WO2021189524A1 - Oled 显示面板及其制备方法 oled 显示装置 - Google Patents

Oled 显示面板及其制备方法 oled 显示装置 Download PDF

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Publication number
WO2021189524A1
WO2021189524A1 PCT/CN2020/083214 CN2020083214W WO2021189524A1 WO 2021189524 A1 WO2021189524 A1 WO 2021189524A1 CN 2020083214 W CN2020083214 W CN 2020083214W WO 2021189524 A1 WO2021189524 A1 WO 2021189524A1
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WIPO (PCT)
Prior art keywords
thickness
layer
electronic component
substrate
oled display
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Application number
PCT/CN2020/083214
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English (en)
French (fr)
Inventor
龚吉祥
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/957,387 priority Critical patent/US11751469B2/en
Priority to EP20750154.5A priority patent/EP4131387A4/en
Publication of WO2021189524A1 publication Critical patent/WO2021189524A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • This application relates to the field of display technology, and in particular to an OLED display panel, a preparation method thereof, and an OLED display device.
  • the Light-Emitting Diode Organic Light-Emitting Diode
  • the display panel will block the light entering the camera.
  • the camera area under the screen undergoes special-shaped cutting, which leads to the need to dig holes in the camera area under the screen, and the digging area cannot be displayed, which affects the display effect.
  • the existing OLED display panel has a technical problem that the camera area under the screen needs to be digged, which affects the display effect.
  • the embodiments of the present application provide an OLED display panel, a manufacturing method thereof, and an OLED display device, which are used to solve the technical problem that the existing OLED display panel needs to dig a hole in the camera area under the screen, which affects the display effect.
  • An embodiment of the present application provides an OLED display panel, which includes:
  • the substrate is arranged on the backplane
  • the driving circuit layer is arranged on the substrate;
  • the light-emitting function layer is arranged on the driving circuit layer;
  • the encapsulation layer is arranged on the light-emitting function layer
  • the sum of the thickness of the back plate and the substrate in the electronic component installation area corresponding to the electronic component installation position is smaller than the sum of the thickness of the back plate and the substrate in other areas.
  • the driving circuit layer includes an active layer, and the mass fraction of the phosphorus element in the active layer of the electronic element installation area is greater than the mass fraction of the phosphorus element in the active layer in other regions.
  • the OLED display panel includes pixel units, and the density of the pixel units in the electronic element arrangement area is smaller than the density of the pixel units in other areas.
  • the thickness of the backplane in the electronic component installation area is smaller than the thickness of the backplane in other areas, and the thickness of the substrate in the electronic component installation area is the same as the thickness of the substrate in other areas. equal.
  • the thickness of the substrate in the electronic component installation area is smaller than the thickness of the substrate in other areas, and the thickness of the backplane in the electronic component installation area is the same as the thickness of the backplane in other areas. equal.
  • the thickness of the backplane in the electronic component installation area is less than the thickness of the backplane in other areas, and the thickness of the substrate in the electronic component installation area is less than the thickness of the substrate in other areas.
  • the substrate includes a first flexible layer, a barrier layer, and a second flexible layer.
  • the thickness of the first flexible layer in the electronic component placement area is smaller than the thickness of the first flexible layer in other areas.
  • an adhesive layer is provided between the first flexible layer and the backplane, and the thickness of the adhesive layer in the area where the electronic component is installed is smaller than the thickness of the adhesive layer in other areas.
  • the thickness of the back plate in the electronic component installation area is zero.
  • the thickness of the adhesive layer in the electronic component installation area is zero.
  • an embodiment of the present application provides an OLED display device, and the OLED display device includes:
  • An OLED display panel the OLED display panel includes a backplane, a substrate, a driving circuit layer, a light-emitting function layer, and an encapsulation layer, the substrate is disposed on the backplane, and the driving circuit layer is disposed on the substrate
  • the light-emitting function layer is disposed on the driving circuit layer
  • the encapsulation layer is disposed on the light-emitting function layer, wherein the backplane and the backplane in the electronic component installation area corresponding to the electronic component installation position
  • the sum of the thicknesses of the substrate is smaller than the sum of the thicknesses of the backplane and the substrate in other regions;
  • An electronic component the electronic component is arranged in the electronic component installation area.
  • the electronic component includes a camera.
  • the driving circuit layer includes an active layer, and the mass fraction of the phosphorus element in the active layer of the electronic element installation area is greater than the mass fraction of the phosphorus element in the active layer in other regions.
  • the OLED display panel includes pixel units, and the density of the pixel units in the electronic element arrangement area is smaller than the density of the pixel units in other areas.
  • the thickness of the backplane in the electronic component installation area is smaller than the thickness of the backplane in other areas, and the thickness of the substrate in the electronic component installation area is the same as the thickness of the substrate in other areas. equal.
  • the thickness of the substrate in the electronic component installation area is smaller than the thickness of the substrate in other areas, and the thickness of the backplane in the electronic component installation area is the same as the thickness of the backplane in other areas. equal.
  • the thickness of the backplane in the electronic component installation area is less than the thickness of the backplane in other areas, and the thickness of the substrate in the electronic component installation area is less than the thickness of the substrate in other areas.
  • the substrate includes a first flexible layer, a barrier layer, and a second flexible layer.
  • the thickness of the first flexible layer in the electronic component placement area is smaller than the thickness of the first flexible layer in other areas.
  • an adhesive layer is provided between the first flexible layer and the backplane, and the thickness of the adhesive layer in the area where the electronic component is installed is smaller than the thickness of the adhesive layer in other areas.
  • an embodiment of the present application provides a method for manufacturing an OLED display panel.
  • the method for manufacturing an OLED display panel includes:
  • the substrate including a first flexible layer, a second flexible layer, and a barrier layer disposed between the first flexible layer and the second flexible layer;
  • the backplane and the first flexible layer in the electronic component installation area are removed to obtain a display panel; the sum of the thickness of the backplane and the substrate in the electronic component installation area is smaller than that of the backplane and the backing in other areas. The sum of the thickness of the bottom.
  • the embodiments of the present application provide an OLED display panel and a preparation method thereof, and an OLED display device.
  • the OLED display panel includes a backplane, a substrate, a driving circuit layer, a light-emitting function layer, and an encapsulation layer.
  • the substrate is disposed on the back.
  • the driving circuit layer is disposed on the substrate
  • the light-emitting function layer is disposed on the driving circuit layer
  • the packaging layer is disposed on the light-emitting function layer, wherein the corresponding electronic element is disposed
  • the sum of the thickness of the back plate and the substrate in the electronic component installation area of the position is smaller than the sum of the thickness of the back plate and the substrate in other areas;
  • the thickness of at least one layer of the substrate and the backplane of the substrate is reduced, so that the light transmittance of the electronic component setting area is increased, and the under-screen camera area is displayed normally, without the need to dig holes to realize the under-screen camera, which improves the screen-to-body ratio. It solves the technical problem that the existing OLED display panel needs to dig a hole in the camera area under the screen, which affects the display effect.
  • FIG. 1 is a first schematic diagram of an OLED display panel provided by an embodiment of the application.
  • FIG. 2 is a second schematic diagram of an OLED display panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of an OLED display device provided by an embodiment of the application.
  • FIG. 4 is a flowchart of a method for manufacturing an OLED display panel provided by an embodiment of the application.
  • FIG. 5 is a graph showing the variation curve of the threshold voltage of the transistor provided by an embodiment of the application.
  • the present application provides an OLED display panel, a manufacturing method thereof, and an OLED display device.
  • an OLED display panel In order to make the objectives, technical solutions, and effects of the present application clearer and clearer, the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the application, and are not used to limit the application.
  • the embodiments of the present application address the technical problem that the existing OLED display panel needs to dig a hole in the camera area under the screen, which affects the display effect.
  • the embodiments of the present application are used to solve the above-mentioned technical problems.
  • an embodiment of the present application provides an OLED display panel
  • the OLED display panel includes:
  • the substrate 12 is arranged on the back plate 11;
  • the driving circuit layer 14 is disposed on the substrate 12;
  • the light-emitting function layer 15 is disposed on the driving circuit layer 14;
  • the encapsulation layer 16 is disposed on the light-emitting function layer 15;
  • the sum of the thickness of the backplane 11 and the substrate 12 in the electronic component installation area 211 corresponding to the electronic component installation position is smaller than the thickness of the backplane 11 and the substrate 12 in the other regions 212.
  • the sum of thickness is smaller than the thickness of the backplane 11 and the substrate 12 in the other regions 212.
  • the embodiment of the present application provides an OLED display panel.
  • the OLED display panel includes a backplane, a substrate, a driving circuit layer, a light-emitting function layer, and an encapsulation layer.
  • the substrate is disposed on the backplane, and the driving circuit layer Is disposed on the substrate, the light-emitting function layer is disposed on the drive circuit layer, and the encapsulation layer is disposed on the light-emitting function layer, wherein, in the electronic component installation area corresponding to the electronic component installation position
  • the sum of the thicknesses of the backplane and the substrate is smaller than the sum of the thicknesses of the backplane and the substrate in other regions;
  • the thickness of at least one layer is reduced, so that the light transmittance of the electronic component setting area is increased, and the camera area under the screen is displayed normally. There is no need to dig a hole to realize the camera under the screen, which increases the screen-to-body ratio and solves the existing OLED display panel. There is a technical
  • FIG. 1 shows display areas in other areas, and non-display areas in other areas are not shown.
  • a buffer layer 13 is provided between the substrate 12 and the driving circuit layer 14.
  • the driving circuit layer 14 includes an active layer 141, a first gate insulating layer 142, a first metal layer 143, a second gate insulating layer 144, and a second metal layer.
  • the mass fraction of phosphorus in the active layer 141 of the electronic element placement region 211 is greater than that of the active layer 141 in the other regions 212
  • the mass fraction of the internal phosphorus element; when preparing the active layer, the channel region 311 of the active layer in the electronic element setting area is doped with phosphorus element, so that the threshold voltage of the transistor of the driving circuit layer is negatively biased.
  • the threshold voltage of the transistor of the driving circuit layer is positively biased, so that the threshold voltage of the transistor caused by the doping of phosphorous element is negatively biased, and the electronic component
  • the substrate or backplane in the setting area, or the threshold voltage of the transistor brought by the substrate and the backplane is offset, so that the thickness of the substrate or backplane, or the substrate and the backplane in the electronic component setting area is reduced.
  • the threshold voltage of the transistor will not be forward biased, which will affect the display effect, thereby solving the technical problem that the threshold voltage of the transistor will be biased forward when the substrate and backplane are lowered.
  • the active layer 141 includes a channel region 311 and a doped region 312.
  • the transistors of the driving circuit layer include P-type transistors.
  • the OLED display panel includes pixel units, and the density of the pixel units in the electronic component setting area is smaller than the density of the pixel units in other areas, that is, considering the metal film in the driving circuit layer
  • the layer will have the problem of blocking light.
  • the thickness of the backplane in the electronic component installation area is smaller than the thickness of the backplane in other areas, and the thickness of the substrate in the electronic component installation area is greater than that of the substrate in other areas.
  • the thickness is equal; when the thickness of the substrate is not changed, taking into account the greater blocking effect of the backplane on the Inside the electronic components, an under-screen camera is realized, and the under-screen camera can work normally.
  • the thickness of the substrate in the electronic component installation area is smaller than the thickness of the substrate in other areas, and the thickness of the backplane in the electronic component installation area is greater than that of the backplane in other areas.
  • the thickness is equal; when the thickness of the backplane is not changed, considering that the substrate has a greater blocking effect on light, especially for high temperature resistant substrates, yellow polyimide will be used to prepare the substrate, which will cause the substrate to The blocking effect of light is further increased, so that the light cannot reach the electronic components well.
  • the embodiment of the present application reduces the thickness of the substrate in the electronic component installation area, thereby increasing the light transmittance in the electronic component installation area. Improve the light transmittance in the area where the electronic components are installed.
  • the thickness of the back plate 11 in the electronic component installation area 211 is smaller than the thickness of the back plate 11 in the other areas 212, and the lining in the electronic component installation area 211
  • the thickness of the bottom 12 is smaller than the thickness of the substrate 12 in the other regions 212.
  • the thickness of the back plate and the substrate in the electronic component installation area are reduced, so that the light transmittance in the electronic component installation area is increased, so that the light can better pass through the OLED display panel to the electronic components, so that the electronic components
  • the effect of the light received by the component is similar to the effect of the light received by the electronic component when the hole is dug, thereby improving the light transmittance of the electronic component installation area.
  • the material of the back plate includes polyethylene terephthalate.
  • the substrate 12 includes a first flexible layer 121, a barrier layer 122, and a second flexible layer 123.
  • the thickness of the first flexible layer 121 of the electronic component placement area 211 is , Is smaller than the thickness of the first flexible layer 121 in the other regions 212.
  • the thickness of the first flexible layer in the electronic component placement area is reduced, and the barrier layer
  • the thickness of the second flexible layer does not change, so that the barrier layer cooperates with the second flexible layer to block water and oxygen intrusion, while the thickness of the first flexible layer is reduced, so that the light transmittance in the electronic component installation area is increased, thereby improving The light transmittance of the electronic component placement area.
  • the material of the first flexible layer includes polyimide.
  • the material of the second flexible layer includes polyimide.
  • an adhesive layer 22 is provided between the first flexible layer 121 and the back plate 11, and the thickness of the adhesive layer 22 in the electronic component installation area 211 is The thickness of the adhesive layer 22 is smaller than that of the other areas 212.
  • the adhesive layer can be reduced by reducing the adhesion of the electronic component installation area.
  • the thickness of the laminated layer increases the light transmittance of the electronic component installation area.
  • the material of the adhesive layer includes optical glue.
  • the light-emitting function layer 15 includes a pixel electrode layer 151, a pixel definition layer 152, a light-emitting layer 153, and a common electrode layer 154.
  • the pixel electrode layer and the common electrode layer The material includes indium oxide, and indium oxide is used to prepare the pixel electrode layer and the common electrode layer, so that the pixel electrode layer and the common electrode layer have better light transmittance, and the light transmittance of the electronic element installation area is improved.
  • the thickness of the back plate of the electronic component installation area is zero.
  • the back plate of the electronic component installation area may be removed, so that the electronic component installation area is transparent. The light rate is increased, and because the electronic component setting area is small, the backplane of this area is removed, and there is no slippage of other film layers, so that the OLED display panel can display normally.
  • the thickness of the adhesive layer of the electronic component installation area is zero. In order to improve the light transmittance of the electronic component installation area, after removing the back plate of the electronic component installation area, the There is no need to bond the backplane and the substrate, and the adhesive layer of the electronic component installation area can be removed, thereby further improving the light transmittance of the electronic component installation area.
  • the thickness of the first flexible layer in the electronic component installation area is zero, and the backplane, adhesive layer, and first flexible layer in the electronic component installation area are removed, and the barrier layer and the first flexible layer are retained.
  • the two flexible layers make the barrier layer and the second flexible layer block water and oxygen, while the backplane, the adhesive layer and the first flexible layer are removed, so that the light transmittance of the electronic component placement area is increased.
  • the opening formed by the backplane 11, the adhesive layer 22, and the first flexible layer 12 is a trapezoid.
  • the opening By designing the opening as a trapezoid, light is transmitted through the first flexible layer. After layering, it can spread to the electronic components so that the electronic components can receive all the light, and the light can be confined to the electronic component installation area by setting the reflective member on the side of the opening, so that the electronic components can receive all the light. As a result, the electronic components receive more light, and the light transmittance is improved.
  • an embodiment of the present invention provides an OLED display device, and the OLED display device includes:
  • An OLED display panel the OLED display panel includes a backplane 11, a substrate 12, a driving circuit layer 14, a light-emitting function layer 15, and an encapsulation layer 16.
  • the substrate 12 is disposed on the backplane 11, and the driving circuit
  • the layer 14 is disposed on the substrate 12, the light-emitting function layer 15 is disposed on the drive circuit layer 14, and the encapsulation layer 16 is disposed on the light-emitting function layer 15, wherein the corresponding electronic component is disposed at a position
  • the sum of the thicknesses of the backplane 11 and the substrate 12 in the electronic component setting area 211 is smaller than the sum of the thicknesses of the backplane 11 and the substrate 12 in other areas;
  • the electronic component 32 is arranged in the electronic component installation area 211.
  • An embodiment of the application provides an OLED display device, which includes an OLED display panel and electronic components.
  • the OLED display panel includes a backplane, a substrate, a driving circuit layer, a light-emitting function layer, and an encapsulation layer.
  • the substrate Is disposed on the backplane, the driving circuit layer is disposed on the substrate, the light-emitting function layer is disposed on the driving circuit layer, and the encapsulation layer is disposed on the light-emitting function layer, wherein:
  • the sum of the thickness of the backplane and the substrate in the electronic component installation area corresponding to the electronic component installation position is smaller than the sum of the thickness of the backplane and the substrate in other areas;
  • the electronic component It is arranged in the electronic component installation area; by reducing the thickness of at least one layer of the substrate and the back plate in the electronic component installation area, the light transmittance of the electronic component installation area is increased, and the under-screen camera area is normal Display, there is no need to dig a hole to
  • the electronic component includes a camera.
  • the received light is poor, and holes need to be drilled in this area.
  • the present application reduces the thickness of the backplane and the substrate. Therefore, the light transmittance of the electronic component installation area is improved, so that the camera can receive more light, without digging holes, the screen-to-body ratio can be increased, and the light transmittance of the electronic component installation area can be improved.
  • the driving circuit layer includes an active layer, and the mass fraction of phosphorus in the active layer in the electronic element setting area is greater than that in the active layer in other regions. The quality score of the element.
  • the OLED display panel includes pixel units, and the density of the pixel units in the electronic element arrangement area is smaller than the density of the pixel units in other areas.
  • the thickness of the backplane in the electronic component installation area is smaller than the thickness of the backplane in other areas, and the thickness of the substrate in the electronic component installation area is less than The thickness of the substrate in other regions is equal.
  • the thickness of the substrate in the electronic element installation area is smaller than the thickness of the substrate in other areas, and the thickness of the back plate in the electronic element installation area is less than The thickness of the backplane in other areas is equal.
  • the thickness of the backplane in the electronic component installation area is less than the thickness of the backplane in other areas, and the thickness of the substrate in the electronic component installation area is less than The thickness of the substrate in other areas.
  • the substrate in the OLED display device, includes a first flexible layer, a barrier layer, and a second flexible layer. The thickness of a flexible layer.
  • an adhesive layer is provided between the first flexible layer and the back plate, and the thickness of the adhesive layer in the area where the electronic component is installed is smaller than that in other areas. The thickness of the laminate.
  • an embodiment of the present application provides a method for preparing an OLED display panel, and the method for preparing an OLED display panel includes:
  • the substrate including a first flexible layer, a second flexible layer, and a barrier layer disposed between the first flexible layer and the second flexible layer;
  • the embodiment of the application provides a method for preparing an OLED display panel.
  • the OLED display panel prepared by the method for preparing an OLED display panel includes a backplane, a substrate, a driving circuit layer, a light-emitting function layer, and an encapsulation layer.
  • the substrate is disposed on the On the backplane, the driving circuit layer is disposed on the substrate, the light-emitting function layer is disposed on the driving circuit layer, and the packaging layer is disposed on the light-emitting function layer.
  • the sum of the thicknesses of the backplane and the substrate in the electronic component installation area of the installation position is smaller than the sum of the thicknesses of the backplane and the substrate in other areas; by preparing the OLED display panel,
  • the channel region of the active layer in the electronic element installation area is doped with phosphorus element, so that the threshold voltage of the transistor in the electronic element installation area is negatively biased, and the backplane and the first substrate in the electronic element installation area are subsequently removed.
  • the threshold voltage of the transistor in the electronic component installation area is positively biased, so that when the substrate and the back plate are removed, the light transmittance of the electronic component installation area is improved, and the transistor in the electronic component installation area
  • the threshold voltage is not forward biased, and the OLED display panel displays normally.
  • phosphine when phosphorus is doped into the channel region of the active layer in the driving circuit layer, phosphine can be used to dope the channel region of the active layer, so that electrons The transistors in the component placement area are negatively biased.
  • the step of removing the backplane and the first flexible layer in the electronic component installation area includes: using a laser to process the backplane and the first flexible layer in the electronic component installation area to remove the electronic component installation area Part of the backplane and the first flexible layer.
  • the abscissa in FIG. 5 represents the threshold voltage Vgs of the transistor in the electronic component installation area, and the ordinate represents the leakage current Ids of the transistor in the electronic component installation area.
  • the threshold voltage of the transistor in the electronic component setting area will be negatively biased, that is, it will change from the curve 42 in FIG.
  • the threshold voltage of the transistor in the electronic component placement area will be positively biased when the board and the first flexible layer are installed, that is, from curve 41 to curve 42; so that when the light transmittance of the electronic component placement area is increased, the transistor is not positively biased, making the display
  • ⁇ Vth, so that after the OLED display panel is processed, the OLED The light transmittance of the electronic element arrangement area of the display panel is increased, and the technical problem that the transistor is forward biased
  • the boron element when the removal of the film layer causes the transistor to cause a negative bias, can be pre-doped to make the transistor positive, so as to increase the light transmittance of the electronic element placement area without affecting the normality of the OLED display panel. show.
  • the embodiments of the present application provide an OLED display panel and a preparation method thereof, and an OLED display device.
  • the OLED display panel includes a backplane, a substrate, a driving circuit layer, a light-emitting function layer, and an encapsulation layer.
  • the substrate is disposed on the back.
  • the driving circuit layer is disposed on the substrate
  • the light-emitting function layer is disposed on the driving circuit layer
  • the packaging layer is disposed on the light-emitting function layer, wherein the corresponding electronic element is disposed
  • the sum of the thickness of the back plate and the substrate in the electronic component installation area of the position is smaller than the sum of the thickness of the back plate and the substrate in other areas;
  • the thickness of at least one layer of the substrate and the backplane of the substrate is reduced, so that the light transmittance of the electronic component setting area is increased, and the under-screen camera area is displayed normally, without the need to dig holes to realize the under-screen camera, which improves the screen-to-body ratio. It solves the technical problem that the existing OLED display panel needs to dig a hole in the camera area under the screen, which affects the display effect.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
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Abstract

一种OLED显示面板及其制备方法、OLED显示装置，该OLED显示面板通过将电子元件设置区（211）内的衬底（12）和背板（11）中的至少一层的厚度降低，从而使得电子元件设置区（211）的透光率增大，且屏下摄像头区域正常显示，无需挖孔实现屏下摄像头，提高了屏占比，解决了现有的OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题。

Description

OLED显示面板及其制备方法、OLED显示装置 技术领域
本申请涉及显示技术领域，尤其是涉及一种OLED显示面板及其制备方法、OLED显示装置。
 背景技术
现有OLED（Organic Light-Emitting Diode，有机发光二极管）显示面板为了提高屏占比，会将摄像头放置在显示面板下方，但在将摄像头放置在显示面板下方时，由于显示面板会遮挡进入摄像头的光线，所以需要对屏下摄像头区域进行异形切割，从而导致屏下摄像头区域需要挖孔，而挖孔区域无法显示，影响显示效果。
所以，现有的OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题。
 技术问题
本申请实施例提供一种OLED显示面板及其制备方法、OLED显示装置，用以解决现有的OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供一种OLED显示面板，该OLED显示面板包括：
背板；
衬底，设置于所述背板上；
驱动电路层，设置于所述衬底上；
发光功能层，设置于所述驱动电路层上；
封装层，设置于所述发光功能层上；
其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和。
在一些实施例中，所述驱动电路层包括有源层，所述电子元件设置区的有源层内的磷元素的质量分数，大于其他区域的有源层内磷元素的质量分数。
在一些实施例中，所述OLED显示面板包括像素单元，所述电子元件设置区内的像素单元的密度，小于其他区域内的像素单元的密度。
在一些实施例中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，与其他区域的衬底的厚度相等。
在一些实施例中，所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度，且所述电子元件设置区内的背板的厚度，与其他区域的背板的厚度相等。
在一些实施例中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度。
在一些实施例中，所述衬底包括第一柔性层、阻挡层和第二柔性层，所述电子元件设置区的第一柔性层的厚度，小于其他区域的第一柔性层的厚度。
在一些实施例中，所述第一柔性层与所述背板之间设有粘合层，所述电子元件设置区的粘合层的厚度，小于其他区域的粘合层的厚度。
在一些实施例中，所述电子元件设置区内的背板的厚度为零。
在一些实施例中，所述电子元件设置区内的粘合层的厚度为零。
同时，本申请实施例提供一种OLED显示装置，该OLED显示装置包括：
OLED显示面板，所述OLED显示面板包括背板、衬底、驱动电路层、发光功能层和封装层，所述衬底设置于所述背板上，所述驱动电路层设置于所述衬底上，所述发光功能层设置于所述驱动电路层上，所述封装层设置于所述发光功能层上，其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和；
电子元件，所述电子元件设置于所述电子元件设置区。
在一些实施例中，所述电子元件包括摄像头。
在一些实施例中，所述驱动电路层包括有源层，所述电子元件设置区的有源层内的磷元素的质量分数，大于其他区域的有源层内磷元素的质量分数。
在一些实施例中，所述OLED显示面板包括像素单元，所述电子元件设置区内的像素单元的密度，小于其他区域内的像素单元的密度。
在一些实施例中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，与其他区域的衬底的厚度相等。
在一些实施例中，所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度，且所述电子元件设置区内的背板的厚度，与其他区域的背板的厚度相等。
在一些实施例中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度。
在一些实施例中，所述衬底包括第一柔性层、阻挡层和第二柔性层，所述电子元件设置区的第一柔性层的厚度，小于其他区域的第一柔性层的厚度。
在一些实施例中，所述第一柔性层与所述背板之间设有粘合层，所述电子元件设置区的粘合层的厚度，小于其他区域的粘合层的厚度。
同时，本申请实施例提供一种OLED显示面板制备方法，该OLED显示面板制备方法包括：
提供背板；
在所述背板上形成衬底，所述衬底包括第一柔性层、第二柔性层，以及设置于所述第一柔性层和第二柔性层之间的阻挡层；
在所述衬底上形成驱动电路层，并在对应电子元件设置位置的电子元件设置区内，向所述驱动电路层中的有源层的沟道区内掺杂磷元素；
在所述驱动电路层上形成发光功能层；
在所述发光功能层上形成封装层；
去除所述电子元件设置区内的背板和第一柔性层的部分，得到显示面板；所述电子元件设置区内的背板与衬底的厚度之和，小于在其他区域的背板与衬底的厚度之和。
 有益效果
本申请实施例提供一种OLED显示面板及其制备方法、OLED显示装置，该OLED显示面板包括背板、衬底、驱动电路层、发光功能层和封装层，所述衬底设置于所述背板上，所述驱动电路层设置于所述衬底上，所述发光功能层设置于所述驱动电路层上，所述封装层设置于所述发光功能层上，其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和；本申请通过将电子元件设置区内的衬底和背板中的至少一层的厚度降低，从而使得电子元件设置区的透光率增大，且屏下摄像头区域正常显示，无需挖孔实现屏下摄像头，提高了屏占比，解决了现有的OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题。
 附图说明
图1为本申请实施例提供的OLED显示面板的第一示意图。
图2为本申请实施例提供的OLED显示面板的第二示意图。
图3为本申请实施例提供的OLED显示装置的示意图。
图4为本申请实施例提供的OLED显示面板制备方法的流程图。
图5为本申请实施例提供的晶体管的阈值电压的变化曲线图。
 本发明的实施方式
本申请提供一种OLED显示面板及其制备方法、OLED显示装置，为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请实施例针对现有OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题，本申请实施例用以解决上述技术问题。
如图1所示，本申请实施例提供一种OLED显示面板，该OLED显示面板包括：
背板11；
衬底12，设置于所述背板11上；
驱动电路层14，设置于所述衬底12上；
发光功能层15，设置于所述驱动电路层14上；
封装层16，设置于所述发光功能层15上；
其中，在对应电子元件设置位置的电子元件设置区211内的所述背板11与所述衬底12的厚度之和，小于在其他区域212的所述背板11与所述衬底12的厚度之和。
本申请实施例提供一种OLED显示面板，该OLED显示面板包括背板、衬底、驱动电路层、发光功能层和封装层，所述衬底设置于所述背板上，所述驱动电路层设置于所述衬底上，所述发光功能层设置于所述驱动电路层上，所述封装层设置于所述发光功能层上，其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和；本申请通过将电子元件设置区内的衬底和背板中的至少一层的厚度降低，从而使得电子元件设置区的透光率增大，且屏下摄像头区域正常显示，无需挖孔实现屏下摄像头，提高了屏占比，解决了现有的OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题。
需要说明的是，图1中示出了其他区域中的显示区，其他区域中的非显示区未示出。
在一种实施例中，如图1所示，所述衬底12与所述驱动电路层14之间设置有缓冲层13。
在一种实施例中，如图1所示，所述驱动电路层14包括有源层141、第一栅极绝缘层142、第一金属层143、第二栅极绝缘层144、第二金属层145、层间绝缘层146、源漏极层147和平坦化层148，在所述电子元件设置区211的有源层141内的磷元素的质量分数，大于其他区域212的有源层141内磷元素的质量分数；通过在制备有源层时，向电子元件设置区内的有源层的沟道区311掺杂磷元素，从而使得驱动电路层的晶体管的阈值电压负偏，而在后续去除电子元件设置区内的衬底或背板、或者衬底和背板时，驱动电路层的晶体管的阈值电压正偏，使得掺杂磷元素造成的晶体管的阈值电压负偏，与电子元件设置区内的衬底或背板、或者衬底和背板带来的晶体管的阈值电压正偏抵消，从而使得在降低电子元件设置区的衬底或背板、或者衬底和背板的厚度时，不会造成晶体管的阈值电压正偏，影响显示效果，从而解决了在降低衬底和背板时，会导致晶体管的阈值电压正偏的技术问题。
在一种实施例中，所述有源层141包括沟道区311和掺杂区312。
在一种实施例中，所述驱动电路层的晶体管包括P型晶体管。
在一种实施例中，所述OLED显示面板包括像素单元，所述电子元件设置区内的像素单元的密度，小于其他区域内的像素单元的密度，即在考虑到驱动电路层中的金属膜层会存在对光线产生遮挡的问题，通过降低电子元件设置区内的像素密度，从而使得电子元件设置区内的像素单元的数量相对减小，从而使得电子元件设置区内光线透过率增大，进而使得电子元件设置区内的透过率增大，无需挖孔，实现了屏下摄像头，且提高了电子元件设置区的光线透过率。
在一种实施例中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，与其他区域的衬底的厚度相等；在不改变衬底的厚度时，考虑到背板对光学的阻挡效果较大，通过降低电子元件设置区内的背板的厚度，从而提高光线的透过率，使得光线能够传递到电子元件内，从而实现屏下摄像头，且屏下摄像头能够正常工作。
在一种实施例中，所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度，且所述电子元件设置区内的背板的厚度，与其他区域的背板的厚度相等；在不改变背板的厚度时，考虑到衬底对光线的阻挡效果较大，特别是对于耐高温的衬底，会采用黄色的聚酰亚胺制备衬底，从而导致衬底对光线的阻挡效果进一步增大，使得光线无法较好的到达电子元件，而本申请实施例通过降低电子元件设置区内的衬底的厚度，从而使得电子元件设置区内的透光率增大，提高了电子元件设置区内的透光率。
在一种实施例中，如图1所示，所述电子元件设置区211内的背板11的厚度，小于其他区域212的背板11的厚度，且所述电子元件设置区211内的衬底12的厚度，小于其他区域212的衬底12的厚度，在考虑到增大电子元件设置区内的光线透过率时，通过同时降低电子元件设置区的背板的厚度和衬底的厚度，使得电子元件设置区内背板与衬底的厚度均降低，从而使得电子元件设置区内的光线透过率增大，从而使得光线能够较好的穿过OLED显示面板到达电子元件，使得电子元件接收到的光线的效果与挖孔时电子元件接收到的光线的效果相近，从而提高了电子元件设置区的透光率。
在一种实施例中，所述背板的材料包括聚对苯二甲酸乙二醇酯。
在一种实施例中，如图2所示，所述衬底12包括第一柔性层121、阻挡层122和第二柔性层123，所述电子元件设置区211的第一柔性层121的厚度，小于其他区域212的第一柔性层121的厚度，在降低衬底的厚度时，考虑到OLED显示面板需要阻隔水氧，则将电子元件设置区的第一柔性层的厚度降低，而阻挡层与第二柔性层的厚度不改变，从而使得阻隔层配合第二柔性层阻隔水氧入侵，而第一柔性层的厚度降低，从而使得电子元件设置区内的光线透过率增大，从而提高电子元件设置区的透光率。
在一种实施例中，所述第一柔性层的材料包括聚酰亚胺。
在一种实施例中，所述第二柔性层的材料包括聚酰亚胺。
在一种实施例中，如图2所示，所述第一柔性层121与所述背板11之间设有粘合层22，所述电子元件设置区211的粘合层22的厚度，小于其他区域212的粘合层22的厚度，在使用粘合层将背板和衬底粘合时，考虑到粘合层也会影响到光线的透过，可以通过降低电子元件设置区的粘合层的厚度，从而使得电子元件设置区的光线透过率提高。
在一种实施例中，所述粘合层的材料包括光学胶。
在一种实施例中，如图1所示，所述发光功能层15包括像素电极层151、像素定义层152、发光层153和公共电极层154，所述像素电极层与所述公共电极层的材料包括氧化铟烯，采用氧化铟烯制备像素电极层和公共电极层，从而使得像素电极层与公共电极层具有较好的透光率，提高电子元件设置区的光线的透过率。
在一种实施例中，所述电子元件设置区的背板的厚度为零，为了提高电子元件设置区的透光率，可以将电子元件设置区的背板去除，从而使得电子元件设置的透光率增大，且由于电子元件设置区较小，使得去除该区域的背板，不会存在其他膜层的滑落，从而使得OLED显示面板正常显示。
在一种实施例中，所述电子元件设置区的粘合层的厚度为零，为了提高电子元件设置区的透光率，在去除电子元件设置区的背板后，由于在电子元件设置区无需粘结背板和衬底，可以去除电子元件设置区的粘合层，从而进一步提升电子元件设置区的透光率。
在一种实施例中，所述电子元件设置区的第一柔性层的厚度为零，通过将电子元件设置区内的背板、粘合层、第一柔性层去除，且保留阻挡层和第二柔性层，使得阻挡层和第二柔性层阻隔水氧，而去除了背板、粘合层和第一柔性层，使得电子元件设置区的透光率增大。
在一种实施例中，如图2所示，所述背板11、粘合层22与第一柔性层12形成的开口为梯形，通过将开口设计为梯形，使得光线在透过第一柔性层后，能够扩散到电子元件上，使得电子元件能够接收到所有的光线，且可以通过在开口的侧面设置反射构件，从而将光线限定在电子元件设置区，使得电子元件接收到所有的光线，从而使得电子元件接收到较多的光线，提高了光线的透过率。
如图3所示，本发明实施例提供一种OLED显示装置，该OLED显示装置包括：
OLED显示面板，所述OLED显示面板包括背板11、衬底12、驱动电路层14、发光功能层15和封装层16，所述衬底12设置于所述背板11上，所述驱动电路层14设置于所述衬底12上，所述发光功能层15设置于所述驱动电路层14上，所述封装层16设置于所述发光功能层15上，其中，在对应电子元件设置位置的电子元件设置区211内的所述背板11与所述衬底12的厚度之和，小于在其他区域的所述背板11和所述衬底12的厚度之和；
电子元件32，所述电子元件32设置于所述电子元件设置区211。
本申请实施例提供一种OLED显示装置，该OLED显示装置包括OLED显示面板和电子元件，所述OLED显示面板包括背板、衬底、驱动电路层、发光功能层和封装层，所述衬底设置于所述背板上，所述驱动电路层设置于所述衬底上，所述发光功能层设置于所述驱动电路层上，所述封装层设置于所述发光功能层上，其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和；所述电子元件设置于所述电子元件设置区；通过将电子元件设置区内的衬底和背板中的至少一层的厚度降低，从而使得电子元件设置区的透光率增大，且屏下摄像头区域正常显示，无需挖孔实现屏下摄像头，提高了屏占比，解决了现有的OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题。
在一种实施例中，所述电子元件包括摄像头，对于摄像头设置在OLED显示面板下，接收到的光线较差，需要对该处进行挖孔，本申请将背板和衬底的厚度降低，从而提高电子元件设置区的光线的透过率，从而使得摄像头能够接收到较多的光线，无需挖孔，即可提高屏占比，且提高电子元件设置区的透光率。
在一种实施例中，在OLED显示装置中，所述驱动电路层包括有源层，所述电子元件设置区的有源层内的磷元素的质量分数，大于其他区域的有源层内磷元素的质量分数。
在一种实施例中，在OLED显示装置中，所述OLED显示面板包括像素单元，所述电子元件设置区内的像素单元的密度，小于其他区域内的像素单元的密度。
在一种实施例中，在OLED显示装置中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，与其他区域的衬底的厚度相等。
在一种实施例中，在OLED显示装置中，所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度，且所述电子元件设置区内的背板的厚度，与其他区域的背板的厚度相等。
在一种实施例中，在OLED显示装置中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度。
在一种实施例中，在OLED显示装置中，所述衬底包括第一柔性层、阻挡层和第二柔性层，所述电子元件设置区的第一柔性层的厚度，小于其他区域的第一柔性层的厚度。
在一种实施例中，在OLED显示装置中，所述第一柔性层与所述背板之间设有粘合层，所述电子元件设置区的粘合层的厚度，小于其他区域的粘合层的厚度。
如图4所示，本申请实施例提供一种OLED显示面板制备方法，该OLED显示面板制备方法包括：
S1，提供背板；
S2，在所述背板上形成衬底，所述衬底包括第一柔性层、第二柔性层，以及设置于所述第一柔性层和第二柔性层之间的阻挡层；
S3，在所述衬底上形成驱动电路层，并在对应电子元件设置位置的电子元件设置区内，向所述驱动电路层中的有源层的沟道区内掺杂磷元素；
S4，在所述驱动电路层上形成发光功能层；
S5，在所述发光功能层上形成封装层；
S6，去除所述电子元件设置区内的背板和第一柔性层的部分，得到显示面板；所述电子元件设置区内的背板与衬底的厚度之和，小于在其他区域的背板与衬底的厚度之和。
本申请实施例提供一种OLED显示面板制备方法，该OLED显示面板制备方法制备的OLED显示面板包括背板、衬底、驱动电路层、发光功能层和封装层，所述衬底设置于所述背板上，所述驱动电路层设置于所述衬底上，所述发光功能层设置于所述驱动电路层上，所述封装层设置于所述发光功能层上，其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和；通过在制备OLED显示面板时，对电子元件设置区内的有源层的沟道区进行磷元素的掺杂，使得电子元件设置区内的晶体管的阈值电压负偏，而在后续去除电子元件设置区内的背板和第一柔性层的部分时，使得电子元件设置区的晶体管的阈值电压正偏，从而使得在去除衬底和背板的部分时，提高电子元件设置区的透光率，且电子元件设置区的晶体管的阈值电压不正偏，OLED显示面板正常显示。
在一种实施例中，在向所述驱动电路层中的有源层的沟道区内掺杂磷元素时，可以采用磷化氢对有源层的沟道区进行掺杂，从而使得电子元件设置区的晶体管负偏。
在一种实施例中，去除所述电子元件设置区内的背板和第一柔性层的部分的步骤包括：使用激光处理电子元件设置区的背板和第一柔性层，去除电子元件设置区的背板和第一柔性层的部分。
在一种实施例中，如图5所示，图5中横坐标表示电子元件设置区的晶体管的阈值电压Vgs，纵坐标表示电子元件设置区的晶体管的漏电流Ids，在对电子元件设置区的有源层的沟道区进行磷元素的掺杂后，电子元件设置区的晶体管的阈值电压会负偏，即会从图5中的曲线42变为曲线41，而在后续采用激光去除背板和第一柔性层时，电子元件设置区的晶体管的阈值电压会正偏，即从曲线41变为曲线42；从而使得在提高电子元件设置区的透光率时，晶体管不正偏，使得显示面板正常显示；同时，可以使得晶体管在掺杂磷元素时的负偏与去除背板和第一柔性层时的正偏相等，即例如激光去除背板和第一柔性层时，晶体管的阈值电压会正偏ΔVth，则可以控制掺杂的磷元素的计量，使得晶体管负偏，阈值电压由Vth1变为Vth2，即使得|Vth1-Vth2|=ΔVth，从而使得对OLED显示面板进行处理后，OLED显示面板的电子元件设置区的透光率增大，且解决了去除OLED显示面板时，会导致晶体管正偏的技术问题。
在一种实施例中，在去除膜层会晶体管导致负偏时，可以预先掺杂硼元素，使得晶体管正偏，从而使得提高电子元件设置区的透光率的同时，不影响OLED显示面板正常显示。
根据上述实施例可知：
本申请实施例提供一种OLED显示面板及其制备方法、OLED显示装置，该OLED显示面板包括背板、衬底、驱动电路层、发光功能层和封装层，所述衬底设置于所述背板上，所述驱动电路层设置于所述衬底上，所述发光功能层设置于所述驱动电路层上，所述封装层设置于所述发光功能层上，其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和；本申请通过将电子元件设置区内的衬底和背板中的至少一层的厚度降低，从而使得电子元件设置区的透光率增大，且屏下摄像头区域正常显示，无需挖孔实现屏下摄像头，提高了屏占比，解决了现有的OLED显示面板存在屏下摄像头区域需要挖孔，影响显示效果的技术问题。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (20)

  1. 一种OLED显示面板，其包括：
    背板；
    衬底，设置于所述背板上；
    驱动电路层，设置于所述衬底上；
    发光功能层，设置于所述驱动电路层上；
    封装层，设置于所述发光功能层上；
    其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和。
  2. 如权利要求1所述的OLED显示面板，其中，所述驱动电路层包括有源层，所述电子元件设置区的有源层内的磷元素的质量分数，大于其他区域的有源层内磷元素的质量分数。
  3. 如权利要求2所述的OLED显示面板，其中，所述OLED显示面板包括像素单元，所述电子元件设置区内的像素单元的密度，小于其他区域内的像素单元的密度。
  4. 如权利要求1所述OLED显示面板，其中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，与其他区域的衬底的厚度相等。
  5. 如权利要求1所述OLED显示面板，其中，所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度，且所述电子元件设置区内的背板的厚度，与其他区域的背板的厚度相等。
  6. 如权利要求1所述的OLED显示面板，其中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度。
  7. 如权利要求6所述的OLED显示面板，其中，所述衬底包括第一柔性层、阻挡层和第二柔性层，所述电子元件设置区的第一柔性层的厚度，小于其他区域的第一柔性层的厚度。
  8. 如权利要求7所述的OLED显示面板，其中，所述第一柔性层与所述背板之间设有粘合层，所述电子元件设置区的粘合层的厚度，小于其他区域的粘合层的厚度。
  9. 如权利要求8所述的OLED显示面板，其中，所述电子元件设置区内的背板的厚度为零。
  10. 如权利要求8所述的OLED显示面板，其中，所述电子元件设置区内的粘合层的厚度为零。
  11. 一种OLED显示装置，其包括：
    OLED显示面板，所述OLED显示面板包括背板、衬底、驱动电路层、发光功能层和封装层，所述衬底设置于所述背板上，所述驱动电路层设置于所述衬底上，所述发光功能层设置于所述驱动电路层上，所述封装层设置于所述发光功能层上，其中，在对应电子元件设置位置的电子元件设置区内的所述背板与所述衬底的厚度之和，小于在其他区域的所述背板和所述衬底的厚度之和；
    电子元件，所述电子元件设置于所述电子元件设置区。
  12. 如权利要求11所述的OLED显示装置，其中，所述电子元件包括摄像头。
  13. 如权利要求11所述的OLED显示装置，其中，所述驱动电路层包括有源层，所述电子元件设置区的有源层内的磷元素的质量分数，大于其他区域的有源层内磷元素的质量分数。
  14. 如权利要求13所述的OLED显示装置，其中，所述OLED显示面板包括像素单元，所述电子元件设置区内的像素单元的密度，小于其他区域内的像素单元的密度。
  15. 如权利要求11所述的OLED显示装置，其中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，与其他区域的衬底的厚度相等。
  16. 如权利要求11所述的OLED显示装置，其中，所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度，且所述电子元件设置区内的背板的厚度，与其他区域的背板的厚度相等。
  17. 如权利要求11所述的OLED显示装置，其中，所述电子元件设置区内的背板的厚度，小于其他区域的背板的厚度，且所述电子元件设置区内的衬底的厚度，小于其他区域的衬底的厚度。
  18. 如权利要求17所述的OLED显示装置，其中，所述衬底包括第一柔性层、阻挡层和第二柔性层，所述电子元件设置区的第一柔性层的厚度，小于其他区域的第一柔性层的厚度。
  19. 如权利要求18所述的OLED显示装置，其中，所述第一柔性层与所述背板之间设有粘合层，所述电子元件设置区的粘合层的厚度，小于其他区域的粘合层的厚度。
  20. 一种OLED显示面板制备方法，其包括：
    提供背板；
    在所述背板上形成衬底，所述衬底包括第一柔性层、第二柔性层，以及设置于所述第一柔性层和第二柔性层之间的阻挡层；
    在所述衬底上形成驱动电路层，并在对应电子元件设置位置的电子元件设置区内，向所述驱动电路层中的有源层的沟道区内掺杂磷元素；
    在所述驱动电路层上形成发光功能层；
    在所述发光功能层上形成封装层；
    去除所述电子元件设置区内的背板和第一柔性层的部分，得到显示面板；所述电子元件设置区内的背板与衬底的厚度之和，小于在其他区域的背板与衬底的厚度之和。
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