WO2021051647A1 - 一种pcb背钻无损检测方法 - Google Patents

一种pcb背钻无损检测方法 Download PDF

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WO2021051647A1
WO2021051647A1 PCT/CN2019/120767 CN2019120767W WO2021051647A1 WO 2021051647 A1 WO2021051647 A1 WO 2021051647A1 CN 2019120767 W CN2019120767 W CN 2019120767W WO 2021051647 A1 WO2021051647 A1 WO 2021051647A1
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layer
drilling
detection
drill
hole
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PCT/CN2019/120767
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English (en)
French (fr)
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肖永龙
韩启龙
张军杰
夏国伟
胡新星
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胜宏科技（惠州）股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/26—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring depth

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  • the invention relates to the technical field of PCB back drilling detection, in particular to a PCB back drilling non-destructive detection method.
  • the back-drilling technology is a PCB drilling technology proposed to solve the EMI problems caused by the excess copper plating in the PTH hole and ensure the integrity of the signal.
  • Jingwang Electronic Technology (Longchuan) Co., Ltd. proposed a PCB backing on 2015.01.14.
  • the back-drilling depth detection method of the drill plate, and the back-drilling detection method published on 2015.04.29, is based on the PCB process side, according to the number of PCB back-drilling layers, set up several test strips, each test strip is set up 3 Detection hole, 1 common connecting hole and 1 back drilling.
  • the detection strip is set on each layer to detect the back drilling condition of each layer to determine the depth of the back drilling. It can only detect the depth of the back drilling, and the detection is complicated.
  • the present invention provides a PCB back-drilling non-destructive testing method, which detects the back-drilling depth, penetration level and back-drilling accuracy of the back-drilled PCB before shipment without affecting the customer's product design, and the detection can be monitored
  • the back drill quality of each delivered board effectively prevents defective products from flowing into the client, and at the same time avoids PCB scrapping caused by slicing.
  • a PCB back-drilling nondestructive testing method by designing a back-drilling detection module next to a PCB production unit, the back-drilling detection module includes a first detection hole to a fourth detection hole, a back drilling, and a top-down Top layer, precision detection layer, drill-through layer, non-drillable layer and Bottom layer, back-drilled through the first inspection hole to the fourth inspection hole, back-drilled respectively in the precision inspection layer, drill-through layer and non-drillable layer
  • the first detection hole and the second detection hole are used for back-drilling precision detection of the precision detection layer
  • the third detection hole is used for the drill-through detection of the drill-through layer
  • the fourth detection hole is used for the non-drillable Non-drill-through detection of through-layers.
  • the PCB back-drilling non-destructive testing method of the present invention designs a back-drilling detection module next to the PCB production unit, that is, in the attachment of the delivery unit, which can not only non-destructively monitor the back-drilling depth of the PCB, but also can non-destructively monitor the back-drilling accuracy and drilling accuracy of the PCB. Wear levels to ensure the quality of PCB back-drills, realize non-destructive monitoring of the back-drill quality of each delivered board, and prevent defective products from flowing into the client; at the same time, it also avoids the problem of PCB scrap caused by traditional slicing destructive testing.
  • the detection of the accuracy detection layer use a multimeter to measure the first detection point of the first detection hole in the accuracy detection layer, the first back drilling detection point of the back drilling in the accuracy detection layer, and the second detection hole in the accuracy detection
  • the detection result is NG
  • the detection result is OK.
  • PCB back-drilling boards with NG test results are recycled, and PCB back-drilling boards with OK test results are transferred to the customer to ensure that the accuracy of the PCB back-drilling board that flows into the customer meets the requirements.
  • the accuracy detection layer is designed to be within the same level as the minimum distance level of the BD2M in the board, BD2M is the distance from the back drilling to the conductor, and the accuracy detection layer is designed to be the same as the minimum distance from the back drilling to the conductor in the board.
  • the accuracy detection layer adopts the design of the analog product board to ensure that the design of the accuracy detection layer is consistent with the product board, so that the back drill detection module can more truly feedback the actual state of the product board.
  • circuit design of the accuracy detection layer is formed by connecting the loop circuit at the first detection point, the second detection point, and the loop line at the first back-drilling detection point.
  • the width of the loop line is 2mil to 3mil, and the specific size of the loop line width is determined according to the actual copper thickness, the production capacity of the factory and the size of the BD2M. According to the actual situation, the loop line width can be designed to be 2mil, It can also be designed as 3mil and so on.
  • the distance between the hole wall of the back-drilled hole at the accuracy detection layer and the outermost side of the loop line is the maximum value of BD2M. That is, the maximum allowable offset value of the back drill.
  • the detection line of the accuracy detection layer is an open circuit, and the detection result is NG.
  • the detection circuit of the accuracy detection layer is short-circuited, and the detection result is OK.
  • the detection of the drill-through layer use a multimeter to measure the open circuit or short circuit between the third inspection point of the third inspection hole in the drill-through layer and the back-drilled hole at the second back-drill inspection point of the drill-through layer,
  • an open circuit it means that the back drill has penetrated the drill-through layer and the test result is OK.
  • a short circuit is displayed, it indicates that the drill-through layer has not been drilled and the test result is NG.
  • the drill-through layer is designed to be in the drill-through layer in the board, and the third inspection hole and the second back-drilled inspection hole are provided with a single-sided 4mil pad on the drill-through layer, and the pass line width is The 4mil line is connected.
  • the detection of the non-drillable layer use a multimeter to measure the open circuit between the fourth detection point of the fourth detection hole in the non-drillable layer and the third back-drilled detection point of the back-drilled layer in the non-drillable layer.
  • a short circuit when an open circuit is displayed, it means that the back drill has penetrated the non-drillable layer, and the test result is NG; when a short circuit is displayed, it indicates that the non-drillable layer has not been drilled and the test result is OK.
  • the non-drillable layer is designed in the non-drillable layer in the board, and the fourth inspection hole and the third back-drilled inspection hole are provided with a single-sided 4mil pad on the non-drillable layer, and pass Lines with a line width of 4mil are connected.
  • the PCB back-drilling nondestructive testing method of the present invention has the following beneficial effects:
  • the back-drilling inspection module next to the PCB production unit, and designing the accuracy inspection layer, the drill-through layer and the non-drillable layer in the back-drilling inspection module, the accuracy inspection is passed.
  • Design lines for layers, drill-through layers and non-drill-through layers use a multimeter to detect the open/short-circuit conditions of the precision detection layers, drill-through layers and non-drill-through layers, and achieve correctness without affecting the customer’s product design. Monitor the accuracy, depth and penetration level of PCB back drilling to realize non-destructive monitoring of PCB back drilling quality;
  • the monitoring of each back-drilled PCB board to be shipped can be realized. Because the detection method of the present invention realizes the non-destructive monitoring of the quality of the PCB back-drilling, it effectively solves the problem that the traditional back-drilling detection adopts the destructive detection of slices. The shortcomings of all boards are tested, and the back-drilling quality inspection of each back-drilled PCB board to be shipped can be realized to ensure that the boards that flow into the customer are the good boards that have passed the monitoring, which effectively solves the problem of influx of bad boards into the customer in the prior art End, huge economic and time loss to customers;
  • the back drill can detect the accuracy of the back drill, set the accuracy detection layer, simulate the design of the product board, and pass the first detection point, the second detection point and the first back drilling detection point on the accuracy detection layer and the line design of the accuracy detection layer , Use a multimeter to detect the open/short condition of the first detection point, the first back-drilling detection point and the second detection point. If the line is open, the back-drilling accuracy exceeds the accuracy range, and the test result is NG. If the line is short-circuited, then The back drilling accuracy is within the accuracy range, the test result is OK, and the test module can more truly feedback the actual status of the product board.
  • Figure 1 is a schematic diagram of the overall structure layout of the PCB back-drilling non-destructive testing method of the present invention
  • Figure 2 is a schematic diagram of the test circuit of the precision detection layer in the PCB back-drilling non-destructive testing method of the present invention
  • Fig. 3 is a schematic diagram of the test circuit of the drill-through layer in the PCB back-drilling non-destructive testing method of the present invention
  • Fig. 4 is a schematic diagram of the test circuit of the non-drillable layer in the PCB back-drilling non-destructive testing method of the present invention.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • “plurality” means two or more than two, unless specifically defined otherwise.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense.
  • it can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
  • installed can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
  • a PCB back-drilling non-destructive testing method is designed by designing a back-drilling inspection module beside the PCB manufacturing unit.
  • the back-drilling inspection module includes a first inspection hole 1, a second inspection hole 2, and a third inspection hole. 3.
  • the back drilling 5 is performed on the accuracy inspection layer 20, the drill-through layer 30 and the non-drillable layer 40 respectively for back-drilling inspection.
  • the first inspection hole 1 and the second inspection hole 2 are used for accuracy inspection
  • the back-drilling accuracy of the layer 20 is detected
  • the third detection hole 3 is used for the drill-through detection of the drill-through layer 30
  • the fourth detection hole 4 is used for the non-drill-through detection of the non-drillable layer 40.
  • the PCB back-drilling non-destructive testing method of the present invention designs a back-drilling detection module next to the PCB production unit, that is, in the attachment of the delivery unit.
  • the detection of the accuracy detection layer 20 use a multimeter to measure the first detection point 21 of the first detection hole 1 in the accuracy detection layer 20, and the first back drill 5 of the back drill 5 in the accuracy detection layer 20
  • the detection point 23 and the second detection hole 2 are open circuit or short circuit between the second detection point 22 of the accuracy detection layer 20.
  • the back drilling accuracy of the meter exceeds the control standard, and the detection result is NG; when a short circuit is displayed Indicates that the back drilling accuracy is within the control range, and the test result is OK.
  • PCB back-drilling boards with NG test results are recycled, and PCB back-drilling boards with OK test results are transferred to the customer to ensure that the accuracy of the PCB back-drilling board that flows into the customer meets the requirements.
  • the accuracy detection layer 20 is designed to be within the same level as the minimum distance level of the BD2M in the board.
  • BD2M is the distance from the back hole to the conductor.
  • the accuracy detection layer is designed to be drilled to the conductor in the back of the board.
  • the minimum distance level is within the same level, that is, the accuracy detection layer adopts the analog product board design to ensure that the design of the accuracy detection layer is consistent with the product board, so that the back drill detection module can more truly feedback the actual state of the product board.
  • the circuit design of the accuracy detection layer 20 is formed by connecting the loop line at the first detection point 21, the second detection point 22 and the loop line at the first back drill detection point 23.
  • the width of the loop line is 2mil ⁇ 3mil, and the specific size of the loop line width is determined according to the actual copper thickness, the production capacity of the factory and the size of BD2M. According to the actual situation, the width of the loop line can be designed to be 2mil, or it can be designed For 3mil and so on.
  • the distance between the hole wall of the back bore 5 at the accuracy detection layer 20 and the outermost side of the loop line is the maximum value of BD2M. That is, the maximum allowable offset value of the back drilling.
  • the detection line of the accuracy detection layer 20 is an open circuit, and the detection result is NG.
  • the detection circuit of the accuracy detection layer 20 is short-circuited, and the detection result is OK.
  • the drill-through layer 30 is designed in the drill-through layer 30 in the board, and the third inspection hole 3 and the second back-drilled inspection point 32 are provided with a single side 4mil on the drill-through layer 30.
  • the pads are connected by a line with a line width of 4mil.
  • Detection of the drill-through layer 30 use a multimeter to measure the open circuit of the third inspection hole 3 between the third inspection point 31 of the drill-through layer 30 and the back drill 5 at the second back drill inspection point 32 of the drill-through layer 30 Or a short circuit. When an open circuit is displayed, it means that the back drill has penetrated the drill-through layer 30 and the test result is OK. When a short circuit is displayed, it indicates that the drill-through layer 30 has not been drilled and the test result is NG.
  • the non-drillable layer 40 is designed in the non-drillable layer 40 in the board, and the fourth inspection hole 4 and the third back-drilled inspection hole are provided with a single unit on the non-drillable layer 40.
  • the pads on the sides are 4 mils, and are connected by lines with a line width of 4 mils.
  • the detection of the non-drillable layer 40 Use a multimeter to measure the fourth detection hole 4 at the fourth detection point 41 of the non-drillable layer 40 and the back drill 5 at the third back drilled detection point 42 of the non-drillable layer 40
  • the test result is NG
  • a short circuit is displayed, it indicates that the non-drillable layer 40 has not been drilled, and the test result is OK.
  • the PCB back-drilling non-destructive testing method of the present invention designs a back-drilling detection module next to the PCB production unit, that is, in the attachment of the delivery unit, which can not only non-destructively monitor the back-drilling depth of the PCB, but also can non-destructively monitor the back-drilling accuracy and drilling accuracy of the PCB. Wear levels to ensure the quality of PCB back-drills, realize non-destructive monitoring of the back-drill quality of each delivered board, and prevent defective products from flowing into the client; at the same time, it also avoids the problem of PCB scrap caused by traditional slicing destructive testing.

Abstract

一种PCB背钻无损检测方法，通过在PCB制作单元旁设计背钻检测模块，背钻检测模块包括第一检测孔（1）至第四检测孔（4）、背钻孔（5），以及自上而下依次设置的Top层（10）、精度检测层（20）、钻穿层（30）、不可钻穿层（40）和Bottom层，通过第一检测孔（1）至第四检测孔（4）对背钻孔（5）在精度检测层（20）、钻穿层（30）和不可钻穿层（40）分别进行背钻检测，第一检测孔（1）和第二检测孔（2）用于精度检测层（20）的背钻精度检测，第三检测孔（3）用于钻穿层（30）的钻穿检测，第四检测孔（4）用于不可钻穿层（40）的不钻穿检测。PCB背钻无损检测方法适用所有背钻类PCB检测，在不影响客户的产品设计的情况下对背钻类PCB进行出货前背钻深度、钻穿层次和背钻精度进行检测，其检测可监控每块交货板的背钻品质，有效避免不良品流入客户端，同时避免切片导致的PCB报废。

Description

一种PCB背钻无损检测方法 技术领域
本发明涉及PCB背钻检测技术领域，具体为一种PCB背钻无损检测方法。
背景技术
随着数字信号传输的速度越来越快，频率越来越高，信号的完整性传输研究成为PCB越来越关键的重要核心技术。其中，背钻技术是为了解决PTH孔内多余镀铜产生的EMI类问题，保证信号完整性而提出的PCB钻孔技术。
目前，检测背钻深度、钻孔层次、Stub值以及背钻精度等均需要进行破坏性检测，故无法对每一块PCB进行检测。常规条件下，背钻类PCB板在出货前只会取1～3pcs进行破坏性质的切片测试其背钻深度、钻穿层次、Stub值以及背钻精度数据。由于少量的切片测试无法代表所有的出货产品，往往存在背钻不良问题漏波到客户端。由于此类PCB封装后产品的价值极高，每当有背钻不良的PCB流转到客户端后，会对客户带来巨大的经济与时间损失，同时PCB生产厂商将面临的巨额赔款。因此，背钻类PCB如何进行无损检测成为其重要的技术指标之一。
为了解决传统背钻检测采用破坏性检测带来的检测繁琐、难度大，难于做到每PCS板的检测问题，景旺电子科技(龙川)有限公司于2015.01.14日提出了一种PCB背钻板背钻深度检测方法，并于2015.04.29日公开的背钻检测方法，其通过在PCB工艺边，根据PCB背钻层的数量，设置若干个检测条，每个检测条均设置3个检测孔，1个共用连通孔和1个背钻孔。其在每层均设置检测条的方式对每层的背钻情况进行检测确定背钻的深度，其只能检测背钻孔的深度，而且检测繁杂。
发明内容
本发明提供一种PCB背钻无损检测方法，其在不影响客户的产品设计的情况下对背钻类PCB进行出货前背钻深度、钻穿层次和背钻精度进行检测，其检测可监控每块交货板的背钻品质，有效避免不良品流入客户端，同时避免切片导致的PCB报废。
为了实现上述目的，通过以下技术方案实现。
一种PCB背钻无损检测方法，通过在PCB制作单元旁设计背钻检测模块，所述背钻检测模块包括第一检测孔至第四检测孔、背钻孔，以及自上而下依次设置的Top层、精度检测层、钻穿层、不可钻穿层和Bottom层，通过第一检测孔至第四检测孔对背钻孔在精度检测层、钻穿层和不可钻穿层分别进行背钻检测，所述第一检测孔和第二检测孔用于精度检测层的背钻精度检测，所述第三检测孔用于钻穿层的钻穿检测，所述第四检测孔用于不可钻穿层的不钻 穿检测。本发明PCB背钻无损检测方法通过在PCB制作单元旁，即在交货单元附件中设计背钻检测模块，其不仅可以无损监测PCB的背钻深度，而且可以无损监测PCB的背钻精度和钻穿层次，确保PCB的背钻品质，实现无损监测每块交货板的背钻品质，避免不良品流入客户端；同时也避免了传统切片破坏性检测导致的PCB报废问题。
进一步地，所述精度检测层的检测：使用万用表测量第一检测孔在精度检测层的第一检测点、背钻孔在精度检测层的第一背钻检测点和第二检测孔在精度检测层的第二检测点之间的开路或短路情况，当显示开路时，表时背钻精度超出控制标准，检测结果NG；当显示短路时表示背钻精度在控制范围以内，检测结果OK。检测结果NG的PCB背钻板进行回收处理，而检测结果OK的PCB背钻板流转至客户，确保流入至客户的PCB背钻板的精度符合要求。
进一步地，所述精度检测层设计在与板内BD2M最小距离层次一致的层次以内，BD2M为背钻孔到导体距离，所述精度检测层设计在板内背钻孔到导体的最小距离层次一致的层次以内，即所述精度检测层采用模拟产品板设计，保证精度检测层的设计与产品板一致，使背钻检测模块能更加真实的反馈产品板的实际状态。
进一步地，所述精度检测层的线路设计由第一检测点、第二检测点处的环形线路与第一背钻检测点处的环形线路连接构成。
进一步地，所述环形线路的宽度为2mil～3mil，所述环形线宽的具体尺寸大小根据实际铜厚度、工厂的生产能力以及BD2M的大小确定，根据实际情况，环形线路宽度可以设计为2mil，也可以设计为3mil等。
进一步地，所述背钻孔在精度检测层处的孔壁距离环形线路最外侧距离为BD2M的最大值。即为背钻最大允许偏移值，当背钻孔的偏移量大于背钻最大允许偏移值时，所述精度检测层的检测线路为开路，检测结果为NG。当背钻孔的偏移量在背钻最大允许偏移值以内，则精度检测层的检测线路为短路，检测结果为OK。
进一步地，所述钻穿层的检测：使用万用表测量第三检测孔在钻穿层的第三检测点与背钻孔在钻穿层的第二背钻检测点之间的开路或短路情况，当显示开路时，表示背钻已钻穿钻穿层，检测结果OK，当显示短路时，表示未钻穿钻穿层，检测结果NG。
进一步地，所述钻穿层设计在板内钻穿层内，所述第三检测孔和第二背钻检测孔在钻穿层上均设有单边4mil的焊盘，并通过线宽为4mil的线路相连。
进一步地，所述不可钻穿层的检测：使用万用表测量第四检测孔在不可钻穿层的第四检测点与背钻孔在不可钻穿层的第三背钻检测点之间的开路或短路情况，当显示开路时表示背钻已钻穿不可钻穿层，检测结果NG；当显示短路时表示未钻到不可钻穿层，检测结果OK。
进一步地，所述不可钻穿层设计在板内不可钻穿层内，所述第四检测孔和第三背钻检测 孔在不可钻穿层上均设有单边4mil的焊盘，并通过线宽为4mil的线路相连。
本发明PCB背钻无损检测方法与现有技术相比，具有如下有益效果：
第一、可实现无损监测PCB的背钻品质，通过在PCB制作单元旁设计背钻检测模块，并在背钻检测模块中设计精度检测层、钻穿层和不可钻穿层，通过对精度检测层、钻穿层和不可钻穿层设计线路，使用万用表对精度检测层、钻穿层和不可钻穿层的线路的开/短路情况进行检测，在不影响客户的产品设计情况下，实现对PCB背钻精度、深度及钻穿层次的监测，进而实现对PCB背钻品质的无损监测；
第二、可实现对每块待出货背钻PCB板的监测，由于采用本发明检测方法实现了对PCB背钻品质的无损监测，有效解决了传统背钻检测采用切片破坏性检测而无法对所有板进行检测的弊端，可实现对每块待出货背钻PCB板进行背钻品质检测，确保流入客户的板均为监测合格的良板，有效解决了现有技术中因不良板流入客户端，对客户带来的巨大经济与时间损失；
第三、可对背钻精度进行检测，精度检测层的设置，模拟产品板设计，通过精度检测层上第一检测点、第二检测点和第一背钻检测点以及精度检测层的线路设计，使用万用表检测第一检测点、第一背钻检测点和第二检测点的线路开/短情况，如线路为开路，则背钻精度超出精度范围，检测结果NG，如线路为短路，则背钻精度在精度范围内，检测结果OK，检测模块能更加真实的反馈产品板的实际状态。
附图说明
附图1为本发明PCB背钻无损检测方法的整体结构布局示意图；
附图2为本发明PCB背钻无损检测方法中精度检测层的测试线路示意图；
附图3为本发明PCB背钻无损检测方法中钻穿层的测试线路示意图；
附图4为本发明PCB背钻无损检测方法中不可钻穿层的测试线路示意图。
具体实施方式
在本发明的描述中，需要理解的是，术语诸如“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个 以上，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
下面将结合具体实施例及附图对本发明PCB背钻无损检测方法作进一步详细描述。
如图1所示，一种PCB背钻无损检测方法，通过在PCB制作单元旁设计背钻检测模块，所述背钻检测模块包括第一检测孔1、第二检测孔2、第三检测孔3、第四检测孔4、背钻孔5，以及自上而下依次设置的Top层10、精度检测层20、钻穿层30、不可钻穿层40和Bottom层，通过第一检测孔1至第四检测孔4对背钻孔5在精度检测层20、钻穿层30和不可钻穿层40分别进行背钻检测，所述第一检测孔1和第二检测孔2用于精度检测层20的背钻精度检测，所述第三检测孔3用于钻穿层30的钻穿检测，所述第四检测孔4用于不可钻穿层40的不钻穿检测。本发明PCB背钻无损检测方法通过在PCB制作单元旁，即在交货单元附件中设计背钻检测模块，其不仅可以无损监测PCB的背钻深度，而且可以无损监测PCB的背钻精度和钻穿层次，确保PCB的背钻品质，实现无损监测每块交货板的背钻品质，避免不良品流入客户端；同时也避免了传统切片破坏性检测导致的PCB报废问题。
参照图1和图2，所述精度检测层20的检测：使用万用表测量第一检测孔1在精度检测层20的第一检测点21、背钻孔5在精度检测层20的第一背钻检测点23和第二检测孔2在精度检测层20的第二检测点22之间的开路或短路情况，当显示开路时，表时背钻精度超出控制标准，检测结果NG；当显示短路时表示背钻精度在控制范围以内，检测结果OK。检测结果NG的PCB背钻板进行回收处理，而检测结果OK的PCB背钻板流转至客户，确保流入至客户的PCB背钻板的精度符合要求。
参照图1和图2，所述精度检测层20设计在与板内BD2M最小距离层次一致的层次以内，BD2M为背钻孔到导体距离，所述精度检测层设计在板内背钻孔到导体的最小距离层次一致的层次以内，即所述精度检测层采用模拟产品板设计，保证精度检测层的设计与产品板一致，使背钻检测模块能更加真实的反馈产品板的实际状态。
参照图1和图2，所述精度检测层20的线路设计由第一检测点21、第二检测点22处的环形线路与第一背钻检测点23处的环形线路连接构成。所述环形线路的宽度为2mil～3mil，所述环形线宽的具体尺寸大小根据实际铜厚度、工厂的生产能力以及BD2M的大小确定，根据实际情况，环形线路宽度可以设计为2mil，也可以设计为3mil等。
参照图1和图2，所述背钻孔5在精度检测层20处的孔壁距离环形线路最外侧距离为BD2M的最大值。即为背钻最大允许偏移值，当背钻孔5的偏移量大于背钻最大允许偏移值时，所述精度检测层20的检测线路为开路，检测结果为NG。当背钻孔5的偏移量在背钻最大允许偏移值以内，则精度检测层20的检测线路为短路，检测结果为OK。
参照图1和图3，所述钻穿层30设计在板内钻穿层30内，所述第三检测孔3和第二背钻检测点32在钻穿层30上均设有单边4mil的焊盘，并通过线宽为4mil的线路相连。所述钻穿层30的检测：使用万用表测量第三检测孔3在钻穿层30的第三检测点31与背钻孔5在钻穿层30的第二背钻检测点32之间的开路或短路情况，当显示开路时，表示背钻已钻穿钻穿层30，检测结果OK，当显示短路时，表示未钻穿钻穿层30，检测结果NG。
参照图1和图4，所述不可钻穿层40设计在板内不可钻穿层40内，所述第四检测孔4和第三背钻检测孔在不可钻穿层40上均设有单边4mil的焊盘，并通过线宽为4mil的线路相连。所述不可钻穿层40的检测：使用万用表测量第四检测孔4在不可钻穿层40的第四检测点41与背钻孔5在不可钻穿层40的第三背钻检测点42之间的开路或短路情况，当显示开路时表示背钻已钻穿不可钻穿层40，检测结果NG；当显示短路时表示未钻到不可钻穿层40，检测结果OK。
本发明PCB背钻无损检测方法通过在PCB制作单元旁，即在交货单元附件中设计背钻检测模块，其不仅可以无损监测PCB的背钻深度，而且可以无损监测PCB的背钻精度和钻穿层次，确保PCB的背钻品质，实现无损监测每块交货板的背钻品质，避免不良品流入客户端；同时也避免了传统切片破坏性检测导致的PCB报废问题。
上述实施例仅为本发明的具体实施例，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些显而易见的替换形式均属于本发明的保护范围。

Claims (10)

  1. 一种PCB背钻无损检测方法，其特征在于：通过在PCB制作单元旁设计背钻检测模块，所述背钻检测模块包括第一检测孔至第四检测孔、背钻孔，以及自上而下依次设置的Top层、精度检测层、钻穿层、不可钻穿层和Bottom层，通过第一检测孔至第四检测孔对背钻孔在精度检测层、钻穿层和不可钻穿层分别进行背钻检测，所述第一检测孔和第二检测孔用于精度检测层的背钻精度检测，所述第三检测孔用于钻穿层的钻穿检测，所述第四检测孔用于不可钻穿层的不钻穿检测。
  2. 根据权利要求1所述的PCB背钻无损检测方法，其特征在于，所述精度检测层的检测：使用万用表测量第一检测孔在精度检测层的第一检测点、背钻孔在精度检测层的第一背钻检测点和第二检测孔在精度检测层的第二检测点之间的开路或短路情况，当显示开路时，表时背钻精度超出控制标准，检测结果NG；当显示短路时表示背钻精度在控制范围以内，检测结果OK。
  3. 根据权利要求2所述的PCB背钻无损检测方法，其特征在于，所述精度检测层设计在与板内BD2M最小距离层次一致的层次以内。
  4. 根据权利要求3所述的PCB背钻无损检测方法，其特征在于，所述精度检测层的线路设计由第一检测点、第二检测点处的环形线路与第一背钻检测点处的环形线路连接构成。
  5. 根据权利要求4所述的PCB背钻无损检测方法，其特征在于，所述环形线路的宽度为2mil～3mil。
  6. 根据权利要求5所述的PCB背钻无损检测方法，其特征在于，所述背钻孔在精度检测层处的孔壁距离环形线路最外侧距离为BD2M的最大值。
  7. 根据权利要求1所述的PCB背钻无损检测方法，其特征在于，所述钻穿层的检测：使用万用表测量第三检测孔在钻穿层的第三检测点与背钻孔在钻穿层的第二背钻检测点之间的开路或短路情况，当显示开路时，表示背钻已钻穿钻穿层，检测结果OK，当显示短路时，表示未钻穿钻穿层，检测结果NG。
  8. 根据权利要求7所述的PCB背钻无损检测方法，其特征在于，所述钻穿层设计在板内钻穿层内，所述第三检测孔和第二背钻检测孔在钻穿层上均设有单边焊盘，并通过线路相连。
  9. 根据权利要求1所述的PCB背钻无损检测方法，其特征在于，所述不可钻穿层的检测：使用万用表测量第四检测孔在不可钻穿层的第四检测点与背钻孔在不可钻穿层的第三背钻检测点之间的开路或短路情况，当显示开路时表示背钻已钻穿不可钻穿层，检测结果NG；当显示短路时表示未钻到不可钻穿层，检测结果OK。
  10. 根据权利要求9所述的PCB背钻无损检测方法，其特征在于，所述不可钻穿层设计在板内不可钻穿层内，所述第四检测孔和第三背钻检测孔在不可钻穿层上均设有单边焊盘，并通 过线路相连。
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CN206531465U (zh) * 2017-03-11 2017-09-29 郑州云海信息技术有限公司 测试过孔背钻精度的测试板
CN109195313A (zh) * 2018-09-25 2019-01-11 深圳崇达多层线路板有限公司 一种新型背钻测试孔制作方法
CN110191569A (zh) * 2019-04-17 2019-08-30 奥士康科技股份有限公司 一种5g电路板的背钻对准度的测试结构和方法

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