CN113785385A - 接合装置、导线架馈入器以及加热单元 - Google Patents

接合装置、导线架馈入器以及加热单元 Download PDF

Info

Publication number
CN113785385A
CN113785385A CN202080028931.6A CN202080028931A CN113785385A CN 113785385 A CN113785385 A CN 113785385A CN 202080028931 A CN202080028931 A CN 202080028931A CN 113785385 A CN113785385 A CN 113785385A
Authority
CN
China
Prior art keywords
lead frame
heating
bonding
heating block
heating unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080028931.6A
Other languages
English (en)
Chinese (zh)
Inventor
长野一昭
小岛和仁
宫近峻匡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of CN113785385A publication Critical patent/CN113785385A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
    • H01L2224/78281—Resistance welding electrodes, i.e. for ohmic heating in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/785—Cooling means
    • H01L2224/78501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CN202080028931.6A 2020-03-06 2020-03-06 接合装置、导线架馈入器以及加热单元 Pending CN113785385A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (1)

Publication Number Publication Date
CN113785385A true CN113785385A (zh) 2021-12-10

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080028931.6A Pending CN113785385A (zh) 2020-03-06 2020-03-06 接合装置、导线架馈入器以及加热单元

Country Status (5)

Country Link
JP (1) JP7216451B2 (enrdf_load_stackoverflow)
KR (1) KR20210146410A (enrdf_load_stackoverflow)
CN (1) CN113785385A (enrdf_load_stackoverflow)
SG (1) SG11202111143PA (enrdf_load_stackoverflow)
WO (1) WO2021176739A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11315808B2 (en) * 2017-08-01 2022-04-26 Shinkawa Ltd. Frame feeder

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (enrdf_load_stackoverflow) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
KR20000050301A (ko) * 1999-01-05 2000-08-05 윤종용 롱 루프 와이어 본딩을 위한 히터블록
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646646B2 (ja) 1986-01-21 1994-06-15 日本電気株式会社 半導体装置組立用ワイヤボンデイング装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (enrdf_load_stackoverflow) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
KR20000050301A (ko) * 1999-01-05 2000-08-05 윤종용 롱 루프 와이어 본딩을 위한 히터블록
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Also Published As

Publication number Publication date
JPWO2021176739A1 (enrdf_load_stackoverflow) 2021-09-10
SG11202111143PA (en) 2021-11-29
KR20210146410A (ko) 2021-12-03
WO2021176739A1 (ja) 2021-09-10
JP7216451B2 (ja) 2023-02-01

Similar Documents

Publication Publication Date Title
US7861908B2 (en) Component mounting method, component mounting apparatus, and ultrasonic bonding head
US8328066B2 (en) Bonding tool and electronic component mounting apparatus and method
JP6148800B1 (ja) ヒータチップ及び接合装置及び接合方法
CN113785385A (zh) 接合装置、导线架馈入器以及加热单元
US20090289099A1 (en) Wire bonding method
KR20180046195A (ko) 열전 모듈 제조 장치
TWI788622B (zh) 接合裝置、導線架饋入器以及加熱單元
CN107112248B (zh) 芯片接合装置以及芯片接合方法
JP7031185B2 (ja) ウェッジツール及びウェッジボンディング方法
US20230274951A1 (en) Mounting device and mounting method
US11618107B2 (en) Device for manufacturing electric component and method for manufacturing electric component
JP2005123222A (ja) クリップボンダ
JP4109000B2 (ja) 電子部品実装装置
JP7222306B2 (ja) 放熱体の貼り付け方法及び放熱体貼り付け装置
JP3377660B2 (ja) 加熱炉およびダイボンドペーストの硬化方法
JP2703272B2 (ja) ワイヤボンディング装置
JP4539678B2 (ja) 電子部品実装方法
KR20120138114A (ko) 기판 처리 장치 및 방법
JP2699583B2 (ja) 半導体装置の製造方法及びその装置
JP3444211B2 (ja) 噴流はんだ付装置
JPS60167336A (ja) 加熱装置
JP3166752B2 (ja) ベアチップ実装システム
JPH10242177A (ja) キュア装置
JPH07300235A (ja) 板状材料の移送方法
JPS63226034A (ja) ワイヤボンデイング装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20211210

WD01 Invention patent application deemed withdrawn after publication