JP2019140205A - Mounting apparatus and mounting method - Google Patents

Abstract

To provide a mounting apparatus and a mounting method capable of locally cleaning a mounting area by a simple mechanism and preventing a bonding failure between a workpiece and a substrate.SOLUTION: A mounting apparatus 10 for mounting a workpiece 2 on a substrate 1 includes: a stage 20 that supports the substrate; a cover member 30 installed at a predetermined interval from the stage and the substrate on the upper part facing the stage; and a mounting nozzle 40a that mounts the workpiece on the substrate arranged on the stage, in which the stage is provided so as to surround at least a part of the substrate arranged on the stage, and includes a stage-side gas discharge hole 31 that discharges clean gas toward the cover member.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mounting apparatus and a mounting method for mounting a workpiece (electronic component or the like) on a substrate, and more specifically, a mounting apparatus and a mounting method capable of preventing oxidation or the like at the joint surface between the workpiece and the substrate. About.

  When a workpiece is mounted on a substrate, if the workpiece and the substrate are bonded to each other while being exposed to the atmosphere, the bonded surface is oxidized and mixed with dust, which causes problems such as bonding failure.

  In view of this, a technique has been proposed in which when the workpiece is mounted, the periphery of the mounting area is cleaned to prevent the joining surface from being oxidized and dust mixed therein.

  As a method for cleaning the periphery of the mounting region, for example, Patent Document 1 discloses a technique in which a mounting device is covered with a frame member and a high cleanliness maintaining unit is provided. Patent Document 2 discloses a technique for providing a cover portion that surrounds a stage that supports a substrate, and flowing clean gas from the cover portion toward the mounting region.

JP 2006-80131 A Special table 2013-506311 gazette

  In the mounting apparatus according to Patent Document 1, since the high cleanliness maintaining unit is configured in a wide area, it takes time for cleaning and a large-scale facility is required to maintain the high cleanliness. .

  In the mounting apparatus according to Patent Document 2, since it is necessary to generate a uniform gas flow for a large number of dies on the target wafer, strict gas flow control in the mounting region is required. Further, as in Patent Document 2, in a mounting apparatus in which a clean gas flow circulates along the target wafer mounting surface, the temperature of the target wafer mounting surface is lowered by the clean gas flow. In the case of performing soldering, the solder is not sufficiently melted, and there is a risk of causing poor bonding.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a mounting apparatus and a mounting method capable of locally cleaning a mounting region by a simple mechanism and preventing a bonding failure between a workpiece and a substrate. And

  In order to solve the above-described problems, the present invention provides a stage that supports a substrate, a cover member that is installed on the upper part that faces the stage, with a predetermined interval from the stage and the substrate, and is disposed on the stage. A mounting nozzle for mounting the workpiece on the substrate, and the stage is provided so as to surround at least a part of the substrate disposed on the stage, and is supplied with clean gas toward the cover member. Provided is a mounting apparatus including a stage-side gas discharge hole for discharging.

  In the mounting apparatus according to the present invention, the clean gas released from the stage side gas discharge hole is discharged first from the first air stream flowing along the mounting surface of the substrate disposed on the stage and from the side opening. Since the two air flows are formed, the mounting area can be highly purified while preventing air from entering from the outside of the mounting apparatus. Further, in the mounting apparatus according to the present invention, the clean gas supplied to the stage-side gas discharge hole is heated through the stage when passing through the inside of the stage, so that the clean gas flows along the mounting surface of the substrate. It is possible to prevent a temperature drop of the mounting surface that occurs when flowing. Therefore, the mounting apparatus according to the present invention can reliably bond the workpiece and the substrate.

  The cover member is provided with an opening through which the mounting nozzle mounts the workpiece on the substrate, and at least a pair of covers that are provided on both sides of the opening and discharge clean gas toward the stage. A side gas discharge hole may be provided.

  Since the cover member has the opening, a first air stream of clean gas discharged from the opening to the outside after flowing along the mounting surface of the substrate and a second air stream discharged to the outside from the side opening are formed. Therefore, the mounting area can be efficiently cleaned. Further, since the cover member has the cover-side gas discharge hole, the first air flow can be more strongly and effectively formed, so that the mounting region can be more highly purified.

  Further, for example, the opening may be provided at substantially the center of the pair of cover-side gas discharge holes in a plan view.

  By providing the opening substantially at the center of the pair of cover-side gas discharge holes, the first air flow can be appropriately formed, and the mounting area can be cleaned to a higher degree.

  Further, for example, the pair of cover-side gas discharge holes may be provided between the opening and the stage-side gas discharge hole in a plan view.

  By providing the pair of cover-side gas discharge holes between the opening and the stage-side gas discharge hole in a plan view, it is possible to effectively form the first air flow and to clean the mounting area more highly.

  Further, for example, the stage side gas discharge hole may be provided between the pair of cover side gas discharge holes in a plan view.

  Even when the stage-side gas discharge hole is provided between the pair of cover-side gas discharge holes in plan view, after flowing along the mounting surface of the substrate, the first flow of clean gas discharged from the opening to the outside Since the second air flow discharged to the outside from the side opening is formed, the mounting area can be cleaned. In addition, since the first air flow can be formed at a position close to the mounting area, the mounting area can be more locally cleaned. Furthermore, since the heated clean gas can be discharged from a position close to the mounting region, it is possible to more effectively prevent the temperature of the mounting surface from decreasing.

  Further, for example, a heat source for heating the clean gas may be provided in a flow path in which the clean gas is supplied to the cover-side gas discharge hole.

  By having a heat source for heating the clean gas in the flow path through which the clean gas is supplied to the cover side gas discharge hole, the temperature of the stage and the substrate is lowered at the time of bonding by the clean gas released from the cover side gas discharge hole. Since it can prevent, a workpiece | work and a board | substrate can be joined more reliably.

  Further, for example, a heat source for heating the clean gas may be provided in a flow path in which the clean gas is supplied to the stage-side gas discharge hole.

  By having a heat source for heating the clean gas in the flow path through which the clean gas is supplied to the stage side gas discharge hole, the temperature of the stage and the substrate is lowered at the time of bonding by the clean gas released from the stage side gas discharge hole. Since it can prevent, a workpiece | work and a board | substrate can be joined more reliably.

  For example, the mounting nozzle may include a heater for joining the workpiece and the substrate.

  When the mounting nozzle includes a heater for mounting the workpiece on the substrate, the workpiece and the substrate can be more reliably bonded by melting the bonding agent printed on the mounting surface of the substrate at the time of mounting.

  Further, for example, the stage may be movable in XY directions parallel to the upper surface of the stage.

  Since the stage can be moved in the XY direction parallel to the upper surface of the stage, a mechanism for driving the mounting nozzle in the XY direction is not required, so that the apparatus configuration can be simplified.

  Further, according to the present invention, a predetermined interval is provided between the stage and the substrate at an upper portion facing the stage from a stage-side gas discharge hole provided so as to surround at least a part of the substrate disposed on the stage. There is provided a mounting method comprising a step of discharging a clean gas toward the cover member that is installed, and a step of mounting the workpiece on the substrate disposed on the stage.

  In the mounting method according to the present invention, the clean gas released from the stage-side gas discharge hole is a first airflow that flows along the mounting surface of the substrate disposed on the stage, and the first gas that is discharged to the outside from the side opening. Since the two airflows are formed, the mounting area can be highly purified while preventing intrusion of air from the outside. Further, in the mounting method according to the present invention, the clean gas supplied to the stage side gas discharge hole is heated through the stage when passing through the inside of the stage, so that the clean gas flows along the mounting surface of the substrate. It is possible to prevent a temperature drop of the mounting surface that occurs when flowing. Therefore, the mounting method according to the present invention can reliably join the workpiece and the substrate.

  A step of releasing clean gas from at least a pair of cover-side gas discharge holes provided on both sides of the opening provided in the cover member toward the stage; and mounting the work on the substrate through the opening And a step of performing.

  The above process forms a first air stream of clean gas that flows along the mounting surface of the substrate and then discharges from the opening to the outside, and a second air stream that discharges from the side opening to the outside. Can be efficiently cleaned. Further, since the clean gas is discharged from the cover-side gas discharge hole, the first airflow can be more strongly and effectively formed, so that the mounting region can be more highly purified.

  Further, it may include a step of discharging clean gas toward the stage from the pair of cover side gas discharge holes provided between the opening and the stage side gas discharge hole in plan view.

  The pair of cover-side gas discharge holes effectively releases the first air flow by discharging clean gas from the pair of cover-side gas discharge holes provided between the opening and the stage-side gas discharge hole in plan view. The mounting area can be cleaned to a higher degree.

  Further, it may include a step of releasing clean gas from the stage side gas discharge hole provided between the pair of cover side gas discharge holes in plan view toward the cover member.

  Also in the case of discharging clean gas from the stage side gas discharge hole provided between the pair of cover side gas discharge holes in the plan view toward the cover member, after flowing along the mounting surface of the substrate, the opening is exposed to the outside. Since the first air stream of the released clean gas and the second air stream released from the side openings are formed, the mounting area can be cleaned. In addition, since the first air flow can be formed at a position close to the mounting area, the mounting area can be more locally cleaned. Furthermore, since the heated clean gas can be discharged from a position close to the mounting region, it is possible to more effectively prevent the temperature of the mounting surface from decreasing.

  The work may be mounted by eutectic bonding.

  Since the work is mounted by eutectic bonding, the substrate and the work can be bonded better.

  Moreover, the process of heating the clean gas discharge | released from the said cover side gas discharge hole may be included.

  By heating the clean gas released from the cover-side gas discharge hole, the clean gas released from the cover-side gas discharge hole can prevent the temperature of the stage and the substrate from being lowered during bonding. Can be joined.

  Moreover, the process of heating the clean gas discharge | released from the said stage side gas discharge hole may be included.

  By heating the clean gas released from the stage-side gas discharge hole, the clean gas released from the stage-side gas discharge hole can prevent the temperature of the stage and the substrate from being lowered during bonding. Can be joined.

FIG. 1 is a schematic view of a mounting apparatus according to the first embodiment of the present invention. FIG. 2 is a schematic view of a mounting apparatus according to the second embodiment of the present invention.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings.

  FIG. 1 is a schematic view showing a mounting apparatus 10 according to the first embodiment of the present invention. In FIG. 1, the left-right direction toward the mounting apparatus 10 is the X axis, the front-rear direction is the Y-axis, and the up-down direction is the Z-axis.

  The mounting apparatus 10 is an apparatus that performs processing for mounting the workpiece 2 on the substrate 1. As illustrated in FIG. 1, the mounting apparatus 10 includes a stage 20, a cover member 30, and a mounting head 40.

  The stage 20 is a support base that supports the substrate 1 on which the workpiece 2 is mounted in the Z-axis direction. The stage 20 has a substantially rectangular parallelepiped shape, and the upper surface 20a of the stage 20 that is the support surface of the substrate 1 is a horizontal plane. One or a plurality of vacuum suction holes (not shown) are formed on the upper surface 20a of the stage 20, and the substrate 1 is held horizontally by the vacuum suction holes sucking the substrate 1 when the workpiece 2 is mounted. Is done. The stage 20 is connected to a moving mechanism (not shown) that can move the stage 20 in the XY direction parallel to the mounting surface 1a of the substrate 1, and the mounting position of the workpiece 2 is passed through the moving mechanism. Adjustment and replacement of the substrate 1 on which the workpiece 2 is mounted is performed. Further, the stage 20 includes a heater (not shown). The stage 20 heated by the heater is transmitted to the mounting surface 1a of the substrate 1, and the bonding agent printed on the mounting surface 1a of the substrate 1 is transferred. The workpiece 2 is joined by melting. The method for joining the workpieces 2 is not particularly limited, but is preferably performed by eutectic bonding using a solder such as Au—Sn.

  The cover member 30 is a plate-like member that is installed at a predetermined interval from the stage 20 and the substrate 1 in an upper portion facing the stage 20. The cover member 30 includes an opening 32 through which the mounting nozzle 40 a passes when mounting the workpiece 2 on the substrate 1.

  The mounting head 40 functions as mounting means for mounting the workpiece 2 at a predetermined position on the mounting surface 1 a of the substrate 1 disposed on the stage 20. A mounting nozzle 40 a that sucks and holds the workpiece 2 is provided in a lower portion of the mounting head 40 facing the stage 20 so that the mounting head 40 can expand and contract in the Z-axis direction perpendicular to the XY plane. . The mounting head 40 is connected to a lifting mechanism (not shown) that can lift the mounting head 40 in the Z-axis direction, and the mounting head 40 is moved to a predetermined position with respect to the substrate 1 on the stage 20 via the lifting mechanism. After being lowered, the work 2 is mounted by extending the mounting nozzle 40a to the mounting position of the board mounting surface 1a. When the mounting of the workpiece 2 is completed, the mounting head 40 is raised and separated from the board mounting surface 1a. The mounting nozzle 40 a includes a heater 41 that heats the workpiece 2. The heat of the workpiece 2 heated by the heater 41 is transmitted to the mounting surface 1 a of the substrate 1 and printed on the mounting surface 1 a of the substrate 1. The workpiece 2 can be joined by melting the joining agent.

  The stage 20 is provided so as to surround at least a part of the substrate 1 disposed on the upper surface 20 a of the stage 20, and includes one or a plurality of stage-side gas discharge holes 21 that discharge clean gas toward the cover member 30. . For example, nitrogen gas is preferably used as the clean gas discharged from the stage-side gas discharge hole 21, and the supply source and the stage-side gas are supplied from a clean gas supply source (not shown) provided outside the stage 20. The gas is supplied to the stage side gas discharge hole 21 through the flow path 23 connecting the discharge hole 21. At least a part of the flow path 23 connected to the stage side gas discharge hole 21 is provided so as to penetrate the inside of the stage 20 vertically (Z-axis direction). In addition, a heat source 24 for heating the clean gas is provided in the flow path 23 below the stage 20, and the heated clean gas can be supplied to the stage-side gas discharge hole 21 through the heat source 24.

  The cover member 30 includes at least a pair of cover-side gas discharge holes 31 that are provided on both sides of the opening 32 and discharge clean gas toward the stage 20. For example, nitrogen gas is preferably used as the clean gas discharged from the cover-side gas discharge hole 31, and the supply source and the cover side are supplied from a clean gas supply source (not shown) provided outside the cover member 30. The gas is supplied to the cover-side gas discharge hole 31 through a flow path 33 that connects the gas discharge hole 31. A heat source 34 for heating the clean gas is provided in the flow path 33, and the heated clean gas can be supplied to the cover-side gas discharge hole 31 through the heat source 34.

  The clean gas released from the stage-side gas discharge hole 21 and the cover-side gas discharge hole 31 into the gap 25 between the upper surface 20a of the stage 20 and the lower surface 30a of the cover member 30 opens along the mounting surface 1a of the substrate 1. After flowing in the direction 32, the air flows toward the first air flow F <b> 1 that is discharged to the outside from the opening 32 and the side opening 22 formed at the side end of the gap 25, and then is discharged to the outside from the side opening 22. The second air flow F2 is formed. The first air flow F1 pumps oxidizing gas, dust, and the like present in the gap 25 and discharges them outside from the opening 32, and prevents outside air from entering the mounting area through the opening 32. In addition, the second air flow F <b> 2 pumps oxidizing gas, dust, and the like present in the gap 25 and discharges them to the outside from the side opening 22, and prevents outside air from entering the mounting area through the side opening 22. . In other words, the mounting apparatus 10 forms the first air flow F1 and the second air flow F2 via the stage side gas discharge hole 21 and the cover side gas discharge hole 31 to highly clean the mounting area while preventing the intrusion of outside air. Can be

  Further, unlike the frame material of Patent Document 1 and the cover part of Patent Document 2, the mounting apparatus 10 does not require a cover member that surrounds the mounting apparatus or the stage, so the mounting area is locally cleaned with a simple structure. can do.

  Furthermore, in the mounting apparatus 10, the clean gas supplied to the stage-side gas discharge hole 21 through the flow path 23 is heated through the stage 20 heated by the heater when passing through the inside of the stage 20. Temperature reduction of the mounting surface 1a and the stage upper surface 20a that occurs when the clean gas flows through the gap 25 along the mounting surface 1a of the substrate 1 and the upper surface 20a of the stage 20 can be prevented. Therefore, the mounting apparatus 10 can reliably bond the workpiece 2 and the substrate 1 and prevent a bonding failure between the workpiece 2 and the substrate 1.

  Although the mounting apparatus 10 according to the present invention can clean the mounting area only with the stage-side gas discharge hole 21, it has the cover-side gas discharge hole 31 in addition to the stage-side gas discharge hole 21. Thus, since the first air flow F1 can be more strongly and effectively formed, the mounting area can be more highly purified.

  The position of the pair of cover-side gas discharge holes 31 shown in FIG. 1 is not particularly limited, but is a plan view (Z-axis direction) from the viewpoint of effectively forming the first air flow F1 and realizing more advanced cleaning. It is preferable to provide between the opening 32 and the stage side gas discharge hole 21 in FIG. Also, the position of the opening 32 is not particularly limited, but is provided at substantially the center of the pair of cover-side gas discharge holes 31 in a plan view from the viewpoint of appropriately forming the first air flow F1 and realizing higher level cleaning. It is preferred that

  The length L1 in the width direction between the cover-side gas discharge holes 31 shown in FIG. 1, the length L2 in the width direction between the stage-side gas discharge holes 21, and the length L3 in the width direction of the opening 32 are not particularly limited. For example, when the length of the substrate 1 in the width direction is 50 mm, L1 can be 30 to 40 mm, L2 can be 85 mm, and L3 can be 26 mm.

  The first embodiment of the mounting apparatus according to the present invention has been described above, but the present invention is not limited to this, and various modifications can be made without departing from the spirit of the present invention.

  FIG. 2 is a schematic view showing a mounting apparatus 100 according to the second embodiment of the present invention. The mounting apparatus 100 is the same as the mounting apparatus 10 according to the first embodiment except that the stage-side gas discharge hole 121 is provided between the pair of cover-side gas discharge holes 131 in a plan view.

  In the mounting apparatus 100, the clean gas released into the gap 125 between the upper surface 120 a of the stage 120 and the lower surface 130 a of the cover member 130 from the stage side gas discharge hole 121 and the cover side gas discharge hole 131 is mounted on the substrate 1. After flowing in the direction of the opening 132 along 1a, the first air flow F1 discharged to the outside from the opening 132 and the side opening 122 formed at the side end of the gap 125 are flown toward the side opening 122. And a second air flow F2 discharged to the outside. Therefore, as with the mounting device 10, the mounting device 100 can clean the mounting region while preventing intrusion of outside air.

  In the mounting apparatus 100, the stage-side gas discharge hole 121 is provided between the pair of cover-side gas discharge holes 131 in a plan view (Z-axis direction). Thus, the stage-side gas discharge hole 121 is located closer to the mounting area. That is, in the mounting apparatus 100, since the first air flow F1 can be formed at a position closer to the mounting area, it is possible to clean the mounting area more locally.

  Further, in the mounting apparatus 100, similarly to the mounting apparatus 10, it is possible to prevent the temperature of the mounting surface 1 a from being lowered by releasing the heated clean gas from the stage-side gas discharge hole 121 through the stage 120. In the mounting apparatus 100, since the heated clean gas can be released from a position closer to the mounting area, it is possible to more effectively prevent the temperature reduction of the mounting surface 1a.

  The above-described embodiments are merely examples of the embodiments included in the present invention, and do not limit the present invention. For example, in the above-described embodiment, the mounting nozzle 40a has the heater 41 that heats the workpiece 2. However, when the workpiece 2 can be joined by the heaters of the stages 20 and 120, the heater 41 is It is not always necessary. In the above-described embodiment, the heat sources 24 and 124 for heating the clean gas are provided in the flow paths 23 and 123 for supplying the clean gas to the stage-side gas discharge holes 21 and 121. When the workpiece 2 can be joined by the heater, the heat sources 24 and 124 are not necessarily provided. Similarly, the heat sources 34 and 134 provided in the flow paths 33 and 133 that supply the clean gas to the cover-side gas discharge holes 31 and 131 are not necessarily provided.

1: substrate 1a: mounting surface 2: workpiece 10, 100: mounting apparatus 20, 120: stage 20a, 120a: stage upper surface 21, 121: stage side gas discharge hole 22, 122: side opening 23, 123: flow path 24 , 124: heat source 25, 125: gap 30, 130: cover member 30a, 130a: cover member lower surface 31, 131: cover side gas discharge hole 32, 132: opening 33, 133: flow path 34, 134: heat source 40: mounting Head 40a: Mounting nozzle 41: Heater F1: First air flow F2: Second air flow L1: Length in width direction between cover side gas discharge holes L2: Length in width direction between stage side gas discharge holes L3: Width direction of opening length

Claims (16)

A mounting device for mounting a workpiece on a substrate,
A stage for supporting the substrate;
A cover member installed at a predetermined interval from the stage and the substrate on the upper part facing the stage;
A mounting nozzle for mounting the work on the substrate disposed on the stage;
The stage is provided with a stage-side gas discharge hole that is provided so as to surround at least a part of the substrate disposed on the stage and discharges a clean gas toward the cover member.   The cover member is provided with an opening through which the mounting nozzle mounts the workpiece on the substrate, and at least a pair of cover side gases that are provided on both sides of the opening and release clean gas toward the stage. The mounting apparatus according to claim 1, further comprising a discharge hole.   The mounting apparatus according to claim 2, wherein the opening is provided at substantially the center of the pair of cover-side gas discharge holes in a plan view.   The mounting apparatus according to claim 2, wherein the pair of cover-side gas discharge holes are provided between the opening and the stage-side gas discharge hole in a plan view.   The mounting device according to claim 2, wherein the stage side gas discharge hole is provided between the pair of cover side gas discharge holes in a plan view.   The mounting apparatus according to claim 2, further comprising: a heat source that heats the clean gas in a flow path in which the clean gas is supplied to the cover-side gas discharge hole.   The mounting apparatus according to claim 1, further comprising: a heat source that heats the clean gas in a flow path in which the clean gas is supplied to the stage-side gas discharge hole.   The mounting apparatus according to claim 1, wherein the mounting nozzle includes a heater for joining the workpiece and the substrate.   The mounting apparatus according to claim 1, wherein the stage is movable in an XY direction parallel to an upper surface of the stage. A mounting method for mounting a workpiece on a substrate supported by a stage,
From the stage-side gas discharge hole provided so as to surround at least a part of the substrate disposed on the stage, the stage and the substrate are disposed at a predetermined interval on the upper part facing the stage. Releasing a clean gas toward the cover member;
And a step of mounting the workpiece on the substrate disposed on the stage. Further including a step of discharging clean gas from at least a pair of cover-side gas discharge holes provided on both sides of an opening provided in the cover member toward the stage;
The mounting method according to claim 10, wherein the step of mounting the workpiece includes a step of mounting the workpiece on the substrate through the opening.   In the step of discharging the clean gas toward the stage, the clean gas is discharged toward the stage from the pair of cover-side gas discharge holes provided between the opening and the stage-side gas discharge hole in plan view. The mounting method according to claim 11, wherein:   In the step of discharging the clean gas toward the cover member, the clean gas is discharged toward the cover member from the stage side gas discharge hole provided between the pair of cover side gas discharge holes in a plan view. The mounting method according to claim 11.   The mounting method according to claim 10, wherein the work is mounted by eutectic bonding.   The mounting method according to claim 10, further comprising a step of heating the clean gas released from the cover-side gas discharge hole.   The mounting method according to claim 10, further comprising a step of heating the clean gas discharged from the stage side gas discharge hole.

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