KR20210146410A - 본딩 장치, 프레임 피더 및 히터 유닛 - Google Patents

본딩 장치, 프레임 피더 및 히터 유닛 Download PDF

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Publication number
KR20210146410A
KR20210146410A KR1020217037044A KR20217037044A KR20210146410A KR 20210146410 A KR20210146410 A KR 20210146410A KR 1020217037044 A KR1020217037044 A KR 1020217037044A KR 20217037044 A KR20217037044 A KR 20217037044A KR 20210146410 A KR20210146410 A KR 20210146410A
Authority
KR
South Korea
Prior art keywords
lead frame
unit
bonding
heater
heater block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020217037044A
Other languages
English (en)
Korean (ko)
Inventor
카즈아키 나가노
마사토 코지마
타카마사 미야치카
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20210146410A publication Critical patent/KR20210146410A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
    • H01L2224/78281—Resistance welding electrodes, i.e. for ohmic heating in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/785—Cooling means
    • H01L2224/78501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
KR1020217037044A 2020-03-06 2020-03-06 본딩 장치, 프레임 피더 및 히터 유닛 Withdrawn KR20210146410A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (1)

Publication Number Publication Date
KR20210146410A true KR20210146410A (ko) 2021-12-03

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217037044A Withdrawn KR20210146410A (ko) 2020-03-06 2020-03-06 본딩 장치, 프레임 피더 및 히터 유닛

Country Status (5)

Country Link
JP (1) JP7216451B2 (enrdf_load_stackoverflow)
KR (1) KR20210146410A (enrdf_load_stackoverflow)
CN (1) CN113785385A (enrdf_load_stackoverflow)
SG (1) SG11202111143PA (enrdf_load_stackoverflow)
WO (1) WO2021176739A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11315808B2 (en) * 2017-08-01 2022-04-26 Shinkawa Ltd. Frame feeder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169340A (ja) 1986-01-21 1987-07-25 Nec Corp 半導体装置組立用ワイヤボンデイング装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529343B2 (ja) * 1988-03-24 1996-08-28 松下電器産業株式会社 ワイヤボンディング装置
JP2531024Y2 (ja) * 1988-10-05 1997-04-02 松下電器産業株式会社 セラミック基板の共晶加熱ボンディング装置
JP3231882B2 (ja) * 1993-03-09 2001-11-26 ソニー株式会社 リードフレームの加熱機構
KR100546280B1 (ko) * 1999-01-05 2006-01-26 삼성전자주식회사 롱 루프 와이어 본딩을 위한 히터블록
US11315808B2 (en) * 2017-08-01 2022-04-26 Shinkawa Ltd. Frame feeder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169340A (ja) 1986-01-21 1987-07-25 Nec Corp 半導体装置組立用ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPWO2021176739A1 (enrdf_load_stackoverflow) 2021-09-10
SG11202111143PA (en) 2021-11-29
CN113785385A (zh) 2021-12-10
WO2021176739A1 (ja) 2021-09-10
JP7216451B2 (ja) 2023-02-01

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

PC1202 Submission of document of withdrawal before decision of registration

St.27 status event code: N-1-6-B10-B11-nap-PC1202