WO2023238471A1 - Dispositif de commande électronique - Google Patents
Dispositif de commande électronique Download PDFInfo
- Publication number
- WO2023238471A1 WO2023238471A1 PCT/JP2023/010064 JP2023010064W WO2023238471A1 WO 2023238471 A1 WO2023238471 A1 WO 2023238471A1 JP 2023010064 W JP2023010064 W JP 2023010064W WO 2023238471 A1 WO2023238471 A1 WO 2023238471A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- control device
- electronic control
- circuit board
- metal
- area
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 114
- 239000002184 metal Substances 0.000 claims abstract description 114
- 239000000853 adhesive Substances 0.000 claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 claims abstract description 54
- 230000000694 effects Effects 0.000 description 10
- 230000005855 radiation Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the present invention relates to an electronic control device.
- Patent Document 1 discloses that a pin surrounding part is integrally formed in a metal casing that houses a printed circuit board, and this pin surrounding part functions as a shield part to prevent noise, thereby preventing circuit malfunction due to noise. The technology has been disclosed.
- a ground pattern connected to a casing to which a shield of a cable connector is connected is sometimes arranged as a small island-like pattern only around the connector.
- the potential of a small-area ground pattern tends to become unstable, so that the degree of deterioration of the noise resistance described above increases.
- An object of the present invention is to provide an electronic control device that can have higher noise resistance than conventional ones.
- the present application includes a plurality of means for solving the above problems, and one of them is an electronic control device that has a circuit board on which electronic components and connectors are mounted, and a metal casing that houses the circuit board. It is.
- the circuit board has a ground area defined around the connector, and the metal casing includes a metal part that is placed in a position overlapping the ground area and close to the ground area. The metal part is electrically connected to the metal casing and is fixed to the ground area via an adhesive.
- FIG. 1 is a perspective view of an electronic control device according to a first embodiment.
- FIG. 2 is a vertical cross-sectional view taken along line II-II of the electronic control device shown in FIG. 1;
- FIG. 2 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the first embodiment.
- FIG. 3 is a top view showing a state in which adhesive is applied to the circuit board.
- FIG. 3 is a cross-sectional view of the attached state of the metal part in the first embodiment, viewed from the longitudinal direction of the metal casing.
- FIG. 3 is a bottom view showing the arrangement of the housing base and metal parts in the first embodiment.
- FIG. 3 is a sectional view of an electronic control device according to a second embodiment.
- FIG. 7 is a sectional view of an electronic control device according to a third embodiment. It is a top view of the housing cover in 3rd Embodiment. It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 4th embodiment is provided with. It is a sectional view of an electronic control device concerning a 5th embodiment. It is a sectional view of an electronic control device concerning a 6th embodiment. It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 6th embodiment is provided with. It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 7th embodiment is provided with. It is a bottom view of the housing base with which the electronic control device concerning 7th Embodiment is equipped.
- FIG. 1 is a perspective view of the electronic control device according to the first embodiment
- FIG. 2 is a longitudinal sectional view taken along line II-II of the electronic control device shown in FIG.
- the electronic control device 100 includes a metal casing (hereinafter referred to as "metal casing") 101, which is a conductive casing, and a circuit board 104.
- the metal casing 101 is a casing that houses the circuit board 104.
- the metal casing 101 is formed into a so-called flat rectangular parallelepiped shape with a small height (thickness).
- the metal housing 101 is not limited thereto, and a part thereof may be made of an insulating material such as resin.
- the metal casing 101 is composed of a casing base 102 and a casing cover 103.
- the housing base 102 corresponds to the first housing and is made of aluminum, for example.
- the housing cover 103 corresponds to the second housing, and is made of, for example, rust-proofed iron.
- a heat dissipation boss portion 120 and a protrusion portion 121 are integrally formed on the housing base 102 .
- the circuit board 104 is surrounded from above and below by the housing base 102 and the housing cover 103.
- An LSI element 105 is mounted on the circuit board 104.
- LSI is an abbreviation for Large Scale Integration.
- the LSI element 105 is a heat generation source and also a noise source.
- Heat radiation grease 106 is inserted between the LSI element 105 and the heat radiation boss portion 120 of the housing base 102. Thereby, the heat generated by the LSI element 105 is transmitted to the housing base 102 via the heat radiation grease 106 and is emitted from the outer surface of the housing base 102.
- FIG. 3 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the first embodiment. Note that although electronic components other than the LSI element 105 are also mounted on the circuit board 104, electronic components other than the LSI element 105, wiring, etc. are omitted in FIG.
- the circuit board 104 is formed into a rectangle.
- the circuit board 104 is constituted by a printed wiring board made of glass epoxy as a base material, for example. Screw holes 112 are provided at the four corners of the circuit board 104. The screw holes 112 are through holes for fixing the circuit board 104 to the housing base 102 with screws.
- a board-side connector 107 and a board-side connector 111 are mounted on the circuit board 104.
- four board-side connectors 107 and one board-side connector 111 are mounted on the end of the circuit board 104.
- the four board-side connectors 107 are arranged side by side at the end of the circuit board 104 at predetermined intervals.
- the board-side connector 111 is composed of a multi-pin connector.
- the board-side connector 111 is arranged at the end of the circuit board 104 together with the four board-side connectors 107.
- a cable-side connector 113 (FIGS. 1 and 2) is connected to the board-side connector 107, and a cable-side connector 114 (FIG. 1) is connected to the board-side connector 111.
- the board-side connector 107 and the cable-side connector 113 are in the relationship of a male connector and a female connector that can be inserted and removed from each other, and the board-side connector 111 and the cable-side connector 113 are also a male connector and a female connector that can be inserted and removed from each other. In a relationship.
- a cable 108 is connected to each of the cable side connector 113 and the cable side connector 114.
- the electronic control device 100 is connected to external equipment (not shown) via a plurality of cables 108.
- the circuit board 104 has a ground area 151 and a circuit area 154. Ground area 151 and circuit area 154 are separated from each other.
- the aforementioned protrusion 121 (FIG. 2) of the housing base 102 is placed close to the boundary between the ground area 151 and the circuit area 154.
- the protruding portion 121 is formed continuously from one end to the other end in the longitudinal direction of the housing base 102 (see FIG. 6).
- the protruding portion 121 functions as a shield portion (shield wall) between the ground region 151 and the circuit area 154 to shield electromagnetic noise propagating through the space within the metal casing 101.
- the circuit area 154 is an area where various electronic components (including the LSI element 105) are mounted. Further, the circuit area 154 is also an area where a wiring pattern (including a signal line, a power supply line, a ground line, etc.) (not shown) is formed.
- the ground area 151 is an area defined around the board-side connector 107 and the board-side connector 111.
- the ground area 151 is an area where a ground pattern (not shown) of the circuit board 104 is formed and is maintained at a ground potential.
- the ground area 151 is divided so as to surround the board-side connector 107 and the board-side connector 111. For example, regarding the board-side connector 111, the board-side connector 111 is connected in three directions (upward direction, downward direction in FIG. 3, (to the left) is surrounded by a ground area 151. The same holds true for each board-side connector 107.
- the metal housing 101 includes a metal portion 109 (FIG. 2).
- the metal part 109 is attached to the metal casing 101 while being electrically connected to the metal casing 101 . Further, the metal part 109 is fixed to the ground area 151 of the circuit board 104 via an adhesive 110.
- FIG. 4 is a top view showing how adhesive is applied to the circuit board.
- the adhesive 110 is applied to almost the entire ground area 151 (FIG. 3) of the circuit board 104, except for the vicinity of the screw hole 112.
- the adhesive 110 is applied to the ground area 151 in a planar (solid) manner. That is, the adhesive 110 is uniformly applied to the entire ground area 151.
- Adhesive 110 is a conductive adhesive.
- FIG. 5 is a cross-sectional view of the attached state of the metal part in the first embodiment, viewed from the longitudinal direction of the metal casing.
- the metal portion 109 is a so-called sheet metal obtained by bending a thin metal plate.
- the metal portion 109 is made of a metal material having appropriate spring properties.
- the metal portion 109 integrally includes a base portion 109e and locking portions 109a and 109b.
- the base portion 109e is formed into a flat plate shape.
- the locking portions 109a and 109b are formed at both ends of the metal portion 109 in the lateral direction (left-right direction in FIG. 5). Furthermore, the locking portions 109a and 109b are formed long in the longitudinal direction of the metal portion 109 (the depth direction in FIG. 5).
- a groove 121a is formed on the lower surface of the protrusion 121 of the housing base 102.
- the groove portion 121a is formed to be elongated in the longitudinal direction of the housing base 102 (the depth direction in FIG. 5).
- a stepped portion 102a is formed at the end of the housing base 102 on the connector side.
- the locking portion 109a of the metal portion 109 is locked in the groove portion 121a of the protrusion 121.
- a locking portion 109b of the metal portion 109 is locked to a stepped portion 102a of the housing base 102.
- the metal portion 109 is electrically and mechanically connected to the housing base 102 through contact between the locking portion 109a and the protruding portion 121, and contact between the locking portion 109b and the stepped portion 102a.
- FIG. 6 is a bottom view showing the arrangement of the housing base and metal parts in the first embodiment.
- the metal portion 109 is an elongated plate-like member extending in the longitudinal direction of the housing base 102.
- the metal part 109 is fixed to the housing base 102 with screws 130. Therefore, the metal part 109 is electrically and mechanically connected to the housing base 102 also at the fastening part of the screw 130.
- a recess 132 is formed in the metal portion 109 in correspondence with the mounting position of the screw 130. The recess 132 is formed to avoid interference between the screw 130 and the circuit board 104.
- Screw holes 131 are provided at both ends of the metal portion 109 in the longitudinal direction.
- the screw hole 131 is a through hole for fixing the metal part 109 and the circuit board 104 to the housing base 102 by tightening them together. Therefore, the screw holes 131 of the metal part 109 are arranged substantially coaxially with the screw holes 112 provided on the connector side of the circuit board 104.
- the base portion 109e of the metal portion 109 is formed with a notch portion 109c for avoiding interference with the board-side connector 107 and a notch portion 109d for avoiding interference with the board-side connector 111. .
- the metal part 109 is arranged at a position overlapping with and close to the ground area 151 of the circuit board 104. Proximity described here means that the base portion 109e of the metal portion 109 is close to the ground region 151 of the circuit board 104 at a distance approximately equal to the thickness of the adhesive 110.
- the metal part 109 is fixed to the ground area 151 of the circuit board 104 via an adhesive 110.
- the adhesive 110 is made of a conductive adhesive, the metal part 109 is electrically connected to the ground area 151 of the circuit board 104 with a wide contact area corresponding to the planar area of the base part 109e. It will be connected.
- Screw holes 122 and 123 are provided at the four corners of the housing base 102.
- the screw hole 122 is arranged outside the screw hole 123.
- the screw hole 123 is provided in the screw boss 124.
- the screw boss 124 is integrally formed with the housing base 102.
- the screw boss 124 is a portion that regulates the mounting position of the circuit board 104 in the height (thickness) direction of the electronic control device 100 so that the electronic components and connectors mounted on the circuit board 104 do not interfere with the housing base 102. It is.
- a total of four screw holes 122 provided at the four corners of the housing base 102 are holes for fixing the housing cover 103 to the housing base 102 with screws.
- a total of four screw holes 123 provided at the four corners of the housing base 102 are holes for fixing the circuit board 104 and the metal part 109 to the housing base 102 by screwing.
- two screw holes 123 for co-tightening are visible through the screw holes 131 of the metal part 109.
- the housing base 102 of the metal housing 101 includes the metal portion 109, and this metal portion 109 is arranged in a state close to the ground area 151 of the circuit board 104. has been done. Further, the metal part 109 is electrically connected to the metal housing 101 and is fixed to the ground area 151 via an adhesive 110. As a result, the ground area 151 of the circuit board 104 is covered by the metal portion 109 having substantially the same potential as the metal housing 101 . Therefore, the potential of the entire ground area 151 around the connector can be stabilized, and the effect of suppressing noise can be enhanced. As a result, it is possible to provide the electronic control device 100 with higher noise resistance than before.
- the ground region 151 and the circuit area 154 are separated from each other, it is possible to stabilize the ground potential around the connector while suppressing the influence on the ground potential of the circuit area 154.
- the metal portion 109 is made of a sheet metal.
- the shape and dimensions of the metal part 109 can be freely set or changed according to the layout of the circuit board 104. Therefore, even if the layout of the circuit board 104 is changed, there is no need to change the mold for manufacturing the metal casing. Therefore, it is possible to flexibly respond to changes in the layout of the circuit board 104.
- the adhesive 110 is made of a conductive adhesive.
- the metal part 109 can be electrically connected to the ground area 151 around the connector in a planar manner. Therefore, the ground potential around the connector can be further stabilized.
- the metal portion 109 be connected to the metal casing 101 at as many points as possible and at positions close to the ends of the electronic control device 100. Therefore, in the first embodiment, the locking part 109a of the metal part 109 is connected to the protrusion part 121 of the housing base 102, and the locking part 109b of the metal part 109 is connected to the step of the housing base 102. It is connected to the attaching portion 102a. Thereby, the potential stabilizing effect of the ground region 151 can be enhanced.
- FIG. 7 is a sectional view of the electronic control device according to the second embodiment.
- FIG. 8 is a bottom view of the housing base in the second embodiment.
- the electronic control device 100A according to the second embodiment differs in the configuration of the housing base 102A compared to the first embodiment.
- the metal part 109 is made of a sheet metal, but in the second embodiment, the metal part 152 is formed integrally with the housing base 102A. In other words, the metal portion 152 has an integral structure with the housing base 102A.
- the metal part 152 is arranged at a position overlapping with and close to the ground area 151 of the circuit board 104. Further, the metal part 152 is electrically connected to the metal housing 101 and is fixed to the ground area 151 via the adhesive 110.
- the metal portion 152 has the same planar shape as the ground area 151 (FIG. 3).
- the metal portion 152 is formed with a notch 152a for avoiding interference with the board-side connector 107 and a notch 152b for avoiding interference with the board-side connector 111.
- screw holes 123 for screwing the circuit board 104 are provided at both ends of the metal part 109 in the longitudinal direction.
- the metal portion 152 is integrally formed on the housing base 102A of the metal housing 101A, the potential of the ground region 151 is higher than that in the first embodiment described above. The effect of stabilizing can be obtained up to a higher frequency band. Further, since there is no need to attach separate parts to the housing base 102A, parts costs and manufacturing costs can be reduced.
- FIG. 9 is a sectional view of an electronic control device according to a third embodiment.
- FIG. 10 is a top view of the housing cover in the third embodiment.
- the electronic control device 100B has a different configuration of a housing cover 103B compared to the second embodiment.
- the housing cover 103B includes a proximal portion 153.
- the proximal portion 153 is integrally formed with the housing cover 103B.
- the housing cover 103B is placed close to the ground area 151 of the circuit board 104, as shown in FIG. Further, the proximal portion 153 is fixed to the ground area 151 via the conductive adhesive 110, similarly to the metal portion 152 of the housing base 102A.
- the proximal portion 153 is formed continuously from one end to the other end in the longitudinal direction of the housing cover 103B.
- Screw holes 133 are provided at the four corners of the housing cover 103B.
- the screw hole 133 is a through hole for attaching (fastening together) the housing cover 103B and the circuit board 104 to the housing base 102A with a common screw. Therefore, the screw holes 133 are arranged substantially coaxially with the screw holes 112 (FIG. 3) provided at the four corners of the circuit board 104.
- the housing cover 103B of the metal housing 101B includes a proximal portion 153.
- the proximal portion 153 is disposed on the opposite side of the metal portion 152 and close to the ground region 151 of the circuit board 104 .
- the metal portion 152 approaches the ground region 151 of the circuit board 104 from the top surface of the circuit board 104
- the proximal portion 153 approaches the ground region 151 from the bottom surface of the circuit board 104. Therefore, the potential of the ground region 151 can be made more stable.
- the proximal portion 153 is fixed to the ground area 151 via the conductive adhesive 110.
- the ground area 151 is electrically connected to the housing base 102A on the upper surface side of the circuit board 104, and electrically connected to the housing cover 103B on the lower surface side of the circuit board 104. Therefore, the ground potential around the connector can be further stabilized.
- the space between the casing cover 103B and the circuit board 104 is The effect of blocking the noise transmitted by the adjacent portion 153 can be obtained. Therefore, a higher noise suppression effect can be expected. Further, it is also possible to enhance the dustproof effect and drip-proof effect.
- FIG. 11 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the fourth embodiment.
- the electronic control device differs from the first embodiment in that the adhesive 110 is applied in multiple spots on the ground area 151 of the circuit board 104. That is, the adhesive 110 is not uniformly applied to the entire ground area 151 as in the first embodiment, but is applied in multiple small areas. Thereby, the amount of adhesive 110 used can be reduced compared to the case of the first embodiment.
- the fourth embodiment there may be a gap between the application points of the adhesive 110 as appropriate depending on the electromagnetic wave shielding performance required as a noise countermeasure. Furthermore, it is desirable that the interval between the application points of the adhesive 110 be less than half the wavelength of the maximum frequency within the frequency range in which electromagnetic shielding performance is desired to be ensured.
- FIG. 12 is a sectional view of the electronic control device according to the fifth embodiment.
- the electronic control device 100C according to the fifth embodiment uses a non-conductive adhesive 116 instead of the conductive adhesive 110, as compared to the third embodiment (FIG. 9).
- the points are different.
- Non-conductive adhesives are insulators. Therefore, it is not possible to electrically connect the metal portion 152 or the adjacent portion 153 of the metal housing 101B to the ground area 151 of the circuit board 104.
- FIG. 13 is a sectional view of an electronic control device according to a sixth embodiment.
- FIG. 14 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the sixth embodiment.
- a plurality of EMI gaskets 117 are arranged as conductive members between the adhesive 116 application area and the circuit area 154, compared to the fifth embodiment. The difference is that it is The plurality of EMI gaskets 117 are arranged in a line along one side (long side) of the circuit area 154. Each EMI gasket 117 is formed into a chip shape and is arranged at predetermined intervals in the longitudinal direction of the circuit board 104. The EMI gasket 117 is fixed to the upper and lower surfaces of the circuit board 104 with double-sided tape (not shown). EMI is an abbreviation for Electro Magnetic Interference.
- the EMI gaskets 117 which are conductive members, between the adhesive 116 application area and the circuit area 154, the EMI gaskets 117 can suppress noise from entering and exiting the circuit area 154. I can do it.
- an EMI gasket is a component used to establish continuity between the ground of a circuit board and a metal casing, or between a casing base and a casing cover, in order to ensure shielding against electromagnetic waves. be.
- it is necessary to narrow the distance between adjacent EMI gaskets in order to shield higher frequency electromagnetic waves. Therefore, the number of EMI gaskets used increases, resulting in increased costs.
- the cost will be higher than if a chip-shaped EMI gasket is used.
- the EMI gasket 117 since shielding performance is ensured against high-frequency electromagnetic waves by capacitive coupling by the adhesive 116, the EMI gasket 117 only shields against low-frequency electromagnetic waves below GHz. It may be arranged in such a way as to ensure the correctness. This makes it possible to shield electromagnetic waves over a wide range from low frequencies to high frequencies while reducing the number of EMI gaskets 117 used and reducing costs.
- FIG. 15 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the seventh embodiment.
- FIG. 16 is a bottom view of the housing base included in the electronic control device according to the seventh embodiment.
- the electronic control device is different from the first embodiment (FIGS. 4 and 6) in that the application area of the adhesive 110 is divided and that there is a recess in the metal part 109. The difference is that 136 is formed.
- the application area of the adhesive 110 is divided into a plurality of areas so as to avoid the wiring 119 formed on the circuit board 104 and the chip component 125 mounted on the circuit board 104.
- the wiring 119 is a wiring that connects the electronic component mounted on the circuit area 154 of the circuit board 104 and the board-side connector 107 or the board-side connector 111 mounted on the end of the circuit board 104. Wiring 119 illustrated in FIG.
- the 15 is a signal wiring that connects communication IC (integrated circuit) 118 mounted in circuit area 154 of circuit board 104 and board-side connector 107.
- the communication IC 118 is an electronic component mounted on the circuit board 104 together with the LSI element 105.
- the chip component 125 is, for example, a chip capacitor.
- the application area of the adhesive 110 is divided so as to avoid the wiring 119 formed on the circuit board 104 and the chip components 125 mounted on the circuit board 104. Therefore, electromagnetic shielding properties can be ensured without impairing the degree of freedom in layout of the circuit board 104 around the connector.
- the application area of the adhesive 110 may be divided so as to avoid at least one of the wiring 119 and the chip component 125. Further, when the adhesive 110 application area exists on both sides of the circuit board 104, the adhesive 110 application area may be divided between both sides of the circuit board 104, or either one of the surfaces. However, from the viewpoint of ensuring electromagnetic shielding properties, it is desirable to make the area where the adhesive 110 is not applied as small as possible.
- the present invention is not limited to the embodiments described above, but includes various modifications.
- the content of the present invention is explained in detail to make it easier to understand, but the present invention is not necessarily limited to having all the configurations described in the embodiments described above.
- the metal part 109 is fixed to the housing base 102 with the screw 130 to prevent the metal part 109 from falling off.
- the metal part 109 is attached to the housing base 102 by locking the locking parts 109a and 109b to the housing base 102, the present invention is not limited to this.
- a metal part 109 may be attached to the.
- any structure for attaching the metal part 109 to the housing base 102 may be used as long as it is a structure that allows the housing base 102 and the metal part 109 to be electrically connected.
- the proximal portion 153 is formed integrally with the housing cover 103B, but the present invention is not limited to this, and the proximal portion 153 may be formed separately from the housing cover 103B. Good too. Furthermore, the proximity portion 153 may be provided on the housing cover 103 of the electronic control device 100 according to the first embodiment.
- the application state of the adhesive 110 adopted in the fourth embodiment may be applied to the second embodiment and the third embodiment.
- the electronic control device according to the present invention can be suitably applied to an electronic control device installed in a vehicle such as an automobile, but the scope of application is not limited to vehicles, but can also be applied to ships, aircraft, cranes, etc. good.
- vehicles also include railway vehicles, construction vehicles, agricultural vehicles, and the like.
- 100, 100A, 100B, 100C, 100D...Electronic control unit 101, 101A, 101B...Metal casing, 102, 102A... Casing base (first casing), 103, 103B... Casing cover (second casing) ), 104... Circuit board, 105... LSI element (electronic component), 107... Board side connector (connector), 109... Metal part, 110... Adhesive (conductive adhesive), 111... Board side connector (connector), 116... Adhesive (non-conductive adhesive), 117... EMI gasket (conductive member), 118... Communication IC (electronic component), 119... Wiring, 125... Chip component, 151... Ground area, 152... Metal part, 154...Circuit area
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Ce dispositif de commande électronique comprend une carte de circuit imprimé sur laquelle un composant électronique et un connecteur sont montés, et un boîtier métallique dans lequel la carte de circuit imprimé est logée. La carte de circuit imprimé comprend une région de masse définie autour du connecteur. Le boîtier métallique est pourvu d'une partie métallique qui est disposée dans une position chevauchant la région de masse dans un état proche de la région de masse. La partie métallique est électriquement connectée au boîtier métallique et est fixée à la région de masse par l'intermédiaire d'un adhésif.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022093987A JP2023180583A (ja) | 2022-06-09 | 2022-06-09 | 電子制御装置 |
JP2022-093987 | 2022-06-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023238471A1 true WO2023238471A1 (fr) | 2023-12-14 |
Family
ID=89117939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2023/010064 WO2023238471A1 (fr) | 2022-06-09 | 2023-03-15 | Dispositif de commande électronique |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2023180583A (fr) |
WO (1) | WO2023238471A1 (fr) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283962A (ja) * | 1996-04-12 | 1997-10-31 | Mitsubishi Electric Corp | マイクロ波装置 |
JP2000286587A (ja) * | 1999-03-30 | 2000-10-13 | Matsushita Electric Ind Co Ltd | 外部ケーブル接続用コネクタ部の電磁シールド構造 |
JP2004221537A (ja) * | 2002-11-20 | 2004-08-05 | Komatsu Seiren Co Ltd | 電磁波シールド壁紙ならびにその製造方法およびそれを用いた電磁波シールドルーム |
JP2019106404A (ja) * | 2017-12-08 | 2019-06-27 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
WO2021131599A1 (fr) * | 2019-12-27 | 2021-07-01 | 日立Astemo株式会社 | Dispositif de commande électronique |
JP2021150517A (ja) * | 2020-03-19 | 2021-09-27 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
WO2022059263A1 (fr) * | 2020-09-18 | 2022-03-24 | 日立Astemo株式会社 | Dispositif de commande électronique |
-
2022
- 2022-06-09 JP JP2022093987A patent/JP2023180583A/ja active Pending
-
2023
- 2023-03-15 WO PCT/JP2023/010064 patent/WO2023238471A1/fr unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283962A (ja) * | 1996-04-12 | 1997-10-31 | Mitsubishi Electric Corp | マイクロ波装置 |
JP2000286587A (ja) * | 1999-03-30 | 2000-10-13 | Matsushita Electric Ind Co Ltd | 外部ケーブル接続用コネクタ部の電磁シールド構造 |
JP2004221537A (ja) * | 2002-11-20 | 2004-08-05 | Komatsu Seiren Co Ltd | 電磁波シールド壁紙ならびにその製造方法およびそれを用いた電磁波シールドルーム |
JP2019106404A (ja) * | 2017-12-08 | 2019-06-27 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
WO2021131599A1 (fr) * | 2019-12-27 | 2021-07-01 | 日立Astemo株式会社 | Dispositif de commande électronique |
JP2021150517A (ja) * | 2020-03-19 | 2021-09-27 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
WO2022059263A1 (fr) * | 2020-09-18 | 2022-03-24 | 日立Astemo株式会社 | Dispositif de commande électronique |
Also Published As
Publication number | Publication date |
---|---|
JP2023180583A (ja) | 2023-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11330704B2 (en) | Electronic control device | |
US20220368079A1 (en) | Connector and connector device | |
US20210218196A1 (en) | Connector and connector device | |
WO2024140696A1 (fr) | Module de faisceau de câbles pour interférence anti-électromagnétique | |
JP4731788B2 (ja) | ケーブル配線構造およびケーブル配線構造を有する電子機器 | |
US20220408569A1 (en) | Electronic control device | |
CN113711160B (zh) | 电子设备 | |
WO2023238471A1 (fr) | Dispositif de commande électronique | |
US20200253049A1 (en) | Display device and printed circuit board | |
US7301097B2 (en) | Printed-circuit board and electronic device | |
CN113169485A (zh) | 连接器部件以及连接器组 | |
US20220239042A1 (en) | Electrical connector with electromagnetic shielding function | |
WO2020217891A1 (fr) | Dispositif de commande électronique | |
JP6994814B1 (ja) | エンドランチコネクタ及び空洞共振抑制方法 | |
US12058822B2 (en) | Electronic control device | |
JP6688719B2 (ja) | 電子制御ユニット | |
WO2022215176A1 (fr) | Carte de circuit imprimé | |
JP7307844B2 (ja) | 電子制御装置 | |
WO2022244344A1 (fr) | Dispositif de commande électronique | |
WO2024157448A1 (fr) | Dispositif de commande électronique | |
US10863615B2 (en) | Electronic apparatus | |
WO2022004182A1 (fr) | Dispositif de commande électronique | |
JP7007057B2 (ja) | プリント配線板及、プリント回路板及び電子装置 | |
US20210296806A1 (en) | Electric connector set and mounting structure of electric connector set | |
TWI467866B (zh) | 防電磁干擾之電連接器及其端子總成 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 23819458 Country of ref document: EP Kind code of ref document: A1 |