WO2021137443A1 - Stratifié photosensible, procédé de fabrication de stratifié photosensible et procédé de fabrication de carte de circuit imprimé - Google Patents

Stratifié photosensible, procédé de fabrication de stratifié photosensible et procédé de fabrication de carte de circuit imprimé Download PDF

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Publication number
WO2021137443A1
WO2021137443A1 PCT/KR2020/017150 KR2020017150W WO2021137443A1 WO 2021137443 A1 WO2021137443 A1 WO 2021137443A1 KR 2020017150 W KR2020017150 W KR 2020017150W WO 2021137443 A1 WO2021137443 A1 WO 2021137443A1
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Prior art keywords
boiling point
photosensitive
less
meth
formula
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PCT/KR2020/017150
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English (en)
Korean (ko)
Inventor
석상훈
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코오롱인더스트리 주식회사
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Priority claimed from KR1020190179860A external-priority patent/KR102237567B1/ko
Priority claimed from KR1020200099130A external-priority patent/KR102250828B1/ko
Priority claimed from KR1020200125243A external-priority patent/KR102341768B1/ko
Application filed by 코오롱인더스트리 주식회사 filed Critical 코오롱인더스트리 주식회사
Priority to CN202080088801.1A priority Critical patent/CN114846404A/zh
Priority to JP2022538873A priority patent/JP7535585B2/ja
Publication of WO2021137443A1 publication Critical patent/WO2021137443A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • the present invention relates to a photosensitive laminate, a method for manufacturing a photosensitive laminate, and a method for manufacturing a circuit board.
  • the photosensitive resin composition is used in the form of Dry Film Photoresist (DFR), Liquid Photoresist Ink, etc. used in Printed Circuit Board (PCB) or Lead Frame. .
  • DFR Dry Film Photoresist
  • PCB Printed Circuit Board
  • Lead Frame .
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2006-106287 (published on: April 20, 2006)
  • An object of the present invention is to provide a photosensitive laminate capable of reducing defects in the formation of fine wiring, securing high reliability during development, and forming high-density circuits.
  • this invention is for providing the manufacturing method of the said photosensitive laminated body.
  • this invention relates to the manufacturing method of the circuit board using the said photosensitive laminated body.
  • a supporting substrate and a photosensitive resin layer formed on the paper substrate, wherein 5 cells/mm 2 or less of bubbles having a diameter of less than 1 ⁇ m are present in the photosensitive resin layer.
  • a method for manufacturing a circuit board using the photosensitive laminate may be provided.
  • a method for manufacturing the photosensitive laminate may be provided.
  • a weight average molecular weight means the weight average molecular weight of polystyrene conversion measured by the GPC method.
  • a commonly known analyzer and a detector such as a differential refraction detector and a column for analysis may be used, and the temperature generally applied Conditions, solvents, and flow rates can be applied.
  • the alkali developable binder resin is dissolved in tetrahydrofuran so as to have a concentration of 1.0 (w/w)% in THF (about 0.5 (w/w)% based on solid content), and a syringe of 0.45 ⁇ m pore size
  • THF tetrahydrofuran
  • the column was Agilent PLgel 5 ⁇ m Guard (7.5 x 50 mm) and Agilent PLgel 5 ⁇ m Mixed D (7.5 x 300 mm) were connected in series, and the Agilent 1260 Infinity II System, RI Detector was used as a detector to measure at 40°C.
  • (photo)cured product or “(photo)cured” means not only when all of the components having an unsaturated group that can be cured or crosslinked in the chemical structure are cured, crosslinked or polymerized, but also a part of it is cured , cross-linked or polymerized.
  • a supporting substrate and a photosensitive resin layer formed on the paper substrate, wherein 5 cells/mm 2 or less of bubbles having a diameter of less than 1 ⁇ m are present in the photosensitive resin layer.
  • the present inventors have newly developed a photosensitive laminate including a photosensitive resin layer having 5 cells/mm 2 or less of cells having a diameter of less than 1 ⁇ m, or 0.001 ⁇ m or more and less than 1 ⁇ m, and using this photosensitive laminate It is possible to realize high sensitivity to exposure in the manufacturing process of circuit boards, and the reliability during development is increased, so that it is possible to realize high density and sensitivity while securing high reliability, and to form finer wiring through experiments.
  • the invention was completed.
  • a mixed solvent including a high boiling point solvent and a low boiling point solvent having a boiling point of 100° C. or less is used together with a resin composition comprising an alkali developable binder resin including a carboxyl group and a photoinitiator, having a diameter of less than 1 ⁇ m in the photosensitive resin layer.
  • the bubbles were to be present in the 5 / mm 2 or less, or 3 / mm 2 or less.
  • a drying rate and/or a drying temperature in addition to using a mixed solvent including a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or less, a drying rate and/or a drying temperature
  • a drying rate and/or a drying temperature in addition to using a mixed solvent including a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or less, a drying rate and/or a drying temperature
  • the amount of microbubbles formed in the photosensitive resin layer can be greatly reduced or substantially absent by adjusting the
  • the number of bubbles having a diameter of less than 1 ⁇ m in the photosensitive resin layer may be 5 / mm 2 or less, or 3 / mm 2 or less, in particular the opposite surface of the interface between the support substrate and the photosensitive resin layer, or Bubbles having a diameter of less than 1 ⁇ m toward the outer surface of the photosensitive resin layer may or may not be present in a trace amount, and more specifically, from the opposite surface of the interface between the supporting substrate and the photosensitive resin layer, the entire photosensitive resin layer. Within 50% of the thickness, up to 3 cells/mm 2 of cells having a diameter of less than 1 ⁇ m may be present.
  • the photosensitive laminate may not only contain a very small amount or substantially not contain the above-mentioned bubbles having a diameter of less than 1 ⁇ m, and may not include bubbles having a diameter of 1 ⁇ m or more and 5 ⁇ m or less.
  • defects do not occur or occur over the entire area, and may occur in a very small amount.
  • defects are formed on the upper surface of the photosensitive resin layer. It is not substantially present, and microscopic defects may be present in a very small amount on the lower surface or inside of the photosensitive resin layer after development.
  • the photosensitive resin layer after exposing the photosensitive resin layer to ultraviolet light and developing with an alkali solution, there are 3 defects/mm 2 or less having a cross-sectional diameter of 0.3 ⁇ m to 4 ⁇ m, or 0.5 ⁇ m or more and 3 ⁇ m or less, or 1/mm 2 or less may be observed, and may be substantially absent.
  • the cross-sectional diameter of the defect may be defined as the largest diameter among diameters of the bond defined in a cross-section in one direction on the photosensitive resin layer.
  • the conditions of the exposure and development are not particularly limited.
  • the wavelength of the light irradiated to the photosensitive laminate is in the range of 340 nm to 420 nm, and the remaining number of steps measured using a 41-step step tablet manufactured by Stouffer Graphic Arts Equipment is 15 steps. It may proceed from 1 minute to 60 minutes.
  • the development can be carried out by a method such as a spray method with an aqueous alkali solution such as Na 2 CO 3 having a concentration of 0.1 to 3.0 wt%.
  • the photosensitive laminate when used, higher density and higher sensitivity can be realized while using lower energy. More specifically, the amount of energy at which the remaining number of steps becomes 15 when the wavelength of the light irradiated to the photosensitive laminate is in the range of 340 nm to 420 nm, measured using a 41-step step tablet manufactured by Stouffer Graphic Arts Equipment, 300 mJ/cm2 It may be less than or equal to 100 mJ/cm 2 , and the resolution after development may be realized to be less than 15 ⁇ m, or less than 10 ⁇ m.
  • the thickness of the supporting substrate and the photosensitive resin layer is not particularly limited, but as a specific example, the thickness of the supporting substrate may be 1 ⁇ m to 100 ⁇ m, or 5 ⁇ m to 50 ⁇ m, and the thickness of the photosensitive resin layer. The thickness may be from 1 ⁇ m to 100 ⁇ m, or from 5 ⁇ m to 50 ⁇ m.
  • the characteristics of the photosensitive laminate or the constitutional characteristics in which 5 cells/mm 2 or less of bubbles having a diameter of less than 1 ⁇ m exist in the photosensitive resin layer may be attributed to the above-described manufacturing method, and the photosensitive number It may be due to the characteristics of the strata.
  • the photosensitive resin layer may include an alkali developable binder resin including a carboxyl group.
  • the alkali developable binder may include at least one carboxyl group in a molecule to react with alkali during the development process.
  • alkali developable binder examples include a repeating unit represented by the following formula (3), a repeating unit represented by the following formula (4), a repeating unit represented by the following formula (5), and a repeating unit represented by the following formula (6) It may be a polymer or a copolymer including one or more repeating units selected from the group consisting of.
  • R 3 is hydrogen, or alkyl having 1 to 10 carbon atoms
  • R 4 is hydrogen or alkyl having 1 to 10 carbon atoms
  • R 5 is alkyl having 1 to 10 carbon atoms
  • Ar is aryl having 6 to 20 carbon atoms.
  • R 3 and R 4 are the same as or different from each other, and each independently represents hydrogen or alkyl having 1 to 10 carbon atoms, R 5 is alkyl having 1 to 10 carbon atoms, and Ar is 6 to 20 carbon atoms. is the aryl of
  • R 3 and R 4 are the same as or different from each other, and each independently may be any one of hydrogen or alkyl having 1 to 10 carbon atoms, and specific examples of the alkyl having 1 to 10 carbon atoms include methyl can be heard
  • R 5 is alkyl having 1 to 10 carbon atoms, and specific examples of the alkyl having 1 to 10 carbon atoms include methyl.
  • Ar is an aryl having 6 to 20 carbon atoms, and specific examples of the aryl having 6 to 20 carbon atoms include phenyl.
  • the repeating unit represented by Chemical Formula 4 may be a repeating unit derived from a monomer represented by the following Chemical Formula 4-1.
  • R 3 is hydrogen or alkyl having 1 to 10 carbon atoms.
  • the contents of R 3 are the same as those described above in Formula 4 above.
  • Specific examples of the monomer represented by Formula 4-1 include acrylic acid (AA) and methacrylic acid (MAA).
  • the repeating unit represented by the formula (5) may be a repeating unit derived from a monomer represented by the following formula (5-1).
  • R 4 is hydrogen or alkyl having 1 to 10 carbon atoms
  • R 5 is alkyl having 1 to 10 carbon atoms.
  • the contents of R 4 and R 5 are the same as those described above in Formula 3 above.
  • Specific examples of the monomer represented by Formula 3-1 include methyl methacrylate (MMA) and butyl acrylate (BA).
  • the repeating unit represented by Chemical Formula 6 may be a repeating unit derived from a monomer represented by Chemical Formula 6-1.
  • Ar is aryl having 6 to 20 carbon atoms.
  • the contents of Ar are the same as those described above in Formula 4 above.
  • Specific examples of the monomer represented by Formula 6-1 include styrene (Styrene, SM).
  • the alkali developable binder resin including the carboxyl group may serve as a base material for the photosensitive resin layer, and thus should have a minimum molecular weight, for example, 20,000 g / mol to 300,000 g / mol, or 30,000 g / It may have a weight average molecular weight of mol to 150,000 g/mol.
  • the alkali developable binder resin including the carboxyl group should have heat resistance of a certain level or higher, and thus may have a glass transition temperature of 20°C or more and 150°C or less.
  • the alkali developable binder resin including the carboxyl group may have an acid value of 100 mgKOH/g or more and 300 mgKOH/g in consideration of the developability of the photosensitive resin layer.
  • the photosensitive resin layer may include a cross-linked copolymer between an alkali developable binder resin including a carboxyl group and a photopolymerizable compound including a (meth)acrylate monomer or oligomer.
  • the photopolymerizable compound including the (meth)acrylate monomer or oligomer may serve as a crosslinking agent to increase mechanical strength of the photosensitive resin layer, or to increase resistance to a developer and to provide flexibility of the cured film.
  • the content of the photopolymerizable compound including the (meth) acrylate monomer or oligomer can be adjusted, for example, compared to 100 parts by weight of the alkali developable binder resin including the carboxyl group 1 to 80 parts by weight of a photopolymerizable compound including a (meth)acrylate monomer or oligomer.
  • the photopolymerizable compound may be a monofunctional or polyfunctional (meth)acrylate monomer or oligomer.
  • the photopolymerizable compound As the photopolymerizable compound, a conventionally known monofunctional or polyfunctional (meth)acrylate monomer or oligomer may be used, but in order to satisfy the above-described characteristics, the monofunctional or polyfunctional (meth)acrylate monomer or oligomer may be used. A 2- to 10-functional (meth)acrylate monomer or oligomer containing an aromatic functional group in the molecule may be used.
  • the photopolymerizable compound may be a bifunctional (meth) acrylate compound represented by the following formula (1).
  • R 1 and R 2 are the same as or different from each other, H or CH 3 , and j and k are each an integer of 1 to 20.
  • the bifunctional (meth)acrylate compound of Formula 1 may include a bifunctional (meth)acrylate compound of Formula 11 below and a bifunctional (meth)acrylate compound of Formula 12 below.
  • R 11 and R 12 are the same as or different from each other, and are H or CH 3 , and J1 and K1 are each an integer of 1 to 8.
  • R 21 and R 22 are the same as or different from each other, and are H or CH 3 , and J2 and K2 are each an integer of 10 to 20.
  • the bifunctional (meth) acrylate compound of Formula 1 is the difunctional (meth) acrylate compound of Formula 11: the difunctional (meth) acrylate compound of Formula 12 in a ratio of 1:1 to 1:30. It may be included in weight ratio.
  • bifunctional (meth)acrylate compound of Formula 12 in an equivalent weight or more than the bifunctional (meth)acrylate compound of Formula 11, adhesion to the substrate is increased and resistance to developer is improved. As a result, excellent fine wire adhesion and resolution can be secured.
  • the photopolymerizable compound may further include a monofunctional or polyfunctional (meth)acrylate compound in addition to the bifunctional (meth)acrylate compound of Formula 1 above.
  • the usable monofunctional or polyfunctional (meth)acrylate compound excludes the compound included in the bifunctional (meth)acrylate compound of Formula 1 above.
  • Examples of additionally usable photopolymerizable compounds are not particularly limited, but ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate ), propylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, butylene glycol dimethacrylate, neopentyl glycol Dimethacrylate (neopentyl glycol dimethacrylate), 1,6-hexane glycol dimethacrylate (1,6-hexane glycol dimethacrylate), trimethylolpropane trimethacrylate, trimethylolpropane triacrylate (trimethyolpropane) triacrylate), glycerin dimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, dipentaerythritol pentamethacrylate, 2,2-bis
  • the supporting substrate may serve as a support for the photosensitive laminate, and may facilitate handling of the photosensitive resin layer having adhesive force during exposure.
  • various plastic films can be used, for example, an acrylic film, a polyethylene terephthalate (PET) film, a triacetyl cellulose (TAC) film, a polynorbornene (PNB) film, a cycloolefin polymer (COP) film , and may include at least one plastic film selected from the group consisting of a polycarbonate (PC) film.
  • PET polyethylene terephthalate
  • TAC triacetyl cellulose
  • PPB polynorbornene
  • COP cycloolefin polymer
  • PC polycarbonate
  • the photosensitive laminate may further include a protective film formed to face the supporting substrate with the photosensitive resin layer as a center.
  • the protective film prevents damage to the resist during handling and serves as a protective cover for protecting the photosensitive resin layer from foreign substances such as dust, and may be laminated on the back surface of the photosensitive resin layer on which the base film is not formed.
  • the protective film serves to protect the photosensitive resin layer from the outside, and it is easily detached when the dry film photoresist is applied in a post-process, and requires suitable releasability and adhesiveness so as not to be released during storage and distribution.
  • plastic films can be used as the protective film, for example, an acrylic film, a polyethylene (PE) film, a polyethylene terephthalate (PET) film, a triacetyl cellulose (TAC) film, a polynorbornene (PNB) film, a cyclo It may include at least one plastic film selected from the group consisting of an olefin polymer (COP) film, and a polycarbonate (PC) film.
  • the thickness of the protective film is not particularly limited, but can be freely adjusted within the range of, for example, 0.01 ⁇ m to 1 m.
  • a mixed solvent comprising a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or less; alkali developable binder resin including a carboxyl group; and a photoinitiator; and applying and drying a resin composition comprising a resin composition on a supporting substrate may be provided.
  • the photosensitive laminate described above in the embodiment may be provided.
  • the photosensitive laminate includes a supporting substrate; and a photosensitive resin layer formed on the paper substrate, wherein 5 cells/mm 2 or less may exist in the photosensitive resin layer having a diameter of less than 1 ⁇ m.
  • a diameter of less than 1 ⁇ m may be formed in the photosensitive resin layer for reasons such as bubbles generated during the solution preparation process of the photosensitive resin composition or the solution drying process of the composition.
  • the manufacturing method by using a mixed solvent including a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or less, the evaporation time of the solution of the photosensitive resin composition is delayed so that bubbles are not trapped in the numerical layer Accordingly, the number of bubbles having a diameter of less than 1 ⁇ m may be present in the photosensitive resin layer at 5/mm 2 or less.
  • the number of bubbles having a diameter of less than 1 ⁇ m in the photosensitive resin layer may be 5/mm 2 or less, or 3/mm 2 or less.
  • 3 bubbles/mm 2 or less having a diameter of less than 1 ⁇ m may exist.
  • bubbles having a diameter of less than 1 ⁇ m on the opposite surface of the interface between the supporting substrate and the photosensitive resin layer or the photosensitive resin layer toward the outer surface are present in a trace amount or substantially absent, the reliability during development is increased, resulting in a high-density circuit It is possible to form and reduce defects in the formation of fine wiring. Accordingly, when the photosensitive laminate is used, high sensitivity to exposure can be realized, and the manufacturing yield of a high-density printed circuit board can be improved.
  • the high boiling point solvent having a boiling point of 115° C. or higher may serve to slow the evaporation time of the liquid component of the photosensitive resin composition, thereby preventing air bubbles from being trapped in the numerical layer. Accordingly, 5 bubbles/mm 2 or less may exist in the photosensitive resin layer having a diameter of less than 1 ⁇ m.
  • the mixed solvent may include the high boiling point solvent having a boiling point of 115° C. or higher in a certain amount or more, for example, the content of the high boiling point solvent having a boiling point of 115° C. or higher relative to 100 parts by weight of the mixed solvent is 3 parts by weight or more. , or 5 parts by weight or more, or 3 to 50 parts by weight, or 5 to 40 parts by weight.
  • the dissolving power of the photosensitive resin composition can be increased.
  • the mixed solvent may contain a higher content of the low boiling point solvent having a boiling point of 100° C. or less than the high boiling point solvent having a boiling point of 115° C. or higher.
  • the mixed solvent includes the high boiling point solvent having a boiling point of 115° C. or higher: the low boiling point solvent having a boiling point of 100° C. or less in a weight ratio of 1:2 to 1:20, or 1:3 to 1:15 can do.
  • the high boiling point solvent having a boiling point of 115° C. or higher By including the low boiling point solvent having a boiling point of 100° C. or less in the above content, the dissolving power of the photosensitive resin_composition can be increased.
  • Examples of the high boiling point solvent having a boiling point of 115° C. or higher include butanol, dimethylformamide, N-methyl-2-pyrrolidone, gamma butyrolactone, butyl capitol, butyl cellosolve, methyl cellosolve, butyl acetate , Diethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, methyl 3-methoxy propionate, ethyl 3-ethoxy propionate, propylene glycol methyl ether pro Cypionate, dipropylene glycol dimethyl ether, cyclohexanone, propylene glycol monomethyl ether acetate (PGMEA), and one or more mixed solvents thereof are mentioned.
  • PMEA propylene glycol monomethyl ether acetate
  • Examples of the low boiling point solvent having a boiling point of 100° C. or less include methyl ethyl ketone, methanol, ethanol, acetone, tetrahydrofuran, ethyl acetate, isopropyl alcohol, and one or more mixed solvents thereof.
  • the resin composition may include a solid content in consideration of specific uses or fields of application, for example, the resin composition may include 10 to 99% by weight of the mixed solvent.
  • the method or apparatus that can be used in the step of applying and drying the resin composition on the supporting substrate is not particularly limited,
  • the resin composition may be coated on a conventional base film such as polyethylene terephthalate using a conventional coating method, and then dried to prepare a dry film.
  • a method of coating the resin composition is not particularly limited, and for example, a method such as a coating bar may be used.
  • the drying rate and/or drying temperature are adjusted. Through this, the amount of microbubbles formed in the photosensitive resin layer may be greatly reduced or may be substantially absent.
  • the drying of the coated resin composition may be performed by a heating means such as a hot air oven, a hot plate, a hot air circulation furnace, an infrared furnace, and a temperature of 50 ° C. to 100 ° C., or 60 ° C. to 90 ° C. of temperature, it can be carried out at a temperature of 70 °C to 85 °C.
  • a heating means such as a hot air oven, a hot plate, a hot air circulation furnace, an infrared furnace, and a temperature of 50 ° C. to 100 ° C., or 60 ° C. to 90 ° C. of temperature, it can be carried out at a temperature of 70 °C to 85 °C.
  • the drying time may vary depending on the drying temperature, for example, may be 30 seconds to 20 minutes, more specifically 1 minute to 10 minutes, or 3 minutes to 7 minutes.
  • the content of the alkali developable binder resin including a carboxyl group included in the resin composition includes the content described above in the photosensitive laminate of the embodiment.
  • the alkali developable binder resin including the carboxyl group may have a weight average molecular weight of 20,000 g/mol to 300,000 g/mol, or 30,000 g/mol to 150,000 g/mol, and a glass transition temperature of 20° C. or more and 150° C. or less.
  • the alkali developable binder resin including the carboxyl group may have an acid value of 100 mgKOH/g or more and 300 mgKOH/g.
  • the resin composition may further include a photopolymerizable compound including a (meth)acrylate monomer or oligomer together with an alkali developable binder resin including a carboxyl group.
  • the resin composition may include 1 to 80 parts by weight of a photopolymerizable compound including a (meth)acrylate monomer or oligomer based on 100 parts by weight of the alkali developable binder resin including the carboxyl group.
  • the photopolymerizable compound As the photopolymerizable compound, a conventionally known monofunctional or polyfunctional (meth)acrylate monomer or oligomer may be used, but in order to satisfy the above-described characteristics, the monofunctional or polyfunctional (meth)acrylate monomer or oligomer may be used. A 2- to 10-functional (meth)acrylate monomer or oligomer containing an aromatic functional group in the molecule may be used.
  • the photopolymerizable compound may be a bifunctional (meth) acrylate compound represented by the following formula (1).
  • R 1 and R 2 are the same as or different from each other, H or CH 3 , and j and k are each an integer of 1 to 20.
  • the bifunctional (meth)acrylate compound of Formula 1 may include a bifunctional (meth)acrylate compound of Formula 11 below and a bifunctional (meth)acrylate compound of Formula 12 below.
  • R 11 and R 12 are the same as or different from each other, and are H or CH 3 , and J1 and K1 are each an integer of 1 to 8.
  • R 21 and R 22 are the same as or different from each other, and are H or CH 3 , and J2 and K2 are each an integer of 10 to 20.
  • the bifunctional (meth) acrylate compound of Formula 1 is the difunctional (meth) acrylate compound of Formula 11: the difunctional (meth) acrylate compound of Formula 12 in a ratio of 1:1 to 1:30. It may be included in weight ratio.
  • bifunctional (meth)acrylate compound of Formula 12 in an equivalent weight or more than the bifunctional (meth)acrylate compound of Formula 11, adhesion to the substrate is increased and resistance to developer is improved. As a result, excellent fine wire adhesion and resolution can be secured.
  • the photoinitiator is a material that initiates a chain reaction of photopolymerizable monomers by UV and other radiation, and plays an important role in curing the photosensitive resin layer of the resin composition and the photosensitive laminate.
  • Examples of the compound that can be used as the photoinitiator include anthraquinone derivatives such as 2-methyl anthraquinone and 2-ethyl anthraquinone; and benzoin derivatives such as benzoin methyl ether, benzophenone, phenanthrene quinone, and 4,4'-bis-(dimethylamino)benzophenone.
  • anthraquinone derivatives such as 2-methyl anthraquinone and 2-ethyl anthraquinone
  • benzoin derivatives such as benzoin methyl ether, benzophenone, phenanthrene quinone, and 4,4'-bis-(dimethylamino)benzophenone.
  • the content of the photoinitiator is included in an amount of 0.1 to 20% by weight or 1% by weight or more and 10% by weight or less with respect to the total weight of the resin composition based on the solid content. When the content of the photoinitiator is within the above range, sufficient sensitivity can be obtained.
  • the production efficiency may be extremely reduced because the light efficiency is low and a large amount of exposure is required. If the content of the photoinitiator is too high, the film may be brittle and the developer contamination may be increased, which may lead to defects such as short circuit.
  • the resin composition may further include other additives as necessary.
  • the other additives include dibutyl phthalate, diheptyl phthalate, dioctyl phthalate, and diallyl phthalate in the form of phthalic acid esters as plasticizers; triethylene glycol diacetate, tetraethylene glycol diacetate in the form of glycol esters; p-toluene sulfonamide, benzenesulfonamide, n-butylbenzenesulfonamide in acid amide form; triphenyl phosphate and the like can be used.
  • the leuco dye include tris(4-dimethylamino-2-methylphenyl)methane, tris(4-dimethylamino-2methylphenyl)methane, and fluoran dye.
  • the contrast is favorable and it is preferable.
  • the content may be 0.1 wt% or more and 10 wt% or less in the photosensitive resin composition. From a viewpoint of expression of contrast, 0.1 weight% or more is preferable, and 10 weight% or less is preferable from a viewpoint of maintaining storage stability.
  • the coloring material for example, toluenesulfonic acid monohydrate, fucine, phthalocyanine green, auramine base, paramagenta, crystal violet, methyl orange, Nile Blue 2B, Victoria Blue, Malachite Green, Diamond Green, Basic Blue 20, etc.
  • the added amount may be 0.001% by weight or more and 1% by weight or less in the photosensitive resin composition. At a content of 0.001% by weight or more, there is an effect of improving handling, and at a content of 1% by weight or less, there is an effect of maintaining storage stability.
  • additives may further include a thermal polymerization inhibitor, a dye, a discoloring agent, an adhesion promoter, and the like.
  • a method for manufacturing a circuit board using the photosensitive laminate of the embodiment may be provided.
  • the photosensitive laminate of the embodiment may be used for lamination on copper clad laminates.
  • a pretreatment process is first performed in order to laminate a copper clad laminate, which is a raw material of the PCB.
  • the pretreatment process is in the order of drilling, deburing, and front face in the outer layer process, and undergoes face or pickling in the inner layer process.
  • face process bristle brush and jet pumice processes are mainly used, and soft etching and sulfuric acid pickling can be used for pickling.
  • the photosensitive laminate or dry film photoresist (hereinafter referred to as DFR) may be laminated on the copper layer of the copper-clad laminate.
  • DFR dry film photoresist
  • a photoresist layer of DFR is laminated on the copper surface while peeling off the protective film of DFR using a laminator.
  • it can proceed at a lamination speed of 0.5 to 3.5 m/min, a temperature of 100 to 130° C., and a roller pressure heating roll pressure of 10 to 90 psi.
  • the photoresist of the DFR may be exposed using a photomask having a desired circuit pattern formed thereon.
  • polymerization of the photoresist irradiated with ultraviolet rays may be initiated by the photoinitiator contained in the irradiated area.
  • oxygen in the photoresist is consumed, and then the activated monomer is polymerized to cause a crosslinking reaction. After that, a large amount of monomer is consumed and the polymerization reaction can proceed, and the unexposed area is left in a state where the crosslinking reaction has not proceeded. may exist.
  • a developing process of removing the unexposed portion of the photoresist is performed.
  • alkali developable DFR 0.8 to 1.2 wt% of potassium carbonate and sodium carbonate aqueous solution may be used as a developer.
  • the photoresist of the unexposed part is washed away by the saponification reaction of the carboxylic acid of the binder polymer and the developer in the developer, and the cured photoresist may remain on the copper surface.
  • a circuit may be formed through different processes according to the next inner layer and outer layer processes.
  • a circuit may be formed on the substrate through corrosion and peeling processes, and in the outer layer process, after plating and tenting processes, etching and solder peeling may be performed to form a predetermined circuit.
  • a commonly known light source more specifically, an ultra-high pressure mercury lamp or laser direct exposure equipment, may be used.
  • the photosensitive laminated body which can reduce defects in the formation of fine wiring, and can form high-density circuits with improved reliability during development, a manufacturing method of the photosensitive laminate, and a circuit board using the photosensitive laminate A method of manufacturing may be provided.
  • Example 1 is a photograph obtained by confirming the surface and cross-section of the photosensitive resin layer of Example 1 with a field emission scanning electron microscope (FE-SEM, 3000 ⁇ ) using a polarizing microscope.
  • FE-SEM field emission scanning electron microscope
  • FIG. 2 is a photograph confirming the surface and cross-section of the photosensitive resin layer of Comparative Example 2 with a field emission scanning electron microscope (FE-SEM, 3000 ⁇ ) using a polarizing microscope.
  • FE-SEM field emission scanning electron microscope
  • FIG. 3 is a photograph of the photosensitive resin layer of Comparative Example 1 exposed to ultraviolet light and alkali development, and the formed defects were confirmed with a field emission scanning electron microscope (FE-SEM, 3000 times).
  • FIG. 5 is a photograph of the photosensitive resin layer of Comparative Example 3 exposed to ultraviolet light and alkali-developed, and the formed defects were confirmed with a field emission scanning electron microscope (FE-SEM, 3000x).
  • a mechanical stirrer and a reflux device were installed in a four-necked round-bottom flask, and then the inside of the flask was purged with nitrogen.
  • the inside of the flask was purged with nitrogen.
  • 170 g of methyl ethyl ketone (Methyl Ethyl Ketone, MEK) and 12.5 g of methanol (Methanol, MeOH) were added, and then 2.25 g of azobisisobutyronitrile (AIBN) was added and completely dissolved.
  • the alkali developable binder resin prepared in Preparation Example was dissolved in tetrahydrofuran so as to have a concentration of 1.0 (w/w)% in THF (about 0.5 (w/w)% based on solid content), and a Syringe Filter of 0.45 ⁇ m Pore Size After filtration, 20 ⁇ l was injected into GPC.
  • tetrahydrofuran THF
  • the photopolymerizable compound and the alkali developable binder resin were added and mixed using a mechanical stirrer for about 1 hour to prepare a photosensitive resin composition.
  • the obtained photosensitive resin composition was coated on a 25 ⁇ m PET film using a coating bar.
  • the coated photosensitive resin composition layer was dried using a hot air oven, wherein the drying temperature was 80° C., the drying time was 5 minutes, and the thickness of the photosensitive resin layer after drying was 25 ⁇ m.
  • a photosensitive laminate (dry film photoresist) was prepared by lamination using a protective film (polyethylene) on the dried photosensitive resin composition layer.
  • Example 1 Example 2
  • Example 3 Example 4
  • Example 5 Example 6 Alkali Developable Binder Resin Preparation
  • Example 1 55 55 55 55 55 55 55 55 55 55 photopolymerizable compound M-2101 15 10 15 15 15 15 M-241 3 8 3 3 3 3 3 M-281 2 2 2 2 2 2 2 photoinitiator BCIM 3.5 3.5 3.5 3.5 3.5 3.5 9,10-dibutoxyanthracene 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
  • M2101 Bisphenol A (EO) 10 dimethacrylate (Miwon Specialty Chemical)
  • M281 Polyethylene glycol dimethacrylate (Miwon Specialty Chemical)
  • Example 4 of Patent Document 1 Based on the description of Example 4 of Patent Document 1, based on 300 parts by weight of the “alkali developable binder resin” obtained in Preparation Example 1 of the present specification, the following components were mixed using a mechanical stirrer for about 1 hour to achieve photosensitivity A resin composition was prepared.
  • polypropylene glycol diacrylate (the number of propylene glycol chains: 7) 50 parts by mass
  • photoinitiator 25 parts by mass of benzophenone, 1.0 part by mass of 2-(o-chlorophenyl)-4,5-diphenyl imidazole dimer, and 1.0 part by mass of diethylaminobenzophenone
  • the obtained photosensitive resin composition was coated on a 25 ⁇ m PET film using a coating bar.
  • the coated photosensitive resin composition layer was dried using a hot air oven, wherein the drying temperature was 80° C., the drying time was 5 minutes, and the thickness of the photosensitive resin layer after drying was 25 ⁇ m.
  • the dry film photoresist prepared in Examples and Comparative Examples was laminated on a 1.6 mm thick copper-clad laminate that had been brush-polished.
  • the lamination was performed using a HAKUTO MACH 610i, at a substrate preheating roll temperature of 120 °C, a laminator roll temperature of 115 °C, and a roll pressure of 4.0 kgf/cm2. and a roll speed of 2.0 min/m was applied.
  • Dry film photoresist laminated on a copper clad laminate was irradiated with UV rays of 405 nm wavelength using ORC's FDi-3, using a 41-layer step tablet from Stouffer Graphic Arts Equipment, and the remaining number of steps became 15 steps and left for 15 minutes. did. After that, Na 2 CO 3 1.0wt% aqueous solution was developed under the development conditions of the spray injection method. At this time, the amount of energy at which the determined number of remaining step steps becomes 15 steps was measured.
  • the dry film photoresist prepared in Examples and Comparative Examples was laminated on a 1.6 mm thick copper-clad laminate that had been brush-polished.
  • the lamination was performed using a HAKUTO MACH 610i, at a substrate preheating roll temperature of 120 °C, a laminator roll temperature of 115 °C, and a roll pressure of 4.0 kgf/cm2. and a roll speed of 2.0 min/m was applied.
  • ORC's using data formed at an interval of 0.5 ⁇ m from 4 to 20 ⁇ m so that the space interval between the circuit line width and the circuit line after development in the laminate is 1:1.
  • FDi-3 using a 41-step step tablet from Stouffer Graphic Arts Equipment, the remaining number of steps was 15 steps. After irradiating UV rays with a wavelength of 405 nm, it was left for 15 minutes. After that, development was carried out under the development conditions of a spray injection method with a 1.0 wt% aqueous solution of Na2CO3.
  • the dry film photoresist prepared in Examples and Comparative Examples was laminated on a 1.6 mm thick copper-clad laminate that had been brush-polished.
  • the lamination was performed using a HAKUTO MACH 610i, at a substrate preheating roll temperature of 120 °C, a laminator roll temperature of 115 °C, and a roll pressure of 4.0 kgf/cm2. and a roll speed of 2.0 min/m was applied.
  • the upper and lower surfaces of the resist were observed within a unit area (1 mm * 1 mm) using an electron microscope, and defects of 0.5 ⁇ m or more and 3 ⁇ m or less (Defect) ) was confirmed, and the surface and cross-section of the photosensitive resin layer obtained in each of Examples and Comparative Examples were examined using a field emission scanning electron microscope (FE-SEM, manufactured by Hitachi, magnification 3000 times). was observed using FE-SEM, manufactured by Hitachi, magnification 3000 times).
  • Example 1 50 8 0 0 Example 2 60 8 0 0 Example 3 50 8 0 0 Example 4 50 8 0 0 Example 5 50 8 One One Example 6 50 8 0 0 Comparative Example 1 50 10 36 15 Comparative Example 2 50 9 18 8 Comparative Example 3 350 15 17 8
  • the photosensitive resin layer of the photosensitive laminates of the Examples 1 bubble/mm 2 or less having a diameter of less than 1 ⁇ m exists, and 1 ⁇ m or more and 5 ⁇ m or less It was also confirmed that there was also no large bubble with a diameter of .
  • the photosensitive resin layer of the above embodiments does not substantially generate defects having a diameter of 0.5 ⁇ m or more and 3 ⁇ m or less, or 1 piece/mm 2 or less even after exposure to ultraviolet light and development with an alkaline solution. has been confirmed to occur.

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  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
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Abstract

La présente invention concerne: un stratifié photosensible comprenant un substrat de support et une couche de résine photosensible formée sur le substrat de support, le nombre de bulles ayant un diamètre inférieur à 1 µm présentes dans la couche de résine photosensible étant d'au plus 5/mm2; et un procédé de fabrication du stratifié photosensible.
PCT/KR2020/017150 2019-12-31 2020-11-27 Stratifié photosensible, procédé de fabrication de stratifié photosensible et procédé de fabrication de carte de circuit imprimé WO2021137443A1 (fr)

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CN202080088801.1A CN114846404A (zh) 2019-12-31 2020-11-27 光敏层压体、制造光敏层压体的方法和制造电路板的方法
JP2022538873A JP7535585B2 (ja) 2019-12-31 2020-11-27 感光性積層体、感光性積層体の製造方法、および回路基板の製造方法

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KR10-2019-0179860 2019-12-31
KR10-2020-0099130 2020-08-07
KR1020200099130A KR102250828B1 (ko) 2020-08-07 2020-08-07 감광성 적층체, 감광성 적층체 제조 방법, 및 회로 기판 제조방법
KR1020200125243A KR102341768B1 (ko) 2020-09-25 2020-09-25 감광성 적층체, 감광성 적층체 제조 방법, 및 회로 기판 제조방법
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