WO2021152743A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2021152743A1
WO2021152743A1 PCT/JP2020/003239 JP2020003239W WO2021152743A1 WO 2021152743 A1 WO2021152743 A1 WO 2021152743A1 JP 2020003239 W JP2020003239 W JP 2020003239W WO 2021152743 A1 WO2021152743 A1 WO 2021152743A1
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WO
WIPO (PCT)
Prior art keywords
housing
upper housing
electronic device
lower housing
shielding
Prior art date
Application number
PCT/JP2020/003239
Other languages
English (en)
Japanese (ja)
Inventor
賢悟 上山
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2020/003239 priority Critical patent/WO2021152743A1/fr
Priority to JP2021573702A priority patent/JP7262627B2/ja
Publication of WO2021152743A1 publication Critical patent/WO2021152743A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • This disclosure relates to electronic devices.
  • the electronic circuit board is sealed with a metal housing in order to reduce electromagnetic field radiation originating from the drive clock signal on the electronic circuit board.
  • Patent Document 1 and Patent Document 2 describe a structure in which an electronic circuit board is sandwiched between metal housings. When the electronic circuit board is sandwiched between metal housings, the electronic circuit board is sealed with the metal housing while ensuring continuity between the electronic circuit board and the metal housing.
  • Patent Document 1 and Patent Document 2 disclose that a cushioning material having elasticity or plasticity is arranged on a pedestal portion of a metal housing for holding an electronic circuit board.
  • the use of cushioning material enhances the tightness of the metal housing, resulting in reduced electromagnetic radiation.
  • Patent Document 1 and Patent Document 2 have a complicated structure because they are provided with a cushioning material having elasticity or plasticity. Specifically, it is necessary to add a material different from the metal housing. In addition, the complicated structure makes it difficult to disassemble and reassemble after assembling once.
  • the purpose of this disclosure is to suppress the electromagnetic field radiation of electronic devices with a simple structure.
  • the electronic device includes a first metal housing, a second metal housing, an electronic circuit board sandwiched between the first housing and the second housing, and a second housing.
  • a shielding portion arranged on at least one of the first housing and the second housing is provided, and a peripheral edge portion of the first housing is provided.
  • a gap is provided between the surface and the peripheral edge of the second housing, and the shielding portion includes a protruding portion protruding outward from the main body portion of the first housing or the second housing, and the protruding portion. Has an inclined surface that narrows the gap in the protruding direction.
  • the present disclosure it is not necessary to process the pedestal of the metal housing for holding the electronic circuit board and to seal the metal housing. That is, the radiated electromagnetic field can be relaxed only by changing the shape of the existing metal housing. Therefore, according to the present disclosure, it is possible to suppress the electromagnetic field radiation of an electronic device with a simple structure.
  • FIG. 1 Schematic perspective view showing the outer shape of the electronic device according to the first embodiment of the present disclosure. Partially enlarged view showing the main part of the EMI resistant structure of FIG. Schematic perspective view showing the outer shape of the electronic device according to the second embodiment of the present disclosure. Partially enlarged view showing the main part of the EMI resistant structure of FIG. Schematic perspective view showing the outer shape of the electronic device according to the third embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the fourth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the fifth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the sixth embodiment of the present disclosure.
  • Schematic perspective view showing the outer shape of the electronic device according to the fifteenth embodiment of the present disclosure Schematic perspective view showing the outer shape of the electronic device according to the 16th embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the 17th embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the eighteenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the nineteenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the twentieth embodiment of the present disclosure. Frequency characteristic diagram showing the electromagnetic field strength of an arbitrary point in the surrounding space of the electronic device in the third embodiment and the seventh embodiment of the present disclosure and the comparative example.
  • FIG. 1 is a cross-sectional view showing the structure of the electronic device according to the first embodiment of the present disclosure.
  • the top, bottom, left, and right are described with reference to FIG. 1, but the actual product is not limited to this.
  • the electronic device 10 has a structure in which the electronic circuit board 3 is sandwiched between the upper housing 1 and the lower housing 2 of the metal housing 7. More specifically, the upper housing 1, the lower housing 2 and the electronic circuit board 3 are collectively tightened and fixed with a plurality of screws 4.
  • the upper housing 1 is made of metal and includes each part of reference numerals 1a to 1e.
  • the sandwiching portion 1a is a circumferential portion that comes into contact with the electronic circuit board 3 when the electronic circuit board 3 is sandwiched between the lower housing 2 and the lower housing 2.
  • the holes 1b are a plurality of through holes for inserting and tightening the screw 4.
  • the recess 1c is provided inside the holding portion 1a in order to secure a distance between the upper housing 1 and the electronic circuit of the electronic circuit board 3.
  • the recess 1d is a circumferential groove provided on the outside of the holding portion 1a.
  • the protruding portion 1e is a portion of the lower end portion of the main body portion of the upper housing 1 that includes a plate-shaped portion that protrudes outward and an inclined surface that tapers outward in the protruding direction between the lower housing 2 and the lower housing 2. Is.
  • the lower housing 2 is made of metal and includes each part of reference numerals 2a to 2e.
  • the sandwiching portion 2a is a circumferential portion that comes into contact with the electronic circuit board 3 when sandwiching the electronic circuit board 3 with the upper housing 1.
  • the screw 4 is screwed into the screw hole 2b.
  • the recess 2c is provided inside the holding portion 2a in order to secure a distance between the lower housing 2 and the electronic circuit of the electronic circuit board 3.
  • the recess 2d is a circumferential groove provided on the outside of the holding portion 2a.
  • the protruding portion 2e is a portion of the upper end portion of the main body portion of the lower housing 2 that includes a plate-shaped portion that protrudes outward and an inclined surface that tapers outward in the protruding direction between the upper housing 1 and the upper housing 1. Is.
  • the inclined surfaces of the protruding portion 1e and the protruding portion 2e are provided with a slight angle with respect to the plane perpendicular to the sandwiching direction X of the electronic circuit board 3 by the upper housing 1 and the lower housing 2, respectively.
  • the sandwiching direction X is a tightening direction in which the electronic circuit board 3 is placed on the lower housing 2 and the upper housing 1 is tightened to the lower housing 2 with screws 4. Point to.
  • the shielding portion 6 is configured by one or both of the protruding portion 1e and the protruding portion 2e.
  • the shielding portion 6 of the first embodiment is provided on all the side surfaces of the metal housing 7 including the upper housing 1 and the lower housing 2. Further, the shielding portion 6 is provided so as to cover the entire length of the joint between the upper housing 1 and the lower housing 2. However, it does not matter whether or not the shielding portion 6 is provided in a portion having a complicated shape such as a corner portion or an opening of a connector and which is not uniform.
  • the electronic circuit board 3 is a board on which an electronic circuit having a single-layer or multi-layer structure is formed.
  • the electronic circuit is formed at an arbitrary position on the substrate as long as it is within the range of the recess 1c and / or the recess 2c.
  • the electronic circuit is provided with a plurality of holes for inserting the screws 4 on the peripheral edge of the electronic circuit board 3 of the substrate.
  • a gap 5 is formed between the lower surface of the upper housing 1 and the upper surface of the lower housing 2. That is, the upper housing 1 and the lower housing 2 are not in contact with each other at the seams.
  • the upper housing 1 and the lower housing 2 may come into contact with each other. be.
  • the electronic circuit board 3 does not come into contact with either or both of the upper housing 1 and the lower housing 2 at the screw fixing portion, and the ground is conducted.
  • the EMC Electromagnetic Compatibility
  • FIG. 2 is a schematic view showing the outer shape of the electronic device 10 according to the first embodiment of the present disclosure.
  • the metal housing 7 is a combination of the upper housing 1 and the lower housing 2 shown in FIG. 1 and is formed in a rectangular parallelepiped. Although not shown, the electronic circuit board 3 is held in the metal housing 7.
  • the shielding portions 6 are arranged on the four side surfaces of the metal housing 7. In FIG. 2, the shielding portions 6 on each side surface are represented by reference numerals 6a, 6b, 6c and 6d counterclockwise when viewed from above. On each side surface, a shielding portion 6 is formed to cover the entire length of the joint between the upper housing 1 and the lower housing 2. Further, each of the shielding portions 6 is composed of a combination of a protruding portion 1e and a protruding portion 2e.
  • FIG. 3 shows an enlarged view of the gap 5 and the shielding portion 6.
  • both the upper housing 1 and the lower housing 2 are reliably conducted with the ground pattern of the electronic circuit board 3 to ensure EMC performance.
  • the distance of the gap 5 must be set to a value or more that allows for all the dimensional variations due to the manufacture of the upper housing 1, the lower housing 2, and the electronic circuit board 3.
  • the upper housing 1 and the lower housing 2 are connected to the electronic circuit board 3, but a gap 5 must be provided. Therefore, the electromagnetic field leaking from the gap 5 adversely affects other electronic devices as a radiated electromagnetic field from the electronic device, or causes a problem that the EMC standard test cannot be complied with.
  • circuit drive clock signal that is the source of the electromagnetic field mounted on the electronic circuit board 3 or the characteristics of the electrical resonance of the metal housing 7.
  • the characteristics of the circuit drive clock signal are, for example, the frequency, voltage amplitude, and number of circuit drive clock signals.
  • the characteristics of electrical resonance are, for example, frequency and amplification factor.
  • the gap 5 is provided with a shielding portion 6 having an angle between the upper housing 1 and the lower housing 2 in a plane perpendicular to the board sandwiching direction.
  • the shielding portion 6 acts as a shield against the electromagnetic field leaking from the gap 5, it is possible to suppress the radiated electromagnetic field of the electronic device.
  • the upper housing 1 and the lower housing 2 do not come into direct contact with each other including the gap 5 and the shielding portion 6.
  • the dimension D1 of the gap 5 is maintained as designed. Therefore, even if the thickness t of the electronic circuit board 3 shown in FIG. 3 varies, the continuity between the electronic circuit board 3 and the upper housing 1 and the lower housing 2 can be maintained. Even in this case, the radiated electromagnetic field from the electronic device can be suppressed by narrowing the gap 5 with the shielding portion 6 which is a metal shield.
  • the structure provided with the shielding portion 6 has an effect of suppressing the radiated electromagnetic field from the electronic device as compared with the structure not provided with the shielding portion 6.
  • the dimension D2 of the gap between the sandwiching portion 1a of the upper housing 1 and the sandwiching portion 2a of the lower housing 2 and the thickness t of the electronic circuit board 3 are the following mathematical formulas ( It may be related to 3).
  • the thickness t of the electronic circuit board 3 may be smaller than the design value within the allowable tolerance range due to manufacturing variations.
  • the protruding portion 1e and the protruding portion 2e of the shielding portion 6 have elasticity in the substrate sandwiching direction. Therefore, the protruding portion 1e and the protruding portion 2e push each other against each other, and the shielding portion 6 bends. As a result, even when the mathematical formulas (2) and (3) are satisfied, the upper housing 1, the lower housing 2 and the electronic circuit board 3 can be brought into contact with each other by the screw portion, so that the continuity can be maintained.
  • the electronic device 10 has a structure in which the electronic circuit board 3 is sandwiched between the upper housing 1 and the lower housing 2.
  • a gap or looseness called play for absorbing manufacturing variation or assembly variation can be provided in the plane direction of the electronic circuit board 3.
  • an angle is provided between the protruding portion 1e of the upper housing 1 and the protruding portion 2e of the lower housing 2.
  • the shielding portion 6 is configured by the protruding portion 1e of the upper housing 1 and the protruding portion 2e of the lower housing 2. According to the first embodiment, it is not necessary to process the pedestal of the upper housing 1 or the lower housing 2 for holding the electronic circuit board 3 and to seal the upper housing 1 and the lower housing 2 by combining them. Become. That is, the radiated electromagnetic field can be relaxed only by changing the shape of the existing metal housing. Therefore, according to the present disclosure, it is possible to suppress the electromagnetic field radiation of an electronic device with a simple structure.
  • FIG. 4 is a schematic view showing the outer shape of the electronic device 10 according to the second embodiment of the present disclosure.
  • FIGS. 4 to 23 among the shielding portions 6a, 6b, 6c and 6d, those formed are designated by reference numerals and displayed. Further, in the shielding portions 6a, 6b, 6c and 6d, the formed portions of the protruding portions 1e and the protruding portions 2e are indicated by reference numerals. With respect to the protruding portion 1e and the protruding portion 2e, the display of reference numerals is omitted except for the typical side surfaces. Further, in the following description of Embodiments 2 to 20, the combination of the upper housing 1 and the lower housing 2 illustrated in FIGS. 4 to 23 will be referred to as a metal housing 7.
  • shielding portions 6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7.
  • the shielding portions 6a, 6b, 6c and 6d all cover the entire length of the joint between the upper housing 1 and the lower housing 2.
  • each of the shielding portions 6a, 6b, 6c and 6d is composed of only the protruding portion 1e and does not include the protruding portion 2e.
  • the upper surface of the lower housing 2 on which the protrusion 2e is not formed is a flat surface having no inclined surface.
  • the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case without the shielding portion 6.
  • FIG. 6 is a schematic view showing the outer shape of the electronic device 10 according to the third embodiment of the present disclosure.
  • the shielding portion 6a is formed on the side surface of the metal housing 7.
  • the shielding portion 6a covers the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof.
  • the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e. Similar to FIG. 5, the lower surface of the upper housing 1 in which the protrusion 1e is not formed and the upper surface of the lower housing 2 in which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the lower surface of the upper housing 1 in which the protruding portion 1e is not formed and the upper surface of the upper housing 2 in which the protruding portion 2e is not formed do not have an inclined surface. It is a plane.
  • the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the first embodiment because it is specified only on the peripheral side surface of the side surface provided with the shielding portion 6 and far away in the direction thereof, but is lower than the case where the shielding portion 6 is not provided. Is also expensive.
  • FIG. 7 is a schematic view showing the outer shape of the electronic device 10 according to the fourth embodiment of the present disclosure.
  • shielding portions 6a and 6b are formed on the side surfaces of the metal housing 7.
  • the shielding portions 6a and 6b cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof.
  • the shielding portions 6a and 6b are composed of a combination of the protruding portions 1e and the protruding portions 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the first embodiment because it is specified only on the peripheral side surface of the side surface provided with the shielding portion 6 and far away in the direction thereof, but is lower than the case where the shielding portion 6 is not provided. Is also expensive.
  • FIG. 8 is a schematic view showing the outer shape of the electronic device 10 according to the fifth embodiment of the present disclosure.
  • shielding portions 6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7.
  • the shielding portions 6a, 6b, 6c and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case without the shielding portion 6.
  • Embodiment 6 The shielding portion 6 may be provided so that not all of the side surfaces of the metal housing 7 but a part thereof is missing.
  • FIG. 9 is a schematic view showing the outer shape of the electronic device 10 according to the sixth embodiment of the present disclosure.
  • shielding portions 6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7.
  • the shielding portion 6a covers a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface.
  • the shielding portions 6b, 6c and 6d cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • each of the shielding portions 6a, 6b, 6c and 6d is composed of a combination of the protruding portion 1e and the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case without the shielding portion 6.
  • Embodiment 7 The shielding portion 6 may be provided on only one of the upper housing 1 and the lower housing 2, and not on all the side surfaces but only on a specific side surface.
  • FIG. 10 is a schematic view showing the outer shape of the electronic device 10 according to the seventh embodiment of the present disclosure.
  • the shielding portion 6a is formed on the side surface of the metal housing 7.
  • the shielding portion 6a covers the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. Further, the shielding portion 6a is composed of only the protruding portion 1e and does not include the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and third embodiments, but higher than that without the shielding portion 6.
  • Embodiment 8 The shielding portion 6 may be provided on only one of the upper housing 1 or the lower housing 2 and on a plurality of specific side surfaces instead of all the side surfaces.
  • FIG. 11 is a schematic view showing the outer shape of the electronic device 10 according to the eighth embodiment of the present disclosure.
  • shielding portions 6a and 6c are formed on the side surfaces of the metal housing 7.
  • the shielding portions 6a and 6c cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. Further, the shielding portions 6a and 6c are composed of only the protruding portions 1e and do not include the protruding portions 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and fourth embodiments, but higher than that without the shielding portion 6.
  • Embodiment 9 The shielding portion 6 may be provided on only one of the upper housing 1 and the lower housing 2, and may be provided on a part of each side surface, not all of them.
  • FIG. 12 is a schematic view showing the outer shape of the electronic device 10 according to the ninth embodiment of the present disclosure.
  • shielding portions 6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7.
  • the shielding portions 6a, 6b, 6c and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • each of the shielding portions 6a, 6b, 6c and 6d is composed of only the protruding portion 1e and does not include the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2 and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 is larger than the configurations of the first, second and fifth embodiments. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and fifth embodiments, but higher than that without the shielding portion 6.
  • Embodiment 10 may be provided on only one of the upper housing 1 and the lower housing 2, and not all but a part of each side surface may be missing.
  • FIG. 13 is a schematic view showing the outer shape of the electronic device 10 according to the tenth embodiment of the present disclosure.
  • shielding portions 6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7.
  • the shielding portions 6a, 6b, 6c and 6d cover a range in which a central part of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface.
  • each of the shielding portions 6a, 6b, 6c and 6d is composed of only the protruding portion 1e and does not include the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the second embodiment, and the sixth embodiment. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and sixth embodiments, but higher than that without the shielding portion 6.
  • FIG. 14 is a schematic view showing the outer shape of the electronic device 10 according to the eleventh embodiment of the present disclosure.
  • the shielding portion 6a is formed on the side surface of the metal housing 7.
  • the shielding portion 6a covers a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the third embodiment, and the fifth embodiment. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, third and fifth embodiments, but higher than that without the shielding portion 6.
  • Embodiment 12 The shielding portion 6 may be provided only on a specific side surface instead of all the side surfaces, and may be provided not all but a part of each side surface.
  • FIG. 15 is a schematic view showing the outer shape of the electronic device 10 according to the twelfth embodiment of the present disclosure.
  • the shielding portion 6a is formed on the side surface of the metal housing 7.
  • the shielding portion 6a covers a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface.
  • the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is larger than the configurations of the first, third, and sixth embodiments. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, third and sixth embodiments, but higher than that without the shielding portion 6.
  • Embodiment 13 The shielding portion 6 may be provided on a plurality of specific side surfaces instead of all the side surfaces, and may be provided on a part of each side surface instead of all.
  • FIG. 16 is a schematic view showing the outer shape of the electronic device 10 according to the thirteenth embodiment of the present disclosure.
  • shielding portions 6b and 6d are formed on the side surfaces of the metal housing 7.
  • the shielding portions 6b and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • the shielding portions 6b and 6d are composed of a combination of the protruding portions 1e and the protruding portions 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the fourth embodiment, and the fifth embodiment. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, fourth and fifth embodiments, but higher than that without the shielding portion 6.
  • Embodiment 14 The shielding portion 6 may be provided on a plurality of specific side surfaces instead of all the side surfaces, and may be provided on a part of each side surface, not all of them.
  • FIG. 17 is a schematic view showing the outer shape of the electronic device 10 according to the thirteenth embodiment of the present disclosure.
  • shielding portions 6a and 6c are formed on the side surfaces of the metal housing 7.
  • the shielding portions 6a and 6c cover a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface.
  • the shielding portions 6a and 6c are composed of a combination of the protruding portions 1e and the protruding portions 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the fourth embodiment, and the sixth embodiment. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, fourth and sixth embodiments, but higher than that without the shielding portion 6.
  • Embodiment 15 The shielding portion 6 may be provided on only one of the upper housing 1 or the lower housing 2 and on a part of only a specific side surface of the metal housing 7 instead of all the side surfaces.
  • FIG. 18 is a schematic view showing the outer shape of the electronic device 10 according to the fifteenth embodiment of the present disclosure.
  • the shielding portion 6a is formed on the side surface of the metal housing 7.
  • the shielding portion 6a covers a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • the shielding portion 6a is composed of only the protruding portion 1e and does not include the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 are larger than those of the first, second, third, and fifth embodiments. Improves assembly tolerance for manufacturing variations.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the third embodiment and the fifth embodiment, but is higher than that of the case without the shielding portion 6.
  • FIG. 19 is a schematic view showing the outer shape of the electronic device 10 according to the 16th embodiment of the present disclosure.
  • the shielding portion 6a is formed on the side surface of the metal housing 7.
  • the shielding portion 6a covers a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface.
  • the shielding portion 6a is composed of only the protruding portion 1e and does not include the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 are larger than those of the configurations of the first embodiment, the second embodiment, the third embodiment and the sixth embodiment. Improves assembly tolerance for manufacturing variations.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the third embodiment and the sixth embodiment, but is higher than that of the case without the shielding portion 6.
  • Embodiment 17 The shielding portion 6 may be provided on only one of the upper housing 1 or the lower housing 2 and on a part of a plurality of specific side surfaces instead of all the side surfaces of the metal housing 7.
  • FIG. 20 is a schematic view showing the outer shape of the electronic device 10 according to the 17th embodiment of the present disclosure.
  • shielding portions 6b and 6d are formed on the side surface of the metal housing 7.
  • the shielding portions 6b and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • the shielding portions 6b and 6d are composed of only the protruding portions 1e, and do not include the protruding portions 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 are larger than those of the configurations of the first embodiment, the second embodiment, the fourth embodiment and the fifth embodiment. Improves assembly tolerance for manufacturing variations.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the fourth embodiment and the fifth embodiment, but higher than the case where the shielding portion 6 is not provided.
  • Embodiment 18 The shielding portion 6 is provided on only one of the upper housing 1 or the lower housing 2 and in a state where a part of each side surface is missing from a plurality of specific side surfaces instead of all the side surfaces of the metal housing 7. You may be.
  • FIG. 21 is a schematic view showing the outer shape of the electronic device 10 according to the eighteenth embodiment of the present disclosure.
  • shielding portions 6a and 6c are formed on the side surfaces of the metal housing 7.
  • the shielding portions 6a and 6c cover a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface.
  • the shielding portions 6a and 6c are composed of only the protruding portions 1e and do not include the protruding portions 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 are larger than those of the first, second, fourth, and sixth embodiments. Improves assembly tolerance for manufacturing variations.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the fourth embodiment and the sixth embodiment, but is higher than that of the case without the shielding portion 6.
  • FIG. 22 is a schematic view showing the outer shape of the electronic device 10 according to the nineteenth embodiment of the present disclosure.
  • shielding portions 6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7.
  • the shielding portions 6a and 6c cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof.
  • the shielding portions 6b and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface.
  • Each of the shielding portions 6a and 6c is composed of only the protruding portion 2e and does not include the protruding portion 1e.
  • each of the shielding portions 6b and 6d is composed of only the protruding portion 1e and does not include the protruding portion 2e.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is larger than the configurations of the first, second, and fifth embodiments. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case where the second embodiment, the fifth embodiment and the shielding portion 6 are not provided.
  • the shielding portion 6 may have a structure in which both the protruding portion 1e and the protruding portion 2e are provided on one side surface, and the protruding portion 1e and the protruding portion 2e do not overlap.
  • FIG. 23 is a schematic view showing the outer shape of the electronic device 10 according to the twentieth embodiment of the present disclosure.
  • shielding portions 6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7.
  • the shielding portions 6a, 6b, 6c and 6d cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof.
  • the shielding portions 6a and 6c have one protruding portion 2e provided in the central portion and two protruding portions 1e provided on both sides of the protruding portion 2e.
  • the shielding portions 6b and 6d have one protruding portion 1e and one protruding portion 2e.
  • the protrusion 1e and the protrusion 2e do not overlap.
  • the lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.
  • the assembly of the upper housing 1, the lower housing 2 and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the second embodiment, and the sixth embodiment. Tolerance is improved.
  • the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the second embodiment, the sixth embodiment and the case without the shielding portion 6.
  • FIG. 24 is a frequency characteristic diagram of an example of the analysis result of the electromagnetic field strength at an arbitrary point in the surrounding space in the above three examples of telegraph equipment.
  • the electronic device 10 of the third embodiment has a protrusion 1e and a protrusion 2e on one side surface of the metal housing 7. Further, as shown in FIG. 10, the electronic device 10 of the seventh embodiment has only the protruding portion 1e on one side surface of the metal housing 7.
  • the horizontal axis is the frequency [Frequency / MHz]
  • the vertical axis is the electric field [Electric Field / dB (uV / m)].
  • the thick broken line plotted in FIG. 24 is the third embodiment
  • the thin broken line is the seventh embodiment
  • the solid line is a comparative example.
  • the electromagnetic field strength of the third embodiment and the seventh embodiment was larger than that of the comparative example at 2200 to 2550 MHz. Therefore, according to the present disclosure, the electromagnetic field strength can be reduced at a desired frequency by providing the shielding portion 6.
  • the frequency of the peak of the electromagnetic field strength is deviated from the comparative example. Therefore, according to the present disclosure, the effect of shifting the frequency of the peak of the electromagnetic field strength can be expected by providing the shielding portion 6.
  • the structure of the present disclosure does not involve additional elastic members or plastic deformation. Therefore, according to the present disclosure, an effect that aged deterioration is less likely to occur can be obtained as compared with the prior art described in Patent Document 1 and Patent Document 2.
  • the lower end portion of the protruding portion 1e may extend below the upper surface of the lower housing 2.
  • the lower housing 2 may be formed thicker than the upper housing 1.
  • the angle of the protruding portion 1e extending from the upper housing 1 and the angle of the protruding portion 2e extending from the lower housing 2 may be different.
  • the lower housing 2 may be formed thinner than the upper housing 1.
  • the portion where a part of the shielding portion 6 is missing which is described in the sixth embodiment, the tenth embodiment, etc., may be divided into not only one location but also a plurality of locations with respect to one side surface.
  • the shielding portion 6 is arranged at the center of the side surface, but the shielding portion 6 may be arranged at a position close to either the left or right side of the side surface.
  • two or three shielding portions 6 are arranged on each side surface, but four or more shielding portions may be arranged.
  • any shielding unit 6 can be configured by combining the embodiments of the present disclosure. Further, the hierarchical relationship of the illustrated structure may be interchanged.
  • the sandwiching portion 1a and the sandwiching portion 2a are each formed in a circumferential shape.
  • the sandwiching portion 1a and the sandwiching portion 2a may be formed in a structure lacking a part of the circumferential shape, if necessary for the electronic device.
  • the protruding portion 1e and the protruding portion 2e are formed in a plate shape, but the gap 5 may be narrowed and bent, and may have a shape other than the plate shape.
  • the electronic device of the present disclosure can be used for a device having an electronic circuit board and needing to reduce electromagnetic field radiation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne également un dispositif électronique (10) pourvu : d'un premier boîtier métallique (1) ; d'un second boîtier métallique (2) ; d'une carte de circuit électronique (3) maintenue entre les premier et second boîtiers (1, 2) ; et d'un élément de protection (6) disposé au niveau d'au moins l'un des premier et second boîtiers (1, 2) dans un endroit où les premier et second boîtiers (1, 2) se rapprochent l'un de l'autre, un espace (5) étant généré entre les bords périphériques des premier et second boîtiers (1, 2), l'élément de protection (6) est pourvu d'une saillie (1e, 2e) qui fait saillie à partir du corps du premier boîtier (1) ou du second boîtier (2), et la saillie (1e, 2e) a une pente qui rétrécit l'espace (5) vers une direction de projection.
PCT/JP2020/003239 2020-01-29 2020-01-29 Dispositif électronique WO2021152743A1 (fr)

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PCT/JP2020/003239 WO2021152743A1 (fr) 2020-01-29 2020-01-29 Dispositif électronique
JP2021573702A JP7262627B2 (ja) 2020-01-29 2020-01-29 電子機器

Applications Claiming Priority (1)

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PCT/JP2020/003239 WO2021152743A1 (fr) 2020-01-29 2020-01-29 Dispositif électronique

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016189442A (ja) * 2015-03-30 2016-11-04 株式会社ケーヒン 電子制御装置
JP2018107229A (ja) * 2016-12-26 2018-07-05 株式会社ケーヒン 電子制御装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08107285A (ja) * 1994-10-04 1996-04-23 Oki Electric Ind Co Ltd 接続構造および接続部材
JPH11135975A (ja) * 1997-10-31 1999-05-21 Nec Kansai Ltd 高周波電子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016189442A (ja) * 2015-03-30 2016-11-04 株式会社ケーヒン 電子制御装置
JP2018107229A (ja) * 2016-12-26 2018-07-05 株式会社ケーヒン 電子制御装置

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