本，还增大了操作复杂度。
发明内容
根据本申请的各种实施例，提供一种等离子清洗装置及其使用方法。
一种等离子清洗装置，包括作业平台、料盒、升降模组、等离子发生器和移料模组。作业平台具有准备位置和取料位置。料盒活动设置于所述作业平台上，所述料盒用于容纳产品，所述取料位置位于所述料盒中的产品的下方。升降模组用于驱动所述料盒沿着竖直方向移动。等离子发生器设置于所述作业平台上并与所述料盒相邻，所述准备位置位于所述等离子发生器远离所述料盒的一侧。移料模组设置于所述作业平台上，所述移料模组包括移料驱动机构和用于承载所述产品的取料机构，所述移料驱动机构驱动所述取料机构在所述准备位置和所述取料位置之间往复移动，以使得所述取料机构中的所述产品经过所述等离子发生器。其中当所述取料机构位于所述取料位置时，所述升降模组驱动所述料盒沿着竖直方向移动，以使所述产品从所述料盒落入所述取料机构，或使所述产品从所述取料机构落入所述料盒。
该等离子清洗装置中，容纳有产品的料盒放置于作业平台上，且料盒活动设置于所述作业平台上。清洗时，启动等离子发生器，移料驱动机构驱动取料机构从准备位置移动至取料位置，此时取料机构位于料盒中的产品的下方，继而升降驱动机构驱动料盒向下移动，使得取料机构取得位于取料机构上方的产品，移料驱动机构再驱动携带产品的取料机构从取料位置经等离子发生器移动至准备位置，产品在经过等离子发生器时进行等离子清洗。该等离子清洗装置的整个清洗过程清洗效率高、操作简单。
在其中一个实施例中，所述料盒用于容纳多个所述产品，所述料盒包括相对设置的两个侧壁，每一侧壁上设有多个沿竖直方向间隔排列的卡槽，每一所述产品的两端分别滑动收容于一个卡槽内，所述卡槽的厚度大于所述产品的厚度，所述取料机构能够插入两个相邻的所 述产品之间。
在其中一个实施例中，所述移料模组还包括设置于所述作业平台上的移料滑轨和移料滑块，所述移料滑轨从所述准备位置延伸到所述取料位置，所述取料机构固定于所述移料滑块上，所述移料驱动机构驱动所述移料滑块沿着所述移料滑轨移动。
在其中一个实施例中，所述升降模组包括升降驱动机构和升降台，所述料盒放置在所述升降台上，所述作业平台开设有升降孔，所述升降驱动机构驱动所述升降台穿过所述升降孔并沿着所述竖直方向移动。
在其中一个实施例中，所述升降模组还包括升降滑轨和升降滑块，所述升降滑轨沿竖直方向延伸，所述升降台固定于所述升降滑块上，所述升降驱动机构驱动所述升降滑块沿所述升降滑轨移动。
在其中一个实施例中，所述取料机构的形状为U形，且包括两个向所述料盒方向延伸的支脚，所述两个支脚与所述产品接触的表面均设有防滑结构。
在其中一个实施例中，所述防滑结构为多个间隔设置的防滑凸棱。
在其中一个实施例中，等离子清洗装置还包括气源设备，所述气源设备向所述等离子发生器通入氩气，所述等离子发生器激发氩气以产生等离子体。
一种上述等离子清洗装置的使用方法，包括：所述移料驱动机构驱动所述取料机构从所述准备位置移动至所述取料位置，以使所述取料机构位于第一产品的下方。所述升降驱动机构驱动所述料盒向下移动第一距离，使得所述第一产品落于所述取料机构上。所述移料驱动机构驱动承载所述第一产品的所述取料机构从所述取料位置经所述等离子发生器移动至所述准备位置。
该等离子清洗方法通过移料驱动机构和升降驱动机构的配合，使得取料机构将料盒内的第一产品取出，并携带该第一产品从取料位置经等离子发生器移动至准备位置，从而完成该第一产品的等离子清洗。该等离子清洗装置清洗效率高、能保证产品的均匀性，而且制造成本低，操作简单。
在其中一个实施例中，该方法还包括：
所述移料驱动机构驱动承载第一产品的所述取料机构从所述准备位置移动至所述取料位置；
所述升降驱动机构驱动所述料盒向上移动第一距离，使得承载于所述取料机构上的所述第一产品放置回所述料盒内。
在其中一个实施例中，该方法还包括:
所述移料驱动机构驱动所述取料机构从所述取料位置移动至所述准备位置；
所述升降驱动机构驱动料盒向下移动第二距离；
所述移料驱动机构驱动所述取料机构从所述准备位置移动至所述取料位置，使得所述取料机构位于所述第一产品和第二产品之间；
所述升降驱动机构驱动料盒向下移动所述第一距离，使得所述第二产品落于所述取料机 构上；及
所述移料驱动机构驱动承载所述第二产品的所述取料机构从所述取料位置经所述等离子发生器移动至所述准备位置。
本发明的一个或多个实施例的细节在下面的附图和描述中提出。本发明的其他特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更好地描述和说明这里公开的那些发明的实施例和/或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的发明、目前描述的实施例和/或示例以及目前理解的这些发明的最佳模式中的任何一者的范围的限制。
图1为根据一实施例的等离子清洗装置的立体图；
图2为图1所示的等离子清洗装置去除防护罩和机柜后的立体图；
图3为图2所示的等离子清洗装置的另一个视角的立体图；
图4为图2中的料盒、等离子发生器及移料模组的放大立体图；
图5为图2中的作业平台、料盒、等离子发生器、移料模组及升降模组的爆炸图；
图6为图5中的料盒的放大立体图；
图7为沿图6中A-A线的剖视图；
图8为图7的B处放大立体图；
图9为图5中的升降模组的放大立体图；
图10为图9中的升降模组的爆炸图；
图11-图17分别为图1所示的等离子清洗装置的使用过程示意图；
图18为一实施例的等离子清洗装置的使用方法的流程图。
具体实施方式
为使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施方式，对本申请进行进一步的详细说明。应当理解的是，此处所描述的具体实施方式仅用以解释本申请，并不限定本申请的保护范围。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本申请。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
如图1和图2所示，一实施例提出一种等离子清洗装置10主要用于清洗产品20。等离子清洗装置10包括作业平台100、料盒200、等离子发生器300、移料模组400和升降模组500。
如图2和图3所示，作业平台100大致为沿水平方向延伸的方形板，料盒200、等离子 发生器300、移料模组400分别设置在作业平台100上。具体的，等离子发生器300固定设置于作业平台100的中部，料盒200和移料模组400分别位于等离子发生器300的两侧。作业平台100具有准备位置110和取料位置120。移料模组400的初始位置位于准备位置110。料盒200所在位置为取料位置120。移料模组400包括移料驱动机构410和用于承载产品20的取料机构420，移料驱动机构410能够驱动取料机构420在准备位置110和取料位置120之间往复移动。
料盒200活动设置于作业平台100上，用于容纳一个或多个产品20。本实施例中，如图6至图8所示，料盒200大致为中空的盒体，其包括顶壁250、底壁260、及相对设置的两个侧壁230。顶壁250连接于两个侧壁230的顶部，底壁260连接于两个侧壁230的底部。每一侧壁230上设有多个沿竖直方向间隔排列的卡槽210。每一产品20的两端分别滑动收容于一个卡槽210内。卡槽210在竖直方向上的厚度T1大于产品20的厚度T2，从而使得产品20的两端能够在卡槽210内沿竖直方向上下移动一定的距离。另外，卡槽210的厚度T1要大于移料模组400的取料机构420的厚度，从而使得取料机构420能够插入相邻两个产品20之间。在本实施例中，料盒200的两个侧壁230内侧均设有多个沿着竖直方向间隔设置的凸条220，相邻两个凸条220之间形成一个卡槽210。在其他实施例中，卡槽210也可以为开设于两个侧壁230上的多个沿着竖直方向间隔设置的条形孔。
如图2和图3所示，等离子发生器300固定设置于作业平台100上，其下方设置有允许取料机构420穿过的通道。当取料机构420承载产品20从等离子发生器300的下方穿过时，等离子发生器300能够对产品20进行等离子清洗。
进一步地，等离子清洗装置10还包括气源设备(附图未示出)，气源设备用于向等离子发生器300通入氩气，等离子发生器300用于激发氩气以产生等离子体。使等离子发生器300通入氩气，并通过等离子激发器激发氩气以产生等离子体，使得在常压情况下即能进行等离子清洗，省去了传统的真空等离子清洗装置10中对真空设备的需求，同时相对于真空等离子，采用氩气等离子对产品20进行清洗，产品20的清洗效果更加均匀，不易出现产品20四周清洗效果比中间清洗效果较差的问题。
如图3和图4所示，移料模组400活动设置于作业平台100。具体的，移料模组400包括移料驱动机构410、取料机构420、移料滑轨430和移料滑块440。
移料驱动机构410能够驱动取料机构420在准备位置110和取料位置120之间往复移动，以使得承载于取料机构420中的产品20经过等离子发生器300的下方。本实施例中，移料驱动机构410为电机。在其他实施例中，移料驱动机构410也可以为气缸或油缸等。
取料机构420能够从两个侧壁230之间伸入料盒200中，从而从料盒200中取出产品20，或将产品20放回料盒200。如图3所示，本实施例中，取料机构420大致为U形薄板，且包括向料盒200方向延伸且相互连接的两个支脚421。产品20能够平稳地放置在两个支脚421上。相对于采用一整块板，U形的取料机构420一方面有利于减少取料机构420的制作材料，节约成本，另一方面有利于减轻取料机构420的重量，防止取料机构420因产品20及自身的重量而导致变形而无法插设入料盒200内的相邻两个产品20之间，同时也能减小取料机构420与产品20的接触面积，防止取料机构420对产品20造成损伤。本实施例中，产品20为镶嵌于环形框架内的晶圆片。取料机构420取料时，取料机构420的两个支脚421分别支撑于环形框架的下方，与晶圆片几乎没有接触，从而很好地保护晶圆片不受取料机构420损伤。当然，根据实际使用需要，取料机构420也可以为环形、V型或其他形状。在其他实施例中，取料机构420也可以为电磁铁，产品20的环形框架也可由具有铁磁性的材料制成。通过控制取料机构420的通断电可控制取料机构420的磁性，以控制取料机构420对产品20的吸附和解吸。
进一步地，两个支脚421与产品20接触的表面均设有防滑结构(未示出)。该防滑结构有助于防止产品20随取料机构420移动过程中从取料机构420上掉落。本实施例中，防滑结构为多个间隔设置的防滑凸棱。防滑凸棱不仅能增大产品20与取料机构420之间的摩擦力， 防止产品20随取料机构420移动过程中从取料机构420上掉落，同时能进一步减小取料机构420与产品20的接触面积，防止取料机构420对产品20造成损伤。
如图3和图5所示，移料滑轨430大致呈长条状，并从准备位置110延伸到取料位置120。本实施例中，作业平台100上还开设有滑轨孔140，移料滑轨430嵌设于滑轨孔140内。移料滑块440活动设置于移料滑轨430上，移料驱动机构410能够驱动移料滑块440沿着移料滑轨430移动。取料机构420固定于所述移料滑块440上，本实施例中，取料机构420的两个支脚421的连接处通过多个螺钉固定于移料滑块440上。
升降模组500用于驱动料盒200沿着竖直方向移动。具体地，如图9和图10所示，升降模组500包括升降驱动机构510和升降台520。料盒200放置在升降台520上。本实施例中，升降驱动机构510为电机，在其他实施例中，升降驱动机构510也可以为气缸或油缸等。如图5所示，作业平台100开设有形状与升降台520相对应的升降孔130，升降驱动机构510能够驱动升降台520穿过升降孔130并沿着竖直方向移动，以便实现料盒200升降，从而与取料机构420配合实现取出料盒200内的产品20进行清洗，并将清洗后的产品20放置回料盒200内。
进一步地，如图9和图10所示，升降模组500还包括升降滑轨530和升降滑块540。升降滑轨530设置于作业平台100的下方，并沿竖直方向延伸。升降滑块540在升降驱动机构510的驱动下能够沿着升降滑轨530移动。升降台520固定于升降滑块540上且随着升降滑块540一起移动。本实施例中，升降模组500还包括固定支架580、升降支架570、两个升降导轨550和四个辅助滑块560。固定支架580与升降滑轨530相对设置，两个升降导轨550平行地固定排列在固定支架580上。升降台520固定于升降支架570的顶部。四个辅助滑块560两两一组固定在升降支架570的一侧，每组辅助滑块560可在一个升降导轨550上沿竖直方向滑动。升降滑块540固定在升降支架570的另一侧。由此，升降支架570连同升降台520能够在固定支架580与升降滑轨530之间沿竖直方向上下移动。
进一步地，如图2和图3所示，等离子清洗装置10还包括电源(附图未示出)，电源用于为等离子发生器300、移料驱动机构410、升降驱动机构510等部件供电。等离子清洗装置10还包括匹配器710。匹配器710有利于电源的功率有效传递给等离子发生器300，从而产生期望的等离子功率。
如图1所示，等离子清洗装置10还包括防护罩610。防护罩610罩设于作业平台100上，料盒200、等离子发生器300、移料模组400和匹配器710均设于防护罩610内，该防护罩610能为操作人员起到安全防护的作用。防护罩610上开设有舱门612，便于上下料及查看防护罩610内部的状况。进一步地，等离子清洗装置10还包括机柜620，机柜620位于作业平台100的下方。本实施例中，升降模组500至少部分位于机柜620内。等离子清洗装置10还包括电气安装板720及用于为等离子发生器300冷却降温的冷水机组730。本实施例中，电源、电气安装板720及冷水机组730均位于机柜620内。
进一步地，等离子清洗装置10还包括设置于防护罩610外的触控屏740和指示灯750。触控屏740便于操作人员输入产品20总数、氩气充气量等参数，也便于监控等离子清洗过程的各项参数。指示灯750用于指示清洗过程的进行与结束。
进一步地，等离子清洗装置10还包括控制器(图未示)，移料驱动机构410、升降驱动机构510、触控屏740和指示灯750均与控制器电连接，控制器用于获取产品20是否清洗完毕的信息，控制器用于控制移料驱动机构410和升降驱动机构510的运转。控制器可根据产品20是否清洗完毕，控制移料驱动机构410和升降驱动机构510的运转，从而提高整个等离子清洗装置10的自动化。
本实施例中，控制器是指能够获取产品20是否清洗完毕的信息，并实现对移料驱动机构410和升降驱动机构510的控制的设备，例如，电脑、PLC(可编辑控制器)、DDC(数字控制器)和PCB(印制电路板)板中的至少一种。其中，产品20是否清洗完毕的信息可包括产品20总数、已清洗产品20数量及这两者的比较结果等信息。可选地，产品20总数可由触控 屏740手动输入获得。已清洗产品20数量可通过设置在作业平台100上的位置传感器获得，例如，在取料位置120处设置与控制器电连接的位置传感器(附图未示出)，位置传感器每次监测到取料机构经过，即向控制器发射到达信号，控制器每接收两次到达信号则已清洗产品20数量增加一个。
如图18所示，本申请一实施例还提出一种等离子清洗装置10的使用方法，包括以下步骤：
S100、移料驱动机构410驱动取料机构420从准备位置110移动至取料位置120，以使取料机构420位于第一产品20的下方。
请参阅图11和图12，在初始状态，取料机构420位于准备位置110处。包括第一产品、第二产品等的多个产品20上下堆叠地容纳在料盒200内。当接受到开始清洗的指令，控制器控制移料驱动机构410驱动取料机构420从准备位置110移动至取料位置120。当取料机构420位于取料位置120时，由于相邻两个产品20之间的垂直距离大于取料机构420的厚度，因此取料机构420能够插入两个相邻产品20之间。可以理解，若料盒200内只有一个产品20，则取料机构420位于该第一产品20的下方。
S200、升降驱动机构510驱动料盒200向下移动第一距离，使得第一产品20落于取料机构420上。
如图12所示，料盒200移动之前，取料机构420与位于取料机构420上方的第一产品20的距离为第一间距D1。当升降驱动机构510驱动料盒200向下移动第一距离时，第一产品20的中部将与取料机构420接触，而第一产品20的两端不再与料盒200的卡槽210接触，即使得第一产品20落入取料机构420上，便于后续步骤中取料机构420将第一产品20从料盒200中移出。本实施例中，第一距离大于第一间距D1，但小于相邻两个产品20之间的垂直距离D2。
S300、移料驱动机构410驱动承载第一产品20的取料机构420从取料位置120经过等离子发生器300移动至准备位置110。
如图13及图14所示，在取料机构420从取料位置120移动至准备位置110的过程中，第一产品20将第一次经过等离子发生器300的下方。控制器对等离子发生器300发出工作指令，使其对第一产品20进行第一次等离子清洗。第一次等离子清洗的时长，即第一产品20经过等离子发生器300的下方的时间可以依据需求由移料驱动机构410精确地控制。
S400、移料驱动机构410驱动承载该第一产品20的取料机构420从准备位置110移动至取料位置120。
如图14及图15所示，第一次等离子清洗完毕后，取料机构420从准备位置110返回至取料位置120。在此过程中，第一产品20将第二次经过等离子发生器300的下方。此时，控制器对等离子发生器300发出工作指令，使其对第一产品20进行第二次等离子清洗。当然，可以理解，如果第一次等离子清洗的效果较好，第一次等离子清洗的步骤也可省略，从而可以加快取料机构420从准备位置110返回取料位置120的速度，提升工作效率。
当取料机构420返回取料位置120之后，承载于取料机构420上的第一产品20将位于料盒200的内部。
S500、升降驱动机构510驱动料盒200向上移动第一距离，使得取料机构420上的第一产品20放置回料盒200内。
如图16所示，当料盒200向上移动第一距离之后，第一产品20的两端将与料盒200的卡槽210接触，而第一产品20的中部将不再与取料机构420接触，即使得第一产品20放置回料盒200内。此时，取料机构420与第一产品20的距离恢复成第一间距D1。
S600、移料驱动机构410驱动取料机构420从取料位置120移动至准备位置110。
如图17所示，当第一产品20放置回料盒200后，取料机构420返回准备位置110，为下次清洗做准备。
以上即是清洗第一产品20的全部过程。当需要对多个产品20进行清洗时，上述方法还 包括如下步骤：
S700、判断料盒200内的产品20是否均清洗完毕，若是，则结束清洗过程，若否，则执行步骤S800。
在步骤S700中，判断料盒200内的产品20是否清洗完毕的具体步骤为:获取料盒200内的产品20总数；获取已清洗的产品20个数；比较料盒200内的产品20总数和已清洗的产品20个数，若料盒200内的产品20总数大于已清洗的产品20个数，则料盒200内的产品20均清洗完毕，若料盒200内的产品20总数不大于已清洗的产品20个数，则料盒200内的产品20未清洗完毕。
S800、升降驱动机构510驱动料盒200移动第二距离，并重复执行步骤S100至步骤S600。
在步骤S800中，若取料机构420从上到下依次取出产品20进行清洗，则升降驱动机构510驱动料盒200向上移动第二距离D2；若取料机构420从下到上依次取出产品20进行清洗，则升降驱动机构510驱动料盒200向下移动第二距离D2。本实施例中，如图8所示，第二距离D2为相邻两个产品20之间的垂直距离。
利用移料模组400和升降模组500的相互配合，可以对料盒200中的其他产品20进行清洗，直到所有产品20清洗结束。上述步骤可以使得等离子清洗装置10能有序地将所有产品20依次进行清洗，避免某一产品20被遗漏或重复清洗，提高整体清洗效率。
上述等离子清洗装置的整个清洗过程清洗效率高、操作简单。该等离子清洗装置10中，多个产品20可始终位于等离子清洗装置10内，无需每清洗一个产品20即进行一次人工上下料，大大提高了清洗效率，且避免了人工上下料过程中的造成的产品20不均匀甚至损伤。同时，通过移料模组400和升降模组500的相互配合即能实现多个产品20的自动化清洗，相比于使用机械手上下料更加节省设备成本，缩小了装置体积，更便于集成到多种工业流水线中，同时也大大提高了操作简便性。
以上实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (11)

  1. 一种等离子清洗装置，包括：
    作业平台，具有准备位置和取料位置；
    料盒，活动设置于所述作业平台上，所述料盒用于容纳产品，所述取料位置位于所述料盒中的所述产品的下方；
    升降模组，用于驱动所述料盒沿着竖直方向移动；
    等离子发生器，设置于所述作业平台上并与所述料盒相邻，所述准备位置位于所述等离子发生器远离所述料盒的一侧；
    移料模组，设置于所述作业平台上，所述移料模组包括移料驱动机构和用于承载所述产品的取料机构，所述移料驱动机构驱动所述取料机构在所述准备位置和所述取料位置之间往复移动，以使得所述取料机构中的所述产品经过所述等离子发生器；
    其中当所述取料机构位于所述取料位置时，所述升降模组驱动所述料盒沿着竖直方向移动，以使所述产品从所述料盒落入所述取料机构，或使所述产品从所述取料机构落入所述料盒。
  2. 根据权利要求1所述的等离子清洗装置，其特征在于，所述料盒用于容纳多个所述产品，所述料盒包括相对设置的两个侧壁，每一侧壁上设有多个沿竖直方向间隔排列的卡槽，每一所述产品的两端分别滑动收容于一个卡槽内，所述卡槽的厚度大于所述产品的厚度，所述取料机构能够插入两个相邻的所述产品之间。
  3. 根据权利要求1所述的等离子清洗装置，其特征在于，所述移料模组还包括设置于所述作业平台上的移料滑轨和移料滑块，所述移料滑轨从所述准备位置延伸到所述取料位置，所述取料机构固定于所述移料滑块上，所述移料驱动机构驱动所述移料滑块沿着所述移料滑轨移动。
  4. 根据权利要求1所述的等离子清洗装置，其特征在于，所述升降模组包括升降驱动机构和升降台，所述料盒放置在所述升降台上，所述作业平台开设有升降孔，所述升降驱动机构驱动所述升降台穿过所述升降孔并沿着所述竖直方向移动。
  5. 根据权利要求4所述的等离子清洗装置，其特征在于，所述升降模组还包括升降滑轨和升降滑块，所述升降滑轨沿竖直方向延伸，所述升降台固定于所述升降滑块上，所述升降驱动机构驱动所述升降滑块沿所述升降滑轨移动。
  6. 根据权利要求1所述的等离子清洗装置，其特征在于，所述取料机构的形状为U形，且包括两个向所述料盒方向延伸的支脚，所述两个支脚与所述产品接触的表面均设有防滑结构。
  7. 根据权利要求6所述的等离子清洗装置，其特征在于，所述防滑结构为多个间隔设置的防滑凸棱。
  8. 根据权利要求1所述的等离子清洗装置，其特征在于，还包括气源设备，所述气源设备向所述等离子发生器通入氩气，所述等离子发生器激发氩气以产生等离子体。
  9. 一种如权利要求1所述的等离子清洗装置的使用方法，包括：
    所述移料驱动机构驱动所述取料机构从所述准备位置移动至所述取料位置，以使所述取料机构位于第一产品的下方；
    所述升降驱动机构驱动所述料盒向下移动第一距离，使得所述第一产品落于所述取料机构上，所述第一距离大于所述取料机构与所述第一产品之间的垂直距离；及
    所述移料驱动机构驱动承载所述第一产品的所述取料机构从所述取料位置经所述等离子发生器移动至所述准备位置。
  10. 根据权利要求9所述的方法，其特征在于，还包括：
    所述移料驱动机构驱动承载第一产品的所述取料机构从所述准备位置移动至所述取料位置；
    所述升降驱动机构驱动所述料盒向上移动第一距离，使得承载于所述取料机构上的所述第一产品放置回所述料盒内。
  11. 根据权利要求10所述的方法，其特征在于，还包括:
    所述移料驱动机构驱动所述取料机构从所述取料位置移动至所述准备位置；
    所述升降驱动机构驱动料盒向下移动第二距离；
    所述移料驱动机构驱动所述取料机构从所述准备位置移动至所述取料位置，使得所述取料机构位于所述第一产品和第二产品之间，所述第二距离为所述第一产品和所述第二产品之间的垂直距离；
    所述升降驱动机构驱动料盒向下移动所述第一距离，使得所述第二产品落于所述取料机构上；及
    所述移料驱动机构驱动承载所述第二产品的所述取料机构从所述取料位置经所述等离子发生器移动至所述准备位置。
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