Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/32—Alkaline compositions
  • C23F1/38—Alkaline compositions for etching refractory metals
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K13/00—Etching, surface-brightening or pickling compositions
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P50/00—Etching of wafers, substrates or parts of devices
  • H10P50/60—Wet etching
  • H10P50/66—Wet etching of conductive or resistive materials
  • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
  • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only

Definitions

• the present invention relates to a novel processing liquid for etching a Group 6 metal by bringing a semiconductor wafer containing a Group 6 metal into contact with a processing liquid in a semiconductor element manufacturing process.
• Group 6 metals are widely used in electronic devices such as semiconductor devices, and are used, for example, as contact materials for connecting transistor electrodes and metal wiring, and 3D-NAND gate materials.
• the wiring is formed by dry or wet etching or CMP polishing in the same manner as the conventional wiring material. Since the time required for these processes directly affects the semiconductor manufacturing cost, a technique capable of shortening the processing time is required.
• the dissolution rate of the metal per unit time that is, the etching rate is important. If the etching rate is high, the metal can be melted in a short time, so that the number of wafers processed per unit time can be increased.
• Patent Document 1 contains hypochlorite ion and a solvent, and the pH is more than 7 and less than 12.0 at 25 ° C.
• a processing liquid for wafers having the above has been proposed. It has been shown that the treatment liquid contains hypochlorite ions and can remove ruthenium and tungsten adhering to the end face portion and the back surface portion of the semiconductor wafer.
• Patent Document 2 proposes a tungsten etching solution containing nitric acid, fluoride, iron salt and water. It has been shown that the etching solution can etch tungsten used in the manufacture of semiconductor integrated circuits and flat panel displays at high speed.
• Patent Document 3 proposes an etching solution of tungsten and a tungsten alloy having a pH of 7 or less containing hydrogen peroxide and an alkaline component. It has been shown that the etching solution can stably etch the electrodes and wiring of thin film transistors of semiconductor devices and liquid crystal displays, and the wiring of these electrodes and tungsten used as a barrier metal.
• Patent Document 4 proposes a solution for removing tungsten metal containing orthoperiodic acid and water. It has been shown that the removing liquid can stably remove unnecessary tungsten metal formed or adhered to the semiconductor substrate.
• Patent Document 5 discloses a method of forming wiring by processing copper and molybdenum with a chemical solution containing an oxidizing agent and an acid.
• the oxidizing agent include hydrogen peroxide, persulfate, nitric acid, hypochlorous acid, permanganate and dichromic acid.
• a molybdenum film is etched using an aqueous solution containing hydrogen peroxide and a carboxylic acid as the chemical solution is shown.
• the etching rate of the metal is important.
• the conventional treatment liquid described in the prior art document has room for improvement in the following points.
• Patent Document 1 describes a treatment liquid having a pH of more than 7 and less than 12.0 as a treatment liquid for a wafer having tungsten.
• tungsten etching is performed. The speed is not enough.
• Patent Document 2 The etching solution described in Patent Document 2 is not practical because it etches the silicon substrate and the oxide film in no small measure.
• the etching solution described in Patent Document 3 contains hydrogen peroxide as a main component, and has problems that the etching rate is not stable due to the self-decomposition reaction of hydrogen peroxide and the life of the solution is short. Moreover, it cannot be said that the etching rate is sufficient.
• the chemical solution described in Patent Document 5 is a chemical solution containing an oxidizing agent and an acid.
• the only oxidizing agent disclosed in the examples of Patent Document 5 is hydrogen peroxide, and as described above, there are problems that the etching rate is not stable due to the autolysis reaction and the life of the liquid is short. Moreover, it cannot be said that the etching rate is sufficient.
• the present invention has been made in view of the above background technology, and an object of the present invention is to be stable at high speed for a long time even at room temperature without damaging the silicon-based material contained in the substrate. It is an object of the present invention to provide a processing liquid capable of etching a metal.
• the present inventors have conducted diligent studies to solve the above problems. Then, they have found that by treating the Group 6 metal with a treatment liquid containing hypobromous acid ion, the metal can be etched at high speed even at room temperature without damaging the silicon-based material. Furthermore, it has been found that the bromine-containing compound added to the alkaline treatment liquid is oxidized by the oxidizing agent in the treatment liquid to become a bromine oxide, so that the Group 6 metal can be etched more stably. Furthermore, they have found that a sufficient etching rate and stability can be achieved by setting an appropriate pH range, a bromine-containing compound concentration range, and an oxidizing agent concentration range, and have completed the present invention.
• Item 2 The semiconductor treatment liquid according to Item 1, wherein the Group 6 metal is at least one selected from the group consisting of tungsten, molybdenum, and chromium.
• Item 3 The semiconductor treatment liquid according to Item 1 or 2, wherein the hypobromous acid ion is 0.001 mol / L or more and 1.2 mol / L or less.
• Item 4 The semiconductor processing liquid according to any one of Items 1 to 3, wherein the pH of the semiconductor processing liquid at 25 ° C. is 8 or more and 14 or less.
• Item 5 The semiconductor treatment liquid according to any one of Items 1 to 4, further containing tetraalkylammonium ions.
• Item 6 The item according to any one of Items 1 to 5, wherein the treatment liquid for semiconductor further contains an oxidizing agent, and the redox potential of the oxidizing agent exceeds the redox potential of the hypobromous acid ion / Br ⁇ system. Processing liquid for semiconductors.
• Item 7 The semiconductor processing solution according to Item 6, wherein the oxidizing agent contained in the semiconductor processing solution is hypochlorite ion, periodic acid, or ozone.
• Item 8 The semiconductor according to any one of Items 1 to 7, wherein the semiconductor treatment liquid further contains chloride ions, and the ratio of the hypobromous acid ions to the chloride ions is 0.001 or more and 10 or less. Treatment liquid.
• Item 9 The item according to any one of claims 1 to 8, wherein the semiconductor treatment liquid further contains chloride ions, and the ratio of the hypobromous acid ions to the chloride ions is 0.05 or more and 10 or less. Processing liquid for semiconductors.
• Item 8 The treatment for semiconductors according to any one of Items 1 to 9, further comprising a step of mixing a solution containing a base compound with hypobromous acid, hypobromous acid, bromate water, or bromine gas. Liquid manufacturing method. Item 8. The method for producing a treatment liquid for a semiconductor according to any one of Items 1 to 9, further comprising a step of mixing a solution containing a hypochlorous acid compound and a base compound with a bromine-containing compound.
• the bromine-containing compound contains at least a bromine-containing compound, an oxidizing agent, a basic compound, and water, and the amount of the bromine-containing compound added is 0.008% by mass or more and less than 10% by mass as the amount of bromine element with respect to the total mass of the oxidizing agent.
• Item 13 The semiconductor treatment liquid according to Item 12, wherein the semiconductor treatment liquid further contains chloride ions, and the ratio of hypobromous acid ions to the chloride ions is 0.001 or more and 10 or less.
• Item 14 The semiconductor treatment liquid according to Item 12 or 13, wherein the oxidizing agent is a hypochlorous acid compound or ozone.
• Item 15 The treatment liquid for a semiconductor according to any one of Items 12 to 14, wherein the bromine-containing compound is a bromate salt or hydrogen bromide.
• Item 16 The semiconductor treatment liquid according to Item 15, wherein the bromate is tetraalkylammonium bromide.
• Item 17 The treatment liquid for semiconductors according to any one of Items 12 to 16, wherein the base compound is tetramethylammonium hydroxide.
• Item 18 The semiconductor treatment liquid according to any one of Items 12 to 17, wherein the pH at 25 ° C. is 8 or more and 13 or less.
• Item 19 The method for producing a treatment liquid for a semiconductor according to any one of Items 12 to 18, further comprising a step of mixing the solution containing the oxidizing agent and the base compound with the bromine-containing compound.
• Item 20 A method for treating a substrate in which a semiconductor treatment liquid is produced by the production method according to Item 19, and then a film containing a Group 6 metal deposited on the substrate is etched with the semiconductor treatment liquid.
• Item 21 Use of the semiconductor treatment liquid according to any one of Items 12 to 18 in the treatment of a substrate containing a film containing a Group 6 metal.
• the Group 6 metal in the semiconductor forming process, can be stably wet-etched at a sufficiently high speed without damaging the silicon-based material contained in the substrate. Further, the roughness of the transition metal surface after etching can be reduced, and the smoothness can be maintained. As a result, the processing accuracy of the transition metal contained in the semiconductor wafer is improved, the yield is improved, and the wafer processing efficiency per unit time is improved.
• the treatment liquid of the present invention is a treatment liquid (composition) containing hypobromous acid ion (BrO ⁇ ).
• Hypobromous acid ion is an oxidizing agent having strong oxidizing property, and the treatment liquid of the present invention containing hypobromous acid ion can etch Group 6 metal at high speed.
• another aspect of the treatment liquid of the present invention is a treatment liquid containing at least a composition containing a bromine-containing compound, an oxidizing agent, a base compound and water, and etches a Group 6 metal at high speed. It is a treatment liquid that can be used.
• the treatment liquid of the present invention is a treatment liquid that can be suitably used in an etching step, a residue removing step, a cleaning step, a CMP step, and the like in a semiconductor manufacturing step.
• tungsten, molybdenum and chromium may be generically referred to as Group 6 metals (metals of Group 6 elements).
• the “semiconductor of Group 6 metal” means a semiconductor element containing the Group 6 metal and a semiconductor wafer having the Group 6 metal on the surface or inside thereof.
• the treatment liquid of the present invention can be used in a process that requires etching of a Group 6 metal in a semiconductor manufacturing process. Further, the Group 6 metal adhering to the end face portion and the back surface portion of the semiconductor wafer can be removed at a sufficient etching rate.
• the sufficient etching rate in the present invention means that when the Group 6 metal is tungsten, the etching rate is 50 nm / min or more. When the Group 6 metal is molybdenum, it means that the etching rate is 50 nm / min or more. When the Group 6 metal is chromium, it means that the etching rate is 50 nmmin or more.
• the treatment liquid in the present invention etches Group 6 metals, but does not etch metals such as silicon, silicon oxide, copper, cobalt, titanium, platinum, titanium nitride, and tantalum nitride, or compared to Group 6 metals.
• the etching rate is extremely low. Therefore, in the semiconductor manufacturing process or the like, it is possible to selectively etch the Group 6 metal without damaging the substrate material containing these metals.
• the hypobromous acid ion contained in the treatment liquid of the present invention may be generated in the treatment liquid or may be added to the treatment liquid as hypobromous acid salt.
• the hypobromous acid salt referred to here is a salt containing hypobromous acid ion or a solution containing the salt.
• bromine gas may be blown into the treatment liquid.
• the treatment liquid is preferably 50 ° C. or lower from the viewpoint of efficiently generating hypobromous acid ions.
• the treatment liquid is 50 ° C. or lower, not only hypobromous acid ions can be efficiently generated, but also the generated hypobromous acid ions can be stably used for etching the Group 6 metal.
• the temperature of the treatment liquid is more preferably 30 ° C. or lower, and most preferably 25 ° C. or lower.
• the lower limit of the temperature of the treatment liquid is not particularly limited, but it is preferable that the treatment liquid does not freeze. Therefore, the treatment liquid is preferably ⁇ 35 ° C. or higher, more preferably ⁇ 15 ° C. or higher, and most preferably 0 ° C. or higher.
• hypobromous acid ion is generated by blowing bromine gas into the treatment liquid
• the treatment liquid contains bromide ion (Br ⁇ )
• the solubility of the bromine gas (Br 2) is improved. This is because Br 2 dissolved in the treatment liquid reacts with Br ⁇ and Br 3 ⁇ to form complex ions such as Br 3 ⁇ and Br 5 ⁇ , which are stabilized in the treatment liquid.
• Br 2, Br -, Br 3 -, Br 5 - many containing processing liquid it is possible to generate more hypobromous acid ion, can be preferably used as the processing liquid of the present invention.
• hypobromous acid ion as a compound to the treatment liquid, hypobromous acid, bromine water, and / or hypobromous acid may be added.
• hypobromous acid sodium hypobromite, potassium hypobromite, and tetraalkylammonium hypobromite are suitable, and hypobromous acid does not contain metal ions, which is a problem in semiconductor production. Acids or tetraalkylammonium hypobromite are more preferred.
• the tetraalkylammonium hypobromite can be easily obtained by passing bromine gas through a tetraalkylammonium hydroxide solution. It can also be obtained by mixing hypobromous acid and a tetraalkylammonium hydroxide solution. Further, tetraalkylammonium hypobromite can also be obtained by substituting a cation contained in hypobromous acid such as sodium hypobromite with tetraalkylammonium ion using an ion exchange resin.
• the concentration of the hypobromous acid ion in the treatment liquid of the present invention is not particularly limited as long as it does not deviate from the object of the present invention, but preferably, the amount of bromine element contained in the hypobromous acid ion is 0. It is 001 mol / L or more and 1.2 mol / L or less. If it is less than 0.001 mol / L, the etching rate of the Group 6 metal is low and the practicality is low. On the other hand, if it exceeds 1.2 mol / L, the etching rate of the Group 6 metal becomes difficult to stabilize.
• the concentration of the hypobromous acid ion is 0.001 mol / L or more and 1.2 mol / L as the amount of bromine element contained in the hypobromous acid ion. It is preferably L or less, more preferably 0.001 mol / L or more and 1 mol / L or less, particularly preferably 0.005 mol / L or more and 0.50 mol / L or less, and 0.01 mol / L or more. Most preferably, it is 0.2 mol / L or less.
• the concentration of hypobromous acid ion in the treatment liquid can be confirmed by using a widely known method. For example, if the ultraviolet-visible absorptiometry is used, absorption due to hypobromous acid ions can be easily confirmed, and the absorption peak (depending on the pH of the treatment solution and the concentration of hypobromous acid ions, but approximately around 330 nm).
• the hypobromous acid ion concentration can be determined from the intensity.
• the hypobromous acid ion concentration can also be determined by iodine titration.
• the hypobromous acid ion concentration can be determined from the redox potential (ORP) and pH of the treatment liquid.
• the measurement by the ultraviolet-visible absorptiometry is most preferable.
• the hypobromous acid ion concentration by the ultraviolet-visible absorptiometry if there is absorption by other chemical species, perform data processing such as spectrum division and baseline correction, and select an appropriate reference. Therefore, the hypobromous acid ion concentration can be obtained with sufficient accuracy.
• HBrO and BrO processing solution - if it contains, HBrO and BrO - dealing with the total concentration of the concentration of the hypobromite ion.
• hypobromous acid ions dissolve Group 6 metals are not always clear, but it is speculated that they are as follows.
• the case where the Group 6 metal is tungsten will be described below as an example, but the same mechanism can be considered for molybdenum and chromium.
• Hypobromous acid generated from hypobromous acid ion or hypobromous acid ion in the treating solution is oxidized tungsten, speculate that dissolved in the treatment solution by the WO 4 2-.
• To dissolve the tungsten as WO 4 2- is more preferably a pH of 8 to 14 of the treatment liquid, and most preferably a pH of 8 to 13. If the pH of the treatment solution at 8 to 14, tungsten is dissolved in the processing liquid as WO 4 2-.
• Acid or alkali can be added to the treatment liquid to adjust the pH of the treatment liquid.
• the acid may be either an inorganic acid or an organic acid, and examples thereof include carboxylic acids such as hydrofluoric acid, hydrochloric acid, hydrobromic acid, nitrate, sulfuric acid, peroxodisulfate, formic acid and acetic acid.
• carboxylic acids such as hydrofluoric acid, hydrochloric acid, hydrobromic acid, nitrate, sulfuric acid, peroxodisulfate, formic acid and acetic acid.
• a widely known acid used in a treatment liquid for semiconductors can be used without any limitation.
• the alkali it is preferable to use an organic alkali because it does not contain metal ions, which is a problem in semiconductor production.
• the organic alkalis it is preferable to use an onium salt containing onium ions.
• an onium salt is tetraalkylammonium hydroxide, which is composed of tetraalkylammonium ions and hydroxide ions.
• the alkyl carbon number of the tetraalkylammonium ion derived from the tetraalkylammonium hydroxide can be 1 or more and 20 or less, and is preferably 1 or more and 10 or less.
• Examples of the tetraalkylammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide and the like.
• the organic alkali is preferably tetraalkylammonium hydroxide, and is tetramethylammonium hydroxide. Is more preferable.
• the tetraalkylammonium ion contained in the treatment liquid may be used alone or in combination of two or more.
• the treatment liquid of the present invention preferably contains an oxidizing agent.
• the oxidizing agent plays a role of reoxidizing the bromide ion (Br ⁇ ) generated by decomposing or reducing hypobromous acid ion to hypobromous acid ion.
• bromide ion Br ⁇
• hypobromous acid ions are reduced to Br ⁇ .
• hypobromous acid ion is easily spontaneously decomposed in the treatment liquid, and a part of it changes to Br ⁇ .
• the decomposition of hypobromous acid ion is promoted by ultraviolet rays and visible light, and a part of the hypobromous acid ion is changed to Br ⁇ .
• hypobromous acid ion is decomposed by heating, contact with acid, and contact with metal, and a part of it changes to Br ⁇ .
• the etching rate of Group 6 metals decreases.
• Br caused by reduction or decomposition - a can be oxidized to hypobromite ions, can be gentle lowering of the etching rate of the Group 6 metal It becomes. That is, when hypobromous acid ion and an appropriate oxidizing agent are contained in the treatment liquid, the stabilization time of the etching rate becomes long.
• the redox potential between the oxidizing agent and the chemical species generated by the reduction of the oxidizing agent exceeds the redox potential of the hypobromous acid ion / Br ⁇ system. ..
• the use of such an oxidizing agent, Br - can the be oxidized to hypobromite ion.
• the oxidation-reduction potential between the oxidant that may be contained in the treatment liquid / the chemical species generated by the reduction of the oxidant is the concentration of the oxidant and the chemical species generated by the reduction of the oxidant, the temperature and pH of the solution.
• the oxidation-reduction potential between the oxidant / chemical species generated by reduction of the oxidant may exceed the hypobromine ion / Br-system oxidation-reduction potential. ..
• the upper limit of the redox potential of the oxidizing agent that may be contained in the treatment liquid between the oxidizing agent and the chemical species generated by the reduction of the oxidizing agent is particularly limited as long as the object of the present invention is not deviated. There is no.
• hypochlorite ion Since the oxidizing agent that may be contained in the treatment liquid of the present invention does not contain a metal element that causes a problem in semiconductor production, it is preferable to use hypochlorite ion or ozone. Among them, hypochlorite ion is more preferable in that it has high solubility in a treatment liquid, is stably present in the solution, and its concentration can be easily adjusted.
• Hypochlorite ion and ozone have the ability to reoxidize Br ⁇ to hypobromous acid ion in an alkaline treatment liquid (pH 8 or more and 14 or less).
• This hypochlorite / Cl - oxidation-reduction potential of the system is 0.89 V, the oxidation-reduction potential of the ozone / oxygen system whereas a 1.24V, hypobromite ion / Br - oxidation system It can be seen from the fact that the reduction potential is 0.76 V.
• the redox potential is a value with respect to a standard hydrogen electrode at pH 14 (25 ° C.).
• the treatment solution of the present invention containing hypobromous acid ion and hypobromous acid ion or ozone increases the concentration of hypobromous acid ion in the treatment solution by oxidizing Br ⁇ to hypobromous acid ion. Since the concentration can be maintained, it is possible to stabilize the etching rate of the Group 6 metal.
• the concentration of hypochlorite ion in the treatment liquid of the present invention is not limited as long as it does not deviate from the gist of the present invention, but is preferably 0.005% by mass or more and 20% by mass or less. Hypochlorite ions at a concentration of 0.005 wt% smaller than Br - can not be efficiently oxidized, the etching rate of the Group 6 metal is reduced. On the other hand, if the amount of hypochlorite ion added is larger than 20% by mass, the stability of hypochlorite ion is lowered, which is not appropriate. From the viewpoint of the etching rate of the Group 6 metal, the concentration of the oxidizing agent is more preferably 0.02% by mass or more and 10% by mass or less, and most preferably 0.05% by mass or more and 5% by mass or less. ..
• the ratio (molar ratio) of hypobromous acid ion to chlorine ion contained in the treatment liquid is preferably 0.001 or more and 10 or less.
• the ratio of hypobromous acid ion to chlorine ion is preferably 0.001 or more and 10 or less, more preferably 0.05 or more and 10 or less, and 0. It is more preferably 1 or more and 1 or less, and most preferably 0.1 or more and 0.5 or less.
• the treatment liquid of the present invention may contain at least one anion species selected from halide ions other than halogenate ion, subhalogenate ion, and chloride ion.
• anion species selected from halide ions other than halogenate ion, subhalogenate ion, and chloride ion.
• the anionic species ClO 3 -, BrO 3 - , IO 3 - or the like halogen acid ions; ClO 2 -, BrO 2 - , IO 2 - such as nitrous halide ion; Br -, I -, etc.
• Halide ion of One of these anion species may be contained in the treatment liquid, or two or more kinds of anion species may be contained.
• ions having the same oxidation number of halogen atoms are contained such that two kinds among halogenate ions are contained, or when one kind of phosphite ion and a halide are contained. It is possible to include ions having different oxidation numbers of halogen atoms so that one type of ion is included. Among these, from the viewpoints of solubility in the treatment solution, availability, cost, etc., it is preferable that the halide ion is contained as the anion species, and two or more kinds of anions may be contained in the treatment solution. More preferred.
• a halide ion and an anion species having different oxidation numbers of the halide ion and the halogen atom are contained from the viewpoint of effectively suppressing the roughness of the metal surface. Is particularly preferable.
• the anion species used in the present invention can be generated by dissolving an acid, a salt or the like containing the anion species in a treatment liquid.
• Acids containing anionic species include halogen acids such as chloric acid, bromic acid and iodic acid; chlorous acids such as chlorous acid, bromine acid and iodic acid; hydrogen chloride, hydrogen bromide, hydrogen iodide and the like. Examples include hydrogen halide.
• the salt containing an anion species include alkali metal salts, alkaline earth metal salts, and organic salts.
• the alkali metal salt includes potassium chloride, sodium chlorate, potassium bromide, sodium bromine, potassium iodide, sodium iodate and the like
• the organic salt includes tetramethylammonium chloride and odor.
• examples thereof include organic salts containing onium ions such as quaternary alkylammonium salts such as tetramethylammonium chloride and tetramethylammonium iodide.
• the hydrogen halide can also be generated by dissolving a halogen gas such as chlorine gas, bromine gas, or iodine gas in water.
• acids containing anionic species and organic salts because they do not contain metals that cause a decrease in yield in semiconductor production, and in consideration of industrial availability and ease of handling.
• it is more preferable that it is an organic salt containing onium ions such as a quaternary alkylammonium salt.
• organic salts those that can be particularly preferably used in terms of stability, purity and cost are chloride or bromide or tetramethylammonium iodide, chloride or bromide or tetraethylammonium iodide, chloride or odor. Examples thereof include tetrapropylammonium iodide or tetrapropylammonium iodide.
• an industrially available salt may be used or may be prepared by a known method.
• a quaternary alkylammonium salt containing the anionic species can be prepared by preparing an aqueous solution of tetramethylammonium hydroxide and blowing chlorine, bromine or the like. Further, a tetramethylammonium hydroxide solution is brought into contact with a cation exchange type ion exchange resin to convert the cation in the ion exchange resin into tetramethylammonium ions, and then halogen acids such as hydrochloric acid, bromic acid and iodic acid are circulated.
• a solution containing a quaternary alkylammonium salt of the anion species can also be prepared by the method of exchanging ions.
• the concentration of ozone in the treatment liquid of the present invention is not limited as long as it does not deviate from the gist of the present invention, but is preferably 0.1 mass ppm or more and 1000 mass ppm (0.1 mass%) or less. If it is less than 0.1 mass ppm , the rate of oxidizing Br ⁇ to hypobromous acid ion is slow and does not affect the etching rate of the Group 6 metal. Further, from the viewpoint of stably dissolving ozone in the treatment liquid, the ozone concentration is more preferably 1 mass ppm or more and 500 mass ppm or less.
• ozone concentration is 5 mass ppm or more and 200 mass ppm or less
• Br ⁇ can be efficiently oxidized to hypobromous acid ion, which is particularly preferable.
• a method for generating ozone and a method for dissolving in a treatment liquid a widely known method can be used without any problem.
• ozone is generated by discharging to a gas containing oxygen, and the gas containing ozone is treated.
• a part or all of ozone is dissolved in the treatment liquid, and the treatment liquid containing ozone can be obtained.
• the contact between ozone and the treatment liquid may be carried out continuously or intermittently.
• the method for producing the hypochlorite ion is not particularly limited, and any hypochlorite ion generated by any method can be suitably used for the treatment liquid of the present invention.
• a method for generating hypochlorous acid ions for example, addition of hypochlorite, blowing of chlorine gas, or the like can be preferably used.
• the method of adding hypochlorite to the treatment liquid is more preferable because the concentration of hypochlorite ion can be easily controlled and the hypochlorite can be easily handled.
• hypochlorites examples include tetraalkylammonium hypochlorite, sodium hypochlorite, potassium hypochlorite, calcium hypochlorite, magnesium hypochlorite, and hypochlorous acid.
• tetraalkylammonium hypochlorite or hypochlorous acid is particularly preferable from the viewpoint that it does not contain a metal that causes a problem in semiconductor production, and since it can exist stably even at a high concentration, tetra hypochlorite is present.
• Alkylammonium is most suitable.
• tetraalkylammonium hypochlorous acid tetraalkylammonium hypochlorous acid containing a tetraalkylammonium ion having 1 to 20 carbon atoms per alkyl group is suitable. Specifically, tetramethylammonium hypochlorous acid, tetraethylammonium hypochlorous acid, tetrapropylammonium hypochlorous acid, tetrabutylammonium hypochlorous acid, tetrapentylammonium hypochlorous acid, tetrahexyl hypochlorite.
• Tetramethylammonium hypochlorous acid and tetraethylammonium hypochlorous acid are more preferable from the viewpoint that they are ammonium and have a large amount of hypochlorous acid ions per unit weight. Tetramethylammonium hypochlorous acid is most suitable because high-purity products are easily available.
• the method for producing tetramethylammonium hypochlorous acid is not particularly limited, and a method produced by a widely known method can be used. For example, a method of blowing chlorine into tetramethylammonium hydroxide, a method of mixing hypochlorite and tetramethylammonium hydroxide, or a method of substituting a cation in a hypochlorite solution with tetramethylammonium using an ion exchange resin. Tetramethylammonium hypochlorite produced by the method of mixing the distillate of the solution containing hypochlorite and tetramethylammonium hydroxide can be preferably used.
• hypobromous acid ions in the treatment liquid there is a method of oxidizing a bromine-containing compound with an oxidizing agent.
• the amount ratio of the bromine-containing compound and the oxidizing agent contained in the treatment liquid is the chemical quantity ratio and reaction rate when the bromine-containing compound reacts with the oxidizing agent to generate hypobromous acid ion, and the treatment liquid. included Br - and it is preferred that the oxidizing agent is determined in consideration of the reaction rate and the stoichiometric ratio at the time of reaction to occur is hypobromite ions, in practice, a plurality of sources for these reactions It is difficult to obtain an appropriate amount ratio of the bromine-containing compound and the oxidant because of the complex influence of each other.
• the ratio of the value obtained by dividing the concentration of the bromine-containing compound by the chemical equivalent (molar equivalent) of the bromine-containing compound to the value obtained by dividing the concentration of the oxidant by the chemical equivalent (molar equivalent) of the oxidant is 0. be in the range of 001 ⁇ 100, BrO from said bromine-containing compound oxidizing agent - not only efficiently produce, BrO - Br caused by a reduction reaction or a decomposition reaction of the - again BrO - be oxidized to Therefore, the etching rate of the Group 6 metal is stabilized.
• the reaction equivalent (molar equivalent) and oxidation of the bromine-containing compound in the reaction between these chemical species since the chemical equivalents (molar equivalents) of the agents are equal, the ratio of the molar concentration of the bromine-containing compound to the concentration of the oxidizing agent may be in the range of 0.001 to 100.
• the ratio of the molar concentration of hypobromous acid ion to the molar concentration of hypobromous acid ion is in the range of 0.001 to 100. if, BrO - Br caused by a reduction reaction or a decomposition reaction of the - again by hypochlorite ions BrO - in can be oxidized, the etching rate of the group 6 metal is stabilized.
• the pH of the Group 6 metal semiconductor treatment liquid in the present invention is preferably 8 or more and 14 or less, and most preferably 8 or more and 13 or less. When the pH of the treatment liquid is 8 or more and 14 or less, the Group 6 metal can be efficiently etched.
• the Group 6 metal contained in the semiconductor wafer to which the treatment liquid of the present invention is applied may be formed by any method.
• a method widely known in the semiconductor manufacturing process for example, CVD, ALD, sputtering, plating, or the like can be used.
• the Group 6 metal contained in the semiconductor wafer to which the treatment liquid of the present invention is applied may be any one type of tungsten, molybdenum, or chromium, or may be a plurality of types.
• tungsten is a metal tungsten, a tungsten-based metal containing tungsten as a main component, a compound containing tungsten substantially as well as an alloy of tungsten and another metal.
• a tungsten-based metal an oxide of tungsten (W X O Y), nitrides (WN), oxynitride (WNO), a cobalt tungsten phosphorus (CoWP) etc., wherein the oxide of tungsten , Tungsten dioxide (WO 2 ), Tungsten trioxide (WO 3 ), Ditungsten pentoxide (W 2 O 5 ).
• molybdenum is a compound containing not only metallic molybdenum, molybdenum-based metal containing molybdenum as a main component, an alloy of molybdenum and other metals, but also molybdenum.
• a molybdenum-based metal an oxide of molybdenum (Mo X O Y), nitrides (MoN), oxynitride (MONO) is such, wherein the oxide of molybdenum, molybdenum dioxide (MoO 2) , Molybdenum trioxide (MoO 3 ), and dimolybdenum pentoxide (Mo 2 O 5 ).
• chromium is not only metallic chromium, a chromium-based metal containing chromium as a main component, an alloy of chromium and other metals, but also a compound substantially containing chromium.
• a chromium-based metal chromium oxide (Cr X O Y), nitrides (CrN), oxynitride (CrNO) is such, wherein the oxide of molybdenum, chromium dioxide (CrO 2) , Mochromium trioxide (CrO 3 ), Dichromium pentoxide (Cr 2 O 5 ).
• the alloy of the Group 6 metal and the other metal may contain any metal in addition to the Group 6 metal, but the Group 6 metal contained in the alloy of the Group 6 metal and the other metal.
• Examples of metals other than tantalum, silicon, copper, hafnium, zirconium, aluminum, vanadium, cobalt, nickel, manganese, gold, rhodium, palladium, titanium, ruthenium, platinum, iridium and the like, and oxidation of these It may contain an object, a nitride, and a silicide.
• Group 6 metals may be intermetallic compounds, ionic compounds, or complexes. Further, the Group 6 metal may be exposed on the surface of the wafer, or may be covered with another metal, a metal oxide film, an insulating film, a resist or the like.
• the treatment liquid of the present invention is a treatment liquid containing at least a bromine-containing compound, an oxidizing agent, a base compound and water.
• a bromine-containing compound used in the treatment solution of the present invention contains a bromine atom and is oxidized by an oxidizing agent described later to bromine, hypobromous acid, hypobromous acid ion, bromic acid, bromic acid ion, bromic acid.
• Bromate ion, perbromic acid, perbromate ion, bromide ion may be any compound as long as it is produced.
• the hydrogen bromide referred to here may be hydrogen bromide gas or hydrogen bromide acid, which is an aqueous solution of hydrogen bromide.
• the bromine salt include lithium bromide, sodium bromide, potassium bromide, rubidium bromide, cesium bromide, ammonium bromide, and onium bromide.
• the onium bromide referred to here is a compound formed from onium ions and bromide ions. Onium ions are compounds of polyatomic cations formed by adding excess protons (hydrogen cations) to monoatomic anions.
• a compound that produces hypobromous acid or hypobromous acid ion in the treatment liquid can also be suitably used as the bromine-containing compound.
• examples of such compounds include, but are not limited to, bromohydantoins, bromoisocyanuric acids, bromsulfamic acids, bromchloramines and the like. More specific examples of the compound include 1-bromo-3-chloro-5,5-dimethylhydantoin, 1,3-dibromo-5,5-dimethylhydantoin, tribromoisocyanuric acid and the like.
• the bromine-containing compound may be added to the treatment liquid as hydrogen bromide or a bromate salt, may be added to the treatment liquid as a solution containing a bromate, or may be added to the treatment liquid as a bromate gas. good. Since the bromine-containing compound is easy to handle in the semiconductor manufacturing process, it is preferable to mix the bromine-containing compound as a bromate or a solution containing a bromate or hydrogen bromide with another treatment liquid.
• the bromine-containing compound contained in the treatment liquid may be used alone or in combination of two or more.
• the bromine-containing compound does not contain a metal because the mixing of a metal or a metal ion causes a decrease in yield.
• onium bromide does not substantially contain a metal, and therefore can be suitably used as the bromine-containing compound of the present invention.
• the onium bromides the quaternary onium bromide, the tertiary onium bromide, and hydrogen bromide are industrially easily available and easy to handle, and therefore, as the bromine-containing compound of the present invention. It is more suitable.
• Quaternary onium bromide is a bromate composed of ammonium ions or phosphonium ions that can be stably present in the treatment liquid.
• quaternary onium bromide tetramethylammonium bromide, tetraethylammonium bromide, tetrapropylammonium bromide, tetrabutylammonium bromide, tetrapentylammonium bromide, tetrahexylammonium bromide, methyl bromide Triethylammonium, diethyldimethylammonium bromide, trimethylpropylammonium bromide, butyltrimethylammonium bromide, trimethylnonylammonium bromide, decyltrimethylammonium bromide, tetradecyltrimethylammonium, hexadecyltrimethylammonium bromide, trimethylstearylammonium
• a compound in which a proton is added to a tertiary amine, a secondary amine, or a primary amine can also be used.
• Tertiary onium bromide is a bromate consisting of sulfonium ions that can be stably present in the treatment solution.
• tertiary sulfonium bromide trimethylsulfonium bromide, triethylsulfonium bromide, tripropylsulfonium bromide, tributylsulfonium bromide, triphenylsulfonium bromide,- (2carboxyethyl) dimethylsulfonium bromide, etc.
• quaternary onium bromide which is a bromate composed of ammonium ions, is preferable because of its high stability, industrial availability of high-purity products, and low cost.
• the quaternary onium bromide is preferably tetraalkylammonium bromide, which has particularly excellent stability and can be easily synthesized.
• the carbon number of the alkyl group is not particularly limited, and the carbon number of the four alkyl groups may be the same or different.
• tetraalkylammonium bromide having 1 to 20 carbon atoms per alkyl group can be preferably used.
• tetraalkylammonium bromide, which has a small number of carbon atoms in the alkyl group can be more preferably used because the number of bromine atoms per weight is large.
• Examples include tetramethylammonium bromide, tetraethylammonium bromide, tetrapropylammonium bromide, tetrabutylammonium bromide, tetrapentylammonium bromide, tetrahexylammonium bromide, and among them tetramethylammonium bromide, Tetraethylammonium bromide, tetrapropylammonium bromide, and tetrabutylammonium bromide are preferred, with tetramethylammonium bromide being the most preferred.
• the number of bromine-containing compounds contained in the treatment liquid may be one or plural.
• tetraalkylammonium bromide used in the present invention commercially available tetraalkylammonium bromide may be used, or tetraalkylammonium bromide produced from tetraalkylammonium and bromide ion may be used. I do not care.
• a method for producing tetraalkylammonium bromide it is only necessary to mix an aqueous solution containing tetraalkylammonium hydroxide with an aqueous solution containing bromide ions or a gas containing bromine that generates bromide ions when dissolved in water.
• tetraalkylammonium hydroxide used for producing tetraalkylammonium bromide examples include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, and tetrabutylammonium hydroxide. Among them, tetramethylammonium hydroxide is more preferable because the number of hydroxide ions per unit weight is large and a high-purity product is easily available.
• the bromide ion sources used to produce tetraalkylammonium bromide that generate bromide ions include hydrogen bromide, lithium bromide, sodium bromide, potassium bromide, rubidium bromide, cesium bromide, and ammonium bromide. And so on. Of these, hydrogen bromide is preferable because it does not contain a metal substantially, is easily available industrially, and a high-purity product is easily available.
• the amount of the bromine-containing compound added is not particularly limited, and may be determined in consideration of the etching rate of the Group 6 metal, the stability of the treatment solution, the solubility of the bromine-containing compound, the cost, and the like.
• the bromic-containing compound added to the treatment liquid is oxidized by an oxidizing agent described later, and is a chemical species effective for etching Group 6 metals, specifically, bromic acid (Br 2 ) and hypobromous acid (HBrO).
• the treatment liquid containing HBrO, BrO ⁇ , HBrO 2 , BrO 2 ⁇ , HBrO 3 and BrO 3 ⁇ is treated because the etching rate of the Group 6 metal is high.
• the liquid preferably contains these chemical species.
• a treatment liquid containing a large amount of HBrO and BrO ⁇ (hereinafter, also referred to as BrO ⁇ or the like) is more preferable in that the processing time can be shortened because the etching rate of the Group 6 metal is particularly high.
• the amount of the bromine-containing compound added is preferably 0.008% by mass or more and less than 10% by mass as the amount of bromine element with respect to the total mass of the treatment liquid. If it is less than 0.008% by mass, the etching rate of the Group 6 metal is low and the practicality is low. If it is less than 10% by mass, it is easy to control the etching rate of the Group 6 metal, and it is easy to control it as a manufacturing process. Furthermore, decomposition of chemical species effective for etching Group 6 metals is unlikely to occur, and the stability of the etching rate is good.
• the amount of the bromine-containing compound added is preferably 0.008% by mass or more and less than 10% by mass, and 0.04% by mass or more and less than 8% by mass as the amount of bromine element with respect to the total mass of the treatment liquid. It is more preferably 0.08% by mass or more and less than 4% by mass, particularly preferably 0.08% by mass or more and less than 2% by mass, and 0.08% by mass or more and 1.5% by mass. Most preferably less than%.
• the etching rate of the Group 6 metal tends to decrease.
• the inclusion of chloride ions in the treatment liquid further suppresses the roughness of the metal surface due to etching. Therefore, in order to achieve both the etching rate and the suppression of surface roughness due to etching, it is preferable to adjust the concentrations of hypobromous acid ion and chloride ion contained in the treatment liquid within the range described later.
• the hypobromous acid ion concentration is 0.008% by mass or more as the amount of bromine element with respect to the total mass of the treatment liquid. It is preferably less than mass% and the ratio of hypobromous acid ion to chlorine ion contained in the treatment liquid is preferably 0.001 or more and 10 or less, and the hypobromous acid ion concentration is based on the total mass of the treatment liquid.
• the amount of bromine element is 0.04% by mass or more and less than 8% by mass, and the ratio of hypobromous acid ion to chlorine ion contained in the treatment liquid is 0.05 or more and 1 or less.
• the concentration of hypobromous acid ion is 0.08% by mass or more and less than 2% by mass as the amount of bromine element with respect to the total mass of the treatment liquid, and the ratio of hypobromous acid ion to chlorine ions contained in the treatment liquid is 0. It is particularly preferable that it is 1 or more and 1 or less.
• the pH of the solution containing the bromine-containing compound is not particularly limited, but the pH is preferably 8 or more and 14 or less, and more preferably 8 or more and 13 or less. With a solution in this pH range, the pH change that occurs when a solution containing an oxidizing agent described later and a solution containing the bromine-containing compound are mixed can be reduced, and the treatment liquid of the present invention can be stably produced. It can be saved and used.
• the iodine-containing compound in the same manner as the bromine-containing compound.
• the iodine contained in the iodine-containing compound can be a chemical species that etches the Group 6 metal by being oxidized by the oxidizing agent contained in the treatment liquid.
• the oxidizing agent used in the treatment liquid of the present invention has a function of oxidizing a bromine-containing compound to generate a chemical species effective for etching a Group 6 metal.
• These oxidizing agents may be used alone or in combination of two or more. When adding these oxidizing agents to the treatment liquid of the present invention, one of solid, liquid, and gas may be selected according to the properties of the oxidizing agent to be used.
• hypochlorous acid, chloronic acid, chloric acid, perchloric acid, hypobromic acid, bromine acid, bromic acid, perbromic acid, hypochlorous acid can exist stably even in alkaline conditions.
• Hypoic acid, iodic acid, periodic acid, and salts thereof, and ions, ozone or hydrogen peroxide generated by dissociation of these salts preferably hypochlorous acid, chloric acid, chloric acid, perchlorine.
• Acids, hypobromic acid, bromine acid, bromic acid, perbromic acid, and salts thereof, and ions, ozone or hydrogen peroxide produced by dissociation of these salts are more preferred, hypochlorite ions or ozone. Is more preferable, and hypochlorite ion is most preferable.
• hypochlorous acid its salt, tetraalkylammonium hypochlorous acid, periodic acid, or ozone
• the oxidizing agent it is possible to substantially prevent the mixing of metals, and thus a treatment liquid for semiconductor production.
• the periodic acid ortho-periodic acid and metaperiodic acid are suitable.
• tetraalkylammonium hypochlorous acid is particularly suitable because it exists stably even in an alkali and can efficiently oxidize the bromine-containing compound.
• the concentration of the oxidizing agent is not particularly limited, and an amount capable of oxidizing the bromine-containing compound to a chemical species effective for etching a Group 6 metal may be added.
• the amount of the oxidizing agent added is preferably 0.1% by mass or more and 20% by mass or less. If the amount of the oxidizing agent added is less than 0.1 mass ppm, the bromine-containing compound cannot be efficiently oxidized, and the etching rate of the Group 6 metal decreases. That is, the etching rate is low in the composition in which the oxidizing agent is not mixed. On the other hand, if the amount of the oxidizing agent added is larger than 20% by mass, the stability of the oxidizing agent is lowered, which is not suitable. From the viewpoint of the etching rate of the Group 6 metal, the concentration of the oxidizing agent is more preferably 1% by mass or more and 10% by mass or less, and most preferably 0.5% by mass or more and 5% by mass or less.
• the pH of the solution containing the oxidizing agent is not particularly limited, but it is preferably pH 8 or more and 14 or less, and more preferably 8 or more and 13 or less. With a solution in this pH range, the pH change that occurs when the solution containing the bromine-containing compound and the solution containing the oxidizing agent are mixed can be reduced, and the treatment liquid of the present invention can be stably produced and stored. And it becomes possible to use it.
• the base compound used in the treatment liquid of the present invention is not particularly limited, but is limited to lithium hydroxide, sodium hydroxide, potassium hydroxide, rubidium hydroxide, cesium hydroxide, magnesium hydroxide, calcium hydroxide, and the like.
• Strontium hydroxide, barium hydroxide, ammonia, choline, alkylammonium hydroxide and the like are used.
• sodium hydroxide, potassium hydroxide, ammonia, choline, and alkylammonium hydroxide are easily available, and a high etching rate for Group 6 metals can be obtained when used in a treatment solution. , Suitable.
• ammonia, choline, and alkylammonium hydroxide do not contain metals, they can be particularly preferably used as the treatment liquid of the present invention.
• alkylammonium hydroxide tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide and the like are industrially available, and high-purity semiconductor manufacturing grades are easily available. Tetramethylammonium hydroxide is most preferred in that it is possible.
• the above basic compound can be added to the treatment liquid as a solid or an aqueous solution.
• the above basic compound When the above basic compound is a solid, it may be added to the present treatment liquid as a solution containing the basic compound.
• the concentration of the basic compound is not particularly limited as long as it does not deviate from the object of the present invention, but the pH of the solution containing the basic compound is preferably in the range of pH 8 or more and 14 or less, and more preferably 8 or more and 13 or less. preferable.
• the pH of the solution containing the basic compound is within this pH range, the pH change that occurs when the solution containing the oxidizing agent and the solution containing the bromine-containing compound are mixed can be reduced, and the treatment solution of the present invention can be reduced. Can be stably manufactured, stored and used.
• the water contained in the treatment liquid of the present invention is preferably water from which metal ions, organic impurities, particle particles, etc. have been removed by distillation, ion exchange treatment, filter treatment, various adsorption treatments, etc., particularly pure water and ultrapure water. Is preferable.
• Such water can be obtained by a known method widely used in semiconductor manufacturing.
• the pH of the treatment liquid of the present invention is preferably 8 or more and 14 or less. If the pH of the treatment liquid is in this range, the Group 6 metal can be etched at a sufficient speed. If the pH of the treatment liquid is lower than 8, hypobromous acid ion decomposition occurs and etching does not proceed. On the other hand, when the pH of the treatment liquid exceeds 14, the oxidizing agent is decomposed, so that the oxidation of the bromine-containing compound may not be constant. This means that the etching rate of the Group 6 metal is not constant, and it is necessary to avoid it because it complicates the process control in the semiconductor manufacturing process. Further, if desired, a pH buffer can be added to the treatment liquid to reduce the pH fluctuation of the treatment liquid. As the pH buffering agent, a widely known pH buffering agent can be used, and examples thereof include one or more selected from phosphoric acid, boric acid, carbonic acid, oxalic acid and salts thereof. The salt is preferably an organic salt.
• the pH at which the Group 6 metal is etched is preferably 8 or more and 14 or less, and more preferably 8 or more and 13 or less.
• the pH of the treatment liquid is in this range, it is possible to obtain a sufficient etching rate in etching the Group 6 metal.
• the treatment liquid of the present invention contains a bromine-containing compound, an oxidizing agent, a base compound and water
• the treatment liquid may be one liquid, two liquids or more.
• the treatment liquid When the treatment liquid is a single liquid, it becomes a solution containing all of the bromine-containing compound, the oxidizing agent, the base compound and water.
• the treatment liquid When the treatment liquid is two liquids or more, the treatment liquid may be produced by mixing each solution.
• each solution contains at least one or more of a bromine-containing compound, an oxidizing agent, a base compound, and water. Further, other components described later may be contained.
• the treatment liquid is one liquid or two or more liquids
• the bromine-containing compound, the oxidizing agent, and the base compound are simultaneously present in the treatment liquid, so that the bromine-containing compound is oxidized by the oxidizing agent, and the sixth Chemical species that etch group metals are generated.
• the treatment liquid of the present invention is produced by mixing two or more solutions, it is preferable to divide it into a solution containing a bromine-containing compound and a solution containing an oxidizing agent.
• a solution containing a bromine-containing compound and a solution containing an oxidizing agent.
• a production method having a step of mixing a solution containing a base compound with hypobromous acid, hypobromous acid, bromate water, or bromine gas.
• a solution containing a base compound with hypobromous acid, hypobromous acid, bromine water, or bromine gas By mixing a solution containing a base compound with hypobromous acid, hypobromous acid, bromine water, or bromine gas, hypobromous acid ions are generated in the mixed solution, and the treatment solution of the present invention is produced. It becomes.
• the concentration of hypobromous acid ion contained in the treatment liquid is appropriately adjusted according to the concentration of hypobromous acid, hypobromous acid or bromate water to be mixed, or the amount of bromine gas supplied. It is possible.
• hypobromous acid ion in the production method of this embodiment is extremely fast, and the treatment liquid can be used in the semiconductor production process immediately after mixing.
• a production method having a step of mixing a solution containing a hypochlorous acid compound and a base compound with a bromine-containing compound can be mentioned.
• the bromine-containing compound is oxidized by the hypobromous acid compound to generate hypobromous acid ions, and the treatment of the present invention is carried out. It becomes a liquid.
• the bromine-containing compound can be appropriately selected from chemical species having various structures as described above. This makes it possible to appropriately adjust the concentration of hypobromous acid ion contained in the treatment liquid and its stability. Furthermore, it is possible to select raw materials in consideration of manufacturing cost, safety of raw materials, harmfulness, handleability, and the like.
• the treatment liquid of the present invention produced in any of the embodiments can also be suitably used in the semiconductor manufacturing process.
• a widely known method can be used as a method for mixing the semiconductor chemical solution.
• a method using a mixing tank, a method of mixing in the piping of a semiconductor manufacturing apparatus (in-line mixing), a method of mixing by simultaneously applying a plurality of liquids on a wafer, and the like can be preferably used.
• the solutions may be mixed at any time.
• the solution can be mixed before etching the Group 6 metal to provide a time to generate a chemical species effective for etching the Group 6 metal.
• the time required for oxidation is preferably short, and preferably 1 hour or less.
• the time required for oxidation of the bromine-containing compound can be controlled by appropriately selecting the oxidant concentration, the bromine-containing compound concentration, the pH of the treatment liquid, the temperature of the treatment liquid, the stirring method of the treatment liquid, and the like.
• the concentrations of both the oxidizing agent and the bromine-containing compound may be increased, or only one of them may be increased.
• the time required for oxidation of the bromine-containing compound can be shortened.
• the concentration of the chemical species that etches the Group 6 metal is low, the lifetime of the treatment liquid is short, and it is considered that the control of the manufacturing process becomes difficult. In such a case, it is preferable to mix the solution immediately before etching the Group 6 metal.
• the solution containing the oxidizing agent and the base compound with the bromine-containing compound, and the solution containing the hypochlorite ion and the base compound and the bromine-containing compound are mixed. Is even more preferable.
• the solution containing the hypochlorite ion and the base compound is preferably alkaline. Further, for mixing, it is preferable to add the bromine-containing compound to the solution containing the oxidizing agent and the base compound.
• the oxidizing agent is an alkaline solution containing hypochlorous acid and the solution containing a bromine-containing compound is an acidic solution, when the former is gradually added to the latter, hypochlorous acid is contained in the acidic solution.
• the solution containing the oxidizing agent and the basic compound and the solution containing the bromine-containing compound may be either a solution or an aqueous solution, but when the solvent is other than water, such as an organic or inorganic solvent, the solvent reacts with the oxidizing agent. There is a risk that the oxidizing agent will be decomposed by doing so. For this reason, the solution is preferably an aqueous solution.
• the pH of the treatment liquid after mixing is alkaline.
• the pH of the treatment liquid is preferably 8 or more and 14 or less.
• the concentration of the base compound and / or water is adjusted so that the treatment liquid after mixing (including bromine-containing compound, oxidizing agent, base compound and water) has pH 8 or more and 14 or less. adjust.
• the pH of the mixed solutions may be the same or different.
• the pH of the treatment liquid of the present invention after mixing does not change significantly, and it can be suitably used as an etching liquid for a Group 6 metal.
• the composition of the treatment solution of the present invention after mixing (bromine-containing compound concentration, oxidizing agent concentration, basic compound concentration, pH). Is within the above range, and the mixing method such as the mixing ratio and the mixing order of the solutions to be mixed is not particularly limited. However, for example, when an alkaline solution containing a hypochlorous acid compound and an acidic solution containing a bromine-containing compound are mixed, the decomposition of the hypochlorous acid compound may proceed locally. It is preferable to mix an acidic solution containing a bromine-containing compound with an alkaline solution containing a chlorite compound.
• the hypochlorous acid compound refers to a compound that produces hypochlorous acid or hypochlorite ion in the treatment liquid.
• the hypochlorous acid compound include hypochlorous acid, hypochlorite, hydantoins, isocyanuric acids, sulfamic acids, chloramines and the like.
• hypochlorous acid and hypochlorite are preferable because they can efficiently generate hypochlorous acid or hypochlorite ions.
• hypochlorite tetraalkylammonium hypochlorite is preferable, and among them, since the amount of hypochlorous acid or hypochlorite ion per unit weight is large, tetramethylammonium hypochlorite is used. Is more preferable.
• the chemical species effective for etching Group 6 metals produced by oxidizing a bromine-containing compound with an oxidizing agent vary depending on the pH of the treatment liquid, redox potential (ORP), etc., but are mainly bromine or bromide. Ions, hypobromous acid, bromous acid, bromic acid, perbromic acid and their ions.
• the contents of metals specifically sodium, potassium, aluminum, magnesium, iron, nickel, copper, silver, cadmium, and lead are 1 ppb or less, respectively.
• the amount of ammonia and amines contained in the treatment liquid of the present invention and the bromine-containing compound, oxidizing agent, base compound, water, solvent, and other additives used in the treatment liquid is small.
• ammonia and amines When ammonia and amines are present in the treatment liquid, they react with oxidants, bromine-containing compounds, chemical species effective for etching Group 6 metals generated from bromine-containing compounds, etc., and reduce the stability of the treatment liquid. be.
• ammonia and amines contained in the base compound, particularly trimethylamine may cause a decrease in the stability of the treatment liquid.
• the total amount of amines contained in the basic compound is preferably 100 ppm or less.
• the influence of the reaction with the chemical species effective for etching the Group 6 metal generated from the oxidizing agent, the bromine-containing compound, and the bromine-containing compound is slight, and the stability of the treatment liquid is small. It does not spoil.
• the treatment liquid of the present invention When the treatment liquid of the present invention is produced, it is preferable to shield it from light in order to prevent decomposition of an oxidizing agent by light, a chemical species effective for etching a Group 6 metal generated from a bromine-containing compound, and the like.
• the treatment liquid of the present invention it is preferable to prevent the dissolution of carbon dioxide in the treatment liquid.
• the treatment liquid of the present invention is alkaline
• carbon dioxide can easily dissolve in the treatment liquid and cause a pH change.
• the pH of the treatment liquid changes not only the etching rate of the Group 6 metal fluctuates, but also the stability of the treatment liquid decreases.
• the dissolution of carbon dioxide in the treatment liquid can be reduced by a method such as flowing an inert gas to purge the carbon dioxide in the manufacturing apparatus or conducting a reaction in an atmosphere of the inert gas. If the amount of carbon dioxide in the manufacturing apparatus is 100 ppm or less, the effect of dissolving carbon dioxide can be ignored.
• the surface of the reaction vessel in contact with the treatment liquid is made of glass or an organic polymer material.
• the contamination of impurities such as metals, metal oxides, and organic substances can be further reduced.
• the organic polymer material used for the inner surface of the reaction vessel include vinyl chloride resin (soft / hard vinyl chloride resin), nylon resin, silicone resin, polyolefin resin (polyethylene, polypropylene), fluorine resin and the like. Can be used. Among them, a fluororesin is preferable in consideration of ease of molding, solvent resistance, and less elution of impurities.
• the fluororesin is not particularly limited as long as it is a resin (polymer) containing a fluorine atom, and a known fluororesin can be used.
• a resin polymer
• a known fluororesin can be used.
• examples thereof include a trifluoroethylene-ethylene copolymer and a cyclized polymer of perfluoro (butenyl vinyl ether).
• the treatment liquid of the present invention may contain other additives conventionally used in the treatment liquid for semiconductors, as long as the object of the present invention is not impaired.
• other additives include acids, metal corrosion inhibitors, water-soluble organic solvents, fluorine compounds, oxidizing agents, reducing agents, complexing agents, chelating agents, surfactants, defoamers, pH adjusters, stabilizers. Etc. can be added. These additives may be added alone or in combination of two or more.
• the treatment liquid of the present invention may contain alkali metal ions, alkaline earth metal ions, etc. due to the origin of these additives and the convenience of manufacturing the treatment liquid.
• alkali metal ions, alkaline earth metal ions, etc. may be contained.
• sodium ion, potassium ion, calcium ion and the like may be contained.
• these alkali metal ions, alkaline earth metal ions, etc. remain on the semiconductor wafer, they adversely affect the semiconductor element (adverse effects such as a decrease in the yield of the semiconductor wafer), so the amount thereof is preferably small. , Actually, it is better not to be included infinitely.
• the pH adjuster is preferably not an alkali metal hydroxide such as sodium hydroxide or an alkaline earth metal hydroxide, but an organic alkali such as ammonia, amine, choline or tetraalkylammonium hydroxide.
• the total amount of the alkali metal ion and the alkaline earth metal ion is preferably 1% by mass or less, more preferably 0.7% by mass or less, and 0.3% by mass or less. It is more preferably 10 ppm or less, and most preferably 500 ppb or less.
• the treatment liquid of the present invention may further contain an organic solvent.
• Any organic solvent may be used as long as the function of the treatment liquid of the present invention is not impaired. Examples include sulfolane, acetonitrile, carbon tetrachloride, 1,4-dioxane and the like, but of course, the organic solvent is not limited to these.
• the temperature at which the Group 6 metal is etched by the treatment liquid of the present invention is not particularly limited, but it may be determined in consideration of the etching rate of the Group 6 metal, the stability of the treatment liquid, and the like.
• the etching rate of the Group 6 metal increases as the temperature increases.
• the temperature for etching the Group 6 metal is preferably 10 ° C. to 90 ° C., more preferably 15 ° C. to 70 ° C., and most preferably 20 ° C. to 60 ° C.
• the treatment time for etching the Group 6 metal with the treatment liquid of the present invention is in the range of 0.1 to 120 minutes, preferably 0.3 to 60 minutes, and is appropriately selected depending on the etching conditions and the semiconductor element used. do it.
• an organic solvent such as alcohol can be used, but rinsing with deionized water is sufficient.
• the treatment liquid of the present invention can be suitably used for treating a substrate containing a film containing a Group 6 metal.
• the substrate include a silicon wafer on which a film containing a Group 6 metal is formed, glass, plastic, a semiconductor substrate other than silicon, and the like.
• the films containing the Group 6 metals existing on these substrates can be etched at a sufficient speed.
• the Group 6 metal existing on the substrate is etched (melted), and the metal is processed and / or removed to form a semiconductor element, form a wiring, control the film thickness of the metal, and form an electrode. Etc. can be performed.
• the Group 6 metal adhering to the end face portion and the back surface portion of the semiconductor wafer can be removed at a sufficient etching rate.
• a sufficient etching rate means that when the Group 6 metal is tungsten, the etching rate is 50 nm / min or more.
• the Group 6 metal is molybdenum, it means that the etching rate is 50 nm / min or more.
• the Group 6 metal is chromium, it means that the etching rate is 50 nm / min or more.
• the hypobromous acid ion concentration, hypochlorite ion concentration, bromine-containing compound concentration, and oxidizing agent contained in the treatment liquid When it is necessary to etch a Group 6 metal at a speed higher than the above etching rate, the hypobromous acid ion concentration, hypochlorite ion concentration, bromine-containing compound concentration, and oxidizing agent contained in the treatment liquid.
• the concentration, the pH of the treatment liquid, the treatment temperature, the contact method between the treatment liquid and the wafer, and the like may be appropriately selected.
• the metal film of the Group 6 metal deposited on the substrate and / or the alloy film of the Group 6 metal and another metal can be etched with the treatment liquid.
• it can also be used for cleaning Group 6 metals adhering to the inner wall of the chamber, piping, and the like.
• it is used as a cleaning liquid used for removing Group 6 metal adhering to chambers, pipes, etc. in maintenance of equipment for forming Group 6 metal using physical vapor deposition (PVD) or chemical vapor deposition (CVD). Can be done.
• the treatment liquid of the present invention is preferably stored at a low temperature and / or in a light-shielded manner.
• the treatment liquid of the present invention is preferably stored at a low temperature and / or in a light-shielded manner.
• the stability of the treatment liquid is prevented by storing the treatment liquid in a container whose surface in contact with the solution is made of an organic polymer material and storing the treatment liquid in a container filled with an inert gas to prevent carbon dioxide from being mixed.
• the inner surface of the container that is, the surface in contact with the treatment liquid is preferably formed of glass or an organic polymer material.
• the inner surface of the reaction vessel is made of glass or an organic polymer material, the contamination of impurities such as metals, metal oxides, and organic substances can be further reduced.
• the organic polymer material used for the inner surface of the reaction vessel the material exemplified in the production of the treatment liquid of the present invention can be preferably used.
• the pH at which the treatment liquid is stored can be appropriately selected, but the pH of the treatment liquid is alkaline in order to prevent decomposition of hypobromous acid ions, bromine-containing compounds, oxidizing agents, and other additives. It is preferably 8 or more and 14 or less.
• Group 6 metal film formation and film thickness change An oxide film was formed on a silicon wafer using a batch thermal oxidation furnace, and a Group 6 metal was formed on the oxide film by a sputtering method.
• the Group 6 metal was tungsten, 8000 ⁇ ( ⁇ 10%) of tungsten was formed.
• the Group 6 metal was molybdenum or chromium, 1000 ⁇ ( ⁇ 10%) of molybdenum or chromium was formed.
• the film thickness of the Group 6 metal is determined by measuring the sheet resistance with a four-probe resistance measuring device (Loresta-GP, manufactured by Mitsubishi Chemical Analytech Co., Ltd.) and converting it to the film thickness of the Group 6 metal before etching. The film thickness was set.
• the sheet resistance was similarly measured with a four-probe resistance measuring device and converted into a film thickness to obtain the film thickness of the Group 6 metal after the etching treatment.
• the difference between the film thickness of the Group 6 metal after the etching treatment and the film thickness of the Group 6 metal before the etching treatment was defined as the amount of change in the film thickness before and after the etching treatment.
• Each sample piece having a size of 10 ⁇ 20 mm was immersed in a treatment liquid at 60 ° C. for 1 minute to perform group 6 metal etching treatment.
• the value obtained by dividing the amount of change in film thickness before and after the etching treatment by the immersion time was calculated as the etching rate and evaluated as the etching rate in the present invention.
• SiO 2 film (Damage evaluation of silicon-based materials) An oxide film (SiO 2 film) was formed on a silicon wafer using a batch thermal oxidation furnace. 60 mL of the treatment liquids of Examples and Comparative Examples were prepared in a fluororesin container with a lid (ASONE, PFA container 94.0 mL), and each sample piece having a size of 10 ⁇ 20 mm was immersed in the treatment liquid at 25 ° C. , SiO 2 film was etched. The dissolution amount of the SiO 2 film was determined from the difference in film thickness before and after the treatment determined by spectroscopic ellipsometry, and the value divided by the processing time was taken as the SiO 2 etching rate.
• Example 1> Manufacturing of oxidizer
• a 2 L glass three-necked flask manufactured by Cosmos Bead Co., Ltd.
• 527 g of a 25 mass% tetramethylammonium hydroxide aqueous solution is mixed with 527 g of a 25 mass% tetramethylammonium hydroxide aqueous solution and 473 g of ultrapure water to have a CO 2 content of 0.5 ppm and 13.2 mass%.
• An aqueous solution of tetramethylammonium hydroxide was obtained.
• the pH at this time was 14.2.
• thermometer protection tube manufactured by Cosmos Bead, bottom-sealed type
• thermometer manufactured by Cosmos Bead, bottom-sealed type
• the tip of a PFA tube (Flon Industrial Co., Ltd., F-8011-02), which is connected to a chlorine gas cylinder and a nitrogen gas cylinder in one opening and is in a state where chlorine gas / nitrogen gas can be switched arbitrarily, is used.
• a magnetic stirrer (C-MAG HS10 manufactured by AsOne) was installed in the lower part of the three-necked flask, rotated and stirred at 300 rpm, and while cooling the outer periphery of the three-necked flask with ice water, chlorine gas (manufactured by Fujiox, specified purity). 99.4%) was supplied at 200 ccm (25 ° C.) for 69 minutes, and an aqueous solution of tetramethylammonium hypochlorite (oxidizing agent; equivalent to 6.78% by mass, 0.54 mol / L) and tetramethylammonium hydroxide (0.54 mol / L) were supplied. A mixed solution (corresponding to 0.91% by mass, 0.1 mol / L) was obtained. At this time, the liquid temperature during the reaction was 11 ° C.
• Example 2 In Example 2, 15 wt% HCl and ultrapure water were added to a mixed solution of tetramethylammonium hypochlorite aqueous solution and tetramethylammonium hydroxide obtained by the above operation to adjust the pH to 12.0 and 0.45 mL / L. An aqueous solution of tetramethylammonium hypochlorite was prepared. 97% by mass of tetramethylammonium bromide was added to 93.47 g of the obtained mixed solution of tetramethylammonium hypochlorous acid and tetramethylammonium hydroxide to obtain 100 g of the treatment liquid shown in Table 1. rice field. Evaluation was performed using a tungsten film (sample piece) prepared in the same manner as in Example 1.
• Examples 3 to 10 a treatment liquid was prepared in the same manner as in Example 2 so as to have the composition shown in Table 1, and evaluation was performed using the tungsten film (sample piece) prepared in the same manner as in Example 1. went.
• Example 11 A 2 L glass three-necked flask (manufactured by Cosmos Bead Co., Ltd.) is mixed with 990 g of a 25 mass% tetramethylammonium hydroxide aqueous solution and 10 g of ultrapure water to have a CO 2 content of 0.5 ppm and 24.74 mass%. An aqueous solution of tetramethylammonium hydroxide was obtained. The pH at this time was 14.4. Carbon dioxide in the gas phase was expelled by the same operation as in Example 1. At this time, the carbon dioxide concentration in the gas phase was 1 ppm or less.
• a magnetic stirrer (C-MAG HS10 manufactured by AsOne) was installed in the lower part of the three-necked flask, rotated and stirred at 300 rpm, and while cooling the outer periphery of the three-necked flask with ice water, chlorine gas (manufactured by Fujiox, specified purity). 99.4%) was supplied at 200 ccm (25 ° C.) for 146 minutes, and an aqueous solution of tetramethylammonium hypochlorite (oxidizing agent; equivalent to 13.94% by mass, 1.11 mol / L) and tetramethylammonium hydroxide (1.11 mol / L) were supplied.
• oxidizing agent equivalent to 13.94% by mass, 1.11 mol / L
• tetramethylammonium hydroxide (1.11 mol / L
• a mixed solution (corresponding to 2.88% by mass, 0.32 mol / L) was obtained.
• the liquid temperature during the reaction was 11 ° C. 97% by mass of tetramethylammonium bromide (manufactured by Tokyo Kasei Kogyo Co., Ltd.) 15.88 g (15.41) in 92.06 g of a mixed solution of tetramethylammonium hypochlorite aqueous solution and tetramethylammonium hydroxide obtained by the above operation. (Equivalent to mass%, 1.0 mol / L, 7.9 mass% as the amount of bromine element) was added to obtain 100 g of a treatment solution having the composition shown in Table 1. Evaluation was performed using a tungsten film (sample piece) prepared in the same manner as in Example 1.
• Example 12 has the composition shown in Table 1 in a mixed solution of an aqueous solution of tetramethylammonium hypobromous acid and tetramethylammonium hydroxide prepared in the same manner as in Example 2.
• a mixed solution of hypobromous acid ion and orthoperiodic acid was prepared by adding orthoperiodic acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., content> 98.5%). Evaluation was performed using a tungsten film (sample piece) prepared in the same manner as in Example 1.
• Example 13 tetramethylammonium hydroxide, ultrapure water and tetramethylammonium bromide are added to sodium hypochlorite pentahydrate (SHC5, manufactured by Nippon Light Metal Co., Ltd.) so as to have the composition shown in Table 1.
• SHC5 sodium hypochlorite pentahydrate
• Example 14 and 15 tetramethylammonium bromide was added to a mixed solution of an aqueous solution of tetramethylammonium hypochlorous acid and tetramethylammonium hydroxide prepared in the same manner as in Example 2 so as to have the composition shown in Table 1. It was prepared by adding tetramethylammonium chloride (manufactured by Tokyo Chemical Industry Co., Ltd., purity> 98%). Evaluation was performed using a tungsten film (sample piece) prepared in the same manner as in Example 1.
• Example 16 to 22 a treatment liquid was prepared in the same manner as in Example 2 so as to have the composition shown in Table 3, and evaluation was performed using the prepared molybdenum film or chromium film (sample piece).
• Example 23> a treatment liquid was prepared in the same manner as in Example 13 so as to have the composition shown in Table 3, and evaluation was performed using the prepared molybdenum film or chromium film (sample piece).
• Example 24 and 25> In Examples 24 and 25, a treatment liquid was prepared in the same manner as in Example 14 so as to have the composition shown in Table 3, and evaluation was performed using the prepared molybdenum film or chromium film (sample piece).
• Comparative Examples 1 to 7 a mixed solution of an aqueous solution of tetramethylammonium hypochlorous acid and tetramethylammonium hydroxide was prepared in the same manner as in Example 2 so as to have the composition shown in Table 1, and compared with Example 1. Evaluation was performed using the tungsten film (sample piece) prepared in the same manner.
• Comparative Example 9 was prepared by adding ultrapure water to orthoperiodic acid so as to have the composition shown in Table 1. Evaluation was performed using a tungsten film (sample piece) prepared in the same manner as in Example 1.
• Comparative Example 9 shows hydrofluoric acid (manufactured by Kanto Chemical Co., Inc., ultra-high purity grade, concentration 50%) 20% by mass, nitric acid solution (manufactured by Kanto Chemical Co., Inc., ultra-high purity grade, concentration 69%) 7% by mass, and water. was mixed and stirred to prepare a treatment solution. Evaluation was performed using a tungsten film (sample piece) prepared in the same manner as in Example 1.
• Comparative Examples 10 to 15 a molybdenum film prepared by preparing a mixed solution of an aqueous solution of tetramethylammonium hypochlorous acid and tetramethylammonium hydroxide in the same manner as in Example 2 so as to have the composition shown in Table 3. Alternatively, evaluation was performed using a chromium film (sample piece).
• Tables 2 and 4 show the composition of the treatment liquid and the evaluation results. As shown in Table 2, it was confirmed that the treatment liquid of the present embodiment has a high etching rate of the Group 6 metal and is excellent. Further, in any of the examples, it was confirmed that the film thickness of the SiO 2 film was not reduced by the etching treatment and there was no damage to the SiO 2.

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