WO2021184370A1 - 金属线栅偏振器及其制备方法、显示装置 - Google Patents
金属线栅偏振器及其制备方法、显示装置 Download PDFInfo
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- WO2021184370A1 WO2021184370A1 PCT/CN2020/080475 CN2020080475W WO2021184370A1 WO 2021184370 A1 WO2021184370 A1 WO 2021184370A1 CN 2020080475 W CN2020080475 W CN 2020080475W WO 2021184370 A1 WO2021184370 A1 WO 2021184370A1
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- Prior art keywords
- metal wire
- base substrate
- wire grid
- layer
- binding
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 303
- 239000002184 metal Substances 0.000 title claims abstract description 303
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 189
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 151
- 239000011347 resin Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011241 protective layer Substances 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000004973 liquid crystal related substance Substances 0.000 claims description 15
- 238000000059 patterning Methods 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 239000003292 glue Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 229910052681 coesite Inorganic materials 0.000 description 9
- 229910052906 cristobalite Inorganic materials 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 229910052682 stishovite Inorganic materials 0.000 description 9
- 229910052905 tridymite Inorganic materials 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 5
- 238000004049 embossing Methods 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133528—Polarisers
- G02F1/133548—Wire-grid polarisers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1347—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1347—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
- G02F1/13471—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells in which all the liquid crystal cells or layers remain transparent, e.g. FLC, ECB, DAP, HAN, TN, STN, SBE-LC cells
Definitions
- the embodiments of the present disclosure relate to the field of display technology, and in particular, to a metal wire grid polarizer and a manufacturing method of the metal wire grid polarizer, and a display device including the metal wire grid polarizer.
- the large-screen devices that we can come into contact with in our daily life are nothing more than TV products, and with the change of consumers' consumption concepts, TVs have begun to develop in the direction of smart and large screens.
- 55-inch TVs may be standard, but more and more manufacturers have begun to introduce 65-inch or even 75-inch, 80-inch large-screen TVs, which can foresee the increasing trend of TV screen area.
- the production capacity of large-size LCD screens continues to rise, and market competition is becoming more intense.
- the embodiments of the present disclosure provide a metal wire grid polarizer, a method for manufacturing the metal wire grid polarizer, and a display device including the metal wire grid polarizer, which can achieve binding accuracy.
- a metal wire grid polarizer which includes:
- the base substrate has multiple binding areas and multiple binding alignment areas
- a plurality of metal wire grids are arranged on the base substrate, and the plurality of metal wire grids are arranged parallel to each other, and the orthographic projection of the plurality of metal wire grids on the base substrate and the plurality of binding There is no overlap between the fixed area and the plurality of binding alignment areas.
- the metal wire grid whose orthographic projection extends to the binding area and the binding alignment area includes at least two sub-metal wire grids arranged at intervals, and the metal wire grids are polarized
- the device also includes:
- a plurality of transparent wire grids are arranged on the same surface of the base substrate as a plurality of the metal wire grids, and the plurality of transparent wire grids are arranged in parallel with the metal wire grids. Two ends of at least one of the sub-metal wire grids are respectively connected to the two sub-metal wire grids located on the same straight line.
- the metal wire grid polarizer further includes:
- a plurality of first shielding portions are located on the light emitting side of the metal wire grid, and the edge of the binding area is located in the orthographic projection of the first shielding portion on the base substrate;
- a plurality of second shielding portions are located on the light emitting side of the metal wire grid, and the edge of the binding and alignment area is located in the orthographic projection of the second shielding portion on the base substrate.
- the metal wire grid is an aluminum wire grid
- the transparent wire grid is a transparent resin wire grid
- a method for manufacturing a metal wire grid polarizer which includes:
- the base substrate having a plurality of bonding regions and a plurality of bonding alignment regions
- a plurality of metal wire grids are formed on the base substrate, and the plurality of metal wire grids are arranged in parallel to each other, and the orthographic projection of the plurality of metal wire grids on the base substrate and the plurality of binding There is no overlap between the fixed area and the plurality of binding alignment areas.
- forming a plurality of metal wire grids on the base substrate includes:
- the metal layer is patterned to remove part of the metal layer, so that the orthographic projection of the remaining metal layer on the base substrate does not intersect the binding area and the binding alignment area Stack
- the metal layer is patterned again to form a plurality of metal wire grids.
- the preparation method further includes:
- the transparent resin layer is patterned to form a plurality of transparent wire grids.
- forming a plurality of metal wire grids on the base substrate includes:
- the metal layer and the protective layer are patterned to remove part of the metal layer and part of the protective layer, so that the remaining metal layer and the remaining protective layer are on the base substrate.
- the orthographic projection does not overlap with the binding zone and the binding alignment zone;
- the metal layer and the protective layer are patterned again to form a plurality of metal wire grids.
- the preparation method further includes:
- a transparent resin layer is formed in the via hole formed by removing the metal layer and the protective layer of the base substrate, and the thickness of the transparent resin layer is the sum of the thickness of the metal layer and the thickness of the protective layer same;
- the transparent resin layer is patterned to form a plurality of transparent wire grids.
- forming a plurality of metal wire grids on the base substrate includes:
- a patterning process is performed on a plurality of the metal wire grids to remove part of the metal wire grid, so that the orthographic projection of the remaining metal wire grid on the base substrate and the binding area and the There is no overlap in the binding counterpoint area.
- the preparation method further includes:
- a first shielding portion and a second shielding portion are formed on the light-emitting side of the metal wire grid, and the edge of the binding area is located in the orthographic projection of the first shielding portion on the base substrate, and the binding The edge of the alignment area is located in the orthographic projection of the second shielding portion on the base substrate.
- a display device which includes:
- a display panel including the aforementioned metal wire grid polarizer
- the light control panel includes the above-mentioned metal wire grid polarizer
- the display panel is located on the light emitting side of the light control panel.
- the display panel further includes:
- the first array substrate is arranged on the side of the base substrate away from the metal wire grid or the side of the metal wire grid away from the base substrate;
- the first liquid crystal layer is provided on a side of the first array substrate away from the base substrate;
- the color filter substrate is arranged on the side of the first liquid crystal layer away from the array substrate.
- the light control panel further includes:
- the second array substrate is arranged on the side of the base substrate away from the metal wire grid or the side of the metal wire grid away from the base substrate;
- the second liquid crystal layer is arranged on the side of the second array substrate away from the base substrate.
- the multiple binding areas and multiple binding alignment areas of the display panel and the multiple binding areas and multiple binding alignment areas of the light control panel are located at the same location.
- FIG. 1 is a schematic structural diagram of an exemplary embodiment of a metal wire grid polarizer of the present invention
- Fig. 2 is a partial enlarged schematic diagram of the part indicated by H in Fig. 1;
- Fig. 3 is a schematic cross-sectional view taken along the line I-I in Fig. 1;
- FIG. 4 is a schematic block diagram of the flow of an exemplary embodiment of a method for manufacturing a metal wire grid polarizer according to the present invention
- FIG. 6 is a schematic diagram of the microstructure of the metal wire grid formed when the transparent resin layer is not filled;
- Fig. 7 is a schematic cross-sectional view of Fig. 6;
- FIG. 8 is a schematic diagram of the microstructure of a metal wire grid formed after filling a transparent resin layer
- Fig. 9 is a schematic cross-sectional view of Fig. 8.
- FIG. 10 is a schematic structural diagram of an exemplary embodiment of a display device of the present invention.
- Metal wire grid polarizer 11. Base substrate; 12, metal wire grid; 13, transparent wire grid; 14, binding area; 15, binding alignment area; 16, metal layer; 17, transparent resin layer 18, the first shielding part; 19, the second shielding part;
- Display panel 21, first array substrate; 22, first liquid crystal layer; 23, color film substrate;
- the present invention first provides a metal wire grid polarizer.
- the metal wire grid polarizer 1 may include a liner.
- the base substrate 11 has a plurality of bonding regions 14 and a plurality of bonding alignment regions 15;
- a plurality of metal wire grids 12 are provided on the substrate
- a plurality of the metal wire grids 12 are arranged in parallel to each other, and the orthographic projection of the plurality of metal wire grids 12 on the base substrate 11 and the plurality of binding regions 14 and the plurality of None of the binding alignment regions 15 overlap.
- the orthographic projection of the plurality of metal wire grids 12 on the base substrate 11 may be that the plurality of metal wire grids 12 are on the plurality of bonding regions 14 and the plurality of bonding pairs of the base substrate 11.
- the orthographic projection of the plurality of metal wire grids 12 on the base substrate 11 does not overlap with the plurality of bonding regions 14 and the plurality of bonding alignment regions 15. In this way, the metal wire grid 12 is prevented from blocking light during the binding process, so that the alignment process can proceed smoothly, and the accuracy of the binding can be achieved.
- the base substrate 11 may be a glass substrate.
- the base substrate 11 has a display area and a non-display area.
- Two binding areas 14 and two binding alignment areas 15 are provided in the non-display area.
- the two binding areas 14 are located between the two binding alignment areas 15
- the area of the two binding regions 14 is larger than the area of the two binding alignment regions 15.
- the binding area 14 is used for binding with a circuit board or a flexible circuit board
- the binding alignment area 15 is used for setting an alignment mark.
- the base substrate 11 may be a flexible substrate.
- the number and size of the binding area 14 and the binding alignment area 15 can be set as required.
- a plurality of metal wire grids 12 are provided on the side of the base substrate 11 opposite to the plurality of bonding regions 14 and the plurality of bonding alignment regions 15, and the width of the metal wire grids 12 is nanometer level.
- the length of the metal wire grid 12 is of the macroscopic order and can be polarized.
- the metal wire grid 12 may be an aluminum wire grid. That is to say, the plurality of metal wire grids 12 and the plurality of bonding regions 14 and the plurality of bonding alignment regions 15 are arranged on opposite sides of the base substrate 11.
- the orthographic projection of the metal wire grid 12 on the base substrate 11 does not overlap with the multiple bonding areas 14 and the multiple bonding alignment areas 15, that is, in the multiple bonding areas 14 and the multiple bonding alignment areas 15
- a plurality of transparent wire grids 13 are also provided on the same surface of the base substrate 11 where the plurality of metal wire grids 11 are provided, and the plurality of transparent wire grids 13 are arranged parallel to the metal wire grid 11, and the transparent wire
- the two ends of the grid 13 are connected between the two sub-metal wire grids located on the same straight line, that is, the transparent wire grid 13 reconnects the above-mentioned truncated sub-metal wire grids located on the same straight line to form a wire grid.
- the transparent wire grid 13 may be a transparent resin wire grid.
- the metal wire grid 12 and the bonding area 14 and the bonding alignment area 15 may be arranged on the same surface.
- the metal wire grid 12 is not provided in the multiple binding areas 14 and the multiple binding alignment areas 15, and multiple transparent wires may also be provided in the multiple binding areas 14 and the multiple binding alignment areas 15.
- the wire grid 13 is connected to two sub-metal wire grids located on the same straight line at both ends of the transparent wire grid 13.
- the metal wire grid polarizer may further include a plurality of first shielding portions 18 and a plurality of second shielding portions 19, and the number of the first shielding portions 18 is equal to the number of the binding regions 14.
- the number of second shielding portions 19 is equal to the number of binding alignment areas 15, so that the edge of each binding area 14 is shielded by a first shielding portion 18, and the edge of each binding alignment area 15 is also Both are blocked by a second blocking portion 19.
- the first shielding portion 18 and the second shielding portion 19 may be provided on the side of the base substrate 11 away from the metal wire grid 12, that is, the first shielding portion 18, the second shielding portion 19 and the metal wire grid 12 are provided on the base substrate 11 Opposite sides.
- Both the first shielding portion 18 and the second shielding portion 19 are arranged in a ring shape.
- the edge of the binding area 14 is located in the orthographic projection of the first shielding portion 18 on the base substrate 11, and the edge of the binding alignment area 15 is located in the orthographic projection of the second shielding portion 19 on the base substrate 11; and
- the edge of the fixed area 14 may be located at the middle position of the width direction of the orthographic projection of the first shielding portion 18 on the base substrate 11, and the edge of the binding alignment area 15 may be located at the position of the second shielding portion 19 on the base substrate 11.
- the width of the first shielding portion 18 and the second shielding portion 19 is approximately 5 microns.
- the first shielding portion 18 and the second shielding portion 19 remove the abnormal shielding caused by the edge metal wire grid 12 of the binding area 14 and the binding alignment area 15, so as to avoid the uneven light caused by the abnormality of the metal wire grid 12.
- the first shielding portion 18 and the second shielding portion 19 may also be arranged at The side of the metal wire grid 12 facing away from the base substrate 11.
- the first shielding portion 18 and the second shielding portion 19 may be arranged on the metal wire grid 12 and the substrate. Between the substrate 11.
- the abnormal shielding caused by the edge metal wire grid 11 of the binding area 14 and the binding alignment area 15 can be removed. Avoid uneven light caused by abnormal metal wire grid 12.
- the present invention also provides a method for manufacturing a metal wire grid polarizer.
- a method for manufacturing a metal wire grid polarizer Refer to the schematic block diagram of the process of an exemplary embodiment of the method for manufacturing a metal wire grid polarizer of the present invention shown in FIG. 4.
- the manufacturing method of the metal wire grid polarizer may include the following steps:
- step S10 a base substrate 11 is provided, and the base substrate 11 has a plurality of bonding regions 14 and a plurality of bonding alignment regions 15.
- Step S20 forming a plurality of metal wire grids 12 on the base substrate 11, the plurality of metal wire grids 12 are arranged in parallel with each other, and the plurality of metal wire grids 12 are arranged on the base substrate 11
- the orthographic projection has no overlap with the plurality of binding areas 14 and the plurality of binding alignment areas 15.
- step S10 a base substrate 11 is provided, and the base substrate 11 has a plurality of bonding regions 14 and a plurality of bonding alignment regions 15.
- a base substrate 11 is provided.
- the base substrate 11 is provided with a display area and a non-display area located at the periphery of the display area, and two bonding areas 14 and two bonding pairs are provided in the non-display area.
- Step S20 forming a plurality of metal wire grids 12 on the base substrate 11, the plurality of metal wire grids 12 are arranged in parallel with each other, and the plurality of metal wire grids 12 are arranged on the base substrate 11
- the orthographic projection has no overlap with the plurality of binding regions 14 and the plurality of binding alignment regions 15.
- the metal layer 16 is formed by deposition, sputtering or evaporation on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are provided, and the metal layer 16 is an aluminum layer.
- the thickness of the metal layer 16 is approximately 200 nm.
- photolithography is performed on the metal layer 16 to remove part of the metal layer 16 so that the orthographic projection of the remaining metal layer on the base substrate 11 does not overlap with the binding area 14 and the binding alignment area 15. In this way, the shielding of light by the metal wire grid 12 in the subsequent bonding process is avoided, so that the alignment process is smoothly performed, and the accuracy of the bonding is realized.
- the metal layer 16 may be formed on the side of the base substrate 11 where the bonding area 14 and the bonding alignment area 15 are provided, and then the metal layer 16 may be lithographically removed to remove part of it.
- the metal layer 16 ensures that the orthographic projection of the remaining metal layer on the base substrate 11 does not overlap with the binding area 14 and the binding alignment area 15. In this way, the shielding of light by the metal wire grid 12 in the subsequent bonding process is avoided, so that the alignment process is smoothly performed, and the accuracy of the bonding is realized.
- a transparent resin layer 17 is formed on the side of the base substrate 11 where the metal layer is formed, and the transparent resin layer 17 is only filled in the via hole formed after part of the metal layer 16 is removed.
- the thickness of the transparent resin layer 17 is the same as the thickness of the metal layer 16, and is approximately 200 nm.
- the transparent resin layer 17 has certain rigidity and can withstand the subsequent temperature of about 150°C.
- the metal wire grid 12 After the metal layer is removed, there is a step difference between the metal layer 16 on the base substrate 11 and the base substrate 11. Due to the finer process conditions of nanoimprinting itself, a slight step difference can cause line defects in a larger area around the edge. Eventually, the metal wire grid 12 will fall and be missing. Referring to the schematic diagrams of the microstructure of the metal wire grid formed when the transparent resin layer is not filled as shown in FIG. 6 and FIG. The filling of the transparent resin layer 17 does not affect the transmittance of light, and provides a better substrate for nanoimprinting to avoid the subsequent fall and loss of the metal wire grid 12. Referring to the schematic diagrams of the microstructures of the metal wire grid formed after filling the transparent resin layer shown in FIGS. 8 and 9, it can be seen from the figure that the metal wire grid 12 is neither flat nor missing.
- a Hard Mask (hard mask) is deposited on the metal layer 16 and the transparent resin layer 17.
- the hard mask is an inorganic thin film material generated by CVD (Chemical Vapor Deposition). Its main components usually include TiN, SiN, SiO2 and so on.
- Embossing on the Hard Mask to form a laminated printing glue using a soft template to imprint and curing the printing glue, so that a number of parallel strip grooves are formed on the printing glue; for Hard Mask that is not covered by the printing glue
- the Mask performs dry etching to remove the Hard Mask layer that is not covered by the embossing glue to form a Hard Mask mask; the metal layer 16 and the transparent resin layer 17 that are not covered by the Hard Mask mask are etched to make the metal layer 16 forms a plurality of metal wire grids 12, and the transparent resin layer 17 forms a transparent wire grid 13.
- the metal wire grid 12 can also be formed by the following method.
- the metal layer 16 is formed on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are provided by deposition, sputtering or evaporation.
- the metal layer 16 is an aluminum layer, and the thickness of the metal layer 16 is approximately 200nm.
- a protective layer is formed on the side of the metal layer 16 away from the base substrate 11, and the thickness of the protective layer is about 100 nm.
- the protective layer may be a silicon oxide layer, a silicon nitride layer, or the like.
- the metal layer 16 may be formed on the side of the base substrate 11 where the bonding area 14 and the bonding alignment area 15 are provided, and on the side of the metal layer 16 that faces away from the base substrate 11.
- Form a protective layer and perform photolithography on the metal layer 16 and the protective layer to remove part of the metal layer 16 and part of the protective layer, so that the remaining metal layer 16 and the remaining protective layer are in the orthographic projection and binding area on the base substrate 11 There is no overlap between 14 and the binding alignment zone 15. In this way, the shielding of light by the metal wire grid 12 in the subsequent bonding process is avoided, so that the alignment process is smoothly performed, and the accuracy of the bonding is realized.
- a transparent resin layer 17 is formed on the side of the base substrate 11 where the metal layer is formed, and the transparent resin layer 17 is only filled in the via hole formed after removing part of the metal layer 16 and part of the protective layer.
- the thickness of the transparent resin layer 17 is the same as the sum of the thickness of the metal layer 16 and the thickness of the protective layer, and is approximately 300 nm.
- the transparent resin layer 17 has certain rigidity and can withstand the subsequent temperature of about 150°C.
- the protective layer and the transparent resin layer 17 are embossed to form a laminated printing glue, and a soft template is used to imprint and solidify the printing glue, so that a plurality of parallel-arranged patterns are formed on the printing glue.
- the metal wire grid 12 can also be formed by the following method.
- a metal layer 16 is formed on the opposite side of the base substrate 11 where the binding area 14 and the binding alignment area 15 are provided by deposition, sputtering or evaporation.
- the metal layer 16 is an aluminum layer, and the thickness of the metal layer 16 is approximately 200nm.
- a SiO2 layer is formed on the metal layer 16; the thickness of the SiO2 layer is about 100 nm.
- a laminated printing glue is formed on the SiO2 layer; the soft template is used to imprint and solidify the printing glue, so that a plurality of parallel strip grooves are formed on the printing glue; the SiO2 layer that is not covered by the printing glue is processed Dry etching to remove the SiO2 layer not covered by the embossing paste to form a SiO2 mask; etching the metal layer 16 not covered by the SiO2 mask to form multiple metal wire grids 12, and then remove the SiO2 mask membrane.
- the multiple metal wire grids 12 are patterned to remove a part of the metal wire grid 12, so that the orthographic projection of the remaining metal wire grid 12 on the base substrate 11 and the binding area 14 and the binding alignment area 15 There is no overlap.
- the patterning process can be dry etching or photolithography. In this way, the shielding of light by the metal wire grid 12 in the subsequent bonding process is avoided, so that the alignment process is smoothly performed, and the accuracy of the bonding is realized.
- the metal wire grid 12 may be formed on the side of the base substrate 11 where the bonding region 14 and the bonding alignment region 15 are provided, and then the metal wire grid 12 is lithographically Some sections of the metal wire grid 12 are removed, so that the orthographic projection of the remaining metal wire grid 12 on the base substrate 11 does not overlap with the binding area 14 and the binding alignment area 15. In this way, the shielding of light by the metal wire grid 12 in the subsequent bonding process is avoided, so that the alignment process is smoothly performed, and the accuracy of the bonding is realized.
- the light is set to be incident from the opposite side of the base substrate 11 where the bonding area 14 and the bonding alignment area 15 are provided.
- the above-mentioned preparation method of the metal wire grid polarizer may further include: A shielding material layer is formed on one side of the metal wire grid 12, and then the shielding material layer is patterned to form a first shielding portion 18 and a second shielding portion 19. Both the first shielding portion 18 and the second shielding portion 19 are arranged in a ring shape. The first shielding portion 18 and the second shielding portion 19 are both located on the light-emitting side of the metal wire grid 12. The light enters the metal wire grid 12, after being polarized by the metal wire grid 12, it strikes the base substrate 11 and passes through the base substrate. 11 shoots to the first shielding portion 18 and the second shielding portion 19.
- the edge of the binding area 14 is located in the orthographic projection of the first shielding portion 18 on the base substrate 11, and the edge of the binding alignment area 15 is located in the orthographic projection of the second shielding portion 19 on the base substrate 11, and the binding
- the edge of the fixed area 14 may be located at the middle position of the width direction of the orthographic projection of the first shielding portion 18 on the base substrate 11, and the edge of the binding alignment area 15 may be located at the position of the second shielding portion 19 on the base substrate 11.
- the middle position in the width direction of the orthographic projection The width of the first shielding portion 18 and the second shielding portion 19 is approximately 5 microns.
- the first shielding portion 18 and the second shielding portion 19 respectively remove the abnormal shielding caused by the edge metal wire grids of the binding region 14 and the binding alignment region 15 to avoid uneven light caused by abnormal metal wire grids.
- the first shielding portion 18 and the second shielding portion 19 and the metal wire grid 12 are arranged on opposite sides of the base substrate 11. Therefore, the first shielding portion 18 and the second shielding portion 19 can also be formed first and then Then the metal wire grid 12 is formed.
- the first shielding portion 18 and the second shielding portion 19 may be formed on the metal wire.
- the metal wire grid 12 needs to be formed first and then the first shielding portion 18 and the second shielding portion 19 are formed.
- the first shielding portion 18 and the second shielding portion 19 may be formed on the metal wire grid 12 and the substrate.
- the first shielding portion 18 and the second shielding portion 19 need to be formed first, and then the metal wire grid 12 is formed. In this way, it can be ensured that the first shielding portion 18 and the second shielding portion 19 are located on the light emitting side of the metal wire grid 12.
- the present invention also provides a display device.
- the display device may include a display panel 2 and a light control panel 3.
- the light-emitting side of the control panel 3 is specifically: the display panel 2 is located on the side of the second liquid crystal layer 32 facing away from the second array substrate 31, and the first liquid crystal layer 22 of the display panel 2 is farther from the light control panel than the first array substrate 21.
- the display panel 2 includes the metal wire grid polarizer 1 described above.
- the structure of the metal wire grid polarizer 1 has been described in detail above, so it will not be repeated here.
- the display panel 2 may further include a first array substrate 21, a first liquid crystal layer 22, and a color filter substrate 23; the first array substrate 21 may be provided on the base substrate 11 away from the metal wire grid 12 The first array substrate 21 and the metal wire grid 12 are provided on opposite sides of the base substrate 11; the first liquid crystal layer 22 is provided on the side of the first array substrate 21 facing away from the base substrate 11; The substrate 23 is disposed on the side of the first liquid crystal layer 22 facing away from the array substrate.
- the first array substrate 21 may be provided on the side of the metal wire grid 12 facing away from the base substrate 11, that is, the metal wire grid 12 is provided on the base substrate 11 and the first array substrate 21. between.
- An insulating layer may also be provided between the metal wire grid 12 and the first array substrate 21.
- the light control panel 3 includes the metal wire grid polarizer 1 described above.
- the structure of the metal wire grid polarizer 1 has been described in detail above, so it will not be repeated here.
- the light control panel 3 may further include a second array substrate 31 and a second liquid crystal layer 32; the second array substrate 31 may be provided on a side of the base substrate 11 away from the metal wire grid 12, That is, the second array substrate 31 and the metal wire grid 12 are provided on opposite sides of the base substrate 11; the second liquid crystal layer 32 is provided on the side of the second array substrate 31 away from the base substrate 11.
- the second array substrate 31 may be provided on the side of the metal wire grid 12 facing away from the base substrate 11, that is, the metal wire grid 12 is provided on the base substrate 11 and the second array substrate 31. between.
- An insulating layer may also be provided between the metal wire grid 12 and the second array substrate 31.
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
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- Crystallography & Structural Chemistry (AREA)
- Polarising Elements (AREA)
Abstract
Description
Claims (15)
- 一种金属线栅偏振器,其中,包括:衬底基板,具有多个绑定区和多个绑定对位区;多根金属线栅,设于所述衬底基板上,多根所述金属线栅相互平行布置,且多根所述金属线栅在所述衬底基板上的正投影与多个所述绑定区和多个所述绑定对位区均无交叠。
- 根据权利要求1所述的金属线栅偏振器,其中,正投影延伸至所述绑定区和所述绑定对位区的所述金属线栅包括间隔设置的至少两条子金属线栅,所述金属线栅偏振器还包括:多根透明线栅,与多根所述金属线栅设于所述衬底基板的同一面,且多根所述透明线栅与所述金属线栅平行设置,所述多根透明线栅中的至少一根的两端分别连接位于同一直线上的两根所述子金属线栅。
- 根据权利要求1或2所述的金属线栅偏振器,其中,所述金属线栅偏振器还包括:多个第一遮挡部,位于所述金属线栅的出光侧,且所述绑定区的边缘位于所述第一遮挡部在所述衬底基板上的正投影内;多个第二遮挡部,位于所述金属线栅的出光侧,所述绑定对位区的边缘位于所述第二遮挡部在所述衬底基板上的正投影内。
- 根据权利要求2所述的金属线栅偏振器,其中,所述金属线栅为铝线栅,所述透明线栅为透明树脂线栅。
- 一种金属线栅偏振器的制备方法,其中,包括:提供一衬底基板,所述衬底基板具有多个绑定区和多个绑定对位区;在所述衬底基板之上形成多根金属线栅,多根所述金属线栅相互平行布置,且多根所述金属线栅在所述衬底基板上的正投影与多个所述绑定区和多个所述绑定对位区均无交叠。
- 根据权利要求5所述的金属线栅偏振器的制备方法,其中,在所述衬底基板之上形成多根金属线栅,包括:在所述衬底基板之上形成金属层;对所述金属层进行图案化处理以去除部分所述金属层,使剩余的所述金属层在所述衬底基板上的正投影与所述绑定区和所述绑定对位区无交叠;再次对所述金属层进行图案化处理以形成多根所述金属线栅。
- 根据权利要求6所述的金属线栅偏振器的制备方法,其中,去除部分所述金属层后,所述制备方法还包括:在所述衬底基板的去除所述金属层形成的过孔内形成透明树脂层,所述透明树脂层的厚度与所述金属层的厚度相同;在再次对所述金属层进行图案化处理以形成多根金属线栅的同时,对所述透明树脂层进行图案化处理以形成多根透明线栅。
- 根据权利要求5所述的金属线栅偏振器的制备方法,其中,在所述衬底基板之上形成多根金属线栅,包括:在所述衬底基板之上形成金属层;在所述金属层的背离所述衬底基板的一面形成保护层;对所述金属层和所述保护层进行图案化处理以去除部分所述金属层和部分所述保护层,使剩余的所述金属层和剩余的所述保护层在所述衬底基板上的正投影与所述绑定区和所述绑定对位区无交叠;再次对所述金属层和所述保护层进行图案化处理以形成多根所述金属线栅。
- 根据权利要求8所述的金属线栅偏振器的制备方法,其中,去除部分所述金属层和部分所述保护层后,所述制备方法还包括:在所述衬底基板的去除所述金属层和所述保护层形成的过孔内形成透明树脂层,所述透明树脂层的厚度与所述金属层的厚度和所述保护层的厚度之和相同;在再次对所述金属层和所述保护层进行图案化处理以形成多根金属线栅的同时,对所述透明树脂层进行图案化处理以形成多根透明线栅。
- 根据权利要求5所述的金属线栅偏振器的制备方法,其中,在所述衬底基板之上形成多根金属线栅,包括:在所述衬底基板之上形成金属层;对所述金属层进行图案化处理以形成多根金属线栅;对多根所述金属线栅进行图案化处理以去除部分所述金属线栅的部分段,使剩余所述金属线栅在所述衬底基板上的正投影与所述绑定区和所述绑定对位区无交叠。
- 根据权利要求5~9任意一项所述的金属线栅偏振器的制备方法,其中,所述制备方法还包括:在所述金属线栅的出光侧形成第一遮挡部和第二遮挡部,所述绑定区的边缘位于所述第一遮挡部在所述衬底基板上的正投影内,所述绑定对位区的边缘位于所述第二遮挡部在所述衬底基板上的正投影内。
- 一种显示装置,其中,包括:显示面板,包括权利要求1~4任意一项所述的金属线栅偏振器;光控面板,包括权利要求1~4任意一项所述的金属线栅偏振器;所述显示面板位于所述光控面板的出光侧。
- 根据权利要求12所述的显示装置,其中,所述显示面板还包括:第一阵列基板,设于所述衬底基板的背离所述金属线栅的一侧或所述金属线栅的背离所述衬底基板的一侧;第一液晶层,设于所述第一阵列基板的背离所述衬底基板的一侧;彩膜基板,设于所述第一液晶层的背离所述阵列基板的一侧。
- 根据权利要求12所述的显示装置,其中,所述光控面板还包括:第二阵列基板,设于衬底基板的背离所述金属线栅的一侧或所述金属线栅的背离所述衬底基板的一侧;第二液晶层,设于第二阵列基板的背离所述衬底基板的一侧。
- 根据权利要求12所述的显示装置,其中,所述显示面板的多个绑定区和多个绑定对位区与所述光控面板的多个绑定区和多个绑定对位区位于所述显示装置的相对两侧。
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PCT/CN2020/080475 WO2021184370A1 (zh) | 2020-03-20 | 2020-03-20 | 金属线栅偏振器及其制备方法、显示装置 |
CN202080000331.9A CN115668042A (zh) | 2020-03-20 | 2020-03-20 | 金属线栅偏振器及其制备方法、显示装置 |
US17/260,911 US11675227B2 (en) | 2020-03-20 | 2020-03-20 | Metal wire grid polarizer and manufacturing method thereof, display device |
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US20090109369A1 (en) * | 2007-10-26 | 2009-04-30 | Mitsubishi Electric Corporation | Liquid crystal display device |
CN104102383A (zh) * | 2014-07-15 | 2014-10-15 | 京东方科技集团股份有限公司 | 彩膜基板、液晶模组及触控显示装置 |
CN105242342A (zh) * | 2015-11-09 | 2016-01-13 | 武汉华星光电技术有限公司 | 偏光板和透明显示器 |
CN105892177A (zh) * | 2016-06-17 | 2016-08-24 | 京东方科技集团股份有限公司 | 一种显示面板及显示装置 |
CN110646969A (zh) * | 2019-09-25 | 2020-01-03 | 京东方科技集团股份有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
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KR20180032726A (ko) * | 2016-09-22 | 2018-04-02 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
JP7467220B2 (ja) * | 2020-04-28 | 2024-04-15 | 株式会社ジャパンディスプレイ | 表示システム及び車両 |
-
2020
- 2020-03-20 US US17/260,911 patent/US11675227B2/en active Active
- 2020-03-20 CN CN202080000331.9A patent/CN115668042A/zh active Pending
- 2020-03-20 WO PCT/CN2020/080475 patent/WO2021184370A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20090109369A1 (en) * | 2007-10-26 | 2009-04-30 | Mitsubishi Electric Corporation | Liquid crystal display device |
CN104102383A (zh) * | 2014-07-15 | 2014-10-15 | 京东方科技集团股份有限公司 | 彩膜基板、液晶模组及触控显示装置 |
CN105242342A (zh) * | 2015-11-09 | 2016-01-13 | 武汉华星光电技术有限公司 | 偏光板和透明显示器 |
CN105892177A (zh) * | 2016-06-17 | 2016-08-24 | 京东方科技集团股份有限公司 | 一种显示面板及显示装置 |
CN110646969A (zh) * | 2019-09-25 | 2020-01-03 | 京东方科技集团股份有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
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US11675227B2 (en) | 2023-06-13 |
US20220137456A1 (en) | 2022-05-05 |
CN115668042A (zh) | 2023-01-31 |
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