WO2021139200A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2021139200A1
WO2021139200A1 PCT/CN2020/114569 CN2020114569W WO2021139200A1 WO 2021139200 A1 WO2021139200 A1 WO 2021139200A1 CN 2020114569 W CN2020114569 W CN 2020114569W WO 2021139200 A1 WO2021139200 A1 WO 2021139200A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat sink
circuit board
optical
conducting
Prior art date
Application number
PCT/CN2020/114569
Other languages
English (en)
French (fr)
Inventor
姚建伟
董本正
徐发部
于冬梅
刘飞
罗从文
慕建伟
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010018784.6A external-priority patent/CN113093349B/zh
Priority claimed from CN202010018782.7A external-priority patent/CN111061022B/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2021139200A1 publication Critical patent/WO2021139200A1/zh
Priority to US17/707,879 priority Critical patent/US20220221667A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]

Definitions

  • This application relates to the field of optical communication technology, and in particular to an optical module.
  • the optical module includes a printed circuit board (PCB), a laser, a detector, and a driver chip for driving the laser and detector on the printed circuit board.
  • PCB printed circuit board
  • Each device is soldered on the printed circuit board. On the pad. Each device generates heat during operation. If the heat cannot be quickly dissipated, the ambient temperature will continue to rise, which will affect the performance of the optical module.
  • the present application provides an optical module, including: a circuit board on which circuits are arranged; an optical chip, which is electrically connected to the circuit board, for implementing the transmission and/or reception of optical signals; and a lens assembly, Covered on the optical chip for light beam propagation; a first heat sink, one part is located below the lens assembly, and the other part is located outside the lens assembly; the optical chip is attached to the first heat sink One end of the first heat dissipation member, the first heat dissipation member can conduct the heat generated by the optical chip outside the coverage area of the lens assembly; the second heat dissipation member is attached to the first heat dissipation member and is located on the On the outside of the lens assembly, the second heat sink is used to receive and diffuse the heat conducted by the first heat sink; the third heat sink is embedded in the middle layer of the circuit board, and a part is located below the lens assembly, The other part is located on the outside of the lens assembly; the through hole penetrates the multi-layer board in the circuit board
  • an optical module includes: a circuit board on which circuits are arranged; an optical chip, which is electrically connected to the circuit board, and is used to implement the transmission and/or reception of optical signals; and a lens assembly, Covered on the optical chip for light beam propagation; a first heat sink, one part is located below the lens assembly, and the other part is located outside the lens assembly; the optical chip is attached to the first heat sink One end of the element, the first heat dissipation element can conduct the heat generated by the optical chip outside the coverage area of the lens assembly; the third heat dissipation element is embedded in the middle layer of the circuit board, and a part is located in the lens Below the assembly, another part is located on the outside of the lens assembly; the second heat sink is attached to the circuit board and is located on the outside of the lens assembly, opposite to one end of the third heat sink.
  • the second heat sink is used to receive and diffuse the heat conducted by the third heat sink; the through hole penetrates through the multilayer board in the circuit board and is filled with a thermally conductive material for heat conduction; the first heat sink The through hole is provided between the upper surface of the third heat dissipation member and the third heat dissipation member to realize heat conduction between the first heat dissipation member and the third heat dissipation member; the second heat dissipation member and the first heat dissipation member are The through hole is provided between the three heat dissipation elements to realize the heat conduction between the second heat dissipation element and the third heat dissipation element; the heat conduction element is arranged on the upper surface of the second heat dissipation element for receiving The heat conducted by the second heat dissipating element; the upper shell is thermally connected to one end of the heat conducting element, and can receive the heat conducted by the heat conducting element and dissipate it to the surrounding environment.
  • an optical module includes a circuit board on which circuits are arranged; an optical chip, which is electrically connected to the circuit board, and is used to transmit and/or receive optical signals; and a lens assembly that covers On the optical chip, it is used for the propagation of the light beam; a part of the first heat sink is located below the lens assembly and the other part is located outside the lens assembly; the optical chip is attached to the first heat sink One end of the first heat sink, the first heat sink can conduct the heat generated by the optical chip outside the coverage area of the lens assembly; the second heat sink is attached to the first heat sink and is located on the lens On the outside of the assembly, the second heat dissipation element is used to receive and diffuse the heat conducted by the first heat dissipation element; the heat conduction element is arranged on the upper surface of the second heat dissipation element and is used to receive the conduction of the second heat dissipation element
  • the upper shell which is thermally connected to one end of the heat-conduct
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal
  • Figure 2 is a schematic diagram of the optical network terminal structure
  • FIG. 3 is a schematic diagram of the overall structure of an optical module provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of the internal structure of an optical module provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of another internal structure of an optical module provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of an internal decomposition structure of an optical module provided by an embodiment of the application.
  • FIG. 8 is a schematic diagram of an exploded structure of a heat dissipation structure provided by an embodiment of the application.
  • FIG. 9 is a schematic diagram of a partial exploded structure of a heat dissipation structure provided by an embodiment of the application.
  • FIG. 10 is a cross-sectional view of a circuit board provided by an embodiment of the application.
  • FIG. 11 is a heat dissipation path diagram of a heat dissipation structure provided by an embodiment of the application.
  • FIG. 12 is a longitudinal cross-sectional view of an optical module provided by an embodiment of the application.
  • FIG. 13 is a schematic structural diagram of an integrally formed heat conducting element and an upper casing provided by an embodiment of the application;
  • FIG. 14 is a schematic structural diagram of a heat conducting element mounted on a circuit board according to an embodiment of the application.
  • 15 is a schematic diagram of the structure when the upper housing and the circuit board are connected through a heat conducting member according to an embodiment of the application;
  • FIG. 16 is a cross-sectional view of the internal structure of a circuit board provided by an embodiment of the application.
  • FIG. 17 is another longitudinal cross-sectional view of the optical module provided by the embodiment of the application.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to be transmitted in optical fibers/optical waveguides and other information transmission equipment.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can achieve low-cost and low-loss information transmission; and computers and other information processing equipment Electrical signals are used.
  • information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize mutual conversion between electrical signals and optical signals.
  • the optical module realizes the above-mentioned mutual conversion function of optical and electrical signals in the field of optical fiber communication technology, and the mutual conversion of optical signals and electrical signals is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the golden finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data signal and grounding, etc.; the electrical connection method realized by the golden finger has become the optical module.
  • the mainstream connection method of the industry based on this, the definition of the pins on the golden finger has formed a variety of industry protocols/standards.
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103.
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing equipment.
  • the connection between the local information processing equipment and the remote server is completed by the connection of the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is The optical network terminal 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is externally connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100 to establish a bidirectional electrical signal connection with the optical network terminal 100;
  • the optical module realizes the mutual conversion between optical signals and electrical signals, thereby realizing the establishment of an information connection between the optical fiber and the optical network terminal; in some embodiments of the present application, the optical signal from the optical fiber is converted into an electrical signal by the optical module It is input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.
  • the optical module 200 is a tool for realizing the mutual conversion of photoelectric signals and does not have the function of processing data. In the foregoing photoelectric conversion process, the information only changes in the transmission carrier, and the information does not change.
  • the optical network terminal has an optical module interface 102, which is used to connect to the optical module 200 and establish a two-way electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used to connect to the network cable 103 and establish a two-way electrical connection with the network cable 103. Signal connection; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100.
  • the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical Module, the optical network terminal is used as the upper computer of the optical module to monitor the work of the optical module. Unlike optical modules, optical network terminals have certain information processing capabilities.
  • the remote server establishes a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the upper computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module.
  • the common optical module upper computer also has optical lines Terminal and so on.
  • FIG 2 is a schematic diagram of the optical network terminal structure.
  • the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for accessing optical module electrical ports such as golden fingers; A heat sink 107 is provided on the cage 106, and the heat sink 107 has protrusions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network terminal. Specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
  • the cage 106 is located on the circuit board 105, and the electrical connectors on the circuit board 105 are wrapped in the cage 106; the optical module 200 is inserted into the cage 106, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then The diffusion is carried out through the radiator 107 on the cage 106.
  • FIG. 3 is a schematic diagram of the overall structure of an optical module provided by an embodiment of this application
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of this application
  • FIG. 5 is a schematic diagram of the internal structure of an optical module provided by an embodiment of this application.
  • the optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, a lens assembly 401, an optical chip 406, and an optical fiber ribbon. 403.
  • the upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square shape.
  • the lower shell 202 includes a main board And two side plates located on both sides of the main board and perpendicular to the main board;
  • the upper casing 201 includes a cover plate, which covers the two side plates of the upper casing 201 to form a wrapping cavity;
  • the upper casing 201 It may also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize the upper shell covering the lower shell 202.
  • the two openings can be two openings in opposite directions, or two openings in other different directions; the openings 204 and 205 in FIG. 3 are two openings in opposite directions, where the opening 204 is an electrical port, and the circuit board 300
  • the golden finger of the ” is extended from the electrical port 204 and inserted into the upper computer such as an optical network terminal; the other opening 205 is an optical port for external optical fiber access to connect the optical transceiver device 400 inside the optical module; the circuit board 300, optical transceiver Optoelectronic devices such as the device 400 are located in the package cavity.
  • the optical transceiver device 400 includes a lens assembly 401, an optical chip 406, and an optical fiber ribbon 403.
  • the upper housing 201 and the lower housing 202 are combined to facilitate the installation of the circuit board 300, the optical transceiver device 400 and other components in the housing.
  • the upper housing 201 and the lower housing 202 form the outermost layer of the optical module.
  • Encapsulation and protection shell; the upper shell 201 and the lower shell 202 are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; generally, the shell of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning Components, heat dissipation and electromagnetic shielding components cannot be installed, and it is not conducive to production automation.
  • the unlocking component 203 is located on the outer wall of the lower housing 202 in the wrapping cavity, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
  • the unlocking part 203 has an engaging part that matches the cage of the upper computer; pulling the end of the unlocking part can move the unlocking part on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed by the engaging part of the unlocking part In the cage of the host computer; by pulling the unlocking part, the locking part of the unlocking part moves accordingly, and then the connection relationship between the locking part and the host computer is changed to release the optical module and the host computer. The module is withdrawn from the cage of the host computer.
  • the circuit board 300 is provided with circuit wiring, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as MCUs, laser drive chips, limiting amplification chips, clock data recovery CDR, power management chips, and data processing chips) DSP) and so on.
  • the circuit board 300 connects the electrical components in the optical module according to the circuit design through circuit wiring to achieve electrical functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the carrying function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver 400 is located on the circuit board 300, the rigid circuit board It can also provide a stable load; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • a metal pin/gold finger is formed on one end surface of the rigid circuit board, Used to connect with electrical connectors; these are not easy to implement with flexible circuit boards.
  • Some optical modules also use flexible circuit boards as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards, for example, flexible circuit boards can be used to connect between rigid circuit boards and optical transceiver devices.
  • 400G optical modules have been adopted in the field to transmit and receive light of different wavelengths.
  • the optical module may adopt a photoelectric conversion device with the characteristics of dual-fiber bidirectional optical signal transmission.
  • FIG. 6 is a schematic diagram of another internal structure of an optical module provided by an embodiment of the application.
  • the optical transceiver device 400 includes a lens assembly 401, an optical fiber ribbon 403, an optical interface 405 and an optical chip 406.
  • the optical chip 406 includes a laser and a laser driving chip, or a detector and a detector driving chip, or any one of a laser, a laser driving chip, a detector and a detector driving chip.
  • the two driving chips are electrically connected to the signal circuit of the circuit board 300.
  • the laser driving chip drives the laser to generate optical signals and propagates into the optical fiber ribbon through the lens assembly, and the detector driving chip drives the detector to receive the optical signals from the optical fiber ribbon.
  • the lens assembly 401 is covered above the optical chip 406, and the lens assembly 401 is used for light beam propagation, such as light collimation and convergence.
  • the lens assembly 401 is connected to the optical interface 405 through the optical fiber ribbon 403.
  • the optical signal emitted by the laser in the optical chip 406 is collimated and converged by the lens assembly 401, and then emitted through the optical fiber ribbon 403; in the light receiving process, The optical signal generated by the optical interface 405 propagates into the optical fiber ribbon 403 and is received by the detector in the optical chip 406.
  • multiple groups of optical transceivers can also be set in the optical module, that is, one group of optical transceivers, two groups of optical transceivers, or three groups of optical transceivers.
  • the arrangement of a group of optical transceivers is the same or similar. Taking two sets of optical transceivers as an example, the first set of optical transceivers consisting of a lens assembly 401, an optical fiber ribbon 403, and an optical chip 406, and a second lens assembly 402, a second optical fiber ribbon 404, and a second optical chip 407 are included.
  • the second group of optical transceivers is formed, as shown in FIG. 5 and FIG. 6.
  • the second optical chip 407 is electrically connected to the signal circuit of the circuit board 300 to realize optical signal reception and emission.
  • the second lens assembly 402 is connected to the optical interface 405 through the second optical fiber ribbon 404.
  • the optical signal emitted by the second optical chip 407 is collimated and converged by the second lens assembly 402, and then emitted through the second optical fiber ribbon 404
  • the optical signal generated by the optical interface 405 propagates into the second optical fiber ribbon 404, and then is received by the second optical chip 407.
  • the optical chips in each group of optical transceivers can be equipped with detectors, detector drive chips, laser drive chips and lasers at the same time, or only detectors and detector drive chips can be set, or only The setting of the laser driving chip and the laser depends on the actual application, which is not specifically limited in this embodiment.
  • the embodiment of the present application adopts the heat dissipation structure 500 and the heat conducting member 600 to conduct the heat generated by the optical chip to the upper housing 201 through the surface of the circuit board 300. It can receive the heat conducted by the heat conducting member 600 and radiate it to the surrounding environment.
  • the heat dissipation principle of the multiple sets of optical transceiver devices is the same as the heat dissipation principle provided in the embodiment of the present application, and will not be repeated here. And only take the laser heat dissipation as an example to illustrate, but the solution for the heat dissipation of the detector, as well as the solution for the heat dissipation of the laser, the laser drive chip, the detector and the detector drive chip at the same time, can refer to the solution for the heat dissipation of the laser. Go into details again.
  • FIG. 7 is a schematic diagram of the internal exploded structure of an optical module provided by an embodiment of this application
  • FIG. 8 is a schematic diagram of an exploded structure of a heat dissipation structure provided by an embodiment of this application
  • FIG. 9 is a schematic diagram of a partial exploded structure of the heat dissipation structure provided by an embodiment of this application
  • FIG. 10 is a cross-sectional view of a circuit board provided by an embodiment of the application.
  • the heat dissipation structure 500 provided by the embodiment of the present application includes a first heat dissipation member 501, a second heat dissipation member 502, and a third heat dissipation member 503.
  • the first heat sink 501 In order to make one end of the first heat sink 501 extend beyond the coverage area of the lens assembly 401, so that the heat generated by the optical chip under the lens assembly 401 diffuses outside the coverage area of the lens assembly 401, the first heat sink 501 is arranged in the circuit On the board 300, the first heat sink 501 can be attached to the surface of the circuit board 300 along the length direction of the circuit board 300, or can be built into the circuit board 300.
  • the first heat sink 501 is used to diffuse the heat generated by the optical chip 406 out of the coverage area of the lens assembly 401 along the circuit board 300, that is, diffuse the heat generated by the laser out of the coverage area of the lens assembly 401 along the circuit board 300.
  • the first heat dissipation member 501 can be made of a material with a heat conduction effect, such as a copper layer or a copper block, or other materials, which is not specifically limited in this embodiment.
  • the first heat sink 501 is mounted on the surface of the circuit board 300.
  • the copper layer can be attached to the surface of the circuit board 300, and a layer of copper skin is formed on the surface of the circuit board 300, with a thickness of about 20 microns.
  • the heat generated by the laser diffuses along the copper skin, so that the heat is diffused from the surface of the circuit board 300 to outside the coverage area of the lens assembly 401.
  • the first heat sink 502 is embedded in the circuit board 300, and the surface of the first heat sink 501 is exposed on the surface of the circuit board 300.
  • the circuit board 300 is provided with a through hole penetrating the surface, the first heat dissipation member 501 is embedded in the through hole, the upper surface of the first heat dissipation member 501 is exposed on the upper surface of the circuit board 300, and the lower surface of the first heat dissipation member 501 is exposed on the The lower surface of the circuit board 300.
  • the copper block can be built into the circuit board 300, that is, a groove or digging through the thickness direction of the circuit board 300 is used, and the copper block is built into the groove so that the copper block
  • the upper surface of the copper block is exposed on the surface of the circuit board 300; if the upper and lower surfaces of the circuit board 300 are dug out, at this time, the first heat sink 501 of the copper block structure penetrates the circuit board 300, and the upper and lower surfaces of the copper block must be exposed respectively On the upper and lower surfaces of the circuit board 300, heat can be dissipated along the lower surface of the circuit board at the same time.
  • the lower surface of the copper block When the upper surface of the copper block is exposed, part of the heat generated by the laser diffuses along the upper surface of the copper block, and the other part of the heat diffuses downwards along the copper block.
  • the lower surface of the copper block also exposes the lower surface of the circuit board 300, and the lower surface of the circuit board 300
  • the surface is thermally connected to the lower housing 202 of the optical module, so that the downwardly conducted heat can be transferred to the lower housing 202 again, and then the lower housing 202 realizes heat dissipation.
  • the optical chip 406 is attached to the first heat sink 501.
  • the optical chip 406 can be all attached to the first heat sink 501, or only the part that generates a large amount of heat can be attached to the first heat sink 501.
  • On the heat sink 501 only the laser and the detector that can generate a large amount of heat are attached to the first heat sink 501, and the laser drive chip and the detector drive chip are attached to the circuit board 300.
  • the other end of the first heat sink 501 extends out of the coverage area of the lens assembly 401, and the coverage area of the lens assembly 401 is as The area shown by the dashed frame in part A in Fig. 7 and Fig. 8.
  • the coverage area of the first heat sink 501 on the circuit board 300 exceeds the coverage area of the lens assembly 401 on the circuit board 300.
  • the heat diffuses along the first heat sink 501 ,
  • the diffusion direction is from right to left (the state shown in FIG. 7), so that heat is diffused from the bottom of the lens assembly 401 to the outside of the lens assembly 401, and the first heat sink 501 is used to conduct the heat generated by the optical chip 406 to the lens assembly Outside the coverage area of 401, for example, heat generated by the laser is conducted to outside the coverage area of the lens assembly 401.
  • the end of the first heat sink 501 where the optical chip 406 is attached is located under the lens assembly 401, that is, the end where the laser is attached is located Below the lens assembly 401, the other end of the first heat sink 501 is far away from the lens assembly 401, so that the heat under the lens assembly 401 can be diffused along the first heat sink 501 to the outside of the coverage area of the lens assembly 401 to facilitate heat dissipation.
  • An optical chip 406 is attached to one end of the first heat sink 501, and a lens assembly 401 is covered above the optical chip 406, that is, a laser is attached to one end of the first heat sink 501, and a lens assembly is covered above the laser 401, and the lens assembly 401 is connected to the optical fiber ribbon 403, so that the first heat sink 501 is located below the optical fiber ribbon 403.
  • the optical fiber ribbon 403 is located between the upper housing 201 and the first heat sink 501, and between the upper housing 201 and the first heat sink 501 A heat-conducting member 600 is also provided, so that a positional conflict between the heat-conducting member 600 and the optical fiber ribbon 403 occurs. It can be seen that the optical fiber ribbon 403 will affect the heat dissipation path of the heat conducting element 600.
  • the heat diffused to the end of the first heat sink 501 away from the lens assembly 401 needs to be guided to a relatively large area on both sides of the optical fiber ribbon 403. Therefore, in order to improve the heat dissipation efficiency, the second heat dissipation member 502 is used in this embodiment to realize heat dissipation in a direction avoiding the optical fiber ribbon 403.
  • the second heat sink 502 is located outside the lens assembly 401 and is attached to the end of the first heat sink 501 away from the lens assembly 401 for receiving the heat conducted by the first heat sink 501 and directing the heat to the circuit board 200 Conduction on both sides.
  • the second heat dissipation member 502 may be perpendicular to the first heat dissipation member 501, or not perpendicular to the first heat dissipation member 501, so as to realize heat diffusion to both sides of the optical fiber ribbon 403, so that the second heat dissipation member 502 can absorb the heat received Conduction to both sides of the optical fiber ribbon 403, that is, conduction to both sides of the circuit board 300, and conduction along the width direction of the circuit board 300.
  • FIG. 11 is a heat dissipation path diagram of a heat dissipation structure provided by an embodiment of the application.
  • the second heat dissipation member 502 in order to conduct heat toward the two sides of the optical fiber ribbon 403, the second heat dissipation member 502 is not only attached to the first heat dissipation member 501, but needs to extend to both sides of the optical fiber ribbon 403.
  • the middle part of the second heat sink 502 is attached to the end of the first heat sink 501 away from the lens assembly 401, and the two ends of the second heat sink 502 are perpendicular to the first heat sink 501.
  • the length direction extends toward both sides of the circuit board 300, so that the second heat dissipation member 502 is perpendicular to the first heat dissipation member 501, that is, the second heat dissipation member 502 and the first heat dissipation member 501 are in a T-shaped structure, and the middle of the second heat dissipation member 502
  • the part is used to receive the heat conducted by the first heat dissipating member 501, and diffuse it toward both ends along the length direction.
  • the heat generated by the laser diffuses from one end of the first heat sink 501 to the other end, and this end is vertically attached to the second heat sink 502, so that the heat flows from the middle part of the second heat sink 502. Diffusion to both ends to increase the cross-sectional area of heat transfer and accelerate the diffusion of heat.
  • the second heat dissipation member 502 can be made of high thermal conductivity materials such as ceramic plates (ALN), copper foil, and carbon fiber materials.
  • the optical module provided by the embodiment of the present application diffuses the heat generated by the laser along the surface of the circuit board 300 and is discharged through the upper housing 201 when heat dissipation is realized.
  • the second heat sink 502 is located on the circuit board 300 and is separated from the upper casing 201 by a certain distance. Therefore, in order to realize the heat conduction between the second heat dissipation element 502 and the upper casing 201, in this embodiment, the heat conduction element 600 is used to conduct the heat conducted by the second heat dissipation element 502 to the upper casing 201 again, and then the upper casing 201 Export.
  • FIG. 12 is a longitudinal cross-sectional view of an optical module provided by an embodiment of the application.
  • the path shown by the arrow in FIG. 12 is a path through which heat is conducted from the second heat dissipating member 502 to the heat conducting member 600, and then to the upper housing 201.
  • the heat-conducting element 600 is disposed on the upper surface of the second heat-dissipating element 502 and is used to receive the heat conducted by the second heat-dissipating element 502 and conduct the heat away from the circuit board 300.
  • the upper shell 201 is connected to one end of the heat conducting element 600 for receiving and dissipating the heat conducted by the heat conducting element 600.
  • the heat-conducting member 600 is connected between the second heat-dissipating member 502 and the upper casing 201, and not only functions to conduct heat, but also functions to support the upper casing 201.
  • the heat-conducting member 600 can conduct the heat located at the circuit board 300 to the upper housing 201, which is the main heat dissipation surface of the optical module, and has a better heat dissipation effect.
  • the heat-conducting element 600 is made into a rigid structure.
  • the circuit board 300 also has a rigid structure.
  • the second heat dissipation member 502 is laid on the circuit board 300. When the heat conduction member 600 and the second heat dissipation member 502 are in contact, the rigid structure and the rigid structure are in contact with each other, which may easily cause the heat conduction member 600 or The second heat dissipation member 502 is worn out.
  • a heat-conducting adhesive layer 700 is provided between the two to achieve soft contact between the heat-conducting element 600 and the second heat-dissipating element 502.
  • the thermal conductive adhesive layer 700 is located at both ends of the second heat dissipation member 502 and between the second heat dissipation member 502 and the heat conduction member 600 to increase the heat conduction efficiency.
  • the thermal conductive adhesive layer 700 can be a thermal conductive adhesive, and the thermal conductive adhesive has a good thermal conductivity effect. Connecting the second heat dissipating member 502 and the heat conductive member 600 through the thermal conductive adhesive can not only prevent the second heat dissipating member 502 or the heat conductive member 600 from being worn out, but also Can improve the heat conduction efficiency.
  • the structure of the thermally conductive adhesive layer 700 is determined by the structure of the thermally conductive element 600. If the thermally conductive element 600 is in full contact with the second heat sink 502, only one thermally conductive adhesive layer 700 can be provided to cover the entire surface of the second heat sink 502; If the heat-conducting element 600 is only in contact with the two ends of the second heat-dissipating element 502, two heat-conducting adhesive layers 700 can be provided to cover the two ends of the second heat-dissipating element 502, respectively, so that the second heat-dissipating element 502 and the heat-conducting element 600 are connected connection.
  • the first heat sink 501 and the second heat sink 502 are used to diffuse the heat generated by the optical chip 406, such as a laser, from the bottom of the lens assembly 401 to the outside of the coverage area of the lens assembly 401, and spread to avoid At the position of the optical fiber ribbon 403, the diffused heat is then transferred to the upper housing 201 by the heat conducting member 600, and the upper housing 201 realizes heat dissipation.
  • the heat-conducting member 600 can be individually designed to be pasted or mounted on the circuit board 300, and can also be integrally formed with the upper housing 201 to simplify the structure of the optical module.
  • the heat-conducting element 600 in the two solutions may adopt the same structure or different.
  • FIG. 13 is a schematic structural diagram of the heat conducting element provided by an embodiment of the application and the upper shell integrally formed;
  • FIG. 14 is a schematic structural diagram of the heat conducting element provided by the embodiment of the application mounted on a circuit board;
  • FIG. 15 is a schematic diagram of the upper housing provided by the embodiment of the application A schematic diagram of the structure when the housing and the circuit board are connected through a heat-conducting element.
  • the heat conducting element 600 and the upper housing 201 are integrally formed.
  • the heat-conducting element 600 is arranged at a position of the upper housing 201 corresponding to the second heat-dissipating element 502, so that after the heat-conducting element 600 and the upper housing 201 are integrally formed, one end of the heat-conducting element 600 can be connected to the upper surface of the second heat-dissipating element 502, The heat transferred by the second heat dissipating element 502 is again conducted to the upper housing 201 via the heat conducting element 600 and is discharged from the upper housing 201.
  • the thermal conductive member 600 when the thermal conductive member 600 is separately designed and installed on the circuit board 300, in order to allow the optical fiber ribbon 403 to pass through, the thermal conductive member 600 is provided with a gap.
  • the heat conducting member 600 includes: a first heat conducting pillar 601, a second heat conducting pillar 602, and a heat conducting part 603.
  • the thermal conductive member 600 needs to reserve an area for the optical fiber ribbon 403 to pass through, that is, a gap is formed between the first heat conduction column 601 and the second heat conduction column 602, and the heat conduction part 603 realizes the avoidance of the optical fiber ribbon 403.
  • the heat-conducting element 600 may adopt a concave-shaped structure, that is, the first heat-conducting pillar 601, the heat conducting portion 603, and the second heat-conducting pillar 602 are sequentially connected to form a concave-shaped structure.
  • the first heat-conducting pillar 601 and the second heat-conducting pillar 602 are located at the two ends of the heat conducting portion 603, so that a reserved gap is formed between the first heat-conducting pillar 601 and the second heat-conducting pillar 602 to avoid the optical fiber ribbon 403.
  • the first heat-conducting column 601 is used to connect one end of the second heat sink 502 to the upper housing 201
  • the second heat-conducting column 602 is used to connect the other end of the second heat sink 502 to the upper housing 201.
  • first heat conduction pillar 601 and the second heat conduction pillar 602 are only in contact with one end of the second heat dissipation element 502, that is, heat is only conducted from one end of the second heat dissipation element 502 to the first heat conduction pillar 601 or the second heat conduction pillar 601. ⁇ 602 ⁇ Post 602.
  • the heat conduction part 503 is used to realize the first heat conduction pillar 601 and the second heat conduction The connection of the pillars 602 enables the heat of the second heat dissipation member 502 to be transferred to the first heat conduction pillar 601 and the second heat conduction pillar 602 through the heat conduction part 503.
  • the heat conducting portion 603 is connected to the middle part of the second heat sink 502, and is used for receiving the heat conducted by the middle part of the second heat sink 502 and spreading the heat to both ends.
  • the heat conducting part 603 at the middle part is used to avoid the optical fiber ribbon 403, and to receive the heat from the middle part of the second heat sink 502, and divide the heat into two parts, one part diffuses to the first heat conducting column 601, and the other part to the first heat conduction column 601.
  • the two heat conducting pillars 602 are diffused. This makes it possible to use the first heat conducting column 601 and the second heat conducting column 602 to conduct all the heat diffused by the second heat sink 502 to the upper housing 201.
  • the first heat conducting column 601 is connected to one end of the heat conducting part 603 to receive the heat transferred by the heat conducting part 603.
  • the bottom surface of the first heat-conducting pillar 601 is attached to one end of the second heat-dissipating element 502 to receive the heat diffused to the end of the second heat-dissipating element 502; the top surface of the first heat-conducting pillar 601 is connected to the upper housing 201 to receive
  • the heat conducted by the heat conduction portion 603 and the heat conducted by one end of the second heat dissipation member 502 are again conducted to the upper casing 201, and the heat is discharged through the upper casing 201.
  • the second heat-conducting column 602 is connected to the other end of the heat-conducting part 603 to receive the heat transferred by the heat-conducting part 603.
  • the bottom surface of the second heat conduction column 602 is attached to the other end of the second heat dissipation member 502 to receive the heat diffused to the end of the second heat dissipation member 502;
  • the top surface of the second heat conduction column 602 is connected to the upper housing 201 to receive
  • the heat conducted by the heat conduction portion 603 and the heat conducted by the other end of the second heat sink 502 are again conducted to the upper casing 201, and the heat is discharged through the upper casing 201.
  • the heat-conducting member 600 may include a heat-conducting part 603 and a first heat-conducting pillar 601, and the heat-conducting part 603 and the first heat-conducting pillar 601 are vertically connected to form an L-shaped structure.
  • One end of the first heat conduction column 601 can be thermally connected to the heat conduction part 603, and the first heat conduction post 601 can also extend upward at one end of the heat conduction part 603 to form an L-shaped structure.
  • the heat conducting member 600 is provided with two sets of L-shaped structures, which are respectively located at two ends of the second heat dissipation member 502, and the two sets of L-shaped structures are symmetrically arranged in the vertical direction.
  • the two sets of L-shaped structures can be in contact or not, and the contact part is the corresponding heat conducting part 603.
  • the heat dissipation process of the heat conduction member 603 in this embodiment can refer to the heat dissipation process of the heat conduction member 603 provided in the foregoing embodiment, which is not repeated here.
  • a first heat sink 501 is provided on the surface of the circuit board 300.
  • the laser is attached to one end of the first heat sink 501 and is located under the lens assembly 401, and the other end is located outside the coverage area of the lens assembly 401 to diffuse the heat generated by the laser through one end to the other end, and this end is connected to each other.
  • the vertical second heat dissipation member 502 is used to increase the diffusion area of heat.
  • the second heat dissipation member 502 is connected to the upper housing 201 through the heat-conducting member 600.
  • the second heat-dissipating member 502 can conduct the heat diffused from the first heat dissipation member 501 to the upper housing via the heat-conducting member 600, and the upper housing 201 dissipates the heat , The heat dissipation effect is better.
  • the optical module provided by the embodiment of the present application can also adopt the solution of the lower housing 202 for heat dissipation. That is, on the basis of the structure of the optical module provided in the foregoing embodiment, the heat is transferred from the optical module at the same time.
  • the upper casing 201 and the lower casing 202 dissipate heat.
  • the first heat sink 501 and the second heat sink 502 are attached to the circuit board 300 based on the foregoing embodiment.
  • the third heat sink 503 can be embedded.
  • the first heat sink 501 and the second heat sink 502 are attached to the circuit board 300, and the third heat sink 503 is built in between the multilayer boards of the circuit board 300. None of the surfaces are exposed on the upper and lower surfaces of the circuit board 300.
  • the circuit board 300 is formed of multiple multilayer boards.
  • the thickness of the third heat sink 503 can occupy the middle layers of the circuit board 300.
  • the circuit board 300 includes 8 multilayer boards, from one side surface to the other side surface. Respectively numbered "one, two...seven, eight", the third heat sink 503 occupies three to six layers in the middle, and the first to second and seventh to eighth layers can be used to arrange circuits.
  • the third heat sink 503 is made of copper material, for example, a copper block.
  • the first heat dissipation member 501 adopts a solution with a copper layer structure.
  • the third heat sink 503 is built in the circuit board 300, one part is located below the lens assembly 401, and the other part is located outside the lens assembly 401.
  • the third heat sink 503 can realize heat conduction from one side surface of the circuit board 300 to the other side surface.
  • the coverage area of the third heat sink 503 is the same as the first heat sink 501 attached to the surface of the circuit board 300 provided in the previous embodiment.
  • the coverage area is the same or similar, and both extend from one end of the optical chip 406 to outside the coverage area of the lens assembly 401.
  • the cross-sectional area of the first heat dissipation member 501 and the third heat dissipation member 503 may be the same or different, and may be determined according to specific usage conditions.
  • the position of the third heat sink 503 is opposite to the position of the first heat sink 501, that is, one end of the third heat sink 503 It is located below one end of the first heat sink 501 where the laser is attached, and the other end of the third heat sink 503 is located below the second heat sink 502.
  • the heat dissipation rate is relatively low, and the third heat sink 503 occupies the middle layers of the circuit board 300, so that the third heat sink 503 does not directly contact the first heat sink 501,
  • the third heat dissipation member 503 cannot absorb the heat generated by the optical chip 406 conducted by the first heat dissipation member 501.
  • a plurality of through holes 504 are opened in the circuit board 300 between the third heat sink 503, and the through holes 504 realize that the heat generated by the laser is transferred from the first heat sink 501 to the second heat sink 503.
  • the three heat sinks 503 are turned on, so that the heat generated by the laser is conducted from the first heat sink 501 to one surface of the circuit board 300 and can be absorbed by the third heat sink 503.
  • the third heat dissipation member 503 with a copper block structure is used for heat dissipation, which can improve the heat dissipation efficiency.
  • the through hole 504 penetrates the multilayer board of the circuit board 300 and is filled with a thermally conductive material for heat conduction.
  • the thermally conductive material includes thermally conductive ceramics, aluminum foil, or carbon fiber materials.
  • the through holes 504 may be provided on the first to second layers, or the seventh to eighth layers of the circuit board 300.
  • FIG. 16 is a cross-sectional view of the internal structure of the circuit board provided by the embodiment of the application;
  • FIG. 17 is another longitudinal cross-sectional view of the optical module provided by the embodiment of the application. 16 and 17, a through hole 504 is provided between the position of the third heat sink 503 and the corresponding circuit board 300.
  • the through hole 504 is located in the circuit board 300 and is connected to the upper surface of the third heat sink 503 and the circuit Between one side surface of the board 300, the third heat dissipation member 503 and the first heat dissipation member 501 are thermally connected through the through holes 504, so that the third heat dissipation member 503 and the first heat dissipation member 501 realize heat conduction, that is, the first heat dissipation
  • the part 501 conducts the heat generated by the laser to the third heat dissipation part 503 through the through hole 504, and then the third heat dissipation part 503 spreads the heat laterally from the end under the laser to outside the coverage area of the lens assembly 401, and the third heat dissipation
  • the component 503 transfers the heat back to the first heat dissipation component 501 through the through hole 504, and the first heat dissipation component 501 conducts the heat to the second heat dissipation component 502, and finally achieves heat dissi
  • the third heat dissipating element 503 is provided to improve the efficiency of conduction from the first heat dissipating element 501 to the second heat dissipating element 502.
  • the heat dissipation path is to absorb the heat generated by the laser by one end of the first heat dissipating element 501, and then part of the heat is passed through
  • the through hole 504 is conducted to the third heat dissipating member 503, and the third heat dissipating member 503 conducts this part of the heat laterally to the end close to the second heat dissipating member 502, and then conducts the heat to the first heat dissipating member through the through hole 504 from this end 501:
  • the first heat sink 501 transmits the received heat generated by the laser and the heat conducted from the third heat sink 503 to the second heat sink 502 together.
  • the through holes 504 are provided in all areas corresponding to the third heat sink 503 and the first heat sink 501, and all areas include the corresponding circuit board between the upper surface of the third heat sink 503 and the first heat sink 501 In the area of 300, at this time, the first heat dissipation element 501 and the third heat dissipation element 503 are thermally connected through the through hole 504, but the third heat dissipation element 503 and the second heat dissipation element 502 are not directly thermally connected.
  • the through hole 504 may also be provided in the end area of the third heat sink 503 corresponding to the first heat sink 501, the end area including the area of the circuit board 300 corresponding to the optical chip 406, and, The area of the circuit board 300 corresponding to a heat sink 501 and the second heat sink 502.
  • the second heat sink 502 and the third heat sink 503 are thermally connected through the through hole 504, and the third heat sink 503 can connect the first heat sink 503
  • the heat conducted by 501 is directly conducted to the second heat dissipation element 502.
  • the through holes 504 are provided in all areas, and the circuit board 300 between the first heat sink 501 and the third heat sink 503 is evenly distributed with a plurality of through holes 504.
  • the heat generated by the laser is first conducted to the first heat dissipating member 501, and the first heat dissipating member 501 conducts a part of the heat downward through the through hole 504 located under the laser, and then conducts to the third heat dissipating member 503.
  • the first heat dissipation member 501 diffuses another part of the heat along the surface of the first heat dissipation member 501 to outside the coverage area of the lens assembly 401, that is, to a position where it contacts the second heat dissipation member 502.
  • the heat diffused along the surface of the first heat dissipating member 501 can also be diffused to the second heat dissipating member 502 through the through holes 504 passing along the way to realize the heat conduction between the first heat dissipating member 501 and the third heat dissipating member 503.
  • the first heat dissipation member 501 can realize heat conduction in two directions, and the two conduction directions are perpendicular to each other.
  • the third heat dissipation member 503 can receive the heat diffused from the end of the first heat dissipation member 501 through the through hole 504, and can also receive the heat diffused from the middle portion of the first heat dissipation member 501.
  • the third heat sink 503 conducts the received heat laterally to an end located below the second heat sink 502, and conducts it again to the end of the first heat sink 501 close to the second heat sink 502 through the corresponding through hole 504, and the second heat sink 502
  • a heat dissipation element 501 conducts the total heat to the second heat dissipation element 502, and then the second heat dissipation element 502 conducts the heat to the heat conduction element 600, and finally leads out through the upper housing 201, which has high heat dissipation efficiency. It can be seen that at the corresponding positions of the second heat dissipating member 502 and the third heat dissipating member 503, the two can realize the bidirectional heat conduction through the through hole 504.
  • the through holes 504 are provided in the end area, and a plurality of through holes 504 are evenly distributed on the circuit board 300 between the corresponding first heat sink 501 and the third heat sink 503 under the laser. A plurality of through holes 504 are evenly distributed on the circuit board 300 corresponding to the positions where the heat sink 501 and the second heat sink 502 are attached. At this time, the through holes 504 are located at both ends of the third heat sink 503.
  • the heat generated by the laser is first conducted to the first heat dissipating member 501, and the first heat dissipating member 501 conducts a part of the heat downward through the through hole 504 located under the laser, and then conducts to the third heat dissipating member 503.
  • the first heat dissipation member 501 diffuses another part of the heat along the surface of the first heat dissipation member 501 to outside the coverage area of the lens assembly 401, that is, to a position where it contacts the second heat dissipation member 502.
  • the first heat sink 501 can conduct a small part of the heat downward through the through holes 504 in this area, conduct it to the third heat sink 503, and transfer another small part of the heat. It is diffused to the second heat dissipating element 502, and then conducted to the upper casing 201 through the heat conducting element 600, and then exported.
  • the first heat dissipation member 501 can realize heat conduction in two directions, and the two conduction directions are perpendicular to each other.
  • the third heat dissipation member 503 can receive heat diffused from the two ends of the first heat dissipation member 501 through the through holes 504, and at the same time, the third heat dissipation member 503 conducts the received heat laterally to an end located below the second heat dissipation member 502 , And conducted to the second heat dissipating member 502 through the corresponding through hole 504, and then the second heat dissipating member 502 conducts the heat to the heat conducting member 600, and finally is discharged through the upper housing 201, which has high heat dissipation efficiency. It can be seen that at the corresponding positions of the second heat dissipating member 502 and the third heat dissipating member 503, the two can realize the bidirectional heat conduction through the through hole 504.
  • a fourth heat sink is attached to the surface of the circuit board 300 corresponding to the lower surface of the third heat sink 503 (Not shown in the figure), the fourth heat sink and the first heat sink are respectively attached to the opposite sides of the circuit board 300, the fourth heat sink may have the same structure as the third heat sink, and both use copper or embedded Copper block structure.
  • the fourth heat sink is thermally connected to the lower housing 202 of the optical module; a through hole 504 is provided between the fourth heat sink and the lower surface of the third heat sink 503, and the through hole 504 is used to receive the heat conducted by the third heat sink 503, And conduct the heat to the lower housing 202 through the fourth heat dissipation member.
  • the through hole 504 between the first heat dissipation member 501 and the third heat dissipation member 503 is provided in the first to second layer of the circuit board 300
  • the through hole between the third heat dissipation member 503 and the fourth heat dissipation member 504 is arranged in the seven to eight layers of the circuit board 300.
  • the heat generated by the laser is conducted to the third heat sink 503 through the first heat sink 501 and the through hole 504 (the through hole between the first heat sink 501 and the third heat sink 503), and the third heat sink 503 continues to transfer the heat to
  • the bottom conduction is conducted to the fourth heat sink through the through hole 504 (the through hole between the fourth heat sink and the third heat sink 503) located on the lower surface of the third heat sink 503, and then the fourth heat sink is conducted to the bottom
  • the upper shell 202 is led out from the lower shell 202.
  • the optical module provided in this embodiment can realize the export of heat generated by the laser through the upper housing 201 and the lower housing 202 at the same time, and the heat dissipation efficiency is higher.
  • the first heat sink 501 and the fourth heat sink may be installed on the surface of the circuit board 300.
  • the copper skin may also be a copper block embedded in the circuit board 300.
  • a groove is provided on one side of the circuit board 300, that is, grooves are provided on the first to second layers of the circuit board 300, or grooves are provided on the seventh to eighth layers .
  • the copper block is located in the groove, and the upper surface of the copper block is exposed on the surface of the circuit board 300.
  • a thermally conductive adhesive layer 700 is provided between the circuit board 300 and the lower casing 202.
  • the structure and material of the thermally conductive adhesive layer 700 in this embodiment can be the same as those in the previous embodiment, and will not be repeated here.
  • the structure of the optical module provided in this embodiment is different from the optical module provided in the previous embodiment in that the first heat sink 501 and the second heat sink 503 are not bonded together, but the first heat sink 501 and the second heat sink 503 are not bonded together.
  • the second heat dissipation element 502 and the third heat dissipation element 503 are thermally connected through the through hole 504.
  • the second heat sink 502 is attached to the circuit board 300 and is located outside the lens assembly 401, opposite to one end of the third heat sink 503.
  • the second heat sink 502 is used to receive and diffuse the heat conducted by the third heat sink.
  • the coverage area of the third heat sink 503 exceeds the coverage area of the first heat sink 501. Since the first heat sink 501 is not in contact with the second heat sink 502, the function of the first heat sink 501 is to reduce The heat generated by the laser attached to it diffuses outside the coverage area of the lens assembly 401, and then conducts the heat through the through hole 504 to the third heat sink 503 located in the middle layer of the circuit board 300, and the third heat sink 503 will The heat spreads rapidly.
  • the third heat sink 503 spreads the received heat conducted from the first heat sink 501 laterally and conducts it below the position of the second heat sink 502.
  • a through hole 504 is provided between the second heat sink 502 and the third heat sink 503 .
  • the heat conduction between the second heat sink 502 and the third heat sink 503 is realized by the through hole between the second heat sink 502 and the third heat sink 503.
  • the third heat dissipating member 503 conducts heat to the second heat dissipating member 502 through the through hole 504, and finally achieves heat dissipation through the heat conducting member 600 and the upper housing 201.
  • the first heat sink 501 is provided on the surface of the circuit board 300 or through the circuit board 300, and the first heat sink 501 and the second heat sink are provided on the surface of the circuit board 300.
  • 502 conducts the heat generated by the laser to the upper housing 201 through the heat-conducting member 600, and is discharged from the upper housing 201.
  • the third heat sink 503 By embedding the third heat sink 503 in the middle layers of the circuit board 300, the heat generated by the laser is conducted to the lower housing 202 by the third heat sink 503 and the corresponding through holes 504 arranged in the middle of the circuit board 300.
  • the body 202 realizes heat dissipation; at the same time, the third heat dissipation member 503 will laterally diffuse the heat received from the first heat dissipation member 501 to a position close to the second heat dissipation member 502, and conduct it to the first heat dissipation member 501 again through the through hole 504, A heat dissipation element 501 conducts the total heat to the second heat dissipation element 502, and finally passes through the heat conduction element 600 and the upper casing 201 and then is discharged. It can be seen that the optical modules provided in the embodiments of the present application can all realize the heat dissipation of the laser, and the heat dissipation efficiency is higher.
  • the circuit board 300 is provided with a first heat sink 501, one end of the first heat sink 501 is attached with an optical chip 406, and the lens assembly 401 covers the optical chip. 406 on.
  • the other end of the first heat dissipation member 501 extends beyond the coverage area of the lens assembly 401 to diffuse the heat generated by the optical chip 406 from the bottom of the lens assembly 401 to the outside of the lens assembly, and to one side surface of the circuit board 300 Conduction.
  • the third heat sink 503 is embedded in the middle layer of the circuit board 300, one part is located below the lens assembly 401, and the other part is located outside the lens assembly 402; the through hole 504 penetrates the multi-layer board of the circuit board 200 and is filled with a thermally conductive material, Used for heat conduction; a through hole 504 is provided between the upper surfaces of the first heat dissipating member 501 and the third heat dissipating member 503 to realize heat conduction between the first heat dissipating member 501 and the third heat dissipating member 503.
  • An end of the first heat dissipation member 501 away from the lens assembly 401 is provided with a second heat dissipation member 502, the upper surface of the second heat dissipation member 502 is provided with a heat conduction member 600, and the upper surface of the heat conduction member 600 is thermally connected to the upper housing 201.
  • the first heat dissipation member 501 conducts the heat conducted by itself and the heat diffused by the third heat dissipation member 503 to the second heat dissipation member 502, and then conducts to the upper housing 201 via the heat conduction member 600, and the upper housing 201 realizes heat dissipation.
  • the optical module provided by the embodiment of the present application can use the first heat dissipation member 501 to diffuse the heat generated by the optical chip 406 covered by the lens assembly 401 to the outside of the coverage area of the lens assembly 401, and then the second heat dissipation member 502, heat conduction
  • the member 600 and the third heat dissipation member 503 increase the heat conduction area, so that the heat can be dissipated from the upper casing 201, and the heat dissipation effect is better.

Abstract

一种光模块（200），电路板（300）上设有第一散热件（501），第一散热件（501）的一端贴合有光芯片（406），透镜组件（401）覆盖在光芯片（406）上。第一散热件（501）的另一端延伸至透镜组件（401）的覆盖区域之外，以将光芯片（406）产生的热量由透镜组件（401）的底部扩散至透镜组件（401）的外部。第一散热件（501）的远离透镜组件（401）的一端设有第二散热件（502），第二散热件（502）的上表面设有导热件（600），导热件（600）的上表面与上壳体（201）导热连接，第二散热件（502）将来自第一散热件（501）扩散的热量经由导热件（600）传导至上壳体（201），由上壳体（201）实现散热。

Description

一种光模块
本申请要求在2020年01月08日提交中国专利局、申请号为202010018782.7、发明名称为“一种光模块”，在2020年01月08日提交中国专利局、申请号为202010018784.6、发明名称为“一种光模块”的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光通信技术领域，尤其涉及一种光模块。
背景技术
光模块包括印刷电路板(PrintedCircuit board，简称：PCB)、设置在印刷电路板上的激光器、探测器、以及用于驱动激光器和探测器的驱动芯片等器件，各器件焊接在印刷电路板的对应焊盘上。各器件在运行的过程中会发热，若热量不能快速地被散发出去，则会导致其环境温度不断升高，影响光模块性能。
发明内容
第一方面，本申请提供了一种光模块，包括：电路板，其上布设有电路；光芯片，与所述电路板电连接，用于实现光信号的发射和/或接收；透镜组件，覆盖在所述光芯片上，用于光束的传播；第一散热件，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；所述光芯片贴合在所述第一散热件的一端，所述第一散热件可将所述光芯片产生的热量传导至所述透镜组件的覆盖区域以外；第二散热件，贴合在所述第一散热件上，且位于所述透镜组件的外侧，所述第二散热件用于接收并扩散所述第一散热件传导的热量；第三散热件，嵌入在所述电路板的中间层，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；通孔，贯穿所述电路板中的多层板，填充有导热材料，用于进行热量传导；所述第一散热件与所述第三散热件的上表面之间设有所述通孔，实现所述第一散热件与所述第三散热件之间的热量传导；导热件，设置在所述第二散热件的上表面，用于接收所述第二散热件传导的热量；上壳体，与所述导热件的一端导热连接，能够接收所述导热件传导的热量并向周边环境散发。
第二方面，本申请实施例一种光模块，包括：电路板，其上布设有电路；光芯片，与所述电路板电连接，用于实现光信号的发射和/或接收；透镜组件，覆盖在所述光芯片上，用于光束的传播；第一散热件，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；所述光芯片贴合在所述第一散热件的一端，所述第一散热件可将所述光芯片产生的热量传导至所述透镜组件的覆盖区域以外；第三散热件，嵌入在所述电路板的中间层，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；第二散热件，贴合在所述电路板上，且位于所述透镜组件的外侧，与所述第三散热件的一端相对，所述第二散热件用于接收并扩散所述第三散热件传导的热量；通孔，贯穿所述电路板中的多层板内，填充有导热材料，用于进行热量传导；所述第一散热件与所述第三散热件的上表面 之间设有所述通孔，实现所述第一散热件与所述第三散热件之间的热量传导；所述第二散热件与所述第三散热件之间设有所述通孔，实现所述第二散热件与所述第三散热件之间的热量传导；导热件，设置在所述第二散热件的上表面，用于接收所述第二散热件传导的热量；上壳体，与所述导热件的一端导热连接，能够接收所述导热件传导的热量并向周边环境散发。
第三方面，本申请实施例一种光模块，包括电路板，其上布设有电路；光芯片，与所述电路板电连接，用于实现光信号的发射和/或接收；透镜组件，覆盖在所述光芯片上，用于光束的传播；第一散热件，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；所述光芯片贴合在所述第一散热件的一端，所述第一散热件可将所述光芯片产生的热量传导至所述透镜组件的覆盖区域以外；第二散热件，贴合在所述第一散热件上，且位于所述透镜组件的外侧，所述第二散热件用于接收并扩散所述第一散热件传导的热量；导热件，设置在所述第二散热件的上表面，用于接收所述第二散热件传导的热量；上壳体，与所述导热件的一端导热连接，能够接收所述导热件传导的热量并向周边环境散发。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为光通信终端连接关系示意图；
图2为光网络终端结构示意图；
图3为本申请实施例提供的光模块的整体结构示意图；
图4为本申请实施例提供光模块分解结构示意图；
图5为本申请实施例提供的光模块的内部结构示意图；
图6为本申请实施例提供的光模块的另一内部结构示意图；
图7为本申请实施例提供的光模块的内部分解结构示意图；
图8为本申请实施例提供的散热结构的分解结构示意图；
图9为本申请实施例提供的散热结构的局部分解结构示意图；
图10为本申请实施例提供的电路板的截面图；
图11为本申请实施例提供的散热结构的散热路径图；
图12为本申请实施例提供的光模块的纵向截面图；
图13为本申请实施例提供的导热件与上壳体一体成型的结构示意图；
图14为本申请实施例提供的导热件安装到电路板的结构示意图；
图15为本申请实施例提供的上壳体与电路板通过导热件连接时的结构示意图；
图16为本申请实施例提供的电路板的内部结构剖视图；
图17为本申请实施例提供的光模块的另一纵向截面图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
光纤通信的核心环节之一是光、电信号的相互转换。光纤通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输，利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输；而计算机等信息处理设备使用的是电信号，为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，就需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光、电信号的相互转换功能，光信号与电信号的相互转换是光模块的核心功能。光模块通过其内部电路板上的金手指实现与外部上位机之间的电连接，主要的电连接包括供电、I2C信号、数据信号以及接地等；采用金手指实现的电连接方式已经成为光模块行业的主流连接方式，以此为基础，金手指上引脚的定义形成了多种行业协议/规范。
图1为光通信终端连接关系示意图。如图1所示，光通信终端的连接主要包括光网络终端100、光模块200、光纤101及网线103之间的相互连接。
光纤101的一端连接远端服务器，网线103的一端连接本地信息处理设备，本地信息处理设备与远端服务器的连接由光纤101与网线103的连接完成；而光纤101与网线103之间的连接由具有光模块200的光网络终端100完成。
光模块200的光口对外接入光纤101，与光纤101建立双向的光信号连接；光模块200的电口对外接入光网络终端100中，与光网络终端100建立双向的电信号连接；在光模块内部实现光信号与电信号的相互转换，从而实现在光纤与光网络终端之间建立信息连接；在本申请的某些实施例中，来自光纤的光信号由光模块转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块转换为光信号输入至光纤中。光模块200是实现光电信号相互转换的工具，不具有处理数据的功能，在上述光电转换过程中，信息仅发生传输载体的变化，信息并未发生变化。
光网络终端具有光模块接口102，用于接入光模块200，与光模块200建立双向的电信号连接；光网络终端具有网线接口104，用于接入网线103，与网线103建立双向的电信号连接；光模块200与网线103之间通过光网络终端100建立连接，在本申请的某些实施例中，光网络终端将来自光模块的信号传递给网线，将来自网线的信号传递给光模块，光网络终端作为光模块的上位机监控光模块的工作。与光模块不同，光网络终端具有一定的信息处理能力。
至此，远端服务器通过光纤、光模块、光网络终端及网线，与本地信息处理设备之间建立双向的信号传递通道。
常见的信息处理设备包括路由器、交换机、电子计算机等；光网络终端是光模块的上位机，向光模块提供数据信号，并接收来自光模块的数据信号，常见的光模块上位机还有 光线路终端等。
图2为光网络终端结构示意图。如图2所示，在光网络终端100中具有电路板105，在电路板105的表面设置笼子106；在笼子106内部设置有电连接器，用于接入金手指等光模块电口；在笼子106上设置有散热器107，散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端中，具体为光模块的电口插入笼子106内部的电连接器，光模块的光口与光纤101连接。
笼子106位于电路板105上，电路板105上的电连接器包裹在笼子106中；光模块200插入笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过笼子106上的散热器107进行扩散。
图3为本申请实施例提供的光模块的整体结构示意图，图4为本申请实施例提供光模块分解结构示意图；图5为本申请实施例提供的光模块的内部结构示意图。如图3、图4和图5所示，本申请实施例提供的光模块200包括上壳体201、下壳体202、解锁部件203、电路板300、透镜组件401、光芯片406、光纤带403、散热结构500和导热件600。
上壳体201盖合在下壳体202上，以形成具有两个开口的包裹腔体；包裹腔体的外轮廓一般呈现方形体，在本申请的某些实施例中，下壳体202包括主板以及位于主板两侧、与主板垂直设置的两个侧板；上壳体201包括盖板，盖板盖合在上壳体201的两个侧板上，以形成包裹腔体；上壳体201还可以包括位于盖板两侧、与盖板垂直设置的两个侧壁，由两个侧壁与两个侧板结合，以实现上壳体盖合在下壳体202上。
两个开口可以是相反方向的两个开口，也可以是其他不同方向上的两处开口；图3中开都204和205为相反方向的两个开口，其中开口204为电口，电路板300的金手指从电口204伸出，插入光网络终端等上位机中；另一个开口205为光口，用于外部光纤接入以连接光模块内部的光收发器件400；电路板300、光收发器件400等光电器件位于包裹腔体中。光收发器件400包括透镜组件401、光芯片406、光纤带403。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光收发器件400等器件安装到壳体中，由上壳体201、下壳体202形成光模块最外层的封装保护壳体；上壳体201及下壳体202一般采用金属材料，利于实现电磁屏蔽以及散热；一般不会将光模块的壳体做成一体部件，这样在装配电路板等器件时，定位部件、散热以及电磁屏蔽部件无法安装，也不利于生产自动化。
解锁部件203位于包裹腔体中下壳体202的外壁，用于实现光模块与上位机之间的固定连接，或解除光模块与上位机之间的固定连接。
解锁部件203具有与上位机笼子匹配的卡合部件；拉动解锁部件的末端可以在使解锁部件在外壁的表面移动；光模块插入上位机的笼子里，由解锁部件的卡合部件将光模块固定在上位机的笼子里；通过拉动解锁部件，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块与上位机的卡合关系，从而可以将光模块从上位机的笼子里抽出。
电路板300上设置有电路走线、电子元件(如电容、电阻、三极管、MOS管)及芯 片(如MCU、激光驱动芯片、限幅放大芯片、时钟数据恢复CDR、电源管理芯片、数据处理芯片DSP)等。电路板300通过电路走线将光模块中的用电器件按照电路设计连接在一起，以实现供电、电信号传输及接地等电功能。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；当光收发器件400位于电路板300上时，硬性电路板也可以提供平稳的承载；硬性电路板还可以插入上位机笼子中的电连接器中，在本申请的某些实施例中，在硬性电路板的一侧末端表面形成金属引脚/金手指，用于与电连接器连接；这些都是柔性电路板不便于实现的。
部分光模块中也会使用柔性电路板，作为硬性电路板的补充；柔性电路板一般与硬性电路板配合使用，如硬性电路板与光收发器件之间可以采用柔性电路板连接。
为使光模块能够实现远距离传输，提高光通信传输速率，本领域开始采用400G光模块实现不同波长光的发射和接收。具体的，光模块可采用具有双纤双向光信号传输特点的光电转换器件。
图6为本申请实施例提供的光模块的另一内部结构示意图。为实现双纤双向的光信号传输特点，参见图5和图6，光收发器件400包括透镜组件401、光纤带403、光接口405和光芯片406。光芯片406包括激光器和激光器驱动芯片，或者探测器和探测器驱动芯片，或者激光器、激光器驱动芯片、探测器和探测器驱动芯片中的任意一个。两个驱动芯片均与电路板300的信号电路电连接，由激光器驱动芯片驱动激光器产生光信号并经由透镜组件传播进光纤带，由探测器驱动芯片驱动探测器接收来自光纤带的光信号。
为实现光模块的光耦合，将透镜组件401覆盖在光芯片406的上方，透镜组件401用于进行光束的传播，如光的准直和会聚。透镜组件401通过光纤带403与光接口405连接，在光发射过程中，光芯片406中的激光器发出的光信号经过透镜组件401准直会聚后，经由光纤带403射出；在光接收过程中，光接口405产生的光信号传播进光纤带403，再被光芯片406中的探测器接收。
为提高光模块的传输速率，光模块内还可设置多组光收发器件，即包括一组光收发器件、两组光收发器件或三组光收发器件，多组光收发器件的设置方式可与一组光收发器件的设置方式相同或相似。以设置两组光收发器件为例，包括透镜组件401、光纤带403和光芯片406组成的第一组光收发器件，以及，包括第二透镜组件402、第二光纤带404和第二光芯片407组成的第二组光收发器件，如图5和图6中，在本申请的某些实施例中，第二光芯片407与电路板300的信号电路电连接，用于实现光信号的接收和发射。第二透镜组件402通过第二光纤带404与光接口405连接，在光发射过程中，第二光芯片407发出的光信号经过第二透镜组件402准直会聚后，经由第二光纤带404射出；在光接收过程中，光接口405产生的光信号传播进第二光纤带404，再被第二光芯片407接收。在设置多组光收发器件时，每组光收发器件中的光芯片可同时设置探测器、探测器驱动芯片、激光器驱动芯片和激光器，也可仅设置探测器和探测器驱动芯片，还可仅设置激光器驱动芯片和激光器，根据实际应用而定，本实施例不做具体限定。
光芯片中的激光器等器件在运行的过程中会发热，若热量不能快速地被散发出去，则 会导致其环境温度不断升高，影响光模块性能。由于两个光芯片的上方均覆盖有透镜组件，而透镜组件的外壳为塑料材质，导热效果差。为此，为对光模块进行散热以及提高散热效果，本申请实施例采用散热结构500和导热件600，将光芯片产生的热量经由电路板300的表面传导到上壳体201，上壳体201能够接收导热件600传导的热量并向周边环境散发。
由于本申请实施例提供的光模块中，在设置多组光收发器件时，多组光收发器件的散热原理与本申请实施例提供的散热原理相同，此处不再赘述。且仅以为激光器散热为例进行说明，而为探测器散热的方案，以及，同时为激光器、激光器驱动芯片、探测器和探测器驱动芯片散热的方案均可参照以为激光器散热的方案，此处不再赘述。
图7为本申请实施例提供的光模块的内部分解结构示意图；图8为本申请实施例提供的散热结构的分解结构示意图；图9为本申请实施例提供的散热结构的局部分解结构示意图；图10为本申请实施例提供的电路板的截面图。参见图7、图8、图9和图10，本申请实施例提供的散热结构500包括第一散热件501、第二散热件502和第三散热件503。
为使第一散热件501的一端延伸到透镜组件401的覆盖区域之外，使透镜组件401下光芯片产生的热量扩散到透镜组件401的覆盖区域之外，将第一散热件501设置在电路板300上，第一散热件501可沿电路板300的长度方向贴合在电路板300的表面，也可内置于电路板300之中。第一散热件501用于将光芯片406产生的热量沿电路板300扩散出透镜组件401的覆盖区域，即将激光器产生的热量沿电路板300扩散出透镜组件401的覆盖区域。第一散热件501可采用具有导热效果的材料制成，如铜层或铜块，也可为其他材质，本实施例不做具体限定。
第一散热件501贴装在电路板300的表面上。在第一散热件501采用铜层时，可将铜层贴在电路板300的表面，在电路板300表面形成一层铜皮，厚度约20微米。激光器产生的热量沿铜皮扩散，使得热量由电路板300的表面扩散到透镜组件401的覆盖区域之外。
第一散热件502嵌入到电路板300内，第一散热件501的表面露出在电路板300的表面。电路板300内设有贯穿表面的贯通孔，第一散热件501嵌入到贯通孔内，第一散热件501的上表面露出在电路板300的上表面，第一散热件501的下表面露出在电路板300的下表面。在第一散热件501采用铜块时，可将铜块内置在电路板300中，即在电路板300的厚度方向挖一个凹槽或挖通，将铜块内置在凹槽中，使得铜块的上表面露出在电路板300的表面；若将电路板300的上下表面挖通，此时，铜块结构的第一散热件501贯穿电路板300，铜块的上表面和下表面需分别露出在电路板300的上下表面，进而可同时实现热量沿电路板上下表面散热。铜块上表面露出时，激光器产生的热量一部分沿铜块上表面扩散，另一部分热量沿铜块向下扩散，此时铜块下表面也露出电路板300的下表面，而电路板300的下表面与光模块的下壳体202导热连接，因此，使得向下传导的热量可再次传导到下壳体202上，进而由下壳体202实现散热。
为实现光芯片的散热，将光芯片406贴合在第一散热件501上，光芯片406可全部贴合在第一散热件501上，也可仅将产生大量热量的部分贴合在第一散热件501上，即仅将能产生大量热量的激光器和探测器贴合在第一散热件501上，而将激光器驱动芯片和探测器驱动芯片贴合在电路板300上。由于光芯片406的上方覆盖有透镜组件401，为避免透 镜组件401影响散热效果，本实施例中，第一散热件501的另一端延伸出透镜组件401的覆盖区域，透镜组件401的覆盖区域如图7和图8中A部分虚线框所示区域。
第一散热件501在电路板300上的覆盖区域超过透镜组件401在电路板300上的覆盖区域，在第一散热件501一端上的激光器产生的热量时，该热量沿第一散热件501扩散，扩散方向由右向左(图7所示的状态)，使得热量由透镜组件401的底部扩散至透镜组件401的外部，第一散热件501用于将光芯片406产生的热量传导至透镜组件401的覆盖区域以外，例如，将激光器产生的热量传导至透镜组件401的覆盖区域以外。
可见，为将位于透镜组件401下方的激光器产生的热量散发出去，本实施例，将第一散热件501的贴合有光芯片406的一端位于透镜组件401的下方，即将贴有激光器的一端位于透镜组件401的下方，第一散热件501的另一端远离透镜组件401，使得透镜组件401下方的热量可沿第一散热件501扩散至透镜组件401的覆盖区域的外部，以便于热量的导出。
第一散热件501的一端上贴合有光芯片406，光芯片406的上方覆盖有透镜组件401，也就是说，第一散热件501的一端上贴合有激光器，激光器的上方覆盖有透镜组件401，而透镜组件401与光纤带403连接，因此，使得第一散热件501位于光纤带403的下方。在利用第一散热件501进行散热，即通过传导至上壳体201进行散热，光纤带403位于上壳体201和第一散热件501之间，而上壳体201和第一散热件501之间还设有导热件600，使得导热件600与光纤带403产生位置冲突。可见，光纤带403将会对导热件600的散热路径产生影响。
因此，为避免光纤带403限制热量的导出，本实施例中，需要将扩散至第一散热件501的远离透镜组件401一端的热量引导到位于光纤带403两侧空间比较大的区域。因此，为了提高散热效率，本实施例利用第二散热件502实现热量朝向避开光纤带403的方向扩散。
第二散热件502位于透镜组件401的外部，且贴合在第一散热件501的远离透镜组件401的一端上，用于接收第一散热件501传导的热量，并将热量向电路板200的两侧方向传导。第二散热件502可垂直于第一散热件501，也可不垂直于第一散热件501，以实现热量向光纤带403的两侧扩散即可，使得第二散热件502可将接收到的热量传导到光纤带403的两侧区域，即向电路板300的两侧方向传导，沿电路板300的宽度方向传导。
图11为本申请实施例提供的散热结构的散热路径图。参见图11，为将热量朝向光纤带403的两侧区域传导，第二散热件502并非仅与第一散热件501贴合，而是需向光纤带403的两侧方向延伸。在本申请的某些实施例中，第二散热件502的中间部位与第一散热件501的远离透镜组件401的一端贴合，第二散热件502的两端沿垂直于第一散热件501的长度方向朝电路板300的两侧延伸，使得第二散热件502与第一散热件501垂直，即第二散热件502与第一散热件501呈T型结构，第二散热件502的中间部位用于接收第一散热件501传导的热量，并沿长度方向朝两端扩散。
如图11中箭头所示路径，激光器产生的热量沿第一散热件501的一端向另一端扩散，而该端垂直贴合有第二散热件502，使得热量由第二散热件502的中间部位向两端扩散， 以提高传热横截面积，加速热量的扩散。
为了提高散热效果，第二散热件502可采用陶瓷板(ALN)、铜箔和碳纤维材料等高导热材料。
本申请实施例提供的光模块，在实现散热时，将激光器产生的热量沿电路板300表面扩散，并经由上壳体201导出。而第二散热件502位于电路板300上，与上壳体201相距一定距离。因此，为实现第二散热件502与上壳体201之间的导热，本实施例中，利用导热件600将第二散热件502传导的热量再次传导至上壳体201，再由上壳体201导出。
图12为本申请实施例提供的光模块的纵向截面图。参见图6、图8和图12，图12中的箭头所示路径为热量由第二散热件502传导到导热件600的路径，再传导到上壳体201的路径。导热件600设置在第二散热件502的上表面，用于接收第二散热件502传导的热量，并将热量向远离电路板300的方向传导。上壳体201与导热件600的一端连接，用于接收导热件600传导的热量并导出。
导热件600连接于第二散热件502和上壳体201之间，既起到传导热量的作用，还可起到支撑上壳体201的作用。导热件600可实现将位于电路板300处的热量传导到上壳体201，上壳体201是光模块的主散热面，散热效果更好。
为使导热件600起到支撑作用，本实施例中，将导热件600制成硬性结构。而电路板300也为硬性结构，第二散热件502铺在电路板300上，在导热件600与第二散热件502接触时，呈现硬性结构与硬性结构接触的现象，易导致导热件600或第二散热件502出现磨损。因此，为避免出现磨损，本实施例中，在导热件600与第二散热件502接触时，在二者之间设置导热胶层700，实现导热件600和第二散热件502的软接触。
导热胶层700位于第二散热件502的两端，且位于第二散热件502和导热件600之间，用于增大热量的传导效率。导热胶层700可选用导热胶，且导热胶具有很好的导热效果，将第二散热件502和导热件600通过导热胶连接，既能避免第二散热件502或导热件600出现磨损，还能提高热量的传导效率。
导热胶层700的结构以导热件600的结构而定，如果导热件600与第二散热件502全部接触，则可仅设置一个导热胶层700，覆盖在第二散热件502的全部表面上；而如果导热件600仅与第二散热件502的两端接触，则可设置两个导热胶层700，分别覆盖在第二散热件502的两端，实现第二散热件502与导热件600的连接。
本实施例中，利用第一散热件501和第二散热件502将光芯片406，例如激光器，产生的热量由透镜组件401的底部扩散至透镜组件401的覆盖区域之外，且扩散至避开光纤带403的位置，之后再借助导热件600将扩散的热量传导到上壳体201，由上壳体201实现散热。为此，导热件600可单独设计粘贴或安装到电路板300上，还可与上壳体201一体成型，以简化光模块的结构。但无论导热件600是安装到电路板300上，还是与上壳体201一体成型，两种方案中的导热件600可采用同一种结构，也可不同。
图13为本申请实施例提供的导热件与上壳体一体成型的结构示意图；图14为本申请实施例提供的导热件安装到电路板的结构示意图；图15为本申请实施例提供的上壳体与电路板通过导热件连接时的结构示意图。
参见图13，导热件600与上壳体201一体成型。将导热件600设置在上壳体201的对应第二散热件502的位置，使得导热件600与上壳体201一体成型后，导热件600的一端可与第二散热件502的上表面连接，实现第二散热件502传递的热量经由导热件600再次传导至上壳体201，由上壳体201导出。
参见图8、图14和图15，在采用导热件600单独设计并安装到电路板300的方案时，为了让光纤带403穿过，导热件600上设有缺口，在本申请的某些实施例中，导热件600包括：第一导热柱601、第二导热柱602和热量传导部603。为避让光纤带403，导热件600需预留可供光纤带403穿过的区域，即由第一导热柱601和第二导热柱602之间形成缺口，且由热量传导部603实现避让光纤带403。为此，导热件600可采用凹字型结构，即由第一导热柱601、热量传导部603和第二导热柱602顺次连接，形成凹字型结构。
第一导热柱601和第二导热柱602位于热量传导部603的两端，使得第一导热柱601和第二导热柱602之间形成预留空隙，以避让光纤带403。第一导热柱601用于实现第二散热件502的一端与上壳体201连接，第二导热柱602用于实现第二散热件502的另一端与上壳体201连接。可见，第一导热柱601和第二导热柱602仅与第二散热件502的一端有接触，也就是说，热量仅由第二散热件502的一端传导至第一导热柱601或者第二导热柱602。
但是，由于第二散热件502的中间部位也接收来自第一散热件501传递的热量，因此，为提高散热效果，本实施例中，利用热量传导部503实现第一导热柱601和第二导热柱602的连接，使得第二散热件502的热量可以通过热量传导部503传递至第一导热柱601和第二导热柱602。此时，热量传导部603与第二散热件502的中间部位连接，用于接收第二散热件502的中间部位传导的热量，并将热量向两端扩散。
位于中间部位的热量传导部603用于避让光纤带403，且接收来自第二散热件502的中间部位的热量，并将热量分为两部分，一部分向第一导热柱601扩散，另一部分向第二导热柱602扩散。使得利用第一导热柱601和第二导热柱602可以将第二散热件502扩散的热量全部传导至上壳体201。
在本申请的某些实施例中，第一导热柱601与热量传导部603的一端连接，以接收热量传导部603传递的热量。第一导热柱601的底面贴合于第二散热件502的一端，以接收第二散热件502扩散到该端的热量；第一导热柱601的顶面与上壳体201连接，以将接收到的热量传导部603传导的热量和第二散热件502的一端传导的热量再次传导给上壳体201，将热量经上壳体201导出。
第二导热柱602与热量传导部603的另一端连接，以接收热量传导部603传递的热量。第二导热柱602的底面贴合于第二散热件502的另一端，以接收第二散热件502扩散到该端的热量；第二导热柱602的顶面与上壳体201连接，以将接收到的热量传导部603传导的热量和第二散热件502的另一端传导的热量再次传导给上壳体201，将热量经上壳体201导出。
在其他实施例中，导热件600可包括热量传导部603和第一导热柱601，热量传导部603和第一导热柱601垂直连接，形成L型结构。第一导热柱601的一端可与热量传导部 603导热连接，第一导热柱601也可在热量传导部603的一端向上延伸，以形成L型结构。在进行导热时，导热件600设置两组L型结构，分别位于第二散热件502的两端，两组L性结构以竖直方向对称设置。两组L型结构可接触，也可不接触，接触部位为对应的热量传导部603。本实施例的导热件603的散热过程可参照前述实施例提供的导热件603的散热过程，此处不再赘述。
上述实施例提供的光模块，为将透镜组件401下方的激光器产生的热量经由上壳体201导出，在电路板300的表面设有第一散热件501。第一散热件501的一端上贴有激光器且位于透镜组件401的下方，另一端位于透镜组件401的覆盖区域之外，以将激光器产生的热量经由一端扩散至另一端，且该端连接有相互垂直的第二散热件502，以增加热量的扩散面积。第二散热件502通过导热件600与上壳体201连接，第二散热件502可将来自第一散热件501扩散的热量经由导热件600传导至上壳体，由上壳体201将热量散出，散热效果更好。
为了提高光模块的散热效率，本申请实施例提供的光模块，还可采用下壳体202进行散热的方案，即在前述实施例提供的光模块的结构基础上，同时实现热量由光模块的上壳体201和下壳体202的散热。
再次参见图10所示电路板的截面图，为提高散热效果，基于前述实施例提供的电路板300上贴合有第一散热件501和第二散热件502的方案，电路板300之中还可嵌入第三散热件503。本申请实施例提供的光模块，在电路板300上贴合有第一散热件501和第二散热件502的基础上，第三散热件503内置在电路板300的多层板之间，上下表面均未露出在电路板300的上下表面。
电路板300由多个多层板形成，第三散热件503的厚度尺寸可占据电路板300的中间几层，例如，电路板300包括8个多层板，由一侧表面到另一侧表面分别编号“一、二……七、八”，则第三散热件503占据位于中间的三至六层，而一至二层，以及七至八层则可布置电路。第三散热件503为铜质材料制成，例如，铜块。本实施例中，第一散热件501采用设置铜层结构的方案。
第三散热件503内置在电路板300中，一部分位于透镜组件401的下方，另一部分位于透镜组件401的外侧。第三散热件503可实现热量由电路板300的一侧表面向另一侧表面传导，第三散热件503的覆盖面积与前述实施例提供的贴合在电路板300表面的第一散热件501的覆盖面积相同或相似，均为由光芯片406的一端延伸至透镜组件401的覆盖区域以外。第一散热件501与第三散热件503的横截面积可以相同，也可不同，可根据具体使用情况而定。
为了将位于透镜组件401下方的激光器产生的热量扩散至透镜组件401的覆盖区域之外，第三散热件503的设置位置与第一散热件501的设置位置相对，即第三散热件503的一端位于第一散热件501贴合有激光器的一端下方，第三散热件503的另一端位于第二散热件502的下方。
由于第一散热件501采用铜层结构时，散热的速率较小，且第三散热件503占据电路板300的中间几层，使得第三散热件503并未与第一散热件501直接接触，第三散热件 503无法吸收第一散热件501传导的光芯片406产生的热量。为此，本实施例提供的光模块，在电路板300中与第三散热件503之间的位置开设数个通孔504，由通孔504实现激光器产生的热量由第一散热件501向第三散热件503导通，使得激光器产生的热量由第一散热件501向电路板300的一侧表面传导，且能够被第三散热件503吸收。由采用铜块结构的第三散热件503进行散热，可提高散热效率。
通孔504贯穿在电路板300的多层板内，填充有导热材料，用于进行热量传导，导热材料包括导热陶瓷、铝箔或碳纤维材料等。例如，通孔504可设置在电路板300的一至二层，或七至八层。
图16为本申请实施例提供的电路板的内部结构剖视图；图17为本申请实施例提供的光模块的另一纵向截面图。参见图16和图17，在第三散热件503和对应的电路板300的位置之间设置通孔504，通孔504位于电路板300内，且连接于第三散热件503的上表面与电路板300的一侧表面之间，第三散热件503与第一散热件501之间通过通孔504导热连接，使得第三散热件503和第一散热件501实现热量的传导，即第一散热件501将激光器产生的热量通过通孔504传导到第三散热件503上，再由第三散热件503将热量由位于激光器下方的一端横向扩散至透镜组件401的覆盖区域之外，第三散热件503再通过通孔504将热量传递回第一散热件501，由第一散热件501将热量传导给第二散热件502，最后经由导热件600和上壳体201实现散热。
本实施例中通过设置第三散热件503提高了由第一散热件501向第二散热件502的传导效率，散热路径由第一散热件501的一端吸收激光器产生的热量，再将一部分热量通过通孔504传导给第三散热件503，由第三散热件503将该部分热量横向传导到靠近第二散热件502的一端，再由该端通过通孔504将热量再传导给第一散热件501，由第一散热件501将接收的激光器产生的热量和来自第三散热件503传导的热量一同传导给第二散热件502。
为实现热量的扩散，通孔504设置在第三散热件503与第一散热件501对应的全部区域，全部区域包括第三散热件503的上表面与第一散热件501之间对应的电路板300的区域，此时，第一散热件501与第三散热件503通过通孔504导热连接，而第三散热件503与第二散热件502之间未直接进行导热连接。另外，在其他实施例中，通孔504还可设置在第三散热件503与第一散热件501对应的端部区域，端部区域包括光芯片406对应的电路板300的区域，以及，第一散热件501与第二散热件502对应的电路板300的区域，此时，第二散热件502与第三散热件503通过通孔504导热连接，第三散热件503可将第一散热件501传导的热量直接传导给第二散热件502。
在一些实施例中，通孔504设置在全部区域，位于第一散热件501和第三散热件503之间的电路板300均布多个通孔504。激光器产生的热量先传导到第一散热件501上，第一散热件501将一部分热量经过位于激光器下方的通孔504向下传导，进而传导到第三散热件503上。第一散热件501将另一部分热量沿第一散热件501的表面扩散到透镜组件401的覆盖区域之外，即扩散到与第二散热件502接触的位置。同时，沿第一散热件501表面扩散的热量，还可在扩散到第二散热件502的过程中，沿途中经过的通孔504实现第 一散热件501与第三散热件503的热量传导。可见，第一散热件501可实现热量沿两个方向传导，该两个传导方向相互垂直。第三散热件503可通过通孔504接收来自第一散热件501端部扩散的热量，还可接收来自第一散热件501中部扩散的热量。第三散热件503将接收到的热量横向传导到位于第二散热件502下方的一端，并通过对应的通孔504再次传导给靠近第二散热件502的第一散热件501的一端，由第一散热件501将总热量传导给第二散热件502，再由第二散热件502将热量传导给导热件600，最后经由上壳体201导出，散热效率高。可见，在第二散热件502和第三散热件503相对应的位置，二者可通过通孔504实现热量的双向传导。
在一些实施例中，通孔504设置在端部区域，在激光器下方对应的第一散热件501和第三散热件503之间的电路板300均布多个通孔504，还可在第一散热件501与第二散热件502贴合位置对应的电路板300上均布多个通孔504，此时，通孔504位于第三散热件503的两端。激光器产生的热量先传导到第一散热件501上，第一散热件501将一部分热量经过位于激光器下方的通孔504向下传导，进而传导到第三散热件503上。第一散热件501将另一部分热量沿第一散热件501的表面扩散到透镜组件401的覆盖区域之外，即扩散到与第二散热件502接触的位置。热量在扩散到第二散热件502时，第一散热件501可通过该区域的通孔504再将一小部分热量向下传导，传导到第三散热件503上，并将另一小部分热量扩散给第二散热件502，再经过导热件600传导至上壳体201后导出。可见，第一散热件501可实现热量沿两个方向传导，该两个传导方向相互垂直。第三散热件503可通过通孔504接收来自第一散热件501的两个端部扩散的热量，同时，第三散热件503将接收到的热量横向传导到位于第二散热件502下方的一端，并通过对应的通孔504传导给第二散热件502，再由第二散热件502将热量传导给导热件600，最后经由上壳体201导出，散热效率高。可见，在第二散热件502和第三散热件503相对应的位置，二者可通过通孔504实现热量的双向传导。
为实现热量由光模块的下壳体202导出，在本实施例中，在由下壳体202导出时，电路板300的与第三散热件503下表面对应的表面贴合有第四散热件(图中未示出)，第四散热件与第一散热件分别贴合在电路板300的相对两面，第四散热件可与第三散热件的结构相同，均采用铜皮或嵌入式的铜块结构。第四散热件与光模块的下壳体202导热连接；第四散热件与第三散热件503的下表面之间设置通孔504，通孔504用于接收第三散热件503传导的热量，并将热量经过第四散热件传导到下壳体202。例如，如果第一散热件501与第三散热件503之间的通孔504设置在电路板300的一至二层多层板中，那么第三散热件503与第四散热件之间的通孔504则设置在电路板300的七至八层多层板中。
激光器产生的热量经过第一散热件501和通孔504(第一散热件501与第三散热件503之间的通孔)传导到第三散热件503上，第三散热件503继续将热量向下传导，通过位于第三散热件503下表面的通孔504(第四散热件与第三散热件503之间的通孔)传导到第四散热件上，再由第四散热件传导给下壳体202上，由下壳体202导出。本实施例提供的光模块，可同时通过上壳体201和下壳体202实现激光器产生的热量的导出，散热效率更高。
在光模块中利用第一散热件501、第二散热件502、第三散热件503和第四散热件进行散热时，第一散热件501和第四散热件可为设置在电路板300表面的铜皮，也可为嵌入到电路板300中的铜块。在第一散热件501和第四散热件采用铜块时，电路板300的一侧表面设有凹槽，即在电路板300的一至二层设置凹槽，或者在七至八层设置凹槽。铜块位于凹槽内，且铜块的上表面露出在电路板300的表面。第一散热件501和第四散热件采用铜皮或铜块的具体实现方案，可参照前述实施例的内容，此处不再赘述。
为实现电路板300的下表面与下壳体202的软接触，在电路板300和下壳体202之间设置导热胶层700。本实施例中的导热胶层700的结构和材质可与前述实施例的相同，此处不再赘述。
在另一个实施例中，该实施例提供的光模块，与前述实施例提供的光模块的结构不同之处在于，第一散热件501与第二散热件503不贴合在一起，而将第二散热件502与第三散热件503通过通孔504导热连接。第二散热件502贴合在电路板300上，且位于透镜组件401的外侧，与第三散热件503的一端相对，第二散热件502用于接收并扩散第三散热件传导的热量。
在本实施例中，第三散热件503的覆盖区域超过第一散热件501的覆盖区域，由于第一散热件501与第二散热件502未接触，因此，第一散热件501的作用是将贴合在其上的激光器产生的热量扩散到透镜组件401的覆盖区域之外，再将热量通过通孔504传导到位于电路板300中间层的第三散热件503，由第三散热件503将热量进行快速的扩散。
第三散热件503将接收到的来自第一散热件501传导的热量横向扩散，传导到第二散热件502的位置下方，第二散热件502与第三散热件503之间设有通孔504，由第二散热件502与第三散热件503之间的通孔实现第二散热件502与第三散热件503之间的热量传导。第三散热件503通过通孔504将热量传导给第二散热件502，最后经由导热件600和上壳体201实现散热。
上述多个实施例提供的光模块，通过在电路板300的表面或者以贯穿电路板300的方式设置第一散热件501，由设置在电路板300表面的第一散热件501和第二散热件502将激光器产生的热量经过导热件600传导到上壳体201，由上壳体201实现导出。通过在电路板300的中间几层嵌入第三散热件503，由设置在电路板300中间的第三散热件503和对应的通孔504将激光器产生的热量传导至下壳体202，由下壳体202实现散热；同时，第三散热件503将接收来自第一散热件501的热量横向扩散至靠近第二散热件502的位置，并通过通孔504再次传导至第一散热件501，由第一散热件501将总热量传导给第二散热件502，最后经过导热件600和上壳体201后导出。可见，本申请实施例提供的光模块，均可实现激光器的热量的散热，且散热效率更高。
由以上技术方案可知，本申请实施例提供的一种光模块，电路板300上设有第一散热件501，第一散热件501的一端贴合有光芯片406，透镜组件401覆盖在光芯片406上。第一散热件501的另一端延伸至透镜组件401的覆盖区域之外，以将光芯片406产生的热量由透镜组件401的底部扩散至透镜组件的外部，以及，向电路板300的一侧表面传导。第三散热件503嵌入在电路板300的中间层，一部分位于透镜组件401的下方，另一部分 位于透镜组件402的外侧；通孔504贯穿在电路板200的多层板内，填充有导热材料，用于进行热量传导；第一散热件501与第三散热件503的上表面之间设有通孔504，以实现第一散热件501与第三散热件503之间的热量传导。第一散热件501的远离透镜组件401的一端设有第二散热件502，第二散热件502的上表面设有导热件600，导热件600的上表面与上壳体201导热连接。第一散热件501将自身传导的热量和第三散热件503扩散的热量传导给第二散热件502，再经由导热件600传导至上壳体201，由上壳体201实现散热。可见，本申请实施例提供的光模块，可利用第一散热件501将透镜组件401覆盖的光芯片406产生的热量扩散至透镜组件401的覆盖区域之外，再由第二散热件502、导热件600和第三散热件503提高热量传导面积，使得热量可以由上壳体201散出，散热效果更好。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (20)

  1. 一种光模块，其特征在于，包括：
    电路板，其上布设有电路；
    光芯片，与所述电路板电连接，用于实现光信号的发射和/或接收；
    透镜组件，覆盖在所述光芯片上，用于光束的传播；
    第一散热件，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；所述光芯片贴合在所述第一散热件的一端，所述第一散热件可将所述光芯片产生的热量传导至所述透镜组件的覆盖区域以外；
    第二散热件，贴合在所述第一散热件上，且位于所述透镜组件的外侧，所述第二散热件用于接收并扩散所述第一散热件传导的热量；
    第三散热件，嵌入在所述电路板的中间层，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；
    通孔，贯穿所述电路板中的多层板，填充有导热材料，用于进行热量传导；
    所述第一散热件与所述第三散热件的上表面之间设有所述通孔，实现所述第一散热件与所述第三散热件之间的热量传导；
    导热件，设置在所述第二散热件的上表面，用于接收所述第二散热件传导的热量；
    上壳体，与所述导热件的一端导热连接，能够接收所述导热件传导的热量并向周边环境散发。
  2. 根据权利要求1所述的光模块，其特征在于，所述第三散热件的一端位于所述第一散热件贴合有所述光芯片的一端下方，所述第三散热件的另一端位于所述第二散热件的下方。
  3. 根据权利要求1所述的光模块，其特征在于，所述电路板的下表面贴合有第四散热件，所述第四散热件与所述光模块的下壳体导热连接；所述第四散热件与所述第三散热件的下表面之间设置所述通孔，所述通孔用于接收所述第三散热件传导的热量，并将所述热量经过所述第四散热件传导到所述下壳体。
  4. 根据权利要求1所述的光模块，其特征在于，所述第一散热件贴装在所述电路板的表面上。
  5. 根据权利要求1所述的光模块，其特征在于，所述第一散热件嵌入到所述电路板内，所述第一散热件的表面露出在所述电路板的表面。
  6. 根据权利要求1所述的光模块，其特征在于，所述导热件的中间部位设有预留空隙，所述预留空隙用于供光纤带通过。
  7. 根据权利要求6所述的光模块，其特征在于，所述导热件包括：
    热量传导部，与所述第二散热件导热连接，用于接收所述第二散热件传导的热量，并将所述热量向两端扩散；
    第一导热柱，与所述热量传导部连接，所述第一导热柱的底面贴合于所述第二散热件的一端，顶面与所述上壳体连接；所述第一导热柱用于接收所述热量传导部传导的热量， 将所述热量经所述上壳体导出。
  8. 根据权利要求1所述的光模块，其特征在于，还包括：
    导热胶层，设置在所述第二散热件的两端，且位于所述第二散热件和所述导热件之间，以及，设置在下壳体和所述电路板之间，用于增大热量的传导效率。
  9. 一种光模块，其特征在于，包括：
    电路板，其上布设有电路；
    光芯片，与所述电路板电连接，用于实现光信号的发射和/或接收；
    透镜组件，覆盖在所述光芯片上，用于光束的传播；
    第一散热件，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；所述光芯片贴合在所述第一散热件的一端，所述第一散热件可将所述光芯片产生的热量传导至所述透镜组件的覆盖区域以外；
    第三散热件，嵌入在所述电路板的中间层，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；
    第二散热件，贴合在所述电路板上，且位于所述透镜组件的外侧，与所述第三散热件的一端相对，所述第二散热件用于接收并扩散所述第三散热件传导的热量；
    通孔，贯穿所述电路板中的多层板内，填充有导热材料，用于进行热量传导；
    所述第一散热件与所述第三散热件的上表面之间设有所述通孔，实现所述第一散热件与所述第三散热件之间的热量传导；
    所述第二散热件与所述第三散热件之间设有所述通孔，实现所述第二散热件与所述第三散热件之间的热量传导；
    导热件，设置在所述第二散热件的上表面，用于接收所述第二散热件传导的热量；
    上壳体，与所述导热件的一端导热连接，能够接收所述导热件传导的热量并向周边环境散发。
  10. 根据权利要求9所述的光模块，其特征在于，所述电路板的下表面贴合有第四散热件，所述第四散热件与所述光模块的下壳体导热连接；所述第四散热件与所述第三散热件的下表面之间设置所述通孔，所述通孔用于接收所述第三散热件传导的热量，并将所述热量经过所述第四散热件传导到所述下壳体。
  11. 一种光模块，其特征在于，包括：
    电路板，其上布设有电路；
    光芯片，与所述电路板电连接，用于实现光信号的发射和/或接收；
    透镜组件，覆盖在所述光芯片上，用于光束的传播；
    第一散热件，一部分位于所述透镜组件的下方，另一部分位于所述透镜组件的外侧；所述光芯片贴合在所述第一散热件的一端，所述第一散热件可将所述光芯片产生的热量传导至所述透镜组件的覆盖区域以外；
    第二散热件，贴合在所述第一散热件上，且位于所述透镜组件的外侧，所述第二散热件用于接收并扩散所述第一散热件传导的热量；
    导热件，设置在所述第二散热件的上表面，用于接收所述第二散热件传导的热量；
    上壳体，与所述导热件的一端导热连接，能够接收所述导热件传导的热量并向周边环境散发。
  12. 根据权利要求11所述的光模块，其特征在于，所述第一散热件贴装在所述电路板的表面上。
  13. 根据权利要求11所述的光模块，其特征在于，所述第一散热件嵌入到所述电路板内，所述第一散热件的表面露出在所述电路板的表面。
  14. 根据权利要求13所述的光模块，其特征在于，所述电路板内设有贯穿表面的贯通孔，所述第一散热件嵌入到所述贯通孔内，所述第一散热件的上表面露出在所述电路板的上表面，所述第一散热件的下表面露出在所述电路板的下表面。
  15. 根据权利要求11所述的光模块，其特征在于，所述第二散热件的中间部位与所述第一散热件的远离所述透镜组件的一端贴合，所述第二散热件的中间部位能够接收所述第一散热件传导的热量，实现所述第二散热件的热量由中心部位到两端的散热。
  16. 根据权利要求11所述的光模块，其特征在于，所述导热件的中间部位设有预留空隙，所述预留空隙用于供光纤带通过。
  17. 根据权利要求16所述的光模块，其特征在于，所述导热件包括：
    热量传导部，与所述第二散热件导热连接，能够接收所述第二散热件传导的热量，并将所述热量扩散；
    第一导热柱，与所述热量传导部连接，所述第一导热柱的底面贴合于所述第二散热件的一端，顶面与所述上壳体连接；所述第一导热柱能够接收所述热量传导部传导的热量，将所述热量经所述上壳体导出；
  18. 根据权利要求17所述的光模块，其特征在于，所述导热件还包括：
    第二导热柱，与所述热量传导部连接，所述第二导热柱的底面贴合于所述第二散热件的另一端，顶面与所述上壳体连接，所述第一导热柱与所述第二导热柱之间形成所述预留空袭；所述第二导热柱能够接收所述热量传导部传导的热量，将所述热量经所述上壳体导出。
  19. 根据权利要求11至18中任一项所述的光模块，其特征在于，所述导热件与所述上壳体一体成型。
  20. 根据权利要求11至18中任一项所述的光模块，其特征在于，还包括：
    导热胶层，设置在所述第二散热件的两端，且位于所述第二散热件和所述导热件之间，能够增大热量的传导效率。
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