WO2021117624A1 - カバーテープおよび電子部品包装体 - Google Patents

カバーテープおよび電子部品包装体 Download PDF

Info

Publication number
WO2021117624A1
WO2021117624A1 PCT/JP2020/045203 JP2020045203W WO2021117624A1 WO 2021117624 A1 WO2021117624 A1 WO 2021117624A1 JP 2020045203 W JP2020045203 W JP 2020045203W WO 2021117624 A1 WO2021117624 A1 WO 2021117624A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
cover tape
sealant layer
base material
resin
Prior art date
Application number
PCT/JP2020/045203
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
皓基 阿部
Original Assignee
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019222664A external-priority patent/JP7003099B2/ja
Priority claimed from JP2019222697A external-priority patent/JP6777216B1/ja
Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Priority to CN202080086005.4A priority Critical patent/CN114787052A/zh
Publication of WO2021117624A1 publication Critical patent/WO2021117624A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/34—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents and having several recesses to accommodate a series of articles or quantities of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Definitions

  • the present invention relates to a cover tape and an electronic component packaging body. More specifically, the present invention relates to a cover tape preferably used for packaging electronic components, and an electronic component package using the cover tape.
  • Carrier tapes and cover tapes are often used when transporting, storing, etc. electronic components. Specifically, an electronic component (semiconductor chip or the like) is placed in a recess formed in the carrier tape for storing the electronic component, and then the cover tape is heat-sealed on the upper surface of the carrier tape to enclose the electronic component. .. Then, it is wound up in a reel shape and transported / stored.
  • an electronic component semiconductor chip or the like
  • Patent Document 1 As a prior art of the cover tape, for example, in Patent Document 1, a heat-adhesive resin layer is provided on the support, and an antistatic layer is provided on the outside of the support or between the support and the heat-adhesive resin layer.
  • the cover tape for transporting electronic parts is described.
  • the contact angle with water is 0.5 to 95 °
  • the surface resistivity is 1.0 ⁇ 10 13 ⁇ / ⁇ or less.
  • the cover tape is usually wound on a reel before use. According to the findings of the present inventor, in the conventional cover tape, blocking may occur in the wound state before use.
  • the cover tape is sufficiently transparent.
  • some conventional cover tapes have room for improvement in terms of transparency.
  • the present inventor has an object of this time to provide a cover tape which is less likely to cause blocking in the rolled state before use and has good transparency. , Various studies were conducted.
  • a cover tape comprising a base material layer containing polyethylene terephthalate, a sealant layer containing a styrene resin, and an intermediate layer provided between the base material layer and the sealant layer.
  • a cover tape having an arithmetic mean height Sa of the exposed surface on the sealant layer side of 0.05 to 0.35 ⁇ m is provided.
  • a carrier tape in which electronic components are housed in a recess and the above-mentioned cover tape are provided.
  • An electronic component package in which the sealant layer is adhered to the carrier tape so as to seal the electronic component is provided.
  • a cover tape that is less likely to cause blocking in the rolled state before use and has good transparency.
  • the term "abbreviation” means to include a range in consideration of manufacturing tolerances, assembly variations, etc., unless otherwise specified explicitly.
  • the notation “XY” in the description of the numerical range means X or more and Y or less unless otherwise specified.
  • “1 to 5% by mass” means “1% by mass or more and 5% by mass or less”.
  • the notation that does not indicate whether it is substituted or unsubstituted includes both those having no substituent and those having a substituent.
  • the "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • the notation "(meth) acrylic” herein represents a concept that includes both acrylic and methacryl. The same applies to similar notations such as "(meth) acrylate”.
  • the arithmetic mean height Sa and the root mean square height Sq in this specification are based on ISO 25178 specified for "surface roughness”.
  • the cover tape of the present embodiment includes a base material layer containing polyethylene terephthalate, a sealant layer containing a styrene resin, and an intermediate layer provided between the base material layer and the sealant layer.
  • the arithmetic mean height Sa of the exposed surface on the sealant layer side is 0.05 to 0.35 ⁇ m.
  • the Sa on the sealant layer side containing the styrene resin is 0.05 to 0.35 ⁇ m, the surface unevenness having a size that can affect the visibility of the electronic component is reduced. , It is estimated that good transparency can be obtained. Further, by providing surface irregularities having a Sa of about 0.05 to 0.35 ⁇ m on the sealant layer side containing the styrene resin, the cover tapes on which the base material layer side and the sealant layer side overlap "slide moderately". I think I will be able to do it. Then, it is considered that the force that may lead to the occurrence of blocking is moderately relaxed in the wound cover tape.
  • the Sa on the sealant layer side containing the styrene resin is 0.05 to 0.35 ⁇ m, it is difficult for electronic components to stick to the cover tape. It is considered that when Sa is 0.05 to 0.35 ⁇ m, the contact area between the cover tape and the electronic component is reduced and sticking is suppressed.
  • the cover tape having a Sa of 0.05 to 0.35 ⁇ m on the sealant layer side of the present embodiment it is important to select an appropriate manufacturing method / manufacturing condition in addition to selecting the material. .. Details will be described later.
  • the sealant layer is provided by the extrusion laminating method, the sealant layer is pressed against a cooling roll having an appropriate surface roughness with an appropriate pressure to appropriately provide Sa on the sealant layer side. Can be adjusted.
  • the base material layer is not particularly limited as long as it contains polyethylene terephthalate (also abbreviated as PET).
  • the base material layer is composed of a PET-containing resin film. PET is preferable in that it is low in cost and has excellent mechanical strength.
  • the base material layer may be a single-layer PET-containing resin film or a laminated film composed of a plurality of PET-containing layers.
  • the method for producing the PET-containing resin film is not particularly limited. Examples of the manufacturing method include a film forming method such as an extrusion method, a cast molding method, a T-die method, a cutting method, and an inflation method.
  • the PET-containing resin film may be stretched or unstretched. From the viewpoint of strength, it is preferably stretched in the uniaxial direction or the biaxial direction, and more preferably stretched in the biaxial direction.
  • the base material layer has improved workability, heat resistance, weather resistance, mechanical properties, dimensional stability, antioxidant properties, slipperiness, releasability, flame retardancy, antifungal properties, electrical properties, strength, etc.
  • Additives may be included for the purpose of modification.
  • the additive component include various plastic compounding agents, additives, and modifying resins.
  • a plasticizer, a lubricant, a cross-linking agent, an antioxidant, an ultraviolet adsorbent, a light stabilizer, a filler, an antistatic agent, an antiblocking agent, a colorant (dye, pigment, etc.) are also used.
  • the amount thereof is usually about 0.001 to 10% by mass with respect to the entire base material layer.
  • Some surface treatment may be applied to one side or both sides of the PET-containing resin film constituting the base material layer.
  • the surface treatment include corona discharge treatment, plasma treatment, ozone treatment, frame treatment, glow discharge treatment, preheat treatment, dust removal treatment, vapor deposition treatment, chemical treatment, alkali treatment, and the like. By these treatments, the adhesion (bonding force) between the base material layer and the intermediate layer may be increased.
  • the surface treatment it is also possible to arbitrarily form a primer coating agent layer, an undercoating agent layer, an anchor coating agent layer, an adhesive layer, a vapor deposition anchor coating agent layer and the like.
  • the thickness of the base material layer is preferably 2.5 to 100 ⁇ m, more preferably 6 to 50 ⁇ m, and even more preferably 12 to 25 ⁇ m.
  • the base material layer is 2.5 ⁇ m or more, it is easy to sufficiently secure the rigidity and mechanical strength of the cover tape.
  • the base material layer is 100 ⁇ m or less, it becomes easy to sufficiently secure heat conduction to the sealant layer through the base material layer at the time of heat sealing, which leads to shortening of the heat sealing time.
  • the surface roughness of the exposed surface on the base material layer side it is possible to further suppress the occurrence of blocking.
  • the surface roughness of the exposed surface on the base material layer side is also appropriate, so that the occurrence of blocking can be further suppressed.
  • the transparency can be further enhanced.
  • the arithmetic mean height Sa of the exposed surface on the base material layer side is preferably 0.01 to 0.2 ⁇ m, more preferably 0.02 to 0.17 ⁇ m, and further preferably 0.03 to 0. It is 15 ⁇ m, particularly preferably 0.03 to 0.1 ⁇ m.
  • the sealant layer is not particularly limited as long as it contains a styrene resin.
  • the styrene-based resin preferably contains a styrene-based elastomer. Although the details are unknown, it is considered that the appropriate elasticity of the styrene-based elastomer enhances the adhesion between the cover tape and the carrier tape and increases the heat seal strength.
  • Examples of the styrene-based elastomer include a block copolymer of a vinyl aromatic hydrocarbon and a conjugated diene, and a derivative thereof.
  • Block copolymers of vinyl aromatic hydrocarbons and conjugated dienes include blocks mainly composed of vinyl aromatic hydrocarbons typified by styrene and blocks mainly composed of conjugated diene such as butadiene and isoprene. Examples include block copolymers (a block containing vinyl aromatic hydrocarbons as the "main component” means a block having 50% by mass or more of vinyl aromatic hydrocarbons, and a block containing a conjugated diene as the "main body". Means a block having a conjugated diene in excess of 50% by mass).
  • Examples of the derivative include those obtained by hydrogenating at least a part of the double bonds of the block copolymer, those modified with maleic acid, amine, and imine.
  • the content of styrene (styrene content) in the styrene-based elastomer is preferably 50% by mass or less, more preferably 40% by mass or less, still more preferably 30% by mass or less. From another viewpoint, the content of styrene in the styrene-based elastomer (styrene content) is preferably 10% by mass or more, more preferably 20% by mass or less, and further preferably 25% by mass or more.
  • the sealant layer may contain other resins in addition to the styrene resin from the viewpoint of heat sealability.
  • the other resin a resin that sufficiently melts / softens under the heat-sealing conditions usually used for packaging electronic parts can be appropriately selected from known thermoplastic resins.
  • the sealant layer may contain an olefin resin as a resin other than the styrene resin.
  • the olefin resin can typically be a resin having a structural unit derived from an ⁇ -olefin such as ethylene, propylene or butene.
  • ⁇ -olefin such as ethylene, propylene or butene.
  • polyethylene or an ethylene copolymer is preferable.
  • the mode of copolymerization may be random, alternating, block or the like.
  • the olefin resin preferably has a structural unit derived from an ⁇ -olefin and other structural units.
  • the olefin resin is preferably a copolymer of an ⁇ -olefin monomer and other monomers. More preferably, the olefin resin contains a structural unit derived from ethylene.
  • the "other structural unit” is preferably a structural unit derived from any monomer selected from the group consisting of (meth) acrylic acid, (meth) acrylic acid ester and vinyl carboxylate. Since these structural units have appropriate polarities, they are considered to be related to the adjustment of seal strength.
  • Specific examples of the (meth) acrylic acid ester include methyl (meth) acrylate and ethyl (meth) acrylate.
  • vinyl carboxylate include vinyl acetate, vinyl propionate, vinyl butyrate and the like.
  • the olefin resin examples include ethylene-vinyl acetate copolymer (EVA), ethylene- (meth) acrylic acid copolymer (EAA, EMAA, etc.), and ethylene- (meth) acrylic acid ester copolymer (EEA). , EMMA, EGMA, etc.) and the like. These are also preferable in terms of cost and availability.
  • EVA ethylene-vinyl acetate copolymer
  • EAA ethylene- (meth) acrylic acid copolymer
  • EAA ethylene- (meth) acrylic acid copolymer
  • EAA ethylene- (meth) acrylic acid ester copolymer
  • EMMA ethylene- (meth) acrylic acid ester copolymer
  • the ratio of "other structural units" in the olefin resin is preferably 6 to 34% by mass, more preferably 8 to 30% by mass, and even more preferably 10 to 25% by mass. By appropriately adjusting this ratio, it is easy to obtain an appropriate heat sealability.
  • the ratio of "other structural units" in the olefin resin when the olefin resin is a commercial product, for example, the value described in the catalog provided by the manufacturer or the distributor can be adopted. If the ratio is not known from the catalog, the ratio may be obtained from the area (integral value) of the chart obtained by spectral measurement such as 13 C-NMR.
  • the ratio of the styrene resin to another resin (olefin resin, etc.) in the sealant layer is preferably 40:60 to 99: 1, more preferably 50:50 to 97: 3 in terms of mass ratio.
  • the sealant layer may contain any additive component in addition to the styrene resin and other resins.
  • the additive component include antiblocking agents, antistatic agents, tackifiers, slip agents, lubricants, plasticizers, antioxidants, ultraviolet absorbers, colorants, surfactants, inorganic particles, organic particles and the like. it can.
  • the occurrence of blocking can be further reduced by including an appropriate additive component in the sealant layer.
  • a known antistatic agent can be used.
  • a cationic antistatic agent having a cationic functional group such as a quaternary ammonium salt, a pyridinium salt, a primary amino group, a secondary amino group, or a tertiary amino group.
  • a cationic polymer antistatic agent having a quaternary ammonium salt in the side chain Preferably, a cationic polymer antistatic agent having a quaternary ammonium salt in the side chain.
  • -Polymer containing a polyether structure for example, a polyamide copolymer such as a polyether ester amide, a block polymer of a polyolefin and a polyether, a polymer composed of polyethylene ether and glycol), a carboxylic acid base-containing polymer such as potassium ionomer, a fourth Grade ammonium base-containing copolymers, etc.
  • a polyamide copolymer such as a polyether ester amide, a block polymer of a polyolefin and a polyether, a polymer composed of polyethylene ether and glycol
  • a carboxylic acid base-containing polymer such as potassium ionomer
  • -Metal fillers such as tin oxide, zinc oxide, and titanium oxide.
  • -A thiophene-based conductive polymer such as polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS).
  • Examples of the tackifier include petroleum resin, rosin resin, terpene resin, styrene resin (different from the above-mentioned styrene resin), kumaron inden resin and the like. Of these, petroleum resin styrene resin (different from the above-mentioned styrene resin) is preferable because of the difficulty of adhering electronic components, heat sealing property to carrier tape, gas barrier property, and the like.
  • Examples of the petroleum resin-based tackifier include aliphatic petroleum resins, aromatic petroleum resins, and aliphatic aromatic copolymer petroleum resins. Commercially available products include hydrogenated petroleum resin manufactured by Arakawa Chemical Industry Co., Ltd. and the trade name "Arcon" series.
  • slip agents include palmitate amide, stearate amide, behenic acid amide, oleate amide, erucic acid amide, oleyl palmido amide, stearyl palmido amide, methylene bisstearyl amide, methylene bisoleyl amide, ethylene bisoleyl amide, examples thereof include various amides such as ethylene biserkaic acid amides, polyalkylene glycols such as polyethylene glycol and polypropylene glycol, and hydrogenated castor oil.
  • processability such as extrusion processing, roll-off property, film slip property and the like are improved.
  • the amount thereof can be appropriately adjusted within the range of, for example, 0.01 to 20% by mass of the entire sealant layer.
  • the thickness of the sealant layer is, for example, 1 to 40 ⁇ m, preferably 3 to 30 ⁇ m, more preferably 5 to 20 ⁇ m, and particularly preferably 5 to 10 ⁇ m.
  • the thickness of the sealant layer is 1 ⁇ m or more, sufficient sealing property can be ensured.
  • the thickness of the sealant layer is 40 ⁇ m or less, the rigidity of the cover tape does not become too high. As a result, the cover tape can easily follow the deformation of the carrier tape even when a torsional stress is applied to the carrier tape after sealing. Therefore, it is possible to prevent the cover tape from being unintentionally peeled off from the carrier tape. Further, when the thickness of the sealant layer is 40 ⁇ m or less, there is an advantage that “bleeding out” of the melted resin during heat sealing can be suppressed.
  • the arithmetic mean height Sa of the exposed surface on the sealant layer side will be supplemented.
  • the arithmetic mean height Sa of the exposed surface on the sealant layer side is 0.05 to 0.35 ⁇ m.
  • This Sa is preferably 0.06 to 0.32 ⁇ m, more preferably 0.07 to 0.3 ⁇ m.
  • the root mean square height Sq of the exposed surface on the sealant layer side is preferably 0.05 to 0.35 ⁇ m, more preferably 0.06 to 0.32 ⁇ m, and even more preferably 0.07 to 0.3 ⁇ m. ..
  • the intermediate layer is provided between the base material layer and the sealant layer.
  • the intermediate layer does not necessarily have to be in contact with the base material layer and the sealant layer. That is, there may be an additional layer between the substrate layer and the intermediate layer, or there may be an additional layer between the sealant layer and the intermediate layer. Of course, the intermediate layer may be in contact with the base material layer and the sealant layer. The presence of the intermediate layer can enhance the cushioning property and impact resistance of the cover tape.
  • Examples of the material forming the intermediate layer include an olefin resin, a styrene resin, and a cyclic olefin resin. Above all, an olefin resin is preferable from the viewpoint of improving the cushioning property of the entire cover tape.
  • Examples of the olefin resin include polyethylene and polypropylene, and polyethylene is preferable. In particular, from the viewpoint of cushioning property, low density polyethylene (LDPE) or linear low density polyethylene (L-LDPE) is more preferable. High-density polyethylene (HDPE) is also preferable from the viewpoint of achieving both cushioning and strength.
  • the intermediate layer may contain various additives. Examples of the additive include those mentioned in the sealant layer and the base material layer.
  • the thickness thereof is preferably 10 to 45 ⁇ m, more preferably 15 to 40 ⁇ m from the viewpoint of improving the cushioning property of the entire cover tape without excessively impairing other performance.
  • the cover tape of the present embodiment may include any layer other than the base material layer, the sealant layer and the intermediate layer.
  • an adhesive layer may be present between the substrate layer and the sealant layer and / or between the sealant layer and the intermediate layer.
  • various known solvent-based or water-based anchor coating agents can be used as the material for forming the adhesive layer. More specific examples of the anchor coating agent include isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based ones.
  • some thin layer may be provided on the surface of the base material layer opposite to the intermediate layer and / or on the surface of the sealant layer opposite to the intermediate layer.
  • the thin layer is provided, for example, as a blocking resistance measure or an antistatic measure.
  • the thin layer contains an antistatic agent, the thin layer can be an antistatic layer.
  • the antistatic agent that can be used include the above-mentioned antistatic agents exemplified as those that can be contained in the sealant layer.
  • the antistatic agent is preferably a cationic antistatic agent, more preferably a cationic polymer antistatic agent having a quaternary ammonium salt in the side chain (Suftmer ST1000, Saftmer ST-2000H, etc.
  • the thin layer preferably contains an anti-blocking agent.
  • the anti-blocking agent inorganic particles such as silica and alumina can be preferably mentioned.
  • the median diameter (catalog value) of the antiblocking agent can be, for example, 0.1 to 0.2 ⁇ m.
  • a thin transfer layer may be provided on the sealant layer.
  • peeling occurs between the sealant layer and the transfer layer, and the transfer layer, which is a thin layer, is transferred to the carrier tape, which is an adherend.
  • the transfer layer contains an antistatic agent
  • the transfer layer also serves as an antistatic layer.
  • the interface peeling mechanism is a mechanism in which the sealing surfaces of the cover tape and the carrier tape are peeled off.
  • the transfer peeling mechanism is that when the cover tape is peeled off from the carrier tape, the layer that was in contact with the carrier tape is "transferred” to the carrier tape (remains on the carrier tape side) without the sealant layer itself being destroyed so much. ).
  • the cohesive failure mechanism is a type in which a layer different from the sealant layer or the sealant itself is torn and peeled off.
  • the "transfer layer” refers to a layer that is provided on the sealant layer so that when the cover tape is peeled from the carrier tape, the cover tape is peeled off by the transfer peeling mechanism.
  • the transfer layer can be provided by using, for example, a (meth) acrylic resin, specifically, a Mitsubishi Chemical company's acrylic resin for paints and inks "Dianar" (registered trademark) series.
  • the thickness of the thin layer is preferably about 0.01 to 3 ⁇ m from the viewpoint of not excessively inhibiting the roles of the base material layer and the sealant layer.
  • Sa in the outermost layers of the cover tape
  • Sq will be measured.
  • the thin layer may not be present. In that case, the surface of the base material layer opposite to the intermediate layer and the surface of the sealant layer opposite to the intermediate layer are exposed surfaces. Then, the surface roughness on those exposed surfaces is measured.
  • the width and length of the cover tape of the present embodiment can be appropriately set mainly according to the width and length of the carrier tape to which the cover tape is adhered.
  • the width of the cover tape is about 1 to 100 mm, and the length is about 100 to 30,000 m.
  • the method for producing the cover tape of the present embodiment is not particularly limited, but the cover tape is produced by, for example, the following procedure. In particular, by appropriately performing the "pressing" in (2) below, it is easy to manufacture a cover tape having a Sa of 0.05 to 0.35 ⁇ m.
  • An intermediate layer is provided on one side of a film to be a base material layer by an extrusion laminating method.
  • the extrusion temperature may be appropriately adjusted depending on the material of the intermediate layer, and is, for example, about 150 to 350 ° C.
  • a sealant layer is provided on the intermediate layer (exposed surface) provided in (1) above by an extrusion laminating method (extrusion temperature of about 280 ° C.). At this time, it is preferable that the sealant layer is pressed against a cooling roll having protrusions on the surface to provide unevenness on the surface of the sealant layer.
  • the maximum height Rz of the cooling roll is preferably 1.0 to 4.0 ⁇ m, more preferably 1.5 to 3.0 ⁇ m.
  • the pressing pressure is preferably 0.05 to 0.4 MPa, more preferably 0.1 to 0.3 MPa.
  • the pressing can be performed by a silicone rubber touch roll or the like provided so as to face the cooling roll.
  • the temperature of the extruded sealant layer when the cooling roll is pressed is preferably about 200 to 250 ° C. Further, it is preferable that the temperatures of the cooling roll and the touch roll are adjusted (cooled) to about 15 to 25 ° C.
  • the arithmetic mean height Sa of the exposed surface on the sealant layer side is 0.05 to 0. It is easy to obtain a cover tape having a thickness of 35 ⁇ m.
  • An antistatic layer is provided on the surface of the base material layer opposite to the side on which the intermediate layer is provided by a gravure coating method.
  • the surface (exposed surface) of the sealant layer provided in (2) is corona-treated, and then an antistatic layer or an antistatic layer / transfer layer is provided on the corona-treated surface by a gravure coating method.
  • the electronic component package can be obtained from the above-mentioned cover tape and the carrier tape in which the electronic component is housed in the recess. This will be described with reference to FIG.
  • the cover tape 10 is used as a lid material for a strip-shaped carrier tape 20 in which concave pockets 21 are continuously provided according to the shape of an electronic component. Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20.
  • the structure obtained by adhering the cover tape 10 and the carrier tape 20 will be referred to as an electronic component packaging body 100.
  • the electronic component package 100 can be manufactured, for example, by the following procedure. First, the electronic components are housed in the pocket 21 of the carrier tape 20. Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the surface of the cover tape 10 on the sealant layer side is brought into contact with the carrier tape 20. By doing so, a structure (electronic component package 100) in which electronic components are hermetically housed can be obtained.
  • the specific method and conditions of the heat seal are not particularly limited as long as the cover tape 10 adheres sufficiently strongly to the carrier tape 20. Typically, a known taping machine can be used, and the temperature can be set in the range of 100 to 240 ° C., a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.
  • the material of the carrier tape 20 is not particularly limited as long as the cover tape 10 can be adhered by heat sealing. It is usually made of resin.
  • the carrier tape 20 is composed of a material containing polystyrene resin, a material containing polycarbonate resin, a material containing polyethylene terephthalate resin, and the like.
  • the electronic component package 100 is wound on a reel, for example, and then transported to a work area where electronic components are mounted on an electronic circuit board or the like.
  • the material of the reel can be metal, paper, plastic, or the like.
  • the cover tape 10 is peeled off from the carrier tape 20 and the contained electronic component is taken out.
  • the electronic components housed in the electronic component packaging body 100 are not particularly limited. Examples of all parts used in the manufacture of electrical and electronic equipment such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes can be mentioned.
  • the cover tape of the present embodiment can also be expressed as follows.
  • 1. A cover tape comprising a base material layer containing polyethylene terephthalate, a sealant layer containing a styrene resin, and an intermediate layer provided between the base material layer and the sealant layer.
  • a cover tape having a value of ⁇ h / ⁇ d of 0.25 to 0.55 when the diiodomethane contact angle is ⁇ d and the hexadecane contact angle is ⁇ h on the exposed surface on the sealant layer side.
  • 2. 1. 1.
  • the cover tape described in The base material layer exists on the outermost surface of the cover tape and When the diiodomethane contact angle of the exposed surface on the base material layer side is ⁇ d ′ and the hexadecane contact angle of the exposed surface on the base material layer side is ⁇ h ′, the value of ⁇ h ′ / ⁇ d ′ is 0. Cover tape that is 10 to 0.50. 3. 3. 1. 1. Or 2. The cover tape described in A cover tape having ⁇ d of 28 to 65 °. 4. 1. 1. ⁇ 3. The cover tape described in any one of the above. A cover tape having ⁇ h of 5 to 35 °. 5. 1. 1. ⁇ 4. The cover tape described in any one of the above.
  • the sealant layer is a cover tape containing a styrene-based elastomer as the styrene-based resin. 6. 1. 1. ⁇ 5. The cover tape described in any one of the above.
  • the intermediate layer is a cover tape containing an olefin resin. 7. Carrier tape with electronic components housed in recesses and 1. ⁇ 6. With the cover tape described in any one of An electronic component package in which the sealant layer is adhered to the carrier tape so as to seal the electronic component.
  • the cover tape is required to have low tackiness (less stickiness) and to prevent electronic components from sticking to the cover tape.
  • the cover tape is required to have good heat sealability. That is, it is preferable that the cover tape is appropriately melted by heat and adheres sufficiently strongly to the carrier tape.
  • ⁇ 7. Is to solve such a problem. From the viewpoint of designing the cover tape, the present inventor determines the diiodomethane contact angle ⁇ d and the hexadecane contact angle ⁇ h of the exposed surface on the sealant layer side (the surface where the electronic components are in contact with each other and are bonded to the carrier tape). We adopted it and proceeded with the examination. This is because it is considered that the difficulty of sticking electronic components (tackiness) and the adhesiveness with carrier tape are related to physical properties such as the hydrophobicity of the exposed surface and the surface free energy.
  • a cover tape including a base material layer containing polyethylene terephthalate, a sealant layer containing a styrene resin, and an intermediate layer provided between the base material layer and the sealant layer is ⁇ .
  • the value of h / ⁇ d was designed to be 0.25 to 0.55. As a result, it was possible to achieve both the difficulty of sticking electronic components and the heat-sealing property.
  • the condition of the exposed surface on the sealant layer side is that the contact angle of diiodomethane with moderate polarity is relatively large (difficult to get wet), and the contact angle of hexadecane with low polarity is relatively small (easy to get wet). It is thought that the state will reduce the interaction with electronic parts made of highly polar materials such as metal oxides, and increase the interaction with carrier tapes made of low polar materials such as polystyrene. Be done. Then, it is considered that the difficulty of sticking the electronic component and the heat-sealing property with the carrier tape are compatible.
  • a cover tape having a value of ⁇ h / ⁇ d of 0.25 to 0.55
  • ⁇ h / ⁇ d When the value of ⁇ h / ⁇ d is 0.25 to 0.55, it is possible to obtain the effect of difficulty in sticking electronic components and good heat sealing property with the carrier tape, but ⁇ d and ⁇ h themselves.
  • ⁇ d is preferably 28 to 65 °, more preferably 28 to 64 °, and even more preferably 30 to 63 °.
  • ⁇ h is preferably 5 to 35 °, more preferably 7 to 33 °.
  • the value of ⁇ h / ⁇ d is preferably 0.25 to 0.53.
  • the value of ⁇ h ′ / ⁇ d ′ is It is preferably 0.10 to 0.50, and more preferably 0.12 to 0.48.
  • the value of ⁇ h ′ is preferably 3 to 30 °, more preferably 5 to 28 °.
  • the value of ⁇ d ′ is preferably 35 to 62 °, more preferably 35 to 61 °, still more preferably 37 to 59 °, and particularly preferably 37 to 60 °.
  • the components, materials, thicknesses, etc. of the base material layer, the sealant layer, the intermediate layer, and any other layer (thin layer, etc.) are described in the above ⁇ Cover tape> section. Same as the description.
  • the width and length of the cover tape are the same as those described in the above section ⁇ Cover tape>.
  • the method of manufacturing the cover tape of another embodiment is almost the same as the method described above (method of manufacturing the cover tape), but will be described again.
  • the cover tape of another embodiment can preferably be produced by the following procedures (1) to (4).
  • An intermediate layer is provided on one side of a PET film constituting a base material layer by an extrusion laminating method.
  • the extrusion temperature can be about 300 ° C.
  • a sealant layer is provided on the exposed surface of the provided intermediate layer by an extrusion laminating method.
  • the extrusion temperature can be about 280 ° C.
  • the pressure at this time is preferably 0.05 to 0.4 MPa, more preferably 0.1 to 0.3 MPa.
  • the pressure can be preferably adjusted by pressing a silicone rubber touch roll from the base material layer side. By doing so, the surface texture is adjusted, and it is easy to obtain a cover tape having a value of ⁇ h / ⁇ d of 0.25 to 0.55.
  • An antistatic layer is provided on the surface of the base material layer opposite to the side on which the intermediate layer is provided.
  • the antistatic layer can be preferably provided by applying a coating liquid by a gravure coating method.
  • H1041 Styrene-based resin, manufactured by Asahi Kasei Corporation, product name "Tough Tech H1041" -H1043: Styrene-based resin, manufactured by Asahi Kasei Corporation, product name "Tough Tech H1043” -KF260T: Polyolefin resin, linear low density polyethylene (manufactured by Japan Polyethylene Corporation, trade name "Kernel KF260T”" -AC1820: Polyolefin resin, ethylene-methyl acrylate copolymer, manufactured by Mitsui Dow Polychemical Co., Ltd., trade name "Elvalois AC1820"
  • -Suftmer ST-1000 Cationic polymer antistatic agent, manufactured by Mitsubishi Chemical Corporation, trade name "Saftmer ST-1000" -Saftmer ST-2000H: Cationic polymer antistatic agent (manufactured by Mitsubishi Chemical Corporation, trade name "Saftmer ST-2000H” -SNS-10T: Conductive filler, antimony-doped tin oxide solution, manufactured by Ishihara Sangyo Co., Ltd., trade name "SNS-10T" -BR-113: Acrylic resin, manufactured by Mitsubishi Chemical Corporation, product name "Dianar BR-113"
  • the cover tapes of each Example and Comparative Example were generally produced by the following procedure.
  • An intermediate layer was provided on one side of the polyester film constituting the base material layer by an extrusion laminating method (extrusion temperature of about 300 ° C.).
  • a sealant layer was provided on the provided intermediate layer (exposed surface) by an extrusion laminating method (extrusion temperature of about 280 ° C.). At this time, the sealant layer was pressed against a cooling roll having protrusions on the surface to adjust the surface roughness.
  • Example 2 An antistatic layer was provided on the surface of the base material layer opposite to the side on which the intermediate layer was provided by a coating method.
  • the surface (exposed surface) of the sealant layer provided in (2) was corona-treated, and then an antistatic layer or an antistatic layer / transfer layer was provided on the corona-treated surface by a coating method.
  • (3) and (4) were not performed. Therefore, the cover tape of Example 2 is provided with neither an antistatic layer nor an antistatic layer / transfer layer.
  • Linear low-density polyethylene (manufactured by Nippon Polyethylene Co., Ltd., trade name "Kernel KF260T”) is subjected to an extrusion lamination method on one side of a biaxially stretched polyester film (manufactured by Toyo Boseki Co., Ltd .: trade name E5102) having a thickness of 16 ⁇ m, which is a base material layer. ”) was formed into a film having a thickness of 20 ⁇ m at an extrusion temperature of 300 ° C. As a result, an intermediate layer was provided.
  • a styrene-based elastomer (manufactured by Asahi Kasei Corporation, trade name: Tuftec H1043) was formed on the formed intermediate layer by an extrusion laminating method to a thickness of 10 ⁇ m at an extrusion temperature of 280 ° C. This formed a sealant layer.
  • the sealant layer is pressed against a cooling roll provided with protrusions having a maximum height Rz of 1.5 ⁇ m, and a silicone rubber touch roll is pressed from the base material layer side at a pressure of 0.3 MPa.
  • the surface roughness of the sealant layer was adjusted.
  • the temperatures of the cooling roll and the touch roll were adjusted (cooled) so as to be around 20 ° C.
  • the temperature of the sealant layer when the cooling roll and the touch roll were pressed was about 200 to 250 ° C.
  • the antistatic agent "Saftmer ST-2000H” (manufactured by Mitsubishi Chemical Corporation) was applied to the surface of the base material layer opposite to the side on which the intermediate layer was provided, and the thickness after drying was reduced to 0.1 ⁇ m using a gravure coater. It was applied so as to become. As a result, an antistatic layer was provided.
  • the surface of the sealant layer formed above was corona-treated. Then, on the corona-treated surface, the acrylic resin "Dianal BR-113" (manufactured by Mitsubishi Chemical Co., Ltd.) and the conductive filler solution "SNS-10T” (manufactured by Ishihara Sangyo Co., Ltd.) are applied, and the mass ratio of the resin and the conductive filler is 1: 1.
  • the coating solution mixed so as to be 4 was applied using a gravure coater so that the thickness after drying was 0.5 ⁇ m. In this way, the antistatic layer and transfer layer were provided.
  • Example 1 1.5 ⁇ m, 0.1 MPa
  • Example 2 2.5 ⁇ m, 0.2 MPa -Examples 3 and 4: 1.5 ⁇ m, 0.3 MPa -Comparative example 1: 0.5 ⁇ m, 0.2 MPa -Comparative example 2: 5.5 ⁇ m ⁇ 0.2 MPa
  • Transparency Transparency was evaluated by measuring the degree of cloudiness. Specifically, the cloudiness of the cover tapes of each Example and Comparative Example was measured according to JIS K 7105 (1998) measurement method A. It can be said that the smaller the cloudiness value, the more transparent the cover tape.
  • a cover tape was attached onto the slide glass so that the exposed surface on the sealant layer side was facing upward.
  • a test sample was prepared in which 20 metal pieces (length: 0.4 mm ⁇ width: 0.8 mm ⁇ thickness: 0.4 mm) were placed on the exposed surface.
  • the metal piece is obtained by cutting nickel with a precision cutting machine, processing it into a length: 0.4 mm ⁇ width: 0.8 mm ⁇ thickness: 0.4 mm, and providing a surface oxide film.
  • the test sample was allowed to stand at 60 ° C. and 95% RH for 24 hours, and further allowed to stand at room temperature and normal humidity for 24 hours. Then, with the slide glass inverted, vibration at 25 Hz for 20 seconds was applied to the test piece. Then, the adhesion ratio (%) was calculated from the number of metal pieces adhering to the exposed surface. It can be said that the smaller this value is, the more difficult it is for the electronic component to stick, and the more preferable the performance as the cover tape is.
  • Table 1 shows the formulation and thickness of each layer of cover tape
  • Table 2 summarizes the surface roughness measurement results and performance evaluation results.
  • E5102 Biaxially stretched film made mainly of polyethylene terephthalate (PET), manufactured by Toyobo Co., Ltd., Toyobo ester (registered trademark) film, product name "E5102" (thickness is as shown in the table below).
  • PET polyethylene terephthalate
  • Toyobo ester registered trademark
  • the cover tapes of each Example and Comparative Example were generally produced by the following procedure.
  • As the raw materials constituting each layer those shown in Table 3 were used.
  • An intermediate layer was provided on one side of the polyester film constituting the base material layer by an extrusion laminating method (extrusion temperature of about 300 ° C.).
  • a sealant layer was provided on the provided intermediate layer (exposed surface) by an extrusion laminating method (extrusion temperature of about 280 ° C.).
  • An antistatic layer was provided on the surface of the base material layer opposite to the side on which the intermediate layer was provided by a gravure coating method.
  • Example 2' The surface (exposed surface) of the sealant layer provided in (2) was corona-treated, and then an antistatic layer or an antistatic layer / transfer layer was provided on the corona-treated surface by a coating method.
  • (3) and (4) were not performed. Therefore, the cover tape of Example 2'does not have an antistatic layer, an antistatic layer, and a transfer layer.
  • a linear low-density polyethylene (manufactured by Nippon Polyethylene Co., Ltd., trade name "Kernel KF260T”) is subjected to an extrusion lamination method on one side of a biaxially stretched polyester film (manufactured by Toyo Boseki Co., Ltd .: trade name E5102) having a thickness of 16 ⁇ m, which is a base material layer. ”) was formed into a film having a thickness of 20 ⁇ m at an extrusion temperature of 300 ° C. As a result, an intermediate layer was provided.
  • a styrene-based elastomer (manufactured by Asahi Kasei Corporation, trade name: Tuftec H1043) was formed on the formed intermediate layer by an extrusion laminating method to a thickness of 10 ⁇ m at an extrusion temperature of 280 ° C. This formed a sealant layer.
  • the sealant layer was pressed against a cooling roll provided with protrusions having a maximum height Rz of 1.5 ⁇ m, and a silicone rubber touch roll was pressed from the base material layer side at a pressure of 0.3 MPa. By doing so, the surface texture of the sealant layer was adjusted.
  • the antistatic agent 2 "Saftomer ST-2000H” (manufactured by Mitsubishi Chemical Corporation) was applied to the surface of the base material layer opposite to the side on which the intermediate layer was provided, and the thickness after drying was 0.1 ⁇ m using a gravure coater. It was applied so as to become. As a result, an antistatic layer was provided. Further, the surface of the sealant layer formed above was corona-treated.
  • the acrylic resin "Dianal BR-113" manufactured by Mitsubishi Chemical Co., Ltd.
  • the conductive filler solution "SNS-10T” manufactured by Ishihara Sangyo Co., Ltd.
  • the coating solution mixed so as to have a thickness of 0.5 ⁇ m after drying was applied.
  • an antistatic layer and a transfer layer were provided.
  • Example 4 Manufacturing of Cover Tapes of Examples 1'to 3'and Comparative Example 1'
  • Example 4 except that the materials shown in Table 3 were used and the maximum height Rz of the cooling roll and the touch roll pressure were changed as follows for adjusting the surface roughness of the sealant layer.
  • the cover tape was manufactured in the same manner as'.
  • Example 1'and Comparative Example 1' 1.5 ⁇ m, 0.1 MPa
  • Example 2' 2.5 ⁇ m
  • 0.2 MPa -Examples 3'and 4' 1.5 ⁇ m, 0.3 MPa
  • the cover tape was wrapped around a paper tube and left in an environment of 40 ° C. for 24 hours. After that, the strength of adhesion between the front and back of the cover tape was confirmed. Specifically, the cover tape that can be unwound by its own weight was evaluated as ⁇ (good), and the cover tape that could not be unwound by its own weight was evaluated as x (bad).
  • Table 3 shows the formulation and thickness of each layer of the cover tape
  • Table 4 shows the contact angle measurement results and performance evaluation results.
  • the electronic components were hard to stick and the peel strength was sufficiently high. That is, it includes a base material layer containing polyethylene terephthalate, a sealant layer containing a styrene resin, and an intermediate layer provided between the base material layer and the sealant layer, and the value of ⁇ h / ⁇ d is 0.25. It was shown that the cover tape having a value of about 0.55 is hard to adhere to electronic components and has good heat sealability with the carrier tape. On the other hand, in the evaluation of the cover tape of Comparative Example 1'in which the value of ⁇ h / ⁇ d was more than 0.55 (0.57), sticking of electronic components was observed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
PCT/JP2020/045203 2019-12-10 2020-12-04 カバーテープおよび電子部品包装体 WO2021117624A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202080086005.4A CN114787052A (zh) 2019-12-10 2020-12-04 盖带及电子部件包装体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-222697 2019-12-10
JP2019222664A JP7003099B2 (ja) 2019-12-10 2019-12-10 カバーテープおよび電子部品包装体
JP2019-222664 2019-12-10
JP2019222697A JP6777216B1 (ja) 2019-12-10 2019-12-10 カバーテープおよび電子部品包装体

Publications (1)

Publication Number Publication Date
WO2021117624A1 true WO2021117624A1 (ja) 2021-06-17

Family

ID=76330325

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/045203 WO2021117624A1 (ja) 2019-12-10 2020-12-04 カバーテープおよび電子部品包装体

Country Status (2)

Country Link
CN (1) CN114787052A (zh)
WO (1) WO2021117624A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007123241A1 (ja) * 2006-04-25 2007-11-01 Denki Kagaku Kogyo Kabushiki Kaisha カバーフィルム
JP2010215256A (ja) * 2009-03-16 2010-09-30 Sumitomo Chemical Co Ltd 電子部品収納容器用蓋材及び電子部品収納容器
JP2015099710A (ja) * 2013-11-19 2015-05-28 大日本印刷株式会社 透明導電膜形成用基材、透明導電性基材及びタッチパネル
JP2015210273A (ja) * 2014-04-23 2015-11-24 大日本印刷株式会社 積層体の製造方法、積層体、偏光板及び画像表示装置
JP2017088635A (ja) * 2015-10-31 2017-05-25 三菱樹脂株式会社 積層ポリエステルフィルム
JP2019014521A (ja) * 2017-07-07 2019-01-31 凸版印刷株式会社 包装材用シーラントフィルム、包装材、及び包装体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4573442B2 (ja) * 2001-01-11 2010-11-04 日東電工株式会社 電子部品キャリア用ボトムカバーテープ
CN104106147B (zh) * 2012-02-06 2016-09-21 大日本印刷株式会社 太阳能电池用密封片
WO2018221580A1 (ja) * 2017-05-31 2018-12-06 株式会社クラレ 積層フィルム、積層成形体、およびこれらの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007123241A1 (ja) * 2006-04-25 2007-11-01 Denki Kagaku Kogyo Kabushiki Kaisha カバーフィルム
JP2010215256A (ja) * 2009-03-16 2010-09-30 Sumitomo Chemical Co Ltd 電子部品収納容器用蓋材及び電子部品収納容器
JP2015099710A (ja) * 2013-11-19 2015-05-28 大日本印刷株式会社 透明導電膜形成用基材、透明導電性基材及びタッチパネル
JP2015210273A (ja) * 2014-04-23 2015-11-24 大日本印刷株式会社 積層体の製造方法、積層体、偏光板及び画像表示装置
JP2017088635A (ja) * 2015-10-31 2017-05-25 三菱樹脂株式会社 積層ポリエステルフィルム
JP2019014521A (ja) * 2017-07-07 2019-01-31 凸版印刷株式会社 包装材用シーラントフィルム、包装材、及び包装体

Also Published As

Publication number Publication date
CN114787052A (zh) 2022-07-22

Similar Documents

Publication Publication Date Title
JP6694387B2 (ja) カバーフィルムおよびそれを用いた電子部品包装体
TWI738837B (zh) 樹脂組成物、覆蓋帶及電子零件用包裝體
EP2700593B1 (en) Cover film
JP5695644B2 (ja) カバーテープ
TWI658932B (zh) 電子零件包裝用覆蓋帶
WO2021095638A1 (ja) カバーテープおよび電子部品包装体
JP6777216B1 (ja) カバーテープおよび電子部品包装体
JP2023021347A (ja) 紙キャリアテープ用カバーテープ、電子部品搬送用包装体および電子部品包装体
JP7138651B2 (ja) カバーフィルム
WO2021117624A1 (ja) カバーテープおよび電子部品包装体
JP7003099B2 (ja) カバーテープおよび電子部品包装体
JP2022009075A (ja) カバーテープおよび電子部品包装体
JP2021080024A (ja) カバーテープおよび電子部品包装体
JP3241220B2 (ja) チップ型電子部品包装用カバーテープ
JP7414165B1 (ja) 電子部品包装用カバーテープおよび電子部品包装体
TWI522239B (zh) 覆蓋膜
JP6930625B1 (ja) カバーテープおよび電子部品包装体
WO2024085137A1 (ja) カバーテープ、カバーテープの製造方法、カバーテープの原反ロール、および電子部品包装体
JP2020121785A (ja) 電子部品包装用のカバーテープおよび電子部品包装体
JP2021116121A (ja) 電子部品包装用のカバーテープおよび電子部品包装体
JP2024061650A (ja) カバーテープ、カバーテープの製造方法、カバーテープの原反ロール、および電子部品包装体
JP2021138412A (ja) 電子部品包装用カバーテープおよび電子部品包装体
JP2022156197A (ja) カバーテープおよび電子部品包装体
TW202319238A (zh) 蓋帶及電子零件包裝體
JP2021062892A (ja) 電子部品包装用のカバーテープおよび電子部品包装体

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20900111

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20900111

Country of ref document: EP

Kind code of ref document: A1