WO2021120844A1 - 一种中框组件、中框组件的制备方法及电子设备 - Google Patents

一种中框组件、中框组件的制备方法及电子设备 Download PDF

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Publication number
WO2021120844A1
WO2021120844A1 PCT/CN2020/123271 CN2020123271W WO2021120844A1 WO 2021120844 A1 WO2021120844 A1 WO 2021120844A1 CN 2020123271 W CN2020123271 W CN 2020123271W WO 2021120844 A1 WO2021120844 A1 WO 2021120844A1
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WO
WIPO (PCT)
Prior art keywords
middle frame
antenna
conductive coating
oxide film
frame assembly
Prior art date
Application number
PCT/CN2020/123271
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English (en)
French (fr)
Inventor
杨永周
霍国亮
曹先锁
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021120844A1 publication Critical patent/WO2021120844A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H01Q1/244—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas extendable from a housing along a given path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Definitions

  • This application relates to the technical field of communication equipment, and in particular to a middle frame assembly, a method for preparing the middle frame assembly, and electronic equipment.
  • the antenna in the mobile phone is coated with an oxide film, that is, the antenna is protected by the oxide film to prevent the antenna from being oxidized and affecting the antenna signal transmission.
  • the antenna in the mobile phone (not shown in the figure, the antenna is laid on the middle frame 03 of the mobile phone) is electrically connected to the transceiver module (not shown in the figure) on the circuit board 01 through the metal elastic member 02
  • One end of the metal elastic member 02 is connected to the signal line on the circuit board 01, which is connected to the transceiver module for transmitting and receiving antenna signals, and the other end of the metal elastic member 02 is in contact with the antenna.
  • the technical problem of this structure is: after removing the oxide film in the laser engraving area, the oxide film in the laser engraving area will be uncleanly removed, and even the laser engraving area will appear uneven, which will cause the metal elastic part and the antenna to be uneven.
  • the contact of the feeder is unreliable to affect the transmission and reception of the antenna signal.
  • FIG 2 when the current is 200mA, multiple mobile phones with this structure perform harmonic interference on the surface where the metal elastic part contacts the antenna.
  • the curve formed by multiple harmonic margins is the curve P12, and the straight line P11 is the limit of the harmonic margin on the surface of the metal elastic part in contact with the antenna.
  • the embodiments of the present application provide a middle frame assembly, a preparation method of the middle frame assembly, and electronic equipment, and the main purpose is to improve the contact reliability between the metal elastic member and the antenna, so as to improve the stability of the antenna signal transmission and reception.
  • the present application provides a middle frame assembly, the middle frame assembly is configured to be installed on an electronic device, and the middle frame assembly includes:
  • the antenna is laid on the middle frame body
  • Oxide film the outside of the antenna is covered with an oxide film, and the position of the oxide film at the feeder part of the antenna is a hollow area;
  • the conductive coating at least covers the hollow area.
  • the position of the oxide film at the feed portion of the antenna is a hollow area, and the conductive coating at least covers the hollow area. Because the hollow area is covered with a conductive coating, the conductive coating and The feed part of the antenna is in contact and conduction, so that when the metal elastic part of the electronic device is connected to the antenna and the transceiver module, one end of the metal elastic part is connected to the transceiver module and the other end is in contact with the conductive coating to realize the feed part of the antenna Connection with the transceiver module.
  • the conductive coating is used as the conduction structure between the metal elastic part and the antenna, which will not cause the gap between the metal elastic part and the antenna and the phenomenon of insecure contact, which can effectively improve the reliability of the conduction between the metal elastic part and the antenna.
  • the conductive coating can be directly coated by printing, three-dimensional printing, spraying or plating. If conductive steel sheet is used, the processing space required for the subsequent conductive steel sheet spot welding process needs to be reserved on the middle frame body, and the conductive steel sheet The chip and the antenna cannot be completely contacted and connected, which will cause clutter, which affects the antenna's receiving and sending waveforms. Therefore, compared with the conductive steel sheet, the conductive coating not only effectively guarantees the reliability of the contact between the metal elastic part and the antenna, but also does not need to be reserved.
  • the processing space increases the size of the middle frame body.
  • the middle frame body includes a metal part and a plastic part
  • the antenna is laid on the metal part
  • the side of the antenna has a plastic part
  • the conductive coating covers at least a part of the plastic part.
  • the electronic device has components that can emit electromagnetic waves
  • the middle frame body includes a metal part and a plastic part
  • the antenna is laid on the metal part
  • the side of the plastic part facing the electromagnetic wave is covered with Conductive coating.
  • the conductive coating is made of conductive gold paste or conductive silver paste and other conductive metal pastes.
  • the present application also provides a method for preparing a middle frame component, which is used to prepare the middle frame component in the first aspect or any implementation of the first aspect.
  • the preparation method of the middle frame component includes:
  • the conductive coating is applied so that the conductive coating at least covers the hollow area.
  • the antenna covered with the oxide film is first laid on the body of the middle frame, and then the oxide film on the feed part of the antenna is removed, that is, the oxide film is located on the antenna
  • the oxide film of the power feeding part is removed to expose the power feeding part, and then a conductive coating is applied, and the conductive coating covers at least the hollow area, so that the conductive coating and the antenna will be in contact and conduction.
  • the middle frame component prepared by the preparation method When the middle frame component prepared by the preparation method is applied to an electronic device, when the metal elastic part of the electronic device is connected to the antenna and the transceiver module, one end of the metal elastic part is connected with the transceiver module, and the other end is in contact with the conductive coating to realize the antenna Connection with the transceiver module.
  • the conductive coating is used as the conductive structure between the metal elastic part and the antenna, which will not cause gaps between the metal elastic part and the antenna and the phenomenon of insecure contact, which can effectively improve the reliability of the connection between the metal elastic part and the antenna, and guarantee The stability of antenna signal transmission.
  • the method further includes: cleaning the removed impurities with a cleaning solution and drying them. After the removal process, there will be impurities after removal on the oxide film.
  • the cleaning solution cleans and removes impurities.
  • the removed impurities are cleaned and then dried to ensure that there is no cleaning solution on the oxide film and the hollow area.
  • the cleaning liquid is alcohol
  • coating the conductive coating includes: printing, three-dimensional printing, spraying, or plating and drying the conductive coating.
  • printing, three-dimensional printing, spraying, or electroplating can be used.
  • the conductive coating applied by these processes is uniform to ensure the stability of the conduction between the metal elastic part and the antenna, and through the The coated conductive coating is dried to ensure that the conductive coating reliably adheres to the hollow area or oxide film.
  • the drying temperature is 80°C to 130°C.
  • this application also provides an electronic device, including:
  • a middle frame component the middle frame component being the middle frame component in the foregoing first aspect or any implementation manner of the first aspect
  • Circuit board the circuit board is arranged on the middle frame body, and the transceiver module is arranged on the circuit board;
  • the metal elastic piece is formed with a connecting part and a contact part, the connecting part is electrically connected with the transceiver module, and the contact part is in contact with the conductive coating.
  • the electronic device provided by the embodiments of the present application includes the middle frame assembly of any of the above technical solutions, so that it is connected to the transceiver module through the connecting part of the metal elastic part, and the contact part of the metal elastic part is in contact with the conductive coating. To the conduction between the module and the antenna.
  • the electronic equipment provided by the embodiments of the present application and the middle frame assembly described in the above technical solutions can solve the same technical problems and achieve the same expected effects.
  • the metal elastic member includes a metal elastic sheet or conductive silica gel.
  • the structure is simple and the manufacturing is convenient.
  • the electronic device is a mobile phone, a tablet computer, etc.
  • Figure 1 is a schematic diagram of a partial structure of an electronic device in the prior art
  • FIG. 2 is a graph formed by harmonic margins of multiple mobile phones using the structure shown in FIG. 1;
  • FIG. 3 is a schematic diagram of the structure of a frame assembly in an embodiment of the application.
  • FIG. 4 is a schematic diagram of a partial structure of the circuit board, the metal elastic member, and the middle frame assembly in the embodiment of the application;
  • Figure 5 is an enlarged view of A in Figure 4.
  • FIG. 6 is a schematic diagram of a partial structure of the circuit board, the metal elastic member, and the middle frame assembly in the embodiment of the application;
  • FIG. 7 is a top view of the connection between the conductive coating and the middle frame body according to the embodiment of the application.
  • FIG. 8 is a graph formed by the harmonic margins of multiple mobile phones using the structure shown in FIG. 4 or FIG. 6;
  • FIG. 9 is a top view of the connection between the conductive coating and the middle frame body according to the embodiment of the application.
  • FIG. 10 is a flowchart of a method for manufacturing a frame assembly in an embodiment of the application.
  • the embodiments of the present application relate to electronic equipment, a middle frame component, and a manufacturing method of a middle frame component.
  • the preparation method of the electronic device, the middle frame component and the middle frame component will be described in detail below with reference to the drawings.
  • an embodiment of the present application provides an electronic device.
  • the electronic device includes a middle frame assembly 1, a circuit board 15 and a metal elastic member 14.
  • the circuit board 15 is arranged on the middle frame assembly 1.
  • the circuit board 15 is provided with a transceiver module (not shown in the figure)
  • the middle frame assembly 1 includes an antenna
  • the metal elastic member 14 is formed with a connecting part and a contact part.
  • the connecting part is electrically connected with the transceiver module, and the contact part is in contact with the antenna.
  • the metal elastic piece connects the transceiver module with the antenna.
  • the electronic device provided in the embodiments of the present application may be a mobile phone, a tablet computer or other electronic products, and there is no limitation on the electronic device, and any electronic device is within the protection scope of the present application.
  • the middle frame assembly 1 includes a middle frame body 111, an antenna 121, and a conductive material. Coating 13, wherein the antenna 121 is laid on the middle frame body 111, the outside of the antenna 121 is covered with an oxide film 122, the position of the oxide film 122 at the feeding part of the antenna 121 is a hollow area Q, and the conductive coating 13 At least cover the hollow area Q.
  • the conductive coating 13 covering at least the hollow area Q includes: the conductive coating 13 exactly covers the hollow area Q, or the conductive coating 13 covers the hollow area Q and also covers the area other than the hollow area Q For example, the entire oxide film 122 is covered, or even the area outside the oxide film 122 is covered.
  • the conductive coating 13 Since at least the hollow area Q is covered with the conductive coating 13, so that the conductive coating 13 will be in contact with the antenna 121, that is, the conductive coating 13 serves as the conductive structure between the antenna 121 and the metal elastic member 14, and the conductive coating 13 is pasted and covered.
  • the conductive coating can ensure the metal elastic member and the feeding part of the antenna. The reliability of the connection will not generate clutter due to the incomplete conduction between the metal elastic member and the antenna, which will affect the difference between the antenna's transmit and receive waveform and the preset waveform. Therefore, the middle frame component provided by the embodiment of the application will improve the antenna The stability of signal transmission.
  • a conductive steel sheet may also be provided.
  • the conductive steel sheet covers at least the hollow area, and the metal elastic member is connected to the feed portion of the antenna through the conductive steel sheet.
  • the conductive coating is compared with the conductive steel. The advantage of the sheet is: due to the small area of the hollow area, if only the conductive steel sheet covers the hollow area, the size of the conductive steel sheet required is also relatively small, which is likely to cause greater difficulty in processing the conductive steel sheet.
  • the conductive steel sheet has a certain rigidity, resulting in The conductive steel sheet cannot be in close contact with the feed part of the antenna, and there will be gaps between them. Eventually, the metal elastic part cannot be in close contact with the feed part of the antenna, which also affects the stability of the antenna signal transmission.
  • the embodiment of the electrical connection between the connecting portion of the metal elastic piece and the transceiver module is as follows: the circuit board has a signal line electrically connected with the transceiver module, and the connecting portion of the metal elastic piece is welded to the signal line.
  • the manner in which the connecting portion of the metal elastic member is electrically connected to the transceiver module can also be other structures.
  • the conductive coating can be made of conductive gold paste, or made of conductive silver paste, because the conductive gold paste and the conductive silver paste have better current conductivity, that is, it will also improve the stability of the antenna receiving and sending signals. Sex.
  • the metal elastic member may have various implementation structures.
  • the metal elastic member includes a metal elastic sheet; for another example, the metal elastic member includes conductive silica gel.
  • the middle frame body 111 includes a metal part 111A and a plastic part 111B.
  • the antenna is laid on the metal part 111A.
  • the side of the antenna has a plastic part 111B.
  • the conductive coating 13 covers at least Part of the plastic part 111B.
  • the conductive coating 13 covering at least a part of the plastic part 111B means that the conductive coating 13 may cover part of the plastic part 111B, or may cover all the plastic part 111B.
  • the metal elastic part cannot accurately contact the antenna, but contacts the plastic part on the side.
  • the conductive coating will cover at least part of the plastic part. In this way, even if the metal elastic piece cannot be connected to the feeding part of the antenna, but is in contact with the conductive coating on the plastic part, it will still The connection between the metal elastic member and the feed part of the antenna can be ensured.
  • the harmonic margin on the contact surface of the metal elastic parts of the multiple mobile phones with the middle frame assembly of the embodiment of the present application and the antenna, and the multiple harmonic margins are formed
  • the curve is the curve P1
  • the straight line P2 is the limit of the harmonic margin on the surface of the metal elastic part in contact with the antenna.
  • the antenna In electronic equipment, components that can emit electromagnetic waves (for example, liquid crystal displays, radio frequency devices, or camera modules, etc.) can interfere with the antenna signal.
  • the antenna In order to prevent the electromagnetic waves emitted by these components from passing through the plastic part and affecting the antenna signal, some In the embodiment, the antenna is laid on the metal part. Referring to Figure 9, the side of the plastic part facing the electromagnetic waves is covered with a conductive coating 13, that is, the conductive coating prevents the electromagnetic waves emitted by the components from passing through the plastic part to interfere with the transmission and reception of antenna signals. .
  • the electromagnetic waves emitted by the copper foil component isolation components can also be arranged to pass through the plastic part to interfere with the transmission and reception of the antenna signal.
  • the advantage of using a conductive coating over copper foil components is: the thickness of the general copper foil component The thickness of the conductive coating is about 0.10mm, but the thickness of the conductive coating is 0.01mm to 0.05mm. The thickness of the conductive coating is obviously less than the thickness of the copper foil component, so that it will not occupy a large installation space inside the electronic device.
  • the copper foil component Generally, an adhesive layer is used to bond the middle frame body. The adhesive layer cannot ensure that the copper foil component and the middle frame component are evenly bonded. With the long-term use of electronic equipment, blistering may occur. Therefore, conductive coating is used. The layer is significantly better than copper foil components.
  • the embodiment of the present application also provides a method for preparing a middle frame assembly.
  • the method for preparing a middle frame assembly includes the following steps:
  • S02 Remove the oxide film on the power feeding part of the antenna, so that the oxide film is located at the position of the power feeding part of the antenna to form a hollow area.
  • the oxide film on the feeder portion on the antenna is removed.
  • the advantage achieved by this process is that the oxide film has poor conductivity, and exposing the antenna can improve the conduction performance between the antenna and the metal elastic member.
  • the oxide film is removed on the feeding part of the antenna, so that the oxide film is located at the position of the feeding part to form a hollow area , And then expose the feeder part to transmit signals with the transceiver module; then apply a conductive coating, the conductive coating covers the hollow area or covers the hollow area and places other than the hollow area, usually, the conductive coating will cover To the place outside the hollow area, in this way, under the premise of ensuring that the metal elastic piece can be connected with the feed part of the antenna, the processing technology is simplified.
  • the subsequent conductive coating will be conductive. Impurities mixed in the coating not only affect the adhesion of the conductive coating, but also affect the signal transmission between the antenna's feeder and the transceiver module. Therefore, after removing the oxide film on the antenna's feeder, it also includes: cleaning fluid Wash impurities and air dry.
  • the cleaning fluid can be alcohol or other volatile cleaning fluids. After the cleaning fluid is used to clean impurities, the conductive coating cannot be applied immediately, because the cleaning fluid remains in the hollow area of the oxide film, which will affect the adhesion of the conductive coating. After cleaning the impurities, it needs to be air-dried to evaporate the remaining cleaning liquid.
  • S021 The oxide film on the power feeding part of the laser engraving antenna, so that the oxide film is located at the position of the power feeding part of the antenna to form a hollow area.
  • S031 Use alcohol to clean the impurities after laser engraving and dry it.
  • S022 The oxide film on the power feeding part of the laser carving antenna, so that the oxide film is located at the position of the power feeding part of the antenna to form a hollow area.
  • S032 Use alcohol to clean the impurities after laser engraving and dry it.
  • S042 Three-dimensional printing of the conductive coating so that the conductive coating at least covers the hollow area.
  • S023 The oxide film on the power feeding part of the laser engraving antenna, so that the oxide film is located at the position of the power feeding part of the antenna to form a hollow area.
  • S033 Use alcohol to clean impurities after laser engraving and dry it.
  • S043 Spray conductive coating so that the conductive coating at least covers the hollow area.
  • S024 Use a mechanical processing machine tool to remove the oxide film on the feed portion of the antenna, so that the oxide film forms a hollow area at the position of the feed portion of the antenna.
  • electroplating used in step S044 may also be vapor deposition, electroless plating, or the like.

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Abstract

本申请实施例提供一种中框组件、中框组件的制备方法及电子设备，涉及通讯设备技术领域。该中框组件用于设置在电子设备上，该中框组件包括：中框本体；天线，天线铺设在中框本体上；氧化膜，天线的外部包覆有氧化膜，氧化膜的位于金属片的馈电部的位置处为镂空区；导电涂层，导电涂层至少覆盖住镂空区。本申请实施例提供的中框组件、中框组件的制备方法及电子设备，用于提高金属弹性件与金属片的接触可靠性，以提高天线信号的收发稳定性。

Description

一种中框组件、中框组件的制备方法及电子设备
本申请要求于2019年12月20日提交国家知识产权局、申请号为201911329846.9发明名称为“一种中框组件、中框组件的制备方法及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通讯设备技术领域，尤其涉及一种中框组件、中框组件的制备方法及电子设备。
背景技术
手机内的天线的外部包覆有氧化膜，即通过氧化膜保护天线，防止天线被氧化影响天线信号的传输。现有技术中，参照图1，手机内的天线(图中未显示，天线铺设在手机中框03上)是通过金属弹性件02与线路板01上的收发模块(图中未显示)电连接，金属弹性件02的一端与线路板01上的信号线连接，该信号线与用于收发天线信号的收发模块连接，金属弹性件02的另一端接触天线，为了促使金属弹性件与天线接触，需要在氧化膜的位于天线馈电部的区域进行镭雕，以将镭雕区域的氧化膜去除，进而将包覆在氧化膜内的天线的馈电部外露，这样金属弹性件就可以与天线的馈电部接触，保障天线信号的传输。
但是，该结构存在的技术问题是：将镭雕区域的氧化膜去除后，会出现镭雕区域的氧化膜去除不干净，甚至镭雕区域出现凹凸不平的现象，进而导致金属弹性件与天线的馈电部的接触不可靠，以影响天线信号的收发，如图2所示为在电流为200mA的情况下，具有该结构的多个手机进行金属弹性件与天线接触的面上的谐波余量，且多个谐波余量形成的曲线为曲线P12，直线P11为金属弹性件与天线接触的面上的谐波余量限值，由图中看出，金属弹性件与天线接触的面上的多个谐波余量分散，且存在多个超过谐波余量限值的现象，即由于金属弹性件与天线的馈电部的接触不可靠，存在杂波现象，进而会影响天线收发信号的稳定性。
发明内容
本申请的实施例提供一种中框组件、中框组件的制备方法及电子设备，主要目的是提高金属弹性件与天线的接触可靠性，以提高天线信号的收发稳定性。
为达到上述目的，本申请的实施例采用如下技术方案：
第一方面，本申请提供了一种中框组件，该中框组件用于设置在电子设备上，该中框组件包括：
中框本体；
天线，天线铺设在中框本体上；
氧化膜，天线的外部包覆有氧化膜，氧化膜的位于天线的馈电部的位置处为镂空区；
导电涂层，导电涂层至少覆盖住镂空区。
本申请实施例提供的中框组件，氧化膜的位于天线的馈电部的位置处为镂空区， 且导电涂层至少覆盖住镂空区，由于在镂空区覆盖有导电涂层，导电涂层与天线的馈电部接触导通，这样当电子设备的金属弹性件连接天线和收发模块时，金属弹性件的一端与收发模块连接，另一端与导电涂层接触，就可实现天线的馈电部与收发模块的连接。采用导电涂层作为金属弹性件与天线之间的导通结构，不会造成金属弹性件与天线之间出现间隙、接触不牢靠的现象，能够有效提高金属弹性件与天线的导通可靠性，以使天线收发波形与预设波形差异小，保障天线信号传输的稳定性。另外，导电涂层可采用印刷、三维打印、喷涂或者镀等工艺直接涂覆，若采用导电钢片，需要在中框本体上预留后续导电钢片点焊工艺需要的加工空间，且导电钢片与天线不能完全接触导通而产生杂波，影响天线收发波形，所以，导电涂层相比导电钢片，不仅有效保障了金属弹性件与天线接触的可靠性，还不会因为需要预留加工空间而增加中框本体的尺寸的现象。
在第一方面可能的实现方式中，中框本体包括金属部和塑胶部，天线铺设在金属部上，天线的旁侧具有塑胶部，导电涂层覆盖住至少部分塑胶部。当天线的旁侧具有塑胶部，且金属弹性件由于装配公差或者设计公差导致金属弹性件不能与天线接触，而与塑胶部接触时，通过将导电涂层覆盖住至少部分塑胶部，依然可以保障通过金属弹性件将天线与收发模块连接。
在第一方面可能的实现方式中，电子设备上具有元器件，元器件可发射电磁波，中框本体包括金属部和塑胶部，天线铺设在金属部上，塑胶部的朝向电磁波的一侧覆盖有导电涂层。当元器件发射的电磁波穿过塑胶部传输至天线时，会成为天线所收发信号的干扰信号，通过在塑胶部的朝向电磁波的一侧覆盖导电涂层，即通过导电涂层屏蔽信号传输至天线。
在第一方面可能的实现方式中，导电涂层为导电金浆或导电银浆等能实现导通的金属导电浆制得。
第二方面，本申请还提供了一种中框组件的制备方法，用于制备上述第一方面或第一方面的任一实现方式中的中框组件，中框组件的制备方法包括：
将包覆有氧化膜的天线铺设在中框本体上；
去除天线的馈电部上的氧化膜，以使氧化膜的位于天线的馈电部的位置处形成镂空区；
涂覆导电涂层，以使导电涂层至少覆盖住镂空区。
本申请实施例提供的中框组件的制备方法，首先将包覆有氧化膜的天线铺设在中框本体上，再去除天线的馈电部上的氧化膜，也就是将氧化膜的位于天线的馈电部的氧化膜去除，以使馈电部外露，再涂覆导电涂层，且导电涂层至少覆盖住镂空区，这样导电涂层与天线会接触导通。该制备方法制备的中框组件应用在电子设备时，当电子设备的金属弹性件连接天线和收发模块时，金属弹性件的一端与收发模块连接，另一端与导电涂层接触，就可实现天线与收发模块的连接。采用导电涂层作为金属弹性件与天线之间的导通结构，不会造成金属弹性件与天线之间出现间隙、接触不牢靠的现象，能够有效提高金属弹性件与天线的连接可靠性，保障天线信号传输的稳定性。
在第二方面可能的实现方式中，去除天线的馈电部上的氧化膜之后还包括：清洗液清洗去除后的杂质并进行晾干。进行去除工艺之后，氧化膜上会存在去除后的杂质， 为了保障后续涂覆导电涂层时，导电涂层能够与天线牢固贴合，在将天线的馈电部上的氧化膜去除之后，采用清洗液清洗去除后的杂质，为了防止清洗液影响导电涂层的附着力，去除后的杂质被清洗掉后，再进行晾干，保障氧化膜上以及镂空区内没有清洗液。
在第二方面可能的实现方式中，清洗液为酒精。
在第二方面可能的实现方式中，涂覆导电涂层包括：采用印刷、三维打印、喷涂或者镀导电涂层并进行烘干。在进行导电涂层涂覆时，可以采用印刷、三维打印、喷涂或者电镀等工艺方法，这些工艺方法涂覆的导电涂层均匀，保障金属弹性件与天线的导通的稳定性，且通过对涂覆后的导电涂层烘干，以确保导电涂层可靠的粘附在镂空区或者氧化膜上。
在第二方面可能的实现方式中，烘干温度为80℃至130℃。
第三方面，本申请还提供了一种电子设备，包括：
中框组件，该中框组件为上述第一方面或第一方面的任一实现方式中的中框组件；
线路板，线路板设置在中框本体上，线路板上设置有收发模块；
金属弹性件，金属弹性件形成有连接部和接触部，连接部与收发模块电连接，接触部与导电涂层接触。
本申请实施例提供的电子设备，由于包括上述任一技术方案的中框组件，这样通过金属弹性件的连接部与收发模块连接，金属弹性件的接触部与导电涂层接触，就可实现收到模块与天线的导通。且本申请实施例提供的电子设备与上述技术方案所述的中框组件能够解决相同的技术问题，并达到相同的预期效果。
在第三方面可能的实现方式中，金属弹性件包括金属弹片或者导电硅胶。采用金属弹片或者导电硅胶作为金属弹性件，结构简单，制造方便。
在第三方面可能的实现方式中，电子设备为手机、平板电脑等。
附图说明
图1为现有技术中电子设备的局部结构示意图；
图2为采用图1所示的结构的多个手机的谐波余量形成的曲线图；
图3为本申请实施例中框组件的结构示意图；
图4为本申请实施例线路板、金属弹性件与中框组件连接的局部结构示意图；
图5为图4的A处放大图；
图6为本申请实施例线路板、金属弹性件与中框组件连接的局部结构示意图；
图7为本申请实施例导电涂层与中框本体连接的俯视图；
图8为采用图4或者图6所示的结构的多个手机的谐波余量形成的曲线图；
图9为本申请实施例导电涂层与中框本体连接的俯视图；
图10为本申请实施例中框组件的制备方法的流程框图。
具体实施方式
本申请实施例涉及电子设备、中框组件及中框组件的制备方法，下面结合附图对电子设备、中框组件及中框组件的制备方法进行详细描述。
一方面，本申请实施例提供了一种电子设备，参照图3和图4，该电子设备包括中框组件1、线路板15和金属弹性件14，线路板15设置在中框组件1上，线路板15 上设置有收发模块(图中未显示)，中框组件1包括天线，金属弹性件14形成有连接部和接触部，连接部与收发模块电连接，接触部与天线接触，即通过金属弹性件将收发模块与天线连接。
本申请实施例提供的电子设备可以是手机、平板电脑或者其他电子产品，在此对具有电子设备不做限定，任何电子设备均在本申请的保护范围之内。
为了保障金属弹性件与天线接触的可靠性，另一方面，参照图4和图5，本申请实施例提供了一种中框组件，该中框组件1包括中框本体111、天线121和导电涂层13，其中，天线121铺设在中框本体111上，天线121的外部包覆有氧化膜122，氧化膜122的位于天线121的馈电部的位置处为镂空区Q，导电涂层13至少覆盖住镂空区Q。
需要说明的是：导电涂层13至少覆盖住镂空区Q包括：导电涂层13恰好覆盖住镂空区Q，或者导电涂层13除过覆盖住镂空区Q，还覆盖住镂空区Q以外的区域，例如将整个氧化膜122覆盖住，甚至覆盖住氧化膜122以外的区域。
由于至少在镂空区Q覆盖有导电涂层13，这样导电涂层13会与天线121接触导通，即导电涂层13作为天线121与金属弹性件14的导通结构，导电涂层13贴覆在天线121的馈电部上，不会造成金属弹性件14与天线121之间出现间隙、接触不牢靠的现象，所以，通过设置的导电涂层能够保障金属弹性件与天线的馈电部的连接的可靠性，不会因为金属弹性件与天线之间不完全导通而产生杂波，影响天线收发波形与预设波形产生差异的现象，所以本申请实施例提供的中框组件会提高天线信号传输的稳定性。
在一些实施方式中，还可以设置导电钢片，导电钢片至少覆盖住镂空区，通过导电钢片将金属弹性件与天线的馈电部连接，本申请实施例采用导电涂层相比导电钢片的好处是：由于镂空区的面积较小，若仅将导电钢片覆盖住镂空区，则需要的导电钢片的尺寸也相对较小，容易造成导电钢片加工难度较大，若为了减小导电钢片的加工难度，导电钢片的尺寸可以设计的较大，不仅覆盖住镂空区，还覆盖住镂空区以外的地方，但是这样造成的问题是：导电钢片具有一定的刚度，造成导电钢片不能与天线的馈电部紧密的接触，之间也会存在间隙，最终造成金属弹性件与天线的馈电部不能紧密接触，同样影响天线信号传输的稳定性，但是采用本申请实施例提供的导电涂层作为导通结构时，由于导电涂层能够填充于镂空区内，完全可以保障金属弹性件与天线的馈电部的连接可靠性；另外，导电钢片在具体实施时，一般通过点焊工艺焊接，这样就需要在中框本体上预留点焊时所需要的操作空间，进而就相对应的要增加中框本体的尺寸，这样与目前电子设备小型化设计要求相背离，所以，采用导电涂层作为导电钢片具有明显的技术效果。
金属弹性件的连接部与收发模块电连接的实施方式为：线路板上具有与收发模块电连接的信号线，金属弹性件的连接部与信号线焊接。当然，金属弹性件的连接部与收发模块电连接的方式也可以是其他结构。
在一些实施方式中，导电涂层可以由导电金浆制得，或者由导电银浆制得，因为导电金浆和导电银浆的电流导通性较好，即也会提高天线收发信号的稳定性。
金属弹性件可以具有多种实施结构，示例的，金属弹性件包括金属弹片；再示例 的，金属弹性件包括导电硅胶。
在一些实施方式中，参照图6和图7，中框本体111包括金属部111A和塑胶部111B，天线铺设在金属部111A上，天线的旁侧具有塑胶部111B，导电涂层13覆盖住至少部分塑胶部111B。
需要说明的是：导电涂层13覆盖住至少部分塑胶部111B指：导电涂层13可以覆盖住部分塑胶部111B，也可以覆盖住全部塑胶部111B。
由于目前电子设备朝小型化趋势发展，在具体加工或者安装时，由于加工误差或者安装误差导致金属弹性件不能准确的与接触在天线上，而是与旁侧的塑胶部接触，为了保障依然能够使金属弹性件与天线的馈电部连接，则导电涂层覆盖住至少部分塑胶部，这样即使金属弹性件不能与天线的馈电部连接，而是与塑胶部上的导电涂层接触，依然可以保障金属弹性件与天线的馈电部的连接。
参照图8，在电流为200mA的情况下，具有本申请实施例的中框组件的多个手机的金属弹性件与天线接触的面上的谐波余量，且多个谐波余量形成的曲线为曲线P1，直线P2为金属弹性件与天线接触的面上的谐波余量限值，由图中看出，金属弹性件与天线接触的面上的多个谐波余量稳定，均达到15dB以上，即满足谐波余量限值，且具有较大的谐波余量，所以，利用本实施例提供的中框组件，能够提高天线收发信号的稳定性。
在电子设备中，可发射电磁波的元器件(例如，液晶显示器、射频器件或者摄像模块等)会对天线的信号造成干扰，为了避免这些元器件发射的电磁波穿过塑胶部影响天线信号，在一些实施方式中，天线铺设在金属部上，参照图9，塑胶部的朝向电磁波的一侧覆盖有导电涂层13，即通过导电涂层阻止元器件发射的电磁波穿过塑胶部干扰天线信号的收发。
在一些实施方式中，还可以通过设置铜箔组件隔离元器件发射的电磁波穿过塑胶部干扰天线信号的收发，但是，采用导电涂层相比铜箔组件的好处是：一般铜箔组件的厚度为0.10mm左右，但是导电涂层的厚度为0.01mm至0.05mm，明显的导电涂层的厚度小于铜箔组件的厚度，这样不会占用电子设备内部较大的安装空间，另外，铜箔组件一般采用粘结层粘结在中框本体上，粘结层无法保障铜箔组件与中框组件粘结均匀，随着电子设备的长期使用，可能会出现起泡的现象，所以，采用导电涂层明显优于铜箔组件。
另一方面，本申请实施例还提供了一种中框组件的制备方法，参照图10，中框组件的制备方法包括以下步骤：
S01：将包覆有氧化膜的天线铺设在中框本体上。
S02：去除天线的馈电部上的氧化膜，以使氧化膜的位于天线的馈电部的位置处形成镂空区。
将天线上的馈电部的氧化膜去除，该工艺所达到的好处是：氧化膜导通性差，露出天线可以提高天线与金属弹性件的导通性能。
S03：涂覆导电涂层，以使导电涂层至少覆盖住镂空区。
本申请实施例提供的中框组件的制备方法中，为了将天线上的馈电部外露，在天线的馈电部上去除氧化膜，以使氧化膜的位于馈电部的位置处形成镂空区，进而使馈 电部外露，就可以与收发模块进行信号的传输；再涂覆导电涂层，导电涂层覆盖住镂空区或者覆盖镂空区和镂空区以外的地方，通常，导电涂层都会覆盖至镂空区以外的地方，这样在保障金属弹性件能够与天线的馈电部连接的前提下，简化加工工艺。
去除天线的馈电部上的氧化膜之后，氧化膜甚至是氧化膜的旁边的结构上会残留杂质(包括去除的氧化膜)，若不清洗掉杂质，后续在涂覆导电涂层时，导电涂层内混杂有杂质，不仅影响导电涂层的附着力，也影响天线的馈电部与收发模块的信号的传输，所以，在去除天线的馈电部上的氧化膜之后还包括：清洗液清洗杂质并进行晾干。清洗液可以是酒精或者其他可挥发的清洗液等，采用清洗液清洗杂质后，不能立刻涂覆导电涂层，因为氧化膜的镂空区内残留清洗液，这样会影响导电涂层的附着，则在清洗杂质后需要进行晾干，以使残留的清洗液蒸发掉。
以下为中框组件制备方法的具体实施方式：
实施例一
S011：将包覆有氧化膜的天线铺设在中框本体上。
S021：镭雕天线的馈电部上的氧化膜，以使氧化膜的位于天线的馈电部的位置处形成镂空区。
S031：采用酒精清洗镭雕后的杂质并进行晾干。
S041：印刷导电涂层，以使导电涂层至少覆盖住镂空区。
S051：烘干印刷的导电涂层。
实施例二
S012：将包覆有氧化膜的天线铺设在中框本体上。
S022：镭雕天线的馈电部上的氧化膜，以使氧化膜的位于天线的馈电部的位置处形成镂空区。
S032：采用酒精清洗镭雕后的杂质并进行晾干。
S042：三维打印导电涂层，以使导电涂层至少覆盖住镂空区。
S052：烘干三维打印的导电涂层。
实施例三
S013：将包覆有氧化膜的天线铺设在中框本体上。
S023：镭雕天线的馈电部上的氧化膜，以使氧化膜的位于天线的馈电部的位置处形成镂空区。
S033：采用酒精清洗镭雕后的杂质并进行晾干。
S043：喷涂导电涂层，以使导电涂层至少覆盖住镂空区。
S053：烘干喷涂的导电涂层。
实施例四
S014：将包覆有氧化膜的天线铺设在中框本体上。
S024：采用机械加工机床去除天线的馈电部上的氧化膜，以使氧化膜的位于天线的馈电部的位置处形成镂空区。
S034：采用酒精清洗杂质并进行晾干。
S044：电镀导电涂层，以使导电涂层至少覆盖住镂空区。
S054：烘干电镀的导电涂层。
需要说明的是：步骤S044中采用的电镀也可以是蒸镀、化学镀等。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种中框组件，所述中框组件用于设置在电子设备上，其特征在于，包括：
    中框本体；
    天线，所述天线铺设在所述中框本体上；
    氧化膜，所述天线的外部包覆有所述氧化膜，所述氧化膜的位于所述天线的馈电部的位置处为镂空区；
    导电涂层，所述导电涂层至少覆盖住所述镂空区。
  2. 根据权利要求1所述的中框组件，其特征在于，所述中框本体包括金属部和塑胶部，所述天线铺设在所述金属部上，所述天线的旁侧具有所述塑胶部，所述导电涂层覆盖住至少部分所述塑胶部。
  3. 根据权利要求1或2所述的中框组件，其特征在于，所述电子设备上具有元器件，所述元器件可发射电磁波，所述中框本体包括金属部和塑胶部，所述天线铺设在所述金属部上，所述塑胶部的朝向所述电磁波的一侧覆盖有所述导电涂层。
  4. 根据权利要求1-3中任一项所述的中框组件，其特征在于，所述导电涂层为导电金浆或导电银浆制得。
  5. 一种中框组件的制备方法，用于制备权利要求1-4中任一项所述的中框组件，其特征在于，所述中框组件的制备方法包括：
    将包覆有氧化膜的天线铺设在中框本体上；
    去除天线的馈电部上的氧化膜，以使所述氧化膜的位于所述天线的馈电部的位置处形成镂空区；
    涂覆导电涂层，以使所述导电涂层至少覆盖住所述镂空区。
  6. 根据权利要求5所述的中框组件的制备方法，其特征在于，所述去除天线的馈电部上的氧化膜之后还包括：
    清洗液清洗去除后的杂质并进行晾干。
  7. 根据权利要求5或6所述的中框组件的制备方法，其特征在于，所述涂覆导电涂层包括：
    采用印刷、三维打印、喷涂或者镀导电涂层并进行烘干。
  8. 一种电子设备，其特征在于，包括：
    中框组件，所述中框组件如权利要求1～4中任一项所述的中框组件；
    线路板，所述线路板设置在所述中框本体上，所述线路板上设置有收发模块；
    金属弹性件，所述金属弹性件形成有连接部和接触部，所述连接部与所述收发模块电连接，所述接触部与所述导电涂层接触。
  9. 根据权利要求8所述的电子设备，其特征在于，所述金属弹性件包括金属弹片或者导电硅胶。
  10. 根据权利要求8或9所述的电子设备，其特征在于，所述电子设备为手机。
PCT/CN2020/123271 2019-12-20 2020-10-23 一种中框组件、中框组件的制备方法及电子设备 WO2021120844A1 (zh)

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