WO2021152743A1

WO2021152743A1 - Electronic device

Info

Publication number: WO2021152743A1
Application number: PCT/JP2020/003239
Authority: WO
Inventors: 賢悟上山
Original assignee: 三菱電機株式会社
Priority date: 2020-01-29
Filing date: 2020-01-29
Publication date: 2021-08-05
Also published as: JP7262627B2; JPWO2021152743A1

Abstract

An electronic device (10) provided with: a first metal housing (1); a second metal housing (2); an electronic circuit board (3) held between the first and second housings (1, 2); and a shielding member (6) disposed at at least one of the first and second housings (1, 2) in a place where the first and second housings (1, 2) come close to each other, wherein a gap (5) is generated between the peripheral edges of the first and second housings (1, 2), the shielding member (6) is provided with a projection (1e, 2e) which projects from the body of the first housing (1) or the second housing (2), and the projection (1e, 2e) has a slope narrowing the gap (5) toward a projecting direction.

Description

Electronics

This disclosure relates to electronic devices.

In electronic devices, the electronic circuit board is sealed with a metal housing in order to reduce electromagnetic field radiation originating from the drive clock signal on the electronic circuit board.

Patent Document 1 and Patent Document 2 describe a structure in which an electronic circuit board is sandwiched between metal housings. When the electronic circuit board is sandwiched between metal housings, the electronic circuit board is sealed with the metal housing while ensuring continuity between the electronic circuit board and the metal housing.

Further, Patent Document 1 and Patent Document 2 disclose that a cushioning material having elasticity or plasticity is arranged on a pedestal portion of a metal housing for holding an electronic circuit board. The use of cushioning material enhances the tightness of the metal housing, resulting in reduced electromagnetic radiation.

Japanese Unexamined Patent Publication No. 8-14501 International Publication No. 2011/013509

The electronic devices of Patent Document 1 and Patent Document 2 have a complicated structure because they are provided with a cushioning material having elasticity or plasticity. Specifically, it is necessary to add a material different from the metal housing. In addition, the complicated structure makes it difficult to disassemble and reassemble after assembling once.

The purpose of this disclosure is to suppress the electromagnetic field radiation of electronic devices with a simple structure.

The electronic device according to the present disclosure includes a first metal housing, a second metal housing, an electronic circuit board sandwiched between the first housing and the second housing, and a second housing. In a portion where the first housing and the second housing are close to each other, a shielding portion arranged on at least one of the first housing and the second housing is provided, and a peripheral edge portion of the first housing is provided. A gap is provided between the surface and the peripheral edge of the second housing, and the shielding portion includes a protruding portion protruding outward from the main body portion of the first housing or the second housing, and the protruding portion. Has an inclined surface that narrows the gap in the protruding direction.

According to the present disclosure, it is not necessary to process the pedestal of the metal housing for holding the electronic circuit board and to seal the metal housing. That is, the radiated electromagnetic field can be relaxed only by changing the shape of the existing metal housing. Therefore, according to the present disclosure, it is possible to suppress the electromagnetic field radiation of an electronic device with a simple structure.

Cross-sectional view showing an electronic device according to the first embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the first embodiment of the present disclosure. Partially enlarged view showing the main part of the EMI resistant structure of FIG. Schematic perspective view showing the outer shape of the electronic device according to the second embodiment of the present disclosure. Partially enlarged view showing the main part of the EMI resistant structure of FIG. Schematic perspective view showing the outer shape of the electronic device according to the third embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the fourth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the fifth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the sixth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the seventh embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the eighth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the ninth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the tenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the eleventh embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the twelfth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the thirteenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the thirteenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the fifteenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the 16th embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the 17th embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the eighteenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the nineteenth embodiment of the present disclosure. Schematic perspective view showing the outer shape of the electronic device according to the twentieth embodiment of the present disclosure. Frequency characteristic diagram showing the electromagnetic field strength of an arbitrary point in the surrounding space of the electronic device in the third embodiment and the seventh embodiment of the present disclosure and the comparative example. Schematic diagram showing a modified example of the electronic device of the present disclosure Schematic diagram showing a modified example of the electronic device of the present disclosure Schematic diagram showing a modified example of the electronic device of the present disclosure Schematic diagram showing a modified example of the electronic device of the present disclosure

Embodiment 1.
FIG. 1 is a cross-sectional view showing the structure of the electronic device according to the first embodiment of the present disclosure. In the present specification, the top, bottom, left, and right are described with reference to FIG. 1, but the actual product is not limited to this.

As shown in FIG. 1, the electronic device 10 has a structure in which the electronic circuit board 3 is sandwiched between the upper housing 1 and the lower housing 2 of the metal housing 7. More specifically, the upper housing 1, the lower housing 2 and the electronic circuit board 3 are collectively tightened and fixed with a plurality of screws 4.

The upper housing 1 is made of metal and includes each part of reference numerals 1a to 1e. The sandwiching portion 1a is a circumferential portion that comes into contact with the electronic circuit board 3 when the electronic circuit board 3 is sandwiched between the lower housing 2 and the lower housing 2. The holes 1b are a plurality of through holes for inserting and tightening the screw 4. The recess 1c is provided inside the holding portion 1a in order to secure a distance between the upper housing 1 and the electronic circuit of the electronic circuit board 3. The recess 1d is a circumferential groove provided on the outside of the holding portion 1a. The protruding portion 1e is a portion of the lower end portion of the main body portion of the upper housing 1 that includes a plate-shaped portion that protrudes outward and an inclined surface that tapers outward in the protruding direction between the lower housing 2 and the lower housing 2. Is.

The lower housing 2 is made of metal and includes each part of reference numerals 2a to 2e. The sandwiching portion 2a is a circumferential portion that comes into contact with the electronic circuit board 3 when sandwiching the electronic circuit board 3 with the upper housing 1. The screw 4 is screwed into the screw hole 2b. The recess 2c is provided inside the holding portion 2a in order to secure a distance between the lower housing 2 and the electronic circuit of the electronic circuit board 3. The recess 2d is a circumferential groove provided on the outside of the holding portion 2a. The protruding portion 2e is a portion of the upper end portion of the main body portion of the lower housing 2 that includes a plate-shaped portion that protrudes outward and an inclined surface that tapers outward in the protruding direction between the upper housing 1 and the upper housing 1. Is.

The inclined surfaces of the protruding portion 1e and the protruding portion 2e are provided with a slight angle with respect to the plane perpendicular to the sandwiching direction X of the electronic circuit board 3 by the upper housing 1 and the lower housing 2, respectively. In the description of the embodiment of the present disclosure, the sandwiching direction X is a tightening direction in which the electronic circuit board 3 is placed on the lower housing 2 and the upper housing 1 is tightened to the lower housing 2 with screws 4. Point to.

The shielding portion 6 is configured by one or both of the protruding portion 1e and the protruding portion 2e. The shielding portion 6 of the first embodiment is provided on all the side surfaces of the metal housing 7 including the upper housing 1 and the lower housing 2. Further, the shielding portion 6 is provided so as to cover the entire length of the joint between the upper housing 1 and the lower housing 2. However, it does not matter whether or not the shielding portion 6 is provided in a portion having a complicated shape such as a corner portion or an opening of a connector and which is not uniform.

The electronic circuit board 3 is a board on which an electronic circuit having a single-layer or multi-layer structure is formed. The electronic circuit is formed at an arbitrary position on the substrate as long as it is within the range of the recess 1c and / or the recess 2c. The electronic circuit is provided with a plurality of holes for inserting the screws 4 on the peripheral edge of the electronic circuit board 3 of the substrate.

When the electronic circuit board 3 is sandwiched between the upper housing 1 and the lower housing 2, a gap 5 is formed between the lower surface of the upper housing 1 and the upper surface of the lower housing 2. That is, the upper housing 1 and the lower housing 2 are not in contact with each other at the seams.

There is no solder resist on the peripheral side surface of the screw fixing part of the electronic circuit board 3, and the ground pattern is exposed. At this time, a gap 5 is provided between the upper housing 1 and the lower housing 2 in order to ensure that both the upper housing 1 and the lower housing 2 are electrically connected to the ground pattern of the electronic circuit board 3. ..

For example, if there is a variation in the thickness of the electronic circuit board 3 and the dimensions of either the upper housing 1 or the lower housing 2, the upper housing 1 and the lower housing 2 may come into contact with each other. be. When the upper housing 1 and the lower housing 2 come into contact with each other, the electronic circuit board 3 does not come into contact with either or both of the upper housing 1 and the lower housing 2 at the screw fixing portion, and the ground is conducted. There is a concern that the EMC (Electromagnetic Compatibility) performance will deteriorate. In order to avoid the concern, the gap 5 is provided.

FIG. 2 is a schematic view showing the outer shape of the electronic device 10 according to the first embodiment of the present disclosure.

The metal housing 7 is a combination of the upper housing 1 and the lower housing 2 shown in FIG. 1 and is formed in a rectangular parallelepiped. Although not shown, the electronic circuit board 3 is held in the metal housing 7. In the first embodiment, the shielding portions 6 are arranged on the four side surfaces of the metal housing 7. In FIG. 2, the shielding portions 6 on each side surface are represented by

reference numerals

6a, 6b, 6c and 6d counterclockwise when viewed from above. On each side surface, a shielding portion 6 is formed to cover the entire length of the joint between the upper housing 1 and the lower housing 2. Further, each of the shielding portions 6 is composed of a combination of a protruding portion 1e and a protruding portion 2e.

Hereinafter, the EMI-resistant (Electromagnetic Interference) structure of the electronic device 10 will be described in more detail with reference to FIG. 3, which shows an enlarged view of the gap 5 and the shielding portion 6.

It is preferable that both the upper housing 1 and the lower housing 2 are reliably conducted with the ground pattern of the electronic circuit board 3 to ensure EMC performance. For that purpose, the distance of the gap 5 must be set to a value or more that allows for all the dimensional variations due to the manufacture of the upper housing 1, the lower housing 2, and the electronic circuit board 3.

Therefore, in order to ensure the EMC performance, the upper housing 1 and the lower housing 2 are connected to the electronic circuit board 3, but a gap 5 must be provided. Therefore, the electromagnetic field leaking from the gap 5 adversely affects other electronic devices as a radiated electromagnetic field from the electronic device, or causes a problem that the EMC standard test cannot be complied with.

Whether or not the above problem actually occurs depends on the characteristics of the circuit drive clock signal that is the source of the electromagnetic field mounted on the electronic circuit board 3 or the characteristics of the electrical resonance of the metal housing 7. The characteristics of the circuit drive clock signal are, for example, the frequency, voltage amplitude, and number of circuit drive clock signals. The characteristics of electrical resonance are, for example, frequency and amplification factor.

In the present disclosure, the gap 5 is provided with a shielding portion 6 having an angle between the upper housing 1 and the lower housing 2 in a plane perpendicular to the board sandwiching direction. As a result, since the shielding portion 6 acts as a shield against the electromagnetic field leaking from the gap 5, it is possible to suppress the radiated electromagnetic field of the electronic device.

The relationship between the dimension D1 of the gap 5 in consideration of the variation and the dimensions H1 and H2 in the direction of sandwiching the substrate on the end side surface of the shielding portion 6 is as shown in the following mathematical formula (1).
D1> H1 + H2 ... Formula (1)

That is, if there is no manufacturing variation and the result is as designed, the upper housing 1 and the lower housing 2 do not come into direct contact with each other including the gap 5 and the shielding portion 6. When the mathematical formula (1) is satisfied, the dimension D1 of the gap 5 is maintained as designed. Therefore, even if the thickness t of the electronic circuit board 3 shown in FIG. 3 varies, the continuity between the electronic circuit board 3 and the upper housing 1 and the lower housing 2 can be maintained. Even in this case, the radiated electromagnetic field from the electronic device can be suppressed by narrowing the gap 5 with the shielding portion 6 which is a metal shield.

In addition, there are cases where the gap 5 becomes larger than the design value due to manufacturing variations. Even in that case, the structure provided with the shielding portion 6 has an effect of suppressing the radiated electromagnetic field from the electronic device as compared with the structure not provided with the shielding portion 6.

When the mathematical formula (1) is not satisfied, that is, when D1, H1 and H2 have the relationship of the following mathematical formula (2), the protruding portion 1e of the upper housing 1 and the protruding portion 2e of the lower housing 2 come into contact with each other. Will be done. For example, there is a case where the dimension D1 of the gap 5 becomes smaller than the design value within the allowable tolerance range due to the occurrence of manufacturing variation, and the dimensions H1 and H2 of the shielding portion 6 are as designed. Further, the distance of the gap 5 is as designed, but the dimensions H1 and H2 of the shielding portion 6 are larger than the design value within the allowable tolerance range due to manufacturing variations.
D1 ≤ H1 + H2 ... Formula (2)

When the mathematical formula (2) is satisfied, at the same time, the dimension D2 of the gap between the sandwiching portion 1a of the upper housing 1 and the sandwiching portion 2a of the lower housing 2 and the thickness t of the electronic circuit board 3 are the following mathematical formulas ( It may be related to 3). For example, the thickness t of the electronic circuit board 3 may be smaller than the design value within the allowable tolerance range due to manufacturing variations. When the mathematical formulas (2) and (3) are satisfied, the continuity between the electronic circuit board 3 and one or both of the upper housing 1 and the lower housing 2 cannot be ensured.
t <D2 ... Formula (3)

However, in the present disclosure, since an angle is provided between the protruding portion 1e and the protruding portion 2e of the shielding portion 6, one or both of the following two actions (i) and (ii) are exhibited. As a result, even if the upper housing 1 and the lower housing 2 come into contact with each other at the shielding portion 6 due to manufacturing variations, the electronic circuit board 3 can be attached to the upper housing 1 and the lower housing 2. Contact with both is maintained.

(I) The protruding portion 1e and the protruding portion 2e of the shielding portion 6 have elasticity in the substrate sandwiching direction. Therefore, the protruding portion 1e and the protruding portion 2e push each other against each other, and the shielding portion 6 bends. As a result, even when the mathematical formulas (2) and (3) are satisfied, the upper housing 1, the lower housing 2 and the electronic circuit board 3 can be brought into contact with each other by the screw portion, so that the continuity can be maintained.

(Ii) The electronic device 10 has a structure in which the electronic circuit board 3 is sandwiched between the upper housing 1 and the lower housing 2. By adopting the sandwiching structure, a gap or looseness called play for absorbing manufacturing variation or assembly variation can be provided in the plane direction of the electronic circuit board 3. Further, an angle is provided between the protruding portion 1e of the upper housing 1 and the protruding portion 2e of the lower housing 2. As a result, the upper housing 1 and the lower housing 2 can easily slide and move in the horizontal direction with respect to the electronic circuit board 3 by utilizing the play.

In the first embodiment, the shielding portion 6 is configured by the protruding portion 1e of the upper housing 1 and the protruding portion 2e of the lower housing 2. According to the first embodiment, it is not necessary to process the pedestal of the upper housing 1 or the lower housing 2 for holding the electronic circuit board 3 and to seal the upper housing 1 and the lower housing 2 by combining them. Become. That is, the radiated electromagnetic field can be relaxed only by changing the shape of the existing metal housing. Therefore, according to the present disclosure, it is possible to suppress the electromagnetic field radiation of an electronic device with a simple structure.

Embodiment 2.
The shielding portion 6 may be provided only in either the upper housing 1 or the lower housing 2. FIG. 4 is a schematic view showing the outer shape of the electronic device 10 according to the second embodiment of the present disclosure.

Hereinafter, in FIGS. 4 to 23, among the shielding

portions

6a, 6b, 6c and 6d, those formed are designated by reference numerals and displayed. Further, in the

shielding portions

6a, 6b, 6c and 6d, the formed portions of the protruding portions 1e and the protruding portions 2e are indicated by reference numerals. With respect to the protruding portion 1e and the protruding portion 2e, the display of reference numerals is omitted except for the typical side surfaces. Further, in the following description of Embodiments 2 to 20, the combination of the upper housing 1 and the lower housing 2 illustrated in FIGS. 4 to 23 will be referred to as a metal housing 7.

As shown in FIG. 4, shielding

portions

6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7. The shielding

portions

6a, 6b, 6c and 6d all cover the entire length of the joint between the upper housing 1 and the lower housing 2. Further, as shown in FIG. 5, each of the shielding

portions

6a, 6b, 6c and 6d is composed of only the protruding portion 1e and does not include the protruding portion 2e. The upper surface of the lower housing 2 on which the protrusion 2e is not formed is a flat surface having no inclined surface. In addition, it is permissible to provide an inclined surface or a stepped portion other than the purpose of shielding. In the structure of FIG. 5, D1 and H1 shown in the mathematical formula (1) are the same as D1 and H1 of FIG. However, since the protruding portion 2e is not provided, the tolerance of D1 is slightly wider than the case where H2 = 0 in the mathematical formula (1).

According to the configuration of the second embodiment, the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case without the shielding portion 6.

Embodiment 3.
The shielding portion 6 may be provided only on a specific side surface instead of all the side surfaces of the metal housing 7. FIG. 6 is a schematic view showing the outer shape of the electronic device 10 according to the third embodiment of the present disclosure.

As shown in FIG. 6, only the shielding portion 6a is formed on the side surface of the metal housing 7. The shielding portion 6a covers the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. Further, the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e. Similar to FIG. 5, the lower surface of the upper housing 1 in which the protrusion 1e is not formed and the upper surface of the lower housing 2 in which the protrusion 2e is not formed are flat surfaces having no inclined surface. In each of the following embodiments, the lower surface of the upper housing 1 in which the protruding portion 1e is not formed and the upper surface of the upper housing 2 in which the protruding portion 2e is not formed do not have an inclined surface. It is a plane.

According to the configuration of the third embodiment, the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the first embodiment because it is specified only on the peripheral side surface of the side surface provided with the shielding portion 6 and far away in the direction thereof, but is lower than the case where the shielding portion 6 is not provided. Is also expensive.

Embodiment 4.
The shielding portion 6 may be provided on a plurality of specific side surfaces instead of all the side surfaces of the metal housing 7. FIG. 7 is a schematic view showing the outer shape of the electronic device 10 according to the fourth embodiment of the present disclosure.

As shown in FIG. 7, shielding

portions

6a and 6b are formed on the side surfaces of the metal housing 7. The shielding

portions

6a and 6b cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. Further, the shielding

portions

6a and 6b are composed of a combination of the protruding portions 1e and the protruding portions 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the fourth embodiment, the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the first embodiment because it is specified only on the peripheral side surface of the side surface provided with the shielding portion 6 and far away in the direction thereof, but is lower than the case where the shielding portion 6 is not provided. Is also expensive.

Embodiment 5.
The shielding portion 6 may be provided on a part of each side surface of the metal housing 7, but not all of the side surfaces. FIG. 8 is a schematic view showing the outer shape of the electronic device 10 according to the fifth embodiment of the present disclosure.

As shown in FIG. 8, shielding

portions

6a, 6b, 6c and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface. Further, the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the fifth embodiment, the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case without the shielding portion 6.

Embodiment 6.
The shielding portion 6 may be provided so that not all of the side surfaces of the metal housing 7 but a part thereof is missing. FIG. 9 is a schematic view showing the outer shape of the electronic device 10 according to the sixth embodiment of the present disclosure.

As shown in FIG. 9, shielding

portions

6a, 6b, 6c and 6d are formed on each side surface of the metal housing 7. The shielding portion 6a covers a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface. The shielding

portions

6b, 6c and 6d cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface. Further, each of the shielding

portions

6a, 6b, 6c and 6d is composed of a combination of the protruding portion 1e and the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the sixth embodiment, the tolerance for assembly with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is improved as compared with the configuration of the first embodiment. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case without the shielding portion 6.

Embodiment 7.
The shielding portion 6 may be provided on only one of the upper housing 1 and the lower housing 2, and not on all the side surfaces but only on a specific side surface. FIG. 10 is a schematic view showing the outer shape of the electronic device 10 according to the seventh embodiment of the present disclosure.

As shown in FIG. 10, only the shielding portion 6a is formed on the side surface of the metal housing 7. The shielding portion 6a covers the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. Further, the shielding portion 6a is composed of only the protruding portion 1e and does not include the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the seventh embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation in the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 as compared with the configurations of the first embodiment, the second embodiment, and the third embodiment. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and third embodiments, but higher than that without the shielding portion 6.

Embodiment 8.
The shielding portion 6 may be provided on only one of the upper housing 1 or the lower housing 2 and on a plurality of specific side surfaces instead of all the side surfaces. FIG. 11 is a schematic view showing the outer shape of the electronic device 10 according to the eighth embodiment of the present disclosure.

As shown in FIG. 11, shielding

portions

6a and 6c are formed on the side surfaces of the metal housing 7. The shielding

portions

6a and 6c cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. Further, the shielding

portions

6a and 6c are composed of only the protruding portions 1e and do not include the protruding portions 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the eighth embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation in the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 as compared with the configurations of the first embodiment, the second embodiment, and the fourth embodiment. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and fourth embodiments, but higher than that without the shielding portion 6.

Embodiment 9.
The shielding portion 6 may be provided on only one of the upper housing 1 and the lower housing 2, and may be provided on a part of each side surface, not all of them. FIG. 12 is a schematic view showing the outer shape of the electronic device 10 according to the ninth embodiment of the present disclosure.

As shown in FIG. 12, shielding

portions

6a, 6b, 6c and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface. Further, each of the shielding

portions

6a, 6b, 6c and 6d is composed of only the protruding portion 1e and does not include the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the ninth embodiment, the assembly of the upper housing 1, the lower housing 2 and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 is larger than the configurations of the first, second and fifth embodiments. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and fifth embodiments, but higher than that without the shielding portion 6.

Embodiment 10.
The shielding portion 6 may be provided on only one of the upper housing 1 and the lower housing 2, and not all but a part of each side surface may be missing. FIG. 13 is a schematic view showing the outer shape of the electronic device 10 according to the tenth embodiment of the present disclosure.

As shown in FIG. 13, shielding

portions

6a, 6b, 6c and 6d cover a range in which a central part of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface. Further, each of the shielding

portions

According to the configuration of the tenth embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the second embodiment, and the sixth embodiment. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, second and sixth embodiments, but higher than that without the shielding portion 6.

Embodiment 11.
The shielding portion 6 may be provided only on a specific side surface instead of all the side surfaces, and may be provided on a part of each side surface instead of all. FIG. 14 is a schematic view showing the outer shape of the electronic device 10 according to the eleventh embodiment of the present disclosure.

As shown in FIG. 14, only the shielding portion 6a is formed on the side surface of the metal housing 7. The shielding portion 6a covers a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface. Further, the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the eleventh embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the third embodiment, and the fifth embodiment. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, third and fifth embodiments, but higher than that without the shielding portion 6.

Embodiment 12.
The shielding portion 6 may be provided only on a specific side surface instead of all the side surfaces, and may be provided not all but a part of each side surface. FIG. 15 is a schematic view showing the outer shape of the electronic device 10 according to the twelfth embodiment of the present disclosure.

As shown in FIG. 15, only the shielding portion 6a is formed on the side surface of the metal housing 7. The shielding portion 6a covers a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface. Further, the shielding portion 6a is composed of a combination of the protruding portion 1e and the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the twelfth embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is larger than the configurations of the first, third, and sixth embodiments. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, third and sixth embodiments, but higher than that without the shielding portion 6.

Embodiment 13.
The shielding portion 6 may be provided on a plurality of specific side surfaces instead of all the side surfaces, and may be provided on a part of each side surface instead of all. FIG. 16 is a schematic view showing the outer shape of the electronic device 10 according to the thirteenth embodiment of the present disclosure.

As shown in FIG. 16, shielding

portions

6b and 6d are formed on the side surfaces of the metal housing 7. The shielding

portions

6b and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface. Further, the shielding

portions

6b and 6d are composed of a combination of the protruding portions 1e and the protruding portions 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the thirteenth embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the fourth embodiment, and the fifth embodiment. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, fourth and fifth embodiments, but higher than that without the shielding portion 6.

Embodiment 14.
The shielding portion 6 may be provided on a plurality of specific side surfaces instead of all the side surfaces, and may be provided on a part of each side surface, not all of them. FIG. 17 is a schematic view showing the outer shape of the electronic device 10 according to the thirteenth embodiment of the present disclosure.

As shown in FIG. 17, shielding

portions

6a and 6c are formed on the side surfaces of the metal housing 7. The shielding

portions

6a and 6c cover a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface. Further, the shielding

portions

6a and 6c are composed of a combination of the protruding portions 1e and the protruding portions 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the fourteenth embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the fourth embodiment, and the sixth embodiment. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first, fourth and sixth embodiments, but higher than that without the shielding portion 6.

Embodiment 15.
The shielding portion 6 may be provided on only one of the upper housing 1 or the lower housing 2 and on a part of only a specific side surface of the metal housing 7 instead of all the side surfaces. FIG. 18 is a schematic view showing the outer shape of the electronic device 10 according to the fifteenth embodiment of the present disclosure.

As shown in FIG. 18, only the shielding portion 6a is formed on the side surface of the metal housing 7. The shielding portion 6a covers a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface. Further, the shielding portion 6a is composed of only the protruding portion 1e and does not include the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the fifteenth embodiment, the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 are larger than those of the first, second, third, and fifth embodiments. Improves assembly tolerance for manufacturing variations. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the third embodiment and the fifth embodiment, but is higher than that of the case without the shielding portion 6.

Embodiment 16.
Even if the shielding portion 6 is provided on only one of the upper housing 1 and the lower housing 2, and in a state where a part of the side surface is missing only on a specific side surface instead of all the side surfaces of the metal housing 7. good. FIG. 19 is a schematic view showing the outer shape of the electronic device 10 according to the 16th embodiment of the present disclosure.

As shown in FIG. 19, only the shielding portion 6a is formed on the side surface of the metal housing 7. The shielding portion 6a covers a range in which a part of the center of the joint between the upper housing 1 and the lower housing 2 is missing on the side surface. Further, the shielding portion 6a is composed of only the protruding portion 1e and does not include the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the 16th embodiment, the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 are larger than those of the configurations of the first embodiment, the second embodiment, the third embodiment and the sixth embodiment. Improves assembly tolerance for manufacturing variations. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the third embodiment and the sixth embodiment, but is higher than that of the case without the shielding portion 6.

Embodiment 17.
The shielding portion 6 may be provided on only one of the upper housing 1 or the lower housing 2 and on a part of a plurality of specific side surfaces instead of all the side surfaces of the metal housing 7. FIG. 20 is a schematic view showing the outer shape of the electronic device 10 according to the 17th embodiment of the present disclosure.

As shown in FIG. 20, shielding

portions

6b and 6d are formed on the side surface of the metal housing 7. The shielding

portions

6b and 6d are composed of only the protruding portions 1e, and do not include the protruding portions 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the 17th embodiment, the dimensions of the upper housing 1, the lower housing 2 and the electronic circuit board 3 are larger than those of the configurations of the first embodiment, the second embodiment, the fourth embodiment and the fifth embodiment. Improves assembly tolerance for manufacturing variations. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the fourth embodiment and the fifth embodiment, but higher than the case where the shielding portion 6 is not provided.

Embodiment 18.
The shielding portion 6 is provided on only one of the upper housing 1 or the lower housing 2 and in a state where a part of each side surface is missing from a plurality of specific side surfaces instead of all the side surfaces of the metal housing 7. You may be. FIG. 21 is a schematic view showing the outer shape of the electronic device 10 according to the eighteenth embodiment of the present disclosure.

As shown in FIG. 21, shielding

portions

6a and 6c are formed on the side surfaces of the metal housing 7. The shielding

portions

According to the configuration of the eighteenth embodiment, the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 are larger than those of the first, second, fourth, and sixth embodiments. Improves assembly tolerance for manufacturing variations. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configurations of the first embodiment, the second embodiment, the fourth embodiment and the sixth embodiment, but is higher than that of the case without the shielding portion 6.

Embodiment 19.
The shielding portion 6 may be provided on each specific side surface of the upper housing 1 and the lower housing 2, and may be provided with either one of the protruding portions 2e of the protruding portion 1e. FIG. 22 is a schematic view showing the outer shape of the electronic device 10 according to the nineteenth embodiment of the present disclosure.

As shown in FIG. 22, shielding

portions

6a and 6c cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. The shielding

portions

6b and 6d cover a part of the center of the joint between the upper housing 1 and the lower housing 2 on the side surface. Each of the shielding

portions

6a and 6c is composed of only the protruding portion 2e and does not include the protruding portion 1e. Further, each of the shielding

portions

6b and 6d is composed of only the protruding portion 1e and does not include the protruding portion 2e. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the nineteenth embodiment, the assembly of the upper housing 1, the lower housing 2, and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions of the upper housing 1, the lower housing 2, and the electronic circuit board 3 is larger than the configurations of the first, second, and fifth embodiments. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the case where the second embodiment, the fifth embodiment and the shielding portion 6 are not provided.

20.
The shielding portion 6 may have a structure in which both the protruding portion 1e and the protruding portion 2e are provided on one side surface, and the protruding portion 1e and the protruding portion 2e do not overlap. FIG. 23 is a schematic view showing the outer shape of the electronic device 10 according to the twentieth embodiment of the present disclosure.

As shown in FIG. 23, shielding

portions

6a, 6b, 6c and 6d cover the entire length of the joint between the upper housing 1 and the lower housing 2 on the side surface thereof. The shielding

portions

6a and 6c have one protruding portion 2e provided in the central portion and two protruding portions 1e provided on both sides of the protruding portion 2e. Further, the shielding

portions

6b and 6d have one protruding portion 1e and one protruding portion 2e. On each side surface, the protrusion 1e and the protrusion 2e do not overlap. The lower surface of the upper housing 1 on which the protrusion 1e is not formed and the upper surface of the lower housing 2 on which the protrusion 2e is not formed are flat surfaces having no inclined surface.

According to the configuration of the 20th embodiment, the assembly of the upper housing 1, the lower housing 2 and the electronic circuit board 3 with respect to the manufacturing variation of the dimensions as compared with the configurations of the first embodiment, the second embodiment, and the sixth embodiment. Tolerance is improved. On the other hand, the effect of suppressing the radiated electromagnetic field is lower than that of the configuration of the first embodiment, but higher than that of the second embodiment, the sixth embodiment and the case without the shielding portion 6.

Next, a comparison of the third embodiment, the seventh embodiment, and the comparative example without the shielding portion 6 will be described. FIG. 24 is a frequency characteristic diagram of an example of the analysis result of the electromagnetic field strength at an arbitrary point in the surrounding space in the above three examples of telegraph equipment.

As shown in FIG. 6, the electronic device 10 of the third embodiment has a protrusion 1e and a protrusion 2e on one side surface of the metal housing 7. Further, as shown in FIG. 10, the electronic device 10 of the seventh embodiment has only the protruding portion 1e on one side surface of the metal housing 7.

In FIG. 24, the horizontal axis is the frequency [Frequency / MHz], and the vertical axis is the electric field [Electric Field / dB (uV / m)]. Further, the thick broken line plotted in FIG. 24 is the third embodiment, the thin broken line is the seventh embodiment, and the solid line is a comparative example.

As shown in FIG. 24, it was obtained that the decrease in the electromagnetic field strength of the third embodiment and the seventh embodiment was larger than that of the comparative example at 2200 to 2550 MHz. Therefore, according to the present disclosure, the electromagnetic field strength can be reduced at a desired frequency by providing the shielding portion 6.

Further, from FIG. 24, it can be seen that in the third embodiment and the seventh embodiment, the frequency of the peak of the electromagnetic field strength is deviated from the comparative example. Therefore, according to the present disclosure, the effect of shifting the frequency of the peak of the electromagnetic field strength can be expected by providing the shielding portion 6.

Also, the structure of the present disclosure does not involve additional elastic members or plastic deformation. Therefore, according to the present disclosure, an effect that aged deterioration is less likely to occur can be obtained as compared with the prior art described in Patent Document 1 and Patent Document 2.

Note that this disclosure is not limited to the above embodiment, and various modifications and applications are possible.

For example, as shown in FIG. 25A, the lower end portion of the protruding portion 1e may extend below the upper surface of the lower housing 2. Further, as shown in FIG. 25B, the lower housing 2 may be formed thicker than the upper housing 1. Further, as shown in FIG. 25C, the angle of the protruding portion 1e extending from the upper housing 1 and the angle of the protruding portion 2e extending from the lower housing 2 may be different. Further, as shown in FIG. 25D, the lower housing 2 may be formed thinner than the upper housing 1.

The portion where a part of the shielding portion 6 is missing, which is described in the sixth embodiment, the tenth embodiment, etc., may be divided into not only one location but also a plurality of locations with respect to one side surface.

In the fifth embodiment, the ninth embodiment, and the like, the shielding portion 6 is arranged at the center of the side surface, but the shielding portion 6 may be arranged at a position close to either the left or right side of the side surface.

In the 20th embodiment, two or three shielding portions 6 are arranged on each side surface, but four or more shielding portions may be arranged.

In addition, any shielding unit 6 can be configured by combining the embodiments of the present disclosure. Further, the hierarchical relationship of the illustrated structure may be interchanged.

In the first embodiment, the sandwiching portion 1a and the sandwiching portion 2a are each formed in a circumferential shape. In addition to this, the sandwiching portion 1a and the sandwiching portion 2a may be formed in a structure lacking a part of the circumferential shape, if necessary for the electronic device.

In each embodiment, the protruding portion 1e and the protruding portion 2e are formed in a plate shape, but the gap 5 may be narrowed and bent, and may have a shape other than the plate shape.

The present disclosure allows for various embodiments and modifications without departing from the broad spirit and scope of the present disclosure. Moreover, the above-described embodiment is for explaining the present disclosure, and does not limit the scope of the present disclosure. That is, the scope of the present disclosure is indicated by the scope of claims, not by the embodiment. And various modifications made within the scope of the claims and within the equivalent meaning of disclosure are considered to be within the scope of the present disclosure.

The electronic device of the present disclosure can be used for a device having an electronic circuit board and needing to reduce electromagnetic field radiation.

1 Upper housing (first housing), 1a pinching part, 1b hole, 1c recess, 1d recess, 1e protruding part (first protruding part), 2 lower housing (second housing), 2a pinching Part, 2b screw hole, 2c recess, 2d recess, 2e protrusion (second protrusion), 3 electronic circuit board, 4 screws, 5 gap, 6, 6a, 6b, 6c, 6d shield, 7 metal housing 10, electronic equipment.

Claims

The first metal housing and
A second metal housing and
An electronic circuit board sandwiched between the first housing and the second housing,
In a portion where the first housing and the second housing are close to each other, a shielding portion arranged on at least one of the first housing and the second housing is provided.
A gap is provided between the peripheral edge of the first housing and the peripheral edge of the second housing.
The shielding portion includes a protruding portion protruding outward from the main body portion of the first housing or the second housing, and the protruding portion has an inclined surface that narrows the gap in the protruding direction.
Electronics.
The shielding portion is arranged only in one of the first housing and the second housing.
The electronic device according to claim 1.
The shielding portion is arranged in both the first housing and the second housing.
The electronic device according to claim 1.
The shielding portion is arranged on a part of the plurality of side surfaces including the gap of the metal housing in which the first housing and the second housing are combined.
The electronic device according to claim 1.
The shielding portion is arranged so as to cover a part of the gap in the metal housing in which the first housing and the second housing are combined.
The electronic device according to claim 1.
The shielding portion includes a first protruding portion provided in the first housing and a second protruding portion provided in the second housing.
The first protrusion and the second protrusion are arranged at positions where they do not overlap each other.
The electronic device according to claim 1.