WO2021059937A1 - ダイシング装置及び方法 - Google Patents

ダイシング装置及び方法 Download PDF

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Publication number
WO2021059937A1
WO2021059937A1 PCT/JP2020/033741 JP2020033741W WO2021059937A1 WO 2021059937 A1 WO2021059937 A1 WO 2021059937A1 JP 2020033741 W JP2020033741 W JP 2020033741W WO 2021059937 A1 WO2021059937 A1 WO 2021059937A1
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WO
WIPO (PCT)
Prior art keywords
work
jig
dicing
shape
division line
Prior art date
Application number
PCT/JP2020/033741
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
邦義 武田
健夫 對馬
浩則 深谷
裕介 新井
翼 清水
Original Assignee
株式会社東京精密
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020149028A external-priority patent/JP6912745B1/ja
Application filed by 株式会社東京精密 filed Critical 株式会社東京精密
Priority to KR1020217041965A priority Critical patent/KR102411860B1/ko
Priority to CN202080061320.1A priority patent/CN114340846B/zh
Publication of WO2021059937A1 publication Critical patent/WO2021059937A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a dicing device and a method, and relates to a dicing device and a method for dividing a workpiece (hereinafter referred to as a work) such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.
  • a work such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.
  • a dicing device that divides a work such as a wafer on which a semiconductor device or an electronic component is formed into individual chips includes a blade that is rotated at high speed by a spindle, a work table that attracts and holds the work, and a work table and a blade. It includes X, Y, Z and ⁇ drive units that change their relative positions. In the dicing device, dicing (cutting) is performed by cutting the blade into the work while relatively moving the blade and the work by each drive unit.
  • the work When dicing the work, the work is sucked and fixed to the jig, and the work division line and the jig groove of the jig are aligned. As a result, the work can be completely divided by cutting the blade deeply so as to penetrate the work.
  • Patent Documents 1 and 2 disclose that when the work is to be aligned with the scheduled division line of the work, the work is retracted from the jig and then replaced. Specifically, the jig groove and the planned division line are detected from the images before and after the work is placed on the jig, and the position between the jig groove position of the jig and the position of the planned division line of the work is reached. Calculate the amount of deviation. Next, the work is retracted from the jig, the work or the jig is moved to correct the amount of deviation, and then the work is placed back on the jig. As a result, the scheduled division line and the jig groove are aligned.
  • (1) and (2) can be considered as factors that cause the blade and the jig to interfere with each other during dicing.
  • Patent Documents 1 and 2 the amount of deviation between the position of the jig groove of the jig and the position of the line to be divided of the work is calculated, and the work is retracted from the jig and repositioned to perform alignment. There is. According to Patent Documents 1 and 2, the amount of deviation due to the carry-in error of (1) can be calculated from the images before and after the work is placed on the jig, and the amount of deviation can be corrected by repositioning. .. However, in Patent Documents 1 and 2, it takes time and effort to retract the work from the jig and replace it, which leads to a loss of time. Therefore, there is a problem that the throughput of the dicing apparatus is lowered.
  • the present invention has been made in view of such circumstances, and a dicing apparatus and method capable of preventing interference between a blade and a jig during dicing processing and ensuring throughput can be provided.
  • the purpose is to provide.
  • the dicing apparatus is used for dicing a jig for sucking and holding a work and a work sucked and held by the jig along a planned division line.
  • a machined part including a blade for processing and dividing, and a measurement result of the shape of the work before dicing, and based on the measurement result, the blade thickness along the planned division line is obtained.
  • a control unit for aligning the work and the jig is provided so that a line having a corresponding thickness fits in the jig groove of the jig, and the control unit is separated from the cross point of the planned division line on the surface of the work.
  • the inclination of the planned division line is detected from the detection results of at least two patterns formed at the above positions, the position of the cross point is calculated from the inclination of the planned division line, and the work is performed from the inclination of the planned division line and the position of the cross point. Calculate the amount of distortion of.
  • the dicing apparatus further includes a pre-alignment unit for measuring the shape of the work, and the control unit obtains the measurement result of the shape of the work from the pre-alignment unit. get.
  • the control unit acquires the measurement result of the shape of the work from the external device for prealignment for measuring the shape of the work.
  • control unit has all the lines of the thickness corresponding to the blade thickness along the planned division line of the jig. Align the work piece and the jig so that they fit in the jig groove.
  • the control unit divides the work into a plurality of divided areas, and the blades along the planned division line included in the divided areas. Align the work piece with the jig so that the line with the thickness corresponding to the blade thickness of the tool fits in the jig groove of the jig.
  • a shape measurement step for measuring the shape of the work and a measurement result of the shape of the work are acquired, and based on the measurement result, a line along a scheduled division line of the work is used.
  • the shape measurement step was formed on the surface of the work at a position away from the cross point of the planned division line, including a step of sucking and holding the work with a jig and dicing the work along the planned division line.
  • a step of detecting the inclination of the planned division line from the detection results of at least two patterns, a step of calculating the position of the cross point from the inclination of the planned division line, and a distortion of the work from the inclination of the planned division line and the position of the cross point. Includes a step to calculate the quantity.
  • the shape of the work is measured by the pre-alignment unit provided in the dicing device in the shape measurement step, and from the pre-alignment unit in the alignment step. , Obtain the measurement result of the shape of the work.
  • the dicing method according to the eighth aspect of the present invention measures the shape of the work by an external device for prealignment different from the dicing device in the shape measurement step in the sixth aspect, and externally in the alignment step. Obtain the measurement result of the shape of the work from the device.
  • the position of the planned division line is measured in advance and the alignment is performed so that the blade and the jig can be aligned. Interference can be prevented.
  • FIG. 1 is a plan view showing a dicing apparatus according to the first embodiment of the present invention.
  • FIG. 2 is a block diagram showing a control system of the dicing apparatus according to the first embodiment of the present invention.
  • FIG. 3 is a plan view for explaining pattern matching in measuring the shape of the work.
  • FIG. 4 is a plan view for explaining pattern matching in measuring the shape of the work.
  • FIG. 5 is a plan view for explaining a pattern search method (spiral search operation) using a microscope.
  • FIG. 6 is a plan view showing another embodiment of the handler arm.
  • FIG. 7 is a plan view (before alignment) showing the machining stage and the work.
  • FIG. 8 is a plan view (after alignment) showing the machining stage and the work.
  • FIG. 7 is a plan view (before alignment) showing the machining stage and the work.
  • FIG. 9 is an enlarged perspective view showing a jig provided on the surface of the processing stage.
  • FIG. 10 is a plan view showing a cutting state of the work.
  • FIG. 11 is a cross-sectional view taken along the line XI-XI of FIG.
  • FIG. 12 is a plan view showing a comparative example.
  • FIG. 13 is a flowchart showing a dicing method according to the first embodiment of the present invention.
  • FIG. 14 is a plan view showing a case where the cross marks on the planned division line are arranged apart from each other in the Y direction with respect to the pattern.
  • FIG. 15 is a plan view showing an example in which the planned division line is tilted with respect to the example of FIG. FIG.
  • FIG. 16 is a plan view showing a case where the cross marks on the planned division line are arranged apart from each other in the XY directions with respect to the pattern.
  • FIG. 17 is a plan view showing an example in which the planned division line is tilted with respect to the example of FIG.
  • FIG. 18 is a flowchart showing a procedure for calculating the position of the scheduled division line.
  • FIG. 19 is a plan view showing an example in which the left and right patterns and the distance to the cross mark are different.
  • FIG. 20 is a plan view showing an example in which the left and right patterns and the distance to the cross mark are different.
  • FIG. 21 is a plan view for explaining the dicing method according to the second embodiment of the present invention.
  • FIG. 21 is a plan view for explaining the dicing method according to the second embodiment of the present invention.
  • FIG. 22 is a flowchart showing a dicing method according to the second embodiment of the present invention.
  • FIG. 23 is a flowchart showing a dicing process for each divided area in FIG. 22.
  • FIG. 24 is a plan view showing a dicing apparatus according to a third embodiment of the present invention.
  • FIG. 25 is a block diagram showing a control system of the dicing apparatus according to the third embodiment of the present invention.
  • FIG. 1 is a plan view showing a dicing apparatus according to the first embodiment of the present invention
  • FIG. 2 is a block diagram showing a control system of the dicing apparatus according to the first embodiment of the present invention.
  • the dicing apparatus 1 includes a pre-alignment unit 10 for measuring the shape of the work W and a processing unit 20 for dicing the work W.
  • the shape of the work W is measured in the prealignment unit 10 before the dicing process, and the work W in the processing unit 20 is measured based on the measurement result of the measurement of the shape of the work W.
  • the jig J1 is aligned with the jig groove G1 (see FIGS. 7 to 11).
  • the handler 50 is used to carry the work W into the pre-alignment unit 10, move the work W between the pre-alignment unit 10 and the processing unit 20, and carry out the work W from the processing unit 20.
  • the handler 50 includes a handler axis 52, a handler arm 54, and a handler drive unit 56.
  • the handler axis 52 extends in the Y direction and holds the handler arm 54 so as to be movable along the Y direction and the Z direction.
  • the handler arm 54 attracts and holds the work W.
  • the handler drive unit 56 includes a power source (for example, a motor) for moving the handler arm 54 in the Y direction.
  • a ball screw mechanism in which the handler shaft 52 is provided with a ball screw and the handler arm 54 is provided with a nut or the like to be screwed with the ball screw, a rack and pinion mechanism, or the like. It is possible to use a mechanism capable of reciprocating linear motion.
  • the control system of the dicing device 1 includes a control unit 100, an input unit 102, and a display unit 104.
  • the control system of the dicing device 1 can be realized by a general-purpose computer such as a personal computer or a microcomputer.
  • the control unit 100 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a storage device (for example, a hard disk, etc.) and the like.
  • various programs such as a control program stored in the ROM are expanded in the RAM, and the program expanded in the RAM is executed by the CPU to realize the functions of each unit of the dicing device 1.
  • the input unit 102 includes an operation member (for example, a keyboard, a pointing device, etc.) for receiving an operation input from the user.
  • an operation member for example, a keyboard, a pointing device, etc.
  • the display unit 104 is a device that displays a GUI (Graphical User Interface) or the like for operating the dicing device 1, and includes, for example, a liquid crystal display.
  • GUI Graphic User Interface
  • the prealigned portion 10 and the processed portion 20 of the dicing apparatus 1 will be described below.
  • a three-dimensional Cartesian coordinate system will be used for convenience.
  • the prealignment unit 10 includes a prealignment stage ST0, a microscope MS1, a prealignment stage drive unit 12, and an MS drive unit 14.
  • the work W is attracted and held by the handler arm 54, carried into the prealignment unit 10, and placed on the prealignment stage ST0.
  • a jig J1 (see FIGS. 7 to 11) for sucking and holding the work W is provided on the surface of the prealignment stage ST0, and the work W is sucked and held on the prealignment stage ST0 by the jig J1. Will be done.
  • the prealignment stage drive unit 12 includes a motor that rotates the prealignment stage ST0 in the ⁇ 0 direction, and a vacuum source (vacuum generator, for example, an ejector, a pump) for sucking air and attracting the work W to the prealignment stage ST0. Etc.) and is included.
  • a vacuum source vacuum generator, for example, an ejector, a pump
  • the MS drive unit 14 includes a power source (for example, a motor) for moving the microscope MS1 along the X0 axis and the MS1 axis.
  • a power source for example, a motor
  • a mechanism for moving the microscope MS1 for example, a mechanism capable of reciprocating linear motion such as a ball screw or a rack and pinion mechanism can be used.
  • the microscope MS1 captures an image of the surface of the work W adsorbed and held by the prealignment stage ST0.
  • the surface image of the work W taken by the microscope MS1 is transmitted to the control unit 100.
  • the microscope MS1 is moved along the X0 axis and the MS1 axis, but the prealignment stage ST0 may be moved, or both the microscope MS1 and the prealignment stage ST0 are moved. You may let it.
  • the control unit 100 performs image processing on the surface image of the work W received from the microscope MS1 and measures the position of the scheduled division line of the work W. For example, the control unit 100 performs pattern matching on the surface image of the work W received from the microscope MS1. Then, the control unit 100 detects the repeating pattern or alignment mark (hereinafter referred to as pattern M1) of the semiconductor device or electronic component formed on the surface of the work W, thereby detecting the position of the scheduled division line of the work W (hereinafter referred to as the pattern M1). For example, the coordinates of the intersection and the end point) are measured. As a result, the shape of the work W is measured.
  • pattern M1 repeating pattern or alignment mark
  • 3 and 4 are plan views for explaining pattern matching in measuring the shape of the work.
  • the intersection (pattern M1) of substantially all scheduled division lines CL1 of the work W is detected by pattern matching with respect to the image taken by the microscope MS1. According to the example shown in FIG. 3, it is possible to align the work W scheduled division line CL1 and the jig groove G1 of the jig J1 with high accuracy.
  • a part of the work W pattern M1 (for example, points at four corners) is detected. Also in the example shown in FIG. 4, when the dicing process is performed along the scheduled division line CL1, the alignment can be performed so that the scheduled division line CL1 and the jig groove G1 of the jig J1 do not interfere with each other.
  • the pattern M1 can be increased or decreased according to the required alignment accuracy.
  • Patent Documents 1 and 2 since it is necessary to perform pattern matching for alignment at least twice before and after repositioning, the time required for alignment of the work W becomes long. In particular, as shown in FIG. 3, when a large number of patterns M1 to be detected are set, the efficiency of dicing processing is significantly reduced. On the other hand, according to the present embodiment, even when a large number of patterns M1 to be detected are set, the shape of the work W is measured only once in the prealignment unit 10, so that the pattern matching time is required. Can be shortened, and a decrease in the efficiency of dicing processing can be suppressed.
  • FIG. 5 is a plan view for explaining a pattern search method (spiral search operation) using a microscope.
  • the pattern M1 may not be included in the field of view V1 of the microscope MS1 when the microscope MS1 is moved to the position of the pattern M1 on the design of the work W.
  • the microscope MS1 is moved in the X0 direction and the MS1 direction to sequentially search the periphery of the field of view V1. This makes it possible to detect the pattern M1.
  • the processing unit 20 can perform alignment without performing the spiral search operation as described above.
  • the processing unit 20 includes a first stage ST1, a second stage ST2, a first stage drive unit 22-1, a second stage drive unit 22-2, a processing drive unit 26, a microscope MS2, an MS drive unit 28, and a first spindle 30. -1, 2nd spindle 30-2, 1st blade 32-1 and 2nd blade 32-2 are included.
  • the work W whose shape has been measured in the pre-alignment unit 10 is attracted and held by the handler arm 54, carried into the processing unit 20, and placed on the first stage ST1 or the second stage ST2. Similar to the prealignment stage ST0, a jig for sucking and holding the work W is provided on the surface of the first stage ST1 or the second stage ST2.
  • W workpieces being conveyed
  • W0 workpieces adsorbed and held by the prealignment stage ST0, the first stage ST1 and the second stage ST2
  • W0, W1 and W2 respectively.
  • the first stage drive unit 22-1 includes a motor for rotating the first stage ST1 in the ⁇ 1 direction and a pump for sucking air and sucking the work W to the first stage ST1.
  • the second stage drive unit 22-2 includes a motor for rotating the second stage ST2 in the ⁇ 2 direction and a pump for sucking air and sucking the work W to the second stage ST2.
  • the processing unit 20 is provided with two stages (first stage ST1 and second stage ST2), but the processing unit 20 may have one stage.
  • the pre-alignment unit 10 dedicated to shape measurement is provided separately from the processing unit 20, but the present invention is not limited to this.
  • the processing unit 20 has two stages, one of the stages of the processing unit 20 may also be used as the pre-alignment unit 10 without providing the pre-alignment unit 10 dedicated to shape measurement.
  • the machining of the work is not completed in the second stage ST2 even though the shape measurement of the work W1-1 is completed in the first stage ST1.
  • the situation is possible. In this case, if only one work can be held by the handler arm 54, the work W1-1 whose shape has been measured cannot be processed until the second stage ST2 becomes empty. Therefore, a waiting time occurs between the measurement of the shape in the first stage ST1 and the start of machining in the second stage ST2, which causes a decrease in tact.
  • the handler arm 54A provided with a mechanism for holding a plurality of (two pieces) of the workpieces W1-1 and W1-2, the work W-1 is vacant after the shape is measured.
  • the shape of the work W-2 can be measured.
  • the shape of the work can be measured all at once, and no empty stage is generated, so that the stage can be effectively used.
  • the first blade 32-1 and the second blade 32-2 are attached to the first spindle 30-1 and the second spindle 30-2, respectively.
  • the first spindle 30-1 and the second spindle 30-2 include a high frequency motor for rotating the first blade 32-1 and the second blade 32-2 at high speed, respectively.
  • the first blade 32-1 and the second blade 32-2 are, for example, disk-shaped cutting blades.
  • a diamond abrasive grain or an electrodeposition blade obtained by electrodepositing CBN (Cubic Boron Nitride) abrasive grains with nickel, a resin blade obtained by bonding with a resin, or the like is used. It is possible.
  • the first blade 32-1 and the second blade 32-2 can be replaced according to the type and size of the work W to be processed, the processing content, and the like.
  • the first stage ST1 and the second stage ST2 have the same configuration. Therefore, in the following description, the first stage drive unit 22-1 and the second stage drive unit 22-2 are the machining stage drive unit 22, the first spindle 30-1 and the second spindle 30-2 are the spindle 30, and the second spindle 30-2.
  • the 1st blade 32-1 and the 2nd blade 32-2 may be collectively referred to as the blade 32.
  • the machining drive unit 26 includes a motor for moving the first spindle 30-1 and the second spindle 30-2 along the machining axis (Y axis).
  • the MS drive unit 28 includes a power source (for example, a motor) for moving the microscope MS2 along the X1 axis, the X2 axis, and the MS2 axis.
  • a power source for example, a motor
  • a mechanism for moving the microscope MS2 for example, a mechanism capable of reciprocating linear motion such as a ball screw or a rack and pinion mechanism can be used.
  • the microscope MS2 captures images of the surfaces of the workpieces W1 and W2 adsorbed and held in the first stage ST1 and the second stage ST2.
  • the surface images of the works W1 and W2 taken by the microscope MS2 are transmitted to the control unit 100.
  • the microscope MS2 is moved along the X1 axis, the X2 axis, and the MS2 axis, but the first stage ST1 and the second stage ST2 may be moved, or the microscope MS2, The first stage ST1 and the second stage ST2 may be moved.
  • the first stage ST1 and the second stage ST2 may be referred to as a machining stage ST.
  • the control unit 100 performs image processing on the surface images of the workpieces W1 and W2 received from the microscope MS2, and is provided on the planned division lines of the workpieces W1 and W2 and the surfaces of the first stage ST1 and the second stage ST2. Align with the jig.
  • the X0, X1 and X2 axes are parallel to the X axis
  • the handler axis 52, MS1 axis, MS2 axis and processing axis are parallel to the Y axis.
  • the X0 axis and the MS1 axis of the prealignment unit 10 and the X1 axis and the X2 axis and the MS2 axis of the processing unit 20 can be provided independently of each other.
  • FIG. 7 and 8 are plan views showing a machining stage and a work. 7 and 8 show the states before and after the alignment between the machining stage ST and the work W is performed, respectively. Further, FIG. 9 is an enlarged perspective view showing a jig provided on the surface of the processing stage.
  • a division schedule line CL1 for dividing a semiconductor device, an electronic component, or the like formed on the work W into individual chips is provided on the surface of the work W.
  • a jig (suction pad) J1 is provided on the surface of the processing stage ST so as to have a one-to-one correspondence with the tip of the work W.
  • Jig J1 is the surface of the work stage ST, at predetermined intervals W G, (it is bonded) by being mounted side by side along the XY direction.
  • the space between the jigs J1 is referred to as a jig groove G1.
  • the jig J1 is replaced according to the type of workpiece W to be processed and the size and contents of the machining or the like, the width W G is the width (edge thickness) of the blade 32 of Chigumizo G1 wider than W B Is used.
  • the planar shape of the jig J1 is substantially rectangular in the examples shown in FIGS. 7 and 8, but it can be changed according to the shape of the chip. As shown in FIG. 8, the size of the jig J1 in a plan view is smaller than the size of the chip.
  • the jig J1 is made of rubber, for example, and has a tubular shape (square tubular shape) with the upper side (+ Z side) open and the bottom closed, as shown in FIG.
  • a suction hole H1 is formed on the bottom surface of the jig J1 and is used between the work W and the jig J1 by using the pump of the first stage drive unit 22-1 or the second stage drive unit 22-2. By sucking air, the work W is attracted and held on the processing stage ST.
  • the shape of the jig J1 is not limited to the tubular shape.
  • the jig J1 may be created, for example, by dicing a plate-shaped rubber having a plurality of suction holes H1 formed therein.
  • the control unit 100 When the work W is loaded on the machining stage ST, alignment is performed based on the position of the scheduled division line CL1 measured by the pre-alignment unit 10 as shown in FIG. More specifically, the control unit 100, X of the workpiece W to fit into the line of the thickness W B along the dividing lines CL1 measured in the pre-alignment unit 10 all corresponding Chigumizo G1, Y coordinates And the rotation angle ( ⁇ 1 or ⁇ 2) of the machining stage ST is calculated. Then, the control unit 100 adjusts the relative position between the handler arm 54 and the machining stage ST based on the calculated X and Y coordinates and the rotation angle ( ⁇ 1 or ⁇ 2), and aligns the work W with the jig groove G1. To attract the work W to the jig J1.
  • the line of the thickness W B along the dividing lines CL1 has to perform the alignment to fit into all the corresponding Chigumizo G1
  • the present invention is not limited thereto.
  • only a part of the planned division line CL1 for example, the two planned division lines CL X11 and CL X42 closest to the two opposing sides of the work W in the X direction, and the two opposing sides of the work W in the Y direction).
  • the two planned division lines closest to In the example shown in FIG.
  • the scheduled division line CL1 is distributed substantially linearly according to the strain of the work W. Therefore, for example, even if the alignment is performed so that the two scheduled division lines CL1 closest to the two opposite sides of the work W in the Y direction fit into the corresponding jig groove G1, the other scheduled division lines CL1 correspond. It is possible to fit in the jig groove G1.
  • FIG. 10 is a plan view showing a cutting state of the work
  • FIG. 11 is a cross-sectional view taken along the line XI-XI of FIG.
  • FIG. 12 is a plan view showing a comparative example.
  • the alignment as lines CT1 Thickness W B along the dividing lines CL1 falls in all corresponding Chigumizo G1 Do. Thereby, the interference between the blade 32 and the jig J1 can be prevented.
  • FIG. 13 is a flowchart showing a dicing method according to the first embodiment of the present invention.
  • control unit 100 controls the handler arm 54 and carries it into the prealignment unit 10. Then, the control unit 100 loads the work W on the prealignment stage ST0, and the pump of the prealignment stage drive unit 12 sucks and holds the work W on the prealignment stage ST0.
  • control unit 100 takes an image of the work W using the microscope MS1 and performs pattern matching of the image of the work W to detect the pattern M1 of the work W. Then, the control unit 100 measures the shape of the work W based on the position (distribution) of the pattern M1 (step S10: shape measurement step).
  • control unit 100 controls the prealignment stage drive unit 12 to release the suction state of the work W. Then, the control unit 100 controls the handler arm 54 to carry out the work W from the pre-alignment unit 10 and load the work W into the processing stage ST of the processing unit 20. At this time, the control unit 100 aligns the work W with the jig groove G1 of the jig J1 using the measurement result of the shape of the work W in step S10, controls the machining stage drive unit 22, and performs machining. The work W is sucked and held on the stage ST (step S12: alignment step). The alignment in step S12 is performed by, for example, any of the following (A) to (C).
  • control unit 100 performs alignment to fit into line CT1 Thickness W B along the dividing lines CL1 are all corresponding Chigumizo G1.
  • the control unit 100 is the two lines CL X11 and CL X42 (see FIG. 8) closest to the two opposite sides of the work W in the X direction, or the Y of the work W (B2).
  • Scheduled division lines closest to the two opposite sides at both ends of the direction In the example shown in FIG. 8, since the work W is divided into four division areas A1 to A4, a total of eight scheduled division lines CL Y11 and CL Y12 , alignment to fit into the CL Y21, CL Y22, CL Y31 , CL Y32, CL Y41 and CL Y42) the line CT1 of thickness W B along the corresponding Chigumizo G1.
  • the planned division lines CL Y11 , CL Y21 , CL Y31 and CL Y41 and the planned division lines CL Y12 , CL Y22 , CL Y32 and CL Y42 are each cut by one scan, so that each line is one. It may be treated as a planned division line.
  • the control unit 100 determines whether it is possible to alignment to fit into Chigumizo G1 which line CT1 of thickness W B along the dividing lines CL1 of the part of the all corresponding.
  • the part of the planned division line CL1 is, for example, (C1) the planned division lines (CL X11 and CL X42 and CL Y11 , CL Y12 , CL Y21 , CL Y22 , CL Y31 , which are closest to the four sides of the work W.
  • CL Y32 , CL Y41 and CL Y42 (C2) Two scheduled split lines CL1 or (C3) including the two scheduled split lines CL X11 and CL X42 closest to the two opposite sides of the work W in the X direction.
  • Multiple scheduled division lines CL1 including CL Y11 , CL Y12 , CL Y21 , CL Y22 , CL Y31 , CL Y32 , CL Y41 and CL Y42, which are the closest to the two opposite sides of the work W in the Y direction. Is.
  • control unit 100 moves the blade 32 along the scheduled division line CL1 of the work W attracted and held by the machining stage ST to perform dicing machining (step S14).
  • the blade 32 is aligned by measuring the position of the scheduled division line CL1 in advance. And the jig J1 can be prevented from interfering with each other.
  • FIG. 14 is a plan view showing a case where the cross marks on the planned division line are arranged apart from the pattern in the Y direction
  • FIG. 15 is a plan view in which the planned division line is tilted with respect to the example of FIG. It is a top view which shows an example.
  • the cross mark is omitted for convenience of illustration.
  • the scheduled division line CL1 is parallel to the X-axis, and a substantially cross is formed on the surface of the work W at a position dY away (offset) from the scheduled division line CL1 to the ⁇ Y side.
  • the shape pattern P1 is arranged.
  • the planned division line CL1 is a tangent line tangent to a circle C1 having a diameter dY centered on the center point (cross point) of each of the two patterns P1, and the contact point between the planned division line CL1 and the circle C1 is scheduled to be divided in the XY direction. It becomes the cross mark CM1 which is the intersection of the lines CL1.
  • the scheduled division line CL1 has a pattern as in the example shown in FIG. It is defined as the tangent of the circle C1 with radius dY centered on the cross point of P1.
  • FIG. 16 is a plan view showing a case where the cross marks on the planned division line are arranged apart from the pattern in the XY direction, and FIG. 17 shows the planned division line tilted with respect to the example of FIG. It is a top view which shows an example.
  • the scheduled division line CL1 is parallel to the X axis, and on the surface of the work W, dX is separated (offset) from the planned division line CL1 to the ⁇ X side and the ⁇ Y side.
  • a substantially cross-shaped pattern P1 is arranged at the position).
  • the planned division line CL1 is a tangent line tangent to a circle C1 having a diameter dY centered on the center point (cross point) of each of the two patterns P1, and is dX away from the contact point between the planned division line CL1 and the circle C1 in the + X direction.
  • the position is the cross mark CM1.
  • the scheduled division line CL1 has a pattern as in the example shown in FIG. It is defined as the tangent of the circle C1 with radius dY centered on the cross point of P1.
  • a plurality of scheduled division lines CL1 are obtained as described above. That is, at least two patterns P1 corresponding to the scheduled division line CL1 are detected to obtain the angle component d ⁇ , and the planned division line CL1 is obtained based on the angle component d ⁇ .
  • the strain amount of the work W is calculated based on the coordinates (X, Y) (hereinafter referred to as reference coordinates) of the cross mark CM1 obtained for the plurality of dividing lines. Specifically, a two-dimensional map of the correction amount with respect to the reference coordinates is created from the reference coordinates (X, Y) obtained for the plurality of division lines CL1 and the design coordinates. Then, the strain amount of the work W for each reference coordinate is calculated by the interpolation method or the like.
  • the strain amount of the work W is calculated from the reference coordinates (X, Y) and the slope d ⁇ of the plurality of scheduled division lines CL1, but the present invention is not limited to this.
  • a two-dimensional map for the XY coordinates of the pattern P1 may be created from the design value and the measured value of the coordinates of each pattern P1, and the strain amount of the work W for each reference coordinate may be calculated by an interpolation method or the like.
  • the amount of distortion at each reference coordinate is added to the amount of offset between the pattern P1 and the cross mark CM1, and the reference position (X, Y) is recalculated.
  • the machining position of the scheduled division line CL1 can be detected with high accuracy by obtaining the cross mark CM1 after obtaining the slope d ⁇ of the scheduled division line CL1.
  • the interference between the blade 32 and the jig J1 can be checked with high accuracy.
  • FIG. 18 is a flowchart showing a procedure for calculating the position of the scheduled division line.
  • control unit 100 takes an image of the work W using the microscope MS1. Then, the control unit 100 performs pattern matching of the image of the work W, detects at least two (one pair) patterns P1 for each scheduled division line CL1 from the image captured by the microscope MS1, and detects the scheduled division line CL1. The slope d ⁇ of is detected (step S100).
  • control unit 100 calculates the reference coordinates (X, Y) of the cross mark CM1 of the scheduled division line CL1 by the above equations (1) and (2) (step S102).
  • the amount of strain of the work W is calculated from the reference coordinates (X, Y) and the slope d ⁇ of the plurality of scheduled division lines CL1 (step S104).
  • step S106 based on the strain amount of the work W obtained in step S104, the position of each scheduled division line CL1 is recalculated to accurately obtain the machining position (step S106).
  • the cross mark CM1 on the scheduled division line is arranged apart from the pattern P1 in the Y direction or the XY direction has been described. It is also applicable when they are arranged apart in the direction. That is, in FIG. 15, the slope d ⁇ of the line segment connecting the two cross points is calculated assuming that the radius of the circle C1 centered on the cross point of the pattern P1 is zero. Then, assuming that the cross mark CM1 is located at a position dX away from the X axis rotated by d ⁇ in the ⁇ direction, the position of the cross mark CM1 can be calculated with high accuracy by obtaining the coordinates of the cross mark CM1. it can.
  • the line CT1 of thickness W B along the dividing lines CL1 performs an alignment to fit into all the corresponding Chigumizo G1.
  • the present embodiment in which only a part of the line CT1 of the lines CT1 Thickness W B along the dividing lines CL1 repeats alignment to fit into the Chigumizo G1.
  • FIG. 21 is a plan view for explaining the dicing method according to the second embodiment of the present invention.
  • line CT1 of thickness W B along the dividing lines CL1 can not perform an alignment to fit into all the corresponding Chigumizo G1. Therefore, the work W is divided into a plurality of divided areas A1 to A4, and alignment and dicing are performed for each of the divided areas A1 to A4.
  • the scheduled division line CL1 included in the division area A1 is aligned with the jig groove G1 of the jig J1.
  • a portion of the line CT1 of thickness W B along the dividing lines CL1 is interfering with the jig J1.
  • dicing processing is performed on the scheduled division line CL1 included in the division area A1.
  • the chip included in the divided area A1 is separated from the work W.
  • the suction state of the work W is released, and the work W composed of the divided areas A2 to A4 is pulled up by the handler arm 54 to be sucked and held.
  • the dividing lines CL1 included in divided area A2 the alignment such as lines CT1 Thickness W B along the dividing lines CL1 falls in all jig groove of the corresponding tool group JG2 G1.
  • dicing processing is performed on the scheduled division line CL1 included in the division area A2.
  • the chip included in the divided area A2 is separated from the work W.
  • the division areas A3 and A4 are also sequentially aligned and diced. Accordingly, even when the line CT1 of thickness W B along the dividing lines CL1 can not perform an alignment to fit into all the corresponding Chigumizo G1, the blade 32 and the jig J1 Dicing can be performed while preventing interference.
  • Alignment of each divided area A1 to A4 with the jig groove G1 of the jig J1 can be performed by the following ⁇ A> to ⁇ C>.
  • ⁇ B> For each division area A1 to A4, two planned division lines CL X11 and CL X12 , CL X21 and CL X22 , CL X31 and CL X32 , and CL X41 and CL X42 , or CL X41 and CL X42 at both ends in the ⁇ B1> X direction.
  • ⁇ B2> 2 this dividing line CL in the Y direction across Y11 and CL Y12, CL Y21 and CL Y22, CL Y31 and CL Y32 and CL Y41 and the line CT1 of thickness W B along the CL Y42 all corresponding Align so that it fits in the jig groove G1.
  • the part of the planned division lines CL1 is, for example, in the ⁇ C1> division areas A1 to A4, each of the four planned division lines (CL X11 , CL X12 , CL Y11 and CL Y12 , CL) closest to the four sides.
  • the machining stage drive unit 22 may be able to release the suction state for each of the divided areas A1 to A4, for example.
  • the tip of the jig group JG1 corresponding to the divided area A1 is kept sucked and held.
  • the suction state is released, and the work W composed of the divided areas A2 to A4 is pulled up from the machining stage ST by the handler arm 54.
  • the remaining divided areas A2 to A4 may be diced in the same procedure, and the chips may be collected when all the divided areas A1 to A4 are diced.
  • the chip separated from the work W by the dicing process may be collected.
  • the number of divided areas is four, but the present invention is not limited to this.
  • the work W is divided along the X direction, it may be divided in the Y direction or both the X direction and the Y direction.
  • the work W may be divided in a direction in which the distortion is larger.
  • FIG. 22 is a flowchart showing a dicing method according to the second embodiment of the present invention.
  • FIG. 23 is a flowchart showing a dicing process for each divided area in FIG. 22.
  • control unit 100 takes an image of the work W using the microscope MS1 and performs pattern matching of the image of the work W to detect the pattern M1 of the work W. Then, the control unit 100 measures the shape of the work W based on the position (distribution) of the pattern M1 (step S20).
  • step S22 determines whether or not it is possible to align all the scheduled division lines CL1 of the work W with the jig groove G1 based on the measurement result of the shape of the work W (step S22).
  • step S22 it is determined whether it is possible to perform the alignment as lines CT1 Thickness W B along the dividing lines CL1 falls in all corresponding Chigumizo G1.
  • the control unit 100 connects the scheduled division line CL1 of the work W and the jig groove G1. Alignment (step S24) and dicing (step S26) are performed. Since steps S24 and S26 are the same as steps S12 and S14 in FIG. 13, the description thereof will be omitted.
  • step S28 if it is determined in step S22 that it is impossible to align all the scheduled division lines CL1 of the work W with the jig groove G1, dicing is performed for each division area (step S28).
  • step S22 it was determined whether or not the alignment of (A) in step S12 of FIG. 13 was possible, but it may be determined whether or not the alignment of (B) or (C) is possible.
  • control unit 100 When dicing is performed for each division area, the control unit 100 first divides the work W into a plurality of (N) division areas A1, ..., AN based on the shape measurement result in step S20 (step S280). ).
  • the blade 32 and the jig J1 interfere with each other by repeatedly performing the alignment and the dicing process for each of the plurality of divided areas. Dicing can be performed while preventing the above.
  • the dicing device 1 includes a pre-alignment unit 10 for measuring the shape of the work W, but the present invention is not limited to this, and the pre-alignment unit 10 is different from the dicing device 1. It may be an external device.
  • FIG. 24 is a plan view showing the dicing device according to the third embodiment of the present invention
  • FIG. 25 is a block diagram showing a control system of the dicing device according to the third embodiment of the present invention.
  • the same reference numerals will be given to the same configurations as those in the above embodiment, and the description thereof will be omitted.
  • the dicing device 1-2 has a configuration in which the prealignment unit 10 is removed from the dicing device 1 according to the above embodiment. Then, in the present embodiment, the shape of the work W is measured by using the external device 70 for prealignment.
  • the external device 70 includes a pre-alignment stage ST3, a microscope MS3, a pre-alignment stage drive unit 72, an MS drive unit 74, and a control device 76.
  • the control device 76 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a storage device (for example, a hard disk, etc.), and an input / output device (for example, an operation unit and a display unit for receiving operation input). Etc.) etc. are included.
  • CPU Central Processing Unit
  • ROM Read Only Memory
  • RAM Random Access Memory
  • storage device for example, a hard disk, etc.
  • an input / output device for example, an operation unit and a display unit for receiving operation input.
  • Etc. etc.
  • the work W is carried into the external device 70 and placed on the prealignment stage ST3.
  • a jig J1 (see FIGS. 7 to 11) for sucking and holding the work W is provided on the surface of the prealignment stage ST3, and the work W is sucked and held on the prealignment stage ST3 by the jig J1. Will be done.
  • the prealignment stage drive unit 72 includes a motor that rotates the prealignment stage ST0 in the ⁇ 0 direction, and a vacuum source (vacuum generator, for example, an ejector, a pump) for sucking air and attracting the work W to the prealignment stage ST3. Etc.) and is included.
  • a vacuum source vacuum generator, for example, an ejector, a pump
  • the MS drive unit 74 includes a power source (for example, a motor) for moving the microscope MS3 along the X0 axis and the MS1 axis.
  • a power source for example, a motor
  • a mechanism for moving the microscope MS3 for example, a mechanism capable of reciprocating linear motion such as a ball screw or a rack and pinion mechanism can be used.
  • the microscope MS3 captures an image of the surface of the work W adsorbed and held by the prealignment stage ST3.
  • the surface image of the work W taken by the microscope MS3 is transmitted to the control device 76.
  • the microscope MS3 is moved along the X0 axis and the MS3 axis, but the prealignment stage ST3 may be moved, or both the microscope MS3 and the prealignment stage ST3 are moved. You may let it.
  • the line scan camera may capture an image of the entire area of the work W to measure the shape of the work.
  • the control device 76 performs image processing on the surface image of the work W received from the microscope MS3, and measures the position of the scheduled division line of the work W. For example, the control device 76 performs pattern matching on the surface image of the work W received from the microscope MS3. Then, the control device 76 detects the repeating pattern or alignment mark (hereinafter referred to as pattern M1) of the semiconductor device or electronic component formed on the surface of the work W, thereby detecting the position of the scheduled division line of the work W (hereinafter referred to as pattern M1). For example, the coordinates of the intersection and the end point) are measured. As a result, the shape of the work W is measured. The control device 76 stores the data of the measurement result of the shape of the work W in association with the identification information of the work W (for example, ID (Identification), serial number, etc.).
  • ID Identity
  • serial number serial number
  • the control device 76 can communicate with the control unit 100 of the dicing device 1-2 via a network (for example, LAN (Local Area Network)).
  • the control device 76 transmits the data of the measurement result of the shape of the work W to the control unit 100.
  • the control device 76 attaches the identification information of the work W and transmits the data.
  • the control unit 100 acquires the measurement result of the shape of the work W from the control device 76 of the external device 70 via the network.
  • the control unit 100 controls the handler arm 54 at the time of dicing, and loads the work W to be processed into the processing stage ST of the processing unit 20.
  • the dicing device 1-2 includes a work collating unit 60.
  • the work collating unit 60 reads the identification information attached to the work W loaded on the machining stage ST.
  • the means for reading the identification information attached to the work W is not particularly limited.
  • a means for reading the identification information attached to the work W for example, a two-dimensional code (for example, a QR code (registered trademark)) including the identification information is attached to the work W, and the two-dimensional code is read.
  • a code reader may be used.
  • an IC (Integrated Circuit) tag in which identification information is recorded may be attached to the work W so that the IC tag can be read.
  • the identification information (number or the like) attached to the work W may be read by OCR (Optical Character Reader).
  • the control unit 100 reads out the data of the measurement result of the shape of the work W to be machined from the measurement result of the shape of the work W acquired from the external device 70 based on the identification information of the work W. Then, the control unit 100 aligns the work W with the jig groove G1 of the jig J1 by using the measurement result data as in the first and second embodiments, and the machining stage drive unit 22 To attract and hold the work W on the machining stage ST.
  • the time difference between the dicing process and the prealignment process (the time during which the processing unit 20 or the external device 70 is idle) is taken into consideration. It can be processed without any problem, and CoO (Cost of Ownership) can be maximized.
  • control unit 100 of the dicing device 1-2 and the control device 76 of the external device 70 can communicate with each other via a network, but the present invention is not limited to this.
  • the control unit 100 of the dicing device 1-2 and the control device 76 of the external device 70 may be directly connected by, for example, a cable (for example, USB (Universal Serial Bus) or the like), or cloud storage or removable media.
  • the data of the measurement result may be exchanged via.
  • the detection result of detecting at least two patterns P1 for each scheduled division line CL1 in the external device 70 is obtained. It may be transmitted to the control unit 100 of the dicing device 1-2, and the control unit 100 may perform the calculation shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Automatic Control Of Machine Tools (AREA)
PCT/JP2020/033741 2019-09-27 2020-09-07 ダイシング装置及び方法 WO2021059937A1 (ja)

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KR101607226B1 (ko) * 2014-04-14 2016-03-29 주식회사 레이저앱스 레이저 절단 및 가공장치와 그 방법
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JP2006253466A (ja) * 2005-03-11 2006-09-21 Disco Abrasive Syst Ltd アライメント方法
JP2009170501A (ja) * 2008-01-11 2009-07-30 Disco Abrasive Syst Ltd 切削装置
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