WO2021044939A1 - Élément de protection - Google Patents

Élément de protection Download PDF

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Publication number
WO2021044939A1
WO2021044939A1 PCT/JP2020/032363 JP2020032363W WO2021044939A1 WO 2021044939 A1 WO2021044939 A1 WO 2021044939A1 JP 2020032363 W JP2020032363 W JP 2020032363W WO 2021044939 A1 WO2021044939 A1 WO 2021044939A1
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WO
WIPO (PCT)
Prior art keywords
electrode
heating element
surface electrode
insulating member
insulating substrate
Prior art date
Application number
PCT/JP2020/032363
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English (en)
Japanese (ja)
Inventor
幸市 向
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020227006525A priority Critical patent/KR20220035499A/ko
Priority to CN202080060906.6A priority patent/CN114303219B/zh
Publication of WO2021044939A1 publication Critical patent/WO2021044939A1/fr

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046Fuses formed as printed circuits

Definitions

  • the present invention relates to a protective element.
  • the present application claims priority based on Japanese Patent Application No. 2019-161178 filed in Japan on September 4, 2019, the contents of which are incorporated herein by reference.
  • the circuit board is generally equipped with a protective element.
  • the protective element cuts off the current path in the event of an abnormality such as when an overcurrent exceeding the rating occurs in the current path.
  • the protective element include an insulating substrate, a first electrode and a second electrode provided on one surface of the insulating substrate so as to face each other, and a heating element provided on one surface of the insulating substrate.
  • the third electrode connected to one end of the heating element and the heating element extraction electrode connected to the end opposite to the end connected to the third electrode of the heating element, while facing each other.
  • the protective element having this configuration, there is a space between the first electrode and the heating element extraction electrode and between the second electrode and the heating element extraction electrode. Therefore, by melting the fuse element by heat, the fuse element is blown on the space between the first electrode and the heating element extraction electrode or on the space between the second electrode and the heating element extraction electrode.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a protective element having a structure that can be easily reduced in resistance and miniaturization and that is less likely to cause an internal short circuit.
  • the present invention provides the following means for solving the above problems.
  • the protective element includes an insulating substrate, a first electrode and a second electrode provided on one surface of the insulating substrate so as to face each other, and one of the insulating substrates.
  • a heating element provided on the surface of the heating element, a third electrode connected to one end of the heating element, and a heating element extraction electrode connected to an end of the heating element opposite to the one end. And one end facing each other is connected to the first electrode, the other end is connected to the second electrode, and the central portion between the one end and the other end is said.
  • a fuse element in contact with a heating element extraction electrode is provided, and the first electrode is provided with a side surface facing the second electrode and at least a part of an upper surface connected to the side surface covered with a first insulating member.
  • the two electrodes have a side surface facing the first electrode and at least a part of an upper surface connected to the side surface covered with a second insulating member.
  • the heating element extraction electrode may be extended to the upper surfaces of the first insulating member and the second insulating member.
  • a protective element having a structure that can be easily reduced in resistance and miniaturization and that is less likely to cause an internal short circuit.
  • FIG. 1 is a cross-sectional view taken along the line III-III'of FIG.
  • FIG. 1 is a vertical cross-sectional view taken along the line IV-IV'of FIG.
  • FIG. 1 is a cross-sectional view which shows the state which the protection element of 1st Embodiment operates and the fuse element is melted.
  • It is sectional drawing of the protection element which concerns on 2nd Embodiment of this invention. It is a vertical sectional view of the protection element which concerns on 2nd Embodiment of this invention.
  • FIG. 9 is a cross-sectional view taken along the line XX'of FIG. 9 is a vertical cross-sectional view taken along the line XI-XI'in FIG. It is a cross-sectional view of the protection element produced in Comparative Example 1.
  • FIG. 1 is a top view (plan view) of the protective element.
  • FIG. 2 is a bottom view (bottom view) of the protective element.
  • FIG. 3 is a cross-sectional view taken along the line III-III'of FIG.
  • FIG. 4 is a vertical cross-sectional view taken along the line IV-IV'of FIG.
  • the protective element 1 includes an insulating substrate 10, a first electrode 11 (first upper surface electrode 11a) and a second electrode 12 provided on the upper surface 10a of the insulating substrate 10 so as to face each other. (Second upper surface electrode 12a), a heating element 20 provided on the lower surface 10b of the insulating substrate 10, a third electrode 13 connected to one end of the heating element 20, and one end of the heating element 20.
  • a heating element extraction electrode 14 connected to an end portion on the opposite side to the portion, and a fuse element 30 connected to the first electrode 11, the second electrode 12, and the heating element extraction electrode 14 are provided.
  • a first electrode 11 is connected to one end 30a of the fuse element 30 facing each other via a first terminal 18a.
  • a second electrode 12 is connected to the other end portion 30b via a second terminal 18b.
  • a heating element extraction electrode 14 is connected to the central portion 30c between the end portions 30a and the end portion 30b of the fuse element 30 via a conductive member 15.
  • the first terminal 18a and the fuse element 30, the second terminal 18b and the fuse element 30, and the conductive member 15 and the fuse element 30 are adhered to each other by the solder paste 32.
  • the insulating substrate 10 is not particularly limited as long as it is made of a material having insulating properties.
  • a substrate used for a printed wiring board such as a ceramics substrate or a glass epoxy substrate, a glass substrate, a resin substrate, and an insulating treatment.
  • a metal substrate or the like can be used.
  • a ceramic substrate which is an insulating substrate having excellent heat resistance and thermal conductivity, is preferable.
  • the first electrode 11 includes a first upper surface electrode 11a, a first lower surface electrode 11b, and a first conductive portion 11c.
  • the first upper surface electrode 11a is formed on the upper surface 10a of the insulating substrate 10.
  • the first upper surface electrode 11a has a side surface facing the second upper surface electrode 12a and at least a part of the upper surface connected to the side surface is covered with the first insulating member 17a.
  • the portion of the first upper surface electrode 11a that is not covered with the first insulating member 17a is covered with the first terminal 18a.
  • the first lower surface electrode 11b is formed on the lower surface 10b of the insulating substrate 10.
  • the first lower surface electrode 11b is connected to the wiring of the circuit board.
  • the first conductive portion 11c penetrates the insulating substrate 10 and electrically connects the first upper surface electrode 11a and the first lower surface electrode 11b.
  • the second electrode 12 includes a second upper surface electrode 12a, a second lower surface electrode 12b, and a second conductive portion 12c.
  • the second upper surface electrode 12a is formed on the upper surface 10a of the insulating substrate 10.
  • the side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and at least a part of the upper surface connected to the side surface are covered with the second insulating member 17b.
  • the portion of the second upper surface electrode 12a that is not covered with the second insulating member 17b is covered with the second terminal 18b.
  • the second lower surface electrode 12b is formed on the lower surface 10b of the insulating substrate 10.
  • the second bottom electrode 12b is connected to the wiring of the circuit board.
  • the second conductive portion 12c penetrates the insulating substrate 10 and electrically connects the second upper surface electrode 12a and the second lower surface electrode 12b.
  • the third electrode 13 is connected to one end of the heating element 20.
  • the third electrode 13 is partially covered with a heat insulating member 21.
  • the portion of the third electrode 13 that is not covered with the heat insulating member 21 is connected to the switching element of the circuit board.
  • the switching element operates when an abnormality other than an overcurrent occurs in the circuit board to supply a current to the third electrode 13.
  • first electrode 11, the second electrode 12, and the third electrode 13 metal materials such as Ag and Cu can be used.
  • the surfaces of the first electrode 11, the second electrode 12, and the third electrode 13 may be coated with a metal or alloy such as Ag, Ag-Pt, Ag-Pd, Au, or Ni-Au.
  • the heating element 20 has a relatively high resistance as compared with the third electrode 13.
  • the heating element 20 is formed of a high resistance conductive material that easily generates heat when energized.
  • ruthenium oxide or carbon black can be used as a material constituting the heating element 20.
  • the heating element 20 is covered with a heat insulating member 21.
  • a heat insulating member 21 As the material of the heat insulating member 21, for example, an insulating material such as ceramics or glass can be used.
  • the heating element extraction electrode 14 includes a heating element extraction upper surface electrode 14a, a heating element extraction lower surface electrode 14b, and a heating element extraction electrode conduction portion 14c.
  • the heating element extraction upper surface electrode 14a is formed on the upper surface 10a of the insulating substrate 10.
  • a conductive member 15 is laminated on the upper surface of the heating element extraction upper surface electrode 14a.
  • the heating element extraction lower surface electrode 14b is formed on the lower surface 10b of the insulating substrate 10 and is connected to the heating element 20.
  • the heating element extraction electrode conduction portion 14c penetrates the insulating substrate 10 and electrically connects the heating element extraction upper surface electrode 14a and the heating element extraction lower surface electrode 14b.
  • the heating element extraction electrode 14 and the conductive member 15 have high thermal conductivity and conductivity.
  • a metal material such as Ag or Cu can be used.
  • the surface of the heating element extraction electrode 14 and the conductive member 15 may be coated with a metal or alloy such as Ag, Ag-Pt, Ag-Pd, Au, or Ni-Au.
  • a space 19a is formed between the heating element drawer upper surface electrode 14a and the first terminal 18a. Further, a space 19b is formed between the heating element extraction upper surface electrode 14a and the second terminal 18b.
  • the first upper surface electrode 11a below the space 19a is covered with the first insulating member 17a.
  • the second upper surface electrode 12a below the space 19b is covered with a second insulating member 17b. Therefore, the heating element extraction upper surface electrode 14a is extended to the upper surface of the first insulating member 17a, particularly to a position where the heating element extraction upper surface electrode 14a and the first upper surface electrode 11a overlap with each other via the first insulating member 17a. However, internal short circuits are unlikely to occur.
  • the heating element extraction upper surface electrode 14a is extended to the upper surface of the second insulating member 17b, particularly to a position where the heating element extraction upper surface electrode 14a and the first upper surface electrode 11a overlap via the second insulating member 17b. Even if it is, internal short circuit is unlikely to occur. Therefore, the widths of the space 19a and the space 19b can be narrowed.
  • the width Wa of the space 19a and the width Wb of the space 19b are preferably in the range of 0.02 mm or more and 1.0 mm or less, respectively.
  • the fuse element 30 may be a single metal.
  • the fuse element 30 may be a laminated body having a high melting point metal layer having a relatively high melting point on the outside and a low melting point metal layer having a relatively low melting point on the inside.
  • the fuse element 30 is a simple substance of metal, an alloy containing In, Pb, Ag, Cu or any of these as a main component can be used as the material thereof.
  • the melting point of the low melting point metal layer may be in the range of 280 ° C. or lower at the heating temperature (usually about 220 ° C.) or more at the time of reflow performed when the protective element 1 is mounted. preferable.
  • the material of the low melting point metal layer is preferably tin or a tin alloy containing tin as a main component.
  • the tin content of the tin alloy is preferably 40% by mass or more, more preferably 60% by mass or more.
  • Examples of tin alloys include Sn—Bi alloys, In—Sn alloys, and Sn—Ag—Cu alloys.
  • the high melting point metal layer is a layer made of a metal material that is dissolved in a melt of the low melting point metal layer.
  • the material of the low melting point metal layer is tin or a tin alloy
  • the material of the high melting point metal layer is preferably silver or an alloy containing silver as a main component.
  • the silver content of the silver alloy is preferably 40% by mass or more, more preferably 60% by mass or more.
  • Examples of silver alloys include Ag—Pd alloys.
  • FIG. 5 is a cross-sectional view showing a state in which the protection element of the first embodiment is activated and the fuse element is melted.
  • the cross-sectional view of FIG. 5 is a cross-sectional view at the same position as the cross-sectional view of the line III-III'of FIG.
  • the heating element 20 when an abnormality other than an overcurrent occurs in the circuit board, the heating element 20 generates heat due to the current flowing through the third electrode 13. The heat is transferred to the fuse element 30 via the heating element extraction electrode 14, and the fuse element 30 melts and blows, thereby interrupting the current path of the circuit board. The fused solidified fuse element 31 after melting is held on the solder paste 32.
  • the protective element 1 can be manufactured, for example, as follows.
  • the insulating substrate 10 is prepared.
  • the first conductive portion 11c of the first electrode 11, the second conductive portion 12c of the second electrode 12, and the heating element lead-out electrode conductive portion 14c are formed on the prepared insulating substrate 10.
  • the first upper surface electrode 11a is formed around the first conductive portion 11c of the upper surface 10a of the insulating substrate 10, and the second upper surface electrode 12a is formed around the second conductive portion 12c. Further, a heating element extraction upper surface electrode 14a is formed between the first upper surface electrode 11a and the second upper surface electrode 12a. Further, a first lower surface electrode 11b is formed around the first conductive portion 11c of the lower surface 10b of the insulating substrate 10, and a second lower surface electrode 12b is formed around the second conductive portion 12c. Further, a heating element extraction lower surface electrode 14b is formed around the heating element extraction electrode conduction portion 14c on the lower surface 10b of the insulating substrate 10. The third electrode 13 is formed at a position facing the lower electrode 14b of the heating element drawer.
  • Electrodes can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the printing method is a method in which a metal or alloy paste for forming an electrode is printed in a desired pattern and fired if necessary.
  • the heating element 20 is formed on the lower surface 10b of the insulating substrate 10.
  • the heating element 20 is formed so that one end is connected to the third electrode 13 and the other end is connected to the heating element drawer lower surface electrode 14b.
  • the heating element 20 is covered with the heat insulating member 21.
  • the heating element 20 can be formed, for example, by applying a high resistance conductive paste containing a high resistance conductive material and a binder and firing it if necessary.
  • a binder an inorganic binder such as water glass or an organic binder such as a thermosetting resin can be used.
  • the heating element 20 can be formed by a known method used as a method for forming a conductive film such as a plating method, a vapor deposition method, and a sputtering method. Further, as a method for forming the heating element 20, a method of attaching or laminating a high resistance conductive film obtained by the above method may be used.
  • the heat insulating member 21 can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the printing method is a method in which the paste of the heat insulating member is printed in a desired pattern and fired if necessary.
  • the first insulating member 17a is formed on the side surface of the first upper surface electrode 11a facing the second upper surface electrode 12a and a part of the upper surface connected to the side surface.
  • the first terminal 18a is formed in a portion of the first upper surface electrode 11a where the first insulating member 17a is not formed.
  • the second insulating member 17b is formed on the side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and a part of the upper surface connected to the side surface.
  • the second terminal 18b is formed in the portion of the second upper surface electrode 12a where the second insulating member 17b is not formed.
  • the order of forming the first insulating member 17a and the first terminal 18a and the second insulating member 17b and the second terminal 18b is not particularly limited.
  • the first terminal 18a and the second terminal 18b may be formed before the first insulating member 17a and the second insulating member 17b.
  • the first insulating member 17a and the second insulating member 17b can be formed by, for example, a printing method.
  • the printing method is a method in which a paste of an insulating material is printed in a desired pattern and fired if necessary.
  • the first terminal 18a and the second terminal 18b can be formed by a known method used as an electrode forming method such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the printing method is a method in which a metal or alloy paste for forming terminals is printed in a desired pattern and fired if necessary.
  • the conductive member 15 is formed on the upper surface of the heating element drawer upper surface electrode 14a.
  • the conductive member 15 can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the fuse element 30 is laminated on the upper surfaces of the first terminal 18a, the conductive member 15, and the second terminal 18b.
  • the fuse element 30 can be laminated by applying the solder paste 32 on the upper surfaces of the first terminal 18a, the conductive member 15 and the second terminal 18b, and then arranging the fuse element 30 on the solder paste 32.
  • the protection element 1 of the present embodiment since the first upper surface electrode 11a and the second upper surface electrode 12a are covered with the first insulating member 17a and the second insulating member 17b, respectively, there is a space. Even if the width Wa of 19a and the width Wb of the space 19b are narrowed, an internal short circuit is unlikely to occur. Therefore, the protective element 1 of the present embodiment can be easily miniaturized. Further, by narrowing the width Wa of the space 19a and the width Wb of the space 19b, the width of the fuse element 30 can be shortened, so that the resistance between the first electrode 11 and the second electrode 12 of the protection element 1 can be lowered. .. Therefore, the protection element 1 of the present embodiment can be easily reduced in resistance and size, and an internal short circuit is unlikely to occur.
  • FIGS. 6 to 7 The configuration of the protective element according to the second embodiment of the present invention is shown in FIGS. 6 to 7.
  • FIG. 6 is a cross-sectional view of the protective element according to the second embodiment of the present invention
  • FIG. 7 is a vertical cross-sectional view of the protective element.
  • the cross-sectional view of FIG. 6 corresponds to the cross-sectional view of line III-III'of FIG. 3
  • the vertical cross-sectional view of FIG. 7 corresponds to the vertical cross-sectional view of line IV-IV of FIG.
  • the heating element extraction upper surface electrode 14d has a shape in which the heating element extraction upper surface electrode 14a and the conductive member 15 of the protection element 1 according to the first embodiment are integrated. It is connected to the fuse element 30 without passing through the conductive member 15.
  • the protective element 2 according to the second embodiment is different from the protective element 1 according to the first embodiment.
  • the parts common to the protective element 2 according to the second embodiment and the protective element 1 according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the protective element 2 can be manufactured in the same manner as the protective element 1 according to the first embodiment, except for the following points. Do not form the heating element drawer upper surface electrode 14a on the upper surface 10a of the insulating substrate 10. Instead of forming the conductive member 15, the heating element extraction upper surface electrode 14d is formed on the upper surface 10a of the insulating substrate 10.
  • the heating element extraction upper surface electrode 14d can be formed by a known method used as an electrode forming method such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the first upper surface electrode 11a and the second upper surface electrode 12a are covered with the first insulating member 17a and the second insulating member 17b, respectively. Similar to the protection element 1 according to the first embodiment, it is easy to reduce the resistance and size, and it is difficult for an internal short circuit to occur. Further, in the protection element 2, since the heating element extraction upper surface electrode 14d is connected to the fuse element 30 without passing through the conductive member 15, the heat generated by the heating element 20 can be transferred to the fuse element 30 more efficiently. Can be done. Therefore, according to the protection element 2, the fusing speed when a current flows through the third electrode 13 can be further increased.
  • FIGS. 8 to 11 The configuration of the protective element according to the third embodiment of the present invention is shown in FIGS. 8 to 11.
  • FIG. 8 is a top view (plan view) of the protective element
  • FIG. 9 is a bottom view (bottom view) of the protective element.
  • 10 is a cross-sectional view taken along the line XX'of FIG. 8
  • FIG. 11 is a vertical cross-sectional view taken along the line XI-XI'of FIG.
  • the parts common to the protective element 3 according to the third embodiment and the protective element 1 according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the heating element 20 is provided on the upper surface 10a of the insulating substrate 10.
  • the heating element 20 is covered with a heat insulating member 21.
  • the heat insulating member 21 includes a side surface of the first upper surface electrode 11a facing the second upper surface electrode 12a and a part of the upper surface connected to the side surface, and a side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and its side surface. It covers a part of the upper surface connected to. That is, the heat insulating member 21 also functions as an insulating member that insulates the first upper surface electrode 11a and the second upper surface electrode 12a.
  • the third electrode 13 includes a third upper surface electrode 13a, a third lower surface electrode 13b, and a third conductive portion 13c.
  • the third upper surface electrode 13a is formed on the upper surface 10a of the insulating substrate 10.
  • the third upper surface electrode 13a is connected to one end of the heating element 20.
  • the third lower surface electrode 13b is formed on the lower surface 10b of the insulating substrate 10.
  • the third bottom electrode 13b is connected to the switching element of the circuit board.
  • the third conductive portion 13c penetrates the insulating substrate 10 and electrically connects the third upper surface electrode 13a and the third lower surface electrode 13b.
  • the end of the heating element 20 opposite to the third lower surface electrode 13b side is connected to the heating element extraction electrode 14.
  • the heating element extraction electrode 14 is routed to the upper surface of the heat insulating member 21.
  • the heating element extraction electrode 14 is connected to the fuse element 30 by a solder paste 32.
  • the protective element 3 can be manufactured, for example, as follows.
  • the insulating substrate 10 is prepared.
  • the first conductive portion 11c of the first electrode 11, the second conductive portion 12c of the second electrode 12, and the third conductive portion 13c are formed on the prepared insulating substrate 10.
  • the first upper surface electrode 11a is formed around the first conductive portion 11c of the upper surface 10a of the insulating substrate 10, and the second upper surface electrode 12a is formed around the second conductive portion 12c. Further, a third upper surface electrode 13a is formed around the third conductive portion 13c of the upper surface 10a of the insulating substrate 10, and a third lower surface electrode 13b is formed around the third conductive portion 13c of the lower surface 10b.
  • a heat insulating member layer having the same width as or wider than the heating element 20 is formed between the first upper surface electrode 11a and the second upper surface electrode 12a of the upper surface 10a of the insulating substrate 10.
  • the heating element 20 is formed on the heat insulating member layer. The heating element 20 is formed so that one end is connected to the third upper surface electrode 13a.
  • the first terminal 18a is formed on the side surface of the first upper surface electrode 11a that does not face the second upper surface electrode 12a and a part of the upper surface connected to the side surface.
  • the second terminal 18b is formed on a side surface of the second upper surface electrode 12a that does not face the first upper surface electrode 11a and a part of the upper surface connected to the side surface.
  • the heat insulating member 21 is formed between the first upper surface electrode 11a and the second upper surface electrode 12a.
  • the heating element extraction electrode 14 is formed on the upper surface of the heat insulating member 21.
  • the heating element extraction electrode 14 is formed so that one end thereof is connected to the heating element 20.
  • the fuse element 30 is laminated on the upper surfaces of the first terminal 18a, the heating element extraction electrode 14 and the second terminal 18b using the solder paste 32.
  • the protective element 3 having the above configuration, since the first upper surface electrode 11a and the second upper surface electrode 12a are each covered with the heat insulating member 21, the same as the protective element 1 according to the first embodiment. Although the structure is easy to reduce resistance and miniaturization, internal short circuit is unlikely to occur. Further, since the heating element 20 is arranged on the upper surface 10a side of the insulating substrate 10, the heat generated by the heating element 20 can be more efficiently transferred to the fuse element 30. Therefore, the fusing speed when a current flows through the third electrode 13 can be further increased.
  • Example 1 The protective element 1 according to the first embodiment was manufactured.
  • the constituent materials of each member are as follows.
  • Insulated substrate 10 Alumina substrate, length: 2 mm, width: 4 mm, thickness: 0.2 mm
  • First electrode 11 Ag whose surface is coated with Ni-Au plating
  • Second electrode 12 Ag whose surface is coated with Ni-Au plating
  • Third electrode 13 Ag whose surface is coated with Ni-Au plating
  • Heating element extraction electrode 14 Ag whose surface is coated with Ni-Au plating.
  • Conductive member 15 Ag whose surface is coated with Ni-Au plating 1st insulating member 17a, 2nd insulating member 17b: glass 1st terminal 18a, 2nd terminal 18b: silver Total width of space 19a and space 19b (Wa + Wb): 0.5 mm
  • Heating element 20 Luthenium oxide fuse element 30: Laminated body using Ag as the high melting point metal layer on the outside and Sn alloy as the low melting point metal layer on the inside, length: 1.6 mm, width: 2.0 mm, thickness : 0.6mm
  • Solder paste 32 Sn alloy
  • Example 2 The protective element 2 according to the second embodiment was produced in the same manner as in the first embodiment except that the heating element drawer upper surface electrode 14d was formed instead of forming the heating element drawer upper surface electrode 14a and the conductive member 15. The obtained protective element 2 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • Example 3 The protective element 3 according to the third embodiment was manufactured using the same material as in Example 1. The obtained protective element 3 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • FIG. 12 shows a cross-sectional view of the protective element produced in Comparative Example 1.
  • the protective element 4 produced in Comparative Example 1 is different from the protective element 1 produced in Example 1 in the following points. Without forming the first insulating member 17a on the upper surface of the first upper surface electrode 11a and forming the second insulating member 17b on the upper surface of the second upper surface electrode 12a, the conductive member 15 surrounds the heating element extraction upper surface electrode 14a. Covered. The width of the conductive member 15 was the same as that of the protective element 1 of the first embodiment.
  • the position of the first upper surface electrode 11a was shifted outward by 0.5 mm so that the width Wa of the space 19a between the conductive member 15 and the first upper surface electrode 11a was 0.25 mm.
  • the position of the second upper surface electrode 12a was shifted outward by 0.5 mm so that the width Wa of the space 19b between the conductive member 15 and the second upper surface electrode 12a was 0.25 mm.
  • the total width (Wa + Wb) of the space 19a and the space 19b is 0.5 mm, which is the same as that of the protective element 1, but the width of the fuse element 30 is 3 mm, which is 1 mm wider than that of the protective element 1.
  • the obtained protective element 4 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • the protective elements 1 to 3 of Examples 1 to 3 had a smaller resistance value between the first electrode 11 and the second electrode 12 than the protective element 4 of Comparative Example 1. It is considered that this is because the width of the fuse element 30 is narrow and the distance between the first electrode 11 and the second electrode 12 is shortened.
  • the protection element 2 of Example 2 in which the heating element extraction upper surface electrode 14d is formed is when a current is passed through the third electrode 13.
  • the fusing time was shorter than that of the protective element 1 of Example 1, and the fusing speed was higher.
  • the protective element 3 of the third embodiment in which the heating element 20 is arranged on the upper surface 10a side of the insulating substrate 10 has a shorter fusing time when a current is passed through the third electrode 13 as compared with the protective element 2 of the second embodiment. , The fusing speed has become even faster.

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  • Fuses (AREA)

Abstract

L'invention concerne un élément de protection comportant un substrat isolant, une première électrode et une deuxieme électrode disposées face à face sur une surface du substrat isolant, un corps de génération de chaleur disposé sur la surface du substrat isolant, une troisième électrode reliée à une extrémité du corps de génération de chaleur, une électrode de sortie de corps de génération de chaleur connectée à l'extrémité opposée du corps de génération de chaleur à partir de ladite extrémité, et un élément fusible, dont l'une des extrémités en vis-à-vis est reliée à la première électrode, dont l'autre extrémité est reliée à la deuxième électrode, et dont une partie centrale entre ladite extrémité et l'autre extrémité est en contact avec l'électrode de sortie de corps générant de la chaleur, une surface latérale de la première électrode faisant face à la deuxieme électrode et au moins une partie d'une surface supérieure reliant ladite surface latérale étant recouverte d'un premier élément isolant, et une surface latérale de la deuxieme électrode faisant face à la première électrode et au moins une partie d'une surface supérieure se raccordant à ladite surface latérale est recouverte d'un second élément isolant.
PCT/JP2020/032363 2019-09-04 2020-08-27 Élément de protection WO2021044939A1 (fr)

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KR1020227006525A KR20220035499A (ko) 2019-09-04 2020-08-27 보호 소자
CN202080060906.6A CN114303219B (zh) 2019-09-04 2020-08-27 保护元件

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JP2019161178A JP7393898B2 (ja) 2019-09-04 2019-09-04 保護素子
JP2019-161178 2019-09-04

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WO2021044939A1 true WO2021044939A1 (fr) 2021-03-11

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CN (1) CN114303219B (fr)
TW (1) TW202115979A (fr)
WO (1) WO2021044939A1 (fr)

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WO2023167069A1 (fr) * 2022-03-02 2023-09-07 デクセリアルズ株式会社 Élément de protection
WO2023248787A1 (fr) * 2022-06-22 2023-12-28 デクセリアルズ株式会社 Élément de protection, et procédé de fabrication d'un élément de protection

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WO2022190707A1 (fr) 2021-03-12 2022-09-15 テルモ株式会社 Cathéter et cathéter à ballonnet

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JP2017174592A (ja) * 2016-03-23 2017-09-28 デクセリアルズ株式会社 保護素子
JP2018092892A (ja) * 2016-11-29 2018-06-14 デクセリアルズ株式会社 保護素子

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JP2017174592A (ja) * 2016-03-23 2017-09-28 デクセリアルズ株式会社 保護素子
JP2018092892A (ja) * 2016-11-29 2018-06-14 デクセリアルズ株式会社 保護素子

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023167069A1 (fr) * 2022-03-02 2023-09-07 デクセリアルズ株式会社 Élément de protection
WO2023248787A1 (fr) * 2022-06-22 2023-12-28 デクセリアルズ株式会社 Élément de protection, et procédé de fabrication d'un élément de protection

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KR20220035499A (ko) 2022-03-22
CN114303219B (zh) 2024-05-28
TW202115979A (zh) 2021-04-16
JP2021039903A (ja) 2021-03-11
CN114303219A (zh) 2022-04-08
JP7393898B2 (ja) 2023-12-07

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