TWI788622B - Splicing Sets, Lead Frame Feeders, and Heating Units - Google Patents

Abstract

The object of the present invention is to improve productivity. The wire bonding device 1 of the present invention includes: a bonding tool 7 for performing wire bonding on the lead frame 100; heating. The preheater 11 has: a cartridge heater 14; and a heating block 16 arranged on the upstream side of the bonding area A2 in the conveyance direction D1 of the lead frame 100, and supplies heat received from the cartridge heater 14 to Give lead frame 100. A plurality of fins 22 extending in the facing direction D2 are provided on the heating block 16 .

Description

Splicing Sets, Lead Frame Feeders, and Heating Units

The present invention relates to a bonding device, a frame feeder and a heater unit.

The so-called die bonding is an operation for bonding semiconductor dies to a lead frame. In addition, the so-called wire bonding is an operation of bonding a bonding wire to a semiconductor die. When performing the bonding work as described above, the lead frame is heated to a predetermined temperature higher than room temperature. If the lead frame is heated in the area where the bonding operation is performed, the lead frame stays in the area where the bonding operation is performed only for the time that is the sum of the time for heating and the time for bonding.

For example, the semiconductor assembly device of Patent Document 1 includes a region where lead frames are preheated and a region where wire bonding is performed. According to such an apparatus, the time for preheating and the time for wire bonding can be overlapped. As a result, the working efficiency of the joining operation can be improved.

[Prior art literature]

[Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 62-169340

In recent years, it has been desired to further improve the productivity of a bonding apparatus that performs bonding work. Therefore, an object of the present invention is to provide a bonding device, a lead frame feeder, and a heating unit capable of improving productivity.

A splicing device according to an aspect of the present invention includes: a splicing unit for splicing a lead frame transported to the work area; and a lead frame feeder for transporting the lead frame to the work area through the transport unit, and The lead frame is preheated before being transported to the work area; and the heating unit has: a heating element; The back side of the frame is arranged in an opposite manner, and the heat received from the heating body is provided to the lead frame; a heat dissipation part is provided on the heating block, and the heat dissipation part has a plurality of fins (fins) formed from the surface of the heating block toward the depth direction. ).

In the joining device, the joining work performed by the joining section is performed in the working area. On the upstream side of the working area, a heating unit is arranged, and the heating unit preheats the lead frame before being transported to the working area. Therefore, the area where preheating is performed before the joining operation and the area where the joining operation is performed can be made different from each other. Furthermore, the heating block included in the heating unit has a plurality of fins (fins) extending in the depth direction. With multiple fins, heat is efficiently transferred from the heating block to the lead frame, so the time required for preheating can be shortened. As a result, productivity can be improved.

The plurality of fins may be spaced apart from each other in a direction intersecting with the conveyance direction of the lead frame. According to the above configuration, the back surface of the lead frame can be protected.

Holes may be provided in the heating block, and the holes are provided between the fins and penetrate through the depth direction. The transfer of heat from the heating block to the leadframe depends on the convection of air from the heating block towards the leadframe. By providing the holes, air for transferring heat is preferably supplied toward the fins, so heat is transferred more efficiently from the heating block toward the lead frame. As a result, productivity can be further improved.

The length of the fin in the depth direction may be longer than the distance from the front end of the fin to the lead frame in the depth direction. According to the above configuration, the air heated by the fins can be preferably supplied to the back surface of the lead frame.

The splicing device may further include a control part, the control part controls the operation of the splicing part and the lead frame feeder, the control part provides a first control signal to the splicing part during the first period to make the splicing part carry out the splicing operation, and In a second period repeated from the first period, a second control signal for causing the heating unit to preheat the lead frame is supplied to the lead frame feeder, and the length of the second period is equal to or less than the length of the first period. According to the control, the subsequent preheating of the lead frame is completed during the bonding operation. Therefore, after the bonding operation is completed, the preheated lead frame can be carried in in parallel with the lead frame being carried out from the work area. That is, there is no need to set a standby time for the joining work for preheating. As a result, productivity can be further improved.

Another aspect of the present invention, that is, the lead frame feeder includes: a transfer unit that transfers the lead frame to the work area where the lead frame is bonded; and a first heating unit that pre-heats the lead frame before being transferred to the work area. heating; and the first heating unit has: a first heat generating body; and a first heating block arranged in a way that is closer to the upstream side than the working area in the conveying direction of the lead frame and faces the back side of the lead frame and provide the heat received from the first heating body to the lead frame; a first heat dissipation part is provided on the first heating block, and the first heat dissipation part has a plurality of holes formed from the surface of the first heating block toward the depth direction first fin.

The heating block of the heating unit of the lead frame feeder has a plurality of fins extending in the depth direction. With multiple fins, heat is efficiently transferred from the heating block to the lead frame, so the time required for preheating can be shortened. As a result, productivity can be improved.

The lead frame feeder may further include a second heating unit for heating the lead frame transported from the working area after the bonding work is performed, and the second heating unit has: a second heating element ; and the second heating block is disposed on the downstream side of the work area in the conveying direction of the lead frame, and is arranged in a manner facing the back of the lead frame, and provides heat received from the second heating element to the lead frame; A second heat dissipation portion is provided on the second heating block, and the second heat dissipation portion has a plurality of second fins formed from the surface of the second heating block toward the depth direction. According to the above configuration, rapid cooling of the lead frame on which the bonding work has been performed is suppressed. Therefore, the result obtained by the bonding operation can be protected.

A heating unit according to still another aspect of the present invention preheats the lead frame before it is transported to the work area where the lead frame is bonded, and includes: a heating element; The area is closer to the upstream side, and is arranged in a way facing the back of the lead frame, and provides the heat received from the heating element to the lead frame; a heat dissipation part is provided on the heating block, and the heat dissipation part has a direction from the surface of the heating block toward the lead frame. A plurality of fins formed in the depth direction.

The heating block of the heating unit has a plurality of fins extending in the depth direction. With multiple fins, heat is efficiently transferred from the heating block to the lead frame, so the time required for preheating can be shortened. As a result, productivity can be improved. Also, the plurality of fins may be spaced apart from each other along a direction intersecting with the conveyance direction of the lead frame. In addition, holes may be provided in the heating block, and the holes are provided between the fins and penetrate through the depth direction. Furthermore, the length of the fin in the depth direction may be longer than the distance from the front end of the fin to the lead frame in the depth direction.

According to the bonding device, the lead frame feeder, and the heating unit of the present invention, productivity can be improved.

1: Wire bonding device (bonding device)

2: Lead frame feeder

3: Joining unit (Joint part)

4: Control unit (control unit)

6: base

7: Joining tool

8: Capillary

9: Track (conveying department)

10: Driving mechanism

11: Preheater (heating unit, first heating unit)

12: Heating plate

13: Afterheater (heating unit, second heating unit)

14: Plug-in heater (heating body, first heating body, second heating body)

16: heating block (first heating block)

16a: main surface

17: Heater fixing surface

18:Upstream cooling unit

19: Downstream radiator

21: Connection Department

22: Fins (first fin, second fin)

22a: Front end face of the fin

23: Slot

23a: Bottom surface of groove

24: Air supply hole

24a: Opening of the air supply hole

24b: Opening on the opposite side of the air supply hole

100: lead frame

100a: the back of the lead frame

A1: Preheating area

A2: Joining area (working area)

A3: rear heating area

D1: Transport direction

D2: opposite direction

D3: Depth direction

L1: Gap

G6a, G6b: graphics

K: imaginary surface

L3: Depth of slot

P1~P5: Plotting

S1~S9, S11~S13: steps

FIG. 1 is a perspective view showing a wire bonding apparatus according to an embodiment.

(a) and (b) of FIG. 2 are diagrams showing the positional relationship between a preheater (preheater), a heating plate (heat plate), an afterheater (after-heater) and a lead frame.

Fig. 3 is a perspective view showing a heating unit.

Fig. 4 is a perspective view showing a section of a heating unit.

FIG. 5 is a flow chart illustrating the operation of the wire bonding apparatus.

6 is a graph showing the heating performance of the heating unit of the comparative example and the heating performance of the heating unit of the example.

Hereinafter, embodiments for implementing the present invention will be described in detail with reference to the accompanying drawings. Explain in detail. In the description of the drawings, the same symbols are assigned to the same components, and overlapping descriptions are omitted.

[Wire bonding device]

The wire bonding apparatus 1 (bonding apparatus) shown in FIG. 1 electrically connects electrodes of a lead frame 100 and electrodes of a semiconductor element die-bonded to the lead frame 100 using, for example, thin metal bonding wires. The wire bonding device 1 applies heat, ultrasonic waves, or pressure to the wire to connect the wire to the electrode. The wire bonding apparatus 1 has a lead frame feeder 2 , a bonding unit 3 (bonding unit), and a control unit 4 (control unit). The lead frame feeder 2 , the bonding unit 3 and the control unit 4 are disposed on a base 6 .

In addition, in the following description, the term of conveyance direction D1, facing direction D2, and depth direction D3 may be used. The transport direction D1 is the direction in which the lead frame 100 is transported by the lead frame feeder 2 . The facing direction D2 is a direction from the main surface 11 a of the preheater 11 described later to the rear surface 100 a of the lead frame 100 . Furthermore, the facing direction D2 can be said to be parallel to the moving direction of the capillary 8 of the bonding unit 3 . Furthermore, the facing direction D2 is also the depth direction of the heating block 16 . The depth direction D3 is a direction orthogonal to the conveyance direction D1 and the facing direction D2, respectively.

The lead frame feeder 2 conveys the lead frame 100 which is a part to be processed. In addition, the lead frame feeder 2 heats the lead frame 100 in order to control the temperature of the lead frame 100 . Details of the lead frame feeder 2 will be described later. The bonding unit 3 includes a bonding tool 7 and a capillary 8 . At the front end of the bonding tool 7, a capillary 8 is detachably provided. Capillary 8 provides heat, ultrasonic wave or pressure to wire bonding. The control unit 4 controls the overall operation of the wire bonding device 1 including the operations of the lead frame feeder 2 and the bonding unit 3 .

The control unit 4 provides several control signals to the bonding unit 3 and the lead frame feeder 2 . For example, the control signal includes a signal for controlling the conveyance of the lead frame 100 of the lead frame feeder 2 and a signal for controlling heating of the lead frame 100 of the lead frame feeder 2 . Moreover, the control signal may also include a signal for controlling the position of the capillary 8 relative to the lead frame 100 , and a signal for starting and stopping the supply of heat, ultrasound or pressure.

[Lead frame feeder]

The lead frame feeder 2 has: a rail (rail) 9 (conveyor), a preheater 11 (heating unit, first heating unit), a heating plate (heat plate) 12, and an afterheater 13 (second heating unit). ).

The rail 9 is a pair of members extended in the conveyance direction D1, and is mutually spaced apart and arrange|positioned in the direction orthogonal to conveyance direction D1. The track 9 takes out the lead frame 100 from the magazine that accommodates the unprocessed lead frame 100 . The rail 9 moves the lead frame 100 along the conveyance direction D1. During the conveyance, the rails 9 hold the position of the lead frame 100 above the preheater 11 , the heating plate 12 , and the afterheater 13 for a predetermined period of time. Then, the track 9 stores the processed lead frames 100 in other cassettes.

The preheater 11 , the heating plate 12 and the afterheater 13 are arranged between the pair of rails 9 . Moreover, the preheater 11, the heating plate 12, and the afterheater 13 are arrange|positioned in this order along the conveyance direction D1. And, as shown in part (a) of FIG. 2 , a preheating region A1 is set in the preheater 11 . On the heating plate 12, a bonding area A2 is set (for business area). Furthermore, an afterheating area A3 is set on the afterheater 13 . According to the configuration, the lead frame 100 moves in the order of the pre-heating area A1 , the bonding area A2 and the post-heating area A3 .

The preheater 11 and the afterheater 13 are arranged at a predetermined distance from the rear surface 100 a of the lead frame 100 . That is, a gap L1 is formed between the preheater 11 and the afterheater 13 and the lead frame 100 . The gap L1 is, for example, not less than 0.5 mm and not more than 3.0 mm, and as an example, it may be not less than 1 mm and not more than 2 mm. The preheater 11 and the afterheater 13 are fixed on the base 6 ( FIG. 1 ). Therefore, the distance between the preheater 11 and the afterheater 13 and the lead frame 100 is basically unchanged.

The distance between the heating plate 12 and the back surface 100 a of the lead frame 100 is variable. Specifically, during the bonding operation, the heating plate 12 is in contact with the back surface 100 a of the lead frame 100 (see FIG. 2( a )). On the other hand, when the lead frame 100 is conveyed toward the heater plate 12 and when the lead frame 100 is unloaded from the heater plate 12 , the heater plate 12 is moved downward by the drive mechanism 10 (see FIG. 2( b )). At this time, a gap L2 is formed between the heating plate 12 and the lead frame 100 . The gap L2 is, for example, not less than 1 mm and not more than 15 mm, and may be 10 mm as an example.

[Preheater]

FIG. 3 is a perspective view showing more specifically the configuration of the preheater 11 . The preheater 11 has a cartridge heater 14 (a heat generating body, a first heat generating body) and a heating block 16 (a first heating block). The plug-in heater 14 generates heat by energizing. For example, the temperature of the cartridge heater 14 may be not less than 200°C and not more than 400°C.

The heating block 16 directs the heat emitted by the plug-in heater 14 toward the lead frame 100 transfer. The heating block 16 includes a main surface 16 a facing the lead frame 100 . The width of the heating block 16 in the depth direction D3 may be greater than the width of the lead frame 100 . The heating block 16 has a heater fixing surface 17 , an upstream heat dissipation portion 18 , and a downstream heat dissipation portion 19 . The heater fixing surface 17 is fixed to the base 6 via an adapter or the like. An upstream heat dissipation portion 18 and a downstream heat dissipation portion 19 are formed on the surface of the heating block 16 facing the lead frame 100 . The upstream radiator 18 and the downstream radiator 19 can serve as the main surface of the preheater 11 or the main surface of the heating block 16 . The upstream heat dissipation portion 18 and the downstream heat dissipation portion 19 face each other across the gap L1 in the lead frame 100 . The heat received from the heater fixing surface 17 is supplied to the lead frame 100 from the upstream heat dissipation portion 18 and the downstream heat dissipation portion 19 .

The upstream heat radiation part 18 is provided in the upstream side of the conveyance direction D1. A cylindrical plug-in heater 14 is provided on the upstream heat dissipation portion 18 . The downstream heat radiation part 19 is provided in the downstream side of conveyance direction D1. A connecting portion 21 is provided between the upstream heat dissipation portion 18 and the downstream heat dissipation portion 19 . Fins 22 to be described later are not provided on the connecting portion 21 . In the connection part 21, the bolt hole for fixing the base 6 (refer FIG. 1) to the preheater 11 can be provided, for example.

The downstream heat dissipation portion 19 will be described with reference to FIG. 4 . FIG. 4 is a cross-sectional perspective view of a virtual plane K shown in FIG. 3 . The upstream radiating portion 18 differs from the downstream radiating portion 19 only in the position where it is formed, and thus detailed description thereof will be omitted. The downstream radiating portion 19 has a plurality of fins 22 (a plurality of first fins), a groove 23 , and an air supply hole 24 .

In the heating block 16, the main surface 16a constitutes a heat radiation part (1st heat radiation part). Furthermore, having the fins 22 opened toward the main surface 16a increases the heat dissipation area and forms the groove 23 as an approach section. The fins 22 extend in the facing direction D2. Front end of fin 22 Surface 22 a is part of main surface 16 a of heating block 16 . Therefore, the gap L1 from the preheater 11 to the lead frame 100 is synonymous with the distance from the front end surface 22 a of the fin 22 to the back surface 100 a of the lead frame 100 .

The fins 22 are spaced apart from each other along directions perpendicular to the facing direction D2 and the conveyance direction D1 , respectively. Therefore, the ridgeline of the tip of the fin is parallel to the conveyance direction D1. Grooves 23 are formed by the above configuration. That is, the grooves 23 are formed between the fins 22 . That is, the depth L3 of the groove 23 is synonymous with the height of the fin 22 . The depth L3 of the groove 23 is greater than the gap L1. For example, the depth L3 of the groove 23 is not less than 5 mm and not more than 30 mm, and is, for example, 12 mm. In addition, the depth L3 of the groove 23 may be 5 times (L3=5×L1) or more and 20 times or less than the gap L1, and may be 10 times as an example.

On the bottom surface 23a of the groove 23, an opening 24a of the air supply hole 24 is provided. The air supply hole 24 extends along the facing direction D2. The opening 24 b on the opposite side of the air supply hole 24 is provided on the side of the heater fixing surface 17 . The air supply hole 24 takes in air from the opening 24 b and discharges the air toward the bottom surface 23 a of the groove 23 . That is, the air supply holes 24 supply air (see hollow arrows) between the fins 22 . An air supply hole 24 is provided for each groove 23 . Therefore, when the heating block 16 is viewed from above, the air supply holes 24 are provided in the heating block 16 so as to be spaced apart from each other along the depth direction D3.

Heat is generated in the plug-in heater 14 by the preheater 11 . The heat moves to the heating block 16 . The heat then reaches the fins 22 . The heat reaching the fins 22 heats the air near the sides of the fins 22 . That is, the air located in the groove 23 is heated. The heated air becomes relatively less dense, so it begins to rise. Here, at the fins 22, the heat transfer is generated on the side of the fins 22, and the rise of the heated air is generated. flow. A section in which heat transfer to the air from the fins 22 is referred to as an approach section. That is, even when the fins 22 are not provided, although heat transfer from the fins 22 to the air occurs, no run-up section is formed. By using the natural convection heating in the run-up section, necessary and sufficient heat energy can be supplied from the preheater 11 to the lead frame 100 .

In addition, the afterheater 13 has the same structure as the preheater 11. That is, it has the plug-in heater 14 which is a 2nd heating body, and the heating block 16 which is a 2nd heating block. Furthermore, the heating block 16 has an upstream heat dissipation portion 18 and a downstream heat dissipation portion 19 as a second heat dissipation portion, and fins 22 as a second fin are provided on the upstream heat dissipation portion 18 and the downstream heat dissipation portion 19 . Therefore, a detailed description of the afterheater 13 is omitted.

[Operation of wire bonding device]

Next, the operation of the wire bonding apparatus 1 will be described. FIG. 5 is a diagram schematically showing the operation of the wire bonding apparatus 1 . In FIG. 5 , the uppermost horizontal axis corresponds to the preheating area A1. The horizontal axis of the middle section corresponds to the joint area A2. The lowermost horizontal axis corresponds to the post-heating area A3. Each horizontal axis represents time progression from left to right. Also, the rectangles overlapping the respective horizontal axes indicate that the lead frame 100 is located in each area.

First, the control unit 4 supplies current to the preheater 11 , the heating plate 12 and the afterheater 13 . By the operation described above, the preheater 11, the heating plate 12, and the afterheater 13 are respectively set to predetermined temperatures. For example, the set temperature of the preheater 11 is 200°C to 350°C. For example, the set temperature of the heating plate 12 is 300°C. For example, the set temperature of the afterheater 13 is 300°C.

Secondly, the control unit 4 provides control signals to the lead frame feeder 2 to control the transfer of the lead frame 100 . The following describes the operation of the lead frame feeder 2, Each operation is performed according to the control signal received by the lead frame feeder 2 from the control unit 4 .

Specifically, the lead frame feeder 2 takes out the lead frame 100 from the magazine. Then, the lead frame feeder 2 transports the taken out lead frame 100 to the preheating area A1 ( S1 ). Next, the lead frame feeder 2 maintains the position of the lead frame 100 for a predetermined period of time (S2). During this period, the lead frame 100 receives heat from the preheater 11, and thus is heated to a predetermined temperature.

After a predetermined period of time has elapsed, the lead frame feeder 2 transports the lead frame 100 to the bonding area A2 ( S3 ). In parallel with the transfer, the lead frame feeder 2 takes out the lead frame 100 from the cassette again and transfers the taken out lead frame 100 to the preheating area A1 ( S4 ). Then, the position of the lead frame 100 to be transported to the bonding area A2 by the lead frame feeder 2 is maintained for a predetermined period (first period). Similarly, the position of the lead frame 100 to be conveyed by the lead frame feeder 2 to the preheating area A1 is maintained only for a predetermined period (second period). During the period, the control unit 4 provides a control signal to the bonding unit 3 . The bonding unit 3 performs bonding operation on the lead frame 100 according to the control signal ( S5 ). Furthermore, in parallel with the bonding operation, the lead frame 100 disposed in the preheating area A1 receives heat from the preheater 11 and is heated to a predetermined temperature ( S6 ).

Here, the period ( S6 ) in which the lead frame 100 is arranged in the preheating area A1 is the same as the period required for the bonding operation ( S5 ). That is, if the timing at which the lead frame 100 reaches the preheating area A1 is the same as the timing at which the lead frame 100 arrives at the bonding area A2, the preheating ( S6 ) and the bonding operation ( S5 ) end simultaneously.

Furthermore, the period of disposing the lead frame 100 mentioned here may be the period from when the position of the lead frame 100 in the preheating area A1 stops to when the lead frame 100 starts to move again. The period required for the bonding operation may be a period from when the position of the lead frame 100 in the bonding area A2 stops to when it starts to move again. In addition, the period required for the bonding operation may be the period from the start of the operation of the bonding unit 3 to the stop. That is, the period required for the bonding operation may or may not include the period from when the position of the lead frame 100 in the bonding area A2 stops to when the operation of the bonding unit 3 starts.

After a predetermined period of time has elapsed, the lead frame feeder 2 transports the lead frame 100 on which the bonding work has been performed to the post-heating area A3 ( S7 ). In parallel with the transfer, the lead frame feeder 2 transfers the preheated lead frame 100 to the bonding area A2 ( S8 ). Furthermore, the lead frame feeder 2 takes out the lead frame 100 from the magazine again and transports the taken out lead frame 100 to the preheating area A1 ( S9 ).

Then, the lead frame feeder 2 maintains the position of the lead frame 100 conveyed to the rear heating area A3 for a predetermined period of time. Likewise, the position of the lead frame 100 to be transported to the bonding area A2 is maintained for a predetermined period of time. Furthermore, the lead frame feeder 2 maintains the position of the lead frame 100 conveyed to the preheating area A1 only for a predetermined period of time. During this period, the lead frame 100 disposed in the afterheating area A3 receives heat from the afterheater 13 ( S10 ). Furthermore, the bonding unit 3 performs bonding operation to the lead frame 100 (S11). Furthermore, in parallel with the bonding operation, the lead frame 100 arranged in the preheating area A1 receives heat from the preheater 11 and is heated to a predetermined temperature (S12). Thereafter, the lead frame feeder 2 stores the lead frame 100 in the cassette ( S13 ).

[Effect]

Hereinafter, the operation and effect of the wire bonding apparatus 1 will be described.

The wire bonding apparatus 1 performs preheating and bonding operations in parallel. More specifically, the period required for preheating is either the same as or shorter than the period required for the joining work. In this way, when the bonding operation is completed, the lead frame 100 that has been preheated can be immediately transported to the bonding area A2. Therefore, the transfer time of the lead frame 100 is eliminated, and the standby time of the bonding unit 3 is not generated, thereby improving productivity.

On the other hand, as the operation of the wire bonding apparatus, it is also possible to perform an operation in which a lead frame that has not reached a predetermined temperature is carried into the bonding area immediately after the lead frame that has completed the bonding operation is carried out. However, in the above operation, after being carried into the bonding area, the bonding operation cannot be started until the lead frame reaches a predetermined temperature. This is because the bonding unit 3 needs to accurately move the capillary 8 to the bonding position (for example, the position of the electrode pad) during the bonding operation. Here, if the temperature of the lead frame 100 arranged in the bonding area A2 rises, the lead frame 100 thermally expands, so that the positions of the electrode pads change. As a result, it is difficult to accurately position the capillary 8 on the electrode pad. Therefore, even by such operation, the standby time of the bonding unit still occurs.

On the other hand, in the wire bonding apparatus 1 , the lead frame 100 having reached the target temperature can always be provided to the bonding area A2 . That is, the lead frame 100 conveyed to the bonding area A2 does not undergo thermal expansion to an extent that affects the bonding operation. Therefore, accurate joining work can be performed without causing the above-mentioned waiting time.

Also, the preheating unit included in the lead frame feeder 2 of the wire bonding apparatus 1 The device 11 does not require complicated mechanisms such as equipment for supplying compressed air or piping air passages. Therefore, the lead frame 100 can be rapidly heated to a predetermined temperature with a simple configuration.

[Example 1 and Comparative Example 1]

It was confirmed by comparing the effect of the preheater 11 which is a heating means with the effect of the heating means of a comparative example. The heating unit of the comparative example is different from the preheater 11 in that it does not have the fins 22 and the air supply holes 24 . Other configurations of the heating unit of the comparative example are the same as those of the preheater 11 of the embodiment. That is, according to the heating unit of the comparative example, heat is transferred by heat transfer due to radiation between the main surface of the heating block and the back surface of the lead frame and heat transfer due to upward convection generated from the main surface of the heating block. Provided from heating unit to lead frame.

In Example 1 and Comparative Example 1, the temperature of the insertion heater 14 was set to 350°C. Then, the lead frame 100 was transported, and the temperature rise of the lead frame 100 was confirmed based on the timing at which the lead frame 100 was stationary on the main surface 16 a of the heating block 16 . FIG. 6 is a graph showing the results of Example 1 and Comparative Example 1. FIG. The horizontal axis represents time. The vertical axis represents the temperature of the lead frame 100 . Graph G6a shows the results of Example 1. Graph G6b shows the results of Comparative Example 1.

First, the results of Comparative Example 1 were confirmed. According to the graph G6b, firstly, it is found that the temperature of the lead frame 100 is about 25°C (refer to plot P1). Said temperature approximately corresponds to room temperature. Next, after about 40 seconds have elapsed from the start of the measurement, the lead frame 100 is transferred to the heating unit (see plot P2). As a result, it was found that the temperature of the lead frame 100 rises rapidly. Then, after 120 seconds have elapsed since the start of the measurement, the lead frame The temperature converges to about 260°C (cf. plot P3).

Next, the results of Example 1 were confirmed. According to the graph G6a, firstly, it is found that the temperature of the lead frame 100 is about 25°C (refer to plot P1). Next, after about 40 seconds have elapsed from the start of the measurement, the lead frame 100 is transferred to the heating unit (see plot P2). As a result, it was found that the temperature of the lead frame 100 rises rapidly. Then, after 120 seconds had elapsed from the start of the measurement, the temperature of the lead frame converged to about 260° C. (refer to plot P3 ).

That is, it was confirmed that there is no intentional difference in the convergence temperature with respect to the lead frame 100 regardless of the presence or absence of the fins 22 .

On the other hand, a difference appears in the period until the convergence temperature is reached. For example, the period from the start of heating to reaching 95% of the convergence temperature (260° C.) is compared. First, in the case of the comparative example (graph G6b), it takes about 48 seconds (87 seconds-39 seconds) from the start of heating until reaching 95% of the convergence temperature (see plot P4). In the case of Example 1 (graph G6a), it takes about 28 seconds (71 seconds-42 seconds) from the start of heating to reach 95% of the convergence temperature (see plot P5). That is, by providing the fins 22 and the air supply holes 24, 20 seconds were successfully shortened. Therefore, it was confirmed that the period required for preheating can be shortened by providing the fins 22 and the air supply holes 24 .

[modified example]

As mentioned above, although embodiment of this invention was described, it can implement in various forms without being limited to the said embodiment.

For example, in the above-mentioned embodiment, the wire bonding apparatus 1 is illustrated as for the joining device. For example, the bonding device may also be a die bonding device. In this case, the bonding operation is not wire bonding but die bonding. Furthermore, the bonding unit may also include a mechanism for transferring the semiconductor wafer to the lead frame 100 or a mechanism for disposing an adhesive on the semiconductor wafer and/or the lead frame 100 .

11: Preheater (heating unit, first heating unit)

14: Plug-in heater (heating element, first heating element)

16: heating block (first heating block)

16a: main surface

17: Heater fixing surface

18: Upstream cooling unit

19: Downstream radiator

21: Connection Department

22: Fin (first fin)

D1: Transport direction

D2: opposite direction

D3: Depth direction

K: imaginary surface

Claims (11)

A splicing device comprising: a work area and a heating area located upstream of the work area; a splicing section for splicing a lead frame transported to the work area; and a lead frame feeder for feeding the lead frame through rails. The lead frame is transported to the working area, and the heating unit located in the heating area is used to preheat the lead frame before being transported to the working area; and the heating unit has: a heating element; a block arranged upstream of the work area in the conveyance direction of the lead frame and facing the back surface of the lead frame, and supplies heat received from the heating element to the Lead frame; a heat dissipation part is provided on the heating block, and the heat dissipation part has a plurality of fins formed from the surface of the heating block toward the depth direction. The bonding apparatus according to claim 1, wherein the plurality of fins are separated from each other along a direction intersecting with a conveyance direction of the lead frame. The bonding device according to claim 1 or claim 2, wherein a hole is provided in the heating block, and the hole is provided between the fins and penetrates through the depth direction. The bonding device according to claim 1 or claim 2, wherein the length of the fins in the depth direction is longer than that from the fins in the depth direction The distance from the front end of the sheet to the lead frame. The splicing device according to claim 1 or claim 2, further comprising a control unit that controls the operations of the splice unit and the lead frame feeder; and the control unit, during the first period A control signal is provided to the bonding portion to cause the bonding portion to carry out the bonding operation, and during a second period overlapping the first period, a control signal is provided to the lead frame feeder to cause the heating unit to perform the conducting operation of the wire. A control signal for preheating of racks, the length of the second period is equal to or less than the length of the first period. A lead frame feeder, comprising: rails for transporting a lead frame to an operation area where the lead frame is bonded; and a first heating unit located in the heating area for the The lead frame is preheated, wherein the heating area is located upstream of the working area; and the first heating unit has: a first heating element; The working area is arranged closer to the upstream side and facing the back of the lead frame, and the heat received from the first heating element is provided to the lead frame; the first heating block is provided with The first heat dissipation part, the first heat dissipation part has A plurality of first fins formed from the surface of the first heating block toward the depth direction. The lead frame feeder according to claim 6, further comprising a second heating unit for heating the lead frame transported from the work area after the bonding work is performed ; and the second heating unit has: a second heating body; and a second heating block, which is closer to the downstream side than the working area in the conveying direction of the lead frame, and faces the back of the lead frame configured in a manner, and provide the heat received from the second heating body to the lead frame; a second heat dissipation part is provided on the second heating block, and the second heat dissipation part has a function of heating from the second heating element. A plurality of second fins are formed on the surface of the block toward the depth direction. A heating unit for preheating the lead frame transported by rails before a working area where the lead frame is bonded, the heating unit is located in a heating area upstream of the working area; and It includes a heating element; and a heating block arranged upstream of the work area in the conveying direction of the lead frame and facing the back surface of the lead frame, and receiving the heating block from the heating element. The heat is provided to the lead frame; a heat dissipation part is provided on the heating block, and the heat dissipation part has a plurality of fins formed from the surface of the heating block toward the depth direction. The heating unit according to claim 8, wherein the plurality of fins are separated from each other along a direction intersecting with a conveyance direction of the lead frame. The heating unit according to claim 8 or claim 9, wherein holes are provided in the heating block, and the holes are arranged between the fins and penetrate through the depth direction. The heating unit according to claim 8, wherein the length of the fins in the depth direction is longer than the distance from the front end of the fins to the lead frame in the depth direction.

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