WO2021066075A1 - Gabarit d'aide au positionnement de substrat et procédé de fabrication de substrat - Google Patents

Gabarit d'aide au positionnement de substrat et procédé de fabrication de substrat Download PDF

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Publication number
WO2021066075A1
WO2021066075A1 PCT/JP2020/037328 JP2020037328W WO2021066075A1 WO 2021066075 A1 WO2021066075 A1 WO 2021066075A1 JP 2020037328 W JP2020037328 W JP 2020037328W WO 2021066075 A1 WO2021066075 A1 WO 2021066075A1
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WO
WIPO (PCT)
Prior art keywords
substrate
holes
carrier
standby
jig
Prior art date
Application number
PCT/JP2020/037328
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English (en)
Japanese (ja)
Inventor
ヴッチポン シーテープ
ヴォラヴット クナリンチップ
Original Assignee
Hoya株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya株式会社 filed Critical Hoya株式会社
Priority to CN202080067872.3A priority Critical patent/CN114521161B/zh
Priority to JP2021551426A priority patent/JP7291795B2/ja
Publication of WO2021066075A1 publication Critical patent/WO2021066075A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

Definitions

  • the present invention provides a substrate placement support jig for arranging a plurality of substrates in each of the substrate holding holes of the carrier when the substrate is held in the substrate holding holes of the carrier and the main surface of the substrate is polished, and the substrate.
  • the present invention relates to a method for manufacturing a substrate to be polished using an arrangement support jig.
  • HDD hard disk drive
  • a magnetic disk provided with a magnetic layer on the substrate is used, and magnetic recording information is recorded or read on the magnetic layer by a magnetic head slightly levitated on the surface of the magnetic disk.
  • the magnetic recording density is increased in order to increase the storage capacity, and in order to enable the increase in the magnetic recording density, the surface unevenness of the main surface of the substrate used as the substrate of the magnetic disk is It is as small as possible. Therefore, in the manufacture of the substrate used for the magnetic disk, highly accurate polishing is performed.
  • the substrate is sandwiched between an upper surface plate and a lower surface plate provided with a polishing pad, and the main surface of the substrate is polished by the polishing pad while rotating the upper surface plate and the lower surface plate.
  • the polishing liquid is supplied between the polishing pad and the main surface of the substrate.
  • the polishing liquid contains abrasive grains having a fine particle size such as ceria and colloidal silica.
  • the polishing liquid is supplied on the main surface of the substrate.
  • the substrate sandwiched between the upper surface plate and the lower surface plate moves between the upper surface plate and the lower surface plate so as to revolve around the rotation center axis of the upper surface plate while rotating.
  • the main surface is polished.
  • the substrate is held in each of the holding holes of a flat plate-shaped carrier provided with a plurality of holding holes, for example, six holding holes, and the carrier is sandwiched between the upper surface plate and the lower surface plate provided with the polishing pad on the surface.
  • the main surface of the substrate is polished by relatively moving the carrier and the upper surface plate and the lower surface plate while supplying the polishing liquid between the upper surface plate and the lower surface plate. That is, since a plurality of substrates are arranged on one carrier and several carriers holding the substrates are sandwiched between the upper surface plate and the lower surface plate and polished at the same time, one substrate holding hole of all the carriers is performed.
  • the preparation time for arranging the substrates in one is long.
  • the object to be polished loading jig is a polishing process for polishing an object to be polished such as a substrate held by a carrier arranged between an upper surface plate and a lower surface plate, and each of a plurality of holding holes provided in the carrier is used. It is a device for simultaneously loading a plurality of objects to be polished.
  • the body loading jig to be polished includes a first jig having a plurality of insertion holes arranged so as to face a plurality of holding holes of the carrier, and a plurality of carriers stacked on the upper surface of the first jig.
  • a second jig having a plurality of waiting holes for making the plurality of objects to be polished wait to be loaded in the holding holes of the above is provided.
  • the contact surfaces of the first jig and the second jig are supported so as to be slidable in the horizontal direction.
  • the rotation centers of the first jig and the second jig are aligned with each other, the standby hole and the insertion hole are displaced in the directional direction with respect to the circular rotation center, and the second jig is used as the first jig. Stack so that it touches the top surface.
  • the object to be polished is arranged in the waiting hole of the second jig.
  • the object to be polished for example, the main surface of the substrate, which is arranged in the waiting hole of the second jig, is the first. Since it rubs while contacting the surface of the jig, even if the first jig uses a resin material that does not easily damage the surface of the substrate, there is a problem that it is not possible to prevent the surface of the abrasive body from being scratched. Occurs.
  • the surface unevenness of the main surface of the substrate is as small as possible, such as the main surface of the substrate for a magnetic disk, and therefore it is not preferable to generate scratches on the main surface before polishing.
  • the present invention has a configuration different from that of the jig for loading the object to be polished, so that the main surface of the substrate is not scratched and the outer peripheral edge of the substrate is not scratched. It is an object of the present invention to provide a substrate arrangement support jig capable of arranging a substrate in a field, and a method for manufacturing a substrate including a polishing process for polishing the substrate using the jig.
  • the board placement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in a carrier in order to polish the main surface of the substrate.
  • the board placement support jig includes a plate-shaped jig body provided with a plurality of standby holes on which a board can be placed, corresponding to the positions of the plurality of board holding holes of the carrier. At least one of the edges of each of the waiting holes is provided with a claw provided on the jig body, which protrudes from the edge and comes into contact with the outer peripheral edge of the substrate to hold the substrate.
  • the claw portion advances to hold the substrate in each of the standby holes, and the substrate is retracted from each of the standby holes in a state where the jig body is located above the carrier.
  • the claws are configured such that the claws move forward or backward freely in and out of the area of the standby holes so that they can be opened and dropped and placed in each of the substrate holding holes of the carrier below. Has been done.
  • the claws are provided at two or more places on the circumference of each of the waiting holes.
  • the claw portion has an inclined surface provided so as not to contact the main surface of the substrate but to contact the chamfered surface provided at the outer peripheral end of the substrate. It is preferable that the chamfered surface comes into contact with the inclined surface and each of the claws supports the substrate from below, so that the substrate is held in each of the standby holes.
  • the claw portion has a protrusion that protrudes inward from the edge of each of the standby holes that abuts on a side wall surface that is provided at the outer peripheral end of the substrate and is orthogonal to the main surface of the substrate. It is preferable that the substrate is held in each of the waiting holes by abutting the protrusion from the direction orthogonal to the side wall surface and pressing the substrate against the walls of the waiting holes.
  • the claws provided in each of the waiting holes are configured to retract at the same time.
  • the position of the standby hole is locked to a hole or a protrusion provided on the surface of the carrier so as to correspond to the position of the substrate holding hole of the carrier. It is preferable that a protrusion or a hole is provided.
  • Another aspect of the present invention is a method for manufacturing a substrate, which comprises a polishing process for polishing the main surface of the substrate while holding the substrate in each of the substrate holding holes of a carrier provided with a plurality of substrate holding holes. is there.
  • the manufacturing method is Above the carrier arranged on the lower platen while holding the substrate by advancing the claw portion so as to protrude from the edge of the standby hole in each of the standby holes of the substrate placement support jig. By retracting the claw portion of the jig body at the position of, the substrate is opened from the standby hole and dropped, and the substrate is arranged in each of the substrate holding holes of the carrier below.
  • Steps and A step of polishing the substrate by sandwiching the substrate arranged on the carrier between the upper surface plate and the lower surface plate and moving the substrate relative to each other. To be equipped.
  • the substrate placement support jig and the method for manufacturing a substrate for polishing a substrate using this jig scratches are generated on the outer peripheral edge of the substrate without causing scratches on the main surface of the substrate.
  • the substrate can be efficiently arranged in the substrate holding hole of the carrier.
  • FIG. 1 is a diagram showing a schematic configuration of a substrate arrangement support jig of one embodiment.
  • the substrate placement support jig 10 is a placement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in the carrier 12 in order to polish the main surface of the substrate. Polishing referred to in the present specification is not only “polishing" in which the surface is polished to reduce the surface roughness of the substrate after grinding, but also rough grinding in order to change the dimensions and shape of the substrate, that is, “grinding (wrapping)”. ) ”Is also included.
  • the substrate placement support jig 10 When the process of polishing the surface to reduce the surface roughness of the substrate after "grinding” is referred to as “polishing" to distinguish it from grinding, the substrate placement support jig 10 "grinds” or “grinds” the main surface of the substrate. It is an arrangement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in the carrier 12 for “polishing". In other words, the substrate arrangement support jig 10 can be used regardless of the processing method as long as the main surface of the substrate is processed by using the carrier 12 as described above. As shown in FIG. 1, the substrate arrangement support jig 10 includes a plate-shaped jig main body 16.
  • the jig main body 16 is provided with a plurality of standby holes 18 on which the substrate S can be arranged, corresponding to the positions of the plurality of substrate holding holes 14 of the carrier 12.
  • the carrier 12 is provided with six substrate holding holes 14, and correspondingly, the jig main body 16 is also provided with six standby holes 18 at the same positions.
  • the carrier 12 is provided with six substrate holding holes 14, but the number of substrate holding holes 14 is not limited to six and may be a plurality.
  • the number of substrate holding holes 14 is preferably 5 or more, and more preferably 10 or more.
  • a tooth portion that engages with the internal gear (gear 62 shown in FIG. 5) of the lower platen is provided on the outer periphery of the carrier 12 shown in FIG.
  • At least one edge of each of the standby holes 18 of the jig body 16 is provided with a claw portion that protrudes from the edge and comes into contact with the outer peripheral edge of the substrate S to hold the substrate S.
  • the claws move forward to hold the substrate S in each of the standby holes, and the substrate S is retracted while the jig body 16 is moved to the upper part of the carrier 12 placed on the lower platen. Is opened from each of the waiting holes 18 and dropped to be arranged in each of the substrate holding holes 14 of the carrier 12 below, so that the claw portion moves forward or backward freely in and out of the area of the waiting holes 18.
  • the contact of the claw portion with the outer peripheral end of the substrate S means that the claw portion contacts at least a part of the outer peripheral end.
  • the outer peripheral end also includes a boundary portion between the end face and the main surface (when the chamfered surface is formed on the end face, the boundary portion between the chamfered surface and the main surface).
  • the claw portion may have a shape that protrudes so as to hold the substrate S by coming into contact with at least a part of the outer peripheral end of the substrate S, and does not necessarily have a claw-shaped shape.
  • FIG. 2 is a diagram illustrating a claw portion for holding the substrate S in the standby hole 18, which is an embodiment.
  • the claw portion 20 shown in FIG. 2 has an inclined surface 24 provided so as not to contact the main surface of the substrate S but to contact the chamfered surface 22 provided at the outer peripheral end of the substrate S.
  • the chamfered surface 22 comes into contact with the inclined surface 24, and each of the claw portions 20 supports the substrate S from below, whereby the substrate S is formed. It is held in each of the waiting holes 18.
  • the claw portion 20 moves forward or backward freely in and out of the area of the standby hole 18 by the operator pressing the operating portion 26 shown in FIG.
  • the chamfered surface 22 is a surface interposed between the side wall surface 25 (see FIG. 3) substantially orthogonal to the main surface of the substrate S (the angle substantially orthogonal is 89 to 91 degrees) and the main surface.
  • the chamfered surface 22 is smoothly connected to the main surface and extends toward the side wall surface 25.
  • the mechanism for advancing and retreating the claw portion 20 is not particularly limited.
  • the claw portion 20 is urged by a spring member and is normally in a protruding state with respect to the standby hole 18, and by pressing the operation portion 26, the spring that overcomes the urging force of the spring member and retracts the claw portion 20.
  • a mechanism using a member can be used.
  • a gear that rotates and moves along the inner circumference of each of the standby holes 18 is provided, and when this gear rotates and moves, the cam mechanism connected to the claw portion 20 operates by the movement of the gear, so that the claw portion 20 moves.
  • a mechanism using a cam mechanism that moves forward or backward can be used.
  • the claws 20 are provided at two or more locations on the circumference of each of the standby holes 18.
  • the inclined surface 24 of the claw portion 20 only supports the chamfered surface 22 from below, and since the region in contact with the substrate S is small, the chamfered surface 22 is less likely to be damaged.
  • the number of claws 20 is not particularly limited, but the number of claws 20 is preferably two or three because the device configuration becomes complicated when the number of claws 20 is four or more. When two or three claw portions 20 are provided, it is preferable to provide the claw portions 20 at intervals of about 180 degrees and about 120 degrees, respectively, on the circumference of the standby hole 18.
  • FIG. 3 is a diagram illustrating a claw portion for holding the substrate S in the standby hole 18, which is another embodiment.
  • the claw portion 20 shown in FIG. 3 projects from the edge of each of the standby holes 18 toward the inside of the standby holes 18 so as to abut on the side wall surface 25 provided at the outer peripheral end of the substrate S and orthogonal to the main surface of the substrate S. It has a protrusion 28.
  • the protrusion 28 abuts on the side wall surface 25 from a direction orthogonal to the side wall surface 25 and presses the substrate S against the walls of the standby holes 18 (walls on the opposite side of the protrusion 28) so that the substrate S is formed by the standby holes 18.
  • Each is held by frictional force.
  • the protrusion 28 of the claw portion 20 presses the side wall surface 25 from the side, but since the region where the protrusion 28 is in contact with the substrate S is small, the side wall surface 25 is less likely to be damaged.
  • the mechanism for advancing and retreating the claw portion 20 in FIG. 3 is not particularly limited as described above, and a mechanism using a spring member or a mechanism using a cam mechanism can be used.
  • FIG. 4 is a diagram illustrating a state in which the substrate S is separated from the standby hole 18 in the substrate arrangement support jig of one embodiment.
  • the substrate S cannot be reliably arranged in the substrate holding hole 14 unless the standby hole 18 and the substrate holding hole 14 are correctly aligned in the vertical direction. Therefore, according to one embodiment, the jig main body 16 is provided with an alignment portion, and can be locked with the alignment portion provided on the carrier 12.
  • the jig body 16 can be arranged at an appropriate position with respect to the carrier 12.
  • the alignment portion of the jig body 16 is, for example, a protrusion or a hole protruding from the jig body 16 toward the carrier 12, and the alignment portion of the carrier 12 can lock the protrusion, for example, a hole. Alternatively, it is a protrusion protruding toward the jig body 16.
  • the claw portion 20 is formed in the standby holes 18. Since the mechanism is such that it can move forward or backward freely in and out of the region, it efficiently holds the carrier 12 on the substrate without causing scratches on the main surface of the substrate S and without causing scratches on the outer peripheral end of the substrate S.
  • the substrate S can be arranged in the hole 14.
  • the claw portions 20 provided in each of the standby holes 18 are configured to retract at the same time because the substrate S can be simultaneously arranged in the substrate holding holes 14 of the carrier 12.
  • Such a substrate arrangement support jig 10 can be suitably used when the polishing process is performed while the substrate S is held in the substrate holding holes 14 of the carrier 12.
  • the setting work is performed in which the substrate S is arranged in the substrate holding hole 14 with the restricted space created by the upper surface plate moving upward with respect to the lower surface plate as a work space.
  • the substrate arrangement support jig 10 in order to efficiently set the substrate S in the space provided. Therefore, in one embodiment, the manufacture of the substrate S includes a polishing process for polishing the main surface of the substrate S while holding the substrate S in each of the substrate holding holes 14 of the carrier 12 provided with the plurality of substrate holding holes 14.
  • the substrate placement support jig 10 is used. That is, in the method of manufacturing a substrate, the lower platen is held in a state where the claw portion 20 is advanced so as to protrude from the edge of the standby hole 18 in each of the standby holes 18 of the substrate arrangement support jig 10 described above to hold the substrate S. By retracting the claw portion 20 of the jig body 16 at a position above the carrier 12 arranged on the substrate S, the substrate S is opened from the standby hole 18 and dropped. As a result, the substrate S is arranged in each of the substrate holding holes 14 of the carrier 12 below.
  • the substrate S arranged on the carrier 12 is sandwiched between the upper surface plate and the lower surface plate and moved relative to each other to polish the substrate S.
  • the jig body 16 is arranged at a position above the carrier 12, for example, the jig body 16 is placed in contact with the surface (main surface) of the carrier 12 and the surface (main surface) of the jig body 16.
  • the jig body 16 may be arranged so that the surface (main surface) of the jig body 16 is slightly separated from the surface (main surface) of the carrier 12.
  • FIGS. 5 and 6 are diagrams showing the configuration of a polishing apparatus used for the polishing process of one embodiment.
  • polishing pads 30 are attached to the upper surface of the lower surface plate 60 and the lower surface of the upper surface plate 40.
  • the polishing pad 30 is written in the form of a sheet.
  • urethane foam resin or the like can be used for the polishing pad 30, for example, urethane foam resin or the like.
  • the material and manufacturing method of the substrate S to be polished by the polishing device are not particularly limited.
  • the material of the substrate S is, for example, glass or an aluminum alloy. Further, a layer of NiP (nickel phosphorus) alloy may be provided on these surfaces.
  • the size of the substrate S is, for example, the size of a substrate for a magnetic disk having a nominal diameter of 3.5 inches or 2.5 inches.
  • the outer diameter is 94 mm to 98 mm and the inner diameter is about 25 mm.
  • the substrate S is a substrate for a magnetic disk having a nominal diameter of 2.5 inches, for example, the outer diameter is 56 mm to 68 mm, and the inner diameter is about 20 mm.
  • the plate thickness of the substrate S is, for example, 0.20 mm to 1.3 mm, preferably 0.30 mm to 0.7 mm.
  • the substrate S is scribed and cut on a large sheet glass to form a disk-shaped glass plate. That is, a method is used in which a notch line is formed on a glass plate using a scriber, and cracks are generated along the notch line by heating or the like to cut the glass plate.
  • a laser beam may be used from a large glass plate to form a disk-shaped glass plate slightly larger than the size of the substrate S.
  • a disk-shaped glass plate may be formed by wet etching using an etching solution such as hydrofluoric acid.
  • the large sheet glass before cutting out the glass blank is, for example, a glass plate having a constant plate thickness produced by using a floating method or a down draw method.
  • the glass block may be a substrate press-molded using a mold. Further, in order to make concentric circular holes in the disk-shaped glass blank, a circular hole is made using a scriber.
  • the circular hole may be made by irradiation with a laser beam or by etching.
  • shape processing is performed with a full-type grindstone.
  • the shape processing by the laser beam L may be used.
  • the carrier 12 has a substrate holding hole 14 for holding the substrate S when the disk-shaped substrate S is sandwiched between the upper surface plate 40 and the lower surface plate 60 and the main surface of the substrate S is polished.
  • the carrier 12 has a tooth portion 31 provided on the outer peripheral portion and meshing with the sun gear 61 and the internal gear 62, and a plurality of substrate holding holes 14 for accommodating and holding the substrate S.
  • the sun gear 61, the internal gear 62 provided on the outer edge, and the disk-shaped carrier 12 together constitute a planetary gear mechanism centered on the central axis CTR (see FIG. 6).
  • the disk-shaped carrier 12 meshes with the sun gear 61 inside the polishing device and meshes with the internal gear 62 outside the polishing device, and accommodates and holds a plurality of substrates S.
  • the carrier 12 revolves while rotating as a planetary gear, and the substrate S and the lower platen 60 are relatively moved.
  • the sun gear 61 rotates in the counterclockwise direction
  • the carrier 12 rotates in the clockwise direction
  • the internal gear 62 rotates in the counterclockwise direction.
  • a relative motion occurs between the lower platen 60 and the substrate S.
  • the substrate S and the upper surface plate 40 are relatively moved.
  • the upper surface plate 40 presses the substrate S held by the carrier 12 with a predetermined pressure (that is, in the vertical direction), whereby the polishing pad 30 presses against the substrate S. Be pressed. Further, as shown in FIG. 6, a polishing slurry is supplied from the supply tank 71 between the substrate S and the polishing pad 30 via one or a plurality of pipes 72 by a pump (not shown). The main surface of the substrate S is polished using the above polishing device.
  • the polishing process of the substrate S includes a first polishing and a second polishing.
  • the first polishing the main surfaces on both sides of the substrate S are polished while holding the outer end faces of the substrate S in the substrate holding holes 14 provided in the carrier 12 of the double-sided polishing apparatus described above.
  • the purpose of the first polishing is to adjust minute surface irregularities (microwaveness, roughness).
  • abrasive grains such as cerium oxide or zirconia are used as the free abrasive grains used in the first polishing treatment.
  • the size of the abrasive grains is, for example, in the range of 0.5 to 3 ⁇ m in terms of average particle size (D50).
  • the substrate S When the substrate S is a glass plate, it may be chemically strengthened after the first polishing.
  • a mixed melt of potassium nitrate and sodium nitrate is used as the chemical strengthening liquid, and the glass plate is immersed in the chemical strengthening liquid.
  • a compressive stress layer can be formed on the surface of the glass plate by ion exchange.
  • the substrate S is subjected to the second polishing.
  • the second polishing process the main surfaces on both sides of the substrate S are polished while being held in the substrate holding holes 14 provided in the carrier 12 of the double-sided polishing apparatus described above.
  • the type and particle size of the free abrasive grains are different from those in the first polishing treatment, and the hardness of the resin polisher is different.
  • the hardness of the resin polisher is preferably smaller than that at the time of the first polishing treatment.
  • a polishing liquid containing colloidal silica as free abrasive grains is supplied between the polishing pad of the double-sided polishing apparatus and the main surface of the glass plate, and the main surface of the glass plate is polished.
  • the size of the abrasive grains used for the second polishing is the average particle size (D50), and is preferably in the range of, for example, 5 to 50 nm.
  • the disk-shaped substrate S may be subjected to a "grinding" process before the first polishing.
  • the substrate placement support jig 10 can be used.
  • the polishing treatment is performed twice, but the polishing treatment may be performed once. In this way, the substrate S is subjected to the first polishing and the second polishing to produce a substrate having a target surface unevenness.
  • the substrate S applied to the substrate arrangement support jig 10 a disc-shaped substrate having no inner hole is used, but the substrate S is concentric in addition to the circular substrate. It may be a disk-shaped substrate having an inner hole, a polygonal substrate such as a quadrangle, or a semiconductor substrate such as a silicon wafer.
  • the substrate placement support jig and the method for manufacturing the substrate of the present invention have been described in detail above, the present invention is not limited to the above embodiment, and various improvements and changes are made without departing from the gist of the present invention. Of course, it may be.

Abstract

L'invention concerne un gabarit d'aide au positionnement de substrat comprenant : un corps de gabarit tabulaire muni d'une pluralité de trous d'attente dans lesquels des substrats peuvent être positionnés de façon à correspondre aux positions d'une pluralité de trous de maintien de substrat dans un support ; et des griffes qui font saillie à partir d'au moins un emplacement sur le bord des trous d'attente respectifs et viennent en contact avec l'extrémité périphérique externe d'un substrat et la maintiennent. Dans un état où la griffe est avancée et les substrats sont maintenus dans les trous d'attente respectifs, le corps de gabarit est déplacé sur le support et les griffes sont rétractées pour libérer et lâcher les substrats des trous d'attente et positionner les substrats dans les trous de maintien de substrat respectifs du support situé au-dessous.
PCT/JP2020/037328 2019-09-30 2020-09-30 Gabarit d'aide au positionnement de substrat et procédé de fabrication de substrat WO2021066075A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080067872.3A CN114521161B (zh) 2019-09-30 2020-09-30 基板配置辅助治具及基板的制造方法
JP2021551426A JP7291795B2 (ja) 2019-09-30 2020-09-30 基板配置支援治具及び基板の製造方法

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Application Number Priority Date Filing Date Title
VN1-2019-05355 2019-09-30
VN201905355 2019-09-30

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WO2021066075A1 true WO2021066075A1 (fr) 2021-04-08

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10225841A (ja) * 1997-02-17 1998-08-25 Suwa Kikai Seisakusho:Kk ワークの装着治具
JP2012076191A (ja) * 2010-10-04 2012-04-19 Asahi Glass Co Ltd 被研磨体装填治具及び被研磨体の研磨方法及び磁気ディスク用ガラス基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10225841A (ja) * 1997-02-17 1998-08-25 Suwa Kikai Seisakusho:Kk ワークの装着治具
JP2012076191A (ja) * 2010-10-04 2012-04-19 Asahi Glass Co Ltd 被研磨体装填治具及び被研磨体の研磨方法及び磁気ディスク用ガラス基板の製造方法

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