JP3253761B2 - Outer bonding apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an outer bonding apparatus for connecting an outer lead of a TCP component (tape carrier package) to a wiring pattern of a printed circuit board, for example.

[0002]

2. Description of the Related Art In recent years, TAB (Tape Automated Bonding)
) TCP parts (Tape Carrie)
r Package) is being incorporated into particularly thin electronic devices.

[0003] The TCP component is as shown by 1 in FIG. 2 and uses a cine-film-like film carrier 4 on which an inner lead 2 and an outer lead 3 are formed. In this TCP component 1, after bonding the semiconductor element 5 to the inner lead 3 of the film carrier 4, the film carrier 4 is punched along the outer lead 3, and the outer lead 3 is formed into a gull-wing shape. It is manufactured by forming.

The TCP component 1 is mounted by placing the outer leads 3 on a wiring pattern 7 of a printed circuit board 6 (substrate), and placing the outer leads 3 on the wiring. Joining to pattern 7 (outer lead bonding)
By doing so, it is mounted on the printed circuit board 6.

[0005] According to such a TCP component 1, it is easy to easily realize a multi-pin narrow pitch. However, since the film carrier 4 has a cine film shape as described above, the film carrier 4 is easily deformed, and the outer lead 3 is minute and easily deformed.

Conventionally, an outer bonding apparatus for mounting such a TCP component 1 on a printed circuit board 6 has a configuration as shown in FIG. 8 in the figure shows this T
The suction nozzle holds the TCP component 1 by sucking the upper surface of the CP component 1. A bonding tool 9 for heating and pressurizing the outer lead 3 of the TCP component 1 on the printed circuit board 6 and a holder 10 for holding the bonding tool 9 are provided radially outside the suction nozzle 8.
Is provided.

In general, the suction nozzle 8 and the holder 10 holding the bonding tool 9 are both connected to the same driving source via a spring (not shown). Therefore, the suction nozzle 8 is connected to the bonding tool.
9 is simultaneously driven up and down. However, if the movement of the suction nozzle 8 is restricted during the lowering, for example, only the spring attached to the suction nozzle 8 is compressed, and the bonding tool 9 can continue to lower as it is.

Next, the outer bonding process will be described with reference to FIGS. FIG.
As shown in FIG. 1A, wiring patterns 7 corresponding to the outer leads 3 of the TCP component 1 are formed on the printed circuit board 6. As shown in FIG. 4A, a solder material 11 is previously formed on the wiring patterns 7.
Is supplied.

Next, as shown in FIG.
The suction nozzle 8 and the bonding tool 9 which hold the CP component by suction are positioned above the wiring pattern 7 and descend to lower the outer leads 3... Of the TCP component 1 to the wiring pattern. 7 is brought into contact with the solder material 8.

In this state, the lowering of the suction nozzle 8 stops, but the bonding tool 9 further lowers.
As shown in FIG. 3 (c), it comes into contact with the upper surface of the outer lead 3. The outer leads 3 are connected to the wiring patterns 7 by the elastic force of a spring (not shown).
(Solder material 11) and heated to melt the solder material 11, so that all of the outer
Are thermally bonded to the wiring patterns 7 collectively. Thus, the TCP component 1 is outer bonded to the printed circuit board 6.

[0011]

The conventional outer bonding apparatus has the following problems to be solved. That is, although the TCP component 1 is multi-pin (multi-terminal) large, such a large TCP component 1 has a disadvantage that the film carrier 4 is flexible.
Deformation such as warpage tends to occur by itself. If the film carrier 4 is warped, there will be a difference in the height of the tip of each of the outer leads 3 as shown in FIG.

When all of the outer leads 3 are brought into contact with the solder material 11 supplied to the wiring pattern 7, the outer leads 3 at the center shown in FIG. It will be pressed strongly and for a long time.

Since the solder material 11 is supplied in a semi-cylindrical shape, the outer lead 3 strongly pressed as described above is used as shown in FIG.
Laterally along the surface of the outer lead 3 to come into contact with the adjacent outer lead 3 or insufficient bonding strength.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has as its object to provide an outer bonding apparatus capable of performing outer bonding of a TCP component in a satisfactory manner.

[0015]

According to a first aspect of the means of the present invention includes a holding mechanism that holds the TCP part, the T in the pressing surface
Pressurizing the outer lead of the CP component to a wiring pattern provided on the substrate and heated, the outer lead bonding apparatus comprising a bonding tool for bonding to the wiring pattern, a holding mechanism drive means for drive the said holding mechanism, a bonding tool drive means for drive the above bonding tool to detect the lead TCP component held in the holding mechanism, the plane in which the pressing surface abuts against the bonding tool of the pressing surface and the lead of the bonding tool And an outer lead detecting means for obtaining a relative drive amount of the suction nozzle necessary for bringing the suction tool into contact with the bonding tool.

According to a second aspect of the present invention, there is provided an outer lead bonding method for connecting an outer lead of a TCP component held by a holding mechanism to a wiring pattern provided on a substrate by heating and pressing using a bonding tool. , the TCP part which is retained in the retention mechanism to detect the surface in contact with the wiring pattern of the outer lead, a first step of detecting a position of the outer leads which this surface located nearest the substrate, the detected outer leads based on the position, by relatively moving the aforementioned holding mechanism and a bonding tool, a second step of abutting the pressing surface of the outer lead and the bonding tool is held in the holding mechanism
TCP component with which the bonding tool was
A third step of relatively driving the board and pressurizing and heating the outer leads of the TCP component to the wiring pattern provided on the substrate to connect the outer leads to the wiring pattern. Outer lead bonding method.

[0017]

According to such a construction, all outer
After the heights of the leads have been adjusted, all the outer leads can be pressed against the wiring pattern almost simultaneously and connected collectively.

[0018]

An embodiment of the present invention will be described below with reference to the drawings. The same components as those described in the conventional example are denoted by the same reference numerals, and description thereof will be omitted. FIG.
As shown in (a), the outer lead bonding apparatus of the present invention includes a suction nozzle (holding mechanism) 15 capable of sucking the upper surface of the TCP component 1 (see FIG. 2), and the suction nozzle 1
5, four bonding tools 16 (only two are shown in the figure) provided so as to correspond to the outer leads 3 projecting in four directions of the TCP component 1.

Each of the bonding tools 16 includes a heating chip 17 that is heated by being supplied with electric power,
And a holder 18 for holding the upper part of The lower end face 17a of the heating chip 17 is provided with the outer leads 3... On a wiring pattern provided on an external substrate such as the printed circuit board 6.
7 are pressed against each other.

The suction nozzle 15 is connected to suction nozzle driving means 19 for vertically driving the suction nozzle 15 via a spring (not shown). On the other hand, the bonding tool 16 is similarly connected to a bonding tool driving means 20 for vertically driving the bonding tool 16 via a spring (not shown). That is, unlike the conventional example, the suction nozzle 15 and the bonding tool 16 are respectively connected to the driving means 1.
5 and 16 are independently driven up and down.

On the other hand, this outer lead bonding apparatus comprises outer lead detecting means 22 shown in FIG.
3 is provided. The outer lead detection means 22 detects the position (height) of the lower surface of each of the outer leads 3 of the TCP component 1 by scanning the laser beam L and observing the reflected laser beam L '. The printed board detecting means 23 similarly detects the height of the upper surface of the printed board 6 by scanning the laser light L.

The outer lead detecting means 22 includes:
It is connected to the arithmetic and control unit 24. This operation control unit 24
Receives the height signal of the outer lead 3 from the outer lead detecting means 22 and determines that the distance from the printed circuit board 6 is
The position of the closest (lowest) outer lead 3 (high
) Is obtained, and a driving signal based on this is sent to the suction nozzle driving means 19.

Next, the operation of this bonding apparatus will be described with reference to FIG.
This will be described with reference to (a) to (c). First, the outer bonding apparatus receives the TCP component 1 from the TCP component conveying means (not shown) by suction-holding the TCP component 1 using the suction nozzle 15.

Next, this outer lead bonding apparatus rotates the suction nozzle 15 to rotate the T.
After correcting the attitude of the CP component 1, the TCP component 1 is transported above the printed circuit board 6, and the outer lead 3 and each wiring pattern 7 face each other as shown in FIG. Position.

When the outer lead 3 and the wiring pattern 7 are positioned, the outer lead detecting means 22
Scans the laser beam L, and irradiates each outer lead 3 with the laser beam L. Then, the height of each outer lead 3 is obtained by observing the reflected laser light.

The arithmetic control unit 24 determines the lowest outer lead 3 among the outer leads 3 of the TCP 1 based on the signal from the outer lead detecting means 22. Then, the lower end surface 17a of the heating chip 17
From the relative positional relationship between the outer leads 3 and the relative position of the outer leads 3, the amount of rise of the suction nozzle 15 required to bring the upper surface of the lowermost outer lead 3 into contact with the lower end surface 17a of the heating tip 17 is determined. Ask. Then, the rising amount 15 is input to the suction nozzle driving means 19.

Next, the suction nozzle driving means 19
The suction nozzle 15 is driven upward by the above-described amount. As a result, the TCP component 1 has an upper surface of the lowest outer lead 3 and a lower end surface 17 a of the heating chip 17.
Rise until it abuts. Thus, the lowest the upper surface of the outer lead 3 be to contact the lower end surface 17a of the heating tip 17, the lower end surface 17a of the heating chip 1 7 all outer lead 3 ... a, as shown in FIG. 1 (b) Can be abutted. As a result, the heights of all the outer leads 3 are made uniform.

On the other hand, the printed circuit board detecting means 23
Similarly, the height of the printed circuit board 6 (wiring pattern 7) is detected by scanning the laser light L. As a result, the height difference between the outer lead 3 and the printed circuit board 6, that is, the bonding tool 16 is
The amount of descent required to press the gate 3 against the wiring pattern 7 is determined.

Next, the suction nozzle driving means 19 and the bonding tool driving means 20 operate based on a detection signal from the printed circuit board detecting means 23, and the suction nozzle 15 and the bonding tool 16 are simultaneously and simultaneously. It is driven down at the same speed. Then, as shown in FIG. 1C, the bonding tool 16
The outer lead 3 of the CP component 1 is pressed against the wiring pattern 7 of the printed circuit board 6 while heating.

At this time, all the outer leads 3 are
Since the heights are uniform, they come into contact with the wiring pattern 7 almost at the same time. At the same time, it is pressed against the wiring pattern 7 by the same force, and bonded to the wiring pattern 7.

According to such a configuration, the outer lead 3
Therefore, since the pressing time is not different and the force pressed against the wiring pattern 7 is not different, the lateral displacement of the outer lead 3 as in the conventional example is effectively prevented. This makes it possible to perform good bonding of the TCP component 1.

Further, since all the outer leads 3 are in contact with the lower end surface 17a of the heating tip 17 and are heated to a predetermined temperature in advance, the solder material 11 can be instantaneously melted. . This also improves the bondability.

The present invention is not limited to the above-described embodiment, but can be variously modified without changing the gist of the invention. In the above embodiment, the suction nozzle 15 (the TCP component 1) is driven upward to bring all the outer leads 3 of the TCP component 1 into contact with the lower end face 17a of the heating chip 17 (the bonding tool 16). However, the present invention is not limited to this.

For example, without driving the suction nozzle 15 (TCP component 1), the bonding tool 16 is driven downward to lower the lower end surface 17a of the heating chip 17 to the outer space.
It may be made to abut on the door 3. Alternatively, the bonding tool 16 may be driven downward and the suction nozzle 15 may be driven upward to bring the outer lead 3 of the TCP component 1 into contact with the lower end face 17a of the heating chip 17. Similar effects can be obtained.

[0035]

As described above, the first means of the present invention comprises a suction nozzle for sucking and holding a TCP component, and a wiring pattern in which the outer lead of the TCP component is provided on the substrate at the lower end surface. A suction nozzle driving means for driving the suction nozzle up and down, and a bonding tool for vertically moving the bonding tool, the bonding tool being provided with a bonding tool for applying pressure and heating to the wiring pattern. A driving tool for driving the bonding tool and a lead of the TCP component held by the suction nozzle are detected, and a lower end surface of the bonding tool and a lower end surface of the bonding tool of the lead are detected. An outer having an outer lead detecting means for obtaining a relative drive amount of the suction nozzle and the bonding tool necessary for bringing the contact surface into contact.
Bonding apparatus.

The second means is to connect the outer lead of the TCP component sucked and held by the suction nozzle to a wiring pattern provided on the substrate by heating and pressurizing the outer lead using a bonding tool. In the bonding method, the surface of the outer lead of the TCP component sucked and held by the suction nozzle is detected in contact with the wiring pattern, and the height of the outer lead which is closest to the substrate is detected. The suction nozzle and the bonding tool are relatively moved based on the height of the detected outer lead, and the outer lead is moved to the bonding tool.
A second step of bringing the suction nozzle and the bonding tool into contact with the pressing surface of the tool;
A third step of connecting the outer lead to the wiring pattern by pressing and heating the outer lead of the P component to the wiring pattern provided on the substrate.
Bonding method.

According to such a configuration, all the outer leads are made uniform in height before joining, so that the outer leads are pressed against the wiring pattern with almost the same force at substantially the same time.
Since the outer leads are not bonded to each other, there is no difference in the pressing time or the force pressed against the wiring pattern, so that the outer leads are effectively prevented from laterally rubbing. Is done. This makes it possible to perform good bonding of the TCP component.

[Brief description of the drawings]

1 (a) to 1 (c) are process diagrams showing one embodiment of the present invention.

FIG. 2 is a perspective view showing a general TCP component.

FIGS. 3A to 3C are process diagrams showing a conventional example.

FIGS. 4 (a) and 4 (b) are similarly enlarged process views.

[Description of Signs] 1 ... TCP component, 3 ... Outer lead, 6 ... Printed circuit board (board), 7 ... Wiring pattern, 15 ... Suction nozzle, 16
... bonding tool, 17a ... lower end face, 19 ... suction nozzle driving means, 20 ... bonding tool driving means, 2
2 ... outer lead detecting means, 24 ... operation control section (outer lead detecting means).

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 311 H01L 23/50

Claims (2)

(57) [Claims] 1. A holding mechanism of the TCP part to hold, the outer leads of the TCP component pressure, heated to a wiring pattern provided on the substrate by the pressing surface comprises a bonding tool for bonding to the wiring pattern in the outer lead bonding apparatus detects a holding mechanism drive means for drive the said holding mechanism, a bonding tool drive means for drive the above bonding tool, the leads of TCP component held in the holding mechanism, the bonding tool that pressing surface of the bonding tool of the pressing surface and the lead comprises a outer lead detection means for obtaining a relative drive amount of the suction nozzle and the bonding tool required to contact the surface to be abutted Outer lead bonding equipment. 2. A method outer leads of TCP component held by the holding mechanism, by applying heat using a bonding tool pressure, the outer lead bonding method to connect to a wiring pattern provided on a substrate, are retained in the retention mechanism the surface in contact with the wiring pattern of the outer lead of the TCP part detects the a first step of detecting a position of the outer leads which this surface located nearest the substrate, based on the detected position of the outer leads, the holding Machine
A second step of relatively moving the structure and the bonding tool and bringing the outer lead into contact with the pressing surface of the bonding tool; and contacting the bonding tool held by the holding mechanism.
Relative movement of the TCP component and the base,
A third step of connecting the outer leads to the wiring pattern by pressurizing and heating the outer leads of the CP component to the wiring pattern provided on the substrate.