JP7216451B2 - ボンディング装置、フレームフィーダ及びヒータユニット - Google Patents

ボンディング装置、フレームフィーダ及びヒータユニット Download PDF

Info

Publication number
JP7216451B2
JP7216451B2 JP2021549567A JP2021549567A JP7216451B2 JP 7216451 B2 JP7216451 B2 JP 7216451B2 JP 2021549567 A JP2021549567 A JP 2021549567A JP 2021549567 A JP2021549567 A JP 2021549567A JP 7216451 B2 JP7216451 B2 JP 7216451B2
Authority
JP
Japan
Prior art keywords
lead frame
bonding
heater
unit
depth direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021549567A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021176739A1 (enrdf_load_stackoverflow
Inventor
一昭 長野
和仁 小島
峻匡 宮近
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of JPWO2021176739A1 publication Critical patent/JPWO2021176739A1/ja
Application granted granted Critical
Publication of JP7216451B2 publication Critical patent/JP7216451B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/7828—Resistance welding electrodes, i.e. for ohmic heating
    • H01L2224/78281—Resistance welding electrodes, i.e. for ohmic heating in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/785—Cooling means
    • H01L2224/78501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2021549567A 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット Active JP7216451B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (2)

Publication Number Publication Date
JPWO2021176739A1 JPWO2021176739A1 (enrdf_load_stackoverflow) 2021-09-10
JP7216451B2 true JP7216451B2 (ja) 2023-02-01

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021549567A Active JP7216451B2 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Country Status (5)

Country Link
JP (1) JP7216451B2 (enrdf_load_stackoverflow)
KR (1) KR20210146410A (enrdf_load_stackoverflow)
CN (1) CN113785385A (enrdf_load_stackoverflow)
SG (1) SG11202111143PA (enrdf_load_stackoverflow)
WO (1) WO2021176739A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11315808B2 (en) * 2017-08-01 2022-04-26 Shinkawa Ltd. Frame feeder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026916A1 (ja) 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646646B2 (ja) 1986-01-21 1994-06-15 日本電気株式会社 半導体装置組立用ワイヤボンデイング装置
JP2529343B2 (ja) * 1988-03-24 1996-08-28 松下電器産業株式会社 ワイヤボンディング装置
JP2531024Y2 (ja) * 1988-10-05 1997-04-02 松下電器産業株式会社 セラミック基板の共晶加熱ボンディング装置
JP3231882B2 (ja) * 1993-03-09 2001-11-26 ソニー株式会社 リードフレームの加熱機構
KR100546280B1 (ko) * 1999-01-05 2006-01-26 삼성전자주식회사 롱 루프 와이어 본딩을 위한 히터블록

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026916A1 (ja) 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Also Published As

Publication number Publication date
JPWO2021176739A1 (enrdf_load_stackoverflow) 2021-09-10
SG11202111143PA (en) 2021-11-29
CN113785385A (zh) 2021-12-10
KR20210146410A (ko) 2021-12-03
WO2021176739A1 (ja) 2021-09-10

Similar Documents

Publication Publication Date Title
US7861908B2 (en) Component mounting method, component mounting apparatus, and ultrasonic bonding head
JP7216451B2 (ja) ボンディング装置、フレームフィーダ及びヒータユニット
KR100700317B1 (ko) 다이를 부착하기 위한 장치 및 방법
TWI788622B (zh) 接合裝置、導線架饋入器以及加熱單元
US7637411B2 (en) Wire bonding apparatus and process
JP4014579B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
WO2022029916A1 (ja) 実装装置及び実装方法
JP4056276B2 (ja) 部品実装方法及び装置
KR102707392B1 (ko) 접합헤드 및 이를 구비하는 접합 장치
JP4109000B2 (ja) 電子部品実装装置
JP2703272B2 (ja) ワイヤボンディング装置
JP3259381B2 (ja) 半導体チップ接着装置及び接着方法
JP2001110840A (ja) ワイヤボンド装置及び方法
KR970002101Y1 (ko) 와이어 본딩 장비의 예열 장치
JP4539678B2 (ja) 電子部品実装方法
JP4952683B2 (ja) 基板搬出装置
JP3758791B2 (ja) キュア装置
JPH04273454A (ja) ボンディング工具
JPH05259218A (ja) ボンディング装置
JP2001284406A (ja) 半導体製造装置
JPH0389526A (ja) 電気的接続方法及び電気的接続用治具
JPH10219198A (ja) キュア装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210823

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220906

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221027

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230113

R150 Certificate of patent or registration of utility model

Ref document number: 7216451

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150