JPH0590306A - Positioning device of substrate transfer - Google Patents

Abstract

PURPOSE:To provide a positioning device of substrate transfer which is provided with a general purpose positioning means of simple and inexpensive constitution to substrates of all configurations. CONSTITUTION:A plurality of long grooves 60b and 60c for fluid emission of air, etc., are provided to cross each other on a cradle 60 whereon a substrate 31 which is transferred by a substrate transfer means is mounted to perform accurate positioning by emitting fluid in all directions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transport positioning device for transporting a flat substrate and placing the flat substrate on a flat receiving surface of a pedestal for positioning.

[0002]

2. Description of the Related Art Conventionally, a substrate transfer positioning device of this type is provided in, for example, a wire bonding device.

In this wire bonding apparatus, a plurality of lead frames as substrates on which a plurality of semiconductor components (IC chips) are arranged side by side in the longitudinal direction are arranged and accommodated in a magazine, and these lead frames are accommodated. The lead frame transporting device sequentially pushes it out of the magazine and transports it to the bonding position by the bonding means.

In this bonding means, the conveyed lead frame is carried on a bonding stage which is a pedestal heated by a heat block, and an IC chip arranged on the lead frame is connected to surrounding leads and wires. Bonding connection is performed using a bonding tool (capillary).

Further, the lead frame transporting device includes a frame push-out means for sequentially pushing out each of the lead frames arranged in the magazine so that a part of the lead frame projects outside the magazine, and a lead frame pushed out by the frame push-out means. It has a frame transfer unit for intermittently feeding each IC chip on the lead frame by the arrangement pitch and transferring it to a bonding position, that is, a substrate transfer unit.

FIG. 3 is a plan view of a lead frame carrying device provided in a conventional wire bonding device.

As shown in FIG. 3, this lead frame carrying device is provided with a plurality of substantially rectangular lead frames 31.
Has a magazine receiver 33 carrying a magazine 32 arranged and housed in the vertical direction, that is, in a direction perpendicular to the paper surface,
An elevating mechanism 35 for intermittently descending or ascending by the array pitch of the lead frames 31 housed in the magazine.
And a push mechanism 37 for pushing out the lead frames 31 in the magazine 32 one by one in synchronization with the operation of the elevating mechanism 35. The elevating mechanism 35 and the push mechanism 37 constitute the frame pushing means described above. Further, on the side of the elevating mechanism 35, there is provided a frame transfer means 39 for transferring the lead frame 31 pushed out of the magazine to a bonding position 41 by a bonding means described later.

The detailed structure of the lifting mechanism 35 has been filed by the applicant as Japanese Patent Application No. 1-108382, and therefore the detailed structure will not be described in detail. Further, the structure of the frame transfer means 39 is also disclosed in, for example, Japanese Utility Model Laid-Open No. 61-156233, so the description will be limited to the following.

The frame transfer means 39 is arranged so as to sandwich the lead frame 31 projecting from the magazine 32 from both sides in the width direction thereof, and is capable of relatively approaching and separating from each other so as to guide the lead frame. The guide rails 42 and 43, the feed screws 44 and 45 threadedly engaged with the guide rails 42 and 43, and the motors 46 and 47 for applying torque to the feed screws 44 and 45 are provided. A rail drive mechanism connecting 42 and 43, and a driving force that gives a driving force to the lead frame 31 so that the lead frame 31 can move in the bonding position 41 direction along both guide rails 42 and 43. And a granting means.

The motors 46 and 47 are normally or reversely rotated by a command from a control circuit (not shown) so as to widen or narrow the rail interval so as to cope with a change in the frame width dimension due to the exchange of lead frame types. It is configured. In addition, the magazine 3 by the frame pushing means
The sensor 50 which detects that the lead frame 31 extruded from 2 has reached the position where the driving force can be applied by the driving force applying means provided in the frame transfer means, that is, the transfer starting position, and issues a detection signal. Is provided.

On the other hand, the driving force applying means has a pair of feed arms 58 and 59 for sandwiching the end portion in the width direction of the lead frame 31 from above and below, as shown in FIGS. 4 to 11, and these feed arms 58 and 59. In order to clamp and release the lead frame 31, arm driving means (not shown) that is relatively driven up and down and both feed arms 58 and 59 are horizontally moved and positioned on the bonding stage. And a drive source (not shown).

The push mechanism 37, which constitutes the frame pushing means together with the elevating mechanism 35 described above, includes a base 52 and a guide shaft 5 fixedly mounted on the base 52.
3, a slider 54 guided by the guide shaft 53, and a pusher 55 that is attached to the slider 54 and abuts the lead frames 31 one by one at their tips to push them out of the magazine 32. , The pusher 5 provided on the base 52 via the slider 54.
5 and an air cylinder 56 that drives the motor 5.

FIGS. 12 and 13 show the IC on the lead frame 31 conveyed to the bonding position 41 shown in FIG.
FIG. 9 is a diagram showing a bonding means for performing a bonding operation on a chip 59.

As shown in FIGS. 12 and 13, this bonding means includes a bonding stage 60 carrying a lead frame 31, and this bonding stage 60.
A heat block 61 for heating the wire, a bonding tool (capillary) 62 for supplying a wire such as a gold wire or an aluminum wire, and a lead frame retainer 63 for pressing the lead frame 31 toward the bonding stage 60 to determine the position. And a contacting / separating means for moving the lead frame 31 toward and away from the bonding stage 60 in order to press the lead frame 31 and release the lead frame 31.

The bonding tool 62 is attached to the tip of a vibrating horn 64 for amplifying and applying ultrasonic vibration, and through the horn 64, the bonding tool 62 is directed in the direction of arrow S, that is, the lead. Ultrasonic vibration is applied in a direction parallel to the main surface of the frame 31.

Next, the operation of the wire bonding apparatus having the above structure will be described.

First, in FIG. 3, the spacing between both guide rails 42 and 43 is adjusted so as to match the width dimension of the lead frame 31 conveyed by the rotation of the motors 46 and 47 according to a command from a control circuit (not shown). To be done. After this,
Push the output shaft of the air cylinder 56 into the pusher 55
Is moved in the direction of arrow X. Then, of the plurality of lead frames 31 arranged and accommodated in the magazine 32, for example, the tip end of the pusher 55 comes into contact with the rear end of the lowermost one and pushes the lead frame by a certain amount a to the outside of the magazine 32. Make it protrude. Then, the sensor 50 detects the tip of the lead frame 31, and the lead frame 31
It has been confirmed that the frame has reached the transfer start position where it can be transferred by the frame transfer means 39.

Next, the frame transfer means 39 is operated as shown in FIGS. 4 to 11, the lead frame 31 is transferred to the bonding stage 60, and FIGS.
By the bonding means shown in FIG.
Bonding work is sequentially performed on the above IC chips. However, in FIG. 12, among the IC chips arranged on the lead frame 31, the number of IC chips counted from the earliest one is 3
A state is shown in which a bonding operation is being performed on the second IC chip.

In the bonding means shown in FIGS. 12 and 13, first, the lead frame retainer 63, which was in the raised position, is lowered to the position shown in FIG. 13, and the lead frame 31 is pressed toward the bonding stage 60 for positioning. Next, the bonding tool 62 in the raised position is moved and controlled by an XY table (not shown) and positioned.
The bonding work is performed by descending to the position indicated by. In this way, for example, the third IC chip 5 from the front
When the bonding work for 9 is completed, the bonding tool 62 and the lead frame retainer 63 are raised,
After that, the lead frame 31 is driven by one pitch of the arrangement pitch of the IC chips, and the fourth IC chip reaches the bonding work position.

By repeating this series of operations, the lead frame 31 for which the bonding operation for all the IC chips has been completed is further driven in the direction of arrow X by the frame transfer means 39, and is collected in the magazine on the unloader side.

Following this, or in conjunction with the series of operations described above, the magazine receiver 33 of the elevating mechanism 35 descends by one pitch of the lead frame arrangement pitch, and the second lead frame corresponds to the pusher 55. Will be brought to the position. Hereinafter, the above series of operations is sequentially repeated for the second and subsequent lead frames.

FIG. 14 is a plan view showing a state in which the pad 59a on the IC chip 59 and the lead 31 on the lead frame 31 side are connected by the wire 65 by the wire bonding device.

In FIG. 14, the ball 65a formed at the tip of the wire 65 is crushed by the bonding tool 62 onto the pad 59a serving as the first bonding point and thermocompression bonded, and then the lead serving as the second bonding point. A state of being bonded and connected to 31 is shown.

By the way, in the apparatus having the above structure, the lead frame 3 transferred by the frame transfer means 39.
1, that is, the substrate is placed on a bonding stage 60 (usually heated by a heater arranged below the stage) as a pedestal, but as shown in FIG. Due to the action of heating fluid such as air that enters the lower surface of the lead frame 31, the lead frame 31 floats on the bonding stage 60 and is displaced from the regular mounting position.

Therefore, the lead frame 31 can be positioned by providing a mechanism for engaging the L-shaped positioning member 68 as shown in FIG. 16 with the corner of the lead frame 31 on the bonding stage 60. Is configured.

Others As shown in FIG. 17, by providing a leaf spring-like pressing member 70 on the upper surface of one guide rail 42, the lead frame 31 is forcibly pressed toward the bonding stage 60, so that the lead frame 31 is conveyed. It is also practiced to prevent the entry of heating fluid.
As the frame transfer means, in addition to the frame-holding type shown in FIGS. 4 to 11, a belt conveyor type is often adopted, but in this case as well, a shift due to air entrapment occurs. Therefore, the positioning means shown in FIGS. 16 and 17 is required.

[0027]

However, the conventional apparatus has the following drawbacks due to the change of the frame shape due to the kind change of the lead frame to be transferred and positioned. That is, it is necessary to replace the positioning member 68 and the pressing member 70 due to the difference in frame shape. Particularly, in the case of the configuration shown in FIG.
There is a drawback that not only a mechanism for driving 8 is required, but also positioning adjustment must be performed. Also,
Since the apparatus shown in FIG. 17 needs to be mounted on the upper surface of one guide rail 42, not only is there a restriction on the mounting location or the like due to the difference in height between the guide rail 42 and the upper surface of the bonding stage 60, but also the board Since it is pressed from the upper surface of the board, it is difficult to limit the thickness of the substrate and adjust the pressing force,
In addition, if there is a semiconductor component or the like already attached to the upper surface of the substrate, the pressing member 70 may damage the semiconductor component or the like. Therefore, the conventional device lacks general versatility and has a drawback that the structure for positioning the lead frame becomes complicated and the cost is increased.

Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and provides a substrate transfer positioning device having a positioning means which can be commonly used for substrates of all shapes with an extremely simple and inexpensive structure. The purpose is to do.

[0029]

SUMMARY OF THE INVENTION According to the present invention, a pedestal having a flat receiving surface for placing a substrate, and the substrate is transferred in parallel to its main surface and placed on the pedestal. And a plurality of longitudinal grooves are formed on the receiving surface.

[0030]

EXAMPLE An example of a wire bonding apparatus including a substrate transfer positioning apparatus according to the present invention will be described below. The wire bonding apparatus according to the present invention is configured in the same manner as the conventional apparatus shown in FIGS. 3 to 15 except for the parts described below, and therefore the entire apparatus will not be described in detail. In the following description, the same or corresponding parts as those of the conventional device will be described using the same reference numerals.

As shown in FIG. 1, a frame transfer means 39 as a substrate transfer means after being projected from a magazine 32 (shown in FIG. 3) by a push mechanism 37 (shown in FIG. 3).
(See FIGS. 3 to 5), the transferred lead frame 31, that is, the substrate is flattened on the bonding stage 60 (the stage is heated by the cartridge heater disposed below) as a pedestal. It is placed on the receiving surface. As shown in the drawing, the frame transfer means 3 is provided on the receiving surface 60a of the bonding stage 60.
9 Lead frame 31 transfer direction (arrow X direction)
For example, three longitudinal grooves 60b are formed so as to extend at. The longitudinal grooves 60b are formed at equal intervals. In addition, the longitudinal groove 6 is formed on the receiving surface 60a.
For example, four long grooves 60c intersecting at right angles to 0b
Are formed at equal intervals. This longitudinal groove 60b
And 60c form a lattice-shaped groove on the bonding stage 60.

The heating fluid such as air that has entered the lower surface side of the lead frame 31 during the transfer by the frame transfer means 39 is placed in the longitudinal grooves 60b and 60c at the same time when the lead frame 31 is placed on the bonding stage 60. It is guided and discharged laterally, that is, in all directions, as shown by arrows A and B. As a result, the lead frame 31 is reliably positioned without floating on the bonding stage 60 so as to reach the position positioned by the frame transfer means 39.

FIG. 2 is a view showing a modification of the form of the longitudinal groove formed on the bonding stage 60.

As shown, this bonding stage 6
0 on the center of the bonding stage 60 in a radial manner, for example, 12 long grooves 60a to 60.
o is formed. In addition, each of the longitudinal grooves 60a to 60
For example, a circular recess 60p is formed at the intersection of o, and the longitudinal grooves 60a to 60o communicate with each other through the recess 60p. With this configuration as well, similar to the configuration shown in FIG. 1, the longitudinal groove is positioned so as to be placed at a predetermined position by the action of releasing the heating fluid such as air.

The form of the longitudinal grooves formed on the bonding stage 60 is not limited to the above-mentioned lattice-like or radial form, but various forms can be used as long as the heating fluid such as air can be discharged in all directions. Needless to say, can be adopted. In addition, in the present embodiment, the case where it is applied to the wire bonding apparatus is described.
Of course, it can be applied to other bonding devices and the like. Further, in the present embodiment, the heating fluid that can obtain a greater positioning effect has been described, but it goes without saying that the same effect can be obtained even in the case of a fluid such as unheated air.

[0036]

As described above, according to the present invention,
Since the substrate is positioned by the fluid discharge action of the longitudinal groove formed on the pedestal, there is an effect that the structure is simple and inexpensive, and it has versatility for substrates of all shapes.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of a wire bonding apparatus according to the present invention.

FIG. 2 is a perspective view showing a modified example of the bonding stage shown in FIG.

FIG. 3 is a plan view including a partial cross section of a wire bonding apparatus including a conventional substrate transport positioning device.

FIG. 4 is a side view of frame transfer means included in the wire bonding apparatus shown in FIG.

FIG. 5 is a view taken along the line EE of FIG.

FIG. 6 is an operation explanatory view of the frame transfer means shown in FIG.

FIG. 7 is a view on arrow F-F of FIG. 6.

FIG. 8 is an operation explanatory diagram of the frame transfer unit shown in FIG. 4;

9 is a view taken along the line GG in FIG.

10 is an operation explanatory view of the frame transfer means shown in FIG.

11 is a view taken along the line HH of FIG.

FIG. 12 is a plan view showing a bonding means of the wire bonding apparatus shown in FIG.

FIG. 13 is a view as seen in the direction of arrows I-I in FIG. 12.

FIG. 14 is a plan view of a connecting portion bonded and connected by the bonding means shown in FIGS. 12 and 13.

15 is a perspective view showing a state in which a lead frame is transferred onto a bonding stage included in the wire bonding apparatus shown in FIG.

16 is a perspective view showing the bonding stage shown in FIG. 15 and its peripheral mechanism.

FIG. 17 is a perspective view showing the bonding stage shown in FIG. 15 and its peripheral mechanism.

[Explanation of sign]

 31 Lead Frame (Substrate) 39 Frame Transfer Means (Substrate Transfer Means) 60 Bonding Stage (Receiver) 60a Receiving Surface 60b to 60o Longitudinal Groove

Claims (1)

[Claims] 1. A pedestal having a flat receiving surface for placing a substrate thereon, and a substrate transfer means for transferring the substrate parallel to its main surface and placing it on the pedestal. A substrate transfer positioning device, wherein a plurality of longitudinal grooves are formed on the receiving surface.