CN113785385A - Bonding device, lead frame feeder and heating unit - Google Patents
Bonding device, lead frame feeder and heating unit Download PDFInfo
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- CN113785385A CN113785385A CN202080028931.6A CN202080028931A CN113785385A CN 113785385 A CN113785385 A CN 113785385A CN 202080028931 A CN202080028931 A CN 202080028931A CN 113785385 A CN113785385 A CN 113785385A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 145
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000004904 shortening Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- 230000000630 rising effect Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
- H01L2224/78281—Resistance welding electrodes, i.e. for ohmic heating in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/785—Cooling means
- H01L2224/78501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
The wire bonding apparatus 1 of the present invention comprises: a bonding tool 7 for wire bonding the lead frame 100; and a lead frame feeder 2 for carrying the lead frame 100 through the rail 9 and preheating the lead frame 100 through a preheater 11. The preheater 11 has: a heater 14 is inserted; and a heating block 16 disposed upstream of the bonding region a2 in the conveying direction D1 of the lead frame 100, for supplying heat received from the package heater 14 to the lead frame 100. A plurality of fins 22 extending in the facing direction D2 are provided on the heating block 16.
Description
Technical Field
The present invention relates to a bonding apparatus, a lead frame feeder (frame feeder), and a heater unit (heater unit).
Background
So-called die bond (die bond) is the process of bonding semiconductor dies for lead frames. Wire bonding is an operation of bonding a semiconductor die with a bonding wire. In the bonding operation, the lead frame is heated to a predetermined temperature higher than room temperature. When the heating of the lead frame is performed in the region where the bonding work is performed, the lead frame remains only in the region where the bonding work is performed for a time obtained by summing up the time for heating and the time for bonding.
For example, the semiconductor packaging apparatus of patent document 1 includes a region for preheating the lead frame and a region for wire bonding. According to this device, the time for performing the preheating and the time for performing the wire bonding can be repeated. As a result, the work efficiency of the joining work can be improved.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 62-169340
Disclosure of Invention
Problems to be solved by the invention
In recent years, it has been desired to further improve the productivity of a joining apparatus that performs a joining operation. Accordingly, an object of the present invention is to provide a bonding apparatus, a lead frame feeder, and a heating unit capable of improving productivity.
Means for solving the problems
The bonding apparatus of an embodiment of the present invention includes: a bonding section for performing a bonding operation on the lead frame conveyed to the operation area; and a lead frame feeder, which transports the lead frame to the operation area through the transport part and preheats the lead frame before being transported to the operation area through the heating unit; and the heating unit has: a heating element; and a heater block (heater block) disposed upstream of the work area in the transfer direction of the lead frame and facing the back surface of the lead frame, and configured to supply heat received from the heater body to the lead frame; the heating block is provided with a heat dissipation part which is provided with a plurality of fins (fin) formed from the surface of the heating block towards the depth direction.
In the joining apparatus, a joining operation performed by the joining portion is performed in the working area. A heating unit that preheats the lead frame before being conveyed to the work area is disposed upstream of the work area. Therefore, the region to be preheated before the joining operation and the region to be joined can be made different from each other. Further, the heating block of the heating unit has a plurality of fins (fin) extending in the depth direction. The plurality of fins efficiently transfer heat from the heating block to the lead frame, thereby shortening the time required for preheating. As a result, productivity can be improved.
The plurality of fins may be spaced apart from each other in a direction crossing a carrying direction of the lead frame. According to the structure, the back surface of the lead frame can be protected.
The heating block may be provided with holes disposed between the fins and penetrating in a depth direction. The transfer of heat from the heating block toward the lead frame is dependent upon convection of air from the heating block toward the lead frame. By providing the holes, air for transferring heat is preferably supplied toward the fins, so that heat is more efficiently transferred from the heating block toward the lead frame. As a result, productivity can be further improved.
The length of the fin in the depth direction may be longer than a distance from a front end of the fin to the lead frame in the depth direction. According to the structure, air heated by the fins can be preferably supplied to the rear surface of the lead frame.
The bonding apparatus may further include a control part controlling operations of the bonding part and the lead frame feeder, the control part providing a first control signal for causing the bonding part to perform a bonding operation to the bonding part during a first period, and providing a second control signal for causing the heating unit to perform preheating of the lead frame to the lead frame feeder during a second period repeated with the first period, a length of the second period being less than or equal to a length of the first period. According to the control, the preheating of the subsequent lead frame is completed during the bonding operation. Therefore, after the bonding operation is finished, the preheated lead frame can be carried in parallel with the carrying out of the lead frame from the operation area. That is, the standby time of the joining work does not need to be set for the preliminary heating. As a result, productivity can be further improved.
Another embodiment of the present invention provides a lead frame feeder, including: a conveying part for conveying the lead frame to an operation area for performing bonding operation on the lead frame; the first heating unit is used for preheating the lead frame before being conveyed to the operation area; and the first heating unit has: a first heat generating body; and a first heating block disposed to face the back surface of the lead frame and upstream of the operation region in the transfer direction of the lead frame, and supplying the heat received from the first heat generating body to the lead frame; the first heating block is provided with a first heat dissipation part which is provided with a plurality of first fins formed from the surface of the first heating block towards the depth direction.
The heating unit of the lead frame feeder has a heating block having a plurality of fins extending in a depth direction. The plurality of fins efficiently transfer heat from the heating block to the lead frame, thereby shortening the time required for preheating. As a result, productivity can be improved.
The lead frame feeder may further include a second heating unit that heats the lead frame that is carried from the operation area after the bonding operation is performed, and the second heating unit may include: a second heating element; and a second heating block disposed to face the rear surface of the lead frame and downstream of the operation region in the transfer direction of the lead frame, and configured to supply heat received from the second heating element to the lead frame; the second heat dissipation part is arranged on the second heating block and provided with a plurality of second fins formed from the surface of the second heating block towards the depth direction. According to the above configuration, the lead frame subjected to the bonding operation is suppressed from being rapidly cooled. Therefore, the result obtained by the joining operation can be protected.
A heating unit according to still another embodiment of the present invention preheats a lead frame before being conveyed to an operation area where a bonding operation is performed on the lead frame, and includes: a heating element; and a heating block disposed to face the rear surface of the lead frame and upstream of the operation region in the transfer direction of the lead frame, and configured to supply heat received from the heating body to the lead frame; the heating block is provided with a heat dissipation portion having a plurality of fins formed from the surface of the heating block in the depth direction.
The heating block of the heating unit has a plurality of fins extending in a depth direction. The plurality of fins efficiently transfer heat from the heating block to the lead frame, thereby shortening the time required for preheating. As a result, productivity can be improved. The plurality of fins may be spaced apart from each other in a direction intersecting the conveying direction of the lead frame. Further, the heating block may be provided with holes which are provided between the fins and penetrate in the depth direction. Further, the length of the fin in the depth direction may be longer than the distance from the front end of the fin to the lead frame in the depth direction.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the bonding device, the lead frame feeder and the heating unit of the invention, the productivity can be improved.
Drawings
Fig. 1 is a perspective view showing a wire bonding apparatus according to an embodiment.
Fig. 2 is a diagram showing a positional relationship between a preheater (preheater), a heat plate (heat plate), and an after-heater (after-heater) and a lead frame.
Fig. 3 is a perspective view showing the heating unit.
Fig. 4 is a perspective view showing a cross section of the heating unit.
Fig. 5 is a flow chart illustrating the operation of the wire bonding apparatus.
Fig. 6 is a graph showing the heating performance of the heating unit of the comparative example and the heating performance of the heating unit of the example.
Detailed Description
Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same components are denoted by the same reference numerals, and redundant description thereof will be omitted.
[ wire bonding apparatus ]
The wire bonding apparatus 1 (bonding apparatus) shown in fig. 1 electrically connects an electrode of a lead frame 100 and an electrode of a semiconductor device die-bonded to the lead frame 100, for example, by a metal wire having a small diameter. The wire bonding apparatus 1 applies heat, ultrasonic waves or pressure to the wire to connect the wire to the electrode. The wire bonding apparatus 1 includes: a lead frame feeder 2, a bonding unit 3 (bonding portion), and a control unit 4 (control portion). The lead frame feeder 2, the bonding unit 3 and the control unit 4 are disposed on a base (base) 6.
In the following description, terms of the conveyance direction D1, the facing direction D2, and the depth direction D3 may be used. The carrying direction D1 is a direction in which the lead frame 100 is carried by the lead frame feeder 2. The facing direction D2 is a direction from the main surface 11a of the preheater 11 described later toward the rear surface 100a of the lead frame 100. The facing direction D2 may be parallel to the moving direction of the capillary (capillary)8 of the bonding unit 3. Further, the facing direction D2 is also the depth direction of the heating block 16. The depth direction D3 is a direction perpendicular to the conveyance direction D1 and the opposing direction D2, respectively.
The lead frame feeder 2 transports a lead frame 100, which is a processed component. In addition, the lead frame feeder 2 heats the lead frame 100 in order to control the temperature of the lead frame 100. The details of the lead frame feeder 2 will be described later. The bonding unit 3 includes a bonding tool (bonding tool)7, and a capillary 8. A capillary 8 is detachably provided at the tip of the bonding tool 7. The capillary tube 8 provides heat, ultrasound or pressure to the bonding wire. The control unit 4 controls the overall operation of the wire bonding apparatus 1 including the operations of the lead frame feeder 2 and the bonding unit 3.
The control unit 4 provides a number of control signals to the bonding unit 3 and the lead frame feeder 2. For example, the control signals include a signal for controlling the conveyance of the lead frame 100 of the lead frame feeder 2 and a signal for controlling the heating of the lead frame 100 of the lead frame feeder 2. The control signal may include a signal for controlling the position of the capillary 8 with respect to the lead frame 100, and a signal for starting and stopping the supply of heat, ultrasonic waves, or pressure.
[ lead frame feeder ]
The lead frame feeder 2 includes: a rail (rail)9 (conveying section), a preheater 11 (heating means, first heating means), a heat plate (heat plate)12, and an afterheater 13 (second heating means).
The rails 9 are a pair of members extending in the conveyance direction D1, and are arranged to be spaced apart from each other in a direction orthogonal to the conveyance direction D1. The rail 9 takes out the lead frame 100 from a cassette (magazine) that receives the unprocessed lead frame 100. The rail 9 moves the lead frame 100 in the transfer direction D1. In the above conveyance, the rail 9 holds the position of the lead frame 100 above the preheater 11, the hot plate 12, and the afterheater 13 for a predetermined period of time. Then, the rail 9 stores the processed lead frame 100 in another cassette.
The preheater 11, the hot plate 12, and the afterheater 13 are disposed between the pair of rails 9. The preheater 11, the hot plate 12, and the after-heater 13 are arranged in this order along the conveyance direction D1. As shown in part (a) of fig. 2, a preheating area a1 is set in the preheater 11. A bonding region a2 (working region) is set in the hot plate 12. Further, a post-heating area a3 is set in the post-heater 13. According to the above arrangement, the lead frame 100 is moved in the order of the preheating zone a1, the bonding zone a2, and the post-heating zone A3.
The preheater 11 and the afterheater 13 are disposed to be separated from the rear surface 100a of the lead frame 100 by a predetermined distance. That is, a gap L1 is formed between the preheater 11 and the afterheater 13 and the lead frame 100. The clearance L1 is, for example, 0.5mm to 3.0mm, and may be, for example, 1mm to 2 mm. The preheater 11 and the afterheater 13 are fixed to the susceptor 6 (fig. 1). Accordingly, the distances between the pre-heater 11 and the post-heater 13 and the lead frame 100 are substantially constant.
The distance between the thermal plate 12 and the rear surface 100a of the lead frame 100 is variable. Specifically, in the bonding operation, the hot plate 12 is in contact with the rear surface 100a of the lead frame 100 (see fig. 2 (a)). On the other hand, when the lead frame 100 is conveyed to the heat plate 12 and when the lead frame 100 is conveyed from the heat plate 12, the heat plate 12 is moved downward by the driving mechanism 10 (see fig. 2 (b)). At this time, a gap L2 is formed between the hot plate 12 and the lead frame 100. The clearance L2 is, for example, 1mm to 15mm, and may be 10mm as an example.
[ preheater ]
Fig. 3 is a perspective view showing more specifically the structure of the preheater 11. The preheater 11 has: a cartridge heater (cartridge heater)14 (heating element, first heating element), and a heating block 16 (first heating block). The plug heater 14 generates heat by being energized. For example, the temperature of the cartridge heater 14 may be 200 ℃ to 400 ℃.
The heating block 16 transfers heat generated from the cartridge heater 14 toward the lead frame 100. The heater block 16 includes a main surface 16a facing the lead frame 100. The width of the heat block 16 in the depth direction D3 may be greater than the width of the leadframe 100. The heater block 16 has a heater fixing surface 17, an upstream heat radiating portion 18, and a downstream heat radiating portion 19. The heater fixing surface 17 is fixed to the base 6 via an adapter (adapter) or the like. An upstream heat sink 18 and a downstream heat sink 19 are formed on the surface of the heating block 16 facing the lead frame 100. The upstream heat sink 18 and the downstream heat sink 19 may be main surfaces of the preheater 11 or main surfaces of the heating block 16. The upstream heat sink member 18 and the downstream heat sink member 19 face each other in the lead frame 100 with a gap L1 therebetween. The heat received from the heater fixing surface 17 is supplied from the upstream heat sink 18 and the downstream heat sink 19 to the lead frame 100.
The upstream heat sink member 18 is provided upstream in the conveyance direction D1. The upstream heat radiating portion 18 is provided with a cylindrical cartridge heater 14. The downstream heat radiating portion 19 is provided downstream in the conveyance direction D1. A connection portion 21 is provided between the upstream heat dissipation portion 18 and the downstream heat dissipation portion 19. Coupling portion 21 is not provided with fins 22 described later. The connection portion 21 may be provided with a bolt hole for fixing the base 6 (see fig. 1) to the preheater 11, for example.
The downstream heat sink 19 will be described with reference to fig. 4. Fig. 4 is a sectional perspective view of the imaginary plane K shown in fig. 3. The upstream heat sink 18 is formed at a different position from the downstream heat sink 19, and therefore, a detailed description thereof is omitted. The downstream heat sink 19 has a plurality of fins 22 (a plurality of first fins), a groove 23, and an air supply hole 24.
In the heating block 16, the main surface 16a constitutes a heat dissipation portion (first heat dissipation portion). Further, the fin 22 having the opening toward the main surface 16a increases the heat radiation area and forms the groove 23 as the run-up section. Fins 22 extend in opposite direction D2. Distal end surfaces 22a of fins 22 are part of main surface 16a of heating block 16. Therefore, the gap L1 from the pre-heater 11 to the lead frame 100 is the same as the distance from the front surface 22a of the fin 22 to the back surface 100a of the lead frame 100.
An opening 24a of the air supply hole 24 is provided in the bottom surface 23a of the groove 23. The air supply holes 24 extend in the facing direction D2. An opening 24b on the opposite side of the air supply hole 24 is provided on the heater fixing surface 17 side. The air supply hole 24 takes in air from the opening 24b and discharges the air toward the bottom surface 23a of the groove 23. That is, air supply hole 24 supplies air (refer to hollow arrows) between fins 22. An air supply hole 24 is provided for each groove 23. Therefore, when the heating block 16 is viewed in plan, the air supply holes 24 are provided in the heating block 16 so as to be spaced apart from each other along the depth direction D3.
Heat is generated in the cartridge heater 14 by the preheater 11. The heat moves to the heating block 16. The heat then reaches fin 22. The heat reaching fin 22 heats the air near the sides of fin 22. That is, the air located in the groove 23 is heated. The heated air becomes less dense in comparison and begins to rise. Here, at fin 22, the heat movement is generated at the side of fin 22, and an upward flow of heated air is generated. The interval of heat movement toward the air generated from the fins 22 is referred to as a run-up interval. That is, even when fin 22 is not provided, heat transfer from fin 22 to the air occurs, but the run-up section is not formed. By using natural convection heating in which the run-up section is installed, sufficient heat energy can be supplied from the pre-heater 11 to the lead frame 100.
The after heater 13 has the same structure as the preheater 11. That is, the heater 14 as a second heating element and the heating block 16 as a second heating block are provided. The heating block 16 has an upstream heat sink 18 and a downstream heat sink 19, which are second heat sinks, and the upstream heat sink 18 and the downstream heat sink 19 are provided with fins 22, which are second fins. Therefore, a detailed description of the afterheater 13 is omitted.
[ operation of wire bonding apparatus ]
Next, the operation of the wire bonding apparatus 1 will be described. Fig. 5 is a diagram schematically showing the operation of wire bonding apparatus 1. In fig. 5, the horizontal axis of the uppermost stage corresponds to the preheating region a 1. The transverse axis of the middle section corresponds to the junction area a 2. The lowest horizontal axis corresponds to the rear heating zone a 3. The horizontal axes represent the time progression from left to right. The rectangles overlapping the horizontal axes indicate that the lead frame 100 is located in each region.
First, the control unit 4 supplies electric current to the preheater 11, the hot plate 12, and the after-heater 13. By the above operation, the preheater 11, the hot plate 12, and the afterheater 13 are set to predetermined temperatures, respectively. For example, the temperature of the preheater 11 is set to 200 ℃ to 350 ℃. For example, the set temperature of the hot plate 12 is 300 ℃. For example, the set temperature of the afterheater 13 is 300 ℃.
Next, the control unit 4 supplies a control signal to the lead frame feeder 2 to control the transfer of the lead frame 100. The operation of the lead frame feeder 2 will be described below, each operation being performed in accordance with a control signal received by the lead frame feeder 2 from the control unit 4.
Specifically, the lead frame feeder 2 takes out the lead frame 100 from the cassette. Then, the lead frame feeder 2 transfers the extracted lead frame 100 to the preheating zone a1 (S1). Next, the lead frame feeder 2 holds the position of the lead frame 100 for a predetermined period (S2). During this period, the lead frame 100 receives heat from the pre-heater 11 and is thus heated to a predetermined temperature.
After a predetermined period of time has elapsed, the lead frame feeder 2 conveys the lead frame 100 to the bonding area a2 (S3). In parallel with the transfer, the lead frame feeder 2 again takes out the lead frame 100 from the cassette and transfers the taken-out lead frame 100 to the preheating area a1 (S4). Then, the lead frame feeder 2 holds the position of the lead frame 100 conveyed to the bonding area a2 for a predetermined period (first period). Similarly, the lead frame feeder 2 holds the position of the lead frame 100 conveyed to the preheating zone a1 for a predetermined period (second period). During which the control unit 4 provides a control signal to the engaging unit 3. The bonding unit 3 performs a bonding operation to the lead frame 100 according to the control signal (S5). Further, in parallel with the bonding operation, the lead frame 100 disposed in the preheating zone a1 receives heat from the preheater 11 and is thus heated to a predetermined temperature (S6).
Here, the period (S6) in which the lead frame 100 is arranged in the preliminary heating area a1 is the same as the period required for the bonding work (S5). That is, if the timing at which the lead frame 100 reaches the preliminary heating area a1 is the same as the timing at which the lead frame 100 reaches the bonding area a2, the preliminary heating (S6) and the bonding operation (S5) are simultaneously completed.
The period of time during which the lead frame 100 is disposed may be a period of time from when the position of the lead frame 100 in the preheating area a1 is stationary to when the movement is started again. The period required for the bonding operation may be a period from when the position of the lead frame 100 in the bonding region a2 is stationary to when the movement is resumed. The period required for the joining operation may be a period from the start to the stop of the operation of the joining unit 3. That is, the period required for the bonding operation may or may not include a period from the time when the position of the lead frame 100 in the bonding region a2 is stationary to the time when the operation of the bonding unit 3 is started.
After a predetermined period of time has elapsed, the lead frame feeder 2 conveys the lead frame 100 subjected to the bonding operation to the post-heating area a3 (S7). In parallel with the conveyance, the lead frame feeder 2 conveys the preheated lead frame 100 to the bonding area a2 (S8). Further, the lead frame feeder 2 again takes out the lead frame 100 from the cassette and transfers the taken-out lead frame 100 to the preheating area a1 (S9).
Then, the lead frame feeder 2 holds the position of the lead frame 100 conveyed to the post heating area a3 for a predetermined period. Similarly, the position of the lead frame 100 conveyed to the bonding area a2 is maintained for a predetermined period. Further, the lead frame feeder 2 keeps the position of the lead frame 100 conveyed to the preliminary heating area a1 for a predetermined period. During this period, the lead frame 100 disposed in the rear heating area a3 receives heat from the rear heater 13 (S10). The bonding unit 3 performs a bonding operation on the lead frame 100 (S11). Further, in parallel with the bonding operation, the lead frame 100 disposed in the preheating zone a1 receives heat from the preheater 11 and is thus heated to a predetermined temperature (S12). Thereafter, the lead frame feeder 2 receives the lead frame 100 in a cassette (S13).
[ Effect ]
The operation and effect of the wire bonding apparatus 1 will be described below.
The wire bonding apparatus 1 performs preheating and bonding operations in parallel. More specifically, the period required for the preliminary heating is the same as or shorter than the period required for the joining operation. As described above, when the bonding operation is completed, the lead frame 100 having completed the preheating is immediately conveyed to the bonding area a 2. Therefore, the conveyance time of the lead frame 100 is eliminated without generating the standby time of the bonding unit 3, and the productivity is improved.
On the other hand, as the operation of the wire bonding apparatus, there is also a possibility that: after the lead frame having finished the bonding operation is carried out, the lead frame having not reached a predetermined temperature is carried into the bonding area. However, in the above operation, after being carried into the bonding region, the bonding operation cannot be started until the lead frame reaches a predetermined temperature. This is because the bonding unit 3 needs to accurately move the capillary 8 to the bonding position (e.g., the position of the electrode pad) at the time of the bonding operation. Here, when the temperature of the lead frame 100 disposed in the bonding region a2 rises, the lead frame 100 thermally expands, and the positions of the electrode pads change. As a result, it is difficult to accurately position the capillary 8 to the electrode pad. Therefore, even by the operation, the standby time of the engaging unit is generated.
On the other hand, in the wire bonding apparatus 1, the lead frame 100 having reached the target temperature can be always supplied to the bonding area a 2. That is, the lead frame 100 conveyed to the bonding area a2 does not thermally expand to such an extent as to affect the bonding operation. Therefore, the accurate bonding operation can be performed without generating the standby time as described above.
The preheater 11 included in the lead frame feeder 2 of the wire bonding apparatus 1 does not require a complicated mechanism such as a device for supplying compressed air or a piping air passage. Therefore, the lead frame 100 can be rapidly heated to a predetermined temperature with a simple structure.
Example 1 and comparative example 1
The effect of the preheater 11 as the heating unit was compared with the effect of the heating unit of the comparative example, and confirmed. The heating unit of the comparative example is different from the pre-heater 11 in that it does not have the fins 22 and the air supply holes 24. The other structure of the heating unit of the comparative example is the same as that of the preheater 11 of the embodiment. That is, according to the heating unit of the comparative example, heat is supplied from the heating unit to the lead frame by heat transfer due to radiation between the main surface of the heating block and the back surface of the lead frame and heat transfer due to rising convection generated from the main surface of the heating block.
In example 1 and comparative example 1, the temperature of the cartridge heater 14 was set to 350 ℃. Then, the lead frame 100 is conveyed, and the temperature rise of the lead frame 100 is confirmed with the timing at which the lead frame is stationary on the main surface 16a of the heating block 16 as a base point. FIG. 6 is a graph showing the results of example 1 and comparative example 1. The horizontal axis represents time. The vertical axis represents the temperature of the lead frame 100. Graph G6a shows the results of example 1. Graph G6b shows the results of comparative example 1.
First, the results of comparative example 1 were confirmed. From graph G6b, it is first found that the temperature of leadframe 100 is about 25 ℃ (see plot P1). The temperature corresponds approximately to room temperature. Next, after about 40 seconds from the start of the measurement, the lead frame 100 is conveyed to the heating unit (see plot P2). As a result, the temperature of lead frame 100 is found to increase rapidly. Then, after 120 seconds from the start of measurement, the temperature of the lead frame converged to about 260 ℃ (see plot P3).
Next, the results of example 1 were confirmed. From graph G6a, it is first found that the temperature of leadframe 100 is about 25 ℃ (see plot P1). Next, after about 40 seconds from the start of the measurement, the lead frame 100 is conveyed to the heating unit (see plot P2). As a result, the temperature of lead frame 100 is found to increase rapidly. Then, after 120 seconds from the start of measurement, the temperature of the lead frame converged to about 260 ℃ (see plot P3).
That is, regardless of the presence or absence of fin 22, no intentional difference in convergence temperature of lead frame 100 is observed.
On the other hand, a difference appears until the convergence temperature is reached. For example, the period from the start of heating to 95% of the convergence temperature (260 ℃) is compared. First, in the case of the comparative example (graph G6b), it took about 48 seconds (87 seconds to 39 seconds) from the start of heating until 95% of the convergence temperature was reached (see plot P4). In the case of example 1 (graph G6a), it took about 28 seconds (71 seconds to 42 seconds) from the start of heating until 95% of the convergence temperature was reached (see plot P5). That is, by providing fin 22 and air supply hole 24, 20 seconds are successfully shortened. Therefore, it was confirmed that the time period required for preheating can be shortened by providing the fins 22 and the air supply holes 24.
[ modified examples ]
While the embodiments of the present invention have been described above, the present invention can be implemented in various forms without being limited to the embodiments.
For example, in the above embodiment, the wire bonding apparatus 1 is exemplified as the bonding apparatus. For example, the bonding device may also be a die bonding device. In this case, the bonding operation is not wire bonding but die bonding. The bonding portion may include a mechanism for transferring the semiconductor chip to the lead frame 100, a mechanism for disposing an adhesive on the semiconductor chip and/or the lead frame 100, or the like.
Description of the symbols
1: wire bonding device (bonding device)
2: feeder for lead frame
3: joining unit
4: control unit
6: base seat
7: joining tool
8: capillary tube
9: track
10: driving mechanism
11: preheater (heating unit, first heating unit)
12: hot plate
13: afterheater (heating unit, second heating unit)
14: plug-in heater (heating element, first heating element, second heating element)
16: heating block
16 a: major face
17: fixed surface of heater
18: upstream heat sink
19: downstream heat sink
21: connecting part
22: fin plate
23: trough
24: air supply hole
100: lead frame
D1: direction of conveyance
D2: in the opposite direction
D3: depth direction
K: imaginary plane
L1: gap
L3: depth of groove
A1: preheating zone
A2: joining area
A3: rear heating zone
Claims (11)
1. A joining device comprising: a bonding section for performing a bonding operation on the lead frame conveyed to the operation area; and
a lead frame feeder which conveys the lead frame to the operation area through a conveying part and preheats the lead frame before being conveyed to the operation area through a heating unit; and is
The heating unit has:
a heating element; and
a heating block disposed on an upstream side of the work area in a conveying direction of the lead frame so as to face a back surface of the lead frame, the heating block supplying heat received from the heating element to the lead frame;
the heating block is provided with a heat dissipation portion having a plurality of fins formed in a depth direction from a surface of the heating block.
2. The bonding device according to claim 1, wherein the plurality of fins are spaced apart from each other in a direction crossing a carrying direction of the lead frame.
3. The joining device according to claim 1 or 2, wherein a hole is provided in the heating block, the hole being provided between the fins and penetrating the depth direction.
4. The bonding apparatus according to any one of claims 1 to 3, wherein a length of the fin in the depth direction is longer than a distance from a front end of the fin to the lead frame in the depth direction.
5. The bonding apparatus according to any one of claims 1 to 4, further comprising a control portion that controls operations of the bonding portion and the lead frame feeder; and is
The control part is used for controlling the operation of the motor,
providing a control signal to the engaging portion for causing the engaging portion to perform an engaging operation during a first period,
providing a control signal for the lead frame feeder to cause the heating unit to perform preheating of the lead frame during a second period that is repeated with the first period,
the length of the second period is equal to or less than the length of the first period.
6. A lead frame feeder, comprising: a conveying part for conveying the lead frame to an operation area for performing bonding operation on the lead frame; and
a first heating unit preheating the lead frame before being conveyed to the operation area; and is
The first heating unit has:
a first heat generating body; and
a first heating block disposed to face the rear surface of the lead frame on an upstream side of the work area in a carrying direction of the lead frame, and configured to supply heat received from the first heat generator to the lead frame;
the first heating block is provided with a first heat dissipation part, and the first heat dissipation part is provided with a plurality of first fins formed from the surface of the first heating block towards the depth direction.
7. The lead frame feeder according to claim 6, further comprising a second heating unit for heating the lead frame conveyed from the work area after the bonding operation; and is
The second heating unit has:
a second heating element; and
a second heating block disposed on the lead frame downstream of the work area in the transfer direction of the lead frame and facing the rear surface of the lead frame, the second heating block supplying heat received from the second heating element to the lead frame;
the second heating block is provided with a second heat dissipation part, and the second heat dissipation part is provided with a plurality of second fins formed from the surface of the second heating block towards the depth direction.
8. A heating unit preheats a lead frame before the lead frame is conveyed to an operation area for bonding the lead frame; and comprises
A heating element; and
a heating block disposed on an upstream side of the work area in a conveying direction of the lead frame so as to face a back surface of the lead frame, the heating block supplying heat received from the heating element to the lead frame;
the heating block is provided with a heat dissipation portion having a plurality of fins formed in a depth direction from a surface of the heating block.
9. The heating unit of claim 8, wherein the plurality of fins are spaced apart from each other in a direction crossing a carrying direction of the lead frame.
10. The heating unit according to claim 8 or 9, wherein a hole is provided in the heating block, the hole being provided between the fins and penetrating the depth direction.
11. The heating unit as claimed in any one of claims 8 to 10, wherein a length of the fin in the depth direction is longer than a distance from a front end of the fin to the lead frame in the depth direction.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/009886 WO2021176739A1 (en) | 2020-03-06 | 2020-03-06 | Bonding device, frame feeder, and heater unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113785385A true CN113785385A (en) | 2021-12-10 |
Family
ID=77614184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080028931.6A Pending CN113785385A (en) | 2020-03-06 | 2020-03-06 | Bonding device, lead frame feeder and heating unit |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7216451B2 (en) |
| KR (1) | KR20210146410A (en) |
| CN (1) | CN113785385A (en) |
| SG (1) | SG11202111143PA (en) |
| WO (1) | WO2021176739A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019026916A1 (en) * | 2017-08-01 | 2019-02-07 | 株式会社新川 | Frame feeder |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241837A (en) * | 1988-03-24 | 1989-09-26 | Matsushita Electric Ind Co Ltd | Wire bonding apparatus |
| JPH0252334U (en) * | 1988-10-05 | 1990-04-16 | ||
| JPH06260526A (en) * | 1993-03-09 | 1994-09-16 | Sony Corp | Mechanism for heating lead frame |
| KR20000050301A (en) * | 1999-01-05 | 2000-08-05 | 윤종용 | Heater block for long loop wire bonding |
| WO2019026916A1 (en) * | 2017-08-01 | 2019-02-07 | 株式会社新川 | Frame feeder |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0646646B2 (en) | 1986-01-21 | 1994-06-15 | 日本電気株式会社 | Wire bonding equipment for semiconductor device assembly |
-
2020
- 2020-03-06 WO PCT/JP2020/009886 patent/WO2021176739A1/en active Application Filing
- 2020-03-06 JP JP2021549567A patent/JP7216451B2/en active Active
- 2020-03-06 CN CN202080028931.6A patent/CN113785385A/en active Pending
- 2020-03-06 SG SG11202111143PA patent/SG11202111143PA/en unknown
- 2020-03-06 KR KR1020217037044A patent/KR20210146410A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241837A (en) * | 1988-03-24 | 1989-09-26 | Matsushita Electric Ind Co Ltd | Wire bonding apparatus |
| JPH0252334U (en) * | 1988-10-05 | 1990-04-16 | ||
| JPH06260526A (en) * | 1993-03-09 | 1994-09-16 | Sony Corp | Mechanism for heating lead frame |
| KR20000050301A (en) * | 1999-01-05 | 2000-08-05 | 윤종용 | Heater block for long loop wire bonding |
| WO2019026916A1 (en) * | 2017-08-01 | 2019-02-07 | 株式会社新川 | Frame feeder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7216451B2 (en) | 2023-02-01 |
| WO2021176739A1 (en) | 2021-09-10 |
| SG11202111143PA (en) | 2021-11-29 |
| KR20210146410A (en) | 2021-12-03 |
| JPWO2021176739A1 (en) | 2021-09-10 |
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Application publication date: 20211210 |
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