JP2529343B2 - Wire bonding equipment - Google Patents
Wire bonding equipmentInfo
- Publication number
- JP2529343B2 JP2529343B2 JP7000588A JP7000588A JP2529343B2 JP 2529343 B2 JP2529343 B2 JP 2529343B2 JP 7000588 A JP7000588 A JP 7000588A JP 7000588 A JP7000588 A JP 7000588A JP 2529343 B2 JP2529343 B2 JP 2529343B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat block
- stage
- wire
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Description
【発明の詳細な説明】 産業上の利用分野 本発明はワイヤボンディング装置に関し、特に両面実
装した基板に対応できるワイヤボンディング装置に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus, and more particularly, to a wire bonding apparatus that can be used for substrates mounted on both sides.
従来の技術 従来から、半導体等の部品を装着した基板を載置固定
して基板及びその上の半導体を加熱するヒートブロック
を設けるとともに、ワイヤを挿通されたキャピラリを基
板の上方で上下動可能な超音波ホーンの先端に装着し、
前記半導体や基板上の被ボンディング部にキャピラリの
先端部から導出されたワイヤを押し付け、超音波を印加
することによってワイヤを被ボンディング部に接合して
ワイヤリングを行うようにしたワイヤボンディング装置
は周知である。2. Description of the Related Art Conventionally, a heat block for mounting and fixing a substrate on which components such as semiconductors are mounted and heating the substrate and the semiconductor on the substrate is provided, and a capillary having a wire inserted therein can be moved up and down above the substrate. Attach it to the tip of the ultrasonic horn,
A wire bonding apparatus is known in which a wire led out from a tip portion of a capillary is pressed against a bonded portion on a semiconductor or a substrate, and ultrasonic waves are applied to bond the wire to the bonded portion to perform wiring. is there.
又、そのようなワイヤボンディング装置において、基
板の両面に部品を装着されている両面実装基板に対して
ワイヤリングを施す場合には、基板裏面に装着されてい
る部品が嵌まり込むような凹部を形成したヒートブロッ
クを用い、部品装着部を除いて基板裏面をヒートブロッ
クに密接させることによって基板を加熱するようにして
いた。In addition, in such a wire bonding apparatus, when wiring is applied to a double-sided mounting board in which components are mounted on both sides of the board, a recess is formed on the back surface of the board so that the components mounted on the board are fitted. The heat block is used to heat the substrate by bringing the back surface of the substrate into close contact with the heat block except for the component mounting portion.
発明が解決しようとする課題 ところが、上記のように部品を逃がすための凹部を形
成したヒートブロックを用いた場合には、基板の品種が
変わると、ヒートブロックを交換する必要があり、品種
切換に時間と手間を要するという問題があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, when the heat block in which the recesses for letting out the components are formed as described above is used, when the type of the substrate changes, the heat block needs to be replaced, and the type change is required. There was a problem that it took time and effort.
本発明は上記従来の問題点に鑑み、両面実装基板に対
するワイヤリングにおいて品種切換を容易に行えるワイ
ヤボンディング装置の提供を目的とする。In view of the above-mentioned conventional problems, an object of the present invention is to provide a wire bonding apparatus that can easily change the type of wiring for a double-sided mounting board.
課題を解決するための手段 本発明は上記目的を達成するため、部品を装着された
基板を載置して加熱するヒートブロックと、前記基板と
部品にそれぞれ形成された被ボンディング部に、ワイヤ
を押し付け超音波を印加して接合するキャピラリとを備
えたワイヤボンディング装置において、前記ヒートブロ
ック上に、両面に部品を装着された基板の片面側の部品
の逃げ穴を形成されたスペーサ板を装着したことを特徴
とする。Means for Solving the Problems In order to achieve the above object, the present invention provides a heat block for mounting and heating a substrate on which a component is mounted, and a wire to a bonded portion formed on each of the substrate and the component. In a wire bonding apparatus having a capillary for pressing and applying ultrasonic waves to bond, on the heat block, a spacer plate having escape holes for the components on one side of a substrate having components mounted on both sides is mounted. It is characterized by
作用 本発明は上記構成を有するので、基板の品種切換を行
う場合に、ヒートブロックはそのままでスペーサ板だけ
を交換する簡単な作業で容易に対処できるとともに、ス
ペーサ板の熱容量はヒートブロック全体に比して小さい
ので、所定温度まで速やかに上昇し、作業再開までの時
間も短くて済む。Effect Since the present invention has the above-mentioned configuration, when changing the type of substrate, it is possible to easily deal with the simple work of replacing only the spacer plate while keeping the heat block, and the heat capacity of the spacer plate is higher than that of the entire heat block. Since it is small, the temperature can be quickly raised to a predetermined temperature, and the time required for resuming work can be shortened.
実施例 以下、本発明の一実施例を第１図及び第２図を参照し
ながら説明する。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
第１図において、基板１の搬送方向に沿って、プリヒ
ート・ステージ２、ボンディング・ステージ３及びアフ
ターヒート・ステージ４が配設されている。各ステージ
２、３、４には、ヒータ5aを内蔵したヒートブロック５
が配設され、かつ第２図に示すように、各ヒートブロッ
ク５上に、その上面とほぼ等しい面積のスペーサ板６が
ボルト等の固定手段5bにて着脱可能に設置固定されてい
る。このスペーサ板６の厚さは、基板１に装着されてい
る部品1aの高さより若干大きく設定され、かつ前記基板
１の裏面に装着された部品1aが嵌まり込む逃げ穴6aが形
成されている。In FIG. 1, a preheat stage 2, a bonding stage 3 and an afterheat stage 4 are arranged along the carrying direction of the substrate 1. A heat block 5 with a heater 5a built in each of the stages 2, 3 and 4.
2, and as shown in FIG. 2, a spacer plate 6 having an area substantially equal to the upper surface of each heat block 5 is detachably installed and fixed by fixing means 5b such as bolts. The thickness of the spacer plate 6 is set to be slightly larger than the height of the component 1a mounted on the substrate 1, and an escape hole 6a into which the component 1a mounted on the back surface of the substrate 1 is fitted is formed. .
プリヒート・ステージ２とアフターヒート・ステージ
４のヒートブロック５は、ボンディング・ステージ３の
ヒートブロック５と同一レベルの上昇位置とそれより下
方の下降位置との間で昇降可能に支持されている。The heat block 5 of the preheat stage 2 and the afterheat stage 4 is supported so as to be able to move up and down between a raised position at the same level as the heat block 5 of the bonding stage 3 and a lowered position below it.
７は、基板供給コンベアで、モータ８にて駆動される
一対の丸ベルト９にて構成され、プリヒート・ステージ
２における下降位置のヒートブロック５上に基板１を供
給するように配設されている。又、10は基板排出コンベ
アで、モータ11にて駆動される一対の丸ベルト12にて構
成され、アフターヒート・ステージ４におけるヒートブ
ロック５上の基板１を、このヒートブロック５の下降に
よって受け取って排出するように配設されている。A substrate supply conveyor 7 is composed of a pair of round belts 9 driven by a motor 8 and is arranged so as to supply the substrate 1 onto the heat block 5 at the lowered position in the preheat stage 2. . Further, 10 is a substrate discharge conveyor, which is composed of a pair of round belts 12 driven by a motor 11, and receives the substrate 1 on the heat block 5 in the afterheat stage 4 by descending the heat block 5. It is arranged to discharge.
ボンディング・ステージ３のヒートブロック５はＸ−
Ｙテーブル13上に設置され、水平方向に任意に位置決め
可能に構成されている。14はヒートブロック５上に供給
された基板１の位置規正手段、15は基板１の固定手段で
ある。The heat block 5 of the bonding stage 3 is X-
It is installed on the Y table 13 and can be arbitrarily positioned in the horizontal direction. Reference numeral 14 is a position regulating means for the substrate 1 supplied onto the heat block 5, and 15 is a fixing means for the substrate 1.
16は、プリヒート・ステージ２の基板１をボンディン
グ・ステージ３に、ボンディング・ステージ３の基板１
をアフターヒート・ステージ４にそれぞれ同時に移載す
る移載手段である。この移載手段16は一対の平面形状が
コ次状の把持部材17、18を備えており、これら把持部材
17、18の両端から延出された把持片はそれぞれ隣り合う
２つのステージの上手側と下手側に位置している。これ
ら把持部材17、18は、移動体19に相対移動可能に装着さ
れるとともに中間位置を水平方向に揺動可能に枢支され
たレバー20の両側に連結され、かつこのレバー20を駆動
手段21にて揺動駆動するように構成されている。従っ
て、レバー20を揺動させると、前記把持部材17、18の把
持片にて２つのステージの基板１を同時に把持又は把持
解除できる。また、前記移動体19は昇降手段22にて昇降
可能に、かつ駆動レバー23にてステージ間隔に対応する
距離だけ往復駆動可能に構成されている。24は駆動レバ
ー23の回転駆動装置である。16 is the substrate 1 of the preheating stage 2 on the bonding stage 3 and the substrate 1 of the bonding stage 3
Is a transfer means for simultaneously transferring to the afterheat stage 4. The transfer means 16 is provided with a pair of gripping members 17 and 18 having a conical shape in plan view.
Grasping pieces extending from both ends of 17 and 18 are located on the upper side and the lower side of two adjacent stages, respectively. These gripping members 17, 18 are connected to both sides of a lever 20 which is mounted on a moving body 19 so as to be movable relative to each other and which is pivotally supported at an intermediate position so as to be capable of swinging in the horizontal direction. Is configured to be rocking driven. Therefore, when the lever 20 is swung, the gripping pieces of the gripping members 17 and 18 can simultaneously grip or release the substrates 1 of the two stages. Further, the moving body 19 can be moved up and down by an elevating means 22 and can be reciprocally driven by a drive lever 23 by a distance corresponding to the stage interval. Reference numeral 24 is a rotary drive device for the drive lever 23.
前記ボンディング・ステージ３の上部には、ワイヤ25
を挿通され、かつ先端から導出されたワイヤを基板１又
はその上の部品の被ボンディング部に押し付けながら超
音波を印加することによってワイヤ25を接合するキャピ
ラリ26が配設されている。このキャピラリ26は、上下揺
動可能に支持された超音波ホーン27の先端部に装着され
ていることによって、上下移動可能かつ超音波を印加可
能となっている。28はワイヤ25の下部クランパ、29は上
部クランパ、30はガイド、31はバックテンション装置、
32はワイヤ先端にボールを形成する電気トーチである。A wire 25 is provided on the bonding stage 3.
There is provided a capillary 26 for joining the wire 25 by applying ultrasonic waves while pressing the wire which is inserted through the wire and which is led out from the tip against the bonded portion of the substrate 1 or a component on the substrate 1. The capillary 26 is attached to the tip of an ultrasonic horn 27 that is supported so as to be vertically swingable, so that it can move vertically and can apply ultrasonic waves. 28 is a lower clamper for the wire 25, 29 is an upper clamper, 30 is a guide, 31 is a back tension device,
32 is an electric torch that forms a ball at the tip of the wire.
次に、動作を説明する。プリヒート・ステージ２のヒ
ートブロック５を下降させた状態で、基板供給コンベア
７にて基板１をプリヒート・ステージ２に供給し、次に
ヒートブロック５を上昇させることによってこのヒート
ブロック５にて基板１を支持するとともに基板１を予熱
する。Next, the operation will be described. In the state where the heat block 5 of the preheat stage 2 is lowered, the substrate 1 is supplied to the preheat stage 2 by the substrate supply conveyor 7, and then the heat block 5 is raised to raise the substrate 1 in this heat block 5. And preheat the substrate 1.
予熱が終わると、昇降手段22にて移動体19を下降させ
て把持部材17、18の把持片を基板１の前後端に対向させ
る。次に、レバー20を駆動手段21にて回動させて把持部
材17、18を相対移動させ、把持片にて基板１を把持し、
続いて移動体19を上昇させた後、駆動レバー23を回動さ
せて移動体19を移動させ、プリヒート・ステージ上の基
板１をボンディング・ステージ３の上方に位置させ、さ
らに移動体19を下降させ、レバー20を反対方向に回動さ
せて基板１の把持を解除し、ボンディング・ステージ３
のヒートブロック５上に基板１を載置する。又、位置規
正手段14にて基板１の位置を規正した後固定手段15にて
固定する。一方、把持部材17、18は元の位置に戻し、上
記の如くプリヒート・ステージ２に次の基板１を供給し
て予熱する。When the preheating is completed, the moving body 19 is lowered by the elevating means 22 so that the gripping pieces of the gripping members 17 and 18 face the front and rear ends of the substrate 1. Next, the lever 20 is rotated by the driving means 21 to relatively move the grip members 17, 18, and the substrate 1 is gripped by the grip pieces.
Then, after moving the movable body 19, the drive lever 23 is rotated to move the movable body 19, the substrate 1 on the preheat stage is positioned above the bonding stage 3, and the movable body 19 is further lowered. Then, the lever 20 is rotated in the opposite direction to release the grip of the substrate 1, and the bonding stage 3
The substrate 1 is placed on the heat block 5. Further, the position of the substrate 1 is regulated by the position regulating means 14 and then fixed by the fixing means 15. On the other hand, the gripping members 17 and 18 are returned to their original positions, and the next substrate 1 is supplied to the preheat stage 2 to preheat as described above.
ボンディング・ステージ３では、Ｘ−Ｙテーブル13に
て順次基板１の被ボンディング部をキャピラリ26の直下
位置に位置決めするとともに、キャピラリ26にてワイヤ
25を被ボンディング部に接合してワイヤリングを行う。In the bonding stage 3, the bonded portion of the substrate 1 is sequentially positioned directly below the capillary 26 by the XY table 13, and the wire is moved by the capillary 26.
25 is bonded to the bonded portion and wiring is performed.
基板１に対するワイヤリングが終了すると、基板１の
固定を解除し、上記と同様に移載手段16を動作させてワ
イヤリングの終了した基板１をボンディング・ステージ
３からアフターヒート・ステージ４に移載するととも
に、プリヒート・ステージ２にて予熱された基板１をボ
ンディング・ステージ３に移載する。その後、アフター
ヒート・ステージ４のヒートブロック５上の基板１を、
ヒートブロック５を下降させて基板排出コンベア10にて
排出する。When the wiring to the substrate 1 is completed, the substrate 1 is released from the fixed state, and the transfer means 16 is operated in the same manner as described above to transfer the substrate 1 after the wiring from the bonding stage 3 to the afterheat stage 4. The substrate 1 preheated by the preheat stage 2 is transferred to the bonding stage 3. After that, the substrate 1 on the heat block 5 of the afterheat stage 4
The heat block 5 is lowered and discharged by the substrate discharge conveyor 10.
以上の動作を繰り返すことによって順次供給される基
板１に対してワイヤリングを施して次の工程に排出する
ことができる。そして、基板１の品種が変わった場合に
は、各ステージ２、３、４のヒートブロック５のスペー
サ板６だけを対応するものに取り替えればよい。By repeating the above operation, the substrates 1 sequentially supplied can be wired and discharged to the next step. When the type of the substrate 1 is changed, only the spacer plate 6 of the heat block 5 of each stage 2, 3, 4 may be replaced with a corresponding one.
発明の効果 本発明のワイヤボンディング装置によれば、ヒートブ
ロック上に、基板の裏面に装着された部品の逃げ穴を形
成されたスペーサ板を装着しているので、基板の品種切
換を行う場合、ヒートブロックはそのままでスペーサ板
だけを交換する簡単な作業で容易に対処できる。また、
スペーサ板の熱容量はヒートブロック全体に比して小さ
いので、所定温度まで速やかに上昇し、作業再開までの
時間も短くて済む等、大なる効果を発揮する。Advantageous Effects of Invention According to the wire bonding apparatus of the present invention, since the spacer plate on which the escape holes for the components mounted on the back surface of the substrate are formed is mounted on the heat block, when switching the type of the substrate, The heat block can be left as it is and the spacer plate can be easily replaced by a simple operation. Also,
Since the heat capacity of the spacer plate is smaller than that of the entire heat block, the spacer plate has a great effect such that it quickly rises to a predetermined temperature and the time required to restart the work is short.
第１図及び第２図は本発明の一実施例を示し、第１図は
全体の概略構成を示す斜視図、第２図はヒートブロック
部の部分断面側面図である。 １……基板 1a……部品 ５……ヒートブロック ６……スペーサ板 6a……逃げ穴 25……ワイヤ 26……キャピラリ。1 and 2 show an embodiment of the present invention, FIG. 1 is a perspective view showing the overall schematic configuration, and FIG. 2 is a partial sectional side view of a heat block portion. 1 ... Substrate 1a ... Parts 5 ... Heat block 6 ... Spacer plate 6a ... Escape hole 25 ... Wire 26 ... Capillary.
Claims (1)
ヒートブロックと、前記基板及び部品にそれぞれ形成さ
れた被ボンディング部に、ワイヤを押し付け超音波を印
加して接合するキャピラリとを備えたワイヤボンディン
グ装置において、前記ヒートブロック上に、両面に部品
を装着された基板の片面側の部品の逃げ穴を形成された
スペーサ板を装着したことを特徴とするワイヤボンディ
ング装置。1. A heat block for mounting and heating a substrate on which a component is mounted, and a capillary for bonding an ultrasonic wave to a bonded portion formed on each of the substrate and the component by applying an ultrasonic wave. In a wire bonding apparatus provided with the wire bonding apparatus, a spacer plate is formed on the heat block, the spacer plate having escape holes for components on one side of a substrate having components mounted on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7000588A JP2529343B2 (en) | 1988-03-24 | 1988-03-24 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7000588A JP2529343B2 (en) | 1988-03-24 | 1988-03-24 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01241837A JPH01241837A (en) | 1989-09-26 |
| JP2529343B2 true JP2529343B2 (en) | 1996-08-28 |
Family
ID=13419056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7000588A Expired - Fee Related JP2529343B2 (en) | 1988-03-24 | 1988-03-24 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2529343B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2531016B2 (en) * | 1991-12-03 | 1996-09-04 | ニチデン機械株式会社 | Lead frame transfer device |
| JP2020115528A (en) * | 2019-01-18 | 2020-07-30 | 株式会社新川 | Bonding device, frame feeder, and heater unit |
| KR20210146410A (en) * | 2020-03-06 | 2021-12-03 | 가부시키가이샤 신가와 | Bonding unit, frame feeder and heater unit |
-
1988
- 1988-03-24 JP JP7000588A patent/JP2529343B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01241837A (en) | 1989-09-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |