WO2021176739A1 - ボンディング装置、フレームフィーダ及びヒータユニット - Google Patents

ボンディング装置、フレームフィーダ及びヒータユニット Download PDF

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Publication number
WO2021176739A1
WO2021176739A1 PCT/JP2020/009886 JP2020009886W WO2021176739A1 WO 2021176739 A1 WO2021176739 A1 WO 2021176739A1 JP 2020009886 W JP2020009886 W JP 2020009886W WO 2021176739 A1 WO2021176739 A1 WO 2021176739A1
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WO
WIPO (PCT)
Prior art keywords
lead frame
bonding
unit
heater
heater block
Prior art date
Application number
PCT/JP2020/009886
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English (en)
French (fr)
Japanese (ja)
Inventor
一昭 長野
和仁 小島
峻匡 宮近
Original Assignee
株式会社新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社新川 filed Critical 株式会社新川
Priority to SG11202111143PA priority Critical patent/SG11202111143PA/en
Priority to CN202080028931.6A priority patent/CN113785385A/zh
Priority to JP2021549567A priority patent/JP7216451B2/ja
Priority to PCT/JP2020/009886 priority patent/WO2021176739A1/ja
Priority to KR1020217037044A priority patent/KR20210146410A/ko
Publication of WO2021176739A1 publication Critical patent/WO2021176739A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
    • H01L2224/78281—Resistance welding electrodes, i.e. for ohmic heating in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/785—Cooling means
    • H01L2224/78501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected

Definitions

  • the present invention relates to a bonding device, a frame feeder, and a heater unit.
  • So-called die bond is the work of joining a semiconductor die to a lead frame.
  • so-called wire bonding is a work of joining a bonding wire to a semiconductor die.
  • the lead frame is heated to a predetermined temperature higher than room temperature.
  • the lead frame stays in the area where the joining work is performed for the total time of the time for heating and the time for joining.
  • the semiconductor assembly apparatus of Patent Document 1 includes a region for preheating the lead frame and a region for wire bonding. According to this device, the time for preheating and the time for wire bonding can be overlapped. As a result, it becomes possible to improve the work efficiency of the joining work.
  • an object of the present invention is to provide a bonding device, a frame feeder, and a heater unit capable of improving productivity.
  • a bonding unit that performs bonding work on a lead frame conveyed to a work area, a lead frame that is conveyed to the work area by the transfer unit, and a heater unit that conveys the lead frame to the work area. It is provided with a frame feeder that preheats the lead frame before it is used.
  • the heater unit is arranged so as to face the back surface of the lead frame on the upstream side of the work area in the transport direction of the heating element and the heating element, and provides the heat received from the heating element to the lead frame.
  • the heater block is provided with a heat radiating portion having a plurality of fins formed in the depth direction from the surface of the heater block.
  • the bonding device performs bonding work by the bonding portion in the work area.
  • a heater unit that heats the lead frame before being transported to the work area is arranged. Therefore, it is possible to make the region where the preheating is performed before the bonding work and the region where the bonding work is performed different from each other.
  • the heater block included in the heater unit has a plurality of fins extending in the depth direction. According to the plurality of fins, heat is efficiently transferred from the heater block to the lead frame. Therefore, the time required for preheating can be shortened. As a result, productivity can be improved.
  • the plurality of fins may be separated from each other along a direction intersecting the transport direction of the lead frame. According to this configuration, the back surface of the lead frame can be protected.
  • the heater block may be provided with a hole between the fins and a hole penetrating in the depth direction.
  • the heat transfer from the heater block to the lead frame is due to the convection of air from the heater block to the lead frame.
  • air for transferring heat is suitably supplied to the fins. Therefore, heat is transferred from the heater block to the lead frame more efficiently. As a result, productivity can be further improved.
  • the length of the fin in the depth direction may be longer than the distance from the tip of the fin in the depth direction to the lead frame. According to this configuration, the air heated by the fins can be suitably supplied to the back surface of the lead frame.
  • the above-mentioned bonding apparatus may further include a control unit that controls the operation of the bonding unit and the frame feeder.
  • the control unit provides the bonding unit with a first control signal for causing the bonding unit to perform the bonding operation in the first period, and preheats the lead frame to the heater unit in the second period overlapping the first period.
  • a second control signal to be performed may be provided to the frame feeder.
  • the length of the second period may be less than or equal to the length of the first period.
  • the frame feeder which is another embodiment of the present invention, has a transfer unit that conveys the lead frame to a work area where bonding work is performed on the lead frame, and a first heater that preheats the lead frame before being transferred to the work area. It is equipped with a unit.
  • the first heater unit is arranged to face the back surface of the lead frame on the upstream side of the work area in the transport direction of the lead frame with the first heating element, and receives heat received from the first heating element.
  • It has a first heater block provided for a lead frame.
  • the first heater block is provided with a first heat radiating portion having a plurality of first fins formed in the depth direction from the surface of the first heater block.
  • the heater block of the heater unit of the frame feeder may have a plurality of fins extending in the depth direction. According to the plurality of fins, heat is efficiently transferred from the heater block to the lead frame. Therefore, the time required for preheating can be shortened. As a result, productivity can be improved.
  • the above frame feeder may further include a second heater unit that heats the lead frame conveyed from the work area after the bonding work is performed.
  • the second heater unit is arranged to face the back surface of the lead frame on the downstream side of the work area in the transport direction of the lead frame with the second heating element, and receives heat received from the second heating element.
  • It may have a second heater block provided for the lead frame.
  • the second heater block may be provided with a second heat radiating portion having a plurality of second fins formed in the depth direction from the surface of the second heater block.
  • Yet another embodiment of the present invention is a heater unit that preheats the lead frame before it is conveyed to the work area where the lead frame is bonded.
  • the heater unit is arranged so as to face the back surface of the lead frame on the upstream side of the work area in the transport direction of the heating element and the heating element, and provides the heat received from the heating element to the lead frame.
  • the heater block is provided with a heat radiating portion having a plurality of fins formed in the depth direction from the surface of the heater block.
  • the heater block of the heater unit has a plurality of fins extending in the depth direction. According to the plurality of fins, heat is efficiently transferred from the heater block to the lead frame. Therefore, the time required for preheating can be shortened. As a result, productivity can be improved. Further, the plurality of fins may be separated from each other along a direction intersecting the transport direction of the lead frame. Further, the heater block may be provided with a hole provided between the fins and penetrated in the depth direction. Further, the length of the fin in the depth direction may be longer than the distance from the tip of the fin in the depth direction to the lead frame.
  • FIG. 1 is a perspective view showing a wire bonding apparatus according to an embodiment.
  • FIG. 2 is a diagram showing the positional relationship between the preheater, the heat plate, the afterheater, and the lead frame.
  • FIG. 3 is a perspective view showing the heater unit.
  • FIG. 4 is a perspective view showing a cross section of the heater unit.
  • FIG. 5 is a chart diagram illustrating the operation of the wire bonding apparatus.
  • FIG. 6 is a graph showing the heating performance of the heater unit of the comparative example and the heating performance of the heater unit of the embodiment.
  • the wire bonding device 1 (bonding device) shown in FIG. 1 electrically connects, for example, an electrode of a lead frame 100 and an electrode of a semiconductor element die-bonded to the lead frame 100 using a metal wire having a small diameter. do.
  • the wire bonding apparatus 1 connects the wire to the electrode by providing heat, ultrasonic waves, or pressure to the wire.
  • the wire bonding device 1 includes a frame feeder 2, a bonding unit 3 (bonding unit), and a control unit 4 (control unit).
  • the frame feeder 2, the bonding unit 3, and the control unit 4 are provided on the base 6.
  • the transport direction D1 is the direction in which the lead frame 100 is transported by the frame feeder 2.
  • the facing direction D2 is a direction from the main surface 11a of the preheater 11 described later toward the back surface 100a of the lead frame 100.
  • the facing direction D2 is parallel to the moving direction of the capillary 8 in the bonding unit 3.
  • the facing direction D2 is the depth direction in the heater block 16.
  • the depth direction D3 is orthogonal to each of the transport direction D1 and the facing direction D2.
  • the frame feeder 2 conveys the lead frame 100, which is a component to be processed.
  • the frame feeder 2 heats the lead frame 100 in order to control the temperature of the lead frame 100. Details of the frame feeder 2 will be described later.
  • the bonding unit 3 includes a bonding tool 7 and a capillary 8.
  • the capillary 8 is detachably provided with respect to the tip of the bonding tool 7.
  • the capillary 8 provides heat, ultrasonic waves or pressure to the wire.
  • the control unit 4 controls the overall operation of the wire bonding device 1 including the operations of the frame feeder 2 and the bonding unit 3.
  • the control unit 4 provides some control signals to the bonding unit 3 and the frame feeder 2.
  • the control signal includes a signal for controlling the transfer of the lead frame 100 in the frame feeder 2 and a signal for controlling the heating of the lead frame 100 in the frame feeder 2.
  • the control signal may also include a signal for controlling the position of the capillary 8 with respect to the lead frame 100 and a signal for starting and stopping the provision of heat, ultrasonic waves or pressure.
  • the frame feeder 2 includes a rail 9 (conveying unit), a preheater 11 (heater unit, first heater unit), a heat plate 12, and an afterheater 13 (second heater unit).
  • the rail 9 is a pair of members extending in the transport direction D1.
  • the rails 9 are separated from each other in a direction orthogonal to the transport direction D1.
  • the rail 9 takes out the lead frame 100 from the magazine containing the unprocessed lead frame 100.
  • the rail 9 moves the lead frame 100 along the transport direction D1. In this transfer, the rail 9 holds the position of the lead frame 100 above each of the preheater 11, the heat plate 12, and the afterheater 13 for a predetermined period of time. Then, the rail 9 stores the processed lead frame 100 in another magazine.
  • the preheater 11, the heat plate 12, and the afterheater 13 are arranged between the pair of rails 9.
  • the preheater 11, the heat plate 12, and the afterheater 13 are arranged in this order along the transport direction D1.
  • a preheating region A1 is set on the preheater 11.
  • a bonding region A2 (working region) is set on the heat plate 12.
  • a post-heating region A3 is set on the after-heater 13. According to this arrangement, the lead frame 100 moves in the order of the preheating region A1, the bonding region A2, and the postheating region A3.
  • the preheater 11 and the afterheater 13 are separated from the back surface 100a of the lead frame 100 by a predetermined distance.
  • a gap L1 is formed between the preheater 11 and the lead frame 100.
  • a gap L1 is also formed between the afterheater 13 and the lead frame 100.
  • the gap L1 is, for example, 0.5 mm or more and 3.0 mm or less, and may be 1 mm or more and 2 mm or less as an example.
  • the preheater 11 and the afterheater 13 are fixed to the base 6 (FIG. 1). Therefore, the distance between the preheater 11 and the lead frame 100 is basically invariant. Similarly, the distance between the afterheater 13 and the lead frame 100 is basically unchanged.
  • the distance between the heat plate 12 and the back surface 100a of the lead frame 100 is variable. Specifically, when the bonding operation is performed, the heat plate 12 comes into contact with the back surface 100a of the lead frame 100 (see the portion (a) in FIG. 2). On the other hand, when the lead frame 100 is conveyed to the heat plate 12 and when the lead frame 100 is carried out from the heat plate 12, the heat plate 12 is moved downward by the drive mechanism 10 ((b) in FIG. 2). ) See section). At this time, a gap L2 is formed between the heat plate 12 and the lead frame 100.
  • the gap L2 is, for example, 1 mm or more and 15 mm or less, and may be 10 mm as an example.
  • FIG. 3 is a perspective view showing the configuration of the preheater 11 more specifically.
  • the preheater 11 has a cartridge heater 14 (heating element, first heating element) and a heater block 16 (first heater block).
  • the cartridge heater 14 generates heat when energized.
  • the temperature of the cartridge heater 14 may be 200 ° C. or higher and 400 ° C. or lower.
  • the heater block 16 transfers the heat generated by the cartridge heater 14 to the lead frame 100.
  • the heater block 16 includes a main surface 16a facing the lead frame 100.
  • the width of the heater block 16 in the depth direction D3 may be larger than the width of the lead frame 100.
  • the heater block 16 has a heater fixing surface 17, an upstream heat radiating portion 18, and a downstream heat radiating portion 19.
  • the heater fixing surface 17 is fixed to the base 6 via an adapter or the like.
  • An upstream heat radiating portion 18 and a downstream heat radiating portion 19 are formed on the surface of the heater block 16 facing the lead frame 100.
  • the upstream heat radiating unit 18 and the downstream heat radiating unit 19 may serve as the main surface of the preheater 11.
  • the upstream heat radiating unit 18 and the downstream heat radiating unit 19 may serve as the main surface of the heater block 16.
  • the upstream heat radiating unit 18 and the downstream heat radiating unit 19 face each other with a gap L1 in the lead frame 100.
  • the heat received from the heater fixing surface 17 is provided to the lead frame 100 from the upstream heat radiating unit 18 and the downstream heat radiating unit 19.
  • the upstream heat radiating unit 18 is provided on the upstream side in the transport direction D1.
  • the downstream heat dissipation unit 19 is provided on the downstream side in the transport direction D1.
  • the downstream heat radiating unit 19 is provided with a cylindrical cartridge heater 14.
  • a connecting portion 21 is provided between the upstream heat radiating portion 18 and the downstream heat radiating portion 19.
  • the connecting portion 21 is not provided with fins 22, which will be described later.
  • the connecting portion 21 may be provided with, for example, a bolt hole for fixing the preheater 11 to the base 6 (see FIG. 1).
  • the downstream heat dissipation unit 19 will be described with reference to FIG. FIG. 4 is a cross-sectional perspective view of the virtual surface K shown in FIG. Since the upstream heat radiating unit 18 is different only in the position formed with respect to the downstream heat radiating unit 19, detailed description thereof will be omitted.
  • the downstream heat radiating unit 19 has a plurality of fins 22 (plurality of first fins), a groove 23, and an air supply hole 24.
  • the main surface 16a constitutes a heat radiating portion (first heat radiating portion).
  • the fin 22 has an opening on the main surface 16a.
  • the fins 22 increase the heat dissipation area and form a groove 23 as a run-up section.
  • the fins 22 extend in the facing direction D2.
  • the tip surface 22a of the fin 22 is a part of the main surface 16a of the heater block 16. Therefore, the gap L1 from the preheater 11 to the lead frame 100 has the same meaning as the distance from the front end surface 22a of the fin 22 to the back surface 100a of the lead frame 100.
  • the plurality of fins 22 are separated from each other along the directions (depth direction D3) orthogonal to each of the facing direction D2 and the transport direction D1. Therefore, the ridgeline at the tip of the fin is parallel to the transport direction D1.
  • the groove 23 is formed. That is, a groove 23 is formed between the fins 22.
  • the depth L3 of the groove 23 has the same meaning as the height of the fin 22.
  • the depth L3 of the groove 23 is larger than the gap L1.
  • the depth L3 of the groove 23 is 5 mm or more and 30 mm or less, and is 12 mm as an example.
  • the bottom surface 23a of the groove 23 is provided with an opening 24a of the air supply hole 24.
  • the air supply hole 24 extends along the facing direction D2.
  • the opening 24b on the opposite side of the air supply hole 24 is provided on the heater fixing surface 17 side.
  • the air supply hole 24 takes in air from the opening 24b and discharges the air to the bottom surface 23a of the groove 23.
  • the air supply holes 24 supply air (see white arrows) between the fins 22.
  • the air supply hole 24 is provided for each groove 23. Therefore, when the heater block 16 is viewed in a plan view, the air supply holes 24 are provided in the heater block 16 so as to be separated from each other along the depth direction D3.
  • heat is generated in the cartridge heater 14.
  • the heat is transferred to the heater block 16.
  • the heat then reaches the fins 22.
  • the heat that reaches the fins 22 is transferred to the air that exists near the sides of the fins 22. That is, the air existing in the groove 23 is heated.
  • the heated air has a relatively low density and therefore begins to rise.
  • the above-mentioned heat transfer occurs on the side surface of the fin 22, and an upward flow of heated air is generated.
  • the section where heat transfer from the fins 22 to the air occurs is called a run-up section. That is, even when the fin 22 is not provided, heat transfer from the fin 22 to the air occurs, but the approach section is not formed.
  • the afterheater 13 has the same configuration as the preheater 11. That is, it has a cartridge heater 14 which is a second heating element and a heater block 16 which is a second heater block.
  • the heater block 16 has an upstream heat radiating unit 18 and a downstream heat radiating unit 19 which are second heat radiating units, and the upstream heat radiating unit 18 and the downstream heat radiating unit 19 are provided with fins 22 which are second fins. .. Therefore, detailed description of the afterheater 13 will be omitted.
  • FIG. 5 is a diagram schematically showing the operation of the wire bonding device 1.
  • the uppermost horizontal axis corresponds to the preheating region A1.
  • the horizontal axis in the middle stage corresponds to the bonding region A2.
  • the horizontal axis at the bottom corresponds to the post-heating region A3.
  • Each horizontal axis indicates that time progresses from left to right. Further, the rectangles overlapping on each horizontal axis indicate that the lead frame 100 exists in each region.
  • the control unit 4 provides an electric current to the preheater 11, the heat plate 12, and the afterheater 13.
  • the preheater 11, the heat plate 12, and the afterheater 13 are each set to a predetermined temperature.
  • the set temperature of the preheater 11 is 200 ° C. or higher and 350 ° C. or lower.
  • the set temperature of the heat plate 12 is 300 ° C.
  • the set temperature of the afterheater 13 is 300 ° C.
  • control unit 4 provides a control signal to the frame feeder 2.
  • control for transporting the lead frame 100 is performed.
  • the operation of the frame feeder 2 will be described below, but each operation is performed according to the control signal received from the control unit 4 by the frame feeder 2.
  • the frame feeder 2 takes out the lead frame 100 from the magazine.
  • the frame feeder 2 conveys the taken-out lead frame 100 to the preheating region A1 (S1).
  • the frame feeder 2 holds the position of the lead frame 100 for a predetermined period (S2).
  • the lead frame 100 receives heat from the preheater 11. As a result, the lead frame 100 is heated to a predetermined temperature.
  • the frame feeder 2 conveys the lead frame 100 to the bonding region A2 (S3).
  • the frame feeder 2 again takes out the lead frame 100 from the magazine and conveys the taken out lead frame 100 to the preheating region A1 (S4).
  • the frame feeder 2 holds the position of the lead frame 100 conveyed to the bonding region A2 for a predetermined period (first period).
  • the frame feeder 2 holds the position of the lead frame 100 conveyed to the preheating region A1 for a predetermined period (second period).
  • the control unit 4 provides a control signal to the bonding unit 3.
  • the bonding unit 3 performs a bonding operation on the lead frame 100 (S5).
  • the lead frame 100 arranged in the preheating region A1 receives heat from the preheater 11 and is therefore heated to a predetermined temperature (S6).
  • the length of the period (S6) in which the lead frame 100 is arranged in the preheating region A1 is the same as the length of the period required for the bonding operation (S5). That is, if the timing at which the lead frame 100 reaches the preheating region A1 and the timing at which the lead frame 100 arrives at the bonding region A2 are the same, the preheating (S6) and the bonding operation (S5) are completed at the same time. do.
  • the period in which the lead frame 100 is arranged here may be a period from when the position of the lead frame 100 in the preheating region A1 is stationary to when the movement is started again.
  • the period required for the bonding work may be a period from when the position of the lead frame 100 in the bonding region A2 is stationary to when the movement is started again.
  • the period required for the bonding work may be a period from the start of the operation of the bonding unit 3 to the stop of the operation. That is, the period required for the bonding work may or may not include the period from the position of the lead frame 100 in the bonding region A2 to the start of the operation of the bonding unit 3.
  • the frame feeder 2 conveys the lead frame 100 in which the bonding work has been performed to the post-heating region A3 (S7). In parallel with this transfer, the frame feeder 2 transfers the preheated lead frame 100 to the bonding region A2 (S8). Further, the frame feeder 2 takes out the lead frame 100 from the magazine again and conveys the taken out lead frame 100 to the preheating region A1 (S9).
  • the frame feeder 2 holds the position of the lead frame 100 conveyed to the post-heating region A3 for a predetermined period of time. Similarly, the frame feeder 2 holds the position of the lead frame 100 conveyed to the bonding region A2 for a predetermined period of time. Further, the frame feeder 2 holds the position of the lead frame 100 conveyed to the preheating region A1 for a predetermined period of time. During this period, the lead frame 100 arranged in the post-heating region A3 receives heat from the afterheater 13 (S11). Further, the bonding unit 3 performs a bonding operation on the lead frame 100 (S12).
  • the lead frame 100 arranged in the preheating region A1 receives heat from the preheater 11 and is therefore heated to a predetermined temperature (S14). After that, the frame feeder 2 stores the lead frame 100 in the magazine (S14).
  • the wire bonding apparatus 1 performs preheating and bonding work in parallel. More specifically, the time required for preheating is the same as or shorter than the time required for the bonding operation. Then, as soon as the bonding work is completed, the lead frame 100 for which the preheating has been completed can be conveyed to the bonding region A2. Therefore, there is no time for the bonding unit 3 to stand by except for the time for transporting the lead frame 100. As a result, productivity is improved.
  • the bonding operation cannot be started until the lead frame reaches a predetermined temperature after being carried into the bonding region.
  • the bonding unit 3 needs to accurately move the capillary 8 to the bonding position (for example, the position of the electrode pad).
  • the bonding unit 3 needs to accurately move the capillary 8 to the bonding position (for example, the position of the electrode pad).
  • the lead frame 100 that has reached the target temperature can always be provided to the bonding region A2. That is, the lead frame 100 conveyed to the bonding region A2 does not undergo thermal expansion to the extent that it affects the bonding operation. Therefore, accurate bonding work can be performed without generating the above-mentioned waiting time.
  • the preheater 11 provided in the frame feeder 2 of the wire bonding device 1 does not require equipment for providing compressed air or a complicated mechanism such as a piping air passage. Therefore, with a simple configuration, the lead frame 100 can be quickly heated to a predetermined temperature.
  • Example 1 and Comparative Example 1 The effect of the preheater 11 which is a heater unit was confirmed by comparing with the effect of the heater unit of the comparative example.
  • the heater unit of the comparative example differs from the preheater 11 in that it does not have fins 22 and air supply holes 24.
  • Other configurations of the heater unit of the comparative example are the same as those of the preheater 11 of the embodiment. That is, according to the heater unit of the comparative example, the heater is caused by heat transfer due to radiation between the main surface of the heater block and the back surface of the lead frame, and heat transfer due to rising convection generated from the main surface of the heater block. Heat is provided from the unit to the lead frame.
  • Example 1 and Comparative Example 1 the temperature of the cartridge heater 14 was set to 350 ° C. Then, the state of the temperature rise of the lead frame 100 was confirmed with the timing at which the lead frame 100 was conveyed and stopped on the main surface 16a of the heater block 16 as a base point.
  • FIG. 6 is a graph showing the results of Example 1 and the results of Comparative Example 1. The horizontal axis indicates time. The vertical axis indicates the temperature of the lead frame 100.
  • Graph G6a shows the results of Example 1.
  • Graph G6b shows the result of Comparative Example 1.
  • Comparative Example 1 was confirmed. According to the graph G6b, first, it was found that the temperature of the lead frame 100 was about 25 ° C. (see plot P1). This temperature generally corresponds to room temperature. Next, about 40 seconds after the start of measurement, the lead frame 100 was conveyed onto the heater unit (see plot P2). As a result, it was found that the temperature of the lead frame 100 was rapidly rising. Then, 120 seconds after the start of measurement, the temperature of the lead frame converged to about 260 ° C. (see plot P3).
  • Example 1 the result of Example 1 was confirmed.
  • the temperature of the lead frame 100 was about 25 ° C. (see plot P1).
  • the lead frame 100 was conveyed onto the heater unit (see plot P2).
  • the temperature of the lead frame 100 was rapidly rising.
  • 120 seconds after the start of measurement the temperature of the lead frame converged to about 260 ° C. (see plot P3).
  • the wire bonding device 1 is exemplified as the bonding device.
  • the bonding device may be a die bonding device.
  • the bonding operation means die bonding, not wire bonding.
  • the bonding portion may include a mechanism for transporting the semiconductor chip to the lead frame 100, a mechanism for arranging the adhesive on the semiconductor chip and / or the lead frame 100, and the like.
  • air supply hole 100 ... lead frame, D1 ... Transfer direction, D2 ... Face-to-face direction, D3 ... Depth direction, K ... Virtual surface, L1 ... Gap, L3 ... Depth, A1 ... Preheating area, A2 ... Bonding area, A3 ... Post-heating area.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
PCT/JP2020/009886 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット WO2021176739A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG11202111143PA SG11202111143PA (en) 2020-03-06 2020-03-06 Bonding apparatus, frame feeder, and heater unit
CN202080028931.6A CN113785385A (zh) 2020-03-06 2020-03-06 接合装置、导线架馈入器以及加热单元
JP2021549567A JP7216451B2 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット
KR1020217037044A KR20210146410A (ko) 2020-03-06 2020-03-06 본딩 장치, 프레임 피더 및 히터 유닛

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111108584A (zh) * 2017-08-01 2020-05-05 株式会社新川 框架馈入器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (enrdf_load_stackoverflow) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646646B2 (ja) 1986-01-21 1994-06-15 日本電気株式会社 半導体装置組立用ワイヤボンデイング装置
KR100546280B1 (ko) * 1999-01-05 2006-01-26 삼성전자주식회사 롱 루프 와이어 본딩을 위한 히터블록

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (enrdf_load_stackoverflow) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111108584A (zh) * 2017-08-01 2020-05-05 株式会社新川 框架馈入器

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SG11202111143PA (en) 2021-11-29
CN113785385A (zh) 2021-12-10
KR20210146410A (ko) 2021-12-03
JP7216451B2 (ja) 2023-02-01

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