KR100820741B1 - Bonding apparatus for electronic component - Google Patents

Abstract

A bonding apparatus for electronic components is provided to eliminate the necessity of a bonding apparatus even if the size or characteristic of electronic components is varied in manufacturing an electronic product by varying the irradiation position of a laser beam, the intensity of a laser beam or the irradiation time of a laser beam according to the size or characteristic of the electronic components. A plurality of divided pressure modules(120) pressurize a contact part between electronic components pre-bonded by a conductive bonding agent(30). A plurality of divided laser modules(140) irradiate a laser beam for heating the conductive bonding agent interposed between the pre-bonded electronic components. A pressure module supporting unit supports the plurality of divided pressure modules in a manner that the divided pressure modules can be transferred. A laser module supporting unit supports the plurality of divided laser modules in a manner that the divided laser modules can be transferred. Each divided pressure module and each divided laser module can be transferred according to the position of the conductive bonding agent. Each divided pressure module can include a transfer body(123), a pressure member(121) and an actuator(126). The transfer body can be supported by the pressure module supporting unit, capable of being transferred. The pressure member is installed in the transfer body, capable of being elevated. The actuator elevates the pressure member.

Description

Bonding apparatus for electronic component

1 is a configuration diagram schematically showing a bonding device for an electronic component according to an embodiment of the present invention.

2 is a side view showing a part of the configuration of the bonding device for an electronic component according to an embodiment of the present invention.

3 is a side view illustrating an operation of a bonding apparatus for an electronic component according to an embodiment of the present disclosure.

4 is a configuration diagram schematically showing a bonding device for an electronic component according to another embodiment of the present invention.

5 is a side view showing a part of a configuration of a bonding apparatus for an electronic component according to another embodiment of the present invention.

<Description of Signs of Major Parts of Drawings>

10 ... Flat display device 20 ... Drive circuit

30 ... conductive bonding agent 110,210 ... base

120,220 ... Split pressure module 121,221 ... Pressure member

123,223 Moving body 124,125,224 Guide protrusion

126,226 Actuator 130,230 Support Plate

131,133,231 ... Guide rail 140,240 ... split laser module

141,241 ... Radiator 142,242 ... Slider

144,245 ... light source 145,246 ... optical fiber

160,260 ... Control panel 170,270 ... Operation panel

280 ... Pressure module shifter 281,291 ... Motor

282,292 ... Screwbar 290 ... Laser module shifter

The present invention relates to an apparatus for bonding electronic components, and more particularly, to an apparatus for bonding electronic components that electrically connects two electronic components with a laser.

Recently, various production methods and automation devices have been developed to automate the production of electronic products to reduce production time and production costs, thereby modularizing the various electronic components constituting the electronic products and electrically connecting each modular electronic component. The method is widely used. In addition, various conductive bonding agents for electrically connecting each electronic component, and various bonding apparatuses for bonding each electronic component using the conductive bonding agent have been actively released.

Currently, anisotropic conductive film (ACF) is a conductive bonding agent widely used. The anisotropic conductive film is a bonding agent in the form of a double-sided tape in which a resin cured by heat and fine conductive balls are mixed therein, and is particularly useful for bonding thin electronic components. An anisotropic conductive film is interposed between two electronic components, and after receiving a certain heat and pressure, the resin melts and a conductive ball electrically connects the two electronic components. Therefore, in order to bond two electronic components using an anisotropic conductive film, a bonding apparatus capable of simultaneously applying heat and pressure is required.

There is a bonding apparatus using a hot bar as a bonding apparatus for applying heat and pressure to the anisotropic conductive film. The hot bar type bonding apparatus bonds the two electronic components by heating the hot bar while pressing the surface of the electronic component positioned above the two electronic components having the anisotropic conductive film at a constant pressure.

By the way, since the bonding apparatus of the conventional electronic component heats a hot bar using a heater for heat-sealing an anisotropic conductive film, it is difficult to make a hot bar heating time long and to make the temperature of the whole hot bar uniform. In addition, the heat consumption other than the connection site is large, the efficiency is lowered, there is a problem that the hot bar surface is contaminated when used for a long time.

In order to solve the problem of the hot bar type bonding apparatus, a bonding apparatus for applying heat to an anisotropic conductive film using a laser is disclosed in Korean Patent Publication No. 2005-42582 (published on May 10, 2005). The conventional bonding apparatus disclosed in the above publication can reduce the heating time by irradiating a connecting portion of two electronic components with a laser beam generated from a light source through a beam expander to heat only the connecting portion.

However, since the size of the beam expander is determined according to the size of the electronic component, such a conventional electronic component bonding device has a problem of newly designing a bonding apparatus suitable for the electronic component when the electronic component is changed in size. For example, a bonding device for bonding a small electronic component cannot be used to bond a large electronic component, and a bonding device for bonding a large electronic component can be used for bonding a small electronic component, but the efficiency is very low and it can be used to A separate part must be added to block the laser beam from the laser beam to the site.

In addition, in the conventional bonding device for electronic components, since the intensity or irradiation time of the laser beam is set regardless of the characteristics of the electronic components, it is difficult to bond various electronic components having various characteristics, and the bonding time of the electronic components is long. Lose.

The present invention is to solve the above problems, by changing the irradiation position of the laser beam or the intensity of the laser beam in accordance with the size and characteristics of the electronic component, an electronic component capable of bonding electronic components having various sizes and characteristics The purpose of the present invention is to provide a bonding device.

The bonding apparatus for an electronic component according to the present invention for achieving the above object is to combine the two electronic components by applying heat and pressure to the conductive bonding agent interposed between the two electronic components, the electrons are bonded by the conductive bonding agent A plurality of split press modules for pressurizing the contacts between the parts, a plurality of split laser modules for irradiating a laser beam to heat the conductive bonding agent interposed between the respective coupled electronic parts, and And a pressurizing module support means for movably supporting a plurality of divided pressurizing modules, and a laser module support means for movably supporting the plurality of divided laser modules, wherein each of the divided pressurizing modules and each of the divided laser modules are configured as the It can be moved to match the position of the conductive bonding agent.

Here, each of the divided pressure module may include a moving body movably supported by the pressure module support means, a pressure member installed to be liftable on the moving body, and an actuator for lifting the pressure member. .

Each of the divided laser modules is movable by the laser module support means, and includes a beam irradiator for irradiating a laser beam to the conductive bonding agent, a light source for generating a laser beam, and a laser beam generated from the light source. It may include a beam transmitting means for guiding to the beam irradiator.

In addition, the bonding apparatus for an electronic component according to the present invention may further include a pressure module moving device for automatically moving each of the divided pressure modules.

In addition, the bonding apparatus for an electronic component according to the present invention may further include a control device for controlling the operation of the pressure module moving device.

In addition, the bonding apparatus for an electronic component according to the present invention may further include a laser module moving device for automatically moving each of the divided laser modules.

In addition, the bonding apparatus for an electronic component according to the present invention may further include a control device for controlling the operation of the laser module moving device.

Hereinafter, a bonding apparatus for an electronic component according to an embodiment of the present invention will be described with reference to the accompanying drawings.

The bonding apparatus for an electronic component according to an exemplary embodiment of the present invention illustrated in FIGS. 1 to 3 is for bonding a plurality of driving circuits 20 to a flat panel display device 10 such as an LCD.

As shown in FIG. 1 and FIG. 2, the bonding apparatus for an electronic component according to an exemplary embodiment of the present invention includes a base 110 supporting the flat panel display device 10 and a plurality of bonding units installed on the base 110. Of the divided pressurizing module 120, a pair of guide rails 131 and 133 for movably supporting the plurality of divided pressurizing modules 120, and a plurality of divided laser modules installed under the base 110. 140, a guide bar 150 for movably supporting each divided laser module 140, and a control device 160 and an operation panel 170 for controlling the operation of the device.

The base 110 is provided with a flat upper surface, on which an electronic component such as the flat panel display device 10 is placed. The flat panel display device 10 is provided with a conductive pattern portion 11 on an outer side thereof, and is moved to the base 110 with the plurality of driving circuits 20 coupled to the pattern portion 11. Before the flat panel display 10 is moved to the base 110, the conductive bonding agent 30 is placed on a specific portion of the pattern portion 11, and the driving circuits 20 are placed thereon. As the conductive bonding agent 30, an anisotropic conductive film (ACF) may be used as in the related art. The anisotropic conductive film is a mixture of a resin cured by heat and a fine conductive ball therein, and electrically connects the flat panel display device 10 to each driving circuit 20 while the resin melts under heat and pressure. The central portion of the base 110, on which the pattern portion 11 of the electronic component is placed, is opened so that the laser beam irradiated from the plurality of divided laser modules 140 installed under the base 110 may pass therethrough.

Each of the divided pressurizing modules 120 supports the pressurizing member 121 which is lifted to pressurize the surface of each driving circuit 20, and the pressurizing member 121 to be lifted and lifted. The first and second guide rails 131 ( The moving body 123 is installed to be movable in the 133, and the actuator 126 for elevating the pressing member 121. The pressurizing member 121 has a pressurizing portion 122 having a reduced width so as to intensively press a part of an electronic component such as the driving circuit 20 at the lower end.

The moving body 123 supports the pressing member 121 and the actuator 126 and is slidably coupled to the first and second guide rails 131 and 133. The first and second guide rails 131 and 133 are fixed to the support plate 130 by pressure module support means for movably supporting each divided pressure module 120. Each of the first and second guide rails 131 and 133 is provided with first and second guide grooves 132 and 134. These first and second guide grooves 132 and 134 are parallel to each other. The moving body 123 is provided with a first pressing protrusion 124 inserted into the first guide groove 132 and a second pressing protrusion 125 inserted into the second guide groove 134. Therefore, when the user pushes or pulls the movable body 123, the movable body 123 slides left and right along the first and second slide grooves 132 and 134.

The actuator 126 moves the operation bar 127 linearly up and down, and is fixedly installed on the upper portion of the moving body 123. The actuator 126 is provided with an operating bar 127 coupled with the pressing member 121. Actuator 126 in this embodiment is a cylinder that is pneumatically or hydraulically actuated. However, in the present invention, the actuator 126 is not limited to a cylinder, and a linear motor or other linear motion device other than the cylinder may be used.

Each split laser module 140 beams a beam irradiator 141 for irradiating a laser beam to each conductive bonding agent 30, a light source 144 for generating a laser beam, and a laser beam generated from the light source 144. It comprises an optical fiber (beam transmission means, 145) to guide the irradiator 141. The beam irradiator 141 is coupled to the slider 142 that is slidably installed on the guide bar 150 and slides together with the slider 142. The slider 142 includes a slide groove 143 into which the guide bar 150 is inserted. The guide bar 150 is a laser module support means for movably supporting each divided laser module 140 and has a cross-sectional shape corresponding to the shape of the slide groove 143. The cross-sectional shape of the slide groove 143 and the guide bar 150 may be rectangular or other non-circular shape so that the slider 142 does not tilt on the guide bar 150. When the user pushes or pulls each slider 142, each slider 142 slides along the guide bar 150 together with the beam irradiator 141.

Each light source 144 is connected to the control device 160, the control device 160 is connected to the operation panel 170. When the user manipulates the operation panel 170 according to the characteristics of the bonded electronic parts, the control unit 160 controls the intensity of the laser beam generated from each light source 144 or the irradiation time of the laser beam.

In the bonding apparatus for an electronic component according to the exemplary embodiment of the present invention having the above configuration, the plurality of driving circuits 20 are temporarily coupled to the pattern portion 11 of the flat panel display device 10 by the conductive bonding agent 30. When it is moved to the base 110 in a closed state, as shown in FIG. 3, the actuator 126 is operated to lower the pressing member 121. Then, when the pressing member 121 is lowered and the pressing part 122 of the pressing member 121 presses one side of the surface of the driving circuit 20, the laser beam generated from the light source 144 is generated by the optical fiber 145 and the light irradiator. The light is emitted toward the flat display device 10 through 141. The laser beam irradiated to the flat display device 10 is transmitted through the flat display device 10 and absorbed by the conductive bonding agent 30, thereby heating the conductive bonding agent 30. As a result, as the conductive bonding agent 30 is melted, the flat panel display device 10 and the driving circuit 20 are coupled to each other, and the two electronic components 10 and 20 are electrically connected to each other. When the two electronic components 10 and 20 are coupled, the light source 144 stops operating, and the actuator 126 raises the pressing member 121 to its original position.

Meanwhile, when more driving circuits 20 than the number of the divided pressurizing module 120 and the divided laser module 140 are coupled to the flat panel display device 10, each of the divided pressurizing modules 120 and the divided laser modules ( Each driving circuit 20 may be coupled to the flat panel display 10 in sequence while moving the 140.

When the large driving circuit 20 is coupled to the flat display device 10, the flat display device 10 and the driving circuit 20 are moved while the divided pressing module 120 and the divided laser module 140 are moved. The electroconductive bonding agent 30 interposed between can be divided | divided several times, and can pressurize and heat.

4 and 5 are diagrams schematically illustrating a bonding apparatus for an electronic component according to another exemplary embodiment of the present invention.

In the bonding apparatus for an electronic component according to another exemplary embodiment of the present invention shown in FIGS. 4 and 5, the division pressing module 220 and the division laser module 240 are automatically moved. Compared with the split pressure module 220 and the split laser module 240 has a device for automatically moving. In describing the bonding apparatus for an electronic component according to another exemplary embodiment of the present disclosure, detailed descriptions of the same parts as those of the bonding apparatus for the electronic component according to the exemplary embodiment will be omitted.

According to another embodiment of the present invention, a bonding apparatus for an electronic component includes a base 210 supporting two electronic components 10 and 20 coupled to each other, and a plurality of pressurizing elements for pressing the two electronic components 10 and 20. And a plurality of pressurizing module moving apparatuses 280 for automatically moving the divided pressurizing modules 220, a support plate 230 for supporting the plurality of divided pressurizing modules 220, and each divided pressurizing module 220. A plurality of divided laser modules 240 for irradiating a laser beam with a conductive bonding agent 30 interposed between two electronic components, and a laser module moving device 290 for automatically moving each divided laser module 240. And a control device 260 and an operation panel 270 for controlling the operation of the device.

Each divided pressurizing module 220 is moved to raise and lower the pressing member 221 having a pressing unit 222, a moving body 223 for supporting the pressing member 221 to be liftable, and the pressing member 221. It includes an actuator 226 fixed to the body 223. One side of the moving body 223 is provided with a guide protrusion 224 that is slidably inserted into the guide groove 232 of the guide rail 231 is fixed to the support plate 230. In addition, the other side of the moving body 223 is provided with an operating unit 225 provided with a screw hole 226.

Each pressurizing module moving device 280 includes a motor 281 and a screw bar 282 coupled to the motor 281 and inserted into the screw hole 226 of each moving body 223. The motor 281 is fixed to the support plate 230 to enable forward / reverse rotation. When the motor 281 is operated to rotate the screw bar 282, the movable body 223 moves by the interaction of the screw bar 282 and the operation unit 225. The operation of the motor 281 is controlled by the controller 260.

Each split laser module 240 includes a light irradiator 241 for irradiating a laser beam, a light source 245 for generating a laser beam, and an optical fiber for guiding the laser beam generated from the light source 245 to the light irradiator 241. 246. The light irradiator 241 is coupled to the slider 242 which is slidably coupled to the guide bar 250. The slider 242 is provided with a slide groove 243 and a screw hole 244 having a shape corresponding to the shape of the guide bar 250.

Each laser module moving device 290 includes a screw bar 292 inserted into the screw hole 244 of the slider 242, and a motor 291 for rotating the screw bar 292. The motor 291 is controlled by the controller 260 as being capable of forward / reverse rotation. When the motor 291 is driven, the screw bar 292 is rotated so that the slider 242 moves along the screw bar 292 and the guide bar 250.

In the present invention, the pressure module moving device 280 and the laser module moving device 290, in addition to the motor and screw bar, pneumatic cylinder, hydraulic cylinder, rack-pinion device, cam device, or in addition to the divided pressure module 220 And various linear movement devices capable of linearly moving the split laser module 240 from side to side.

In the bonding device for an electronic component according to another embodiment of the present invention having such a configuration, when a user operates the operation panel 270 according to the characteristics of the electronic component or the position of the conductive bonding agent 30, each pressurizing module moving device ( 280 and the laser module moving device 290 automatically move the split pressure module 220 and the split laser module 240 to the conductive bonding agent 30 position. Then, after each of the divided pressing modules 220 pressurizes the surface of each of the driving circuits 20, each of the divided laser modules 240 irradiates a laser beam to each of the conductive bonding agents 30.

On the other hand, the bonding device for an electronic component according to another embodiment of the present invention may further include a sensor for detecting the position of each conductive bonding agent (30). In this case, when the sensor senses the position of the conductive bonding agent 30 and transmits the signal to the control device 260, the control device 260 is the respective pressure module moving device 280 and the laser module moving device 290 ), The divided pressurizing module 220 and the divided laser module 240 may be automatically moved to the respective conductive bonding agent 30 positions.

The bonding apparatus for an electronic component according to the present invention described above has been described as having two divided pressure modules and a divided laser module, but the number of installation of the divided pressure module and the divided laser module may be variously changed.

In addition, the installation position of the split laser module may be an upper portion of the base like the split pressure module. In this case, the split laser module is installed next to the split pressure module so as not to overlap with the split pressure module to irradiate the laser beam obliquely toward the conductive bonding agent.

In the above, the electronic component bonding apparatus according to the present invention has been described as being used in the manufacturing process of the flat panel display apparatus 10. However, the electronic component bonding apparatus according to the present invention manufactures various electronic products other than the flat panel display apparatus 10. It can be used to.

According to the present invention described above, since the irradiation position of the laser beam, the intensity of the laser beam, or the irradiation time of the laser beam can be changed in accordance with the size and characteristics of the electronic component, bonding of various electronic components having various raw material characteristics. You can. Therefore, even if the size or characteristics of the electronic components change in the production of electronic products, there is no need to replace the bonding apparatus, and the bonding time of the electronic components can be reduced.

The present invention described above is not limited to the configuration and operation as illustrated and described. That is, the present invention is capable of various changes and modifications within the spirit and scope of the appended claims.

Claims (7)

In the bonding device for an electronic component to combine the two electronic components by applying heat and pressure to the conductive bonding agent interposed between the two electronic components, Irradiating a laser beam to heat the plurality of divided pressurizing modules for pressurizing the contact portions between the electronic components temporarily coupled by the conductive bonding agent, and the conductive bonding agent interposed between the respective bonded electronic components. A plurality of divided laser modules, a pressurizing module support means for movably supporting the plurality of divided pressurization modules, and a laser module support means for movably supporting the plurality of divided laser modules, wherein each of the divided pressurized modules And each of the divided laser modules is movable in accordance with the position of the conductive bonding agent. The method of claim 1, Each of the divided pressure modules includes a moving body movably supported by the pressure module support means, a pressure member installed on the movable body so as to be liftable, and an actuator for lifting the pressure member. Bonding device for parts. The method of claim 1, Each of the divided laser modules is movably supported by the laser module supporting means, and includes a beam irradiator for irradiating a laser beam to the conductive bonding agent, a light source for generating a laser beam, and a laser beam generated from the light source. Bonding device for an electronic component comprising a beam transmitting means for guiding to the irradiator. The method of claim 1, Bonding device for an electronic component, characterized in that it further comprises a pressure module moving device for automatically moving each of the divided pressure module. The method of claim 4, wherein Bonding device for an electronic component, characterized in that it further comprises a control device for controlling the operation of the pressure module moving device. The method of claim 1, And a laser module moving device for automatically moving each of the divided laser modules. The method of claim 6, And a control device for controlling the operation of the laser module moving device.

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