WO2021066075A1

WO2021066075A1 - Substrate positioning assistance jig and substrate manufacturing method

Info

Publication number: WO2021066075A1
Application number: PCT/JP2020/037328
Authority: WO
Inventors: ヴッチポンシーテープ; ヴォラヴットクナリンチップ
Original assignee: Hoya株式会社
Priority date: 2019-09-30
Filing date: 2020-09-30
Publication date: 2021-04-08

Abstract

This substrate positioning assistance jig comprises: a plate-shaped jig body provided with a plurality of standby holes in which substrates can be positioned so as to correspond to the positions of a plurality of substrate holding holes in a carrier; and claws which protrude from at least one site on the edge of the respective standby holes and contact and hold the outer peripheral end of a substrate. In a state where the claw is advanced and the substrates are held in the respective standby holes, the jig body is moved over the carrier and the claws are retracted to release and drop the substrates from the standby holes and position the substrates in the respective substrate holding holes of the carrier located below.

Description

Substrate placement support jig and substrate manufacturing method

The present invention provides a substrate placement support jig for arranging a plurality of substrates in each of the substrate holding holes of the carrier when the substrate is held in the substrate holding holes of the carrier and the main surface of the substrate is polished, and the substrate. The present invention relates to a method for manufacturing a substrate to be polished using an arrangement support jig.

Today, personal computers, DVD (Digital Versatile Disc) recording devices, and the like have a built-in hard disk drive (HDD) for data recording.
In the hard disk device, a magnetic disk provided with a magnetic layer on the substrate is used, and magnetic recording information is recorded or read on the magnetic layer by a magnetic head slightly levitated on the surface of the magnetic disk. In the hard disk device, the magnetic recording density is increased in order to increase the storage capacity, and in order to enable the increase in the magnetic recording density, the surface unevenness of the main surface of the substrate used as the substrate of the magnetic disk is It is as small as possible. Therefore, in the manufacture of the substrate used for the magnetic disk, highly accurate polishing is performed.

In the polishing device, for example, the substrate is sandwiched between an upper surface plate and a lower surface plate provided with a polishing pad, and the main surface of the substrate is polished by the polishing pad while rotating the upper surface plate and the lower surface plate. At that time, the polishing liquid is supplied between the polishing pad and the main surface of the substrate. The polishing liquid contains abrasive grains having a fine particle size such as ceria and colloidal silica. The polishing liquid is supplied on the main surface of the substrate. The substrate sandwiched between the upper surface plate and the lower surface plate moves between the upper surface plate and the lower surface plate so as to revolve around the rotation center axis of the upper surface plate while rotating. The main surface is polished.

In the polishing apparatus, the substrate is held in each of the holding holes of a flat plate-shaped carrier provided with a plurality of holding holes, for example, six holding holes, and the carrier is sandwiched between the upper surface plate and the lower surface plate provided with the polishing pad on the surface. The main surface of the substrate is polished by relatively moving the carrier and the upper surface plate and the lower surface plate while supplying the polishing liquid between the upper surface plate and the lower surface plate. That is, since a plurality of substrates are arranged on one carrier and several carriers holding the substrates are sandwiched between the upper surface plate and the lower surface plate and polished at the same time, one substrate holding hole of all the carriers is performed. The preparation time for arranging the substrates in one is long.

On the other hand, in order to efficiently load a plurality of substrates in a polishing process for polishing an object to be polished such as a substrate held by a carrier arranged between an upper surface plate and a lower surface plate of a double-sided polishing apparatus. A jig for loading a body to be polished has been proposed (Patent Document 1).
The object to be polished loading jig is a polishing process for polishing an object to be polished such as a substrate held by a carrier arranged between an upper surface plate and a lower surface plate, and each of a plurality of holding holes provided in the carrier is used. It is a device for simultaneously loading a plurality of objects to be polished. The body loading jig to be polished includes a first jig having a plurality of insertion holes arranged so as to face a plurality of holding holes of the carrier, and a plurality of carriers stacked on the upper surface of the first jig. A second jig having a plurality of waiting holes for making the plurality of objects to be polished wait to be loaded in the holding holes of the above is provided. In the first jig and the second jig, the contact surfaces of the first jig and the second jig are supported so as to be slidable in the horizontal direction. The rotation centers of the first jig and the second jig are aligned with each other, the standby hole and the insertion hole are displaced in the directional direction with respect to the circular rotation center, and the second jig is used as the first jig. Stack so that it touches the top surface. At this time, the object to be polished is arranged in the waiting hole of the second jig. By sliding the second jig around the center of rotation, when the standby hole coincides with the insertion hole, each of the plurality of objects to be polished placed on the second jig is first cured through the insertion hole. It is set by dropping into the holding hole of the carrier at the bottom of the jig at the same time.

Japanese Unexamined Patent Publication No. 2012-76191

In this object to be polished loading jig, when the second jig is slid around the center of rotation, the object to be polished, for example, the main surface of the substrate, which is arranged in the waiting hole of the second jig, is the first. Since it rubs while contacting the surface of the jig, even if the first jig uses a resin material that does not easily damage the surface of the substrate, there is a problem that it is not possible to prevent the surface of the abrasive body from being scratched. Occurs. In particular, it is preferable that the surface unevenness of the main surface of the substrate is as small as possible, such as the main surface of the substrate for a magnetic disk, and therefore it is not preferable to generate scratches on the main surface before polishing.

Therefore, the present invention has a configuration different from that of the jig for loading the object to be polished, so that the main surface of the substrate is not scratched and the outer peripheral edge of the substrate is not scratched. It is an object of the present invention to provide a substrate arrangement support jig capable of arranging a substrate in a field, and a method for manufacturing a substrate including a polishing process for polishing the substrate using the jig.

One aspect of the present invention is a substrate placement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in a carrier in order to polish the main surface of the substrate. The board placement support jig includes a plate-shaped jig body provided with a plurality of standby holes on which a board can be placed, corresponding to the positions of the plurality of board holding holes of the carrier.
At least one of the edges of each of the waiting holes is provided with a claw provided on the jig body, which protrudes from the edge and comes into contact with the outer peripheral edge of the substrate to hold the substrate.
The claw portion advances to hold the substrate in each of the standby holes, and the substrate is retracted from each of the standby holes in a state where the jig body is located above the carrier. The claws are configured such that the claws move forward or backward freely in and out of the area of the standby holes so that they can be opened and dropped and placed in each of the substrate holding holes of the carrier below. Has been done.

The claws are provided at two or more places on the circumference of each of the waiting holes.
The claw portion has an inclined surface provided so as not to contact the main surface of the substrate but to contact the chamfered surface provided at the outer peripheral end of the substrate.
It is preferable that the chamfered surface comes into contact with the inclined surface and each of the claws supports the substrate from below, so that the substrate is held in each of the standby holes.

The claw portion has a protrusion that protrudes inward from the edge of each of the standby holes that abuts on a side wall surface that is provided at the outer peripheral end of the substrate and is orthogonal to the main surface of the substrate.
It is preferable that the substrate is held in each of the waiting holes by abutting the protrusion from the direction orthogonal to the side wall surface and pressing the substrate against the walls of the waiting holes.

It is preferable that the claws provided in each of the waiting holes are configured to retract at the same time.
On the surface of the jig body facing the carrier, the position of the standby hole is locked to a hole or a protrusion provided on the surface of the carrier so as to correspond to the position of the substrate holding hole of the carrier. It is preferable that a protrusion or a hole is provided.

Another aspect of the present invention is a method for manufacturing a substrate, which comprises a polishing process for polishing the main surface of the substrate while holding the substrate in each of the substrate holding holes of a carrier provided with a plurality of substrate holding holes. is there. The manufacturing method is
Above the carrier arranged on the lower platen while holding the substrate by advancing the claw portion so as to protrude from the edge of the standby hole in each of the standby holes of the substrate placement support jig. By retracting the claw portion of the jig body at the position of, the substrate is opened from the standby hole and dropped, and the substrate is arranged in each of the substrate holding holes of the carrier below. Steps and
A step of polishing the substrate by sandwiching the substrate arranged on the carrier between the upper surface plate and the lower surface plate and moving the substrate relative to each other.
To be equipped.

According to the above-mentioned substrate placement support jig and the method for manufacturing a substrate for polishing a substrate using this jig, scratches are generated on the outer peripheral edge of the substrate without causing scratches on the main surface of the substrate. The substrate can be efficiently arranged in the substrate holding hole of the carrier.

It is a figure which shows the schematic structure of the substrate arrangement support jig of one Embodiment. It is a figure explaining the claw part for holding a substrate in a substrate holding hole which is one Embodiment. It is a figure explaining the claw part for holding a substrate in a substrate holding hole which is another embodiment. It is a figure explaining the state which the substrate is separated from the substrate holding hole in the substrate arrangement support jig of one Embodiment. It is a figure which shows the structure of the polishing apparatus used for the polishing process of one Embodiment. It is a figure which shows the structure of the polishing apparatus used for the polishing process of one Embodiment.

Hereinafter, the substrate placement support jig of one embodiment and the manufacturing method of the substrate will be described with reference to the drawings.

(Board placement support jig)
FIG. 1 is a diagram showing a schematic configuration of a substrate arrangement support jig of one embodiment.
The substrate placement support jig 10 is a placement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in the carrier 12 in order to polish the main surface of the substrate. Polishing referred to in the present specification is not only "polishing" in which the surface is polished to reduce the surface roughness of the substrate after grinding, but also rough grinding in order to change the dimensions and shape of the substrate, that is, "grinding (wrapping)". ) ”Is also included. When the process of polishing the surface to reduce the surface roughness of the substrate after "grinding" is referred to as "polishing" to distinguish it from grinding, the substrate placement support jig 10 "grinds" or "grinds" the main surface of the substrate. It is an arrangement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in the carrier 12 for "polishing". In other words, the substrate arrangement support jig 10 can be used regardless of the processing method as long as the main surface of the substrate is processed by using the carrier 12 as described above.
As shown in FIG. 1, the substrate arrangement support jig 10 includes a plate-shaped jig main body 16. The jig main body 16 is provided with a plurality of standby holes 18 on which the substrate S can be arranged, corresponding to the positions of the plurality of substrate holding holes 14 of the carrier 12. The carrier 12 is provided with six substrate holding holes 14, and correspondingly, the jig main body 16 is also provided with six standby holes 18 at the same positions.
In the example shown in FIG. 1, the carrier 12 is provided with six substrate holding holes 14, but the number of substrate holding holes 14 is not limited to six and may be a plurality. The number of substrate holding holes 14 is preferably 5 or more, and more preferably 10 or more.
Although not shown, a tooth portion that engages with the internal gear (gear 62 shown in FIG. 5) of the lower platen is provided on the outer periphery of the carrier 12 shown in FIG.

At least one edge of each of the standby holes 18 of the jig body 16 is provided with a claw portion that protrudes from the edge and comes into contact with the outer peripheral edge of the substrate S to hold the substrate S. The claws move forward to hold the substrate S in each of the standby holes, and the substrate S is retracted while the jig body 16 is moved to the upper part of the carrier 12 placed on the lower platen. Is opened from each of the waiting holes 18 and dropped to be arranged in each of the substrate holding holes 14 of the carrier 12 below, so that the claw portion moves forward or backward freely in and out of the area of the waiting holes 18. When the claw portion holds the substrate S, the contact of the claw portion with the outer peripheral end of the substrate S means that the claw portion contacts at least a part of the outer peripheral end. In addition to the end face, the outer peripheral end also includes a boundary portion between the end face and the main surface (when the chamfered surface is formed on the end face, the boundary portion between the chamfered surface and the main surface).
The claw portion may have a shape that protrudes so as to hold the substrate S by coming into contact with at least a part of the outer peripheral end of the substrate S, and does not necessarily have a claw-shaped shape.

FIG. 2 is a diagram illustrating a claw portion for holding the substrate S in the standby hole 18, which is an embodiment. The claw portion 20 shown in FIG. 2 has an inclined surface 24 provided so as not to contact the main surface of the substrate S but to contact the chamfered surface 22 provided at the outer peripheral end of the substrate S. As shown in FIG. 2, the chamfered surface 22 (including the boundary portion between the chamfered surface 22 and the main surface) comes into contact with the inclined surface 24, and each of the claw portions 20 supports the substrate S from below, whereby the substrate S is formed. It is held in each of the waiting holes 18. The claw portion 20 moves forward or backward freely in and out of the area of the standby hole 18 by the operator pressing the operating portion 26 shown in FIG. 1 or releasing the pressing of the operating portion 26.
The chamfered surface 22 is a surface interposed between the side wall surface 25 (see FIG. 3) substantially orthogonal to the main surface of the substrate S (the angle substantially orthogonal is 89 to 91 degrees) and the main surface. The chamfered surface 22 is smoothly connected to the main surface and extends toward the side wall surface 25.

The mechanism for advancing and retreating the claw portion 20 is not particularly limited. For example, the claw portion 20 is urged by a spring member and is normally in a protruding state with respect to the standby hole 18, and by pressing the operation portion 26, the spring that overcomes the urging force of the spring member and retracts the claw portion 20. A mechanism using a member can be used. Further, a gear that rotates and moves along the inner circumference of each of the standby holes 18 is provided, and when this gear rotates and moves, the cam mechanism connected to the claw portion 20 operates by the movement of the gear, so that the claw portion 20 moves. A mechanism using a cam mechanism that moves forward or backward can be used. The claws 20 are provided at two or more locations on the circumference of each of the standby holes 18. As a result, the substrate S can be stably held in the standby hole 18.
The inclined surface 24 of the claw portion 20 only supports the chamfered surface 22 from below, and since the region in contact with the substrate S is small, the chamfered surface 22 is less likely to be damaged.
The number of claws 20 is not particularly limited, but the number of claws 20 is preferably two or three because the device configuration becomes complicated when the number of claws 20 is four or more. When two or three claw portions 20 are provided, it is preferable to provide the claw portions 20 at intervals of about 180 degrees and about 120 degrees, respectively, on the circumference of the standby hole 18.

FIG. 3 is a diagram illustrating a claw portion for holding the substrate S in the standby hole 18, which is another embodiment.
The claw portion 20 shown in FIG. 3 projects from the edge of each of the standby holes 18 toward the inside of the standby holes 18 so as to abut on the side wall surface 25 provided at the outer peripheral end of the substrate S and orthogonal to the main surface of the substrate S. It has a protrusion 28. The protrusion 28 abuts on the side wall surface 25 from a direction orthogonal to the side wall surface 25 and presses the substrate S against the walls of the standby holes 18 (walls on the opposite side of the protrusion 28) so that the substrate S is formed by the standby holes 18. Each is held by frictional force. The protrusion 28 of the claw portion 20 presses the side wall surface 25 from the side, but since the region where the protrusion 28 is in contact with the substrate S is small, the side wall surface 25 is less likely to be damaged.
The mechanism for advancing and retreating the claw portion 20 in FIG. 3 is not particularly limited as described above, and a mechanism using a spring member or a mechanism using a cam mechanism can be used.

As the claw portion 20 retracts, as shown in FIG. 4, the substrate S held in the standby hole 18 falls from the standby hole 18 and is placed on the lower platen of the carrier 12. It can be arranged in the substrate holding hole 14. FIG. 4 is a diagram illustrating a state in which the substrate S is separated from the standby hole 18 in the substrate arrangement support jig of one embodiment.
In this case, the substrate S cannot be reliably arranged in the substrate holding hole 14 unless the standby hole 18 and the substrate holding hole 14 are correctly aligned in the vertical direction. Therefore, according to one embodiment, the jig main body 16 is provided with an alignment portion, and can be locked with the alignment portion provided on the carrier 12. As a result, the jig body 16 can be arranged at an appropriate position with respect to the carrier 12. The alignment portion of the jig body 16 is, for example, a protrusion or a hole protruding from the jig body 16 toward the carrier 12, and the alignment portion of the carrier 12 can lock the protrusion, for example, a hole. Alternatively, it is a protrusion protruding toward the jig body 16.

In this way, in order to open the substrate S from each of the standby holes 18 and drop the substrate S and arrange the substrate S in each of the substrate holding holes 14 of the carrier 12 below, the claw portion 20 is formed in the standby holes 18. Since the mechanism is such that it can move forward or backward freely in and out of the region, it efficiently holds the carrier 12 on the substrate without causing scratches on the main surface of the substrate S and without causing scratches on the outer peripheral end of the substrate S. The substrate S can be arranged in the hole 14.

It is preferable that the claw portions 20 provided in each of the standby holes 18 are configured to retract at the same time because the substrate S can be simultaneously arranged in the substrate holding holes 14 of the carrier 12.

Such a substrate arrangement support jig 10 can be suitably used when the polishing process is performed while the substrate S is held in the substrate holding holes 14 of the carrier 12. In particular, before the start of the polishing process by the polishing apparatus, the setting work is performed in which the substrate S is arranged in the substrate holding hole 14 with the restricted space created by the upper surface plate moving upward with respect to the lower surface plate as a work space. It is preferable to use the substrate arrangement support jig 10 in order to efficiently set the substrate S in the space provided. Therefore, in one embodiment, the manufacture of the substrate S includes a polishing process for polishing the main surface of the substrate S while holding the substrate S in each of the substrate holding holes 14 of the carrier 12 provided with the plurality of substrate holding holes 14. As the method, the substrate placement support jig 10 is used. That is, in the method of manufacturing a substrate, the lower platen is held in a state where the claw portion 20 is advanced so as to protrude from the edge of the standby hole 18 in each of the standby holes 18 of the substrate arrangement support jig 10 described above to hold the substrate S. By retracting the claw portion 20 of the jig body 16 at a position above the carrier 12 arranged on the substrate S, the substrate S is opened from the standby hole 18 and dropped. As a result, the substrate S is arranged in each of the substrate holding holes 14 of the carrier 12 below. After that, the substrate S arranged on the carrier 12 is sandwiched between the upper surface plate and the lower surface plate and moved relative to each other to polish the substrate S.
When the jig body 16 is arranged at a position above the carrier 12, for example, the jig body 16 is placed in contact with the surface (main surface) of the carrier 12 and the surface (main surface) of the jig body 16. The jig body 16 may be arranged so that the surface (main surface) of the jig body 16 is slightly separated from the surface (main surface) of the carrier 12.

(Abrasive device)
The configuration of the polishing apparatus will be described more specifically with reference to FIGS. 5 and 6. 5 and 6 are diagrams showing the configuration of a polishing apparatus used for the polishing process of one embodiment.
In the polishing apparatus, polishing pads 30 are attached to the upper surface of the lower surface plate 60 and the lower surface of the upper surface plate 40. In FIG. 5, the polishing pad 30 is written in the form of a sheet. For the polishing pad 30, for example, urethane foam resin or the like can be used.

The material and manufacturing method of the substrate S to be polished by the polishing device are not particularly limited. The material of the substrate S is, for example, glass or an aluminum alloy. Further, a layer of NiP (nickel phosphorus) alloy may be provided on these surfaces. When the substrate S is a substrate for a magnetic disk, the size of the substrate S is, for example, the size of a substrate for a magnetic disk having a nominal diameter of 3.5 inches or 2.5 inches. When the substrate S is a substrate for a magnetic disk having a nominal diameter of 3.5 inches, for example, the outer diameter is 94 mm to 98 mm and the inner diameter is about 25 mm. When the substrate S is a substrate for a magnetic disk having a nominal diameter of 2.5 inches, for example, the outer diameter is 56 mm to 68 mm, and the inner diameter is about 20 mm. The plate thickness of the substrate S is, for example, 0.20 mm to 1.3 mm, preferably 0.30 mm to 0.7 mm.
In the case of a glass plate, for example, the substrate S is scribed and cut on a large sheet glass to form a disk-shaped glass plate. That is, a method is used in which a notch line is formed on a glass plate using a scriber, and cracks are generated along the notch line by heating or the like to cut the glass plate.
When the substrate S is a glass plate, for example, a laser beam may be used from a large glass plate to form a disk-shaped glass plate slightly larger than the size of the substrate S. Further, a disk-shaped glass plate may be formed by wet etching using an etching solution such as hydrofluoric acid.
The large sheet glass before cutting out the glass blank is, for example, a glass plate having a constant plate thickness produced by using a floating method or a down draw method. Alternatively, the glass block may be a substrate press-molded using a mold.
Further, in order to make concentric circular holes in the disk-shaped glass blank, a circular hole is made using a scriber. Instead of making a circular hole using a scriber, the circular hole may be made by irradiation with a laser beam or by etching. In order to form the chamfered surface 22 on the end surface (the end surface of the outer peripheral end portion and the end surface of the inner peripheral end portion) of the disk-shaped substrate S thus obtained, shape processing is performed with a full-type grindstone. Instead of the shape processing by the total type grindstone, the shape processing by the laser beam L may be used.

The carrier 12 has a substrate holding hole 14 for holding the substrate S when the disk-shaped substrate S is sandwiched between the upper surface plate 40 and the lower surface plate 60 and the main surface of the substrate S is polished. The carrier 12 has a tooth portion 31 provided on the outer peripheral portion and meshing with the sun gear 61 and the internal gear 62, and a plurality of substrate holding holes 14 for accommodating and holding the substrate S. The sun gear 61, the internal gear 62 provided on the outer edge, and the disk-shaped carrier 12 together constitute a planetary gear mechanism centered on the central axis CTR (see FIG. 6). The disk-shaped carrier 12 meshes with the sun gear 61 inside the polishing device and meshes with the internal gear 62 outside the polishing device, and accommodates and holds a plurality of substrates S. On the lower platen 60, the carrier 12 revolves while rotating as a planetary gear, and the substrate S and the lower platen 60 are relatively moved. For example, if the sun gear 61 rotates in the counterclockwise direction, the carrier 12 rotates in the clockwise direction and the internal gear 62 rotates in the counterclockwise direction. As a result, a relative motion occurs between the lower platen 60 and the substrate S. In the same manner, the substrate S and the upper surface plate 40 are relatively moved.

During the operation of the relative motion, the upper surface plate 40 presses the substrate S held by the carrier 12 with a predetermined pressure (that is, in the vertical direction), whereby the polishing pad 30 presses against the substrate S. Be pressed. Further, as shown in FIG. 6, a polishing slurry is supplied from the supply tank 71 between the substrate S and the polishing pad 30 via one or a plurality of pipes 72 by a pump (not shown).
The main surface of the substrate S is polished using the above polishing device.

According to one embodiment, the polishing process of the substrate S includes a first polishing and a second polishing.
In the first polishing, the main surfaces on both sides of the substrate S are polished while holding the outer end faces of the substrate S in the substrate holding holes 14 provided in the carrier 12 of the double-sided polishing apparatus described above. The purpose of the first polishing is to adjust minute surface irregularities (microwaveness, roughness).
As the free abrasive grains used in the first polishing treatment, for example, abrasive grains such as cerium oxide or zirconia are used. The size of the abrasive grains is, for example, in the range of 0.5 to 3 μm in terms of average particle size (D50).

When the substrate S is a glass plate, it may be chemically strengthened after the first polishing. In this case, for example, a mixed melt of potassium nitrate and sodium nitrate is used as the chemical strengthening liquid, and the glass plate is immersed in the chemical strengthening liquid. As a result, a compressive stress layer can be formed on the surface of the glass plate by ion exchange.

Next, the substrate S is subjected to the second polishing. In the second polishing process, the main surfaces on both sides of the substrate S are polished while being held in the substrate holding holes 14 provided in the carrier 12 of the double-sided polishing apparatus described above. In the second polishing treatment, the type and particle size of the free abrasive grains are different from those in the first polishing treatment, and the hardness of the resin polisher is different. The hardness of the resin polisher is preferably smaller than that at the time of the first polishing treatment. For example, a polishing liquid containing colloidal silica as free abrasive grains is supplied between the polishing pad of the double-sided polishing apparatus and the main surface of the glass plate, and the main surface of the glass plate is polished. The size of the abrasive grains used for the second polishing is the average particle size (D50), and is preferably in the range of, for example, 5 to 50 nm.
The disk-shaped substrate S may be subjected to a "grinding" process before the first polishing. When an apparatus including a carrier similar to the polishing apparatus is used in the "grinding" process, the substrate placement support jig 10 can be used. Further, in the above embodiment, the polishing treatment is performed twice, but the polishing treatment may be performed once.
In this way, the substrate S is subjected to the first polishing and the second polishing to produce a substrate having a target surface unevenness.

In the above description, as the substrate S applied to the substrate arrangement support jig 10, a disc-shaped substrate having no inner hole is used, but the substrate S is concentric in addition to the circular substrate. It may be a disk-shaped substrate having an inner hole, a polygonal substrate such as a quadrangle, or a semiconductor substrate such as a silicon wafer.

Although the substrate placement support jig and the method for manufacturing the substrate of the present invention have been described in detail above, the present invention is not limited to the above embodiment, and various improvements and changes are made without departing from the gist of the present invention. Of course, it may be.

10 Board placement support jig 12 Carrier 14 Board holding hole 16 Jig body 18 Standby hole 20 Claw part 22 Chamfered surface 24 Inclined surface 25 Side wall surface 26 Operation part 28 Projection part 30 Polishing pad 31 Tooth part 40 Upper surface plate 60 Lower surface plate 61 Sun gear 62 Internal gear 71 Tank 72 Piping

Claims

A substrate placement support jig for arranging a substrate in each of a plurality of substrate holding holes provided in a carrier in order to polish the main surface of the substrate.
A plate-shaped jig body provided with a plurality of standby holes on which a substrate can be arranged corresponding to the positions of the plurality of substrate holding holes of the carrier, and a plate-shaped jig body.
At least one of the edges of each of the waiting holes is provided with a claw portion provided on the jig body, which protrudes from the edge and contacts the outer peripheral edge of the substrate to hold the substrate.
By advancing the claws to hold the substrate in each of the waiting holes and retracting the claws while the jig body is located above the carrier, the substrate can be moved from each of the waiting holes. The claws are configured such that the claws move forward or backward freely in and out of the area of the standby holes so that they can be opened, dropped, and placed in each of the substrate holding holes of the carrier below. A board placement support jig characterized by being
The claws are provided at two or more places on the circumference of each of the waiting holes.
The claw portion has an inclined surface provided so as not to contact the main surface of the substrate but to contact the chamfered surface provided at the outer peripheral end of the substrate.
The substrate placement support jig according to claim 1, wherein the substrate is held in each of the standby holes by contacting the chamfered surface with the inclined surface and supporting the substrate from below by each of the claws.
The claw portion has a protrusion that protrudes inward from the edge of each of the standby holes that abuts on a side wall surface that is provided at the outer peripheral end of the substrate and is orthogonal to the main surface of the substrate.
The first aspect of the present invention, wherein the substrate is held in each of the waiting holes by abutting the protrusion from a direction orthogonal to the side wall surface and pressing the substrate against the walls of the waiting holes. Board placement support jig.
The substrate placement support jig according to any one of claims 1 to 3, wherein the claws provided in each of the standby holes are configured to retract at the same time.
On the surface of the jig body facing the carrier, the position of the standby hole is locked to a hole or a protrusion provided on the surface of the carrier so as to correspond to the position of the substrate holding hole of the carrier. The substrate placement support jig according to any one of claims 1 to 4, which is provided with protrusions or holes.
A method for manufacturing a substrate, which includes a polishing process for polishing the main surface of a substrate while holding the substrate in each of the substrate holding holes of a carrier provided with a plurality of substrate holding holes.
The substrate is held in a state where the claws are advanced so as to protrude from the edges of the standby holes in each of the standby holes of the substrate placement support jig according to any one of claims 1 to 5. By retracting the claw of the jig body at a position above the carrier arranged on the lower platen, the substrate is opened from the standby hole and dropped, and the substrate of the carrier below is dropped. The step of arranging the substrate in each of the holding holes and
A step of polishing the substrate by sandwiching the substrate arranged on the carrier between the upper surface plate and the lower surface plate and moving the substrate relative to each other.
A method for manufacturing a substrate, which comprises.