WO2023238471A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2023238471A1
WO2023238471A1 PCT/JP2023/010064 JP2023010064W WO2023238471A1 WO 2023238471 A1 WO2023238471 A1 WO 2023238471A1 JP 2023010064 W JP2023010064 W JP 2023010064W WO 2023238471 A1 WO2023238471 A1 WO 2023238471A1
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WO
WIPO (PCT)
Prior art keywords
control device
electronic control
circuit board
metal
area
Prior art date
Application number
PCT/JP2023/010064
Other languages
French (fr)
Japanese (ja)
Inventor
仁博 遠山
俊明 高井
祐輝 中村
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Publication of WO2023238471A1 publication Critical patent/WO2023238471A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electronic control device.
  • Patent Document 1 discloses that a pin surrounding part is integrally formed in a metal casing that houses a printed circuit board, and this pin surrounding part functions as a shield part to prevent noise, thereby preventing circuit malfunction due to noise. The technology has been disclosed.
  • a ground pattern connected to a casing to which a shield of a cable connector is connected is sometimes arranged as a small island-like pattern only around the connector.
  • the potential of a small-area ground pattern tends to become unstable, so that the degree of deterioration of the noise resistance described above increases.
  • An object of the present invention is to provide an electronic control device that can have higher noise resistance than conventional ones.
  • the present application includes a plurality of means for solving the above problems, and one of them is an electronic control device that has a circuit board on which electronic components and connectors are mounted, and a metal casing that houses the circuit board. It is.
  • the circuit board has a ground area defined around the connector, and the metal casing includes a metal part that is placed in a position overlapping the ground area and close to the ground area. The metal part is electrically connected to the metal casing and is fixed to the ground area via an adhesive.
  • FIG. 1 is a perspective view of an electronic control device according to a first embodiment.
  • FIG. 2 is a vertical cross-sectional view taken along line II-II of the electronic control device shown in FIG. 1;
  • FIG. 2 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the first embodiment.
  • FIG. 3 is a top view showing a state in which adhesive is applied to the circuit board.
  • FIG. 3 is a cross-sectional view of the attached state of the metal part in the first embodiment, viewed from the longitudinal direction of the metal casing.
  • FIG. 3 is a bottom view showing the arrangement of the housing base and metal parts in the first embodiment.
  • FIG. 3 is a sectional view of an electronic control device according to a second embodiment.
  • FIG. 7 is a sectional view of an electronic control device according to a third embodiment. It is a top view of the housing cover in 3rd Embodiment. It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 4th embodiment is provided with. It is a sectional view of an electronic control device concerning a 5th embodiment. It is a sectional view of an electronic control device concerning a 6th embodiment. It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 6th embodiment is provided with. It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 7th embodiment is provided with. It is a bottom view of the housing base with which the electronic control device concerning 7th Embodiment is equipped.
  • FIG. 1 is a perspective view of the electronic control device according to the first embodiment
  • FIG. 2 is a longitudinal sectional view taken along line II-II of the electronic control device shown in FIG.
  • the electronic control device 100 includes a metal casing (hereinafter referred to as "metal casing") 101, which is a conductive casing, and a circuit board 104.
  • the metal casing 101 is a casing that houses the circuit board 104.
  • the metal casing 101 is formed into a so-called flat rectangular parallelepiped shape with a small height (thickness).
  • the metal housing 101 is not limited thereto, and a part thereof may be made of an insulating material such as resin.
  • the metal casing 101 is composed of a casing base 102 and a casing cover 103.
  • the housing base 102 corresponds to the first housing and is made of aluminum, for example.
  • the housing cover 103 corresponds to the second housing, and is made of, for example, rust-proofed iron.
  • a heat dissipation boss portion 120 and a protrusion portion 121 are integrally formed on the housing base 102 .
  • the circuit board 104 is surrounded from above and below by the housing base 102 and the housing cover 103.
  • An LSI element 105 is mounted on the circuit board 104.
  • LSI is an abbreviation for Large Scale Integration.
  • the LSI element 105 is a heat generation source and also a noise source.
  • Heat radiation grease 106 is inserted between the LSI element 105 and the heat radiation boss portion 120 of the housing base 102. Thereby, the heat generated by the LSI element 105 is transmitted to the housing base 102 via the heat radiation grease 106 and is emitted from the outer surface of the housing base 102.
  • FIG. 3 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the first embodiment. Note that although electronic components other than the LSI element 105 are also mounted on the circuit board 104, electronic components other than the LSI element 105, wiring, etc. are omitted in FIG.
  • the circuit board 104 is formed into a rectangle.
  • the circuit board 104 is constituted by a printed wiring board made of glass epoxy as a base material, for example. Screw holes 112 are provided at the four corners of the circuit board 104. The screw holes 112 are through holes for fixing the circuit board 104 to the housing base 102 with screws.
  • a board-side connector 107 and a board-side connector 111 are mounted on the circuit board 104.
  • four board-side connectors 107 and one board-side connector 111 are mounted on the end of the circuit board 104.
  • the four board-side connectors 107 are arranged side by side at the end of the circuit board 104 at predetermined intervals.
  • the board-side connector 111 is composed of a multi-pin connector.
  • the board-side connector 111 is arranged at the end of the circuit board 104 together with the four board-side connectors 107.
  • a cable-side connector 113 (FIGS. 1 and 2) is connected to the board-side connector 107, and a cable-side connector 114 (FIG. 1) is connected to the board-side connector 111.
  • the board-side connector 107 and the cable-side connector 113 are in the relationship of a male connector and a female connector that can be inserted and removed from each other, and the board-side connector 111 and the cable-side connector 113 are also a male connector and a female connector that can be inserted and removed from each other. In a relationship.
  • a cable 108 is connected to each of the cable side connector 113 and the cable side connector 114.
  • the electronic control device 100 is connected to external equipment (not shown) via a plurality of cables 108.
  • the circuit board 104 has a ground area 151 and a circuit area 154. Ground area 151 and circuit area 154 are separated from each other.
  • the aforementioned protrusion 121 (FIG. 2) of the housing base 102 is placed close to the boundary between the ground area 151 and the circuit area 154.
  • the protruding portion 121 is formed continuously from one end to the other end in the longitudinal direction of the housing base 102 (see FIG. 6).
  • the protruding portion 121 functions as a shield portion (shield wall) between the ground region 151 and the circuit area 154 to shield electromagnetic noise propagating through the space within the metal casing 101.
  • the circuit area 154 is an area where various electronic components (including the LSI element 105) are mounted. Further, the circuit area 154 is also an area where a wiring pattern (including a signal line, a power supply line, a ground line, etc.) (not shown) is formed.
  • the ground area 151 is an area defined around the board-side connector 107 and the board-side connector 111.
  • the ground area 151 is an area where a ground pattern (not shown) of the circuit board 104 is formed and is maintained at a ground potential.
  • the ground area 151 is divided so as to surround the board-side connector 107 and the board-side connector 111. For example, regarding the board-side connector 111, the board-side connector 111 is connected in three directions (upward direction, downward direction in FIG. 3, (to the left) is surrounded by a ground area 151. The same holds true for each board-side connector 107.
  • the metal housing 101 includes a metal portion 109 (FIG. 2).
  • the metal part 109 is attached to the metal casing 101 while being electrically connected to the metal casing 101 . Further, the metal part 109 is fixed to the ground area 151 of the circuit board 104 via an adhesive 110.
  • FIG. 4 is a top view showing how adhesive is applied to the circuit board.
  • the adhesive 110 is applied to almost the entire ground area 151 (FIG. 3) of the circuit board 104, except for the vicinity of the screw hole 112.
  • the adhesive 110 is applied to the ground area 151 in a planar (solid) manner. That is, the adhesive 110 is uniformly applied to the entire ground area 151.
  • Adhesive 110 is a conductive adhesive.
  • FIG. 5 is a cross-sectional view of the attached state of the metal part in the first embodiment, viewed from the longitudinal direction of the metal casing.
  • the metal portion 109 is a so-called sheet metal obtained by bending a thin metal plate.
  • the metal portion 109 is made of a metal material having appropriate spring properties.
  • the metal portion 109 integrally includes a base portion 109e and locking portions 109a and 109b.
  • the base portion 109e is formed into a flat plate shape.
  • the locking portions 109a and 109b are formed at both ends of the metal portion 109 in the lateral direction (left-right direction in FIG. 5). Furthermore, the locking portions 109a and 109b are formed long in the longitudinal direction of the metal portion 109 (the depth direction in FIG. 5).
  • a groove 121a is formed on the lower surface of the protrusion 121 of the housing base 102.
  • the groove portion 121a is formed to be elongated in the longitudinal direction of the housing base 102 (the depth direction in FIG. 5).
  • a stepped portion 102a is formed at the end of the housing base 102 on the connector side.
  • the locking portion 109a of the metal portion 109 is locked in the groove portion 121a of the protrusion 121.
  • a locking portion 109b of the metal portion 109 is locked to a stepped portion 102a of the housing base 102.
  • the metal portion 109 is electrically and mechanically connected to the housing base 102 through contact between the locking portion 109a and the protruding portion 121, and contact between the locking portion 109b and the stepped portion 102a.
  • FIG. 6 is a bottom view showing the arrangement of the housing base and metal parts in the first embodiment.
  • the metal portion 109 is an elongated plate-like member extending in the longitudinal direction of the housing base 102.
  • the metal part 109 is fixed to the housing base 102 with screws 130. Therefore, the metal part 109 is electrically and mechanically connected to the housing base 102 also at the fastening part of the screw 130.
  • a recess 132 is formed in the metal portion 109 in correspondence with the mounting position of the screw 130. The recess 132 is formed to avoid interference between the screw 130 and the circuit board 104.
  • Screw holes 131 are provided at both ends of the metal portion 109 in the longitudinal direction.
  • the screw hole 131 is a through hole for fixing the metal part 109 and the circuit board 104 to the housing base 102 by tightening them together. Therefore, the screw holes 131 of the metal part 109 are arranged substantially coaxially with the screw holes 112 provided on the connector side of the circuit board 104.
  • the base portion 109e of the metal portion 109 is formed with a notch portion 109c for avoiding interference with the board-side connector 107 and a notch portion 109d for avoiding interference with the board-side connector 111. .
  • the metal part 109 is arranged at a position overlapping with and close to the ground area 151 of the circuit board 104. Proximity described here means that the base portion 109e of the metal portion 109 is close to the ground region 151 of the circuit board 104 at a distance approximately equal to the thickness of the adhesive 110.
  • the metal part 109 is fixed to the ground area 151 of the circuit board 104 via an adhesive 110.
  • the adhesive 110 is made of a conductive adhesive, the metal part 109 is electrically connected to the ground area 151 of the circuit board 104 with a wide contact area corresponding to the planar area of the base part 109e. It will be connected.
  • Screw holes 122 and 123 are provided at the four corners of the housing base 102.
  • the screw hole 122 is arranged outside the screw hole 123.
  • the screw hole 123 is provided in the screw boss 124.
  • the screw boss 124 is integrally formed with the housing base 102.
  • the screw boss 124 is a portion that regulates the mounting position of the circuit board 104 in the height (thickness) direction of the electronic control device 100 so that the electronic components and connectors mounted on the circuit board 104 do not interfere with the housing base 102. It is.
  • a total of four screw holes 122 provided at the four corners of the housing base 102 are holes for fixing the housing cover 103 to the housing base 102 with screws.
  • a total of four screw holes 123 provided at the four corners of the housing base 102 are holes for fixing the circuit board 104 and the metal part 109 to the housing base 102 by screwing.
  • two screw holes 123 for co-tightening are visible through the screw holes 131 of the metal part 109.
  • the housing base 102 of the metal housing 101 includes the metal portion 109, and this metal portion 109 is arranged in a state close to the ground area 151 of the circuit board 104. has been done. Further, the metal part 109 is electrically connected to the metal housing 101 and is fixed to the ground area 151 via an adhesive 110. As a result, the ground area 151 of the circuit board 104 is covered by the metal portion 109 having substantially the same potential as the metal housing 101 . Therefore, the potential of the entire ground area 151 around the connector can be stabilized, and the effect of suppressing noise can be enhanced. As a result, it is possible to provide the electronic control device 100 with higher noise resistance than before.
  • the ground region 151 and the circuit area 154 are separated from each other, it is possible to stabilize the ground potential around the connector while suppressing the influence on the ground potential of the circuit area 154.
  • the metal portion 109 is made of a sheet metal.
  • the shape and dimensions of the metal part 109 can be freely set or changed according to the layout of the circuit board 104. Therefore, even if the layout of the circuit board 104 is changed, there is no need to change the mold for manufacturing the metal casing. Therefore, it is possible to flexibly respond to changes in the layout of the circuit board 104.
  • the adhesive 110 is made of a conductive adhesive.
  • the metal part 109 can be electrically connected to the ground area 151 around the connector in a planar manner. Therefore, the ground potential around the connector can be further stabilized.
  • the metal portion 109 be connected to the metal casing 101 at as many points as possible and at positions close to the ends of the electronic control device 100. Therefore, in the first embodiment, the locking part 109a of the metal part 109 is connected to the protrusion part 121 of the housing base 102, and the locking part 109b of the metal part 109 is connected to the step of the housing base 102. It is connected to the attaching portion 102a. Thereby, the potential stabilizing effect of the ground region 151 can be enhanced.
  • FIG. 7 is a sectional view of the electronic control device according to the second embodiment.
  • FIG. 8 is a bottom view of the housing base in the second embodiment.
  • the electronic control device 100A according to the second embodiment differs in the configuration of the housing base 102A compared to the first embodiment.
  • the metal part 109 is made of a sheet metal, but in the second embodiment, the metal part 152 is formed integrally with the housing base 102A. In other words, the metal portion 152 has an integral structure with the housing base 102A.
  • the metal part 152 is arranged at a position overlapping with and close to the ground area 151 of the circuit board 104. Further, the metal part 152 is electrically connected to the metal housing 101 and is fixed to the ground area 151 via the adhesive 110.
  • the metal portion 152 has the same planar shape as the ground area 151 (FIG. 3).
  • the metal portion 152 is formed with a notch 152a for avoiding interference with the board-side connector 107 and a notch 152b for avoiding interference with the board-side connector 111.
  • screw holes 123 for screwing the circuit board 104 are provided at both ends of the metal part 109 in the longitudinal direction.
  • the metal portion 152 is integrally formed on the housing base 102A of the metal housing 101A, the potential of the ground region 151 is higher than that in the first embodiment described above. The effect of stabilizing can be obtained up to a higher frequency band. Further, since there is no need to attach separate parts to the housing base 102A, parts costs and manufacturing costs can be reduced.
  • FIG. 9 is a sectional view of an electronic control device according to a third embodiment.
  • FIG. 10 is a top view of the housing cover in the third embodiment.
  • the electronic control device 100B has a different configuration of a housing cover 103B compared to the second embodiment.
  • the housing cover 103B includes a proximal portion 153.
  • the proximal portion 153 is integrally formed with the housing cover 103B.
  • the housing cover 103B is placed close to the ground area 151 of the circuit board 104, as shown in FIG. Further, the proximal portion 153 is fixed to the ground area 151 via the conductive adhesive 110, similarly to the metal portion 152 of the housing base 102A.
  • the proximal portion 153 is formed continuously from one end to the other end in the longitudinal direction of the housing cover 103B.
  • Screw holes 133 are provided at the four corners of the housing cover 103B.
  • the screw hole 133 is a through hole for attaching (fastening together) the housing cover 103B and the circuit board 104 to the housing base 102A with a common screw. Therefore, the screw holes 133 are arranged substantially coaxially with the screw holes 112 (FIG. 3) provided at the four corners of the circuit board 104.
  • the housing cover 103B of the metal housing 101B includes a proximal portion 153.
  • the proximal portion 153 is disposed on the opposite side of the metal portion 152 and close to the ground region 151 of the circuit board 104 .
  • the metal portion 152 approaches the ground region 151 of the circuit board 104 from the top surface of the circuit board 104
  • the proximal portion 153 approaches the ground region 151 from the bottom surface of the circuit board 104. Therefore, the potential of the ground region 151 can be made more stable.
  • the proximal portion 153 is fixed to the ground area 151 via the conductive adhesive 110.
  • the ground area 151 is electrically connected to the housing base 102A on the upper surface side of the circuit board 104, and electrically connected to the housing cover 103B on the lower surface side of the circuit board 104. Therefore, the ground potential around the connector can be further stabilized.
  • the space between the casing cover 103B and the circuit board 104 is The effect of blocking the noise transmitted by the adjacent portion 153 can be obtained. Therefore, a higher noise suppression effect can be expected. Further, it is also possible to enhance the dustproof effect and drip-proof effect.
  • FIG. 11 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the fourth embodiment.
  • the electronic control device differs from the first embodiment in that the adhesive 110 is applied in multiple spots on the ground area 151 of the circuit board 104. That is, the adhesive 110 is not uniformly applied to the entire ground area 151 as in the first embodiment, but is applied in multiple small areas. Thereby, the amount of adhesive 110 used can be reduced compared to the case of the first embodiment.
  • the fourth embodiment there may be a gap between the application points of the adhesive 110 as appropriate depending on the electromagnetic wave shielding performance required as a noise countermeasure. Furthermore, it is desirable that the interval between the application points of the adhesive 110 be less than half the wavelength of the maximum frequency within the frequency range in which electromagnetic shielding performance is desired to be ensured.
  • FIG. 12 is a sectional view of the electronic control device according to the fifth embodiment.
  • the electronic control device 100C according to the fifth embodiment uses a non-conductive adhesive 116 instead of the conductive adhesive 110, as compared to the third embodiment (FIG. 9).
  • the points are different.
  • Non-conductive adhesives are insulators. Therefore, it is not possible to electrically connect the metal portion 152 or the adjacent portion 153 of the metal housing 101B to the ground area 151 of the circuit board 104.
  • FIG. 13 is a sectional view of an electronic control device according to a sixth embodiment.
  • FIG. 14 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the sixth embodiment.
  • a plurality of EMI gaskets 117 are arranged as conductive members between the adhesive 116 application area and the circuit area 154, compared to the fifth embodiment. The difference is that it is The plurality of EMI gaskets 117 are arranged in a line along one side (long side) of the circuit area 154. Each EMI gasket 117 is formed into a chip shape and is arranged at predetermined intervals in the longitudinal direction of the circuit board 104. The EMI gasket 117 is fixed to the upper and lower surfaces of the circuit board 104 with double-sided tape (not shown). EMI is an abbreviation for Electro Magnetic Interference.
  • the EMI gaskets 117 which are conductive members, between the adhesive 116 application area and the circuit area 154, the EMI gaskets 117 can suppress noise from entering and exiting the circuit area 154. I can do it.
  • an EMI gasket is a component used to establish continuity between the ground of a circuit board and a metal casing, or between a casing base and a casing cover, in order to ensure shielding against electromagnetic waves. be.
  • it is necessary to narrow the distance between adjacent EMI gaskets in order to shield higher frequency electromagnetic waves. Therefore, the number of EMI gaskets used increases, resulting in increased costs.
  • the cost will be higher than if a chip-shaped EMI gasket is used.
  • the EMI gasket 117 since shielding performance is ensured against high-frequency electromagnetic waves by capacitive coupling by the adhesive 116, the EMI gasket 117 only shields against low-frequency electromagnetic waves below GHz. It may be arranged in such a way as to ensure the correctness. This makes it possible to shield electromagnetic waves over a wide range from low frequencies to high frequencies while reducing the number of EMI gaskets 117 used and reducing costs.
  • FIG. 15 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the seventh embodiment.
  • FIG. 16 is a bottom view of the housing base included in the electronic control device according to the seventh embodiment.
  • the electronic control device is different from the first embodiment (FIGS. 4 and 6) in that the application area of the adhesive 110 is divided and that there is a recess in the metal part 109. The difference is that 136 is formed.
  • the application area of the adhesive 110 is divided into a plurality of areas so as to avoid the wiring 119 formed on the circuit board 104 and the chip component 125 mounted on the circuit board 104.
  • the wiring 119 is a wiring that connects the electronic component mounted on the circuit area 154 of the circuit board 104 and the board-side connector 107 or the board-side connector 111 mounted on the end of the circuit board 104. Wiring 119 illustrated in FIG.
  • the 15 is a signal wiring that connects communication IC (integrated circuit) 118 mounted in circuit area 154 of circuit board 104 and board-side connector 107.
  • the communication IC 118 is an electronic component mounted on the circuit board 104 together with the LSI element 105.
  • the chip component 125 is, for example, a chip capacitor.
  • the application area of the adhesive 110 is divided so as to avoid the wiring 119 formed on the circuit board 104 and the chip components 125 mounted on the circuit board 104. Therefore, electromagnetic shielding properties can be ensured without impairing the degree of freedom in layout of the circuit board 104 around the connector.
  • the application area of the adhesive 110 may be divided so as to avoid at least one of the wiring 119 and the chip component 125. Further, when the adhesive 110 application area exists on both sides of the circuit board 104, the adhesive 110 application area may be divided between both sides of the circuit board 104, or either one of the surfaces. However, from the viewpoint of ensuring electromagnetic shielding properties, it is desirable to make the area where the adhesive 110 is not applied as small as possible.
  • the present invention is not limited to the embodiments described above, but includes various modifications.
  • the content of the present invention is explained in detail to make it easier to understand, but the present invention is not necessarily limited to having all the configurations described in the embodiments described above.
  • the metal part 109 is fixed to the housing base 102 with the screw 130 to prevent the metal part 109 from falling off.
  • the metal part 109 is attached to the housing base 102 by locking the locking parts 109a and 109b to the housing base 102, the present invention is not limited to this.
  • a metal part 109 may be attached to the.
  • any structure for attaching the metal part 109 to the housing base 102 may be used as long as it is a structure that allows the housing base 102 and the metal part 109 to be electrically connected.
  • the proximal portion 153 is formed integrally with the housing cover 103B, but the present invention is not limited to this, and the proximal portion 153 may be formed separately from the housing cover 103B. Good too. Furthermore, the proximity portion 153 may be provided on the housing cover 103 of the electronic control device 100 according to the first embodiment.
  • the application state of the adhesive 110 adopted in the fourth embodiment may be applied to the second embodiment and the third embodiment.
  • the electronic control device according to the present invention can be suitably applied to an electronic control device installed in a vehicle such as an automobile, but the scope of application is not limited to vehicles, but can also be applied to ships, aircraft, cranes, etc. good.
  • vehicles also include railway vehicles, construction vehicles, agricultural vehicles, and the like.
  • 100, 100A, 100B, 100C, 100D...Electronic control unit 101, 101A, 101B...Metal casing, 102, 102A... Casing base (first casing), 103, 103B... Casing cover (second casing) ), 104... Circuit board, 105... LSI element (electronic component), 107... Board side connector (connector), 109... Metal part, 110... Adhesive (conductive adhesive), 111... Board side connector (connector), 116... Adhesive (non-conductive adhesive), 117... EMI gasket (conductive member), 118... Communication IC (electronic component), 119... Wiring, 125... Chip component, 151... Ground area, 152... Metal part, 154...Circuit area

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This electronic control device comprises a circuit board on which an electronic component and a connector are mounted, and a metal housing in which the circuit board is housed. The circuit board includes a ground region defined around the connector. The metal housing is provided with a metal portion which is disposed in a position overlapping with the ground region in a state of being proximate to the ground region. The metal portion is electrically connected to the metal housing and is fixed to the ground region via an adhesive.

Description

電子制御装置electronic control unit
　本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
　運転支援システムや自動運転のために、カメラに代表されるセンサモジュールと電子制御装置とを高速な信号伝送によって接続し、センサデータを伝送する方式が増えつつある。このような信号伝送の高速化に伴い、電子制御装置からの不要電磁波放射の増加、及び外来電磁ノイズに対する電子制御装置の耐性低下が課題の一つとなっている。電子制御装置においては、特に、外部接続用のコネクタの周辺部において電磁波ノイズ（以下、単に「ノイズ」ともいう。）が出入りしやすいことが課題になっている。 For driving support systems and autonomous driving, there is an increasing number of methods that connect sensor modules, typically cameras, and electronic control devices using high-speed signal transmission to transmit sensor data. As the speed of signal transmission increases, one of the issues is an increase in unnecessary electromagnetic wave radiation from the electronic control device and a decrease in the resistance of the electronic control device to external electromagnetic noise. In electronic control devices, it has become a problem that electromagnetic noise (hereinafter also simply referred to as "noise") tends to enter and exit, particularly in the vicinity of connectors for external connections.
　特許文献１には、プリント基板を収納する金属筐体にピン囲み部を一体に形成し、このピン囲み部をノイズ対策のためのシールド部として機能させることにより、ノイズによる回路の誤動作を防止する技術が開示されている。 Patent Document 1 discloses that a pin surrounding part is integrally formed in a metal casing that houses a printed circuit board, and this pin surrounding part functions as a shield part to prevent noise, thereby preventing circuit malfunction due to noise. The technology has been disclosed.
特開２００８－１９３１０８号公報Japanese Patent Application Publication No. 2008-193108
　しかしながら、特許文献１に記載された従来の技術では、筐体内の空間を伝わるノイズについては前述したピン囲み部によって抑制できるものの、回路エリアとコネクタとを電気的に接続するために引き回された配線（信号ライン、電源ライン、グラウンドラインなど）を伝わって伝播するノイズに対する減衰効果が得られないという課題があった。電子制御装置内のノイズが前述の配線を伝わってシールド部を通過し、コネクタ周辺部のグラウンド電位が不安定になった場合は、電子制御装置の外部のケーブル全体にノイズが重畳するため、不要電磁波放射につながることになる。また、外部のケーブルを伝わって金属筐体内に侵入する外来ノイズによってコネクタ周辺部のグラウンド電位が不安定になると、前述の配線を介して回路エリアにノイズが伝わるため、耐ノイズ性が悪化することになる。特に、車載用の電子制御装置においては、ケーブル・コネクタのシールドを接続する筺体につながるグラウンドパターンがコネクタ周辺部のみに小さな島状のパターンとして配置される場合がある。その場合、小面積のグラウンドパターンは電位が不安定になりやすいため、前述のノイズ耐性の劣化度合いが大きくなる。 However, in the conventional technology described in Patent Document 1, although the noise transmitted through the space inside the housing can be suppressed by the aforementioned pin surrounding part, The problem was that it was not possible to attenuate noise propagated through wiring (signal lines, power lines, ground lines, etc.). If the noise inside the electronic control device is transmitted through the wiring mentioned above and passes through the shield section, and the ground potential around the connector becomes unstable, the noise will be superimposed on the entire cable outside the electronic control device, making it unnecessary. This will lead to electromagnetic radiation. Additionally, if the ground potential around the connector becomes unstable due to external noise that infiltrates the metal casing through the external cable, the noise will be transmitted to the circuit area via the aforementioned wiring, resulting in a deterioration in noise resistance. become. In particular, in a vehicle-mounted electronic control device, a ground pattern connected to a casing to which a shield of a cable connector is connected is sometimes arranged as a small island-like pattern only around the connector. In that case, the potential of a small-area ground pattern tends to become unstable, so that the degree of deterioration of the noise resistance described above increases.
　本発明の目的は、従来よりも耐ノイズ性を高めることができる電子制御装置を提供することにある。 An object of the present invention is to provide an electronic control device that can have higher noise resistance than conventional ones.
　上記課題を解決するために、たとえば、請求の範囲に記載された構成を採用する。
　本願は、上記課題を解決する手段を複数含んでいるが、その一つを挙げるならば、電子部品及びコネクタが搭載される回路基板と、回路基板を収容する金属筐体とを有する電子制御装置である。回路基板は、コネクタの周辺に区画されるグラウンド領域を有し、金属筐体は、グラウンド領域と重なる位置にグラウンド領域と近接する状態で配置される金属部を備える。金属部は、金属筺体と電気的に接続されるとともに、グラウンド領域に接着剤を介して固定されている。 In order to solve the above problems, for example, the configuration described in the claims is adopted.
The present application includes a plurality of means for solving the above problems, and one of them is an electronic control device that has a circuit board on which electronic components and connectors are mounted, and a metal casing that houses the circuit board. It is. The circuit board has a ground area defined around the connector, and the metal casing includes a metal part that is placed in a position overlapping the ground area and close to the ground area. The metal part is electrically connected to the metal casing and is fixed to the ground area via an adhesive.
　本発明によれば、従来よりも耐ノイズ性を高めた電子制御装置を提供することができる。
　上記した以外の課題、構成及び効果は、以下の実施形態の説明によって明らかにされる。 According to the present invention, it is possible to provide an electronic control device with improved noise resistance compared to the conventional one.
Problems, configurations, and effects other than those described above will be made clear by the description of the embodiments below.
第１実施形態に係る電子制御装置の斜視図である。FIG. 1 is a perspective view of an electronic control device according to a first embodiment. 図１に示す電子制御装置のＩＩ－ＩＩ線位置の縦断面図である。FIG. 2 is a vertical cross-sectional view taken along line II-II of the electronic control device shown in FIG. 1; 第１実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。FIG. 2 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the first embodiment. 回路基板における接着剤の塗布状態を示す上面図である。FIG. 3 is a top view showing a state in which adhesive is applied to the circuit board. 第１実施形態における金属部の取付状態を金属筐体の長手方向から見た断面図である。FIG. 3 is a cross-sectional view of the attached state of the metal part in the first embodiment, viewed from the longitudinal direction of the metal casing. 第１実施形態における筐体ベースと金属部の配置状態を示す下面図である。FIG. 3 is a bottom view showing the arrangement of the housing base and metal parts in the first embodiment. 第２実施形態に係る電子制御装置の断面図である。FIG. 3 is a sectional view of an electronic control device according to a second embodiment. 第２実施形態における筐体ベースの下面図である。It is a bottom view of the housing base in 2nd Embodiment. 第３実施形態に係る電子制御装置の断面図である。FIG. 7 is a sectional view of an electronic control device according to a third embodiment. 第３実施形態における筐体カバーの上面図である。It is a top view of the housing cover in 3rd Embodiment. 第４実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 4th embodiment is provided with. 第５実施形態に係る電子制御装置の断面図である。It is a sectional view of an electronic control device concerning a 5th embodiment. 第６実施形態に係る電子制御装置の断面図である。It is a sectional view of an electronic control device concerning a 6th embodiment. 第６実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 6th embodiment is provided with. 第７実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。It is a top view showing the arrangement state of the housing cover and the circuit board which the electronic control device concerning a 7th embodiment is provided with. 第７実施形態に係る電子制御装置が備える筐体ベースの下面図である。It is a bottom view of the housing base with which the electronic control device concerning 7th Embodiment is equipped.
　以下、本発明の実施形態について図面を参照して詳細に説明する。本明細書及び図面において、実質的に同一の機能又は構成を有する要素については、同一の符号を付し、重複する説明は省略する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this specification and the drawings, elements having substantially the same functions or configurations are denoted by the same reference numerals, and redundant explanations are omitted.
　（第１実施形態）
　まず、第１実施形態に係る電子制御装置について、図１～図６を用いて説明する。
　図１は、第１実施形態に係る電子制御装置の斜視図であり、図２は、図１に示す電子制御装置のＩＩ－ＩＩ線位置の縦断面図である。
　図１及び図２に示すように、電子制御装置１００は、導電性を有する筐体である金属性の筐体（以下、「金属筐体」という。）１０１と、回路基板１０４とを備えている。金属筐体１０１は、回路基板１０４を収容する筐体である。金属筐体１０１は、高さ寸法（厚み寸法）が小さく抑えられた、いわゆる扁平の直方体形状に形成されている。金属筐体１０１は、金属筐体１０１の全ての部分が金属製で高い導電性を有することが好ましいが、これに限らず、一部が樹脂などの絶縁材料で構成されていてもよい。 (First embodiment)
First, an electronic control device according to a first embodiment will be explained using FIGS. 1 to 6.
FIG. 1 is a perspective view of the electronic control device according to the first embodiment, and FIG. 2 is a longitudinal sectional view taken along line II-II of the electronic control device shown in FIG.
As shown in FIGS. 1 and 2, the electronic control device 100 includes a metal casing (hereinafter referred to as "metal casing") 101, which is a conductive casing, and a circuit board 104. There is. The metal casing 101 is a casing that houses the circuit board 104. The metal casing 101 is formed into a so-called flat rectangular parallelepiped shape with a small height (thickness). Although it is preferable that all parts of the metal housing 101 are made of metal and have high conductivity, the metal housing 101 is not limited thereto, and a part thereof may be made of an insulating material such as resin.
　金属筐体１０１は、筐体ベース１０２及び筐体カバー１０３によって構成されている。筐体ベース１０２は、第１筐体に相当するもので、例えばアルミニウムによって構成される。筐体カバー１０３は、第２筐体に相当するもので、例えば防錆処理が施された鉄によって構成される。筐体ベース１０２には、放熱用ボス部１２０と、突条部１２１とが一体に形成されている。 The metal casing 101 is composed of a casing base 102 and a casing cover 103. The housing base 102 corresponds to the first housing and is made of aluminum, for example. The housing cover 103 corresponds to the second housing, and is made of, for example, rust-proofed iron. A heat dissipation boss portion 120 and a protrusion portion 121 are integrally formed on the housing base 102 .
　回路基板１０４は、筐体ベース１０２と筐体カバー１０３によって上下から囲われている。回路基板１０４にはＬＳＩ素子１０５が搭載されている。ＬＳＩは、Large Scale Integrationの略称である。ＬＳＩ素子１０５は、発熱源であり、ノイズ源でもある。ＬＳＩ素子１０５と筐体ベース１０２の放熱用ボス部１２０との間には放熱グリス１０６が挿入されている。これにより、ＬＳＩ素子１０５が発生する熱は、放熱グリス１０６を介して筐体ベース１０２に伝えられ、筐体ベース１０２の外表面から放出される。 The circuit board 104 is surrounded from above and below by the housing base 102 and the housing cover 103. An LSI element 105 is mounted on the circuit board 104. LSI is an abbreviation for Large Scale Integration. The LSI element 105 is a heat generation source and also a noise source. Heat radiation grease 106 is inserted between the LSI element 105 and the heat radiation boss portion 120 of the housing base 102. Thereby, the heat generated by the LSI element 105 is transmitted to the housing base 102 via the heat radiation grease 106 and is emitted from the outer surface of the housing base 102.
　図３は、第１実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。なお、回路基板１０４にはＬＳＩ素子１０５以外の電子部品も搭載されるが、図３においては、ＬＳＩ素子１０５以外の電子部品や配線などを省略している。 FIG. 3 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the first embodiment. Note that although electronic components other than the LSI element 105 are also mounted on the circuit board 104, electronic components other than the LSI element 105, wiring, etc. are omitted in FIG.
　図３に示すように、回路基板１０４は、長方形に形成されている。回路基板１０４は、例えばガラスエポキシを基材とするプリント配線基板によって構成される。回路基板１０４の四隅には、ネジ通し孔１１２が設けられている。ネジ通し孔１１２は、回路基板１０４を筐体ベース１０２にネジ止めによって固定するための貫通孔である。 As shown in FIG. 3, the circuit board 104 is formed into a rectangle. The circuit board 104 is constituted by a printed wiring board made of glass epoxy as a base material, for example. Screw holes 112 are provided at the four corners of the circuit board 104. The screw holes 112 are through holes for fixing the circuit board 104 to the housing base 102 with screws.
　回路基板１０４には、基板側コネクタ１０７と、基板側コネクタ１１１とが搭載されている。本実施形態においては、一例として、４つの基板側コネクタ１０７と１つの基板側コネクタ１１１が、回路基板１０４の端部に搭載されている。４つの基板側コネクタ１０７は、所定の間隔をあけて回路基板１０４の端部に並べて配置されている。基板側コネクタ１１１は、多ピンコネクタによって構成されている。基板側コネクタ１１１は、４つの基板側コネクタ１０７と共に、回路基板１０４の端部に配置されている。 A board-side connector 107 and a board-side connector 111 are mounted on the circuit board 104. In this embodiment, as an example, four board-side connectors 107 and one board-side connector 111 are mounted on the end of the circuit board 104. The four board-side connectors 107 are arranged side by side at the end of the circuit board 104 at predetermined intervals. The board-side connector 111 is composed of a multi-pin connector. The board-side connector 111 is arranged at the end of the circuit board 104 together with the four board-side connectors 107.
　基板側コネクタ１０７にはケーブル側コネクタ１１３（図１、図２）が接続され、基板側コネクタ１１１にはケーブル側コネクタ１１４（図１）が接続される。基板側コネクタ１０７とケーブル側コネクタ１１３は、互いに抜き差し可能な雄型コネクタと雌型コネクタの関係にあり、基板側コネクタ１１１とケーブル側コネクタ１１３も、互いに抜き差し可能な雄型コネクタと雌型コネクタの関係にある。ケーブル側コネクタ１１３及びケーブル側コネクタ１１４には、それぞれケーブル１０８がつながっている。電子制御装置１００は、複数のケーブル１０８を介して外部の機器（図示せず）に接続される。 A cable-side connector 113 (FIGS. 1 and 2) is connected to the board-side connector 107, and a cable-side connector 114 (FIG. 1) is connected to the board-side connector 111. The board-side connector 107 and the cable-side connector 113 are in the relationship of a male connector and a female connector that can be inserted and removed from each other, and the board-side connector 111 and the cable-side connector 113 are also a male connector and a female connector that can be inserted and removed from each other. In a relationship. A cable 108 is connected to each of the cable side connector 113 and the cable side connector 114. The electronic control device 100 is connected to external equipment (not shown) via a plurality of cables 108.
　回路基板１０４は、グラウンド領域１５１と、回路エリア１５４とを有している。グラウンド領域１５１と回路エリア１５４は、互いに分離されている。グラウンド領域１５１と回路エリア１５４との境界部には、前述した筐体ベース１０２の突条部１２１（図２）が近接して配置される。突条部１２１は、筐体ベース１０２の長手方向の一端から他端にわたって連続的に形成されている（図６参照）。突条部１２１は、グラウンド領域１５１と回路エリア１５４との間で、金属筐体１０１内の空間を伝って伝播する電磁波ノイズをシールドするシールド部（シールド壁）として機能する。 The circuit board 104 has a ground area 151 and a circuit area 154. Ground area 151 and circuit area 154 are separated from each other. The aforementioned protrusion 121 (FIG. 2) of the housing base 102 is placed close to the boundary between the ground area 151 and the circuit area 154. The protruding portion 121 is formed continuously from one end to the other end in the longitudinal direction of the housing base 102 (see FIG. 6). The protruding portion 121 functions as a shield portion (shield wall) between the ground region 151 and the circuit area 154 to shield electromagnetic noise propagating through the space within the metal casing 101.
　回路エリア１５４は、各種の電子部品（ＬＳＩ素子１０５を含む）が搭載されるエリアである。また、回路エリア１５４は、図示しない配線パターン（信号ライン、電源ライン、グラウンドライン等を含む）が形成されるエリアでもある。 The circuit area 154 is an area where various electronic components (including the LSI element 105) are mounted. Further, the circuit area 154 is also an area where a wiring pattern (including a signal line, a power supply line, a ground line, etc.) (not shown) is formed.
　グラウンド領域１５１は、基板側コネクタ１０７及び基板側コネクタ１１１の周辺に区画される領域である。グラウンド領域１５１は、回路基板１０４のグラウンドパターン（図示せず）が形成される領域であって、グラウンド電位に維持される領域である。グラウンド領域１５１は、基板側コネクタ１０７及び基板側コネクタ１１１を取り囲むように区画されている。例えば、基板側コネクタ１１１について述べると、基板側コネクタ１１１は、ケーブル側コネクタ１１４との接続が行われる方向（図３の右方向）を除いて、３方向（図３の上方向、下方向、左方向）がグラウンド領域１５１によって取り囲まれている。この点は、各々の基板側コネクタ１０７についても同様である。 The ground area 151 is an area defined around the board-side connector 107 and the board-side connector 111. The ground area 151 is an area where a ground pattern (not shown) of the circuit board 104 is formed and is maintained at a ground potential. The ground area 151 is divided so as to surround the board-side connector 107 and the board-side connector 111. For example, regarding the board-side connector 111, the board-side connector 111 is connected in three directions (upward direction, downward direction in FIG. 3, (to the left) is surrounded by a ground area 151. The same holds true for each board-side connector 107.
　ここで本実施形態においては、金属筐体１０１が金属部１０９（図２）を備えている。金属部１０９は、金属筐体１０１と電気的に接続された状態で、金属筐体１０１に取り付けられている。また、金属部１０９は、回路基板１０４のグラウンド領域１５１に接着剤１１０を介して固定されている。 In this embodiment, the metal housing 101 includes a metal portion 109 (FIG. 2). The metal part 109 is attached to the metal casing 101 while being electrically connected to the metal casing 101 . Further, the metal part 109 is fixed to the ground area 151 of the circuit board 104 via an adhesive 110.
　図４は、回路基板における接着剤の塗布状態を示す上面図である。
　図４に示すように、回路基板１０４には、ネジ通し孔１１２の近傍を除いて、グラウンド領域１５１（図３）のほぼ全域に接着剤１１０が塗布されている。接着剤１１０は、グラウンド領域１５１に面状（ベタ）に塗布されている。つまり、接着剤１１０は、グラウンド領域１５１全体に均一に塗布されている。接着剤１１０は、導電性接着剤である。 FIG. 4 is a top view showing how adhesive is applied to the circuit board.
As shown in FIG. 4, the adhesive 110 is applied to almost the entire ground area 151 (FIG. 3) of the circuit board 104, except for the vicinity of the screw hole 112. The adhesive 110 is applied to the ground area 151 in a planar (solid) manner. That is, the adhesive 110 is uniformly applied to the entire ground area 151. Adhesive 110 is a conductive adhesive.
　図５は、第１実施形態における金属部の取付状態を金属筐体の長手方向から見た断面図である。
　図５に示すように、金属部１０９は、薄い金属の板を曲げ加工して得られる、いわゆる板金である。金属部１０９は、適度なバネ性を有する金属材料によって構成されている。金属部１０９は、ベース部１０９ｅと、係止部１０９ａ，１０９ｂとを一体に有している。ベース部１０９ｅは、平板状に形成されている。係止部１０９ａ，１０９ｂは、金属部１０９の短手方向（図５の左右方向）の両端部に形成されている。また、係止部１０９ａ，１０９ｂは、金属部１０９の長手方向（図５の奥行き方向）に長く形成されている。 FIG. 5 is a cross-sectional view of the attached state of the metal part in the first embodiment, viewed from the longitudinal direction of the metal casing.
As shown in FIG. 5, the metal portion 109 is a so-called sheet metal obtained by bending a thin metal plate. The metal portion 109 is made of a metal material having appropriate spring properties. The metal portion 109 integrally includes a base portion 109e and locking portions 109a and 109b. The base portion 109e is formed into a flat plate shape. The locking portions 109a and 109b are formed at both ends of the metal portion 109 in the lateral direction (left-right direction in FIG. 5). Furthermore, the locking portions 109a and 109b are formed long in the longitudinal direction of the metal portion 109 (the depth direction in FIG. 5).
　筐体ベース１０２の突条部１２１の下面には、溝部１２１ａが形成されている。溝部１２１ａは、筐体ベース１０２の長手方向（図５の奥行き方向）に細長く形成されている。また、筐体ベース１０２のコネクタ側の端部には、段付き部１０２ａが形成されている。金属部１０９の係止部１０９ａは突条部１２１の溝部１２１ａに係止されている。金属部１０９の係止部１０９ｂは筐体ベース１０２の段付き部１０２ａに係止されている。金属部１０９は、係止部１０９ａと突条部１２１との接触、及び、係止部１０９ｂと段付き部１０２ａとの接触により、筐体ベース１０２に電気的かつ機械的に接続されている。 A groove 121a is formed on the lower surface of the protrusion 121 of the housing base 102. The groove portion 121a is formed to be elongated in the longitudinal direction of the housing base 102 (the depth direction in FIG. 5). Furthermore, a stepped portion 102a is formed at the end of the housing base 102 on the connector side. The locking portion 109a of the metal portion 109 is locked in the groove portion 121a of the protrusion 121. A locking portion 109b of the metal portion 109 is locked to a stepped portion 102a of the housing base 102. The metal portion 109 is electrically and mechanically connected to the housing base 102 through contact between the locking portion 109a and the protruding portion 121, and contact between the locking portion 109b and the stepped portion 102a.
　図６は、第１実施形態における筐体ベースと金属部の配置状態を示す下面図である。
　図６に示すように、金属部１０９は、筐体ベース１０２の長手方向に長い長尺状の板状部材である。金属部１０９は、ネジ１３０によって筐体ベース１０２に固定されている。このため、金属部１０９は、ネジ１３０の締結部においても筐体ベース１０２に電気的かつ機械的に接続されている。金属部１０９には、ネジ１３０の取付位置に対応して凹部１３２が形成されている。凹部１３２は、ネジ１３０と回路基板１０４との干渉を避けるために形成されている。 FIG. 6 is a bottom view showing the arrangement of the housing base and metal parts in the first embodiment.
As shown in FIG. 6, the metal portion 109 is an elongated plate-like member extending in the longitudinal direction of the housing base 102. As shown in FIG. The metal part 109 is fixed to the housing base 102 with screws 130. Therefore, the metal part 109 is electrically and mechanically connected to the housing base 102 also at the fastening part of the screw 130. A recess 132 is formed in the metal portion 109 in correspondence with the mounting position of the screw 130. The recess 132 is formed to avoid interference between the screw 130 and the circuit board 104.
　金属部１０９の長手方向の両端部には、ネジ通し孔１３１が設けられている。ネジ通し孔１３１は、筐体ベース１０２に対して金属部１０９と回路基板１０４を共締めによって固定するための貫通孔である。このため、金属部１０９のネジ通し孔１３１は、回路基板１０４のコネクタ側に設けられたネジ通し孔１１２とほぼ同軸に配置される。また、金属部１０９のベース部１０９ｅには、基板側コネクタ１０７との干渉を避けるための切り欠き部１０９ｃと、基板側コネクタ１１１との干渉を避けるための切り欠き部１０９ｄとが形成されている。 Screw holes 131 are provided at both ends of the metal portion 109 in the longitudinal direction. The screw hole 131 is a through hole for fixing the metal part 109 and the circuit board 104 to the housing base 102 by tightening them together. Therefore, the screw holes 131 of the metal part 109 are arranged substantially coaxially with the screw holes 112 provided on the connector side of the circuit board 104. Further, the base portion 109e of the metal portion 109 is formed with a notch portion 109c for avoiding interference with the board-side connector 107 and a notch portion 109d for avoiding interference with the board-side connector 111. .
　金属部１０９は、図２に示すように、回路基板１０４のグラウンド領域１５１と重なる位置に、グラウンド領域１５１と近接する状態で配置される。ここで記述する近接とは、金属部１０９のベース部１０９ｅが回路基板１０４のグラウンド領域１５１に対して接着剤１１０の厚み寸法程度の距離で近接することを意味する。金属部１０９は、回路基板１０４のグラウンド領域１５１に接着剤１１０を介して固定されている。本実施形態においては、接着剤１１０が導電性接着剤によって構成されているため、金属部１０９は、ベース部１０９ｅの平面積に相当する広い接触面積で回路基板１０４のグラウンド領域１５１に電気的に接続された状態となる。 As shown in FIG. 2, the metal part 109 is arranged at a position overlapping with and close to the ground area 151 of the circuit board 104. Proximity described here means that the base portion 109e of the metal portion 109 is close to the ground region 151 of the circuit board 104 at a distance approximately equal to the thickness of the adhesive 110. The metal part 109 is fixed to the ground area 151 of the circuit board 104 via an adhesive 110. In this embodiment, since the adhesive 110 is made of a conductive adhesive, the metal part 109 is electrically connected to the ground area 151 of the circuit board 104 with a wide contact area corresponding to the planar area of the base part 109e. It will be connected.
　筐体ベース１０２の四隅には、ネジ孔１２２，１２３が設けられている。ネジ孔１２２は、ネジ孔１２３よりも外側に配置されている。ネジ孔１２３は、ネジ用ボス１２４に設けられている。ネジ用ボス１２４は、筐体ベース１０２に一体に形成されている。ネジ用ボス１２４は、回路基板１０４に搭載される電子部品やコネクタが筐体ベース１０２に干渉しないように、電子制御装置１００の高さ（厚み）方向における回路基板１０４の取付位置を規制する部分である。筐体ベース１０２の四隅に設けられた計４つのネジ孔１２２は、筐体ベース１０２に筐体カバー１０３をネジ止めによって固定するための孔である。また、筐体ベース１０２の四隅に設けられた計４つのネジ孔１２３は、筐体ベース１０２に回路基板１０４及び金属部１０９をネジ止めによって固定するための孔である。図６においては、４つのネジ孔１２３のうち、共締め用の２つのネジ孔１２３が、金属部１０９のネジ通し孔１３１を通して見えている。 Screw holes 122 and 123 are provided at the four corners of the housing base 102. The screw hole 122 is arranged outside the screw hole 123. The screw hole 123 is provided in the screw boss 124. The screw boss 124 is integrally formed with the housing base 102. The screw boss 124 is a portion that regulates the mounting position of the circuit board 104 in the height (thickness) direction of the electronic control device 100 so that the electronic components and connectors mounted on the circuit board 104 do not interfere with the housing base 102. It is. A total of four screw holes 122 provided at the four corners of the housing base 102 are holes for fixing the housing cover 103 to the housing base 102 with screws. Further, a total of four screw holes 123 provided at the four corners of the housing base 102 are holes for fixing the circuit board 104 and the metal part 109 to the housing base 102 by screwing. In FIG. 6, of the four screw holes 123, two screw holes 123 for co-tightening are visible through the screw holes 131 of the metal part 109.
　以上説明した第１実施形態に係る電子制御装置１００においては、金属筐体１０１の筐体ベース１０２が金属部１０９を備え、この金属部１０９が回路基板１０４のグラウンド領域１５１に近接する状態で配置されている。また、金属部１０９は、金属筐体１０１と電気的に接続されるとともに、グラウンド領域１５１に接着剤１１０を介して固定されている。これにより、回路基板１０４のグラウンド領域１５１は、金属筐体１０１と実質的に同じ電位をもつ金属部１０９によって覆われた状態になる。このため、コネクタ周辺のグラウンド領域１５１全体の電位を安定させ、ノイズの抑制効果を高めることができる。その結果、従来よりも耐ノイズ性を高めた電子制御装置１００を提供することができる。 In the electronic control device 100 according to the first embodiment described above, the housing base 102 of the metal housing 101 includes the metal portion 109, and this metal portion 109 is arranged in a state close to the ground area 151 of the circuit board 104. has been done. Further, the metal part 109 is electrically connected to the metal housing 101 and is fixed to the ground area 151 via an adhesive 110. As a result, the ground area 151 of the circuit board 104 is covered by the metal portion 109 having substantially the same potential as the metal housing 101 . Therefore, the potential of the entire ground area 151 around the connector can be stabilized, and the effect of suppressing noise can be enhanced. As a result, it is possible to provide the electronic control device 100 with higher noise resistance than before.
　また、第１実施形態においては、グラウンド領域１５１と回路エリア１５４が互いに分離されているため、回路エリア１５４のグラウンド電位への影響を抑えつつ、コネクタ周辺のグラウンド電位を安定させることができる。 Furthermore, in the first embodiment, since the ground region 151 and the circuit area 154 are separated from each other, it is possible to stabilize the ground potential around the connector while suppressing the influence on the ground potential of the circuit area 154.
　また、第１実施形態においては、金属部１０９を板金によって構成している。これにより、回路基板１０４のレイアウトに応じて金属部１０９の形状及び寸法を自由に設定又は変更することができる。このため、回路基板１０４のレイアウトが変更になった場合でも、金属筐体製造用の金型を変更する必要がない。したがって、回路基板１０４のレイアウト変更に柔軟に対応することができる。 Furthermore, in the first embodiment, the metal portion 109 is made of a sheet metal. Thereby, the shape and dimensions of the metal part 109 can be freely set or changed according to the layout of the circuit board 104. Therefore, even if the layout of the circuit board 104 is changed, there is no need to change the mold for manufacturing the metal casing. Therefore, it is possible to flexibly respond to changes in the layout of the circuit board 104.
　また、第１実施形態においては、接着剤１１０を導電性接着剤によって構成している。これにより、コネクタ周辺のグラウンド領域１５１に対して金属部１０９を面状に導通させることができる。このため、コネクタ周辺のグラウンド電位を、より一層安定させることができる。 Furthermore, in the first embodiment, the adhesive 110 is made of a conductive adhesive. Thereby, the metal part 109 can be electrically connected to the ground area 151 around the connector in a planar manner. Therefore, the ground potential around the connector can be further stabilized.
　なお、グラウンド領域１５１の電位安定効果を高めるため、金属部１０９はなるべく多点で、かつ電子制御装置１００の端部に近い位置で金属筐体１０１と接続するのが望ましい。このため、上記第１実施形態においては、金属部１０９の係止部１０９ａを筐体ベース１０２の突条部１２１に接続させ、かつ、金属部１０９の係止部１０９ｂを筐体ベース１０２の段付き部１０２ａに接続させている。これにより、グラウンド領域１５１の電位安定効果を高めることができる。 Note that in order to enhance the potential stabilization effect of the ground region 151, it is desirable that the metal portion 109 be connected to the metal casing 101 at as many points as possible and at positions close to the ends of the electronic control device 100. Therefore, in the first embodiment, the locking part 109a of the metal part 109 is connected to the protrusion part 121 of the housing base 102, and the locking part 109b of the metal part 109 is connected to the step of the housing base 102. It is connected to the attaching portion 102a. Thereby, the potential stabilizing effect of the ground region 151 can be enhanced.
　（第２実施形態）
　次に、第２実施形態に係る電子制御装置について、図７及び図８を用いて説明する。
　図７は、第２実施形態に係る電子制御装置の断面図である。図８は、第２実施形態における筐体ベースの下面図である。 (Second embodiment)
Next, an electronic control device according to a second embodiment will be described using FIGS. 7 and 8.
FIG. 7 is a sectional view of the electronic control device according to the second embodiment. FIG. 8 is a bottom view of the housing base in the second embodiment.
　第２実施形態に係る電子制御装置１００Ａは、上記第１実施形態の場合と比較して、筐体ベース１０２Ａの構成が異なる。具体的には、前述した第１実施形態においては、金属部１０９が板金によって構成されているが、第２実施形態においては、金属部１５２が筐体ベース１０２Ａと一体に形成されている。つまり、金属部１５２は筐体ベース１０２Ａと一体構造になっている。 The electronic control device 100A according to the second embodiment differs in the configuration of the housing base 102A compared to the first embodiment. Specifically, in the first embodiment described above, the metal part 109 is made of a sheet metal, but in the second embodiment, the metal part 152 is formed integrally with the housing base 102A. In other words, the metal portion 152 has an integral structure with the housing base 102A.
　金属部１５２は、図７に示すように、回路基板１０４のグラウンド領域１５１と重なる位置に、グラウンド領域１５１と近接する状態で配置されている。また、金属部１５２は、金属筐体１０１と電気的に接続されるとともに、グラウンド領域１５１に接着剤１１０を介して固定されている。 As shown in FIG. 7, the metal part 152 is arranged at a position overlapping with and close to the ground area 151 of the circuit board 104. Further, the metal part 152 is electrically connected to the metal housing 101 and is fixed to the ground area 151 via the adhesive 110.
　金属部１５２は、図８に示すように、グラウンド領域１５１（図３）と同様の平面形状を有している。金属部１５２には、基板側コネクタ１０７との干渉を避けるための切り欠き部１５２ａと、基板側コネクタ１１１との干渉を避けるための切り欠き部１５２ｂとが形成されている。また、金属部１０９の長手方向の両端部には、回路基板１０４をネジ止めするためのネジ孔１２３が設けられている。 As shown in FIG. 8, the metal portion 152 has the same planar shape as the ground area 151 (FIG. 3). The metal portion 152 is formed with a notch 152a for avoiding interference with the board-side connector 107 and a notch 152b for avoiding interference with the board-side connector 111. Moreover, screw holes 123 for screwing the circuit board 104 are provided at both ends of the metal part 109 in the longitudinal direction.
　第２実施形態に係る電子制御装置１００Ａにおいては、金属筐体１０１Ａの筐体ベース１０２Ａに金属部１５２を一体に形成しているため、前述した第１実施形態に比べて、グラウンド領域１５１の電位を安定させる効果が、より高い周波数帯域まで得られる。また、筐体ベース１０２Ａに対して別部品を取り付ける必要がないため、部品コスト及び製造コストを低減することができる。 In the electronic control device 100A according to the second embodiment, since the metal portion 152 is integrally formed on the housing base 102A of the metal housing 101A, the potential of the ground region 151 is higher than that in the first embodiment described above. The effect of stabilizing can be obtained up to a higher frequency band. Further, since there is no need to attach separate parts to the housing base 102A, parts costs and manufacturing costs can be reduced.
　（第３実施形態）
　次に、第３実施形態に係る電子制御装置について、図９及び図１０を用いて説明する。
　図９は、第３実施形態に係る電子制御装置の断面図である。図１０は、第３実施形態における筐体カバーの上面図である。 (Third embodiment)
Next, an electronic control device according to a third embodiment will be described using FIGS. 9 and 10.
FIG. 9 is a sectional view of an electronic control device according to a third embodiment. FIG. 10 is a top view of the housing cover in the third embodiment.
　第３実施形態に係る電子制御装置１００Ｂは、上記第２実施形態の場合と比較して、筐体カバー１０３Ｂの構成が異なる。具体的には、図９及び図１０に示すように、筐体カバー１０３Ｂは、近接部１５３を備えている。近接部１５３は、筐体カバー１０３Ｂに一体に形成されている。筐体カバー１０３Ｂは、図９に示すように、回路基板１０４のグラウンド領域１５１に近接して配置されている。また、近接部１５３は、筐体ベース１０２Ａの金属部１５２と同様に、導電性の接着剤１１０を介してグラウンド領域１５１に固定されている。 The electronic control device 100B according to the third embodiment has a different configuration of a housing cover 103B compared to the second embodiment. Specifically, as shown in FIGS. 9 and 10, the housing cover 103B includes a proximal portion 153. The proximal portion 153 is integrally formed with the housing cover 103B. The housing cover 103B is placed close to the ground area 151 of the circuit board 104, as shown in FIG. Further, the proximal portion 153 is fixed to the ground area 151 via the conductive adhesive 110, similarly to the metal portion 152 of the housing base 102A.
　近接部１５３は、図１０に示すように、筐体カバー１０３Ｂの長手方向の一端から他端にわたって連続する状態で形成されている。筐体カバー１０３Ｂの四隅には、ネジ通し孔１３３が設けられている。ネジ通し孔１３３は、筐体ベース１０２Ａに対して、筐体カバー１０３Ｂと回路基板１０４とを共通のネジで取り付ける（共締めする）ための貫通孔である。このため、ネジ通し孔１３３は、回路基板１０４の四隅に設けられたネジ通し孔１１２（図３）とほぼ同軸に配置される。 As shown in FIG. 10, the proximal portion 153 is formed continuously from one end to the other end in the longitudinal direction of the housing cover 103B. Screw holes 133 are provided at the four corners of the housing cover 103B. The screw hole 133 is a through hole for attaching (fastening together) the housing cover 103B and the circuit board 104 to the housing base 102A with a common screw. Therefore, the screw holes 133 are arranged substantially coaxially with the screw holes 112 (FIG. 3) provided at the four corners of the circuit board 104.
　第３実施形態に係る電子制御装置１００Ｂにおいては、金属筐体１０１Ｂの筐体カバー１０３Ｂが近接部１５３を備えている。そして、近接部１５３は、金属部１５２と反対側で、回路基板１０４のグラウンド領域１５１に近接して配置されている。これにより、回路基板１０４のグラウンド領域１５１に対しては、回路基板１０４の上面側から金属部１５２が近接し、かつ、回路基板１０４の下面側から近接部１５３が近接した状態になる。このため、グラウンド領域１５１の電位を、より安定させることができる。 In the electronic control device 100B according to the third embodiment, the housing cover 103B of the metal housing 101B includes a proximal portion 153. The proximal portion 153 is disposed on the opposite side of the metal portion 152 and close to the ground region 151 of the circuit board 104 . As a result, the metal portion 152 approaches the ground region 151 of the circuit board 104 from the top surface of the circuit board 104, and the proximal portion 153 approaches the ground region 151 from the bottom surface of the circuit board 104. Therefore, the potential of the ground region 151 can be made more stable.
　また、第３実施形態においては、導電性の接着剤１１０を介して近接部１５３をグラウンド領域１５１に固定している。これにより、グラウンド領域１５１は、回路基板１０４の上面側では筐体ベース１０２Ａに電気的に接続され、回路基板１０４の下面側でも筐体カバー１０３Ｂに電気的に接続される。このため、コネクタ周辺のグラウンド電位を、より一層安定させることができる。 Furthermore, in the third embodiment, the proximal portion 153 is fixed to the ground area 151 via the conductive adhesive 110. Thereby, the ground area 151 is electrically connected to the housing base 102A on the upper surface side of the circuit board 104, and electrically connected to the housing cover 103B on the lower surface side of the circuit board 104. Therefore, the ground potential around the connector can be further stabilized.
　また、金属筐体１０１Ｂの内部では、筐体ベース１０２Ａと回路基板１０４との間の空間を伝わるノイズを金属部１５２によって遮る効果に加えて、筐体カバー１０３Ｂと回路基板１０４との間の空間を伝わるノイズを近接部１５３によって遮る効果が得られる。このため、より高いノイズ抑制効果が期待できる。また、防塵効果や防滴効果を高くすることもできる。 Furthermore, inside the metal casing 101B, in addition to the effect of blocking noise transmitted in the space between the casing base 102A and the circuit board 104 by the metal part 152, the space between the casing cover 103B and the circuit board 104 is The effect of blocking the noise transmitted by the adjacent portion 153 can be obtained. Therefore, a higher noise suppression effect can be expected. Further, it is also possible to enhance the dustproof effect and drip-proof effect.
　（第４実施形態）
　次に、第４実施形態に係る電子制御装置について、図１１を用いて説明する。
　図１１は、第４実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。 (Fourth embodiment)
Next, an electronic control device according to a fourth embodiment will be described using FIG. 11.
FIG. 11 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the fourth embodiment.
　第４実施形態に係る電子制御装置は、上記第１実施形態の場合に比較して、回路基板１０４のグラウンド領域１５１に接着剤１１０が多点状に塗布されている点が異なる。つまり、接着剤１１０は、上記第１実施形態のようにグラウンド領域１５１全体に均一に塗布するのではなく、小面積の多点に分けて塗布されている。これにより、第１実施形態の場合と比較して、接着剤１１０の使用量を減らすことができる。 The electronic control device according to the fourth embodiment differs from the first embodiment in that the adhesive 110 is applied in multiple spots on the ground area 151 of the circuit board 104. That is, the adhesive 110 is not uniformly applied to the entire ground area 151 as in the first embodiment, but is applied in multiple small areas. Thereby, the amount of adhesive 110 used can be reduced compared to the case of the first embodiment.
　また、第４実施形態において、接着剤１１０の塗布点同士の間には、ノイズ対策として必要とされる電磁波シールド性能に応じて適宜、隙間があってもよい。また、接着剤１１０の塗布点同士の間隔は、電磁波シールド性能を確保したい周波数範囲のうち、最大周波数の波長の半分以下とするのが望ましい。 Furthermore, in the fourth embodiment, there may be a gap between the application points of the adhesive 110 as appropriate depending on the electromagnetic wave shielding performance required as a noise countermeasure. Furthermore, it is desirable that the interval between the application points of the adhesive 110 be less than half the wavelength of the maximum frequency within the frequency range in which electromagnetic shielding performance is desired to be ensured.
　（第５実施形態）
　次に、第５実施形態に係る電子制御装置について、図１２を用いて説明する。
　図１２は、第５実施形態に係る電子制御装置の断面図である。
　第５実施形態に係る電子制御装置１００Ｃは、上記第３実施形態の場合（図９）と比較して、導電性の接着剤１１０に代えて、非導電性の接着剤１１６を採用している点が異なる。非導電性接着剤は絶縁体である。このため、回路基板１０４のグラウンド領域１５１に対して、金属筐体１０１Ｂの金属部１５２や近接部１５３を電気的に接続することはできない。ただし、金属部１５２とグラウンド領域１５１との間、及び、近接部１５３とグラウンド領域１５１との間に、それぞれ非導電性（絶縁性）の接着剤１１６が介在することで、電極面積と比誘電率を大きく確保し、容量性の結合をもたせることができる。このため、特に容量性結合のインピーダンスが下がるＧＨｚ帯において、電磁波シールド効果を発揮することができる。例えば、比誘電率が２．７である接着剤１１６を使用した場合は、接着剤１１６の厚みを０．４ｍｍ以下とすることで、一般的なコネクタサイズの周辺のグラウンド面積で効果的に電磁波シールド効果をもたせることができる。 (Fifth embodiment)
Next, an electronic control device according to a fifth embodiment will be described using FIG. 12.
FIG. 12 is a sectional view of the electronic control device according to the fifth embodiment.
The electronic control device 100C according to the fifth embodiment uses a non-conductive adhesive 116 instead of the conductive adhesive 110, as compared to the third embodiment (FIG. 9). The points are different. Non-conductive adhesives are insulators. Therefore, it is not possible to electrically connect the metal portion 152 or the adjacent portion 153 of the metal housing 101B to the ground area 151 of the circuit board 104. However, by interposing a non-conductive (insulating) adhesive 116 between the metal part 152 and the ground area 151 and between the adjacent part 153 and the ground area 151, the electrode area and relative dielectric It is possible to secure a large ratio and provide capacitive coupling. Therefore, an electromagnetic wave shielding effect can be exhibited, particularly in the GHz band where the impedance of capacitive coupling is low. For example, when using an adhesive 116 with a dielectric constant of 2.7, by setting the thickness of the adhesive 116 to 0.4 mm or less, electromagnetic waves can be effectively transmitted in the ground area around a typical connector size. Can have a shielding effect.
　（第６実施形態）
　次に、第６実施形態に係る電子制御装置について、図１３及び図１４を用いて説明する。
　図１３は、第６実施形態に係る電子制御装置の断面図である。図１４は、第６実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。 (Sixth embodiment)
Next, an electronic control device according to a sixth embodiment will be described using FIGS. 13 and 14.
FIG. 13 is a sectional view of an electronic control device according to a sixth embodiment. FIG. 14 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the sixth embodiment.
　第６実施形態に係る電子制御装置１００Ｄは、上記第５実施形態の場合に比較して、接着剤１１６の塗布エリアと回路エリア１５４との間に、導電性部材として複数のＥＭＩガスケット１１７が配置されている点が異なる。複数のＥＭＩガスケット１１７は、回路エリア１５４の一辺（長辺）に沿って一列に並べられている。各々のＥＭＩガスケット１１７は、チップ状に形成されるとともに、回路基板１０４の長手方向に所定の間隔をあけて配置されている。ＥＭＩガスケット１１７は、回路基板１０４の上面及び下面に、図示しない両面テープによって固定される。ＥＭＩは、Electro Magnetic Interferenceの略称である。
　このように、接着剤１１６の塗布エリアと回路エリア１５４との間に、導電性部材である複数のＥＭＩガスケット１１７を配置することにより、回路エリア１５４に対するノイズの出入りをＥＭＩガスケット１１７によって抑制することができる。 In the electronic control device 100D according to the sixth embodiment, a plurality of EMI gaskets 117 are arranged as conductive members between the adhesive 116 application area and the circuit area 154, compared to the fifth embodiment. The difference is that it is The plurality of EMI gaskets 117 are arranged in a line along one side (long side) of the circuit area 154. Each EMI gasket 117 is formed into a chip shape and is arranged at predetermined intervals in the longitudinal direction of the circuit board 104. The EMI gasket 117 is fixed to the upper and lower surfaces of the circuit board 104 with double-sided tape (not shown). EMI is an abbreviation for Electro Magnetic Interference.
In this way, by arranging the plurality of EMI gaskets 117, which are conductive members, between the adhesive 116 application area and the circuit area 154, the EMI gaskets 117 can suppress noise from entering and exiting the circuit area 154. I can do it.
　また一般に、ＥＭＩガスケットは、電磁波に対するシールド性を確保する目的で、回路基板のグラウンドと金属筐体とを導通させる、あるいは、筐体ベースと筐体カバーとを導通させるために使用される部品である。このような用途では、より周波数の高い電磁波をシールドするために、隣り合うＥＭＩガスケットの間隔を狭くする必要がある。このため、ＥＭＩガスケットの使用個数が増えて、コストが多くかかってしまう。また、長尺状のＥＭＩガスケットを採用した場合は、チップ状のＥＭＩガスケットを使用する場合よりもコストが高くなってしまう。 Generally, an EMI gasket is a component used to establish continuity between the ground of a circuit board and a metal casing, or between a casing base and a casing cover, in order to ensure shielding against electromagnetic waves. be. In such applications, it is necessary to narrow the distance between adjacent EMI gaskets in order to shield higher frequency electromagnetic waves. Therefore, the number of EMI gaskets used increases, resulting in increased costs. Furthermore, if a long EMI gasket is used, the cost will be higher than if a chip-shaped EMI gasket is used.
　これに対して、第６実施形態では、周波数の高い電磁波に対しては接着剤１１６による容量結合によってシールド性が確保されるため、ＥＭＩガスケット１１７はＧＨｚ以下の低い周波数の電磁波に対してのみシールド性を確保できるように配置すればよい。これにより、ＥＭＩガスケット１１７の使用個数を減らしてコストを削減しながら、低周波から高周波まで広範囲に電磁波をシールドすることが可能となる On the other hand, in the sixth embodiment, since shielding performance is ensured against high-frequency electromagnetic waves by capacitive coupling by the adhesive 116, the EMI gasket 117 only shields against low-frequency electromagnetic waves below GHz. It may be arranged in such a way as to ensure the correctness. This makes it possible to shield electromagnetic waves over a wide range from low frequencies to high frequencies while reducing the number of EMI gaskets 117 used and reducing costs.
　（第７実施形態）
　次に、第７実施形態に係る電子制御装置について、図１５及び図１６を用いて説明する。
　図１５は、第７実施形態に係る電子制御装置が備える筐体カバーと回路基板の配置状態を示す上面図である。図１６は、第７実施形態に係る電子制御装置が備える筐体ベースの下面図である。 (Seventh embodiment)
Next, an electronic control device according to a seventh embodiment will be described using FIGS. 15 and 16.
FIG. 15 is a top view showing the arrangement of a housing cover and a circuit board included in the electronic control device according to the seventh embodiment. FIG. 16 is a bottom view of the housing base included in the electronic control device according to the seventh embodiment.
　第７実施形態に係る電子制御装置は、上記第１実施形態の場合（図４、図６）に比較して、接着剤１１０の塗布エリアが分割されている点、及び、金属部１０９に凹部１３６が形成されている点が異なる。接着剤１１０の塗布エリアは、回路基板１０４に形成された配線１１９、及び、回路基板１０４に搭載されたチップ部品１２５を避けるように、複数のエリアに分割されている。配線１１９は、回路基板１０４の回路エリア１５４に搭載された電子部品と、回路基板１０４の端部に搭載された基板側コネクタ１０７又は基板側コネクタ１１１とを接続する配線である。図１５に例示する配線１１９は、回路基板１０４の回路エリア１５４に搭載された通信ＩＣ(integrated circuit)１１８と基板側コネクタ１０７とを接続する信号配線である。通信ＩＣ１１８は、ＬＳＩ素子１０５とともに回路基板１０４に搭載される電子部品である。チップ部品１２５は、例えばチップコンデンサである。 The electronic control device according to the seventh embodiment is different from the first embodiment (FIGS. 4 and 6) in that the application area of the adhesive 110 is divided and that there is a recess in the metal part 109. The difference is that 136 is formed. The application area of the adhesive 110 is divided into a plurality of areas so as to avoid the wiring 119 formed on the circuit board 104 and the chip component 125 mounted on the circuit board 104. The wiring 119 is a wiring that connects the electronic component mounted on the circuit area 154 of the circuit board 104 and the board-side connector 107 or the board-side connector 111 mounted on the end of the circuit board 104. Wiring 119 illustrated in FIG. 15 is a signal wiring that connects communication IC (integrated circuit) 118 mounted in circuit area 154 of circuit board 104 and board-side connector 107. The communication IC 118 is an electronic component mounted on the circuit board 104 together with the LSI element 105. The chip component 125 is, for example, a chip capacitor.
　このように第７実施形態においては、回路基板１０４に形成された配線１１９や回路基板１０４に搭載されたチップ部品１２５を避けるように、接着剤１１０の塗布エリアを分割している。このため、コネクタ周辺において回路基板１０４のレイアウトの自由度を損ねることなく、電磁波シールド性を確保することができる。 As described above, in the seventh embodiment, the application area of the adhesive 110 is divided so as to avoid the wiring 119 formed on the circuit board 104 and the chip components 125 mounted on the circuit board 104. Therefore, electromagnetic shielding properties can be ensured without impairing the degree of freedom in layout of the circuit board 104 around the connector.
　なお、接着剤１１０の塗布エリアは、配線１１９及びチップ部品１２５のうち、少なくとも一方を避けるように分割されていればよい。また、回路基板１０４の両面に接着剤１１０の塗布エリアが存在する場合は、回路基板１０４の両面、又はいずれか一方の面で接着剤１１０の塗布エリアを分割してもよい。ただし、電磁波シールド性を確保する観点から、接着剤１１０が塗布されないエリアはなるべく小さくすることが望ましい。 Note that the application area of the adhesive 110 may be divided so as to avoid at least one of the wiring 119 and the chip component 125. Further, when the adhesive 110 application area exists on both sides of the circuit board 104, the adhesive 110 application area may be divided between both sides of the circuit board 104, or either one of the surfaces. However, from the viewpoint of ensuring electromagnetic shielding properties, it is desirable to make the area where the adhesive 110 is not applied as small as possible.
　（変形例等）
　本発明は、上述した実施形態に限定されるものではなく、様々な変形例を含む。たとえば、上述した実施形態では、本発明の内容を理解しやすいように詳細に説明しているが、本発明は、上述した実施形態で説明したすべての構成を必ずしも備えるものに限定されない。また、ある実施形態の構成の一部を、他の実施形態の構成に置き換えることが可能である。また、ある実施形態の構成に他の実施形態の構成を加えることも可能である。また、各実施形態の構成の一部について、これを削除し、又は他の構成を追加し、あるいは他の構成に置換することも可能である。 (Modified examples, etc.)
The present invention is not limited to the embodiments described above, but includes various modifications. For example, in the embodiments described above, the content of the present invention is explained in detail to make it easier to understand, but the present invention is not necessarily limited to having all the configurations described in the embodiments described above. Further, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment. Furthermore, it is also possible to add the configuration of another embodiment to the configuration of one embodiment. It is also possible to delete some of the configurations of each embodiment, add other configurations, or replace them with other configurations.
　たとえば、上記第１実施形態においては、金属部１０９をネジ１３０で筐体ベース１０２に固定することにより、金属部１０９の脱落を防止する一方、ネジ１３０の取付部以外の部分では、金属部１０９の係止部１０９ａ，１０９ｂを筐体ベース１０２に係止させることにより、筐体ベース１０２に金属部１０９を取り付けているが、本発明はこれに限らず、例えば、溶接などによって筐体ベース１０２に金属部１０９を取り付けてもよい。つまり、筐体ベース１０２に対する金属部１０９の取付構造については、筐体ベース１０２と金属部１０９とを電気的に接続可能な構造であれば、どのような構造を採用してもよい。 For example, in the first embodiment, the metal part 109 is fixed to the housing base 102 with the screw 130 to prevent the metal part 109 from falling off. Although the metal part 109 is attached to the housing base 102 by locking the locking parts 109a and 109b to the housing base 102, the present invention is not limited to this. A metal part 109 may be attached to the. In other words, any structure for attaching the metal part 109 to the housing base 102 may be used as long as it is a structure that allows the housing base 102 and the metal part 109 to be electrically connected.
　また、上記第３実施形態においては、近接部１５３を筐体カバー１０３Ｂと一体に形成しているが、本発明はこれに限らず、近接部１５３を筐体カバー１０３Ｂと別体に構成してもよい。また、第１実施形態に係る電子制御装置１００の筐体カバー１０３に近接部１５３を設けてもよい。 Further, in the third embodiment, the proximal portion 153 is formed integrally with the housing cover 103B, but the present invention is not limited to this, and the proximal portion 153 may be formed separately from the housing cover 103B. Good too. Furthermore, the proximity portion 153 may be provided on the housing cover 103 of the electronic control device 100 according to the first embodiment.
　また、上記第４実施形態で採用している接着剤１１０の塗布状態は、第２実施形態や第３実施形態に適用してもよい。 Furthermore, the application state of the adhesive 110 adopted in the fourth embodiment may be applied to the second embodiment and the third embodiment.
　また、本発明に係る電子制御装置は、自動車などの車両に搭載される電子制御装置に好適に適用可能であるが、適用対象範囲は車両に限らず、船舶、航空機、クレーンなどであってもよい。また、車両には、自動車のほか、鉄道車両、工事用車両、農耕用車両なども含まれる。 Further, the electronic control device according to the present invention can be suitably applied to an electronic control device installed in a vehicle such as an automobile, but the scope of application is not limited to vehicles, but can also be applied to ships, aircraft, cranes, etc. good. In addition to automobiles, vehicles also include railway vehicles, construction vehicles, agricultural vehicles, and the like.
　１００，１００Ａ，１００Ｂ，１００Ｃ，１００Ｄ…電子制御装置、１０１，１０１Ａ，１０１Ｂ…金属筐体、１０２，１０２Ａ…筐体ベース（第１筐体）、１０３，１０３Ｂ…筐体カバー（第２筐体）、１０４…回路基板、１０５…ＬＳＩ素子（電子部品）、１０７…基板側コネクタ（コネクタ）、１０９…金属部、１１０…接着剤（導電性接着剤）、１１１…基板側コネクタ（コネクタ）、１１６…接着剤（非導電性接着剤）、１１７…ＥＭＩガスケット（導電性部材）、１１８…通信ＩＣ（電子部品）、１１９…配線、１２５…チップ部品、１５１…グラウンド領域、１５２…金属部、１５４…回路エリア 100, 100A, 100B, 100C, 100D...Electronic control unit, 101, 101A, 101B...Metal casing, 102, 102A... Casing base (first casing), 103, 103B... Casing cover (second casing) ), 104... Circuit board, 105... LSI element (electronic component), 107... Board side connector (connector), 109... Metal part, 110... Adhesive (conductive adhesive), 111... Board side connector (connector), 116... Adhesive (non-conductive adhesive), 117... EMI gasket (conductive member), 118... Communication IC (electronic component), 119... Wiring, 125... Chip component, 151... Ground area, 152... Metal part, 154...Circuit area

Claims (11)

  1. 　電子部品及びコネクタが搭載される回路基板と、前記回路基板を収容する金属筐体とを有する電子制御装置であって、
    　前記回路基板は、前記コネクタの周辺に区画されるグラウンド領域を有し、
    　前記金属筐体は、前記グラウンド領域と重なる位置に前記グラウンド領域と近接する状態で配置される金属部を備え、
    　前記金属部は、前記金属筐体と電気的に接続されるとともに、前記グラウンド領域に接着剤を介して固定されている
    　電子制御装置。     An electronic control device comprising a circuit board on which electronic components and a connector are mounted, and a metal casing housing the circuit board,
    The circuit board has a ground area defined around the connector,
    The metal casing includes a metal part located close to the ground area at a position overlapping with the ground area,
    The said metal part is electrically connected to the said metal housing|casing, and is fixed to the said ground area|region via adhesive. Electronic control device.
  2. 　前記金属部は、板金である
    　請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein the metal part is a sheet metal.
  3. 　前記接着剤は、導電性接着剤である
    　請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein the adhesive is a conductive adhesive.
  4. 　前記接着剤は、非導電性接着剤である
    　請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein the adhesive is a non-conductive adhesive.
  5. 　前記回路基板は、前記電子部品が搭載される回路エリアを有し、
    　前記回路基板上において、前記回路エリアと前記グラウンド領域とは、互いに分離されている
    　請求項１に記載の電子制御装置。     The circuit board has a circuit area on which the electronic component is mounted,
    The electronic control device according to claim 1, wherein the circuit area and the ground area are separated from each other on the circuit board.
  6. 　前記金属筐体は、第１筐体及び第２筐体によって構成され、
    　前記金属部は、前記第１筐体と一体に形成されている
    　請求項１に記載の電子制御装置。     The metal casing includes a first casing and a second casing,
    The electronic control device according to claim 1, wherein the metal part is formed integrally with the first casing.
  7. 　前記第２筐体は、前記グラウンド領域に近接する近接部を有する
    　請求項６に記載の電子制御装置。     The electronic control device according to claim 6, wherein the second housing has a proximal portion proximate to the ground area.
  8. 　前記接着剤は、多点状に塗布されている
    　請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein the adhesive is applied in multiple points.
  9. 　前記回路基板は、前記電子部品が搭載される回路エリアを有し、
    　前記接着剤の塗布エリアと前記回路エリアとの間に導電性部材が配置されている
    　請求項１に記載の電子制御装置。     The circuit board has a circuit area on which the electronic component is mounted,
    The electronic control device according to claim 1, further comprising a conductive member disposed between the adhesive application area and the circuit area.
  10. 　前記導電性部材は、複数のＥＭＩガスケットによって構成されている
    　請求項９に記載の電子制御装置。     The electronic control device according to claim 9, wherein the conductive member is constituted by a plurality of EMI gaskets.
  11. 　前記回路基板に形成された配線、及び／又は、前記回路基板に搭載されたチップ部品を避けるように、前記接着剤の塗布エリアが分割されている
    　請求項１に記載の電子制御装置。     The electronic control device according to claim 1, wherein the adhesive application area is divided so as to avoid wiring formed on the circuit board and/or chip components mounted on the circuit board.
PCT/JP2023/010064 2022-06-09 2023-03-15 Electronic control device WO2023238471A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283962A (en) * 1996-04-12 1997-10-31 Mitsubishi Electric Corp Microwave device
JP2000286587A (en) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd Electromagnetic shield structure at connector part with external cable
JP2004221537A (en) * 2002-11-20 2004-08-05 Komatsu Seiren Co Ltd Electromagnetic wave shield wallpaper, manufacturing method thereof and electromagnetic wave shield room using the same
JP2019106404A (en) * 2017-12-08 2019-06-27 日立オートモティブシステムズ株式会社 Electronic control device
WO2021131599A1 (en) * 2019-12-27 2021-07-01 日立Astemo株式会社 Electronic control device
JP2021150517A (en) * 2020-03-19 2021-09-27 株式会社ソニー・インタラクティブエンタテインメント Electronic apparatus
WO2022059263A1 (en) * 2020-09-18 2022-03-24 日立Astemo株式会社 Electronic control device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283962A (en) * 1996-04-12 1997-10-31 Mitsubishi Electric Corp Microwave device
JP2000286587A (en) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd Electromagnetic shield structure at connector part with external cable
JP2004221537A (en) * 2002-11-20 2004-08-05 Komatsu Seiren Co Ltd Electromagnetic wave shield wallpaper, manufacturing method thereof and electromagnetic wave shield room using the same
JP2019106404A (en) * 2017-12-08 2019-06-27 日立オートモティブシステムズ株式会社 Electronic control device
WO2021131599A1 (en) * 2019-12-27 2021-07-01 日立Astemo株式会社 Electronic control device
JP2021150517A (en) * 2020-03-19 2021-09-27 株式会社ソニー・インタラクティブエンタテインメント Electronic apparatus
WO2022059263A1 (en) * 2020-09-18 2022-03-24 日立Astemo株式会社 Electronic control device

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