WO2021044939A1 - Protective element - Google Patents

Protective element Download PDF

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Publication number
WO2021044939A1
WO2021044939A1 PCT/JP2020/032363 JP2020032363W WO2021044939A1 WO 2021044939 A1 WO2021044939 A1 WO 2021044939A1 JP 2020032363 W JP2020032363 W JP 2020032363W WO 2021044939 A1 WO2021044939 A1 WO 2021044939A1
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WO
WIPO (PCT)
Prior art keywords
electrode
heating element
surface electrode
insulating member
insulating substrate
Prior art date
Application number
PCT/JP2020/032363
Other languages
French (fr)
Japanese (ja)
Inventor
幸市 向
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020227006525A priority Critical patent/KR20220035499A/en
Priority to CN202080060906.6A priority patent/CN114303219B/en
Publication of WO2021044939A1 publication Critical patent/WO2021044939A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits

Definitions

  • the present invention relates to a protective element.
  • the present application claims priority based on Japanese Patent Application No. 2019-161178 filed in Japan on September 4, 2019, the contents of which are incorporated herein by reference.
  • the circuit board is generally equipped with a protective element.
  • the protective element cuts off the current path in the event of an abnormality such as when an overcurrent exceeding the rating occurs in the current path.
  • the protective element include an insulating substrate, a first electrode and a second electrode provided on one surface of the insulating substrate so as to face each other, and a heating element provided on one surface of the insulating substrate.
  • the third electrode connected to one end of the heating element and the heating element extraction electrode connected to the end opposite to the end connected to the third electrode of the heating element, while facing each other.
  • the protective element having this configuration, there is a space between the first electrode and the heating element extraction electrode and between the second electrode and the heating element extraction electrode. Therefore, by melting the fuse element by heat, the fuse element is blown on the space between the first electrode and the heating element extraction electrode or on the space between the second electrode and the heating element extraction electrode.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a protective element having a structure that can be easily reduced in resistance and miniaturization and that is less likely to cause an internal short circuit.
  • the present invention provides the following means for solving the above problems.
  • the protective element includes an insulating substrate, a first electrode and a second electrode provided on one surface of the insulating substrate so as to face each other, and one of the insulating substrates.
  • a heating element provided on the surface of the heating element, a third electrode connected to one end of the heating element, and a heating element extraction electrode connected to an end of the heating element opposite to the one end. And one end facing each other is connected to the first electrode, the other end is connected to the second electrode, and the central portion between the one end and the other end is said.
  • a fuse element in contact with a heating element extraction electrode is provided, and the first electrode is provided with a side surface facing the second electrode and at least a part of an upper surface connected to the side surface covered with a first insulating member.
  • the two electrodes have a side surface facing the first electrode and at least a part of an upper surface connected to the side surface covered with a second insulating member.
  • the heating element extraction electrode may be extended to the upper surfaces of the first insulating member and the second insulating member.
  • a protective element having a structure that can be easily reduced in resistance and miniaturization and that is less likely to cause an internal short circuit.
  • FIG. 1 is a cross-sectional view taken along the line III-III'of FIG.
  • FIG. 1 is a vertical cross-sectional view taken along the line IV-IV'of FIG.
  • FIG. 1 is a cross-sectional view which shows the state which the protection element of 1st Embodiment operates and the fuse element is melted.
  • It is sectional drawing of the protection element which concerns on 2nd Embodiment of this invention. It is a vertical sectional view of the protection element which concerns on 2nd Embodiment of this invention.
  • FIG. 9 is a cross-sectional view taken along the line XX'of FIG. 9 is a vertical cross-sectional view taken along the line XI-XI'in FIG. It is a cross-sectional view of the protection element produced in Comparative Example 1.
  • FIG. 1 is a top view (plan view) of the protective element.
  • FIG. 2 is a bottom view (bottom view) of the protective element.
  • FIG. 3 is a cross-sectional view taken along the line III-III'of FIG.
  • FIG. 4 is a vertical cross-sectional view taken along the line IV-IV'of FIG.
  • the protective element 1 includes an insulating substrate 10, a first electrode 11 (first upper surface electrode 11a) and a second electrode 12 provided on the upper surface 10a of the insulating substrate 10 so as to face each other. (Second upper surface electrode 12a), a heating element 20 provided on the lower surface 10b of the insulating substrate 10, a third electrode 13 connected to one end of the heating element 20, and one end of the heating element 20.
  • a heating element extraction electrode 14 connected to an end portion on the opposite side to the portion, and a fuse element 30 connected to the first electrode 11, the second electrode 12, and the heating element extraction electrode 14 are provided.
  • a first electrode 11 is connected to one end 30a of the fuse element 30 facing each other via a first terminal 18a.
  • a second electrode 12 is connected to the other end portion 30b via a second terminal 18b.
  • a heating element extraction electrode 14 is connected to the central portion 30c between the end portions 30a and the end portion 30b of the fuse element 30 via a conductive member 15.
  • the first terminal 18a and the fuse element 30, the second terminal 18b and the fuse element 30, and the conductive member 15 and the fuse element 30 are adhered to each other by the solder paste 32.
  • the insulating substrate 10 is not particularly limited as long as it is made of a material having insulating properties.
  • a substrate used for a printed wiring board such as a ceramics substrate or a glass epoxy substrate, a glass substrate, a resin substrate, and an insulating treatment.
  • a metal substrate or the like can be used.
  • a ceramic substrate which is an insulating substrate having excellent heat resistance and thermal conductivity, is preferable.
  • the first electrode 11 includes a first upper surface electrode 11a, a first lower surface electrode 11b, and a first conductive portion 11c.
  • the first upper surface electrode 11a is formed on the upper surface 10a of the insulating substrate 10.
  • the first upper surface electrode 11a has a side surface facing the second upper surface electrode 12a and at least a part of the upper surface connected to the side surface is covered with the first insulating member 17a.
  • the portion of the first upper surface electrode 11a that is not covered with the first insulating member 17a is covered with the first terminal 18a.
  • the first lower surface electrode 11b is formed on the lower surface 10b of the insulating substrate 10.
  • the first lower surface electrode 11b is connected to the wiring of the circuit board.
  • the first conductive portion 11c penetrates the insulating substrate 10 and electrically connects the first upper surface electrode 11a and the first lower surface electrode 11b.
  • the second electrode 12 includes a second upper surface electrode 12a, a second lower surface electrode 12b, and a second conductive portion 12c.
  • the second upper surface electrode 12a is formed on the upper surface 10a of the insulating substrate 10.
  • the side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and at least a part of the upper surface connected to the side surface are covered with the second insulating member 17b.
  • the portion of the second upper surface electrode 12a that is not covered with the second insulating member 17b is covered with the second terminal 18b.
  • the second lower surface electrode 12b is formed on the lower surface 10b of the insulating substrate 10.
  • the second bottom electrode 12b is connected to the wiring of the circuit board.
  • the second conductive portion 12c penetrates the insulating substrate 10 and electrically connects the second upper surface electrode 12a and the second lower surface electrode 12b.
  • the third electrode 13 is connected to one end of the heating element 20.
  • the third electrode 13 is partially covered with a heat insulating member 21.
  • the portion of the third electrode 13 that is not covered with the heat insulating member 21 is connected to the switching element of the circuit board.
  • the switching element operates when an abnormality other than an overcurrent occurs in the circuit board to supply a current to the third electrode 13.
  • first electrode 11, the second electrode 12, and the third electrode 13 metal materials such as Ag and Cu can be used.
  • the surfaces of the first electrode 11, the second electrode 12, and the third electrode 13 may be coated with a metal or alloy such as Ag, Ag-Pt, Ag-Pd, Au, or Ni-Au.
  • the heating element 20 has a relatively high resistance as compared with the third electrode 13.
  • the heating element 20 is formed of a high resistance conductive material that easily generates heat when energized.
  • ruthenium oxide or carbon black can be used as a material constituting the heating element 20.
  • the heating element 20 is covered with a heat insulating member 21.
  • a heat insulating member 21 As the material of the heat insulating member 21, for example, an insulating material such as ceramics or glass can be used.
  • the heating element extraction electrode 14 includes a heating element extraction upper surface electrode 14a, a heating element extraction lower surface electrode 14b, and a heating element extraction electrode conduction portion 14c.
  • the heating element extraction upper surface electrode 14a is formed on the upper surface 10a of the insulating substrate 10.
  • a conductive member 15 is laminated on the upper surface of the heating element extraction upper surface electrode 14a.
  • the heating element extraction lower surface electrode 14b is formed on the lower surface 10b of the insulating substrate 10 and is connected to the heating element 20.
  • the heating element extraction electrode conduction portion 14c penetrates the insulating substrate 10 and electrically connects the heating element extraction upper surface electrode 14a and the heating element extraction lower surface electrode 14b.
  • the heating element extraction electrode 14 and the conductive member 15 have high thermal conductivity and conductivity.
  • a metal material such as Ag or Cu can be used.
  • the surface of the heating element extraction electrode 14 and the conductive member 15 may be coated with a metal or alloy such as Ag, Ag-Pt, Ag-Pd, Au, or Ni-Au.
  • a space 19a is formed between the heating element drawer upper surface electrode 14a and the first terminal 18a. Further, a space 19b is formed between the heating element extraction upper surface electrode 14a and the second terminal 18b.
  • the first upper surface electrode 11a below the space 19a is covered with the first insulating member 17a.
  • the second upper surface electrode 12a below the space 19b is covered with a second insulating member 17b. Therefore, the heating element extraction upper surface electrode 14a is extended to the upper surface of the first insulating member 17a, particularly to a position where the heating element extraction upper surface electrode 14a and the first upper surface electrode 11a overlap with each other via the first insulating member 17a. However, internal short circuits are unlikely to occur.
  • the heating element extraction upper surface electrode 14a is extended to the upper surface of the second insulating member 17b, particularly to a position where the heating element extraction upper surface electrode 14a and the first upper surface electrode 11a overlap via the second insulating member 17b. Even if it is, internal short circuit is unlikely to occur. Therefore, the widths of the space 19a and the space 19b can be narrowed.
  • the width Wa of the space 19a and the width Wb of the space 19b are preferably in the range of 0.02 mm or more and 1.0 mm or less, respectively.
  • the fuse element 30 may be a single metal.
  • the fuse element 30 may be a laminated body having a high melting point metal layer having a relatively high melting point on the outside and a low melting point metal layer having a relatively low melting point on the inside.
  • the fuse element 30 is a simple substance of metal, an alloy containing In, Pb, Ag, Cu or any of these as a main component can be used as the material thereof.
  • the melting point of the low melting point metal layer may be in the range of 280 ° C. or lower at the heating temperature (usually about 220 ° C.) or more at the time of reflow performed when the protective element 1 is mounted. preferable.
  • the material of the low melting point metal layer is preferably tin or a tin alloy containing tin as a main component.
  • the tin content of the tin alloy is preferably 40% by mass or more, more preferably 60% by mass or more.
  • Examples of tin alloys include Sn—Bi alloys, In—Sn alloys, and Sn—Ag—Cu alloys.
  • the high melting point metal layer is a layer made of a metal material that is dissolved in a melt of the low melting point metal layer.
  • the material of the low melting point metal layer is tin or a tin alloy
  • the material of the high melting point metal layer is preferably silver or an alloy containing silver as a main component.
  • the silver content of the silver alloy is preferably 40% by mass or more, more preferably 60% by mass or more.
  • Examples of silver alloys include Ag—Pd alloys.
  • FIG. 5 is a cross-sectional view showing a state in which the protection element of the first embodiment is activated and the fuse element is melted.
  • the cross-sectional view of FIG. 5 is a cross-sectional view at the same position as the cross-sectional view of the line III-III'of FIG.
  • the heating element 20 when an abnormality other than an overcurrent occurs in the circuit board, the heating element 20 generates heat due to the current flowing through the third electrode 13. The heat is transferred to the fuse element 30 via the heating element extraction electrode 14, and the fuse element 30 melts and blows, thereby interrupting the current path of the circuit board. The fused solidified fuse element 31 after melting is held on the solder paste 32.
  • the protective element 1 can be manufactured, for example, as follows.
  • the insulating substrate 10 is prepared.
  • the first conductive portion 11c of the first electrode 11, the second conductive portion 12c of the second electrode 12, and the heating element lead-out electrode conductive portion 14c are formed on the prepared insulating substrate 10.
  • the first upper surface electrode 11a is formed around the first conductive portion 11c of the upper surface 10a of the insulating substrate 10, and the second upper surface electrode 12a is formed around the second conductive portion 12c. Further, a heating element extraction upper surface electrode 14a is formed between the first upper surface electrode 11a and the second upper surface electrode 12a. Further, a first lower surface electrode 11b is formed around the first conductive portion 11c of the lower surface 10b of the insulating substrate 10, and a second lower surface electrode 12b is formed around the second conductive portion 12c. Further, a heating element extraction lower surface electrode 14b is formed around the heating element extraction electrode conduction portion 14c on the lower surface 10b of the insulating substrate 10. The third electrode 13 is formed at a position facing the lower electrode 14b of the heating element drawer.
  • Electrodes can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the printing method is a method in which a metal or alloy paste for forming an electrode is printed in a desired pattern and fired if necessary.
  • the heating element 20 is formed on the lower surface 10b of the insulating substrate 10.
  • the heating element 20 is formed so that one end is connected to the third electrode 13 and the other end is connected to the heating element drawer lower surface electrode 14b.
  • the heating element 20 is covered with the heat insulating member 21.
  • the heating element 20 can be formed, for example, by applying a high resistance conductive paste containing a high resistance conductive material and a binder and firing it if necessary.
  • a binder an inorganic binder such as water glass or an organic binder such as a thermosetting resin can be used.
  • the heating element 20 can be formed by a known method used as a method for forming a conductive film such as a plating method, a vapor deposition method, and a sputtering method. Further, as a method for forming the heating element 20, a method of attaching or laminating a high resistance conductive film obtained by the above method may be used.
  • the heat insulating member 21 can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the printing method is a method in which the paste of the heat insulating member is printed in a desired pattern and fired if necessary.
  • the first insulating member 17a is formed on the side surface of the first upper surface electrode 11a facing the second upper surface electrode 12a and a part of the upper surface connected to the side surface.
  • the first terminal 18a is formed in a portion of the first upper surface electrode 11a where the first insulating member 17a is not formed.
  • the second insulating member 17b is formed on the side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and a part of the upper surface connected to the side surface.
  • the second terminal 18b is formed in the portion of the second upper surface electrode 12a where the second insulating member 17b is not formed.
  • the order of forming the first insulating member 17a and the first terminal 18a and the second insulating member 17b and the second terminal 18b is not particularly limited.
  • the first terminal 18a and the second terminal 18b may be formed before the first insulating member 17a and the second insulating member 17b.
  • the first insulating member 17a and the second insulating member 17b can be formed by, for example, a printing method.
  • the printing method is a method in which a paste of an insulating material is printed in a desired pattern and fired if necessary.
  • the first terminal 18a and the second terminal 18b can be formed by a known method used as an electrode forming method such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the printing method is a method in which a metal or alloy paste for forming terminals is printed in a desired pattern and fired if necessary.
  • the conductive member 15 is formed on the upper surface of the heating element drawer upper surface electrode 14a.
  • the conductive member 15 can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the fuse element 30 is laminated on the upper surfaces of the first terminal 18a, the conductive member 15, and the second terminal 18b.
  • the fuse element 30 can be laminated by applying the solder paste 32 on the upper surfaces of the first terminal 18a, the conductive member 15 and the second terminal 18b, and then arranging the fuse element 30 on the solder paste 32.
  • the protection element 1 of the present embodiment since the first upper surface electrode 11a and the second upper surface electrode 12a are covered with the first insulating member 17a and the second insulating member 17b, respectively, there is a space. Even if the width Wa of 19a and the width Wb of the space 19b are narrowed, an internal short circuit is unlikely to occur. Therefore, the protective element 1 of the present embodiment can be easily miniaturized. Further, by narrowing the width Wa of the space 19a and the width Wb of the space 19b, the width of the fuse element 30 can be shortened, so that the resistance between the first electrode 11 and the second electrode 12 of the protection element 1 can be lowered. .. Therefore, the protection element 1 of the present embodiment can be easily reduced in resistance and size, and an internal short circuit is unlikely to occur.
  • FIGS. 6 to 7 The configuration of the protective element according to the second embodiment of the present invention is shown in FIGS. 6 to 7.
  • FIG. 6 is a cross-sectional view of the protective element according to the second embodiment of the present invention
  • FIG. 7 is a vertical cross-sectional view of the protective element.
  • the cross-sectional view of FIG. 6 corresponds to the cross-sectional view of line III-III'of FIG. 3
  • the vertical cross-sectional view of FIG. 7 corresponds to the vertical cross-sectional view of line IV-IV of FIG.
  • the heating element extraction upper surface electrode 14d has a shape in which the heating element extraction upper surface electrode 14a and the conductive member 15 of the protection element 1 according to the first embodiment are integrated. It is connected to the fuse element 30 without passing through the conductive member 15.
  • the protective element 2 according to the second embodiment is different from the protective element 1 according to the first embodiment.
  • the parts common to the protective element 2 according to the second embodiment and the protective element 1 according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the protective element 2 can be manufactured in the same manner as the protective element 1 according to the first embodiment, except for the following points. Do not form the heating element drawer upper surface electrode 14a on the upper surface 10a of the insulating substrate 10. Instead of forming the conductive member 15, the heating element extraction upper surface electrode 14d is formed on the upper surface 10a of the insulating substrate 10.
  • the heating element extraction upper surface electrode 14d can be formed by a known method used as an electrode forming method such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
  • the first upper surface electrode 11a and the second upper surface electrode 12a are covered with the first insulating member 17a and the second insulating member 17b, respectively. Similar to the protection element 1 according to the first embodiment, it is easy to reduce the resistance and size, and it is difficult for an internal short circuit to occur. Further, in the protection element 2, since the heating element extraction upper surface electrode 14d is connected to the fuse element 30 without passing through the conductive member 15, the heat generated by the heating element 20 can be transferred to the fuse element 30 more efficiently. Can be done. Therefore, according to the protection element 2, the fusing speed when a current flows through the third electrode 13 can be further increased.
  • FIGS. 8 to 11 The configuration of the protective element according to the third embodiment of the present invention is shown in FIGS. 8 to 11.
  • FIG. 8 is a top view (plan view) of the protective element
  • FIG. 9 is a bottom view (bottom view) of the protective element.
  • 10 is a cross-sectional view taken along the line XX'of FIG. 8
  • FIG. 11 is a vertical cross-sectional view taken along the line XI-XI'of FIG.
  • the parts common to the protective element 3 according to the third embodiment and the protective element 1 according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
  • the heating element 20 is provided on the upper surface 10a of the insulating substrate 10.
  • the heating element 20 is covered with a heat insulating member 21.
  • the heat insulating member 21 includes a side surface of the first upper surface electrode 11a facing the second upper surface electrode 12a and a part of the upper surface connected to the side surface, and a side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and its side surface. It covers a part of the upper surface connected to. That is, the heat insulating member 21 also functions as an insulating member that insulates the first upper surface electrode 11a and the second upper surface electrode 12a.
  • the third electrode 13 includes a third upper surface electrode 13a, a third lower surface electrode 13b, and a third conductive portion 13c.
  • the third upper surface electrode 13a is formed on the upper surface 10a of the insulating substrate 10.
  • the third upper surface electrode 13a is connected to one end of the heating element 20.
  • the third lower surface electrode 13b is formed on the lower surface 10b of the insulating substrate 10.
  • the third bottom electrode 13b is connected to the switching element of the circuit board.
  • the third conductive portion 13c penetrates the insulating substrate 10 and electrically connects the third upper surface electrode 13a and the third lower surface electrode 13b.
  • the end of the heating element 20 opposite to the third lower surface electrode 13b side is connected to the heating element extraction electrode 14.
  • the heating element extraction electrode 14 is routed to the upper surface of the heat insulating member 21.
  • the heating element extraction electrode 14 is connected to the fuse element 30 by a solder paste 32.
  • the protective element 3 can be manufactured, for example, as follows.
  • the insulating substrate 10 is prepared.
  • the first conductive portion 11c of the first electrode 11, the second conductive portion 12c of the second electrode 12, and the third conductive portion 13c are formed on the prepared insulating substrate 10.
  • the first upper surface electrode 11a is formed around the first conductive portion 11c of the upper surface 10a of the insulating substrate 10, and the second upper surface electrode 12a is formed around the second conductive portion 12c. Further, a third upper surface electrode 13a is formed around the third conductive portion 13c of the upper surface 10a of the insulating substrate 10, and a third lower surface electrode 13b is formed around the third conductive portion 13c of the lower surface 10b.
  • a heat insulating member layer having the same width as or wider than the heating element 20 is formed between the first upper surface electrode 11a and the second upper surface electrode 12a of the upper surface 10a of the insulating substrate 10.
  • the heating element 20 is formed on the heat insulating member layer. The heating element 20 is formed so that one end is connected to the third upper surface electrode 13a.
  • the first terminal 18a is formed on the side surface of the first upper surface electrode 11a that does not face the second upper surface electrode 12a and a part of the upper surface connected to the side surface.
  • the second terminal 18b is formed on a side surface of the second upper surface electrode 12a that does not face the first upper surface electrode 11a and a part of the upper surface connected to the side surface.
  • the heat insulating member 21 is formed between the first upper surface electrode 11a and the second upper surface electrode 12a.
  • the heating element extraction electrode 14 is formed on the upper surface of the heat insulating member 21.
  • the heating element extraction electrode 14 is formed so that one end thereof is connected to the heating element 20.
  • the fuse element 30 is laminated on the upper surfaces of the first terminal 18a, the heating element extraction electrode 14 and the second terminal 18b using the solder paste 32.
  • the protective element 3 having the above configuration, since the first upper surface electrode 11a and the second upper surface electrode 12a are each covered with the heat insulating member 21, the same as the protective element 1 according to the first embodiment. Although the structure is easy to reduce resistance and miniaturization, internal short circuit is unlikely to occur. Further, since the heating element 20 is arranged on the upper surface 10a side of the insulating substrate 10, the heat generated by the heating element 20 can be more efficiently transferred to the fuse element 30. Therefore, the fusing speed when a current flows through the third electrode 13 can be further increased.
  • Example 1 The protective element 1 according to the first embodiment was manufactured.
  • the constituent materials of each member are as follows.
  • Insulated substrate 10 Alumina substrate, length: 2 mm, width: 4 mm, thickness: 0.2 mm
  • First electrode 11 Ag whose surface is coated with Ni-Au plating
  • Second electrode 12 Ag whose surface is coated with Ni-Au plating
  • Third electrode 13 Ag whose surface is coated with Ni-Au plating
  • Heating element extraction electrode 14 Ag whose surface is coated with Ni-Au plating.
  • Conductive member 15 Ag whose surface is coated with Ni-Au plating 1st insulating member 17a, 2nd insulating member 17b: glass 1st terminal 18a, 2nd terminal 18b: silver Total width of space 19a and space 19b (Wa + Wb): 0.5 mm
  • Heating element 20 Luthenium oxide fuse element 30: Laminated body using Ag as the high melting point metal layer on the outside and Sn alloy as the low melting point metal layer on the inside, length: 1.6 mm, width: 2.0 mm, thickness : 0.6mm
  • Solder paste 32 Sn alloy
  • Example 2 The protective element 2 according to the second embodiment was produced in the same manner as in the first embodiment except that the heating element drawer upper surface electrode 14d was formed instead of forming the heating element drawer upper surface electrode 14a and the conductive member 15. The obtained protective element 2 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • Example 3 The protective element 3 according to the third embodiment was manufactured using the same material as in Example 1. The obtained protective element 3 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • FIG. 12 shows a cross-sectional view of the protective element produced in Comparative Example 1.
  • the protective element 4 produced in Comparative Example 1 is different from the protective element 1 produced in Example 1 in the following points. Without forming the first insulating member 17a on the upper surface of the first upper surface electrode 11a and forming the second insulating member 17b on the upper surface of the second upper surface electrode 12a, the conductive member 15 surrounds the heating element extraction upper surface electrode 14a. Covered. The width of the conductive member 15 was the same as that of the protective element 1 of the first embodiment.
  • the position of the first upper surface electrode 11a was shifted outward by 0.5 mm so that the width Wa of the space 19a between the conductive member 15 and the first upper surface electrode 11a was 0.25 mm.
  • the position of the second upper surface electrode 12a was shifted outward by 0.5 mm so that the width Wa of the space 19b between the conductive member 15 and the second upper surface electrode 12a was 0.25 mm.
  • the total width (Wa + Wb) of the space 19a and the space 19b is 0.5 mm, which is the same as that of the protective element 1, but the width of the fuse element 30 is 3 mm, which is 1 mm wider than that of the protective element 1.
  • the obtained protective element 4 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
  • the protective elements 1 to 3 of Examples 1 to 3 had a smaller resistance value between the first electrode 11 and the second electrode 12 than the protective element 4 of Comparative Example 1. It is considered that this is because the width of the fuse element 30 is narrow and the distance between the first electrode 11 and the second electrode 12 is shortened.
  • the protection element 2 of Example 2 in which the heating element extraction upper surface electrode 14d is formed is when a current is passed through the third electrode 13.
  • the fusing time was shorter than that of the protective element 1 of Example 1, and the fusing speed was higher.
  • the protective element 3 of the third embodiment in which the heating element 20 is arranged on the upper surface 10a side of the insulating substrate 10 has a shorter fusing time when a current is passed through the third electrode 13 as compared with the protective element 2 of the second embodiment. , The fusing speed has become even faster.

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Abstract

A protective element provided with an insulating substrate, a first electrode and a second electrode disposed face-to-face on one surface of the insulating substrate, a heat-generating body disposed on the one surface of the insulating substrate, a third electrode connected to one end of the heat-generating body, a heat-generating body lead-out electrode connected to the opposite end of the heat-generating body from the one end, and a fuse element, one of the facing ends of which is connected to the first electrode, the other end of which is connected to the second electrode, and a middle part of which between the one end and the other end is in contact with the heat-generating body lead-out electrode, wherein a side surface of the first electrode facing the second electrode and at least a portion of a top surface connecting to said side surface are covered with a first insulating member, and a side surface of the second electrode facing the first electrode and at least a portion of a top surface connecting to said side surface are covered with a second insulating member.

Description

保護素子Protective element
　本発明は、保護素子に関する。
　本願は、２０１９年９月４日に、日本に出願された特願２０１９－１６１１７８号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a protective element.
The present application claims priority based on Japanese Patent Application No. 2019-161178 filed in Japan on September 4, 2019, the contents of which are incorporated herein by reference.
　回路基板には、一般に保護素子が備えられている。保護素子は、電流経路に定格を超える過電流が発生したときなどの異常時に、電流経路を遮断する。保護素子としては、例えば、絶縁基板と、絶縁基板の一方の表面上に、互いに対向するように設けられた第１電極および第２電極と、絶縁基板の一方の表面上に設けられた発熱体と、発熱体の一方の端部に接続する第３電極と、発熱体の第３電極と接続している端部とは反対側の端部に接続する発熱体引出電極と、互いに対向する一方の端部が第１電極と接続し、他方の端部が第２電極と接続し、その端部間の中央部が発熱体引出電極に接続するヒューズエレメントとを備える構成のものが知られている（特許文献１を参照）。この構成の保護素子では、第１電極と発熱体引出電極との間および第２電極と発熱体引出電極との間は空間とされている。このため、ヒューズエレメントを熱によって溶融させることにより、ヒューズエレメントは、第１電極と発熱体引出電極との空間の上もしくは第２電極と発熱体引出電極との空間の上で溶断する。 The circuit board is generally equipped with a protective element. The protective element cuts off the current path in the event of an abnormality such as when an overcurrent exceeding the rating occurs in the current path. Examples of the protective element include an insulating substrate, a first electrode and a second electrode provided on one surface of the insulating substrate so as to face each other, and a heating element provided on one surface of the insulating substrate. And the third electrode connected to one end of the heating element and the heating element extraction electrode connected to the end opposite to the end connected to the third electrode of the heating element, while facing each other. Is known to have a fuse element in which one end of the is connected to the first electrode, the other end is connected to the second electrode, and the central portion between the ends is connected to the heating element extraction electrode. (See Patent Document 1). In the protective element having this configuration, there is a space between the first electrode and the heating element extraction electrode and between the second electrode and the heating element extraction electrode. Therefore, by melting the fuse element by heat, the fuse element is blown on the space between the first electrode and the heating element extraction electrode or on the space between the second electrode and the heating element extraction electrode.
　上記の保護素子は、第１電極と第２電極との間に過電流が流れると、ヒューズエレメントにてジュール熱が発生する。この熱によってヒューズエレメントが溶融して溶断することにより、回路基板の電流経路が遮断される。また、回路基板に過電流以外の異常が発生したときには、第３電極に電流が流れることにより、発熱体が発熱する。その熱が、発熱体引出電極を介してヒューズエレメントに伝わって、ヒューズエレメントが溶融して溶断する。このことによって、回路基板の電流経路が遮断される。 In the above protection element, when an overcurrent flows between the first electrode and the second electrode, Joule heat is generated in the fuse element. This heat melts and blows the fuse element, interrupting the current path of the circuit board. Further, when an abnormality other than an overcurrent occurs in the circuit board, a current flows through the third electrode, causing the heating element to generate heat. The heat is transferred to the fuse element via the heating element extraction electrode, and the fuse element melts and blows. This cuts off the current path of the circuit board.
特開２０１７－１７４５９２号公報JP-A-2017-174592
　近年の電子機器の高電力化や小型化に伴って、保護素子についてはさらなる低抵抗化と小型化が望まれている。保護素子の低抵抗化のために、ヒューズエレメントの断面積を大きくすることが考えられる。しかしながら、この場合、溶融したヒューズエレメントを保持するためのスペースを確保する必要が生じるため、保護素子を小型化するのが難しい。
　また、保護素子の低抵抗化と小型化のために、第１電極と発熱体引出電極との間および第２電極と発熱体引出電極との間を狭くして、ヒューズエレメントの幅を短くすることが考えられる。しかしながら、この場合、第１電極と発熱体引出電極の間もしくは第２電極と発熱体引出電極の間で内部短絡が起こりやすくなる。 With the recent increase in power consumption and miniaturization of electronic devices, further reduction in resistance and miniaturization of protective elements are desired. In order to reduce the resistance of the protective element, it is conceivable to increase the cross-sectional area of the fuse element. However, in this case, it is difficult to miniaturize the protective element because it is necessary to secure a space for holding the molten fuse element.
Further, in order to reduce the resistance and size of the protective element, the width between the first electrode and the heating element extraction electrode and the space between the second electrode and the heating element extraction electrode are narrowed to shorten the width of the fuse element. Is possible. However, in this case, an internal short circuit is likely to occur between the first electrode and the heating element extraction electrode or between the second electrode and the heating element extraction electrode.
　本発明は、上記の事情に鑑みてなされたものであり、その目的は、低抵抗化と小型化が容易な構造で、かつ内部短絡が起こりにくい保護素子を提供することにある。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a protective element having a structure that can be easily reduced in resistance and miniaturization and that is less likely to cause an internal short circuit.
　本発明は、上記課題を解決するため、以下の手段を提供する。 The present invention provides the following means for solving the above problems.
（１）本発明の一態様に係る保護素子は、絶縁基板と、前記絶縁基板の一方の表面上に、互いに対向するように設けられた第１電極および第２電極と、前記絶縁基板の一方の表面上に設けられた発熱体と、前記発熱体の一方の端部に接続する第３電極と、前記発熱体の前記一方の端部とは反対側の端部に接続する発熱体引出電極と、互いに対向する一方の端部が前記第１電極と接続し、他方の端部が前記第２電極と接続し、前記一方の端部と前記他方の端部との間の中央部が前記発熱体引出電極に接するヒューズエレメントと、を備え、前記第１電極は、前記第２電極に対向する側面と、その側面に接続する上面の少なくとも一部が第１絶縁部材で被覆され、前記第２電極は、前記第１電極に対向する側面と、その側面に接続する上面の少なくとも一部が第２絶縁部材で被覆されている。 (1) The protective element according to one aspect of the present invention includes an insulating substrate, a first electrode and a second electrode provided on one surface of the insulating substrate so as to face each other, and one of the insulating substrates. A heating element provided on the surface of the heating element, a third electrode connected to one end of the heating element, and a heating element extraction electrode connected to an end of the heating element opposite to the one end. And one end facing each other is connected to the first electrode, the other end is connected to the second electrode, and the central portion between the one end and the other end is said. A fuse element in contact with a heating element extraction electrode is provided, and the first electrode is provided with a side surface facing the second electrode and at least a part of an upper surface connected to the side surface covered with a first insulating member. The two electrodes have a side surface facing the first electrode and at least a part of an upper surface connected to the side surface covered with a second insulating member.
（２）上記（１）に記載の態様において、前記発熱体引出電極が、第１絶縁部材および第２絶縁部材の上面にまで延長されている構成としてもよい。 (2) In the embodiment described in (1) above, the heating element extraction electrode may be extended to the upper surfaces of the first insulating member and the second insulating member.
　本発明によれば、低抵抗化と小型化が容易な構造で、かつ内部短絡が起こりにくい保護素子を提供することが可能となる。 According to the present invention, it is possible to provide a protective element having a structure that can be easily reduced in resistance and miniaturization and that is less likely to cause an internal short circuit.
本発明の第１実施形態に係る保護素子の上面図である。It is a top view of the protection element which concerns on 1st Embodiment of this invention. 本発明の第１実施形態に係る保護素子の下面図である。It is a bottom view of the protection element which concerns on 1st Embodiment of this invention. 図１のIII－III’線横断面図である。FIG. 1 is a cross-sectional view taken along the line III-III'of FIG. 図１のIV－IV’線縦断面図である。FIG. 1 is a vertical cross-sectional view taken along the line IV-IV'of FIG. 第１実施形態の保護素子が作動して、ヒューズエレメントが溶融した状態を示す横断面図である。It is a cross-sectional view which shows the state which the protection element of 1st Embodiment operates and the fuse element is melted. 本発明の第２実施形態に係る保護素子の横断面図である。It is sectional drawing of the protection element which concerns on 2nd Embodiment of this invention. 本発明の第２実施形態に係る保護素子の縦断面図である。It is a vertical sectional view of the protection element which concerns on 2nd Embodiment of this invention. 本発明の第３実施形態に係る保護素子の上面図である。It is a top view of the protection element which concerns on 3rd Embodiment of this invention. 本発明の第３実施形態に係る保護素子の下面図である。It is a bottom view of the protection element which concerns on 3rd Embodiment of this invention. 図９のＸ－Ｘ’線横断面図である。9 is a cross-sectional view taken along the line XX'of FIG. 図９のXI－XI’線縦断面図である。9 is a vertical cross-sectional view taken along the line XI-XI'in FIG. 比較例１で作製した保護素子の横断面図である。It is a cross-sectional view of the protection element produced in Comparative Example 1.
　以下、本発明の実施形態について、図面を参照して詳細に説明する。以下の説明で用いる図面は、特徴をわかりやすくするために便宜上特徴となる部分を拡大して示している場合がある。図面の各構成要素の寸法比率などは、実際とは異なっていることがある。以下の説明において例示される材料、寸法等は一例であって、本発明はそれらに限定されるものではなく、本発明の効果を奏する範囲で適宜変更して実施可能である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings used in the following description, the feature portion may be enlarged for convenience in order to make the feature easy to understand. The dimensional ratio of each component in the drawing may differ from the actual one. The materials, dimensions, etc. exemplified in the following description are examples, and the present invention is not limited thereto, and can be appropriately modified and carried out within the range in which the effects of the present invention are exhibited.
［第１実施形態］
　本発明の第１実施形態に係る保護素子の構成を図１～図４に示す。図１は、保護素子の上面図（平面図）である。図２は保護素子の下面図（底面図）である。図３は図１のIII－III’線横断面図である。図４は図１のIV－IV’線縦断面図である。 [First Embodiment]
The configuration of the protective element according to the first embodiment of the present invention is shown in FIGS. 1 to 4. FIG. 1 is a top view (plan view) of the protective element. FIG. 2 is a bottom view (bottom view) of the protective element. FIG. 3 is a cross-sectional view taken along the line III-III'of FIG. FIG. 4 is a vertical cross-sectional view taken along the line IV-IV'of FIG.
　第１実施形態に係る保護素子１は、絶縁基板１０と、絶縁基板１０の上面１０ａの上に、互いに対向するように設けられた第１電極１１（第１上面電極１１ａ）および第２電極１２（第２上面電極１２ａ）と、絶縁基板１０の下面１０ｂの上に設けられた発熱体２０と、発熱体２０の一方の端部に接続する第３電極１３と、発熱体２０の一方の端部とは反対側の端部に接続する発熱体引出電極１４と、第１電極１１、第２電極１２および発熱体引出電極１４と接続するヒューズエレメント３０と、を備える。ヒューズエレメント３０の互いに対向する一方の端部３０ａには第１電極１１が第１端子１８ａを介して接続している。他方の端部３０ｂには第２電極１２が第２端子１８ｂを介して接続している。そして、ヒューズエレメント３０の端部３０ａと端部３０ｂとの間の中央部３０ｃには、発熱体引出電極１４が導電部材１５を介して接続している。第１端子１８ａとヒューズエレメント３０、第２端子１８ｂとヒューズエレメント３０、そして導電部材１５とヒューズエレメント３０は、それぞれはんだペースト３２により接着している。 The protective element 1 according to the first embodiment includes an insulating substrate 10, a first electrode 11 (first upper surface electrode 11a) and a second electrode 12 provided on the upper surface 10a of the insulating substrate 10 so as to face each other. (Second upper surface electrode 12a), a heating element 20 provided on the lower surface 10b of the insulating substrate 10, a third electrode 13 connected to one end of the heating element 20, and one end of the heating element 20. A heating element extraction electrode 14 connected to an end portion on the opposite side to the portion, and a fuse element 30 connected to the first electrode 11, the second electrode 12, and the heating element extraction electrode 14 are provided. A first electrode 11 is connected to one end 30a of the fuse element 30 facing each other via a first terminal 18a. A second electrode 12 is connected to the other end portion 30b via a second terminal 18b. A heating element extraction electrode 14 is connected to the central portion 30c between the end portions 30a and the end portion 30b of the fuse element 30 via a conductive member 15. The first terminal 18a and the fuse element 30, the second terminal 18b and the fuse element 30, and the conductive member 15 and the fuse element 30 are adhered to each other by the solder paste 32.
　絶縁基板１０としては、絶縁性を有する材質のものであれば特に制限されず、例えば、セラミックス基板やガラスエポキシ基板のようなプリント配線基板に用いられる基板の他、ガラス基板、樹脂基板、絶縁処理金属基板等を用いることができる。なお、これらの中では、耐熱性と熱伝導性とに優れた絶縁基板であるセラミックス基板が好適である。 The insulating substrate 10 is not particularly limited as long as it is made of a material having insulating properties. For example, in addition to a substrate used for a printed wiring board such as a ceramics substrate or a glass epoxy substrate, a glass substrate, a resin substrate, and an insulating treatment. A metal substrate or the like can be used. Among these, a ceramic substrate, which is an insulating substrate having excellent heat resistance and thermal conductivity, is preferable.
　第１電極１１は、第１上面電極１１ａと、第１下面電極１１ｂと、第１導通部１１ｃとからなる。第１上面電極１１ａは、絶縁基板１０の上面１０ａの上に形成されている。第１上面電極１１ａは、第２上面電極１２ａに対向する側面と、その側面に接続する上面の少なくとも一部が第１絶縁部材１７ａで被覆されている。第１上面電極１１ａの第１絶縁部材１７ａで被覆されていない部分は、第１端子１８ａで被覆されている。第１下面電極１１ｂは、絶縁基板１０の下面１０ｂの上に形成されている。第１下面電極１１ｂは、回路基板の配線に接続される。第１導通部１１ｃは、絶縁基板１０を貫通して、第１上面電極１１ａと第１下面電極１１ｂとを電気的に接続している。 The first electrode 11 includes a first upper surface electrode 11a, a first lower surface electrode 11b, and a first conductive portion 11c. The first upper surface electrode 11a is formed on the upper surface 10a of the insulating substrate 10. The first upper surface electrode 11a has a side surface facing the second upper surface electrode 12a and at least a part of the upper surface connected to the side surface is covered with the first insulating member 17a. The portion of the first upper surface electrode 11a that is not covered with the first insulating member 17a is covered with the first terminal 18a. The first lower surface electrode 11b is formed on the lower surface 10b of the insulating substrate 10. The first lower surface electrode 11b is connected to the wiring of the circuit board. The first conductive portion 11c penetrates the insulating substrate 10 and electrically connects the first upper surface electrode 11a and the first lower surface electrode 11b.
　第２電極１２は、第２上面電極１２ａと、第２下面電極１２ｂと、第２導通部１２ｃとからなる。第２上面電極１２ａは、絶縁基板１０の上面１０ａの上に形成されている。第２上面電極１２ａは、第１上面電極１１ａに対向する側面と、その側面に接続する上面の少なくとも一部が第２絶縁部材１７ｂで被覆されている。第２上面電極１２ａの第２絶縁部材１７ｂで被覆されていない部分は、第２端子１８ｂで被覆されている。第２下面電極１２ｂは、絶縁基板１０の下面１０ｂの上に形成されている。第２下面電極１２ｂは、回路基板の配線に接続される。第２導通部１２ｃは、絶縁基板１０を貫通して、第２上面電極１２ａと第２下面電極１２ｂとを電気的に接続している。 The second electrode 12 includes a second upper surface electrode 12a, a second lower surface electrode 12b, and a second conductive portion 12c. The second upper surface electrode 12a is formed on the upper surface 10a of the insulating substrate 10. The side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and at least a part of the upper surface connected to the side surface are covered with the second insulating member 17b. The portion of the second upper surface electrode 12a that is not covered with the second insulating member 17b is covered with the second terminal 18b. The second lower surface electrode 12b is formed on the lower surface 10b of the insulating substrate 10. The second bottom electrode 12b is connected to the wiring of the circuit board. The second conductive portion 12c penetrates the insulating substrate 10 and electrically connects the second upper surface electrode 12a and the second lower surface electrode 12b.
　第３電極１３は、発熱体２０の一方の端部に接続している。第３電極１３は、一部が断熱部材２１で被覆されている。第３電極１３の断熱部材２１で被覆されていない部分は、回路基板のスイッチング素子に接続される。スイッチング素子は、回路基板に過電流以外の異常が発生したときに作動して、第３電極１３に電流を供給する。 The third electrode 13 is connected to one end of the heating element 20. The third electrode 13 is partially covered with a heat insulating member 21. The portion of the third electrode 13 that is not covered with the heat insulating member 21 is connected to the switching element of the circuit board. The switching element operates when an abnormality other than an overcurrent occurs in the circuit board to supply a current to the third electrode 13.
　第１電極１１、第２電極１２および第３電極１３を構成する材料としては、Ａｇ、Ｃｕ等の金属材料を用いることができる。第１電極１１、第２電極１２および第３電極１３は、表面がＡｇ、Ａｇ－Ｐｔ、Ａｇ－Ｐｄ、Ａｕ、Ｎｉ－Ａｕ等の金属あるいは合金で被覆されていてもよい。 As a material constituting the first electrode 11, the second electrode 12, and the third electrode 13, metal materials such as Ag and Cu can be used. The surfaces of the first electrode 11, the second electrode 12, and the third electrode 13 may be coated with a metal or alloy such as Ag, Ag-Pt, Ag-Pd, Au, or Ni-Au.
　発熱体２０は、第３電極１３と比較して相対的に抵抗が高い。発熱体２０は、通電により発熱し易い高抵抗導電性材料から形成されている。発熱体２０を構成する材料としては、酸化ルテニウムやカーボンブラックを用いることができる。 The heating element 20 has a relatively high resistance as compared with the third electrode 13. The heating element 20 is formed of a high resistance conductive material that easily generates heat when energized. As a material constituting the heating element 20, ruthenium oxide or carbon black can be used.
　発熱体２０は、断熱部材２１で被覆されている。断熱部材２１の材料としては、例えば、セラミックス、ガラスなどの絶縁材料を用いることができる。 The heating element 20 is covered with a heat insulating member 21. As the material of the heat insulating member 21, for example, an insulating material such as ceramics or glass can be used.
　発熱体引出電極１４は、発熱体引出上面電極１４ａと、発熱体引出下面電極１４ｂと、発熱体引出電極導通部１４ｃとからなる。発熱体引出上面電極１４ａは、絶縁基板１０の上面１０ａの上に形成されている。発熱体引出上面電極１４ａの上面の上には、導電部材１５が積層されている。発熱体引出下面電極１４ｂは、絶縁基板１０の下面１０ｂの上に形成され、発熱体２０と接続している。発熱体引出電極導通部１４ｃは、絶縁基板１０を貫通して、発熱体引出上面電極１４ａと発熱体引出下面電極１４ｂとを電気的に接続している。 The heating element extraction electrode 14 includes a heating element extraction upper surface electrode 14a, a heating element extraction lower surface electrode 14b, and a heating element extraction electrode conduction portion 14c. The heating element extraction upper surface electrode 14a is formed on the upper surface 10a of the insulating substrate 10. A conductive member 15 is laminated on the upper surface of the heating element extraction upper surface electrode 14a. The heating element extraction lower surface electrode 14b is formed on the lower surface 10b of the insulating substrate 10 and is connected to the heating element 20. The heating element extraction electrode conduction portion 14c penetrates the insulating substrate 10 and electrically connects the heating element extraction upper surface electrode 14a and the heating element extraction lower surface electrode 14b.
　発熱体引出電極１４および導電部材１５は、熱伝導性と導電性が高いことが好ましい。発熱体引出電極１４および導電部材１５を構成する材料としてはＡｇ、Ｃｕ等の金属材料を用いることができる。発熱体引出電極１４および導電部材１５は、表面がＡｇ、Ａｇ－Ｐｔ、Ａｇ－Ｐｄ、Ａｕ、Ｎｉ－Ａｕ等の金属あるいは合金で被覆されていてもよい。 It is preferable that the heating element extraction electrode 14 and the conductive member 15 have high thermal conductivity and conductivity. As a material constituting the heating element extraction electrode 14 and the conductive member 15, a metal material such as Ag or Cu can be used. The surface of the heating element extraction electrode 14 and the conductive member 15 may be coated with a metal or alloy such as Ag, Ag-Pt, Ag-Pd, Au, or Ni-Au.
　発熱体引出上面電極１４ａと第１端子１８ａとの間には空間１９ａが形成されている。また、発熱体引出上面電極１４ａと第２端子１８ｂとの間には空間１９ｂが形成されている。空間１９ａの下方の第１上面電極１１ａは第１絶縁部材１７ａで被覆されている。空間１９ｂの下方の第２上面電極１２ａは第２絶縁部材１７ｂで被覆されている。このため、発熱体引出上面電極１４ａを、第１絶縁部材１７ａの上面にまで、特に第１絶縁部材１７ａを介して発熱体引出上面電極１４ａと第１上面電極１１ａと重なる位置にまで延長していても内部短絡が起こりにくい。同様に、発熱体引出上面電極１４ａを、第２絶縁部材１７ｂの上面にまで、特に第２絶縁部材１７ｂを介して発熱体引出上面電極１４ａと第１上面電極１１ａとが重なる位置にまで延長していても内部短絡が起こりにくい。よって、空間１９ａおよび空間１９ｂの幅を狭くすることができる。空間１９ａの幅Ｗａと空間１９ｂの幅Ｗｂは、それぞれ０．０２ｍｍ以上１．０ｍｍ以下の範囲内にあることが好ましい。 A space 19a is formed between the heating element drawer upper surface electrode 14a and the first terminal 18a. Further, a space 19b is formed between the heating element extraction upper surface electrode 14a and the second terminal 18b. The first upper surface electrode 11a below the space 19a is covered with the first insulating member 17a. The second upper surface electrode 12a below the space 19b is covered with a second insulating member 17b. Therefore, the heating element extraction upper surface electrode 14a is extended to the upper surface of the first insulating member 17a, particularly to a position where the heating element extraction upper surface electrode 14a and the first upper surface electrode 11a overlap with each other via the first insulating member 17a. However, internal short circuits are unlikely to occur. Similarly, the heating element extraction upper surface electrode 14a is extended to the upper surface of the second insulating member 17b, particularly to a position where the heating element extraction upper surface electrode 14a and the first upper surface electrode 11a overlap via the second insulating member 17b. Even if it is, internal short circuit is unlikely to occur. Therefore, the widths of the space 19a and the space 19b can be narrowed. The width Wa of the space 19a and the width Wb of the space 19b are preferably in the range of 0.02 mm or more and 1.0 mm or less, respectively.
　ヒューズエレメント３０は熱によって溶断可能であれば、構成や材料は特に制限はない。ヒューズエレメント３０は、金属単体であってもよい。ヒューズエレメント３０は、外側を相対的に融点が高い高融点金属層とし、内側を相対的に融点が低い低融点金属層とした積層体であってもよい。
　ヒューズエレメント３０が金属単体である場合、その材料としてはＩｎ、Ｐｂ、Ａｇ、Ｃｕ又はこれらのうちのいずれかを主成分とする合金を用いることができる。積層体の場合、低融点金属層は、融点が、保護素子１を実装する際に行なわれるリフロー時の加熱温度（通常は、約２２０℃）以上で、２８０℃以下の範囲内にあることが好ましい。低融点金属層の材料は、錫もしくは錫を主成分とする錫合金であることが好ましい。錫合金の錫の含有量は４０質量％以上であることが好ましく、６０質量％以上であることがより好ましい。錫合金の例としては、Ｓｎ－Ｂｉ合金、Ｉｎ－Ｓｎ合金、Ｓｎ－Ａｇ－Ｃｕ合金を挙げることができる。高融点金属層は、低融点金属層の溶融物に溶解される金属材料からなる層である。低融点金属層の材料が錫もしくは錫合金である場合、高融点金属層の材料は、銀もしくは銀を主成分とする合金であることが好ましい。銀合金の銀の含有量は４０質量％以上であることが好ましく、６０質量％以上であることがより好ましい。銀合金の例としては、Ａｇ－Ｐｄ合金を挙げることができる。 As long as the fuse element 30 can be blown by heat, the structure and material are not particularly limited. The fuse element 30 may be a single metal. The fuse element 30 may be a laminated body having a high melting point metal layer having a relatively high melting point on the outside and a low melting point metal layer having a relatively low melting point on the inside.
When the fuse element 30 is a simple substance of metal, an alloy containing In, Pb, Ag, Cu or any of these as a main component can be used as the material thereof. In the case of the laminated body, the melting point of the low melting point metal layer may be in the range of 280 ° C. or lower at the heating temperature (usually about 220 ° C.) or more at the time of reflow performed when the protective element 1 is mounted. preferable. The material of the low melting point metal layer is preferably tin or a tin alloy containing tin as a main component. The tin content of the tin alloy is preferably 40% by mass or more, more preferably 60% by mass or more. Examples of tin alloys include Sn—Bi alloys, In—Sn alloys, and Sn—Ag—Cu alloys. The high melting point metal layer is a layer made of a metal material that is dissolved in a melt of the low melting point metal layer. When the material of the low melting point metal layer is tin or a tin alloy, the material of the high melting point metal layer is preferably silver or an alloy containing silver as a main component. The silver content of the silver alloy is preferably 40% by mass or more, more preferably 60% by mass or more. Examples of silver alloys include Ag—Pd alloys.
　図５は、第１実施形態の保護素子が作動して、ヒューズエレメントが溶融した状態を示す横断面図である。図５の横断面図は、図３のIII－III’線横断面図と同位置の横断面図である。
　回路基板の配線に過電流が流れると、保護素子１の第１電極１１と第１端子１８ａおよび第２電極１２と第２端子１８ｂを介してヒューズエレメント３０に過電流が流れる。ヒューズエレメント３０に過電流が流れると、ヒューズエレメント３０にてジュール熱が発生する。この熱によってヒューズエレメント３０が溶融して溶断することにより、回路基板の電流経路が遮断される。また、回路基板に過電流以外の異常が発生したときには、第３電極１３に電流が流れることによって、発熱体２０が発熱する。その熱が、発熱体引出電極１４を介してヒューズエレメント３０に伝わって、ヒューズエレメント３０が溶融して溶断することにより、回路基板の電流経路が遮断される。溶融した後のヒューズエレメント溶融固化物３１は、はんだペースト３２の上に保持される。 FIG. 5 is a cross-sectional view showing a state in which the protection element of the first embodiment is activated and the fuse element is melted. The cross-sectional view of FIG. 5 is a cross-sectional view at the same position as the cross-sectional view of the line III-III'of FIG.
When an overcurrent flows through the wiring of the circuit board, an overcurrent flows through the fuse element 30 via the first electrode 11 and the first terminal 18a of the protection element 1 and the second electrode 12 and the second terminal 18b. When an overcurrent flows through the fuse element 30, Joule heat is generated at the fuse element 30. The heat causes the fuse element 30 to melt and blow, thereby interrupting the current path of the circuit board. Further, when an abnormality other than an overcurrent occurs in the circuit board, the heating element 20 generates heat due to the current flowing through the third electrode 13. The heat is transferred to the fuse element 30 via the heating element extraction electrode 14, and the fuse element 30 melts and blows, thereby interrupting the current path of the circuit board. The fused solidified fuse element 31 after melting is held on the solder paste 32.
　次に、保護素子１の製造方法を説明する。
　保護素子１は、例えば、次のようにして製造することができる。 Next, a method of manufacturing the protective element 1 will be described.
The protective element 1 can be manufactured, for example, as follows.
　先ず、始めに、絶縁基板１０を用意する。
　用意した絶縁基板１０に、第１電極１１の第１導通部１１ｃと、第２電極１２の第２導通部１２ｃと、発熱体引出電極導通部１４ｃを形成する。 First, the insulating substrate 10 is prepared.
The first conductive portion 11c of the first electrode 11, the second conductive portion 12c of the second electrode 12, and the heating element lead-out electrode conductive portion 14c are formed on the prepared insulating substrate 10.
　次に、絶縁基板１０の上面１０ａの第１導通部１１ｃの周囲に第１上面電極１１ａを、第２導通部１２ｃの周囲に第２上面電極１２ａをそれぞれ形成する。さらに、第１上面電極１１ａと第２上面電極１２ａとの間に発熱体引出上面電極１４ａを形成する。また、絶縁基板１０の下面１０ｂの第１導通部１１ｃの周囲に第１下面電極１１ｂを、第２導通部１２ｃの周囲に第２下面電極１２ｂをそれぞれ形成する。さらに、絶縁基板１０の下面１０ｂの発熱体引出電極導通部１４ｃの周囲に発熱体引出下面電極１４ｂを形成する。発熱体引出下面電極１４ｂとは対向する位置に第３電極１３を形成する。 Next, the first upper surface electrode 11a is formed around the first conductive portion 11c of the upper surface 10a of the insulating substrate 10, and the second upper surface electrode 12a is formed around the second conductive portion 12c. Further, a heating element extraction upper surface electrode 14a is formed between the first upper surface electrode 11a and the second upper surface electrode 12a. Further, a first lower surface electrode 11b is formed around the first conductive portion 11c of the lower surface 10b of the insulating substrate 10, and a second lower surface electrode 12b is formed around the second conductive portion 12c. Further, a heating element extraction lower surface electrode 14b is formed around the heating element extraction electrode conduction portion 14c on the lower surface 10b of the insulating substrate 10. The third electrode 13 is formed at a position facing the lower electrode 14b of the heating element drawer.
　これらの電極は、例えば、印刷法、めっき法、蒸着法、スパッタ法など電極の形成方法として利用されている公知の方法によって形成できる。印刷法は、電極形成用の金属あるいは合金のペーストを所望のパターンで印刷し、必要に応じて焼成する方法である。 These electrodes can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method. The printing method is a method in which a metal or alloy paste for forming an electrode is printed in a desired pattern and fired if necessary.
　次に、絶縁基板１０の下面１０ｂの上に発熱体２０を形成する。発熱体２０は、一方の端部が第３電極１３に接続し、他方の端部が発熱体引出下面電極１４ｂと接続するように形成する。次いで、発熱体２０を断熱部材２１で被覆する。 Next, the heating element 20 is formed on the lower surface 10b of the insulating substrate 10. The heating element 20 is formed so that one end is connected to the third electrode 13 and the other end is connected to the heating element drawer lower surface electrode 14b. Next, the heating element 20 is covered with the heat insulating member 21.
　発熱体２０は、例えば、高抵抗導電材料とバインダとを含む高抵抗導電性ペーストを塗布し、必要に応じて焼成することによって形成できる。バインダとしては、水ガラス等の無機系バインダや熱硬化性樹脂等の有機系バインダを用いることができる。また、発熱体２０は、めっき法、蒸着法、スパッタ法などの導電膜の形成方法として利用されている公知の方法によって形成できる。さらに、発熱体２０の形成方法として、上記の方法によって得られた高抵抗導電膜を貼付や積層する方法を用いてもよい。 The heating element 20 can be formed, for example, by applying a high resistance conductive paste containing a high resistance conductive material and a binder and firing it if necessary. As the binder, an inorganic binder such as water glass or an organic binder such as a thermosetting resin can be used. Further, the heating element 20 can be formed by a known method used as a method for forming a conductive film such as a plating method, a vapor deposition method, and a sputtering method. Further, as a method for forming the heating element 20, a method of attaching or laminating a high resistance conductive film obtained by the above method may be used.
　断熱部材２１は、例えば、印刷法、めっき法、蒸着法、スパッタ法など電極の形成方法として利用されている公知の方法によって形成できる。印刷法は、断熱部材のペーストを所望のパターンで印刷し、必要に応じて焼成する方法である。 The heat insulating member 21 can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method. The printing method is a method in which the paste of the heat insulating member is printed in a desired pattern and fired if necessary.
　次に、第１上面電極１１ａの第２上面電極１２ａに対向する側面と、その側面に接続する上面の一部に第１絶縁部材１７ａを形成する。第１上面電極１１ａの第１絶縁部材１７ａが形成されていない部分に第１端子１８ａを形成する。同様に、第２上面電極１２ａの第１上面電極１１ａに対向する側面と、その側面に接続する上面の一部に第２絶縁部材１７ｂを形成する。第２上面電極１２ａの第２絶縁部材１７ｂが形成されていない部分に第２端子１８ｂを形成する。なお、第１絶縁部材１７ａと第１端子１８ａおよび第２絶縁部材１７ｂと第２端子１８ｂの形成順序は、特に制限はない。第１端子１８ａと第２端子１８ｂを、第１絶縁部材１７ａと第２絶縁部材１７ｂよりも先に形成してもよい。 Next, the first insulating member 17a is formed on the side surface of the first upper surface electrode 11a facing the second upper surface electrode 12a and a part of the upper surface connected to the side surface. The first terminal 18a is formed in a portion of the first upper surface electrode 11a where the first insulating member 17a is not formed. Similarly, the second insulating member 17b is formed on the side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and a part of the upper surface connected to the side surface. The second terminal 18b is formed in the portion of the second upper surface electrode 12a where the second insulating member 17b is not formed. The order of forming the first insulating member 17a and the first terminal 18a and the second insulating member 17b and the second terminal 18b is not particularly limited. The first terminal 18a and the second terminal 18b may be formed before the first insulating member 17a and the second insulating member 17b.
　第１絶縁部材１７ａおよび第２絶縁部材１７ｂは、例えば、印刷法によって形成できる。印刷法は、絶縁材料のペーストを所望のパターンで印刷し、必要に応じて焼成する方法である。 The first insulating member 17a and the second insulating member 17b can be formed by, for example, a printing method. The printing method is a method in which a paste of an insulating material is printed in a desired pattern and fired if necessary.
　第１端子１８ａおよび第２端子１８ｂは、例えば、印刷法、めっき法、蒸着法、スパッタ法など電極の形成方法として利用されている公知の方法によって形成できる。印刷法は、端子形成用の金属あるいは合金のペーストを所望のパターンで印刷し、必要に応じて焼成する方法である。 The first terminal 18a and the second terminal 18b can be formed by a known method used as an electrode forming method such as a printing method, a plating method, a vapor deposition method, or a sputtering method. The printing method is a method in which a metal or alloy paste for forming terminals is printed in a desired pattern and fired if necessary.
　次に、発熱体引出上面電極１４ａの上面に、導電部材１５を形成する。導電部材１５は、例えば、印刷法、めっき法、蒸着法、スパッタ法など電極の形成方法として利用されている公知の方法によって形成できる。 Next, the conductive member 15 is formed on the upper surface of the heating element drawer upper surface electrode 14a. The conductive member 15 can be formed by a known method used as an electrode forming method, such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
　そして、第１端子１８ａ、導電部材１５および第２端子１８ｂの上面に、ヒューズエレメント３０を積層する。ヒューズエレメント３０は、第１端子１８ａ、導電部材１５および第２端子１８ｂの上面に、はんだペースト３２を塗布し、次いで、はんだペースト３２の上にヒューズエレメント３０を配置することによって、積層できる。 Then, the fuse element 30 is laminated on the upper surfaces of the first terminal 18a, the conductive member 15, and the second terminal 18b. The fuse element 30 can be laminated by applying the solder paste 32 on the upper surfaces of the first terminal 18a, the conductive member 15 and the second terminal 18b, and then arranging the fuse element 30 on the solder paste 32.
　以上のような構成された本実施形態の保護素子１によれば、第１上面電極１１ａと第２上面電極１２ａがそれぞれ第１絶縁部材１７ａと第２絶縁部材１７ｂで被覆されているので、空間１９ａの幅Ｗａ並びに空間１９ｂの幅Ｗｂを狭くしても内部短絡が起こりにくい。このため、本実施形態の保護素子１は、小型化が容易になる。また、空間１９ａの幅Ｗａ並びに空間１９ｂの幅Ｗｂを狭くすることによって、ヒューズエレメント３０の幅を短くできるので、保護素子１の第１電極１１と第２電極１２との間の抵抗を低くできる。よって、本実施形態の保護素子１は、低抵抗化と小型化が容易で、かつ内部短絡が起こりにくい。 According to the protection element 1 of the present embodiment configured as described above, since the first upper surface electrode 11a and the second upper surface electrode 12a are covered with the first insulating member 17a and the second insulating member 17b, respectively, there is a space. Even if the width Wa of 19a and the width Wb of the space 19b are narrowed, an internal short circuit is unlikely to occur. Therefore, the protective element 1 of the present embodiment can be easily miniaturized. Further, by narrowing the width Wa of the space 19a and the width Wb of the space 19b, the width of the fuse element 30 can be shortened, so that the resistance between the first electrode 11 and the second electrode 12 of the protection element 1 can be lowered. .. Therefore, the protection element 1 of the present embodiment can be easily reduced in resistance and size, and an internal short circuit is unlikely to occur.
［第２実施形態］
　本発明の第２実施形態に係る保護素子の構成を図６～図７に示す。図６は、本発明の第２実施形態に係る保護素子の横断面図であり、図７は、保護素子の縦断面図である。図６の横断面図は、図３のIII－III’線横断面図に相当し、図７の縦断面図は、図４のIV-IV線縦断面図に相当する。 [Second Embodiment]
The configuration of the protective element according to the second embodiment of the present invention is shown in FIGS. 6 to 7. FIG. 6 is a cross-sectional view of the protective element according to the second embodiment of the present invention, and FIG. 7 is a vertical cross-sectional view of the protective element. The cross-sectional view of FIG. 6 corresponds to the cross-sectional view of line III-III'of FIG. 3, and the vertical cross-sectional view of FIG. 7 corresponds to the vertical cross-sectional view of line IV-IV of FIG.
　第２実施形態に係る保護素子２は、発熱体引出上面電極１４ｄが、第１実施形態に係る保護素子１の発熱体引出上面電極１４ａと導電部材１５とを一体とした形状とされていて、導電部材１５を介さずにヒューズエレメント３０と接続している。この点において、第２実施形態に係る保護素子２は、第１実施形態に係る保護素子１と相違する。なお、第２実施形態に係る保護素子２と第１実施形態に係る保護素子１とで共通する部分は、同一の符号を付して説明を省略する。 In the protection element 2 according to the second embodiment, the heating element extraction upper surface electrode 14d has a shape in which the heating element extraction upper surface electrode 14a and the conductive member 15 of the protection element 1 according to the first embodiment are integrated. It is connected to the fuse element 30 without passing through the conductive member 15. In this respect, the protective element 2 according to the second embodiment is different from the protective element 1 according to the first embodiment. The parts common to the protective element 2 according to the second embodiment and the protective element 1 according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
　保護素子２は、例えば、下記の点以外は、第１実施形態に係る保護素子１と同様にして製造できる。
　絶縁基板１０の上面１０ａに発熱体引出上面電極１４ａを形成しないこと。
　導電部材１５を形成する代わりに、絶縁基板１０の上面１０ａに発熱体引出上面電極１４ｄを形成すること。発熱体引出上面電極１４ｄは、例えば、印刷法、めっき法、蒸着法、スパッタ法など電極の形成方法として利用されている公知の方法によって形成できる。 The protective element 2 can be manufactured in the same manner as the protective element 1 according to the first embodiment, except for the following points.
Do not form the heating element drawer upper surface electrode 14a on the upper surface 10a of the insulating substrate 10.
Instead of forming the conductive member 15, the heating element extraction upper surface electrode 14d is formed on the upper surface 10a of the insulating substrate 10. The heating element extraction upper surface electrode 14d can be formed by a known method used as an electrode forming method such as a printing method, a plating method, a vapor deposition method, or a sputtering method.
　以上のような構成された本実施形態の保護素子２によれば、第１上面電極１１ａと第２上面電極１２ａがそれぞれ第１絶縁部材１７ａと第２絶縁部材１７ｂで被覆されているので、第１実施形態に係る保護素子１と同様に、低抵抗化と小型化が容易で、かつ内部短絡が起こりにくい。また、保護素子２は、発熱体引出上面電極１４ｄが導電部材１５を介さずにヒューズエレメント３０と接続しているので、発熱体２０で発熱した熱をより効率よくヒューズエレメント３０に伝熱させることができる。このため、保護素子２によれば、第３電極１３に電流が流れたときの溶断速度をより速くすることができる。 According to the protective element 2 of the present embodiment configured as described above, the first upper surface electrode 11a and the second upper surface electrode 12a are covered with the first insulating member 17a and the second insulating member 17b, respectively. Similar to the protection element 1 according to the first embodiment, it is easy to reduce the resistance and size, and it is difficult for an internal short circuit to occur. Further, in the protection element 2, since the heating element extraction upper surface electrode 14d is connected to the fuse element 30 without passing through the conductive member 15, the heat generated by the heating element 20 can be transferred to the fuse element 30 more efficiently. Can be done. Therefore, according to the protection element 2, the fusing speed when a current flows through the third electrode 13 can be further increased.
［第３実施形態］
　本発明の第３実施形態に係る保護素子の構成を図８～図１１に示す。図８は、保護素子の上面図（平面図）であり、図９は保護素子の下面図（底面図）である。図１０は図８のＸ－Ｘ’線横断面図であり、図１１は図８のXI－XI’線縦断面図である。なお、第３実施形態に係る保護素子３と第１実施形態に係る保護素子１とで共通する部分は、同一の符号を付して説明を省略する。 [Third Embodiment]
The configuration of the protective element according to the third embodiment of the present invention is shown in FIGS. 8 to 11. FIG. 8 is a top view (plan view) of the protective element, and FIG. 9 is a bottom view (bottom view) of the protective element. 10 is a cross-sectional view taken along the line XX'of FIG. 8, and FIG. 11 is a vertical cross-sectional view taken along the line XI-XI'of FIG. The parts common to the protective element 3 according to the third embodiment and the protective element 1 according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
　第３実施形態に係る保護素子３では、発熱体２０は、絶縁基板１０の上面１０ａの上に備えられている。発熱体２０は、断熱部材２１で被覆されている。断熱部材２１は、第１上面電極１１ａの第２上面電極１２ａに対向する側面およびその側面に接続する上面の一部と、第２上面電極１２ａの第１上面電極１１ａに対向する側面およびその側面に接続する上面の一部とを被覆している。すなわち、断熱部材２１は、第１上面電極１１ａと第２上面電極１２ａとを絶縁する絶縁部材としても機能している。 In the protective element 3 according to the third embodiment, the heating element 20 is provided on the upper surface 10a of the insulating substrate 10. The heating element 20 is covered with a heat insulating member 21. The heat insulating member 21 includes a side surface of the first upper surface electrode 11a facing the second upper surface electrode 12a and a part of the upper surface connected to the side surface, and a side surface of the second upper surface electrode 12a facing the first upper surface electrode 11a and its side surface. It covers a part of the upper surface connected to. That is, the heat insulating member 21 also functions as an insulating member that insulates the first upper surface electrode 11a and the second upper surface electrode 12a.
　発熱体２０の一方の端部は第３電極１３に接続している。第３電極１３は、第３上面電極１３ａと、第３下面電極１３ｂと、第３導通部１３ｃとからなる。第３上面電極１３ａは、絶縁基板１０の上面１０ａの上に形成されている。第３上面電極１３ａは、発熱体２０の一方の端部に接続している。第３下面電極１３ｂは、絶縁基板１０の下面１０ｂの上に形成されている。第３下面電極１３ｂは、回路基板のスイッチング素子に接続される。第３導通部１３ｃは、絶縁基板１０を貫通して、第３上面電極１３ａと第３下面電極１３ｂとを電気的に接続している。 One end of the heating element 20 is connected to the third electrode 13. The third electrode 13 includes a third upper surface electrode 13a, a third lower surface electrode 13b, and a third conductive portion 13c. The third upper surface electrode 13a is formed on the upper surface 10a of the insulating substrate 10. The third upper surface electrode 13a is connected to one end of the heating element 20. The third lower surface electrode 13b is formed on the lower surface 10b of the insulating substrate 10. The third bottom electrode 13b is connected to the switching element of the circuit board. The third conductive portion 13c penetrates the insulating substrate 10 and electrically connects the third upper surface electrode 13a and the third lower surface electrode 13b.
　発熱体２０の第３下面電極１３ｂ側とは反対側の端部は、発熱体引出電極１４に接続している。発熱体引出電極１４は、断熱部材２１の上面に引き回されている。発熱体引出電極１４は、ヒューズエレメント３０とはんだペースト３２により接続している。 The end of the heating element 20 opposite to the third lower surface electrode 13b side is connected to the heating element extraction electrode 14. The heating element extraction electrode 14 is routed to the upper surface of the heat insulating member 21. The heating element extraction electrode 14 is connected to the fuse element 30 by a solder paste 32.
　次に、保護素子３の製造方法を説明する。
　保護素子３は、例えば、次のようにして製造することができる。 Next, a method of manufacturing the protective element 3 will be described.
The protective element 3 can be manufactured, for example, as follows.
　先ず、始めに、絶縁基板１０を用意する。
　用意した絶縁基板１０に、第１電極１１の第１導通部１１ｃと、第２電極１２の第２導通部１２ｃと、第３導通部１３ｃを形成する。 First, the insulating substrate 10 is prepared.
The first conductive portion 11c of the first electrode 11, the second conductive portion 12c of the second electrode 12, and the third conductive portion 13c are formed on the prepared insulating substrate 10.
　次に、絶縁基板１０の上面１０ａの第１導通部１１ｃの周囲に第１上面電極１１ａを、第２導通部１２ｃの周囲に第２上面電極１２ａをそれぞれ形成する。さらに、絶縁基板１０の上面１０ａの第３導通部１３ｃの周囲に第３上面電極１３ａを、下面１０ｂの第３導通部１３ｃの周囲に第３下面電極１３ｂを形成する。 Next, the first upper surface electrode 11a is formed around the first conductive portion 11c of the upper surface 10a of the insulating substrate 10, and the second upper surface electrode 12a is formed around the second conductive portion 12c. Further, a third upper surface electrode 13a is formed around the third conductive portion 13c of the upper surface 10a of the insulating substrate 10, and a third lower surface electrode 13b is formed around the third conductive portion 13c of the lower surface 10b.
　次に、絶縁基板１０の上面１０ａの第１上面電極１１ａと第２上面電極１２ａとの間に、発熱体２０と幅が同じもしくはそれより広い断熱部材層を形成する。次いで、断熱部材層の上に発熱体２０を形成する。発熱体２０は、一方の端部が第３上面電極１３ａに接続するように形成する。 Next, a heat insulating member layer having the same width as or wider than the heating element 20 is formed between the first upper surface electrode 11a and the second upper surface electrode 12a of the upper surface 10a of the insulating substrate 10. Next, the heating element 20 is formed on the heat insulating member layer. The heating element 20 is formed so that one end is connected to the third upper surface electrode 13a.
　次に、第１上面電極１１ａの第２上面電極１２ａに対向しない側面と、その側面に接続する上面の一部に第１端子１８ａを形成する。第２上面電極１２ａの第１上面電極１１ａに対向しない側面と、その側面に接続する上面の一部に第２端子１８ｂを形成する。次いで、第１上面電極１１ａと第２上面電極１２ａとの間に、断熱部材２１を形成する。 Next, the first terminal 18a is formed on the side surface of the first upper surface electrode 11a that does not face the second upper surface electrode 12a and a part of the upper surface connected to the side surface. The second terminal 18b is formed on a side surface of the second upper surface electrode 12a that does not face the first upper surface electrode 11a and a part of the upper surface connected to the side surface. Next, the heat insulating member 21 is formed between the first upper surface electrode 11a and the second upper surface electrode 12a.
　次に、断熱部材２１の上面に発熱体引出電極１４を形成する。発熱体引出電極１４は、一方の端部が発熱体２０に接続するように形成する。 Next, the heating element extraction electrode 14 is formed on the upper surface of the heat insulating member 21. The heating element extraction electrode 14 is formed so that one end thereof is connected to the heating element 20.
　そして、第１端子１８ａ、発熱体引出電極１４および第２端子１８ｂの上面に、ヒューズエレメント３０を、はんだペースト３２を用いて積層する。 Then, the fuse element 30 is laminated on the upper surfaces of the first terminal 18a, the heating element extraction electrode 14 and the second terminal 18b using the solder paste 32.
　以上のような構成とされた保護素子３によれば、第１上面電極１１ａと第２上面電極１２ａがそれぞれ断熱部材２１で被覆されているので、第１実施形態に係る保護素子１と同様に、低抵抗化と小型化が容易な構造でありながらも、内部短絡が起こりにくい。また、発熱体２０が絶縁基板１０の上面１０ａ側に配置されているので、発熱体２０で発熱した熱をさらに効率よくヒューズエレメント３０に伝熱させることができる。このため、第３電極１３に電流が流れたときの溶断速度をさらに速くすることができる。 According to the protective element 3 having the above configuration, since the first upper surface electrode 11a and the second upper surface electrode 12a are each covered with the heat insulating member 21, the same as the protective element 1 according to the first embodiment. Although the structure is easy to reduce resistance and miniaturization, internal short circuit is unlikely to occur. Further, since the heating element 20 is arranged on the upper surface 10a side of the insulating substrate 10, the heat generated by the heating element 20 can be more efficiently transferred to the fuse element 30. Therefore, the fusing speed when a current flows through the third electrode 13 can be further increased.
　次に、本発明を実施例により説明する。 Next, the present invention will be described by way of examples.
［実施例１］
　第１実施形態に係る保護素子１を作製した。各部材の構成材料は以下のとおりである。
　絶縁基板１０：アルミナ基板、縦：２ｍｍ、幅：４ｍｍ、厚さ：０．２ｍｍ
　第１電極１１：表面がＮｉ－Ａｕめっきで被覆されたＡｇ
　第２電極１２：表面がＮｉ－Ａｕめっきで被覆されたＡｇ
　第３電極１３：表面がＮｉ－Ａｕめっきで被覆されたＡｇ
　発熱体引出電極１４：表面がＮｉ－Ａｕめっきで被覆されたＡｇ
　導電部材１５：表面がＮｉ－Ａｕめっきで被覆されたＡｇ
　第１絶縁部材１７ａ、第２絶縁部材１７ｂ：ガラス
　第１端子１８ａ、第２端子１８ｂ：銀
　空間１９ａと空間１９ｂの合計幅（Ｗａ＋Ｗｂ）：０．５ｍｍ
　発熱体２０：酸化ルテニウム
　ヒューズエレメント３０：外側を高融点金属層としてＡｇを用い、内側を低融点金属層としてＳｎ合金を用いた積層体、縦：１．６ｍｍ、幅：２．０ｍｍ、厚さ：０．６ｍｍ
　はんだペースト３２：Ｓｎ合金 [Example 1]
The protective element 1 according to the first embodiment was manufactured. The constituent materials of each member are as follows.
Insulated substrate 10: Alumina substrate, length: 2 mm, width: 4 mm, thickness: 0.2 mm
First electrode 11: Ag whose surface is coated with Ni-Au plating
Second electrode 12: Ag whose surface is coated with Ni-Au plating
Third electrode 13: Ag whose surface is coated with Ni-Au plating
Heating element extraction electrode 14: Ag whose surface is coated with Ni-Au plating.
Conductive member 15: Ag whose surface is coated with Ni-Au plating
1st insulating member 17a, 2nd insulating member 17b: glass 1st terminal 18a, 2nd terminal 18b: silver Total width of space 19a and space 19b (Wa + Wb): 0.5 mm
Heating element 20: Luthenium oxide fuse element 30: Laminated body using Ag as the high melting point metal layer on the outside and Sn alloy as the low melting point metal layer on the inside, length: 1.6 mm, width: 2.0 mm, thickness : 0.6mm
Solder paste 32: Sn alloy
（評価）
　保護素子１のヒューズエレメント３０の第１電極１１と第２電極１２と間の抵抗値を測定した。また、第３電極１３に１１Ｗの電力と、１２Ｗの電力を供給してから、ヒューズエレメント３０が溶断するまでの時間を計測した。これらの結果を、ヒューズエレメント３０の縦と横のサイズおよび空間１９ａと空間１９ｂの合計幅と共に表１に示す。 (Evaluation)
The resistance value between the first electrode 11 and the second electrode 12 of the fuse element 30 of the protection element 1 was measured. Further, the time from when the electric power of 11 W and the electric power of 12 W was supplied to the third electrode 13 until the fuse element 30 was blown was measured. These results are shown in Table 1 along with the vertical and horizontal sizes of the fuse element 30 and the total width of the spaces 19a and 19b.
［実施例２］
　発熱体引出上面電極１４ａと導電部材１５とを形成する代わりに、発熱体引出上面電極１４ｄを形成したこと以外は、実施例１と同様にして第２実施形態に係る保護素子２を作製した。得られた保護素子２について、実施例１と同様に評価した。その結果を、表１に示す。 [Example 2]
The protective element 2 according to the second embodiment was produced in the same manner as in the first embodiment except that the heating element drawer upper surface electrode 14d was formed instead of forming the heating element drawer upper surface electrode 14a and the conductive member 15. The obtained protective element 2 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
［実施例３］
　実施例１と同じ材料を用いて第３実施形態に係る保護素子３を作製した。得られた保護素子３について、実施例１と同様に評価した。その結果を、表１に示す。 [Example 3]
The protective element 3 according to the third embodiment was manufactured using the same material as in Example 1. The obtained protective element 3 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
［比較例１］
　図１２に、比較例１で作製した保護素子の横断面図を示す。比較例１で作製した保護素子４は、以下の点が、実施例１で作製した保護素子１と異なる。
　第１上面電極１１ａの上面に第１絶縁部材１７ａを形成せず、第２上面電極１２ａの上面に第２絶縁部材１７ｂを形成せずに、発熱体引出上面電極１４ａの周囲を導電部材１５で被覆した。導電部材１５の幅は実施例１の保護素子１と同じとした。また、導電部材１５と第１上面電極１１ａとの空間１９ａの幅Ｗａが０．２５ｍｍとなるように第１上面電極１１ａの位置を外側に０．５ｍｍずらした。導電部材１５と第２上面電極１２ａとの空間１９ｂの幅Ｗａが０．２５ｍｍとなるように第２上面電極１２ａの位置を外側に０．５ｍｍずらした。これによって、空間１９ａと空間１９ｂの合計幅（Ｗａ＋Ｗｂ）は、０．５ｍｍで保護素子１と同じであるが、ヒューズエレメント３０の幅は、３ｍｍで、保護素子１よりも１ｍｍ広くなった。得られた保護素子４について、実施例１と同様に評価した。その結果を、表１に示す。 [Comparative Example 1]
FIG. 12 shows a cross-sectional view of the protective element produced in Comparative Example 1. The protective element 4 produced in Comparative Example 1 is different from the protective element 1 produced in Example 1 in the following points.
Without forming the first insulating member 17a on the upper surface of the first upper surface electrode 11a and forming the second insulating member 17b on the upper surface of the second upper surface electrode 12a, the conductive member 15 surrounds the heating element extraction upper surface electrode 14a. Covered. The width of the conductive member 15 was the same as that of the protective element 1 of the first embodiment. Further, the position of the first upper surface electrode 11a was shifted outward by 0.5 mm so that the width Wa of the space 19a between the conductive member 15 and the first upper surface electrode 11a was 0.25 mm. The position of the second upper surface electrode 12a was shifted outward by 0.5 mm so that the width Wa of the space 19b between the conductive member 15 and the second upper surface electrode 12a was 0.25 mm. As a result, the total width (Wa + Wb) of the space 19a and the space 19b is 0.5 mm, which is the same as that of the protective element 1, but the width of the fuse element 30 is 3 mm, which is 1 mm wider than that of the protective element 1. The obtained protective element 4 was evaluated in the same manner as in Example 1. The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示すように、実施例１～３の保護素子１～３は、比較例１の保護素子４と比較して第１電極１１と第２電極１２と間の抵抗値が小さくなった。これは、ヒューズエレメント３０の幅が狭く、第１電極１１と第２電極１２と間の距離が短くなったためであると考えられる。 As shown in Table 1, the protective elements 1 to 3 of Examples 1 to 3 had a smaller resistance value between the first electrode 11 and the second electrode 12 than the protective element 4 of Comparative Example 1. It is considered that this is because the width of the fuse element 30 is narrow and the distance between the first electrode 11 and the second electrode 12 is shortened.
　また、発熱体引出上面電極１４ａと導電部材１５とを分けて形成する代わりに、発熱体引出上面電極１４ｄを形成した実施例２の保護素子２は、第３電極１３に電流を流したときの溶断時間が実施例１の保護素子１と比較して短くなり、溶断速度がより速くなった。
　発熱体２０を絶縁基板１０の上面１０ａ側に配置した実施例３の保護素子３は、第３電極１３に電流を流したときの溶断時間が実施例２の保護素子２と比較して短くなり、溶断速度がさらに速くなった。 Further, instead of forming the heating element extraction upper surface electrode 14a and the conductive member 15 separately, the protection element 2 of Example 2 in which the heating element extraction upper surface electrode 14d is formed is when a current is passed through the third electrode 13. The fusing time was shorter than that of the protective element 1 of Example 1, and the fusing speed was higher.
The protective element 3 of the third embodiment in which the heating element 20 is arranged on the upper surface 10a side of the insulating substrate 10 has a shorter fusing time when a current is passed through the third electrode 13 as compared with the protective element 2 of the second embodiment. , The fusing speed has become even faster.
　１、２、３　保護素子
　１０　絶縁基板
　１０ａ　上面
　１０ｂ　下面
　１１　第１電極
　１１ａ　第１上面電極
　１１ｂ　第１下面電極
　１１ｃ　第１導通部
　１２　第２電極
　１２ａ　第２上面電極
　１２ｂ　第２下面電極
　１２ｃ　第２導通部
　１３　第３電極
　１３ｂ　第３下面電極
　１３ｃ　第３導通部
　１４　発熱体引出電極
　１４ａ、１４ｄ　発熱体引出上面電極
　１４ｂ　発熱体引出下面電極
　１４ｃ　発熱体引出電極導通部
　１５　導電部材
　１７ａ　第１絶縁部材
　１７ｂ　第２絶縁部材
　１８ａ　第１端子
　１８ｂ　第２端子
　１９ａ、１９ｂ　空間
　２０　発熱体
　２１　断熱部材
　３０　ヒューズエレメント
　３０ａ、３０ｂ　端部
　３０ｃ　中央部
　３１　ヒューズエレメント溶融固化物
　３２　はんだペースト 1, 2, 3 Protective elements 10 Insulated substrate 10a Upper surface 10b Lower surface 11 First electrode 11a First upper surface electrode 11b First lower surface electrode 11c First conductive part 12 Second electrode 12a Second upper surface electrode 12b Second lower surface electrode 12c Second Conductive part 13 3rd electrode 13b 3rd lower surface electrode 13c 3rd conductive part 14 Heat generating element drawer electrode 14a, 14d Heat generating body drawer upper surface electrode 14b Heat generating body drawer lower surface electrode 14c Heat generating body drawer electrode Conductive part 15 Conductive member 17a 1st insulating member 17b 2nd Insulation Member 18a 1st Terminal 18b 2nd Terminal 19a, 19b Space 20 Heat Heater 21 Insulation Member 30 Fuse Element 30a, 30b End 30c Central 31 Fuse Element Molten Solidified 32 Solder Paste

Claims (2)

  1. 　絶縁基板と、
    　前記絶縁基板の一方の表面上に、互いに対向するように設けられた第１電極および第２電極と、
    　前記絶縁基板の一方の表面上に設けられた発熱体と、
    　前記発熱体の一方の端部に接続する第３電極と、
    　前記発熱体の前記一方の端部とは反対側の端部に接続する発熱体引出電極と、
    　互いに対向する一方の端部が前記第１電極と接続し、他方の端部が前記第２電極と接続し、前記一方の端部と前記他方の端部との間の中央部が前記発熱体引出電極に接するヒューズエレメントと、を備え、
    　前記第１電極は、前記第２電極に対向する側面と、その側面に接続する上面の少なくとも一部が第１絶縁部材で被覆され、
    　前記第２電極は、前記第１電極に対向する側面と、その側面に接続する上面の少なくとも一部が第２絶縁部材で被覆されている保護素子。     Insulated substrate and
    A first electrode and a second electrode provided on one surface of the insulating substrate so as to face each other,
    A heating element provided on one surface of the insulating substrate and
    A third electrode connected to one end of the heating element and
    A heating element extraction electrode connected to an end of the heating element opposite to the one end,
    One end facing each other is connected to the first electrode, the other end is connected to the second electrode, and the central portion between the one end and the other end is the heating element. Equipped with a fuse element in contact with the extraction electrode,
    At least a part of the side surface of the first electrode facing the second electrode and the upper surface connected to the side surface is covered with the first insulating member.
    The second electrode is a protective element in which at least a part of a side surface facing the first electrode and an upper surface connected to the side surface is covered with a second insulating member.
  2. 　前記発熱体引出電極が、第１絶縁部材および第２絶縁部材の上面にまで延長されている請求項１に記載の保護素子。 The protective element according to claim 1, wherein the heating element extraction electrode is extended to the upper surfaces of the first insulating member and the second insulating member.
PCT/JP2020/032363 2019-09-04 2020-08-27 Protective element WO2021044939A1 (en)

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