WO2024140696A1

WO2024140696A1 - Wire harness module for anti-electromagnetic interference

Info

Publication number: WO2024140696A1
Application number: PCT/CN2023/141998
Authority: WO
Inventors: 王超
Original assignee: 长春捷翼汽车科技股份有限公司
Priority date: 2022-12-27
Filing date: 2023-12-26
Publication date: 2024-07-04
Also published as: CN116075041A

Abstract

Disclosed in the present application is a wire harness module for anti-electromagnetic interference. The wire harness module comprises at least one layer of circuit board, at least two shielding layers, and at least one connector electrically connected to the circuit board and/or the shielding layers, wherein the circuit board and the shielding layers are placed in a stacked manner, and at least one layer of circuit board is arranged between adjacent shielding layers; and the connector comprises a sheath and at least one terminal that is at least partially arranged in the sheath, the terminal being electrically connected to a loop conductor and/or a shielding layer in the circuit board. Since a multi-layer shielding structure is used, space can be saved on; a shielding space can be formed between shielding layers, such that electromagnetic interference from the inside and electromagnetic interference on the outside can be reduced, and electromagnetic interference from the outside on an internal circuit board can also be reduced, thereby greatly improving the EMC performance of the whole vehicle; in addition, the present application has the characteristics of convenient installation, good flatness, saving on space, no need for additional shielding means, and a wide range of usage scenarios.

Description

A wiring harness module capable of resisting electromagnetic interference

Related Applications

This application claims priority to the Chinese invention patent application with application number 202211683275.0 filed on December 27, 2022, and cites all the contents disclosed in the above patent application as part of this application.

Technical Field

The present application relates to the technical field of circuit board manufacturing, and more specifically, to a wiring harness module that is resistant to electromagnetic interference.

Background technique

As long as there is an electric field or magnetic field in the electronic circuit, electromagnetic interference will be generated. The electric field or magnetic field can emit electromagnetic waves and affect the normal operation of other systems or other subsystems within the system. Such a problem also exists in the field of automotive wiring. The automotive wiring harness is often affected by the electromagnetic interference EMI (Electromagnetic Interference) factor, which causes the performance of the automotive wiring harness to be impaired. Therefore, electromagnetic compatibility EMC (Electromagnetic Compatibility) must be effectively managed to maintain the normal signal transmission of the wiring harness to improve reliability. As low-power, high-speed, and highly integrated large-scale integrated circuits are increasingly adopted by automotive wiring to meet a variety of complex applications, automotive wiring systems are more vulnerable to electromagnetic interference than ever before. Moreover, too many circuits will complicate the wiring of the lines in the car, resulting in too much space being occupied. Therefore, a wiring harness structure that can eliminate electromagnetic interference, facilitate installation, and save space is required.

Summary of the invention

The present application provides an electromagnetic interference resistant wiring harness module, comprising at least one circuit board and at least two shielding layers, and at least one connector electrically connected to the circuit board and/or the shielding layer, wherein the circuit board and the shielding layer are stacked, and at least one circuit board is arranged between adjacent shielding layers; the connector comprises a sheath and at least one terminal at least partially arranged in the sheath, and the terminal is electrically connected to a loop conductor in the circuit board and/or the shielding layer.

Optionally, a avoidance hole is provided on the shielding layer at a position corresponding to the welding hole, the diameter of the avoidance hole is larger than the diameter of the welding hole, and the terminal is not electrically connected to the shielding layer when passing through the welding hole.

This article uses a multi-layer circuit board as a substitute for automotive wiring harnesses. Specifically, a multi-layer shielding structure is used to transmit power signals, ground signals, differential signals, and common signals. The use of a multi-layer shielding structure can save space, and shielding spaces can be created between the shielding layers, reducing internal EMI, external EMI, and reducing external interference with the circuit board. EMI reduces most of the electromagnetic radiation interference, can greatly improve the EMC performance of the whole vehicle, and has the characteristics of easy installation and good flatness. It is easy to install, saves space, does not require additional shielding methods, and has a wide range of usage scenarios.

Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

FIG1 is a schematic diagram of the interior of a wiring harness module according to an embodiment of the present application;

FIG2 is a plan view of a wiring harness module according to an embodiment of the present application;

Fig. 3 is a cross-sectional view taken along the A-A direction in Fig. 2;

FIG4 is another plan view of the wiring harness module according to an embodiment of the present application;

FIG5 is a side view of a wiring harness module according to an embodiment of the present application;

FIG6 is a schematic diagram of the connection between the inside of the wiring harness module and the terminals according to an embodiment of the present application;

FIG. 7 is a schematic diagram of another method of connecting terminals inside a wiring harness module according to an embodiment of the present application.

Detailed ways

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the above-mentioned technologies, methods, and equipment should be considered as part of the specification.

In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

This article provides an electromagnetic interference-resistant wiring harness module 100, as shown in Figures 1 to 7, including at least one circuit board and at least two shielding layers 102, and at least one connector 103 electrically connected to the circuit board and/or the shielding layer 102. The circuit board and the shielding layer 102 are stacked and placed, and at least one circuit board is arranged between adjacent shielding layers 102; the connector 103 includes a sheath 1031 and at least one terminal 1032 at least partially arranged in the sheath 1031, and the terminal 1032 is electrically connected to the conductor in the circuit board and/or the shielding layer 102. The multi-layer shielding structure of this scheme can transmit power signals, ground signals, differential signals, and ordinary signals. Due to the use of a multi-layer shielding structure, space can be saved, and a shielding space can be generated between the shielding layers 102 and the shielding layers 102, reducing internal EMI, external EMI, reducing the EMI of the outside world to the circuit board, reducing most of the electromagnetic radiation disturbance, and greatly improving the EMC performance of the whole vehicle. It has the characteristics of easy installation and good flatness, saving space, and no need to adopt additional shielding means, and has a wide range of use scenarios.

In some embodiments, the shielding layer 102 at least covers the surfaces of adjacent circuit boards. A shielding space is formed between two adjacent shielding layers 102 to eliminate the electromagnetic radiation interference of the outside world on the circuit boards between the two adjacent shielding layers 102. Therefore, the shielding layer 102 is set to at least cover the surfaces of the adjacent circuit boards, that is, the area of the shielding layer 102 is not less than the surface of the adjacent circuit boards and covers the corresponding surfaces of the adjacent circuit boards. It should be noted that Figure 1 is only a schematic diagram of the internal circuit board arrangement of the wiring harness module of this scheme. In order to clearly show the arrangement of each layer of circuit boards, there is a certain distance between the adjacent circuit boards and the insulating layer in Figure 1. However, the illustrated distance does not exist in actual production and manufacturing.

In some embodiments, an insulating layer 104 is disposed between adjacent shielding layers 102 and circuit boards, and between adjacent circuit boards. Since there is a circuit loop on the surface of the circuit board, as shown in FIG1 , an insulating layer 104 is disposed between adjacent shielding layers 102 and circuit boards, and between adjacent circuit boards, to avoid short circuits caused by circuit contact between different board layers.

In some embodiments, the insulating layer 104 is an insulating adhesive layer, and the adjacent shielding layers 102 and circuit boards, and the adjacent circuit boards are connected together by the insulating adhesive layer. The adjacent shielding layers 102 and circuit boards, or the circuit boards are bonded together by the insulating adhesive layer, and the insulating adhesive layer can play a role of bonding and insulation at the same time. There is no need to set an additional insulating layer 104 between the circuit boards, thereby reducing the overall weight of the wiring harness module 100 and reducing costs.

In some embodiments, the material of the loop conductor is at least one (i.e., one or more) of carbon, aluminum, silver, or copper. When the material of the conductor in the loop is multiple of carbon, aluminum, silver, and copper, each loop conductor is one of carbon, aluminum, silver, and copper, that is, each loop conductor is still a single material (not a mixture of multiple materials), and different loop conductors can use different materials.

In some embodiments, multiple loop conductors are included, and the absolute value of the conductivity difference between different loop conductors is less than or equal to 69%. In practical applications, due to factors such as cost and material performance, the loop conductors can be made of materials with different conductivity. For example, silver has high conductivity, but its cost is also high, so it is suitable for conductors that require better conductivity. In some current-transmitting loop conductors, aluminum, a metal material with low conductivity but low cost, can be used. For example, when used in power lines, the cross-sectional area can be appropriately increased to ensure the size of the transmitted current.

In order to verify the influence of the absolute value of the difference in conductivity of each loop conductor on the temperature rise and stability of the wiring harness, the present application selects multiple loop conductors of the same cross-sectional area, each of which uses a different conductivity material from other loop conductors and conducts the same current to test the temperature rise and stability of the wiring harness. The temperature rise test is to pass the same current through the wiring harness, detect the temperature of the same position of the wiring harness before power-on and after the temperature is stabilized in a closed environment, and take the absolute value of the difference between the two temperatures at the same position of the wiring harness before power-on and after the temperature is stabilized. In this embodiment, it can be preset that a temperature rise greater than 50K is considered unqualified.

The stability test is to connect the wire harness to the same electrical device and continuously conduct the same signal to test the stability of the electrical device; this test lasts for 100 hours, and any errors reported by the electrical device are recorded. In this embodiment, if the number of errors reported is greater than 3 times within the preset test time, it is considered unqualified. The test results are shown in Table 1:

Table 1: Effect of the absolute value of the conductivity difference of each loop conductor on the temperature rise and stability of the wiring harness

It can be seen from Table 1 above that, under the same cross-sectional area, when the absolute value of the difference in conductivity of each loop conductor is less than 69%, the performance of each loop conductor in conducting current is similar, and the temperature rise of the wiring harness and the number of errors of the electrical device are both within the qualified range. When the absolute value of the difference in conductivity of each loop conductor is greater than 69%, due to the large difference in the performance of the conduction current of each loop conductor, it has exceeded the rated conduction current of the loop conductor and the stability range of the conduction current of the electrical device, resulting in the temperature rise of the wiring harness and the number of errors of the electrical device being unqualified. Therefore, the inventor controls the absolute value of the difference in conductivity of each loop conductor among multiple loop conductors to be within 69%.

In some embodiments, the circuit board is a printed circuit board (PCB) or a flexible circuit board (FPC). The printed circuit board (PCB), whose Chinese name is printed circuit board, is a support for electronic components and a carrier for electrical connections, and is widely used in electronic products. When the wiring harness module 100 needs to be bent or twisted during specific use, a flexible printed circuit (FPC) is used. The flexible printed circuit (FPC) is a highly reliable and highly flexible printed circuit board made of polyimide or polyester film as a substrate. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability, but it is costly, limited in size, easily damaged by improper operation, and difficult to repair.

In some embodiments, at least one welding hole 108 is provided on the wiring harness module 100, as shown in FIG6, the welding hole 108 passes through at least one loop conductor, and the terminal 1032 is electrically connected to the corresponding loop conductor through the welding hole 108. Since the wiring harness module 100 is provided with the welding hole 108, the welding hole 108 passes through at least one loop conductor, and the terminal 1032 is electrically connected to the corresponding loop conductor through the welding hole 108, and is further connected to the connector 103 to be electrically connected to the external circuit.

In some embodiments, a avoidance hole 1021 is provided at a position corresponding to the welding hole 108 in the shielding layer 102 of the wiring harness module 100, and the diameter of the avoidance hole 1021 is larger than the diameter of the welding hole 108, so that the terminal 1032 is not electrically connected to the shielding layer 102 when passing through the welding hole 108. As shown in FIG6, the avoidance hole 1021 is provided at a position corresponding to the welding hole 108 in the shielding layer 102, and the diameter of the avoidance hole 1021 is larger than the diameter of the welding hole 108, so that the terminal 1032 is not electrically connected to the shielding layer 102 when passing through the welding hole 108; further, the avoidance hole 1021 is provided at the welding hole 108 on the circuit board that does not need to be electrically connected to the terminal 1032, so that the terminal 1032 can be selectively electrically connected to different board layers.

In some embodiments, at least one welding hole 108 is provided on the wiring harness module 100, the welding hole 108 passes through at least one shielding layer 102, and the terminal 1032 is electrically connected to the corresponding shielding layer 102 through the welding hole 108. As shown in FIG. 7, in some usage scenarios, the welding hole 108 passes through at least one shielding layer 102, and the connector 103 is electrically connected to the shielding layer 102 through the terminal 1032.

In some embodiments, the circuit board includes at least one power layer 1011 and at least one signal layer 1012, and the shielding layer 102 is at least arranged on both sides of the power layer 1011 or the signal layer 1012. In actual use, the circuit board includes at least one power layer 1011 and at least one signal layer 1012, and the shielding layer 102 is at least arranged on both sides of the power layer 1011 or the signal layer 1012. The two shielding layers 102 constitute a shielding space to prevent external signals from generating electromagnetic interference to the circuit between the two shielding layers 102. As shown in FIG. 1 , three shielding layers 102 are included, and at least one circuit board is arranged between every two shielding layers 102. In FIG. 1 , two power layers 1011 are arranged between the two shielding layers 102 to avoid setting a loop conductor on only one power layer 1011 so that the power layer 1011 is overheated and easily damaged. Setting two power layers 1011 can not only expand the wiring range of the loop conductor, but also facilitate heat dissipation. The loop conductor arranged in the power layer 1011 has a large wire diameter and a high current intensity, which will generate greater electromagnetic interference. The signal layer 1012 has a small wire diameter and a low current intensity, and is easily affected by electromagnetic interference. Therefore, placing the power layer 1011 and the signal layer 1012 separately and providing shielding layers 102 on both sides can not only reduce the external electromagnetic interference to the inside of the wiring harness module 100, but also reduce the electromagnetic interference of the power layer 1011 to the signal layer 1012.

In some embodiments, a housing 111 is further included, and the housing 111 covers at least part of the circuit board and the shielding layer 102. In actual use, the housing 111 covering at least part of the circuit board and the shielding layer 102 protects the internal circuit board and plays a shielding role again.

In some embodiments, at least one window 109 is provided on the housing 111, and the connector 103 is connected to the outside world through the window 109. As shown in FIG4, at least one window 109 is provided on the housing 111 to ensure that the connector 103 can be connected to the outside world through the window 109.

In some embodiments, at least one shock absorbing device is further provided between the circuit board and the shielding layer 102 and the inner wall of the housing 111. At least one shock absorbing device is provided on the inner wall of the housing 111 to prevent the wiring harness module 100 from vibrating with the vibration of the car during use, thereby preventing the wiring harness module 100 from vibrating and causing problems such as unstable or damaged electrical connections inside the wiring harness module 100. Generally, the shock absorbing device can be a felt pad or a rubber pad, etc., which can achieve a shock absorbing effect while also reducing abnormal noise.

In some embodiments, at least one mounting and positioning portion 107 is provided on the housing 111, and the housing 111 is fixed to a predetermined mounting position by the mounting and positioning portion 107. The mounting and positioning portion 107 is provided on the housing 111, and the housing 111 is fixed to a predetermined mounting position (such as a vehicle body) by the mounting and positioning portion 107, so as to achieve the purpose of positioning and installing the wiring harness module 100, and facilitate the installation, disassembly and maintenance of the wiring harness module 100.

In some embodiments, at least one bending portion 105 is provided on the wiring harness module 100. In order to adapt to different use environments, the wiring harness module 100 may also include a bending portion 105, that is, the bending portion 105 is provided in a direction perpendicular to the extension direction of the wiring harness module 100, so that the wiring harness module 100 can be used inside a non-flat vehicle shell.

In some embodiments, the wiring harness module 100 includes a wiring harness branch 106 and a wiring harness trunk. The circuit board and the shielding layer 102 in the wiring harness trunk extend along a set path to form the wiring harness branch 106 .

In some embodiments, the wiring harness module 100 is arranged to extend along the shape of the installation location. When the wiring harness module 100 is used in a vehicle body, the installation location may have a variety of curved shapes, and the wiring harness module 100 is arranged to extend along the shape of the installation location.

Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

A wiring harness module for resisting electromagnetic interference comprises at least one circuit board and at least two shielding layers, and at least one connector electrically connected to the circuit board and/or the shielding layer, characterized in that: the circuit board and the shielding layer are stacked, and at least one circuit board is arranged between adjacent shielding layers; the connector comprises a sheath and at least one terminal at least partially arranged in the sheath, and the terminal is electrically connected to a loop conductor in the circuit board and/or the shielding layer.
The electromagnetic interference resistant wiring harness module according to claim 1, characterized in that the shielding layer at least covers the surface of the adjacent circuit board.
The anti-electromagnetic interference wiring harness module according to claim 1 is characterized in that an insulating layer is provided between adjacent shielding layers and circuit boards, and an insulating layer is provided between adjacent circuit boards.
According to the electromagnetic interference resistant wiring harness module of claim 3, it is characterized in that the insulating layer is an insulating adhesive layer, the adjacent shielding layers and circuit boards are connected together by the insulating adhesive layer, and the adjacent circuit boards are connected together by the insulating adhesive layer.
The electromagnetic interference resistant wiring harness module according to claim 1 is characterized in that the material of the loop conductor is at least one of carbon, aluminum, silver or copper.
The anti-electromagnetic interference wiring harness module according to claim 1 is characterized in that it comprises a plurality of the loop conductors, and the absolute value of the conductivity difference between different loop conductors is less than or equal to 69%.
The electromagnetic interference resistant wiring harness module according to claim 1 is characterized in that the circuit board is a printed circuit board or a flexible circuit board.
The anti-electromagnetic interference wiring harness module according to claim 1 is characterized in that at least one welding hole is provided on the wiring harness module, the welding hole passes through at least one of the loop conductors, and the terminal is electrically connected to the corresponding loop conductor through the welding hole.
The anti-electromagnetic interference wiring harness module according to claim 8 is characterized in that a avoidance hole is provided in the shielding layer at a position corresponding to the welding hole, the diameter of the avoidance hole is larger than the diameter of the welding hole, and the terminal is not electrically connected to the shielding layer when passing through the welding hole.
The anti-electromagnetic interference wiring harness module according to claim 1 is characterized in that at least one welding hole is provided on the wiring harness module, the welding hole passes through at least one of the shielding layers, and the terminal is electrically connected to the corresponding shielding layer through the welding hole.
The anti-electromagnetic interference wiring harness module according to claim 1 is characterized in that the circuit board includes at least one power layer and at least one signal layer, and the shielding layer is at least arranged on both sides of the power layer or the signal layer.
The electromagnetic interference resistant wiring harness module according to claim 1 is characterized in that it also includes a shell, and the shell covers at least a portion of the circuit board and the shielding layer.
The electromagnetic interference resistant wiring harness module according to claim 12 is characterized in that at least one window is provided on the shell, and the connector is connected to the outside world through the window.
The electromagnetic interference resistant wiring harness module according to claim 12 is characterized in that at least one shock absorbing device is further provided between the circuit board and the shielding layer and the inner wall of the shell respectively.
The electromagnetic interference resistant wiring harness module according to claim 12 is characterized in that at least one mounting positioning portion is provided on the shell, and the shell is fixed at a predetermined mounting position by the mounting positioning portion.
The electromagnetic interference resistant wiring harness module according to claim 1 is characterized in that at least one bending portion is provided on the wiring harness module.
The anti-electromagnetic interference wiring harness module according to claim 1 is characterized in that the wiring harness module includes a wiring harness trunk and a wiring harness branch, and the circuit board and the shielding layer in the wiring harness trunk extend along a set path to form the wiring harness branch.
The electromagnetic interference resistant wiring harness module according to claim 16 is characterized in that the wiring harness module is extended along the shape of the installation position.