WO2021144853A1 - Carte de conversion de puissance - Google Patents

Carte de conversion de puissance Download PDF

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Publication number
WO2021144853A1
WO2021144853A1 PCT/JP2020/000903 JP2020000903W WO2021144853A1 WO 2021144853 A1 WO2021144853 A1 WO 2021144853A1 JP 2020000903 W JP2020000903 W JP 2020000903W WO 2021144853 A1 WO2021144853 A1 WO 2021144853A1
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WO
WIPO (PCT)
Prior art keywords
switching element
power
substrate
drive circuit
wiring
Prior art date
Application number
PCT/JP2020/000903
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English (en)
Japanese (ja)
Inventor
基 高原
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2020/000903 priority Critical patent/WO2021144853A1/fr
Priority to JP2020531549A priority patent/JP6752400B1/ja
Publication of WO2021144853A1 publication Critical patent/WO2021144853A1/fr

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode

Definitions

  • the present disclosure relates to a power conversion board having one or both of a function of converting DC power into AC power and a function of converting AC power into DC power.
  • the inverter device has a short-circuiting means located between the full-bridge inverter and the reactor to short-circuit the output of the full-bridge inverter.
  • the short circuit means has two switching elements.
  • the inverter device reduces the ripple generated in the alternating current output by the full-bridge inverter near the point where the average value of the alternating current becomes zero. As a result, the conversion efficiency from direct current to alternating current is improved, and noise is reduced.
  • the inverter device suppresses the fluctuation range of the potential at the negative output end of the DC voltage. This reduces the leakage current.
  • a conventional inverter device when a surge voltage is generated when AC power supplied from a power system is converted into DC power and DC power is output to a power storage device, the surge voltage constitutes a full bridge inverter. It is applied to the element. Therefore, in the conventional inverter device, when a surge voltage is generated, a part or all of the plurality of switching elements may fail. It is required to provide a power conversion substrate that suppresses ripples generated in alternating current, reduces leakage current, and suppresses failure of each of a plurality of switching elements included in an inverter when a surge voltage occurs. Has been done.
  • the present disclosure has been made in view of the above, in which ripples generated in alternating current are suppressed, leakage current is reduced, and when a surge voltage is generated, each of a plurality of switching elements included in the inverter fails.
  • the purpose is to obtain a power conversion substrate that suppresses this.
  • the power conversion substrate includes a smoothing capacitor for smoothing a DC voltage, a function for converting DC power to AC power, and a function for converting AC power to DC power. It has a full bridge portion having one or both functions, a short circuit portion for short-circuiting AC power, and a substrate on which a smoothing capacitor, a full bridge portion, and a short-circuit portion are arranged.
  • the full bridge section includes a first switching element, a second switching element, a third switching element, and a fourth switching element that form a full bridge circuit.
  • the short-circuit portion has a fifth switching element and a sixth switching element.
  • Each of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element has a body portion and a terminal portion.
  • Each of the first switching element, the second switching element, the third switching element, the fourth switching element, the fifth switching element, and the sixth switching element is placed on the substrate with the terminal portion located closer to the smoothing capacitor than the body portion. Have been placed.
  • FIG. 1 The figure which shows the outline of the structure of the power conditioner which concerns on Embodiment 1.
  • An example of the direction in which current flows in the circuit of the power conversion board when the power conditioner according to the first embodiment converts the AC power supplied from the power system into DC power and outputs the DC power to the power storage device is shown.
  • Figure 1 An example of the direction in which current flows in the circuit of the power conversion board when the power conditioner according to the first embodiment converts the AC power supplied from the power system into DC power and outputs the DC power to the power storage device is shown.
  • Figure 2 The figure which shows the example of the wiring which influences the magnitude of a surge voltage in the circuit of the power conversion board which concerns on Embodiment 1.
  • FIG. 1 An example of the direction in which current flows in the circuit of the power conversion board when the power conditioner according to the first embodiment converts the AC power supplied from the power system into DC power and outputs the DC power to the power storage device is shown
  • FIG. 1 schematically shows a state in which a plurality of elements included in the power conversion board according to the first embodiment are arranged on the board.
  • FIG. 2 schematically shows a state in which a plurality of elements included in the power conversion board according to the first embodiment are arranged on the board.
  • FIG. 1 for explaining the effect of the first drive circuit included in the power conversion board according to the first embodiment.
  • FIG. 2 for explaining the effect of the first drive circuit included in the power conversion board according to the first embodiment.
  • FIG. 1 is a diagram showing an outline of the configuration of the power conditioner 1 according to the first embodiment.
  • the power conditioner 1 has a function of converting AC power supplied from the power system 71 into DC power and outputting the DC power to the power storage device 72, and converting the DC power supplied from the power storage device 72 into AC power. It has a function of outputting AC power to one or both of the power system 71 and the load 73.
  • FIG. 1 also shows a power system 71, a power storage device 72, and a load 73.
  • the load 73 is a device that operates based on AC power.
  • the load 73 can also operate based on the AC power supplied from the power system 71.
  • the power conditioner 1 has a power conversion board 2 having a function of converting DC power into AC power and a function of converting AC power into DC power, and a control device 3 for controlling the power conversion board 2.
  • the power conversion board 2 includes a converter 4 having a function of boosting and lowering a DC voltage, a smoothing capacitor 5 for smoothing the DC voltage, a function of converting DC power into AC power, and a function of converting AC power into DC power. It has an inverter 6 having a function to perform the function.
  • An example of a smoothing capacitor 5 is an electrolytic capacitor.
  • FIG. 2 is a diagram showing a configuration of a circuit of the power conversion board 2 according to the first embodiment.
  • the power conversion board 2 includes a converter 4, a smoothing capacitor 5, and an inverter 6.
  • the converter 4 is not shown in FIG.
  • the power conversion board 2 further includes a first reactor 7 and a second reactor 8 for removing high frequency components in AC power.
  • the power conversion board 2 further includes a snubber capacitor 9 located between the smoothing capacitor 5 and the inverter 6. Details of the snubber capacitor 9 will be described later.
  • the inverter 6 has a full bridge portion 10 having a function of converting DC power into AC power and a function of converting AC power into DC power, and a short-circuit portion 11 that short-circuits AC power.
  • the power conversion board 2 further includes a board 12 on which a converter 4, a smoothing capacitor 5, an inverter 6, a first reactor 7, a second reactor 8, and a snubber capacitor 9 are arranged.
  • the board 12 is formed with the first wiring 13 and the second wiring 14 for connecting the converter 4 and the inverter 6, and the third wiring 15 and the fourth wiring 16 for connecting the inverter 6 and the power system 71. ing.
  • the smoothing capacitor 5 and the snubber capacitor 9 are connected in parallel to the first wiring 13 and the second wiring 14.
  • One end of the first reactor 7 is connected to the third wire 15, and one end of the second reactor 8 is connected to the fourth wire 16.
  • the other end of each of the first reactor 7 and the second reactor 8 is connected to the power system 71.
  • the power system 71 is not shown in FIG.
  • the full bridge unit 10 includes a first switching element 21, a second switching element 22, a third switching element 23, and a fourth switching element 24 that form a full bridge circuit.
  • each of the first switching element 21, the second switching element 22, the third switching element 23, and the fourth switching element 24 is a metal oxide silicon field effect transmitter.
  • the first switching element 21 and the second switching element 22 operate based on the first drive signal
  • the third switching element 23 and the fourth switching element 24 operate based on the second drive signal.
  • the first drive signal and the second drive signal are generated by the control device 3.
  • the collector terminal 211 of the first switching element 21 is connected to the first wiring 13, and the emitter terminal 212 of the first switching element 21 is connected to the third wiring 15.
  • each of the collector terminal 211 and the emitter terminal 212 is indicated by a broken line ellipse.
  • the collector terminal 221 of the second switching element 22 is connected to the fourth wiring 16, and the emitter terminal 222 of the second switching element 22 is connected to the second wiring 14.
  • each of the collector terminal 221 and the emitter terminal 222 is indicated by a broken line ellipse.
  • the collector terminal 231 of the third switching element 23 is connected to the third wiring 15, and the emitter terminal 232 of the third switching element 23 is connected to the second wiring 14.
  • each of the collector terminal 231 and the emitter terminal 232 is indicated by a broken line ellipse.
  • the collector terminal 241 of the fourth switching element 24 is connected to the first wiring 13, and the emitter terminal 242 of the fourth switching element 24 is connected to the fourth wiring 16.
  • each of the collector terminal 241 and the emitter terminal 242 is indicated by a broken line ellipse.
  • a voltage corresponding to the first drive signal is supplied to the gate terminal 213 of the first switching element 21 and the gate terminal 223 of the second switching element 22.
  • each of the gate terminal 213 and the gate terminal 223 is indicated by a broken line ellipse.
  • the first switching element 21 and the second switching element 22 are turned on or off based on the voltage.
  • the first drive signal is generated by the control device 3.
  • a voltage corresponding to the second drive signal is supplied to the gate terminal 233 of the third switching element 23 and the gate terminal 243 of the fourth switching element 24.
  • each of the gate terminal 233 and the gate terminal 243 is indicated by a broken line ellipse.
  • the third switching element 23 and the fourth switching element 24 are turned on or off based on the voltage.
  • the second drive signal is generated by the control device 3.
  • the first switching element 21 has a diode 214 that connects the emitter terminal 212 of the first switching element 21 and the collector terminal 211 of the first switching element 21.
  • the second switching element 22 has a diode 224 that connects the emitter terminal 222 of the second switching element 22 and the collector terminal 221 of the second switching element 22.
  • the third switching element 23 has a diode 234 that connects the emitter terminal 232 of the third switching element 23 and the collector terminal 231 of the third switching element 23.
  • the fourth switching element 24 has a diode 244 that connects the emitter terminal 242 of the fourth switching element 24 and the collector terminal 241 of the fourth switching element 24.
  • the short-circuit portion 11 has a fifth switching element 25 and a sixth switching element 26.
  • each of the fifth switching element 25 and the sixth switching element 26 is a metal oxide silicon field effect transmitter.
  • the fifth switching element 25 and the sixth switching element 26 are connected in series.
  • the collector terminal 251 of the fifth switching element 25 and the collector terminal 261 of the sixth switching element 26 are connected.
  • each of the collector terminal 251 and the collector terminal 261 is indicated by a broken line ellipse.
  • the emitter terminal 252 of the fifth switching element 25 is connected to the third wiring 15, and the emitter terminal 262 of the sixth switching element 26 is connected to the fourth wiring 16.
  • each of the emitter terminal 252 and the emitter terminal 262 is indicated by a broken line ellipse. Since the power conversion board 2 has a short-circuit portion 11 having a fifth switching element 25 and a sixth switching element 26, it is possible to suppress ripples generated in alternating current and reduce leakage current.
  • the fifth switching element 25 has a gate terminal 253 to which a voltage corresponding to the third drive signal is supplied.
  • the sixth switching element 26 has a gate terminal 263 to which a voltage corresponding to the fourth drive signal is supplied.
  • each of the gate terminal 253 and the gate terminal 263 is indicated by a broken line ellipse.
  • the third drive signal and the fourth drive signal are generated by the control device 3.
  • the fifth switching element 25 has a diode 254 that connects the emitter terminal 252 of the fifth switching element 25 and the collector terminal 251 of the fifth switching element 25.
  • the sixth switching element 26 has a diode 264 that connects the emitter terminal 262 of the sixth switching element 26 and the collector terminal 261 of the sixth switching element 26.
  • FIG. 3 shows a current in the circuit of the power conversion board 2 when the power conditioner 1 according to the first embodiment converts the AC power supplied from the power system 71 into DC power and outputs the DC power to the power storage device 72.
  • FIG. 1 is a diagram showing an example of a direction in which power flows.
  • FIG. 3 shows the direction of the current when the system voltage is positive. In FIG. 3, the arrows drawn by relatively thick lines indicate the direction in which the current flows.
  • the first switching element 21, the second switching element 22, and the fifth switching element 25 are in the on state, and the third switching element 23, the fourth switching element 24, and the sixth switching element 26 are in the off state.
  • the current flows in the order of the first reactor 7 and the diode 214 of the first switching element 21, and also flows in the order of the diode 224 of the second switching element 22 and the second reactor 8.
  • FIG. 4 shows a current in the circuit of the power conversion board 2 when the power conditioner 1 according to the first embodiment converts the AC power supplied from the power system 71 into DC power and outputs the DC power to the power storage device 72.
  • FIG. 2 is a diagram showing an example of the direction in which power flows. Next to the state shown in FIG. 3, the state shown in FIG. 4 is obtained. In FIG. 4, the arrows drawn by relatively thick lines indicate the direction in which the current flows.
  • the first switching element 21 and the second switching element 22 change from the on state to the off state, and the sixth switching element 26 is in the off state. Changes from to the on state.
  • the third switching element 23 and the fourth switching element 24 are maintained in the off state, and the fifth switching element 25 is maintained in the on state.
  • the current flows in the order of the first reactor 7, the diode 254 of the fifth switching element 25, the collector terminal 261 of the sixth switching element 26, the emitter terminal 262 of the sixth switching element 26, and the second reactor 8. Since the sixth switching element 26 is in the ON state, the current energy is stored in the first reactor 7 and the second reactor 8.
  • the state shown in FIG. 3 is obtained. In this way, the state shown in FIG. 3 and the state shown in FIG. 4 alternately occur.
  • the first reactor 7, the diode 254 of the fifth switching element 25, the collector terminal 261 of the sixth switching element 26, and the emitter of the sixth switching element 26 are obtained. The current flowing in the order of the terminal 262 and the second reactor 8 is maintained.
  • V SURGE L ⁇ dI / dt ⁇ ⁇ ⁇ (1)
  • V SURGE indicates the magnitude of the surge voltage in the switching element.
  • L indicates the magnitude of the wiring inductance component for the wiring connecting the capacitor connected to the switching element and the switching element.
  • I indicates the current flowing between the collector and the emitter of the switching element.
  • T indicates time.
  • D is a symbol indicating differentiation.
  • FIG. 5 is a diagram showing an example of wiring 30 that affects the magnitude of surge voltage in the circuit of the power conversion board 2 according to the first embodiment.
  • FIG. 5 shows the wiring 30 that affects the magnitude of the surge voltage when the system voltage is positive.
  • the wiring 30 is shown by a relatively thick line.
  • the length of the wiring 30 depends on the distance between the first switching element 21, the second switching element 22, the fifth switching element 25 and the sixth switching element 26, and the snubber capacitor 9.
  • the length of the wiring that affects the magnitude of the surge voltage is the third switching element 23, the fourth switching element 24, the fifth switching element 25, the sixth switching element 26, and the snubber capacitor 9.
  • the snubber capacitor 9 is located between the smoothing capacitor 5 and the inverter 6.
  • the magnitude of the surge voltage in the circuit of the power conversion board 2 is the first switching element 21, the second switching element 22, the third switching element 23, the fourth switching element 24, the fifth switching element 25, and the sixth switching element. It depends on the length of the wiring connecting 26 and the smoothing capacitor 5.
  • FIG. 6 is a diagram schematically showing a state in which a plurality of elements included in the power conversion board 2 according to the first embodiment are arranged on the board 12.
  • FIG. 6 shows a state of the front surface of the substrate 12 and a state of the back surface of the substrate 12.
  • the substrate 12 is not shown in FIG. All the elements included in the power conversion substrate 2 are arranged on the front surface of the substrate 12, not on the back surface of the substrate 12. Wiring is formed on the back surface of the substrate 12.
  • On the back surface of the substrate 12 of FIG. 6, a figure showing the position of each of the plurality of elements shown on the front surface of the substrate 12 of FIG. 6 is shown.
  • FIG. 6 shows the first smoothing capacitor 5A, the second smoothing capacitor 5B, and the third smoothing capacitor 5C.
  • the first smoothing capacitor 5A, the second smoothing capacitor 5B, and the third smoothing capacitor 5C are examples of the smoothing capacitor 5.
  • FIG. 6 shows a first snubber capacitor 9A and a second snubber capacitor 9B.
  • the first snubber capacitor 9A and the second snubber capacitor 9B are examples of the snubber capacitor 9.
  • Wiring 31 is provided on the front surface of the substrate 12, and wiring 32 is provided on the back surface of the substrate 12.
  • the second switching element 22 has a body portion 41 and a terminal portion 42.
  • the body portion 41 of the second switching element 22 is a portion having a switching function of the second switching element 22.
  • the terminal portion 42 of the second switching element 22 is a collector terminal 221 and an emitter terminal 222 and a gate terminal 223.
  • the symbol “C” is described on the right side of the collector terminal
  • the symbol “E” is described on the right side of the emitter terminal
  • the symbol “G” is described on the right side of the gate terminal.
  • each of the first switching element 21, the third switching element 23, the fourth switching element 24, the fifth switching element 25, and the sixth switching element 26 also has a body portion 41 and a terminal portion 42. And have.
  • each terminal portion 42 of the first switching element 21, the third switching element 23, the fourth switching element 24, the fifth switching element 25, and the sixth switching element 26 is indicated by a broken ellipse.
  • the terminal portion 42 is a smoothing capacitor 5 from the body portion 41. It is arranged on the substrate 12 in a state of being located on the side of.
  • the terminal portion 42 is smoother than the body portion 41. Close to capacitor 5.
  • the lengths of the wiring 31 and the wiring 32 are shorter than those when the body portion 41 is closer to the smoothing capacitor 5 than the terminal portion 42.
  • the surge voltage in the switching element becomes smaller as the wiring length becomes shorter.
  • the surge voltage in each switching element of the first embodiment is smaller than that in the case where the body portion 41 is closer to the smoothing capacitor 5 than the terminal portion 42.
  • the power conversion board 2 can prevent each of the plurality of switching elements included in the inverter 6 from failing when a surge voltage is generated.
  • the pair of the first switching element 21 and the second switching element 22 that operates based on the first drive signal is defined as the first set 51, and operates based on the second drive signal.
  • the pair of the third switching element 23 and the fourth switching element 24 is defined as the second set 52, and the pair of the fifth switching element 25 and the sixth switching element 26 of the short-circuit portion 11 is defined as the third set 53.
  • NS the pair of the first group 51, the second group 52, and the third group 53 is shown by a broken line frame.
  • the first switching element 21, the second switching element 22, the third switching element 23, the fourth switching element 24, the fifth switching element 25, and the sixth switching element 26 included in the inverter 6 are the third.
  • the first set 51, the third set 53, and the second set 52 are arranged on the substrate 12 in this order.
  • the wiring becomes shorter than when the six switching elements are arranged in an order other than the above order. Therefore, the surge voltage in each switching element of the first embodiment becomes small. Therefore, the power conversion board 2 can prevent each of the plurality of switching elements included in the inverter 6 from failing when a surge voltage is generated.
  • the first switching element 21, the second switching element 22, the third switching element 23, the fourth switching element 24, the fifth switching element 25, and the sixth switching element 26 are the first group 51 and the third group 53.
  • the second set 52 is arranged on the substrate 12 in this order. That is, the third set 53, which is a set of the fifth switching element 25 and the sixth switching element 26 included in the short-circuit portion 11, is located between the first set 51 and the second set 52.
  • the length of the wiring connecting the first switching element 21 and the third switching element 23 is longer than the case where the first switching element 21 and the third switching element 23 are arranged next to each other.
  • the short-circuit current generated by the malfunction of the switching element becomes large when the wiring inductance component is short, that is, in a short path, and may cause the switching element to be destroyed. Therefore, the power conversion board 2 can reduce the short-circuit current flowing from the first switching element 21 to the third switching element 23. Similarly, the power conversion board 2 can reduce the short-circuit current flowing from the second switching element 22 to the fourth switching element 24.
  • the power conversion board 2 has a snubber capacitor 9 located between the smoothing capacitor 5 and the inverter 6.
  • the power conversion board 2 has a first snubber capacitor 9A and a second snubber capacitor 9B.
  • the first snubber capacitor 9A protects the first switching element 21 and the second switching element 22 when an overvoltage is applied to the first switching element 21 and the second switching element 22 that operate based on the first drive signal. It is a capacitor.
  • the second snubber capacitor 9B protects the third switching element 23 and the fourth switching element 24 when an overvoltage is applied to the third switching element 23 and the fourth switching element 24 that operate based on the second drive signal. It is a capacitor.
  • the first snubber capacitor 9A is connected to the wiring 31 connecting the smoothing capacitor 5 and the full bridge portion 10, and includes the first set 51 and the smoothing capacitor 5, which are a set of the first switching element 21 and the second switching element 22. Located between. Furthermore, the first snubber capacitor 9A is located between the collector terminal 211 of the first switching element 21 and the emitter terminal 222 of the second switching element 22. The portion between the collector terminal 211 of the first switching element 21 and the emitter terminal 222 of the second switching element 22 is a portion affected by the surge voltage.
  • the second snubber capacitor 9B is connected to the wiring 31 connecting the smoothing capacitor 5 and the full bridge portion 10, and includes the second set 52 and the smoothing capacitor 5, which are a set of the third switching element 23 and the fourth switching element 24. Located between. Furthermore, the second snubber capacitor 9B is located between the emitter terminal 232 of the third switching element 23 and the collector terminal 241 of the fourth switching element 24. The portion between the emitter terminal 232 of the third switching element 23 and the collector terminal 241 of the fourth switching element 24 is a portion affected by the surge voltage.
  • the power conversion board 2 Since the power conversion board 2 has the first snubber capacitor 9A and the second snubber capacitor 9B, it is possible to protect the first switching element 21, the second switching element 22, the third switching element 23, and the fourth switching element 24. At the same time, the surge voltage applied to each of the fifth switching element 25 and the sixth switching element 26 included in the short-circuit portion 11 can be suppressed. Therefore, the power conversion board 2 can prevent each of the plurality of switching elements included in the inverter 6 from failing when a surge voltage is generated.
  • FIG. 7 is a second diagram schematically showing a state in which a plurality of elements included in the power conversion board 2 according to the first embodiment are arranged on the board 12.
  • FIG. 7 shows the state of the surface of the substrate 12.
  • the substrate 12 is not shown in FIG. As described above, all the elements of the power conversion board 2 are arranged on the surface of the board 12.
  • the power conversion board 2 includes a first drive circuit 61 for driving the first switching element 21, a second drive circuit 62 for driving the second switching element 22, and the like.
  • a third drive circuit 63 that drives the third switching element 23, a fourth drive circuit 64 that drives the fourth switching element 24, a fifth drive circuit 65 that drives the fifth switching element 25, and a sixth switching element 26. It further has a sixth drive circuit 66 for driving the above.
  • the first drive circuit 61 charges and discharges the gate of the first switching element 21 according to the first drive signal generated by the control device 3, and controls the on and off of the first switching element 21.
  • the first drive circuit 61 is arranged on the substrate 12 in a state of being located not on the terminal portion 42 side of the first switching element 21 but on the body portion 41 side.
  • the terminal portion 42 of the first switching element 21 is indicated by a broken line ellipse.
  • the side of the terminal portion 42 is described as “main circuit portion side”
  • the side of the body portion 41 is described as “control unit side”.
  • the second drive circuit 62 charges and discharges the gate of the second switching element 22 according to the first drive signal generated by the control device 3, and controls the on and off of the second switching element 22.
  • the second drive circuit 62 is arranged on the substrate 12 in a state of being located not on the terminal portion 42 side of the second switching element 22 but on the body portion 41 side.
  • the third drive circuit 63 charges and discharges the gate of the third switching element 23 according to the second drive signal generated by the control device 3, and controls the on and off of the third switching element 23.
  • the third drive circuit 63 is arranged on the substrate 12 in a state of being located not on the terminal portion 42 side of the third switching element 23 but on the body portion 41 side.
  • the fourth drive circuit 64 charges and discharges the gate of the fourth switching element 24 according to the second drive signal generated by the control device 3, and controls the on and off of the fourth switching element 24.
  • the fourth drive circuit 64 is arranged on the substrate 12 in a state of being located not on the terminal portion 42 side of the fourth switching element 24 but on the body portion 41 side.
  • the fifth drive circuit 65 charges and discharges the gate of the fifth switching element 25 according to the third drive signal generated by the control device 3, and controls the on and off of the fifth switching element 25.
  • the fifth drive circuit 65 is arranged on the substrate 12 in a state of being located not on the terminal portion 42 side of the fifth switching element 25 but on the body portion 41 side.
  • the sixth drive circuit 66 charges and discharges the gate of the sixth switching element 26 according to the fourth drive signal generated by the control device 3, and controls the on and off of the sixth switching element 26.
  • the sixth drive circuit 66 is arranged on the substrate 12 in a state of being located not on the terminal portion 42 side of the sixth switching element 26 but on the body portion 41 side.
  • the configuration of the first drive circuit 61 is the same as that of each of the second drive circuit 62, the third drive circuit 63, the fourth drive circuit 64, the fifth drive circuit 65, and the sixth drive circuit 66.
  • the first drive circuit 61 will be further referred to on behalf of the first drive circuit 61, the second drive circuit 62, the third drive circuit 63, the fourth drive circuit 64, the fifth drive circuit 65, and the sixth drive circuit 66. explain.
  • FIG. 8 is a diagram for explaining the effect of the first drive circuit 61 included in the power conversion board 2 according to the first embodiment.
  • FIG. 8 corresponds to FIG. 7, and is a case where the first drive circuit 61 is arranged on the substrate 12 in a state where the first drive circuit 61 is located not on the terminal portion 42 side of the first switching element 21 but on the body portion 41 side. It is a figure.
  • FIG. 8 shows a main circuit unit 67 through which the main current flows when power conversion is performed, and a gate drive circuit unit 68 connecting the first drive circuit 61 and the emitter terminal 212 of the first switching element 21.
  • FIG. 8 further shows a common circuit unit 69, which is a common portion between the main circuit unit 67 and the gate drive circuit unit 68. In FIG. 8, the common circuit unit 69 is shown by a relatively thick line.
  • FIG. 9 is a second diagram for explaining the effect of the first drive circuit 61 included in the power conversion board 2 according to the first embodiment.
  • FIG. 9 is a diagram showing a comparative example, which does not correspond to FIG. 7.
  • FIG. 9 is a diagram in the case where the first drive circuit 61 is arranged on the substrate 12 in a state where it is located not on the side of the body portion 41 of the first switching element 21 but on the side of the terminal portion 42.
  • FIG. 9 shows the main circuit unit 67, the gate drive circuit unit 68, and the common circuit unit 69, as in FIG. In FIG. 9, the common circuit unit 69 is shown by a relatively thick line.
  • the common circuit unit 69 of the first embodiment is shorter than the common circuit unit 69 of the comparative example. That is, the inductance of the common circuit unit 69 of the first embodiment is smaller than the inductance of the common circuit unit 69 of the comparative example.
  • the first drive circuit 61 is arranged on the substrate 12 in a state where it is located not on the terminal portion 42 side of the first switching element 21 but on the body portion 41 side. Therefore, the power conversion board 2 can prevent the first drive circuit 61 from malfunctioning due to the voltage generated by the fluctuation of the current flowing through the main circuit unit 67. Furthermore, the power conversion board 2 can prevent the first drive circuit 61 from malfunctioning due to voltage noise generated by fluctuations in the current flowing through the main circuit unit 67.
  • the power conversion substrate 2 since the power conversion substrate 2 according to the first embodiment has the short-circuit portion 11 having the fifth switching element 25 and the sixth switching element 26, the ripple generated in the alternating current is suppressed and the leakage current is reduced. be able to.
  • the power conversion board 2 has a full bridge portion 10 having a first switching element 21, a second switching element 22, a third switching element 23, and a fourth switching element 24 that form a full bridge circuit.
  • the terminal portion 42 is a smoothing capacitor 5 from the body portion 41. It is arranged on the substrate 12 in a state of being located on the side of. Therefore, the surge voltage in each switching element of the first embodiment is smaller than that in the case where the body portion 41 is located closer to the smoothing capacitor 5 than the terminal portion 42. As a result, the power conversion board 2 can prevent each of the six switching elements included in the inverter 6 from failing when a surge voltage is generated.
  • ripples generated in the alternating current are suppressed, leakage current is reduced, and when a surge voltage is generated, each of the plurality of switching elements included in the inverter 6 fails. Can be suppressed. Furthermore, when a surge voltage is generated while some or all of the plurality of switching elements included in the inverter 6 are off, each of the plurality of switching elements included in the inverter 6 fails in the power conversion board 2. Can be suppressed.
  • a surge voltage is generated when the power conditioner 1 converts the DC power supplied from the power storage device 72 into AC power and outputs the AC power to one or both of the power system 71 and the load 73. Even in such a case, it is possible to prevent each of the plurality of switching elements included in the inverter 6 from failing.
  • the six switching elements included in the inverter 6 include a first set 51 of a first switching element 21 and a second switching element 22 that operate based on a first drive signal, and a short-circuit portion 11.
  • the substrate is in the order of the third set 53 of the fifth switching element 25 and the sixth switching element 26, and the second set 52 of the third switching element 23 and the fourth switching element 24 that operate based on the second drive signal. It is arranged at 12.
  • the six switching elements are arranged in the above order, the wiring becomes shorter than when the six switching elements are arranged in an order other than the above order. Therefore, the surge voltage in each of the six switching elements becomes small.
  • the power conversion board 2 can prevent each of the plurality of switching elements included in the inverter 6 from failing when a surge voltage is generated.
  • the wiring connecting the first switching element 21 and the third switching element 23 is the first switching element. It is longer than the case where the 21 and the third switching element 23 are arranged next to each other.
  • the short-circuit current generated by the malfunction of the switching element becomes large when the wiring inductance component is short, that is, in a short path, and may cause the switching element to be destroyed. Therefore, the power conversion board 2 can suppress the short-circuit current flowing from the first switching element 21 to the third switching element 23.
  • the power conversion board 2 can suppress the short-circuit current flowing from the third switching element 23 to the first switching element 21.
  • the power conversion board 2 can suppress the short-circuit current flowing from the second switching element 22 to the fourth switching element 24 and the short-circuit current flowing from the fourth switching element 24 to the second switching element 22.
  • the first drive circuit 61 for driving the first switching element 21 is arranged on the substrate 12 in a state of being located not on the terminal portion 42 side of the first switching element 21 but on the body portion 41 side. There is. Similarly, each of the second drive circuit 62, the third drive circuit 63, the fourth drive circuit 64, the fifth drive circuit 65, and the sixth drive circuit 66 is not on the side of the terminal portion 42 of the switching element to be driven, but on the body portion. It is arranged on the substrate 12 in a state of being located on the side of 41. As a result, the common circuit section 69, which is a common portion between the main circuit section 67 through which the main current flows when the power is converted and the gate drive circuit section 68, becomes relatively short.
  • the power conversion board 2 has a first drive circuit 61, a second drive circuit 62, a third drive circuit 63, a fourth drive circuit 64, and a fifth drive circuit depending on the voltage generated when the current flows through the main circuit unit 67. It is possible to prevent each of the 65 and the sixth drive circuit 66 from malfunctioning.
  • the gate drive circuit unit 68 is a wiring connecting the drive circuit and the emitter terminal of the switching element driven by the drive circuit.
  • the full bridge unit 10 may have only one of a function of converting DC power into AC power and a function of converting AC power into DC power.
  • FIG. 10 is a diagram schematically showing a substrate 12A included in the power conditioner according to the second embodiment.
  • the substrate 12 of the first embodiment is replaced with the substrate 12A.
  • the difference between the second embodiment and the first embodiment is that the substrate 12 of the first embodiment is replaced with the substrate 12A.
  • the differences from the first embodiment will be mainly described.
  • FIG. 10 is an exploded perspective view of the substrate 12A.
  • the substrate 12A is a four-layer substrate having a first wiring layer 121, a second wiring layer 122, a third wiring layer 123, and a fourth wiring layer 124.
  • the first wiring layer 121, the second wiring layer 122, the third wiring layer 123, and the fourth wiring layer 124 are in the order of the first wiring layer 121, the second wiring layer 122, the third wiring layer 123, and the fourth wiring layer 124. It is piled up with.
  • the substrate 12A has a first insulating layer 125 located between the first wiring layer 121 and the second wiring layer 122, and a second insulating layer 126 located between the second wiring layer 122 and the third wiring layer 123. And a third insulating layer 127 located between the third wiring layer 123 and the fourth wiring layer 124.
  • the first switching element 21, the second switching element 22, the third switching element 23, the fourth switching element 24, the fifth switching element 25, and the sixth switching element 26 are the first wirings. It is arranged on the layer 121.
  • the first wiring layer 121 is one layer outside the substrate 12A, which is a four-layer substrate.
  • the converter 4, the smoothing capacitor 5, the first reactor 7, the second reactor 8, the first snubber capacitor 9A and the second snubber capacitor 9B are also arranged in the first wiring layer 121. ..
  • the second wiring layer 122 of the substrate 12A is a layer having a copper foil pattern other than the through hole where the wiring is located. That is, the second wiring layer 122 is a layer in which one surface of the substrate is covered with a copper film and through holes for wiring are formed. Wiring is located in the through hole. The second wiring layer 122 is one layer in the middle of the four-layer substrate. Wiring is provided in each of the third wiring layer 123 and the fourth wiring layer 124.
  • FIG. 11 is a diagram for explaining the effect obtained by the substrate 12A of the power conditioner according to the second embodiment.
  • FIG. 11 shows the first wiring layer 121, the first insulating layer 125, and the second wiring layer 122 of the substrate 12A.
  • the first wiring layer 121 is one layer outside the substrate 12A, which is a four-layer substrate
  • the second wiring layer 122 is a layer having a copper foil pattern except for the through holes.
  • the straight arrow 131 in the first wiring layer 121 of FIG. 11 schematically indicates the direction of the current flowing in a part of the wiring of the first wiring layer 121.
  • a concentric magnetic field centered on the part of the wiring is generated.
  • the circular arrow 132 in FIG. 11 indicates one magnetic field line in the magnetic field. The magnetic field becomes an inductance component of the wiring.
  • the second wiring layer 122 is a layer of a copper foil pattern
  • an eddy current 133 that generates a magnetic field that cancels the above magnetic field flows through the second wiring layer 122. That is, the eddy current 133 reduces the inductance component of the wiring provided in each of the third wiring layer 123 and the fourth wiring layer 124. That is, in the power conditioner according to the second embodiment, since the second wiring layer 122 of the substrate 12A, which is a four-layer substrate, is a layer of the copper foil pattern, each of the third wiring layer 123 and the fourth wiring layer 124 can be used. It is possible to reduce the inductance component of the provided wiring.
  • FIG. 12 is a diagram showing a processor 91 when a part or all of the control device 3 included in the power conditioner 1 according to the first embodiment is realized by the processor 91. That is, some or all of the functions of the control device 3 may be realized by the processor 91 that executes the program stored in the memory 92.
  • the processor 91 is a CPU (Central Processing Unit), a processing device, an arithmetic unit, a microprocessor, or a DSP (Digital Signal Processor).
  • the memory 92 is also shown in FIG.
  • the processor 91 When a part or all the functions of the control device 3 are realized by the processor 91, the part or all the functions are realized by the processor 91 and the software, the firmware, or the combination of the software and the firmware.
  • the software or firmware is written as a program and stored in the memory 92.
  • the processor 91 realizes a part or all the functions of the control device 3 by reading and executing the program stored in the memory 92.
  • the power conditioner 1 is a program in which some or all of the steps executed by the control device 3 are eventually executed. It has a memory 92 for storing. It can be said that the program stored in the memory 92 causes the computer to execute a part or all of the procedure or method executed by the control device 3.
  • the memory 92 is, for example, non-volatile such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), EEPROM (registered trademark) (Electrically Erasable Programmable Read-Only Memory).
  • RAM Random Access Memory
  • ROM Read Only Memory
  • flash memory EPROM (Erasable Programmable Read Only Memory)
  • EEPROM registered trademark
  • it may be a volatile semiconductor memory, a magnetic disk, a flexible disk, an optical disk, a compact disk, a mini disk, a DVD (Digital Versatile Disk), or the like.
  • FIG. 13 is a diagram showing a processing circuit 93 when a part or all of the control device 3 included in the power conditioner 1 according to the first embodiment is realized by the processing circuit 93. That is, a part or all of the control device 3 may be realized by the processing circuit 93.
  • the processing circuit 93 is dedicated hardware.
  • the processing circuit 93 is, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a combination thereof. Is.
  • a part of the control device 3 may be dedicated hardware separate from the rest.
  • some of the plurality of functions may be realized by software or firmware, and the rest of the plurality of functions may be realized by dedicated hardware.
  • the plurality of functions of the control device 3 can be realized by hardware, software, firmware, or a combination thereof.
  • the configuration shown in the above embodiments is an example, and can be combined with another known technique, can be combined with each other, and does not deviate from the gist. It is also possible to omit or change a part of the configuration.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)

Abstract

La présente invention concerne une carte de conversion de puissance (2) comprenant un condensateur de filtrage (5), une section de pont complet (10) qui a une fonction permettant de convertir la puissance d'un courant continu en puissance de courant alternatif et/ou une fonction permettant de convertir la puissance d'un courant alternatif en puissance de courant continu, une section de court-circuit (11) qui met en court-circuit la puissance du courant alternatif, et une carte (12). La section de pont complet (10) comprend un premier élément de commutation (21), un deuxième élément de commutation (22), un troisième élément de commutation (23) et un quatrième élément de commutation (24) qui forment un circuit à pont complet. La section de court-circuit (11) comprend un cinquième élément de commutation (25) et un sixième élément de commutation (26). Le premier élément de commutation (21), le deuxième élément de commutation (22), le troisième élément de commutation (23), le quatrième élément de commutation (24), le cinquième élément de commutation (25) et le sixième élément de commutation (26) sont chacun disposés sur une carte de telle sorte qu'une section terminale (42) soit disposée sur le côté du condensateur de filtrage (5) d'une section de corps (41).
PCT/JP2020/000903 2020-01-14 2020-01-14 Carte de conversion de puissance WO2021144853A1 (fr)

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PCT/JP2020/000903 WO2021144853A1 (fr) 2020-01-14 2020-01-14 Carte de conversion de puissance
JP2020531549A JP6752400B1 (ja) 2020-01-14 2020-01-14 電力変換基板

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PCT/JP2020/000903 WO2021144853A1 (fr) 2020-01-14 2020-01-14 Carte de conversion de puissance

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1127959A (ja) * 1997-07-08 1999-01-29 Toshiba Fa Syst Eng Kk インバータ装置
JP2002044964A (ja) * 2000-07-21 2002-02-08 Hitachi Ltd 半導体装置，電力変換装置及び自動車
JP2002125381A (ja) * 2000-10-13 2002-04-26 Mitsubishi Electric Corp 電力変換装置
JP2009089541A (ja) * 2007-10-01 2009-04-23 Toshiba Carrier Corp 系統連系インバータ装置
JP2013172469A (ja) * 2012-02-17 2013-09-02 Mitsubishi Electric Corp パワーモジュール及び空調装置
JP2016219715A (ja) * 2015-05-26 2016-12-22 住友ベークライト株式会社 絶縁ゲートバイポーラトランジスタ素子、樹脂組成物およびサージ対策部材
JP2017163777A (ja) * 2016-03-11 2017-09-14 オムロン株式会社 インバータ装置
JP2017168721A (ja) * 2016-03-17 2017-09-21 アルプス電気株式会社 半導体装置及び半導体装置の製造方法
WO2018186353A1 (fr) * 2017-04-05 2018-10-11 ローム株式会社 Module de puissance

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1127959A (ja) * 1997-07-08 1999-01-29 Toshiba Fa Syst Eng Kk インバータ装置
JP2002044964A (ja) * 2000-07-21 2002-02-08 Hitachi Ltd 半導体装置，電力変換装置及び自動車
JP2002125381A (ja) * 2000-10-13 2002-04-26 Mitsubishi Electric Corp 電力変換装置
JP2009089541A (ja) * 2007-10-01 2009-04-23 Toshiba Carrier Corp 系統連系インバータ装置
JP2013172469A (ja) * 2012-02-17 2013-09-02 Mitsubishi Electric Corp パワーモジュール及び空調装置
JP2016219715A (ja) * 2015-05-26 2016-12-22 住友ベークライト株式会社 絶縁ゲートバイポーラトランジスタ素子、樹脂組成物およびサージ対策部材
JP2017163777A (ja) * 2016-03-11 2017-09-14 オムロン株式会社 インバータ装置
JP2017168721A (ja) * 2016-03-17 2017-09-21 アルプス電気株式会社 半導体装置及び半導体装置の製造方法
WO2018186353A1 (fr) * 2017-04-05 2018-10-11 ローム株式会社 Module de puissance

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JPWO2021144853A1 (fr) 2021-07-22

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