JPH0252334U - - Google Patents

Info

Publication number
JPH0252334U
JPH0252334U JP13051488U JP13051488U JPH0252334U JP H0252334 U JPH0252334 U JP H0252334U JP 13051488 U JP13051488 U JP 13051488U JP 13051488 U JP13051488 U JP 13051488U JP H0252334 U JPH0252334 U JP H0252334U
Authority
JP
Japan
Prior art keywords
ceramic substrate
heat block
heating device
heating
ribs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13051488U
Other languages
Japanese (ja)
Other versions
JP2531024Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988130514U priority Critical patent/JP2531024Y2/en
Publication of JPH0252334U publication Critical patent/JPH0252334U/ja
Application granted granted Critical
Publication of JP2531024Y2 publication Critical patent/JP2531024Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図は本考案の実施例を示すものであつて、第１
図はボンデイング装置の平面図、第２図は加熱装
置の側面図、第３図はヒートブロツクの斜視図、
第４図は要部断面図である。 ２……セラミツク基板、３……予備加熱装置、
４……メイン加熱装置、５……アフター加熱装置
、１５，１７，２６……ヒートブロツク、１５ａ
，１７ａ，２６ａ……ヒータ、３１……リブ、３
２……吹出孔。 The figure shows an embodiment of the present invention.
The figure is a plan view of the bonding device, FIG. 2 is a side view of the heating device, and FIG. 3 is a perspective view of the heat block.
FIG. 4 is a sectional view of the main part. 2... Ceramic substrate, 3... Preheating device,
4... Main heating device, 5... After heating device, 15, 17, 26... Heat block, 15a
, 17a, 26a...heater, 31...rib, 3
2...Blowout hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 予備加熱装置と、メイン加熱装置と、アフター
加熱装置を並設し、これらの各加熱装置に、セラ
ミツク基板を載置して加熱するヒートブロツクを
設けて成るセラミツク基板の加熱装置において、
上記予備加熱装置とアフター加熱装置に設けられ
た上記ヒートブロツクの上面に、セラミツク基板
を支持する複数個のリブを突設するとともに、こ
のヒートブロツクの上面に、このヒートブロツク
の内部に送られて、このヒートブロツクに内蔵さ
れたヒータにより暖められた還元ガスの吹出孔を
形成したことを特徴とするセラミツク基板の共晶
加熱装置。 A heating device for a ceramic substrate in which a preheating device, a main heating device, and an after-heating device are installed in parallel, and each of these heating devices is provided with a heat block for placing and heating a ceramic substrate,
A plurality of ribs for supporting the ceramic substrate are protrudingly provided on the upper surface of the heat block provided in the preheating device and the afterheating device, and a plurality of ribs that support the ceramic substrate are provided on the upper surface of the heat block. A eutectic heating device for a ceramic substrate, characterized in that the heat block has a blowout hole for a reducing gas heated by a built-in heater.
JP1988130514U 1988-10-05 1988-10-05 Eutectic heating bonding equipment for ceramic substrates Expired - Lifetime JP2531024Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988130514U JP2531024Y2 (en) 1988-10-05 1988-10-05 Eutectic heating bonding equipment for ceramic substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988130514U JP2531024Y2 (en) 1988-10-05 1988-10-05 Eutectic heating bonding equipment for ceramic substrates

Publications (2)

Publication Number Publication Date
JPH0252334U true JPH0252334U (en) 1990-04-16
JP2531024Y2 JP2531024Y2 (en) 1997-04-02

Family

ID=31385749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988130514U Expired - Lifetime JP2531024Y2 (en) 1988-10-05 1988-10-05 Eutectic heating bonding equipment for ceramic substrates

Country Status (1)

Country Link
JP (1) JP2531024Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307353A (en) * 1994-05-11 1995-11-21 Matsushita Electric Ind Co Ltd Curing device
WO2019026916A1 (en) * 2017-08-01 2019-02-07 株式会社新川 Frame feeder
JP2019140205A (en) * 2018-02-08 2019-08-22 Tdk株式会社 Mounting apparatus and mounting method
JP2020115528A (en) * 2019-01-18 2020-07-30 株式会社新川 Bonding device, frame feeder, and heater unit
WO2021176739A1 (en) * 2020-03-06 2021-09-10 株式会社新川 Bonding device, frame feeder, and heater unit

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114739A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Heating table
JPS56108238A (en) * 1980-01-31 1981-08-27 Toshiba Corp Assembling apparatus for semiconductor
JPS59208734A (en) * 1983-05-13 1984-11-27 Hitachi Ltd Pellet bonding apparatus
JPS605125U (en) * 1983-05-31 1985-01-14 ロ−ム株式会社 Heater block for semiconductor device assembly
JPS60167336A (en) * 1984-02-10 1985-08-30 Hitachi Ltd Heating device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114739A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Heating table
JPS56108238A (en) * 1980-01-31 1981-08-27 Toshiba Corp Assembling apparatus for semiconductor
JPS59208734A (en) * 1983-05-13 1984-11-27 Hitachi Ltd Pellet bonding apparatus
JPS605125U (en) * 1983-05-31 1985-01-14 ロ−ム株式会社 Heater block for semiconductor device assembly
JPS60167336A (en) * 1984-02-10 1985-08-30 Hitachi Ltd Heating device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307353A (en) * 1994-05-11 1995-11-21 Matsushita Electric Ind Co Ltd Curing device
WO2019026916A1 (en) * 2017-08-01 2019-02-07 株式会社新川 Frame feeder
JPWO2019026916A1 (en) * 2017-08-01 2020-04-09 株式会社新川 Frame feeder
CN111108584A (en) * 2017-08-01 2020-05-05 株式会社新川 Frame feeder
JP2019140205A (en) * 2018-02-08 2019-08-22 Tdk株式会社 Mounting apparatus and mounting method
JP2020115528A (en) * 2019-01-18 2020-07-30 株式会社新川 Bonding device, frame feeder, and heater unit
WO2021176739A1 (en) * 2020-03-06 2021-09-10 株式会社新川 Bonding device, frame feeder, and heater unit
JPWO2021176739A1 (en) * 2020-03-06 2021-09-10
CN113785385A (en) * 2020-03-06 2021-12-10 株式会社新川 Bonding device, lead frame feeder and heating unit

Also Published As

Publication number Publication date
JP2531024Y2 (en) 1997-04-02

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