WO2022211457A1 - Stratifié photosensible et procédé de fabrication de carte de circuit imprimé - Google Patents

Stratifié photosensible et procédé de fabrication de carte de circuit imprimé Download PDF

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Publication number
WO2022211457A1
WO2022211457A1 PCT/KR2022/004423 KR2022004423W WO2022211457A1 WO 2022211457 A1 WO2022211457 A1 WO 2022211457A1 KR 2022004423 W KR2022004423 W KR 2022004423W WO 2022211457 A1 WO2022211457 A1 WO 2022211457A1
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photosensitive
weight
photosensitive resin
laminate
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PCT/KR2022/004423
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English (en)
Korean (ko)
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석상훈
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코오롱인더스트리 주식회사
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Priority claimed from KR1020210042141A external-priority patent/KR102686422B1/ko
Application filed by 코오롱인더스트리 주식회사 filed Critical 코오롱인더스트리 주식회사
Priority to CN202280018617.9A priority Critical patent/CN116964527A/zh
Publication of WO2022211457A1 publication Critical patent/WO2022211457A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/12—Esters of phenols or saturated alcohols
    • C08F222/20—Esters containing oxygen in addition to the carboxy oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • the present invention relates to a photosensitive laminate and a method for manufacturing a circuit board.
  • the photosensitive resin composition is used in the form of Dry Film Photoresist (DFR), Liquid Photoresist Ink, etc. used in Printed Circuit Board (PCB) or Lead Frame. .
  • DFR Dry Film Photoresist
  • PCB Printed Circuit Board
  • Lead Frame .
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2006-106287 (published on: April 20, 2006)
  • An object of the present invention is to provide a photosensitive laminate capable of reducing defects in the formation of fine wiring, and ensuring high reliability during development, and capable of forming high-density circuits.
  • this invention relates to the manufacturing method of the circuit board using the said photosensitive laminated body.
  • a barrier layer having a haze of 2% or less; and a photosensitive resin layer including a photopolymerizable compound and a binder resin including a phthalate derivative; wherein 5 cells/mm 2 or less are present in the photosensitive resin layer having a diameter of less than 1 ⁇ m. can be
  • a method for manufacturing a circuit board using the photosensitive laminate may be provided.
  • the weight average molecular weight means the weight average molecular weight in terms of polystyrene measured by the GPC method.
  • a commonly known analyzer and a detector such as a differential refraction detector and a column for analysis may be used, and the temperature at which it is normally applied Conditions, solvents, and flow rates can be applied.
  • the alkali developable binder resin is dissolved in tetrahydrofuran so as to have a concentration of 1.0 (w/w)% in THF (about 0.5 (w/w)% based on solid content), and a syringe of 0.45 ⁇ m Pore Size
  • 20 ⁇ l was injected into GPC, tetrahydrofuran (THF) was used as the mobile phase of GPC, and it was introduced at a flow rate of 1.0 mL/min, and the column was Agilent PLgel 5 ⁇ m Guard (7.5 x 50 mm) and Agilent PLgel 5 ⁇ m Mixed D (7.5 x 300 mm) were connected in series, and the Agilent 1260 Infinity II System, RI Detector was used as a detector for measurement at 40°C.
  • THF tetrahydrofuran
  • polystyrene standard samples obtained by dissolving polystyrene having various molecular weights as follows at a concentration of 0.1 (w/w)% in tetrahydrofuran were filtered with a 0.45 ⁇ m pore size Syringe Filter and then GPC The value of the weight average molecular weight (Mw) of the alkali developable binder resin was calculated using a calibration curve formed by injecting into the .
  • (photo)cured product or “(photo)cured” means not only when all of the components having an unsaturated group that can be cured or crosslinked in the chemical structure are cured, crosslinked or polymerized, but also a part of it is cured , cross-linked or polymerized.
  • a barrier layer having a haze of 2% or less; and a photosensitive resin layer including a photopolymerizable compound and a binder resin including a phthalate derivative; wherein 5 cells/mm 2 or less are present in the photosensitive resin layer having a diameter of less than 1 ⁇ m. can be
  • the present inventors have newly developed a photosensitive laminate comprising a barrier layer having a haze of 2% or less and a photosensitive resin layer having 5 cells/mm 2 or less of bubbles having a diameter of less than 1 ⁇ m, or 0.001 ⁇ m or more and less than 1 ⁇ m.
  • a photosensitive laminate comprising a barrier layer having a haze of 2% or less and a photosensitive resin layer having 5 cells/mm 2 or less of bubbles having a diameter of less than 1 ⁇ m, or 0.001 ⁇ m or more and less than 1 ⁇ m.
  • the present inventors have confirmed that excellent circuit pattern resolution can be realized in a dry film photoresist manufacturing process using a photosensitive laminate by including a barrier layer having excellent optical properties having a haze of 2% or less. Specifically, as a barrier layer having a haze of 2% or less is included, the barrier layer acts as an oxygen barrier film that blocks oxygen radical reaction, minimizing the formation of foreign substances or bubbles in the photosensitive resin layer. It was confirmed that the resolution and reliability of the resist could be improved, and the present invention was completed.
  • the barrier layer may have a haze of 2% or less, 0.001% or more and 2% or less, and 0.1% or more and 2% or less.
  • the haze measurement method is not particularly limited, but may be measured according to the measurement method of ASTM D1003 using, for example, a HAZE METER (model name: NDH7000, Nippon Denshoku Corporation).
  • the thickness of the barrier layer to be measured for the haze may be 0.1 ⁇ m to 10 ⁇ m, or 1 ⁇ m to 3 ⁇ m.
  • physical properties measured in the barrier layer may also change by a predetermined value.
  • the barrier layer is 10cc/m 2 /day or less, 5cc/m 2 /day or less, 4cc/m 2 /day or less, 0.01 cc/m 2 /day or more 10cc/m 2 /day It may have an oxygen permeability of 0.01 cc/m 2 /day or more and 5 cc/m 2 /day or less, or 0.01 cc/m 2 /day or more and 4 cc/m 2 /day or less.
  • the method for measuring the oxygen permeability is not particularly limited, but, for example, it may be measured according to the measurement method of ASTM F1927 using OX-Tran (Model 2/61, Mocon Corporation).
  • the thickness of the barrier layer to be measured for the oxygen permeability may be 0.1 ⁇ m to 10 ⁇ m, or 1 ⁇ m to 3 ⁇ m.
  • physical properties measured in the barrier layer may also change by a predetermined value.
  • the barrier layer has an oxygen permeability of 10 cc/m 2 /day or less
  • the barrier layer may act as an oxygen barrier film that blocks oxygen radical reaction, and thus formation of foreign substances or bubbles in the photosensitive resin layer is prevented. By minimizing it, the resolution and reliability of the final manufactured dry film photoresist can be improved.
  • the barrier layer may be formed from a composition for forming a barrier layer, and the composition for forming the barrier layer may include a polyvinyl alcohol resin.
  • the barrier layer is 5,000 g/mol to 1,000,000 g/mol, 7,000 g/mol to 750,000 g/mol, 7,000 g/mol to 700,000 g/mol, 7,000 g/mol to 50,000 g/mol, 7,000 g/mol to 30,000 g/mol, or a polyvinyl alcohol resin having a weight average molecular weight of 10,000 g/mol to 30,000 g/mol.
  • a haze of the barrier layer may satisfy 2% or less.
  • the polyvinyl alcohol resin may have a viscosity of 1.0 cP to 10.0 cP, 3.0 cP to 10.0 cP, 3.0 cP to 5.0 cP.
  • the viscosity of the polyvinyl alcohol resin satisfies 1.0 cP to 10.0 cP, the haze of the barrier layer may satisfy 2% or less.
  • composition for forming a barrier layer may include a high boiling point solvent having a boiling point of 115° C. or higher.
  • Examples of the high boiling point solvent having a boiling point of 115° C. or higher include butanol, dimethylformamide, N-methyl-2-pyrrolidone, gamma butyrolactone, butyl capitol, butyl cellosolve, methyl cellosolve, butyl acetate , Diethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, methyl 3-methoxy propionate, ethyl 3-ethoxy propionate, propylene glycol methyl ether pro cionate, dipropylene glycol dimethyl ether, cyclohexanone, propylene glycol monomethyl ether acetate (PGMEA), and one or more mixed solvents thereof.
  • PMEA propylene glycol monomethyl ether acetate
  • the composition for forming the barrier layer contains 60 parts by weight or more, 60 parts by weight or more and 200 parts by weight or less, 70 parts by weight or more and 200 parts by weight of the high boiling point solvent having a boiling point of 115° C. or more with respect to 100 parts by weight of the polyvinyl alcohol resin. It may be included in an amount of 80 parts by weight or more and 200 parts by weight or less, 80 parts by weight or more and 100 parts by weight or less, or 90 parts by weight or more and 100 parts by weight or less.
  • the haze of the barrier layer may satisfy 2% or less, .
  • the composition for forming the barrier layer contains less than 60 parts by weight of the high boiling point solvent having a boiling point of 115° C. or higher with respect to 100 parts by weight of the polyvinyl alcohol resin, the haze of the barrier layer rapidly increases. can occur
  • the thickness of the barrier layer and the photosensitive resin layer in the photosensitive laminate is not particularly limited, but as a specific example, the thickness of the barrier layer may be 0.1 ⁇ m to 10 ⁇ m, or 1 ⁇ m to 3 ⁇ m, and the thickness of the photosensitive resin layer may be 1 ⁇ m to 100 ⁇ m, or 5 ⁇ m to 50 ⁇ m.
  • the photosensitive laminate of the embodiment may further include a support substrate formed on the barrier layer and having a thickness of 1 ⁇ m to 100 ⁇ m.
  • the thickness of the supporting substrate may be 1 ⁇ m to 100 ⁇ m, or 5 ⁇ m to 50 ⁇ m. That is, the photosensitive laminate of the embodiment may have a laminate structure in which a supporting substrate, a barrier layer, and a photosensitive resin layer are sequentially laminated.
  • the supporting substrate may serve as a kind of carrier in the manufacturing process of the photosensitive laminate.
  • the supporting substrate may or may not be selectively included in the photosensitive laminate according to a semiconductor manufacturing process to which the photosensitive laminate is applied or a final manufactured product.
  • the photosensitive laminate of the embodiment may further include a release layer formed on the photosensitive resin layer and having a thickness of 0.01 ⁇ m to 1 m.
  • the thickness of the release layer may be 0.01 ⁇ m to 1 m, 1 ⁇ m to 100 ⁇ m, or 5 ⁇ m to 50 ⁇ m. That is, the photosensitive laminate of the embodiment may have a laminate structure in which a support substrate, a barrier layer, a photosensitive resin layer, and a release layer are sequentially stacked.
  • the supporting substrate and the release layer may be removed.
  • the photosensitive laminate includes a barrier layer having a haze of 2% or less, even if the supporting substrate is removed, the finally manufactured dry film photoresist may implement excellent reliability and resolution.
  • the number of bubbles having a diameter of less than 1 ⁇ m in the photosensitive resin layer is 5/mm 2 or less, or as substantially no bubbles exist, haze of 2% or less It can be applied to the semiconductor manufacturing process in a state in which only the barrier layer having a barrier layer is formed, and thus, even with a thinner thickness, reliability and sensitivity equal to or higher than that of the conventionally known photosensitive laminate can be realized.
  • the photosensitive laminate of the embodiment can be applied to a semiconductor manufacturing process in a state in which a supporting substrate such as a polyethylene terephthalate (PET) film is peeled off, separately performing the peeling process of the supporting substrate in the semiconductor manufacturing process It can be omitted, and it is possible to improve the limitations in optical properties, exposure, development, and sensitivity implementation due to the support substrate in a structure in which a supporting substrate such as a polyethylene terephthalate (PET) film is laminated or laminated.
  • PET polyethylene terephthalate
  • a mixed solvent including a high boiling point solvent having a and a low boiling point solvent having a boiling point of 100°C or less binder resin; photopolymerizable compounds including phthalate derivatives; and a photoinitiator; using a resin composition including, 5/mm 2 or less, or 3/mm 2 or less of bubbles having a diameter of less than 1 ⁇ m in the photosensitive resin layer.
  • a drying rate and/or a drying temperature in addition to using a mixed solvent including a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or lower, a drying rate and/or a drying temperature
  • a drying rate and/or a drying temperature in addition to using a mixed solvent including a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or lower, a drying rate and/or a drying temperature
  • the amount of microbubbles formed in the photosensitive resin layer can be greatly reduced or substantially absent through adjustment of the .
  • the number of bubbles having a diameter of less than 1 ⁇ m in the photosensitive resin layer may be 5 / mm 2 or less, or 3 / mm 2 or less, in particular the opposite surface of the interface between the support substrate and the photosensitive resin layer, or Bubbles having a diameter of less than 1 ⁇ m toward the outer surface of the photosensitive resin layer may or may not be present in a trace amount, more specifically, from the opposite surface of the interface between the barrier layer and the photosensitive resin layer of the photosensitive resin layer. Within 50% of the total thickness, 3 cells/mm 2 or less of cells having a diameter of less than 1 ⁇ m may be present.
  • the photosensitive laminate may not only contain a very small amount or substantially not contain the above-mentioned bubbles having a diameter of less than 1 ⁇ m, and may not include bubbles having a diameter of 1 ⁇ m or more and 5 ⁇ m or less.
  • the photosensitive resin layer is exposed to ultraviolet light and developed with an alkali solution, defects do not occur or occur over the entire area, and a very small amount may occur. It is not substantially present, and after development, micro-sized defects may be present in a very small amount on the lower surface or inside of the photosensitive resin layer.
  • 3 defects/mm 2 or less, or 1/mm 2 or less may be observed, and may be substantially absent.
  • the cross-sectional diameter of the defect may be defined as the largest diameter among diameters of the bond defined in a cross-section in one direction on the photosensitive resin layer.
  • the conditions of the exposure and development are not particularly limited.
  • the wavelength of the light irradiated to the photosensitive laminate is in the range of 340 nm to 420 nm, and the remaining number of steps measured using a 41-step step tablet manufactured by Stouffer Graphic Arts Equipment is 15 steps. It may proceed from 1 minute to 60 minutes.
  • the development may be carried out by a method such as a spray spray method with an aqueous alkali solution such as Na 2 CO 3 having a concentration of 0.1 to 3.0 wt%.
  • the photosensitive laminate when used, higher density and sensitivity can be realized while using lower energy. More specifically, the amount of energy at which the remaining number of steps is 15 steps measured using a 41-step step tablet manufactured by Stouffer Graphic Arts Equipment in a wavelength range of 340 nm to 420 nm of the light irradiated to the photosensitive laminate is 300 mJ/cm 2 It may be less than or equal to 100 mJ/cm 2 , and the resolution after development may be realized to be 15 ⁇ m or less, or 10 ⁇ m or less, 7 ⁇ m or less, or 5 ⁇ m or less.
  • the characteristics of the photosensitive laminate or the constitutional characteristics in which 5 cells/mm 2 or less of bubbles having a diameter of less than 1 ⁇ m are present in the photosensitive resin layer may be attributed to the above-described manufacturing method, and the photosensitive number It may be due to the characteristics of the strata.
  • the photosensitive resin layer may include an alkali developable binder resin including a carboxyl group.
  • the alkali developable binder may include at least one carboxyl group in a molecule to react with alkali during the development process.
  • alkali developable binder examples include a repeating unit represented by the following Chemical Formula 3, a repeating unit represented by the following Chemical Formula 4, a repeating unit represented by the following Chemical Formula 5, and a repeating unit represented by the following Chemical Formula 6 It may be a polymer or a copolymer including one or more repeating units selected from the group consisting of.
  • R 3 is hydrogen or an alkyl having 1 to 10 carbon atoms
  • R 4 is hydrogen or alkyl having 1 to 10 carbon atoms
  • R 5 is alkyl having 1 to 10 carbon atoms
  • Ar is aryl having 6 to 20 carbon atoms.
  • R 3 and R 4 are the same as or different from each other, and each independently represents hydrogen or alkyl having 1 to 10 carbon atoms, R 5 is alkyl having 1 to 10 carbon atoms, and Ar is 6 to 20 carbon atoms. is the aryl of
  • R 3 and R 4 are the same as or different from each other, and each independently may be any one of hydrogen or alkyl having 1 to 10 carbon atoms, and specific examples of the alkyl having 1 to 10 carbon atoms include methyl can be heard
  • R 5 is alkyl having 1 to 10 carbon atoms, and specific examples of the alkyl having 1 to 10 carbon atoms include methyl.
  • Ar is an aryl having 6 to 20 carbon atoms, and specific examples of the aryl having 6 to 20 carbon atoms include phenyl.
  • the repeating unit represented by Chemical Formula 4 may be a repeating unit derived from a monomer represented by the following Chemical Formula 4-1.
  • R 3 is hydrogen or alkyl having 1 to 10 carbon atoms.
  • the contents of R 3 are the same as those described above in Formula 4 above.
  • Specific examples of the monomer represented by Formula 4-1 include acrylic acid (AA) and methacrylic acid (MAA).
  • the repeating unit represented by the formula (5) may be a repeating unit derived from a monomer represented by the following formula (5-1).
  • R 4 is hydrogen or alkyl having 1 to 10 carbon atoms
  • R 5 is alkyl having 1 to 10 carbon atoms.
  • R 4 and R 5 are the same as described above in Formula 3 above.
  • Specific examples of the monomer represented by Formula 3-1 include methyl methacrylate (MMA) and butyl acrylate (BA).
  • the repeating unit represented by Chemical Formula 6 may be a repeating unit derived from a monomer represented by Chemical Formula 6-1.
  • Ar is aryl having 6 to 20 carbon atoms.
  • the content of Ar is the same as described above in Formula 4 above.
  • Specific examples of the monomer represented by Formula 6-1 include styrene (Styrene, SM).
  • the binder resin may serve as a base material for the photosensitive resin layer, and thus should have a minimum molecular weight, for example, 20,000 g/mol to 300,000 g/mol, 30,000 g/mol to 300,000 g/mol, It may have a weight average molecular weight of 30,000 g/mol to 250,000 g/mol, 30,000 g/mol to 200,000 g/mol, or 30,000 g/mol to 150,000 g/mol.
  • the binder resin should have heat resistance of at least a certain level, and accordingly, 20 °C or more and 150 °C or less, 50 °C or more and 150 °C or less, 70 °C or more and 150 °C or less, 70 °C or more 120 °C or less, 80 °C or more and 120 °C or less , or may have a glass transition temperature of 100 °C or more and 120 °C or less.
  • the binder resin is 100 mgKOH/g or more and 300 mgKOH/g or less, 120 mgKOH/g or more and 300 mgKOH/g or less, 120 mgKOH/g or more and 250 mgKOH/g or less in consideration of the developability of the photosensitive resin layer. , 120 mgKOH/g or more and 200 mgKOH/g or less, or 150 mgKOH/g or more and 200 mgKOH/g or less.
  • the binder resin may include two or more alkali-forming binders having different types or different properties.
  • the binder resin may include a first alkali developable binder resin and a second alkali developable binder resin.
  • the first alkali developable binder resin and the second alkali developable binder resin have a weight average molecular weight of 20,000 g/mol to 300,000 g/mol, 30,000 g/mol to 300,000 g/mol, 30,000 g/mol to 250,000 g/mol , 30,000 g/mol to 200,000 g/mol, or 30,000 g/mol to 150,000 g/mol, and the glass transition temperature is 20 °C or more and 150 °C or less, 50 °C or more and 150 °C or less, 70 °C or more and 150 °C or less, 70 °C It may be 120 °C or more, 80 °C or more and 120 °C or less, or 100 °C or more and 120 °C or less, and may have different weight average molecular weights, glass transition temperatures, or acid values, respectively.
  • the first alkali developable binder resin may have an acid value of 140 mgKOH/g or more and 160 mgKOH/g or less.
  • the second alkali developable binder resin may have an acid value of 160 mgKOH/g or more and 200 mgKOH/g or less.
  • the glass transition temperature ratio of the first alkali developable binder resin and the second alkali developable binder resin is 1:1.5 or more and 1:5 or less, 1:1.5 or more and 1:3 or less, 1:1.5 or more and 1:2 or less , 1:1.5 or more and 1:1.8 or less, 1:1.5 or more and 1:75 or less, or 1:1.6 or more and 1:7 or less.
  • the acid value ratio of the first alkali developable binder resin and the second alkali developable binder resin is 1:1.01 or more and 1:1.5 or less, 1:1.1 or more and 1:1.5 or less, 1:1.25 or more and 1:1.5 or less, or It may be 1:1.4 or more and 1:1.5 or less.
  • the photosensitive resin layer may include a crosslinked copolymer between a binder resin and a photopolymerizable compound including a phthalate derivative.
  • the photosensitive resin layer may include a crosslinked copolymer between an alkali developable binder resin and a photopolymerizable compound including a phthalate derivative.
  • the photopolymerizable compound including the phthalate derivative may serve as a crosslinking agent to increase mechanical strength of the photosensitive resin layer, or to increase resistance to a developer and to provide flexibility of the cured film.
  • the phthalate derivative may include a central group derived from phthalate and a reactive functional group bonded thereto.
  • the phthalate derivative may include 1 or more, or 2 or more, or 3 or more, or 10 or less reactive functional groups.
  • Specific examples of the reactive functional group include halogen, hydroxyl group, ether bond (-O-), ester bond (-COO- or O-CO-), amide bond (-NHCO- or CONH-), vinyl group, (meth)
  • An acrylate group or an aryl group is mentioned.
  • the phthalate derivative has the above-described structure, it is possible to more easily implement a fine pattern by increasing resistance to a plating solution or an etching solution.
  • the weight average molecular weight of the phthalate derivative is not particularly limited, but for example, 50 g/mol to 10,000 g/mol, or 70 g/mol to 5,000 g/mol, or 80 g/mol to 1,200 g/mol, or It may have a weight average molecular weight of 100 g/mol to 1,000 g/mol, or 150 g/mol to 500 g/mol.
  • phthalate derivative may include a compound of Formula 1 below.
  • R1 and R2 are each independently hydrogen or an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and the aliphatic hydrocarbon group is optionally a halogen atom, a hydroxyl group, an ether bond (-O-), an ester bond (-COO- or O-CO-), an amide bond (-NHCO- or CONH-), a (meth)acrylate group or an aryl group.
  • phthalate derivative or the compound of Formula 1 may include a compound of Formula 2 or a compound of Formula 3 below.
  • the content of the photopolymerizable compound including the phthalate derivative can be adjusted, for example, photopolymerizable including the phthalate derivative relative to 100 parts by weight of the alkali developable binder resin.
  • the photosensitive laminate of the embodiment two or more solvents having different boiling points are mixed and used as described in the manufacturing method to be described later, and a photopolymerizable compound containing a phthalate derivative is selected.
  • the microbubbles may be present in trace amounts or may be substantially absent.
  • a photosensitive laminate capable of forming high-density circuits by securing high reliability during development can be provided.
  • the photopolymerizable compound may further include a monofunctional or polyfunctional (meth)acrylate monomer or oligomer.
  • a monofunctional or polyfunctional (meth)acrylate monomer or oligomer may be used.
  • Examples of additionally usable photopolymerizable compounds are not particularly limited, but ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate) , tetraethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol Di (meth) acrylate (polypropylene glycol di (meth) acrylate), butylene glycol di (meth) acrylate (butylene glycol di (meth) acrylate), neopentyl glycol di (meth) acrylate (neopentyl glycol di (meth) )acrylate), 1,6-hexane glycol di(meth)acrylate (1,6-hexane glycol di(meth)acrylate), trimethylolpropane tri(meth)acrylate, trimethylol Propane triacrylate (trimethyolpropane triacrylate), g
  • the content of the monofunctional (meth) acrylate compound or the polyfunctional (meth) acrylate compound can be adjusted, for example, the photopolymerizable compound is 100 weight of the phthalate derivative. 50 parts by weight to 1500 parts by weight, 100 parts by weight to 1500 parts by weight, 110 parts by weight to 1500 parts by weight, 110 parts by weight to It may be included in an amount of 1000 parts by weight, 110 parts by weight to 900 parts by weight, 50 parts by weight to 500 parts by weight.
  • plastic films can be used as the supporting substrate, for example, an acrylic film, a polyethylene terephthalate (PET) film, a triacetyl cellulose (TAC) film, a polynorbornene (PNB) film, a cycloolefin polymer (COP) ) film, and at least one plastic film selected from the group consisting of a polycarbonate (PC) film.
  • PET polyethylene terephthalate
  • TAC triacetyl cellulose
  • PPB polynorbornene
  • COP cycloolefin polymer
  • PC polycarbonate
  • the release layer may include a protective film.
  • the photosensitive laminate may further include a protective film formed to face the supporting substrate with the photosensitive resin layer as a center.
  • the protective film prevents damage to the resist during handling and serves as a protective cover for protecting the photosensitive resin layer from foreign substances such as dust, and may be laminated on the back surface of the photosensitive resin layer on which the barrier layer is not formed.
  • the protective film serves to protect the photosensitive resin layer from the outside, and it is easily detached when the dry film photoresist is applied in a post-process, and requires proper releasability and adhesion so that it does not release when stored and distributed.
  • plastic films can be used as the protective film, for example, an acrylic film, a polyethylene (PE) film, a polyethylene terephthalate (PET) film, a triacetyl cellulose (TAC) film, a polynorbornene (PNB) film, a cyclo It may include at least one plastic film selected from the group consisting of an olefin polymer (COP) film, and a polycarbonate (PC) film.
  • the thickness of the protective film is not particularly limited, but can be freely adjusted within the range of, for example, 0.01 ⁇ m to 1 m.
  • a mixed solvent comprising a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or less; binder resin; photopolymerizable compounds including phthalate derivatives; And a photoinitiator; and coating and drying the resin composition containing the barrier layer on the barrier layer, a method of manufacturing a photosensitive laminate may be provided.
  • the photosensitive laminate described above in the embodiment may be provided.
  • the photosensitive laminate may include a barrier layer having a haze of 2% or less; and a photosensitive resin layer including a photopolymerizable compound including a phthalate derivative and a binder resin; 5 cells/mm 2 or less may be present in the photosensitive resin layer having a diameter of less than 1 ⁇ m.
  • a diameter of less than 1 ⁇ m may be formed in the photosensitive resin layer for reasons such as bubbles generated during the solution preparation process of the photosensitive resin composition or the solution drying process of the composition.
  • the manufacturing method by using a mixed solvent including a high boiling point solvent having a boiling point of 115° C. or higher and a low boiling point solvent having a boiling point of 100° C. or less, the evaporation time of the solution of the photosensitive resin composition is delayed so that bubbles are not trapped in the numerical layer Accordingly, the number of bubbles having a diameter of less than 1 ⁇ m in the photosensitive resin layer may be 5/mm 2 or less.
  • the number of bubbles having a diameter of less than 1 ⁇ m in the photosensitive resin layer may be 5/mm 2 or less, or 3/mm 2 or less.
  • 3 bubbles/mm 2 or less having a diameter of less than 1 ⁇ m may exist.
  • bubbles having a diameter of less than 1 ⁇ m on the opposite surface of the interface between the barrier layer and the photosensitive resin layer or on the outer surface of the photosensitive resin layer are present in a trace amount or substantially absent, reliability during development is increased, so that high-density It is possible to form a circuit and reduce defects in the formation of fine wiring. Accordingly, when the photosensitive laminate is used, high sensitivity to exposure can be realized, and the manufacturing yield of a high-density printed circuit board can be improved.
  • the high boiling point solvent having a boiling point of 115° C. or higher may serve to slow the evaporation time of the liquid component of the photosensitive resin composition, thereby preventing air bubbles from being trapped in the numerical layer. Accordingly, 5 bubbles/mm 2 or less may exist in the photosensitive resin layer having a diameter of less than 1 ⁇ m.
  • the mixed solvent may include the high boiling point solvent having a boiling point of 115° C. or higher in an amount of at least a certain amount, for example, the content of the high boiling point solvent having a boiling point of 115° C. or higher relative to 100 parts by weight of the mixed solvent is 3 parts by weight or more. , or 5 parts by weight or more, or 3 to 50 parts by weight, or 5 to 40 parts by weight.
  • the dissolving power of the photosensitive resin composition can be increased.
  • the mixed solvent may contain a higher content of the low boiling point solvent having a boiling point of 100° C. or less than the high boiling point solvent having a boiling point of 115° C. or higher.
  • the mixed solvent has a high boiling point having a boiling point of 115° C. or higher: 1:2 to 1:18, or 1:3 to 1:15, or 1:5 for a low boiling point solvent having a boiling point of 100° C. or less. to 1:10, or 1:6 to 1:8 by weight.
  • the high boiling point solvent having a boiling point of 115° C. or higher By including the low boiling point solvent having a boiling point of 100° C. or less in the above content, the dissolving power of the photosensitive resin composition can be increased.
  • Examples of the high boiling point solvent having a boiling point of 115° C. or higher include butanol, dimethylformamide, N-methyl-2-pyrrolidone, gamma butyrolactone, butyl capitol, butyl cellosolve, methyl cellosolve, butyl acetate , Diethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, methyl 3-methoxy propionate, ethyl 3-ethoxy propionate, propylene glycol methyl ether pro cionate, dipropylene glycol dimethyl ether, cyclohexanone, propylene glycol monomethyl ether acetate (PGMEA), and one or more mixed solvents thereof.
  • PMEA propylene glycol monomethyl ether acetate
  • Examples of the low boiling point solvent having a boiling point of 100° C. or less include methyl ethyl ketone, methanol, ethanol, acetone, tetrahydrofuran, ethyl acetate, isopropyl alcohol, and one or more mixed solvents thereof.
  • the resin composition may control the solid content in consideration of specific uses or fields of application, and for example, the resin composition may include 10 to 99% by weight of the mixed solvent.
  • the method or apparatus that can be used in the step of applying and drying the resin composition on the barrier layer is not greatly limited,
  • the photosensitive resin composition may be coated on the barrier layer using a conventional coating method, and then dried to prepare a dry film.
  • a method of coating the resin composition is not particularly limited, and for example, a method such as a coating bar may be used.
  • the drying rate and/or drying temperature are adjusted. Through this, the amount of microbubbles formed in the photosensitive resin layer can be greatly reduced or substantially absent.
  • the drying of the coated resin composition may be carried out by heating means such as a hot air oven, a hot plate, a hot air circulation furnace, an infrared furnace, and a temperature of 50 ° C. to 100 ° C., or 60 ° C. to 90 ° C. temperature, it can be carried out at a temperature of 70 °C to 85 °C.
  • heating means such as a hot air oven, a hot plate, a hot air circulation furnace, an infrared furnace, and a temperature of 50 ° C. to 100 ° C., or 60 ° C. to 90 ° C. temperature, it can be carried out at a temperature of 70 °C to 85 °C.
  • the drying time may vary depending on the drying temperature, for example, may be 30 seconds to 20 minutes, more specifically 1 minute to 10 minutes, or 3 minutes to 7 minutes.
  • the content regarding the binder resin included in the resin composition includes the content described above in the photosensitive laminate of the embodiment.
  • the binder resin is 20,000 g/mol to 300,000 g/mol, 30,000 g/mol to 300,000 g/mol, 30,000 g/mol to 250,000 g/mol, 30,000 g/mol to 200,000 g/mol, or 30,000 g/mol to A weight average molecular weight of 150,000 g/mol and 20 °C or more and 150 °C or less, 50 °C or more and 150 °C or less, 70 °C or more and 150 °C or less, 70 °C or more and 120 °C or less, 80 °C or more and 120 °C or less, or 100 °C or more and 120 °C It may have the following glass transition temperature.
  • the binder resin is 100 mgKOH/g or more and 300 mgKOH/g or less, 120 mgKOH/g or more and 300 mgKOH/g or less, 120 mgKOH/g or more and 250 mgKOH/g or less, 120 mgKOH/g or more and 200 mgKOH/g or less, or 150 It may have an acid value of mgKOH/g or more and 200 mgKOH/g or less.
  • the resin composition may include a photopolymerizable compound including a phthalate derivative together with an alkali developable binder resin.
  • the resin composition is 1 to 80 parts by weight, 1 to 50 parts by weight, 1 to 30 parts by weight, 1 to 20 parts by weight, 1 to 10 parts by weight of a photopolymerizable compound containing a phthalate derivative relative to 100 parts by weight of the alkali developable binder resin parts, including 2 to 50 parts by weight, 2 to 30 parts by weight, 2 to 20 parts by weight, 2 to 10 parts by weight, 3 to 50 parts by weight, 3 to 30 parts by weight, 3 to 20 parts by weight, 3 to 10 parts by weight can do.
  • the content of the photopolymerizable compound includes the content described above in the photosensitive laminate of the embodiment.
  • phthalate derivative examples include the compound of Formula 1 above.
  • compound of Formula 1 may include a compound of Formula 2 or a compound of Formula 3 below.
  • the photopolymerizable compound including the phthalate derivative may serve as a crosslinking agent to increase mechanical strength of the photosensitive resin layer, or to increase resistance to a developer and to provide flexibility of the cured film.
  • a crosslinking agent to increase mechanical strength of the photosensitive resin layer, or to increase resistance to a developer and to provide flexibility of the cured film.
  • a photosensitive laminate capable of forming high-density circuits by securing high reliability during development may be provided.
  • the photopolymerizable compound may further include a monofunctional (meth)acrylate compound or a polyfunctional (meth)acrylate compound.
  • the content of the monofunctional (meth) acrylate compound or the polyfunctional (meth) acrylate compound can be adjusted, for example, the photopolymerizable compound is 100 weight of the phthalate derivative. 50 parts by weight to 1500 parts by weight, 100 parts by weight to 1500 parts by weight, 110 parts by weight to 1500 parts by weight, 110 parts by weight to It may be included in an amount of 1000 parts by weight, 110 parts by weight to 900 parts by weight, 50 parts by weight to 500 parts by weight.
  • the photoinitiator is a material that initiates a chain reaction of photopolymerizable monomers by UV and other radiation, and plays an important role in curing the photosensitive resin layer of the resin composition and the photosensitive laminate.
  • Examples of the compound that can be used as the photoinitiator include anthraquinone derivatives such as 2-methyl anthraquinone and 2-ethyl anthraquinone; and benzoin derivatives such as benzoin methyl ether, benzophenone, phenanthrene quinone, and 4,4'-bis-(dimethylamino)benzophenone.
  • anthraquinone derivatives such as 2-methyl anthraquinone and 2-ethyl anthraquinone
  • benzoin derivatives such as benzoin methyl ether, benzophenone, phenanthrene quinone, and 4,4'-bis-(dimethylamino)benzophenone.
  • the content of the photoinitiator is included in an amount of 0.1 to 20% by weight or 1% by weight or more and 10% by weight or less, based on the solid content, based on the total weight of the resin composition. When the content of the photoinitiator is within the above range, sufficient sensitivity can be obtained.
  • the production efficiency may be extremely reduced because the light efficiency is low and a large amount of exposure is required. If the content of the photoinitiator is too high, the film may be brittle, and the contamination of the developer may be increased, which may lead to defects such as short circuit.
  • the resin composition may further include other additives as necessary.
  • Other additives include dibutyl phthalate, diheptyl phthalate, dioctyl phthalate, diallyl phthalate in the form of phthalic acid esters as plasticizers; triethylene glycol diacetate in the form of glycol esters, tetraethylene glycol diacetate; p-toluene sulfonamide, benzenesulfonamide, n-butylbenzenesulfonamide in acid amide form; triphenyl phosphate and the like can be used.
  • the leuco dye include tris(4-dimethylamino-2-methylphenyl)methane, tris(4-dimethylamino-2methylphenyl)methane, and fluoran dye.
  • the contrast is favorable and it is preferable.
  • the content may be 0.1% by weight or more and 10% by weight or less in the photosensitive resin composition. From a viewpoint of expression of contrast, 0.1 weight% or more is preferable, and 10 weight% or less is preferable from a viewpoint of maintaining storage stability.
  • the coloring material for example, toluenesulfonic acid monohydrate, fuchsine, phthalocyanine green, auramine base, paramagenta, crystal violet, methyl orange, Nile Blue 2B, Victoria Blue, Malachite Green, Diamond Green, Basic Blue 20, etc.
  • the added amount may be 0.001% by weight or more and 1% by weight or less in the photosensitive resin composition. At a content of 0.001% by weight or more, there is an effect of improving handling, and at a content of 1% by weight or less, there is an effect of maintaining storage stability.
  • additives may further include a thermal polymerization inhibitor, a dye, a discoloring agent, an adhesion promoter, and the like.
  • a method of manufacturing a circuit board using the photosensitive laminate of the embodiment may be provided.
  • the photosensitive laminate of the embodiment may be used for lamination on copper clad laminates.
  • a pretreatment process is first performed in order to laminate a copper-clad laminate, which is a raw material of the PCB.
  • the pretreatment process is in the order of drilling, deburing, and front face in the outer layer process, and undergoes face or pickling in the inner layer process.
  • face process bristle brush and jet pumice processes are mainly used, and soft etching and sulfuric acid pickling can be used for pickling.
  • the photosensitive laminate or dry film photoresist (hereinafter referred to as DFR) may be laminated on the copper layer of the copper-clad laminate.
  • DFR dry film photoresist
  • a photoresist layer of DFR is laminated on the copper surface while peeling off the protective film of DFR using a laminator.
  • it can proceed at a lamination speed of 0.5 to 3.5 m/min, a temperature of 100 to 130° C., and a roller pressure heating roll pressure of 10 to 90 psi.
  • the printed circuit board that has undergone the lamination process may be left for at least 15 minutes for stabilization of the substrate and then exposed to the photoresist of the DFR using a photomask having a desired circuit pattern formed thereon.
  • polymerization of the photoresist irradiated with ultraviolet rays may be initiated by the photoinitiator contained in the irradiated area. First, oxygen in the photoresist is consumed, and then the activated monomer is polymerized to cause a crosslinking reaction. After that, a large amount of monomer is consumed and the polymerization reaction can proceed. may exist.
  • a developing process of removing the unexposed portion of the photoresist is performed.
  • alkali developable DFR 0.8 to 1.2 wt% of potassium carbonate and sodium carbonate aqueous solution may be used as a developer.
  • the photoresist of the unexposed part is washed away by the saponification reaction of the carboxylic acid of the binder polymer and the developer in the developer, and the cured photoresist may remain on the copper surface.
  • a circuit may be formed through different processes according to the next inner layer and outer layer processes.
  • a circuit may be formed on the substrate through corrosion and peeling processes, and in the outer layer process, after plating and tenting processes, etching and solder peeling may be performed to form a predetermined circuit.
  • a commonly known light source more specifically, an ultra-high pressure mercury lamp or laser direct exposure equipment, may be used.
  • the photosensitive laminated body which can reduce defects in the formation of fine wiring, and can form high-density circuits with increased reliability during development, a manufacturing method of the photosensitive laminate, and a circuit board using the photosensitive laminate A manufacturing method may be provided.
  • Example 1 is a photograph confirming the surface and cross-section of the photosensitive resin layer of Example 1 with a field emission scanning electron microscope (FE-SEM, 800 ⁇ ) using a polarizing microscope.
  • FE-SEM field emission scanning electron microscope
  • FIG. 3 is a photograph obtained by confirming the surface and cross-section of the photosensitive resin layer of Comparative Example 2 with a field emission scanning electron microscope (FE-SEM, 800 ⁇ ) using a polarizing microscope.
  • FE-SEM field emission scanning electron microscope
  • a mechanical stirrer and a reflux device were installed in a four-necked round-bottom flask, and then the inside of the flask was purged with nitrogen.
  • the inside of the flask was purged with nitrogen.
  • 170 g of methyl ethyl ketone (Methyl Ethyl Ketone, MEK) and 12.5 g of methanol (Methanol, MeOH) were added, and then 2.25 g of azobisisobutyronitrile (AIBN) was added and completely dissolved.
  • the alkali developable binder resin prepared in Preparation Example 1 was dissolved in tetrahydrofuran so as to have a concentration of 1.0 (w/w)% in THF (about 0.5 (w/w)% based on solid content) to have a 0.45 ⁇ m pore size Syringe. After filtration using a filter, 20 ⁇ l was injected into GPC. As the mobile phase of GPC, tetrahydrofuran (THF) was used, and it was introduced at a flow rate of 1.0 mL/min, and the analysis was performed at 40°C.
  • THF tetrahydrofuran
  • polystyrene standard samples obtained by dissolving polystyrene having various molecular weights as follows at a concentration of 0.1 (w/w)% in tetrahydrofuran were filtered with a 0.45 ⁇ m pore size Syringe Filter and then GPC The value of the weight average molecular weight (Mw) of the alkali developable binder resin was calculated using a calibration curve formed by injecting into the .
  • a mechanical stirrer and a reflux device were installed in a four-necked round-bottom flask, and then the inside of the flask was purged with nitrogen.
  • 200 g of distilled water and 20 g of butyl cellosolve (BC) were added and completely dissolved.
  • 20 g of PVA-205 KURARAY, polyvinyl alcohol, viscosity: 3.5 cP, weight average molecular weight: 22,000 g/mol
  • BYK BYK-349
  • a mechanical stirrer and a reflux device were installed in a four-necked round-bottom flask, and then the inside of the flask was purged with nitrogen.
  • 200 g of distilled water and 10 g of butyl cellosolve (BC) were added and completely dissolved.
  • 20 g of PVA-205 KURARAY, polyvinyl alcohol, viscosity: 3.5 cP, weight average molecular weight: 22,000 g/mol
  • BYK-349 BYK
  • the composition for forming a barrier layer obtained in Preparation Example 2 was coated on a 25 ⁇ m PET film using a coating bar.
  • the coated barrier layer is dried using a hot air oven, where the drying temperature is 80 °C, the drying time is 10 minutes, the thickness of the barrier layer after drying is 2-3 ⁇ m, the haze value of the barrier layer is 1%, and oxygen
  • the transmittance was 3.5 cc/m 2 /day.
  • the photopolymerizable compound and the alkali developable binder resin were added and mixed using a mechanical stirrer for about 1 hour to prepare a photosensitive resin composition.
  • the obtained photosensitive resin composition was coated on the barrier layer using a coating bar.
  • the coated photosensitive resin composition layer was dried using a hot air oven, wherein the drying temperature was 80° C., the drying time was 5 minutes, and the thickness of the photosensitive resin layer after drying was 25 ⁇ m.
  • a photosensitive laminate (dry film photoresist) was prepared by lamination using a protective film (polyethylene) on the dried photosensitive resin composition layer.
  • the haze of the barrier layer is a value measured according to the measurement method of ASTM D1003 by peeling the PET film and using a HAZE METER (model name: NDH7000, Nippon Denshoku Co.).
  • the oxygen permeability of the barrier layer was 3.5 cc/m 2 /day, and was measured according to ASTM F1927 using an OX-Tran (Model 2/61, Mocon) instrument.
  • a photoinitiator was dissolved in an organic solvent, a photopolymerizable compound and an alkali developable binder resin were added, and mixed using a mechanical stirrer for about 1 hour to prepare a photosensitive resin composition. .
  • the obtained photosensitive resin composition was coated on a 25 ⁇ m PET film using a coating bar.
  • the coated photosensitive resin composition layer was dried using a hot air oven, wherein the drying temperature was 80° C., the drying time was 5 minutes, and the thickness of the photosensitive resin layer after drying was 25 ⁇ m.
  • a photosensitive laminate (dry film photoresist) was prepared by lamination using a protective film (polyethylene) on the dried photosensitive resin composition layer.
  • a photosensitive laminate (dry film photoresist) was prepared in the same manner as in Example 1, except that the composition for forming a barrier layer obtained in Preparation Example 3 was used instead of the composition for forming a barrier layer obtained in Preparation Example 2 .
  • the haze of the prepared barrier layer was 5%, and the haze of the barrier layer was peeled off the PET film before the photosensitive resin composition was applied, and according to the measurement method of ASTM D1003 using a HAZE METER (model name: NDH7000, Nippon denshoku Corporation). is the measured value.
  • the oxygen permeability of the prepared barrier layer was 4.0 cc/m 2 /day, and was measured according to the measurement method of ASTM F1927 using an OX-Tran (Model 2/61, Mocon Company) instrument.
  • a photosensitive laminate dry film photoresist
  • Comparative Example 4 Based on the description of Example 4 of Patent Document 1, 300 parts by weight of the “alkali developable binder resin” obtained in Preparation Example 1 of the present specification, the following components were mixed with a mechanical stirrer for about 1 hour A photosensitive laminate (dry film photoresist) was prepared in the same manner as in the above Example, except that the photosensitive resin composition was prepared by mixing.
  • polypropylene glycol diacrylate (the number of propylene glycol chains: 7) 50 parts by mass
  • photoinitiator 25 parts by mass of benzophenone, 1.0 parts by mass of 2-(o-chlorophenyl)-4,5-diphenyl imidazole dimer, and 1.0 part by mass of diethylaminobenzophenone
  • the dry film photoresist prepared in Examples and Comparative Examples was laminated on a 1.6 mm thick copper-clad laminate that had been brush-polished.
  • the lamination was performed using a HAKUTO MACH 610i, at a substrate preheating roll temperature of 120 °C, a laminator roll temperature of 115 °C, and a roll pressure of 4.0 kgf/cm2. and a roll speed of 2.0 min/m was applied.
  • Comparative Example 1 uses a 41-layer step tablet from Stouffer Graphic Arts Equipment using ORC's FDi-3 on a PET film of dry film photoresist laminated on a copper clad laminate, and has a 405 nm wavelength with an exposure amount such that the remaining number of steps is 15. After irradiation with ultraviolet light, it was left for 15 minutes. After that, Na 2 CO 3 1.0wt% aqueous solution was developed under the development conditions of the spray injection method. At this time, the amount of energy at which the determined number of remaining step steps becomes 15 steps was measured.
  • the dry film photoresist prepared in Examples and Comparative Examples was laminated on a 1.6 mm thick copper-clad laminate that had been brush-polished.
  • the lamination was performed using a HAKUTO MACH 610i, at a substrate preheating roll temperature of 120 °C, a laminator roll temperature of 115 °C, and a roll pressure of 4.0 kgf/cm2. and a roll speed of 2.0 min/m was applied.
  • the remaining step number was 15 steps, irradiated with ultraviolet light of a wavelength of 405 nm, and left for 15 minutes. After that, Na 2 CO 3 1.0wt% aqueous solution was developed under the development conditions of the spray injection method.
  • Comparative Example 1 uses a 41-layer step tablet from Stouffer Graphic Arts Equipment using ORC's FDi-3 on a PET film of dry film photoresist laminated on a copper clad laminate, and has a 405 nm wavelength with an exposure amount such that the remaining number of steps is 15. After irradiation with ultraviolet light, it was left for 15 minutes. After that, Na 2 CO 3 1.0wt% aqueous solution was developed under the development conditions of the spray injection method. At this time, the amount of energy at which the determined number of remaining step steps becomes 15 steps was measured.
  • the dry film photoresist prepared in Examples and Comparative Examples was laminated on a 1.6 mm thick copper-clad laminate that had been brush-polished.
  • the lamination was performed using a HAKUTO MACH 610i, at a substrate preheating roll temperature of 120 °C, a laminator roll temperature of 115 °C, and a roll pressure of 4.0 kgf/cm2. and a roll speed of 2.0 min/m was applied.
  • the upper and lower surfaces of the resist were observed within a unit area (1 mm * 1 mm) using an electron microscope, and defects of 0.5 ⁇ m or more and 3 ⁇ m or less (Defect) ) was confirmed, and the surface and cross-section of the photosensitive resin layer obtained in each of Examples and Comparative Examples were examined using a field emission scanning electron microscope (FE-SEM, manufactured by Hitachi, magnification 3000 times). was observed using FE-SEM, manufactured by Hitachi, magnification 3000 times).
  • Comparative Example 1 uses a 41-layer step tablet from Stouffer Graphic Arts Equipment using ORC's FDi-3 on a PET film of dry film photoresist laminated on a copper clad laminate, and has a 405 nm wavelength with an exposure amount such that the remaining number of steps is 15. After irradiation with ultraviolet light, it was left for 15 minutes. After that, Na 2 CO 3 1.0wt% aqueous solution was developed under the development conditions of the spray injection method. At this time, the amount of energy at which the determined number of remaining step steps becomes 15 steps was measured.
  • Example 1 50 5 0 0
  • Example 2 50 5 0 0
  • Example 3 50 5 0 0
  • Comparative Example 1 50 6
  • One 0 Comparative Example 2 50 8 11 7
  • Comparative Example 4 350 14 17 7
  • the photosensitive resin layer of the above embodiments does not substantially generate defects having a diameter of 0.5 ⁇ m or more and 3 ⁇ m or less, or 1 piece/mm 2 or less after exposure to ultraviolet light and development with an alkaline solution. has been confirmed to occur. That is, in the photosensitive resin layer of the above embodiments, bubbles having a diameter of less than 1 ⁇ m are present in a trace amount and include a barrier layer having a haze of 2% or less. It was also observed that it was possible to realize high density and sensitivity while securing and form finer wiring.

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La présente invention concerne un stratifié photosensible et un procédé de fabrication d'une carte de circuit imprimé à l'aide du stratifié photosensible, le stratifié photosensible comprenant : une couche barrière présentant un trouble inférieur ou égal à 2 % ; et une couche de résine photosensible contenant une résine liante et un composé photopolymérisable comprenant un dérivé de phtalate, les bulles ayant un diamètre inférieur à 1 μm étant présentes à 5/mm2 ou moins dans la couche de résine photosensible.
PCT/KR2022/004423 2021-03-31 2022-03-29 Stratifié photosensible et procédé de fabrication de carte de circuit imprimé WO2022211457A1 (fr)

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CN202280018617.9A CN116964527A (zh) 2021-03-31 2022-03-29 光敏层压体和使用该光敏层压体制造电路板的方法

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KR1020210042141A KR102686422B1 (ko) 2021-03-31 감광성 적층체, 및 회로 기판 제조방법
KR10-2021-0042141 2021-03-31

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JP2006106287A (ja) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法
KR20060088842A (ko) * 2005-02-02 2006-08-07 주식회사 코오롱 포지티브형 드라이 필름 포토레지스트 및 이를 제조하기위한 조성물
JP2007047771A (ja) * 2005-07-14 2007-02-22 Fujifilm Corp 感光性フィルム及びその製造方法、並びに永久パターン形成方法
KR20110067320A (ko) * 2009-12-14 2011-06-22 코오롱인더스트리 주식회사 드라이 필름 포토레지스트
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JP2018155802A (ja) * 2017-03-15 2018-10-04 日立化成株式会社 ポジ型感光性レジストドライフィルムの製造方法及びポジ型感光性レジストドライフィルム

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TW202244618A (zh) 2022-11-16
KR20220135887A (ko) 2022-10-07
TWI808703B (zh) 2023-07-11

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